WO2023032060A1 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
- Publication number
- WO2023032060A1 WO2023032060A1 PCT/JP2021/032025 JP2021032025W WO2023032060A1 WO 2023032060 A1 WO2023032060 A1 WO 2023032060A1 JP 2021032025 W JP2021032025 W JP 2021032025W WO 2023032060 A1 WO2023032060 A1 WO 2023032060A1
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- WIPO (PCT)
- Prior art keywords
- bus bar
- positive electrode
- electrode bus
- positive
- power converter
- Prior art date
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 66
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims description 79
- 239000003990 capacitor Substances 0.000 claims description 47
- 230000004308 accommodation Effects 0.000 claims description 15
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- 238000001816 cooling Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 3
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 239000004020 conductor Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/4826—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode operating from a resonant DC source, i.e. the DC input voltage varies periodically, e.g. resonant DC-link inverters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0067—Converter structures employing plural converter units, other than for parallel operation of the units on a single load
- H02M1/007—Plural converter units in cascade
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
Definitions
- the present invention relates to a power converter.
- a power conversion device that includes a voltage conversion circuit that converts a DC voltage and an inverter circuit that converts the converted DC voltage into an AC voltage is provided with a bus bar that forms positive and negative electrode wiring. Since a large current flows through the busbar, the amount of heat generated is large, and the heat from the busbar greatly affects capacitors and the like installed in the power converter for purposes such as noise removal. Therefore, it is necessary to limit the amount of current flowing through the busbar within a range that does not exceed the heat-resistant temperature of the capacitor or the like, which restricts the output performance of the power converter.
- Patent document 1 includes an inverter circuit unit that performs DC/AC power conversion, a converter circuit unit that boosts the voltage from an external battery and outputs it to the inverter circuit unit, and a smoothing capacitor package.
- a capacitor element a negative bus bar connected to both the negative sides of the inverter circuit section and the converter circuit section, a first positive bus bar connected to the positive pole of the inverter circuit section, and a positive pole of the converter circuit section on the battery side.
- a second positive electrode bus bar the first positive electrode bus bar facing one main surface of the negative electrode bus bar, and the second positive electrode bus bar facing the other main surface of the negative electrode bus bar.
- a power converter includes a voltage conversion circuit that converts a first DC voltage into a second DC voltage, an inverter circuit that converts the second DC voltage into an AC voltage, the voltage conversion circuit and the inverter.
- a negative bus bar commonly connected to a circuit, a first positive bus bar connected to the voltage conversion circuit, a second positive bus bar connected to the inverter circuit, the voltage conversion circuit and the inverter circuit. and a first heat dissipation member provided in the housing, wherein the first positive electrode bus bar, the second positive electrode bus bar, and the negative electrode bus bar are laminated and electrically insulated from each other.
- the first positive electrode bus bar and the second positive electrode bus bar face the first heat radiation member via an insulating member, and at least one of the first positive electrode bus bar and the second positive electrode bus bar , thermal contact with the first heat dissipation member through the insulation member and the first heat conduction member.
- FIG. 1 is an exploded perspective view of a power conversion device; FIG. It is a circuit block diagram of a power converter device. It is an exploded perspective view of the important section of the power conversion device.
- (A) and (B) are cross-sectional views of the power converter.
- (A) and (B) are cross-sectional views showing modified examples 1 and 2 of the power converter.
- (A) and (B) are cross-sectional views showing modification examples 3 and 4 of the power converter. It is a perspective view which shows the modification 5 of a power converter device. It is a perspective view which shows the modification 6 of a power converter device.
- FIG. 1 is an exploded perspective view of a power conversion device 1000 according to this embodiment.
- a power conversion device 1000 includes a semiconductor module 100 , a capacitor 200 and a reactor 300 .
- Semiconductor module 100 , capacitor 200 and reactor 300 are housed in housing 400 .
- the housing 400 is partitioned into a first housing space 401 and a second housing space 402 by a first heat radiation member 410 integrally formed with the housing 400 .
