WO2022239742A1 - 無アルカリガラス板 - Google Patents
無アルカリガラス板 Download PDFInfo
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- WO2022239742A1 WO2022239742A1 PCT/JP2022/019704 JP2022019704W WO2022239742A1 WO 2022239742 A1 WO2022239742 A1 WO 2022239742A1 JP 2022019704 W JP2022019704 W JP 2022019704W WO 2022239742 A1 WO2022239742 A1 WO 2022239742A1
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- glass plate
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- 239000011521 glass Substances 0.000 title claims abstract description 136
- 239000000203 mixture Substances 0.000 claims abstract description 13
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 20
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 16
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 10
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 9
- GOLCXWYRSKYTSP-UHFFFAOYSA-N Arsenious Acid Chemical compound O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 claims 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims 1
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 7
- 229910052681 coesite Inorganic materials 0.000 abstract description 6
- 239000000377 silicon dioxide Substances 0.000 abstract description 6
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 6
- 229910052682 stishovite Inorganic materials 0.000 abstract description 6
- 229910052905 tridymite Inorganic materials 0.000 abstract description 6
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 abstract description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract description 3
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 24
- 238000004031 devitrification Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 14
- 239000002994 raw material Substances 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000007500 overflow downdraw method Methods 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000006060 molten glass Substances 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000006066 glass batch Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007670 refining Methods 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- NOTVAPJNGZMVSD-UHFFFAOYSA-N potassium monoxide Inorganic materials [K]O[K] NOTVAPJNGZMVSD-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000009774 resonance method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910005335 FePt Inorganic materials 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 229910052661 anorthite Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
- G11B5/73921—Glass or ceramic substrates
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Definitions
- the present invention relates to an alkali-free glass plate, and more particularly to an alkali-free glass plate suitable for organic EL displays and magnetic recording media.
- Organic EL displays are thin, excellent in displaying moving images, and have low power consumption, so they are used for applications such as flexible devices and mobile phone displays.
- Glass plates are widely used as substrates for organic EL displays.
- the following properties are mainly required for glass sheets for this application.
- (1) In order to prevent alkali ions from diffusing into the semiconductor material formed as a film in the heat treatment process, it should contain almost no alkali metal oxides. is 0.5 mol% or less),
- (2) In order to reduce the cost of the glass sheet, it should be formed by an overflow down-draw method that facilitates improvement of surface quality, and should be excellent in productivity, especially excellent in meltability and devitrification resistance.
- Glass plates are widely used as substrates for information recording media in place of conventional aluminum alloy substrates.
- magnetic recording media using an energy-assisted magnetic recording system ie, energy-assisted magnetic recording media
- a glass plate is also used for the energy-assisted magnetic recording medium, and a magnetic layer or the like is formed on the surface of the glass substrate.
- an ordered alloy having a large magnetic anisotropy coefficient Ku hereinafter referred to as "high Ku" is used as the magnetic material of the magnetic layer.
- organic EL devices are also widely used in organic EL televisions.
- glass sheets for these applications are required to have thermal dimensional stability that can withstand the demand for high resolution while being large and thin.
- low cost is required, and glass plates are similarly required to be low cost.
- the glass plate tends to bend, and the manufacturing cost rises.
- a glass sheet formed by a glass manufacturer goes through processes such as cutting, annealing, inspection, and cleaning. During these processes, the glass sheet is put into and taken out of a cassette with multiple shelves formed. . Normally, this cassette can be held horizontally by placing opposite sides of the glass plate on shelves formed on the left and right inner surfaces, but a large and thin glass plate has a large amount of deflection. Therefore, when the glass plate is put into the cassette, part of the glass plate comes into contact with the cassette and is damaged, and when it is carried out, it swings greatly and becomes unstable.
- Such a form of cassette is also used by electronic device makers, so similar problems occur. In order to solve this problem, it is effective to increase the Young's modulus of the glass plate to reduce the amount of deflection.
- glass plates for magnetic recording media are required to have high rigidity (Young's modulus) so as not to cause large deformation during high-speed rotation. More specifically, in a disk-shaped magnetic recording medium, information is written and read along the direction of rotation while rotating the medium around its central axis at high speed and moving the magnetic head in the radial direction. In recent years, the number of rotations for increasing the writing speed and reading speed has been increasing from 5400 rpm to 7200 rpm and further to 10000 rpm. A position is assigned to record the information. Therefore, if the glass plate is deformed during rotation, the position of the magnetic head is shifted, making it difficult to read accurately.
- high rigidity Young's modulus
- the DFH mechanism is a mechanism in which a heating portion such as a very small heater is provided in the vicinity of the recording/reproducing element portion of the magnetic head, and only the periphery of the element portion is thermally expanded toward the medium surface direction.
- the gap between the recording/reproducing element portion of the magnetic head and the surface of the magnetic recording medium is extremely small, for example, 2 nm or less, even a slight impact may cause the magnetic head to collide with the surface of the magnetic recording medium. . This tendency becomes more conspicuous as the rotation speed increases. Therefore, during high-speed rotation, it is important to prevent the bending and fluttering of the glass plate, which cause this collision.
