WO2023016013A1 - 摄像模组结构及电子设备 - Google Patents

摄像模组结构及电子设备 Download PDF

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Publication number
WO2023016013A1
WO2023016013A1 PCT/CN2022/092927 CN2022092927W WO2023016013A1 WO 2023016013 A1 WO2023016013 A1 WO 2023016013A1 CN 2022092927 W CN2022092927 W CN 2022092927W WO 2023016013 A1 WO2023016013 A1 WO 2023016013A1
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WO
WIPO (PCT)
Prior art keywords
camera module
circuit board
auxiliary circuit
structure according
camera
Prior art date
Application number
PCT/CN2022/092927
Other languages
English (en)
French (fr)
Inventor
王博
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22799829.1A priority Critical patent/EP4156670A4/en
Publication of WO2023016013A1 publication Critical patent/WO2023016013A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/486—Receivers
    • G01S7/4865—Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means

Definitions

  • This application relates to the technical field of TOF, especially to the camera module structure.
  • the invention also relates to electronic equipment provided with the camera module structure.
  • TOF Time of Flight
  • CCD Charge coupled device
  • CMOS Complementary Metal-Oxide-Semiconductor
  • Chinese name is Complementary Metal Oxide Semiconductor
  • the display screens of mobile phones, tablet computers and other products are equipped with camera areas.
  • the camera area is on the display screen.
  • the occupied area should be as small as possible.
  • two or more front camera modules are generally installed on the edge of the display screen, and these camera modules are installed on the main board of the mobile phone.
  • another feasible design method is to compress the distance between adjacent front camera modules as much as possible.
  • the front TOF device on a smartphone is usually set between two adjacent front camera modules. If the distance between the adjacent front camera module brackets is too small, the width of the TOF device is large, and the two The distance between them is small, which makes it impossible to place TOF devices. Therefore, limited by the size of TOF devices, the use of this method to reduce the area of the imaging area has reached the limit.
  • the purpose of this application is to provide a camera module structure.
  • the camera module structure can further reduce the opening of the camera area, and at the same time reduce the area occupied by the TOF device when it is laid out on the main board.
  • Another object of the present application is to provide an electronic device provided with the camera module structure.
  • an embodiment of the present application provides a camera module structure, which is mainly composed of a main board, a first camera module, a second camera module, and a TOF device, wherein the TOF device is located in the first Between the camera module and the second camera module, the main board is provided with a first installation part and a second installation part in a hollow state, and the first camera module and the second camera module are respectively provided with brackets and are respectively installed on the The first mounting part and the second mounting part; a spacer is formed between the first mounting part and the second mounting part, the TOF device is arranged on the auxiliary circuit board, the width of the auxiliary circuit board is greater than the width of the spacer, and the auxiliary circuit board is located The upper surface of the main board is connected to the main board and at least partially overlaps with the spacer.
  • the main board is provided with a mounting part for installing the first camera module and the second camera module.
  • the main board is stacked with an auxiliary circuit board above the interval, and the TOF device is installed through the auxiliary circuit board. Due to the width of the auxiliary circuit board It is larger than the width of the spacer, so there is enough space to install TOF devices, so that the width of the spacer can be designed to be smaller, that is, after further compressing the distance between the two camera modules, with the help of the above-mentioned unique shape
  • the auxiliary circuit board can still install TOF devices normally, thereby further reducing the opening of the camera area. For the front camera area, it helps to increase the screen-to-body ratio and improve the user experience of consumers. At the same time, it can also Reduce the area occupied by TOF devices when they are laid out on the motherboard, making the internal structure more compact and reasonable.
  • the area where the auxiliary circuit board overlaps with the support of the first camera module and/or the second camera module is provided with a material removal site whose depth is smaller than its thickness.
  • a part of the auxiliary circuit board can be made In the suspended state, the part where the support of the first camera module and/or the second camera module overlaps is accommodated by the material removal part.
  • the part where the support of the first camera module and/or the second camera module overlaps can be accommodated by means of the material-removing part, so as not to interfere with the camera beyond the main board.
  • the module brackets conflict in structure, that is to say, even if the bracket of the camera module is relatively high, the auxiliary circuit board and TOF device can be installed normally.
  • the auxiliary circuit board is biased towards the first camera module or the second camera module, and the material removal part is located on one side of the auxiliary circuit board;
  • the auxiliary circuit board is set in the center, and the two sides of the auxiliary circuit board are respectively formed with material-removing parts.
  • the material removal part is located at the corner area of the lower surface of the auxiliary circuit board, and the non-removal part of the lower surface of the auxiliary circuit board is in the shape of "L” or " ⁇ ".
  • the length of the material-removing portion is 1/2 to 4/5 of the length of the auxiliary circuit board.
  • the depth of the material removal site is 0.2mm-0.5mm.
  • the lower surface of the auxiliary circuit board has solder joints distributed on the non-removed parts, and is electrically connected to the main board through the solder joints.
  • the material-removed portion of the auxiliary circuit board is a non-trace area
  • the partially suspended portion of the auxiliary circuit board is a trace area
  • the sum of the thicknesses of the TOF device and the auxiliary circuit board is less than or equal to the height above the main board of the first camera module and the second camera module.
  • the auxiliary circuit board is in the shape of a rectangle, its upper half partially overlaps with the spacer, and its lower half exceeds the spacer.
  • the auxiliary circuit board includes at least two overlapping circuit boards, wherein the lower circuit board has a notch to form a material removal site, and the TOF device is arranged on the upper circuit board; the upper circuit board is electrically connected to the lower circuit board, and the lower circuit board The circuit board is electrically connected to the main board.
  • the present application provides an electronic device, which has a housing and a display screen, and a camera area is provided on the housing and/or the display screen, a camera module is provided inside the camera area, and the camera The module has the camera module structure described in any one of the above.
  • the electronic equipment provided by this application is provided with the camera module structure. Since the camera module structure has the above-mentioned technical effects, the electronic equipment provided with the camera module structure should also have corresponding technical effects.
  • FIG. 1 is a partial schematic diagram of a smart phone provided with a camera module structure disclosed in an embodiment of the present application;
  • FIG. 2 is a schematic front view of a camera module structure disclosed in an embodiment of the present application.
