WO2022262120A1 - 一种显示面板及显示终端 - Google Patents

一种显示面板及显示终端 Download PDF

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Publication number
WO2022262120A1
WO2022262120A1 PCT/CN2021/115506 CN2021115506W WO2022262120A1 WO 2022262120 A1 WO2022262120 A1 WO 2022262120A1 CN 2021115506 W CN2021115506 W CN 2021115506W WO 2022262120 A1 WO2022262120 A1 WO 2022262120A1
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WIPO (PCT)
Prior art keywords
layer
display panel
conductive
panel according
substrate
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Ceased
Application number
PCT/CN2021/115506
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English (en)
French (fr)
Inventor
李亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
TCL China Star Optoelectronics Technology Co Ltd
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Application filed by TCL China Star Optoelectronics Technology Co Ltd filed Critical TCL China Star Optoelectronics Technology Co Ltd
Priority to US17/600,138 priority Critical patent/US12085821B2/en
Publication of WO2022262120A1 publication Critical patent/WO2022262120A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells

Definitions

  • the present application relates to the technical field of display panels, in particular to a display panel and a display terminal.
  • the signal output from the integrated circuit board is usually introduced into the common electrode on the color filter substrate through conductive metal balls after passing through the wiring of the array substrate. Holes need to be dug on the array substrate so that the conductive metal balls The signal transmission lines on the array substrate are connected and conducted.
  • the surface of the array substrate is recessed due to the existence of dug holes at the conduction position, so that conductive metal balls of the same size have different terrain heights at the conduction position and non-conduction position.
  • the conduction position of the conductive metal ball is low and there is a gap between the common electrode layer on the color filter substrate, resulting in poor contact; the conduction metal ball is in the high position of the non-conduction position, which is easy to be crushed or overstretched, resulting in Peripheral twill phenomenon. Based on the above situation, the display panel is prone to display abnormalities.
  • the current display panel has the technical problem of display abnormality caused by poor contact between conductive metal balls and the substrate or overshoot.
  • the present application provides a display panel and a display terminal, which can improve the technical problem that the display panel is prone to abnormal display.
  • the present application provides a display panel, including a display area and a non-display area located on the periphery of the display area;
  • the display panel includes a first substrate, a second substrate, and a sealant layer disposed between the first substrate and the second substrate, and the sealant layer is located on the non-display surface of the display panel.
  • an electrical connection member is arranged in the sealant layer;
  • the first substrate includes a first-type signal line at least partially arranged in the non-display area and a raised conductive member arranged on the first-type signal line, and the raised conductive member is connected to the first
  • the first end of the electrical connection member is connected to the elevated conductive member, and the second end of the electrical connection member is connected to the common electrode layer of the second substrate.
  • the first substrate includes an array driving layer, a flat layer disposed on the array driving layer, and a pixel electrode layer disposed on the flat layer.
  • the first-type signal line and the elevated conductive member are arranged on the same layer as the array driving layer.
  • the array driving layer includes a gate layer and a source-drain layer located on the gate layer, and the first-type signal lines are arranged in the same layer as the gate layer.
  • the elevated conductive member includes a first conductive layer disposed on the same layer as the source-drain layer.
  • the elevated conductive member further includes a second conductive layer located on the first conductive layer.
  • the second conductive layer electrically connects the first conductive layer to the first type of signal line.
  • the first substrate further includes second-type signal lines located in the non-display area, and the first-type signal lines and the second-type signal lines are arranged on the same layer.
  • the electrical connection member includes first conductive metal balls corresponding to the first type of signal lines and second conductive metal balls corresponding to the second type of signal lines.
  • the second conductive metal ball is insulated from the second type of signal line.
  • the size of the first conductive metal ball in the first direction is smaller than or equal to the size of the second conductive metal ball in the first direction, and the first direction is the same as that of the display panel. parallel to the thickness direction.
  • the first conductive layer includes first metal lines corresponding to the first type of signal lines and second metal lines corresponding to the second type of signal lines.
  • the first metal wires and the second metal wires are arranged side by side or arranged in a crosswise and criss-cross manner.
  • the first metal wire is insulated from the second metal wire.
  • the thickness of the planar layer in the non-display area is smaller than or equal to the thickness of the planar layer in the display area.
  • the first type of signal line includes a first connection section and a second connection section, the first connection section is located in the display area of the display panel, and the second connection section is located in the Displays the non-display area of the panel.
  • the first connecting segment is made of transparent conductive metal.
  • the sealant layer further includes a plurality of spacers.
  • the size of the spacers is the same as that of at least part of the electrical connection members.
  • the present application also provides a display terminal, which includes a terminal body and the above-mentioned display panel.
  • the common electrode layer on the second substrate can be connected to the first substrate through the electrical connection member and the raised conductive member.
  • the first type of signal line is connected, so as to realize the conduction of the upper and lower substrates.
  • the height of the recessed part on the first substrate is realized by increasing the height of the conductive part, so that the size of the electrical connection member at the conduction position of the upper and lower substrates is similar to that of the non-conduction position, reducing the electrical connection at the conduction position in the display panel Poor contact of components or over-extension of electrical connection components at non-conductive positions, thereby effectively improving the phenomenon of abnormal display of the display panel.
  • FIG. 1 is a schematic diagram of the first structure of the display panel described in the present application.
  • Fig. 2 is a second structural diagram of the display panel described in the present application.
  • FIG. 3 is a wiring diagram of the first type of signal lines in the display panel in the present application.
