WO2022193169A1

WO2022193169A1 - Heat sink for communication setting

Info

Publication number: WO2022193169A1
Application number: PCT/CN2021/081279
Authority: WO
Inventors: 孟西陵; 荣朝运; 李婷; 周伟; 张伟; 黄敬伟; 邓南建
Original assignee: 上海精智实业股份有限公司
Priority date: 2021-03-17
Filing date: 2021-03-17
Publication date: 2022-09-22
Also published as: CN114270503A

Abstract

The present application relates to the technical field of communications, and provides a heat sink for communication setting. The heat sink for communication setting comprises: a base assembly, a liquid inlet cavity being formed inside the base assembly and configured to accommodate a refrigerant; a top cap assembly, a liquid return cavity being provided on the top cap assembly; and heat dissipation fins erected between the base assembly and the top cap assembly and respectively connected to the base assembly and the top cap assembly, wherein channels are provided in the heat dissipation fins, the bottom ends of the channels are communicated with the liquid inlet cavity, and the top ends of the channels are communicated with the liquid return cavity. When a location where the base assembly and a chip are attached to each other is heated, heat is transferred to the liquid inlet cavity by means of the base assembly, such that the refrigerant in the liquid inlet cavity is boiled and vaporized into a gaseous refrigerant; the gaseous refrigerant enters, by means of the channels, the liquid return cavity to be condensed into a liquid refrigerant; and the liquid refrigerant can return to the liquid inlet cavity by means of the channels.

Description

Radiator for communication settings

technical field

The present application relates to the field of communication technology, for example, to a radiator for communication settings.

Background technique

With the enrichment of people's lives and the rapid development of the fifth-generation mobile communication technology (5th-Generation, 5G) communication technology, chip technology has been widely developed, resulting in an increase in chip power and an increase in the power of outdoor communication base station equipment. As the power of the chip increases and the use time is prolonged, the chip will release a lot of heat. At this time, if the heat cannot be discharged in time, the chip will be damaged due to the increase in temperature.

In order to solve this problem, the cooling device adopts the following two methods. In the first method, heat is dissipated by natural convection of the substrate, and air flow is used to achieve heat exchange. The heat dissipation effect is poor, and it is difficult to meet the cooling requirements of communication equipment. In the second method, the two ends of the substrate are provided with an inlet and an outlet respectively, so that the refrigerant enters the substrate through the inlet, and the refrigerant absorbs the heat in the substrate and is discharged from the outlet. The second method requires continuous supply and discharge of refrigerants during the heat dissipation process, and the additional pumps or related pipelines lead to complex structures and larger space occupations, resulting in higher production costs.

SUMMARY OF THE INVENTION

The application provides a radiator for communication setting, which has good heat dissipation effect and low production cost.

Provide a heat sink for communication settings for chip cooling, including:

a base assembly, a liquid inlet cavity is arranged inside the base assembly, and the liquid inlet cavity is configured to accommodate a refrigerant;

a top cover assembly, which is arranged in parallel with the base assembly at intervals, and a liquid return cavity is provided on the top cover assembly;

The heat dissipation fins are erected between the base assembly and the top cover assembly and are respectively connected with the base assembly and the top cover assembly. A channel is provided in the heat dissipation fin, and the channel is provided with a channel. The bottom end is communicated with the liquid inlet cavity, and the top end of the channel is communicated with the liquid return cavity;

When the position where the base assembly and the chip are attached is heated, the heat is transferred to the liquid inlet chamber through the base assembly, so that the refrigerant in the liquid inlet chamber is boiled and vaporized to form a gaseous refrigerant, so The gaseous refrigerant enters the liquid return cavity through the passage to be condensed to form a liquid refrigerant, and the liquid refrigerant can be returned to the liquid inlet cavity through the passage.

Optionally, the number of the heat dissipation fins is multiple, the plurality of heat dissipation fins are arranged in parallel and spaced apart, and the plurality of heat dissipation fins are of at least one type.

As an option, each cooling fin is provided with a plurality of channels, and there is a first interval or a second interval between two adjacent channels.

As an option, a through slot is formed at the bottom of the heat dissipation fin, the through slot is communicated with the channel, and the angle between the extension direction of the through slot and the extension direction of the channel ranges from 85 degrees to 95 degrees.