- the first accommodation space 401 accommodates the semiconductor module 100 and the reactor 300
- the second accommodation space 402 accommodates the capacitor 200 .
- a cooling channel is formed in the housing 400 through which the coolant flows in and out from the inlet/outlet 403 .
- the coolant flows through cooling channels provided in the semiconductor module 100 via the cooling channels in the housing 400 .
- the housing 400 and the first heat radiation member 410 are cooled by the coolant flowing through the cooling channel.
- a molded bus bar 500 is arranged on the upper surface.
- the molded bus bar 500 is made of an insulating resin for the purpose of electrically insulating the first positive bus bar 510, the second positive bus bar 520, and the negative bus bar 530 between each bus bar and between other conductive parts. etc. is sealed.
- the first positive bus bar 510, the second positive bus bar 520, and the negative bus bar 530 are flat wiring members that are made of a conductive material such as copper and form power wiring.
- a first heat-conducting member 600 is applied to the top surface of the first heat-dissipating member 410 , and the molded bus bar 500 is in thermal contact with the first heat-dissipating member 410 via the first heat-conducting member 600 . .
- the first positive bus bar 510 and the negative bus bar 530 of the molded bus bar 500 are connected to a battery (not shown) via terminals P and N, and supplied with DC voltage from the battery.
- Battery not shown
- Four semiconductor modules 100 are provided side by side, one being used for the voltage conversion circuit 1100 and the other three for the inverter circuit 1200 (see FIG. 2).
- the semiconductor module 100 for the voltage conversion circuit 1100 boosts the DC voltage supplied through the molded bus bar 500 and converts it into a DC voltage by switching the semiconductor elements sealed in the semiconductor module 100 .
- the converted DC voltage is output to one of output bus bars 700 and input to semiconductor module 100 used as inverter circuit 1200 via molded bus bar 500 .
- the semiconductor module 100 for the inverter circuit 1200 converts a DC voltage supplied from the voltage conversion circuit 1100 via the molded bus bar 500 into an AC current by switching the semiconductor elements sealed in the semiconductor module 100. .
- the converted AC current is output from output bus bar 700 .
- the output alternating current is supplied to a motor (not shown) to drive the motor.
- a current sensor 710 is arranged near the output bus bar 700 .
- the first accommodation space 401 and the second accommodation space 402 are closed by the base plate 800 .
- the periphery of the base plate 800 such as four corners is fixed to the housing 400 with screws or the like.
- a circuit board 900 is installed on the base plate 800 .
- a control circuit 1300 for driving and controlling the voltage conversion circuit 1100 and the inverter circuit 1200 is mounted on the circuit board 900 (see FIG. 2).
- the semiconductor module 100 has a control terminal to which the drive signal G2 from the control circuit 1300 is input. It is connected. Also, the electronic parts input/output command signals such as torque commands to/from an external control device via the connector 910 .
- the housing 400 has a cover 490 and accommodates the base plate 800 and the circuit board 900 .
- a seal ring or liquid seal is provided between the housing 400 and the cover 490 to ensure the internal airtightness of the power converter 1000 .
- the materials of the housing 400, the first heat radiation member 410, the cover 490, and the base plate 800 are materials with high thermal conductivity such as aluminum.
- FIG. 2 is a circuit configuration diagram of the power converter 1000.
- a power conversion device 1000 includes a voltage conversion circuit 1100 , an inverter circuit 1200 and a control circuit 1300 .
- the voltage conversion circuit 1100 and the inverter circuit 1200 are configured with semiconductor modules 100a, 100b, 100c, and 100d containing semiconductor elements.
- Semiconductor elements of the semiconductor modules 100 a , 100 b , 100 c , and 100 d are switched on and off by driving signals G 1 and G 2 from the control circuit 1300 on the circuit board 900 .
- the control circuit 1300 controls switching operations of the semiconductor modules 100a, 100b, 100c, and 100d based on command signals from an external control device (not shown).
