WO2021068680A1 - 感光组件、摄像模组和终端设备 - Google Patents

感光组件、摄像模组和终端设备 Download PDF

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Publication number
WO2021068680A1
WO2021068680A1 PCT/CN2020/112142 CN2020112142W WO2021068680A1 WO 2021068680 A1 WO2021068680 A1 WO 2021068680A1 CN 2020112142 W CN2020112142 W CN 2020112142W WO 2021068680 A1 WO2021068680 A1 WO 2021068680A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive
sides
filter element
mounting area
camera module
Prior art date
Application number
PCT/CN2020/112142
Other languages
English (en)
French (fr)
Inventor
黄桢
栾仲禹
赵波杰
袁栋立
席逢生
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2021068680A1 publication Critical patent/WO2021068680A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • This application relates to the field of camera modules, in particular to photosensitive components, camera modules and terminal equipment.
  • the front camera module is an indispensable component.
  • the front camera module and the display screen of the terminal device are arranged on the same side to meet the needs of consumers such as selfies.
  • “full screen” terminal devices especially “full screen” mobile phones
  • the display screen must provide a shelter for the installation of the front camera module, which becomes an important limiting factor for increasing the "screen-to-body ratio”.
  • the main purpose of this application is to provide a photosensitive component, a camera module and a terminal device, wherein the camera module has a narrow side, when the camera module is configured as a front camera module and is connected to the terminal device
  • the narrow side of the camera module corresponds to the housing of the terminal device so that the camera module can be closer to the top side of the housing, thereby correspondingly
  • the size expansion of the display screen provides space to increase the "screen-to-body ratio" of the terminal device.
  • Another object of the present application is to provide a photosensitive component, camera module, and terminal equipment, wherein the circuit board is located on one side of the narrow side and/or the package is located on one side of the narrow side and/or The side of the outer lens barrel on the narrow side and/or the side of the filter element holder on the narrow side has a relatively small size, so that when the camera module is assembled in the terminal device The camera module can be closer to the top side of the housing, thereby correspondingly providing space for the size expansion of the display screen, so as to increase the "screen-to-body ratio" of the terminal device.
  • Another object of the present application is to provide a photosensitive component, a camera module, and a terminal device, wherein the photosensitive axis set by the photosensitive chip and the optical lens is offset from the center line set by the circuit board Shifted so that when the camera module is installed in the terminal device, the inner barrel of the optical lens is closer to the top side of the housing, so as to reduce the pair of inner barrel of the optical lens. Improve the impact of "screen-to-body ratio".
  • Another object of the present application is to provide a photosensitive component, a camera module, and a terminal device, wherein the package has a mounting area formed on the side surface of the package body for mounting the filter element, and the mounting area At least one side has a relatively smaller width compared to the other sides, so that the overall size of the filter element and the size of the mounting area can be reduced to reduce cost.
  • Another object of the present application is to provide a photosensitive component, a camera module, and a terminal device, wherein the package has a mounting area for filter elements formed on the inner side of the package, wherein the The side of the installation area located on the narrow side has a relatively smaller width than the other sides of the installation area.
  • the side of the filter element located on the narrow side is further applied.
  • An adhesive is applied between the surface and the inner side surface of the package body to improve the stability of the filter element installed in the installation area.
  • Another object of the present application is to provide a photosensitive component, a camera module, and a terminal device, wherein the adhesive is applied to the side surface of the filter element located on the narrow side and the inner part of the package body. Between the sides, such an application position is beneficial to prevent the adhesive from overflowing and contaminating the photosensitive chip.
  • Another object of the present application is to provide a photosensitive component, a camera module and a terminal device, wherein, applied to the filter element located between the side surface of the narrow side and the inner surface of the package body
  • the adhesive can be used as a buffer element to buffer the impact of the packaging body on the filter element caused by the impact of the terminal device.
  • An embodiment of the present application provides a photosensitive component, which includes:
  • a photosensitive chip electrically connected to the circuit board
  • adjacent two sides of the mounting area have a relatively smaller width than other sides.
  • the two opposite sides of the mounting area have a relatively smaller width than the other sides.
  • the side of the package body adjacent to the housing of the terminal device has a relatively smaller width than other sides of the package body so as to be set to form a narrow side.
  • the narrow side is configured to correspond to the housing of the terminal device, and the side with a relatively small width in the installation area is located on the narrow side.
  • the photosensitive assembly further includes a filter element attached to the mounting area.
  • the filter element is attached to the mounting area of the package body through the adhesive, and the adhesive applied to the mounting area has The other side with a relatively large width.
  • the adhesive is further applied to the side surface of the filter element corresponding to one or both sides having a relatively small width in the mounting area and the package body Between the inner sides.
  • the filter element corresponding to the side surface of one or both sides having a relatively small width in the mounting area and the inner surface of the package body.
  • the adhesive and the adhesive applied to the other side having a relatively large width in the mounting area are two different adhesives, and the adhesive applied to the filter element corresponds to that in the mounting area
  • the adhesive between the side surface of one or both sides of the relatively small width and the inner surface of the package has relatively low fluidity.
  • one or both sides of the installation area with a relatively small width are retracted toward the housing of the terminal device to the side with a relatively small width in the installation area
  • the two sides are on the same plane as the inner side surface of the package body, so that the width dimension of one or two sides with a relatively small width in the mounting area is zero.
  • the optical axis set by the photosensitive chip, the filter element and the optical lens are offset from the central axis of the circuit board.
  • the photosensitive assembly further includes a filter element and a filter element holder, the filter element holder is mounted on the upper surface of the package, and the filter element holder includes The inner side surface of the filter element holder is used for the mounting area of the filter element, and at least one side of the mounting area has a relatively smaller width than the other sides.
  • adjacent two sides of the mounting area have a relatively smaller width than other sides.
  • the two opposite sides of the mounting area have a relatively smaller width than the other sides.
  • the side of the package body adjacent to the housing of the terminal device has a relatively smaller width than other sides of the package body so as to be set to form a narrow side.
  • the narrow side is configured to correspond to the housing of the terminal device, and the side with a relatively small width in the mounting area is located on the narrow side .
  • the photosensitive component further includes an adhesive, the filter element is attached to the attachment area of the filter element holder by the adhesive, and the adhesive is applied The other side having a relatively large width in the mounting area.
  • the adhesive is further applied to the side surface of the filter element corresponding to one or both sides having a relatively small width in the mounting area and the filter element. Between the inner sides of the light element holder.
  • the adhesive between the adhesive and the adhesive applied on the other side with a relatively large width in the mounting area are two different adhesives, and the adhesive applied to the filter element corresponds to the
  • the adhesive between the side surface of one or two sides with a relatively small width in the mounting area and the inner surface of the filter element holder has relatively low fluidity.
  • one or both sides of the mounting area with a relatively small width are retracted toward the housing of the terminal device to the mounting area with a relatively small width.
  • One or both sides are in the same plane as the inner side of the filter element holder, so that the width dimension of the side or the two sides with a relatively small width in the mounting area is zero.
  • the package body is integrally formed on the circuit board and integrally covers at least a part of the circuit board and at least a part of the non-photosensitive area of the photosensitive chip.
  • the package body is integrally molded on the circuit board and integrally covers at least a part of the circuit board.
  • the photosensitive component further includes at least one electronic component, and the at least one electronic component is disposed on the other side of the circuit board than the narrow side.
  • the photosensitive component further includes at least one lead for electrically connecting the photosensitive chip and the circuit board, and the lead is disposed in the circuit board other than the narrow side. On the other side.
  • the photosensitive component further includes at least one lead for electrically connecting the photosensitive chip and the circuit board, and part of the at least one lead is disposed in the circuit board and located in the narrow One side of the side and other parts of the leads are arranged on the other side of the circuit board that is not located on the side of the narrow side.
  • a camera module which includes:
  • the optical lens is held in the photosensitive path of the photosensitive component.
  • the optical lens includes at least one optical lens, an inner barrel for mounting the at least one optical lens therein, and an outer lens for supporting the inner barrel Wherein a side of the outer lens barrel located on the narrow side has a relatively smaller width dimension than other sides of the outer lens barrel.
  • the camera module further includes a drive element, wherein the drive element is mounted on the upper surface of the package, and the optical lens is mounted on the drive element so that the The optical lens is held in the photosensitive path of the photosensitive component, wherein the side of the driving element on the narrow side has a smaller width than the other side of the driving element.
  • a terminal device which includes:
  • a display screen mounted on the housing, and
  • FIG. 1 illustrates a partial schematic diagram of a conventional front camera module installed in a terminal device.
  • Fig. 2 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • FIG. 3 illustrates a schematic diagram of the layout of the camera module installed on a terminal device according to an embodiment of the present application.
  • Fig. 4 illustrates a schematic diagram of a photosensitive component of the camera module according to an embodiment of the present application.
  • Fig. 5 illustrates a schematic top view of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 6A illustrates a schematic top view of a modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 6B illustrates a schematic top view of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 6C illustrates a schematic top view of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • Fig. 6D illustrates a schematic top view of yet another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 7 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 8 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 9 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 10 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 11 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 12 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 13 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 14 illustrates a comparison diagram of an existing camera module assembled in a terminal device and the camera module based on an embodiment of the present application is assembled in the terminal device.
  • full screen terminal devices especially “full screen” mobile phones
  • the display screen Since the front camera module and the display screen are installed on the same side of the terminal equipment, the display screen must provide a shelter for the installation of the front camera module, which causes the front camera module to become an important limiting factor for increasing the "screen-to-body ratio” .
  • FIG. 1 illustrates a partial schematic diagram of a conventional front camera module installed in a terminal device.
  • the camera module 10 (a fixed-focus camera module is taken as an example here, of course, the camera module can also be implemented as a dynamic-focus camera module), including: a circuit board 11, electrically connected to the circuit board 11 at least one electronic component 12, electrically connected to the photosensitive chip 13 of the circuit board 11, a bracket 14 arranged on the circuit board 11, a filter element 15 supported on the bracket 14, an optical lens 16 supported on the bracket 14,
  • the optical lens 16 includes at least one optical lens, an inner barrel 162 installed with at least one optical lens, and an outer barrel 163 installed outside the inner barrel 162.
  • the display screen 21 of the terminal device 20 is provided with an opening 210.
  • the opening 210 is located adjacent to the top side of the housing 22 of the terminal device 20.
  • the top side of the housing hereinafter referred to as "top frame”
  • the camera module 10 is installed adjacent to the top frame, so that the optical lens 16 of the camera module 10 corresponds to the opening 210, thereby allowing the camera module 10 to collect imaging light from the outside through the opening 210 .
  • the structure and arrangement of the existing camera module 10 limit the increase in the "screen-to-body ratio" of the terminal device.
  • the existing circuit board 11, the photosensitive chip 13, the filter element 15, the bracket 14, and the optical lens 16 generally have a center-symmetrical shape, and the center of the circuit board 11 is taken as a reference. It should be observed that in the existing camera model, the distance between the side of the circuit board 11 near the top frame, the side of the bracket 14 near the top frame, the side of the outer lens barrel 163 near the top width and the center of the circuit board It is consistent with the distance between the other side and the center of the circuit board.
  • Such a structural configuration makes: when the camera module 10 is installed on the terminal device 20, the camera module 10 cannot be closer to the top frame of the terminal device 20, that is, the display screen 21 cannot be more toward the top frame. Extend the extension to increase the "screen-to-body ratio".
  • the inner lens barrel 162 is close to the top frame, the top frame, the upper area of the outer lens barrel 163, and the transparent cover of the display 21 A blank area is defined between them.
  • the filter element 15, the outer lens barrel 163, and the inner lens barrel 162 of the existing camera module 10 are centered symmetrically (or close to center symmetrical) with the center point of the photosensitive chip 13 as the axis.
  • the photosensitive chip 12 is mounted on the central area of the circuit board 11 so that the filter element 15, the outer lens barrel 163 and the inner lens barrel 162 are arranged symmetrically with respect to the center line of the circuit board 11 (or close to center symmetry).
  • Such a structure and arrangement prevent the inner lens barrel 161 from extending toward the top frame to occupy more blank area, that is, the blank area has a larger space.