  • Fig. 3 is an axonometric view of the structure of the camera module shown in Fig. 2;
  • Fig. 4 is a partial structural schematic diagram of the motherboard described in Fig. 2;
  • Fig. 5 is a schematic diagram of the positions of the auxiliary circuit board provided with the TOF device and the first camera module and the second camera module;
  • Fig. 6 is the front view of auxiliary circuit board and TOF device shown in Fig. 5;
  • Fig. 7 is a side view of the auxiliary circuit board and the TOF device shown in Fig. 5;
  • FIG. 8 is a rear view of the auxiliary circuit board and the TOF device shown in FIG. 5 .
  • First camera module 11. First bracket 2. Second camera module 21. Second bracket 3. Main board 31. First installation part 32. Second installation part 4. TOF device 41. TOF lamp 42. Driver IC 43. Peripheral capacitor resistance 5. Interval part 6. Auxiliary circuit board 61. Removal part 62. Non-removal part 63. Solder joint
  • the present embodiment provides a camera module structure applied to smart phones
  • the smart phone is provided with a camera area on the upper edge of its display screen, and its camera area is biased to the left (of course, the camera area It can also be centered or biased to the right), because it is a dual-camera mode, so the inside of the camera area is provided with a first camera module 1 and a second camera module 2, and in order to enhance the camera function, a TOF device 4 is also provided.
  • TOF technology It is a kind of two-way ranging method. The basic principle is to continuously send light pulses to the target, and then use the sensor to receive the light returned from the object. There is a time difference in this process, so as to measure the distance between the transmitter and the measured object. , The addition of TOF devices enables the camera module to obtain more accurate depth of field information quickly and remotely, thereby completing a larger range of 3D modeling.
  • the area of the imaging area should be as small as possible. Although the area occupied by two adjacent front camera modules can be reduced by compressing the lateral distance between them, if the distance between the first camera module 1 and the second camera module 2 is too small, the normal installation will not be possible. TOF devices.
  • the application redesigned the structure of the camera module, which can still install TOF devices between the camera modules when the distance between the camera modules is small, thereby further reducing the opening of the camera area and improving the screen occupation. Compare.
  • the camera module structure is mainly composed of a main board 3 and a first camera module 1 , a second camera module 2 and a TOF device 4 arranged on the main board 3 .
  • the first camera module 1 and the second camera module 2 together form a double lens to realize the front camera function
  • the TOF device 4 is located between the first camera module 1 and the second camera module 2
  • the main board 3 is provided with a hollow
  • the brackets of the first camera module 1 and the second camera module 2 are in the shape shown in Figure 2 in projection
  • the shape of the second mounting part 32 is shown in FIG. 3 , it is adapted to the brackets of the first camera module 1 and the second camera module 2 , and can be put into the brackets of the first camera module 1 and the second camera module 2 . stand.
  • the auxiliary circuit board 6 is an additional relatively small circuit board, which is connected to The main board 3 is located between the first camera module 1 and the second camera module 2, and through the auxiliary circuit board 6, it can still The TOF device 4 can be installed, thereby reducing the area occupied by the entire camera module structure.
  • the first installation part 31 on the main board 3 is in the shape of being closed all around, and the second installation part 32 adjacent to it is the shape of top opening (see Fig. 4), passes between the first installation part 31 and the second installation part 32
  • the vertical spacer 5 separates the two
  • the auxiliary circuit board 6 is generally rectangular, and its width is greater than the width of the spacer 5
  • the auxiliary circuit board 6 is located on the upper surface of the main board 3, and its upper half overlaps with the spacer 5, Its lower half exceeds the interval part 5 and overlaps with the main board outside the interval part 5.
  • the TOF device 4 is installed on the upper surface of the auxiliary circuit board 6. When assembling, the TOF device 4 is installed on the main board 3 through the auxiliary circuit board 6 , and is electrically connected to the main board 3 through the auxiliary circuit board 6 (see FIG. 5 ).
  • the cameras and brackets of the first camera module 1 and the second camera module 2 are usually in an integrated structure.
  • the overlapping area of a bracket 11 is provided with a material removal part 61 whose depth is smaller than its thickness, and the auxiliary circuit board 6 can be partially suspended in the air through the removal part 61, so that the first bracket 11 can be accommodated to overlap with it through the material removal part 61 position, avoiding the structural conflict between the auxiliary circuit board 6 and the first bracket 11 .
  • the main board of the smart phone also has other parts. Since the improvements of the present application are mainly concentrated in the camera area, only the local structure of the main board corresponding to the camera area is shown in the accompanying drawings, and the parts of the main board are omitted. other parts.
  • Figure 6 is a front view of the auxiliary circuit board and TOF device shown in Figure 5;
  • Figure 7 is a side view of the auxiliary circuit board and TOF device shown in Figure 5;
  • Figure 8 is a diagram Rear view of auxiliary circuit board with TOF device shown in 5.
  • the camera head of the first camera module 1 is biased to the left relative to the first bracket 11
  • the camera head of the second camera module 2 is also biased to the left relative to the second bracket 21. Therefore, in order to ensure The TOF device 4 is located in the middle of the first camera module 1 and the second camera module 2, and the auxiliary circuit board 6 is also biased to the left relative to the spacer part 5, and its right side is basically aligned with the right side of the spacer part 5. It will be structurally conflicted with the second bracket 21 of the second camera module 2 , therefore, the auxiliary circuit board 6 is only formed with a material-removing portion 61 on the left side.
  • the material removal portion 61 is generally in the shape of a vertical rectangle, located on the right side of the lower surface of the auxiliary circuit board 6, and in the upper corner area. .
  • the overlapping area of the auxiliary circuit board 6 and the first bracket 11 is not the same, therefore, the area of the material removal part 61 will also change.
  • the length of the material removal part 61 can be the length of the auxiliary circuit board 6 1/2 to 4/5 of that, and the width can be 1/5 to 1/2 of the width of the auxiliary circuit board 6 .
  • the material-removing part of the auxiliary circuit board 6 is a non-routing area, and the local floating part (that is, the part with a thinner thickness) corresponding to the material-removing part 61 can be a wiring area, and the lower surface of the auxiliary circuit board 6 is in the non-removing area.
  • Solder spots 63 are distributed on the material part 62 , and are electrically connected to the main board 3 through the solder spots 63 .
  • the solder spots 63 are densely distributed in a dot matrix on the lower surface of the auxiliary circuit board 6 .
