WO2023029429A1 - Plaque de transfert de chaleur - Google Patents

Plaque de transfert de chaleur Download PDF

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Publication number
WO2023029429A1
WO2023029429A1 PCT/CN2022/080222 CN2022080222W WO2023029429A1 WO 2023029429 A1 WO2023029429 A1 WO 2023029429A1 CN 2022080222 W CN2022080222 W CN 2022080222W WO 2023029429 A1 WO2023029429 A1 WO 2023029429A1
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WO
WIPO (PCT)
Prior art keywords
channel
pipeline
heat transfer
flow channel
transfer plate
Prior art date
Application number
PCT/CN2022/080222
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English (en)
Chinese (zh)
Inventor
汪艳
刘欣
李帅
段凯文
Original Assignee
中兴通讯股份有限公司
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Publication of WO2023029429A1 publication Critical patent/WO2023029429A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • Embodiments of the present invention relate to the technical field of thermal management of electronic devices, and in particular, relate to a heat transfer plate.
  • the heat transfer element is compounded with a pipeline structure on the surface of the substrate, and the inside of the pipeline is filled with refrigerant, and the heat is removed through the latent heat of the phase change of the refrigerant, so that the heat transfer performance is more prominent on the basis of maintaining a compact size, compared with ordinary Metal fins and heat transfer plates have higher thermal conductivity, better temperature uniformity than ordinary fins, lighter weight, and great application prospects.
  • the heat transfer plate and the base plate are combined into a heat sink in the form of cogs or sticking teeth. Structure, has been widely used in communication base stations, air conditioners, LED (Light Emitting Diode, light emitting diode) cooling industry.
  • Some manufacturers sinter the capillary structure inside the heat transfer plate in order to solve the problem of liquid accumulation at the bottom of the heat transfer plate and no liquid replenishment at the upper heat source. Since the heat transfer plate is made of aluminum alloy, the aluminum powder sintering process is difficult, and the pipeline height is average. If it is less than 2mm, the internal sintered capillary structure will block the pipeline and other phenomena, and the measured heat dissipation effect is poor.
  • Embodiments of the present invention provide a heat transfer plate to at least solve the problems of liquid accumulation at the bottom of the heat transfer plate and lack of liquid at the upper heat source in the related art.
  • the heat transfer plate includes a base plate and a pipe structure compounded on the surface of the base plate, wherein the pipe structure includes a first evaporation flow channel and a plurality of spaced partitioned pipes, and each partitioned pipe
  • the path includes a gas ascending passage and a liquid descending passage communicated with the first evaporating passage, the gas ascending passage is used for the rising gaseous refrigerant working medium in the first evaporating passage to enter the partition pipeline, the The liquid downflow channel is used for the liquid refrigerant working medium in the partition pipeline to return to the first evaporation channel.
  • each subdivision pipeline is arranged at a corresponding position of the corresponding heat source region, and the liquid downflow channel of each subdivision pipeline is lower than corresponding to the bottom of the heat source zone.
  • the partitioned pipeline is a single-circuit pipeline composed of a plurality of sequentially connected U-shaped pipes, one end of the single-circuit pipeline is a gas ascending channel, and the other end is a liquid descending channel .
  • the partitioned pipeline is composed of a plurality of parallel pipelines, one end of each parallel pipeline is connected to the first evaporation channel, and the other ends are connected to each other to form a condensation channel for the refrigerant working medium .
  • the straight pipe sections of the partitioned pipelines form a preset included angle with the horizontal direction.
  • the pipeline structure further includes a liquid storage chamber and a second evaporation flow channel, wherein the liquid storage chamber is arranged on a side close to the heat source area of the substrate, and is located at the first evaporation channel. Below the channel and the second evaporation channel, and communicate with the first evaporation channel and the second evaporation channel.
  • the inner diameter of the second evaporation channel is smaller than the following critical diameter:
  • ⁇ is the surface tension value of the refrigerant working medium
  • ⁇ l is the density of the liquid refrigerant working medium
  • ⁇ v is the gaseous refrigerant working medium density
  • g is the gravitational acceleration value
  • the inner diameter of the first evaporation channel is larger than the critical diameter.
