WO2023032536A1 - Pâte conductrice photosensible, procédé de production de matériau de base à motif conducteur, procédé de production de composant électronique, film durci, corps cuit et composant électronique - Google Patents

Pâte conductrice photosensible, procédé de production de matériau de base à motif conducteur, procédé de production de composant électronique, film durci, corps cuit et composant électronique Download PDF

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WO2023032536A1
WO2023032536A1 PCT/JP2022/029091 JP2022029091W WO2023032536A1 WO 2023032536 A1 WO2023032536 A1 WO 2023032536A1 JP 2022029091 W JP2022029091 W JP 2022029091W WO 2023032536 A1 WO2023032536 A1 WO 2023032536A1
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solvent
photosensitive
conductive paste
film
photosensitive conductive
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PCT/JP2022/029091
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English (en)
Japanese (ja)
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高瀬皓平
小山麻里恵
橋本大樹
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東レ株式会社
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Priority to KR1020247001004A priority Critical patent/KR20240058834A/ko
Priority to JP2022547215A priority patent/JPWO2023032536A1/ja
Priority to CN202280052636.3A priority patent/CN117716291A/zh
Publication of WO2023032536A1 publication Critical patent/WO2023032536A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials

Definitions

  • the present invention relates to a photosensitive conductive paste, a method for manufacturing a substrate with a conductive pattern, a method for manufacturing an electronic component, a cured film, a fired body, and an electronic component.
  • the inductor component includes an insulator made of ceramic and a coil-shaped internal electrode therein.
  • the insulator includes multiple insulating layers.
  • the internal electrodes are formed on the insulating layer in a planar winding shape, and are combined to form a coil.
  • a photosensitive conductive paste see, for example, Japanese Unexamined Patent Application Publication No. 2002-100000
  • Methods of manufacturing these inductor parts include a method of forming an internal electrode with a photosensitive conductive paste on an insulating sheet containing ceramic and resin, and a method of forming a coil by stacking a plurality of obtained sheets, There is a method of forming a coil by alternately laminating internal electrodes made of photosensitive conductive paste and insulating layers containing ceramic and resin on an insulating sheet containing ceramic and resin.
  • the present invention suppresses the viscosity increase in the coating process, suppresses the tackiness of the dry film even when the photosensitive conductive paste is dried at a low temperature, and is contained in the dry film. It aims at suppressing the change with time of the residual solvent amount.
  • the present invention mainly has the following configurations. That is, it contains conductive particles (A), a photosensitive organic component (B), and two or more solvents (C), and among the solvents (C), the solvent (C-1) with the lowest boiling point and the solvent (C-1) with the lowest boiling point
  • the difference in boiling points of the solvent (C-2) with a high boiling point is 35 to 120 ° C.
  • the boiling point of the solvent (C-2) is 251 to 300 ° C.
  • the solvent (C A photosensitive conductive paste in which the content of -2) is 25 to 80% by mass.
  • the viscosity increase in the coating process is suppressed, the tackiness of the dry film is suppressed even when dried at a low temperature, and the amount of residual solvent contained in the dry film change over time can be suppressed.
  • the photosensitive conductive paste of the present invention contains conductive particles (A), a photosensitive organic component (B), and two or more solvents (C), and among the solvents (C), the solvent having the lowest boiling point
  • the boiling point difference between (C-1) and the highest boiling point solvent (C-2) is 35 to 120 ° C.
  • the boiling point of the solvent (C-2) is 251 to 300 ° C.
  • the total solvent is 100% by mass.
  • the content of the solvent (C-2) is 25 to 80% by mass.
  • the conductive particles (A) are melted and fused by heating and firing to become a conductive inorganic sintered body.
  • the photosensitive organic component (B) By including the photosensitive organic component (B), the dry film of the photosensitive conductive paste is imparted with photosensitivity, and fine wiring can be formed by a photolithographic method.
  • the photosensitive conductive paste contains two or more solvents (C), and among the solvents (C), the solvent (C-1) with the lowest boiling point and the solvent (C-1) with the highest boiling point 2) has a boiling point difference of 35 to 120° C., the boiling point of the solvent (C-2) is 251 to 300° C., and the content of the solvent (C-2) with respect to 100% by mass of the total solvent is It is important that it is 25-80% by mass.
  • the present inventors used two or more solvents (C) in which the boiling point difference between the lowest boiling point solvent (C-1) and the highest boiling point solvent (C-2) is 35 to 120 ° C. By doing so, it was found that only the solvent with a low boiling point is dried, while the solvent with a high boiling point remains, and the residual solvent amount can be kept constant.
  • the conductive particles (A) are those that are melted or fused by heating and firing to exhibit conductivity.
  • Examples of the conductive particles (A) include metals such as silver, gold, copper, platinum, palladium, tin, nickel, aluminum, tungsten, molybdenum, ruthenium, chromium, titanium, and indium, and alloys containing any of these metals. , and powders of materials selected from oxides of any of these metals. Two or more of these may be used.
  • silver, copper or gold is preferable from the viewpoint of conductivity
  • silver, copper, or an alloy containing any of these metals is more preferable from the viewpoint of cost, and from the viewpoint of stability. to silver is more preferred.
  • the average secondary particle size (median size (D50)) of the conductive particles (A) is preferably 0.3 to 6.0 ⁇ m.
