WO2023039882A1 - 一种显示面板及其制备方法 - Google Patents

一种显示面板及其制备方法 Download PDF

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Publication number
WO2023039882A1
WO2023039882A1 PCT/CN2021/119333 CN2021119333W WO2023039882A1 WO 2023039882 A1 WO2023039882 A1 WO 2023039882A1 CN 2021119333 W CN2021119333 W CN 2021119333W WO 2023039882 A1 WO2023039882 A1 WO 2023039882A1
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Prior art keywords
conductive
display panel
conductive ink
base layer
unit
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PCT/CN2021/119333
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English (en)
French (fr)
Inventor
向昌明
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Tcl华星光电技术有限公司
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Priority to US17/607,484 priority Critical patent/US20240030193A1/en
Publication of WO2023039882A1 publication Critical patent/WO2023039882A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the present application relates to the field of display technology, in particular to a display panel and a manufacturing method thereof.
  • the metal traces are interlaced and easily scratched.
  • direct contact processes are generally used, such as screen printing and roller transfer.
  • the contact depth between the screen printed screen plate and the substrate is relatively deep, and the pressure of the screen printed scraper is too high, which will scratch the metal wiring.
  • the surface of the roller or substrate conveyed by the screen printing scraper or roller is uneven, which will easily lead to a smaller contact area between the substrate and the scraper or roller, resulting in local stress concentration, which will easily lead to cracks in the insulating layer inside the substrate and lead to grid failure.
  • layer and the source-drain layer are in direct contact and a short circuit occurs.
  • the uneven speed of the scraper or roller can easily lead to uneven thickness of the solder paste. As a result, the thicker part of the solder paste can easily lift up the Mini LED during placement, and eventually cause the Mini LED to shift.
  • the purpose of the present invention is to provide a display panel and its preparation method, which can solve the problem of existing Mini In the solder paste process of LED bonding, there are problems such as easy scratching of metal traces and easy occurrence of short circuits between metal traces.
  • the present invention provides a display panel, which includes: a base layer; a plurality of conductive units arranged on the base layer at intervals; and a plurality of Mini LEDs arranged at intervals between the conductive units away from each other one side of the base layer; each of the Mini LEDs are all electrically connected to the conductive unit; wherein, the material of the conductive unit is conductive ink, and the conductive ink includes prepolymer, monomer, conductive filler and photoinitiator.
  • the prepolymer includes: one or more of hyperbranched urethane acrylate and epoxy acrylate.
  • the monomer includes: one or more of trimethylolpropane triacrylate and pentylene glycol diacrylate.
  • the photoinitiator is isopropylthioxanthone.
  • the conductive filler includes one or more of spherical nano-silver powder and flake-shaped nano-silver powder.
  • the ratio of the monomer to the prepolymer ranges from 1: (1-2).
  • the ratio range of the epoxy acrylate to the hyperbranched urethane acrylate is 2:(2-4).
  • the display panel further includes a plurality of conductive elements, which are arranged at intervals between the base layer and the conductive units, and are arranged in one-to-one correspondence with the conductive units.
  • the present invention provides a method for preparing a display panel, which includes the following steps: providing a base layer; coating conductive ink on the base layer, and patterning the conductive ink by using exposure and development technology processing to form conductive ink units spaced apart from each other on the base layer; the conductive ink includes prepolymers, monomers, conductive fillers, and photoinitiators; multiple Mini LEDs are spaced apart from each other on the conductive ink unit On the side away from the base layer, each of the Mini LEDs are all electrically connected to the conductive ink unit; and the conductive ink unit is cured to form a conductive unit.
  • the thickness range of the conductive ink is 20-30 ⁇ m.
  • the present invention uses prepolymer, monomer, conductive filler and photoinitiator to form conductive ink, and then utilizes the conductive unit prepared by conductive ink to realize the electrical connection between the Mini LED and the conductive element, and utilizes the viscosity of the conductive ink itself to adsorb the Mini LED.
  • LED improve the transfer accuracy of the Mini LED, prevent the weak adsorption between the Mini LED and the conductive unit, and affect the electrical connection between the conductive unit and the Mini LED.