- a DC voltage is input to the voltage conversion circuit 1100 between the first positive bus bar 510 and the negative bus bar 530 via terminals P and N from the battery.
- Capacitors C3 and C4 for filtering are provided between the first positive bus bar 510 and the ground and between the negative bus bar 530 and the ground.
- the capacitors C3 and C4 are mounted in order to reduce common mode noise flowing through the positive and negative electrodes. Specifically, noise from the voltage conversion circuit 1100 and the inverter circuit 1200 is bypassed to the ground to prevent common mode noise from being conducted to the battery. Furthermore, common mode noise from the battery is prevented from being conducted to the voltage conversion circuit 1100 and the inverter circuit 1200 .
- the voltage conversion circuit 1100 includes a semiconductor module 100a, a reactor 300, and a capacitor C1.
- semiconductor elements T1 and T2 are connected in series, and diodes D1 and D2 are connected in parallel between collector emitters of the semiconductor elements T1 and T2, respectively.
- a second positive electrode bus bar 520 is connected to the collector side of the semiconductor element T1, and one end of the reactor 300 and the collector side of the semiconductor element T2 are connected to the emitter side.
- the other end of reactor 300 is connected to first positive bus bar 510 , and the emitter side of semiconductor element T ⁇ b>2 is connected to negative bus bar 530 .
- Capacitor C1 is connected between first positive bus bar 510 and negative bus bar 530 at the other end of reactor 300 .
- Negative bus bar 530 is commonly connected to voltage conversion circuit 1100 and inverter circuit 1200 .
- the voltage conversion circuit 1100 controls the on/off of the semiconductor elements T1 and T2 by the driving signal G1 from the control circuit 1300.
- FIG. 1100 performs a step-up function of converting the DC voltage from the battery into a higher DC voltage value and outputting it to the inverter circuit 1200 . It also performs a step-down function of converting the DC voltage output from the inverter circuit 1200 to the voltage conversion circuit 1100 during the regenerative operation of the motor into a lower DC voltage and outputting it to the battery.
- the inverter circuit 1200 includes semiconductor modules 100b, 100c, 100d and a capacitor C2.
- semiconductor elements T3 and T4 are connected in series, and diodes D3 and D4 are connected in parallel between the collector emitters of the semiconductor elements T3 and T4, respectively.
- semiconductor elements T5 and T6 are connected in series, and diodes D5 and D6 are connected in parallel between the collector emitters of the semiconductor elements T5 and T6, respectively.
- semiconductor elements T7 and T8 are connected in series, and diodes D7 and D8 are connected in parallel between the collector emitters of the semiconductor elements T7 and T8, respectively.
- the collector sides of the semiconductor elements T3, T5 and T7 are connected to the second positive bus bar 520, and the emitter sides of the semiconductor elements T4, T6 and T8 are connected to the negative bus bar 530.
- a smoothing capacitor C2 is connected between the second positive bus bar 520 and the negative bus bar 530 .
- the connection points between the emitter sides of the semiconductor elements T3, T5 and T7 and the collector sides of the semiconductor elements T4, T6 and T8 are connected to a motor (not shown) via an output bus bar 700.
- the inverter circuit 1200 controls the on/off of the semiconductor elements T3 to T8 by the drive signal G2 from the control circuit 1300 based on the DC voltage output from the voltage conversion circuit 1100.
- FIG. 1100 the motor is driven by outputting three-phase AC power to the motor while varying the phases of the AC currents flowing through the motor by 120° for each of the U, V, and W phases.
- FIG. 3 is an exploded perspective view of main parts of the power conversion device 1000.
- FIG. A semiconductor module 100, a capacitor 200 and a molded bus bar 500 are shown.
- the molded bus bar 500 is illustrated in a state where the insulating resin sealing is removed.
- Capacitor 200 shows an example including capacitors C1 and C2, but may include capacitors C1, C2, C3 and C4.
- the illustration of the reactor 300 is omitted.