  • the first evaporation channel and the second evaporation channel are spaced apart.
  • the first evaporating channel and the second evaporating channel are connected at positions of a plurality of heat source regions.
  • the pipeline structure is made by an inflation process or a brazing process.
  • the gas-liquid phase separation is realized through the partitioned pipeline structure design of the heat transfer plate, which avoids the increase of flow resistance caused by gas-liquid mixing, thereby improving the temperature uniformity of the entire plate; at the same time, it can avoid dryness of the top heat source
  • the burning phenomenon solves the problem of lack of liquid at the upper heat source.
  • Fig. 1 is a schematic plan view of a heat transfer plate pipeline according to the related art
  • Fig. 2 is a schematic structural view of a heat transfer plate according to an embodiment of the present invention.
  • Fig. 3 is a schematic diagram of a partitioned pipeline structure in a heat transfer plate according to an embodiment of the present invention
  • Fig. 4 is a schematic structural diagram of a composite pipeline in a heat transfer plate according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the flow path of gas and liquid in a composite pipeline structure according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of another pipeline structure of a heat transfer plate according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the flow path of gas and liquid in the pipeline structure according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of another partitioned pipeline structure of a heat transfer plate according to an embodiment of the present invention.
  • Fig. 9 is a schematic diagram of a flow path of gas and liquid in a pipeline structure according to an embodiment of the present invention.
  • a heat transfer plate is provided in this embodiment.
  • the optimized design of the pipeline shape and structure is expected to solve the problem of liquid accumulation at the bottom of the heat transfer plate and lack of liquid at the upper heat source through the design of the pipeline structure.
  • the heat transfer plate provided in this embodiment may include a base plate and a piping structure compounded on the surface of the base plate, the piping structure includes a first evaporation flow channel and a plurality of spaced partitioned piping, and each partitioned piping includes A gas ascending channel and a liquid descending channel communicated with the first evaporating channel, the gas ascending channel is used for the rising gaseous refrigerant in the first evaporating channel to enter the partition pipeline, and the liquid descending The flow channel is used to return the liquid refrigerant working medium in the partition pipeline to the first evaporation flow channel.
  • the zonal design of the first evaporation flow channel and the condensation pipeline structure is designed to ensure that there is liquid in the position of the evaporation flow channel corresponding to the high power consumption heat source area, and to avoid dry burning in the top heat source area.
  • the first evaporating channel, the second evaporating channel, and the partitioned pipeline structure at the same time, and design the diameter of the second evaporating channel in the evaporating channel structure to be smaller than the equivalent diameter, and the remaining tube diameters It is larger than the equivalent diameter to ensure that the surface tension of the refrigerant can overcome the gravity when the refrigerant flows upward in the second evaporator channel, which can avoid the dry burning phenomenon of the top heat source and further solve the dry burning phenomenon of the top, thereby improving the temperature uniformity of the entire board.
  • Fig. 2 is a schematic structural diagram of a heat transfer plate according to an embodiment of the present invention.
  • the heat transfer plate may be a two-phase heat transfer plate for heat dissipation with a pipe structure 2 compounded on the surface 1 of the aluminum substrate.
  • the pipeline 2 can be processed by an inflation process or a brazing process.
  • the pipeline 2 can be a series structure as shown in Figure 2. Therefore, compared with the honeycomb pipeline structure used in the industry, the gas-liquid mixing flow is chaotic. In this embodiment, the gas-liquid phase can be realized through the series pipeline structure. Separation reduces flow resistance, thereby improving heat transfer efficiency and temperature uniformity of the entire heat transfer plate.
  • the pipeline 2 can also adopt other structural manners.
  • Q is the corresponding position of the high power consumption chip
  • 31, 32 and 33 are heat sources on the substrate
  • the side close to the heat source (31, 32 and 33) is the area near the heat source of the substrate
  • the pipeline structure 2 near the heat source area is defined as the evaporation area
  • the side away from the heat source is the far heat source area of the substrate
  • the pipeline structure 2 near the far heat source area is defined as the condensation area.