  • display panel 100 display area 101, non-display area 102, integrated circuit board 103, transition area 1021, conduction area 1022, first substrate 110, second substrate 120, sealant layer 130, electrical connection members 140, heightened conductive member 150, first substrate 111, array driving layer 112, color resistance layer 113, flat layer 114, pixel electrode layer 115, first alignment film layer 116, first type signal line 117, second type signal line Line 118, gate layer 1121, gate insulating layer 1122, active layer 1123, source-drain layer 1124, passivation layer 1125, second substrate 121, black matrix 122, common electrode layer 123, second alignment film layer 124 , first conductive layer 151, second conductive layer 152, first conductive metal ball 141, second conductive metal ball 142, first metal wire 1511, second metal wire 1512, first connection section 1171, second connection section 1172 , Spacer 131.
  • Embodiments of the present application provide a display panel and a display terminal. Each will be described in detail below. It should be noted that the description sequence of the following embodiments is not intended to limit the preferred sequence of the embodiments.
  • the signal output from the integrated circuit board passes through the wiring of the array substrate, it is usually introduced into the common electrode on the color filter substrate through conductive metal balls.
  • the balls are arranged at the holes, so that the conductive metal balls are connected to the signal transmission lines on the array substrate, so as to conduct the electrical signals on the array substrate to the color filter substrate.
  • the larger the size of the display panel the greater the resistance-capacitance delay (RC delay) of the wiring on the side of the array substrate away from the integrated circuit board, which reduces the signal stability of the common electrode on the color filter substrate.
  • the number of points of conductive metal balls is usually increased in the sealant between the array substrate and the color filter substrate to improve the conduction capability of the upper and lower substrates.
  • the addition of conductive metal balls also has the following disadvantages: the surface of the array substrate is sunken due to digging holes at the conduction position, so that conductive metal balls of the same size have different terrain heights at the conduction position and non-conduction position.
  • the conduction position of the conductive metal ball is low, and it is easy to have a gap with the common electrode layer on the color filter substrate, resulting in poor contact; the conduction metal ball is at a high position in the non-conduction position, and the array substrate at the non-conduction position
  • the distance from the color filter substrate reaches the compression limit of the conductive metal ball, and the conductive metal ball is easily crushed or overstretched, resulting in peripheral twill.
  • the display panel is prone to display abnormalities.
  • the present application proposes the following technical solutions.
  • the present application provides a display panel 100, including a display area 101 and a non-display area 102 located on the periphery of the display area 101;
  • the display panel 100 includes a first substrate 110, a second substrate 120, and a sealant layer 130 disposed between the first substrate 110 and the second substrate 120, and the sealant layer 130 is located In the non-display area 102 of the display panel 100 , an electrical connection member 140 is disposed in the sealant layer 130 .
  • the first substrate 110 may include a first substrate 111, an array driving layer 112 disposed on the first substrate 111, a color resist layer 113 disposed on the array driving layer 112 , a planar layer 114 disposed on the color resist layer 113 , a pixel electrode layer 115 disposed on the planar layer 114 , and a first alignment film layer 116 disposed on the pixel electrode layer 115 .
  • the first substrate 111 may be made of materials such as glass, quartz or polyimide.
  • the array driving layer 112 is a thin film transistor layer, and the thin film transistor layer may include a plurality of thin film transistors.
  • the thin film transistor layer may be of etch barrier type, back channel etching type, bottom gate thin film transistor type or top gate thin film transistor type, etc., which is not specifically limited in this application.
  • the TFT of bottom-gate TFT type may include a gate layer 1121 on the first substrate 111, a gate insulating layer 1122 on the gate layer 1121, a gate insulating layer 1122 on the The active layer 1123 on the active layer 1123, the source and drain layer 1124 on the active layer 1123, and the passivation layer 1125 on the source and drain.
  • the color-resist layer 113 may be a color filter including three primary colors of red (R), green (G), and blue (B), or a color filter including red (R), green (G), Color filters for the four primary colors of blue (B) and white (W).
  • the flat layer 114 may be made of PFA (Soluble Polytetrafluoroethylene) or SOG (Silicon On Glass, silicon-glass bonding structural material).
  • PFA Soluble Polytetrafluoroethylene
  • SOG Silicon On Glass, silicon-glass bonding structural material
  • the pixel electrode layer 115 can be a transparent conductive film layer, such as ITO, ZnO-based TCO film, multi-component TCO film, high-mobility TCO film, and the like.
  • the first alignment film layer 116 and the second alignment film layer 124 are polymers that can control the alignment direction of liquid crystals, such as polyimide and the like.
  • the second substrate 120 may include a second substrate 121, a black matrix 122 disposed on the second substrate 121, a common electrode layer 123 disposed on the black matrix 122, and a The second alignment film layer 124 on the common electrode layer 123 .
  • the second substrate 121 may be made of materials such as glass, quartz or polyimide.
  • the black matrix 122 can be made of materials including carbon black or Cr and other additives.
  • the common electrode layer 123 is a transparent conductive film layer, such as ITO, ZnO-based TCO film, multi-component TCO film, high-mobility TCO film, and the like.
  • the second alignment film layer 124 is a polymer capable of controlling alignment of liquid crystals, such as polyimide.
  • the sealant layer 130 may be made of materials such as epoxy resin.
  • the first substrate 110 may further include a first-type signal line 117 at least partially disposed in the non-display area 102 and disposed in the first The raised conductive member 150 on the similar signal line 117, the raised conductive member 150 is electrically connected to the first type signal line 117, the first end of the electrical connection member 140 is connected to the raised conductive member 150, the The second end of the electrical connection member 140 is connected to the common electrode layer 123 of the second substrate 120 .
  • the common electrode layer 123 on the second substrate 120 can pass through the electrical connection member 140 and the raised conductive member 150.