  • the side of the inner lens barrel 162 adjacent to the top frame prevents the display screen 21 from expanding toward the top frame, so as to limit the increase in the "screen-to-body ratio".
  • the filter element 15 is a sensitive and expensive component in the camera module.
  • the width dimension of the installation area of the filter element 15 needs to be reduced from the existing 0.2 mm to about 0.1 mm.
  • the basic idea of the present application is to set the side of the camera module adjacent to the top side of the terminal device as a narrow side, so that when the camera module is configured as a front camera
  • the narrow side of the camera module corresponds to the housing of the terminal device so that the camera module can be closer to the top of the housing.
  • Side so as to relatively provide space for the size expansion of the display screen, so as to increase the "screen-to-body ratio" of the terminal device.
  • the package body has a mounting area formed on the side surface of the package body for mounting the filter element, wherein at least one side of the mounting area is configured to have a relatively smaller width than the other sides, In order to reduce the overall size of the filter element and the size of the installation area.
  • the present application proposes a camera module, which includes a photosensitive component and an optical lens held in a photosensitive path of the photosensitive component.
  • the photosensitive component includes a circuit board, a photosensitive chip electrically connected to the circuit board, and a package provided on the circuit board, wherein the package has at least a photosensitive chip corresponding to the photosensitive chip.
  • the width of the package is relatively small compared to the other side of the package, so that the side of the package body adjacent to the housing of the terminal device has a relatively smaller width dimension to form a narrow side, so that when When the camera module is assembled in the terminal device, the distance between the camera module and the housing of the terminal device can be reduced. In this way, the display screen of the terminal device is allowed to extend toward the top side of the housing of the terminal device to increase the "screen-to-body ratio".
  • the camera module 30 based on the embodiment of the present application is illustrated.
  • the camera module 30 is configured as the front camera module 30 of the terminal device 80 (for example, a smart phone), which is installed on the same side as the display screen 81 of the terminal device 80 for use in Meet the needs of users such as selfies.
  • the terminal device 80 for example, a smart phone
  • one side of the camera module 30 is configured as the narrow side 100.
  • the narrow side of the camera module 30 corresponds to the housing 82 of the terminal device 80, so that the camera module 30 can be closer to the top side of the housing 82 to relatively provide space for the size of the display screen 81 to increase
  • the "screen-to-body ratio" of the terminal device 80 is described.
  • the camera module 30 includes an optical lens 40 and a photosensitive component 50, wherein the optical lens 40 is held in the photosensitive path of the photosensitive component 50.
  • the photosensitive component 50 includes a circuit board 51, a photosensitive chip 52 electrically connected to the circuit board 51, and a package body 53 disposed on the circuit board 51, wherein the package body 53 has a package corresponding to the photosensitive chip
  • the light window 531 of at least the photosensitive area of the chip 52 allows external light to pass through the light window 531 to be received by the photosensitive area of the photosensitive chip 52 and perform an imaging reaction.
  • the side of the package body 53 adjacent to the housing 82 of the terminal device 80 has a relatively smaller size than the other sides of the package body 53.
  • the width dimension is set to form the narrow side 100.
  • the narrow side 100 of the camera module 30 represents a certain side direction of the camera module 30 and does not specifically refer to a certain side or a certain side of the camera module 30. One side.
  • the photosensitive chip 52 is no longer mounted on the central area of the circuit board 51, that is, In other words, the center of the photosensitive area of the photosensitive chip 52 is offset from the center of the circuit board 51.
  • the distance between the side of the circuit board 51 on the narrow side 100 and the center is less than that of the circuit board 51 The distance between the other side and the center.
  • the camera module 30 in the process of configuring the camera module 30 to form the narrow side 100 (the purpose is to increase the "screen-to-body ratio" of the terminal device 80), the camera The shape, size and installation method of the components (for example, the circuit board 51, the photosensitive chip 52, the package body 53, etc.) in the module 30 need to be adjusted accordingly.
  • the package body 53 is integrally formed on the circuit board 51 through an integral molding process to form an integral bracket.
  • the package body 53 is integrally molded on the circuit board 51 through the MOC (Molding On Chip) process to integrally cover at least a part of the circuit board 51 and the circuit board 51.
  • the side of the package body 53 located on the narrow side 100 has a relatively small width dimension.
  • the package body 53 includes a mounting area 532 formed on the inner side surface 530 of the package body 53 and used for mounting the filter element 54.
  • the inner side surface 530 of the package body 53 is a stepped surface, so that the mounting area 532 is formed at the turning point of the stepped surface, and the inner side surface 530
  • the top area of the light-sensitive chip 52 forms the light window 531 for guiding external light into the light-sensitive area of the light-sensitive chip 52.
  • At least one side of the mounting area 532 has a relatively smaller width compared to the other sides, so that the overall size and mounting size of the filter element 54 can be reduced to reduce cost.
  • the width of the shorter side is less than or equal to 0.1 mm.
  • the side of the installation area 532 located on the narrow side 100 has a relatively smaller width than the other sides of the installation area 532 .
  • the mounting method of the filter element 54 is adjusted.
  • the adhesive 55 is applied to the other side having a relatively large width in the mounting area 532, that is, it is not located on the other side of the narrow side 100, and not on the other side.
  • the adhesive 55 is applied to the surface of the mounting area 532 on one side of the narrow side 100, so that when the filter element 54 is stacked on the mounting area 532, the adhesive 55 is placed in the mounting area 532.
  • the adhesive 55 is not applied to the surface on the side of the narrow side 100, so there is no need to worry about the adhesive 55 overflowing there and causing the photosensitive chip 52 to be contaminated. At the same time, since the mounting area 532 The adhesive 55 is applied to the surface on the other side of the narrow side 100 in Central Africa, which can also provide a relatively stable support for the filter element 54.
  • the supporting strength provided for the filter element 54 on the other side of the mounting area 532 that is not located on the narrow side 100 can make the filter element 54 parallel to all sides. Mentioned photosensitive chip 52.
  • the supporting strength provided by the other side of the mounting area 532 that is not located on the narrow side 100 cannot make the filter element 54 parallel to the photosensitive chip 52 In fact, a slight tilt occurs, and the slight tilt does not have much impact on the imaging quality of the camera module 30.
  • the embodiment of the present application there is no specific and strict requirement for the support strength provided by the other side of the installation area 532 that is not located on the narrow side 100, and it only needs to be able to satisfy the filter It is sufficient that the light element 54 is stably supported on the mounting area 532. That is to say, in the embodiment of the present application, the application amount, width, length, application route and other parameters of the adhesive 55 applied to the other side of the installation area 532 other than the narrow side 100 are combined. There is no strict restriction, and it only needs to be able to support the filter element 54 stably on the mounting area 532.
  • the installation area 532 has a "mouth” shape, wherein the other three sides of the installation area 532 that are not located on the narrow side 100 are connected end to end. It has a "U” shape, and the side of the installation area 532 located on the narrow side 100 has a "one" shape.
  • the width of the side of the installation area 532 located on the narrow side 100 is smaller than the width of the other three sides of the installation area 532 that are not located on the narrow side 100.
  • the adhesive 55 applied to the other three sides of the installation area 532 that are not located on the narrow side 100 has a U-shape.
  • the adhesive 55 may be applied end to end on the other three sides of the installation area 532 that are not located on the narrow side 100.
  • the lower surface of the filter element 54 can be sufficiently aligned with the other three sides of the mounting area 532 that are not located on the narrow side 100.
  • the adhesive 55 is in contact with each other to provide a relatively stable bonding strength after curing.
  • the adhesive 55 is applied to the shape formed by the mounting area 532 on the other three sides that are not located on the narrow side 100.
  • This application is limited.
  • the adhesives 55 applied to the other three sides of the installation area 532 that are not located on the narrow side 100 may be intermittent with each other, as shown in FIG. 6A.
  • the adhesive 55 may also be applied only to two sides of the installation area 532 that are not located on the other three sides of the narrow side 100 symmetrically distributed.
  • the side surface of the filter element 54 located on the narrow side 100 and the inner side of the package body 53 are further provided.
  • the adhesive 55 is applied between the side surfaces 530 to bond the filter element 54 to the inner side surface 530 of the package body 53 through the adhesive 55. It should be understood that when the filter element 54 is adhered by the adhesive 55 applied to the side surface of the filter element 54 between the side surface of the narrow side 100 and the inner side surface 530 of the package body 53 When connected to the inner surface of the package body 53, the filter element 54 completely seals the light window 531 of the package body 53 to prevent external dirt from entering the photosensitive window along the light window 531.
  • the inside of the component 50 causes the photosensitive chip 52 to be contaminated.
  • the adhesive 55 applied between the side surface of the narrow side 100 of the filter element 54 and the inner side surface 530 of the package body 53 can serve as a buffer element to buffer the package body 53 The impact on the filter element 54 caused by the impact of the terminal device 80.
  • the adhesive 55 applied to the other side of the mounting area 532 other than the narrow side 100 and the adhesive 55 applied to the filter element 54 are
  • the adhesive 55 between the side surface of the narrow side 100 and the inner surface 530 of the package body 53 can be implemented as the same adhesive 55.
  • the adhesive 55 between the side surface of the side 100 and the inner side 530 of the encapsulation body 53 can be implemented as different kinds of adhesives 55, wherein, preferably, applied to the filter element 54 located in the The fluidity of the adhesive 55 between the side surface of the narrow side 100 and the inner surface 530 of the package body 53 is relatively low.
  • Fig. 6B illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the two opposite sides of the installation area 532 have a relatively smaller width than the other sides. That is, in this modified embodiment, in addition to the narrow side 100, the side opposite to the narrow side 100 also has a relatively small width dimension. That is to say, in this modified implementation, the opposite sides of the installation area 532 with a smaller width are in a "two" shape.
  • the The way of applying the adhesive 55 is: the adhesive 55 is applied to the other side having a relatively large width in the mounting area 532, and the application of the adhesive 55 to the filter element 54 corresponds to that in the mounting area 532. Between the side surfaces on two opposite sides of the smaller width and the inner side surface 530 of the package body 53.
  • the filter element 54 is applied to the side surfaces of the filter element 54 corresponding to the two opposite sides of the mounting area 532 having a relatively small width and the inner side surface of the package body 53
  • the adhesive 55 between 530 has relatively low fluidity.
  • Fig. 6C illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the adjacent two sides of the installation area 532 have a relatively smaller width than the other sides. That is, in this modified embodiment, in addition to the narrow side 100, the side adjacent to the narrow side 100 also has a relatively small width dimension. As shown in FIG. 6C, in this modified implementation, in addition to the narrow side 100, the side adjacent to the narrow side 100 also has a relatively small width dimension.
  • Font adjacent two sides with a smaller width in the installation area 532 are Font, that is, the side adjacent to the narrow side 100 is located above the narrow side 100, so that when the camera assembly 30 is assembled in a terminal device, the camera module 30 can be as large as possible It is placed in the upper left corner of the terminal device 80 to improve the aesthetics of the terminal device.
  • the The way of applying the adhesive 55 is: the adhesive 55 is applied to the other side having a relatively large width in the mounting area 532, and the application of the adhesive 55 to the filter element 54 corresponds to that in the mounting area 532. Between the side surfaces of two adjacent sides with a smaller width and the inner side surface 530 of the package body 53. It is worth mentioning that in this modified implementation, applied to the side surfaces of the filter element 54 corresponding to the two adjacent sides with relatively small widths in the mounting area 532 and the inner side of the package body 53 The adhesive 55 between the sides 530 has relatively low fluidity.
  • Fig. 6D illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the adjacent two sides of the installation area 532 have a relatively smaller width than the other sides. That is, in this modified embodiment, in addition to the narrow side 100, the side adjacent to the narrow side 100 also has a relatively small width dimension. As shown in FIG. 6D, in this modified implementation, in addition to the narrow side 100, the side adjacent to the narrow side 100 also has a relatively small width dimension.
  • Font adjacent two sides with a smaller width in the installation area 532 are Font, that is, the side adjacent to the narrow side 100 is located above the narrow side 100, so that when the camera assembly 30 is assembled in a terminal device, the camera module 30 can be as large as possible It is placed in the upper right corner of the terminal device 80 to improve the aesthetics of the terminal device.