  • the device on the upper surface and the solder joint 63 on the lower surface can be connected through the internal redirection circuit, that is to say, the entire upper surface of the auxiliary circuit board 6 can be distributed connection point, while the connection point on the lower surface is concentrated in the non-removing part 62, and the connection point on the upper surface and the connection point on the lower surface are conducted on the circuit through the reversing circuit inside the auxiliary circuit board 6, in order to avoid the removal of the material part 61 is too deep to affect the internal wiring of the partially suspended part.
  • the depth of the material removal part 61 can be controlled at 0.2mm-0.5mm. In this embodiment, the thickness of the auxiliary circuit board 6 is 0.7mm, and the depth of the material removal part 61 0.2mm (see Figure 7).
  • the material can be removed without affecting the structural strength of the partially suspended part.
  • the depth of the portion 61 can be designed to be relatively large, for example, it can be 0.3mm, 0.4mm or other values.
  • the auxiliary circuit board 6 Since the auxiliary circuit board 6 is added to the interval part 5 of the main board 3, its local cross-sectional thickness will be the sum of the thicknesses of the main board 3, the auxiliary circuit board 6 and the TOF device 4. In order to prevent the TOF device 4 from exceeding the height limit, the TOF device 4 The sum of the thickness and the thickness of the auxiliary circuit board 6 should be less than or equal to the height of the first camera module 1 and the second camera module 2 beyond the main board 3 . In this embodiment, the thickness of the auxiliary circuit board 6 is smaller than that of the main board 3 , which can prevent the height of the TOF device 4 from exceeding the first camera module 1 and the second camera module 2 .
  • the TOF device 4 on the auxiliary circuit board 6 mainly includes a TOF lamp 41, a driver IC 42 and a peripheral capacitor and resistor 43, wherein the TOF lamp 41 occupies the upper third of the auxiliary circuit board 6, and the driver IC 42 occupies the middle part of the auxiliary circuit board 6.
  • the lower area, the area between the TOF lamp 41 and the driving IC 42 and the lower area of the driving IC 42 are used to set the peripheral capacitor resistor 43 (see FIG. 6 ).
  • the auxiliary circuit board 6 can be arranged in the center, and its two sides are respectively formed with a material-removing part 61, and the material-removing part 61 on the left corresponds to the first bracket 11, which can avoid contact with the first bracket 11.
  • a bracket 11 is structurally conflicting, and the material-removing portion 61 on the right corresponds to the second bracket 21 , which can avoid structural conflict with the second bracket 21 .
  • each material-removing part 61 is generally in a vertical rectangular shape, located on the left and right sides of the lower surface of the auxiliary circuit board 6, and in the upper corner area.
  • the two right removal parts 61 therefore, the non-removal parts 62 on the lower surface of the auxiliary circuit board 6 are in the shape of " ⁇ ", and the widths of the left and right two removal parts 61 are relatively narrow, and the sum of their widths can be equal to the above-mentioned first
  • the width of the material-removing portion 61 in this embodiment and other structures are basically the same as those of the first embodiment above, please refer to the above description. This structure is applicable to the situation where the cameras of the two camera modules do not deviate relative to the support, that is to say, the cameras of the camera modules are located in the very center of the support, and the geometric centers of the two are coincident.
  • the auxiliary circuit board 6 can be set to the right with respect to the spaced part, and a material removal part 61 is formed on the right side, which can avoid structural conflict with the second bracket 21, and from the auxiliary circuit board 6
  • the removal part 61 is generally in the shape of a vertical rectangle, located on the left side of the lower surface of the auxiliary circuit board 6, and in the upper corner area, and the rest of the structure is basically the same as that of the first embodiment above, please refer to the above description of.
  • This structure is applicable to the situation where the cameras of the two camera modules are offset to the right relative to the support.
  • the upper and lower ends of the auxiliary circuit board 6 can exceed the spacer 5 and then be connected to the main board 3. If this structure is adopted, the left and/or right side of the auxiliary circuit board 6 will 61 mainly occupies the middle part of the auxiliary circuit board 6 except for both ends.
  • the non- The removal part 62 is in the shape of "]"
  • the non-removal part 62 on the auxiliary circuit board 6 is in the shape of "[”
  • the removal part 61 is located in the auxiliary circuit board 6
  • the non-removable part 62 on the auxiliary circuit board 6 is in the shape of "I”.
  • the auxiliary circuit board 6 of this structure has a larger overlapping area with the main board 3. On the one hand, the connection strength between the two can be increased. On the other hand, the auxiliary circuit board 6 with a larger size can be adapted to various types of TOF.
  • the device 4 is also easy to carry out circuit design, so as to achieve better electrical connection.
  • the material removal part 61 on the auxiliary circuit board 6 can be processed and manufactured in various ways. It can be integrally formed with the auxiliary circuit board 6, or the auxiliary circuit board 6 can be made first, and then on the basis of the auxiliary circuit board 6, through Subsequent processing and shaping, for example, a cavity process may be used to mill away part of the material of the auxiliary circuit board 6 , so as to form the required material removal portion 61 .
  • the auxiliary circuit board 6 can also be formed by overlapping at least two layers of circuit boards. Specifically, it can be a pressed two-layer, three-layer or four-layer structure. Taking two layers as an example, in the two-layer overlapping circuit board, the lower circuit board It is a rectangular circuit board with missing corners, and the upper circuit board is a complete rectangular circuit board. In this way, after the two layers of circuit boards are overlapped, the missing corner of the lower layer circuit board can form a material removal part 61, and the TOF device 4 is arranged on the upper layer circuit board, and the upper layer circuit board is electrically connected with the lower layer circuit board, and the lower layer circuit board is further connected to the main board. 3, thereby realizing the electrical connection between the TOF device 4 and the main board 3.
  • the above-mentioned embodiments are only preferred solutions of the present application, and are not specifically limited thereto.
  • targeted adjustments can be made according to actual needs, so as to obtain different implementation modes.
  • it can also be applied to triple cameras (ultra-wide-angle lens, zoom lens, main camera lens), quad-camera (ultra-wide-angle lens, zoom lens, main camera lens, depth-of-field auxiliary lens) or penta-camera (super wide-angle lens, zoom lens, main camera lens, depth-of-field auxiliary lens, other lenses) mode, thereby further providing a third camera module, a fourth camera module, and a fifth camera module; or, the first camera module 1 and the second camera module 2 are arranged at intervals up and down, in this case, the orientation of the auxiliary circuit board 6 is also adjusted accordingly, and becomes a horizontal arrangement, and so on. Since there are many ways of possible realization, it is not necessary to give examples one by one here.