  • the conductive member 150 communicates with the first type signal line 117 on the first substrate 110 , so as to realize conduction between the upper and lower substrates.
  • the height of the recessed part on the first substrate 110 is realized by increasing the conductive member 150, so that the size of the electrical connection member 140 at the conduction position of the upper and lower substrates is similar to that of the non-conduction position, reducing the conduction in the display panel 100. Poor contact of the electrical connection member 140 at the position or overshoot of the electrical connection member 140 at the non-conductive position, thereby effectively improving the poor contact or peripheral mura phenomenon of the display panel 100 .
  • the first type signal line 117 and the elevated conductive member 150 may be disposed on the same layer as the array driving layer 112 .
  • the first type of signal line 117, the heightened conductive member 150 and the array driving layer 112 are arranged on the same layer, so that the bottom of the electrical connection member 140 can be extended to the same height as the flat layer 114, so that the electrical connection member 140 is closer to
  • the bottom height of the recessed position in the non-display area 102 that is, the height difference of the bottom of the electrical connection member 140 at different positions in the non-display area 102 is reduced, and the uniform and suitable electrical connection member 140 is not easy to cause contact in the non-display area 102
  • the display effect of the display panel 100 is better if there is no defective or overstretched phenomenon.
  • the first-type signal line 117 can be provided on the same layer as the gate layer 1121, and the raised conductive member 150 can include The layer 1124 is disposed on the same layer as the first conductive layer 151 .
  • the first-type signal line 117 and the gate layer 1121 are arranged on the same layer, and the first conductive layer 151 and the source-drain layer 1124 are arranged on the same layer, so that the metal of the first-type signal line 117 and the gate layer 1121
  • the wiring is performed synchronously, and the first conductive layer 151 and the source-drain layer 1124 are formed synchronously, so that an additional wiring process or forming process is omitted, and the manufacturing process of the first substrate 110 is simpler.
  • first conductive layer 151 and the source-drain layer 1124 are arranged on the same layer, so that the bottom of the connection member connected to the first conductive layer 151 extends to the bottom height closer to the recessed position, that is, the electrical connection member 140 is reduced in the non-conductive display area.
  • the height difference of the bottom at different positions in the 102 can reduce the phenomenon of poor contact or overstretching.
  • the raised conductive member 150 may further include a second conductive layer 152 on the first conductive layer 151, and the second conductive layer 152
  • the first conductive layer 151 is electrically connected to the first type signal line 117 .
  • the gate insulating layer 1122 is located between the first conductive layer 151 and the first type signal line 117, that is, the gate insulating layer 1122 insulates the first conductive layer 151 from the first type signal line 117. open.
  • the second conductive layer 152 covers the first type signal line 117 and at least part of the first conductive layer 151 .
  • the electrical connection member 140 can connect the upper and lower substrates at two second conductive layers 152 with different heights, and the size of the electrical connection member 140 is more selective.
  • the first substrate 110 may further include second-type signal lines 118 located in the non-display area 102 , and the first-type signal lines 117 and The second type signal lines 118 are arranged on the same layer.
  • the first-type signal lines 117 and the second-type signal lines 118 on the first substrate 110 are used to transmit independent electrical signals of different circuits.
  • the first-type signal lines 117 and the second-type signal lines 118 are arranged on the same layer , the first-type signal lines 117 and the second-type signal lines 118 can be wired simultaneously, thereby improving wiring efficiency.
  • the electrical connection member 140 may include a first conductive metal ball 141 corresponding to the first type of signal line 117 and a second conductive metal ball 142 corresponding to the second type of signal line 118 .
  • first type signal line 117 and the first conductive metal ball 141 , the second type signal line 118 and the second conductive metal ball 142 are all insulated by the gate insulating layer 1122 .
  • the electrical connection member 140 is composed of a first conductive metal ball 141 and a second conductive metal ball 142, so that the first conductive metal ball 141 can play the role of conducting the upper and lower substrate circuits at the position corresponding to the first type of signal 117. , so that the second conductive metal ball 142 acts as a spatial support in the display panel 100 at the position corresponding to the second type signal line 118 , and the circuit connection stability and structural support of the upper and lower substrates of the display panel 100 are better strengthened.
  • the size of the first conductive metal ball 141 in the first direction is smaller than or equal to the size of the second conductive metal ball 142 in the first direction, and the first direction is the same as the thickness direction of the display panel 100 parallel.
  • the size of the first conductive metal ball 141 in the first direction (that is, parallel to the thickness direction of the display panel 100) is set to be smaller than or equal to the size of the second conductive metal ball 142 in the first direction, which can make The sum of the thickness of the second conductive layer 152 and the size of the first conductive metal ball 141 along the first direction is equal to or close to the size of the second conductive metal ball 142 along the first direction, thereby reducing poor contact or overshooting.
  • the first conductive layer 151 may include a first metal line 1511 corresponding to the first type signal line 117 and a second metal line 1512 corresponding to the second type signal line 118 ;
  • the first-type signal lines 117 and the second-type signal lines 118 can be arranged in parallel or crosswise.
  • the first metal lines 1511 and the second metal lines 1512 are arranged in parallel or horizontally criss-cross setting. That is, when the first-type signal lines 117 and the second-type signal lines 118 are arranged in parallel, the first metal lines 1511 and the second metal lines 1512 are also arranged in parallel;
  • the second type signal lines 118 are arranged in a criss-cross pattern, the first metal lines 1511 and the second metal lines 1512 are also arranged in a criss-cross pattern.
  • the wiring relationship between the first metal line 1511 and the second metal line 1512 is the same as the wiring relationship between the first type signal line 117 and the second type signal line 118, so that the same type of wiring can be used in the manufacturing process of the first substrate 110.
