WO2021217789A1 - Plaque de dissipation de la chaleur à supraconduction de la chaleur, dispositif de dissipation de la chaleur et appareil de station de base 5g - Google Patents

Plaque de dissipation de la chaleur à supraconduction de la chaleur, dispositif de dissipation de la chaleur et appareil de station de base 5g Download PDF

Info

Publication number
WO2021217789A1
WO2021217789A1 PCT/CN2020/095042 CN2020095042W WO2021217789A1 WO 2021217789 A1 WO2021217789 A1 WO 2021217789A1 CN 2020095042 W CN2020095042 W CN 2020095042W WO 2021217789 A1 WO2021217789 A1 WO 2021217789A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat
pipeline
thermal superconducting
pipe
Prior art date
Application number
PCT/CN2020/095042
Other languages
English (en)
Chinese (zh)
Inventor
仝爱星
孙会会
曾巧
林深
Original Assignee
浙江嘉熙科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010345039.2A external-priority patent/CN111504095A/zh
Priority claimed from CN202020665914.0U external-priority patent/CN212458058U/zh
Application filed by 浙江嘉熙科技有限公司 filed Critical 浙江嘉熙科技有限公司
Publication of WO2021217789A1 publication Critical patent/WO2021217789A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the technical field of heat dissipation, in particular to a thermal superconducting heat sink, a radiator and 5G base station equipment.
  • the purpose of the present invention is to provide a thermal superconducting heat sink, a radiator and 5G base station equipment, which are used to solve the problem of the all-aluminum toothed radiator or die-cast radiator in the prior art It is large and bulky, and it also has disadvantages such as uneven heat dissipation and low heat dissipation efficiency, which cannot meet the heat dissipation requirements of 5G communication base station equipment with high integration, high power, miniaturization, light weight, and high heat flow density.
  • the present invention provides a thermal superconducting heat sink, in which a heat dissipation main pipe, a liquid drop pipe, a heat receiving side connecting pipe, and a condensing side connecting pipe are distributed in the thermal superconducting heat sink
  • the heat-receiving side communication pipeline is located on the side of the thermal superconducting heat dissipation plate adjacent to the device, and the condensing-side pipeline is located on the side opposite to the heat-receiving side communication pipeline;
  • the heat dissipation main pipe Connected between the heat-receiving-side communication pipeline and the condensing-side communication pipeline, the liquid drop pipeline is located under the heat dissipation main pipe one-to-one correspondence, and one end is connected to the corresponding heat dissipation main pipe , The other end is connected to the heat-receiving side communication pipeline;
  • the heat dissipation main pipe is gradually inclined upward in a direction away from the heat-receiving communication
  • the plurality of heat dissipation main pipes are arranged in parallel and spaced apart, and the heat-receiving side communication pipeline and the condensing side communication pipeline are arranged in parallel and spaced apart.
  • the main heat dissipation pipeline is a circular arc-shaped pipeline with the arc-shaped protrusion facing downward.
  • the thermal superconducting heat dissipation plate further includes a plurality of steam rising pipes, the steam rising pipes are located above the heat dissipation main pipe in a one-to-one correspondence, and both ends are connected with the heat dissipation main pipe.
  • the thermal superconducting heat dissipation plate further includes a plurality of steam rising pipes, the steam rising pipes are located above the heat dissipation main pipe in a one-to-one correspondence, and one end is connected to the heat dissipation main pipe, and the other One end is connected with the condensing side communication pipeline.
  • the heat-receiving-side connecting pipe, the heat-radiating main pipe, and the liquid descending pipe constitute a rectangular island-free area;
  • the heat-radiating main pipe, the steam rising pipe, and the condensing-side connecting pipe constitute a rectangular pipe-less island area. Road isolated island area.
  • the thermal superconducting heat dissipation plate further includes an auxiliary branch, the auxiliary branch is located at the lower part of the heat dissipation main pipe at the bottom and both ends are connected with the bottom heat dissipation main pipe.
  • the present invention also provides a thermal superconducting radiator.
  • the thermal superconducting radiator includes a radiator substrate and a plurality of thermal superconducting heat dissipation plates as described in any of the above solutions;
