Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
  • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
  • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
  • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
  • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
  • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation

Definitions

• the present invention relates to a storage system, a lithography system with such a storage system and a method for producing such a storage system.
• Microlithography is used to produce microstructured components such as integrated circuits.
• the microphotography process is carried out using a lithography system which has an illumination system and a projection system.
• the image of a mask (reticle) illuminated by means of the illumination system is projected by means of the projection system onto a substrate, for example a silicon wafer, coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, in order to place the mask structure on the light-sensitive coating of the substrate to transfer.
• a mask reticle
• photoresist light-sensitive layer
• an object of the present invention is to provide an improved storage system, a lithography system with such a storage system and a method for producing such a storage system.
• a storage system for storing a first component on a second component of a lithography system has: the first and second component and an adhesive that attaches the first and second component to one another, the first component having at least two mutually inclined surfaces and a first adhesive surface connecting the two surfaces, the second component having at least one between the has at least two spherical sections accommodated at inclined surfaces, which comprises a spherical surface section and a second adhesive surface, the second adhesive surface being arranged between two partial sections of the spherical surface section when viewed in cross section, and the adhesive being arranged between the first and the second adhesive surface.
• the first and second component By mounting the first and second component on each other by means of the at least one spherical section, which is introduced between the two mutually inclined surfaces, the first and second component only rests directly against one another at point or small surface contacts in the region of the mounting. As a result, a hard contact in the form of a surface contact between the first component and the second component can be avoided outside of this bearing. If the adhesive applied to the adhesive surfaces of the first and second component shrinks during curing, this avoidance of hard contact reduces the effect of a force on the first and/or second component. In particular, one caused by adhesive shrinkage Tilting of the first and / or second component can be avoided.
• the proposed bearing (and the lack of surface-related hard contacts outside the bearing) means that the force is not transferred to the first component avoided.
• an effect of the adhesive hardening on the position of the first and/or second component can be reduced.
• the lithography system is, for example, a DUV or an EUV lithography system.
• EUV stands for "extreme ultraviolet” (Engl.: extreme ultraviolet, EUV) and refers to a working light wavelength between 0.1 nm and 30 nm, in particular 13.5 nm.
• DUV also stands for "deep ultraviolet” (Engl .: deep ultraviolet, DUV) and designates a working light wavelength between 30 nm and 250 nm.
• the DUV or EUV lithography system includes a beam shaping and lighting system and a projection system.
• the image of a mask (reticle) illuminated by means of the illumination system is projected by means of the projection system onto a substrate coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, for example a silicon wafer, in order to to transfer the mask structure to the highly sensitive coating of the substrate.
• a light-sensitive layer for example a silicon wafer
• the first and/or the second component are in particular mechanical components.
• the first and/or second component is, for example, a carrier, a mount, a holder and/or a cover.
• the first or second component is, for example, a carrier and/or a mount of an optical element, such as a lens or a mirror of the DUV or EUV lithography system.
• the first or second component is, for example, a protective cover for the optical element.
• the first and/or second component can also be, for example, a mount for a measuring device, a diaphragm or another element of the lithography system.
• the first and/or the second component is made of metal, for example.
• the adhesive is in particular an adhesive that is applied to the first and/or the second adhesive surface in a liquid or viscous state and is cured to provide the adhesive connection.
• the adhesive is a physically setting adhesive or a chemically curing adhesive. The curing of the adhesive solidifies it and, in the solidified state, forms a solid layer of adhesive between the first and second component, in particular between the first and second adhesive surface.
• the adhesive layer formed in this way is in particular directly attached to the first and second adhesive layers and fastens them to one another.
• the two mutually inclined surfaces and the first adhesive surface delimit or form, in particular, a groove in which the ball section is accommodated.
• the first adhesive surface can, for example, be arranged at least partially perpendicularly to a direction which points from the first component to the second component.
• the first adhesive surface can, for example, connect the two mutually inclined surfaces in a straight line, viewed in cross section. In other words, the first adhesive surface can lie in a single plane.
• the first adhesive surface can also have other shapes and configurations, as long as it connects the two mutually inclined surfaces in such a way that, viewed in cross section, a closed groove results on the side of the first adhesive surface.