  • the average secondary particle diameter D50 of the conductive particles (A) is more preferably 0.8 ⁇ m or more, and even more preferably 1.3 ⁇ m or more.
  • the average secondary particle diameter D50 of the conductive particles (A) is more preferably 5.5 ⁇ m or less, and even more preferably 5.0 ⁇ m or less.
  • the average secondary particle diameter D50 of the conductive particles (A) can be measured by a laser light scattering method using Microtrac HRA (Model No. 9320-X100; manufactured by Nikkiso Co., Ltd.).
  • the content of the conductive particles (A) in the photosensitive conductive paste is preferably 35-60% by volume based on the total solid content.
  • the content of the conductive particles (A) is more preferably 40% by volume or more.
  • the content of the conductive particles (A) is more preferably 55% by volume or less.
  • the total solid content of the photosensitive conductive paste refers to all constituent components of the photosensitive conductive paste excluding the solvent.
  • the content of the conductive particles (A) in the photosensitive conductive paste can be determined by observing a vertical cross-section of the dried paste film obtained by applying and drying the photosensitive paste and sufficiently removing the organic solvent with a transmission electron microscope (for example, Japan Observed with "JEM-4000EX” manufactured by Denshi Co., Ltd.), the volume fraction of the conductive particles (A) is calculated by performing image analysis while distinguishing the conductive particles (A) from other components by the density of the image. can ask for.
  • the observation area of the transmission electron microscope is about 20 ⁇ m ⁇ 100 ⁇ m, and the magnification is about 1,000 to 3,000 times.
  • the content of the conductive particles (A) can be calculated from the blending amount.
  • the photosensitive organic component (B) refers to an organic component containing an alkali-soluble resin and a photosensitizer.
  • An alkali-soluble resin means a resin having an alkali-soluble group. Examples of alkali-soluble groups include carboxyl groups, phenolic hydroxyl groups, sulfonic acid groups, and thiol groups. A carboxyl group is preferred as the alkali-soluble group because of its high solubility in an alkali developer.
  • an acrylic resin is preferable, and a copolymer of an acrylic monomer having a carbon-carbon double bond and another monomer is preferable.
  • Acrylic monomers having a carbon-carbon double bond include, for example, methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, n-pentyl acrylate, isodecyl acrylates, isooctyl acrylate, 2-ethylhexyl acrylate, allyl acrylate, lauryl acrylate, stearyl acrylate, and other chain aliphatic hydrocarbon group-containing acrylates having 1 to 18 carbon atoms; benzyl acrylate, phenyl acrylate, 1-naphthyl acrylate , 2-naphthyl acrylate
  • copolymerization components other than acrylic monomers include styrenes such as styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, ⁇ -methylstyrene, chloromethylstyrene, and hydroxymethylstyrene; acrylic acid; Examples include unsaturated carboxylic acids such as methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid and vinylacetic acid, and acid anhydrides thereof. You may use 2 or more types of these.
  • the acrylic resin preferably has a carbon-carbon double bond at the side chain or at the end of the molecule, which can improve the curing reaction speed during exposure.
  • Structures having a carbon-carbon double bond include, for example, vinyl groups, allyl groups, acrylic groups, and methacrylic groups. You may have 2 or more types of these.
  • a method for introducing a carbon-carbon double bond into an acrylic resin for example, a glycidyl group or an isocyanate group and a carbon-carbon double bond are added to a mercapto group, an amino group, a hydroxyl group, or a carboxyl group in the acrylic resin. and a method of reacting a compound having, acrylic acid chloride, methacrylic acid chloride, allyl chloride, and the like.
  • Compounds having a glycidyl group and a carbon-carbon double bond include, for example, glycidyl methacrylate, glycidyl acrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, glycidyl crotonate, glycidyl isocrotonate, and "cyclomers”. (registered trademark) M100, A200 (manufactured by Daicel Chemical Industries, Ltd.) and the like.
  • Examples of compounds having an isocyanate group and a carbon-carbon double bond include acryloyl isocyanate, methacryloyl isocyanate, acryloylethyl isocyanate, methacryloylethyl isocyanate and the like. You may use 2 or more types of these.
  • Photosensitizers include photopolymerization initiators and dissolution inhibitors.
  • a photopolymerization initiator is preferable from the viewpoint of forming a thicker conductive pattern.
  • the photopolymerization initiator absorbs and decomposes light with a short wavelength such as ultraviolet rays, or generates radicals through a hydrogen abstraction reaction, thereby imparting photocuring properties to the photosensitive conductive paste, which is used in negative photolithography.
  • Photopolymerization initiators that absorb and decompose light such as ultraviolet rays include, for example, 1,2-octanedione, benzophenone, methyl ortho-benzoylbenzoate, 4,4′-bis(dimethylamino)benzophenone, 4,4 '-Bis(diethylamino)benzophenone, 4-benzoyl-4'-methyldiphenyl ketone, dibenzyl ketone, 2,2'-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl Propiophenone, Michler's ketone, 2-methyl-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 4-azidobenzalacetophenone, 2,6-bis(p-azidobenzylidene)cyclohexanone, 6-bis Alkylphenone-based photopolymerization initiators such as (p-azido
  • the dissolution inhibitor increases the solubility of the exposed portions of the photosensitive conductive paste dry film in the developing solution, enabling pattern formation by positive photolithography.
  • the dissolution inhibitor one that generates an acid upon exposure energy is preferred.
