WO2022262178A1 - 一种刚挠结合板高精密线路的制备方法 - Google Patents

一种刚挠结合板高精密线路的制备方法 Download PDF

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WO2022262178A1
WO2022262178A1 PCT/CN2021/129345 CN2021129345W WO2022262178A1 WO 2022262178 A1 WO2022262178 A1 WO 2022262178A1 CN 2021129345 W CN2021129345 W CN 2021129345W WO 2022262178 A1 WO2022262178 A1 WO 2022262178A1
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rigid
resolution
preparing
copper
ldi exposure
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PCT/CN2021/129345
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English (en)
French (fr)
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郑海涛
王康兵
莫欣满
张鉴泽
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广东科翔电子科技股份有限公司
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Publication of WO2022262178A1 publication Critical patent/WO2022262178A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the invention relates to the technical field of circuit board manufacture, in particular to a method for preparing a high-precision circuit of a rigid-flex board.
  • PCBs printed circuit boards
  • the line level especially the line level breaks through 30/30 ⁇ m.
  • the pure subtractive process can no longer meet the product demand, and the MSAP process is more favored by PCB companies.
  • the pure MSAP process is used to produce such line grades, it will cause uneven copper reduction and unreasonable line compensation, resulting in line dog teeth, Product abnormalities such as short circuit and open circuit directly affect the production efficiency of the product, and there are risks of high rework rate and quality loss.
  • this technology innovatively proposes a method for the preparation of high-precision rigid-flex boards, through the optimization of the MSAP process, the addition of a whitening process, and the anti-compensation optimization of engineering data for the resolution accumulation error of the LDI exposure machine. Plan to systematically improve on-site process capabilities and improve the manufacturing process of rigid-flex board precision circuits.
  • the present invention proposes a method for preparing a high-precision circuit of a rigid-flex board, including the following steps:
  • S2 Use ultraviolet laser UV drilling, and sequentially perform plasma degumming, black hole process and flash plating treatment, after the flash plating treatment is completed, perform micro-etching to clean the board surface, and then perform wet lamination and post-baking processes;
  • S3 Carry out the laser direct imaging LDI exposure process, and use the laser direct imaging LDI exposure machine resolution cumulative error reverse compensation to optimize the resolution;
  • the whitening process includes: removing foreign matter on the surface of the PCB by washing with acid and alkali chemicals.
  • the foreign matter includes at least oxides, grease, residual dry film and fingerprints on the surface of the PCB, but is not limited to them.
  • the ultraviolet laser UV drilling adopts the yttrium-aluminum spar laser head, and the ultraviolet laser beam is shot on the copper foil, the copper foil is pierced, and the base material is burned to form a hole with a diameter of less than 75 ⁇ m.
  • said laser direct imaging LDI exposure machine resolution cumulative error counter-compensation includes: after converting the graphics file designed by computer-aided manufacturing software CAM or electronic component design computer-aided production software Genesis from vector format into a scalar file, and then The exposure process is performed by a laser direct imaging LDI exposure machine.
  • the converting the vector format into a scalar file also includes: dividing the graphic file into pictures in units of pixels, which is the minimum resolution of the LDI exposure machine, and each pixel has only 0 or 1 attribute.
  • LDI exposure machine resolution cumulative error reverse compensation also includes: according to the resolution requirements of the dry film, combined with the resolution of the LDI exposure machine, reducing at least one pixel pixel for reverse compensation of the exposure line size.
  • use the alignment target shot out by the shooting machine When exposing, use the alignment target shot out by the shooting machine.
  • use a shooting machine to blindly punch the inner core board at a fixed distance.
  • use a shooting machine to use X-rays to look at the target and shoot the target with the dry film coating alignment target that the inner layer circuit has been prepared.
  • the present invention provides a method for manufacturing high-precision circuits of rigid-flex boards, which optimizes the MSAP process by adding a whitening process and counter-compensating the cumulative error of the resolution of the LDI exposure machine.
  • the whitening process includes washing foreign matter on the surface of the PCB by acid-base potion, while not increasing the roughness of the copper surface, the copper surface is activated, and the copper is uniformly reduced to ensure that the surface of copper ions is more likely to escape under the excitation of ultraviolet light waves. surface.
  • at least one pixel is reduced to perform reverse compensation of the exposure line size, thereby ensuring the yield rate of the line.
  • the invention proposes a method for preparing a high-precision circuit of a rigid-flex board, comprising the following steps:
  • S2 Use ultraviolet laser UV drilling, and sequentially perform plasma degumming, black hole process and flash plating treatment, after the flash plating treatment is completed, perform micro-etching to clean the board surface, and then perform wet lamination and post-baking processes;
  • S3 Carry out the laser direct imaging LDI exposure process, and use the laser direct imaging LDI exposure machine resolution cumulative error reverse compensation to optimize the resolution;
  • S4 Carry out post-sequence processing, including developing sequentially, using vertical developing lines for developing; degreasing treatment, pickling treatment, graphics and hole-filling electroplating, and using organic film-removing liquid for film removal, baking, flash etching, and finally Red/blue light source automatic optical inspection AOI equipment is used for automatic optical inspection processing.
  • the whitening process remove oxides, grease, residual dry film, fingerprints and other foreign matter on the surface of the PCB by acid and alkali washing, and through the chemical reaction between the potion and the copper surface of the PCB, without increasing the roughness of the copper surface , to activate the copper surface and reduce copper evenly.
  • the active copper ion surface is more likely to escape from the surface under the excitation of ultraviolet light waves, which is suitable for manufacturing precision circuits.
  • UV laser adopts yttrium aluminum alloy spar YAG-UV laser head, generally the aperture is small, and the hole is ⁇ 75 ⁇ m.
  • the UV laser can directly rely on the advantages of strong and concentrated UV beam energy.
  • the active copper ions are converted into excited states by using the high-energy photons of ultraviolet rays, allowing them to escape from the surface, and at the same time tear the chemical bonds of long-term healthy polymer organic matter and E-stage glass fiber.
  • the volume of many broken particles increases and the external force sucks, so that the base material can be quickly removed to form holes.
  • the absorption rate of UV rays to resin or glass fiber or copper foil is ⁇ 70%.
  • the laser direct imaging LDI exposure machine resolution accumulation error anti-compensation because the data designed by the computer-aided manufacturing software CAM/electronic component design computer-aided production software Genesis is a vector format, that is, a graphic file, the position of the graphic is described, direction and length.
  • LDI must use image files in scalar format. Therefore, first convert the graphics file designed by CAM or Genesis from vector format to scalar file, and then perform exposure processing through LDI exposure machine, that is, the graphics are divided into pictures in units of pixels, and each pixel pixel is only 0 (lost) or 1 (existence) attribute.
  • the two formats are not completely equal, which will cause part of the picture to be lost, and the pixel is the unit picture, which is the minimum resolution of the LDI exposure machine.
  • Anti-compensation requirements for engineering data For better explanation, another example is listed here: The resolution of LDI exposure machine is 2.457 ⁇ m.
  • the resolution of LDI exposure machine is 2.457 ⁇ m.
  • the line width is 1 attribute must exist , so the originally designed 30 ⁇ m line becomes 31.941 ⁇ m during the conversion process, and when an additional 5 ⁇ m is compensated according to the copper thickness or etching factor, the line width is converted from the original 35 ⁇ m to 36.855 ⁇ m. In this way, the spacing will be smaller, and the resolution of the dry film will not be achieved, resulting in poor line yield.
  • the line can be reverse-compensated according to the resolution of the exposure machine, that is, one pixel is reduced, and the line width is reduced from the original compensated 35 ⁇ m to 34.3 ⁇ m, which can meet the requirements.
  • the alignment method when exposing, the target position used is the alignment target shot by the shooting machine; if this layer is the inner core board, it needs to be blindly hit by the shooting machine at a fixed distance; if it has been pressed For the board, it is necessary to use the target shooting machine to use the X-RAY target shooting method to shoot the selected dry film alignment target with the inner layer circuit already done.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