  • Pipeline structure 2 the inside of the pipeline is filled with refrigerant working fluid, and the heat Q is transferred to the remote heat source area through the phase change latent heat of the refrigerant working fluid, and the heat exchange with the air is natural, so as to realize the uniform temperature effect of the whole board.
  • the first evaporation channel 43 , the second channel 41 and the liquid storage chamber 4 can be designed in the evaporation area.
  • the first evaporation flow channel 43 and the second evaporation flow channel 41 are located above the liquid storage chamber 4 and communicate with the liquid storage chamber 4, the head end 241 and the tail end 201 of the series pipeline structure are connected with the first evaporation flow channel 43,
  • the middle part of the first evaporating channel 43 and the second evaporating channel 41 is separated by a physical spacer 42 .
  • the equivalent diameter of the second evaporating channel 41 is smaller than the critical diameter, and the remaining pipe diameters are larger than the critical diameter, so as to ensure that the surface tension of the refrigerant can overcome the gravity when the refrigerant flows upward in the second evaporating channel 41, and avoid dry burning at the top.
  • D is the equivalent diameter of the second evaporating channel 41
  • ⁇ is the surface tension value of the refrigerant working medium
  • ⁇ l is the liquid density of the refrigerant working medium
  • ⁇ v is the gas density of the refrigerant working medium
  • g is the value of the acceleration of gravity.
  • the characteristics of the pulsating heat pipe are adopted in the second evaporation channel in this embodiment.
  • the diameter of the channel in the condensation area is larger, which reduces the flow resistance and has higher heat transfer efficiency than the pulsating heat pipe. It should be noted that although the number of the first evaporating channel 43 shown in FIG. 2 is one, it can be understood that multiple first evaporating channels 43 can be provided as required.
  • FIG. 3 is a schematic diagram of the pipeline partition structure of the heat transfer plate according to an embodiment of the present invention.
  • the pipeline structure 2 of the heat transfer plate adopts a partition design. Specifically, as shown in FIG. 3 , the pipeline structure 2 is disconnected from oblique pipelines near the heat source position Q evaporation area, such as pipelines 211 and 212 near the heat source 31 and pipelines 221 and 222 near the heat source 32. , and the pipelines 231 and 232 near the heat source 32, which are directly connected to the evaporating channel, that is, in this way, the design of the pipeline partition structure is realized.
  • the partition structure design can be performed for all high power consumption chips as required, and the partition structure design can also be performed for some of the high power consumption chips, which is not limited to the number of partitions.
  • the divisional positions of the pipeline structure include gas ascending passages (211, 221 and 231) and liquid descending passages (212, 222 and 232), wherein the gas ascending passages (211 , 221 and 231) are gas inlets, and liquid downflow channels (212, 222 and 232) are liquid outlets.
  • the outlet height of the liquid downflow channel (212, 222 and 232) at the partition position should be lower than the bottom position of the corresponding heat source area, for example, the liquid downflow channel 222 is located at the lower part of the heat source area 32, for example, at 0-10 mm , so that there is backflow liquid at the heat source.
  • the top of the pipeline 2 is provided with a refrigerant filling port 5, and the top of the first evaporation channel communicates with the first end 241 of the partitioned pipeline structure of the pipeline 2 through the horizontal tube 22.
  • the bottom end of an evaporation channel communicates with the tail end 201 of the partitioned piping structure.
  • the oblique pipeline of each partition of the pipeline 2 forms a certain angle with the horizontal direction, for example, the angle can be between 30° and 60°, so that the gaseous refrigerant in the first evaporating channel can easily enter the partition pipe way, and facilitate the return of the liquid refrigerant working medium in the divisional pipeline to the first evaporator channel.
  • Fig. 4 is a schematic diagram of a composite pipeline structure of a heat transfer plate according to an embodiment of the present invention.