  • the conductive unit is made by coating, exposure and development, and the gap between adjacent conductive units can be adjusted controllably to further improve the transfer accuracy of Mini LED.
  • FIG. 1 is a schematic structural view of a display panel of the present invention
  • FIG. 2 is a schematic structural view of the base layer of the display panel of the present invention.
  • Fig. 3 is a diagram of the preparation steps of the display panel of the present invention.
  • Fig. 4 is the schematic plan view after conductive ink is coated on the base layer between conductive elements and adjacent conductive elements;
  • Fig. 5 is a schematic plan view of the conductive ink unit formed by patterning the conductive ink in Fig. 4;
  • Fig. 6 is the A-A sectional view of Fig. 5;
  • Figure 7 is the Mini Schematic diagram of the structure of the LED arranged on the conductive ink unit
  • FIG. 8 is a schematic structural view of removing the transfer substrate in FIG. 6 to cure the conductive ink unit.
  • Basal layer 1. Basal layer; 2. Conductive components;
  • this embodiment provides a display panel 100 .
  • the display panel 100 includes: a base layer 1, a plurality of conductive elements 2, a plurality of conductive units 3 and a plurality of Mini LED4.
  • the base layer 1 includes a substrate 11 , a buffer layer 12 , a thin film transistor layer 13 and a flat layer 14 .
  • the material of substrate 11 is one or more in glass, polyimide, polycarbonate, polyethylene terephthalate and polyethylene naphthalate, thus substrate 11 can have The better impact resistance can effectively protect the display panel 100 .
  • the buffer layer 12 is disposed on one surface of the substrate 11 .
  • the buffer layer 12 mainly serves as a buffer, and the material of the buffer layer 12 includes one or more of SiNx and SiOx.
  • the thin film transistor layer 13 is disposed on the surface of the buffer layer 12 away from the substrate 11 .
  • the thin film transistor layer 13 is mainly used to control the conversion of electrons in pixels and provide circuit support for the display panel 100 .
  • the thin film transistor layer 13 includes film layers such as an active layer, a first insulating layer, a gate layer, an interlayer insulating layer, and a source-drain layer, which will not be repeated here.
  • the flat layer 14 is disposed on the surface of the thin film transistor layer 13 away from the substrate 11 .
  • the flat layer 14 mainly plays a leveling role, providing a flat surface for the preparation of the upper film layer, and the flat layer 14 can also play a buffering role.
  • the material of the flat layer 14 is one or more of acrylic photoresist, silicon photoresist and polyimide photoresist.
  • a plurality of conductive elements 2 are arranged on the base layer 1 at intervals.
  • the material of the conductive element 2 is indium tin oxide (English full name: Indium tin oxide, ITO for short).
  • the conductive element 2 may also use other conductive materials.
  • a plurality of conductive units 3 are arranged at intervals on the surface of the conductive element 2 away from the base layer 1 , and correspond to the conductive elements 2 one by one.
  • each of the Mini LEDs 4 includes a first electrode 41 and a second electrode 42 . Both the first electrode 41 and the second electrode 42 are respectively electrically connected to a conductive unit 3 .
  • the material of the conductive unit 3 is a conductive ink 31, and the conductive ink 31 includes a prepolymer, a monomer, a conductive filler and a photoinitiator.
  • the prepolymer includes one or more of hyperbranched urethane acrylate and epoxy acrylate.
  • the ratio range of the epoxy acrylate to the hyperbranched urethane acrylate is 2: (2-4)
  • the prepolymer includes hyperbranched urethane acrylate and epoxy acrylate, and the The ratio range of the epoxy acrylate to the hyperbranched urethane acrylate is 2:3.
  • the monomer includes: one or more of trimethylolpropane triacrylate and pentylene glycol diacrylate.
  • the ratio range of the monomer to the prepolymer is 1:(1-2). In this embodiment, the ratio range of the monomer to the prepolymer is 1:1.5.
  • the photoinitiator is isopropylthioxanthone (ITX).
  • the content of the photoinitiator is 10% of the content of the conductive ink except for the conductive filler.
  • the conductive filler includes one or more of spherical nano-silver powder and flake-shaped nano-silver powder.
  • the conductive filler includes spherical nano-silver powder and flake-shaped nano-silver powder, and the ratio of the spherical nano-silver powder to the flake-shaped nano-silver powder is 3:7.