提供一种刚挠结合板高精密线路的制备方法，通过新增白化流程和LDI曝光机解析度累积误差反补偿的方式对MSAP流程进行优化；其中，白化工艺流程包括通过酸碱药水洗除PCB表面的异物，在不增加铜面的粗糙度的同时，活跃铜表面，均匀减铜，保证铜离子表面在紫外线光波的激发下，更容易逃脱表面；在LDI曝光时进一步根据干膜的解析度需求，再结合所述LDI曝光机的解析度，减小至少一个pixel进行曝光线路尺寸的反补偿，从而保证线路的良率。

Description

一种刚挠结合板高精密线路的制备方法 技术领域
本发明涉及电路板制作技术领域，尤其是涉及一种刚挠结合板高精密线路的制备方法。
背景技术
随着电子通讯发展得越来越快，为了满足电子设备微型化的需求，印制电路板(PCB)也逐渐往高精密线路发展。而随着线路等级的升级，尤其线路等级突破30/30μm。单纯的减成法工艺已经无法满足产品需求，MSAP工艺则更受PCB企业青睐而单纯的MSAP工艺在制作此类线路等级时，会因为减铜不均、线路补偿不合理，导致线路狗牙、短路、断路等产品异常，直接影响产品的生产效率，同时存在返工率高和品质漏失风险。
发明内容
针对上述问题，本技术创新地提出了一种刚挠结合板高精密线路的制备方法，通过对MSAP流程优化，以及新增白化流程和针对LDI曝光机解析度累积误差反补偿优化工程资料等技术方案来系统提升现场制程能力，完善刚挠结合板精密线路的制作工艺。
具体的，本发明提出了一种刚挠结合板高精密线路的制备方法，包括以下步骤：
S1：完成内层制作后，进行铜箔压合及去PET膜，采用化学有机液去除厚铜，增加白化工艺流程进行减铜；
S2：采用紫外激光UV钻孔，并依次进行等离子除胶，黑孔工艺及闪镀处理，完成所述闪镀处理后再进行微蚀清洁板面，然后进行湿法压膜和后烘工艺；
S3：进行激光直接成像LDI曝光工艺，并采用激光直接成像LDI曝光机解析度累积误差反补偿进行解析度优化；
S4：进行后序工艺处理，包括依次进行显影，脱脂，酸洗，图形及填孔电镀，去膜，烘烤，闪蚀，最后采用红或蓝光双灯源自动光学检测AOI设备进行自动光学检测处理。
其中，所述白化工艺流程，包括：通过酸碱药水洗除PCB表面的异物。优选的，所述异物至少包括PCB表面的氧化物，油脂，残留的干膜和指纹印，但不限于从。
进一步的，所述紫外激光UV钻孔采用钇铝合晶石激光头，将紫外激光光束打在铜箔上，将铜箔打穿，同时烧掉基材形成成孔的直径小于75μm。
进一步的，所述激光直接成像LDI曝光机解析度累积误差反补偿，包括：将计算机辅助制造软件CAM或电子元器件设计计算机辅助制作软件Genesis设计的图形文件由矢量格式转换成标量文件后，再通过激光直接成像LDI曝光机进行曝光处理。
进一步的，所述将矢量格式转换成标量文件，还包括：将所述图形文件分成以像素pixel为单位的图片就是LDI曝光机的最小解析度，每一个像素pixel只有0或1属性。
进一步的，采用LDI曝光机解析度累积误差反补偿，还包括：根据干膜的解析度需求，再结合所述LDI曝光机的解析度，减小至少一个像素pixel进行曝光线路尺寸的反补偿。
在曝光时，采用打靶机打出来的对位靶。可选的，采用打靶机对内层芯板进行定距离盲打。对于若是已经过压合后的板子，则采用打靶机利用X射线看靶打靶方式打出内层线路已经做好的选镀干膜对位靶。
综上所述，本发明提供一种刚挠结合板高精密线路的制备方法，通过新增白化流程和LDI曝光机解析度累积误差反补偿的方式对MSAP流程进行优化。其中，白化工艺流程包括通过酸碱药水洗除PCB表面的异物，在不增加铜面的粗糙度的同时，活跃铜表面，均匀减铜，保证铜离子表面在紫外线光波的激发下，更容易逃脱表面。在LDI曝光时进一步根据干膜的解析度需求，再结合所述LDI曝光机的解析度，减小至少一个pixel进行曝光线路尺寸的反补偿，从而保证线路的良率。