- the molded busbar 500 has a first positive busbar 510 , a second positive busbar 520 and a negative busbar 530 .
- the first positive bus bar 510, the second positive bus bar 520, and the negative bus bar 530 are wiring members made of a conductive material such as copper and formed in a flat plate shape.
- the first positive bus bar 510 and the second positive bus bar 520 are arranged in parallel on the upper surfaces of the semiconductor modules 100 a , 100 b , 100 c , 100 d and the capacitor 200 .
- the first positive bus bar 510 is arranged on the upper surface of the semiconductor module 100a and the capacitor C1
- the second positive bus bar 520 is arranged on the upper surfaces of the semiconductor modules 100b, 100c, 100d and the capacitor C2 in an insulated state from each other.
- Negative electrode bus bar 530 is on the opposite side of semiconductor module 100 and capacitor 200 with first positive electrode bus bar 510 and second positive electrode bus bar 520 interposed therebetween, and is above first positive electrode bus bar 510 and second positive electrode bus bar 520 . It is provided by laminating on.
- the first positive bus bar 510 is connected via the reactor 300 to the emitter terminal of the semiconductor element T1 protruding from the semiconductor module 100a.
- the negative bus bar 530 is connected to the emitter terminal of the semiconductor element T2 protruding from the semiconductor module 100a.
- the collector terminals of the semiconductor elements T3, T5 and T7 projecting from the semiconductor modules 100b, 100c and 100d are connected to the second positive bus bar 520.
- the emitter terminals of the semiconductor elements T4, T6 and T8 protruding from the semiconductor modules 100b, 100c and 100d are connected to the negative bus bar 530.
- capacitor C1 The positive terminal and negative terminal of capacitor C1 are connected to first positive bus bar 510 and negative bus bar 530, respectively, and the positive terminal and negative terminal of capacitor C2 are connected to second positive bus bar 520 and negative bus bar 530, respectively. .
- control terminals protrude from the gates of the semiconductor elements T1 to T8 of the semiconductor module 100 and are connected to the control circuit 1300 on the circuit board 900.
- FIG. An output terminal protrudes from the connection point between the emitter side of the semiconductor elements T3, T5 and T7 and the collector side of the semiconductor elements T4, T6 and T8 of the semiconductor module 100 and is connected to the output bus bar 700 .
- the power conversion device 1000 uses the voltage conversion circuit 1100 and the inverter circuit 1200 as described with reference to FIG.
- the positive electrode busbar is divided into first positive electrode busbar 510 and second positive electrode busbar 520 .
- the first positive electrode bus bar 510, the second positive electrode bus bar 520, and the negative electrode bus bar 530 which are formed in a flat plate shape, have different areas.
- the area of the positive electrode busbar 520 and the negative electrode busbar 530 increases in this order. Assuming that each bus bar has the same thickness, the smaller the area, the higher the electrical resistance.
- each busbar when each busbar is energized, the amount of heat generated increases in the order of the electrical resistance value, that is, the first positive busbar 510 , the second positive busbar 520 , and the negative busbar 530 .
- each busbar is arranged according to the amount of heat generated by the busbars to comprehensively reduce the heat of the busbars.
- a capacitor 200 is electrically connected to the power converter 1000 for purposes such as charge supply to the semiconductor element and noise removal.
- Capacitor 200 is affected by heat from the busbar. Since the capacitor element in the capacitor 200 generally has a low heat-resistant temperature, it is necessary to limit the amount of current flowing through the busbar within a range that does not exceed the heat-resistant temperature of the capacitor element, which limits the output performance of the power conversion device 1000. . In this embodiment, by reducing the heat of the busbars, the amount of current flowing through the busbars can be increased, and the output performance of the power converter 1000 is improved.
- FIG. 4A and 4(B) are cross-sectional views of the power converter 1000.
- FIG. FIG. 4A is a cross-sectional view taken along line XX after assembling the power conversion device 1000 shown in FIG. 1, and
- FIG. 4B is an enlarged cross-sectional view of the Y portion of FIG. be.
