WO2023032755A1 - 加熱装置 - Google Patents
加熱装置 Download PDFInfo
- Publication number
- WO2023032755A1 WO2023032755A1 PCT/JP2022/031708 JP2022031708W WO2023032755A1 WO 2023032755 A1 WO2023032755 A1 WO 2023032755A1 JP 2022031708 W JP2022031708 W JP 2022031708W WO 2023032755 A1 WO2023032755 A1 WO 2023032755A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heating
- plate
- hole
- heating device
- heating plate
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 153
- 239000000463 material Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 description 23
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000008602 contraction Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000011224 oxide ceramic Substances 0.000 description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/72—Plates of sheet metal
Definitions
- the disclosed embodiments relate to heating devices.
- Patent Document 1 includes a plate-shaped mold in which a hole extending in the thickness direction is formed in the center of a heating surface and a plurality of horizontal holes are formed in the side surface so as to avoid the hole. heaters are respectively inserted.
- a heating device has a heating plate and a plurality of heaters.
- the heating plate has a heating surface and a back surface against the heating surface.
- the heating plate has a hole extending in the thickness direction formed in the center of the heating surface, and a plurality of recesses formed around at least a region corresponding to the hole on the back surface.
- a plurality of heaters are respectively inserted into the plurality of recesses.
- FIG. 1 is a side view of the heating device according to the embodiment.
- FIG. 2 is a top view of the heating device according to the embodiment.
- FIG. 3 is a cross-sectional view taken along line III-III of FIG.
- FIG. 4 is a cross-sectional view of a heating device according to Modification 1 of the embodiment.
- FIG. 5 is a cross-sectional view of a heating device according to Modification 2 of the embodiment.
- FIG. 6 is a cross-sectional view of a heating device according to Modification 3 of the embodiment.
- FIG. 7 is a cross-sectional view of a heating device according to Modification 4 of the embodiment.
- FIG. 8 is a top view of a heating device according to Modification 5 of the embodiment.
- FIG. 1 is a side view of a heating device 100 according to an embodiment.
- FIG. 2 is a top view of the heating device 100 according to the embodiment.
- the surface positioned on the heating object side when the heating device 100 is brought into contact with the heating object is the “upper surface”, and the surface positioned on the opposite side of the heating object is the “lower surface”.
- the heating device 100 may be used upside down, for example, or may be used in any posture.
- the heating device 100 has a heating plate 110, a plurality of heaters 120 and a fixed plate .
- the heating plate 110 is, for example, a plate-like member made of metal, and has an upper surface 110a that can come into contact with an object to be heated. That is, the upper surface 110a of the heating plate 110 serves as a heating surface (an example of the first surface) for heating the object to be heated.
- the upper surface 110a is used, for example, for heating a mold as an example of an object to be heated.
- a plurality of recesses 113 are formed in a lower surface (an example of a second surface) 110b on the side opposite to the heating surface of the heating plate 110 (see FIG. 3).
- the plurality of heaters 120 are, for example, ceramic heaters having a ceramic body and a heating resistor located inside the ceramic body. By using a ceramic heater as the heater 120, it is possible to reduce seizure between the heating plate 110 and the heater 120 which are made of metal.
- the length of the heater 120 that is, the length of the ceramic body can be, for example, about 1 mm to 200 mm. Also, the outer dimensions of the ceramic body can be, for example, about 0.5 mm to 100 mm.
- the shape of the heater 120 that is, the shape of the ceramic body is not limited to a cylindrical shape, and may be, for example, an elliptical columnar shape or a prismatic shape.
- the material of the ceramic body is, for example, ceramic having insulating properties. As the material of the ceramic body, for example, oxide ceramics, nitride ceramics, carbide ceramics, or the like can be used.
- a heating resistor is a member that generates heat when an electric current flows.
- Heating resistors may include high resistance conductors including, for example, tungsten, molybdenum, and the like.
- the dimensions of the heating resistor can be, for example, a width of 0.1 mm to 5 mm, a thickness of 0.05 mm to 0.3 mm, and a total length of 1 mm to 500 mm.
- the heating resistor may be a conductive ceramic containing, for example, tungsten carbide. In this case, the difference in thermal expansion between the ceramic body and the heat generating resistor can be reduced. Thereby, the thermal stress between the ceramic body and the heating resistor can be reduced. As a result, durability of the heater 120 can be enhanced.
