WO2023041123A1 - Composant électronique en matière végétale - Google Patents

Composant électronique en matière végétale Download PDF

Info

Publication number
WO2023041123A1
WO2023041123A1 PCT/DE2022/150003 DE2022150003W WO2023041123A1 WO 2023041123 A1 WO2023041123 A1 WO 2023041123A1 DE 2022150003 W DE2022150003 W DE 2022150003W WO 2023041123 A1 WO2023041123 A1 WO 2023041123A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier substrate
electronic component
electrical connection
electrically conductive
capillary structure
Prior art date
Application number
PCT/DE2022/150003
Other languages
German (de)
English (en)
Inventor
Peter Kraft
Julian Reuter
Moritz Köhn
Felix GRÜNEBERGER
Original Assignee
Ofs - Beteiligungs - Gmbh Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ofs - Beteiligungs - Gmbh Holding filed Critical Ofs - Beteiligungs - Gmbh Holding
Publication of WO2023041123A1 publication Critical patent/WO2023041123A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K9/00—Chemical or physical treatment of reed, straw, or similar material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0287—Unidirectional or parallel fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10712—Via grid array, e.g. via grid array capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Definitions

  • the present invention relates to an electronic component made from plant material according to the features of claim 1 in force.
  • plant-based materials are used as decoration in vehicle interiors. Plant materials are also used, for example, in visible areas of control panels of electrical devices.
  • US 2020/0120793 A1 discloses a multi-layer ecological material as a housing for electronic circuits.
  • a printed circuit board with a real wood layer composite material and a manufacturing method for this is known from DE 10 23012 025 409 A1.
  • a circuit board with a substrate made of wood or bamboo is known from US 2020/0258423 A1.
  • a method for coating a non-conductive material with a metallic layer is known from US 5,492,613.
  • the electronic component according to the invention comprises a carrier substrate for electronic components which are applied to a first and/or second surface of the carrier substrate and an electrical connection formed between the first surface and the second surface of the carrier substrate.
  • the carrier substrate is a rattan material with a capillary structure, the capillary structure running between the first and the second surface and the capillary structure serving at least in sections as an electrical connection between the first and the second surface of the carrier substrate.
  • electrical signals are transported through the capillary structure of the rattan from a first surface of the carrier substrate to a second surface of the carrier substrate.
  • the capillary structure is thus designed to be conductive.
  • the carrier substrate can be designed in such a way that predetermined areas have a conductive capillary structure and other, e.g. adjacent areas have a non-conductive capillary structure.
  • the carrier substrate can thus be subdivided into conductive and non-conductive sections between the first and second surfaces. This makes it possible to create an electrical component which is connected in sections to various other electrical components.
  • a capacitive and/or inductive switch is arranged on the first or second surface of the carrier substrate.
  • an electrical signal can be passed through a conductive portion of the capillary structure of the carrier substrate to a second surface to which a touch-sensitive switch is attached.
  • This switch can be connected, for example, to a control device or another electronic component.
  • the electrical signal to be transmitted is amplified by the electrically conductive capillary structure, which makes it possible to use smaller and less expensive capacitive or inductive switches.
  • space-optimized electronic components can be created, which on any arranged on shaped surfaces or integrated into any shaped surface.
  • capillary structures are understood to mean small tubes running in the longitudinal direction of the rattan stem.
  • Rattan is characterized by a lack of secondary growth in thickness, in contrast to plant material with pronounced growth in thickness, such as wood. With rattan, this results in a largely parallel alignment of the capillary structure along the direction of growth of the plant.
  • This special structure enables the conductive materials to be introduced with very little energy and in a very short time.
  • an electrically conductive layer to be applied to a surface of the carrier substrate.
  • An electrical connection to a control unit or another electrical component can be arranged on this layer, for example.
  • connection is connected to the electrically conductive layer and/or to the electrical connection between the first and second surfaces of the carrier substrate.
  • the electrical connection can thus either be applied directly to the electrically conductive layer on the first or second surface of the carrier substrate, or the electrical connection can be introduced into the capillary structure.
  • the electrical connection can either be soldered, welded or connected to the carrier substrate by means of an electrically conductive adhesive.
  • the electrical connection between the first and second surface of the carrier substrate is formed by an electrically conductive material introduced into the capillary structure of the carrier substrate.
  • the electrically conductive substance can be based on carbon, for example flaked or powdered conductive carbon black, acetylene black or carbon nanotubes, on a metal, for example aluminum flakes coated with copper.
  • the conductive substance can also be based on a polymer, eg PEDOT:PSS (variant of poly-3,4-ethylenedioxythiophene) or POF (polymer optical fibre) or on an oxide, eg indium tin oxide.