  • the camera module structure provided by the present application can make the two camera modules installed on the main board by providing hollow mounting parts for the first camera module 1 and the second camera module 2. 3, its support only exceeds the main board 3 by a small distance, and at the same time, the TOF device 4 is installed by stacking the auxiliary circuit board 6 above the spacing part 5, because the width of the auxiliary circuit board 6 is greater than the width of the spacing part 5 , so there is enough space to install the TOF device 4, and the lower surface of the auxiliary circuit board 6 is provided with a material removal part 61, and the first camera module 1 and/or the second camera module can be accommodated by the material removal part 61 The position where the bracket of 2 overlaps with it, so as not to conflict with the camera module bracket beyond the main board 3 in structure.
  • the width of the spacer 5 can be designed less, that is to say, after further compressing the distance between the two camera modules, the TOF device 4 can still be installed normally by means of the auxiliary circuit board 6 with the above-mentioned structure, thereby further The opening of the camera area is reduced, which is suitable for both the front camera module and the rear camera module.
  • the present application also provides an electronic device, which may specifically be a mobile phone (see Figure 1), a tablet computer, a wearable device, a vehicle-mounted device, augmented reality (augmented reality, AR)/virtual reality (virtual reality, VR) equipment, notebook computer, ultra-mobile personal computer (ultra-mobile personal computer, UMPC), netbook, personal digital assistant (personal digital assistant, PDA), etc., which have a housing and a display screen, and in the housing and/or The display screen is provided with a camera area, and the camera module structure described above is provided in the camera area.
  • a mobile phone see Figure 1
  • a tablet computer a wearable device
  • a vehicle-mounted device augmented reality (augmented reality, AR)/virtual reality (virtual reality, VR) equipment
  • notebook computer ultra-mobile personal computer (ultra-mobile personal computer, UMPC), netbook
  • personal digital assistant personal digital assistant, PDA
  • PDA personal digital assistant

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

一种摄像模组结构及电子设备，所述摄像模组结构包括主板、第一摄像模组、第二摄像模组以及TOF器件，所述TOF器件位于所述第一摄像模组与第二摄像模组之间，所述第一摄像模组和第二摄像模组分别通过支架安装于镂空的第一安装部和第二安装部；所述主板具有将所述第一安装部和第二安装部分开的间隔部位，所述TOF器件设于辅助电路板的上表面，所述辅助电路板的宽度大于所述间隔部位的宽度，所述辅助电路板位于所述主板的上表面，其连接于所述主板并与所述间隔部位至少部分重叠；所述辅助电路板在下表面设有去料部位，以形成局部悬空部位。该摄像模组结构能够进一步减小摄像区域的开口，同时减少TOF器件在主板上布局时所占用的面积。

Description

摄像模组结构及电子设备
本申请要求以2021年08月12日提交中国专利局、申请号为202110924339.0、发明名称为“摄像模组结构及电子设备”的发明专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及TOF技术领域，尤其涉及摄像模组结构。本发明还涉及设有所述摄像模组结构的电子设备。
背景技术
