WO2022255292A1 - フェノールフォーム用樹脂組成物及び発泡体 - Google Patents
フェノールフォーム用樹脂組成物及び発泡体 Download PDFInfo
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- WO2022255292A1 WO2022255292A1 PCT/JP2022/021907 JP2022021907W WO2022255292A1 WO 2022255292 A1 WO2022255292 A1 WO 2022255292A1 JP 2022021907 W JP2022021907 W JP 2022021907W WO 2022255292 A1 WO2022255292 A1 WO 2022255292A1
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- WIPO (PCT)
- Prior art keywords
- foam
- resin composition
- acid
- phenolic
- mass
- Prior art date
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- 239000006260 foam Substances 0.000 title claims abstract description 159
- 239000011342 resin composition Substances 0.000 title claims abstract description 93
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 150000001875 compounds Chemical class 0.000 claims abstract description 38
- 239000003063 flame retardant Substances 0.000 claims abstract description 32
- 239000004593 Epoxy Substances 0.000 claims abstract description 31
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 23
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000004014 plasticizer Substances 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000007787 solid Substances 0.000 claims abstract description 9
- 239000004202 carbamide Substances 0.000 claims abstract description 7
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 7
- -1 aliphatic polyol Chemical class 0.000 claims description 47
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 36
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 27
- 239000002253 acid Substances 0.000 claims description 16
- 229920005906 polyester polyol Polymers 0.000 claims description 16
- 239000002344 surface layer Substances 0.000 claims description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims description 15
- 239000011574 phosphorus Substances 0.000 claims description 15
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 14
- 229910019142 PO4 Inorganic materials 0.000 claims description 12
- 229920005862 polyol Polymers 0.000 claims description 11
- 238000005187 foaming Methods 0.000 claims description 10
- 239000010452 phosphate Substances 0.000 claims description 8
- 239000004604 Blowing Agent Substances 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 abstract description 38
- 239000004088 foaming agent Substances 0.000 abstract description 10
- 230000002378 acidificating effect Effects 0.000 abstract description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 42
- 210000004027 cell Anatomy 0.000 description 41
- 229920001568 phenolic resin Polymers 0.000 description 32
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 30
- 238000001723 curing Methods 0.000 description 27
- 238000010521 absorption reaction Methods 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- 239000000203 mixture Substances 0.000 description 14
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 235000021317 phosphate Nutrition 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
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- 239000002184 metal Substances 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
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- 239000002994 raw material Substances 0.000 description 7
- 229930195734 saturated hydrocarbon Natural products 0.000 description 7
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- 229920000388 Polyphosphate Polymers 0.000 description 5
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 150000004820 halides Chemical class 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229930195733 hydrocarbon Natural products 0.000 description 5
- ULYZAYCEDJDHCC-UHFFFAOYSA-N isopropyl chloride Chemical compound CC(C)Cl ULYZAYCEDJDHCC-UHFFFAOYSA-N 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000001205 polyphosphate Substances 0.000 description 5
- 235000011176 polyphosphates Nutrition 0.000 description 5
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 5
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 125000001309 chloro group Chemical group Cl* 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 3
- OQISUJXQFPPARX-UHFFFAOYSA-N 2-chloro-3,3,3-trifluoroprop-1-ene Chemical compound FC(F)(F)C(Cl)=C OQISUJXQFPPARX-UHFFFAOYSA-N 0.000 description 3
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 3
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 150000008282 halocarbons Chemical class 0.000 description 3
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 3
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 239000001488 sodium phosphate Substances 0.000 description 3
- 239000000600 sorbitol Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 2
- LDTMPQQAWUMPKS-OWOJBTEDSA-N (e)-1-chloro-3,3,3-trifluoroprop-1-ene Chemical compound FC(F)(F)\C=C\Cl LDTMPQQAWUMPKS-OWOJBTEDSA-N 0.000 description 2
- NLOLSXYRJFEOTA-UHFFFAOYSA-N 1,1,1,4,4,4-hexafluorobut-2-ene Chemical class FC(F)(F)C=CC(F)(F)F NLOLSXYRJFEOTA-UHFFFAOYSA-N 0.000 description 2
- NDMMKOCNFSTXRU-UHFFFAOYSA-N 1,1,2,3,3-pentafluoroprop-1-ene Chemical compound FC(F)C(F)=C(F)F NDMMKOCNFSTXRU-UHFFFAOYSA-N 0.000 description 2
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N 2,2-dimethylbutane Chemical compound CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 2
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 2
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- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
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- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 229910001382 calcium hypophosphite Inorganic materials 0.000 description 1
- 229940064002 calcium hypophosphite Drugs 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- PFURGBBHAOXLIO-WDSKDSINSA-N cyclohexane-1,2-diol Chemical compound O[C@H]1CCCC[C@@H]1O PFURGBBHAOXLIO-WDSKDSINSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- RLMGYIOTPQVQJR-UHFFFAOYSA-N cyclohexane-1,3-diol Chemical compound OC1CCCC(O)C1 RLMGYIOTPQVQJR-UHFFFAOYSA-N 0.000 description 1
- VKONPUDBRVKQLM-UHFFFAOYSA-N cyclohexane-1,4-diol Chemical compound OC1CCC(O)CC1 VKONPUDBRVKQLM-UHFFFAOYSA-N 0.000 description 1
- VCVOSERVUCJNPR-UHFFFAOYSA-N cyclopentane-1,2-diol Chemical compound OC1CCCC1O VCVOSERVUCJNPR-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 1
- 235000019838 diammonium phosphate Nutrition 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- AWROWLLGXAQBQF-UHFFFAOYSA-N dilithium hydrogen phosphite Chemical compound [Li+].[Li+].OP([O-])[O-] AWROWLLGXAQBQF-UHFFFAOYSA-N 0.000 description 1
- REKWWOFUJAJBCL-UHFFFAOYSA-L dilithium;hydrogen phosphate Chemical compound [Li+].[Li+].OP([O-])([O-])=O REKWWOFUJAJBCL-UHFFFAOYSA-L 0.000 description 1
- 229910000395 dimagnesium phosphate Inorganic materials 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- IIRVGTWONXBBAW-UHFFFAOYSA-M disodium;dioxido(oxo)phosphanium Chemical compound [Na+].[Na+].[O-][P+]([O-])=O IIRVGTWONXBBAW-UHFFFAOYSA-M 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 210000000497 foam cell Anatomy 0.000 description 1
- HDNHWROHHSBKJG-UHFFFAOYSA-N formaldehyde;furan-2-ylmethanol Chemical compound O=C.OCC1=CC=CO1 HDNHWROHHSBKJG-UHFFFAOYSA-N 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- GFMIDCCZJUXASS-UHFFFAOYSA-N hexane-1,1,6-triol Chemical compound OCCCCCC(O)O GFMIDCCZJUXASS-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QTBFPMKWQKYFLR-UHFFFAOYSA-N isobutyl chloride Chemical compound CC(C)CCl QTBFPMKWQKYFLR-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- DJBOBJVJAJAPAV-UHFFFAOYSA-N lithium dihydrogen phosphite Chemical compound [Li+].OP(O)[O-] DJBOBJVJAJAPAV-UHFFFAOYSA-N 0.000 description 1
- 229910001383 lithium hypophosphite Inorganic materials 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- SNKMVYBWZDHJHE-UHFFFAOYSA-M lithium;dihydrogen phosphate Chemical compound [Li+].OP(O)([O-])=O SNKMVYBWZDHJHE-UHFFFAOYSA-M 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- SEQVSYFEKVIYCP-UHFFFAOYSA-L magnesium hypophosphite Chemical compound [Mg+2].[O-]P=O.[O-]P=O SEQVSYFEKVIYCP-UHFFFAOYSA-L 0.000 description 1
- 229910001381 magnesium hypophosphite Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 229910000400 magnesium phosphate tribasic Inorganic materials 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 235000019837 monoammonium phosphate Nutrition 0.000 description 1
- 235000019691 monocalcium phosphate Nutrition 0.000 description 1
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 1
- 235000019799 monosodium phosphate Nutrition 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- KHARCSTZAGNHOT-UHFFFAOYSA-N naphthalene-2,3-dicarboxylic acid Chemical compound C1=CC=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 KHARCSTZAGNHOT-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- UGJRMHXEWBBMMN-UHFFFAOYSA-N pentadecane-1,3-diol Chemical compound CCCCCCCCCCCCC(O)CCO UGJRMHXEWBBMMN-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000003008 phosphonic acid esters Chemical class 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- XRVCFZPJAHWYTB-UHFFFAOYSA-N prenderol Chemical compound CCC(CC)(CO)CO XRVCFZPJAHWYTB-UHFFFAOYSA-N 0.000 description 1
- 229950006800 prenderol Drugs 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- SBYHFKPVCBCYGV-UHFFFAOYSA-N quinuclidine Chemical compound C1CC2CCN1CC2 SBYHFKPVCBCYGV-UHFFFAOYSA-N 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- AQMNWCRSESPIJM-UHFFFAOYSA-N sodium;phosphenic acid Chemical compound [Na+].O[P+]([O-])=O AQMNWCRSESPIJM-UHFFFAOYSA-N 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- CNALVHVMBXLLIY-IUCAKERBSA-N tert-butyl n-[(3s,5s)-5-methylpiperidin-3-yl]carbamate Chemical compound C[C@@H]1CNC[C@@H](NC(=O)OC(C)(C)C)C1 CNALVHVMBXLLIY-IUCAKERBSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 229910000391 tricalcium phosphate Inorganic materials 0.000 description 1
- 229940078499 tricalcium phosphate Drugs 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
- LEMQFBIYMVUIIG-UHFFFAOYSA-N trifluoroborane;hydrofluoride Chemical compound F.FB(F)F LEMQFBIYMVUIIG-UHFFFAOYSA-N 0.000 description 1