- a plurality of heaters 120 are positioned in each of the plurality of recesses 113 in the heating plate 110 . That is, the plurality of heaters 120 are inserted into the plurality of recesses 113 so as to be perpendicular to the upper surface 110a of the heating plate 110, which is the heating surface.
- the fixing plate 130 is, for example, a plate-like member made of metal. A plurality of heaters 120 are fixed to the fixed plate 130 .
- FIG. 3 is a cross-sectional view taken along line III-III of FIG. Note that FIG. 2 shows a plan transparent view of the heating plate 110 seen through from a direction orthogonal to the upper surface 110a. As shown in FIGS. 2 and 3 , the heating device 100 is configured such that a plurality of heaters 120 are fixed to a fixing plate 130 and inserted into a plurality of recesses 113 of a heating plate 110 .
- the heating plate 110 has an upper surface 110a and a lower surface 110b.
- the upper surface 110a is a heating surface for heating an object to be heated, and the lower surface 110b is the back surface of the heating surface.
- a hole 116 extending in the thickness direction of the heating plate 110 is formed in the center of the upper surface 110a, as shown in FIGS.
- the hole 116 extends in the thickness direction of the heating plate 110 to a depth that does not penetrate the heating plate 110 from the upper surface 110a to the lower surface 110b.
- the hole 116 extends to a position reaching a heat insulating member 115 of the heating plate 110, which will be described later.
- the cross-sectional shape of the hole 116 may be any shape.
- the hole 116 shown in FIG. 3 has a cross-sectional shape with linear side surfaces.
- the diameter (width) of the hole 116 may be any diameter.
- the hole 116 shown in FIG. 3 has a smaller diameter than each of the plurality of recesses 113 .
- the heat in the center of the upper surface 110 a can be released to the atmosphere inside the hole 116 . That is, the center of the upper surface 110a is more difficult for heat to escape to the surrounding atmosphere of the heating plate 110 than the periphery of the upper surface 110a. Therefore, the center of the upper surface 110a of the heating plate 110 may have a higher temperature than the periphery.
- the hole 116 is formed in the center of the upper surface 110a, the heat in the center of the upper surface 110a can be released to the atmosphere inside the hole 116. It can be increased compared to the heat dissipation at the periphery. Thereby, the temperature difference between the center and the periphery of the upper surface 110a can be reduced.
- a plurality of recesses 113 into which a plurality of heaters 120 are respectively inserted are formed around at least a region corresponding to the hole 116 of the lower surface 110b.
- the plurality of recesses 113 are formed at equal intervals along the outer periphery of at least the area corresponding to the hole 116 of the lower surface 110b.
- the plurality of recesses 113 are formed in a grid pattern at even intervals over the entire surface of the lower surface 110b.
- a plurality of recesses 113 are formed at equal intervals along the outer periphery of at least the region corresponding to the hole 116 of the lower surface 110b, so that a plurality of heaters are formed along the circumferential direction of the hole 116 of the upper surface 110a. 120 can be evenly spaced.
- the plurality of heaters 120 are located around the hole 116 when seen from above (see FIG. 2).
- the area around the hole 116 of the upper surface 110 a of the heating plate 110 can be evenly heated by the plurality of heaters 120 without causing a temperature difference along the circumferential direction of the hole 116 .
- the heating device 100 of the present embodiment it is possible to improve the heat uniformity around the hole 116 of the upper surface 110a, which is the heating surface.
- the formation positions of the plurality of recesses 113 are not limited to the positions shown in FIG.
- the plurality of recesses 113 may be formed concentrically around regions corresponding to the holes 116 on the entire surface of the lower surface 110b.
- the heating plate 110 has a laminated structure in which a first plate member 111, a second plate member 112, and a heat insulating member 115 are laminated.
- the first plate member 111 is a plate member having an upper surface 110a of the heating plate 110, which is a heating surface.
- the first plate member 111 is attached to the second plate member 112 by a joining member 114 such as a bolt while the heat insulating member 115 is arranged between the first plate member 111 and the second plate member 112 .
- a joining member 114 such as a bolt
- the heat insulating member 115 is arranged between the first plate member 111 and the second plate member 112 .
- a cylindrical spacer member 170 made of, for example, highly heat-insulating ceramic is provided on the outer periphery of the joining member 114 .
- a plurality of recesses 111b are formed on the lower surface 111a of the first plate member 111 opposite to the heating surface.