近年来，电子设备市场的竞争越来越激烈，消费者对产品的要求也越来越高，而随着TOF(即Time of flight，中文学名为飞行时间法)技术的应用不断拓宽，TOF图像传感器已经完成从CCD(即Charge coupled device，中文学名为电荷耦合器件)到CMOS(即Complementary Metal-Oxide-Semiconductor，中文学名为互补金属氧化物半导体)的技术演进，同时逐渐成为许多电子产品的标配。
手机、平板电脑等产品的显示屏上都设有摄像区域，为了避免摄像区域过多的影响显示屏的屏占比，以保证消费者能够获得更佳的使用体验感，摄像区域在显示屏上所占的面积应越小越好。
以智能手机为例，其显示屏的边缘部位一般设有两个或多个前置摄像模组，这些摄像模组安装在手机主板上，为了减少手机屏幕摄像区域的开口，除了尽可能的减少模组尺寸以外，另一种可行的设计方式就是尽量压缩相邻前置摄像模组的间距。
智能手机上的前置TOF器件通常设置在两个相邻的前置摄像模组之间，如果相邻前置摄像模组支架的间距过小，则由于TOF器件的宽度较大，而两者之间的间距较小，导致无法放入TOF器件，因此，受限于TOF器件的尺寸，采用这种方式来减小摄像区域面积，已达到极限。
鉴于摄像模组在结构上存在上述缺陷，因此，如何改进摄像模组的结构，以进一步减小摄像区域占用的面积，成为本领域技术人员需要解决的技术问题。
发明内容
本申请的目的在于提供一种摄像模组结构。该摄像模组结构能够进一步减小摄像区域的开口，同时减少TOF器件在主板上布局时所占用的面积。
本申请的另一目的是提供一种设有所述摄像模组结构的电子设备。
为实现上述目的，本申请实施例提供一种摄像模组结构，该摄像模组结构主要由主板、第一摄像模组、第二摄像模组以及TOF器件等组成，其中，TOF器件位于第一摄像模组与第二摄像模组之间，主板设有呈镂空状态的第一安装部和第二安装部，第一摄像模组和第二摄像模组分别设有支架并通过支架分别安装于第一安装部和第二安装部；第一安装部和第二安装部之间形成有间隔部位，TOF器件设置在辅助电路板上，辅助电路板的宽度大于间隔部位的宽度，辅助电路板位于主板的上表面，其连接于主 板并与间隔部位至少部分重叠。
主板设有用于安装第一摄像模组和第二摄像模组的安装部，同时，主板在间隔部位的上方叠置有辅助电路板，通过辅助电路板来安装TOF器件，由于辅助电路板的宽度大于间隔部位的宽度，因此具有足够的空间来安装TOF器件，这样，间隔部位的宽度便可以设计的较小，也就是说，在进一步压缩两个摄像模组的间距之后，借助具有上述独特造型的辅助电路板，仍然可以正常安装TOF器件，从而进一步减小了摄像区域的开口，对于前置摄像区域来讲，有助于提高屏占比，改善消费者的使用体验感，同时，还可以减少TOF器件在主板上布局时所占用的面积，使内部结构更加紧凑、合理。
可选地，辅助电路板与第一摄像模组和/或第二摄像模组的支架相重叠的区域在下表面设有深度小于其厚度的去料部位，这样，可以使辅助电路板的局部呈悬空状态，从而通过去料部位容置第一摄像模组和/或第二摄像模组的支架与之相重叠的部位。
通过在辅助电路板的下表面设置去料部位，可以借助去料部位容置第一摄像模组和/或第二摄像模组的支架与之相重叠的部位，从而不会与超出主板的摄像模组支架在结构上相冲突，也就是说，即使摄像模组的支架相对较高，也能够正常安装辅助电路板和TOF器件。
可选地，相对于间隔部位，辅助电路板偏向于第一摄像模组或第二摄像模组，去料部位位于所述辅助电路板的一侧；或者，
相对于间隔部位，辅助电路板居中设置，其两侧分别形成有去料部位。
可选地，去料部位位于所述辅助电路板下表面的边角区域，辅助电路板下表面的非去料部位呈“L”形或“⊥”形。
可选地，去料部位的长度为所述辅助电路板长度的1/2至4/5。
可选地，去料部位的深度为0.2mm-0.5mm。
可选地，辅助电路板的下表面在非去料部位分布有焊点，并通过焊点与主板电连接。
可选地，辅助电路板的去料部位为非走线区域，辅助电路板的局部悬空部位为走线区域。
可选地，TOF器件与辅助电路板的厚度之和小于等于所述第一摄像模组、第二摄像模组超出主板的高度。
可选地，辅助电路板呈矩形，其上半部分与所述间隔部位部分重叠，其下半部分超出间隔部位。
可选地，辅助电路板包括至少两层重叠的电路板，其中，下层电路板具有缺角，以形成去料部位，TOF器件设于上层电路板；上层电路板与下层电路板电连接，下层电路板与主板电连接。
为实现上述另一目的，本申请提供一种电子设备，其具有壳体和显示屏，并在壳体和/或显示屏上设有摄像区域，摄像区域的内部设有摄像模组，且摄像模组具有上述任一项所述的摄像模组结构。
本申请所提供的电子设备设有所述摄像模组结构，由于所述摄像模组结构具有上 述技术效果，则设有该摄像模组结构的电子设备也应具有相应的技术效果。
附图说明
图1为本申请实施例公开的一种设有摄像模组结构的智能手机的局部示意图；
图2为本申请实施例公开的一种摄像模组结构的正面示意图；
图3为图2所示摄像模组结构的轴侧图；
图4为图2中所述主板的局部结构示意图；
图5为设有TOF器件的辅助电路板与第一摄像模组和第二摄像模组的位置关于示意图；
图6为图5中所示辅助电路板与TOF器件的主视图；
图7为图5中所示辅助电路板与TOF器件的侧视图；
图8为图5中所示辅助电路板与TOF器件的后视图。
图中：
1.第一摄像模组 11.第一支架 2.第二摄像模组 21.第二支架 3.主板 31.第一安装部 32.第二安装部 4.TOF器件 41.TOF灯 42.驱动IC 43.外围电容电阻 5.间隔部位 6.辅助电路板 61.去料部位 62.非去料部位 63.焊点
具体实施方式
为了使本技术领域的人员更好地理解本申请方案，下面结合附图和具体实施方式对本申请作进一步的详细说明。
在本文中，“上、下、内、外”等用语是基于附图所示的位置关系而确立的，根据附图的不同，相应的位置关系也有可能随之发生变化，因此，并不能将其理解为对保护范围的绝对限定；而且，诸如“第一”和“第二”等之类的关系术语仅仅用来将一个与另一个具有相同名称的部件区分开来，而不一定要求或者暗示这些部件之间存在任何这种实际的关系或者顺序。
如图1所示，本实施例提供一种应用于智能手机的摄像模组结构，该智能手机在其显示屏的上边缘位置设有摄像区域，其摄像区域偏向于左侧(当然，摄像区域也可以居中或偏向于右侧)，由于是双摄模式，因此摄像区域的内部设有第一摄像模组1和第二摄像模组2，为了增强摄像功能还设有TOF器件4，TOF技术属于双向测距方法的一种，基本原理就是通过给目标连续发送光脉冲，然后用传感器接收从物体返回的光，这个过程中存在一个时间差，从而测算出发射器与被测物体之间的距离，TOF器件的加入，使摄像模组能够通过快速、远距离获取精度更高的景深信息，从而完成更大范围的3D建模。
由于摄像区域的存在会占用显示屏的正常显示区域，因此，通常来讲，摄像区域的面积应尽可能的小。虽然通过压缩相邻两个前置摄像模组的横向间距，可以减小其占用的面积，但是，如果第一摄像模组1和第二摄像模组2的间距过小，会导致无法正常安装TOF器件。