- the base material including the glass plate is heat-treated at a high temperature of about 800° C. during the film formation of the magnetic layer, or before and after the film formation. I have something to do. Since the higher the recording density, the higher the heat treatment temperature, the higher the heat resistance, that is, the higher the strain point, than the conventional glass plates for magnetic recording media.
- the substrate including the glass plate is irradiated with a laser after the magnetic layer is formed. Such heat treatment and laser irradiation also have the purpose of increasing the annealing temperature and coercive force of the magnetic layer containing the FePt-based alloy or the like.
- the present invention has been invented in view of the above circumstances, and a technical problem thereof is to provide an alkali-free glass plate which is excellent in productivity and has sufficiently high strain point and Young's modulus.
- the inventor found that the above technical problems can be solved by strictly controlling the glass composition of the alkali-free glass plate, and proposes it as the present invention. That is, the alkali-free glass plate of the present invention has a glass composition of SiO 2 64 to 72%, Al 2 O 3 12 to 16%, B 2 O 3 0 to 3%, Li 2 O + Na 2 O + K 2 in mol%.
- (MgO + CaO + SrO + BaO) ⁇ CaO / (SiO 2 ⁇ MgO) is the value obtained by multiplying the mol% total amount of MgO, CaO, SrO and BaO by the mol% content of CaO, the mol% content of SiO 2 and the It is the value divided by the value multiplied by the mol% content.
- the alkali-free glass plate of the present invention has a glass composition of SiO 2 64 to 72%, Al 2 O 3 12 to 15.5%, B 2 O 3 0 to 3%, and Li 2 O + Na 2 in mol%.
- the mol% ratio (MgO+CaO+SrO+BaO) ⁇ CaO/(SiO 2 ⁇ MgO) is preferably 0 to less than 0.25.
- the alkali-free glass plate of the present invention does not substantially contain As 2 O 3 and Sb 2 O 3 .
- substantially free of As 2 O 3 means that the content of As 2 O 3 is 0.05 mol % or less.
- substantially free of Sb 2 O 3 means that the content of Sb 2 O 3 is 0.05 mol % or less.
- the alkali-free glass plate of the present invention preferably further contains 0.001 to 1 mol % of SnO 2 .
- the alkali-free glass plate of the present invention preferably has a Young's modulus of 83 GPa or higher, a strain point of 730° C. or higher, and a liquidus temperature of 1350° C. or lower.
- Young's modulus refers to a value measured by a bending resonance method. 1 GPa corresponds to approximately 101.9 Kgf/mm 2 .
- Stress point refers to a value measured according to the method of ASTM C336.
- “Liquidus temperature” is the temperature at which crystals precipitate after passing through a 30-mesh (500 ⁇ m) standard sieve and remaining on the 50-mesh (300 ⁇ m) glass powder in a platinum boat and holding it in a temperature gradient furnace for 24 hours. point to
- the alkali-free glass plate of the present invention preferably has a strain point of 735°C or higher.
- the alkali-free glass plate of the present invention preferably has a Young's modulus higher than 84 GPa.
- the alkali-free glass plate of the present invention preferably has an average thermal expansion coefficient of 30 ⁇ 10 -7 to 50 ⁇ 10 -7 /°C in the temperature range of 30 to 380°C.
- the "average coefficient of thermal expansion in the temperature range of 30 to 380° C.” can be measured with a dilatometer.
- the alkali-free glass plate of the present invention preferably has a liquidus viscosity of 10 3.9 dPa ⁇ s or more.
- the "liquidus viscosity” refers to the viscosity of the glass at the liquidus temperature, and can be measured by the platinum ball pull-up method.
- the alkali-free glass plate of the present invention is preferably used for an organic EL device.
- the alkali-free glass plate of the present invention is preferably used for magnetic recording media.
- FIG. 1 is a top perspective view to show the disk shape.
- the alkali-free glass plate of the present invention has a glass composition of SiO 2 64 to 72%, Al 2 O 3 12 to 16%, B 2 O 3 0 to 3%, Li 2 O + Na 2 O + K 2 O 0 in mol%. ⁇ 0.5%, MgO 6-12%, CaO 3-9%, SrO 0-2%, BaO 0-1%, mol% ratio SrO/CaO 0-0.2, mol% ratio (MgO+CaO+SrO+BaO) ⁇ CaO/(SiO 2 ⁇ MgO) is 0 to 0.3.
- the reasons for limiting the content of each component as described above are as follows.
- % display represents mol% unless otherwise specified.
- SiO2 is a component that forms the skeleton of glass. If the content of SiO2 is too low, the coefficient of thermal expansion will be high and the density will increase. Therefore, the lower limit of SiO2 is preferably 64%, more preferably 64.2%, more preferably 64.5%, more preferably 64.8%, more preferably 65%, more preferably 65.5%. %, more preferably 65.8%, more preferably 66%, more preferably 66.3%, still more preferably 66.5%, most preferably 66.7%.
- the upper limit of SiO2 is preferably 72%, more preferably 71.8%, more preferably 71.6%, more preferably 71.4%, more preferably 71.2%, more preferably 71% %, more preferably 70.8%, more preferably 70.6%, most preferably 70.4%.