具体实施方式
为了使本技术领域的人员更好地理解本发明方案，下面对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明提出了一种刚挠结合板高精密线路的制备方法，包括以下步骤：
S1：完成内层制作后，进行铜箔压合及去PET膜，采用化学有机液去除厚铜，增加白化工艺流程进行减铜；
S2：采用紫外激光UV钻孔，并依次进行等离子除胶，黑孔工艺及闪镀处理，完成所述闪镀处理后再进行微蚀清洁板面，然后进行湿法压膜和后烘工艺；
S3：进行激光直接成像LDI曝光工艺，并采用激光直接成像LDI曝光机解析度累积误差反补偿进行解析度优化；
S4：进行后序工艺处理，包括依次进行显影，采用垂直显影线进行显影；脱脂处理，酸洗处理，图形及填孔电镀，以及采用有机退膜液进行去膜，烘 烤，闪蚀，最后采用红/蓝光双灯源自动光学检测AOI设备进行自动光学检测处理。
其中，所述白化工艺流程：通过酸碱洗除PCB表面的氧化物、油脂、残留的干膜、指纹印等异物，通过药水与PCB铜面发生的化学反应，在不增加铜面的粗糙度，起到活跃铜表面，均匀减铜的作用，活跃的铜离子表面在紫外线光波的激发下，更容易逃脱表面，适于制造精密线路。
所述紫外激光UV钻孔：UV激光采用的是钇铝合晶石YAG-UV激光头，一般光圈较小，成孔≤75μm，UV激光依靠其本身UV光束能量强且又集中的优势可直接打穿铜箔，同时烧掉基材而成孔。根据光化作用原理，利用其紫外线所具有的高能量光子，将活跃的铜离子转化为激发态，让其逃脱表面，同时将长健状高分子有机物、E阶玻纤的化学键撕裂，在众多碎粒体积增大与外力抽吸下，使基材呗快速移除而成孔。采用这种成孔方式不存在热烧残渣，故成孔表面清洁，孔壁无炭化残渣。其中，UV紫外线对树脂或玻纤或铜箔的吸收率≥70％。
所述激光直接成像LDI曝光机解析度累积误差反补偿：由于计算机辅助制造软件CAM/电子元器件设计计算机辅助制作软件Genesis设计的资料是矢量格式，即图形文件，描述的事这个图形的位置、方向及长度。LDI作为数字扫描成像设备，必须采用的是标量格式的图片文件。故先将CAM或Genesis设计的图形文件由矢量格式转换成标量文件后，再通过LDI曝光机进行曝光处理，即将图形分成以像素pixel为单位的图片，每一个像素pixel只有0(失去)或1(存在)属性。不同线宽或间距在转换过程中，就会存在两种格式不完全相等的情况发生，这就会导致部分图片丢失，而像素pixel为单位图片，就是LDI曝光机的最小解析度。
对工程资料进行反补偿要求：为了更好的解释，此处列举出另一实施例如下：LDI曝光机解析度为2.457μm在设计30/30μm线路等级的时候，因线宽是1属性必须存在，故原设计的30μm线路在在转换过程中就好变成31.941μm，再依据铜厚或蚀刻因子额外补偿5μm时，线宽就由原来的35μm转换成了36.855μm。这样间距就会更小，干膜的解析度达不到，从而导致线路良率较差。这时可以根据曝光机的解析度来反补偿线路，即减小一个pixel，线宽由原来补偿后的35μm减小至34.3μm，就可以达到要求。
其中，对位方式：在曝光时，采用的靶位是打靶机打出来的对位靶；若此层为内层芯板着需要打靶机进行定距离盲打即可；若是已经过压合后的板子，则需要采用打靶机利用X-RAY看靶打靶方式打出内层线路已经做好的选镀干膜对位靶。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为主。

