CN217504464U

CN217504464U - High-power gas-liquid phase change radiator

Info

Publication number: CN217504464U
Application number: CN202120907014.7U
Authority: CN
Inventors: 柯列; 王革委; 杨帆
Original assignee: Shenzhen Sayes Technology Co ltd
Current assignee: Shenzhen Sayes Technology Co ltd
Priority date: 2021-04-28
Filing date: 2021-04-28
Publication date: 2022-09-27
Anticipated expiration: 2031-04-28

Abstract

The utility model discloses a high power gas-liquid phase change radiator, which comprises a heat sink end, a condensation cavity channel, a liquid return cavity channel, a steam pipeline and a liquid return channel, wherein the heat sink end is tightly connected with a heat source; one end of the liquid return channel is communicated with the liquid return cavity channel, and the other end of the liquid return channel is communicated with the heat sink end; a liquid return channel and a condensation radiating fin are fixedly arranged between the condensation cavity channel and the liquid return cavity channel. The utility model discloses a high power gas-liquid phase change radiator passes through pipeline and refrigerant and shifts the heat of heat source to other places, then during reheat exchanges the air, and the structure of pipeline can be adjusted along with the product structure, so can adapt to various complicated product structures more. The high-power gas-liquid phase change radiator can be widely suitable for ultra-high power electronic heat dissipation, the working temperature of a chip can be greatly reduced, the performance of a product is improved and stabilized, and the service life of the product is prolonged.

Description

High-power gas-liquid phase change radiator

Technical Field

The utility model belongs to the radiator field, concretely relates to high power gas-liquid phase transition radiator.

Background

In recent years, with the technological progress and the improvement of application requirements, the chip power of a terminal computer, a server, a gas vehicle industry and even a household appliance industry is higher and higher, and the requirement on the heat dissipation function of a radiator is higher and higher; due to the inherent limitations of product structures, the traditional electronic radiator cannot adapt to various complex product structures, and the problem of high-power heat dissipation is more and more difficult to solve.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a but wide application in the high power gas-liquid phase transition radiator in the electronic product that has complex structure.

In order to solve the technical problem, the utility model provides a technical scheme does:

a high-power gas-liquid phase change radiator comprises a heat sink end, a condensation cavity channel, a liquid return cavity channel, a steam pipeline, a liquid return pipeline and a liquid return channel, wherein the heat sink end, the condensation cavity channel, the liquid return cavity channel, the steam pipeline, the liquid return pipeline and the liquid return channel are tightly connected with a heat source; one end of the liquid return channel is communicated with the liquid return cavity channel, and the other end of the liquid return channel is communicated with the heat sink end; and a liquid return channel and a condensation radiating fin are fixedly arranged between the condensation cavity channel and the liquid return cavity channel.

Furthermore, the heat sink end comprises an evaporation cavity channel, the evaporation cavity channel comprises a heat sink lower bottom plate, a heat sink upper bottom plate, an evaporation cavity and a steam channel, the evaporation cavity is formed by enclosing the heat sink lower bottom plate and the heat sink upper bottom plate, and the evaporation cavity is communicated with the steam channel.

Furthermore, the heat sink end also comprises heat sink end radiating fins which are fixedly arranged on the evaporation cavity channel.

Furthermore, a vacuumizing refrigerant injection port is formed in the steam channel.

Furthermore, the evaporation cavity is internally provided with evaporation end heat exchange teeth.

Further, heat sink end radiating fins are arranged around the steam channel.

Further, the condensation chamber way includes under condensation upper cover plate, the condensation apron and by the apron encloses the condensation chamber of establishing and forming under condensation upper cover plate and the condensation, condensation intracavity is installed condensation end heat exchange tooth.

Furthermore, the liquid return cavity channel comprises a liquid return upper cover plate, a liquid return lower cover plate and a liquid return cavity formed by enclosing the liquid return upper cover plate and the liquid return lower cover plate.

Further, a liquid return fin is arranged in the liquid return cavity.

Further, the inner diameter of the steam pipeline is larger than that of the liquid return pipeline.