  • a polymer eg PEDOT:PSS (variant of poly-3,4-ethylenedioxythiophene) or POF (polymer optical fibre)
  • an oxide eg indium tin oxide.
  • the conductive substance can also be based on a combination of these.
  • the electrically conductive substance can be sprayed, rubbed, troweled, rolled, brushed, pulled, sucked, pressed, steamed, misted, rolled, flooded or gassed into the capillary structure of the carrier substrate.
  • the electrically conductive substance is introduced into the capillary structure in dissolved or undissolved form.
  • the electrically conductive substance it is also possible for the electrically conductive substance to be introduced in areas between the capillary structure of the carrier substrate.
  • the electronic component can have a three-dimensional shape. This is realized, for example, by bringing the carrier substrate into a predetermined three-dimensional shape. The shaped carrier substrate can then be provided with an electrically conductive layer in predetermined areas. The carrier substrate and thus the electronic component can thus be manufactured in such a way that it can be optimally fitted into a given housing, for example.
  • the carrier substrate includes a transparent or quasi-transparent layer or film.
  • this layer or foil can enclose the carrier substrate completely or only in certain areas. This protects the carrier substrate and the electrically conductive layer and existing electrical connections from external environmental influences.
  • FIG. 2 shows a further illustration of an electronic component according to the invention.
  • the electronic component 1 shows a perspective view of an electronic component 1 according to the invention in a first representation.
  • the electronic component 1 has a carrier substrate 2 with a first surface 3 and a second surface 4.
  • the carrier substrate 2 is made of rattan, which has a capillary structure 13 with tubes 12 running parallel. These tubes 12 connect the first surface 3 to the second surface 4 of the carrier substrate 2.
  • the tubes 12 are filled with an electrically conductive material 14 (not shown) to produce an electrical connection 5 between the first surface 3 and the second surface 4 of the carrier substrate 2.
  • an electrically conductive layer 8 is applied to the carrier substrate 2 in the first region 6 .
  • this electrically conductive layer 8 is electrically conductively connected to the electrical connection 5 between the first surface 3 and second surface 4 of the carrier substrate 2 .
  • An electrical connection 9, e.g. a strand 10 of a first cable 11, is connected to this electrically conductive layer 8, e.g. soldered or adhesively bonded in an electrically conductive manner.
  • the cable 11 connects the electronic component 1 to a control unit, not shown.
  • the electrically conductive layer 8 is introduced into the capillary structure 13 of the carrier substrate 2, ie into the tubes 12 in the form of an electrically conductive substance 14.
  • FIG. 1 an electrical connection 5 is thereby realized between the first surface 3 and the second surface 4 of the carrier substrate 2 .
  • a further electrical connection 9 for example a strand 10 of a further cable 11 , is introduced into the tube 12 here.
  • the stranded wire 10 is, for example, with the electrically conductive layer, ie soldered to the electrical connection in the tube 12 or introduced into the tube 12 by means of a fitting.
  • An electrical component 16 is arranged on the second surface 4 .
  • This electrical component 16 is electrically conductively connected to the electrically conductive layer 8 .
  • this electrical connection 5 is realized either via pins (not shown) of the component 16 which extend through the carrier substrate 2 . Or the pins are electrically conductively connected to the electrically conductive substance 14 which is introduced into the tubes 12 .
  • FIG. 2 shows an electronic component according to the invention with a carrier substrate on which a switch is arranged.
  • the electronic component has a carrier substrate with a section of a conductive capillary structure.
  • a switch 17 is arranged on the first surface 3 of the carrier substrate 2 in this section.
  • the switch 17, for example a capacitive or inductive switch, is soldered or glued to the carrier substrate 2.
  • FIG. it is also possible for the switch 17 to be held on the carrier substrate 2 by means of a clamping device (not shown).
  • the switch 17 has electrical lines (not shown) for connection to a control device (not shown) or other electrical device.
  • Carrier substrate first surface second surface electrical connection first area second area electrically conductive layer electrical connection
  • tube capillary structure electrically conductive material further transparent and quasi-transparent layer electrical component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un composant électronique (1) comprenant un substrat de support (2) pour des parties de composant électronique (16), qui sont montées sur une première surface (3) et/ou une seconde surface (4) du substrat de support (2), et comprenant une connexion électrique (5) formée entre la première surface (3) et la seconde surface (4) du substrat de support (2), le substrat de support (2) étant constitué d'un matériau de rotin avec une structure capillaire (13), la structure capillaire (13) s'étendant entre la première surface (3) et la seconde surface (4) et servant de connexion électrique, au moins dans une certaine mesure, entre la première surface (3) et la seconde surface (4) du substrat de support (2).
PCT/DE2022/150003 2021-09-20 2022-09-18 Composant électronique en matière végétale WO2023041123A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021124300.9A DE102021124300B3 (de) 2021-09-20 2021-09-20 Elektronisches Bauelement aus pflanzlichem Material
DE102021124300.9 2021-09-20