- XPDWGBQVDMORPB-UHFFFAOYSA-N trifluoromethane acid Natural products FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 1
- GSURLQOINUQIIH-UHFFFAOYSA-N triheptyl phosphate Chemical compound CCCCCCCOP(=O)(OCCCCCCC)OCCCCCCC GSURLQOINUQIIH-UHFFFAOYSA-N 0.000 description 1
- SFENPMLASUEABX-UHFFFAOYSA-N trihexyl phosphate Chemical compound CCCCCCOP(=O)(OCCCCCC)OCCCCCC SFENPMLASUEABX-UHFFFAOYSA-N 0.000 description 1
- TWQULNDIKKJZPH-UHFFFAOYSA-K trilithium;phosphate Chemical compound [Li+].[Li+].[Li+].[O-]P([O-])([O-])=O TWQULNDIKKJZPH-UHFFFAOYSA-K 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- QJAVUVZBMMXBRO-UHFFFAOYSA-N tripentyl phosphate Chemical compound CCCCCOP(=O)(OCCCCC)OCCCCC QJAVUVZBMMXBRO-UHFFFAOYSA-N 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- 229940048102 triphosphoric acid Drugs 0.000 description 1
- RXPQRKFMDQNODS-UHFFFAOYSA-N tripropyl phosphate Chemical compound CCCOP(=O)(OCCC)OCCC RXPQRKFMDQNODS-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- CMPGARWFYBADJI-UHFFFAOYSA-L tungstic acid Chemical compound O[W](O)(=O)=O CMPGARWFYBADJI-UHFFFAOYSA-L 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0014—Use of organic additives
- C08J9/0028—Use of organic additives containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0014—Use of organic additives
- C08J9/0023—Use of organic additives containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0014—Use of organic additives
- C08J9/0038—Use of organic additives containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0066—Use of inorganic compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/16—Nitrogen-containing compounds
- C08K5/21—Urea; Derivatives thereof, e.g. biuret
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2201/00—Foams characterised by the foaming process
- C08J2201/02—Foams characterised by the foaming process characterised by mechanical pre- or post-treatments
- C08J2201/026—Crosslinking before of after foaming
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/14—Saturated hydrocarbons, e.g. butane; Unspecified hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/14—Saturated hydrocarbons, e.g. butane; Unspecified hydrocarbons
- C08J2203/142—Halogenated saturated hydrocarbons, e.g. H3C-CF3
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/18—Binary blends of expanding agents
- C08J2203/182—Binary blends of expanding agents of physical blowing agents, e.g. acetone and butane
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2205/00—Foams characterised by their properties
- C08J2205/04—Foams characterised by their properties characterised by the foam pores
- C08J2205/052—Closed cells, i.e. more than 50% of the pores are closed
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08J2361/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with monohydric phenols
- C08J2361/10—Phenol-formaldehyde condensates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08J2361/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2467/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0014—Use of organic additives
- C08J9/0033—Use of organic additives containing sulfur
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K2003/026—Phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
Definitions
- the present invention is a foam having closed cells, which has a small difference in closed cell rate between the surface layer and the deeper inside, is excellent in heat insulation, and is a phenolic resin foam that does not easily absorb water when it comes into contact with water.
- the present invention relates to resin compositions for phenolic foams that provide body.
- phenolic resin foam also known as phenolic foam
- phenolic foam has been widely used as a heat insulating material in the construction field, for example, due to its excellent heat resistance and flame retardancy.
- a phenolic resin foam is produced by foaming and curing a composition containing a phenolic resin, a blowing agent, a curing agent, etc.
- the obtained phenolic resin foam usually has closed cells, The closed cells contain gas derived from the blowing agent.
- Patent Document 1 discloses a phenolic resin foam characterized by mixing and foaming a resol-type phenolic resin with an acidic catalyst containing resorcinols as a curing accelerator in the presence of a foaming agent and a foam stabilizer. ing.
- Patent Document 2 contains (A) a resol-type phenolic resin, (B) an acidic curing agent, (C) a foaming agent, (D) a foam stabilizer and (E) a modifier, and as component (E), A mono- and/or polyglycidyl ether compound having a weight average molecular weight of 200 to 3000 and an epoxy equivalent of 150 to 2500 is added in an amount of 0.2 to 20 parts by weight per 100 parts by weight of component (A).
- a foamable resol-type phenolic resin composition containing the composition and a phenolic resin foam obtained by foaming and curing the composition are disclosed.
- an expandable resol-type phenolic resin molding material containing a liquid resol-type phenolic resin, a foaming agent, a foam stabilizer and an acid curing agent is further characterized by containing an epoxy resin compound as an additive.
- a foamable resol type phenolic resin molding material and a phenolic resin foam obtained by foaming and curing the molding material are disclosed.
- JP-A-59-124940 Japanese Patent Application Laid-Open No. 2004-176008 JP 2011-16919 A
- a conventionally known phenolic resin foam obtained using a composition containing a resol-type phenolic resin, an acid curing agent and a foaming agent has a closed cell rate in the surface layer of the foam and a The difference from the closed cell rate in the deep inside (central part) was large, and the stable performance of the foam could not be obtained.
- some of the conventionally known phenolic resin foams tend to absorb water when in contact with water.
- the acid curing agent may be extracted with water, corroding the metal member.
- the water absorption of the foam may increase.
- the present invention is a foam having closed cells, which has a small difference in closed cell rate between the surface layer and the deeper inside, can reduce the initial thermal conductivity, has excellent heat insulation, and is resistant to water.
- a phenolic foam resin composition containing (A) a resol-type phenolic resin, (B) an acid curing agent, (C) a blowing agent, (D) urea, and (E) an aliphatic epoxy compound.
- the aliphatic epoxy compound (E) is an aliphatic polyol polyglycidyl ether compound.
- a foam having closed cells with a small difference in closed cell rate between the surface layer and the deeper inside can be produced with a low shrinkage rate and a desired size.
- a foam can be produced efficiently.
- the resin composition for phenolic foam of the present invention further contains a solid phosphorus-based flame retardant, a phenolic resin foam having flame retardancy while maintaining the property of being difficult to absorb water when contacted with water can be obtained. can be manufactured.
- the resin composition for phenol foam of the present invention further contains a plasticizer, a phenol resin foam having uniform foam cells can be produced.
- the phenolic resin foam of the present invention has closed cells with a small difference in closed cell rate between the surface layer and the deeper inside, and has low thermal conductivity, and is therefore suitable as a heat insulating material.
- the acid curing agent when used in an environment that can be humid or exposed to rainwater, the acid curing agent is less likely to be extracted with water. is expected to have a corrosion inhibitory effect.
- the resin composition for phenolic foam of the present invention (hereinafter sometimes simply referred to as “the resin composition of the present invention”) comprises: (A) a resol-type phenolic resin (hereinafter also referred to as “component (A)”), (B) an acid curing agent (hereinafter also referred to as “component (B)”); (C) a foaming agent (hereinafter also referred to as “component (C)”); (D) urea (hereinafter also referred to as “component (D)”), as well as, (E) Aliphatic epoxy compound (hereinafter also referred to as “component (E)”) contains The resin composition of the present invention can further contain other components (described later) as necessary.
- Component (A) is generally composed of phenols such as phenol, cresol, xylenol, paraalkylphenol, paraphenylphenol and resorcinol or modified phenols thereof and aldehydes such as formaldehyde, paraformaldehyde, furfural and acetaldehyde combined with sodium hydroxide. , potassium hydroxide, calcium hydroxide, etc., and is a resol-type phenolic resin obtained by a reaction.
- the ratio of phenols and aldehydes used is not particularly limited, but the molar ratio is usually about 1.0:1.5 to 1.0:3.0, preferably 1.0:1. 8-1.0:2.5.
- the component (A) contained in the resin composition of the present invention may be of only one type, or may be of two or more types.
- the viscosity and molecular weight of component (A) are not particularly limited.
- the viscosity (temperature: 25°C) measured by a Brookfield viscometer (according to JIS K 7117-1) is preferably 2000 to 100000 mPa s, more preferably 3000 to 80000 mPa s, still more preferably 5000 to 30000 mPa. ⁇ s.
- the weight average molecular weight Mw measured by gel permeation chromatography is preferably 400 to 3,000, more preferably 700 to 2,000. When the weight average molecular weight is 400 or more, it is easy to further improve the compressive strength of the obtained foam and further reduce the thermal conductivity. When the weight-average molecular weight Mw is 3,000 or less, the resin composition of the present invention does not have high viscosity and has good handleability, making it easy to obtain a desired expansion ratio.
- Component (B) The acid curing agent of component (B) is a component that accelerates the curing reaction of component (A).