  • the first evaporation channel and the second evaporation channel and the partitioned pipeline structure are designed at the same time.
  • the heat transfer plate can be composed of a substrate 1 and a pipeline 2 compounded on the surface of the substrate, and a first evaporation channel 43 is provided on the side of the heat source (31, 32, 33) , the second evaporation channel 41 and the liquid storage chamber 4 .
  • the middle part of the first evaporating flow channel 43 and the second evaporating flow channel 41 is separated by a physical spacer 42 , and the width of the spacer 42 can generally be, for example, between 1 mm and 2 mm.
  • the liquid storage chamber 4 is located directly below the first evaporating channel 43 and the second evaporating channel 41 , and is connected to the lower outlet of the pipeline 2 .
  • the top of the pipeline 2 is provided with a refrigerant filling port 5 , and the top of the first evaporating channel communicates with the upper inlet of the partitioned pipeline structure of the pipeline 2 through a horizontal tube 22 .
  • the equivalent diameter of the second evaporating channel 41 is smaller than the critical diameter, therefore, the surface tension of the refrigerant can overcome the effect of gravity g when the refrigerant moves upward in the second evaporating channel 41 .
  • the second evaporation channel 41 and the liquid storage chamber 4 structure are used to realize the suction of the liquid, and at the same time, the partitioned pipeline structure is set at the heat source area, It can ensure that the position of the heat source area does not appear dry burning.
  • the pipeline 2 is arranged as a partitioned single-circuit pipeline structure near the heat source area.
  • the adjacent flow channels 211 and 212 are not directly connected, but only connected to the first evaporation flow channel 43, and each partition forms a single circuit.
  • the single-loop structure ensures phase separation during gas-liquid flow
  • a partitioned pipeline structure is set at the position of the high-power heat source Q to ensure that there is refrigerant backflow supplement near the heat source area, which greatly improves the temperature uniformity of the entire board. Specifically, as shown in FIG.
  • the pipeline structure 2 is composed of a plurality of oblique pipelines, and adjacent pipelines are connected in series, connected by 21 in the evaporation zone, and connected by 23 in the condensation zone. , the first end 241 and the tail end 201 of the series pipeline structure are connected to the first evaporation channel 43 .
  • the gas-liquid phase separation is realized by using the evaporation flow channel structure and the partitioned pipeline structure design, which avoids the increase of flow resistance caused by gas-liquid mixing and avoids the phenomenon of dry burning of the top heat source, and solves the lack of liquid at the upper heat source The problem of improving the temperature uniformity of the entire board.
  • Fig. 5 is a schematic diagram of the flow of gas and liquid in the composite pipeline structure according to an embodiment of the present invention.
  • the filling port is welded and sealed to ensure that the inside of the pipeline 2 is a vacuum-tight space.
  • the working process of the high-efficiency heat dissipation structure provided by this embodiment is as follows: the refrigerant is heated and evaporated in the first evaporating channel 43 and the second evaporating channel 41, driven by the internal pressure, it flows from the near heat source area 21 along the The gas ascending channel (upward position of the arrow) moves towards the heat source area 23 far away from the pipeline 2. During the movement, the gas continuously condenses into a liquid working medium.
  • the pipeline structure is a single-circuit structure
  • the liquid descends along the liquid under the push of high-temperature steam
  • the tube (downward arrow position) flows back to the near heat source area, and after being vaporized again at the corner of the near heat source area 21, the high-temperature steam moves along the gas ascending channel to the far heat source 23.
  • the heat Q is transferred to the remote heat source area 23 to realize the uniform temperature process of the whole board.
  • the gas-liquid phase separation is realized due to the single-circuit structure, which improves the two-phase heat exchange efficiency.
  • the refrigerant liquid in the liquid descending pipeline near the heat source ( 31 , 32 , 33 ) can flow into the first evaporator flow channel 43 due to the two-partition structure design of the pipeline.
  • the refrigerant liquid in the liquid descending flow 222 near the heat source 32 flows along the pipeline to the first evaporating channel 43, and the high-temperature steam in the first evaporating channel 43 moves upward along the first evaporating channel 43.