• the ball section is formed monolithically with the second component, for example.
• the ball section can also be a separate element that is attached to the second component (e.g. screwed on, clamped on, glued on).
• the spherical surface portion of the spherical portion is particularly curved in accordance with a sphere.
• the ball section is flattened, for example, at an end arranged adjacent to the first component, in order to provide the second adhesive surface.
• the spherical surface section is interrupted by the second adhesive surface, in particular adjacent to the first component.
• a spherical segment is placed between two mutually inclined surfaces, then there is in particular a point contact or, due to tolerances and deformation, a small surface contact between the two mutually inclined surfaces and the spherical segment, ie its spherical surface segment.
• the two mutually inclined surfaces are in particular straight in cross-section (e.g. in the case of a V-groove, a conical groove, a cone-segment-shaped groove and/or a funnel-shaped groove).
• the two mutually inclined surfaces can also be curved in cross section (e.g. in the case of a bulbous groove and/or a groove in the form of a bulbous cup).
• the two mutually inclined surfaces are, for example, two mutually inclined planes (e.g. in the case of a V-groove).
• the two mutually inclined surfaces can also each be curved surfaces (e.g. in the case of a conical groove, a conical segment-shaped groove and/or a funnel-shaped groove).
• the first component comprises at least one groove, a V-groove, a conical groove, a conical segment-shaped groove, a funnel-shaped groove, a bulbous groove, a groove in the form of a bulbous cup and/or a funnel-shaped groove, which, in particular hen in cross section gese, which has two mutually inclined surfaces.
• V-groove is a V-groove and the two surfaces inclined towards one another are inclined in a V-shape, viewed in cross-section.
• the tip of the V-groove differs from a V-shape (e.g. flattened or has a further indentation/recess) in order to form the second adhesive surface.
• a V-groove that is flattened at its tip can also be referred to as a cone segment
• first and the second component are in direct contact with each other only at point or surface contacts, which are formed by two mutually inclined surfaces and a spherical section.
• first and the second component are glued to one another at the first and the second adhesive surface by means of the adhesive.
• first and second members are bonded together only outside of the point or surface contacts (i.e. the point or surface contacts between the two mutually inclined surfaces and the spherical portion).
• the adhesive connection is only an indirect contact with the adhesive.
• first and the second component are in direct contact with one another only at a total of six point or area contacts.
• the first and second adhesive surfaces each comprise a plurality of discrete adhesive surfaces.
• the amount of adhesive or the area provided with adhesive can be reduced. Consequently, the effect of the adhesive hardening on the position of the first and/or second component can be reduced even further.
• the storage system comprises, in the cured state of the adhesive, a plurality of discrete adhesive layers spaced apart from one another between the first and the second component.
• the first and second adhesive surface is not a circumferential and/or ring-shaped adhesive surface.
• the storage system comprises a total of three discrete adhesive layers that are spaced apart from one another.
• the first component comprises at least one recess which communicates with the at least one V-groove, which recess has the first adhesive surface and in which the adhesive is arranged.
• the second component comprises at least one projection on the at least one ball section, which, viewed in cross section, protrudes between the two partial sections of the ball surface section and has the second adhesive surface.
• the projection is introduced into the recess of the first component and glued there by means of the adhesive.
• the first adhesive surface is formed by the inner walls of the recess.
• the second adhesive surface is formed by the outer walls of the projection.
• the adhesive can be applied in an even more targeted and defined manner.
• an application of adhesive outside the predefined ned first adhesive surface can be avoided. It is also better to prevent the adhesive in its liquid or viscous form from spreading to areas of the first and/or second component that lie outside the first and second adhesive surface.
• the recess is, for example, a pot or has a pot shape.
• the recess is not an annular (encircling) recess.
• the protrusion has a pin shape, for example.
• the projection is not an annular (circumferential) projection.
• the projection is formed monolithically with the second component, for example.
• the front can also be a separate element that is attached to the second component (e.g. screwed, clamped, glued).
• the projection protrudes in the direction of the first component.
• the second component has at least one threaded pin which is screwed at its first end section into a threaded borehole of the at least one ball section and forms the projection with the second adhesive surface at the second end section.