- Inorganic acids such as hydrofluoroboric acid; Aromatic sulfonic acids such as benzenesulfonic acid, ethylbenzenesulfonic acid, toluenesulfonic acid, xylenesulfonic acid, phenolsulfonic acid, cresolsulfonic acid, naphthalenesulfonic acid, methanesulfonic acid, trifluoromethane
- Organic acids such as aliphatic sulfonic acids such as sulfonic acids can be used.
- the component (B) contained in the resin composition of the present invention may be of only one type, or may be of two or more types.
- Component (B) according to the present invention preferably contains an organic acid.
- these acid curing agents phenolsulfonic acid, toluenesulfonic acid, xylenesulfonic acid, and naphthalenesulfonic acid can achieve an appropriate curing rate in the production of phenolic foam, so resol
- the balance between curing of the mold phenol resin and foaming by the foaming agent is further improved, thereby realizing a desired foam structure, so that it is particularly preferably used.
- the combined use of p-toluenesulfonic acid and xylenesulfonic acid is recommended.
- the amount of p-toluenesulfonic acid used is desirably larger than the amount of xylenesulfonic acid used on a mass basis.
- p-toluenesulfonic acid:xylenesulfonic acid in a mass ratio of 51:49 to 95:5 is advantageously employed.
- the content of component (B) contained in the resin composition of the present invention is preferably 1 to 50 parts by mass, more preferably 5 to 30 parts by mass, and even more preferably 7 to 25 parts by mass.
- the component (C) foaming agent is a component that efficiently foams the component (A) while forming closed cells. , carbon dioxide gas, water, air, or the like can be used.
- the component (C) contained in the resin composition of the present invention may be of one kind, or may be of two or more kinds.
- an aliphatic or alicyclic saturated hydrocarbon or unsaturated hydrocarbon can be used. Of these, aliphatic or alicyclic saturated hydrocarbons are preferred.
- the number of carbon atoms contained in the hydrocarbon is preferably 3 to 7, and specific compounds include propane, butane, pentane, isopentane, hexane, isohexane, neohexane, heptane, isoheptane, cyclopentane, and the like. .
- halogenated hydrocarbon aliphatic or alicyclic saturated hydrocarbon or unsaturated hydrocarbon halide
- This compound may be a compound in which all the hydrogen atoms constituting the hydrocarbon are substituted with halogen atoms, or the remaining hydrogen atoms are substituted with halogen atoms while leaving some of the hydrogen atoms constituting the hydrocarbon. It may be a compound that has been
- a halogen atom can be a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, preferably a fluorine atom and a chlorine atom, particularly preferably a chlorine atom.
- the halogenated hydrocarbon is preferably a saturated hydrocarbon halide, more preferably an aliphatic saturated hydrocarbon chloride.
- saturated hydrocarbon halide more preferably an aliphatic saturated hydrocarbon chloride.
- Examples include dichloroethane, propyl chloride, isopropyl chloride, butyl chloride, isobutyl chloride, pentyl chloride, isopentyl chloride and the like. Of these, propyl chloride and isopropyl chloride are preferred, with isopropyl chloride being particularly preferred.
- halide of an unsaturated hydrocarbon preferably a compound obtained by replacing at least one hydrogen atom contained in an unsaturated hydrocarbon having 2 to 6 carbon atoms with a fluorine atom and/or a chlorine atom
- Specific compounds include tetrafluoropropene, fluorochloropropene, trifluoromonochloropropene, pentafluoropropene, fluorochlorobutene, hexafluorobutene, and the like.
- the hydrofluoroolefin (HFO) which is one of the halides of such unsaturated hydrocarbons, includes, for example, pentafluoropropenes such as 1,2,3,3,3-pentafluoropropene (HFO1225ye) , 1,3,3,3-tetrafluoropropene (HFO1234ze), 2,3,3,3-tetrafluoropropene (HFO1234yf), 1,2,3,3-tetrafluoropropene (HFO1234ye) and the like , trifluoropropenes such as 3,3,3-trifluoropropene (HFO1243zf), tetrafluorobutene isomers (HFO1354), pentafluorobutene isomers (HFO1345), 1,1,1,4,4,4 - hexafluorobutene isomers (HFO1336) such as hexafluoro-2-butene (HFO13), pen
- hydrochlorofluoroolefins include 1-chloro-3,3,3-trifluoropropene (HCFO-1233zd), 2-chloro-3,3,3-trifluoropropene (HCFO-1233xf), Dichlorotrifluoropropene (HCFO1223), 1-chloro-2,3,3-trifluoropropene (HCFO-1233yd), 1-chloro-1,3,3-trifluoropropene (HCFO-1233zb), 2-chloro- 1,3,3-trifluoropropene (HCFO-1233xe), 2-chloro-2,2,3-trifluoropropene (HCFO-1233xc), 3-chloro-1,2,3-trifluoropropene (HCFO- 1233ye), 3-chloro-1,1,2-trifluoropropene (HCFO-1233yc) and the like.
- the component (C) preferably consists of a plurality of components, and as a specific combination, it may consist of a saturated aliphatic or alicyclic hydrocarbon and a halide of the saturated hydrocarbon. can. Especially preferred are combinations of saturated aliphatic hydrocarbons and compounds which are chlorides of saturated hydrocarbons and which contain hydrogen atoms. It should be noted that a combination of isopentane and isopropyl chloride is recommended as such a combination of two types of foaming agents, whereby the object of the present invention can be achieved more advantageously.
- the mass ratio is not particularly limited, but is usually 5 to 25% by mass and 75 to 95% by mass, respectively, when the total of both is 100% by mass.
- the content of the component (C) contained in the resin composition of the present invention is set to 100 parts by mass from the viewpoint of the foamability and curability of the component (A) during foam production. In that case, it is preferably 1 to 30 parts by mass, more preferably 3 to 28 parts by mass, and still more preferably 5 to 25 parts by mass.
- Component (D) Urea as component (D) can effectively lower the initial thermal conductivity of the resulting foam and can reduce the odor of the foam. , It is a component that reduces the difference in closed cell ratio between the surface layer of the foam and the inner part deeper than it, and reduces the water absorption.
- the content of component (D) contained in the resin composition of the present invention is preferably 0.5 to 20 parts by mass, more preferably 1 to 15 parts by mass when the content of component (A) is 100 parts by mass. parts by mass, more preferably 2 to 10 parts by mass.
- Component (E) The aliphatic epoxy compound of component (E) is a compound having a linear and/or branched carbon chain and an epoxy group, and forms a foam having a small shrinkage rate and a desired size. It is a component that reduces water absorption.
- the component (E) contained in the resin composition of the present invention may be of one kind, or may be of two or more kinds.
- the carbon chain constituting component (E) usually forms a hydrocarbon group, or the hydrogen atoms contained in the hydrocarbon group are selected from oxygen, nitrogen, sulfur and halogen atoms.
- a functional group containing at least one atom (for example, a hydroxy group, etc.) or a substituted hydrocarbon group substituted on the atom is formed.
- the number of epoxy groups contained in component (E) is not particularly limited, and is preferably 1 or more, more preferably 2 or more, still more preferably 2-6.
- the component (E) is a compound containing a glycidyl ether group represented by the following formula (1) wherein the epoxy group constitutes a glycidyl ether group represented by the following formula (1), since the effect of reducing the water absorption of the foam can be sufficiently obtained.
- the epoxy group constitutes a glycidyl ether group represented by the following formula (1)
- the number of glycidyl ether groups contained in component (E) is not particularly limited, and is preferably 1 or more, more preferably 2 or more, still more preferably 2-6.
- the compound containing a glycidyl ether group represented by the above formula (1) is not particularly limited, it is preferably an aliphatic polyol polyglycidyl ether compound.
- This aliphatic polyol polyglycidyl ether compound may have a hydroxy group.
- the aliphatic polyol polyglycidyl ether compound is preferably an aliphatic polyhydric alcohol polyglycidyl ether.
- aliphatic polyol polyglycidyl ether compounds include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, glycerin polyglycidyl ether, diglycerol polyglycidyl ether, Glycerol polyglycidyl ether, polyglycerol polyglycidyl ether, trimethylolethane polyglycidyl ether, trimethylolpropane polyglycidyl ether, ditrimethylolpropane polyglycidyl ether, sorbitol polyglycidyl ether, pentaerythritol polyglycidyl ether, resorcinol diglycidyl ether, neopentyl Glycol diglycidyl ether, hydrogenated bisphenol A diglyce
- the aliphatic polyol polyglycidyl ether compound may be either a monomer or a polymer, but when a monomer is used, the water absorption is low when it comes into contact with water, and the difference in closed cell ratio between the surface layer and the deeper inside is small. A small and well-balanced foam can be obtained.
- the epoxy equivalent of component (E) is preferably 100 to 320 g/eq, more preferably 100 to 300 g/eq, more preferably 100 to 300 g/eq, from the viewpoint of good foam production and the effect of reducing water absorption of the resulting foam. It is preferably 100 to 280 g/eq.
- the epoxy equivalent is a value measured according to JIS K 7236:2009.
- the viscosity of component (E) is not particularly limited. from the viewpoint of, preferably 5 to 25000 mPa ⁇ s, more preferably 10 to 22000 mPa ⁇ s, still more preferably 10 to 6000 mPa ⁇ s, and particularly preferably 10 to 900 mPa ⁇ s.
- the preferred upper limit of the viscosity of component (A) is 100000 mPa ⁇ s
- the preferred upper limit of the viscosity of component (E) is 25000 mPa ⁇ s
- component (E) is a viscosity reducing agent. I can say.