- the second plate member 112 is a plate-shaped member having an upper surface 112a that serves as a surface to be joined that is joined to the joint surface of the first plate member 111, and a lower surface 110b located on the opposite side of the upper surface 112a.
- a plurality of through holes 112b are formed in the second plate member 112 at positions corresponding to the plurality of recesses 111b.
- the heat insulating member 115 is positioned between the first plate member 111 and the second plate member 112 . That is, the heat insulating member 115 is interposed between the first plate member 111 and the second plate member 112 .
- the heat insulating member 115 is, for example, a sheet-like member made of heat insulating fibers, and has a function of restricting heat transfer from the first plate member 111 side to the second plate member 112 side.
- a plurality of through holes 115a are formed in the heat insulating member 115 at positions corresponding to the plurality of recesses 111b.
- the material of the heat insulating member 115 is preferably ceramics having heat insulating properties, for example.
- As the material of the heat insulating member 115 for example, oxide ceramics, nitride ceramics, carbide ceramics, or the like can be used.
- Each of the plurality of recesses 113 is formed by each of the plurality of through holes 112b, each of the plurality of through holes 115a, and the plurality of recesses 111b. That is, the inner surface of each through hole 112b, the inner surface of each through hole 115a, and the inner surface of each recess 111b form the inner surface of each recess 113, and the bottom surface of each recess 111b forms the bottom surface of each recess 113.
- the tips 120a of the plurality of heaters 120 are positioned in the plurality of recesses 111b with the plurality of heaters 120 inserted into the plurality of recesses 113, respectively.
- the fixing plate 130 has a plurality of fixing holes 130 a at positions corresponding to the plurality of recesses 113 .
- a plurality of heaters 120 are respectively inserted and fixed to the plurality of fixing holes 130a.
- a female screw is formed on a part of the inner wall of each fixing hole 130a.
- a cylindrical mounting member 121 is attached to the outer peripheral surface of each heater 120, and a part of the outer peripheral surface of the attaching member 121 is formed with an external thread 121a.
- the plurality of heaters 120 are fixed to the fixing plate 130 by fitting the male screw 121a into the female screw of each fixing hole 130a when each heater 120 is inserted into each fixing hole 130a.
- the fixed plate 130 is arranged apart from the heating plate 110 .
- the fixing plate 130 is connected to the heating plate 110 (second plate 110) by connecting members 131 such as bolts with a gap formed between the fixing plate 130 and the heating plate 110. member 112).
- a spacer member 140 is arranged between the heating plate 110 and the fixed plate 130 .
- the spacer member 140 has a tubular shape surrounding a portion of the connecting member 131 located between the heating plate 110 and the fixing plate 130 , and has both ends in contact with the heating plate 110 and the fixing plate 130 .
- the spacer member 140 As a material for the spacer member 140, for example, metal such as stainless steel can be used. Thereby, the durability of the spacer member 140 can be improved, and the distance between the fixing plate 130 and the heating plate 110 can be maintained constant.
- the material of the spacer member 140 may be, for example, heat-resistant ceramics.
- a material of the spacer member 140 for example, oxide ceramics, nitride ceramics, carbide ceramics, or the like can be used. As a result, thermal expansion and thermal contraction of the spacer member 140 can be reduced, and wear of the spacer member 140 can be reduced.
- the plurality of heaters 120 have base ends 120b at positions farther from the upper surface 110a of the heating plate 110, which is the heating surface, than the lower surface of the fixing plate 130 opposite to the heating plate 110.
- Power supply terminals 122 and 123 for supplying electric power to the plurality of heaters 120 are provided at the proximal end 120b.
- the base ends 120b of the plurality of heaters 120 protrude in a direction away from the upper surface 110a of the heating plate 110, which is the heating surface, rather than the lower surface of the fixed plate 130, and the power supply terminals 122 and 123 are provided at the base ends 120b. ing.
- the power supply terminals 122 and 123 By providing the power supply terminals 122 and 123 at the proximal end 120b projecting away from the upper surface 110a of the heating plate 110 which is the heating surface, the power supply terminals 122 and 123 can be kept away from the heating surface. As a result, the power supply terminals 122 and 123 can be protected from the heat of the heating surface.
- FIG. 4 is a cross-sectional view of the heating device 100 according to Modification 1 of the embodiment.
- the heating device 100 shown in FIG. 4 is different from the heating device 100 shown in FIGS. 1 to 3 mainly in the shape of the hole 116 .