  • the conductive ink 31 formed by mixing the prepolymer, monomer, conductive filler and photoinitiator of this embodiment has better conductivity, higher adhesion, shorter photocuring time, and lower resistivity.
  • the curing time range of the conductive ink 31 of this embodiment is 6s-7s, and the resistivity can reach 10 ⁇ 6 ⁇ m.
  • the conductive ink 31 is formed by using the prepolymer, the monomer, the conductive filler and the photoinitiator, and then the conductive unit 3 formed by the conductive ink 31 is used to realize Mini
  • the electrical connection between the LED 4 and the conductive element 2 uses the viscosity of the conductive ink 31 to adsorb the Mini LED 4 to improve the transfer accuracy of the Mini LED 4 and prevent the weak attachment between the Mini LED 4 and the conductive unit 3 from affecting the conductive unit. 3 and the electrical connection between Mini LED 4.
  • the present invention provides a method for manufacturing a display panel 100, which includes the following steps: S1, providing a base layer 1; S2, forming conductive elements spaced apart from each other on the base layer 1 2; S3, coating conductive ink 31 on the surface of the conductive element 2 away from the base layer 1 and the base layer 1 between the adjacent conductive elements 2, using exposure and development technology to the The conductive ink 31 is patterned, and the conductive ink 31 on the base layer 1 between adjacent conductive elements 2 is removed to form conductive ink units 32 that are spaced from each other and correspond to the conductive elements 2 one-to-one.
  • the conductive ink 31 includes a prepolymer, a monomer, a conductive filler, and a photoinitiator; S4, a plurality of the Mini LEDs 4 are arranged at intervals on the side of the conductive unit 3 away from the base layer 1, and each The Mini LED 4 is electrically connected to the conductive ink unit 32; and S5, curing the conductive ink unit 32 to form the conductive unit 3.
  • a conductive ink 31 is coated on the surface of the conductive element 2 away from the base layer 1 and the base layer 1 between adjacent conductive elements 2 by means of inkjet printing or the like.
  • the thickness range of the conductive ink 31 is 20-30 ⁇ m, and in this embodiment, the thickness of the conductive ink 31 is 25 ⁇ m.
  • the conductive ink 31 on the base layer 1 between the adjacent conductive elements 2 is removed by exposure and development technology, forming conductive inks spaced from each other and corresponding to the conductive elements 2 one-to-one
  • the unit 32 can controllably adjust the gap between adjacent conductive ink units 32 to further improve the transfer accuracy of the Mini LED 4 .
  • the Mini LED 4 is fabricated on the transfer substrate 5, and then the Mini LED 4 and the transfer substrate 5 are integrally hot-pressed or cold-pressed on the surface of the conductive ink unit 32 away from the base layer 1. superior. Use the viscosity of the conductive ink unit 32 to adsorb the Mini LED 4 to improve the transfer accuracy of the Mini LED 4 and prevent the weak adsorption between the Mini LED 4 and the conductive ink unit 32 from affecting the electrical connection between the conductive ink unit 32 and the Mini LED 4 .
  • the transfer substrate 5 is peeled off first, and then the conductive ink unit 32 is cured by ultraviolet light (UV light) to form the conductive unit 3 .