• the second component and in particular the projection can be easily made.
• the threaded pin is, for example, a grub screw which has no screw head.
• the at least one projection is designed in such a way that it can be bent relative to the at least one spherical section about a first bending axis and about a second bending axis perpendicular to the first bending axis. Both the first and the second bending axis are perpendicular arranged right to a direction pointing from the first component to the second component.
• the projection can flex relative to the ball portion, it is possible to withstand force from the adhesive as the adhesive cures, e.g. B. on the basis of an occurring adhesive shrinkage to compensate.
• the projection is formed by a threaded pin and the threaded pin, in particular its second end section, is designed in such a way that it can be bent about the first and second bending axis.
• the at least one projection has at least one first leaf spring for bending around the first bending axis and at least one second leaf spring for bending around the second bending axis.
• a head stretching direction of the first leaf spring is arranged perpendicular to a head stretching direction of the second leaf spring.
• the main extension directions of the first and second leaf springs are arranged parallel to the direction from the first component to the second component.
• the boss includes a pin having an internal cavity and a sidewall surrounding the cavity, and the leaf springs are formed by suitable indentations (ie gaps) in the sidewall.
• the second component comprises at least one recess which is formed in the at least one spherical section and has the second adhesive surface.
• the second adhesive surface is formed by inner walls of the recess formed in the at least one spherical segment.
• the adhesive can penetrate into the recess. This makes it easier to prevent adhesive from spreading outside of the predefined first and second adhesive area. For example, it is better to prevent the adhesive in its liquid or viscous form from spreading to areas of the first and/or second component that lie outside of the first and second adhesive surface.
• the recess formed in the at least one spherical section is, for example, a pot or has a pot shape.
• the recess formed in the at least one ball section is in particular not an annular (circular) recess.
• the second component has at least one screw which is screwed into a threaded bore of the second component at its first end section and has a spherical head at its second end section, which forms one of the at least one spherical section.
• one of the first and second components is a carrier of an optical element of the lithography system, and the other of the first and second components is an annular cover of the optical element of the lithography system.
• tilting of the carrier of the optical element and thus tilting of the optical element can be better avoided with the storage system. This can prevent optical properties of the optical element from being impaired by the hardening of the adhesive of the adhesive connection.
• the ring-shaped cover serves, for example, to protect against dirt.
• the first component comprises three V-grooves, which are arranged offset from one another by angles different from zero, the second component three ball sections, which are arranged offset from one another by angles different from zero, the first component three with the at least one V-groove communicating recesses, which are arranged offset from one another by angles different from zero, the second component three projections, which are arranged offset from one another by angles different from zero and/or the second component three in the at least a spherical portion formed finished recesses, which are offset by the non-zero angle to each other.
• the non-zero angles between the above elements are, for example, angles of 120° each. In other words are the aforementioned elements are arranged evenly distributed along a circle. However, the non-zero angles between the above-mentioned elements can also have values other than 120°.
• the at least one spherical section is a spherical segment and/or a spherical wedge, or the bearing system comprises precisely one spherical section and precisely one V-groove, and the spherical section is a torus section and the V-groove is an annular V-groove .
• a sphere segment is in particular a part of a full sphere which is formed from this by a section with a (single) plane.
• a spherical segment has, for example, the shape of a dome with a circular disc as the base.
• a spherical surface of the dome forms the "spherical surface section" of the spherical section.
• An opening angle of the spherical segment is, for example, less than or equal to 90°.
• the spherical segment can, for example, also be a hemisphere (aperture angle of 90°, radius of the base of the spherical segment corresponds to the radius of the full sphere).
• a spherical sector is in particular a cone-like section of a solid sphere.
• a spherical sector has in particular an opening angle of less than or equal to 90°.
• a sphere sector is a cone-like section from a center point of the solid sphere to its surface.
• the spherical sector can also be a hemisphere, for example (aperture angle of 90°).
• a torus section is in particular a section of a torus, in particular a rotary torus.
• a torus section can in particular have the same cross-sectional area as a spherical segment.
• a storage system for storing an annular cover on a carrier of an optical element of a litho graphic system proposed.