  • the radiator substrate has a first surface And a second surface opposite to the first surface, the first surface is provided with a plurality of mounting areas for placing heating devices from bottom to top;
  • the plurality of thermal superconducting heat dissipation plates are arranged in parallel and spaced apart On the second surface, and each of the thermal superconducting heat dissipation plates extends in the longitudinal direction.
  • the second surface of the heat sink substrate has a channel
  • one end of the thermal superconducting heat sink has a bending part
  • the bending part is inserted in the channel.
  • the present invention also provides a 5G base station equipment.
  • the 5G base station equipment includes a heating device and the thermal superconducting heat sink according to any one of the foregoing solutions.
  • the heating device of the 5G base station device is installed on the heat sink substrate. area.
  • thermal superconducting heat sink, heat sink and 5G base station equipment of the present invention have the following beneficial effects:
  • the thermal superconducting heat dissipation plate of the present invention has improved and optimized heat dissipation pipeline structure design, which solves the problems of local dryness and high temperature caused by the insufficient liquid heat conduction working medium of the upper heat source located in the thermal superconducting heat dissipation plate, and can reduce heat transfer at the same time.
  • the total amount of working fluids reduces the weight and volume of thermal superconducting heat sinks while significantly improving heat dissipation uniformity and heat dissipation efficiency, which can fully meet the development requirements of 5G base station equipment such as miniaturization, light weight, high integration and uniform temperature.
  • the 5G base station equipment based on the thermal superconducting radiator of the present invention can significantly improve the heat dissipation performance, which helps to extend the service life of the equipment and improve the performance of the equipment.
  • FIG. 1 is a schematic diagram of the structure of the thermal superconducting heat sink in the first embodiment.
  • Fig. 2 is a schematic diagram showing the flow of the heat transfer working fluid in the thermal superconducting heat sink in Fig. 1.
  • FIG. 3 is a schematic diagram showing the structure of the thermal superconducting heat sink in the second embodiment.
  • FIG. 4 is a schematic diagram showing the flow of the heat transfer working fluid in the thermal superconducting heat sink in FIG. 3.
  • FIG. 5 is a schematic diagram showing the structure of the thermal superconducting heat sink in the third embodiment.
  • FIG. 6 is a schematic diagram showing the structure of the thermal superconducting heat sink in the fourth embodiment.
  • FIG. 7 is a partial enlarged schematic diagram showing the connection between the thermal superconducting heat sink in FIG. 6 and the heat sink substrate.
  • the present invention provides a thermal superconducting heat sink 1 in which a heat dissipation main pipe 11, a liquid drop pipe 12, a heat receiving side communication pipe 13 and Condensation side communication pipeline 14;
  • the heat-receiving side communication pipeline 13 is located on the side of the thermal superconducting heat sink 1 adjacent to the heating device 3, and the condensing-side pipeline is located in the heat-receiving side communication pipeline 13 on the opposite side;
  • the heat dissipation main pipe 11 is connected between the heat-receiving side communication pipe 13 and the condensing side communication pipe 14, and the liquid down pipeline 12 is located in the heat dissipation main pipe one-to-one correspondence 11 below, and one end is connected to the corresponding heat dissipation main pipe 11, and the other end is connected to the heat receiving side communication pipe 13;
  • the heat dissipation main pipe 11 is in a direction away from the heat receiving side communication pipe 13 Gradually inclined upward;
  • the improved and optimized thermal superconductor path structure of the thermal superconducting heat sink of the present invention solves the problems of local dryness and high temperature caused by the insufficient liquid heat transfer working medium 4 in the upper heat source of the thermal superconducting heat sink, and at the same time, it can reduce The total amount of heat transfer working medium 4 reduces the weight and volume of the thermal superconducting heat sink 1 while significantly improving heat dissipation uniformity and heat dissipation efficiency, which can fully meet the miniaturization, light weight, high integration and uniform temperature of 5G base station equipment And other development requirements.