  • UV light ultraviolet light

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Abstract

一种显示面板（100）及其制备方法。显示面板（100）包括：基底层（1）、多个导电单元（3）以及多个Mini LED（4）。其中，导电单元（3）的材质为导电油墨（31），导电油墨（31）包括预聚物、单体、导电填料及光引发剂。利用导电油墨（31）本身的粘性吸附Mini LED（4），提升Mini LED（4）的转移精度，防止Mini LED（4）与导电单元（3）之间吸附不牢固，影响导电单元（3）与Mini LED（4）之间的电连接。

Description

一种显示面板及其制备方法 技术领域
本申请涉及显示技术领域，具体涉及一种显示面板及其制备方法。
 背景技术
目前的次毫米发光二极管（Mini LED）的贴片STM（Surface Mounted Technology）制程中，一般需要在Mini LED的邦定处（bonding pad）点锡膏，用于实现Mini LED与基板的电连接。
 技术问题
由于基板上的图案比较致密，金属走线相互交错且容易被刮伤，而锡膏制程中，一般采用直接接触工艺，如丝网印刷和滚轮传输。其中丝网印刷的丝网板与基板的接触深度较深、丝网印刷的刮片的压力过大，会刮伤金属走线。其中丝网印刷的刮片或者滚轮传输的滚轮或者基板的表面不平，容易导致基板与刮片或者滚轮的接触面积变小，造成局部应力集中，容易导致基板内部的绝缘层产生裂缝进而导致栅极层和源漏极层直接接触发生短路。而且刮片或者滚轮的速度不均匀易造成锡膏厚度不均匀，导致贴片时，锡膏较厚处容易顶起Mini LED，最终导致Mini LED发生偏移。
 技术解决方案
本发明的目的是提供一种显示面板及其制备方法，其能够解决现有Mini LED的邦定过程中的锡膏制程中存在的金属走线易被刮伤、金属走线间易发生短路现象等问题。
为了解决上述问题，本发明提供了一种显示面板，其包括：基底层；多个导电单元，相互间隔设置于所述基底层上；以及多个Mini LED，相互间隔设置于所述导电单元远离所述基底层的一侧；每一所述Mini LED均电连接至所述导电单元；其中，所述导电单元的材质为导电油墨，所述导电油墨包括预聚物、单体、导电填料及光引发剂。
进一步的，所述预聚物包括：超支化聚氨酯丙烯酸酯及环氧丙烯酸酯中的一种或多种。
进一步的，所述单体包括：三羟甲基丙烷三丙烯酸酯和戊二醇二丙烯酸酯中的一种或多种。
进一步的，所述光引发剂为异丙基硫杂蒽酮。
进一步的，所述导电填料包括球形纳米银粉和片形纳米银粉中的一种或多种。
进一步的，所述单体与所述预聚物的比值范围为1：（1-2）。
进一步的，所述环氧丙烯酸酯与所述超支化聚氨酯丙烯酸酯的比值范围为2：（2-4）。
进一步的，所述显示面板还包括多个导电元件，相互间隔设置于所述基底层与所述导电单元之间，且与所述导电单元一一对应设置。
为了解决上述问题，本发明提供了一种显示面板的制备方法，其包括以下步骤：提供一基底层；在所述基底层上涂布导电油墨，利用曝光显影技术对所述导电油墨进行图案化处理，形成相互间隔设置于所述基底层上的导电油墨单元；所述导电油墨包括预聚物、单体、导电填料及光引发剂；将多个Mini LED相互间隔设置于所述导电油墨单元远离所述基底层的一侧，每一所述Mini LED均电连接至所述导电油墨单元；以及对所述导电油墨单元进行固化处理，形成导电单元。
进一步的，所述导电油墨的厚度范围为20-30μm。
 有益效果
本发明利用预聚物、单体、导电填料及光引发剂形成导电油墨，然后利用导电油墨制备形成的导电单元实现Mini LED与导电元件之间的电性连接，利用导电油墨本身的粘性吸附Mini LED，提升Mini LED的转移精度，防止Mini LED与导电单元之间吸附不牢固，影响导电单元与Mini LED之间的电连接。采用涂布曝光显影的方式制作导电单元，可控的调节相邻的导电单元之间的间隙，进一步的提升Mini LED的转移精度。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明的显示面板的结构示意图；
图2是本发明的显示面板的基底层的结构示意图；
图3是本发明的显示面板的制备步骤图；
图4是在导电元件及相邻的导电元件之间的基底层上涂布导电油墨后的平面示意图；