针对这一问题，本申请重新设计了摄像模组结构，其能够在摄像模组间距较小的 情况下，依然能够在两者之间安装TOF器件，从而进一步减少摄像区域的开口，提高屏占比。
如图2、图3所示，具体来讲，此摄像模组结构主要由主板3和设于主板3的第一摄像模组1、第二摄像模组2以及TOF器件4等组成。
第一摄像模组1和第二摄像模组2一起构成双镜头，实现前置摄像功能，TOF器件4位于第一摄像模组1与第二摄像模组2之间，主板3设有镂空的第一安装部31和第二安装部32，第一摄像模组1设有第一支架11，第二摄像模组2设有第二支架21，两者分别通过第一支架11和第二支架21安装在第一安装部31和第二安装部32，第一摄像模组1和第二摄像模组2的支架在投影上呈如图2所示的形状，镂空的第一安装部31和第二安装部32的形状如图3所示，与第一摄像模组1和第二摄像模组2的支架相适配，能够放入第一摄像模组1和第二摄像模组2的支架。
通过在主板3上设置镂空的第一安装部31和第二安装部32，可以使两个摄像模组在安装后，能够坐落在主板3中，尽可能的降低摄像模组的高度，使两个摄像模组的支架仅超出主板3较小的距离，从而为下述辅助电路板6的安装创造有利的条件，辅助电路板6为另外增设的一块体积相对较小的电路板，其连接于主板3，并位于第一摄像模组1与第二摄像模组2之间，通过辅助电路板6，可以在第一摄像模组1与第二摄像模组2间距较小的情况下，依然能够安装TOF器件4，从而减小整个摄像模组结构所占用的面积。
主板3上的第一安装部31呈四周封闭的形状，与之相邻的第二安装部32呈上部敞开的形状(见图4)，第一安装部31和第二安装部32之间通过竖向的间隔部位5将两者分开，辅助电路板6大体呈矩形，其宽度大于间隔部位5的宽度，辅助电路板6位于主板3的上表面，其上半部分与间隔部位5部分重叠，其下半部分超出间隔部位5，与间隔部位5之外的主板重叠，TOF器件4安装在辅助电路板6的上表面，在进行组装时，TOF器件4通过辅助电路板6安装在主板3上，并通过辅助电路板6与主板3电连接(见图5)。
请继续参考图5，第一摄像模组1和第二摄像模组2的摄像头和支架通常为一体式结构，在进行组装时，首先将第一摄像模组1和第二摄像模组2放入第一安装部31和第二安装部32，然后，再安装辅助电路板6，辅助电路板6的左侧与第一摄像模组1的第一支架11局部重叠，其下表面在与第一支架11相重叠的区域设有深度小于其厚度的去料部位61，通过去料部位61可以使辅助电路板6局部悬空，从而可以通过去料部位61容置第一支架11与之相重叠的部位，避免辅助电路板6与第一支架11在结构上相冲突。
不难理解，智能手机的主板还具有其他部分，由于本申请的改进之处主要集中在摄像区域，因此，在附图中仅示出了主板对应于摄像区域的局部结构，而省略了主板的其他部分。
请一并参考图6至图8，图6为图5中所示辅助电路板与TOF器件的主视图；图7为图5中所示辅助电路板与TOF器件的侧视图；图8为图5中所示辅助电路板与TOF器件的后视图。
在本实施例中，由于第一摄像模组1的摄像头相对于第一支架11偏向于左侧，第二摄像模组2的摄像头相对于第二支架21也偏向于左侧，因此，为了保证TOF器件4处于第一摄像模组1和第二摄像模组2的中间位置，辅助电路板6相对于间隔部位5也偏向于左侧，其右侧与间隔部位5的右侧基本对齐，不会与第二摄像模组2的第二支架21在结构上相冲突，因此，辅助电路板6只在左侧形成有去料部位61。
具体地，从辅助电路板6的背面视角(即图8的视角)进行观察时，去料部位61大体呈竖向的矩形形状，位于辅助电路板6下表面的右侧，并处于上边角区域。
根据产品的不同，辅助电路板6与第一支架11重叠的面积也不尽相同，因此，去料部位61的面积也会发生变化，例如，去料部位61的长度可以是辅助电路板6长度的1/2至4/5，宽度可以是辅助电路板6宽度的1/5至1/2。
辅助电路板6的去料部位为非走线区域，而对应于去料部位61的局部悬空部位(也就是厚度变薄的部分)可以是走线区域，辅助电路板6的下表面在非去料部位62分布有焊点63，并通过焊点63与主板3电连接，焊点63在辅助电路板6的下表面以点阵形式密集分布。
如果辅助电路板6的局部悬空部位需要进行走线，则可以通过内部的变向线路连接上表面的器件和下表面的焊点63，也就是说，辅助电路板6的整个上表面都可以分布连接点，而下表面的连接点则集中在非去料部位62，上表面的连接点与下表面的连接点通过辅助电路板6内部的变向线路在电路上导通，为了避免去料部位61过深而影响局部悬空部位的内部走线，去料部位61的深度可控制在0.2mm-0.5mm，在本实施例中，辅助电路板6的厚度为0.7mm，去料部位61的深度为0.2mm(见图7)。
如果辅助电路板6的局部悬空部位为非走线区域，主要用于支撑TOF器件4，起到为TOF器件4提供安装基础的作用，则在不影响局部悬空部位结构强度的前提下，去料部位61的深度可设计的相对较大，例如可以是0.3mm、0.4mm或其他值。
由于在主板3的间隔部位5增设辅助电路板6之后，其局部的截面厚度将是主板3、辅助电路板6以及TOF器件4的厚度之和，为了避免TOF器件4超过高度界限，TOF器件4与辅助电路板6的厚度之和应小于等于第一摄像模组1、第二摄像模组2超出主板3的高度。在本实施例中，辅助电路板6的厚度小于主板3的厚度，可以避免TOF器件4的高度超过第一摄像模组1和第二摄像模组2。
辅助电路板6上的TOF器件4主要包括TOF灯41、驱动IC42以及外围电容电阻43，其中，TOF灯41占据辅助电路板6的上三分之一区域，驱动IC42占据辅助电路板6中部偏下的区域，TOF灯41与驱动IC42之间的区域以及驱动IC42的下部区域则用于设置外围电容电阻43(见图6)。
在另一实施例中，相对于间隔部位5，辅助电路板6可以居中设置，其两侧分别形成有去料部位61，左侧的去料部位61对应于第一支架11，可避免与第一支架11在结构上相冲突，右侧的去料部位61对应于第二支架21，可避免与第二支架21在结构上相冲突。从辅助电路板6的背面视角进行观察时，各去料部位61大体呈竖向的矩形形状，位于辅助电路板6下表面的左侧和右侧，并处于上边角区域，由于设有左、右两个去料部位61，因此，辅助电路板6下表面的非去料部位62呈“⊥”形，左右两个去 料部位61的宽度相对较窄，其宽度之和可以等于上述第一实施例中的去料部位61的宽度，其余结构与上述第一实施例基本相同，请参考上文的描述。这种结构适用于两个摄像模组的摄像头相对于支架不存在偏移的情形，也就是说，摄像模组的摄像头位于其支架的正中央，两者的几何中心相重合。
在又一实施例中，相对于间隔部位，辅助电路板6可以偏右设置，其右侧形成有去料部位61，可避免与第二支架21在结构上相冲突，从辅助电路板6的背面视角进行观察时，去料部位61大体呈竖向的矩形形状，位于辅助电路板6下表面的左侧，并处于上边角区域，其余结构与上述第一实施例基本相同，请参考上文的描述。这种结构适用于两个摄像模组的摄像头相对于支架向右偏移的情形。