- Al 2 O 3 is a component that forms the skeleton of the glass, a component that increases the Young's modulus, and a component that increases the strain point. If the content of Al 2 O 3 is too small, the Young's modulus tends to decrease, and the strain point tends to decrease. Therefore, the lower limit of Al 2 O 3 is preferably 12%, more preferably 12.2%, more preferably 12.4%, even more preferably more than 12.4%, even more preferably 12.5%, most preferably Preferably it is more than 12.5%. On the other hand, if the content of Al 2 O 3 is too high, devitrified crystals such as mullite are likely to precipitate and the liquidus viscosity tends to decrease.
- the upper limit of Al 2 O 3 is preferably 16%, more preferably 15.8%, even more preferably 15.5%, even more preferably 15.3%, even more preferably 15%, even more preferably 14%. .8%, more preferably 14.6%, more preferably 14.4%, more preferably 14.2%, more preferably 14%, more preferably 13.9%, more preferably 13.8%, More preferably 13.7%, most preferably 13.6%
- B 2 O 3 is not an essential component, but if it is included, it can have the effect of improving meltability and devitrification resistance. Therefore, the lower limit amount of B 2 O 3 is preferably 0%, more preferably over 0%, more preferably 0.1%, still more preferably 0.2%, still more preferably 0.3%, still more preferably 0.4%, more preferably 0.7%, more preferably 1%, particularly preferably more than 1%. On the other hand, if the B 2 O 3 content is too high, the Young's modulus and strain point tend to decrease.
- the upper limit of B 2 O 3 is preferably 3%, more preferably 2.9%, more preferably 2.8%, still more preferably 2.7%, still more preferably 2.6%, even more preferably 2.5%, more preferably 2%, more preferably 2.8%, more preferably 2.6%, more preferably 2.4%, more preferably 2.2%, more preferably 2% , more preferably 1.8%, more preferably 1.6%, more preferably 1.4%, more preferably 1.2%, more preferably 1%, most preferably less than 1%.
- Li 2 O, Na 2 O and K 2 O are components that are unavoidably mixed from the glass raw material, and the total amount thereof is 0 to 0.5%, preferably 0 to 0.4%, more preferably 0-0.3%, more preferably 0.005-0.2%, most preferably 0.01-0.1%. If the total amount of Li 2 O, Na 2 O and K 2 O is too large, there is a risk that alkali ions will diffuse into the semiconductor material deposited in the heat treatment process.
- the individual contents of Li 2 O, Na 2 O and K 2 O are each preferably 0 to 0.5%, more preferably 0 to 0.4%, still more preferably 0 to 0.3%, and further preferably Preferably 0.005-0.2%, most preferably 0.01-0.1%.
- MgO is a component that significantly increases Young's modulus among alkaline earth metal oxides. If the content of MgO is too small, the meltability and Young's modulus tend to decrease. Therefore, the lower limit of MgO is preferably 6%, more preferably 6.1%, more preferably 6.3%, still more preferably 6.5%, still more preferably 6.6%, still more preferably 6.5%. 7%, more preferably 6.8%, most preferably 7%. On the other hand, if the MgO content is too high, devitrified crystals such as mullite are likely to precipitate, and the liquidus viscosity tends to decrease.
- the upper limit of MgO is preferably 12%, more preferably 11.8%, more preferably 11.5%, more preferably 11.3%, more preferably 11%, more preferably less than 11%, More preferably 10.8%, more preferably 10.6%, still more preferably 10.4%, still more preferably 10.2%, still more preferably 10%, most preferably 9.8%.
- the mol % ratio B 2 O 3 /MgO is an important component ratio for increasing Young's modulus and devitrification resistance. If the mol % ratio B 2 O 3 /MgO is too small, the resistance to devitrification is lowered, and the manufacturing cost of the glass plate tends to rise. Therefore, the lower limit of the mol % ratio B 2 O 3 /MgO is preferably 0, more preferably 0.0001, even more preferably 0.01, most preferably 0.02. On the other hand, if the mol % ratio B 2 O 3 /MgO is too large, the Young's modulus tends to decrease.
- the upper limit of the mol% ratio B 2 O 3 /MgO is preferably 0.2, more preferably 0.1, still more preferably 0.08, even more preferably 0.05, most preferably 0.03. .
- “B 2 O 3 /MgO” is a value obtained by dividing the mol % content of B 2 O 3 by the mol % content of MgO.
- CaO is a component that lowers the high-temperature viscosity and significantly increases the meltability without lowering the strain point. It is also a component that increases Young's modulus. If the content of CaO is too small, the meltability tends to deteriorate. Therefore, the lower limit of CaO is preferably 6%, more preferably more than 6%, more preferably 6.1%, still more preferably 6.2%, still more preferably 6.3%, still more preferably 6.4 %, more preferably 6.5%, more preferably 6.6%, more preferably 7%, most preferably 7.5%. On the other hand, when the content of CaO is too high, the liquidus temperature increases.
- the upper limit of CaO is preferably less than 9%, more preferably 8.9%, more preferably 8.8%, more preferably 8.6%, more preferably 8.5%, even more preferably 8 .4%, more preferably 8.2%, more preferably 8%, more preferably 7.8%, more preferably 7.5%, most preferably 7%.