  • examples include diazodisulfone compounds, triphenylsulfonium compounds, quinonediazide compounds, and the like.
  • diazodisulfone compounds include bis(cyclohexylsulfonyl)diazomethane, bis(tert-butylsulfonyl)diazomethane, and bis(4-methylphenylsulfonyl)diazomethane.
  • triphenylsulfonium compounds include diphenyl-4-methylphenylsulfonium trifluoromethanesulfonate, diphenyl-2,4,6-trimethylphenylsulfonium p-toluenesulfonate, diphenyl(4-methoxy phenyl)sulfonium trifluoromethanesulfonate and the like.
  • Examples of the quinonediazide compound include those in which a sulfonic acid of quinonediazide is bonded to a polyhydroxy compound via an ester bond, a sulfonic acid of quinonediazide to a polyamino compound in a sulfonamide bond, and a sulfonic acid of quinonediazide to a polyhydroxypolyamino compound in an ester bond and/or or sulfonamide-bonded. You may contain 2 or more types of these.
  • the photosensitive organic component (B) may further contain photosensitive monomers, ultraviolet absorbers, sensitizers, and the like.
  • a photosensitive monomer refers to a monomer or oligomer having a carbon-carbon double bond. Structures having a carbon-carbon double bond include, for example, an acrylic group, a methacrylic group, a vinyl group, a maleimide ring, and the like. Examples of photosensitive monomers having acrylic groups include 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, and dipentaerythritol hexaacrylate.
  • Photosensitive monomers having a methacrylic group include, for example, those obtained by replacing these acrylates with methacrylates.
  • Photosensitive monomers having a vinyl group include, for example, methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether, butyl vinyl ether, cyclohexyl vinyl ether, phenyl vinyl ether, ethylene glycol monovinyl ether, triallyl isocyanurate and the like.
  • the solvent (C) is a liquid at room temperature, and has the effect of moistening or dissolving the components constituting the photosensitive conductive paste to make the liquid excellent in coating properties.
  • the photosensitive conductive paste of the present invention contains two or more solvents (C), and among the solvents (C), the solvent (C-1) with the lowest boiling point and the solvent (C-1) with the highest boiling point It is important that the boiling point difference between 2) is 35-120°C and the boiling point of the solvent (C-2) is 251-300°C.
  • the boiling point of the solvent (C-2) is lower than 251°C, the solvent (C-2) will volatilize in the drying process described later, and the amount of residual solvent will change significantly over time.
  • the boiling point of the solvent (C-2) is higher than 300° C., the binder removal property during firing is lowered.
  • the boiling point of the solvent (C-2) is preferably 257° C. or higher from the viewpoint of further suppressing the change over time of the residual solvent amount.
  • the temperature is preferably 290° C. or lower from the viewpoint of further suppressing deterioration of binder removal properties during firing.
  • the boiling point of the organic solvent (C) is disclosed in various documents and shall be rounded off to the first decimal place. If there is no disclosure in the literature, it can be measured by the method of JIS K0066-1992.
  • the boiling point difference between the solvent (C-1) and the solvent (C-2) is less than 35° C., it is difficult to selectively dry only the solvent (C-1) to suppress the tackiness of the dried film. become.
  • the boiling point difference is more than 120° C., the boiling point of the solvent (C-1) becomes too low, and the volatilization of the solvent tends to increase the viscosity of the photosensitive conductive paste in the coating step described later.
  • the boiling point difference between the solvent (C-1) and the solvent (C-2) is preferably 40° C. or higher, more preferably 50° C. or higher, from the viewpoint of further suppressing tackiness. From the viewpoint of further preventing the boiling point of the solvent (C-1) from becoming too low, the boiling point difference is preferably 110° C. or less, more preferably 100° C. or less.
  • the solvent (C-1) preferably has a boiling point of 180-230°C.
  • the solvent (C-1) preferably has a boiling point of 180-230°C.
  • the boiling point of the solvent (C-1) is more preferably 185° C. or higher, and more preferably 220° C. or lower.
  • the boiling point of a solvent means the boiling point at 1013.25 hPa.
  • Examples of the solvent (C-1) include ethylene glycol hexyl ether, ethylene glycol monobutyl ether acetate, diethylene glycol n-butyl ether, diethylene glycol ethyl ether, diethylene glycol diethyl ether, diethylene glycol butyl methyl ether, diethylene glycol methyl ether, diethylene glycol monoethyl ether, and diethylene glycol.
  • Examples of the solvent (C-2) include 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate, 2,2,4-trimethyl-1,3-pentanediol diisobutyrate, and diethylene glycol hexyl.
  • ether diethylene glycol mono-2-ethylhexyl ether, diethylene glycol monohexyl ether, dipropylene glycol phenyl ether, tetraethylene glycol dimethyl ether, triethylene glycol butyl methyl ether, triethylene glycol monobutyl ether, tripropylene glycol butyl ether, tripropylene glycol monobutyl ether, Diethylene glycol dibutyl ether is mentioned.
  • those having an SP value of 14.6 to 21.5 (J/cm 3 ) 1/2 are preferable.
  • those having an SP value of 14.6 to 21.5 (J/cm 3 ) 1/2 include 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate, tetraethylene glycol dimethyl ether, and triethylene. Glycol butyl methyl ether, diethylene glycol dibutyl ether can be mentioned.
  • the photosensitive organic component (B) can be wetted or dissolved.