  • the The way of applying the adhesive 55 is: the adhesive 55 is applied to the other side having a relatively large width in the mounting area 532, and the application of the adhesive 55 to the filter element 54 corresponds to that in the mounting area 532. Between the side surfaces of two adjacent sides with a smaller width and the inner side surface 530 of the package body 53. It is worth mentioning that in this modified implementation, applied to the side surfaces of the filter element 54 corresponding to the two adjacent sides with relatively small widths in the mounting area 532 and the inner side of the package body 53 The adhesive 55 between the sides 530 has relatively low fluidity.
  • FIG. 7 illustrates a schematic diagram illustrating still another modified implementation of the photosensitive assembly 50 according to an embodiment of the present application.
  • the side of the installation area 532 located on the narrow side 100 is retracted into the installation area 532 toward the top side of the housing 82 of the terminal device 80
  • the side on the narrow side 100 is flush with the inner side of the package body 53 on the narrow side 100. That is, in this modified implementation, the side of the mounting area 532 located on the narrow side 100 and the inner side of the package body 53 located on the narrow side 100 are on the same plane, so that the The width dimension of the side of the installation area 532 located on the narrow side 100 is zero.
  • the inner surface of the package body 53 located on the narrow side 100 extends vertically upward with respect to the upper surface of the circuit board 51 instead of bending upward to form a stepped surface.
  • the filter element 54 is applied to the filter element 54 between the side surface of the narrow side 100 and the inner surface 530 of the package body 53 by the adhesive The agent 55 is adhered to the inner surface 530 of the package body 53.
  • the installation area 532 is implemented as shown in FIGS.
  • the two sides of the installation area 532 with relatively small width dimensions can face the The top side of the housing 82 of the terminal device 80 is retracted so that the two sides with a relatively small width in the installation area 532 are flush with the inner side of the package body 53.
  • this application is not limited.
  • FIG. 8 illustrates a schematic diagram of another modified implementation of the photosensitive assembly 50 according to an embodiment of the present application.
  • the photosensitive assembly 50 further includes a filter element holder 56, wherein the filter element holder 56 is mounted on the upper surface of the package body 53 for mounting the The filter element 54 is thereon.
  • the filter element holder 56 includes a mounting area 561 formed on the inner side surface 560 of the filter element holder 56 and used for mounting the filter element 54.
  • at least one side of the mounting area 561 has a relatively smaller width than the other sides.
  • the side of the mounting area 561 located on the narrow side 100 has a smaller width than the other sides of the mounting area 561.
  • the adhesive 55 is applied to the mounting area 561 on the other side than the narrow side 100.
  • the adhesive 55 is not applied to the surface on the side of the narrow side 100 in the mounting area 561, so that when the filter element 54 is stacked on the mounting area 561, the The adhesive 55 is not applied to the surface of the mounting area 561 on the side of the narrow side 100, so there is no need to worry about the adhesive 55 overflowing there and causing the photosensitive chip 52 to be contaminated.
  • due to Applying the adhesive 55 to the surface of the mounting area 561 on the other side than the narrow side 100 can also provide a relatively stable support strength for the filter element 54.
  • the mounting area 561 has a "mouth” shape, wherein the other three sides of the mounting area 561 that are not located on the narrow side 100 are connected end to end to form " U" shape, the side of the mounting area 561 located on the narrow side 100 has a "one" shape, wherein the mounting area 561 is located on the side of the narrow side 100
  • the width of is smaller than that of the mounting area 561 on the other three sides that are not located on the narrow side 100.
  • the adhesive 55 applied to the mounting area 561 on the other three sides other than the narrow side 100 has a U-shape.
  • the adhesive 55 can be connected end to end.
  • the adhesive 55 is applied to the other three sides of the mounting area 561 that are not located on the narrow side 100. In this way, when the filter element 54 is stacked in the mounting area 561, the lower surface of the filter element 54 can be fully compatible with other parts of the mounting area 561 that are not located on the narrow side 100.
  • the adhesives 55 on the three sides are in contact with each other to provide relatively stable support strength after curing.
  • the adhesive 55 is applied to the shape formed by the mounting area 561 on the other three sides other than the narrow side 100, and Not limited by this application.
  • the adhesives 55 applied to the other three sides of the mounting area 561 that are not located on the other three sides of the narrow side 100 may be intermittent with each other.
  • the adhesive 55 may also be applied only to the symmetrically distributed two sides of the mounting area 561 that are not located on the other three sides of the narrow side 100.
  • the filter element 54 may be further located between the side surface of the narrow side 100 and the inner side 560 of the filter element holder 56
  • the adhesive 55 is applied to bond the filter element 54 to the inner surface 560 of the filter element holder 56 through the adhesive 55. It is worth mentioning that, in the implementation of this modification, the adhesive 55 applied to the mounting area 561 other than the side of the narrow side 100 and applied to the filter element 54 are located in The adhesive 55 between the side surface of the narrow side 100 and the inner side 560 of the filter element holder 56 can be implemented as the same adhesive 55.
  • the adhesive 55 between the side surface of the side 100 and the inner surface 560 of the filter element holder 56 can be implemented as a different kind of adhesive 55, wherein the adhesive 55 applied to the filter element 54 is located in the The fluidity of the adhesive 55 between the side surface of the narrow side 100 and the inner surface 560 of the filter element holder 56 is relatively poor.
  • the adjacent two sides of the mounting area 561 have a relatively smaller width than the other sides, that is, except for the side located on the narrow side 100, and The side adjacent to the narrow side 100 also has a relatively small width.
  • the two opposite sides of the mounting area 561 have a relatively smaller width than the other sides, that is, except for the side located on the narrow side 100, and the side located on the narrow side 100
  • the opposite side also has a relatively small width, which is not limited by this application.
  • FIG. 9 illustrates a schematic diagram illustrating another modified implementation of the photosensitive assembly 50 according to an embodiment of the present application, wherein the embodiment shown in FIG. 9 is a modified implementation of the embodiment shown in FIG. 8.
  • the side of the mounting area 561 located on the narrow side 100 is retracted in the direction of the narrow side 100 to the mounting area 561 located in the direction of the narrow side 100.
  • the side of the narrow side 100 is flush with the inner side of the filter element holder 56 located on the narrow side 100. That is, in this modified implementation, the side of the mounting area 561 located on the narrow side 100 and the inner surface of the filter element holder 56 located on the narrow side 100 are on the same plane.
  • the width dimension of the side of the mounting area 561 located on the narrow side 100 is zero.
  • the inner surface of the filter element holder 56 located on the narrow side 100 extends vertically upward with respect to the upper surface of the package body 53 instead of bending upward to form a stepped surface.
  • the filter element 54 is applied to the filter element 54 between the side surface of the narrow side 100 and the inner surface 560 of the filter element holder 56.
  • the adhesive 55 is adhered to the inner surface 560 of the filter element holder 56.
  • the camera module 30 forms the structural configuration of the narrow side 100, and also affects at least one electronic component 57 (including but not limited to resistors, capacitors, inductors, etc.) provided on the circuit board 51. Make an impact.
  • the at least one electronic component 57 is disposed on the circuit board.
  • the central part of the plate 51 is located on the other side of the narrow side 100.
  • the at least one electronic component 57 is arranged on the two sides of the circuit board 51 that are symmetrical to each other out of the other sides that are not located on the narrow side 100.
  • a small amount of the electronic components 57 can also be arranged on the side of the circuit board 51 located on the narrow side 100. This is not the case. This application is limited.
  • the structure of the narrow side 100 is formed corresponding to the camera module 30, and the at least one lead
  • the layout of 58 also needs to be adjusted. Specifically, since the width dimension of the circuit board 51 on the side of the narrow side 100 is relatively small, preferably, as shown in FIG. 4, in the embodiment of the present application, the at least one lead 58 It is arranged on the other side of the circuit board 51 than the narrow side 100. More preferably, in the embodiment of the present application, the at least one lead 58 is arranged on two sides of the circuit board 51 that are symmetrical to each other out of the other sides that are not located on the narrow side 100.
  • a small amount of the leads 58 can also be arranged on the side of the circuit board 51 located on the narrow side 100 (as shown in FIG. 10), In this regard, this application is not limited.
  • the type of the lead 58 is not limited by this application.
  • the lead 58 may be a gold wire, a silver wire, or a copper wire.
  • the lead 58 can be installed between the circuit board 51 and the photosensitive chip 52 through a process of "golding wire” to achieve electrical connection between the two.
  • the "golden thread” process is generally divided into two types: the “positive gold thread” process and the “reverse gold thread” process.
  • the "positive gold wire” process means that in the process of laying out the leads 58, one end of the lead 58 is first formed on the conductive end of the circuit board 51, and then the lead 58 is bent and extended, and finally The other end of the lead 58 is formed on the conductive end of the photosensitive chip 52. In this way, the lead 58 is formed between the photosensitive chip 52 and the circuit board 51.
  • the "reverse gold wire” process means that in the process of laying out the leads 58, one end of the lead 58 is first formed on the conductive end of the photosensitive chip 52, and then the lead 58 is bent and extended, and finally The other end of the lead 58 is formed on the conductive end of the circuit board 51.
  • the lead 58 is formed between the photosensitive chip 52 and the circuit board 51. It is worth mentioning that the height of the upward protrusion of the lead 58 formed by the "reverse gold wire” process is relative to the height of the upward protrusion of the lead 58 formed by the "positive gold wire” process. Therefore, preferably, In this specific implementation, the lead 58 is formed by using the "reversed gold wire” process.
  • the photosensitive chip 52 and the circuit board 51 can be connected in other ways (the lead 58 may not be used), for example, a back Turn-on technical solutions.
  • this application is not limited.
  • FIG. 11 illustrates a schematic diagram of another modified implementation of the photosensitive assembly 50 according to an embodiment of the present application, in which the embodiment shown in FIG. 11 is a modified implementation of the embodiment illustrated in FIG. 8.
  • the package body 53 is integrally formed on the circuit board 51 through an integral molding process.
  • the package body 53 is integrally molded on the circuit board 51 through a MOB (Molding On Board) process, and integrally covers at least a part of the circuit board 51, and the filter The element 54 is installed in the mounting area 561 between the filter elements 54.
  • MOB Manufacturing On Board
  • FIG. 12 illustrates a schematic diagram of another modified implementation of the photosensitive assembly 50 according to an embodiment of the present application, wherein the embodiment shown in FIG. 12 is a modified implementation of the embodiment illustrated in FIG. 10.
  • the package body 53 is integrally formed on the circuit board 51 through an integral molding process.
  • the package body 53 is integrally molded on the circuit board 51 through a MOB (Molding On Board) process, and integrally covers at least a part of the circuit board 51, and part of the lead 58 and/or part of the electronic components 57 are arranged on the side of the circuit board 51 located on the narrow side 100.
  • MOB Manufacturing On Board
  • FIG. 13 illustrates a schematic diagram of another modified implementation of the photosensitive assembly 50 according to an embodiment of the present application, wherein the embodiment shown in FIG. 13 is a modified implementation of the embodiment illustrated in FIG. 4.
  • the package body 53 is integrally formed on the circuit board 51 through an integral molding process.
  • the package body 53 is integrally molded on the circuit board 51 through a MOB (Molding On Board) process, and integrally covers at least a part of the circuit board 51, and the filter The component 54 is mounted on the mounting area 532 formed by the package body 53.
  • MOB Manufacturing On Board
  • the optical lens is mounted on the upper surface of the package body 53, it should be understood that when at least one side of the mounting area 532 is compared with other The side has a relatively small width, and the width of the upper surface of the package body 53 for mounting the optical lens 40 can be relatively increased.
  • the width of the upper surface of the package body 53 for mounting the optical lens 40 can also be reduced as long as it can support the optical lens 40.
  • the optical lens 40 includes: at least one optical lens 41, an inner lens barrel 42 for installing the at least one optical lens 41 therein, and for supporting the The outer lens barrel 43 of the inner lens barrel 42, wherein a side of the outer lens barrel 43 located on the narrow side 100 has a relatively smaller width than the other sides of the outer lens barrel 43.