  • the high-temperature steam exerts a certain upward driving force on the liquid moving downward, and the liquid moves upward, taking away the heat of the heat source Q through the latent heat of vaporization, and the liquid phase changes into gas, and when the gas moves to the lower part of the upper heat source 32, the pressure is lower
  • the gas ascending flow (for example, 221, 241) enters the interior of the pipeline 2 and moves toward the far heat source area, and after continuous condensation, it moves along the liquid downpipe to the position of the heat source Q, realizing a cycle.
  • the liquid in the 201 liquid descending channel continuously moves to the liquid storage chamber 4, the liquid in the liquid storage chamber is pushed upward, and the inner diameter of the second evaporation channel 41 If the diameter is smaller than the critical diameter, the surface tension overcomes the gravity, the liquid moves upwards along the second evaporation channel 41, and turns into a gas, and the high-temperature steam flows along 22 to the pipeline structure 2, and finally condenses inside the pipeline 2 Enter the liquid storage chamber 4 again through 201 to realize a cycle and continuously take away the heat of the heat source area.
  • this embodiment further provides an internal pipeline structure of the heat transfer plate.
  • Fig. 6 is a schematic diagram of the internal pipeline structure of the heat transfer plate. As shown in FIG. 6 , in this embodiment, the pipeline 2 near the heat source Q adopts a partitioned structure design, which is the same as that of the above-mentioned embodiment 3.
  • the internal pipeline structure of the heat transfer plate of this embodiment is basically the same as that of Embodiment 3, the difference is that in the above-mentioned Embodiment 3, the first evaporating channel 43 and the second evaporating channel 41 are connected by entities 42
  • the first evaporating channel 43 and the second evaporating channel 41 are connected in the area of the heat source Q (411, 412 and 413), and the direction of the communication area is consistent with the direction of the gas ascending flow channel in the area of the heat source. is the intersection of the gas upflow channel and the solid area 42 .
  • This communication design can facilitate gas-liquid exchange at the intersection of the heat source Q area, so that there is liquid at the intersection.
  • Fig. 7 is the moving path of liquid and gas inside the heat transfer plate according to an embodiment of the present invention.
  • the working process of the high-efficiency heat dissipation structure of this embodiment is: the refrigerant liquid in the pipeline structure near the heat source area can flow to the first evaporation flow along the liquid descending channel (for example, the liquid descending channel 222) Road 43, the high-temperature steam in the first evaporation channel 43 moves upward along the channel, and the upward-moving high-temperature steam exerts a certain upward driving force on the downward-moving liquid, and the liquid moves upward, and the heat of the heat source Q is carried by the latent heat of vaporization Go, through the partitioned pipeline design at the heat source Q, so as to ensure that there is liquid at the position of the heat source Q, and at the same time, because the liquid in the liquid descending channel (for example, the liquid descending channel 222) continuously moves to the liquid storage chamber 4, it pushes the liquid storage chamber The internal liquid moves upwards, the inner diameter of the liquid
  • this embodiment further provides another internal pipeline structure of the heat transfer plate.
  • Fig. 8 is a schematic diagram of the internal piping structure of the heat transfer plate of this embodiment
  • Fig. 9 is a movement path of liquid and gas inside the heat transfer plate according to this embodiment.
  • the piping structure of this embodiment is basically the same as that of Embodiment 3, and the piping 2 is designed in partitions for the heat sources (31, 32, 32).
  • the pipelines are of a series structure, but in this embodiment, the adjacent pipelines of the pipeline 2 are multiple parallel pipelines.
  • the evaporation area and the remote heat source area are connected by a plurality of parallel pipeline structures, and the condensation channels (231, 232, 233, 234) of the corresponding channel to the heat source area Q are separated.
  • the condensation channels (231, 232, 233, 234) of the corresponding channel to the heat source area Q are separated.