  • the SP value By setting the SP value to 21.5 or less, it is possible to prevent permeation into the insulating layer and suppress residue on the insulating layer when processed on the insulating resin layer containing ceramic, which will be described later. It is more preferable that the SP value is 20.5 or less because the above effect can be more exhibited.
  • the SP value can be calculated from the molecular structure using the Fedors calculation method.
  • Solvent (C-2) is preferably a glycol alkyl ether represented by R 1 (OC 2 H 4 ) n OR 2 or R 1 (OC 3 H 6 ) n OR 2 .
  • n is an integer of 2 to 5
  • R 1 is H or an alkyl group having 1 to 6 carbon atoms
  • R 2 is an alkyl group having 1 to 6 carbon atoms. Examples of alkyl groups having 1 to 6 carbon atoms include methyl group, ethyl group, n-butyl group and the like.
  • the photosensitive conductive paste of the present invention contains the solvent (C-2) in an amount of 25 to 80% by mass with respect to 100% by mass of the total solvent.
  • the content of the solvent (C-2) is preferably 35% by mass or more.
  • the content of the solvent (C-2) is preferably 70% by mass or less, more preferably 60% by mass or less.
  • the content of the solvent (C-2) is calculated by identifying the types of all solvents contained in the photosensitive conductive paste by chemical analysis such as 1 H-NMR, and then determining the ratio from the peak area in the gas chromatogram. can do.
  • the photosensitive conductive paste of the present invention preferably further contains a non-conductive inorganic powder, which can suppress pattern shrinkage during firing.
  • the particle size of the non-conductive inorganic powder is preferably 1-100 nm.
  • Non-conductive inorganic powders include, for example, alumina (Al 2 O 3 ), zirconia (ZrO 2 ), magnesia (MgO), beryllia (BeO), mullite (3Al 2 O 3.2SiO 2 ), cordierite (5SiO 2.2Al 2 O 3.2MgO), spinel (MgO.Al 2 O 3 ), forsterite (2MgO.SiO 2 ), anorthite (CaO.Al 2 O 3.2SiO 2 ), Sergian (BaO.Al 2 O 3 ⁇ 2SiO 2 ), silica (SiO 2 ), aluminum nitride (AlN), ferrite (garnet type: Y 3 Fe 5 O 12 system, spinel type: MeFe 2 O 4 system), SiO 2 , Al 2 O 3 , CaO , B 2 O 3 , MgO and/or TiO 2 ; inorganic filler powders such as alumina,
  • silica particles are preferable from the viewpoint of further suppressing firing defects.
  • the silica particles are preferably alkylated on the particle surface, especially dialkylsilylated and/or trialkylsilyl It is preferable that the Methods for dialkylsilylating and/or trialkylsilylating the surface of silica particles include a method of reacting silica particles with dimethyldichlorosilane or hexamethyldisilazane.
  • the photosensitive conductive paste of the present invention may contain a dispersant, a plasticizer, a leveling agent, a surfactant, a silane coupling agent, an antifoaming agent, a stabilizer, etc., as long as the desired properties are not impaired. .
  • a dispersant is a component that has an action of dispersing and stabilizing the conductive particles (A) and/or the non-conductive inorganic particles.
  • dispersants include amine-based dispersants and carboxylic acid or carboxylic acid ester-based dispersants.
  • unsaturated fatty acids with 3 to 18 carbon atoms and/or saturated fatty acids with 3 to 18 carbon atoms are preferable because they suppress the generation of residues and facilitate the formation of thick films.
  • Unsaturated fatty acids include myristoleic acid, palmitoleic acid, sapienic acid, oleic acid and the like.
  • Saturated fatty acids include capric acid, lauric acid, myristic acid, pentadecyl acid, palmitic acid, margaric acid, stearic acid and the like.
  • the photosensitive conductive paste of the present invention can be obtained, for example, by mixing and/or dispersing the aforementioned components (A) to (C) and, if necessary, other additives.
  • Apparatuses for mixing and/or dispersing include, for example, dispersers such as three rollers and ball mills, kneaders, and the like.
  • the cured film of the present invention is a film obtained by curing the photosensitive conductive paste of the present invention.
  • the thickness of the cured film is preferably 5 to 30 ⁇ m. By setting the film thickness of the cured film to 5 ⁇ m or more, disconnection during firing can be suppressed. On the other hand, fine wiring can be formed by setting the film thickness of the cured film to 30 ⁇ m or less.
  • the cured film of the present invention may have a predetermined pattern shape.
  • pattern shapes include linear shapes and spiral shapes.
  • the minimum width is preferably 10 to 50 ⁇ m. By setting the pattern width to 10 ⁇ m or more, disconnection during firing can be suppressed. On the other hand, by setting the pattern width to 50 ⁇ m or less, the aspect ratio of the pattern increases and the sheet resistance of the internal wiring can be reduced.
  • the cured film of the present invention can be obtained, for example, by coating the photosensitive conductive paste of the present invention on a substrate, drying it, and photocuring it by exposure.
  • a cured film having a pattern shape can be produced by carrying out pattern exposure in the exposure step and then developing the film.
  • the method for producing a substrate with a conductive pattern of the present invention includes the steps of applying the photosensitive conductive paste of the present invention on a substrate to form a coating film, drying the coating film to form a dry film, and drying The method includes a step of exposing and developing a film to form a pattern, wherein the amount of solvent remaining in the dry film in the step of forming the pattern is 25 to 80% by mass of the total amount of solvent contained in the photosensitive conductive paste. . Each step will be described in detail below.