在其他实施例中，辅助电路板6的上下两端均可以超出间隔部位5，然后与主板3连接，若采用这种结构，则辅助电路板6的左侧和/或右侧的去料部位61主要占据辅助电路板6除两端之外的中间部分，从辅助电路板6的背面视角进行观察时，若去料部位61位于辅助电路板6的左侧，则辅助电路板6上的非去料部位62呈“]”形，若去料部位61位于辅助电路板6的右侧，则辅助电路板6上的非去料部位62呈“[”形，若去料部位61位于辅助电路板6的左侧和右侧，则辅助电路板6上的非去料部位62呈“工”字形。这种结构的辅助电路板6与主板3具有更大的重叠面积，一方面可以增加两者的连接强度，另一方面，尺寸较大的辅助电路板6，可以适配各种不同类型的TOF器件4，也易于进行电路设计，从而更好的实现电连接。
辅助电路板6上的去料部位61可以采用多种方式来进行加工制造，其可以与辅助电路板6一体成型，也可以先制作辅助电路板6，然后在辅助电路板6的基础上，通过后续工艺加工成型，例如，可以使用cavity工艺将辅助电路板6的局部材料铣掉，从而形成所需的去料部位61。
此外，辅助电路板6还可以由至少两层电路板重叠形成，具体可以是压制的两层、三层或四层结构，以两层为例，在两层重叠的电路板中，下层电路板为具有缺角的矩形电路板，上层电路板为完整的矩形电路板。这样，当两层电路板重叠之后，下层电路板的缺角便可以形成去料部位61，TOF器件4则设于上层电路板，上层电路板与下层电路板电连接，下层电路板进一步与主板3电连接，进而实现TOF器件4与主板3的电连接。
上述实施例仅是本申请的优选方案，具体并不局限于此，在此基础上可根据实际需要作出具有针对性的调整，从而得到不同的实施方式。例如，除了适用于前置双镜头的模式，还可以适用于三镜头(超广角镜头、变焦镜头、主摄镜头)、四镜头(超广角镜头、变焦镜头、主摄镜头、景深辅助镜头)或五镜头(超广角镜头、变焦镜头、主摄镜头、景深辅助镜头、其他镜头)的模式，从而进一步设有第三摄像模组、第四摄像模组、第五摄像模组；或者，第一摄像模组1和第二摄像模组2上下间隔设置，这种情况下，辅助电路板6的方位也随之作出调整，变为横向设置，等等。由于可能实现的方式较多，这里就不再一一举例说明。
如图3、5所示，本申请所提供的摄像模组结构，通过为第一摄像模组1和第二摄像模组2设置镂空的安装部，可以使两个摄像模组在安装于主板3之后，其支架仅超 出主板3较小的距离，同时，通过在间隔部位5的上方叠置辅助电路板6的形式来安装TOF器件4，由于辅助电路板6的宽度大于间隔部位5的宽度，因此具有足够的空间来安装TOF器件4，而且，辅助电路板6的下表面设有去料部位61，通过去料部位61可以容置第一摄像模组1和/或第二摄像模组2的支架与之相重叠的部位，从而不会与超出主板3的摄像模组支架在结构上相冲突。这样，间隔部位5的宽度便可以设计的较小，也就是说，在进一步压缩两个摄像模组的间距之后，借助具有上述构造的辅助电路板6，仍然可以正常安装TOF器件4，从而进一步减小了摄像区域的开口，其既适用于前置摄像模组，也适用于后置摄像模组。
如图1所示，当这种摄像模组结构应用于智能手机的前置摄像模组时，由于第一摄像模组1和第二摄像模组2的间距进一步减小，因此，从外部可见的前置摄像模组的横向长度也随之变小，进而减小了整个前置摄像模组在屏幕左上角区域所占用的面积，屏幕显示区域的面积进一步扩大，在保证摄像功能和摄像质量的情况下，有助于提高屏占比，改善消费者的使用体验感，同时，还可以减少TOF器件4在主板3上布局时所占用的面积，使内部结构更加紧凑、合理。
除了上述摄像模组结构，本申请还一种电子设备，具体可以是手机(见图1)、平板电脑、可穿戴设备、车载设备、增强现实(augmented reality，AR)/虚拟现实(virtual reality，VR)设备、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本、个人数字助理(personal digital assistant，PDA)等，其具有壳体和显示屏，并在壳体和/或显示屏设有摄像区域，摄像区域内设有上文介绍的摄像模组结构，关于电子设备的其余结构，请参考现有技术，本文不再赘述。
以上对本申请所提供的摄像模组结构及电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的核心思想。应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以对本申请进行若干改进和修饰，这些改进和修饰也落入本申请权利要求的保护范围内。

Claims (21)

  1. 摄像模组结构，包括主板、第一摄像模组、第二摄像模组以及飞行时间TOF器件，所述TOF器件位于所述第一摄像模组与第二摄像模组之间，其特征在于，所述主板设有镂空的第一安装部和第二安装部，所述第一摄像模组和第二摄像模组分别设有支架并通过所述支架安装于所述第一安装部和第二安装部；所述主板具有将所述第一安装部和第二安装部分开的间隔部位，所述TOF器件设于辅助电路板的上表面，所述辅助电路板的宽度大于所述间隔部位的宽度，所述辅助电路板位于所述主板的上表面，其连接于所述主板并与所述间隔部位至少部分重叠。
  2. 根据权利要求1所述的摄像模组结构，其特征在于，所述辅助电路板与所述第一摄像模组和/或第二摄像模组的支架相重叠的区域在下表面设有深度小于其厚度的去料部位，使所述辅助电路板局部悬空，并通过所述去料部位容置所述第一摄像模组和/或第二摄像模组的支架与之相重叠的部位。
  3. 根据权利要求1所述的摄像模组结构，其特征在于，相对于所述间隔部位，所述辅助电路板偏向于所述第一摄像模组或第二摄像模组，所述去料部位位于所述辅助电路板的一侧；
    或者，相对于所述间隔部位，所述辅助电路板居中设置，其两侧分别形成有所述去料部位。
  4. 根据权利要求3所述的摄像模组结构，其特征在于，所述去料部位位于所述辅助电路板下表面的边角区域，所述辅助电路板下表面的非去料部位呈“L”形或“⊥”形。
  5. 根据权利要求4所述的摄像模组结构，其特征在于，所述去料部位的长度为所述辅助电路板长度的1/2至4/5；和/或，所述去料部位的深度为0.2mm-0.5mm。
  6. 根据权利要求1所述的摄像模组结构，其特征在于，所述辅助电路板的下表面在非去料部位分布有焊点，并通过所述焊点与所述主板电连接。
  7. 根据权利要求6所述的摄像模组结构，其特征在于，所述辅助电路板的去料部位为非走线区域，所述辅助电路板的局部悬空部位为走线区域。
  8. 根据权利要求1所述的摄像模组结构，其特征在于，所述TOF器件与辅助电路板的厚度之和小于等于所述第一摄像模组、第二摄像模组超出所述主板的高度。
