WO2020187055A1 - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置 Download PDF

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Publication number
WO2020187055A1
WO2020187055A1 PCT/CN2020/078096 CN2020078096W WO2020187055A1 WO 2020187055 A1 WO2020187055 A1 WO 2020187055A1 CN 2020078096 W CN2020078096 W CN 2020078096W WO 2020187055 A1 WO2020187055 A1 WO 2020187055A1
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Prior art keywords
touch
electrodes
substrate
layer
sub
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PCT/CN2020/078096
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English (en)
French (fr)
Inventor
唐瑶
周诗博
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京东方科技集团股份有限公司
绵阳京东方光电科技有限公司
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Priority to US17/055,458 priority Critical patent/US11487374B2/en
Publication of WO2020187055A1 publication Critical patent/WO2020187055A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display substrate, a preparation method thereof, and a display device.
  • the touch display panel combines the touch structure and the display panel into one, so that the display panel combined with the touch structure
  • Panels with display and touch sensing functions such as smart phones and tablet computers, all use touch display panels.
  • organic light emitting diode Organic Light Emitting Diode, OLED
  • QLED Quantum Dot Light Emitting Diodes
  • a method for preparing a display substrate includes: providing a substrate; the substrate has a non-display area, and the non-display area includes a binding area.
  • a light emitting function layer and an encapsulation layer are sequentially formed on one side of the substrate; the orthographic projection of the encapsulation layer on the substrate does not overlap with the binding area.
  • a touch control structure is formed on a surface of the packaging layer away from the substrate; the touch control structure includes a first part contacting the packaging layer, and a material of the first part includes a conductive material.
  • forming the first part includes: forming the first part using a nanoimprint process.
  • forming a touch structure on a surface of the packaging layer that is far from the substrate includes: forming a plurality of spaces on the surface of the packaging layer that is far from the substrate.
  • a metal bridge; the plurality of metal bridges are the first part of the touch structure.
  • a plurality of first touch electrodes extending in a first direction are formed on a side of the plurality of metal bridges away from the substrate; each first touch electrode includes a plurality of first touch electrodes connected in series along the first direction The first touch sub-electrode.
  • a plurality of rows of second touch sub-electrodes are formed in the same layer as the plurality of first touch electrodes; each row of second touch sub-electrodes includes a plurality of second touch sub-electrodes arranged at intervals along the second direction; In the two touch sub-electrodes, each two adjacent second touch sub-electrodes are electrically connected to a metal bridge through a via, so that the multiple rows of second touch sub-electrodes and the multiple metal bridges form multiple A second touch electrode.
  • the first direction and the second direction cross.
  • the manufacturing method further includes: after forming the plurality of metal bridges, before forming the plurality of first touch electrodes and the plurality of rows of second touch sub-electrodes in the same layer, A first insulating film is formed on the side of the plurality of metal bridges away from the substrate. The first insulating film is patterned, and a plurality of via holes exposing the plurality of metal bridges are formed in the first insulating film.
  • the plurality of first touch sub-electrodes and the plurality of rows of second touch sub-electrodes are in a grid structure, and the plurality of first touch sub-electrodes and the plurality of rows of second touch sub-electrodes
  • the materials of the two touch sub-electrodes are all metal materials.
  • forming a touch control structure on a surface of the packaging layer that is away from the substrate includes: forming a touch control structure on a surface of the packaging layer that is away from the substrate.
  • a plurality of second touch electrodes extending in a direction and arranged at intervals; the plurality of second touch electrodes are the first part of the touch structure.
  • a second insulating layer is formed on one side of the plurality of second touch electrodes away from the substrate.
  • On a side of the second insulating layer away from the substrate a plurality of first touch electrodes extending along the first direction and arranged at intervals are formed. Wherein, the first direction and the second direction cross.
  • forming the plurality of first touch electrodes includes: forming the plurality of first touch electrodes using a nanoimprint process.
  • the plurality of first touch electrodes and the plurality of second touch electrodes are in a grid structure, and the plurality of first touch electrodes and the plurality of second touch electrodes
  • the materials of the electrodes are all metal oxide materials.
  • forming the first part using a nanoimprint process includes: providing a transfer template substrate.
  • An embossed adhesive layer is formed on one side of the transfer template substrate to obtain a transfer template; the embossed adhesive layer has a plurality of grooves arranged at intervals.
  • a conductive material is filled in the plurality of grooves.
  • the transfer template filled with conductive material is embossed on the surface of the encapsulation layer on the side away from the base substrate to obtain the first part.
  • forming a light-emitting functional layer on one side of the substrate includes: forming an anode layer on one side of the substrate; and forming a light-emitting layer on the side of the anode layer away from the substrate ; Forming a cathode layer on the side of the light-emitting layer away from the substrate.
  • a display substrate in another aspect, includes: a substrate, a light-emitting function layer and an encapsulation layer arranged in sequence on one side of the substrate, and a touch structure arranged on a surface of the encapsulation layer on a side away from the substrate.
  • the substrate has a non-display area, and the non-display area includes a binding area.
  • the orthographic projection of the encapsulation layer on the substrate does not overlap with the binding area; the touch structure includes a first part contacting the encapsulation layer, and a material of the first part includes a conductive material.
  • the first part includes a plurality of metal bridges arranged at intervals.
  • the touch control structure further includes a plurality of first touch electrodes extending along a first direction, and a plurality of rows of second touch sub-electrodes. Each first touch electrode includes a plurality of first touch sub-electrodes connected in series.
  • Each row of second touch sub-electrodes includes a plurality of second touch sub-electrodes arranged at intervals along the second direction; in each row of second touch sub-electrodes, every two adjacent second touch sub-electrodes and one metal
  • the bridges are electrically connected through vias, so that the rows of second touch sub-electrodes and the plurality of metal bridges form a plurality of second touch electrodes.
  • the plurality of first touch sub-electrodes and the plurality of rows of second touch sub-electrodes are made of the same material, and the plurality of first touch sub-electrodes and the plurality of rows of second touch sub-electrodes are arranged in the same layer .
  • the plurality of first touch sub-electrodes and the plurality of rows of second touch sub-electrodes are in a grid structure, and the plurality of first touch sub-electrodes and the plurality of second touch sub-electrodes
  • the materials of the two touch sub-electrodes are all metal materials.
  • the first part includes a plurality of second touch electrodes extending along the second direction and arranged at intervals.
  • the touch structure further includes: a second insulating layer disposed on a side of the plurality of second touch electrodes away from the substrate; and, disposed on a side of the second insulating layer away from the substrate A plurality of first touch electrodes extending along the first direction and spaced apart. Wherein, the first direction and the second direction cross.
  • the plurality of first touch electrodes and the plurality of second touch electrodes are in a grid structure, and the plurality of first touch electrodes and the plurality of second touch electrodes
  • the materials of the electrodes are all metal oxide materials.
  • the display substrate further includes: a protective layer disposed on a side of the touch structure away from the substrate.
  • the display substrate further includes: a light-emitting function layer disposed between the substrate and the encapsulation layer.
  • the light-emitting function layer includes: an anode layer provided on a side of the substrate; a light-emitting layer provided on a side of the anode layer away from the substrate; and a light-emitting layer provided on the light-emitting layer away from the substrate The cathode layer on the bottom side.
  • the display substrate further includes: a plurality of signal lines connected to the touch structure; the plurality of signal lines extend to the binding area.
  • the plurality of signal lines and the first part are made of the same material, and the plurality of signal lines and the first part are arranged in the same layer.
  • a display device in another aspect, includes the display substrate as described in some embodiments above.
  • Fig. 1 is a flow chart of preparing a display substrate according to one of the related technologies
  • Figure 2 is a top view of a display substrate according to the related art
  • FIG. 3 is a cross-sectional view of the display substrate shown in FIG. 2 along the A-A' direction;
  • FIG. 4 is a flowchart of a method for manufacturing a display substrate in some embodiments of the present disclosure
  • Fig. 5 is a flowchart of a method for preparing a light-emitting functional layer in some embodiments of the present disclosure
  • FIG. 6 is a flowchart of forming the first part using a nanoimprinting process according to one of some embodiments of the present disclosure
  • FIG. 7 is a flowchart of a manufacturing method for forming a touch structure according to some embodiments of the present disclosure.
  • FIG. 8 is a flowchart of another manufacturing method for forming a touch structure according to some embodiments of the present disclosure.
  • FIG. 9 is a flowchart of yet another manufacturing method for forming a touch structure according to some embodiments of the present disclosure.
  • FIG. 10 is a flowchart of a display substrate according to some embodiments of the present disclosure.
  • FIG. 11 is a preparation flow chart of a display substrate along the B-B' direction according to some embodiments of the present disclosure.
  • Figure 12 is a flow chart of preparing a transfer template according to some embodiments of the present disclosure.
  • FIG. 13 is a preparation flow chart of forming the first part using a nanoimprinting process according to one of some embodiments of the present disclosure
  • FIG. 14 is a top view of a display substrate according to some embodiments of the present disclosure.
  • FIG. 15 is a cross-sectional view of the display substrate shown in FIG. 14 along the C-C' direction;
  • FIG. 16 is a structural diagram of a touch structure according to some embodiments of the present disclosure.
  • FIG. 17 is a top view of another display substrate according to some embodiments of the present disclosure.
  • FIG. 18 is a cross-sectional view of the display substrate shown in FIG. 17 along the D-D' direction;
  • FIG. 19 is a top view of still another display substrate according to some embodiments of the present disclosure.
  • FIG. 20 is a top view of still another display substrate provided in some embodiments of the present disclosure.
  • FIG. 21 is a cross-sectional view of the display substrate shown in FIG. 20 along the E-E' direction;
  • FIG. 22 is a cross-sectional view of still another display substrate according to some embodiments of the present disclosure.
  • FIG. 23 is a structural diagram of a display device in some embodiments of the present disclosure.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, “plurality” means two or more.
  • the touch structure in the process of preparing the touch display panel, the touch structure is usually manufactured separately, and then the touch structure is attached to the display panel.
  • the touch structure is easy to make the thickness of the touch display panel larger, which is not conducive to the development of light and thin touch display panels.
  • the method of directly forming the touch structure on the packaging layer of the display substrate in the display panel is as follows:
  • the display substrate 100' has a binding area 4', and the encapsulation layer 3'exposes the binding area 4', that is, the encapsulation layer 3'does not cover the binding area 4'.
  • an inorganic material such as silicon nitride, SiNx
  • SiNx silicon nitride
  • the barrier film 61' covers the binding area 4 ’
  • the barrier film 61’ can be used to form the touch structure 5’ in the binding area 4’
  • the part of the barrier film 61' covering the binding area 4' will be etched and removed to form a barrier layer 6'as shown in FIG. 3.
  • the touch structure 5' To be electrically connected to the multiple solder points in the binding area 4'through signal lines.
  • the formation of the barrier layer 6'in the process of forming the touch structure 5' is taken as an example.
  • a plurality of bridges 521' will be formed on one side of the barrier film 61'; then an insulating film 71' will be formed on one side of the plurality of bridges 521', and
  • the barrier film 61' and the insulating film 71' are etched at the same time to form a barrier layer 6'and an insulating layer 7'as shown in FIG.
  • the insulating layer 7' exposes multiple bridges
  • the surface of 521' facilitates subsequent formation of the first touch electrode 51' and multiple second touch sub-electrodes as shown in FIG. 2 on one side of the insulating layer 7', and the multiple touch sub-electrodes can pass through the The holes are electrically connected with the plurality of bridges 521' to form a plurality of second touch electrodes 52'.
  • the thickness of the display substrate 100' is easily increased due to the arrangement of the barrier layer 6', and since the barrier layer 6'is made of inorganic materials Formed, it is easy to increase the film stress in the display substrate 100'.
  • the display substrate 100' is applied to a touch display panel, it is not conducive to thinning and flexibility of the touch display panel.