The utility model has the advantages that:

the utility model discloses a high power gas-liquid phase change radiator passes through pipeline and refrigerant and shifts the heat of heat source (heating element) to other places, then during reheat exchanges the air, and the structure of pipeline can be adjusted along with the product structure, so can adapt to the product structure of various complicacies more. Compared with the traditional radiator structure which takes heat from a heat sink area to a heat dissipation area by utilizing heat conduction, as the liquid refrigerant is transformed into a gas state through phase change, the carried heat energy value is greatly enhanced, and the rate of gas-liquid two-phase change is very high, the heat dissipation capacity of the radiator is greatly improved, the radiator can be widely applied to, but not limited to, the heat dissipation of the latest ultrahigh-power electronics such as CPU (central processing unit) chips and GPU (graphics processing unit) chips, the working temperature of the chips can be greatly reduced, the performance of products is improved and stabilized, and the service life of the products is prolonged.

Drawings

FIG. 1 is a schematic perspective view of a high power gas-liquid phase change heat sink according to a preferred embodiment of the present invention;

FIG. 2 is an exploded view of a high power gas-liquid phase change heat sink of the present invention in a preferred embodiment;

fig. 3 is an exploded view of the heat sink end of the present invention in a preferred embodiment;

FIG. 4 is an exploded view of an evaporation channel of the present invention in a preferred embodiment;

fig. 5 is an exploded view of a preferred embodiment of the condensing channel of the present invention;

fig. 6 is an exploded view of the fluid return channel of the present invention in a preferred embodiment;

fig. 7 is a schematic diagram of the liquid-gas phase change cycle of the high power liquid-gas phase change heat sink of the present invention in a preferred embodiment.

The reference numerals include:

1-heat sink end 2-steam pipeline 3-condensation cavity channel

4-liquid return channel 5-liquid return cavity channel 6-condensation radiating fin

7-liquid return pipeline 8-heat sink lower bottom plate 9-evaporation end heat exchange tooth

10-heat sink upper bottom plate 11-vacuum-pumping refrigerant-filling port 12-steam channel

13-heat sink end radiating fin 14-condensation end heat exchange tooth 15-condensation upper cover plate

16-condensation lower cover plate 17-liquid return upper cover plate 18-liquid return lower cover plate

19-liquid return fin 20-evaporation cavity channel

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 and 2, in order to show a preferred embodiment of the present invention, the high power gas-liquid phase change heat sink includes a heat sink end 1 for being tightly connected to a heat source, a condensation channel 3, a liquid return channel 5, a vapor pipe 2 and a liquid return channel 4, wherein one end of the vapor pipe 2 is communicated with the heat sink end 1, and the other end of the vapor pipe 2 is communicated with the condensation channel 3; one end of the liquid return channel 4 is communicated with the liquid return cavity channel 5, and the other end of the liquid return channel 4 is communicated with the heat sink end 1; and a liquid return channel 4 and a condensing radiating fin 6 are fixedly arranged between the condensing cavity channel 3 and the liquid return cavity channel 5.

The utility model discloses a high power gas-liquid phase transition radiator passes through pipeline and refrigerant and shifts the heat of heat source (heating element) to other places, then during the reheat exchanges the air, and the structure of pipeline can be adjusted along with the product structure, so can adapt to the product structure of various complicacies more. Compared with the traditional radiator structure which takes heat from a heat sink area to a heat dissipation area by utilizing heat conduction, as the liquid refrigerant is transformed into a gas state through phase change, the carried heat energy value is greatly enhanced, and the rate of gas-liquid two-phase change is very high, the heat dissipation capacity of the radiator is greatly improved, the radiator can be widely applied to, but not limited to, the heat dissipation of the latest ultrahigh-power electronics such as CPU (central processing unit) chips and GPU (graphics processing unit) chips, the working temperature of the chips can be greatly reduced, the performance of products is improved and stabilized, and the service life of the products is prolonged. The above components are described in further detail below.