Publications (1)

Publication Number Publication Date
WO2023041123A1 true WO2023041123A1 (fr) 2023-03-23

Family

ID=83508328

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2022/150003 WO2023041123A1 (fr) 2021-09-20 2022-09-18 Composant électronique en matière végétale

Country Status (2)

Country Link
DE (1) DE102021124300B3 (fr)
WO (1) WO2023041123A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD205692A1 (de) 1982-06-24 1984-01-04 Ruhla Uhren Veb K Leitfaehiges ueberzugsmittel
US5492613A (en) 1987-01-27 1996-02-20 Zhang; Shaoxian Process for electroless plating a metal on non-conductive materials
DE102005041112A1 (de) * 2005-08-30 2007-03-01 BSH Bosch und Siemens Hausgeräte GmbH Kapazitiver Annäherungsschalter und Haushaltgerät mit einem solchen
DE102012025409A1 (de) 2012-12-20 2014-06-26 Thomas Hofmann Leiterplatte mit echtholzlagenverbundwerkstoff
DE102016109467A1 (de) 2016-05-24 2017-11-30 Lisa Dräxlmaier GmbH Bauteil, insbesondere Innenausstattungsbauteil für Fahrzeuge
US20200120793A1 (en) 2017-08-25 2020-04-16 Tactotek Oy Ecological multilayer structure for hosting electronics and related method of manufacture
US20200258423A1 (en) 2018-05-18 2020-08-13 Aidmics Biotechnology (Hk) Co., Limited Method of using hand-made circuit board for learning
DE102019003555A1 (de) 2019-05-21 2020-11-26 out for space GmbH Verfahren zur Herstellung eines leitfähigen pflanzlichen Materials, leitfähiges pflanzliches Material und Verwendung

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD205692A1 (de) 1982-06-24 1984-01-04 Ruhla Uhren Veb K Leitfaehiges ueberzugsmittel
US5492613A (en) 1987-01-27 1996-02-20 Zhang; Shaoxian Process for electroless plating a metal on non-conductive materials
DE102005041112A1 (de) * 2005-08-30 2007-03-01 BSH Bosch und Siemens Hausgeräte GmbH Kapazitiver Annäherungsschalter und Haushaltgerät mit einem solchen
DE102012025409A1 (de) 2012-12-20 2014-06-26 Thomas Hofmann Leiterplatte mit echtholzlagenverbundwerkstoff
DE102016109467A1 (de) 2016-05-24 2017-11-30 Lisa Dräxlmaier GmbH Bauteil, insbesondere Innenausstattungsbauteil für Fahrzeuge
US20200120793A1 (en) 2017-08-25 2020-04-16 Tactotek Oy Ecological multilayer structure for hosting electronics and related method of manufacture
US20200258423A1 (en) 2018-05-18 2020-08-13 Aidmics Biotechnology (Hk) Co., Limited Method of using hand-made circuit board for learning
DE102019003555A1 (de) 2019-05-21 2020-11-26 out for space GmbH Verfahren zur Herstellung eines leitfähigen pflanzlichen Materials, leitfähiges pflanzliches Material und Verwendung

Also Published As

Publication number Publication date
DE102021124300B3 (de) 2022-10-27

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