  • some embodiments of the present disclosure provide a method for preparing a display substrate. As shown in FIG. 4, the preparation method of the display substrate includes S100-S300.
  • the substrate 1 has a non-display area H, and the non-display area H includes a bonding area 4.
  • the aforementioned substrate 1 includes a base substrate and a driving circuit provided on the base substrate.
  • the driving circuit is configured to provide a driving voltage for the prepared display substrate 100 so that the display substrate 100 can perform display.
  • the above-mentioned driving circuit is composed of a plurality of thin film transistors and at least one storage capacitor.
  • the plurality of thin film transistors include one driving transistor and at least one switching transistor.
  • the driving circuit includes multiple structures.
  • T means thin film transistors
  • the number before “T” means the number of thin film transistors
  • C means storage capacitor
  • the number before “C” means the number of storage capacitors.
  • the substrate 1 is a flexible substrate, and at this time, the base substrate included in it is a flexible base substrate.
  • the flexible substrate is a PET (Polyethylene terephthalate, polyethylene terephthalate) substrate, a PEN (Polyethylene naphthalate two formal acid glycol ester, polyethylene naphthalate) substrate or PI (Polyimide, polyimide) base substrate.
  • the aforementioned non-display area H is located at the edge of the substrate 1.
  • a light-emitting function layer 2 and an encapsulation layer 3 are sequentially formed on one side of the substrate 1.
  • the orthographic projection of the encapsulation layer 3 on the substrate 1 does not overlap with the bonding area 4.
  • the orthographic projection of the light-emitting function layer 2 on the substrate 1 is within the orthographic projection range of the packaging layer 3 on the substrate 1.
  • the encapsulation layer 3 can be used to block the light-emitting function layer 2 from water and oxygen, and prevent external water vapor from corroding the light-emitting function layer 2, thereby avoiding affecting the display substrate 100 performance.
  • the structure of the encapsulation layer 3 includes multiple types.
  • the encapsulation layer 3 may include a first inorganic layer, an organic layer, and a second inorganic layer that are sequentially stacked in a direction perpendicular to the substrate 1.
  • the orthographic projection of the encapsulation layer 3 on the substrate 1 does not overlap with the bonding area 4. That is, the encapsulation layer 3 does not cover the binding area 4.
  • the binding area 4 is in an exposed state.
  • the light-emitting function layer 2 is formed on one side of the substrate 1, including S210 to S230.
  • the material of the anode layer 21 includes multiple types. Exemplarily, the material of the anode layer 21 includes indium tin oxide (ITO for short).
  • ITO indium tin oxide
  • the structure of the above-mentioned anode layer 21 includes multiple types.
  • the above-mentioned anode layer 21 includes a plurality of anode patterns arranged at intervals.
  • the display substrate 100 has a plurality of sub-pixels arranged at intervals, and each sub-pixel includes an anode pattern.
  • the materials included in the light-emitting layer 22 include multiple types.
  • the material of the light-emitting layer 22 includes an organic material.
  • the display substrate 100 may be an OLED display substrate.
  • the material of the light-emitting layer 22 includes a quantum dot material.
  • the display substrate 100 may be a QLED display substrate.
  • a hole injection layer and a hole transport layer are sequentially stacked on the side of the anode layer 21 away from the substrate 1.
  • the above-mentioned cathode layer 23 may be made of aluminum (Al).
  • the structure of the above-mentioned cathode layer 23 includes multiple types.
  • the foregoing cathode layer 23 includes a plurality of cathode patterns arranged at intervals, and each sub-pixel includes one cathode pattern.
  • the foregoing cathode layer 23 has a planar structure, and a plurality of sub-pixels share the cathode layer 23.
  • an electron transport layer and an electron injection layer are sequentially stacked on the side of the light-emitting layer 22 away from the substrate 1.
  • the driving circuit included in the substrate 1 is configured to provide driving voltage for the prepared display substrate 100, including: the driving circuit provides driving voltage for the anode layer 21 and the cathode layer 23 in the light-emitting function layer 2 , So that the light-emitting layer 22 in the light-emitting function layer 2 can emit light required for display, and thus the display substrate 100 can display.
  • a touch structure 5 is formed on the surface of the packaging layer 3 that is away from the substrate 1.
  • the touch structure 5 includes a first part 50 in contact with the encapsulation layer 3, and the material of the first part 50 includes a conductive material.
  • the conductive material includes a metal material or a metal oxide material.
  • the first part 50 is in contact with the encapsulation layer 3, which means that the first part 50 and the encapsulation layer 3 are in direct contact with no other film between the two.
  • forming the first part 50 includes: forming the first part 50 by using a nanoimprint process.
  • the first part 50 is formed by the nanoimprinting process, including S311 to S314.
  • a transfer template substrate 901 is provided.
  • an embossed adhesive layer 902 is formed on one side of the transfer template substrate 901 to obtain a transfer template 904.
  • the embossed adhesive layer 902 has a plurality of grooves Q arranged at intervals.
  • a coating process can be used to coat one side surface of the transfer template substrate 901 Embossed rubber material to form an embossed rubber film 9020.
  • the imprint template 903 is pressed into the imprint rubber film 9020, so that the convex portion of the imprint template 903 directly contacts the surface of the transfer template substrate 901, and makes The embossing rubber material moves into the recessed part of the embossing template 903 under the squeezing action of the embossing template 903.
  • a photo-curing treatment for example, ultraviolet irradiation
  • a photo-curing treatment for example, ultraviolet irradiation
  • the embossing glue transferred to the recessed portion of the imprinting template 903 is cured and shaped, and the embossing glue layer 902 is formed.
  • the imprint template 903 is removed, so that the desired transfer template 904 can be obtained.
  • the embossing adhesive layer 902 has a plurality of grooves Q arranged at intervals, and the plurality of grooves Q correspond to the convex portions in the imprint template 903. That is, the shape and size of the two are the same.
  • the volume of the embossed rubber film 9020 may be equal to the total volume of all the recessed parts of the embossed template 903.
  • the concave part of the formed transfer template 904 (that is, the multiple grooves Q in the embossed adhesive layer 902) can be made without embossing glue residue, so that the convex part of the formed transfer template 904 (that is, the pressing
  • the size of the convex portion in the printing rubber layer 902 is the same as the size of the concave portion of the corresponding imprint template 903.
  • the size of the concave portion and the convex portion of the imprint template 903 can be controlled accordingly, and then the size of the first portion 50 to be formed later can be controlled.
  • the embossing glue may be a UV curable glue, for example.
  • the material of the imprint template 903 and the material of the transfer template substrate 901 may both be flexible nano materials.
  • the aforementioned conductive material may be a metal ink or a transparent metal oxide material.
  • the conductive material can be shaped. After the conductive material is shaped, the transfer template 904 is removed, and the first part 50 can be obtained.
  • the pattern of the first part 50 formed on the encapsulation layer 3 is complementary to the pattern of the transfer template 904.
  • the first part 50 when the first part 50 is formed by the nanoimprinting process, not only can the first part 50 be formed by using the imprint template 904, but also the first part 50 can be imprinted by, but not limited to, using an imprint roller.
  • the binding area 4 in the process of forming the first portion 50 by the nanoimprinting process, the binding area 4 is in an exposed state, and the orthographic projection of the concave portion of the transfer template 904 on the substrate 1 (that is, the multiple grooves Q) It does not overlap with the binding area 4, that is, the orthographic projection of the first part 50 on the substrate 1 does not overlap with the binding area 4. In this way, damage to the multiple solder joints in the binding area 4 can be avoided, and the first part 50 and the multiple solder joints can be prevented from being shorted.
  • the touch structure 5 and the encapsulation layer 3 are formed by using a nanoimprint process.
  • the bonding area 4 can be avoided during the process of forming the first part 50, and the first part 50 is formed only on the surface of the packaging layer 3 away from the substrate 1.
  • the method for preparing the display substrate provided by the embodiment of the present disclosure can protect the binding area 4 while avoiding the formation of the barrier layer 6', which can effectively simplify the structure and production of the display substrate 100 Process, and effectively reduce the thickness and film stress of the display substrate 100.
  • a display device that is, a touch display panel
  • the method of forming the touch structure 5 on the side surface of the packaging layer 3 away from the substrate 1 in the above-mentioned S300 includes a variety of methods and is related to the structure of the touch structure 5. Which method is used to form the touch structure 5 can be selected and set according to actual needs.
  • the touch structure 5 is formed on the surface of the packaging layer 3 away from the substrate 1 in the above S300, including S310a to S330a.
  • a plurality of metal bridges 522 are formed at intervals on the surface of the packaging layer 3 on the side away from the substrate 1.
  • the plurality of metal bridges 522 are the first part 50 of the aforementioned touch structure 5.
  • the multiple metal bridges 522 are formed by a nano-imprint process. In this way, after the conductive material forming the plurality of metal bridges 522 is shaped, the plurality of metal bridges 522 can be formed in the area where the touch structure 5 is to be formed. Therefore, the plurality of metal bridges 522 can be prevented from being formed in the binding Within zone 4.
  • a plurality of first touch electrodes extending in a first direction X are formed on a side of the plurality of metal bridges 522 away from the substrate 1 51.
  • Each first touch electrode 51 includes a plurality of first touch sub-electrodes 511 connected in series along the first direction X.
  • the plurality of first touch electrodes 51 extend along the first direction X, that is, the plurality of first touch electrodes 51 are arranged parallel to each other.
  • the above-mentioned multiple first touch electrodes 51 may also be arranged in parallel to each other (that is, the multiple first touch electrodes 51 have an angle between them), and no electrical connection is formed between the multiple first touch electrodes 51. Just connect.
  • the plurality of first touch sub-electrodes 511 in each first touch electrode 51 are connected in series along the first direction X, that is, the plurality of first touch sub-electrodes 511 are arranged in sequence along the first direction X and are adjacent to each other.
  • the two first touch sub-electrodes 511 are electrically connected.
  • each first touch electrode 51 is an integral structure.
  • a plurality of rows of second touch sub-electrodes 521 are formed in the same layer as the plurality of first touch electrodes 51.
  • Each row of the second touch sub-electrodes 521 includes a plurality of second touch sub-electrodes 521 arranged at intervals along the second direction Y.
  • every two adjacent second touch sub-electrodes 521 and a metal bridge 522 are electrically connected through vias G, so that the multiple rows of second touch sub-electrodes 521 and The plurality of metal bridges 522 form a plurality of second touch electrodes 52.
  • the first direction X and the second direction Y cross.
  • first direction X and second direction Y are both perpendicular to the thickness direction of the packaging layer 3.
  • size of the included angle between the first direction X and the second direction Y can be selected and set according to actual needs.
  • the two can be perpendicular.
  • the “row” mentioned herein does not refer to the row direction on the paper, but refers to the direction parallel to the second direction Y. In some cases, embodiments involving the "row” direction may be implemented in the "column” direction, etc., and vice versa. Rotating or mirroring the solution described in the present disclosure by 90° also belongs to the scope of rights claimed by the present disclosure.
  • the plurality of second touch electrodes 52 are arranged parallel to each other.
  • the above-mentioned multiple second touch electrodes 52 can also be arranged in parallel to each other (that is, the multiple second touch electrodes 52 have an angle between them), and no electrical connection is formed between the multiple second touch electrodes 52. Just connect.
  • every two adjacent second touch sub-electrodes 521 and a metal bridge 522 are electrically connected through a via G, which means that each second touch
  • the sub-electrodes 521 are electrically connected to a metal bridge 522 through a via G
  • every two adjacent second touch sub-electrodes 521 are electrically connected to a metal bridge 522 through respective vias G, instead of through the same via G.
  • the hole G is electrically connected to a metal bridge 522.
  • the "same layer” mentioned in this article refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask to form a patterning process.
  • a patterning process may include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights Or have different thicknesses.
  • the multiple first touch electrodes 51 and the multiple rows of second touch sub-electrodes 521 can be manufactured at the same time, which is beneficial to simplify the manufacturing process of the display substrate 100.