- the hole 116 has a cross-sectional shape in which the diameter (width) of the upper surface 110a, which is the heating surface, is smaller than the diameter (width) of the lower surface 110b, which is the back surface of the heating surface.
- the hole 116 has a cross-sectional shape in which the diameter on the side of the upper surface 110a is smaller than the diameter on the side of the lower surface 110b, and the side surfaces are stepped.
- the diameter on the side of the upper surface 110a is smaller than the diameter on the side of the lower surface 110b. That is, as the diameter of the hole 116 increases, the amount of heat radiation from the center of the upper surface 110a to the atmosphere inside the hole 116 can be increased. be. Since the upper surface 110a, which is a heating surface, receives an external force from the object to be heated when in contact with the object to be heated, a decrease in the strength of the upper surface 110a side of the heating plate 110 is a factor that impairs the durability of the heating plate 110.
- the strength of the heating plate 110 on the upper surface 110a side can be relatively increased.
- deterioration in the strength of the upper surface 110a side of the heating plate 110 is reduced, so that the durability of the heating plate 110 can be improved.
- the cross-sectional shape of the hole portion 116 may be various shapes as long as the diameter on the side of the upper surface 110a is smaller than the diameter on the side of the lower surface 110b.
- the hole 116 may have a cross-sectional shape in which the diameter on the upper surface 110a side is smaller than the diameter on the lower surface 110b side and the side surfaces are tapered or curved.
- FIG. 5 is a cross-sectional view of a heating device 100 according to Modification 2 of the embodiment.
- the heating device 100 shown in FIG. 5 is different from the heating device 100 shown in FIGS. 1 to 3 mainly in the diameter of the hole 116 .
- hole 116 has a larger diameter than each of recesses 113 .
- the diameter of the hole 116 By making the diameter of the hole 116 larger than the diameter of each of the plurality of recesses 113 in this way, the surface area and cross-sectional area of the hole 116 are increased, and heat dissipation to the atmosphere inside the hole 116 is promoted. Heat uniformity around the hole 116 of the upper surface 110a can be further improved.
- FIG. 6 is a cross-sectional view of a heating device 100 according to Modification 3 of the embodiment.
- Heating device 100 shown in FIG. 5 is different from the heating device 100 shown in FIG. Specifically, in the heating device 100 shown in FIG. 6, the hole 116 penetrates the first plate member 111, the heat insulating member 115, and the second plate member 112 that constitute the heating plate 110 to the lower surface 110b. .
- the hole portion 116 includes a first through-hole 116a penetrating through the first plate member 111 and a second through-hole 116b penetrating through the second plate member 112 .
- the first through-hole 116a and the second through-hole 116b have substantially the same diameter.
- the exposed surface 115b of the heat insulating member 115 exposed between the first through-hole 116a and the second through-hole 116b extends outward from the inner peripheral surfaces of the first through-hole 116a and the second through-hole 116b. It is recessed and forms a step between the first through hole 116a and the second through hole 116b.
- An annular cover member 180 is arranged on the step between the first through hole 116a and the second through hole 116b. Cover member 180 covers exposed surface 115 b of heat insulating member 115 .
- As a material of the cover member 180 for example, highly heat-resistant ceramic or metal can be used.
- the heating plate 110 may have an annular cover member 180 inside the hole 116 .
- the cover member 180 may cover the exposed surface 115 b of the heat insulating member 115 . Thereby, deterioration of the heat insulating member 115 can be reduced.
- the hole 116 penetrates the heating plate 110 to the lower surface 110b in this way, the surface area and the cross-sectional area of the hole 116 are increased, and the heat radiation to the atmosphere inside the hole 116 is facilitated. Heat uniformity around 116 can be further improved.
- the exposed surface 115b of the heat insulating member 115 exposed in the hole 116 is covered with the cover member 180, it is possible to reduce dust in the atmosphere inside the hole 116 from adhering to the heat insulating member 115. can. Thereby, deterioration of the heat insulating member 115 can be reduced.
- FIG. 7 is a cross-sectional view of a heating device 100 according to Modification 4 of the embodiment.
- the heating device 100 shown in FIG. 7 differs from the heating device 100 shown in FIG. 6 in the arrangement of the cover member 180 .
- the cover member 180 is fitted into the groove portion 111c formed in the lower surface 111a of the first plate member 111 with a gap between it and the inner surface of the groove portion 111c. are combined.