  • the side of the thermal superconducting heat sink 1 adjacent to the heating device 3, that is, the place where it is connected to the heat-receiving-side communication pipe 13, has a pipe-free heat-receiving area 17 (ie There are no pipelines in this area).
  • This area is formed because of the need to reserve a space on the thermal superconducting heat sink 1 to connect with the heat sink substrate 2 to avoid connecting the thermal superconducting heat sink 1 and the heat sink substrate 2
  • the pipeline is damaged during the process of connection (for example, connection by means of glue connection, welding, expansion joint, embedding, etc.).
  • the thermal superconducting heat sink 1 at one end of the thermal superconducting heat sink 1 away from the heating element 3, that is, on the outside of the condensing-side communicating pipe 14, there is a pipe-less heat dissipation area 18, which is not formed with pipes to avoid When the thermal superconducting heat sink 1 collides with the outside, the pipeline is damaged. Because the main heat dissipation pipeline 11, the liquid down pipeline 12, the heat-receiving side communication pipeline 13 and the condensing side communication pipeline 14 communicate with each other to form a closed pipeline (the thermal superconducting heat sink 1 is provided with a heat transfer working medium 4). Filling port (not labeled), the heat transfer working medium 4 inside is filled during the manufacturing process of the thermal superconducting heat sink 1. Once any section of the pipeline has pressure-bearing strength and air-tightness problems resulting in deformation and liquid leakage, it will destroy the performance of the heat conduction plate, so the pipe-free area on both sides can play a better protective effect.
  • heating devices are electronic components that can achieve preset functions, including but not limited to radio frequency generators, power amplifiers, filters, microprocessors, memories, power managers, etc., which generate heat during operation. Causes the temperature to rise, too high temperature will reduce the performance, operating speed and even damage of the device, so these heating devices need to be dissipated in time.
  • the thermal superconducting heat sink 1 realizes heat transfer based on the thermal superconducting heat transfer technology; the thermal superconducting technology is to fill the heat transfer working medium 4 in the sealed interconnected microchannels, and pass the heat transfer The evaporation or condensation phase change of the thermal working medium 4 realizes the phase change heat transfer technology of thermal superconducting heat transfer.
  • the thermal superconducting heat dissipation plate 1 is a composite plate structure, including a first plate and a second plate, the thermal superconductor path is formed by a rolling inflation process or a mold forming brazing process, and the first plate
  • the material of the second plate and the second plate are both metal materials with good thermal conductivity, such as, but not limited to, copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, or any combination of more than one, that is, the
  • the first plate and the second plate may be a single layer of material or multiple layers of material, but the inner layer is preferably an aluminum material layer.
  • the first plate and the second plate may be a copper-aluminum composite plate including a copper material layer and an aluminum material layer, or a stainless steel-aluminum composite plate including a stainless steel material layer and an aluminum material layer, It may also be an iron-aluminum composite sheet including an iron material layer and an aluminum material layer, or an aluminum alloy-aluminum composite sheet including an aluminum alloy material layer and an aluminum material layer; all of the first sheet and the second sheet
  • the aluminum material layer is in contact, that is, the second material layer in the first plate is an aluminum material layer, and the second material layer in the second plate is an aluminum material layer.
  • the inner layers of the first plate and the second plate are set as aluminum material layers.
  • the first plate and the second plate are aluminum-copper composite plates, it can be ensured that the copper material layer is located outside , That is, the outer surface of the thermal superconducting heat sink 1 is a copper layer, which can be directly brazed or soldered, which is convenient for operation and stable in quality, which can solve the welding problem between the thermal superconducting heat sink 1 and the heat sink substrate 2 .