图5是图4导电油墨经过图案化处理形成导电油墨单元的平面示意图；
图6是图5的A-A剖面图；
图7是将Mini LED设置于导电油墨单元上的结构示意图；
图8是图6去除转移基板对导电油墨单元进行固化的结构示意图。
附图标记说明：
100、显示面板；
1、基底层；                       2、导电元件；
3、导电单元；                     4、Mini LED；
5、转移基板；
11、基板；                        12、缓冲层；
13、薄膜晶体管层；                14、平坦层；
31、导电油墨；                    32、导电油墨单元。
 本发明的实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是附图中的方向，本文所使用的方向用语是用来解释和说明本发明，而不是用来限定本发明的保护范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的 ，本发明并没有限定每个组件的尺寸和厚度。
如图1所示，本实施例提供了一种显示面板100。所述显示面板100包括：基底层1、多个导电元件2、多个导电单元3以及多个Mini LED 4。
如图2，所述基底层1包括基板11、缓冲层12、薄膜晶体管层13及平坦层14。
其中，基板11的材质为玻璃、聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯以及聚萘二甲酸乙二醇酯中的一种或多种，由此基板11可具有较好的抗冲击能力，可以有效保护显示面板100。
其中，缓冲层12设于基板11的一侧的表面上。缓冲层12主要是起缓冲作用，缓冲层12的材质包括SiNx及SiOx中的一种或多种。
其中，薄膜晶体管层13设置于所述缓冲层12远离所述基板11的一侧的表面上。薄膜晶体管层13主要用于控制像素的电子转化，且为显示面板100提供电路支持。其中，所述薄膜晶体管层13包括：有源层、第一绝缘层、栅极层、层间绝缘层以及源漏极层等膜层，在此不再进行赘述。
其中，平坦层14设置于所述薄膜晶体管层13远离所述基板11的一侧的表面上。平坦层14主要是起平整作用，为其上膜层制备提供一平整的表面，平坦层14还可以起到缓冲作用。其中，平坦层14的材质为亚克力系光刻胶、硅系光刻胶以及聚酰亚胺系光刻胶中的一种或多种。
其中，多个导电元件2相互间隔设置于所述基底层1上。本实施例中，所述导电元件2的材质为氧化铟锡（英文全称：Indium tin oxide，简称ITO）。在其他实施例中，所述导电元件2也可以采用其他导电材质。
其中，多个导电单元3相互间隔设置于所述导电元件2远离所述基底层1的一侧的表面上，且与所述导电元件2一一对应。
其中，多个Mini LED 4相互间隔设置于所述导电单元3远离所述基底层1的一侧的表面上。其中，所述每一所述Mini LED 4均包括第一电极41及第二电极42。所述第一电极41与所述第二电极42均分别对应电连接至一个导电单元3。
其中，所述导电单元3的材质为导电油墨31，所述导电油墨31包括预聚物、单体、导电填料及光引发剂。
其中，所述预聚物包括超支化聚氨酯丙烯酸酯及环氧丙烯酸酯中的一种或多种。所述环氧丙烯酸酯与所述超支化聚氨酯丙烯酸酯的比值范围为2：（2-4）本实施例中，所述预聚物包括超支化聚氨酯丙烯酸酯及环氧丙烯酸酯，且所述环氧丙烯酸酯与所述超支化聚氨酯丙烯酸酯的比值范围为2：3。
所述单体包括：三羟甲基丙烷三丙烯酸酯和戊二醇二丙烯酸酯中的一种或多种。所述单体与所述预聚物的比值范围为1：（1-2）。本实施例中，所述单体与所述预聚物的比值范围为1：1.5。
本实施例中，所述光引发剂为异丙基硫杂蒽酮（ITX）。所述光引发剂的含量为导电油墨除去导电填料之外的含量的10%。
其中，所述导电填料包括球形纳米银粉和片形纳米银粉中的一种或多种。本实施例中，所述导电填料包括球形纳米银粉和片形纳米银粉，且所述球形纳米银粉和片形纳米银粉的比值为3:7。
由此本实施例的预聚物、单体、导电填料及光引发剂混合形成的导电油墨31的导电性能更好、附着力更高、光固化时间更短、电阻率较低。具体的，本实施例的导电油墨31的固化时间范围为6s-7s，且电阻率可以达到10 -6Ωm。