  • the metal bridge 522 in the touch structure 5 is formed on one side surface of the encapsulation layer 3 by using a nanoimprinting process, it can be compared with the method for preparing a display substrate in the related art.
  • the elimination of the formation of the barrier layer 6'before the formation of the touch structure 5 is beneficial to simplify the structure of the display substrate 100 and its production process, and is beneficial to reduce the thickness and film stress of the display substrate 100.
  • the display substrate 100 is applied to a display device, it is beneficial to realize the thinning and flexibility of the display device.
  • the manufacturing method of the display substrate provided by the embodiment of the present disclosure further includes S317a to S318a.
  • the first insulating film 70 is patterned, and a plurality of via holes G exposing the plurality of metal bridges 521 are formed in the first insulating film 70. In this way, the first insulating layer 7 is also obtained.
  • the first insulating layer 7 is formed on the side of the plurality of metal bridges 522 away from the substrate 1.
  • the plurality of first touch electrodes 51 and the plurality of rows of second touch sub-electrodes 521 can be formed on the surface of the first insulating layer 7 away from the substrate 1 to be insulated from the plurality of metal bridges 522,
  • the multiple rows of second touch sub-electrodes 521 can be electrically connected to multiple metal bridges 522 through multiple vias G in the first insulating layer 7 to form multiple second touch electrodes 52.
  • the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 include various structures, and the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 have different structures. Structure and material related.
  • the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 are in a grid structure, and the plurality of first touch sub-electrodes 511 and The materials of the multiple rows of second touch sub-electrodes 521 are all metal materials.
  • the shape of the grid in the above-mentioned grid structure can be a regular polygon or an irregular polygon, and which shape of the grid is used can be selected and set according to actual needs.
  • a plurality of diamond-shaped grids formed by crossing a plurality of metal wires.
  • relevant software can be used for optical processing.
  • Simulation is performed to match the grid parameters of the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 with the display substrate 100.
  • the touch structure 5 can ensure high light transmission
  • the multiple first touch sub-electrodes 511 and the multiple rows of second touch sub-electrodes 521 have lower resistance and better conductivity, and prevent electrical signals from passing between the first touch sub-electrodes 511 and the second
  • the transmission delay in the touch sub-electrodes 521 is beneficial to improve the sensitivity and the touch effect of the touch structure 5.
  • the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 may all have a planar structure, and the plurality of first touch sub-electrodes
  • the materials of the 511 and the multiple rows of second touch sub-electrodes 521 are all indium tin oxide (ITO for short).
  • the use of a light-permeable material to form the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 can ensure that the touch structure 5 has a high light transmittance while simplifying the multiple
  • the structure of the first touch sub-electrodes 511 and the above-mentioned multiple rows of second touch sub-electrodes 521 further simplifies the manufacturing process of the display substrate 100 and improves the production efficiency of the display substrate 100.
  • the touch structure 5 is formed on the surface of the packaging layer 3 away from the substrate 1 in the above S300, including S310b to S330b.
  • a plurality of second touch electrodes 52 extending along the second direction Y and spaced apart are formed on the surface of the packaging layer 3 that is away from the substrate 1.
  • the plurality of second touch electrodes 52 are the first part 50 of the aforementioned touch structure 5.
  • the plurality of second touch electrodes 52 are formed by a nanoimprinting process. In this way, after the conductive material forming the plurality of second touch electrodes 52 is shaped, the plurality of second touch electrodes 52 can be formed in the area where the touch structure 5 is to be formed. Therefore, the binding area 4 can be The circumvention is to prevent the plurality of second touch electrodes 52 from being formed in the binding area 4.
  • a second insulating layer 8 is formed on the side of the plurality of second touch electrodes 52 away from the substrate 1.
  • the second insulating layer 8 may expose the bonding area 4, that is, the second insulating layer 8 does not cover the bonding area 4.
  • the plurality of first touch electrodes 51 are prepared by a nanoimprint process. In this way, in the process of forming the plurality of first touch electrodes 51, after the material forming the plurality of first touch electrodes 51 is shaped, the plurality of first touch electrodes 5 can be obtained. This can prevent the plurality of first touch electrodes 51 from being formed in the bonding area 4, and reduce the formation of the barrier layer 6'.
  • the method for preparing and forming the above-mentioned multiple first touch electrodes 51 by using the nanoimprinting process can refer to the method for preparing and forming the first part 50 of the touch structure 5.
  • the material of the second insulating layer 8 may be an inorganic material, such as silicon nitride, or an organic resin material, such as acrylic.
  • the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 can be insulated from each other, so as to avoid a short circuit between the two.
  • the structures of the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 include multiple types, and the structures and materials of the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 are related .
  • the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 all have a grid structure, and the plurality of first touch electrodes 51 and the plurality of The material of the second touch electrode 52 is a metal oxide material.
  • the shape of the grid in the above-mentioned grid structure can be a regular polygon or an irregular polygon, and which shape of the grid is used can be selected and set according to actual needs.
  • the first touch electrode 51 as an example, it may be a plurality of diamond-shaped grids formed by crossing a plurality of metal oxide lines (as shown in FIG. 19).
  • optical simulation can be performed using related software. In order to match the grid parameters of the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 with the display substrate 100.
  • the touch structure 5 can be made to have a higher The light transmittance can make the touch structure 5 have lower resistance and higher conductivity, avoid the transmission delay of electrical signals in the touch structure 5, and improve the touch effect of the touch structure 5.
  • the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 may each have a planar structure, and the plurality of first touch electrodes 51 and the above The materials of the plurality of second touch electrodes 52 are all indium tin oxide (ITO for short).
  • ITO indium tin oxide
  • the use of a light-permeable material to form the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 can ensure that the touch structure 5 has a higher light transmittance while simplifying the plurality of second touch electrodes.
  • the structure of one touch electrode 51 and the plurality of second touch electrodes 52 further simplifies the manufacturing process of the display substrate 100 and improves the production efficiency of the display substrate 100.
  • the touch structure 5 is in direct contact with the encapsulation layer 3, compared to the display substrate 100' in the related art, the formation of the barrier layer 6'is reduced, which can simplify the structure of the display substrate 100 and its The production process reduces the thickness and film stress of the display substrate 100.
  • the display substrate 100 is applied to a display device, it is beneficial to realize the thinning and flexibility of the display device.
  • the display substrate 100 includes: a substrate 1, a light-emitting function layer 2 and an encapsulation layer 3 sequentially disposed on one side of the substrate 1, and an encapsulation layer 3 The touch structure 5 on the side surface away from the substrate 1.
  • the aforementioned substrate 1 includes a base substrate and a driving circuit provided on the base substrate.
  • the relevant description of the above-mentioned base substrate and the driving circuit can refer to the description of the base substrate and the driving circuit in some of the above embodiments.
  • the structure of the light-emitting functional layer 2 includes multiple types, which can be selected and set according to actual needs.
  • the light-emitting function layer 2 includes: an anode layer 21 disposed on the side of the substrate 1, a light-emitting layer 22 disposed on the side of the anode layer 21 away from the substrate 1, And the cathode layer 23 provided on the side of the light emitting layer 22 away from the substrate 1.
  • a hole injection layer and a hole transport layer are also provided between the anode layer 21 and the light emitting layer 22; an electron transport layer and an electron injection layer are also provided between the light emitting layer 22 and the cathode layer 23.
  • the above-mentioned substrate 1 has a display area I and a non-display area H located on at least one side of the display area, and the non-display area H includes a binding area 4.
  • the above-mentioned light-emitting function layer 2 is located in the display area I, and the orthographic projection of the light-emitting function layer 2 on the substrate 1 is located within the orthographic projection range of the packaging layer 3 on the substrate 1.
  • the encapsulation layer 3 can be used to block the light-emitting function layer 2 from water and oxygen, prevent external water vapor from corroding the light-emitting function layer 2 and avoid affecting the performance of the display substrate 100.
  • the encapsulation layer 3 is a thin-film encapsulation layer.
  • the orthographic projection of the encapsulation layer 3 on the substrate 1 does not overlap with the binding area 4, that is, the encapsulation layer 3 does not cover the binding area 4.
  • the touch structure 5 includes a first portion 50 in contact with the encapsulation layer 3, and the material of the first portion 50 includes a conductive material.
  • the conductive material may be a simple metal, such as Au (gold), Ag (silver), Cu (copper), or Al (aluminum).
  • the conductive material may also be a metal alloy, such as AlNb (aluminum niobium alloy).
  • the above-mentioned first part 50 is prepared and formed by a nanoimprinting process, and is directly formed on the surface of the packaging layer 3 away from the substrate 1, and does not substantially affect the binding area 40.
  • the orthographic projection of the first part 50 on the substrate 1 does not overlap with the binding area 4, that is, the first part 50 will not be formed in the binding area 4, which can prevent the binding area 4 from being affected.
  • An embodiment of the present disclosure provides a display substrate 100.
  • the light emitting function layer 2 and the encapsulation layer 3 are provided on one side of the substrate 1, and the surface of the encapsulation layer 3 that is away from the substrate 1 is directly provided with nano-pressure
  • the first part 50 of the touch structure 5 formed by the printing process compared with the structure shown in FIG. 3 in the related art, the display substrate 100 in the embodiment of the present disclosure can reduce the arrangement of the barrier layer 6', which is beneficial to simplify the display substrate 100
  • the structure reduces the thickness and film stress of the display substrate 100. When the display substrate 100 is applied to a display device, it is beneficial to realize the thinning and flexibility of the display device.
  • the above-mentioned touch structure 5 includes multiple structures, which can be selected and set according to actual needs.
  • the first part 50 in the above-mentioned touch structure 5 includes a plurality of metal bridges 522 arranged at intervals.
  • the touch structure 5 further includes a plurality of first touch electrodes 51 extending along the first direction X.
  • Each first touch electrode 51 includes a plurality of first touch sub-electrodes 511 connected in series.
  • each first touch electrode 51 is an integral structure.
  • the touch structure 5 further includes a plurality of rows of second touch sub-electrodes 521.
  • Each row of the second touch sub-electrodes 521 includes a plurality of second touch sub-electrodes 521 arranged at intervals along the second direction Y.
  • every two adjacent second touch sub-electrodes 521 and a metal bridge 522 are electrically connected through vias G, so that the multiple rows of second touch sub-electrodes 521 and the above A plurality of metal bridges 522 constitute a plurality of second touch electrodes 52.
  • a first insulating layer 7 is provided between the plurality of metal bridges 522 and the plurality of first touch sub-electrodes 511 and the plurality of second touch sub-electrodes 521.
  • a plurality of via holes G are provided in an insulating layer 7, and the plurality of via holes G expose a side surface of the plurality of metal bridges 522 away from the substrate 1.
  • Each second touch sub-electrode 521 is electrically connected to a metal bridge 522 through a via G.
  • the above-mentioned first and the insulating layer 7 includes multiple materials.
  • the material of the first insulating layer 7 may be an inorganic material (for example, silicon nitride) or an organic material.
  • the materials of the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 are the same, and the first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 Same layer settings. This can simplify the manufacturing process of the display substrate 100.
  • first touch electrodes 51 and the number of second touch electrodes 52 are multiple, and the number of first touch electrodes 51 and the number of second touch electrodes 52 may be the same or different.
  • the number of first touch electrodes 51 and the number of second touch electrodes 52 can be selected and set according to actual needs.
  • the plurality of first touch electrodes 51 are electrically disconnected, and the rows of second touch electrodes 52 are electrically disconnected.
  • the structures of the first touch sub-electrode 511 and the second touch sub-electrode 521 include multiple types, and the structures are related to their materials.
  • the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 are in a grid structure, and the plurality of first touch sub-electrodes 511 and the foregoing
  • the materials of the multiple rows of second touch sub-electrodes 521 are all metal materials.
  • the shape of the grid in the above-mentioned grid structure can be a regular polygon or an irregular polygon, and which shape of the grid is used can be selected and set according to actual needs.