Optionally, the base assembly includes a bottom plate and a bottom board, the bottom board is located above the bottom board and is connected to the bottom board, and the liquid inlet cavity is formed between the bottom board and the bottom board, A first socket is provided on the bottom plug-in board, and a first protrusion is correspondingly provided at the bottom of the heat dissipation tooth, and the first protrusion is passed through the first socket.

As an option, one of the bottom plate and the bottom plug-in board is provided with a limiting column, and the other is provided with a limiting hole, and the limiting column is passed through the limiting hole.

As an option, a support column is provided on a side of the bottom plate close to the bottom board, and the bottom board is connected to the bottom board through the support column.

As an option, at least one of the bottom plate and the bottom insert plate is provided with a liquid injection pipe, and the liquid injection pipe is connected to the liquid inlet chamber and transports refrigerant to the liquid inlet chamber.

Optionally, the top cover assembly includes a cover board and a top board, the top board is located below the cover board and is connected to the cover board, and a space is formed between the top board and the cover board. In the liquid return cavity, a second insertion hole is arranged on the top plug-in board, a second convex block is correspondingly disposed on the top of the heat dissipating tooth, and the second convex piece passes through the second insertion hole.

As an option, the base assembly, the top cover assembly and the heat dissipation fins are connected by high temperature brazing.

Description of drawings

Fig. 1 is the structural schematic diagram of the radiator used for communication setting in the present application;

Fig. 2 is the sectional view of the radiator used for communication setting of the present application;

Fig. 3 is a partial enlarged view of Fig. 2 at A;

Fig. 4 is the exploded schematic diagram of the radiator used for communication setting of the present application;

Fig. 5 is the structural schematic diagram of the bottom plate of the radiator used for communication setting in the present application;

6 is a schematic structural diagram of a radiator midsole plug-in board used for communication settings in the present application;

7 is a schematic structural diagram of a cover plate in a radiator used for communication settings in the present application;

8 is a schematic structural diagram of a top board in a radiator used for communication settings in the present application;

Fig. 9 is the structural schematic diagram of the radiator fins in the radiator used for communication setting of the present application;

FIG. 10 is a partial enlarged view at B in FIG. 9 .

In the picture:

1. Base assembly; 2. Top cover assembly; 3. Cooling fins; 4. Liquid injection pipe;

11. Liquid inlet chamber; 12. Bottom plate; 13. Bottom plate;

121, limit column; 122, support column; 123, accommodating slot; 131, limit hole; 132, first jack;

21. Liquid return chamber; 22. Cover plate; 23. Top plate; 231. Second jack;

31, channel; 32, first bump; 33, second bump; 34, through groove.

Detailed ways

The technical solutions of the embodiments of the present application will be described below with reference to the accompanying drawings, and the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

In the description of this application, unless otherwise specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral body; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements. The meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise specified and limited, a first feature "on" or "under" a second feature may include direct contact between the first feature and the second feature, or may include the first feature and the second feature Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The technical solutions of the present application are described below with reference to the accompanying drawings and through embodiments.

In the field of communication, the chip, as the controller of the communication process, has a large application scenario. Since the chip is prone to a large amount of heat during long-term use, if the heat cannot be discharged in time, it will cause a certain degree of damage to the chip. The heat sink used for chip heat dissipation has the problems of poor heat dissipation effect, high production cost, and difficulty in meeting the needs of users.