  • the inner barrel 42 of the optical lens 40 can be integrated into the housing of the terminal device 80.
  • the top side direction of 82 extends to occupy a relatively larger blank area formed between the inner barrel 42 and the top side of the terminal device 80 housing 82, thereby allowing the display screen 81 to face all directions.
  • the housing 82 of the terminal device 80 extends in the top side direction to increase the "screen-to-body ratio".
  • the cross-section of the optical lens 40 has a "D" shape, that is, the side of the outer lens barrel 43 located on the narrow side 100 is compared with the outer lens The other side of the barrel 43 has a relatively small width dimension.
  • the optical lens 40 can also be implemented in other shapes, which is not limited by this application.
  • the photosensitive component 50 based on the embodiment of the present application is clarified, wherein the camera module 30 has a narrow side 100, so that when the camera module 30 is configured as a front camera module 30 and is connected to the terminal
  • the camera module 30 can be closer to the top side of the housing 82, thereby relatively providing space for the size expansion of the display screen 81 to improve the The "screen-to-body ratio" of the terminal device 80.
  • the camera module 30 is implemented as a fixed-focus camera module 30 as an example above, a person of ordinary skill in the art should understand that in other examples of this application, the camera module 30 also It may include a dynamic focus camera module 30 or an optical image stabilization camera module 30.
  • the camera module 30 when the camera module 30 is implemented as a dynamic focus camera module 30, the camera module 30 further includes a driving element, wherein the driving element is mounted on the upper surface of the package body 53, so The optical lens 40 is mounted on the driving element so that the optical lens 40 is held in the light-sensing path of the light-sensing component 50.
  • the width dimension of the driving element on the side of the narrow side 100 is smaller than that of the other sides of the driving element.
  • the camera module 30 when the camera module 30 is implemented as an optical anti-shake camera module 30, the camera module 30 further includes an anti-shake motor, wherein the anti-shake motor is mounted on the package body 53 On the surface, the optical lens 40 is mounted on the anti-shake motor, so that the optical lens 40 is held in the photosensitive path of the photosensitive component 50.
  • the side of the anti-shake motor located on the narrow side 100 has a smaller width than the other sides of the driving element.
  • the package body 53 is integrally formed on the circuit board 51 as an example, a person of ordinary skill in the art should understand that, in other examples of the present application, the package body 53 may also be implemented as a plastic bracket, which is prefabricated and mounted on the circuit board 51 at a preset position through a COB process. In particular, in this example, the side of the plastic bracket located on the narrow side 100 has a relatively small width dimension.
  • FIGS. 6 to 13 illustrate some modified implementation types of the photosensitive component 50 of the camera module 30 in the embodiment of the present application
  • FIGS. 6 to 13 The modified ideas shown in 13 can be combined with each other to form more modified implementations. Since they are only simple permutations and combinations, they will not be repeated here.
  • a terminal device is also provided.
  • the terminal device 80 is taken as an example of a smart phone.
  • the terminal device 80 may also be implemented as other types.
  • the terminal device 80 for example, a tablet computer, a laptop computer, etc.
  • the terminal device 80 includes: a housing 82, a display screen 81 installed on the housing 82, and, as described above, the camera module 30, wherein the camera module 30 and The display screen 81 is assembled on the same side of the terminal device 80 to be configured as the front camera module 30 of the terminal device 80.
  • the camera module 30 has a narrow side 100, wherein when the camera module 30 is configured as a front camera module 30 and is connected to the display screen of the terminal device 80 When 81 is mounted on the same side, the narrow side 100 of the camera module 30 is adjacent to the top side of the housing 82, so that the camera module 30 can be closer to the top side of the housing 82, Therefore, a space is relatively provided for the size expansion of the display screen 81 to increase the "screen-to-body ratio" of the terminal device 80.
  • FIG. 14 illustrates a comparison schematic diagram of the existing camera module 30 assembled in the terminal device 80 and the camera module 30 based on the embodiment of the present application is assembled in the terminal device 80.
  • the center line of the circuit board 51 coincides with the optical axis formed by the photosensitive chip 52 and the optical lens 40.
  • the circuit board The center line of 51 is offset from the optical axis formed by the photosensitive chip 52 and the optical lens 40, so that the camera module 30 provided by the present application can be more closely mounted on the housing 82
  • the top side relatively provides space for the size of the display screen 81 to expand, so as to increase the "screen-to-body ratio" of the terminal device 80.
  • the camera module 30 provided in the present application can provide a laterally extending space of size d for the expansion of the display screen 81, where the distance d represents the line