- the fluidity of the resin composition of the present invention is improved, and the moldability of the foam can be improved.
- the content of the component (E) contained in the resin composition of the present invention is preferably 1 to 20 when the content of the component (A) is 100 parts by mass, from the viewpoint of the effect of reducing the water absorption of the foam. parts by mass, more preferably 2 to 18 parts by mass, and even more preferably 3 to 15 parts by mass.
- the resin composition of the present invention essentially comprises the above components (A), (B), (C), (D) and (E), the closed cell ratio between the surface layer and the deeper interior is It is possible to efficiently produce a foam with a small difference in the phenolic resin foam having a desired size with a low shrinkage rate. In addition, it is possible to produce a phenolic resin foam that has low thermal conductivity, excellent heat insulation, and hardly absorbs water when in contact with water. Furthermore, in a preferred embodiment, a foam having a dimensional change rate of preferably 2.5% or less, more preferably 2.4% or less, can be produced by the method described in [Examples] below.
- the resin composition of the present invention may further contain other components in addition to the essential components (A), (B), (C), (D) and (E).
- Other components include flame retardants, plasticizers, foam stabilizers, corrosion inhibitors, inorganic fillers, and the like.
- Flame retardants may be either solid or liquid, and examples include phosphorus-containing compounds, triazole compounds, triazine compounds, cyclic monoureides, cyclic diureides, amidine compounds, tetrazole compounds, borates, stannates, molybdates, tungstic acid. Salts, metal oxides (antimony oxide, etc.), metal hydroxides, metal sulfides, polyphenylene sulfide resins, polyphenylene oxide resins, polycarbonate resins, polyarylate resins, aromatic amide resins, aralkyl resins, aromatic vinyls Resin etc. are mentioned.
- the flame retardant may be contained either alone or in combination of two or more.
- the flame retardant is preferably a solid phosphorus-containing compound (hereinafter also referred to as “component (F)”).
- This component (F) may be either an inorganic material (hereinafter referred to as “inorganic phosphorus flame retardant”) or an organic material (hereinafter referred to as “organic phosphorus flame retardant”).
- inorganic phosphorus flame retardant an inorganic material
- organic phosphorus flame retardant organic material
- the resin composition of the present invention contains the components (D) and (E), so the dimensional change rate is low, and when in contact with water A phenolic resin foam having flame retardancy can be produced while maintaining the property of being difficult to absorb water.
- Inorganic phosphorus-based flame retardants include red phosphorus, (poly)phosphates, phosphazenes, and the like. "(Poly)phosphate” means monophosphate and polyphosphate.
- Polyphosphates include orthophosphoric acid, phosphorous acid, hypophosphorous acid, polyphosphoric acid (metaphosphoric acid, pyrophosphoric acid, triphosphoric acid, tetraphosphoric acid, etc.), polyphosphorous acid (metaphosphorous acid, non-condensed or condensed (sub)phosphoric acid such as pyrophosphite) and at least one metal selected from periodic table group IA to IVB metals, ammonia, aliphatic amines and aromatic amines, or a compound thereof salt.
- metals of Groups IA to IVB of the periodic table include lithium, sodium, calcium, barium, iron (II), iron (III), and aluminum.
- aliphatic amines examples include methylamine, ethylamine, diethylamine, triethylamine, ethylenediamine and piperazine.
- Aromatic amines include pyridine, triazine, melamine, ammonium, and the like.
- Specific monophosphates include ammonium salts such as ammonium phosphate, ammonium dihydrogen phosphate, and diammonium hydrogen phosphate; monosodium phosphate, disodium phosphate, trisodium phosphate, monosodium phosphite, Sodium salts such as disodium phosphite and sodium hypophosphite; Potassium salts; lithium salts such as monolithium phosphate, dilithium phosphate, trilithium phosphate, monolithium phosphite, dilithium phosphite, lithium hypophosphite; barium dihydrogen phosphate, barium hydrogen phosphate , tribarium phosphate, barium salts such as barium hypophosphite; magnesium monohydrogen phosphate, magnesium hydrogen phosphate, trimagnesium phosphate, magnesium hypophosphite, etc.; calcium dihydrogen phosphate, phosphoric acid Calcium salts such as calcium hydrogen, tricalcium
- Organic phosphorus flame retardants include phosphoric acid esters, phosphoric acid ester amides, phosphonitrile compounds, organic phosphonic acid compounds (phosphonic acid esters, phosphonic acid metal salts, etc.), organic phosphinic acid compounds (phosphinic acid metal salts, etc.), phosphines oxides, resorcinol phosphates, hydroquinone phosphates, biphenol phosphates, bisphenol phosphates and the like.
- the component (F) preferably contains an inorganic phosphorus-based flame retardant, more preferably contains red phosphorus or (poly)phosphate, and high flame retardancy is obtained. It is particularly preferred to include
- the constituent material of the coating layer may be either an inorganic compound or an organic compound.
- inorganic compounds include metal oxides or metal hydroxides such as aluminum hydroxide, magnesium hydroxide, zinc hydroxide, titanium hydroxide, aluminum oxide, magnesium oxide, zinc oxide and titanium oxide.
- organic compounds include thermosetting resins such as phenolic resins, furan resins, and xylene-formaldehyde resins.
- the average particle diameter of component (F) measured by a laser diffraction/scattering method is preferably about 1 to 100 ⁇ m, more preferably about 5 to 50 ⁇ m. If the particle size of component (F) is too small, it may become difficult to uniformly disperse it in the resin composition. On the other hand, even if the particle size of the component (F) is too large, a uniform dispersion effect in the resin composition may not be obtained.
- the content of the flame retardant is preferably 0.3 to 30 parts by mass when the content of component (A) is 100 parts by mass, more preferably 1 to 25 parts by mass, more preferably 2 to 20 parts by mass.
- the resin composition of the present invention may contain flame retardants other than red phosphorus.
- flame retardants other than red phosphorus.
- other solid phosphorus-based flame retardants, liquid phosphorus-based flame retardants, flame retardants that do not contain elemental phosphorus, and the like can be used.
- the content of the other flame retardant is preferably 0.5 to 1000 parts by mass, more preferably 1 to 300 parts by mass, and still more preferably 3 to 1000 parts by mass when the content of red phosphorus is 100 parts by mass. 100 parts by mass.
- plasticizers include polyester polyols, polyethylene glycol, aromatic carboxylic acid esters, and organic phosphoric acid esters.
- the flame retardant may be contained either alone or in combination of two or more.
- the plasticizer permeates between the molecules of component (A) to weaken the intermolecular force of component (A) and facilitate the movement of each molecular chain.
- flexibility can be imparted to the cured resin of component (A), and a synergistic effect can further reduce the water absorption of the foam.
- Plasticizers are preferably polyester polyols and organic phosphoric acid esters, particularly preferably polyester polyols. Since the polyester polyol has a structure containing an ester bond and a hydroxyl group that are excellent in hydrophilicity and surface activity, it has good compatibility with the hydrophilic component (A), and a uniform resin composition can be obtained. Moreover, when a resin composition containing a polyester polyol is used, uneven distribution of cells is suppressed, and a foam having uniform cells can be obtained. Polyester polyols and organic phosphate esters may be used alone as plasticizers, but when they are used in combination, a phenolic resin foam that is less likely to absorb water when contacted with water can be produced.
- a polyester polyol is a compound having a plurality of hydroxy groups obtained by an esterification reaction between a polyol and a polycarboxylic acid.
- the raw material polyol and polycarboxylic acid may be any of an aliphatic compound, an alicyclic compound and an aromatic compound, but an aromatic compound is more preferable.
- the polyester polyol is preferably a polyester polyol obtained by an esterification reaction of a polyol having 2 to 5 hydroxy groups and a polycarboxylic acid having 2 to 4 carboxy groups, particularly preferably.
- diol a polyol having two hydroxy groups
- dicarboxylic acid a polycarboxylic acid having two carboxy groups
- A is the residue obtained by removing the carboxyl group from the dicarboxylic acid
- R1 is the residue obtained by removing the hydroxy group from the diol
- n is an integer of 1 or more.
- Diols may be aliphatic diols, alicyclic diols or aromatic diols, and may have other functional groups or ether bonds or ester bonds in the molecule.
- Aliphatic diols include ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8 - octanediol, 1,9-nonanediol, 2,2-dimethyl-1,3-propanediol (nempentyl glycol), 2,2-diethyl-1,3-propanediol, 2,2-dipropyl-1, 3-propanediol, 2,2-diisopropyl-1,3-propanediol, 2,2-dibutyl-1,3-propanediol, 2,2-diisobutyl-1,3-propanediol, 2-methyl-2- Alkanediol such as dodecyl-1,3-propanediol, 2-
- Cycloaliphatic diols include cyclopentane-1,2-diol, cyclopentane-1,2-dimethanol, cyclohexane-1,2-diol, cyclohexane-1,2-dimethanol and cyclohexane-1,3-diol. , cyclohexane-1,3-dimethanol, cyclohexane-1,4-diol, cyclohexane-1,4-dimethanol, 2,5-norbornanediol and the like.
- Aromatic diols include benzene-1,2-dimethanol, benzene-1,3-dimethanol, benzene-1,4-dimethanol, catechol, resorcinol, hydroquinone, 2,2-bis(4-hydroxyphenyl) Propane (bisphenol A) etc. are mentioned.