  • the process of the first substrate 110 is simpler.
  • the first metal line 1511 and the second metal line 1512 can be insulated, and the second conductive layer 152 can cover the first type signal line 117 and the first metal line 1511 .
  • the first metal wire 1511 is insulated from the second metal wire 1512, so that the first metal wire 1511 plays a role of circuit conduction on the first type of signal line 117, and the second metal wire 1512 is on the second type of signal line.
  • 118 plays a supporting role, and the first metal wire 1511 and the second metal wire 1512 complement each other to improve the display effect and structural stability of the display panel 100 .
  • the first metal line 1511 and the second metal line 1512 can also be provided in electrical connection
  • the second conductive layer 152 covers the first type signal line 117
  • the second The conductive layer 152 also covers at least one of the first metal lines 1511 and the second metal lines 1512 .
  • the connection between the first metal wire 1511 and the second metal wire 1512 is set to be electrically conductive, so that the first conductive layer 151 can form a conductive metal mesh, thereby providing more conduction points for the electrical connection member 140
  • the electrical connection member 140 has more point selectivity between the upper and lower substrates, and the circuit conduction stability is better.
  • the thickness of the flat layer 114 in the non-display area 102 is less than or equal to the thickness of the flat layer 114 in the display area 101 .
  • the non-display area 102 may include a transition area 1021 and a conduction area 1022, and the transition area 1021 is located at The conduction area 1022 is peripheral and connected to the display area 101 and the conduction area 1022 .
  • the thickness of the planar layer 114 in the transition region 1021 may be equal to the thickness of the planar layer 114 in the display region 101 .
  • the thickness of the planar layer 114 in the conduction region 1022 may be smaller than the thickness of the planar layer 114 in the display region 101, or the thickness of the planar layer 114 in the conduction region 1022 is zero , such as shown in Figure 1.
  • the thickness of the flat layer 114 in the conduction area 1022 is set to be smaller than the thickness of the flat layer 114 in the display area 101, so as to select the heightened conductive member according to the depth of the recessed position in the conduction area 1022 and the thickness of the flat layer 114
  • the increased height of 150 and the size of the electrical connection member 140 enable the flat layer 114 in the conduction area 1022 to cooperate with the increased conductive member 150 and the electrical connection member 140 to more stably connect the upper and lower substrates, thereby improving the display quality of the display panel 100 .
  • the first type signal line 117 may include a first connection section 1171 and a second connection section 1172 , and the first connection section 1171 is located on the display panel 100 . area 101 , the second connection section 1172 is located in the non-display area 102 of the display panel 100 .
  • the first connecting section 1171 is made of transparent conductive metal.
  • the first-type signal lines 117 are usually routed near the edge of the non-display area 102 around the display panel 100 , so that a frame is required around the display panel 100 for the first-type signal lines 117 to route.
  • the first-type signal line 117 is divided into two sections, and the first connection section 1171 made of transparent conductive metal is located in the display area 101 of the display panel 100, so that the first-type signal line 117 does not have to bypass the display area 101 Wires are routed at the edge of the non-display area 102 of the display panel 100 .
  • the first type of signal line 117 can directly cross the display area 101 and then be connected to the integrated circuit board 103 at the edge of the non-display area 102, and the transparent conductive metal basically does not affect the normal display of the display area 101, which is conducive to reducing the size of the display panel. 100 for border width.
  • the sealant layer 130 further includes a plurality of spacers 131 , and the size of the spacers 131 is the same as that of at least part of the electrical connection member 140 .
  • the spacers 131 may be fibrous particles or spherical particles, and the spacers 131 may be made of materials such as melamine resin, urea resin, or polystyrene resin.
  • a plurality of spacers 131 are provided in the frame sealing adhesive layer 130, which can further enhance the support stability and box thickness uniformity between the first substrate 110 and the second substrate 120, and at the same time enable the electrical connection member 140 to achieve good
  • the effect of conducting the circuit can also achieve better structural support, thereby further improving the display effect of the display panel 100 .
  • the present application also provides a display terminal, which includes a terminal body and the above-mentioned display panel 100 .
  • the common electrode layer 123 on the second substrate 120 can pass through the electrical connection member 140.
  • the heightened conductive member 150 communicates with the first-type signal line 117 on the first substrate 110 , so as to realize conduction between the upper and lower substrates.
  • the height of the recessed part on the first substrate 110 is realized by increasing the conductive member 150, so that the size of the electrical connection member 140 at the conduction position of the upper and lower substrates is similar to that of the non-conduction position, reducing the conduction in the display panel 100. Poor contact of the electrical connection member 140 at the position or overshoot of the electrical connection member 140 at the non-conductive position, thereby effectively improving the display abnormality of the display panel 100 .