  • a plurality of diamond-shaped grids formed by crossing a plurality of metal wires.
  • relevant software can be used for optical processing.
  • Simulation is performed to match the grid parameters of the multiple first touch sub-electrodes 511 and the multiple rows of second touch sub-electrodes 521 with the display substrate.
  • the metal mesh structure can transmit light, and the resistance of the metal material is low, and the conductivity is good, this can ensure that the touch structure 5 has a high light transmittance, while avoiding electrical signals in the multiple first touch elements.
  • the transmission delay in the electrode 511 and the multiple rows of second touch sub-electrodes 521 is beneficial to increase the sensitivity of the touch structure 5 and improve the touch effect of the touch structure 5.
  • the display substrate 100 when the display substrate 100 is applied to a large-size display device, it can also be driven by an IC (Integrated Circuit, integrated circuit), and can achieve a better touch effect and support multi-touch.
  • the first touch electrode 51 and the second touch electrode 52 made of metal materials can prevent ESD (Electrostatic Discharge).
  • the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 may each have a planar structure, and the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch
  • the material of the control sub-electrode 521 is indium tin oxide (ITO for short).
  • the use of a light-permeable material to form the plurality of first touch sub-electrodes 511 and the plurality of rows of second touch sub-electrodes 521 can ensure that the touch structure 5 has a high light transmittance while simplifying the multiple
  • the structure of the first touch sub-electrodes 511 and the above-mentioned multiple rows of second touch sub-electrodes 521 further simplifies the manufacturing process of the display substrate 100 and improves the production efficiency of the display substrate 100.
  • the first portion 50 in the above-mentioned touch structure 5 includes a plurality of second touch electrodes 52 extending along the second direction Y and arranged at intervals.
  • the touch structure 5 further includes: a second insulating layer 8 disposed on the side of the plurality of second touch electrodes 52 away from the substrate 1 and disposed on the side of the second insulating layer 8 away from the substrate 1, A plurality of first touch electrodes 51 extending along the first direction X and arranged at intervals.
  • the first direction X and the second direction Y cross
  • a plurality of second touch electrodes 52, a second insulating layer 8 and a plurality of first touch electrodes 51 are sequentially stacked on the side of the packaging layer 3 away from the substrate 1.
  • the multiple second touch electrodes 52 directly contact the surface of the encapsulation layer 3 away from the substrate 1, and the second insulating layer 8 makes the multiple first touch electrodes 51 and the multiple second touch electrodes 52 Insulate each other.
  • the material of the aforementioned second insulating layer 8 includes multiple types.
  • the material of the second insulating layer 8 may be an organic resin material (for example, acrylic glue).
  • the material of the second insulating layer 8 may be an inorganic material (for example, silicon nitride).
  • the structures of the first touch electrode 51 and the second touch electrode 52 include multiple types, and the structure is related to the material.
  • the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 are in a grid structure, and the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 are The materials are all metal oxide materials.
  • the shape of the grid in the grid structure can be a regular polygon or an irregular polygon, and the shape of the grid can be selected and set according to actual needs.
  • a plurality of diamond-shaped grids formed by crossing a plurality of metal oxide lines.
  • optical simulation can be performed using related software.
  • the grid parameters of the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 with the display substrate 100 For example, for a diamond-shaped grid, you can simulate the appropriate diamond-shaped side length and diamond-shaped included angle. This can avoid the occurrence of interference fringes after the display substrate 100 is applied to the display device due to the mismatch between the grid structure and the display substrate 100.
  • the touch structure 5 can be made to have higher light.
  • the transmittance can make the touch structure 5 have lower resistance and higher conductivity, avoid the transmission delay of electrical signals in the touch structure 5, and improve the sensitivity and touch effect of the touch structure 5.
  • the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 may each have a planar structure, and the plurality of first touch electrodes 51 and the plurality of The material of the second touch electrode 52 is indium tin oxide (ITO for short).
  • ITO indium tin oxide
  • the use of a light-permeable material to form the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 can ensure that the touch structure 5 has a higher light transmittance while simplifying the plurality of second touch electrodes.
  • the structure of one touch electrode 51 and the plurality of second touch electrodes 52 further simplifies the manufacturing process of the display substrate 100 and improves the production efficiency of the display substrate 100.
  • the display substrate 100 further includes a protective layer 9 disposed on a side of the touch structure 5 away from the substrate 1.
  • the protective layer 8 covers the touch structure 5 for protecting the touch structure 5.
  • the material of the protective layer 9 may be an organic material.
  • the display substrate 100 further includes a plurality of signal lines L electrically connected to the touch structure 5.
  • the multiple signal lines L extend to the binding area 4.
  • multiple solder joints are provided in the binding area 4.
  • the plurality of signal lines L extend to the bonding area 4, that is, the plurality of signal lines L are electrically connected to the plurality of solder joints in the bonding area 4 respectively.