  • the photosensitive conductive paste of the present invention is applied onto a substrate to form a coating film.
  • coating methods in the coating step include coating methods using spray coating, roll coating, screen printing, blade coaters, die coaters, calendar coaters, meniscus coaters, and bar coaters.
  • the film thickness of the coating film can be appropriately selected according to the coating method, the solid content concentration and viscosity of the photosensitive paste, and the like.
  • the coating film using the photosensitive conductive paste of the present invention described above may be formed on a substrate after forming a film containing inorganic particles (D) and an organic component (E) on the film. .
  • a slurry in which inorganic particles are dispersed in a solution containing an organic component (E) and a solvent is applied onto a substrate and dried to form a film.
  • the organic component (E) refers to all organic components remaining after the film is formed.
  • Slurries in which inorganic components are dispersed include non-photosensitive slurries and photosensitive slurries.
  • the non-photosensitive slurry contains inorganic particles, resin, solvent, and the like.
  • the photosensitive slurry contains inorganic particles, a photosensitive organic component, a solvent, and the like.
  • a photosensitive organic component refers to a mixture of an alkali-soluble resin, a photosensitive agent, a photosensitive monomer, and the like.
  • a photosensitive slurry is preferable from the viewpoint of forming fine vias with good positional accuracy when forming a film containing the inorganic particles (D) and the organic component (E). That is, the organic component (E) preferably contains a photosensitive organic component.
  • the organic component (E) may further contain dispersants, plasticizers, leveling agents, etc. as appropriate.
  • Examples of the inorganic particles (D) include glass particles that soften in the firing temperature range, and inorganic particles that do not soften in the firing temperature range and exist as particles. These can also be used in combination.
  • Glass particles that soften in the firing temperature range include glass particles containing SiO 2 , B 2 O 3 , K 2 O, Li 2 O, CaO, ZnO, Bi 2 O 3 and Al 2 O 3 .
  • inorganic particles that do not soften in the firing temperature range and exist as particles include SiO 2 —B 2 O 3 -based glass, quartz, alumina, magnesia, spinel, silica, forsteride, steatite, and zirconia. You may use these in combination of 2 or more types.
  • the coating film is dried to form a dry film.
  • the solvent remaining in the dry film is 25 to 80% by mass of the total amount of solvent contained in the photosensitive conductive paste.
  • the residual solvent amount is 25 to 80% by mass of the total amount of solvent contained in the photosensitive conductive paste.
  • drying methods include heat drying using heating devices such as ovens, hot plates, and infrared rays, and vacuum drying.
  • the drying temperature is preferably 45-80°C.
  • the low boiling point solvent (C-1) can be efficiently volatilized and removed, and the tackiness of the dried film can be suppressed.
  • the drying temperature is set to 80° C. or lower, evaporation of the high boiling point solvent (C-2) can be suppressed, and warpage of the substrate can be suppressed.
  • the heating time is preferably 2 to 60 minutes.
  • the dry film is exposed and developed to form a pattern.
  • the exposure method there are a method of exposing through a photomask and a method of exposing without using a photomask.
  • Examples of the exposure method without using a photomask include a method of direct drawing using a laser beam or the like.
  • the exposure apparatus include a stepper exposure machine, a proximity exposure machine, and the like.
  • Actinic rays for exposure include, for example, near-ultraviolet rays, ultraviolet rays, electron beams, X-rays, and laser light, and ultraviolet rays are preferred.
  • the ultraviolet light source include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, halogen lamps, germicidal lamps, etc. Ultra-high-pressure mercury lamps are preferred.
  • Examples of developing solutions for alkali development include tetramethylammonium hydroxide, diethanolamine, diethylaminoethanol, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, triethylamine, diethylamine, methylamine, dimethylamine, and dimethyl acetate.
  • Aqueous solutions of aminoethyl, dimethylaminoethanol, dimethylaminoethyl methacrylate, cyclohexylamine, ethylenediamine, hexamethylenediamine and the like can be mentioned.
  • Polar solvents such as N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethylsulfoxide and ⁇ -butyrolactone; alcohols such as methanol, ethanol and isopropanol; and ethyl lactate.
  • esters such as propylene glycol monomethyl ether acetate; cyclopentanone, cyclohexanone, isobutyl ketone; ketones such as methyl isobutyl ketone; surfactants and the like.
  • a method of spraying the developer while the substrate on which the cured film after exposure is formed is left stationary, conveyed, or rotated, or a method of immersing the substrate on which the cured film after exposure is formed in the developer. and a method of applying ultrasonic waves while immersing the substrate on which a cured film is formed after exposure in a developer.
  • the pattern obtained by development may be rinsed with a rinse solution.
  • the rinse liquid include water; aqueous solutions of alcohols such as ethanol and isopropyl alcohol; aqueous solutions of esters such as ethyl lactate and propylene glycol monomethyl ether acetate.
  • a step of drying residual solvent in the pattern may be included. By drying the remaining solvent, the shrinkage rate can be reduced when firing is performed.
  • a drying apparatus similar to the drying method described above can be used.
  • a laminate can also be obtained by laminating the obtained patterns.
  • the number of laminations in the laminate is preferably 2 to 30 layers.
  • the thickness of the predetermined pattern can be increased.