  • the thermal superconducting heat dissipation plate 1 may be in a single-sided expansion form, that is, the thermal superconducting heat dissipation pipeline (including the heat dissipation main pipeline 11, the liquid down pipeline 12, the heat receiving side communication pipeline 13 and the condensation side communication pipeline 14 , These pipelines can be formed simultaneously in the same process) only protrude from one surface of the thermal superconducting heat sink 1, or they can be double-sided expansion, that is, the thermal superconducting heat dissipation pipes protrude from The thermal superconducting heat sink 1 is on both surfaces.
  • the single-sided expansion is preferred, and when multiple thermal superconducting heat sinks 1 are used in the same thermal superconducting heat sink, the protrusions of the multiple thermal superconducting heat sinks 1 are preferably symmetrical. Outer distribution (take the centerline of the thermal superconducting radiator as the criterion, the thermal superconducting heat dissipation pipes on the surface of the thermal superconducting heat sink 1 on both sides bulge away from the centerline) to ensure the thermal superconducting heat dissipation
  • the structure is more balanced and stable while having good heat dissipation performance.
  • the surface of the thermal superconducting heat sink 1 may be anodized to form an oxide film (not shown) on the surface of the thermal superconducting heat sink 1, thereby improving the heat dissipation of the thermal superconducting heat sink.
  • the corrosion resistance of the plate 1 can also increase the emissivity of the thermal superconducting heat sink 1 and enhance its heat exchange with the surrounding air.
  • the plurality of heat dissipation main pipes 11 are arranged in parallel and spaced apart, and the heat receiving side communication pipeline 13 and the condensing side communication pipeline 14 are arranged in parallel and spaced apart.
  • the main heat dissipation pipe 11 is a circular arc-shaped pipe with the arc-shaped protrusion facing downward.
  • the liquid descending pipeline 12 includes a first branch and a second branch.
  • the first branch is approximately vertical, one end of which is connected to the corresponding heat dissipation main pipe 11, and the other end is connected to the second branch.
  • the other end of the second branch is connected to the heat-receiving side communication pipeline 13 (it should be noted that when the pipelines are described as being connected to each other in this embodiment, the pipelines are also connected to each other.
  • the second branch is a near-horizontal pipeline or the inclination (that is, the angle with the horizontal plane) is smaller than the inclination of the heat dissipation main pipeline 11.
  • the main heat dissipation pipeline 11, the liquid down pipeline 12 and the heat-receiving-side communication pipeline 13 enclose a plurality of rectangular-shaped island-free island regions 10.
  • the thermal superconducting heat dissipation plate 1 further includes an auxiliary branch 16 which is located at the lower part of the main heat dissipation main line 11 at the bottom and is connected at both ends with the main heat dissipation main line 11 at the bottom.
  • the working principle of the thermal superconducting heat sink 1 of the present invention will be described below in conjunction with FIG. 1 and FIG. 2.
  • One end of the thermal superconducting heat sink 1 is close to the heat receiving side of the heat source (heating device 3), and the liquid drop pipeline 12 is used as a pipeline for the drop of the condensed liquid phase and is connected to the heat dissipation main pipe 11 and the heat receiving side communication pipeline 13, and
  • the liquid down pipeline 12 is located below the main heat dissipation line 11, so the liquid after heat exchange and condensation will mainly enter the liquid down pipeline 12 after reaching the intersection of the main heat dissipation line 11 and the liquid down pipeline 12, and then enters the heated side Connecting pipe 13, and the vapor bubbles generated by the heating and evaporation of the liquid working fluid in the heat-receiving side communicating pipe 13 flow upwards and enter the upwardly inclined heat dissipation main pipe 11.
  • the non-evaporated liquid in the heat-receiving side communication pipe 13 close to the heating element 3 flows downward to participate in the evaporation, condensation and heat exchange of the lower heat source, and does not enter a part of the gas-liquid mixture of the heat dissipation main pipe 11 Flow upward to participate in the evaporation, condensation and heat exchange of the upper heat source.
  • the condensing side communicating pipeline 14 far away from the heating element 3 the uncondensed excess gas from the heat dissipation main pipe 11 flows upwards and enters the upper heat dissipation main pipe 11 for condensation, and the excess condensed liquid flows downwards and enters the lower heat dissipation.
