JPWO2023032755A1 - - Google Patents

Info

Publication number
JPWO2023032755A1
JPWO2023032755A1 JP2023545476A JP2023545476A JPWO2023032755A1 JP WO2023032755 A1 JPWO2023032755 A1 JP WO2023032755A1 JP 2023545476 A JP2023545476 A JP 2023545476A JP 2023545476 A JP2023545476 A JP 2023545476A JP WO2023032755 A1 JPWO2023032755 A1 JP WO2023032755A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545476A
Other languages
Japanese (ja)
Other versions
JPWO2023032755A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032755A1 publication Critical patent/JPWO2023032755A1/ja
Publication of JPWO2023032755A5 publication Critical patent/JPWO2023032755A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/72—Plates of sheet metal
JP2023545476A 2021-08-31 2022-08-23 Pending JPWO2023032755A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021141106 2021-08-31
PCT/JP2022/031708 WO2023032755A1 (ja) 2021-08-31 2022-08-23 加熱装置

Publications (2)

Publication Number Publication Date
JPWO2023032755A1 true JPWO2023032755A1 (enrdf_load_stackoverflow) 2023-03-09
JPWO2023032755A5 JPWO2023032755A5 (enrdf_load_stackoverflow) 2024-05-17

Family

ID=85412514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545476A Pending JPWO2023032755A1 (enrdf_load_stackoverflow) 2021-08-31 2022-08-23

Country Status (2)

Country Link
JP (1) JPWO2023032755A1 (enrdf_load_stackoverflow)
WO (1) WO2023032755A1 (enrdf_load_stackoverflow)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060017A (ja) * 2001-08-10 2003-02-28 Kyocera Corp 電極内蔵セラミック部材及びその製造方法
JP2004071182A (ja) * 2002-08-01 2004-03-04 Ngk Spark Plug Co Ltd 複合ヒータ
WO2004089039A1 (ja) * 2003-03-31 2004-10-14 Ibiden Co., Ltd. 半導体製造・検査装置用ヒータ
JP2016143760A (ja) * 2015-02-02 2016-08-08 住友大阪セメント株式会社 静電チャック装置
JP2016207595A (ja) * 2015-04-28 2016-12-08 日本特殊陶業株式会社 加熱装置
JP2017037721A (ja) * 2015-08-07 2017-02-16 日本発條株式会社 ヒータユニット
JP2020004892A (ja) * 2018-06-29 2020-01-09 日本特殊陶業株式会社 基板保持部材及びその製造方法
JP2020057763A (ja) * 2018-09-27 2020-04-09 東京エレクトロン株式会社 基板処理装置および基板処理方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060017A (ja) * 2001-08-10 2003-02-28 Kyocera Corp 電極内蔵セラミック部材及びその製造方法
JP2004071182A (ja) * 2002-08-01 2004-03-04 Ngk Spark Plug Co Ltd 複合ヒータ
WO2004089039A1 (ja) * 2003-03-31 2004-10-14 Ibiden Co., Ltd. 半導体製造・検査装置用ヒータ
JP2016143760A (ja) * 2015-02-02 2016-08-08 住友大阪セメント株式会社 静電チャック装置
JP2016207595A (ja) * 2015-04-28 2016-12-08 日本特殊陶業株式会社 加熱装置
JP2017037721A (ja) * 2015-08-07 2017-02-16 日本発條株式会社 ヒータユニット
JP2020004892A (ja) * 2018-06-29 2020-01-09 日本特殊陶業株式会社 基板保持部材及びその製造方法
JP2020057763A (ja) * 2018-09-27 2020-04-09 東京エレクトロン株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
WO2023032755A1 (ja) 2023-03-09

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