  • the condensation channel 233 corresponding to the flow channel 212 and the condensation channel 234 corresponding to the flow channel 211 are physically separated at the condensation end to ensure that the refrigerant inside the condensation channel 233 can only flow into the first evaporation flow channel 43 through the flow channel 212 to realize The heat in the heat source area Q is transferred, but cannot flow to the bottom through the condensation channel 234 .
  • the heat dissipation is divided into several circulation structures through the division of the condensing pipeline to ensure that the upper liquid can flow back to the upper part instead of flowing to the bottom to accumulate, thereby improving the heat transfer efficiency of the entire plate.
  • the pipeline partition structure in this embodiment is only an example. It can be understood that based on the same principle, other partition structures can also be used in this embodiment, and the number of straight pipes in each partition , the connection method is not limited, as long as the same technical effect can be achieved.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

Les modes de réalisation de la présente invention concernent une plaque de transfert de chaleur. La plaque de transfert de chaleur comprend un substrat (1) et une structure de conduite (2) composée avec une surface du substrat (1), la structure de conduite (2) comprenant un premier canal d'écoulement d'évaporation (43) et une pluralité de conduites de séparation espacées ; chaque conduite de séparation comprend un canal d'écoulement montant de gaz (211, 221, 231) et un canal d'écoulement de liquide tombant (212, 222, 232) qui sont en communication avec le premier canal d'écoulement d'évaporation (43) ; le canal d'écoulement montant de gaz (211, 221, 231) est utilisé pour un réfrigérant gazeux s'élevant dans le premier canal d'écoulement d'évaporation (43) pour entrer dans la conduite de séparation ; et le canal d'écoulement de chute de liquide (212, 222, 232) est utilisé pour un réfrigérant liquide dans la conduite de séparation pour refluer vers le premier canal d'écoulement d'évaporation (43). Au moyen des modes de réalisation de la présente invention, le problème de chauffage à sec se produisant dans une source de chaleur au sommet de la plaque de transfert de chaleur est résolu, ce qui permet d'obtenir l'effet d'amélioration de la capacité d'égalisation de température de la plaque entière.
PCT/CN2022/080222 2021-08-30 2022-03-10 Plaque de transfert de chaleur WO2023029429A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111007839.4A CN115734559A (zh) 2021-08-30 2021-08-30 一种传热板
CN202111007839.4 2021-08-30

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WO2023029429A1 true WO2023029429A1 (fr) 2023-03-09

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PCT/CN2022/080222 WO2023029429A1 (fr) 2021-08-30 2022-03-10 Plaque de transfert de chaleur

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WO (1) WO2023029429A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101566748A (zh) * 2008-04-22 2009-10-28 鸿富锦精密工业（深圳）有限公司 散热模组及采用该散热模组的背光模组
US20100163212A1 (en) * 2008-12-26 2010-07-01 Chi-Te Chin Flat loop Heat pipe
CN201803624U (zh) * 2010-10-09 2011-04-20 天津大学 多通道并联回路型脉动热管
CN105571366A (zh) * 2015-12-25 2016-05-11 南昌大学 一种带有倾角联通管结构的脉动热管
CN107466195A (zh) * 2017-09-14 2017-12-12 郭良安 脉动热管及热交换器
US20180209745A1 (en) * 2017-01-26 2018-07-26 Asia Vital Components Co., Ltd. Loop heat pipe structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101566748A (zh) * 2008-04-22 2009-10-28 鸿富锦精密工业（深圳）有限公司 散热模组及采用该散热模组的背光模组
US20100163212A1 (en) * 2008-12-26 2010-07-01 Chi-Te Chin Flat loop Heat pipe
CN201803624U (zh) * 2010-10-09 2011-04-20 天津大学 多通道并联回路型脉动热管
CN105571366A (zh) * 2015-12-25 2016-05-11 南昌大学 一种带有倾角联通管结构的脉动热管
US20180209745A1 (en) * 2017-01-26 2018-07-26 Asia Vital Components Co., Ltd. Loop heat pipe structure
CN107466195A (zh) * 2017-09-14 2017-12-12 郭良安 脉动热管及热交换器

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