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种显示面板(100)及显示终端，显示面板(100)包括第一基板(110)、第二基板(120)及封框胶层(130)，封框胶层(130)内设置有电连接构件(140)；第一基板(110)包括至少部分设置于非显示区(102)内的第一类信号线(117)和增高导电件(150)，增高导电件(150)与第一类信号线(117)电连接，电连接构件(140)的第一端与增高导电件(150)连接，电连接构件(140)的第二端与第二基板(120)的公共电极层(123)连接。

Description

一种显示面板及显示终端 技术领域
本申请涉及显示面板技术领域，具体涉及一种显示面板及显示终端。
 背景技术
在液晶显示面板中，从集成电路板输出的信号在经过阵列基板的走线后，通常通过导电金属球导入到彩膜基板上的公共电极中，阵列基板上需挖孔以使导电金属球与阵列基板上的信号传输线连接导通。
阵列基板在导通位置由于存在挖孔而形成表面凹陷，使得相同大小的导电金属球在导通位置与非导通位置的地势高低不同。导电金属球在导通位置的地势较低容易与彩膜基板上的公共电极层存在间隙，产生接触不良；导电金属球在非导通位置的地势较高，容易被压碎或过撑，产生周边斜纹现象。基于上述情况，显示面板容易产生显示异常。
 技术问题
目前的显示面板存在因导电金属球与基板接触不良或过撑所导致的显示异常的技术问题。
 技术解决方案
本申请提供一种显示面板及显示终端，可以改善显示面板容易产生显示异常的技术问题。
为解决上述技术问题，本申请提供的技术方案如下：
本申请提供一种显示面板，包括显示区和位于所述显示区外围的非显示区；
其中，所述显示面板包括第一基板、第二基板及设置于所述第一基板与所述第二基板之间的封框胶层，所述封框胶层位于所述显示面板的非显示区，所述封框胶层内设置有电连接构件；
其中，所述第一基板包括至少部分设置于所述非显示区内的第一类信号线和设置于所述第一类信号线上的增高导电件，所述增高导电件与所述第一类信号线电连接，所述电连接构件的第一端与所述增高导电件连接，所述电连接构件的第二端与所述第二基板的公共电极层连接。
在本申请的显示面板中，所述第一基板包括阵列驱动层、设置于所述阵列驱动层上的平坦层及设置于所述平坦层上的像素电极层。
在本申请的显示面板中，所述第一类信号线和所述增高导电件与所述阵列驱动层同层设置。
在本申请的显示面板中，所述阵列驱动层包括栅极层和位于所述栅极层上的源漏极层，所述第一类信号线与所述栅极层同层设置。
在本申请的显示面板中，所述增高导电件包括与所述源漏极层同层设置的第一导电层。
在本申请的显示面板中，所述增高导电件还包括位于所述第一导电层上的第二导电层。
在本申请的显示面板中，所述第二导电层将所述第一导电层与所述第一类信号线电连接。
在本申请的显示面板中，所述第一基板还包括位于所述非显示区内的第二类信号线，所述第一类信号线与所述第二类信号线同层设置。
在本申请的显示面板中，所述电连接构件包括与所述第一类信号线对应的第一导电金属球和与所述第二类信号线对应的第二导电金属球。
在本申请的显示面板中，所述第二导电金属球与所述第二类信号线绝缘设置。
在本申请的显示面板中，所述第一导电金属球在第一方向上的尺寸小于或等于所述第二导电金属球在第一方向上的尺寸，所述第一方向与所述显示面板的厚度方向平行。
在本申请的显示面板中，所述第一导电层包括与所述第一类信号线对应的第一金属线和与所述第二类信号线对应的第二金属线。
在本申请的显示面板中，所述第一金属线与所述第二金属线并列设置或横纵交错设置。
在本申请的显示面板中，所述第一金属线与所述第二金属线绝缘设置。
在本申请的显示面板中，所述非显示区内的所述平坦层的厚度小于或者等于所述显示区内所述平坦层的厚度。
在本申请的显示面板中，所述第一类信号线包括第一连接段和第二连接段，所述第一连接段位于所述显示面板的显示区，所述第二连接段位于所述显示面板的非显示区。
在本申请的显示面板中，所述第一连接段由透明导电金属构成。
在本申请的显示面板中，所述封框胶层还包括多个间隙子。
在本申请的显示面板中，所述间隙子的尺寸与至少部分所述电连接构件的尺寸相同。
本申请还提供了一种显示终端，所述显示终端包括终端主体和上述显示面板。
 有益效果
本申请通过在第一类信号线上设置增高导电件，再将电连接构件设置在增高导电件上，使第二基板上的公共电极层可以通过电连接构件和增高导电件与第一基板上的第一类信号线连通，从而实现上下基板的导通。第一基板上的凹陷部位通过增高导电件实现了增高，使上下基板的导通位置处的电连接构件与非导通处的电连接构件尺寸相近，减少显示面板中导通位置处的电连接构件接触不良或非导通位置处的电连接构件过撑情况，从而有效改善显示面板的显示异常的现象。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请所述显示面板的第一种结构简图；
图2是本申请所述显示面板的第二种结构简图；
图3是本申请所述第一类信号线在所述显示面板中的布线图。
附图说明：显示面板100、显示区101、非显示区102、集成电路板103、过渡区1021、导通区1022、第一基板110、第二基板120、封框胶层130、电连接构件140、增高导电件150、第一衬底111、阵列驱动层112、色阻层113、平坦层114、像素电极层115、第一配向膜层116、第一类信号线117、第二类信号线118、栅极层1121、栅绝缘层1122、有源层1123、源漏极层1124、钝化层1125、第二衬底121、黑色矩阵122、公共电极层123、第二配向膜层124、第一导电层151、第二导电层152、第一导电金属球141、第二导电金属球142、第一金属线1511、第二金属线1512、第一连接段1171、第二连接段1172、间隙子131。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种显示面板及显示终端。以下分别进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