As shown in FIG. 1 and FIG. 2, the high power gas-liquid phase change heat sink of the present invention mainly comprises an evaporation channel 20, a condensation channel 3, a liquid return channel 5, a vapor channel 2, a liquid return channel 7, and a liquid return channel 4. The evaporation channel 20, the condensation channel 3, the liquid return channel 5, the steam pipeline 2, the liquid return pipeline 7 and the liquid return channel 4 are internally circulated with refrigerants.

As shown in fig. 3, the heat sink end 1 includes an evaporation channel 20 and heat sink end fins 13, and the heat sink end fins 13 are fixedly mounted on the evaporation channel 20.

As shown in fig. 4, the evaporation channel 20 includes a heat sink bottom plate 8, a heat sink top plate 10, an evaporation cavity, and a vapor channel 12. The evaporation cavity is formed by enclosing a heat sink bottom plate 8 and a heat sink upper bottom plate 10, and the heat sink bottom plate 8 and the heat sink upper bottom plate 10 are welded into a whole with the evaporation cavity inside through means such as high-temperature brazing. The evaporation chamber communicates with the vapor passage 12 and is fixed as one body. The heat sink bottom plate 8, the heat sink top plate 10, and the vapor channels 12 are made of metal or alloy material (e.g., aluminum, copper, or other material with good thermal conductivity).

The heat sink bottom plate 8 directly contacts with a high-power heat source (such as a common high-power device like a GPU and a CPU) to dissipate heat from the heat source. Preferably, the evaporation cavity is internally provided with evaporation end heat exchange teeth 9, and the evaporation end heat exchange teeth 9 increase the contact area between the refrigerant in the evaporation cavity channel 20 and the heat sink lower bottom plate 8, thereby increasing the heat exchange capacity and greatly increasing the heat absorption capacity of the refrigerant. Preferably, the heat sink lower base plate 8 and the heat sink upper base plate 10 can be formed in one step by using a stamping die, and the evaporation end heat exchange teeth 9 can be prepared by a fin punching and folding integrated forming machine.

The vapor channel 12 is box-shaped with a cavity communicating with the evaporation chamber. The steam channel 12 is made by CNC processing, and then the tail part is welded with a vacuumized refrigerant injection port 11 by high frequency. Heat sink end fins 13 are provided around the vapor passage 12 to improve the heat dissipation capability of the vapor passage 12.

The steam channel 12 is communicated with the condensing cavity 3 through the steam pipeline 2. As shown in fig. 5, the condensation channel 3 includes a condensation upper cover plate 15, a condensation lower cover plate 16 and a condensation chamber. Wherein, the condensation chamber is enclosed by the condensation upper cover plate 15 and the condensation lower cover plate 16. Preferably, a condensation end heat exchange tooth 14 is installed in the condensation cavity. More preferably, there are two condensing end heat exchange teeth 14.

The upper condensing cover plate 15, the lower condensing cover plate 16 and the heat exchanging teeth 14 are made of metal or alloy material (such as aluminum, copper or other material with good heat conductivity). The two condensation upper cover plates 15 and the condensation lower cover plate 16 can be formed by a sheet metal stamping die in one step, the two condensation end heat exchange teeth 14 can be manufactured by a fin punching and folding integrated forming machine, and the three are welded into a whole with a condensation cavity inside through high-temperature brazing.

The condensation cavity 3 is used for dispersing the refrigerant vapor containing high latent heat from the vapor channel 12, and quickly transferring the heat energy in the refrigerant vapor to the condensation end heat exchange teeth 14 to be transferred to the condensation lower cover plate 16.

Referring back to fig. 1 and 2, a liquid return channel 4 and a condensing heat sink 6 are fixedly disposed between the condensing channel 3 and the liquid return channel 5.

The condensing heat sink 6 is preferably made of metal or alloy material (such as aluminum, copper or other material with good heat conductivity) by a fin punching and folding integrated forming machine. The upper end of the condensing radiating fin 6 is welded and fixed with the condensing cavity channel 3, the lower end of the condensing radiating fin 6 is welded and fixed with the liquid return cavity channel 5, and the main function is to quickly transfer heat on the condensing lower cover plate 16 to the air.