  • the main pipe 11 participates in the evaporation, so that the parts of the internal pipeline of the entire thermal superconducting heat sink 1 are connected to each other, and the pressure balance and the temperature are uniform. A small amount of heat transfer working fluid 4 can achieve a better heat dissipation effect. Conducive to the miniaturization and light weight of the radiator.
  • this embodiment provides a thermal superconducting heat sink 1 of another structure.
  • the difference between the thermal superconducting heat dissipation plate 1 of this embodiment and the first embodiment is that the thermal superconducting heat dissipation plate 1 of this embodiment further includes a plurality of steam rising pipes 15 which are located at all locations in a one-to-one correspondence. Above the heat dissipation main pipe 11, and both ends are connected with the heat dissipation main pipe 11, and the steam rising pipe 15 and the liquid falling pipe 12 are usually spaced apart, and the projections of the two in the longitudinal direction do not overlap .
  • the steam rising pipe 15 may include a straight section and a bent section located at both ends of the straight section, so the steam rising pipe 15 and the heat dissipation main pipe 11 enclose a plurality of similar rectangular islands without pipes.
  • Area 10 please refer to FIG. 3 for details.
  • the thermal superconducting heat dissipating plate 1 of this embodiment does not have the auxiliary branch 16 in the first embodiment, but is formed on the lower right side of the thermal superconducting heat dissipating plate 1 and gradually increases in the direction away from the heat-receiving side communicating pipeline 13 The heat dissipation area without pipes. Except for the above differences, the other structures of the thermal superconducting heat sink 1 of this embodiment are the same as those of the first embodiment.
  • this embodiment provides a thermal superconducting heat sink 1 of another structure.
  • the difference between the thermal superconducting heat sink 1 of this embodiment and the second embodiment is that both ends of the steam rising pipe 15 of the thermal superconducting heat sink 1 of the second embodiment are connected with the heat dissipation main pipe 11, while the present embodiment
  • the steam rising pipes 15 are also located above the heat dissipation main pipe 11 in a one-to-one correspondence, but one end of the steam rising pipe 15 of this embodiment is connected to the heat sink
  • the main pipe 11 is connected, and the other end is connected with the condensing side communication pipe 14, and the steam rising pipe 15 and the liquid falling pipe 12 are usually spaced apart, and the projections of the two in the longitudinal direction do not overlap.
  • the steam rising pipe 15 may include a straight section and a bent section located at one end of the straight section.
  • the steam rising pipe 15, the heat dissipation main pipe 11 and the condensing side communication pipe 14 enclose a plurality of similar rectangular shapes. No pipeline island area 10.
  • the thermal superconducting heat sink 1 of the present invention can be directly connected to the heating device 3 to realize heat dissipation.
  • a plurality of heating devices 3 can be directly attached to the side wall of the thermal superconducting heat sink 1 and distributed up and down in the longitudinal direction.
  • This heat dissipation method through a single thermal superconducting heat sink 1 is particularly suitable for heat dissipation of low-power heating devices.
  • the present invention also provides a thermal superconducting heat sink, which includes a heat sink substrate 2 and a plurality of thermal superconducting heat sinks according to any one of the first to third embodiments.
  • the heat dissipation plate 1 (the thermal superconducting heat sink in FIG. 6 takes the structure of the thermal superconducting heat dissipation plate 1 as an example).
  • the thermal superconducting heat dissipation plate 1 please refer to the foregoing content, for the sake of brevity The purpose is not repeated;
  • the heat sink substrate 2 has a first surface and a second surface opposite to the first surface, and the first surface is provided with a plurality of mounting areas for placing the heating device 3 from bottom to top;
  • the thermal superconducting heat dissipation plates 1 are arranged on the second surface of the heat sink substrate 2 in parallel and spaced apart, and each of the thermal superconducting heat dissipation plates 1 extends in the longitudinal direction.
  • the three installation areas are distributed up and down along the longitudinal direction of the heat sink substrate 2 (that is, the side surface of the thermal superconducting heat sink 1).
  • more heat dissipation areas may be included, which is not strictly limited in this embodiment.