• the storage system includes the carrier and the annular cover. Furthermore, the carrier and the annular cover directly abut each other at only six point or surface contacts. In addition, the carrier and the annular cover are glued together.
• the adhesive connection between the carrier and the ring-shaped cover is only an indirect contact by means of the adhesive.
• the carrier and the annular cover are only glued together outside of the six point or surface contacts.
• a lithography system which has a storage system as described above.
• a method for producing a storage system for a lithography system comprises the steps: a) providing a first component, which comprises at least two mutually inclined surfaces and a first adhesive surface connecting the two surfaces, b) providing a second component, which includes at least one spherical section with a spherical surface section and a second adhesive surface , wherein the second adhesive surface is arranged between two partial sections of the spherical surface section, seen in cross section, c) arranging the second component on the first component, so that the at least one spherical section between the at least two mutually inclined ten surfaces is recorded and the first adhesive surface is arranged adjacent to the second adhesive surface, d) applying adhesive to the first and/or the second adhesive surface, and e) curing the adhesive.
• step d) can be carried out before or after step c).
• the first component comprises at least one recess which communicates with the at least two mutually inclined surfaces and which has the first adhesive surface, and the adhesive is arranged in the recess in step d).
• the second component comprises at least one projection on the at least one ball section, which has the second adhesive surface.
• the at least one projection is designed in such a way that it can be bent relative to the at least one ball section about a first bending axis and about a second bending axis perpendicular to the first bending axis, with both the first and the second bending axis being arranged perpendicular to a direction which from the first component to the second component.
• the projection is introduced into the recess.
• any force exerted by the adhesive on the first and/or second component during the curing in step e) is compensated for by a bending of the projection about the first and/or second bending axis.
• FIG. 1A shows a schematic view of an embodiment of an EUV lithography system
• FIG. 1B shows a schematic view of an embodiment of a DUV lithography system
• FIG. 2 shows a plan view of a storage system according to a first embodiment of the EUV or DUV lithography system from FIG. 1A or 1B;
• FIG. 3 shows a carrier with an annular V-groove of the bearing system of Fig. 2;
• FIG. 4 shows a view similar to FIG. 3, the carrier having three individual V-grooves instead of an annular V-groove;
• Fig. 5 shows a V-groove ball bearing of the bearing system from Fig. 2 before assembly:
• Fig. 6 shows the V-groove ball bearing from Fig. 5 after assembly:
• Fig. 7 shows a perspective view of a V-groove ball bearing of a bearing system according to a second embodiment:
• Fig. 8 shows a cross-sectional view of the V-groove ball bearing of Fig. 7 before assembly:
• Fig. 9 shows the V-groove ball bearing from Fig. 8 after assembly:
• FIG. 10 shows a V-groove ball bearing of a bearing system according to a variant of the second embodiment after assembly:
• FIG. 11 shows a shank of a set screw of the V-groove ball bearing from FIG. 10;
• FIG. 12 shows a V-groove ball bearing of a bearing system according to a third embodiment before assembly
• FIG. 13 shows the V-groove ball bearing of FIG. 12 after assembly
• FIG. 14 shows a flow chart illustrating a method for manufacturing a storage system according to an embodiment.
• elements that are the same or have the same function have been provided with the same reference symbols , unless otherwise stated.
• the illustrations in the figures are not necessarily true to scale.
• EUV stands for "extreme ultraviolet” (English: extreme ultraviolet , EUV) and denotes a wavelength of the working light between 0.1 nm and 30 nm, in particular 13.5 nm.
• the beam shaping and lighting system 102 and the projection system 104 are each provided in a vacuum enclosure, not shown, and each vacuum enclosure is evacuated by an evacuation device, not shown.
• the vacuum housings are surrounded by a machine room, not shown, in which drive devices are provided for mechanically moving or adjusting optical elements. Furthermore, electrical controls and the like can also be provided in this machine room.
• the EUV lithography system 100A has an EUV light source 106A.
• a plasma source (or a synchrotron) can be provided as the EUV light source 106A , for example, which emits radiation 108A in the EUV range (extremely ultraviolet range), ie for example in the wavelength range from 5 nm to 20 nm.
• the EUV radiation 108A is bundled in the beam shaping and illumination system 102 and the desired operating wavelength is filtered out of the EUV radiation 108A.