- the same reference numerals are assigned to the same portions as those in FIGS. 1 to 3, and the description thereof will be simplified.
- the housing 400 includes a cover 490 and accommodates the circuit board 900, the base plate 800, the molded busbar 500, the capacitor 200, and the like.
- the housing 400 includes a first heat dissipation member 410 integrally formed with the housing 400 .
- the molded bus bar 500 has a first positive bus bar 510, a second positive bus bar 520, and a negative bus bar 530 which are electrically insulated from each other and laminated.
- First positive bus bar 510 and second positive bus bar 520 are arranged to face first heat radiation member 410 with insulating member 550 interposed therebetween.
- first positive electrode bus bar 510 and second positive electrode bus bar 520 are in thermal contact with first heat dissipation member 410 via insulating member 550 and first heat conducting member 600 .
- the first heat-conducting member 600 is a heat-conducting material such as grease or sheet, and serves as a cooling path for the high-temperature member by transferring heat from the high-temperature member to the low-temperature member.
- At least one of first positive electrode bus bar 510 and second positive electrode bus bar 520 is configured to be in thermal contact with first heat dissipation member 410 via insulating member 550 and first thermally conductive member 600. You may More preferably, at least the first heat dissipation member 410 that generates a large amount of heat is configured to be in thermal contact with the first heat dissipation member 410 .
- the insulating member 550 is formed of an insulating resin, insulating paper, or the like, and is a member that electrically insulates between different potentials.
- a part of molded bus bar 500 sealing positive electrode bus bar 520 and negative electrode bus bar 530 may be used.
- surfaces of first positive electrode bus bar 510 and second positive electrode bus bar 520 facing first heat radiation member 410 may be exposed, and insulating member 550 may be arranged on the exposed surface.
- the molded bus bar 500 as a whole heat can be reduced, and therefore the amount of current flowing through the busbar can be increased, so the output performance of the power conversion device 1000 can be improved.
- the housing 400 is partitioned into a first housing space 401 and a second housing space 402 by a first heat dissipation member 410 , and the semiconductor module 100 is placed in the first housing space 401 and the second housing space 402 .
- Capacitor 200 is accommodated. Thereby, it is possible to suppress the conduction of the heat of the semiconductor module 100 to the capacitor 200 .
- FIG. 5(A) and 5(B) are cross-sectional views showing modifications of the power conversion device 1000.
- FIG. Both correspond to enlarged cross-sectional views of the Y portion of FIG. 4A, FIG. 5A showing Modification 1 and FIG.
- the same parts as those in FIG. 4B are denoted by the same reference numerals, and the description thereof is simplified.
- the thickness of the first positive electrode busbar 510 is made thicker than the thickness of the second positive electrode busbar 520 and the thickness of the negative electrode busbar 530 .
- the thickness of first positive bus bar 510 may be thicker than at least one of second positive bus bar 520 and negative bus bar 530 .
- the thickness of the insulating member 550 is made thinner in the region where the first positive bus bar 510 and the first heat radiating member 410 face each other than in other regions.
- the thickness of the first thermally conductive member 600 is increased by the thickness of the insulating member 550 , the thermal conductivity of the first thermally conductive member 600 is higher than that of the insulating member 550 . Therefore, by reducing the thickness of the insulating member 550 in the region facing the first positive electrode bus bar 510, the heat radiation efficiency of the first positive electrode bus bar 510 is increased, and the temperature of the first positive electrode bus bar 510 can be lowered. can.
- FIG. 6(A) and 6(B) are cross-sectional views showing modifications of the power converter 1000.
- FIG. Both correspond to an enlarged cross-sectional view of the Y portion of FIG. 4A, FIG.
- the same parts as those in FIG. 4B are denoted by the same reference numerals, and the description thereof is simplified.
- the distance between first heat dissipation member 410 and first positive electrode bus bar 510 is set to , shorter than other regions.