The material of the liquid return channel 4 is metal or alloy material (such as aluminum, copper or other material with good heat conductivity), and can be manufactured by CNC processing or section mould. The upper end and the lower end of the liquid return channel 4 are respectively welded with the condensation cavity of the condensation cavity channel 3 and the liquid return cavity of the liquid return cavity channel 5 into a whole through a high-temperature brazing technology, so that the refrigerant which is changed into liquid in the condensation cavity channel 3 can flow into the liquid return cavity channel 5 through the liquid return channel 4 under the action of gravity.

As shown in fig. 6, the liquid return channel 5 includes a liquid return upper cover plate 17, a liquid return lower cover plate 18, and a liquid return cavity. The liquid return cavity is formed by enclosing the liquid return upper cover plate 17 and the liquid return lower cover plate 18. Preferably, a liquid return fin 19 is installed in the liquid return cavity. More preferably, the number of the liquid return fins 19 is two. The upper liquid return cover plate 17, the lower liquid return cover plate 18 and the liquid return fins 19 are all made of metal or alloy material (such as aluminum, copper or other material with good heat conductivity). The liquid return upper cover plate 17 and the liquid return lower cover plate 18 can be formed in one step by a sheet metal stamping die, the liquid return fins 19 can be manufactured by a fin punching and folding integrated forming machine, the liquid return upper cover plate 17, the liquid return lower cover plate 18 and the liquid return fins 19 are welded into a whole with a liquid return cavity inside through high-temperature brazing, and the liquid return cavity channel 5 mainly has the function of recovering liquid flowing down from the liquid return channel 5 and collecting the liquid together to flow into the liquid return pipeline 7.

Referring back to fig. 1 and 2, one end of the vapor pipeline 2 is communicated with the heat sink end 1, and the other end of the vapor pipeline 2 is communicated with the condensation channel 3; one end of the liquid return channel 4 is communicated with the liquid return cavity channel 5, and the other end of the liquid return channel 4 is communicated with the heat sink end 1.

Specifically, the vapor pipe 2 and the liquid return pipe 7 are made of metal or alloy material (such as aluminum, copper or other material with good heat conductivity). And preferably the inner diameter of the vapor conduit 2 is larger than the inner diameter of the liquid return conduit 7.

The steam pipeline 2 is mainly used for connecting the steam cavity channel 20 and the condensation cavity channel 3 to transmit refrigerant steam; the liquid return pipeline 7 is mainly used for connecting the bottoms of the backflow channel 5 and the evaporation channel 20 and enabling liquid-state refrigerants to flow back to the evaporation channel 20 under the action of gravity, so that the evaporation channel 20, the condensation channel 3 and the liquid return channel 5 form a sealed circulation cavity integrally.

After the high-power gas-liquid phase change radiator is installed in an application scene through six fasteners, as shown in fig. 7, a high-power heat source (such as common high-power components such as a GPU and a CPU) starts to work to radiate heat; after the heat sink area is heated, the liquid refrigerant medium in the evaporation cavity channel 20 is heated and gasified to form refrigerant airflow with high latent heat, because the space above the evaporation cavity channel 20 is large, the space of the evaporation pipeline 2 is large, the flow resistance is small, steam can enter the steam pipeline 2 along the steam cavity channel 20 and then enter the condensation cavity channel 3, in the condensation cavity channel 3, latent heat contained in the gaseous refrigerant medium can be conducted to the condensation end heat exchange teeth 14, the condensation end heat exchange teeth 14 transmit heat to the condensation radiating fins 6 through the condensation lower cover plate 16, and then the heat is dissipated to the surrounding environment through cold air flowing through the condensation radiating fins 6; meanwhile, the gaseous refrigerant medium can gradually change phase and convert into liquid while releasing latent heat, flows into the liquid return cavity channel 5 through the liquid return channel 4, finally collects into the liquid return pipeline 7, flows back into the evaporation cavity channel 20, and reenters the next thermal cycle.