  • the touch structure 5 includes a plurality of first touch electrodes 51 and a plurality of second touch electrodes 52.
  • the multiple signal lines L are electrically connected to the touch structure 5, that is, the multiple signal lines L are electrically connected to the multiple first touch electrodes 51 and the multiple second touch electrodes 52 respectively.
  • the binding area 4 is used to bind IC (Integrated Circuit, integrated circuit) and/or FPC (Flexible Printed Circuit, flexible printed circuit).
  • the bonded IC and/or FPC can provide electrical signals to a plurality of signal lines L extending in the bonding area 4, and then transmit the electrical signals to the touch structure 5.
  • the signal line L electrically connected to the touch structure 5 extends in the binding area 4, and the number of the binding area 4 is one as an example. , But the present disclosure is not limited to this.
  • the multiple signal lines L and the first portion 50 of the touch structure 5 are made of the same material, and the multiple signal lines L and the first portion 50 are arranged in the same layer. This is beneficial to simplify the manufacturing process of the display substrate 100.
  • the plurality of first touch electrodes 51 and the plurality of second touch electrodes 52 in the touch structure 5 may be electrically connected to the above-mentioned plurality of signal lines L through via holes.
  • the display device 200 includes a display substrate 100 as provided in some embodiments above.
  • the display substrate 100 included in the above-mentioned display device 200 has the same structure and beneficial technical effects as the display substrate 100 provided in some of the above-mentioned embodiments, and will not be repeated here.
  • the above-mentioned display device 200 further includes: a housing for installing the above-mentioned display substrate 100 and/or a camera installed on the display substrate 100 and the like.
  • the above-mentioned display device 200 is any product or component with a display function, such as electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator, etc.

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Abstract

一种显示基板的制备方法，包括：提供衬底；所述衬底具有非显示区，所述非显示区包括绑定区。在所述衬底的一侧依次形成发光功能层和封装层；所述封装层在所述衬底上的正投影与所述绑定区无交叠。在所述封装层的远离所述衬底的一侧表面上形成触控结构；所述触控结构包括与所述封装层接触的第一部分，所述第一部分的材料包括导电材料。其中，形成所述第一部分包括：采用纳米压印工艺形成所述第一部分。

Description

显示基板及其制备方法、显示装置
本申请要求于2019年03月21日提交的、申请号为201910218357.X的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示基板及其制备方法、显示装置。
背景技术
随着经济生活的发展，触控显示面板已经广泛地被人们所接受及使用，此处，触控显示面板是将触控结构和显示面板结合为一体，使得结合有触控结构的显示面板同时具备显示和感知触控功能的面板，如智能手机、平板电脑等均使用了触控显示面板。其中，集成有触控结构的有机发光二极管(Organic Light Emitting Diode，简称OLED)显示屏或量子点发光二极管(Quantum Dot Light Emitting Diodes，简称QLED)显示屏成为当下高端智能产品追求采用的热点。
发明内容
一方面，提供一种显示基板的制备方法。所述制备方法包括：提供衬底；所述衬底具有非显示区，所述非显示区包括绑定区。在所述衬底的一侧依次形成发光功能层和封装层；所述封装层在所述衬底上的正投影与所述绑定区无交叠。在所述封装层的远离所述衬底的一侧表面上形成触控结构；所述触控结构包括与所述封装层接触的第一部分，所述第一部分的材料包括导电材料。其中，形成所述第一部分包括：采用纳米压印工艺形成所述第一部分。
在一些实施例中，在所述封装层的远离所述衬底的一侧表面上形成触控结构，包括：在所述封装层的远离所述衬底的一侧表面上形成间隔设置的多个金属搭桥；所述多个金属搭桥为所述触控结构的第一部分。在所述多个金属搭桥的远离所述衬底的一侧形成沿第一方向延伸的多个第一触控电极；每个第一触控电极包括沿所述第一方向串接的多个第一触控子电极。与所述多个第一触控电极同层形成多行第二触控子电极；每行第二触控子电极包括沿第二方向间隔设置的多个第二触控子电极；每行第二触控子电极中，每相邻的两个第二触控子电极与一个金属搭桥通过过孔电连接，以使所述多行第二触控子电极和所述多个金属搭桥形成多个第二触控电极。其中，所述第一方向和所述第二方向交叉。
在一些实施例中，所述的制备方法，还包括：在形成所述多个金属搭桥 之后，同层形成所述多个第一触控电极和所述多行第二触控子电极之前，在所述多个金属搭桥的远离所述衬底的一侧形成第一绝缘薄膜。图案化所述第一绝缘薄膜，在所述第一绝缘薄膜中形成暴露所述多个金属搭桥的多个过孔。
在一些实施例中，所述多个第一触控子电极和所述多行第二触控子电极均呈网格结构，且所述多个第一触控子电极和所述多行第二触控子电极的材料均为金属材料。
在一些实施例中，在所述封装层的远离所述衬底的一侧表面上形成触控结构，包括：在所述封装层的远离所述衬底的一侧表面上，形成沿第二方向延伸且间隔设置的多个第二触控电极；所述多个第二触控电极为所述触控结构的第一部分。在所述多个第二触控电极的远离所述衬底的一侧形成第二绝缘层。在所述第二绝缘层的远离所述衬底的一侧，形成沿第一方向延伸且间隔设置的多个第一触控电极。其中，所述第一方向和所述第二方向交叉。
在一些实施例中，形成所述多个第一触控电极包括：采用纳米压印工艺形成所述多个第一触控电极。
在一些实施例中，所述多个第一触控电极和所述多个第二触控电极均呈网格结构，且所述多个第一触控电极和所述多个第二触控电极的材料均为金属氧化物材料。
在一些实施例中，采用纳米压印工艺形成所述第一部分，包括：提供转印模板基板。在所述转印模板基板的一侧形成压印胶层，得到转印模板；所述压印胶层具有间隔设置的多个凹槽。在所述多个凹槽内填充导电材料。将填充有导电材料的转印模板压印在所述封装层的远离所述衬底基板的一侧表面上，得到所述第一部分。
在一些实施例中，在所述衬底的一侧形成发光功能层，包括：在所述衬底的一侧形成阳极层；在所述阳极层的远离所述衬底的一侧形成发光层；在所述发光层的远离所述衬底的一侧形成阴极层。
另一方面，提供一种显示基板。所述显示基板包括：衬底，依次设置于所述衬底的一侧的发光功能层和封装层，以及，设置于所述封装层的远离所述衬底的一侧表面的触控结构。所述衬底具有非显示区，所述非显示区包括绑定区。所述封装层在所述衬底上的正投影与所述绑定区无交叠；所述触控结构包括与所述封装层接触的第一部分，所述第一部分的材料包括导电材料。
在一些实施例中，所述第一部分包括间隔设置的多个金属搭桥。所述触控结构还包括：沿第一方向延伸的多个第一触控电极，以及多行第二触控子电极。每个第一触控电极包括多个串接的第一触控子电极。每行第二触控子 电极包括沿第二方向间隔设置的多个第二触控子电极；每行第二触控子电极中，每相邻的两个第二触控子电极与一个金属搭桥通过过孔电连接，以使所述多行第二触控子电极和所述多个金属搭桥形成多个第二触控电极。所述多个第一触控子电极和所述多行第二触控子电极的材料相同，且所述多个第一触控子电极和所述多行第二触控子电极同层设置。
在一些实施例中，所述多个第一触控子电极和所述多行第二触控子电极均呈网格结构，且所述多个第一触控子电极和所述多个第二触控子电极的材料均为金属材料。
在一些实施例中，所述第一部分包括沿第二方向延伸且间隔设置的多个第二触控电极。所述触控结构还包括：设置在所述多个第二触控电极的远离所述衬底的一侧的第二绝缘层；以及，设置在所述第二绝缘层的远离所述衬底的一侧、沿第一方向延伸且间隔设置的多个第一触控电极。其中，所述第一方向和所述第二方向交叉。
在一些实施例中，所述多个第一触控电极和所述多个第二触控电极均呈网格结构，且所述多个第一触控电极和所述多个第二触控电极的材料均为金属氧化物材料。
在一些实施例中，所述显示基板，还包括：设置于所述触控结构的远离所述衬底的一侧的保护层。
在一些实施例中，所述显示基板，还包括：设置于所述衬底和所述封装层之间的发光功能层。所述发光功能层包括：设置在所述衬底一侧的阳极层；设置在所述阳极层的远离所述衬底一侧的发光层；以及，设置在所述发光层的远离所述衬底一侧的阴极层。
在一些实施例中，所述显示基板，还包括：与所述触控结构连接的多条信号线；所述多条信号线延伸至所述绑定区。
在一些实施例中，所述多条信号线与所述第一部分的材料相同，且所述多条信号线与所述第一部分同层设置。
又一方面，提供一种显示装置。所述显示装置包括如上述一些实施例中所述的显示基板。
附图说明
为了更清楚地说明本公开或相关技术中的技术方案，下面将对本公开一些实施例或相关技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图 获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程等的限制。
图1为根据相关技术中的一种制备显示基板的流程图；
图2为根据相关技术中的一种显示基板的俯视图；
图3为图2所示的显示基板沿A-A＇向的一种剖视图；
图4为根据本公开一些实施例中的一种显示基板的制备方法的流程图；
图5为根据本公开一些实施例中的一种发光功能层的制备方法的流程图；
图6为根据本公开一些实施例中的一种采用纳米压印工艺形成第一部分的流程图；
图7为根据本公开一些实施例中的一种形成触控结构的制备方法的流程图；
图8为根据本公开一些实施例中的另一种形成触控结构的制备方法的流程图；
图9为根据本公开一些实施例中的又一种形成触控结构的制备方法的流程图；
图10为根据本公开一些实施例中的一种显示基板的流程图；
图11为根据本公开一些实施例中的一种显示基板的沿B-B＇向的制备流程图；
图12为根据本公开一些实施例中的一种转印模板的制备流程图；
图13为根据本公开一些实施例中的一种采用纳米压印工艺形成第一部分的制备流程图；
图14为根据本公开一些实施例中的一种显示基板的俯视图；
图15为图14所示的显示基板沿C-C＇向的剖视图；
图16为根据本公开一些实施例中的一种触控结构的结构图；
图17为根据本公开一些实施例中的另一种显示基板的俯视图；
图18为图17所示的显示基板沿D-D＇向的剖视图；
图19为根据本公开一些实施例中的又一种显示基板的俯视图；
图20为根据本公开一些实施例中提供的又一种显示基板的俯视图；
图21为图20所示的显示基板沿E-E＇向的剖视图；
图22为根据本公开一些实施例中的又一种显示基板的剖视图；
图23为根据本公开一些实施例中的一种显示装置的结构图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
相关技术中，在制备触控显示面板的过程中，通常是将触控结构单独制作完成，再将触控结构贴合在显示面板上。但是这样容易使得触控显示面板的厚度较大，不利于触控显示面板的轻薄化发展。
基于此，在相关技术中，将触控结构直接形成在显示面板中显示基板的封装层上的方法如下：