In order to solve this problem, this embodiment provides a heat sink for communication setting, which is used for cooling the chip. The radiator for communication setting includes: a base assembly 1, a liquid inlet cavity 11 is provided inside the base assembly 1, and the liquid inlet cavity 11 is configured to accommodate a refrigerant; a top cover assembly 2, and the base The components 1 are arranged in parallel and spaced apart, and the top cover component 2 is provided with a liquid return cavity 21; the cooling fins 3 are erected between the base component 1 and the top cover component 2 and are respectively connected with the base component. 1 is connected to the top cover assembly 2, a channel 31 is provided in the heat dissipation tooth 3, the bottom end of the channel 31 is communicated with the liquid inlet chamber 11, and the top end of the channel 31 is communicated with the Liquid return chamber 21; when the position where the base assembly 1 and the chip are attached is heated, the heat is transferred to the liquid inlet chamber 11 through the base assembly 1, so that the The refrigerant boils and vaporizes to form a gaseous refrigerant, and the gaseous refrigerant enters the liquid return chamber 21 through the passage 31 to condense to form a liquid refrigerant, and the liquid refrigerant can be returned to the liquid inlet chamber 11 through the passage 31 . As shown in FIG. 1 , the radiator for communication setting includes a base assembly 1 , a top cover assembly 2 and cooling fins 3 . A top cover assembly 2 is arranged above the base assembly 1 , and the base assembly 1 plays an integral supporting role. The top cover assembly 2 and the base assembly 1 are arranged in parallel and spaced apart to form a accommodating space between the top cover assembly 2 and the base assembly 1, and the radiating fins 3 are erected in the accommodating space, that is, the radiating fins 3 and the base The assembly 1 is arranged vertically, and the bottom and top ends of the cooling fins 3 are respectively connected to the base assembly 1 and the top cover assembly 2 to form an integral structure with good structural stability.

A chip is attached to the side of the base assembly 1 away from the top cover assembly 2. In order to dissipate heat to the chip in a timely and effective manner, as shown in Figures 2 to 3, a liquid inlet chamber 11 is provided inside the base assembly 1. The cavity 11 is set to accommodate the refrigerant, a liquid return cavity 21 is set on the top cover assembly 2, and a channel 31 is set in the heat dissipation tooth 3. Liquid chamber 21 to form a complete circulation loop. Wherein, if the inner diameter of the channel 31 is small, the channel 31 may also be called a microchannel.

In the heat sink for communication setting provided in this embodiment, when the position where the base assembly 1 and the chip are attached is heated, the heat is transferred to the liquid inlet chamber 11 through the base assembly 1, so that the liquid refrigerant in the liquid inlet chamber 11 is heated after being heated. It will rapidly boil and vaporize to form a gaseous refrigerant, and the gaseous refrigerant diffuses to the top of the cooling fins 3 through the channel 31. Under the condensation of the channel 31, rapid heat dissipation is achieved, and finally enters the liquid return chamber 21 to condense to form a liquid refrigerant. At this time, the liquid refrigerant Under the action of gravity, the liquid refrigerant can be returned to the liquid inlet chamber 11 through the channel 31 to realize a complete refrigerant circulation loop, and the two cavities of the liquid inlet chamber 11 and the liquid return chamber 21 of the radiator can be continuously realized. Phase flow transformation, so that the base assembly 1 as the heating end, the cooling fins 3 as the condensing end and the top cover assembly 2 reach a state of rapid temperature equalization, so that the heat of the heating part of the chip is taken away through the radiator to achieve the purpose of rapid cooling .

Compared with the heat dissipation method using natural convection, the radiator used for communication setting realizes heat exchange by means of heating and vaporizing the refrigerant and condensing, liquefying and returning, which improves the heat dissipation effect, and does not require additional pumps and connecting pipelines. The cavity structure needs to be opened in a plurality of parts to realize heat dissipation, the structure is simple, the floor space is small, and the production cost is low.

In one embodiment, the base assembly 1 includes a bottom board 12 and a bottom board 13, the bottom board 13 is located above the bottom board 12 and connected to the bottom board 12, the bottom board 13 and all The liquid inlet cavity 11 is formed between the bottom plates 12 , the bottom insert plate 13 is provided with a first insertion hole 132 , and the bottom of the heat dissipation tooth 3 is correspondingly provided with a first bump 32 . The protruding block 32 passes through the first insertion hole 132 .

As shown in FIG. 4 , the base assembly 1 includes a bottom plate 12 and a bottom insert plate 13 , the bottom plate 12 is manufactured by a forging or liquid die forging process, and the bottom insert plate 13 is formed by stamping a composite material. The bottom board 13 is located above the bottom board 12 and is connected to the bottom board 12 . The bottom board 13 and the bottom board 12 are arranged parallel to each other and form a liquid inlet cavity 11 therebetween.