• the EUV radiation 108A generated by the EUV light source 106A has a relatively low transmissivity through air, which is why the beam guidance spaces in the beam shaping and illumination system 102 and in the projection system 104 are evacuated.
• the E UV radiation 108A After passing through the beam shaping and illumination system 102 , the E UV radiation 108A is directed onto a photomask (EngU reticle) 120 .
• the photomask 120 is also designed as a reflective optical element and can be arranged outside of the systems 102, 104. Furthermore, the EUV radiation 108A can be directed onto the photomask 120 by means of a mirror 122 .
• the photomask 120 has a structure which is imaged on a wafer 124 or the like in reduced form by means of the projection system 104 .
• the projection system 104 (also referred to as a projection objective) has six mirrors M1 to M6 for imaging the photomask 120 onto the wafer 124.
• individual mirrors M1 to M6 of the projection system 104 can be arranged symmetrically with respect to an optical axis 126 of the projection system 104.
• the number of mirrors M1 to M6 of the EUV lithography system 100A is not limited to the number shown. More or fewer mirrors M1 to M6 can also be provided.
• the mirrors M1 to M6 are generally curved on their front side for beam formation.
• Fig. 1B shows a schematic view of a DUV lithography system 100B, which includes a beam shaping and illumination system 102 and a projection system 104 ⁇ .
• DUV stands for "deep ultraviolet” (Engl .: deep ultraviolet, DUV ) and denotes a wavelength of the working light between 30 nm and 250 nm described for FIG . 1A - be arranged in a vacuum housing and/or surrounded by a machine room with corresponding drive devices.
• the DUV lithography system 100B has a DUV light source 106B.
• An ArF excimer laser for example, can be provided as the DUV light source 106B, which emits radiation 108B in the DUV range at, for example, 193 nm.
• the beam shaping and illumination system 102 shown in FIG. 1B guides the DUV radiation 108B onto a photomask 120.
• the photomask 120 is designed as a transmissive optical element and can be arranged outside of the systems 102, 104.
• the photomask 120 has a structure which is reduced by means of the projection system 104 to a wafer 124 or the like ⁇ Chen from formed.
• the projection system 104 has a plurality of lenses 128, 130 and/or mirrors 132 for imaging the photomask 120 onto the wafer 124.
• individual lenses 128, 130 and/or mirrors 132 of the projection system 104 can be arranged symmetrically with respect to an optical axis 126 of the projection system 104.
• the number of lenses 128, 130 and mirrors 132 of the DUV lithography tool 100B is not limited to the number illustrated. More or fewer lenses 128, 130 and/or mirrors 132 can also be provided.
• the mirrors 132 are usually curved on their front side for beam shaping.
• FIG. 2 shows a top view of a storage system 200 of the EUV or DUV lithography system 100A, 100B.
• the storage system 200 has a first me ⁇ chanical component 202 and a second mechanical component 204 and is used to store these two components 202, 204 together.
• the storage system 200 is used to store an annular cover 204 on a carrier 202 of an optical element 206.
• the annular cover 204 covers both the carrier 202 and the optical element 206 partially, especially in a respective edge area, from above.
• the ring-shaped cover 204 serves, for example, to protect against dirt.
• the ring-shaped cover 204 is configured and arranged, for example, in such a way that it allows an air flow between the optical element 206 and the cover 204 .
• the ring-shaped cover 204 is only drawn in dashed lines to make the optical element 206 and the carrier 202 easier to see.
• the annular cover 204 and the support 202 are made of metal, for example.
• the optical element 206 is, for example, the last lens 130, arranged in front of the wafer 124, of the DUV lithography system 100B from FIG. 1B.
• the optical element 206 can also be another optical element of the EUV or DUV lithography system 100A, 100B from FIGS. 1A, 1B.
• the optical element 206 can also be one of the mirrors 110-118,
• the annular cover 204 is mounted on the carrier 202 via a point bearing, for example a V-groove ball bearing 208 (Fig. 5), through which between the first and second components 202, 204 there are only point contacts or small area contacts in the area of the bearing due to tolerances and deformation.