综上，利用预聚物、单体、导电填料及光引发剂形成导电油墨31，然后利用导电油墨31制备形成的导电单元3实现Mini LED 4与导电元件2之间的电性连接，利用导电油墨31本身的粘性吸附Mini LED 4，提升Mini LED 4的转移精度，防止Mini LED 4与导电单元3之间吸附不牢固，影响导电单元3与Mini LED 4之间的电连接。
如图3-图8所示，本发明提供了一种显示面板100的制备方法，其包括以下步骤：S1，提供一基底层1；S2，在所述基底层1上形成相互间隔的导电元件2；S3，在所述导电元件2远离所述基底层1的一侧的表面及相邻的所述导电元件2之间的基底层1上涂布导电油墨31，利用曝光显影技术对所述导电油墨31进行图案化处理，去除相邻的所述导电元件2之间的基底层1上的导电油墨31，形成相互间隔且与所述导电元件2一一对应的导电油墨单元32，所述导电油墨31包括预聚物、单体、导电填料及光引发剂；S4，将多个所述Mini LED 4相互间隔设置于所述导电单元3远离所述基底层1的一侧，每一所述Mini LED 4均电连接至所述导电油墨单元32；以及S5，对所述导电油墨单元32进行固化处理，形成导电单元3。
如图4所示，采用喷墨打印等方式在所述导电元件2远离所述基底层1的一侧的表面及相邻的所述导电元件2之间的基底层1上涂布导电油墨31。其中，所述导电油墨31的厚度范围为20-30μm，本实施例中，所述导电油墨31的厚度为25μm。
如图5、图6所示，利用曝光显影技术去除相邻的所述导电元件2之间的基底层1上的导电油墨31，形成相互间隔且与所述导电元件2一一对应的导电油墨单元32，可控的调节相邻的导电油墨单元32之间的间隙，进一步的提升Mini LED 4的转移精度。
如图7所示，将所述Mini LED 4制作于转移基板5上，然后将 Mini LED 4与转移基板5整体热压或者冷压在导电油墨单元32远离所述基底层1的一侧的表面上。利用导电油墨单元32本身的粘性吸附Mini LED 4，提升Mini LED 4的转移精度，防止Mini LED 4与导电油墨单元32之间吸附不牢固，影响导电油墨单元32与Mini LED 4之间的电连接。
如图8所示，先将转移基板5进行剥离去除，然后采用紫外光（UV光）对所述导电油墨单元32进行固化处理，形成导电单元3。
以上对本申请所提供的一种显示面板及其制备方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (10)

  1. 一种显示面板，包括：
    基底层；
    多个导电单元，相互间隔设置于所述基底层上；以及
    多个Mini LED，相互间隔设置于所述导电单元远离所述基底层的一侧；每一所述Mini LED均电连接至所述导电单元；
    其中，所述导电单元的材质为导电油墨，所述导电油墨包括预聚物、单体、导电填料及光引发剂。
  2. 根据权利要求1所述的显示面板，所述预聚物包括：超支化聚氨酯丙烯酸酯及环氧丙烯酸酯中的一种或多种。
  3. 根据权利要求1所述的显示面板，所述单体包括：三羟甲基丙烷三丙烯酸酯和戊二醇二丙烯酸酯中的一种或多种。
  4. 根据权利要求1所述的显示面板，所述光引发剂为异丙基硫杂蒽酮。
  5. 根据权利要求1所述的显示面板，所述导电填料包括球形纳米银粉和片形纳米银粉中的一种或多种。
  6. 根据权利要求1所述的显示面板，所述单体与所述预聚物的比值范围为1：（1-2）。
  7. 根据权利要求2所述的显示面板，所述环氧丙烯酸酯与所述超支化聚氨酯丙烯酸酯的比值范围为2：（2-4）。
  8. 根据权利要求1所述的显示面板，还包括：
    多个导电元件，相互间隔设置于所述基底层与所述导电单元之间，且与所述导电单元一一对应设置。
  9. 一种显示面板的制备方法，包括以下步骤：
    提供一基底层；
    在所述基底层上涂布导电油墨，利用曝光显影技术对所述导电油墨进行图案化处理，形成相互间隔设置于所述基底层上的导电油墨单元；所述导电油墨包括预聚物、单体、导电填料及光引发剂；
    将多个Mini LED相互间隔设置于所述导电油墨单元远离所述基底层的一侧，每一所述Mini LED均电连接至所述导电油墨单元；以及
    对所述导电油墨单元进行固化处理，形成导电单元。
  10. 根据权利要求9所述的显示面板的制备方法，所述导电油墨的厚度范围为20-30μm。
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