  • the second surface of the heat sink substrate 2 has a channel
  • one end of the thermal superconducting heat sink 1 has a bent portion 19, and the bent portion 19 is inserted into the channel (for details, please refer to Figure 7).
  • a plurality of slots are distributed in the channel at intervals, and the plurality of thermal superconducting heat sinks 1 are inserted into the slots in a one-to-one correspondence through the bent portion 19, and the heat sink substrate 2 corresponds to each slot.
  • the position of the first surface of the thermal superconducting heat sink 1 is the installation area where the heating device 3 is placed, so that the heat dissipated by the heating device 3 can be transferred to the thermal superconducting heat sink as quickly as possible in a short path.
  • each groove is perpendicular to the surface of the heat sink substrate 2.
  • each groove may also be inclined at a certain angle compared to the surface of the heat sink substrate 2.
  • the vertical is only used for The indication of the directional trend does not mean that it is at an angle of 90° with the horizontal plane in a strict sense, and is not limited to this embodiment.
  • a sintered core heat pipe (not shown) is embedded in the heat sink substrate 2.
  • the sintered core heat pipe is a sintered powder tube integrated with the tube wall formed by sintering a certain mesh of metal powder on the inner wall of a metal tube, and the metal powder sintered on the inside of the metal tube forms a wick capillary
  • the structure enables the sintered core heat pipe to have a higher capillary suction force, so that the heat conduction direction of the sintered core heat pipe is not affected by gravity, and the sintered wick capillary structure strengthens the evaporation heat absorption and condensation heat release, greatly
  • the thermal conductivity and transmission power of the heat pipe are improved, so that the sintered core heat pipe has a larger axial equivalent thermal conductivity (a few hundred to a thousand times that of copper).
  • the sintered core heat pipe is embedded in the heat sink substrate 2, so that the heat generated by the heating device 3 provided on the surface of the heat sink substrate 2 can quickly diffuse to other positions of the heat sink substrate 2, so that the heat dissipation
  • the heat distribution on the base plate 2 of the heat sink is relatively uniform, which can effectively improve the heat dissipation efficiency and heat dissipation capacity of the heat sink.
  • each of the thermal superconducting heat dissipation plates 1 is inserted into the groove vertically (may also have a certain inclination angle, not limited to this embodiment), and the thermal superconducting heat dissipation plates 1 can be mechanically pressed Any one or more of the process, the thermal conductive adhesive bonding process or the brazing process is fixedly connected to the radiator substrate 2 to maximize the bonding strength, reduce the bonding thermal resistance, and improve the heat dissipation capacity and efficiency of the radiator .
  • the heat generated during operation of the heat source (heating device 3) located on the surface of the heat sink substrate 2 is quickly transferred to the heat sink substrate 2 via the sintered core heat pipe, and the heat sink substrate 2 quickly conducts the heat to all the heat sinks.
  • the liquid heat transfer working medium 4 evaporates into steam after being heated, and the steam takes the heat along the thermal superconductor path to the entire thermal superconducting plate, and exchanges heat with the ambient air outside the thermal superconducting plate ( After releasing heat), it is condensed into a liquid heat transfer working medium 4 and flows back along the heat superconductor path to the heat superconductor path of the heat receiving side close to the heat source accessory to perform the next heat transfer cycle of evaporative heat absorption and condensation heat release.
  • the thermal superconducting heat sink of the present invention can be used for the heat dissipation of various high-power density electronic heating devices, can effectively improve the uniformity and efficiency of heat dissipation, and is especially suitable for high integration, high power, miniaturization, light weight, and high power.
  • the present invention also provides a 5G base station equipment, the 5G base station equipment includes a heating device, and the thermal superconducting heat sink according to any one of the fourth embodiment, and the heating device of the 5G base station device is arranged in the heat sink.
  • the mounting area of the device substrate For the introduction of the thermal superconducting heat sink, please refer to the fourth embodiment, which is not repeated for the sake of brevity.