- diols are preferably aliphatic diols and alicyclic diols, particularly preferably ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,4-butanediol, 1,6-hexanediol. , neopentyl glycol, cyclohexane-1,2-dimethanol, cyclohexane-1,3-dimethanol and cyclohexanedimethanol.
- the dicarboxylic acid may be any of aliphatic dicarboxylic acid, alicyclic dicarboxylic acid and aromatic dicarboxylic acid, and may have other functional groups in the molecule.
- Aliphatic dicarboxylic acids include adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid and the like.
- Alicyclic dicarboxylic acids include cyclohexane-1,2-dicarboxylic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid and the like.
- aromatic dicarboxylic acids include phthalic acid, isophthalic acid, terephthalic acid, naphthalene-2,3-dicarboxylic acid, naphthalene-1,4-dicarboxylic acid and naphthalene-2,6-dicarboxylic acid.
- the dicarboxylic acid is preferably an aromatic dicarboxylic acid, particularly preferably phthalic acid, isophthalic acid and terephthalic acid.
- the weight-average molecular weight of the polyester polyol is preferably 200 to 10,000, more preferably 200 to 5,000, because it imparts flexibility to the cell walls of the resulting foam and suppresses deterioration over time.
- the hydroxyl value of the polyester polyol is not particularly limited, it is usually 10 to 500 mgKOH/g.
- the content of the component (A) is 100% because the content imparts flexibility to the cell walls and a foam having homogeneous cells is obtained.
- parts by mass it is preferably 1 to 20 parts by mass, more preferably 2 to 15 parts by mass, and even more preferably 3 to 10 parts by mass.
- the organic phosphate ester is preferably a compound that is liquid at room temperature, such as a compound represented by the following general formula (3).
- O P-(OR 2 ) 3 (3)
- each R2 may be the same or different and is a hydrocarbon group or a halogenated hydrocarbon group.
- Examples of the organic phosphate represented by the general formula (3) include trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, tripentyl phosphate, trihexyl phosphate, triheptyl phosphate, trioctyl phosphate, tri-2- Ethylhexyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, tris(2-chloroethyl) phosphate, tris(chloropropyl) phosphate, tris(dichloropropyl) phosphate and the like.
- the resin composition of the present invention contains an organic phosphate ester
- its content is such that the resulting foam is imparted with low water absorbency.
- it is preferably 0.1 to 15 parts by mass, more preferably 0.5 to 10 parts by mass, still more preferably 1 to 8 parts by mass.
- flame retardants for resins
- the use of an organic phosphoric acid ester having a viscosity of 100 mPa ⁇ s or less at 25° C. can reduce the viscosity of the resin composition and improve the fluidity.
- foam stabilizers include castor oil or its alkylene oxide adduct, alkylphenol ethylene oxide adduct, polyoxyethylene alkyl ether, polyoxyethylene polyoxypropylene glycol, dimethylpolysiloxane-polyoxyalkylene copolymer, dimethylpolysiloxane- Examples include polyoxyethylene-polyoxypropylene copolymers, polyoxyethylene sorbitan fatty acid esters, and the like.
- corrosion inhibitors include nitrogen-containing crosslinked cyclic compounds such as quinuclidine and hexamethylenetetramine (hexamine).
- Inorganic fillers include microparticles made of calcium carbonate, magnesium carbonate, calcium sulfate, barium sulfate, calcium silicate, magnesium hydroxide, aluminum hydroxide, mica, talc, bentonite, zeolite, silica gel, aluminum oxide, titanium oxide, antimony oxide, etc. can be used.
- the resin composition of the present invention comprises the above components (A), (B), (C), (D) and (E), and other components used in combination as necessary. It can be produced by mixing with
- the foam of the present invention is obtained by foaming and curing the resin composition of the present invention.
- the foams of the present invention are generally closed-cell foams with a density of 10-150 kg/m 3 . If the density is low, the material is reduced to make the foam lighter and handleability is improved, but the mechanical strength is reduced. 3 , more preferably 29-60 kg/m 3 , particularly preferably 30-50 kg/m 3 .
- the closed cell ratio (according to ASTM D2856) of the foam of the present invention is preferably 85% or more, more preferably 86% or more, at the center of the foam.
- the average of the closed cell rate of the surface layer of the foam and the closed cell rate of the deeper inside (central part) is 80% or more, preferably 85% or more.
- the foam of the present invention is formed of a resin composition containing a specific component, the closed cell rate measured between the surface layer of the foam and the deeper inside (center) difference is small.
- the difference is preferably 15% or less, more preferably 12% or less.
- the thermal conductivity of the foam of the present invention (according to ISO 11561 Annex B, measurement temperature: 20°C) is preferably 0.0200 W/(mK) or less, more preferably 0.0197 W/(mK). It is below.
- a foam having such a low thermal conductivity is suitable for heat insulating materials, packaging materials, and the like.
- the water absorption of the foam of the present invention when it is brought into contact with water is preferably 5.0 g/100 cm 2 or less, more preferably 4.5 g/100 cm 2 or less, as measured by a method according to JIS K 9511. If a foam with such properties is used in a humid environment or in an environment exposed to rainwater, the acid curing agent becomes difficult to extract with water. etc., corrosion of metal members can be suppressed.
- a foam produced using a resin composition containing a flame retardant has excellent flame retardancy, and preferably has an oxygen index of 28 or more, more preferably 30 or more, as measured by a method according to JIS K 7201-2. is.
- the "oxygen index” means the minimum oxygen concentration (% by volume) required for the material to sustain combustion.
- the method for producing the foam of the present invention is appropriately selected depending on the application and the like, and is not particularly limited. For example, conventionally known methods such as those described below can be applied, and if necessary, cutting or the like can be performed as appropriate to form a foam member having a desired shape and size.
- a molding method in which the resin composition is flowed onto an endless conveyor belt to foam and cure (2) A method in which the resin composition is spot-filled to partially foam and cure (3)
- the resin composition is (4)
- a foam block is formed by filling a predetermined large space with a resin composition and foaming and curing the resin composition.
- Method (5) A method of filling, foaming, and curing the resin composition while press-fitting it into the cavity.
- the temperature is preferably 40°C to 90°C, more preferably 50°C to 80°C.
- the heating time is appropriately selected depending on the size of the foam, but is usually 5 to 30 minutes.
- the resin composition of the present invention is foamed and cured at a position in contact with or near another member, so that the foam and the other member are in a bonded state.
- Certain composites can be manufactured.
- articles such as sheet-shaped, plate-shaped, rod-shaped, fiber-shaped, or modified bodies thereof, which are made of an inorganic material, an organic material, or a composite material containing these can be used.
- Blowing Agent Isopropyl chloride and isopentane were mixed at a mass ratio of 85:15 and used as a blowing agent.
- Epoxy compound The following commercial products (aliphatic epoxy compounds or aromatic epoxy resins) were used.
- E-1 ADEKA trimethylolpropane triglycidyl ether “ADEKA GLYCIROL ED-505” (trade name) Number of functional groups: 3, epoxy equivalent: 150 g/eq, viscosity: 150 mPa s (25 ° C.)
- E-2 Neopentyl glycol diglycidyl ether manufactured by ADEKA "ADEKA GLYCIROL ED-523T” (trade name) Number of functional groups: 2, epoxy equivalent: 140 g/eq, viscosity: 15 mPa s (25 ° C.)
- E-3 ADEKA polypropylene glycol diglycidyl ether “ADEKA GLYCIROL ED-506” (trade name) Number of functional groups: 2, epoxy equivalent: 300 g/eq, viscosity: 60 mPa s (25 ° C.)
- E-4 Sorbitol
- Solid flame retardant F-1 red phosphorus "Novaxcel 140" (trade name) manufactured by Rin Kagaku Kogyo Co., Ltd., average particle size: 25 to 35 ⁇ m
- surface coated F-2 zinc borate
- F-3 tetrabromo Bisphenol A
- Plasticizer G-1 A polyester polyol obtained by reacting phthalic acid and diethylene glycol at a molar ratio of 1:2 was used.
- G-2 Tris (chloropropyl) phosphate “TMCPP” (trade name) manufactured by Daihachi Chemical Industry Co., Ltd., viscosity: 60 mPa s (25 ° C.)
- G-3 Triethyl phosphate "TEP” (trade name) manufactured by Daihachi Chemical Industry Co., Ltd., viscosity: 1.6 mPa s (25 ° C.)
- the closed cell rate was measured according to ASTM D2856. The unit is %.
- (3) Dimensional change rate In order to evaluate the dimensional change during molding of the phenolic resin foam, the dimensions of the obtained foam were measured according to JIS A 9511, and the following formula was used to determine the dimensions of the mold. The ratio of the contracted length to (300 mm x 300 mm x 50 mm) was calculated as a percentage. That is, in the width direction of the foam, the length of the line connecting the centers of the two opposing sides was measured at two points. In the thickness direction, the thickness of each center of the four sides of the foam was measured.
- Example 1 100 parts by mass of phenolic resin A-1, 3 parts by mass of a foam stabilizer (castor oil ethylene oxide adduct (addition mole number 22)), 16 parts by mass of a curing agent, 8 parts by mass of a foaming agent, and 5 parts by mass and 3 parts by mass of epoxy compound E-1 were mixed to produce a liquid resin composition for phenolic foam (hereinafter referred to as "resin composition S-1") (see Table 1).