如图1和图2所示，显示基板100＇具有绑定区4＇，封装层3＇曝露出该绑定区4＇，也即封装层3＇未覆盖在绑定区4＇上。在封装层3＇上制备触控结构5＇之前，通常会先使用无机材料(例如氮化硅，SiNx)在封装层3＇上形成阻挡薄膜61＇(该阻挡薄膜61＇覆盖绑定区4＇)，然后再在阻挡薄膜61＇的远离封装层3＇的一侧形成触控结构5＇，以便于在形成触控结构5＇的过程中利用阻挡薄膜61＇对绑定区4＇内的多个焊点进行保护，避免对该多个焊点造成损伤，并避免触控结构5＇与该多个焊点形成短接。
在形成触控结构5＇后或形成触控结构5＇的过程中，会将阻挡薄膜61＇ 的覆盖绑定区4＇的部分刻蚀去除，形成如图3所示的阻挡层6＇，以便于使得触控结构5＇能够通过信号线与绑定区4＇内的多个焊点电连接。
此处，以在形成触控结构5＇的过程中形成阻挡层6＇为例。如图1所示，在形成阻挡薄膜61＇后，会在阻挡薄膜61＇的一侧形成多个搭桥521＇；之后再在该多个搭桥521＇的一侧形成绝缘薄膜71＇，并对阻挡薄膜61＇和绝缘薄膜71＇同时进行刻蚀，形成如图3所示的阻挡层6＇和绝缘层7＇，暴露出绑定区4＇；同时，绝缘层7＇暴露出多个搭桥521＇的表面，便于后续在绝缘层7＇的一侧形成如图2所示的第一触控电极51＇和多个第二触控子电极后，多个触控子电极能够通过该过孔与多个搭桥521＇电连接形成多个第二触控电极52＇。
然而，采用上述方法制备形成的显示基板100＇中，如图3所示，由于该阻挡层6＇的设置，容易使得显示基板100＇的厚度增大，且由于该阻挡层6＇由无机材料形成，容易使得显示基板100＇中的薄膜应力增加。在将显示基板100＇应用于触控显示面板时，不利于触控显示面板的薄型化和柔性化。
基于此，本公开的一些实施例提供了一种显示基板的制备方法。如图4所示，该显示基板的制备方法包括S100～S300。
S100，提供衬底1。如图10和图21所示，该衬底1具有非显示区H，非显示区H包括绑定区4。
在一些示例中，上述衬底1包括衬底基板，以及设置在衬底基板上的驱动电路。该驱动电路被配置为，为制备形成的显示基板100提供驱动电压，以使得显示基板100能够进行显示。
上述驱动电路由多个薄膜晶体管和至少一个存储电容器构成。所述多个薄膜晶体管包括一个驱动晶体管和至少一个开关晶体管。
在一些示例中，驱动电路包括多种结构。例如“6T1C”、“7T1C”、“6T2C”或“7T2C”等结构。此处，“T”表示为薄膜晶体管，位于“T”前面的数字表示为薄膜晶体管的个数，“C”表示为存储电容器，位于“C”前面的数字表示为存储电容器的个数。
在一些示例中，衬底1为柔性衬底，此时，其所包括的衬底基板为柔性衬底基板。例如该柔性衬底基板为PET(Polyethylene terephthalate，聚对苯二甲酸乙二醇酯)衬底基板、PEN(Polyethylene naphthalate two formic acid glycol ester，聚萘二甲酸乙二醇酯)衬底基板或PI(Polyimide，聚酰亚胺)衬底基板。
在一些示例中，上述非显示区域H位于衬底1的边缘位置。
S200，如图10中(a)和图11中(a)所示，在衬底1的一侧依次形成发光功能层2和封装层3。封装层3在衬底1上的正投影与绑定区4无交叠。
在一些示例中，上述发光功能层2在衬底1上的正投影位于封装层3在衬底1上的正投影范围内。通过在发光功能层2的一侧设置封装层3，可以利用封装层3对发光功能层2起到阻水阻氧的作用，防止外部水汽对发光功能层2造成侵蚀，从而避免影响该显示基板100的性能。
封装层3的结构包括多种。示例性的，封装层3可以包括沿垂直于衬底1的方向依次层叠设置的第一无机层、有机层和第二无机层。
此处，封装层3在衬底1上的正投影与绑定区4无交叠。也即，封装层3未对绑定区4进行覆盖。后续在封装层3的远离衬底1的一侧表面上形成触控结构5的过程中，绑定区4处于暴露的状态。
在一些示例中，如图5所示，上述S200中，在衬底1的一侧形成发光功能层2，包括S210～S230。
S210，在衬底1的一侧形成阳极层21。
上述阳极层21的材料包括多种。示例性的，阳极层21的材料包括氧化铟锡(Indium tin oxide，简称ITO)。
上述阳极层21的结构包括多种。示例性的，上述阳极层21包括间隔设置的多个阳极图案。显示基板100具有间隔设置的多个子像素，每个子像素包括一个阳极图案。
S220，在阳极层21的远离衬底1的一侧形成发光层22。
上述发光层22所包括的材料包括多种。
示例性的，发光层22的材料包括有机材料。此时，显示基板100可以为OLED显示基板。
示例性的，发光层22的材料包括量子点材料。此时，显示基板100可以为QLED显示基板。
在一些示例中，在阳极层21的远离衬底1的一侧形成发光层22之前，还会在阳极层21的远离衬底1的一侧依次层叠形成空穴注入层和空穴传输层。
S230，在发光层22的远离衬底1的一侧形成阴极层23。
示例性的，上述阴极层23可以采用铝(Al)制作形成。
上述阴极层23的结构包括多种。示例性的，上述阴极层23包括间隔设置的多个阴极图案，每个子像素包括一个阴极图案。示例性的，上述阴极层23为面状结构，多个子像素共用该阴极层23。
在一些示例中，在发光层22的远离衬底1的一侧形成阴极层23之前，还会在发光层22的远离衬底1的一侧依次层叠形成电子传输层和电子注入层。
上述一些示例中，衬底1所包括的驱动电路被配置为，为制备形成的显示基板100提供驱动电压，包括：驱动电路为上述发光功能层2中的阳极层21和阴极层23提供驱动电压，以使得发光功能层2中的发光层22能够发出显示所需的光，进而使得显示基板100进行显示。
S300，如图10中(b)～(e)和图11中(b)～(e)所示，在封装层3的远离衬底1的一侧表面上形成触控结构5。触控结构5包括与封装层3接触的第一部分50，该第一部分50的材料包括导电材料。该导电材料包括金属材料或金属氧化物材料。
此处，第一部分50与封装层3接触，指的是第一部分50和封装层3直接接触，两者之间无其他薄膜。
在一些示例中，上述S300中，形成第一部分50包括：采用纳米压印工艺形成第一部分50。
示例的，如图6所示，采用纳米压印工艺形成第一部分50，包括S311～S314。
S311，如图12所示，提供转印模板基板901。
S312，如图12所示，在转印模板基板901的一侧形成压印胶层902，得到转印模板904。该压印胶层902具有间隔设置的多个凹槽Q。
示例性的，如图12中(a)所示，在转印模板基板901的一侧形成压印胶层902时，可以采用涂覆工艺，在转印模板基板901的一侧表面上涂覆压印胶材料，形成压印胶薄膜9020。如图12中(b)和(c)所示，将压印模板903压入压印胶薄膜9020，使得压印模板903中的凸起部分与转印模板基板901的表面直接接触，并使得压印胶材料在压印模板903的挤压作用下，移动至压印模板903凹陷部分内。之后进行光固化处理(例如紫外线照射)，使得转移至压印模板903凹陷部分内的压印胶固化定型，形成压印胶层902。如图12中(d)所示，移去压印模板903，这样便可以得到所需的转印模板904。
压印胶层902具有间隔设置的多个凹槽Q，该多个凹槽Q与压印模板903中的凸起部分相对应。也即两者的形状、尺寸等相同。
此处，压印胶薄膜9020的体积可以等于压印模板903的所有凹陷部分的总体积。这样，可以使得形成的转印模板904的凹陷部分(也即压印胶层902中的多个凹槽Q)无压印胶残留，使得形成的转印模板904的凸起部分(也 即压印胶层902中的凸起部分)的尺寸与对应的压印模板903的凹陷部分的尺寸相同。
基于此，可以通过控制压印模板903的凹陷部分和凸起部分的尺寸，相应的控制转印模板904的凸起部分和凹陷部分的尺寸，进而控制后续所形成的第一部分50的尺寸。
在一些示例中，压印胶例如可以为紫外光固化胶。压印模板903的材料与转印模板基板901的材料可以均为柔性纳米材料。
S313，如图13中(a)和(b)所示，在上述多个凹槽Q内填充导电材料。
示例性的，上述导电材料可以为金属油墨或透明金属氧化物材料。
S314，如图13中(c)、(d)和(e)所示，将填充有导电材料的转印模板904压印在封装层3的远离衬底1的一侧表面上，得到第一部分50。
在将导电材料填充在转印模板904的多个凹槽Q内，并将其压印在封装层3上后，可以对导电材料进行定型。在导电材料定型之后取下转印模板904，便可以得到第一部分50。
在封装层3上形成的第一部分50的图案与转印模板904的图案互补。
此外，在纳米压印工艺形成第一部分50时，不仅可以采用压印模板904的方式进行压印形成第一部分50，还可以但不限于采用压印滚轮的方式进行压印第一部分50。需要说明的是，在采用纳米压印工艺形成第一部分50的过程中，绑定区4处于暴露状态，且转印模板904的凹陷部分在衬底1上的正投影(也即多个凹槽Q)与绑定区4不重合，也即第一部分50在衬底1上的正投影与绑定区4不重合。这样可以避免对绑定区4内的多个焊点造成损伤，并避免第一部分50与该多个焊点形成短接。
由此，本公开实施例提供的显示基板的制备方法，在衬底1的一侧依次形成发光功能层2和封装层3之后，通过采用纳米压印工艺形成触控结构5中与封装层3接触、且包括导电材料的第一部分50时，可以在形成第一部分50的过程中对绑定区4形成规避，仅在封装层3的远离衬底1的一侧表面上形成第一部分50。这样相比于相关技术，本公开实施例提供的显示基板的制备方法，可以在避免形成阻挡层6＇的同时，对绑定区4形成了保护，这样可以有效简化显示基板100的结构及生产工艺，并有效降低显示基板100的厚度及薄膜应力。在将该显示基板100应用于显示装置(也即触控显示面板)时，有利于实现显示装置的薄型化和柔性化。
本公开实施例中，上述S300中的在封装层3的远离衬底1的一侧表面上形成触控结构5方法包括多种，且与触控结构5的结构相关。采用何种方法 形成触控结构5，可以根据实际需要选择设置。
在一些实施例中，如图7所示，上述S300中在封装层3的远离衬底1的一侧表面上形成触控结构5，包括S310a～S330a。
S310a，如图10中(b)和图11中(b)所示，在封装层3的远离衬底1的一侧表面上，形成间隔设置的多个金属搭桥522。所述多个金属搭桥522为上述触控结构5的第一部分50。
上述多个金属搭桥522采用纳米压印工艺形成。这样，形成上述多个金属搭桥522的导电材料在定型之后，即可在待形成触控结构5所在区域内形成该多个金属搭桥522，因而，可以避免该多个金属搭桥522形成在绑定区4内。
S320a，如图10中(e)和图11中(e)所示，在所述多个金属搭桥522的远离衬底1的一侧形成沿第一方向X延伸的多个第一触控电极51。每个第一触控电极51包括沿第一方向X串接的多个第一触控子电极511。
上述多个第一触控电极51沿第一方向X延伸，也即，上述多个第一触控电极51的相互平行设置。当然，上述多个第一触控电极51也可以趋近于相互平行设置(也即多个第一触控电极51之间具有夹角)，多个第一触控电极51之间未形成电连接即可。
每个第一触控电极51中的多个第一触控子电极511沿第一方向X串接，也即，多个第一触控子电极511沿第一方向X依次排列，且相邻两个第一触控子电极511之间电连接。
在一些示例中，每个第一触控电极51为一体结构。
S330a，如图10中(e)和图11中(e)所示，与所述多个第一触控电极51同层形成多行第二触控子电极521。每行第二触控子电极521包括沿第二方向Y间隔设置的多个第二触控子电极521。每行第二触控子电极521中，每相邻的两个第二触控子电极521与一个金属搭桥522通过过孔G电连接，以使所述多行第二触控子电极521和所述多个金属搭桥522形成多个第二触控电极52。其中，第一方向X和第二方向Y交叉。
此处，上述第一方向X和第二方向Y均垂直于封装层3的厚度方向。此外，第一方向X和第二方向Y之间的夹角的大小可以根据实际需要选择设置。例如，二者可以垂直。
本文中提及的“行”，并不是指纸面上的行方向，而是指与第二方向Y平行的方向。在某些情况下，涉及“行”方向的实施例可以在“列”方向的情况下实施等等，相反亦如此。将本公开所述方案进行90°旋转或镜像后亦 属本公开要求保护的权利范畴。
上述多个第二触控电极52相互平行设置。当然，上述多个第二触控电极52也可以趋近于相互平行设置(也即多个第二触控电极52之间具有夹角)，多个第二触控电极52之间未形成电连接即可。
在一些示例中，如图11中(e)所示，每相邻的两个第二触控子电极521与一个金属搭桥522通过过孔G电连接，指的是，每个第二触控子电极521通过一个过孔G与一个金属搭桥522电连接，每相邻的两个第二触控子电极521分别通过各自对应的过孔G与一个金属搭桥522电连接，而不是通过同一过孔G与一个金属搭桥522电连接。
需要说明的是，本文中提及的“同层”指的是采用同一成膜工艺形成用于形成特定图形的膜层，然后利用同一掩模板通过一次构图工艺形成的层结构。根据特定图形的不同，一次构图工艺可能包括多次曝光、显影或刻蚀工艺，而形成的层结构中的特定图形可以是连续的也可以是不连续的，这些特定图形还可能处于不同的高度或者具有不同的厚度。这样一来，可以同时制作上述多个第一触控电极51和上述多行第二触控子电极521，有利于简化显示基板100的制作工艺。
本公开实施例中，由于触控结构5中的金属搭桥522是采用纳米压印工艺形成在封装层3的一侧表面上的，因此，相对于相关技术中的显示基板的制备方法，能够在形成触控结构5之前省去形成阻挡层6＇，有利于简化显示基板100的结构及其生产工艺，并有利于降低显示基板100的厚度及薄膜应力。在将该显示基板100应用于显示装置时，有利于实现显示装置的薄型化和柔性化。
在一些示例中，如图8所示，本公开实施例提供的显示基板的制备方法，还包括S317a～S318a。
S317a，如图10中(c)和图11中(c)所示，在形成上述多个金属搭桥522之后，同层形成上述多个第一触控电极51和上述多行第二触控子电极521之前，在上述多个金属搭桥522的远离衬底1的一侧形成第一绝缘薄膜70。
S318a，如图10中(d)和图11中(d)所示，图案化第一绝缘薄膜70，在第一绝缘薄膜70中形成暴露上述多个金属搭桥521的多个过孔G。这样也便得到了第一绝缘层7。
本公开实施例在上述S310之后，并在上述S320和S330之前，在多个金属搭桥522的远离衬底1的一侧形成第一绝缘层7。这样上述多个第一触控电极51和上述多行第二触控子电极521便可以形成在第一绝缘层7的远离衬底 1的一侧表面上，与上述多个金属搭桥522绝缘，上述多行第二触控子电极521便可以通过第一绝缘层7中的多个过孔G与多个金属搭桥522电连接，构成多个第二触控电极52。
上述多个第一触控子电极511和上述多行第二触控子电极521的结构包括多种，且上述多个第一触控子电极511和上述多行第二触控子电极521的结构和材料相关。