  • the heating device includes, but is not limited to, a radio frequency generator, a power amplifier, a filter, a microprocessor, a memory, and a power manager.
  • the 5G base station equipment of the present invention can greatly improve its heat dissipation efficiency and heat dissipation uniformity without increasing the volume and weight of the equipment, which is beneficial to prolonging the service life of the equipment and improving the performance of the equipment.
  • the present invention provides a thermal superconducting heat sink, a heat sink, and 5G base station equipment.
  • the thermal superconducting heat dissipation plate is distributed with a main heat dissipation pipeline, a liquid down pipeline, a heat-receiving side communication pipeline, and a condensing-side communication pipeline;
  • the condensation side pipeline is located on the side opposite to the heat receiving side communication pipeline;
  • the heat dissipation main pipeline is connected between the heat receiving side communication pipeline and the condensation side communication pipeline ,
  • the liquid descending pipeline is located under the heat dissipation main pipeline one-to-one, and one end is connected with the corresponding heat dissipation main pipeline, and the other end is connected with the heat-receiving side communication pipeline;
  • the heat dissipation main pipeline Gradually incline upward in the direction away from the heat-receiving side connecting pipeline;
  • the improved thermal superconducting pipe path structure design of the present invention solves the problems of local drying and high temperature caused by the lack of liquid heat conduction medium in the upper heat source located in the thermal superconducting heat dissipation plate, and can reduce the total amount of heat transfer medium at the same time.
  • the 5G base station equipment based on the thermal superconducting radiator of the present invention can significantly improve the heat dissipation performance, which helps to extend the service life of the equipment and improve the performance of the equipment. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial value.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne une plaque de dissipation de la chaleur à supraconduction de la chaleur, un dispositif de dissipation de la chaleur et un appareil de station de base 5G. Une conduite principale de dissipation de la chaleur, des conduites de descente de liquide, une conduite de communication côté chauffé et une conduite de communication côté condensation sont réparties dans la plaque de dissipation de la chaleur à supraconduction de la chaleur ; la conduite de communication côté chauffé est située du côté de la plaque de dissipation de la chaleur à supraconduction de la chaleur adjacent à un dispositif de chauffage, et la conduite côté condensation est située du côté de la plaque de dissipation de la chaleur à supraconduction de la chaleur opposé à la conduite de communication côté chauffé ; la conduite principale de dissipation de la chaleur est raccordée entre la conduite de communication côté chauffé et la conduite de communication côté condensation, les conduites de descente de liquide sont situées au-dessous de la conduite principale de dissipation de la chaleur de façon à correspondre de manière univoque, une extrémité de chaque conduite de descente de liquide est raccordée à la conduite principale de dissipation de la chaleur, et son autre extrémité est raccordée à la conduite de communication côté chauffé ; la conduite principale de dissipation de la chaleur est inclinée progressivement vers le haut dans une direction s'éloignant de la conduite de communication côté chauffé ; et la conduite principale de dissipation de la chaleur, les conduites de descente de liquide, la conduite de communication côté chauffé et la conduite de communication côté condensation sont en communication entre elles et sont toutes des conduites de dissipation de la chaleur à supraconduction de la chaleur, les conduites de dissipation de la chaleur à supraconduction de la chaleur sont remplies de fluides de travail de transfert de chaleur, et les fluides de travail de transfert de chaleur comprennent un liquide. La présente invention permet d'améliorer l'efficacité de dissipation de la chaleur et l'uniformité de dissipation de la chaleur.
PCT/CN2020/095042 2020-04-27 2020-06-09 Plaque de dissipation de la chaleur à supraconduction de la chaleur, dispositif de dissipation de la chaleur et appareil de station de base 5g WO2021217789A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202010345039.2A CN111504095A (zh) 2020-04-27 2020-04-27 热超导散热板、散热器及5g基站设备
CN202010345039.2 2020-04-27
CN202020665914.0 2020-04-27
CN202020665914.0U CN212458058U (zh) 2020-04-27 2020-04-27 热超导散热板、散热器及5g基站设备