- the cooling efficiency of the first positive electrode bus bar 510 is increased, and the temperature of the first positive electrode bus bar 510 can be lowered. can.
- a second heat dissipation member 420 is provided on the side opposite to the first heat dissipation member 410 across the negative electrode busbar 530, the first positive electrode busbar 510 and the second positive electrode busbar 520. .
- Second heat dissipation member 420 is in thermal contact with negative electrode bus bar 530 via second heat conduction member 620 .
- the second heat-conducting member 620 is a heat-conducting material such as grease or sheet, and serves as a cooling path for the high-temperature member by transferring heat from the high-temperature member to the low-temperature member.
- the second heat dissipating member 420 may be the base plate 800 or other members with high thermal conductivity in contact with the base plate 800 or the housing 400 .
- the thickness of the first heat conducting member 600 is thinner than the second heat conducting member 620 .
- the temperature of the bus bar can be lowered.
- the thickness of the first thermally conductive member 600 thinner than that of the second thermally conductive member 620, the cooling efficiency of the first positive electrode busbar 510, which generates a large amount of heat, is increased. You can lower the temperature.
- FIGS. 7(A) and 7(B) are perspective views showing Modification 5 of the power converter 1000.
- FIG. 7(A) is an exploded perspective view
- FIG. 7(B) is a perspective view before incorporating into the housing 400.
- FIG. The difference from the example shown in FIG. 3 is that the molded bus bar 500 and the capacitor 200 are integrated.
- the same reference numerals are assigned to the same parts as those in FIGS. 1 and 3, and the description thereof will be simplified.
- FIG. 7(A) is an exploded perspective view
- the upper surface of the capacitor 200 is integrated with the molded bus bar 500 .
- the first positive bus bar 510, the second positive bus bar 520, and the negative bus bar 530 of the molded bus bar 500 are connected to the positive terminal and the negative terminal of the capacitor 200 by bolts or welding, and are integrated with the molded bus bar 500.
- the connection between the molded bus bar 500 and the semiconductor module 100 is performed via the relay bus bar 540 .
- Relay bus bar 540 has a two-layer laminated structure insulated from each other in accordance with the two-layer laminated structure of first positive bus bar 510 and second positive bus bar 520 and negative bus bar 530 .
- One end of relay bus bar 540 in the first layer and first positive bus bar 510 and second positive bus bar 520 are fastened with bolts 560 .
- One end of second-layer relay bus bar 540 and negative electrode bus bar 530 are fastened with bolt 560 .
- the other end of the relay bus bar 540 on the first layer is connected to the positive electrode side of the semiconductor module 100 , and the other end of the relay bus bar 540 on the second layer is connected to the negative electrode side of the semiconductor module 100 .
- An output terminal of semiconductor module 100 is connected to output bus bar 700 .
- FIGS. 8(A) and 8(B) are perspective views showing modification 6 of the power converter 1000.
- FIG. 8(A) is an exploded perspective view
- FIG. 8(B) is a perspective view before incorporating into the housing 400.
- 1, 3, 7(A), and 7(B) are assigned the same reference numerals, and the description thereof will be simplified.
- FIG. 8(A) is an exploded perspective view
- the upper surface of the capacitor 200 is integrated with the molded bus bar 500 .
- the first positive bus bar 510, the second positive bus bar 520, and the negative bus bar 530 of the molded bus bar 500 are connected to the positive terminal and the negative terminal of the capacitor 200 by bolts or welding, and are integrated with the molded bus bar 500.
- the connection between the molded bus bar 500 and the semiconductor module 100 is made directly by the molded bus bar 500 .
- First positive bus bar 510 and second positive bus bar 520 are connected to the positive side of semiconductor module 100
- negative bus bar 530 is connected to the negative side of semiconductor module 100
- An output terminal of semiconductor module 100 is connected to output bus bar 700 . Since the relay bus bar 540 is not used, there is no risk of heat generation at the connection point with the relay bus bar 540 . Also, the structure is simplified, and the number of assembly man-hours can be reduced.