In one embodiment, if the bottom plate 12 and the bottom insert plate 13 are both plate-like structures, the liquid inlet chamber 11 is only the gap between the bottom plate 12 and the bottom insert plate 13, and the volume for accommodating the refrigerant is small. The liquid chamber 11 has a relatively large volume. Optionally, as shown in FIG. 5 , a receiving groove 123 is provided on the side of the bottom plate 12 close to the bottom plug-in plate 13 , which is equivalent to forming a receiving groove 123 inwardly recessed on the top surface of the bottom plate 12 , when the bottom surface of the bottom insert plate 13 and the top surface of the bottom plate 12 are in contact, the bottom insert plate 13 is covered on the accommodating groove 123, in addition to ensuring that the liquid inlet chamber 11 has a certain volume, it can also prevent the refrigerant from entering the liquid chamber. 11 overflow, realize the encapsulation function of refrigerant.

When the radiator is assembled, the bottom board 13 needs to be installed on the bottom board 12. In order to ensure the installation accuracy between the bottom board 13 and the bottom board 12, as shown in FIG. 5 and FIG. One of the 13 is provided with a limiting column 121 , and the other is provided with a limiting hole 131 , and the limiting column 121 is penetrated through the limiting hole 131 . Through the mutual cooperation of the limiting posts 121 and the limiting holes 131 , a good positioning effect between the bottom board 13 and the bottom board 12 can be achieved, so as to ensure the precise alignment between the two. In this embodiment, a limiting column 121 may be provided on the side of the bottom plate 12 close to the bottom insert plate 13 , and a limiting hole 131 may be provided on the bottom insert plate 13 corresponding to the limiting column 121 . The limiting column 121 is a cylindrical structure, and the limiting hole 131 is a round hole structure, the limiting post 121 is inserted into the limiting hole 131, the structure is simple, and the use is convenient.

Since the accommodating groove 123 is provided in the middle of the bottom plate 12 , according to the inner and outer regions of the accommodating groove 123 , the limiting column 121 can have two types: the first limiting column and the second limiting column. The number can be multiple, a plurality of first limit posts are arranged around the accommodating groove 123, and each first limit post is passed through a limit hole 131 corresponding to the first limit post, with The bottom plate 12 is located at the limit of the outer area of the accommodating slot 123 . The number of the second limiting pillars may be multiple, and the plurality of second limiting pillars are disposed in the interior of the accommodating groove 123 in parallel and spaced apart, and each second limiting pillar passes through a corresponding second limiting pillar. The limiting hole 131 is used for limiting the position of the bottom plate 12 in the inner area of the accommodating slot 123 .

In one embodiment, since there is a height difference between the bottom wall of the accommodating groove 123 and the top surface of the bottom plate 12, in order to ensure that the heights of the top surfaces of the first limit post and the second limit post are consistent, optionally , between the second limit column and the bottom wall of the accommodating groove 123, a limit table is arranged, and the limit table is equivalent to making up for the height of the second limit column, so as to realize the function of cushioning the height of the second limit column, thereby ensuring The heights of the top surfaces of the two limiting columns 121 are kept the same, so as to avoid the situation where the heat dissipation fins 3 are pushed out and protruded.

If the heat dissipation fins 3 and the bottom board 13 are only fixed by plugging, it is difficult to ensure the fixing effect of the overall structure. Brazing is used to connect, and the solder includes but is not limited to powder texture. It is welded by high-temperature brazing process, which is simple in operation and reliable in structure.

Optionally, a support column 122 is provided on the side of the bottom plate 12 close to the bottom board 13, the support column 122 can be arranged in the receiving groove 123 of the bottom board 12, the bottom board 12 is connected to the bottom board 13 through the support column 122, and the support column 122 has two functions. First, the support column 122 plays the role of carrying the bottom board 13 to avoid the hollow collapse of the bottom board 13 in the area corresponding to the accommodating groove 123. Second, the top of the support column 122 The surface provides a welding position for high-temperature brazing, that is, the support column 122 is the welding position between the bottom plate 12 and the bottom plug-in board 13, which realizes the planning of the welding path, and has high welding strength to ensure the stability of the overall structure.