在显示面板中，从集成电路板输出的信号在经过阵列基板的走线后，通常通过导电金属球导入到彩膜基板上的公共电极中，具体方式为在阵列基板上挖孔，将导电金属球设置在挖孔处，使导电金属球与阵列基板上的信号传输线连接导通，从而将阵列基板上的电信号传导至彩膜基板中。
但是显示面板的尺寸越大，阵列基板远离集成电路板一侧的走线阻容延迟（RC delay）越大，使彩膜基板上公共电极的信号稳定性降低。为了提高彩膜基板上公共电极的信号稳定性，通常在阵列基板与彩膜基板之间的封框胶中增加导电金属球的点位个数，以提高上下基板的导通能力。
但是增加导电金属球还存在以下弊端：阵列基板在导通位置由于挖孔而形成表面凹陷，使得相同大小的导电金属球在导通位置与非导通位置的地势高低不同。导电金属球在导通位置的地势较低，容易与彩膜基板上的公共电极层存在间隙，产生接触不良；导电金属球在非导通位置的地势较高，非导通位置处的阵列基板与彩膜基板间距达到导电金属球的压缩极限，导电金属球容易被压碎或过撑，产生周边斜纹现象。基于上述情况，显示面板容易产生显示异常。本申请基于上述技术问题，提出了以下技术方案。
请参阅图1和图2，本申请提供一种显示面板100，包括显示区101和位于所述显示区101外围的非显示区102；
其中，所述显示面板100包括第一基板110、第二基板120及设置于所述第一基板110与所述第二基板120之间的封框胶层130，所述封框胶层130位于所述显示面板100的非显示区102，所述封框胶层130内设置有电连接构件140。
在本实施例中，所述第一基板110可以包括第一衬底111、设置于所述第一衬底111上的阵列驱动层112、设置于所述阵列驱动层112上的色阻层113、设置于所述色阻层113上的平坦层114、设置于所述平坦层114上的像素电极层115及设置于所述像素电极层115上的第一配向膜层116。
其中，所述第一衬底111可以由玻璃、石英或聚酰亚胺等材料制备。
所述阵列驱动层112为薄膜晶体管层，所述薄膜晶体管层可以包括多个薄膜晶体管。所述薄膜晶体管层可以为蚀刻阻挡型、背沟道蚀刻型、底栅薄膜晶体管型或顶栅薄膜晶体管型等结构，本申请不作具体限制。例如，底栅薄膜晶体管型的所述薄膜晶体管可以包括位于所述第一衬底111上的栅极层1121、位于所述栅极层1121上的栅绝缘层1122、位于所述栅绝缘层1122上的有源层1123、位于所述有源层1123上的源漏极层1124、以及位于所述源漏极上的钝化层1125。
在本实施例中，所述色阻层113可以为包含红色（R）、绿色（G）、蓝色（B）三基色的彩色滤光片，或包含红色（R）、绿色（G）、蓝色（B）和白色（W）的四基色的彩色滤光片。
所述平坦层114可以由PFA（可溶性聚四氟乙烯）或SOG（Silicon On Glass，硅-玻璃键合结构材料）构成。
所述像素电极层115可以为透明导电膜层，如ITO、ZnO基TCO薄膜、多元TCO薄膜、高迁移率TCO薄膜等。
所述第一配向膜层116，所述第二配向膜层124为可控制液晶排列方向的聚合物，如聚酰亚胺等。
在本实施例中，所述第二基板120可以包括第二衬底121、设置于所述第二衬底121上的黑色矩阵122、设置于所述黑色矩阵122上的公共电极层123及设置于所述公共电极层123上的第二配向膜层124。
其中，所述第二衬底121可以由玻璃、石英或聚酰亚胺等材料制备。
所述黑色矩阵122可以由包括炭黑或Cr及其他助剂的材料制备。
所述公共电极层123为透明导电膜层，如ITO、ZnO基TCO薄膜、多元TCO薄膜、高迁移率TCO薄膜等。
所述第二配向膜层124为可控制液晶排列方向的聚合物，如聚酰亚胺等。
在本实施例中，所述封框胶层130可以由环氧树脂等材料制备。
在本申请的显示面板中，请参阅图1和图2，所述第一基板110还可以包括至少部分设置于所述非显示区102内的第一类信号线117和设置于所述第一类信号线117上的增高导电件150，所述增高导电件150与所述第一类信号线117电连接，所述电连接构件140的第一端与所述增高导电件150连接，所述电连接构件140的第二端与所述第二基板120的公共电极层123连接。
本申请通过在第一类信号线117上设置增高导电件150，再将电连接构件140设置在增高导电件150上，使第二基板120上的公共电极层123可以通过电连接构件140和增高导电件150与第一基板110上的第一类信号线117连通，从而实现上下基板的导通。第一基板110上的凹陷部位通过增高导电件150实现了增高，使上下基板的导通位置处的电连接构件140与非导通处的电连接构件140尺寸相近，减少显示面板100中导通位置处的电连接构件140接触不良或非导通位置处的电连接构件140过撑情况，从而有效改善显示面板100的接触不良或周边斜纹（mura）现象。
在本申请的显示面板中，请参阅图1和图2，所述第一类信号线117和所述增高导电件150可以与所述阵列驱动层112同层设置。
本实施例中将第一类信号线117、增高导电件150与阵列驱动层112同层设置，可以使电连接构件140的底部延伸至与平坦层114同等高度，从而时电连接构件140更接近非显示区102内凹陷位置的底部高度，即缩小了电连接构件140在非显示区102内不同位置处的底部高度差，尺寸统一且适宜的电连接构件140在非显示区102内不易引起接触不良或过撑现象，显示面板100的显示效果更好。
在本申请的显示面板中，请参阅图1和图2，所述第一类信号线117可以与所述栅极层1121同层设置，所述增高导电件150可以包括与所述源漏极层1124同层设置的第一导电层151。