- first positive electrode bus bar 510 and second positive electrode bus bar 520 communicates with first heat dissipation member 410 via insulating member 550 and first heat conducting member 600. configured for thermal contact; Therefore, even if the molded bus bar 500 and the capacitor 200 have an integral structure, the heat generated by the first positive electrode bus bar 510 and the second positive electrode bus bar 520, which generate a large amount of heat, can be comprehensively reduced. Since the amount of current to flow can be increased, the output performance of the power conversion device 1000 can be improved.
- the power conversion device 1000 includes a voltage conversion circuit 1100 that converts a first DC voltage into a second DC voltage, an inverter circuit 1200 that converts the second DC voltage into an AC voltage, and a voltage conversion circuit 1100.
- a negative bus bar 530 connected in common to inverter circuit 1200 , a first positive bus bar 510 connected to voltage conversion circuit 1100 , a second positive bus bar 520 connected to inverter circuit 1200 , and voltage conversion circuit 1100 . and an inverter circuit 1200; and a first heat dissipation member 410 provided in the housing 400.
- First positive bus bar 510 and second positive bus bar 520 face first heat dissipation member 410 with insulating member 550 interposed therebetween. At least one of positive electrode busbars 520 is in thermal contact with first heat radiating member 410 via insulating member 550 and first heat conducting member 600 . This makes it possible to reduce the heat of the busbars and improve the output performance of the power converter.
- the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention as long as the features of the present invention are not impaired. . Moreover, it is good also as a structure which combined the above-mentioned embodiment and several modifications.
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Abstract
Description
電力変換装置1000は、半導体モジュール100とキャパシタ200とリアクトル300を備える。半導体モジュール100とキャパシタ200とリアクトル300は筐体400内に収容される。筐体400は、筐体400と一体的に形成された第1の放熱部材410によって第1の収容空間401と第2の収容空間402とに区画される。第1の収容空間401には、半導体モジュール100とリアクトル300が、第2の収容空間402には、キャパシタ200が収容される。筐体400内には、流入出口403より冷媒が流入出される冷却流路が形成されている。図示省略するが冷媒は筐体400内の冷却流路を経由して、半導体モジュール100内に設けられた冷却流路を流れる。冷却流路を流れる冷媒により半導体モジュール100だけでなく、筐体400および第1の放熱部材410も冷却される。