In order to ensure that the liquid inlet cavity 11 between the accommodating tank 123 and the bottom insert plate 13 can be supplied with refrigerant in time, as shown in FIGS. 4-6 , at least one of the bottom plate 12 and the bottom insert plate 13 is provided with a liquid injection pipe 4 , the liquid injection pipe 4 is connected to the liquid inlet cavity 11 and transports the refrigerant to the liquid inlet cavity 11, so that the refrigerant can be transported into the liquid inlet cavity 11 through the liquid injection pipe 4, so as to achieve sufficient supplementation of the refrigerant. As shown in FIG. 6 , in this embodiment, a circular hole may be provided on the bottom insert plate 13 , and the liquid injection pipe 4 is penetrated in the circular hole to provide sufficient refrigerant for the liquid inlet chamber 11 . The liquid injection pipe 4 can adopt a curved pipe structure to avoid the bottom insert plate 13 and the heat dissipation tooth 3. There can be a certain distance between the bottom end of the liquid injection pipe 4 and the bottom wall of the accommodating tank 123 to avoid liquid injection The bottom of the tube 4 is blocked and the flow is not smooth.

Since the heat dissipation fins 3 are erected between the bottom insert plate 13 and the top cover assembly 2 , the bottom insert plate 13 needs to fix the heat sink fins 3 while supporting the heat sink fins 3 . To this end, as shown in FIG. 4 and FIG. 6 , a first insertion hole 132 is provided on the bottom insert board 13 , a first bump 32 is correspondingly provided at the bottom of the heat dissipation tooth 3 , and the first bump 32 passes through the first bump 32 . A jack 132 . Optionally, the first insertion hole 132 is a strip-shaped through hole, and the first protrusion 32 extends along the length direction of the heat dissipation tooth 3 , so that the first protrusion 32 can be inserted into the first insertion hole 132 . This embodiment does not limit the number and length of the first insertion holes 132 , as long as the number and length of each first insertion hole 132 can match the first protrusions 32 corresponding to the first insertion holes 132 , the within the protection scope of this embodiment.

In one embodiment, the top cover assembly 2 includes a cover plate 22 and a top insert plate 23, the top insert plate 23 is located below the cover plate 22 and is connected to the cover plate 22, and the top insert plate 23 is connected to the cover plate 22. The liquid return cavity 21 is formed between the plate 23 and the cover plate 22 , a second insertion hole 231 is arranged on the top insert plate 23 , and a second bump 33 is correspondingly arranged on the top of the heat dissipation tooth 3 , the second protrusions 33 pass through the second insertion holes 231 .

In one embodiment, as shown in FIG. 4 , the top cover assembly 2 includes a cover plate 22 and a top insert plate 23 . The cover plate 22 and the top plate The lower part is connected with the cover plate 22, the top insert plate 23 and the cover plate 22 are arranged parallel to each other and form a liquid return cavity 21 between them. In one embodiment, if the cover plate 22 and the top plate 23 are both flat-plate structures, the liquid return cavity 21 is only the gap between the cover plate 22 and the top plate 23, and the volume for accommodating the refrigerant is small, in order To ensure that the liquid return chamber 21 has a larger volume, optionally, as shown in FIG. The direction of the top surface of the cover plate 22 is concave to form a groove. When the top surface of the top plug plate 23 and the bottom surface of the cover plate 22 are attached, the cover plate 22 is equivalent to the cover plate 22 of the groove, and the groove and the cover plate 22 By forming a structure similar to a flat tube, in addition to ensuring that the liquid return cavity 21 has a certain volume, it can also prevent the refrigerant from overflowing from the liquid return cavity 21, so as to realize the encapsulation function of the refrigerant.

Since the heat dissipation fins 3 are erected between the top plug board 23 and the bottom plug board 13 , the top plug board 23 needs to fix the heat dissipation fins 3 while supporting the heat dissipation fins 3 . To this end, as shown in FIG. 8 , a second socket 231 is provided on the top board 23 , and a second protrusion 33 is correspondingly provided at the bottom of the heat dissipation tooth 3 , and the second protrusion 33 passes through the second socket 231. Optionally, the second insertion hole 231 is a strip-shaped through hole, and the second protrusion 33 extends along the length direction of the heat dissipation tooth 3 , so that the second protrusion 33 can be inserted into the second insertion hole 231 . This embodiment does not limit the number and length of the second insertion holes 231 , as long as the number and length of each second insertion hole 231 can match the second bumps 33 corresponding to the second insertion holes 231 , the within the protection scope of this embodiment.