• a point bearing for example a V-groove ball bearing 208 (Fig. 5)
• the annular cover 204 is adhered to the carrier 202 by an adhesive bond 210 (FIG. 6) located outside of the point or area contacts of the V-groove ball bearing 208.
• Fig. 3 shows the carrier 202 in the same orientation as in Fig. 2, but without the optical element 206 and without the annular cover 204. As in Fig.
• the carrier 202 has a groove, in the example shown an annular V-groove 214.
• FIG. 5 shows the V-groove 214 in a radial cross section (section along line BB in FIG. 3).
• the carrier 202' can also have three individual V-grooves 214', as shown in FIG.
• the three individual V-grooves 214' are offset from one another at angles of ⁇ , ⁇ , g.
• the three individual V-grooves can also be offset from one another at angles ⁇ , ⁇ , g that are different from zero.
• the cross section of the V-groove 214, 214' shown in Figures 5 and 6 corresponds both to the cross-section of the annular V-groove 214 (Fig. 3) and to the cross-section of one of the three V- grooves 214' (Fig 4). It is noted that instead of the annular V-groove 214 (Fig. 3) or the three individual V-grooves 214 ', one or more other shaped grooves, such as a cone-shaped groove, a cone-shaped groove, a funnel-shaped groove, a bulbous Groove and/or a groove in the form of a bulbous cup can be used. As shown in FIG. 5, the V-groove 214, 214' has two surfaces 216 inclined towards one another.
• the V-groove 214, 214' has a first adhesive surface 218 connecting the two surfaces 216 for adhesive connection to the annular cover 204 .
• the V-groove 214, 214' has a V-shape truncated at the bottom (in FIG. In the example shown in FIG. 5, the first adhesive surface 218 is arranged perpendicular to a direction Z, which points from the carrier 202 to the cover 204.
• the cover 204 In order to support the cover 204 on the carrier 202 by means of the V-groove ball bearing 208, the cover 204 has three ball sections 220, one of which is shown in cross section in FIGS. 5 shows the V-groove ball bearing 208 in a condition before the ball portion 220 has been placed in the V-groove 214 or 214'. 6 shows the V-groove ball bearing 208 in a state in which the ball section 220 is in the V-groove 214 or 214'.
• Each of the three ball portions 220 protrudes from a bottom surface 222 (FIG. 5) of the cover 204 toward the carrier 202.
• the ball section 220 shown in FIG . 5 is in particular a hemisphere which is flattened at one end 224 which is lower in FIG.
• Each of the three spherical sections 220 includes a spherical surface section 226 which is spherically curved according to a solid sphere 228 .
• each of the three spherical sections 220 has a second adhesive surface 230 .
• the second adhesive surface 230 is arranged in FIG. 5 on the flattened end 224 of the spherical section 220 .
• FIG. 5 the example shown in FIG.
• the second adhesive surface 230 is arranged perpendicularly to the Z direction.
• the second adhesive surface 230 is, seen in the cross section of FIG . 5, arranged in particular between two partial sections 232 and 234 of the spherical surface section 226 .
• liquid adhesive 212 is introduced between the first and second adhesive surfaces 218,230.
• each of the three ball sections 220 is placed in the one annular V-groove 214 ( Figures 3 and 6) or in one of the three individual V-grooves 214' ( Figures 4 and 6) and stored therein such that a ball section 220 rests on the mutually inclined surfaces 216 of the V-groove 214, 214' at two contact points or two small contact surfaces A1, A2.
• the cover 204 is in contact with the carrier 202 via the V-groove and ball bearing 208 only at point or surface contacts in the area of the bearing 208 .
• a single torus section (not shown), which also has a radial cross-section as shown in FIG. 5, can be used.
• the adhesive 212 introduced in liquid form between the first and second adhesive surface 218, 230 is cured and, in solidified form, forms an adhesive layer 212' (FIG. 6).
• the adhesive connection 210 between the annular cover 204 and the carrier 202 is produced by the fixed adhesive layer 212'.
• the adhesive 212, 212' may shrink and thereby exert a force on the annular cover 204 and/or the carrier 202. Since the adhesive 212, 212' is only applied at three discrete locations between the cover 204 and the carrier 202, namely at the flattened side TE 224 (FIG. 5) arranged second adhesive surface 230 of the three ball sections 220, a force applied by the adhesive 212, 212′ is reduced compared to a case in which an adhesive is applied areally and annularly between a component, such as an annular cover 204, and another component, such as a carrier 202.