- the lower limit of SrO is preferably 0%, more preferably over 0%, more preferably 0.1%, still more preferably over 0.1%, still more preferably 0.2%, still more preferably 0.2%. 3%, more preferably greater than 0.3%, more preferably 0.4%, more preferably greater than 0.4%, most preferably 0.5%.
- the upper limit of SrO is preferably 2%, more preferably less than 2%, still more preferably 1.8%, still more preferably 1.6%, still more preferably 1.5%, still more preferably 1.4% %, more preferably 1.2%, more preferably 1%, more preferably less than 1%, more preferably 0.9%, more preferably less than 0.9%, more preferably 0.8%, more preferably is less than 0.8%, more preferably less than 0.7%, more preferably less than 0.7%, more preferably less than 0.6%, most preferably less than 0.6%.
- the mol% ratio SrO/CaO is an important component ratio related to liquidus temperature and liquidus viscosity. The smaller the mol % ratio SrO/CaO, the lower the liquidus temperature, resulting in an increase in the liquidus viscosity, which tends to reduce the cost of the glass. If the mol% ratio SrO/CaO becomes large, it becomes difficult to receive the above effects. .15, more preferably 0 to less than 0.15, more preferably 0 to 0.1, more preferably 0 to less than 0.1, more preferably 0 to 0.09, most preferably 0 to 0.08 be.
- the lower limit of BaO is preferably 0%, more preferably over 0%, more preferably 0.1%, still more preferably over 0.1%, still more preferably 0.2%, still more preferably 0.2%. 3%, more preferably 0.4%, more preferably greater than 0.4%, most preferably 0.5%.
- the upper limit of BaO is preferably 1%, more preferably less than 1%, more preferably 0.9%, still more preferably less than 0.9%, still more preferably 0.8%, still more preferably 0.9%. Less than 8%, most preferably 0.7%.
- SrO and BaO are components that increase devitrification resistance.
- the lower limit of SrO+BaO is preferably 0%, more preferably over 0%, more preferably 0.1%, still more preferably over 0.1%, still more preferably 0.2%, still more preferably 0.3% , more preferably 0.4%, more preferably greater than 0.4%, and most preferably 0.5%.
- the content of SrO+BaO is too high, the Young's modulus tends to decrease and the density tends to increase. As a result, the specific Young's modulus increases, and the glass sheet becomes more flexible.
- the upper limit of SrO+BaO is preferably 2%, more preferably less than 1%, more preferably 0.9%, still more preferably less than 0.9%, still more preferably 0.8%, still more preferably 0.9%. Less than 8%, most preferably 0.7%.
- SrO+BaO refers to the total amount of SrO and BaO.
- B 2 O 3 , SrO and BaO are components that improve devitrification resistance.
- the lower limit amount of B 2 O 3 +SrO+BaO is preferably 0%, more preferably over 0%, more preferably 0.1%, even more preferably over 0.1%, still more preferably 0.2%, still more preferably 0.3%, more preferably 0.4%, more preferably greater than 0.4%, most preferably 0.5%.
- the content of B 2 O 3 +SrO+BaO is too high, the Young's modulus tends to decrease.
- the upper limit of B 2 O 3 +SrO+BaO is preferably 2%, more preferably less than 1%, more preferably 0.9%, even more preferably less than 0.9%, still more preferably 0.8%, and further preferably Preferably less than 0.8%, most preferably 0.7%.
- B2O3 + SrO+BaO refers to the total amount of B2O3 , SrO and BaO.
- the mol% ratio (MgO+CaO)/(MgO+CaO+SrO+BaO) is an important component ratio in order to achieve both Young's modulus and meltability. If the mol % ratio (MgO+CaO)/(MgO+CaO+SrO+BaO) is too small, Young's modulus and meltability tend to be low. Therefore, the lower limit of the mol% ratio (MgO + CaO) / (MgO + CaO + SrO + BaO) is preferably 0.6, more preferably 0.7, still more preferably 0.8, still more preferably 0.9, most preferably 0.95. be.
- the upper limit of the mol % ratio (MgO+CaO)/(MgO+CaO+SrO+BaO) is preferably 1, more preferably 0.99, still more preferably 0.98, and most preferably 0.97.
- the "mol% ratio (MgO + CaO) / (MgO + CaO + SrO + BaO)" is a value obtained by dividing the total mol% content of MgO and CaO by the total mol% content of MgO, CaO, SrO and BaO.
- the mol % ratio (B 2 O 3 +SrO+BaO)/Al 2 O 3 is an important component ratio for increasing Young's modulus and devitrification resistance. If the mol % ratio (B 2 O 3 +SrO+BaO)/Al 2 O 3 is too small, the devitrification resistance is lowered, and the manufacturing cost of the glass sheet tends to rise. Therefore, the lower limit of the mol% ratio (B 2 O 3 +SrO + BaO)/Al 2 O 3 is preferably 0.001, more preferably 0.005, still more preferably 0.008, still more preferably 0.01, still more preferably is 0.02, more preferably 0.03, more preferably 0.04, most preferably 0.05.
- the upper limit of the mol% ratio (B 2 O 3 +SrO + BaO)/Al 2 O 3 is preferably 0.3, more preferably 0.25, still more preferably 0.2, still more preferably 0.15, still more preferably is 0.12, more preferably 0.1 and most preferably 0.09.