- the obtained resin composition S-1 is placed in a mold (300 mm ⁇ 300 mm ⁇ 50 mm) preheated to 70°C to 75°C, and the mold containing the composition is placed in a heating furnace. did. Then, it was foamed and hardened at 70° C.
- foam H-1 a phenolic resin foam having closed cells and a density of 33 to 35 kg/m 3 (hereinafter referred to as “foam H-1”) was obtained.
- foam H-1 a phenolic resin foam having closed cells and a density of 33 to 35 kg/m 3
- Examples 2-20 The same operation as in Example 1 was performed except that the types and amounts of raw materials used were as shown in Tables 1 and 2, and liquid phenolic foam resin compositions (hereinafter, “resin compositions S-2 to S -20”) was manufactured. Thereafter, phenol resin foams (hereinafter referred to as “foams H-2 to H-20”) were produced in the same manner as in Example 1, and various evaluations were performed (see Tables 1 and 2).
- Comparative Examples 1-10 The same operation as in Example 1 was performed except that the types and amounts of raw materials used were as shown in Table 3, and liquid phenolic foam resin compositions (hereinafter, "resin compositions SS-1 to SS-10" were prepared. ) was manufactured. Thereafter, phenolic resin foams (hereinafter referred to as “foams HH-1 to HH-10”) were produced in the same manner as in Example 1, and various evaluations were performed (see Table 3).
- Comparative Examples 1 and 2 are examples of compositions containing aromatic epoxy resins rather than aliphatic epoxy compounds.
- the foam HH-1 obtained had a large difference of 15% or more in closed cell ratio between the surface layer portion and the inner portion deeper than the surface layer portion.
- the foam HH-2 obtained had a low closed cell rate of less than 75% at the center.
- Comparative Examples 3 to 5, 7, 9 and 10 are examples of compositions containing no epoxy compound, and the water absorption of the obtained foams was large, exceeding 5.0 g/100 cm 2 .
- Comparative Examples 6 and 8 are examples of compositions containing no urea. was greater than 5.0 g/100 cm 2 .
- Examples 1 to 20 are examples of the composition of the present invention.
- the closed cell ratios in the deep interior were all 80% or more, and the difference between the two closed cell ratios was as small as less than 12%.
- Examples 11 and 12 are both examples using a resin composition obtained by adding 10 parts by mass of red phosphorus to each resin composition of Examples 2 and 5.
- the resulting foam H- The water absorption of foams H-2 and H-5 was slightly higher than that of foams H-2 and H-5, but less than 3.0 g/100 cm 2 .
- the use of solid flame retardants did not increase water absorption.
- Examples 15, 17, 18 and 20 are examples using a resin composition obtained by adding a plasticizer to the resin composition of Example 2. It was less than the amount of water absorption of 2.
- Examples 16 and 19 are examples using a resin composition obtained by adding a plasticizer to the resin composition of Example 5, and the water absorption of the obtained foam is the same as that of the foam H-5. less than the amount of water absorbed.
- the resin composition for phenolic foam of the present invention is suitable for forming a phenolic resin foam having a low water absorption and a high closed cell ratio.
- the obtained phenolic resin foam can be suitably used, for example, in the field of construction when it is placed in contact with a metal member in an environment that can be humid or exposed to rainwater.
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Abstract
Description
特許文献1には、レゾール型フェノール樹脂に、硬化促進剤としてレゾルシノール類を含む酸性触媒を、発泡剤、整泡剤の存在下で混合発泡させたことを特徴とするフェノール樹脂発泡体が開示されている。
特許文献2には、(A)レゾール型フェノール樹脂、(B)酸性硬化剤、(C)発泡剤、(D)整泡剤及び(E)改質剤を含み、かつ成分(E)として、重量平均分子量が200~3000であり、エポキシ当量が150~2500の範囲にあるモノ及び/又はポリグリシジルエーテル化合物を、(A)成分100重量部に対し、0.2~20重量部の範囲で含有する発泡性レゾール型フェノール樹脂組成物と、この組成物を発泡硬化させてなるフェノール樹脂発泡体が開示されている。
また、特許文献3には、液状レゾール型フェノール樹脂、発泡剤、整泡剤および酸硬化剤を含む発泡性レゾール型フェノール樹脂成形材料において、さらに添加剤としてエポキシ樹脂化合物を含有させたことを特徴とする発泡性レゾール型フェノール樹脂成形材料と、この成形材料を発泡硬化させてなるフェノール樹脂発泡体が開示されている。
本発明は、独立気泡を有する発泡体であって、表層部とそれより深い内部とのあいだで独立気泡率の差が小さく、初期熱伝導率を低下させることができ断熱性に優れ、水と接触した際に吸水しにくく、製造時の収縮率を低くしつつ所望のサイズのフェノール樹脂発泡体を与えるフェノールフォーム用樹脂組成物を提供することを目的とする。
[1](A)レゾール型フェノール樹脂、(B)酸硬化剤、(C)発泡剤、(D)尿素、及び、(E)脂肪族エポキシ化合物を含有するフェノールフォーム用樹脂組成物。
[2]上記脂肪族エポキシ化合物(E)が、少なくとも1つの分子末端にグリシジルエーテル基を有する上記[1]に記載のフェノールフォーム用樹脂組成物。
[3]上記脂肪族エポキシ化合物(E)が、脂肪族ポリオールポリグリシジルエーテル化合物である上記[1]又は[2]に記載のフェノールフォーム用樹脂組成物。
[4]上記脂肪族エポキシ化合物(E)のエポキシ当量が100~320g/eqである上記[1]乃至[3]のいずれか一項に記載のフェノールフォーム用樹脂組成物。
[5]上記脂肪族エポキシ化合物(E)の粘度(25℃)が5~250000mPa・sである上記[1]乃至[4]のいずれか一項に記載のフェノールフォーム用樹脂組成物。