Publications (1)

Publication Number Publication Date
WO2021217789A1 true WO2021217789A1 (fr) 2021-11-04

Family

ID=78373282

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/095042 WO2021217789A1 (fr) 2020-04-27 2020-06-09 Plaque de dissipation de la chaleur à supraconduction de la chaleur, dispositif de dissipation de la chaleur et appareil de station de base 5g

Country Status (1)

Country Link
WO (1) WO2021217789A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115519846A (zh) * 2022-09-01 2022-12-27 浙江嘉熙科技股份有限公司 一种钢铝复合吹胀板及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070089863A1 (en) * 2005-10-25 2007-04-26 Shuttle Inc. Cooling device having a slanted heat pipe
CN101387478A (zh) * 2008-11-03 2009-03-18 吴鸿平 四要素散热器
CN106686947A (zh) * 2016-12-30 2017-05-17 华为机器有限公司 散热器及通信产品
CN209571408U (zh) * 2019-03-19 2019-11-01 上海嘉熙科技有限公司 热超导散热板及插翅散热器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070089863A1 (en) * 2005-10-25 2007-04-26 Shuttle Inc. Cooling device having a slanted heat pipe
CN101387478A (zh) * 2008-11-03 2009-03-18 吴鸿平 四要素散热器
CN106686947A (zh) * 2016-12-30 2017-05-17 华为机器有限公司 散热器及通信产品
CN209571408U (zh) * 2019-03-19 2019-11-01 上海嘉熙科技有限公司 热超导散热板及插翅散热器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115519846A (zh) * 2022-09-01 2022-12-27 浙江嘉熙科技股份有限公司 一种钢铝复合吹胀板及其制造方法

Similar Documents

Publication Publication Date Title
WO2021253813A1 (fr) Plaque de dissipation de chaleur à supraconduction thermique, dispositif de dissipation de chaleur et dispositif de station de base 5g
JP2006503436A (ja) 板型熱伝達装置及びその製造方法
CN111521051A (zh) 热超导传热板及散热器
WO2020211416A1 (fr) Unité extérieure de climatiseur et climatiseur
TW202028675A (zh) 相變散熱裝置
TWI701991B (zh) 電路板結構
CN111473670A (zh) 热超导传热板及散热器
CN111741649B (zh) 热超导散热板及其制备方法、散热器及5g基站设备
CN212458057U (zh) 热超导散热板、散热器及5g基站设备
WO2021217789A1 (fr) Plaque de dissipation de la chaleur à supraconduction de la chaleur, dispositif de dissipation de la chaleur et appareil de station de base 5g
CN112736046B (zh) 一种集成芯片散热装置及其散热方法
CN212458058U (zh) 热超导散热板、散热器及5g基站设备
CN212463856U (zh) 热超导散热板、散热器及5g基站设备
CN213152666U (zh) 一种散热装置
CN210900115U (zh) 一种散热装置
CN210014478U (zh) 一种散热器、空调室外机和空调器
CN210014476U (zh) 一种散热器、空调室外机和空调器
CN111504095A (zh) 热超导散热板、散热器及5g基站设备
CN102683307B (zh) 复合式角管型平板自激励毛细热管cpu散热器
CN210014477U (zh) 一种散热器、空调室外机和空调器
WO2021203787A1 (fr) Plaque de transfert de chaleur supraconductrice de chaleur et radiateur
CN111609743A (zh) 热超导散热板、散热器及5g基站设备
CN212458062U (zh) 热超导传热板及散热器
CN111818756B (zh) 带有集成的两相散热器的热交换器
CN115881665A (zh) 一种通道壁面对流换热系数可调节的散热装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20933759

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20933759

Country of ref document: EP

Kind code of ref document: A1