- the mol % ratio (B 2 O 3 +SrO+BaO)/MgO is an important component ratio for increasing Young's modulus and devitrification resistance. If the mol % ratio (B 2 O 3 +SrO+BaO)/MgO is too small, the resistance to devitrification is lowered, and the manufacturing cost of the glass plate tends to rise. Therefore, the lower limit of the mol% ratio (B 2 O 3 +SrO+BaO)/MgO is preferably 0.001, more preferably 0.005, still more preferably 0.008, still more preferably 0.01, still more preferably 0.01. 02, more preferably 0.03, more preferably 0.04, most preferably 0.05.
- the upper limit of the mol % ratio (B 2 O 3 +SrO+BaO)/MgO is preferably 0.5, more preferably 0.4, still more preferably 0.3, still more preferably 0.27, still more preferably 0.27. 24, more preferably 0.22, most preferably 0.2.
- " ( B2O3 + SrO+BaO)/MgO” is a value obtained by dividing the total mol% content of B2O3 , SrO and BaO by the mol% content of MgO.
- the mol % ratio (MgO+CaO+SrO+BaO) ⁇ CaO/(SiO 2 ⁇ MgO) is an important ratio of components to achieve both liquidus viscosity, Young's modulus and meltability. If the mol % ratio (MgO+CaO+SrO+BaO) ⁇ CaO/(SiO 2 ⁇ MgO) is too small, the liquidus viscosity tends to be low and the cost of the glass tends to be high.
- the lower limit of the mol % ratio (MgO+CaO+SrO+BaO) ⁇ CaO/(SiO 2 ⁇ MgO) is preferably 0, more preferably greater than 0, still more preferably 0.05, most preferably 0.1.
- the mol % ratio (MgO+CaO+SrO+BaO) ⁇ CaO/(SiO 2 ⁇ MgO) is too large, the Young's modulus tends to decrease, the high-temperature viscosity increases, and the meltability tends to decrease.
- the upper limit of the mol% ratio (MgO + CaO + SrO + BaO) ⁇ CaO / (SiO 2 ⁇ MgO) is preferably 0.3, more preferably less than 0.3, still more preferably 0.28, still more preferably 0.27, and further It is preferably 0.26, more preferably 0.25, more preferably less than 0.25 and most preferably 0.24.
- a suitable glass composition range can be obtained by appropriately combining the suitable content ranges of each component. 72%, Al 2 O 3 12-15.5%, B 2 O 3 0-3%, Li 2 O + Na 2 O + K 2 O 0-0.5%, MgO 6-12%, CaO 6-9%, Contains more than 0 to 2% SrO and 0 to 1% BaO, the mol% ratio SrO/CaO is 0 to 0.1, and the mol% ratio (MgO + CaO + SrO + BaO) x CaO/(SiO 2 x MgO) is 0 to 0.25. It is more preferably less than.
- the following ingredients may be added as optional ingredients.
- the total content of other components other than the above components is preferably 10% or less, particularly 5% or less.
- P 2 O 5 is a component that raises the strain point and is a component that can remarkably suppress the precipitation of alkaline earth aluminosilicate-based devitrified crystals such as anorthite.
- the content of P 2 O 5 is preferably 0-2.5%, more preferably 0-1.5%, still more preferably 0-0.5%, particularly preferably 0-0.3%.
- TiO 2 is a component that lowers high-temperature viscosity and enhances meltability, as well as a component that suppresses solarization. However, if a large amount of TiO 2 is contained, the glass is colored and the transmittance tends to decrease. .
- the content of TiO 2 is preferably 0-2.5%, more preferably 0.0005-1%, still more preferably 0.001-0.5%, particularly preferably 0.005-0.1%. be.
- ZnO is a component that increases Young's modulus. However, if a large amount of ZnO is contained, the glass tends to devitrify and the strain point tends to decrease.
- the content of ZnO is preferably 0-6%, more preferably 0-5%, even more preferably 0-4%, and particularly preferably 0-3%.
- ZrO2 is a component that increases Young's modulus. However, if ZrO 2 is contained in a large amount, the glass tends to devitrify.
- the content of ZrO 2 is preferably 0-2.5%, more preferably 0.0005-1%, still more preferably 0.001-0.5%, particularly preferably 0.005-0.1% .
- Y 2 O 3 , Nb 2 O 5 and La 2 O 3 have the function of increasing the strain point and Young's modulus.
- the total amount and individual content of these components are preferably 0 to 5%, more preferably 0 to 1%, even more preferably 0 to 0.5%, and particularly preferably 0 to less than 0.5%. If the total amount of Y 2 O 3 , Nb 2 O 5 and La 2 O 3 and the individual content are too large, the density and raw material costs tend to increase.
- SnO 2 is a component that has a good refining action in a high temperature range, a component that raises the strain point, and a component that lowers the high-temperature viscosity.
- the SnO 2 content is preferably 0-1%, 0.001-1%, 0.01-0.5%, especially 0.05-0.3%. When the SnO 2 content is too high, devitrified crystals of SnO 2 tend to precipitate. If the SnO 2 content is less than 0.001%, it becomes difficult to obtain the above effects.