  • the number of layers can be 30 or less, the influence of misalignment between layers can be reduced.
  • the sintered body of the present invention is obtained by sintering the cured film of the present invention, and its shape does not matter. Preferred conditions for the firing step will be described later.
  • the thickness of the fired body is preferably 2 to 20 ⁇ m.
  • the thickness of the sintered body is preferably 2 to 20 ⁇ m.
  • the line width of the sintered body of the present invention is preferably 5 to 40 ⁇ m. By setting the line width of the sintered body to 5 ⁇ m or more, disconnection during sintering can be suppressed. On the other hand, by setting the line width of the fired body to 40 ⁇ m or less, a conductive pattern with a high aspect ratio can be formed.
  • the electronic component of the present invention includes the sintered body of the present invention.
  • Electronic parts include chip inductors and LC filters.
  • the method for producing an electronic component of the present invention has a baking step of baking the substrate with a conductive pattern obtained by the method for producing a substrate with a conductive pattern of the present invention. Moreover, it is preferable to include a step of applying a photosensitive conductive paste, a step of drying, and a step of exposing and developing. As an example of the method of manufacturing an electronic component according to the present invention, a method of manufacturing a multilayer chip inductor will be described below.
  • a via hole is formed in a ceramic green sheet, and an interlayer connection wiring is formed by embedding a conductor in the via hole.
  • the via hole forming method include laser irradiation.
  • a method of embedding a conductor in a via hole for example, a method of embedding a conductor paste by a screen printing method and drying the paste can be used.
  • Conductive pastes include, for example, pastes containing copper, silver, and silver-palladium alloys.
  • the above-described photosensitive conductive paste of the present invention is preferable as the conductive paste because the interlayer connection wiring and the internal wiring can be formed at once to simplify the process.
  • Internal wiring is formed on the ceramic green sheet on which the interlayer connection wiring is formed.
  • Examples of the method for forming the internal wiring include a photolithography method using a photosensitive conductive paste.
  • the photosensitive conductive paste the above-described photosensitive paste of the present invention can be preferably used from the viewpoint of imparting properties of high aspect ratio and excellent conductivity.
  • dielectric patterns or insulator patterns are further formed on the ceramic green sheets.
  • a method for forming the dielectric pattern and the insulator pattern includes, for example, a screen printing method.
  • thermocompression bonding apparatus examples include a hydraulic press machine.
  • the thermocompression bonding temperature is preferably 90 to 130° C.
  • the thermocompression pressure is preferably 5 to 20 MPa.
  • a laminated chip inductor can be obtained by dicing the obtained laminate into a desired chip size with a cutting machine, firing, applying terminal electrodes, and plating.
  • the cutting device include a die cutting machine and a laser cutting machine.
  • the firing method include a method of heat-treating at 300-600° C. for 5 minutes-several hours and then further heat-treating at 850-900° C. for 5 minutes-several hours.
  • Examples of the method of applying the terminal electrode include a sputtering method.
  • metals used for plating include nickel and tin.
  • Conductive particles A: Conductive particles (A-1): Ag particles with a D50 of 3.2 ⁇ m Conductive particles (A-2): Ag particles with a D50 of 0.5 ⁇ m Conductive particles (A-3): Ag with a D50 of 1.1 ⁇ m Particles Conductive particles (A-4): Ag particles with a D50 of 2.0 ⁇ m Conductive particles (A-5): Ag particles with a D50 of 4.0 ⁇ m Conductive particles (A-6): D50 of 5.3 ⁇ m Ag Particles
  • the D50 of the conductive particles was measured by a laser light scattering method using a particle size distribution analyzer (Microtrac HRA Model No. 9320-X100; manufactured by Nikkiso Co., Ltd.).
  • Photosensitive monomer NK Oligo UA-122P (ester structure-containing urethane acrylate, viscosity 7.0 Pa ⁇ s, weight average molecular weight 1,100, manufactured by Shin-Nakamura Chemical Co., Ltd.).
  • Photosensitizer (photopolymerization initiator 1): Adeka Optomer N-1919 (manufactured by ADEKA Co., Ltd.).
  • Leveling agent “Disparon” (registered trademark) L-1980N (manufactured by Kusumoto Kasei Co., Ltd.).
  • Dispersant 1 Stearic acid Dispersant 2: Oleic acid Dispersant 3: Floren G-700 (manufactured by Kyoeisha Chemical Co., Ltd.).
  • Solvent (C) Solvent 1: ethylene glycol butyl ether (boiling point: 168°C, SP value: 22.1 (J/cm 3 ) 1/2 )
  • Solvent 2 ethylene glycol monobutyl ether acetate (boiling point: 188°C, SP value: 18.9 (J/cm 3 ) 1/2
  • Solvent 3 dipropylene glycol monobutyl ether (boiling point: 230°C, SP value: 20.9 (J/cm 3 ) 1/2 )
  • Solvent 5 Tetraethylene glycol dimethyl ether (boiling point: 275°C, SP value: 17.5 (J/cm 3 ) 1/2 )
  • Solvent 6 triethylene glycol butyl methyl ether (boiling point: 261°C, SP value: 17.2 (
  • Non-conductive inorganic particles D-1 "AEROSIL” (registered trademark) 300 (manufactured by Nippon Aerosil Co., Ltd.): silica particles D-2: “AEROSIL” (registered trademark) R976 (manufactured by Nippon Aerosil Co., Ltd.): particle surface is dialkylsilylated silica particles.