  • the plate is located on the side of the narrow side (and/or the package body is located on the side of the narrow side and/or the outer lens barrel is located on the side of the narrow side and/or the filter element holder is located on the side of the narrow side).
  • the side of the narrow side) on the narrow side 100 is reduced in width dimension d1 and the center line (optical axis) of the optical lens 40 of the existing camera module 30 and the camera module 30 provided in the present application
  • the terminal device 80 uses the above-mentioned camera module 30 as its front camera module 30 to increase the "screen-to-body ratio" of the terminal device 80.

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Abstract

本申请公开了一种感光组件、摄像模组和终端设备。所述摄像模组具有窄边侧，其中，当所述摄像模组被配置为前置摄像模组并与终端设备的显示屏安装于同一侧时，所述摄像模组的所述窄边侧对应于所述终端设备的壳体，以使得所述摄像模组能够更邻近于所述壳体的顶侧，从而相应地为所述显示屏的尺寸扩展提供空间，以提高所述终端设备的"屏占比"。

Description

感光组件、摄像模组和终端设备 技术领域
本申请涉及摄像模组领域，尤其涉及感光组件、摄像模组和终端设备。
背景技术
随着移动电子设备的普及，被应用于移动电子设备用于帮助使用者获取影像(例如视频或者图像)的摄像模组的相关技术得到了迅猛的发展和进步，并且，在近年来，摄像模组在诸如医疗、安防、工业生产等诸多的领域都得到了广泛的应用。
在消费电子领域(例如，在智能手机领域)，前置摄像模组是一个不可或缺的部件。前置摄像模组与终端设备的显示屏设置于同一侧，用于满足消费者自拍等需求。近年来，“全面屏”终端设备(尤其是“全面屏”手机)越来越受欢迎。然而，由于前置摄像模组与显示屏安装于终端设备的同一侧，显示屏必须为前置摄像模组的安装提供避让空间，其成为提高“屏占比”的重要限制因素。
换言之，不断增大的“屏占比”对前置摄像模组的结构、布置方式等提出了新的要求。
发明内容
本申请的主要目的在于提供一种感光组件、摄像模组和终端设备，其中，所述摄像模组具有窄边侧，当所述摄像模组被配置为前置摄像模组并与终端设备的显示屏安装于同一侧时，所述摄像模组的所述窄边侧对应于终端设备的壳体以使得所述摄像模组能够更邻近于所述壳体的顶侧，从而相应地为所述显示屏的尺寸扩展提供空间，以提高所述终端设备的“屏占比”。
本申请的另一目的在于提供一种感光组件、摄像模组和终端设备，其中，线路板位于所述窄边侧的一侧和/或封装体位于所述窄边侧的一侧和/或外镜筒位于所述窄边侧的一侧和/或滤光元件支架位于所述窄边侧的一侧具有相对较小的尺寸，以使得当所述摄像模组组装于所述终端设备时，所述摄像 模组能够更邻近于所述壳体的顶侧，从而相应地为所述显示屏的尺寸扩展提供空间，以提高所述终端设备的“屏占比”。
本申请的另一目的在于提供一种感光组件、摄像模组和终端设备，其中，所述感光芯片和所述光学镜头所设定的感光轴线与所述线路板所设定的中心线相偏移，以使得当所述摄像模组安装于所述终端设备时，所述光学镜头的内镜筒更邻近于所述所述壳体的顶侧，以降低所述光学镜头的内镜筒对提高“屏占比”的影响。
本申请的另一目的在于提供一种感光组件、摄像模组和终端设备，其中，所述封装体具有形成于所述封装体内侧面的用于安装滤光元件的安装区域，所述安装区域中至少一侧相较于其他侧具有相对较小的宽度，以使得所述滤光元件的整体尺寸和贴装区域的尺寸能得以缩减，以降低成本。
本申请的另一目的在于提供一种感光组件、摄像模组和终端设备，其中，所述封装体具有形成于所述封装体的内侧面的用于滤光元件的安装区域，其中，所述安装区域中位于所述窄边侧的一侧相较于所述安装区域的其他侧具有相对较小的宽度尺寸。特别地，在本申请实施例中，除了在所述安装区域的非位于所述窄边侧的其他侧施加黏着剂之外，进一步地在所述滤光元件中位于所述窄边侧的侧表面与所述封装体的内侧面之间施加黏着剂，以提高所述滤光元件安装于所述安装区域的稳定性。
本申请的另一目的在于提供一种感光组件、摄像模组和终端设备，其中，所述黏着剂施加于所述滤光元件中位于所述窄边侧的侧表面与所述封装体的内侧面之间，这样的施加位置有利于防止所述黏着剂下溢而污染所述感光芯片。
本申请的另一目的在于提供一种感光组件、摄像模组和终端设备，其中，施加于所述滤光元件中位于所述窄边侧的侧表面与所述封装体的内侧面之间的所述黏着剂能够作为缓冲元件，缓冲所述封装体由于终端设备受冲击而对所述滤光元件造成的冲击。
为实现上述至少一目的或优势，提出了本申请。本申请的实施例提供了一种感光组件，其包括：
线路板；
电连接于所述线路板的感光芯片，以及
设置于所述线路板的封装体，所述封装体具有对应于所述感光芯片的至 少感光区域的光窗，其中，所述封装体具有形成于所述封装体内侧面的用于安装滤光元件的安装区域，所述安装区域中至少一侧相较于其他侧具有相对较小的宽度。
在根据本申请的感光组件中，所述安装区域中相邻的两侧相较于其他侧具有相对较小的宽度。
在根据本申请的感光组件中，所述安装区域中相对的两侧相较于其他侧具有相对较小的宽度。
在根据本申请的感光组件中，所述封装体中邻近于终端设备的壳体的一侧相较于所述封装体的其他侧具有相对较小的宽度以设定形成一窄边侧，在所述感光组件安装于所述终端设备时，所述窄边侧被配置对应于所述终端设备的壳体，所述安装区域中具有相对较小的宽度的一侧位于所述窄边侧。
在根据本申请的感光组件中，所述感光组件进一步包括贴装于所述安装区域的滤光元件。
在根据本申请的感光组件中，进一步包括黏着剂，所述滤光元件通过所述黏着剂被贴装于所述封装体的所述安装区域，所述黏着剂施加于所述安装区域中具有相对较大宽度的其他侧。
在根据本申请的感光组件中，所述黏着剂进一步地被施加于所述滤光元件中对应于所述安装区域中具有相对较小宽度的一侧或二侧的侧表面与所述封装体的内侧面之间。
在根据本申请的感光组件中，施加于所述滤光元件中对应于所述安装区域中具有相对较小宽度的一侧或二侧的侧表面与所述封装体的内侧面之间的所述黏着剂与施加于所述安装区域中具有相对较大宽度的其他侧的所述黏着剂为两种不同的黏着剂，以及，施加于所述滤光元件中对应于所述安装区域中具有相对较小宽度的一侧或二侧的侧表面与所述封装体的内侧面之间的所述黏着剂具有相对较低的流动性。
在根据本申请的感光组件中，所述安装区域中具有相对较小宽度的一侧或二侧向所述终端设备的壳体方向缩进至所述安装区域中具有相对较小宽度的一侧或二侧与所述封装体的内侧面处于同一平面，以使得所述安装区域中具有相对较小宽度的一侧或二侧的宽度尺寸为零。
在根据本申请的感光组件中，所述感光芯片、所述滤光元件和所述光学镜头所设定的光轴与所述线路板的中心轴线相偏移。
在根据本申请的感光组件中，所述感光组件进一步包括滤光元件和滤光元件支架，所述滤光元件支架安装于所述封装体的上表面，所述滤光元件支架包括形成于所述滤光元件支架的内侧面并用于安装所述滤光元件的贴装区域，所述贴装区域中至少一侧相较于其他侧具有相对较小的宽度。
在根据本申请的感光组件中，所述贴装区域中相邻的两侧相较于其他侧具有相对较小的宽度。
在根据本申请的感光组件中，所述贴装区域中相对的两侧相较于其他侧具有相对较小的宽度。
在根据本申请的感光组件中，所述封装体中邻近于终端设备的壳体的一侧相较于所述封装体的其他侧具有相对较小的宽度以设定形成一窄边侧，在所述感光组件安装于所述终端设备时，所述窄边侧被配置对应于所述终端设备的壳体，所述贴装区域中具有相对较小的宽度的一侧位于所述窄边侧。
在根据本申请的感光组件中，所述感光组件进一步包括黏着剂，所述滤光元件通过所述黏着剂被贴装于所述滤光元件支架的所述贴装区域，所述黏着剂施加于所述贴装区域中具有相对较大宽度的其他侧。
在根据本申请的感光组件中，所述黏着剂进一步地被施加于所述滤光元件中对应于所述贴装区域中具有相对较小宽度的一侧或二侧的侧表面与所述滤光元件支架的内侧面之间。
在根据本申请的感光组件中，施加于所述滤光元件中对应于所述贴装区域中具有相对较小宽度的一侧或二侧的侧表面与所述滤光元件支架的内侧面之间的所述黏着剂与施加于所述贴装区域中具有相对较大宽度的其他侧的所述黏着剂为两种不同的黏着剂，以及，施加于所述滤光元件中对应于所述贴装区域中具有相对较小宽度的一侧或二侧的侧表面与所述滤光元件支架的内侧面之间的所述黏着剂具有相对较低的流动性。
在根据本申请的感光组件中，所述贴装区域中具有相对较小宽度的一侧或二侧向所述终端设备的壳体方向缩进至所述贴装区域中具有相对较小宽度的一侧或二侧与所述滤光元件支架的内侧面处于同一平面，以使得所述贴装区域中具有相对较小宽度的一侧或二侧的宽度尺寸为零。
在根据本申请的感光组件中，所述封装体一体成型于所述线路板并一体包覆所述线路板的至少一部分和所述感光芯片的非感光区域的至少一部分。
在根据本申请的感光组件中，所述封装体一体成型于所述线路板并一体 包覆所述线路板的至少一部分。
在根据本申请的感光组件中，所述感光组件进一步包括至少一电子元器件，所述至少一电子元器件设置于所述线路板中非位于所述窄边侧的其他侧。
在根据本申请的感光组件中，所述感光组件进一步包括用于电连接所述感光芯片和所述线路板的至少一引线，所述引线设置于所述线路板中非位于所述窄边侧的其他侧。
在根据本申请的感光组件中，所述感光组件进一步包括用于电连接所述感光芯片和所述线路板的至少一引线，部分所述至少一引线设置于所述线路板中位于所述窄边侧的一侧，以及，其他部分引线设置于所述线路板非位于所述窄边侧的其他侧。
根据本申请的另一方面，还提供一种摄像模组，其包括：
光学镜头；
如上所述的感光组件，所述光学镜头被保持于所述感光组件的感光路径。
在根据本申请的摄像模组中，所述光学镜头包括至少一光学透镜、用于安装所述至少一光学透镜于其内的内镜筒，以及，用于支持所述内镜筒的外镜筒，其中，所述外镜筒中位于所述窄边侧的一侧相较于所述外镜筒的其他侧具有相对较小的宽度尺寸。
在根据本申请的摄像模组中，所述摄像模组进一步包括驱动元件，其中，所述驱动元件安装于所述封装体的上表面，所述光学镜头安装于所述驱动元件，以使得所述光学镜头被保持于所述感光组件的感光路径，其中，所述驱动元件位于所述窄边侧的一侧相较于所述驱动元件的其他侧的宽度尺寸较小。
根据本申请又一方面，还提供一种终端设备，其包括：
壳体；
安装于所述壳体的显示屏，以及
如上所述的摄像模组，其中，所述摄像模组与所述显示屏组装于所述终端设备的同一侧，以被配置为终端设备的前置摄像模组，其中，当所述摄像模组组装于所述终端设备时，所述摄像模组的窄边侧对应于所述壳体，以使得所述摄像模组更邻近于所述壳体。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1图示了现有的前置摄像模组安装于终端设备的局部示意图。
图2图示了根据本申请实施例的摄像模组的示意图。
图3图示了根据本申请实施例的所述摄像模组安装于终端设备的布局示意图。
图4图示了根据本申请实施例的所述摄像模组的感光组件的示意图。
图5图示了根据本申请实施例的所述感光组件的俯视示意图。
图6A图示了根据本申请实施例的所述感光组件的一种变形实施的俯视示意图。
图6B图示了根据本申请实施例的所述感光组件的另一种变形实施的俯视示意图。
图6C图示了根据本申请实施例的所述感光组件的又一种变形实施的俯视示意图。
图6D图示了根据本申请实施例的所述感光组件的又一种变形实施的俯视示意图。
图7图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图8图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图9图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图10图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图11图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图12图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图13图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图14图示了现有的摄像模组组装于终端设备和基于本申请实施例的所述摄像模组组装于所述终端设备的对比示意图。
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
申请概述
如上所述，近年来，“全面屏”终端设备(尤其是“全面屏”手机)越来越受欢迎。由于前置摄像模组与显示屏安装于终端设备的同一侧，显示屏必须为前置摄像模组的安装提供避让空间，导致前置摄像摄像模组成为提高“屏占比”的重要限制因素。