• the V-groove ball bearing 208 (FIG. 6) between the cover 204 and the carrier 202 prevents this from happening the carrier 202 is also tilted. Consequently, it is possible in particular to prevent an optical element 206 (FIG. 2) held by the carrier 202, such as a lens or a mirror, from being displaced and/or tilted.
• FIGS. 3 A second embodiment of the bearing system 300 with a V-groove ball bearing 308 and an adhesive connection 310 is shown in FIGS.
• the storage system 300 has a carrier 302 for an optical element 206 (similar to the carrier 202 according to the first embodiment) and an annular cover 304 (similar to the ring ⁇ -shaped cover 204 according to the first embodiment).
• the carrier 302 has a V-groove 314 (similar to the V-groove 214, 214', Fig. 5) and three recesses 340 in communication with the V-groove 314 (Fig. 8).
• the V-groove 314 can be an annular V -groove corresponding to the V-groove 214 (FIG. 3) or three individual V-grooves can correspond to the V-groove 214' ( 4) are present.
• the recesses 340 (FIG. 8) communicating with the V-groove 314 are in particular cup-shaped and are formed on the carrier 302 at three discrete locations spaced apart from one another.
• the recesses 340 are in particular not circumferential or ring-shaped.
• Each of the recesses 340 one of which is shown in cross section in FIGS. 8 and 9, has an adhesive surface 318 (first adhesive surface) on its inner walls 342, in which the adhesive 312 (FIG. 9) is arranged.
• the annular cover 304 has three ball sections 320, one of which is shown in FIGS. 8 and 9 in cross section.
• the Kugelab sections 320 like the spherical portions 220 of the first embodiment (Fig. 5), a spherical surface portion 326 with two sections 332, 334 on.
• the ball sections 320 differ from the ball sections 220 of the first embodiment (FIG. 5) by a projection 344 arranged on the respective ball section.
• the projection 344 can be formed monolithically with the ball section 320 (not shown).
• the protrusion may be provided by a separate member 346 which attaches to the ball portion 320.
• the protrusion 344 is provided by a threaded screw 346 having a thread 350 on a first end portion 348 .
• the threaded screw 346 is screwed into a threaded bore 352 of the ball section 320 (Fig. 9) so that the projection 344 provided by a shank 354 (second end section 354) of the threaded screw 346, viewed in cross section, lies between the two sections 332, 334 of the Ball surface section 326 protrudes.
• the projection 344 also has a second adhesive surface 330 for adhesive attachment to the first adhesive surface 318 of the recess 340.
• an adhesive 312 (FIG. 9) is inserted into the recess 340 of the carrier 302 filled in liquid form. Then the ring-shaped cover 304 is arranged on the carrier 320 in such a way that the projection 344 is introduced into the recess 340 of the carrier 302 and glued there by means of the adhesive 312, 312'. Also, as in the first embodiment, the ball portion 320 is inserted into the V-groove 314 (Fig. 9) so that the ball portion 320 is in discrete point or surface contact A1, A2 at mutually inclined surfaces 316 of the V-groove 314 is present. Curing of the adhesive 312 forms a firm adhesive layer 312' which produces the adhesive connection 310 between the annular cover 304 and the carrier 302.
• the adhesive 312 can be applied in a targeted manner through the recess 340 with the first adhesive surface 318 and the projection 344 with the second adhesive surface 330 . In particular, it can be avoided that the adhesive 312 in its liquid form spreads to areas of the annular cover 304 and/or the carrier 302 outside of the first and second adhesive surfaces 318, 330.
• FIG. 10 shows a variant of the second embodiment of the bearing system 300' with the V-groove ball bearing 308'. Only differences from the second embodiment are described below.
• the protrusion 344' is configured to flex relative to the ball portion 320 to balance forces upon curing of the adhesive 312, 312'.
• the protrusion 344' can pivot relative to the ball portion 320 about a first bending axis X (parallel to the X-direction in Fig. 10) and about a second bending axis Y perpendicular to the first bending axis X (parallel to the Y-direction in Fig. 10). to bend.