  • Example 1 5.0 g of alkali-soluble resin, 2.4 g of NK Oligo UA-122P (photosensitive monomer), 0.5 g of Adeka Optomer N-1919 (photoinitiator 1), 0.1 g of "Disparon" (registered Trademark) L-1980N (leveling agent), 0.1 g of dispersant 1, 5.9 g of ethylene glycol monobutyl ether acetate (solvent 2) and 5.9 g of diethylene glycol dibutyl ether (solvent 4) were mixed to give 19.9 g of a photosensitive resin solution was obtained.
  • the viscosity change rate of the photosensitive conductive paste was measured as follows. 300 g of a photosensitive conductive paste was placed on a screen plate, and applied on an alumina substrate in a square pattern of 100 mm square so that the weight of the paste was 0.6 g. This printing process was repeated 300 times, and the change in viscosity of the paste on the screen plate before printing and after printing 300 times was evaluated. “Excellent” if the viscosity change rate from before printing is 0% or more and less than 5%, "Good” if 5% or more and less than 10%, “Fair” if 10% or more and less than 20%, 20% or more If so, "impossible”. The viscosity is a value measured at 10 rpm using a Brookfield viscometer, and the viscosity change rate is calculated by the following equation.
  • Viscosity change rate (%) (viscosity after printing/viscosity before printing - 1) x 100.
  • Residual solvent amount/initial (% by mass) (paste solvent ratio ⁇ (1 ⁇ (dried film weight (c)/applied paste weight (b))) ⁇ 100)/paste solvent ratio ⁇ 100.
  • Rate of change over time (1-(residual solvent amount/after 10 hours)/(remaining solvent amount/initial period)) x 100.
  • ⁇ Tack evaluation> A photosensitive conductive paste was applied on an alumina substrate by screen printing in a square pattern of 100 mm square so that the film thickness after drying was 15 ⁇ m, and dried at 60° C. for 10 minutes to prepare a dry film.
  • a PET film and a weight of 50 g having an area of 50 mm square were placed on the dry film for 1 minute, and the tackiness of the dry film was evaluated from the area of the dry film transferred to the PET film. "Excellent” if the transfer area is 0% or more and less than 1% with respect to a 50 mm square, "Good” if 1% or more and less than 5%, "Fair” if 5% or more and less than 10%, 10% or more If so, "impossible”.
  • ⁇ Flatness evaluation> A dry film was produced in the same manner as ⁇ tackiness evaluation>. Using a laser microscope VK-X200 (manufactured by KEYENCE CORPORATION), the surface roughness Sa of the dry film was measured with an objective lens of 20x. "Excellent” when surface roughness Sa (arithmetic mean height) is less than 0.3 ⁇ m, “Good” when 0.3 ⁇ m or more and less than 0.5 ⁇ m, "Fair” when 0.5 ⁇ m or more and less than 0.7 ⁇ m, 0 0.7 ⁇ m or more was evaluated as “impossible”.
  • an exposure mask with a stripe pattern of /35 full-line exposure is performed using an exposure apparatus (PEM-6M; manufactured by Union Optics Co., Ltd.) at an exposure amount such that the line width is 30 ⁇ m, and 0.2% by mass of Na
  • PEM-6M manufactured by Union Optics Co., Ltd.
  • a development treatment was performed in which an unexposed portion of the dry film was removed by rinsing with ultrapure water.
  • the maximum film thickness without disconnection or peeling after development was determined. Note that the line width of the conductive pattern was measured by magnifying observation at a magnification of 1000 using an optical microscope. The film thickness of the conductive pattern was measured using a stylus profilometer (for example, "Surfcom” (registered trademark) 1400; manufactured by Tokyo Seimitsu Co., Ltd.).
  • a stylus profilometer for example, "Surfcom” (registered trademark) 1400; manufactured by Tokyo Seimitsu Co., Ltd.
  • a conductive pattern having a maximum film thickness was formed on an alumina substrate in the same manner as ⁇ Evaluation of workability (maximum film thickness)>.
  • the mask pattern shown in FIG. 1 was used as the exposure mask, and the opening width was 25 ⁇ m and the length was 40 mm.
  • the obtained substrate with a conductive pattern was baked at 880° C. for 10 minutes to obtain a baked conductive pattern.
  • a digital multimeter (CDM-16D; manufactured by Custom Co.) was used to measure the resistance value R of the conductive pattern fired body.
  • the line width after firing and the film thickness after firing of the conductive pattern fired body were measured in the same manner as described above, and the aspect ratio and the sheet resistance were calculated by the following equations.
  • Aspect ratio film thickness after firing ( ⁇ m)/line width after firing ( ⁇ m)
  • Sheet resistance (m ⁇ / ⁇ ) conductive pattern resistance value (m ⁇ ) ⁇ line width (mm) ⁇ conductive pattern length (mm).
  • a substrate with an insulating ceramic layer was produced by the following procedure.
  • a dry film was formed on the substrate with the insulating ceramic layer by the same method as ⁇ tackiness evaluation>.
  • the substrate was immersed in a 0.2% by mass Na 2 CO 3 solution, and then rinsed with ultrapure water to dissolve the dry film.
  • the amount of dry film residue remaining on the substrate after rinsing was evaluated.