- SnO 2 is suitable as a refining agent, but as a refining agent instead of SnO 2 or together with SnO 2 , F, SO 3 , C, or Al, Si up to 5% (preferably up to 1%, especially up to 0.5%) of metal powders such as CeO 2 , F and the like can also be added up to 5% each (preferably up to 1%, especially up to 0.5%) as clarifiers.
- As 2 O 3 and Sb 2 O 3 are also effective as clarifiers. However, As 2 O 3 and Sb 2 O 3 are components that increase environmental loads. As 2 O 3 is a component that lowers solarization resistance. Therefore, the alkali-free glass plate of the present invention preferably does not substantially contain these components.
- Cl is a component that promotes the initial melting of the glass batch. Also, the addition of Cl can promote the action of the clarifier. As a result, it is possible to extend the life of the glass manufacturing kiln while reducing the melting cost. However, if the Cl content is too high, the strain point tends to decrease. Therefore, the Cl content is preferably 0 to 3%, more preferably 0.0005 to 1%, and particularly preferably 0.001 to 0.5%.
- a raw material for introducing Cl a raw material such as a chloride of an alkaline earth metal oxide such as strontium chloride or aluminum chloride can be used.
- Fe 2 O 3 is a component that is unavoidably mixed in from the glass raw material, and is a component that lowers the electric resistivity.
- the content of Fe 2 O 3 is preferably 0-300 ppm by weight, 80-250 ppm by weight, especially 100-200 ppm by weight. If the content of Fe 2 O 3 is too small, raw material costs tend to rise. On the other hand, if the Fe 2 O 3 content is too high, the electric resistivity of the molten glass increases, making it difficult to perform electric melting.
- the alkali-free glass plate of the present invention preferably has the following properties.
- the average coefficient of thermal expansion in the temperature range of 30 to 380° C. is preferably 30 ⁇ 10 ⁇ 7 to 50 ⁇ 10 ⁇ 7 /° C., 32 ⁇ 10 ⁇ 7 to 48 ⁇ 10 ⁇ 7 /° C., 33 ⁇ 10 ⁇ 7 to 45 ⁇ 10 -7 /°C, 34 ⁇ 10 -7 to 44 ⁇ 10 -7 /°C, especially 35 ⁇ 10 -7 to 43 ⁇ 10 -7 /°C. In this way, it becomes easier to match the thermal expansion coefficient of Si used for TFTs.
- Young's modulus is preferably 83 GPa or more, 83 GPa or more, 83.3 GPa or more, 83.5 GPa or more, 83.8 GPa or more, 84 GPa or more, 84.3 GPa or more, 84.5 GPa or more, 84.8 GPa or more, 85 GPa or more, 85. 3 GPa or more, 85.5 GPa or more, 85.8 GPa or more, 86 GPa or more, especially more than 86 to 120 GPa. If the Young's modulus is too low, defects due to bending of the glass plate are likely to occur.
- Specific Young's modulus is preferably 32 GPa/g ⁇ cm ⁇ 3 or more, 32.5 GPa/g ⁇ cm ⁇ 3 or more, 33 GPa/g ⁇ cm ⁇ 3 or more, 33.3 GPa/g ⁇ cm ⁇ 3 or more, 33.5 GPa /g ⁇ cm ⁇ 3 or more, 33.8 GPa/g ⁇ cm ⁇ 3 or more, 34 GPa/g ⁇ cm ⁇ 3 or more, 34 GPa/g ⁇ cm ⁇ 3 or more, 34.2 GPa/g ⁇ cm ⁇ 3 or more, 34. 4 GPa/g ⁇ cm ⁇ 3 or more, particularly 34.5 to 37 GPa/g ⁇ cm ⁇ 3 . If the specific Young's modulus is too low, defects due to bending of the glass plate are likely to occur.
- the strain point is preferably 730°C or higher, 732°C or higher, 734°C or higher, 735°C or higher, 736°C or higher, 738°C or higher, particularly 740 to 800°C. In this way, thermal shrinkage of the glass plate can be suppressed in the LTPS process.
- the liquidus temperature is preferably 1350°C or less, less than 1350°C, 1300°C or less, 1290°C or less, 1285°C or less, 1280°C or less, 1275°C or less, 1270°C or less, particularly 1260 to 1200°C. By doing so, it becomes easy to prevent a situation in which devitrification crystals are generated during glass production and the productivity is lowered. Furthermore, since it becomes easy to shape
- the liquidus temperature is an index of devitrification resistance, and the lower the liquidus temperature, the better the devitrification resistance.
- the liquidus viscosity is preferably 10 3.9 dPa ⁇ s or more, 10 4.0 dPa ⁇ s or more, or 10 4.1 dPa ⁇ s or more, particularly 10 4.2 to 10 7.0 dPa ⁇ s.
- the liquidus viscosity is an index of devitrification resistance and moldability, and the higher the liquidus viscosity, the better the devitrification resistance and moldability.
- the temperature at a high temperature viscosity of 10 2.5 dPa ⁇ s is preferably 1650°C or less, 1630°C or less, 1610°C or less, especially 1400 to 1600°C. If the temperature at the high-temperature viscosity of 10 2.5 dPa ⁇ s is too high, it becomes difficult to melt the glass batch, and the manufacturing cost of the glass plate rises.