本实施例中将第一类信号线117与栅极层1121同层设置且第一导电层151与源漏极层1124同层设置，可使第一类信号线117与栅极层1121的金属布线同步进行，第一导电层151与源漏极层1124同步成型，从而省去额外的布线工艺或成型工艺，第一基板110的制程工艺更加简单。而且第一导电层151与源漏极层1124同层设置，使得与第一导电层151连接的连接构件底部延伸至更接近凹陷位置的底部高度，即缩小了电连接构件140在导非显示区102内不同位置处的底部高度差，从而减少接触不良或过撑现象。
在本申请的显示面板中，请参阅图1和图2，所述增高导电件150还可以包括位于所述第一导电层151上的第二导电层152，所述第二导电层152将所述第一导电层151与所述第一类信号线117电连接。
其中，所述栅绝缘层1122位于第一导电层151与第一类信号线117之间，即所述栅绝缘层1122将所述第一导电层151与所述第一类信号线117绝缘隔开。
所述第二导电层152覆盖所述第一类信号线117和至少部分所述第一导电层151。
本实施例通过将第二导电层152同时覆盖第一类信号线117和至少部分第一导电层151，实现第一类信号线117与第一导电层151之间的电连通，使电连接构件140可以在两种高度不同的第二导电层152处导通上下基板，电连接构件140的尺寸选择性更多。
在本申请的显示面板中，请参阅图1和图2，所述第一基板110还可以包括位于所述非显示区102内的第二类信号线118，所述第一类信号线117与所述第二类信号线118同层设置。
第一基板110上的第一类信号线117和第二类信号线118用于传输不同电路的独立电信号，本实施例中将第一类信号线117与第二类信号线118同层设置，可以使第一类信号线117与第二类信号线118同时布线，提高布线效率。
本实施例中，所述电连接构件140可以包括与所述第一类信号线117对应的第一导电金属球141和与所述第二类信号线118对应的第二导电金属球142。
其中，所述第一类信号线117与所述第一导电金属球141、所述第二类信号线118与所述第二导电金属球142均通过所述栅绝缘层1122实现绝缘。
本实施例中使电连接构件140由第一导电金属球141和第二导电金属球142构成，可以使第一导电金属球141在与第一类信号117对应位置起到上下基板电路导通作用，使第二导电金属球142在与第二类信号线118对应位置起到显示面板100内的空间支撑作用，显示面板100上下基板的电路连接稳定性与结构支撑加强效果更好。
其中，所述第一导电金属球141在第一方向上的尺寸小于或等于所述第二导电金属球142在第一方向上的尺寸，所述第一方向与所述显示面板100的厚度方向平行。
本实施例中将第一导电金属球141在第一方向上（即平行于显示面板100的厚度方向）的尺寸设置为小于或等于第二导电金属球142在第一方向上的尺寸，可使第二导电层152的厚度与第一导电金属球141沿第一方向上的尺寸之和与第二导电金属球142沿第一方向上的尺寸相等或相近，从而减少接触不良或过撑现象。
在本申请的显示面板中，所述第一导电层151可以包括与所述第一类信号线117对应的第一金属线1511和与所述第二类信号线118对应的第二金属线1512；
其中，所述第一类信号线117与所述第二类信号线118可以并列设置或横纵交错设置，相应地，所述第一金属线1511与所述第二金属线1512并列设置或横纵交错设置。即所述第一类信号线117与所述第二类信号线118并列设置时，所述第一金属线1511与所述第二金属线1512也并列设置；所述第一类信号线117与所述第二类信号线118横纵交错设置时，所述第一金属线1511与所述第二金属线1512也横纵交错设置。
本实施例中使第一金属线1511和第二金属线1512的布线关系与第一类信号线117与第二类信号线118的布线关系相同，可以使第一基板110制造过程中采用同一种布线制程工艺，第一基板110的制程工艺更简单。
在本实施例中，所述第一金属线1511与所述第二金属线1512可以绝缘设置，所述第二导电层152可以覆盖所述第一类信号线117与所述第一金属线1511。本实施例将第一金属线1511与第二金属线1512绝缘设置，使第一金属线1511在第一类信号线117上起到电路导通作用，第二金属线1512在第二类信号线118上起到支撑作用，第一金属线1511与第二金属线1512相辅相成，提高显示面板100的显示效果与结构稳定性。
在本实施例中，所述第一金属线1511与第二金属线1512也可以电路导通设置，所述第二导电层152覆盖在所述第一类信号线117上，同时所述第二导电层152还覆盖所述第一金属线1511与所述第二金属线1512中的至少一者。本实施例将第一金属线1511与第二金属线1512之间设置为电路导通，可以使第一导电层151形成导电金属网，从而向电连接构件140提供更多的导通点位，电连接构件140在上下基板间的点位选择性更多，电路导通稳定性更好。
在本申请的显示面板中，请参阅图1和图2，所述非显示区102内的所述平坦层114的厚度小于或者等于所述显示区101内所述平坦层114的厚度。
在本实施例中，为使所述非显示区102与所述显示区101之间形成良好的过渡，所述非显示区102可以包括过渡区1021和导通区1022，所述过渡区1021位于所述导通区1022外围并连接所述显示区101与所述导通区1022。
其中，所述过渡区1021内的所述平坦层114的厚度可以与所述显示区101内的所述平坦层114的厚度相等。所述导通区1022内的所述平坦层114的厚度可以小于所述显示区101内的所述平坦层114的厚度，或者所述导通区1022内的所述平坦层114的厚度为零，例如图1所示。
本实施例将导通区1022内的平坦层114厚度设置为小于显示区101内的平坦层114厚度，以便于根据导通区1022内凹陷位置的深度及平坦层114的厚度来选择增高导电件150的增高高度及电连接构件140的尺寸大小，使导通区1022内的平坦层114配合增高导电件150和电连接构件140来更加稳定地导通上下基板，从而提高显示面板100的显示质量。