  9. 根据权利要求1所述的摄像模组结构，其特征在于，所述辅助电路板呈矩形，其上半部分与所述间隔部位部分重叠，其下半部分超出所述间隔部位。
  10. 根据权利要求1所述的摄像模组结构，其特征在于，所述辅助电路板包括至少两层重叠的电路板，其中，下层电路板具有缺角，以形成所述去料部位，所述TOF器件设于上层电路板；所述上层电路板与下层电路板电连接，所述下层电路板与主板电连接。
  11. 电子设备，包括壳体和显示屏，所述壳体和/或显示屏设有摄像区域，所述摄像区域内设有摄像模组，其特征在于，所述摄像模组具有上述权利要求1至10中任一项所述的摄像模组结构。
  12. 摄像模组结构，包括主板、第一摄像模组、第二摄像模组以及飞行时间TOF器 件，所述TOF器件位于所述第一摄像模组与第二摄像模组之间，其特征在于，所述主板设有镂空的第一安装部和第二安装部，所述第一摄像模组和第二摄像模组分别设有支架并通过所述支架安装于所述第一安装部和第二安装部；所述主板具有将所述第一安装部和第二安装部分开的间隔部位，所述TOF器件设于辅助电路板的上表面，所述辅助电路板的宽度大于所述间隔部位的宽度，所述辅助电路板位于所述主板的上表面，其连接于所述主板并与所述间隔部位至少部分重叠；所述辅助电路板与所述第一摄像模组和/或第二摄像模组的支架相重叠的区域在下表面设有深度小于其厚度的去料部位，使所述辅助电路板局部悬空，并通过所述去料部位容置所述第一摄像模组和/或第二摄像模组的支架与之相重叠的部位。
  13. 根据权利要求12所述的摄像模组结构，其特征在于，相对于所述间隔部位，所述辅助电路板偏向于所述第一摄像模组或第二摄像模组，所述去料部位位于所述辅助电路板的一侧；
    或者，相对于所述间隔部位，所述辅助电路板居中设置，其两侧分别形成有所述去料部位。
  14. 根据权利要求13所述的摄像模组结构，其特征在于，所述去料部位位于所述辅助电路板下表面的边角区域，所述辅助电路板下表面的非去料部位呈“L”形或“⊥”形。
  15. 根据权利要求14所述的摄像模组结构，其特征在于，所述去料部位的长度为所述辅助电路板长度的1/2至4/5；和/或，所述去料部位的深度为0.2mm-0.5mm。
  16. 根据权利要求12所述的摄像模组结构，其特征在于，所述辅助电路板的下表面在非去料部位分布有焊点，并通过所述焊点与所述主板电连接。
  17. 根据权利要求12所述的摄像模组结构，其特征在于，所述辅助电路板的去料部位为非走线区域，所述辅助电路板的局部悬空部位为走线区域。
  18. 根据权利要求12所述的摄像模组结构，其特征在于，所述TOF器件与辅助电路板的厚度之和小于等于所述第一摄像模组、第二摄像模组超出所述主板的高度。
  19. 根据权利要求12所述的摄像模组结构，其特征在于，所述辅助电路板呈矩形，其上半部分与所述间隔部位部分重叠，其下半部分超出所述间隔部位。
  20. 根据权利要求12所述的摄像模组结构，其特征在于，所述辅助电路板包括至少两层重叠的电路板，其中，下层电路板具有缺角，以形成所述去料部位，所述TOF器件设于上层电路板；所述上层电路板与下层电路板电连接，所述下层电路板与主板电连接。
  21. 电子设备，包括壳体和显示屏，所述壳体和/或显示屏设有摄像区域，所述摄像区域内设有摄像模组，其特征在于，所述摄像模组具有上述权利要求12至20中任一项所述的摄像模组结构。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150371976A1 (en) * 2014-06-19 2015-12-24 E Ink Holdings Inc. Display apparatus, display module and pixel structure thereof
CN109683434A (zh) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 摄像模组阵列
CN109714516A (zh) * 2019-02-19 2019-05-03 昆山丘钛微电子科技有限公司 Tof摄像模组及电子产品
CN110233951A (zh) * 2018-03-06 2019-09-13 广东欧珀移动通信有限公司 摄像模组、摄像组件及电子装置
CN111567021B (zh) * 2018-03-20 2021-06-01 华为技术有限公司 一种终端
CN113726995A (zh) * 2021-08-12 2021-11-30 荣耀终端有限公司 摄像模组结构及电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101848871B1 (ko) * 2011-08-03 2018-04-13 엘지전자 주식회사 이동 단말기
CN108418915A (zh) * 2018-02-28 2018-08-17 广东欧珀移动通信有限公司 电子组件及电子设备
CN110798550A (zh) * 2019-06-28 2020-02-14 RealMe重庆移动通信有限公司 电子设备
CN110297378B (zh) * 2019-06-30 2021-08-17 Oppo广东移动通信有限公司 拍摄装置、电子设备及电子设备的控制方法
CN213661669U (zh) * 2020-08-17 2021-07-09 华为技术有限公司 电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150371976A1 (en) * 2014-06-19 2015-12-24 E Ink Holdings Inc. Display apparatus, display module and pixel structure thereof
CN109683434A (zh) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 摄像模组阵列
CN110233951A (zh) * 2018-03-06 2019-09-13 广东欧珀移动通信有限公司 摄像模组、摄像组件及电子装置
CN111567021B (zh) * 2018-03-20 2021-06-01 华为技术有限公司 一种终端
CN109714516A (zh) * 2019-02-19 2019-05-03 昆山丘钛微电子科技有限公司 Tof摄像模组及电子产品
CN113726995A (zh) * 2021-08-12 2021-11-30 荣耀终端有限公司 摄像模组结构及电子设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
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