图1图示了现有的前置摄像模组安装于终端设备的局部示意图。如图1所示，该摄像模组10(此处以定焦摄像模组为示例，当然该摄像模组也可以被实施为动焦摄像模组)，包括：线路板11、电连接于线路板11的至少一电子元器件12，电连接线路板11的感光芯片13、设置于线路板11上的支架14,支撑于支架14上的滤光元件15、支撑于支架14上的光学镜头16，其中，所述光学镜头16包括至少一光学透镜、安装至少一光学透镜的内镜筒162，以及，安装于所述内镜筒162外侧的外镜筒163。如图1所示，终端设备20的显示屏21上设有开孔210，特别地，为了提高“屏占比”，该开孔210的开设位置邻近于终端设备20的壳体22的顶侧(壳体的顶侧，以下简称“顶框”)。并且，该摄像模组10邻近地安装于该顶框，以使得摄像模组10的光学镜头16对应于开孔210，从而允许该摄像模组10能够通过该开孔210采集来自外界的成像光线。然而，现有的摄像模组10的结 构及其布置方式却限制着终端设备的“屏占比”的提高。
具体来说，如图1所示，现有的线路板11、感光芯片13、滤光元件15、支架14、光学镜头16通常具有中心对称形状，并且，以线路板11的中心作为参考。应可以观察到，在现有的摄像模中，线路板11靠近顶框的一侧、支架14靠近顶框的一侧、外镜筒163靠近顶宽的一侧与线路板中心之间的距离与其他侧与线路板中心之间距离相一致。这样的结构配置使得：当摄像模组10安装于所述终端设备20时，该摄像模组10不能更邻近该终端设备20的顶框，即，显示屏21不能更多地向该顶框方向扩展延伸，以提高“屏占比”。
此外，当摄像模组10安装于所述终端设备10时，在内镜筒162靠近顶框的一侧、该顶框、外镜筒163的上方区域和该显示屏21的透明盖板的下方之间界定形成一空白区域，现有的摄像模组10的滤光元件15、外镜筒163和内镜筒162以感光芯片13的中心点为轴线成中心对称(或接近中心对称)的方式布置，而感光芯片12安装于线路板11的中心区域，使得滤光元件15、外镜筒163和内镜筒162以关于线路板11的中心线对称的方式布置(或接近中心对称)。这样的结构和布置方式，使得内镜筒161无法向该顶框方向延伸，以占据更多的空白区域，即，该空白区域的空间较大。然而，内镜筒162邻近于顶框的一侧会阻挡显示屏21向该顶框方向扩展，以限制“屏占比”的提升。
并且，本领域普通技术人员应知晓，滤光元件15是摄像模组中敏感且昂贵的部件。在实际生产和组装过程中，对于滤光元件15的整体尺寸和安装区域的尺寸有着较高的要求。具体来说，滤光元件15的安装区域的宽度尺寸需从现有的0.2mm降低至0.1mm左右。同时，当滤光元件15的整体尺寸和安装区域的宽度尺寸缩减时，也间接利于提高终端设备的屏占比。
针对上述技术问题，本申请的基本构思是将所述摄像模组中邻近于终端设备的壳体顶侧的一侧设置为窄边侧，以使得当所述摄像模组被配置为前置摄像模组并与终端设备的显示屏安装于同一侧时，所述摄像模组的所述窄边侧对应于终端设备的壳体以使得所述摄像模组能够更邻近于所述壳体的顶侧，从而相对地为所述显示屏的尺寸扩展提供空间，以提高所述终端设备的“屏占比”。并且，所述封装体具有形成于所述封装体内侧面的用于安装滤光元件的安装区域，其中，所述安装区域中至少一侧被配置为相较于其他侧 具有相对较小的宽度，以缩减所述滤光元件的整体尺寸和安装区域的尺寸。
基于此，本申请提出了一种摄像模组，其包括感光组件和保持于该感光组件的感光路径的光学镜头。特别地，所述感光组件包括线路板、电连接于所述线路板的感光芯片、以及，设置于所述线路板的封装体，其中，所述封装体具有对应于所述感光芯片的至少感光区域的光窗，其中，所述封装体具有形成于所述封装体内侧面的用于安装滤光元件的安装区域，所述安装区域中至少一侧被配置为相较于其他侧具有相对较小的宽度，其中，所述封装体中邻近于该终端设备的壳体的一侧相较于所述封装体的其他侧具有相对较小的宽度尺寸以设定形成一窄边侧，以使得当所述摄像模组组装于所述终端设备时，所述摄像模组与该终端设备的壳体之间的距离可被缩减。通过这样的方式，允许所述终端设备的显示屏往终端设备的壳体的顶侧方向延伸以提高“屏占比”。
在介绍本申请的基本原理之后，下面将参考附图来具体介绍本申请的各种非限制性实施例。
示例性摄像模组及其感光组件
如图2至图5所示，基于本申请实施例的摄像模组30被阐明。在本申请实施例中，所述摄像模组30被配置为终端设备80(例如，智能手机)的前置摄像模组30，其与终端设备80的显示屏81安装于同一侧，以用于满足用户自拍等需求。特别地，在本申请实施例中，所述摄像模组30的一侧被配置为窄边侧100。并且，如图3所示，当所述摄像模组30被配置为前置摄像模组30并与终端设备80的显示屏81安装于同一侧时，所述摄像模组30的所述窄边侧100对应于终端设备80的壳体82，从而所述摄像模组30能够更邻近于所述壳体82的顶侧，以相对地为所述显示屏81的尺寸扩展提供空间，以提高所述终端设备80的“屏占比”。
如图2所示，在本申请实施例中，所述摄像模组30包括光学镜头40和感光组件50，其中，所述光学镜头40被保持于所述感光组件50的感光路径。所述感光组件50包括线路板51、电连接于所述线路板51的感光芯片52、以及，设置于所述线路板51的封装体53，其中，所述封装体53具有对应于所述感光芯片52的至少感光区域的光窗531，以允许外界光线通过所述光窗531被所述感光芯片52的感光区域所接收并进行成像反应。 特别地，如图2所示，在本申请实施例中，所述封装体53中邻近于该终端设备80的壳体82的一侧相较于所述封装体53的其他侧具有相对较小的宽度尺寸以设定形成所述窄边侧100。这里，在本申请实施例中，所述摄像模组30的窄边侧100表示所述摄像模组30的某一侧方向而非具体指的是所述摄像模组30的某一侧或者某一侧边。
如图4所示，应可以观察到，相较于现有的摄像模组30，在本申请实施例中，所述感光芯片52不再贴装于所述线路板51的中心区域，也就是说，所述感光芯片52的感光区域的中心与所述线路板51的中心相偏移。这里，以所述感光芯片52的感光区域的中心为基准，可明显观察到：所述线路板51位于所述窄边侧100的一侧与该中心之间的距离小于所述线路板51的其他侧与该中心之间的距离。应可以理解，在本申请实施例中，在配置所述摄像模组30形成所述窄边侧100(目的是为了提高所述终端设备80的“屏占比”)的过程中，所述摄像模组30中部件(例如，线路板51、感光芯片52、封装体53等)的形状、尺寸与安装方式都需要相应地做出调整。
具体来说，如图4所示，在本申请实施例中，所述封装体53通过一体成型工艺一体成型于所述线路板51，以形成一体式支架。特别地，在如图4所示的示例中，所述封装体53通过MOC(Molding On Chip)工艺一体成型于所述线路板51，以一体包覆所述线路板51的至少一部分和所述感光芯片52的非感光区域的至少一部分。相应地，在本申请实施例中，所述封装体53中位于所述窄边侧100的一侧具有相对较小的宽度尺寸。
如图4所示，在本申请实施例中，所述封装体53包括形成于所述封装体53的内侧面530且用于安装滤光元件54的安装区域532。相应地，如图4所示，在该示例中，所述封装体53的内侧面530为阶梯面，以在所述阶梯面的转折处形成所述安装区域532，并且，所述内侧面530的顶部区域形成用于引导外界光线进入所述感光芯片52的感光区域的所述光窗531。
进一步地，在本申请实施例中，所述安装区域532中至少一侧相较于其他侧具有相对较小的宽度，这样，所述滤光元件54的整体尺寸和贴装尺寸得以缩减以降低成本。特别地，在本申请实施例中，该较短侧的宽度小于或等于0.1mm。优选地，如图4所示，在本申请实施例中，所述安装区域532中位于所述窄边侧100的一侧相较于所述安装区域532的其他侧具有相对较小的宽度尺寸。
应可以理解，当所述安装区域532中位于所述窄边侧100的一侧的宽度减小时，如果仍按照现有的滤光元件54的贴装方式(即，沿着安装区域532施加胶水)，施加于所述安装区域532中位于所述窄边侧100的一侧的黏着剂55容易溢出下流而对所述感光芯片52的感光区域造成污染。
相应地，为了防止所述感光芯片52的感光区域被污染，在本申请实施例中，对所述滤光元件54的贴装方式作出调整。具体来说，在本申请实施例中，将所述黏着剂55施加于所述安装区域532中具有相对较大宽度的其他侧，即非位于所述窄边侧100的其他侧，而不在所述安装区域532中位于所述窄边侧100的一侧的表面施加所述黏着剂55，这样，当所述滤光元件54叠置于所述安装区域532时，由于在所述安装区域532中位于所述窄边侧100的一侧的表面没有施加所述黏着剂55，因此无需担心该处黏着剂55溢出下流而导致所述感光芯片52被污染，同时，由于在所述安装区域532中非位于所述窄边侧100的其他侧的表面施加了所述黏着剂55，也能够为所述滤光元件54提供相对较为稳定的支撑。
优选地，在本申请实施例中，所述安装区域532中非位于所述窄边侧100的其他侧为所述滤光元件54提供的支撑强度，能够使得所述滤光元件54平行于所述感光芯片52。当然，本领域普通技术人员应可以理解，即使所述安装区域532中非位于所述窄边侧100的其他侧所提供的支撑强度不能够使得所述滤光元件54相对所述感光芯片52平行而实际上产生略微的倾斜，略微的倾斜也不会对摄像模组30的成像质量造成太大的影响。也就是说，在本申请实施例中，对所述安装区域532中非位于所述窄边侧100的其他侧所提供的支撑强度并没有特定严格的要求，其仅需能够满足将所述滤光元件54稳定地支撑于所述安装区域532即可。也就是说，在本申请实施例中，对施加于所述安装区域532中非位于所述窄边侧100的其他侧的所述黏着剂55的施加量、宽度、长度、施加路线等参数并没有严格地限制，其仅需能够满足将所述滤光元件54稳定地支撑于所述安装区域532即可。
特别地，如图5所示，在本申请实施例中，所述安装区域532具有“口”字型，其中，所述安装区域532中非位于所述窄边侧100的其他三侧首尾相连成“U”字型，所述安装区域532中位于所述窄边侧100的一侧具有“一”字型。这里，所述安装区域532中位于所述窄边侧100的一侧的宽度相较于所述安装区域532中非位于所述窄边侧100的其他三侧的宽度较小。
特别地，如图5所示，在本申请实施例中，施加于所述安装区域532中非位于所述窄边侧100的其他三侧的黏着剂55具有U字型。例如，可以首尾相连的方式将所述黏着剂55施加于所述安装区域532中非位于所述窄边侧100的其他三侧。这样，当所述滤光元件54叠置于所述安装区域532中，所述滤光元件54的下表面能够充分地与所述安装区域532中非位于所述窄边侧100的其他三侧的黏着剂55相接触，以在固化后提供相对较为稳固的粘接强度。
当然，本领域普通技术人员应可以理解，在本申请实施例中，所述黏着剂55施加于所述安装区域532中非位于所述窄边侧100的其他三侧所形成的形状，并不为本申请所局限。例如，在本申请其他示例中，施加于所述安装区域532中非位于所述窄边侧100的其他三侧的所述黏着剂55可相互间断，如图6A所示。再如，在本申请其他示例中，所述黏着剂55还可仅施加于所述安装区域532中非位于所述窄边侧100的其他三侧中的对称分布的两侧。
为了增强所述滤光元件54的稳定性，优选地，在本申请实施例中，进一步地在所述滤光元件54中位于所述窄边侧100的侧表面与所述封装体53的内侧面530之间施加所述黏着剂55，以通过所述黏着剂55将所述滤光元件54粘接于所述封装体53的内侧面530上。应可以理解，当所述滤光元件54通过施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述封装体53的内侧面530之间的所述黏着剂55粘接于所述封装体53的内表面时，所述滤光元件54将所述封装体53的所述光窗531完全地密封，以防止外界脏污沿着所述光窗531进入所述感光组件50内部而导致所述感光芯片52被污染。此外，施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述封装体53的内侧面530之间的所述黏着剂55能够作为缓冲元件，缓冲所述封装体53由于终端设备80受冲击而对所述滤光元件54造成的冲击。
值得一提的是，在本申请实施例中，施加于所述安装区域532中非位于所述窄边侧100的其他侧的所述黏着剂55与施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述封装体53的内侧面530之间的所述黏着剂55可被实施为同一种黏着剂55。优选地，在本申请实施例中，施加于所述安装区域532中非位于所述窄边侧100的其他侧的所述黏着剂55与 施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述封装体53的内侧面530之间的所述黏着剂55可被实施为不同种黏着剂55，其中，优选地，施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述封装体53的内侧面530之间的所述黏着剂55的流动性相对较低。
图6B图示了根据本申请实施例的所述感光组件的另一种变形实施的示意图。如图6B所示，在该变形实施中，所述安装区域532中相对的两侧相较于其他侧具有相对较小的宽度。也就是说，在该变形实施例中，除了所述窄边侧100之外，与所述窄边侧100相对的一侧也具有相对较小的宽度尺寸。也就是说，在该变形实施中，所述安装区域532中相对的具有较小宽度的两侧呈“二”字型。相应地，为了确保所述滤光元件54能够稳定地贴装于所述安装区域并且黏着剂55不会溢出下流而对所述感光芯片52的感光区域造成污染，在该变形实施中，所述黏着剂55的施加方式为：所述黏着剂55施加于所述安装区域532中具有相对较大宽度的其他侧，以及，施加于所述滤光元件54中对应于所述安装区域532中具有较小宽度的相对二侧的侧表面与所述封装体53的内侧面530之间。值得一提的是，在该变形实施中，施加于所述滤光元件54中对应于所述安装区域532中具有相对较小宽度的相对二侧的侧表面与所述封装体53的内侧面530之间的所述黏着剂55具有相对较低的流动性。