在本申请的显示面板中，请参阅图3，所述第一类信号线117可以包括第一连接段1171和第二连接段1172，所述第一连接段1171位于所述显示面板100的显示区101，所述第二连接段1172位于所述显示面板100的非显示区102。其中，所述第一连接段1171由透明导电金属构成。
现阶段第一类信号线117通常是沿显示面板100周侧的非显示区102靠近边缘位置布线，这样使得显示面板100的周侧需设置一个边框来供第一类信号线117进行走线。本实施例中将第一类信号线117分作两段，且由透明导电金属构成的第一连接段1171位于显示面板100的显示区101，使得第一类信号线117不必绕过显示区101在显示面板100的非显示区102边缘进行走线。第一类信号线117可以直接横穿所述显示区101再与非显示区102边缘处的集成电路板103连接，且透明导电金属基本不影响显示区101的正常显示，有利于减小显示面板100的边框宽度。
在本申请的显示面板中，所述封框胶层130还包括多个间隙子131，所述间隙子131的尺寸与至少部分所述电连接构件140的尺寸相同。
其中，所述间隙子131可以为纤维状微粒子或球状微粒子，所述间隙子131可以由密胺树脂或尿素树脂或聚苯乙烯树脂等材料制备。
本实施例在封框胶层130内设置多个间隙子131，可进一步加强第一基板110与第二基板120之间的支撑稳定性与盒厚均一性，同时使电连接构件140除了实现良好的电路导通作用，还可以实现较好的结构支撑作用，从而进一步改善显示面板100的显示效果。
本申请还提供了一种显示终端，所述显示终端包括终端主体和上述显示面板100。
本申请实施例通过在第一类信号线117上设置增高导电件150，再将电连接构件140设置在增高导电件150上，使第二基板120上的公共电极层123可以通过电连接构件140和增高导电件150与第一基板110上的第一类信号线117连通，从而实现上下基板的导通。第一基板110上的凹陷部位通过增高导电件150实现了增高，使上下基板的导通位置处的电连接构件140与非导通处的电连接构件140尺寸相近，减少显示面板100中导通位置处的电连接构件140接触不良或非导通位置处的电连接构件140过撑情况，从而有效改善显示面板100的显示异常现象。
以上对本申请实施例所提供的一种显示面板及显示终端进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板，其包括显示区和位于所述显示区外围的非显示区；
    其中，所述显示面板包括第一基板、第二基板及设置于所述第一基板与所述第二基板之间的封框胶层，所述封框胶层位于所述显示面板的非显示区，所述封框胶层内设置有电连接构件；
    其中，所述第一基板包括至少部分设置于所述非显示区内的第一类信号线和设置于所述第一类信号线上的增高导电件，所述增高导电件与所述第一类信号线电连接，所述电连接构件的第一端与所述增高导电件连接，所述电连接构件的第二端与所述第二基板的公共电极层连接。
  2. 根据权利要求1所述的显示面板，其中，所述第一基板包括阵列驱动层、设置于所述阵列驱动层上的平坦层及设置于所述平坦层上的像素电极层。
  3. 根据权利要求2所述的显示面板，其中，所述第一类信号线和所述增高导电件与所述阵列驱动层同层设置。
  4. 根据权利要求2所述的显示面板，其中，所述阵列驱动层包括栅极层和位于所述栅极层上的源漏极层，所述第一类信号线与所述栅极层同层设置。
  5. 根据权利要求4所述的显示面板，其中，所述增高导电件包括与所述源漏极层同层设置的第一导电层。
  6. 根据权利要求5所述的显示面板，其中，所述增高导电件还包括位于所述第一导电层上的第二导电层。
  7. 根据权利要求6所述的显示面板，其中，所述第二导电层将所述第一导电层与所述第一类信号线电连接。
  8. 根据权利要求2所述的显示面板，其中，所述第一基板还包括位于所述非显示区内的第二类信号线，所述第一类信号线与所述第二类信号线同层设置。
  9. 根据权利要求8所述的显示面板，其中，所述电连接构件包括与所述第一类信号线对应的第一导电金属球和与所述第二类信号线对应的第二导电金属球。
  10. 根据权利要求9所述的显示面板，其中，所述第二导电金属球与所述第二类信号线绝缘设置。
  11. 根据权利要求9所述的显示面板，其中，所述第一导电金属球在第一方向上的尺寸小于或等于所述第二导电金属球在第一方向上的尺寸，所述第一方向与所述显示面板的厚度方向平行。
  12. 根据权利要求5所述的显示面板，其中，所述第一导电层包括与所述第一类信号线对应的第一金属线和与所述第二类信号线对应的第二金属线。
  13. 根据权利要求12所述的显示面板，其中，所述第一金属线与所述第二金属线并列设置或横纵交错设置。
  14. 根据权利要求13所述的显示面板，其中，所述第一金属线与所述第二金属线绝缘设置。
  15. 根据权利要求2所述的显示面板，其中，所述非显示区内的所述平坦层的厚度小于或者等于所述显示区内所述平坦层的厚度。
  16. 根据权利要求2所述的显示面板，其中，所述第一类信号线包括第一连接段和第二连接段，所述第一连接段位于所述显示面板的显示区，所述第二连接段位于所述显示面板的非显示区。
  17. 根据权利要求16所述的显示面板，其中，所述第一连接段由透明导电金属构成。
  18. 根据权利要求17所述的显示面板，其中，所述封框胶层还包括多个间隙子。
  19. 根据权利要求18所述的显示面板，其中，所述间隙子的尺寸与至少部分所述电连接构件的尺寸相同。
  20. 一种显示终端，其中，包括终端主体和权利要求1所述的显示面板。
PCT/CN2021/115506 2021-06-16 2021-08-31 一种显示面板及显示终端 Ceased WO2022262120A1 (zh)

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