在一些示例中，如图16所示，上述多个第一触控子电极511和上述多行第二触控子电极521均呈网格结构，且上述多个第一触控子电极511和上述多行第二触控子电极521的材料均为金属材料。
上述网格结构中网格的形状可以为规则多边形或无规则多边形，采用何种形状的网格可以根据实际需要选择设置。以图16中一个第一触控子电极511为例，多根金属线交叉形成的多个菱形网格。对于应用到任一种尺寸的显示装置的显示基板100，在制作形成网格结构的多个第一触控子电极511和多行第二触控子电极521之前，可以先使用相关软件进行光学模拟，以使多个第一触控子电极511和多行第二触控子电极521的网格的参数与显示基板100相匹配。例如对于菱形网格，可以模拟出合适的菱形边长及菱形夹角。这样可以避免由于网格结构与显示基板100不匹配，而导致显示基板100应用于显示装置后，出现干涉条纹的情况。
上述多个第一触控子电极511和多行第二触控子电极521在均采用金属材料，且均为网格结构的情况下，既可以确保触控结构5具有较高的光线透过率，又可以使得多个第一触控子电极511和多行第二触控子电极521具有较低的电阻，较好的导电性，避免电信号在第一触控子电极511和第二触控子电极521中出现传输延迟的情况，有利于提升触控结构5的灵敏度和触控效果。
在另一些示例中，如图14所示，上述多个第一触控子电极511和上述多行第二触控子电极521可以均呈面状结构，且上述多个第一触控子电极511和上述多行第二触控子电极521的材料均为氧化铟锡(Indium tin oxide，简称ITO)。
采用可透光的材料形成上述多个第一触控子电极511和上述多行第二触控子电极521，可以在确保触控结构5具有较高的光线透过率的同时，简化上述多个第一触控子电极511和上述多行第二触控子电极521的结构，进而简化显示基板100的制备工艺，提高显示基板100的生产效率。
在另一些实施例中，如图9所示，上述S300中在封装层3的远离衬底1 的一侧表面上形成触控结构5，包括S310b～S330b。
S310b，参考图17和图18所示，在封装层3的远离衬底1的一侧表面上，形成沿第二方向Y延伸且间隔设置的多个第二触控电极52。所述多个第二触控电极52为上述触控结构5的第一部分50。
上述多个第二触控电极52采用纳米压印工艺形成。这样，形成上述多个第二触控电极52的导电材料在定型之后，既可以在待形成触控结构5所在区域内形成该多个第二触控电极52，因而，可以对绑定区4进行规避，避免该多个第二触控电极52形成在绑定区4内。
S320b，参考图17和图18所示，在上述多个第二触控电极52的远离衬底1的一侧形成第二绝缘层8。
此处，第二绝缘层8可以暴露出绑定区4，也即第二绝缘层8未覆盖绑定区4。
S330b，参考图17和图18所示，在第二绝缘层8的远离衬底1的一侧，形成沿第一方向X延伸且间隔设置的多个第一触控电极51。其中，第一方向X和第二方向Y交叉。
在一些示例中，上述多个第一触控电极51采用纳米压印工艺制备形成。这样在形成该多个第一触控电极51的过程中，在对形成多个第一触控电极51的材料进行定型后，即可得到该多个第一触控电极5。这样可以避免该多个第一触控电极51形成在绑定区4内，减少阻挡层6＇的形成。
此处，采用纳米压印工艺制备形成上述多个第一触控电极51的方法，可以参照制备形成触控结构5中第一部分50的方法。
示例的，第二绝缘层8的材料可以为无机材料，例如氮化硅，也可以为有机树脂材料，例如亚克力胶。通过设置第二绝缘层8，可以使得上述多个第一触控电极51和上述多个第二触控电极52之间相互绝缘，避免两者之间形成短接。
上述多个第一触控电极51和上述多个第二触控电极52的结构包括多种，且上述多个第一触控电极51和上述多个第二触控电极52的结构和材料相关。
在一些示例中，如图19所示，上述多个第一触控电极51和上述多个第二触控电极52均呈网格结构，且上述多个第一触控电极51和上述多个第二触控电极52的材料为金属氧化物材料。
上述网格结构中网格的形状可以为规则多边形或无规则多边形，采用何种形状的网格可以根据实际需要选择设置。以第一触控电极51为例，可以为多根金属氧化物线交叉形成的多个菱形网格(如图19所示)。对于应用到任 一种尺寸的显示装置的显示基板100，在制作形成网格结构的多个第一触控电极51和多个第二触控电极52之前，可以先使用相关软件进行光学模拟，以使多个第一触控电极51和多个第二触控电极52的网格的参数与显示基板100相匹配。例如对于菱形网格，可以模拟出合适的菱形边长及菱形夹角。这样可以避免由于网格结构与显示基板100不匹配，而导致显示基板100应用于显示装置后，出现干涉条纹的情况。
此外，在上述多个第一触控电极51和上述多个第二触控电极52均呈网格结构，且材料为金属氧化物材料的情况下，既可以使得触控结构5具有较高的光线透过率，又可以使得触控结构5具有较低的电阻，较高的导电性，避免电信号在触控结构5中出现传输延迟的情况，提升触控结构5的触控效果。
在另一些示例中，如图17所示，上述多个第一触控电极51和上述多个第二触控电极52可以均呈面状结构，且上述多个第一触控电极51和上述多个第二触控电极52的材料均为氧化铟锡(Indium tin oxide，简称ITO)。
采用可透光的材料形成上述多个第一触控电极51和上述多个第二触控电极52，可以在确保触控结构5具有较高的光线透过率的同时，简化上述多个第一触控电极51和上述多个第二触控电极52的结构，进而简化显示基板100的制备工艺，提高显示基板100的生产效率。
本公开实施例中，由于触控结构5与封装层3直接接触，因此，相对于相关技术中的显示基板100＇，减少了阻挡层6＇的形成，这样可以简化显示基板100的结构及其生产工艺，且降低显示基板100的厚度及薄膜应力。在将该显示基板100应用于显示装置时，有利于实现显示装置的薄型化和柔性化。
本公开的一些实施例提供了一种显示基板100。如图14、图15、图17和图18所示，该显示基板100包括：衬底1，依次设置于衬底1的一侧的发光功能层2和封装层3，以及设置于封装层3的远离衬底1的一侧表面的触控结构5。
在一些示例中，上述衬底1包括衬底基板，以及设置在衬底基板上的驱动电路。此处，上述衬底基板和驱动电路的相关说明可以参照上述一些实施例中关于衬底基板和驱动电路的说明。
发光功能层2的结构包括多种，可以根据实际需要选择设置。
在一些示例中，如图15和图18所示，上述发光功能层2包括：设置在衬底1一侧的阳极层21，设置在阳极层21的远离衬底1一侧的发光层22， 以及设置在发光层22的远离衬底1一侧的阴极层23。
在另一些示例中，阳极层21和发光层22之间还会设置有空穴注入层和空穴传输层；发光层22和阴极层23之间还会设置有电子传输层和电子注入层。
如图20和图21所示，上述衬底1具有显示区I和位于显示区的至少一侧的非显示区H，非显示区H包括绑定区4。
此处，上述发光功能层2位于显示区I内，且发光功能层2在衬底1上的正投影位于封装层3在衬底1上的正投影范围内。这样可以利用封装层3对发光功能层2起到阻水阻氧的作用，防止外部水汽对发光功能层2造成侵蚀，避免影响显示基板100的性能。
在一些示例中，封装层3为薄膜封装层。
上述封装层3在衬底1上的正投影与绑定区4无交叠，也即，封装层3未覆盖绑定区4。
在一些示例中，触控结构5包括与封装层3接触的第一部分50，该第一部分50的材料包括导电材料。
上述导电材料的类型包括多种。示例性的，该导电材料可以为金属单质，例如为Au(金)、Ag(银)、Cu(铜)或Al(铝)等。示例性的，该导电材料也可以为金属合金，例如为AlNb(铝铌合金)等。
需要说明的是，上述第一部分50采用纳米压印工艺制备形成，并直接形成在封装层3的远离衬底1的一侧表面上，基本不会对绑定区40造成影响。第一部分50在衬底1上的正投影与绑定区4无交叠，也即第一部分50不会形成在绑定区4内，这样可以避免对绑定区4产生影响。
本公开实施例提供的一种显示基板100，通过在衬底1的一侧设置发光功能层2和封装层3，并在封装层3的远离衬底1的一侧表面上直接设置采用纳米压印工艺形成的触控结构5的第一部分50，相对相关技术中如图3所示的结构，本公开实施例中的显示基板100可以减少阻挡层6＇的设置，这样有利于简化显示基板100的结构，降低显示基板100的厚度及薄膜应力。在将该显示基板100应用于显示装置中时，有利于实现显示装置的薄型化和柔性化。
上述触控结构5的结构包括多种，可以根据实际需要选择设置。
在一些实施例中，如图14所示，上述触控结构5中的第一部分50包括间隔设置的多个金属搭桥522。触控结构5还包括：沿第一方向X延伸的多个第一触控电极51。每个第一触控电极51包括多个串接的第一触控子电极511。示例性的，每个第一触控电极51为一体结构。
在一些示例中，触控结构5还包括：多行第二触控子电极521。每行第二触控子电极521包括沿第二方向Y间隔设置的多个第二触控子电极521。每行第二触控子电极521中，每相邻的两个第二触控子电极521与一个金属搭桥522通过过孔G电连接，以使上述多行第二触控子电极521和上述多个金属搭桥522构成多个第二触控电极52。
在一些示例中，如图15所示，上述多个金属搭桥522与上述多个第一触控子电极511和上述多个第二触控子电极521之间设置有第一绝缘层7，第一绝缘层7中设置有多个过孔G，该多个过孔G暴露出多个金属搭桥522的远离衬底1的一侧表面。每个第二触控子电极521通过一个过孔G与一个金属搭桥522电连接。
上述第一该绝缘层7的材料包括多种。示例性的，第一绝缘层7的材料可以为无机材料(例如氮化硅)，也可以为有机材料。
在一些示例中，上述多个第一触控子电极511和上述多行第二触控子电极521的材料相同，且上述第一触控子电极511和上述多行第二触控子电极521同层设置。这样可以简化显示基板100的制备工艺。
可以理解的是，第一触控电极51和第二触控电极52的个数均为多个，第一触控电极51的个数和第二触控电极52的个数可相同也可不同，第一触控电极51的个数和第二触控电极52的个数可以根据实际需要选择设置。
在一些示例中，上述多个第一触控电极51之间电性断开，上述多行第二触控电极52之间电性断开。
第一触控子电极511和第二触控子电极521的结构包括多种，且该结构与其材料相关。
示例性的，如图16所示，上述多个第一触控子电极511和上述多行第二触控子电极521均呈网格结构，且上述多个第一触控子电极511和上述多行第二触控子电极521的材料均为金属材料。
上述网格结构中网格的形状可以为规则多边形或无规则多边形，采用何种形状的网格可以根据实际需要选择设置。以图16中一个第一触控子电极511为例，多根金属线交叉形成的多个菱形网格。对于应用到任一种尺寸的显示装置的显示基板100，在制作形成网格结构的多个第一触控子电极511和多行第二触控子电极521之前，可以先使用相关软件进行光学模拟，以使多个第一触控子电极511和多行第二触控子电极521的网格的参数与显示基板相匹配。例如对于菱形网格，可以模拟出合适的菱形边长及菱形夹角。这样可以避免由于网格结构与显示基板100不匹配，而导致显示基板100应用于显示 装置后，出现干涉条纹的情况。
由于金属网格结构可以透光，且金属材料的电阻较低、导电性良好，这样可以在确保触控结构5具有较高光线透过率的同时，避免电信号在多个第一触控子电极511和多行第二触控子电极521中的传输延迟，有利于提高触控结构5的灵敏度，提升触控结构5的触控效果。
此外，将显示基板100应用在大尺寸显示装置上时，也能被IC(Integrated Circuit，集成电路)驱动，而且可达到较好的触控效果，支持多点触控。而且，金属材料的第一触控电极51和第二触控电极52，可防止ESD(Electrostatic Discharge，静电放电)。
示例性的，上述多个第一触控子电极511和上述多行第二触控子电极521可以均呈面状结构，且上述多个第一触控子电极511和上述多行第二触控子电极521的材料均为氧化铟锡(Indium tin oxide，简称ITO)。
采用可透光的材料形成上述多个第一触控子电极511和上述多行第二触控子电极521，可以在确保触控结构5具有较高的光线透过率的同时，简化上述多个第一触控子电极511和上述多行第二触控子电极521的结构，进而简化显示基板100的制备工艺，提高显示基板100的生产效率。
在另一些实施例中，如图17和图19所示，上述触控结构5中的第一部分50包括沿第二方向Y延伸且间隔设置的多个第二触控电极52。触控结构5还包括：设置在上述多个第二触控电极52的远离衬底1的一侧的第二绝缘层8，以及设置在第二绝缘层8的远离衬底1的一侧、且沿第一方向X延伸且间隔设置的多个第一触控电极51。第一方向X和第二方向Y交叉
如图18所示，触控结构5中，多个第二触控电极52、第二绝缘层8以及多个第一触控电极51依次层叠设置于封装层3的远离衬底1的一侧表面上，多个第二触控电极52与封装层3的远离衬底1的一侧表面直接接触，第二绝缘层8使得多个第一触控电极51和多个第二触控电极52相互绝缘。
上述第二绝缘层8的材料包括多种。示例性的，第二绝缘层8的材料可以为有机树脂材料(例如亚克力胶)。或者，第二绝缘层8的材料可以为无机材料(例如氮化硅)。
第一触控电极51和第二触控电极52的结构包括多种，且该结构与其材料相关。
示例性的，上述多个第一触控电极51和上述多个第二触控电极52均呈网格结构，且上述多个第一触控电极51和上述多个第二触控电极52的材料均为金属氧化物材料。
此处网格结构中网格的形状可以为规则多边形或无规则多边形，采用何种形状的网格可以根据实际需要选择设置。以图19中一个第一触控电极51为例，多根金属氧化物线交叉形成的多个菱形网格。对于应用到任一种尺寸的显示装置的显示基板100，在制作形成网格结构的多个第一触控电极51和多个第二触控电极52之前，可以先使用相关软件进行光学模拟，以使多个第一触控电极51和多个第二触控电极52的网格的参数与显示基板100相匹配。例如对于菱形网格，可以模拟出合适的菱形边长及菱形夹角。这样可以避免由于网格结构与显示基板100不匹配，而导致显示基板100应用于显示装置后，出现干涉条纹的情况。
此外，在多个第一触控电极51和多个第二触控电极52均呈网格结构，且材料均为金属氧化物材料的情况下，既可以使得触控结构5具有较高的光线透过率，又可以使得触控结构5具有较低的电阻和较高的导电性，避免电信号在触控结构5中出现传输延迟的情况，提升触控结构5的灵敏度和触控效果。
示例性的，如图17所示，上述多个第一触控电极51和上述多个第二触控电极52可以均呈面状结构，且上述多个第一触控电极51和上述多个第二触控电极52的材料均为氧化铟锡(Indium tin oxide，简称ITO)。