- the cover member 180 is not joined to the inner surface of the groove portion 111c with a joining material. In other words, lateral movement of the cover member 180 is not restricted within the groove 111c.
- the cover member 180 is fitted into the groove portion 111c of the first plate member 111 with a gap, thereby preventing the cover member 180 from coming off while allowing the cover member 180 to move laterally. can be done.
- the cover member 180 is formed on at least one of the surface of the first plate member 111 opposite to the first surface and the surface of the second plate member opposite to the second surface.
- the groove 111c may be fitted with a gap from the inner side surface of the groove 111c. As a result, it is possible to prevent the cover member from coming off while allowing the cover member 180 to move in the lateral direction.
- cover member 180 may be fitted into the groove formed in the upper surface 112a of the second plate member 112 with a gap between it and the inner side surface of the groove.
- the cover member 180 is fitted into grooves formed in both the lower surface 111a of the first plate member 111 and the upper surface 112a of the second plate member 112 with a gap between the cover member 180 and the inner side surfaces of the grooves.
- FIG. 8 is a top view of a heating device 100 according to Modification 5 of the embodiment.
- the heating device 100 shown in FIG. 8 is different from the heating device 100 shown in FIGS. 1 to 3 in that holes different from the holes 116 are formed in the upper surface 110a of the heating plate 110, which is the heating surface. do.
- a plurality of (here, four) other holes 117 extending in the thickness direction are formed at positions different from the holes 116 on the upper surface 110a of the heating plate 110 shown in FIG.
- the formation positions of the plurality of other holes 117 may be arbitrary positions.
- a plurality of other holes 117 may be formed at equal intervals along the perimeter of hole 116 of upper surface 110a.
- heating device 110 heating plate 110a upper surface 110b lower surface 111 first plate member 111a lower surface 111b recess 111c groove 112 second plate member 112a upper surface 112b through hole 113 recess 114 joining member 115 heat insulating member 115a through hole 115b exposed surface 116 hole 116a First through hole 116b Second through hole 117 Hole 120 Heater 120a Tip 120b Base end 121 Mounting member 121a Male screw 122, 123 Power supply terminal 130 Fixing plate 130a Fixing hole 131 Connecting member 140 Spacer member 170 Spacer member 180 Cover Element
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- Resistance Heating (AREA)
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JP2023545476A JPWO2023032755A1 (enrdf_load_stackoverflow) | 2021-08-31 | 2022-08-23 |
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JP2021-141106 | 2021-08-31 | ||
JP2021141106 | 2021-08-31 |
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WO2023032755A1 true WO2023032755A1 (ja) | 2023-03-09 |
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PCT/JP2022/031708 WO2023032755A1 (ja) | 2021-08-31 | 2022-08-23 | 加熱装置 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004071182A (ja) * | 2002-08-01 | 2004-03-04 | Ngk Spark Plug Co Ltd | 複合ヒータ |
JP2016207595A (ja) * | 2015-04-28 | 2016-12-08 | 日本特殊陶業株式会社 | 加熱装置 |
JP2017037721A (ja) * | 2015-08-07 | 2017-02-16 | 日本発條株式会社 | ヒータユニット |
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JP4646461B2 (ja) * | 2001-08-10 | 2011-03-09 | 京セラ株式会社 | 電極内蔵セラミック部材及びその製造方法 |
WO2004089039A1 (ja) * | 2003-03-31 | 2004-10-14 | Ibiden Co., Ltd. | 半導体製造・検査装置用ヒータ |
JP6520160B2 (ja) * | 2015-02-02 | 2019-05-29 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP7141262B2 (ja) * | 2018-06-29 | 2022-09-22 | 日本特殊陶業株式会社 | 基板保持部材及びその製造方法 |
JP7263078B2 (ja) * | 2018-09-27 | 2023-04-24 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
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- 2022-08-23 WO PCT/JP2022/031708 patent/WO2023032755A1/ja active Application Filing
- 2022-08-23 JP JP2023545476A patent/JPWO2023032755A1/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004071182A (ja) * | 2002-08-01 | 2004-03-04 | Ngk Spark Plug Co Ltd | 複合ヒータ |
JP2016207595A (ja) * | 2015-04-28 | 2016-12-08 | 日本特殊陶業株式会社 | 加熱装置 |
JP2017037721A (ja) * | 2015-08-07 | 2017-02-16 | 日本発條株式会社 | ヒータユニット |
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