• Both the first X and the second bending axis Y are arranged perpendicularly to the Z direction pointing from the carrier 302 to the cover 304 .
• the flexibility of the projection 344' is realized by incisions 356 in a wall of the shank 354' of the threaded screw 346'.
• FIG. 10 shows a cross section, two incisions 356, which would actually only be visible in a top view, are shown in FIG. 10 for reasons of clarity.
• a web 358 remains between the two incisions 356 and forms a first leaf spring 360 .
• On the rear side of the shaft 354 ' is formed by the two incisions 356 to the first leaf spring 360 symmetrical leaf spring 360.
• the first two leaf springs 360 each have a main extension plane in the YZ plane and allow the shaft 354' (ie the projection 344') to bend about a bending axis in the X direction. Furthermore, the shaft 354' has two further incisions 362, 364 (FIG. 11), through which two second leaf springs 366 are formed (one of which can be seen in FIG. 11). The two second leaf springs 366 have a main extension plane in the XZ plane and allow bending of the shaft 354' (ie the projection 344') about a bending axis in the Y direction.
• the flexibility of the shaft 346' makes it possible to compensate for a force occurring during the curing of the adhesive 312, 312'. This compensation can prevent the carrier 302 and thus the optical element 206 (FIG. 2) from tilting due to the hardening of the adhesive 312, 312′ of the adhesive connection 310 .
• FIG. 12 and 13 is a third embodiment of the storage system 400 with a V-groove ball bearing 408 and an adhesive connec Phyg 410 ge shows.
• the storage system 400 according to the third embodiment has a carrier 402 for an optical element 206 (similar to the carrier 202 according to the first embodiment) and an annular cover 404 (similar to the annular cover 204 according to the first embodiment).
• the ball section 420 has a recess 440 which has the second adhesive surface 430.
• the Kugelab ⁇ section 420 is not monolithic with the annular cover 404 (as in the first embodiment, Fig. 5), but as a separate element 442 is formed.
• the storage system 400 has a screw 442 as a separate element, which has a thread at its first end section 444 with which it can be screwed into a threaded bore 446 of the annular cover 404 .
• the screw 442 has a ball head 450 on its second end section 448 which forms the ball section 420 with the recess 440 .
• the ball section 420 which is formed by a ball head 450 of a separate screw 442, as shown in FIGS. 12 and 13, can also be realized without the recess 440.
• Fig. 13 shows the storage system 400 of the third embodiment in the assembled state with the storage at a support point or a discrete support surface A1, A2 and the hardened adhesive connection 410.
• a method for producing a mounting system 200 for a lithography system 100A, 100B according to a first embodiment is described below with reference to FIGS.
• a first component 202 such as a carrier 202 of an optical element 206 ( FIGS . 2 and 5), is provided , which has at least two mutually inclined surfaces 216 and one connecting the two surfaces 216 first adhesive surface 218 comprises.
• a second component 204 such as an annular cover 204 ( FIGS . 2 and 5), which has at least one spherical section 220 with a spherical surface section 226 and a second adhesive surface 230 includes.
• the second adhesive surface 230 is, viewed in cross section, arranged between two partial sections 232 of the spherical surface section 226 .
• the second component 204 is arranged on the first component 202, so that the at least one spherical segment 220 is received between the at least two mutually inclined surfaces 216 and the first adhesive surface 218 is arranged adjacent to the second adhesive surface 230.
• an adhesive 212 is applied to the first and/or the second adhesive surface 218, 230.
• the adhesive 212 is cured so that it forms a solid adhesive layer 212'.

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• 2021
  • 2021-06-24 DE DE102021206515.5A patent/DE102021206515B4/de active Active
• 2022
  • 2022-05-30 WO PCT/EP2022/064618 patent/WO2022268445A1/de not_active Ceased
  • 2022-05-30 CN CN202280043996.7A patent/CN117546094A/zh active Pending
  • 2022-05-30 JP JP2023578118A patent/JP2024524956A/ja active Pending
• 2023
  • 2023-12-21 US US18/391,797 patent/US20240126184A1/en active Pending

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