電力変換装置1000は、電圧変換回路1100、インバータ回路1200、制御回路1300を備える。電圧変換回路1100と、インバータ回路1200は、半導体素子を内蔵した半導体モジュール100a、100b、100c、100dを備えて構成されている。半導体モジュール100a、100b、100c、100dは、回路基板900上の制御回路1300からの駆動信号G1、G2により、半導体素子のオン・オフの切り替えが行われる。制御回路1300は、図示省略した外部の制御装置からの指令信号を基に、半導体モジュール100a、100b、100c、100dのスイッチング動作を制御する。
(1)電力変換装置1000は、第1の直流電圧を第2の直流電圧に変換する電圧変換回路1100と、第2の直流電圧を交流電圧に変換するインバータ回路1200と、電圧変換回路1100とインバータ回路1200とに共通に接続される負極バスバー530と、電圧変換回路1100に接続される第1の正極バスバー510と、インバータ回路1200に接続される第2の正極バスバー520と、電圧変換回路1100およびインバータ回路1200を収容する筐体400と、筐体400に設けられた第1の放熱部材410とを備え、第1の正極バスバー510および第2の正極バスバー520と負極バスバー530とは積層して互いに電気的に絶縁して設けられ、第1の正極バスバー510および第2の正極バスバー520は絶縁部材550を介して第1の放熱部材410と対向し、第1の正極バスバー510および第2の正極バスバー520の少なくとも一方は、絶縁部材550および第1の熱伝導部材600を介して、第1の放熱部材410と熱的に接触する。これにより、バスバーの熱を低減して、電力変換装置の出力性能を向上させることが可能となる。
Claims (12)
- 第1の直流電圧を第2の直流電圧に変換する電圧変換回路と、
前記第2の直流電圧を交流電圧に変換するインバータ回路と、
前記電圧変換回路と前記インバータ回路とに共通に接続される負極バスバーと、
前記電圧変換回路に接続される第1の正極バスバーと、
前記インバータ回路に接続される第2の正極バスバーと、
前記電圧変換回路および前記インバータ回路を収容する筐体と、
前記筐体に設けられた第1の放熱部材とを備え、
前記第1の正極バスバーおよび前記第2の正極バスバーと前記負極バスバーとは積層して互いに電気的に絶縁して設けられ、
前記第1の正極バスバーおよび前記第2の正極バスバーは絶縁部材を介して前記第1の放熱部材と対向し、
前記第1の正極バスバーおよび前記第2の正極バスバーの少なくとも一方は、前記絶縁部材および第1の熱伝導部材を介して、前記第1の放熱部材と熱的に接触する電力変換装置。 - 請求項1に記載の電力変換装置において、
半導体素子を内蔵して前記電圧変換回路および前記インバータ回路を構成する半導体モジュールと、前記電圧変換回路および前記インバータ回路を構成するキャパシタとを備え、
前記第1の放熱部材は、前記筐体内を前記半導体モジュールが収容される第1の収容空間と前記キャパシタが収容される第2の収容空間に区画する電力変換装置。 - 請求項2に記載の電力変換装置において、
前記負極バスバー、前記第1の正極バスバー、および前記第2の正極バスバーは、前記第1の収容空間および前記第2の収容空間の底面と対向し、前記第1の収容空間に収容された前記半導体モジュールおよび前記第2の収容空間に収容された前記キャパシタの上面に配置される電力変換装置。 - 請求項3に記載の電力変換装置において、
前記負極バスバーは、前記第1の正極バスバーおよび前記第2の正極バスバーを挟んで前記半導体モジュールおよび前記キャパシタとは反対側であって、前記第1の正極バスバーおよび前記第2の正極バスバーの上に積層して設けられる電力変換装置。 - 請求項2に記載の電力変換装置において、
前記第1の放熱部材は、前記筐体と一体的に設けられる電力変換装置。 - 請求項5に記載の電力変換装置において、
前記筐体内には冷却流路が形成される電力変換装置。 - 請求項1から請求項6までのいずれか一項に記載の電力変換装置において、
前記第1の正極バスバーの厚さは、前記第2の正極バスバーおよび前記負極バスバーの少なくとも一方よりも厚い電力変換装置。 - 請求項1から請求項6までのいずれか一項に記載の電力変換装置において、
前記絶縁部材の厚さは、前記第1の正極バスバーと前記第1の放熱部材とが対向する領域内において、その他の領域よりも薄い電力変換装置。 - 請求項1から請求項6までのいずれか一項に記載の電力変換装置において、
前記第1の放熱部材と前記第1の正極バスバーとの距離は、前記第1の正極バスバーと前記第1の放熱部材とが対向する領域内において、その他の領域よりも短い電力変換装置。 - 請求項4に記載の電力変換装置において、
前記負極バスバー、前記第1の正極バスバー、および前記第2の正極バスバーを挟んで前記第1の放熱部材とは反対側に第2の放熱部材を配置し、
前記第2の放熱部材は、第2の熱伝導部材を介して前記負極バスバーと熱的に接触する電力変換装置。 - 請求項10に記載の電力変換装置において、
前記第1の熱伝導部材の厚さは、前記第2の熱伝導部材よりも薄い電力変換装置。 - 請求項2に記載の電力変換装置において、
前記第1の正極バスバーと前記第2の正極バスバーと前記負極バスバーとを絶縁性の樹脂で封止したモールドバスバーを備え、
前記モールドバスバーは、前記キャパシタと一体的に構成される電力変換装置。
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