The utility model discloses a two-phase flow technique is used to high power gas-liquid phase transition radiator, at the heat dissipation in-process, through vapour-liquid circulation, can be applied to the super high heat dissipation power scene in different fields. According to different application scenes, the steam pipeline 2 and the liquid return pipeline 7 with different structures, the heat sink end 1 with different sizes, the condensation cavity channel 3 and the liquid return cavity channel 5 can be selected, and the heat dissipation requirements of multiple fields can be met; according to different application scenes, radiating fins such as condensing radiating fins 6, heat sink end radiating fins 13 and the like with different lengths, different structures and different quantities can be prepared so as to meet the radiating requirements of multiple fields; according to the actual power requirement, refrigerant media with different volumes or different types can be injected into the cavities such as the steam cavity channel 20, the condensation cavity channel 3, the liquid return cavity channel 5 and the like.

The above description is only a preferred embodiment of the present invention, and many changes can be made in the detailed description and the application scope according to the idea of the present invention for those skilled in the art, which all belong to the protection scope of the present invention as long as the changes do not depart from the concept of the present invention.

Claims

1. The high-power gas-liquid phase change radiator is characterized by comprising a heat sink end (1), a condensation cavity channel (3), a liquid return cavity channel (5), a steam pipeline (2), a liquid return pipeline (7) and a liquid return channel (4), wherein the heat sink end (1) is tightly connected with a heat source, one ends of the steam pipeline (2) and the liquid return pipeline (7) are communicated with the heat sink end (1), and the other ends of the steam pipeline (2) and the liquid return pipeline (7) are communicated with the condensation cavity channel (3); one end of the liquid return channel (4) is communicated with the liquid return cavity channel (5), and the other end of the liquid return channel (4) is communicated with the heat sink end (1); a liquid return channel (4) and a condensation radiating fin (6) are fixedly arranged between the condensation cavity channel (3) and the liquid return cavity channel (5).

2. The high-power gas-liquid phase change heat radiator according to claim 1, wherein the heat sink end (1) comprises an evaporation cavity channel (20), the evaporation cavity channel (20) comprises a heat sink bottom plate (8), a heat sink upper bottom plate (10), an evaporation cavity formed by enclosing the heat sink bottom plate (8) and the heat sink upper bottom plate (10), and a vapor channel (12), and the evaporation cavity is communicated with the vapor channel (12).

3. The high-power gas-liquid phase change heat radiator according to claim 2, wherein the heat sink end (1) further comprises heat sink end cooling fins (13), and the heat sink end cooling fins (13) are fixedly mounted on the evaporation cavity (20).

4. The high-power gas-liquid phase change heat radiator as claimed in claim 2, wherein the vapor channel (12) is provided with a vacuuming refrigerant injection port (11).

5. The high-power gas-liquid phase change radiator as claimed in claim 4, wherein evaporation end heat exchange teeth (9) are installed in the evaporation cavity.

6. The high-power gas-liquid phase change heat radiator as claimed in claim 2, wherein heat sink end radiating fins (13) are arranged around the vapor channel (12).

7. The high-power gas-liquid phase change radiator according to claim 1, wherein the condensation channel (3) comprises a condensation upper cover plate (15), a condensation lower cover plate (16) and a condensation cavity enclosed by the condensation upper cover plate (15) and the condensation lower cover plate (16), and condensation end heat exchange teeth (14) are installed in the condensation cavity.

8. The high-power gas-liquid phase change radiator according to claim 1, wherein the liquid return channel (5) comprises a liquid return upper cover plate (17), a liquid return lower cover plate (18) and a liquid return cavity enclosed by the liquid return upper cover plate (17) and the liquid return lower cover plate (18).

9. The high power gas-liquid phase change heat radiator according to claim 8, wherein the liquid return cavity is provided with liquid return fins (19).

10. The high-power gas-liquid phase change radiator according to any one of claims 1-9, wherein the inner diameter of the vapor pipeline (2) is larger than that of the liquid return pipeline (7).