After the introduction of the base assembly 1 and the top cover assembly 2 is completed, the cooling fins 3 are introduced. As shown in FIG. 4 , the heat dissipation fins 3 are extruded by micro-channel aluminum plates, and adopt an integral molding structure, which reduces the links of assembly and assembly of parts, and the production cost is low. At the same time, the aluminum plate has excellent heat dissipation performance and good heat transfer effect. The number of the heat-dissipating fins 3 is multiple, the plurality of heat-dissipating fins 3 are arranged in parallel and spaced apart, and there are at least one type of the plurality of heat-dissipating fins 3 . This embodiment does not limit the number and type of the heat dissipation fins 3, which can be adjusted according to actual production needs. In this embodiment, there can be five types of heat dissipation fins 3. The number of the species is five, the number of the third species is six, the number of the fourth species is two, and the number of the fifth species is eight.

The difference between these five types of fins 3 lies in the following aspects. First, the difference in the length of the fins 3 is that the length of the fins 3 located in the middle is longer, and the lengths of the fins 3 located on both sides are longer. Second, the number and structure of the first bumps 32 at the bottom of the cooling fins 3 are different. The first bumps 32 can be continuous strip-shaped structures, and the first bumps 32 can also be intermittently arranged block-shaped. Third, the length of the second bumps 33 on the top of the cooling fins 3 is different. The length of the bumps 33 is short; fourthly, an escape groove is provided on the bottom of the heat dissipation tooth 3 at a position corresponding to the limit post 121 , and the escape groove is used to avoid the limit post 121 .

As shown in FIGS. 9-10 , for each heat dissipation fin 3 , a plurality of channels 31 are provided in the interior thereof, and there is a first interval or a second interval between two adjacent channels 31 . In one embodiment, the first interval is smaller than the second interval, and each fin 3 has a first interval, but some fins 3 have a second interval, and some fins 3 do not have a second interval. The reason for this setting is that the first interval is the partition between two adjacent channels 31 to ensure the independence of each channel 31, and the blockage of the respective channel 31 will not affect the working state of other channels 31; The two intervals are provided corresponding to the avoidance grooves, and the second interval is larger than the diameter of the limiting column 121 , so that the channel 31 is not provided at the position of the heat dissipation tooth 3 corresponding to the limiting column 121 , so as to avoid the blocking of the channel 31 due to the setting of the limiting column 121 . affect the cooling efficiency.

In one embodiment, a through slot 34 is formed at the bottom of the heat dissipation fin 3, the through slot 34 communicates with the channel 31, and the angle between the extending direction of the through slot 34 and the extending direction of the channel 31 ranges from 85 degrees to 95 degrees. . Optionally, a through slot 34 is formed at the bottom of the heat dissipation fin 3 , the through slot 34 communicates with the channel 31 , and the extending direction of the through slot 34 and the extending direction of the channel 31 are perpendicular to each other. Optionally, the extending direction of the through groove 34 and the extending direction of the channel 31 may also be approximately vertical, and absolute verticality is only the best process route state. If there is no channel 31 at the bottom of the cooling fin 3, only the bottom port of the channel 31 can transport the refrigerant. By opening a through slot 34 at the bottom of the cooling fin 3, the through slot 34 is a rectangular slot structure, and the through slot 34 communicates with the The channel 31 is equivalent to increasing the contact area between the bottom of the channel 31 and the liquid inlet cavity 11, so that the bottom port and the two sides of the channel 31 can provide the inlet for the refrigerant to enter the channel 31, which is convenient for the transportation of the refrigerant.

The radiator for communication setting has undergone a comparative heat test, and the radiator's temperature uniformity and heat dissipation capacity are much better than the original die-casting or extruded aluminum radiator. Under the high temperature working state, the liquid inlet chamber 11 and the channel 31 and the The temperature difference between the liquid return chambers 21 is less than or equal to 3°C, which reduces the temperature difference range.

The installation process of the radiator for communication setting provided by this embodiment is as follows:

1. Pass the limit posts 121 of the bottom plate 12 through the limit holes 131 of the bottom board 13 for pairing and combination.

2. Install the liquid injection pipe 4 in the round hole of the bottom insert plate 13 , and insert the first bump 32 of the heat dissipation tooth 3 into the first insertion hole 132 of the bottom insert plate 13 .

3. After the installation of the plurality of heat-dissipating fins 3 is completed in sequence, the second protrusions 33 of the heat-dissipating fins 3 are inserted through the second sockets 231 of the top insert plate 23, and the cover plate 22 is covered on the top insert plate. on board 23.