  • the evaluation was carried out using a scanning electron microscope (S2400; manufactured by Hitachi, Ltd.) under magnification of 500 times and counting the number of conductive particles remaining in the area of 250 ⁇ m ⁇ 250 ⁇ m. 10 points are evaluated, and the average number is "excellent” when the average number is 0 to 5, "excellent” when it is 6 to 10, "good” when it is 11 to 20, and “good” when it is 21 to 30. "Yes", and when the number is 31 or more, "No".
  • Examples 2 to 22, Comparative Examples 1 to 5 A photosensitive resin solution was prepared in the same manner as in Example 1, except that the solvent was changed as shown in Tables 2 and 4. Tables 2 and 4 show the mass ratio of each solvent to the total amount of solvent. Subsequently, the photosensitive resin solution and the conductive particles shown in Tables 1 and 3 were mixed in the same manner as in Example 1 to prepare photosensitive conductive pastes P-2 to 22 and R-1 to 5. However, the ratio of the photosensitive resin solution and the conductive particles was adjusted so as to achieve the volume ratio of the conductive particles in the total solid content shown in Tables 1 and 3. The density of the photosensitive resin solution was calculated as 1.0 g/cm 3 . Subsequently, the prepared photosensitive conductive pastes P-2 to 22 and R-1 to 5 were evaluated in the same manner as in Example 1. Tables 5 and 6 show the results.
  • Example 23 and 24 A photosensitive resin solution was prepared in the same manner as in Example 1. Subsequently, the photosensitive resin solution, the conductive particles and the non-conductive inorganic particles were mixed so as to have the volume ratio in Table 3, kneaded using three rollers, and the photosensitive conductive paste P- described in Tables 3 and 4. 23 and 24 were produced. However, the density of the photosensitive resin solution was calculated as 1.0 g/cm 3 and the density of the non-conductive inorganic particles was 2.2 g/cm 3 . Subsequently, the prepared photosensitive conductive pastes P-23 and P-24 were evaluated in the same manner as in Example 1. Table 6 shows the results.
  • the photosensitive conductive paste of the present invention can be suitably used for manufacturing internal wiring patterns of electronic parts and the like.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
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Abstract

La présente invention concerne une pâte conductrice photosensible qui contient des particules conductrices (A), un composant organique photosensible (B) et au moins deux solvants (C) : la différence entre les points d'ébullition d'un solvant (C-1) qui présente le point d'ébullition le plus bas et un solvant (C-2) qui présente le point d'ébullition le plus élevé parmi les solvants (C) étant de 35 °C à 120 °C ; le point d'ébullition du solvant (C-2) étant compris dans la plage allant de 251 °C à 300 °C ; et la quantité du solvant (C-2) par rapport à 100 % en masse de tous les solvants étant de 25 % en masse à 80 % en masse. Cette pâte conductrice photosensible est supprimée lors d'une augmentation de la viscosité pendant une étape d'application de revêtement ; et, même dans les cas où la pâte conductrice photosensible est séchée à basse température, les propriétés de collant d'un film séché sont supprimées et le changement au cours du temps de la quantité de solvant résiduel dans le film séché est également supprimé.
PCT/JP2022/029091 2021-09-03 2022-07-28 Pâte conductrice photosensible, procédé de production de matériau de base à motif conducteur, procédé de production de composant électronique, film durci, corps cuit et composant électronique WO2023032536A1 (fr)

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JP2022547215A JPWO2023032536A1 (fr) 2021-09-03 2022-07-28
CN202280052636.3A CN117716291A (zh) 2021-09-03 2022-07-28 感光性导电糊剂、带导电图案的基材的制造方法、电子部件的制造方法、固化膜、烧成体以及电子部件

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011509437A (ja) * 2008-09-26 2011-03-24 エルジー ケム． エルティーディ． ブラックマトリックス感光性樹脂組成物およびそれから製造されたブラックマトリックス
WO2015151892A1 (fr) * 2014-03-31 2015-10-08 東洋紡株式会社 Pâte conductrice photosensible, film mince conducteur, circuit électrique, et écran tactile
JP2016071171A (ja) * 2014-09-30 2016-05-09 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル
JP2017186550A (ja) * 2016-03-30 2017-10-12 住友化学株式会社 硬化性樹脂組成物及び硬化膜
JP2020105442A (ja) * 2018-12-28 2020-07-09 太陽インキ製造株式会社 導電性樹脂組成物、これを用いて得られる導電回路およびタッチパネルディスプレイ

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JP7230347B2 (ja) 2018-06-13 2023-03-01 東レ株式会社 感光性ペースト、それを用いた硬化膜、焼成体および電子部品とその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011509437A (ja) * 2008-09-26 2011-03-24 エルジー ケム． エルティーディ． ブラックマトリックス感光性樹脂組成物およびそれから製造されたブラックマトリックス
WO2015151892A1 (fr) * 2014-03-31 2015-10-08 東洋紡株式会社 Pâte conductrice photosensible, film mince conducteur, circuit électrique, et écran tactile
JP2016071171A (ja) * 2014-09-30 2016-05-09 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル
JP2017186550A (ja) * 2016-03-30 2017-10-12 住友化学株式会社 硬化性樹脂組成物及び硬化膜
JP2020105442A (ja) * 2018-12-28 2020-07-09 太陽インキ製造株式会社 導電性樹脂組成物、これを用いて得られる導電回路およびタッチパネルディスプレイ

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