[6]更に、固体のリン系難燃剤を含有する上記[1]乃至[5]のいずれか一項に記載のフェノールフォーム用樹脂組成物。
[7]上記リン系難燃剤が赤リンを含む上記[6]に記載のフェノールフォーム用樹脂組成物。
[8]更に、可塑剤を含有する上記[1]乃至[7]のいずれか一項に記載のフェノールフォーム用樹脂組成物。
[9]上記可塑剤がポリエステルポリオールを含む上記[8]に記載のフェノールフォーム用樹脂組成物。
[10]上記可塑剤が有機リン酸エステルを含む上記[8]に記載のフェノールフォーム用樹脂組成物。
[11]上記[1]乃至[10]のいずれか一項に記載のフェノールフォーム用樹脂組成物を発泡させて得られた発泡体。
[12]発泡体の表層部と中心部の独立気泡率の平均が80%以上である上記[11]に記載の発泡体。
本発明のフェノールフォーム用樹脂組成物が、更に、固体のリン系難燃剤を含有する場合には、水と接触した際に吸水しにくい性質を維持しながら難燃性を有するフェノール樹脂発泡体を製造することができる。
本発明のフェノールフォーム用樹脂組成物が、更に、可塑剤を含有する場合には、均一な発泡セルを有するフェノール樹脂発泡体を製造することができる。
本発明のフェノール樹脂発泡体は、表層部とそれより深い内部とのあいだで独立気泡率の差が小さい独立気泡を有し、熱伝導率が低いことから、断熱材として好適である。また、多湿となり得る環境下又は雨水に晒される環境下で用いると、酸硬化剤が水で抽出されにくくなるので、例えば、発泡体と金属部材とを接触させる建築分野等における用途では、金属部材の腐食抑制効果が期待される。
本発明のフェノールフォーム用樹脂組成物(以下、単に「本発明の樹脂組成物」ということがある)は、
(A)レゾール型フェノール樹脂(以下、「成分(A)」ともいう)、
(B)酸硬化剤(以下、「成分(B)」ともいう)、
(C)発泡剤(以下、「成分(C)」ともいう)、
(D)尿素(以下、「成分(D)」ともいう)、
及び、
(E)脂肪族エポキシ化合物(以下、「成分(E)」ともいう)
を含有する。
本発明の樹脂組成物は、必要に応じて、更に、他の成分(後述)を含有することができる。
成分(A)は、通常、フェノール、クレゾール、キシレノール、パラアルキルフェノール、パラフェニルフェノール、レゾルシン等のフェノール類又はその変性物と、ホルムアルデヒド、パラホルムアルデヒド、フルフラール、アセトアルデヒド等のアルデヒド類とを、水酸化ナトリウム、水酸化カリウム、水酸化カルシウム等のアルカリ触媒の存在下、反応させて得られたレゾール型フェノール樹脂である。尚、フェノール類とアルデヒド類との使用割合は、特に限定はないが、モル比で、通常、1.0:1.5~1.0:3.0程度、好ましくは1.0:1.8~1.0:2.5である。本発明の樹脂組成物に含まれる成分(A)は、1種のみであってよいし、2種以上であってもよい。
成分(B)の酸硬化剤は、成分(A)の硬化反応を促進する成分であり、例えば、リン酸、亜リン酸、次亜リン酸、ピロリン酸、トリポリリン酸、ポリリン酸、塩酸、硫酸、ホウフッ化水素酸等の無機酸;ベンゼンスルホン酸、エチルベンゼンスルホン酸、トルエンスルホン酸、キシレンスルホン酸、フェノールスルホン酸、クレゾールスルホン酸、ナフタレンスルホン酸等の芳香族スルホン酸、メタンスルホン酸、トリフルオロメタンスルホン酸等の脂肪族スルホン酸等の有機酸等を用いることができる。本発明の樹脂組成物に含まれる成分(B)は、1種のみであってよいし、2種以上であってもよい。本発明に係る成分(B)は、有機酸を含むことが好ましい。尚、これらの酸硬化剤の中でも、フェノールスルホン酸、トルエンスルホン酸、キシレンスルホン酸、ナフタレンスルホン酸にあっては、フェノールフォームの製造に際して、適度な硬化速度を実現することができるために、レゾール型フェノール樹脂の硬化と発泡剤による発泡とのバランスがより一層良好となり、以て、望ましい発泡構造を実現することとなるところから、特に好適に用いられる。中でも、本発明にあっては、パラトルエンスルホン酸とキシレンスルホン酸との併用が推奨される。それらの使用割合は、質量基準において、パラトルエンスルホン酸の使用量が、キシレンスルホン酸の使用量より多いことが望ましい。具体的には、質量比でパラトルエンスルホン酸:キシレンスルホン酸が51:49~95:5の範囲内において、有利に採用されることとなる。
成分(C)の発泡剤は、成分(A)を、独立気泡を形成しつつ成分(A)を効率よく発泡させる成分であり、例えば、炭化水素、ハロゲン化炭化水素、エーテル化合物、窒素、アルゴン、炭酸ガス、水、空気等を用いることができる。本発明の樹脂組成物に含まれる成分(C)は、1種のみであってよいし、2種以上であってもよい。
成分(D)の尿素は、得られる発泡体の初期熱伝導率を効果的に低下せしめることができ、また、発泡体の臭気を低減させることができ、更に、成分(E)との併用により、発泡体の表層部及びそれより深い内部の独立気泡率の差を小さくし、吸水性を低減させる成分である。
本発明の樹脂組成物に含まれる成分(D)の含有量は、成分(A)の含有量を100質量部とした場合に、好ましくは0.5~20質量部、より好ましくは1~15質量部、更に好ましくは2~10質量部である。
成分(E)の脂肪族エポキシ化合物は、直鎖及び/又は分岐の炭素鎖と、エポキシ基とを有する化合物であり、収縮率が小さく所望のサイズを有する発泡体を形成させ、該発泡体の吸水性を低減させる成分である。本発明の樹脂組成物に含まれる成分(E)は、1種のみであってよいし、2種以上であってもよい。
上記のように、成分(A)の粘度の好ましい上限値は100000mPa・sであり、成分(E)の粘度の好ましい上限値は25000mPa・sであり、成分(E)が粘度低減剤であるといえる。この点で本発明の樹脂組成物の流動性は良好となり、発泡体の成形性を向上させることができる。
本発明の樹脂組成物は、上記の必須成分(A)、(B)、(C)、(D)及び(E)に加えて、更に他の成分を含有することができる。他の成分としては、難燃剤、可塑剤、整泡剤、腐食防止剤、無機フィラー等が挙げられる。
ポリエステルポリオールは、親水性並びに界面活性に優れるエステル結合及びヒドロキシル基を含む構造を有しているので、親水性の成分(A)と相溶性が良好となり、均一な樹脂組成物を得ることができる。また、ポリエステルポリオールを含有する樹脂組成物を用いると、気泡の偏在が抑制され、均質な気泡を有する発泡体を得ることができる。
可塑剤として、ポリエステルポリオール及び有機リン酸エステルは、各々、単独で用いてもよいが、これらを併用すると、水と接触した際に、更に吸水しにくいフェノール樹脂発泡体を製造することができる。
本発明において、ポリエステルポリオールは、好ましくは、2~5のヒドロキシ基を有するポリオールと、2~4のカルボキシ基を有するポリカルボン酸とをエステル化反応させて得られたポリエステルポリオールであり、特に好ましくは、2つのヒドロキシ基を有するポリオール(以下、「ジオール」という)と、2つのカルボキシ基を有するポリカルボン酸(以下、「ジカルボン酸」という)とをエステル化反応させて得られた、下記一般式(2)で表されるポリエステルポリオールである。
芳香族ジオールとしては、ベンゼン-1,2-ジメタノール、ベンゼン-1,3-ジメタノール、ベンゼン-1,4-ジメタノール、カテコール、レゾルシノール、ハイドロキノン、2,2-ビス(4-ヒドロキシフェニル)プロパン(ビスフェノールA)等が挙げられる。
脂環式ジカルボン酸としては、シクロヘキサン-1,2-ジカルボン酸、シクロヘキサン-1,3-ジカルボン酸、シクロヘキサン-1,4-ジカルボン酸等が挙げられる。
芳香族ジカルボン酸としては、フタル酸、イソフタル酸、テレフタル酸、ナフタレン-2,3-ジカルボン酸、ナフタレン-1,4-ジカルボン酸、ナフタレン-2,6-ジカルボン酸等が挙げられる。
O=P-(OR2)3 (3)
(式中、各R2は、互いに同一でも異なってもよく、炭化水素基又はハロゲン化炭化水素基である。)
尚、上記好ましい有機リン酸エステルの中には、従来、樹脂用の難燃剤として知られているものもあるため、このような有機リン酸エステルを含有する樹脂組成物を用いると、難燃性を有する発泡体を製造することができる。また、25℃における粘度が100mPa・s以下である有機リン酸エステルを用いると、樹脂組成物の粘度を低減させて流動性を向上させることができる。
本発明の樹脂組成物は、上記成分(A)、(B)、(C)、(D)及び(E)を、必要に応じて併用される他の成分とともに混合することにより、製造することができる。
本発明の発泡体は、上記本発明の樹脂組成物を、発泡、硬化させてなるものである。本発明の発泡体は、通常、独立気泡を有する、密度が10~150kg/m3の発泡体である。密度が低ければ、材料を低減させて発泡体が軽くなりハンドリング性が向上するが、機械的強度が低下するため、密度は、好ましくは20~80kg/m3、より好ましくは27~70kg/m3、更に好ましくは29~60kg/m3、特に好ましくは30~50kg/m3である。
(1)樹脂組成物をエンドレスコンベアベルト上に流出させて、発泡、硬化させる成形方法
(2)樹脂組成物をスポット的に充填して部分的に発泡、硬化させる方法
(3)樹脂組成物を金型(モールド)内に収容して加圧状態で、発泡、硬化させる方法
(4)樹脂組成物を所定の大きな空間内に充填して、発泡、硬化させることにより、発泡体ブロックを形成する方法
(5)樹脂組成物を空洞中に圧入しながら、充填発泡、硬化させる方法
実施例及び比較例で用いたフェノールフォーム用樹脂組成物の原料を以下に示す。
下記の方法により得られたフェノール樹脂A-1及びA-2を用いた。
還流器、温度計及び撹拌機を備えた三つ口反応フラスコに、フェノール1600質量部、47質量%ホルマリン2282質量部及び50質量%水酸化ナトリウム水溶液41.6質量部を仕込み、温度80℃で70分間反応させた。次いで、反応液を40℃とし、50質量%パラトルエンスルホン酸水溶液を添加して中和させ、その後、減圧・加熱条件下において、水分率が9質量%となるまで脱水濃縮することにより、液状のレゾール型フェノール樹脂を得た。得られたフェノール樹脂A-1の粘度を、JIS K 7117-1に準拠して、ブルックフィールド型粘度計を用いて、温度25℃で測定したところ、9000mPa・sであった。