- the temperature at a high-temperature viscosity of 10 2.5 dPa ⁇ s corresponds to the melting temperature, and the lower the temperature, the better the meltability.
- the ⁇ -OH value is an index that indicates the amount of water in the glass, and lowering the ⁇ -OH value can raise the strain point. Further, even when the glass composition is the same, the smaller the ⁇ -OH value, the smaller the thermal shrinkage at a temperature below the strain point.
- the ⁇ -OH value is preferably 0.35/mm or less, 0.30/mm or less, 0.28/mm or less, 0.25/mm or less, in particular 0.20/mm or less. In addition, if the ⁇ -OH value is too small, the meltability tends to decrease.
- the ⁇ -OH value is therefore preferably greater than or equal to 0.01/mm, in particular greater than or equal to 0.03/mm.
- Methods for lowering the ⁇ -OH value include the following methods. (1) Select raw materials with low water content. (2) Adding components (Cl, SO3 , etc.) that lower the ⁇ -OH value into the glass. (3) Reduce the moisture content in the furnace atmosphere. (4) N2 bubbling in the molten glass; (5) Use a small melting furnace. (6) Increase the flow rate of molten glass. (7) Adopt an electric melting method.
- ⁇ -OH value refers to the value obtained by measuring the transmittance of the glass using FT-IR and using Equation 1 below.
- the alkali-free glass plate of the present invention is preferably formed by an overflow down-draw method.
- the overflow down-draw method molten glass is overflowed from both sides of a heat-resistant gutter-shaped structure, and the overflowed molten glass is drawn downward while joining at the lower end of the gutter-shaped structure to produce a glass sheet.
- the method In the overflow down-draw method, the surface to be the surface of the glass plate does not come into contact with the gutter-shaped refractory and is molded in the state of a free surface. Therefore, an unpolished glass plate having a good surface quality can be manufactured at low cost, and thinning is easy.
- the alkali-free glass plate of the present invention is also preferably formed by the float method.
- a large glass plate can be manufactured at low cost.
- the alkali-free glass plate of the present invention preferably has a polished surface. Polishing the glass surface can reduce the total plate thickness deviation TTV. As a result, the magnetic film can be properly formed, making it suitable for substrates of magnetic recording media.
- the plate thickness of the alkali-free glass plate of the present invention is not particularly limited. 0.05 to 0.5 mm is preferred. As the plate thickness becomes thinner, the weight of the organic EL device can be reduced. The plate thickness can be adjusted by adjusting the flow rate, drawing speed, etc. during glass production. On the other hand, when used for a magnetic recording medium, the plate thickness is preferably 1.5 mm or less, 1.2 mm or less, 0.2 to 1.0 mm, particularly 0.3 to 0.9 mm. If the plate thickness is too thick, etching must be performed to the desired plate thickness, which may increase the processing cost.
- the alkali-free glass plate of the present invention is preferably used for organic EL devices, particularly substrates for organic EL television display panels and carriers for manufacturing organic EL display panels.
- organic EL devices particularly substrates for organic EL television display panels and carriers for manufacturing organic EL display panels.
- each device is divided and cut to reduce costs (so-called multi-panel production). Since the alkali-free glass plate of the present invention can be easily formed into a large glass plate, it can meet such requirements precisely.
- the alkali-free glass plate of the present invention is preferably used as a substrate for magnetic recording media, particularly energy-assisted magnetic recording media.
- the substrate including the glass substrate is heated to a high temperature of about 800° C. during or before or after the formation of the magnetic layer on the substrate. In addition to heat treatment, it can withstand impacts on the substrate accompanying high rotation of the magnetic recording medium.
- the alkali-free glass plate of the present invention is processed into a disk substrate 1 as shown in FIG. 1 by processing such as cutting.
- the disk substrate 1 When used as a glass substrate for a magnetic recording medium, the disk substrate 1 preferably has a disk shape, and more preferably has a circular opening C in the center.
- Tables 1 to 3 represent examples of the present invention (Sample Nos. 1 to 25).
- RO represents MgO+CaO+SrO+BaO.
- a glass batch prepared by mixing glass raw materials so as to have the glass composition shown in the table was placed in a platinum crucible and melted at 1600 to 1650° C. for 24 hours.
- the glass batch was melted, it was homogenized by stirring using a platinum stirrer.
- the molten glass was poured onto a carbon plate, shaped into a plate, and then slowly cooled at a temperature near the annealing point for 30 minutes.
- the average coefficient of thermal expansion CTE in the temperature range of 30 to 380°C is the value measured with a dilatometer.
- the density ⁇ is a value measured by the well-known Archimedes method.
- Young's modulus E is a value measured by a well-known resonance method.
- the specific Young's modulus E/ ⁇ is the value obtained by dividing the Young's modulus by the density.
- strain point Ps, annealing point Ta, and softening point Ts are values measured based on the methods of ASTM C336 and C338.
- the temperatures at high-temperature viscosities of 10 4 dPa ⁇ s, 10 3 dPa ⁇ s, and 10 2.5 dPa ⁇ s are values measured by the platinum ball pull-up method.