采用可透光的材料形成上述多个第一触控电极51和上述多个第二触控电极52，可以在确保触控结构5具有较高的光线透过率的同时，简化上述多个第一触控电极51和上述多个第二触控电极52的结构，进而简化显示基板100的制备工艺，提高显示基板100的生产效率。
在一些实施例中，如图22所示，显示基板100还包括：设置于触控结构5的远离衬底1的一侧的保护层9。该保护层8覆盖触控结构5，用于保护触控结构5。
示例的，保护层9的材料可以为有机材料。
在一些实施例中，如图14和图17所示，显示基板100还包括：与触控结构5电连接的多条信号线L。该多条信号线L延伸至绑定区4。
在一些示例中，绑定区4内设置有多个焊点。多条信号线L延伸至绑定区4，也即，多条信号线L分别与绑定区4内的多个焊点电连接。
在另一些示例中，触控结构5包括多个第一触控电极51和多个第二触控电极52。多条信号线L与触控结构5电连接，也即，多条信号线L分别与多个第一触控电极51和多个第二触控电极52电连接。
需要说明的是，绑定区4用于进行IC(Integrated Circuit，集成电路)和/ 或FPC(Flexible Printed Circuit，柔性印刷电路)的绑定。绑定后的IC和/或FPC可以向延伸于绑定区4内的多条信号线L提供电信号，进而将该电信号传输至触控结构5。
此外，本公开的所有涉及绑定区4的附图中，均以与触控结构5电连接的信号线L延伸于绑定区4内，且绑定区4的数量为一个为例进行示意，但本公开并不限于此。
在一些实施例中，上述多条信号线L与上述触控结构5中的第一部分50的材料相同，且上述多条信号线L与第一部分50同层设置。这样有利于简化显示基板100的制备工艺。
此处，触控结构5中的多个第一触控电极51和多个第二触控电极52可以通过过孔与上述多条信号线L分别电连接。
本公开的一些实施例还提供了一种显示装置200。如图23所示，该显示装置200包括如上述一些实施例中提供的显示基板100。
上述显示装置200所包括的显示基板100，具有与上述一些实施例中提供的显示基板100相同的结构和有益技术效果，在此不再赘述。
在一些示例中，上述显示装置200还包括：用于安装上述显示基板100的外壳，和/或，安装在显示基板100上的摄像头等。
在一些实施例中，上述显示装置200为电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种显示基板的制备方法，包括：
    提供衬底；所述衬底具有非显示区，所述非显示区包括绑定区；
    在所述衬底的一侧依次形成发光功能层和封装层；所述封装层在所述衬底上的正投影与所述绑定区无交叠；
    在所述封装层的远离所述衬底的一侧表面上形成触控结构；所述触控结构包括与所述封装层接触的第一部分，所述第一部分的材料包括导电材料；其中，
    形成所述第一部分包括：采用纳米压印工艺形成所述第一部分。
  2. 根据权利要求1所述的制备方法，其中，
    在所述封装层的远离所述衬底的一侧表面上形成触控结构，包括：
    在所述封装层的远离所述衬底的一侧表面上形成间隔设置的多个金属搭桥；所述多个金属搭桥为所述触控结构的第一部分；
    在所述多个金属搭桥的远离所述衬底的一侧形成沿第一方向延伸的多个第一触控电极；每个第一触控电极包括沿所述第一方向串接的多个第一触控子电极；
    与所述多个第一触控电极同层形成多行第二触控子电极；每行第二触控子电极包括沿第二方向间隔设置的多个第二触控子电极；每行第二触控子电极中，每相邻的两个第二触控子电极与一个金属搭桥通过过孔电连接，以使所述多行第二触控子电极和所述多个金属搭桥形成多个第二触控电极；
    其中，所述第一方向和所述第二方向交叉。
  3. 根据权利要求2所述的制备方法，还包括：
    在形成所述多个金属搭桥之后，同层形成所述多个第一触控电极和所述多行第二触控子电极之前，在所述多个金属搭桥的远离所述衬底的一侧形成第一绝缘薄膜；
    图案化所述第一绝缘薄膜，在所述第一绝缘薄膜中形成暴露所述多个金属搭桥的多个过孔。
  4. 根据权利要求2或3所述的制备方法，其中，所述多个第一触控子电极和所述多行第二触控子电极均呈网格结构，且所述多个第一触控子电极和所述多行第二触控子电极的材料均为金属材料。
  5. 根据权利要求1所述的制备方法，其中，
    在所述封装层的远离所述衬底的一侧表面上形成触控结构，包括：
    在所述封装层的远离所述衬底的一侧表面上，形成沿第二方向延伸且间 隔设置的多个第二触控电极；所述多个第二触控电极为所述触控结构的第一部分；
    在所述多个第二触控电极的远离所述衬底的一侧形成第二绝缘层；
    在所述第二绝缘层的远离所述衬底的一侧，形成沿第一方向延伸且间隔设置的多个第一触控电极；
    其中，所述第一方向和所述第二方向交叉。
  6. 根据权利要求5所述的制备方法，其中，形成所述多个第一触控电极包括：采用纳米压印工艺形成所述多个第一触控电极。
  7. 根据权利要求5或6所述的制备方法，其中，所述多个第一触控电极和所述多个第二触控电极均呈网格结构，且所述多个第一触控电极和所述多个第二触控电极的材料均为金属氧化物材料。
  8. 根据权利要求1～7中任一项所述的制备方法，其中，采用纳米压印工艺形成所述第一部分，包括：
    提供转印模板基板；
    在所述转印模板基板的一侧形成压印胶层，得到转印模板；所述压印胶层具有间隔设置的多个凹槽；
    在所述多个凹槽内填充导电材料；
    将填充有导电材料的转印模板压印在所述封装层的远离所述衬底基板的一侧表面上，得到所述第一部分。
  9. 根据权利要求1～8中任一项所述的制备方法，其中，在所述衬底的一侧形成发光功能层，包括：
    在所述衬底的一侧形成阳极层；
    在所述阳极层的远离所述衬底的一侧形成发光层；
    在所述发光层的远离所述衬底的一侧形成阴极层。
  10. 一种显示基板，包括：
    衬底，所述衬底具有非显示区，所述非显示区包括绑定区；
    依次设置于所述衬底的一侧的发光功能层和封装层，所述封装层在所述衬底上的正投影与所述绑定区无交叠；以及，
    设置于所述封装层的远离所述衬底的一侧表面的触控结构；所述触控结构包括与所述封装层接触的第一部分，所述第一部分的材料包括导电材料。
  11. 根据权利要求10所述的显示基板，其中，所述第一部分包括间隔设置的多个金属搭桥；
    所述触控结构还包括：
    沿第一方向延伸的多个第一触控电极；每个第一触控电极包括多个串接的第一触控子电极；以及，
    多行第二触控子电极；每行第二触控子电极包括沿第二方向间隔设置的多个第二触控子电极；每行第二触控子电极中，每相邻的两个第二触控子电极与一个金属搭桥通过过孔电连接，以使所述多行第二触控子电极和所述多个金属搭桥形成多个第二触控电极；
    所述多个第一触控子电极和所述多行第二触控子电极的材料相同，且所述多个第一触控子电极和所述多行第二触控子电极同层设置。
  12. 根据权利要求11所述的显示基板，其中，所述多个第一触控子电极和所述多行第二触控子电极均呈网格结构，且所述多个第一触控子电极和所述多个第二触控子电极的材料均为金属材料。
  13. 根据权利要求10所述的显示基板，其中，所述第一部分包括沿第二方向延伸且间隔设置的多个第二触控电极；
    所述触控结构还包括：
    设置在所述多个第二触控电极的远离所述衬底的一侧的第二绝缘层；以及，
    设置在所述第二绝缘层的远离所述衬底的一侧、沿第一方向延伸且间隔设置的多个第一触控电极；
    其中，所述第一方向和所述第二方向交叉。
  14. 根据权利要求13所述的显示基板，其中，所述多个第一触控电极和所述多个第二触控电极均呈网格结构，且所述多个第一触控电极和所述多个第二触控电极的材料均为金属氧化物材料。
  15. 根据权利要求10～14中任一项所述的显示基板，还包括：
    设置于所述触控结构的远离所述衬底的一侧的保护层。
  16. 根据权利要求10～15中任一项所述的显示基板，所述发光功能层包括：
    设置在所述衬底一侧的阳极层；
    设置在所述阳极层的远离所述衬底一侧的发光层；以及，
    设置在所述发光层的远离所述衬底一侧的阴极层。
  17. 根据权利要求10～16中任一项所述的显示基板，还包括：与所述触控结构电连接的多条信号线；所述多条信号线延伸至所述绑定区。
  18. 根据权利要求17所述的显示基板，其中，所述多条信号线与所述第一部分的材料相同，且所述多条信号线与所述第一部分同层设置。
  19. 一种显示装置，包括如权利要求10～18中任一项所述的显示基板。
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109920828B (zh) 2019-03-21 2022-10-11 京东方科技集团股份有限公司 一种oled基板及其制备方法
CN110489017B (zh) * 2019-09-27 2022-08-30 业成科技（成都）有限公司 触控屏、触控显示屏及智能终端
CN111752415B (zh) * 2020-06-24 2024-01-19 京东方科技集团股份有限公司 一种触控模组、其制备方法及显示装置
CN114115571A (zh) * 2020-08-26 2022-03-01 深圳市柔宇科技股份有限公司 触控显示面板及电子设备
CN112286399A (zh) * 2020-11-18 2021-01-29 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法
CN114690957B (zh) * 2022-03-31 2023-03-31 业成科技（成都）有限公司 内嵌式触控显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106405920A (zh) * 2016-09-09 2017-02-15 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
CN108920012A (zh) * 2018-08-01 2018-11-30 京东方科技集团股份有限公司 一种触控显示面板、显示装置及其制作方法
US20190073071A1 (en) * 2017-09-07 2019-03-07 Samsung Display Co., Ltd. Display device including touch sensor and manufacturing method thereof
CN109920828A (zh) * 2019-03-21 2019-06-21 京东方科技集团股份有限公司 一种oled基板及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8499810B2 (en) * 2009-08-27 2013-08-06 Transfer Devices Inc. Molecular transfer lithography apparatus and method for transferring patterned materials to a substrate
CN105718097A (zh) * 2014-12-04 2016-06-29 介面光电股份有限公司 触控面板及其传感电极
KR101764220B1 (ko) * 2015-10-08 2017-08-03 엘에스니꼬동제련 주식회사 나노 임프린트용 전도성 조성물 및 이의 제조 방법, 그리고 이를 이용하는 터치 패널의 제조 방법
CN106708307B (zh) * 2015-11-16 2023-04-21 台湾格雷蒙股份有限公司 具有无感应功能金属线条的触控面板
KR102415044B1 (ko) * 2015-12-11 2022-07-01 삼성디스플레이 주식회사 터치 스크린 패널, 이의 제조 방법 및 터치 스크린 패널을 포함하는 터치 표시 장치
CN106896948A (zh) * 2015-12-18 2017-06-27 介面光电股份有限公司 触控面板及其制造方法
CN106990858A (zh) * 2016-01-21 2017-07-28 倍胜光电股份有限公司 可消除莫瑞效应的触控面板
CN105977279B (zh) * 2016-07-07 2020-12-01 京东方科技集团股份有限公司 有机电致发光二极管基板及其制备方法、显示装置
CN107248520B (zh) * 2017-06-07 2019-10-01 京东方科技集团股份有限公司 一种掩模板、有机电致发光显示面板及其封装方法
CN107706156A (zh) * 2017-11-13 2018-02-16 京东方科技集团股份有限公司 一种柔性显示基板及其制备方法、柔性显示装置
CN108376749B (zh) * 2018-02-26 2020-12-15 京东方科技集团股份有限公司 一种显示面板的封装方法、显示面板及显示装置
CN208459991U (zh) * 2018-03-27 2019-02-01 佳冠电子股份有限公司 具有无感应功能的网格图案的触控面板
CN208110555U (zh) * 2018-03-28 2018-11-16 佳冠电子股份有限公司 能降低莫瑞效应的触控面板
CN108878444B (zh) * 2018-06-07 2021-11-19 武汉天马微电子有限公司 显示面板及显示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106405920A (zh) * 2016-09-09 2017-02-15 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
US20190073071A1 (en) * 2017-09-07 2019-03-07 Samsung Display Co., Ltd. Display device including touch sensor and manufacturing method thereof
CN108920012A (zh) * 2018-08-01 2018-11-30 京东方科技集团股份有限公司 一种触控显示面板、显示装置及其制作方法
CN109920828A (zh) * 2019-03-21 2019-06-21 京东方科技集团股份有限公司 一种oled基板及其制备方法

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