Claims (7)

  1. 一种刚挠结合板高精密线路的制备方法，其特征在于，包括如下步骤：
    S1：完成内层制作后，进行铜箔压合及去PET膜，采用化学有机液去除厚铜，增加白化工艺流程进行减铜；
    S2：采用UV激光钻孔，并依次进行等离子除胶，黑孔工艺及闪镀处理，完成所述闪镀处理后再进行微蚀清洁板面，然后进行湿法压膜和后烘工艺；
    S3：进行LDI曝光工艺，并采用LDI曝光机解析度累积误差反补偿进行解析度优化，包括：将CAM或Genesis设计的图形文件由矢量格式转换成标量文件后，再通过LDI曝光机进行曝光处理；所述将矢量格式转换成标量文件，还包括：将所述图形文件分成以pixel为单位的图片就是LDI曝光机的最小解析度，每一个pixel只有0或1属性；根据干膜的解析度需求，再结合所述LDI曝光机的解析度，减小至少一个pixel进行曝光线路尺寸的反补偿；
    S4：进行后序工艺处理，包括依次进行显影，脱脂，酸洗，图形及填孔电镀，去膜，烘烤，闪蚀，最后采用红或蓝光双灯源AOI检测设备进行AOI处理。
  2. 根据权利要求1所述的一种刚挠结合板高精密线路的制备方法，其特征在于，所述白化工艺流程，包括：通过酸碱药水洗除PCB表面的异物。
  3. 根据权利要求2所述的一种刚挠结合板高精密线路的制备方法，其特征在于，所述异物至少包括PCB表面的氧化物，油脂，残留的干膜和指纹印。
  4. 根据权利要求1所述的一种刚挠结合板高精密线路的制备方法，其特征在于，所述UV激光钻孔采用YAG-UV激光头，将UV光束打在铜箔上，将铜 箔打穿，同时烧掉基材形成成孔的直径小于75μm。
  5. 根据权利要求1所述的一种刚挠结合板高精密线路的制备方法，其特征在于，还包括：在曝光时，采用打靶机打出来的对位靶。
  6. 根据权利要求5所述的一种刚挠结合板高精密线路的制备方法，其特征在于，采用打靶机对内层芯板进行定距离盲打。
  7. 根据权利要求6所述的一种刚挠结合板高精密线路的制备方法，其特征在于，采用打靶机利用X-RAY看靶打靶方式打出内层线路已经做好的选镀干膜对位靶。
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