- the liquidus temperature TL is the temperature at which crystals precipitate after passing through a 30-mesh (500 ⁇ m) standard sieve and remaining on the 50-mesh (300 ⁇ m) glass powder in a platinum boat and holding it in a temperature gradient furnace for 24 hours. be.
- the liquidus viscosity log 10 ⁇ TL is a value obtained by measuring the viscosity of the glass at the liquidus temperature TL by the platinum ball pull-up method.
- sample no. 1 to 25 are suitable for substrates for organic EL devices and magnetic recording media because they are excellent in productivity and sufficiently high in strain point and Young's modulus.
- the alkali-free glass plate of the present invention is suitable as a substrate for an organic EL device, particularly a substrate for an organic EL television display panel, and as a carrier for manufacturing an organic EL display panel.
- CCD charge-coupled devices
- CIS 1:1 proximity solid-state imaging devices
- the alkali-free glass plate of the present invention has a sufficiently high strain point and Young's modulus, it is also suitable as a glass substrate for magnetic recording media.
- the strain point is high, even if heat treatment at high temperature such as heat assist or laser irradiation is performed, deformation of the glass sheet is difficult to occur.
- a higher heat treatment temperature can be employed when increasing Ku, making it easier to fabricate a magnetic recording device with a high recording density.
- the Young's modulus is high, the glass substrate is less likely to bend or flutter during high-speed rotation, so collision between the information recording medium and the magnetic head can be prevented.
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Abstract
Description
(1)熱処理工程で成膜された半導体物質中にアルカリイオンが拡散する事態を防止するため、アルカリ金属酸化物をほとんど含まないこと、つまり無アルカリガラス(ガラス組成中のアルカリ酸化物の含有量が0.5mol%以下となるガラス)であること、
(2)ガラス板を低廉化するため、表面品位を高め易いオーバーフローダウンドロー法で成形され、かつ生産性に優れること、特に溶融性や耐失透性に優れること、
(3)LTPS(low temperature poly silicon)プロセス、酸化物TFTプロセスにおいて、ガラス板の熱収縮を低減するため、歪点が高いこと。
媒体の需要は急速に伸びている。
β-OH値=(1/X)log(T1/T2)
X:板厚(mm)
T1:参照波長3846cm-1における透過率(%)
T2:水酸基吸収波長3600cm-1付近における最小透過率(%)
Claims (11)
- ガラス組成として、mol%で、SiO2 64~72%、Al2O3 12~16%、B2O3 0~3%、Li2O+Na2O+K2O 0~0.5%、MgO 6~12%、CaO 3~9%未満、SrO 0~2%、BaO 0~1%を含有し、mol%比SrO/CaOが0~0.2、mol%比(MgO+CaO+SrO+BaO)×CaO/(SiO2×MgO)が0~0.3であることを特徴とする無アルカリガラス板。
- ガラス組成として、mol%で、SiO2 64~72%、Al2O3 12~15.5%、B2O3 0~3%、Li2O+Na2O+K2O 0~0.5%、MgO 6~12%、CaO 6~9%未満、SrO 0超~2%、BaO 0~1%を含有し、mol%比SrO/CaOが0~0.1、mol%比(MgO+CaO+SrO+BaO)×CaO/(SiO2×MgO)が0~0.25未満であることを特徴とする請求項1に記載の無アルカリガラス板。
- 実質的にAs2O3、Sb2O3を含有しないことを特徴とする請求項1又は2に記載の無アルカリガラス板。
- 更に、SnO2を0.001~1mol%含むことを特徴とする請求項1~3の何れか一項に記載の無アルカリガラス板。
- ヤング率83GPa以上であり、歪点が730℃以上であり、且つ液相温度が1350℃以下であることを特徴とする請求項1~4の何れかに記載の無アルカリガラス板。
- 歪点が735℃以上であることを特徴とする請求項1~5の何れか一項に記載の無アルカリガラス板。
- ヤング率が84GPaより高いことを特徴とする請求項1~6の何れか一項に記載の無アルカリガラス板。
- 30~380℃の温度範囲における平均熱膨張係数が30×10-7~50×10-7/℃であることを特徴とする請求項1~7の何れか一項に記載の無アルカリガラス板。
- 液相粘度が103.9dPa・s以上であることを特徴とする請求項1~8の何れか一項に記載の無アルカリガラス板。
- 有機ELデバイスに用いることを特徴とする請求項1~9の何れか一項に記載の無アルカリガラス板。
- 磁気記録媒体に用いることを特徴とする請求項1~9の何れか一項に記載の無アルカリガラス板。
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KR1020237038879A KR20240006552A (ko) | 2021-05-10 | 2022-05-09 | 무알칼리 유리판 |
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WO2013099970A1 (ja) * | 2011-12-28 | 2013-07-04 | AvanStrate株式会社 | フラットパネルディスプレイ用ガラス基板およびその製造方法 |
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WO2013099970A1 (ja) * | 2011-12-28 | 2013-07-04 | AvanStrate株式会社 | フラットパネルディスプレイ用ガラス基板およびその製造方法 |
WO2013129368A1 (ja) * | 2012-02-27 | 2013-09-06 | 旭硝子株式会社 | 無アルカリガラスの製造方法 |
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