图6C图示了根据本申请实施例的所述感光组件的另一种变形实施的示意图。如图6C所示，在该变形实施中，所述安装区域532中相邻的两侧相较于其他侧具有相对较小的宽度。也就是说，在该变形实施例中，除了所述窄边侧100之外，与所述窄边侧100相邻的一侧也具有相对较小的宽度尺寸。如图6C所示，在该变形实施中，所述安装区域532中相邻的具有较小宽度的两侧呈
Figure PCTCN2020112142-appb-000001
字型，即，与所述窄边侧100相邻的一侧位于设置于窄边侧100的上方，这样当所述摄像组件30组装于终端设备时，所述摄像模组30可尽可能地放置于所述终端设备80的左上角，提高终端设备的美观性。相应地，为了确保所述滤光元件54能够稳定地贴装于所述安装区域并且黏着剂55不会溢出下流而对所述感光芯片52的感光区域造成污染，在该变形实施中，所述黏着剂55的施加方式为：所述黏着剂55施加于所述安装区域532中具有相对较大宽度的其他侧，以及，施加于所述滤光元件54中对应于所述安装区域532中具有较小宽度的相邻二侧的侧表面与所述封装体53 的内侧面530之间。值得一提的是，在该变形实施中，施加于所述滤光元件54中对应于所述安装区域532中具有相对较小宽度的相邻二侧的侧表面与所述封装体53的内侧面530之间的所述黏着剂55具有相对较低的流动性。
图6D图示了根据本申请实施例的所述感光组件的另一种变形实施的示意图。如图6D所示，在该变形实施中，所述安装区域532中相邻的两侧相较于其他侧具有相对较小的宽度。也就是说，在该变形实施例中，除了所述窄边侧100之外，与所述窄边侧100相邻的一侧也具有相对较小的宽度尺寸。如图6C所示，在该变形实施中，所述安装区域532中相邻的具有较小宽度的两侧呈
Figure PCTCN2020112142-appb-000002
字型，即，与所述窄边侧100相邻的一侧位于设置于窄边侧100的上方，这样当所述摄像组件30组装于终端设备时，所述摄像模组30可尽可能地放置于所述终端设备80的右上角，提高终端设备的美观性。相应地，为了确保所述滤光元件54能够稳定地贴装于所述安装区域并且黏着剂55不会溢出下流而对所述感光芯片52的感光区域造成污染，在该变形实施中，所述黏着剂55的施加方式为：所述黏着剂55施加于所述安装区域532中具有相对较大宽度的其他侧，以及，施加于所述滤光元件54中对应于所述安装区域532中具有较小宽度的相邻二侧的侧表面与所述封装体53的内侧面530之间。值得一提的是，在该变形实施中，施加于所述滤光元件54中对应于所述安装区域532中具有相对较小宽度的相邻二侧的侧表面与所述封装体53的内侧面530之间的所述黏着剂55具有相对较低的流动性。
图7图示了图示了根据本申请实施例的所述感光组件50的又一种变形实施的示意图。如图7所示，在该变形实施中，所述安装区域532中位于所述窄边侧100的一侧向所述终端设备80的壳体82顶侧方向缩进至所述安装区域532中位于所述窄边侧100的该侧与所述封装体53位于所述窄边侧100的内侧面齐平。也就是说，在该变形实施中，所述安装区域532中位于所述窄边侧100的该侧与所述封装体53位于所述窄边侧100的内侧面处于同一平面，以使得所述安装区域532中位于所述窄边侧100的一侧的宽度尺寸为零。也就是说，所述封装体53位于所述窄边侧100的内侧面相对于所述线路板51的上表面垂直地向上延伸而不是弯折地向上延伸以形成阶梯面。并且，在该变形实施中，所述滤光元件54通过施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述封装体53的内侧面530之间的所述黏着剂55粘接于所述封装体53的内侧面530。当然，当所述安 装区域532被实施为如图6B至6D所示意的具有相对二侧相对较小的宽度尺寸时，所述安装区域532中具有相对较小宽度尺寸的两侧能够向所述终端设备80的壳体82顶侧方向缩进至所述安装区域532中具有相对较小宽度尺寸的两侧与所述封装体53的内侧面齐平。对此，并不为本申请所局限。
图8图示了根据本申请实施例的所述感光组件50的另一种变形实施的示意图。如图8所示，在该变形实施中，所述感光组件50进一步包括滤光元件支架56，其中，所述滤光元件支架56安装于所述封装体53的上表面，用于安装所述滤光元件54于其上。特别地。在该变形实施中，所述滤光元件支架56包括形成于所述滤光元件支架56的内侧面560并用于安装所述滤光元件54的贴装区域561。特别地，在该变形实施中，所述贴装区域561中中至少一侧相较于其他侧具有相对较小的宽度。特别地，如图8所示，所述贴装区域561中位于所述窄边侧100的一侧相较于所述贴装区域561的其他侧具有较小的宽度尺寸。
应可以理解，当所述贴装区域561中位于所述窄边侧100的一侧的宽度减小时，如果仍按照现有的滤光元件54的贴装方式(即，环绕所述滤光元件支架56的贴装区域561施加胶水)，施加于所述贴装区域561中位于所述窄边侧100的一侧的黏着剂55容易溢出下流而对所述感光芯片52的感光区域造成污染。
相应地，为了防止所述感光芯片52的感光区域被污染，在本申请实施例中，将所述黏着剂55施加于所述贴装区域561中非位于所述窄边侧100的其他侧，而不在所述贴装区域561中位于所述窄边侧100的一侧的表面施加所述黏着剂55，这样，当所述滤光元件54叠置于所述贴装区域561时，由于在所述贴装区域561中位于所述窄边侧100的一侧的表面没有施加所述黏着剂55，因此无需担心该处黏着剂55溢出下流而导致所述感光芯片52被污染，同时，由于在所述贴装区域561中非位于所述窄边侧100的其他侧的表面施加了所述黏着剂55，也能够为所述滤光元件54相对较为稳定的支撑强度。
如图8所示，在该变形实施中，所述贴装区域561具有“口”字型，其中，所述贴装区域561中非位于所述窄边侧100的其他三侧首尾相连成“U”字型，所述所述贴装区域561中位于所述窄边侧100的一侧具有“一”字型，其中，所述贴装区域561中位于所述窄边侧100的一侧的宽度相较于 所述贴装区域561中非位于所述窄边侧100的其他三侧的宽度尺寸较小。特别地，在该变形实施例中，施加于所述贴装区域561中非位于所述窄边侧100的其他三侧的黏着剂55具有U字型，例如，可以首尾相连的方式将所述黏着剂55施加于所述贴装区域561中非位于所述窄边侧100的其他三侧。这样，当所述滤光元件54叠置于所述贴装区域561中，所述滤光元件54的下表面能够充分地与所述贴装区域561中非位于所述窄边侧100的其他三侧的黏着剂55相接触，以在固化后提供相对较为稳固的支撑强度。
当然，本领域普通技术人员应可以理解，在本申请实施例中，所述黏着剂55施加于所述贴装区域561中非位于所述窄边侧100的其他三侧所形成的形状，并不为本申请所局限。例如，在本申请其他示例中，施加于所述贴装区域561中非位于所述窄边侧100的其他三侧的所述黏着剂55可相互间断。再如，在本申请其他示例中，所述黏着剂55还可仅施加于所述贴装区域561中非位于所述窄边侧100的其他三侧中的对称分布的两侧。
为了增强所述滤光元件54的稳定性，优选地，可以进一步地在所述滤光元件54中位于所述窄边侧100的侧表面与所述滤光元件支架56的内侧面560之间施加所述黏着剂55，以通过所述黏着剂55将所述滤光元件54粘接于所述滤光元件支架56的内侧面560上。值得一提的是，在本该变形实施中，施加于所述贴装区域561中非位于所述窄边侧100的其他侧的所述黏着剂55与施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述滤光元件支架56的内侧面560之间的所述黏着剂55可被实施为同一种黏着剂55。优选地，在本申请实施例中，施加于所述贴装区域561中非位于所述窄边侧100的其他侧的所述黏着剂55与施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述滤光元件支架56的内侧面560之间的所述黏着剂55可被实施为不同种黏着剂55，其中，施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述滤光元件支架56的内侧面560之间的所述黏着剂55的流动性相对较差。
当然，在该变形实施的其他示例中，所述贴装区域561中相邻的两侧相较于其他侧具有相对较小的宽度，即，除了位于所述窄边侧100的该侧，与位于所述窄边侧100的该侧相邻的一侧也具有相对较小的宽度。或者，所述贴装区域561中相对的两侧相较于其他侧具有相对较小的宽度，即，除了位于所述窄边侧100的该侧，与位于所述窄边侧100的该侧相对的一侧也具有 相对较小的宽度，对此，并不为本申请所局限。
图9图示了图示了根据本申请实施例的所述感光组件50的又一种变形实施的示意图，其中，图9所示的实施例为图8所示的实施例的变形实施。如图9所示，在该变形实施中，所述贴装区域561中位于所述窄边侧100的一侧向所述窄边侧100的方向缩进至所述贴装区域561中位于所述窄边侧100的该侧与所述滤光元件支架56中位于所述窄边侧100的内侧面齐平。也就是说，在该变形实施中，所述贴装区域561中位于所述窄边侧100的该侧与所述滤光元件支架56中位于所述窄边侧100的内侧面处于同一平面，以使得所述贴装区域561中位于所述窄边侧100的一侧的宽度尺寸为零。也就是说，所述滤光元件支架56位于所述窄边侧100的内侧面相对于所述封装体53的上表面垂直地向上延伸而不是弯折地向上延伸以形成阶梯面。并且，在该变形实施中，所述滤光元件54通过施加于所述滤光元件54中位于所述窄边侧100的侧表面与所述滤光元件支架56的内侧面560之间的所述黏着剂55粘接于所述滤光元件支架56的内侧面560。
进一步地，所述摄像模组30形成所述窄边侧100的结构配置，也会对设置于所述线路板51的至少一电子元器件57(其包括但不限于电阻、电容、电感等)造成影响。具体来说，由于所述线路板51在位于窄边侧100的一侧的宽度尺寸较小，因此，优选地，如图4所示，将所述至少一电子元器件57设置于所述线路板51中非位于所述窄边侧100的其他侧。更优选地，在本申请实施例中，将所述将所述至少一电子元器件57设置于所述线路板51中非位于所述窄边侧100的其他侧中相互对称的两侧。当然，本领域普通技术人员应知晓，在具体实施中，也可以将少量的所述电子元器件57设置于所述线路板51中位于所述窄边侧100的一侧，对此，并不为本申请所局限。
进一步地，当所述感光芯片52通过至少一引线58的方式电连接于所述线路板51时，对应于所述摄像模组30形成所述窄边侧100的结构配置，所述至少一引线58的布置方式也需作出调整。具体来说，由于所述线路板51在位于窄边侧100的一侧的宽度尺寸较小，因此，优选地，如图4所示，在本申请实施例中，将所述至少一引线58设置于所述线路板51中非位于所述窄边侧100的其他侧。更优选地，在本申请实施例中，将所述将所述至少一引线58设置于所述线路板51中非位于所述窄边侧100的其他侧中相互对称的两侧。当然，本领域普通技术人员应知晓，在具体实施中，也可以 将少量的所述引线58设置于所述线路板51中位于所述窄边侧100的一侧(如图10所示)，对此，并不为本申请所局限。
值得一提的是，在本申请实施例中，所述引线58的类型并不为本申请所局限，例如，所述引线58可以是金线、银线、铜线。并且，所述引线58可通过“打金线”的工艺安装于所述线路板51和所述感光芯片52之间，以用于实现两者之间的电连接。具体来说，“打金线”工艺一般分为两种类型：“正打金线”工艺和“反打金线”工艺。“正打金线”工艺指的是在布设所述引线58的过程中，首先在所述线路板51的导电端上形成所述引线58的一端，进而弯曲地延伸所述引线58，并最终在所述感光芯片52的导电端上形成所述引线58的另一端，通过这样的方式，在所述感光芯片52和所述线路板51之间形成所述引线58。“反打金线”工艺指的是在布设所述引线58的过程中，首先在所述感光芯片52的导电端上形成所述引线58的一端，进而弯曲地延伸所述引线58，并最终在所述线路板51的导电端上形成所述引线58的另一端，通过这样的方式，在所述感光芯片52和所述线路板51之间形成所述引线58。值得一提的是，通过“反打金线”工艺所形成的所述引线58向上突起的高度相对“正打金线”工艺所形成的所述引线58向上突起的高度，因此，优选地，在该具体实施中，采用“反打金线”工艺形成所述引线58。
当然，本领域的技术人员应知晓，在本申请实施例的其他示例中，所述感光芯片52和所述线路板51可通过其他方式进行导通(可不采用所述引线58)，例如采用背部导通的技术方案。对此，并不为本申请所局限。
图11图示了根据本申请实施例的所述感光组件50的又一种变形实施的示意图，其中，图11所示意的实施例为图8所示例的实施例的变形实施。如图11所示，在该变形实施中，所述封装体53通过一体成型工艺一体成型于所述线路板51。特别地，在该变形实施中，所述封装体53通过MOB(Molding On Board)工艺一体成型于所述线路板51，并一体包覆所述线路板51的至少一部分，并且，所述滤光元件54安装于所述滤光元件54之间的贴装区域561。