還流器、温度計及び撹拌機を備えた三つ口反応フラスコに、フェノール1600質量部、47質量%ホルマリン2282質量部及び50質量%水酸化ナトリウム水溶液41.6質量部を仕込み、温度80℃で90分間反応させた。次いで、反応液を40℃とし、50質量%パラトルエンスルホン酸水溶液を添加して中和させ、その後、減圧・加熱条件下において、水分率が12質量%となるまで脱水濃縮することにより、液状のレゾール型フェノール樹脂を得た。得られたフェノール樹脂A-2の粘度を上記と同じ条件で測定したところ、10000mPa・sであった。
パラトルエンスルホン酸及びキシレンスルホン酸を質量比2:1で混合し、これを硬化剤として用いた。
イソプロピルクロリド及びイソペンタンを質量比85:15で混合し、これを発泡剤として用いた。
下記の市販品(脂肪族エポキシ化合物又は芳香族エポキシ樹脂)を用いた。
E-1:ADEKA社製トリメチロールプロパントリグリシジルエーテル「アデカグリシロールED-505」(商品名)
官能基数:3、エポキシ当量:150g/eq、粘度:150mPa・s(25℃)
E-2:ADEKA社製ネオペンチルグリコールジグリシジルエーテル「アデカグリシロールED-523T」(商品名)
官能基数:2、エポキシ当量:140g/eq、粘度:15mPa・s(25℃)
E-3:ADEKA社製ポリプロピレングリコールジグリシジルエーテル「アデカグリシロールED-506」(商品名)
官能基数:2、エポキシ当量:300g/eq、粘度:60mPa・s(25℃)
E-4:ナガセケムテックス社製ソルビトールポリグリシジルエーテル「デナコールEX-614B」(商品名)
官能基数:4、エポキシ当量:173g/eq、粘度:5000mPa・s(25℃)
E-5:ナガセケムテックス社製ソルビトールポリグリシジルエーテル「デナコールEX-614」(商品名)
エポキシ当量:167g/eq、粘度:21200mPa・s(25℃)
E-6:三菱ケミカル社製ビスフェノールA型エポキシ樹脂「jER825」(商品名)
官能基数:2、エポキシ当量:175g/eq、粘度:5500mPa・s(25℃)
E-7:ADEKA社製ビスフェノールF型エポキシ樹脂「アデカレジンEP4901」(商品名)
官能基数:2、エポキシ当量:170g/eq、粘度:3500mPa・s(25℃)
F-1:燐化学工業社製赤リン「ノーバエクセル140」(商品名)、平均粒径:25~35μm、表面コーティング処理済
F-2:ホウ酸亜鉛
F-3:テトラブロモビスフェノールA
G-1:フタル酸と、ジエチレングリコールとをモル比1:2で反応させてなるポリエステルポリオールを用いた。
G-2:大八化学工業社製トリス(クロロプロピル)ホスフェート「TMCPP」(商品名)、粘度:60mPa・s(25℃)
G-3:大八化学工業社製トリエチルホスフェート「TEP」(商品名)、粘度:1.6mPa・s(25℃)
上記の原料を用いて、フェノールフォーム用樹脂組成物を製造した。その後、該樹脂組成物を加熱させてフェノール樹脂発泡体を作製し、以下の各種評価を行った。
(1)吸水性
JIS K 9511に準ずる「吸水量」を測定した。単位はg/100cm2である。
(2)独立気泡率
発泡体を切削加工して、表面から深さ7mmまでの表層部分からなる試験片T1(サイズ:7mm×25mm×25mm)、及び、それより深い内部から作製した試験片T2(サイズ:25mm×25mm×25mm、高さ方向は発泡体の中心線から上下に12.5mmで切り出し)のそれぞれについて、ASTM D2856に準じて、独立気泡率を測定した。単位は%である。
(3)寸法変化率
フェノール樹脂発泡体の成形時の寸法変化を評価するために、得られた発泡体の寸法を、JIS A 9511に準じて測定し、下記式を用いて、成形型枠寸法(300mm×300mm×50mm)に対する、収縮した長さの割合を百分率で算出した。即ち、発泡体の幅方向については、向かい合う2辺の中央を結んだ線の長さを2点測定した。厚み方向については、発泡体の4辺の中央のそれぞれの厚みを測定した。それらの各々について寸法変化率を算出した後、測定した幅と厚みの寸法変化率計算値の平均値を寸法変化率とした。単位は%である。
寸法変化率=〔(成形型枠寸法)-(発泡体寸法)〕÷(成形型枠寸法)×100
(4)初期熱伝導率
JIS A 1412-2(1999)に規定の「熱流計法」に従い、英弘精機社製熱伝導率測定装置「HC-074 304」を用いて、70℃で4日間放置した後のフェノール樹脂発泡体サンプル(200mm×200mm×50mm)を測定試料とし、低温板の温度を10℃、高温板の温度を30℃に設定して、熱伝導率を測定し、測定値を「初期伝導率」とした。
(5)酸素指数
難燃性の評価のため、JIS K 7201-2に規定の「プラスチック-酸素指数による燃焼性の試験方法-第2部:室温における試験」に従い、酸素指数を測定した。
(6)発泡体のセルの均一性
発泡体を厚み方向に平行に切断加工した後、23℃の雰囲気下で10名のパネラーが内部断面を目視観察し、以下の基準でセルの均一性評価し、これらの平均レベルで優劣を評価した。なお、このレベルが1になるほどセルの均一性が良いことを意味している。
1:不均一な個所が全く見られない均一なセルが観察される。
2:僅かに不均一なセルが観察されるが実用上支障はない。
3:明らかに不均一なセルが観察される。
4:明らかに不均一なセルが非常に多く観察される。
100質量部のフェノール樹脂A-1と、3部の整泡剤(ひまし油エチレンオキサイド付加物(付加モル数22))、16質量部の硬化剤と、8質量部の発泡剤と、5質量部の尿素と、3質量部のエポキシ化合物E-1とを混合し、液状のフェノールフォーム用樹脂組成物(以下、「樹脂組成物S-1」という)を製造した(表1参照)。
次に、得られた樹脂組成物S-1を、予め、70℃~75℃に加熱された、型枠(300mm×300mm×50mm)に入れ、組成物入りの型枠を加熱炉内に載置した。そして、70℃で10分間発泡硬化させて抜型した。更に70℃で12時間加熱して硬化させることにより、独立気泡を有し、密度が33~35kg/m3であるフェノール樹脂発泡体(以下、「発泡体H-1」という)を得た。得られた発泡体H-1について各種評価を行った(表1参照)。
原料の種類及び使用量を表1及び表2に示す通りとした以外は、実施例1と同様の操作を行い、液状のフェノールフォーム用樹脂組成物(以下、「樹脂組成物S-2~S-20」という)を製造した。その後、実施例1と同様にして、フェノール樹脂発泡体(以下、「発泡体H-2~H-20」という)を製造し、各種評価を行った(表1及び表2参照)。
原料の種類及び使用量を表3に示す通りとした以外は、実施例1と同様の操作を行い、液状のフェノールフォーム用樹脂組成物(以下、「樹脂組成物SS-1~SS-10」という)を製造した。その後、実施例1と同様にして、フェノール樹脂発泡体(以下、「発泡体HH-1~HH-10」という)を製造し、各種評価を行った(表3参照)。
比較例1及び2は、脂肪族エポキシ化合物ではなく芳香族エポキシ樹脂を含有する組成物の例である。比較例1では、得られた発泡体HH-1において、表層部とそれより深い内部とのあいだで独立気泡率の差が15%以上と大きかった。比較例2では、得られた発泡体HH-2の中心部の独立気泡率が75%未満と低かった。比較例3~5、7、9及び10は、エポキシ化合物を含有しない組成物の例であり、得られた発泡体の吸水量が5.0g/100cm2を超えて多かった。また、比較例6及び8は、尿素を含有しない組成物の例であり、得られた発泡体の表層部及びそれより深い内部における独立気泡率がいずれも80%未満と低く、また、吸水量が5.0g/100cm2を超えて多かった。
一方、実施例1~20は、本発明の組成物の例であり、得られた発泡体H-1~H-20の吸水量が5.0g/100cm2未満であり、表層部及びそれより深い内部における独立気泡率がいずれも80%以上であり、且つ、両者の独立気泡率の差が12%未満と小さかった。実施例11及び12は、いずれも、実施例2及び5の各樹脂組成物に対して、赤リンを10質量部ずつ添加した樹脂組成物を用いた例であり、得られた発泡体H-11及びH-12の吸水量は、発泡体H-2及びH-5の吸水量より少し多めであるが、3.0g/100cm2未満であった。固体の難燃剤を用いても、吸水性が大きくなることはなかった。実施例15、17、18及び20は、実施例2の樹脂組成物に対して可塑剤を添加した樹脂組成物を用いた例であり、得られた発泡体の吸水量は、発泡体H-2の吸水量より少なかった。また、実施例16及び19は、実施例5の樹脂組成物に対して可塑剤を添加した樹脂組成物を用いた例であり、得られた発泡体の吸水量は、発泡体H-5の吸水量より少なかった。
Claims (12)
- (A)レゾール型フェノール樹脂、
(B)酸硬化剤、
(C)発泡剤、
(D)尿素、
及び、
(E)脂肪族エポキシ化合物
を含有するフェノールフォーム用樹脂組成物。 - 前記脂肪族エポキシ化合物(E)が、少なくとも1つの分子末端にグリシジルエーテル基を有する請求項1に記載のフェノールフォーム用樹脂組成物。
- 前記脂肪族エポキシ化合物(E)が、脂肪族ポリオールポリグリシジルエーテル化合物である請求項1又は2に記載のフェノールフォーム用樹脂組成物。
- 前記脂肪族エポキシ化合物(E)のエポキシ当量が100~320g/eqである請求項1乃至3のいずれか一項に記載のフェノールフォーム用樹脂組成物。
- 前記脂肪族エポキシ化合物(E)の粘度(25℃)が5~250000mPa・sである請求項1乃至4のいずれか一項に記載のフェノールフォーム用樹脂組成物。
- 更に、固体のリン系難燃剤を含有する請求項1乃至5のいずれか一項に記載のフェノールフォーム用樹脂組成物。
- 前記リン系難燃剤が赤リンを含む請求項6に記載のフェノールフォーム用樹脂組成物。
- 更に、可塑剤を含有する請求項1乃至7のいずれか一項に記載のフェノールフォーム用樹脂組成物。
- 前記可塑剤がポリエステルポリオールを含む請求項8に記載のフェノールフォーム用樹脂組成物。
- 前記可塑剤が有機リン酸エステルを含む請求項8に記載のフェノールフォーム用樹脂組成物。
- 請求項1乃至10のいずれか一項に記載のフェノールフォーム用樹脂組成物を発泡させて得られた発泡体。
- 発泡体の表層部と中心部の独立気泡率の平均が80%以上である請求項11に記載の発泡体。
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JP2022018806A (ja) * | 2020-07-16 | 2022-01-27 | フクビ化学工業株式会社 | フェノール樹脂発泡体 |
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