4. After being fixed by a special fixture, high temperature brazing is carried out to ensure good welding.

In the description herein, the azimuth or positional relationship of the terms "upper", "lower" and "right" is based on the azimuth or positional relationship shown in the accompanying drawings, which is only for the convenience of description and simplification of operations, rather than indicating or implying that The device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as a limitation of the present application. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

In the description of this specification, description with reference to the terms "an embodiment" and "example" etc. means that a feature, structure, material or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application . In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

Claims

A heat sink for communication settings, used for chip cooling, including:

a base assembly (1), a liquid inlet chamber (11) is provided inside the base assembly (1), and the liquid inlet chamber (11) is configured to accommodate a refrigerant;

a top cover assembly (2), arranged in parallel with the base assembly (1) and spaced apart, and a liquid return cavity (21) is provided on the top cover assembly (2);

The cooling fins (3) are erected between the base assembly (1) and the top cover assembly (2) and are respectively connected with the base assembly (1) and the top cover assembly (2), A channel (31) is provided in the cooling tooth (3), the bottom end of the channel (31) is connected to the liquid inlet chamber (11), and the top end of the channel (31) is connected to the return port liquid chamber (21);

When the position where the base assembly (1) is attached to the chip is heated, the heat is transferred to the liquid inlet chamber (11) through the base assembly (1), so that the liquid inlet chamber (11) The refrigerant in ) is boiled and gasified to form a gaseous refrigerant, and the passage (31) is arranged so that the gaseous refrigerant passing through the passage (31) enters the liquid return chamber (21) to condense to form a liquid refrigerant, and the The channel (31) is also configured to return the liquid refrigerant passing through the channel (31) to the liquid inlet chamber (11).
The radiator for communication setting according to claim 1, wherein the number of the cooling fins (3) is multiple, the plurality of cooling fins (3) are arranged in parallel and spaced apart, and the plurality of cooling fins (3) ) is at least one kind.
The radiator for communication setting according to claim 2, wherein a plurality of channels (31) are provided in each heat dissipation tooth (3), and a first interval or second interval.
The radiator for communication setting according to claim 1, wherein a through groove (34) is opened at the bottom of the heat dissipation tooth (3), and the through groove (34) communicates with the channel (31) ), the angle between the extending direction of the through groove (34) and the extending direction of the channel (31) is in the range of 85 degrees to 95 degrees.
The heat sink for communication setting according to claim 1, wherein the base assembly (1) comprises a bottom plate (12) and a bottom board (13), and the bottom board (13) is located on the bottom board ( 12) and connected to the bottom plate (12), the liquid inlet chamber (11) is formed between the bottom plug board (13) and the bottom board (12), and the bottom plug board (13) ) is provided with a first socket (132), the bottom of the heat dissipation tooth (3) is correspondingly provided with a first bump (32), and the first bump (32) passes through the first socket hole (132).
The radiator for communication setting according to claim 5, wherein one of the bottom plate (12) and the bottom board (13) is provided with a limiting column (121), and the other is provided with a limiting hole (131), the limiting column (121) is penetrated through the limiting hole (131).
The radiator for communication setting according to claim 5, wherein a support column (122) is provided on the side of the bottom plate (12) close to the bottom board (13), and the bottom plate (12) It is connected to the bottom board (13) through the support column (122).
The radiator for communication setting according to claim 5, wherein at least one of the bottom plate (12) and the bottom insert plate (13) is provided with a liquid injection pipe (4), the liquid injection pipe (4) Connect to the liquid inlet chamber (11) and deliver refrigerant to the liquid inlet chamber (11).
The radiator for communication setting according to claim 1, wherein the top cover assembly (2) comprises a cover plate (22) and a top board (23), the top board (23) being located in the The bottom of the cover plate (22) is connected with the cover plate (22), the liquid return cavity (21) is formed between the top insert plate (23) and the cover plate (22), The top plug board (23) is provided with a second insertion hole (231), the top of the heat dissipation tooth piece (3) is correspondingly provided with a second protrusion (33), and the second protrusion (33) penetrates through the the second jack (231).
The radiator for communication setting according to any one of claims 1-9, wherein, between the base assembly (1), the top cover assembly (2) and the heat dissipation fins (3) Connected by high temperature brazing.