图12图示了根据本申请实施例的所述感光组件50的又一种变形实施的示意图，其中，图12所示意的实施例为图10所示例的实施例的变形实施。如图12所示，在该变形实施中，所述封装体53通过一体成型工艺一体成型 于所述线路板51。特别地，在该变形实施中，所述封装体53通过MOB(Molding On Board)工艺一体成型于所述线路板51，并一体包覆所述线路板51的至少一部分，并且，部分所述引线58和/或部分所述电子元器件57设置于所述线路板51中位于所述窄边侧100的一侧。
图13图示了根据本申请实施例的所述感光组件50的又一种变形实施的示意图，其中，图13所示意的实施例为图4所示例的实施例的变形实施。如图13所示，在该变形实施例中，所述封装体53通过一体成型工艺一体成型于所述线路板51。特别地，在该变形实施中，所述封装体53通过MOB(Molding On Board)工艺一体成型于所述线路板51，并一体包覆所述线路板51的至少一部分，并且，所述滤光元件54贴装于所述封装体53所形成的所述安装区域532。应可以理解，相较于图4所示意的实施例，在该变形实施中，所述滤光元件54的尺寸相对较大。
进一步地，如图2所示，在本申请实施例中，所述光学镜头贴装于所述封装体53的上表面，应可以理解，当所述安装区域532中至少一侧相较于其他侧具有相对较小的宽度，所述封装体53的上表面中用于安装所述光学镜头40的宽度尺寸可相对增加。当然，在本申请实施例中，所述封装体53的上表面中用于安装所述光学镜头40的宽度尺寸同样也可以缩减只需要能够满足支撑所述光学镜头40即可。特别地，在本申请实施例中，所述光学镜头40，包括：至少一光学透镜41、用于安装所述至少一光学透镜41于其内的内镜筒42，以及，用于支持所述内镜筒42的外镜筒43，其中，所述外镜筒43中位于所述窄边侧100的一侧相较于所述外镜筒43的其他侧具有相对较小的宽度尺寸。这样，当所述摄像模组30被组装于所述终端设备80时，相较于现有的摄像模组30，所述光学镜头40的内镜筒42能够向所述终端设备80的壳体82的顶侧方向延伸，以占据相对更大的在所述内镜筒42和所述终端设备80壳体82的顶侧之间所形成的空白区域，从而允许所述显示屏81向向所述终端设备80的壳体82的顶侧方向延伸，以提高“屏占比”。
特别地，在本申请实施例中，所述光学镜头40的截面具有“D”字型，即，所述外镜筒43中位于所述窄边侧100的一侧相较于所述外镜筒43的其他侧具有相对较小的宽度尺寸。当然，在本申请其他示例中，所述光学镜头40还可以被实施为其他形状，对此，并不为本申请所局限。
综上基于本申请实施例的感光组件50被阐明，其中，所述摄像模组30具有一窄边侧100，以使得当所述摄像模组30被配置为前置摄像模组30并与终端设备80的显示屏81安装于同一侧时，所述摄像模组30能够更邻近于所述壳体82的顶侧，从而相对地为所述显示屏81的尺寸扩展提供空间，以提高所述终端设备80的“屏占比”。
值得一提的是，虽然以上以所述摄像模组30被实施为定焦摄像模组30为示例，本领域普通技术人员应可以理解，在本申请其他示例中，所述摄像模组30还可以包括动焦摄像模组30或者光学防抖摄像模组30。
相应地，当所述摄像模组30被实施为动焦摄像模组30时，所述摄像模组30进一步包括驱动元件，其中，所述驱动元件安装于所述封装体53的上表面，所述光学镜头40安装于所述驱动元件，以使得所述光学镜头40被保持于所述感光组件50的感光路径。特别地，在该示例中，所述驱动元件位于所述窄边侧100的一侧相较于所述驱动元件的其他侧的宽度尺寸较小。
相应地，当所述摄像模组30被实施为光学防抖摄像模组30时，所述摄像模组30进一步包括防抖马达，其中，所述防抖马达安装于所述封装体53的上表面，所述光学镜头40安装于所述防抖马达，以使得所述光学镜头40被保持于所述感光组件50的感光路径。特别地，在该示例中，所述防抖马达位于所述窄边侧100的一侧相较于所述驱动元件的其他侧的宽度尺寸较小。
值得一提的是，虽然在如图4至图13所示意的所述感光组件50中，以所述封装体53一体成型于所述线路板51为示例，本领域普通技术人员应可以理解，在本申请其他示例中，所述封装体53还可以被实施为塑料支架，其先预制成型并通过COB工艺贴装于所述线路板51的预设位置。特别地，在该示例中，所述塑料支架中位于所述窄边侧100的一侧具有相对较小的宽度尺寸。
还值得一提的是，虽然图6至图13图示了本申请实施例的所述摄像模组30的感光组件50一些变形实施的类型，本领域普通技术人员应可以理解，图6至图13所示意的变形思路可相互组合以形成更多的变型实施，由于其仅为简单的排列组合，故在此不再赘述。
示意性终端设备
根据本申请的另一方面，还提供一种终端设备。特别地，在本申请实施例中，以所述终端设备80为智能手机为示例，本领域普通技术人员应可以理解，在本申请其他示例中，所述终端设备80还可以被实施为其他类型的终端设备80，例如，平板电脑、膝上型电脑等。
在本申请实施例中，所述终端设备80，包括:壳体82、安装于所述壳体82的显示屏81，以及，如上所述摄像模组30，其中，所述摄像模组30与所述显示屏81组装于所述终端设备80的同一侧，以被配置为终端设备80的前置摄像模组30。
如上所述，在本申请实施例中，所述摄像模组30具有一窄边侧100，其中，当所述摄像模组30被配置为前置摄像模组30并与终端设备80的显示屏81安装于同一侧时，所述摄像模组30的窄边侧100邻近于所述壳体82的顶侧，以使得所述摄像模组30能够更邻近于所述壳体82的顶侧，从而相对地为所述显示屏81的尺寸扩展提供空间，以提高所述终端设备80的“屏占比”。
图14图示了现有的摄像模组30组装于终端设备80和基于本申请实施例的所述摄像模组30组装于所述终端设备80的对比示意图。如图14所示，在现有的摄像模组30中，线路板51的中心线与感光芯片52和光学镜头40所形成的光轴重合，然而，在本申请实施例中，所述线路板51的中心线与所述感光芯片52和所述光学镜头40所形成的光轴相偏移，从而本申请所提供的所述摄像模组30能够更为邻近地安装于所述壳体82的顶侧，以相对地为所述显示屏81的尺寸扩展提供空间，以提高所述终端设备80的“屏占比”。量化而言，相较于现有的摄像模组30，本申请所提供的所述摄像模组30能够为所述显示屏81的扩展提供尺寸为d的横向延伸空间，其中，距离d表示线路板位于所述窄边侧的一侧(和/或封装体位于所述窄边侧的一侧和/或外镜筒位于所述窄边侧的一侧和/或滤光元件支架位于所述窄边侧的一侧)在所述窄边侧100被缩小的宽度尺寸d1与现有摄像模组30的光学镜头40的中心线(光轴)与本申请所提供的所述摄像模组30的线路板51的中心线之间的偏移量d2之和。
综上，基于本申请实施例的终端设备80被阐明，其采用如上所述的摄像模组30作为其前置摄像模组30，以提高所述终端设备80的“屏占比”。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (27)

  1. 一种感光组件，其特征在于，包括：
    线路板；
    电连接于所述线路板的感光芯片，以及
    设置于所述线路板的封装体，所述封装体具有对应于所述感光芯片的至少感光区域的光窗，其中，所述封装体具有形成于所述封装体内侧面的用于安装滤光元件的安装区域，所述安装区域中至少一侧相较于其他侧具有相对较小的宽度。
  2. 根据权利要求1所述的感光组件，其中，所述安装区域中相邻的两侧相较于其他侧具有相对较小的宽度。
  3. 根据权利要求1所述的感光组件，其中，所述安装区域中相对的两侧相较于其他侧具有相对较小的宽度。
  4. 根据权利要求1-3任一所述的感光组件，其中，所述封装体中邻近于终端设备的壳体的一侧相较于所述封装体的其他侧具有相对较小的宽度以形成一窄边侧，在所述感光组件安装于所述终端设备时，所述窄边侧被配置对应于所述终端设备的壳体，所述安装区域中具有相对较小的宽度的一侧位于所述窄边侧。
  5. 根据权利要求4所述的感光组件，进一步包括贴装于所述安装区域的滤光元件。
  6. 根据权利要求5所述的感光组件，进一步包括黏着剂，其中，所述滤光元件通过所述黏着剂被贴装于所述封装体的所述安装区域，所述黏着剂施加于所述安装区域中具有相对较大宽度的其他侧。
  7. 根据权利要求5所述的感光组件，其中，所述黏着剂进一步地被施 加于所述滤光元件中对应于所述安装区域中具有相对较小宽度的一侧或二侧的侧表面与所述封装体的内侧面之间。
  8. 根据权利要求5所述的感光组件，其中，施加于所述滤光元件中对应于所述安装区域中具有相对较小宽度的一侧或二侧的侧表面与所述封装体的内侧面之间的所述黏着剂与施加于所述安装区域中具有相对较大宽度的其他侧的所述黏着剂为两种不同的黏着剂，以及，施加于所述滤光元件中对应于所述安装区域中具有相对较小宽度的一侧或二侧的侧表面与所述封装体的内侧面之间的所述黏着剂具有相对较低的流动性。
  9. 根据权利要求4或8所述的感光组件，其中，所述安装区域中具有相对较小宽度的一侧或二侧向所述终端设备的壳体方向缩进至所述安装区域中具有相对较小宽度的一侧或二侧与所述封装体的内侧面处于同一平面，以使得所述安装区域中具有相对较小宽度的一侧或二侧的宽度尺寸为零。
  10. 根据权利要求1所述的感光组件，其中，所述感光芯片、所述滤光元件和所述光学镜头所设定的光轴与所述线路板的中心轴线相偏移。
  11. 根据权利要求1所述的感光组件，进一步包括滤光元件和滤光元件支架，其中，所述滤光元件支架安装于所述封装体的上表面，所述滤光元件支架包括形成于所述滤光元件支架的内侧面并用于安装所述滤光元件的贴装区域，所述贴装区域中至少一侧相较于其他侧具有相对较小的宽度。
  12. 根据权利要求11所述的感光组件，其中，所述贴装区域中相邻的两侧相较于其他侧具有相对较小的宽度。
  13. 根据权利要求11所述的感光组件，其中，所述贴装区域中相对的两侧相较于其他侧具有相对较小的宽度。
  14. 根据权利要求11-13任一所述的感光组件，其中，所述封装体中邻近于终端设备的壳体的一侧相较于所述封装体的其他侧具有相对较小的宽 度以形成一窄边侧，在所述感光组件安装于所述终端设备时，所述窄边侧被配置对应于所述终端设备的壳体，所述贴装区域中具有相对较小的宽度的一侧位于所述窄边侧。
  15. 根据权利要求14所述的感光组件，进一步包括黏着剂，其中，所述滤光元件通过所述黏着剂被贴装于所述滤光元件支架的所述贴装区域，所述黏着剂施加于所述贴装区域中具有相对较大宽度的其他侧。
  16. 根据权利要求15所述的感光组件，其中，所述黏着剂进一步地被施加于所述滤光元件中对应于所述贴装区域中具有相对较小宽度的一侧或二侧的侧表面与所述滤光元件支架的内侧面之间。
  17. 根据权利要求5所述的感光组件，其中，施加于所述滤光元件中对应于所述贴装区域中具有相对较小宽度的一侧或二侧的侧表面与所述滤光元件支架的内侧面之间的所述黏着剂与施加于所述贴装区域中具有相对较大宽度的其他侧的所述黏着剂为两种不同的黏着剂，以及，施加于所述滤光元件中对应于所述贴装区域中具有相对较小宽度的一侧或二侧的侧表面与所述滤光元件支架的内侧面之间的所述黏着剂具有相对较低的流动性。
  18. 根据权利要求14或18所述的感光组件，其中，所述贴装区域中具有相对较小宽度的一侧或二侧向所述终端设备的壳体方向缩进至所述贴装区域中具有相对较小宽度的一侧或二侧与所述滤光元件支架的内侧面处于同一平面，以使得所述贴装区域中具有相对较小宽度的一侧或二侧的宽度尺寸为零。
  19. 根据权利要求4所述的感光组件，其中，所述封装体一体成型于所述线路板并一体包覆所述线路板的至少一部分和所述感光芯片的非感光区域的至少一部分。
  20. 根据权利要求4所述的感光组件，其中，所述封装体一体成型于所述线路板并一体包覆所述线路板的至少一部分。
  21. 根据权利要求4所述的感光组件，进一步包括至少一电子元器件，其中，所述至少一电子元器件设置于所述线路板中非位于所述窄边侧的其他侧。
  22. 根据权利要求4所述的感光组件，进一步包括用于电连接所述感光芯片和所述线路板的至少一引线，其中，所述引线设置于所述线路板中非位于所述窄边侧的其他侧。
  23. 根据权利要求4所述的感光组件，进一步包括用于电连接所述感光芯片和所述线路板的至少一引线，其中，部分所述至少一引线设置于所述线路板中位于所述窄边侧的一侧，以及，其他部分引线设置于所述线路板非位于所述窄边侧的其他侧。
  24. 一种摄像模组，用于被配置为终端设备的前置摄像模组，其特征在于，包括：
    光学镜头；
    根据权利要求1-23任一所述的感光组件，所述光学镜头被保持于所述感光组件的感光路径。
  25. 根据权利要求24所述的摄像模组，其中，所述光学镜头包括至少一光学透镜、用于安装所述至少一光学透镜于其内的内镜筒，以及，用于支持所述内镜筒的外镜筒，所述外镜筒中位于所述窄边侧的一侧相较于所述外镜筒的其他侧具有相对较小的宽度尺寸。
  26. 根据权利要求24所述的摄像模组，进一步包括驱动元件，其中，所述驱动元件安装于所述封装体的上表面，所述光学镜头安装于所述驱动元件，以使得所述光学镜头被保持于所述感光组件的感光路径，所述驱动元件位于所述窄边侧的一侧相较于所述驱动元件的其他侧的宽度尺寸较小。
  27. 一种终端设备，其特征在于，包括：
    壳体；
    安装于所述壳体的显示屏，以及
    根据权利要求1-21任一所述的摄像模组，其中，所述摄像模组与所述显示屏组装于所述终端设备的同一侧，以被配置为终端设备的前置摄像模组，其中，当所述摄像模组组装于所述终端设备时，所述摄像模组的窄边侧对应于所述壳体，以使得所述摄像模组更邻近于所述壳体。
PCT/CN2020/112142 2019-10-08 2020-08-28 感光组件、摄像模组和终端设备 WO2021068680A1 (zh)

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