WO2022215355A1 - パワーモジュール、及びパワーモジュールの製造方法 - Google Patents
パワーモジュール、及びパワーモジュールの製造方法 Download PDFInfo
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- WO2022215355A1 WO2022215355A1 PCT/JP2022/005897 JP2022005897W WO2022215355A1 WO 2022215355 A1 WO2022215355 A1 WO 2022215355A1 JP 2022005897 W JP2022005897 W JP 2022005897W WO 2022215355 A1 WO2022215355 A1 WO 2022215355A1
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- Prior art keywords
- terminal block
- circuit board
- power module
- reinforcing portion
- intermediate portion
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
Definitions
- the present disclosure relates to power modules and methods of manufacturing power modules.
- This application claims priority to Japanese Patent Application No. 2021-064919 filed in Japan on April 6, 2021, the content of which is incorporated herein.
- Patent Document 1 discloses, for example, a power semiconductor module (hereinafter referred to as a power module) used in a power converter such as an inverter.
- a power module a power semiconductor module used in a power converter such as an inverter.
- the input terminal and the output terminal of the power module described in Patent Literature 1 may be subjected to a load due to fastening of conductors or a load due to disturbance such as vibration. Therefore, it is necessary to have sufficient strength to withstand these loads, and it is difficult to achieve further miniaturization without lowering the reliability of the terminal.
- the present disclosure has been made to solve the above problems, and an object thereof is to provide a power module that can be miniaturized without reducing the reliability of terminals, and a method of manufacturing the power module.
- a power module is a power module that converts input power and outputs it, and includes a circuit board on which a power semiconductor element is mounted, and the circuit board are fixed.
- a base plate a base end surface fixed to a surface of the circuit board facing away from the base plate, a front end surface capable of fixing an external conductor electrically connected to the outside, and the circuit board.
- a terminal block having an intermediate portion extending in a direction away from a surface and electrically connecting the proximal end surface and the distal end surface; and a terminal block fixed to at least one of the circuit board and the base plate.
- the intermediate portion of the terminal block has a receiving surface facing the tip surface side, and the reinforcing portion faces the receiving surface in the extending direction of the intermediate portion.
- a restraining surface is provided to restrain displacement of the terminal block in a direction away from the surface of the circuit board.
- the method for manufacturing a power module includes a base end face that can be fixed to a circuit board, a tip face that can fix an external conductor electrically connected to the outside, and the base face and the tip face.
- the present disclosure it is possible to provide a power module that can be miniaturized without reducing the reliability of the terminals, and a method of manufacturing the power module.
- FIG. 1 is a perspective view of a power module according to a first embodiment of the present disclosure, showing a state in which a reinforcing portion is removed;
- FIG. 2 is an enlarged perspective view of a main part of FIG. 1;
- 1 is a perspective view of a power module according to a first embodiment of the present disclosure, showing a state in which a reinforcing portion is provided;
- FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3;
- FIG. 4 is a flow chart of a power module manufacturing method according to the first embodiment of the present disclosure;
- FIG. 4 is a perspective view of a power module according to a second embodiment of the present disclosure
- 6 is a flowchart of a power module manufacturing method according to a second embodiment of the present disclosure
- FIG. 5 is a diagram showing a modification of the terminal block of the power module according to the embodiment of the present disclosure
- the power module of this embodiment constitutes a part of a power converter such as an inverter or a converter that converts input power and outputs the converted power.
- a case where the power module constitutes a part of an inverter that receives a direct current and outputs an alternating current will be described as an example.
- FIG. 1 is a perspective view of the power module according to the present embodiment, showing a state in which a reinforcing portion is removed.
- the power module 1 of this embodiment includes a base plate 10, a circuit board 15, a terminal block 20, a power semiconductor element 12, a cooler 40, an output conductor 30, and a reinforcing portion 50 ( See FIG. 3).
- the base plate 10 is a flat member.
- the base plate 10 has a first surface 10a and a second surface 10b positioned behind the first surface 10a. That is, the first surface 10a and the second surface 10b of the base plate 10 are back to back.
- the base plate 10 is made of copper, for example. A metal other than copper may be used for the base plate 10 .
- the circuit board 15 has a circuit board body 16 and a circuit pattern C. As shown in FIG.
- the circuit board body 16 has a flat plate shape.
- the circuit board main body 16 has a front surface 16a and a back surface 16b located on the back side of the front surface 16a.
- the back surface 16b of the circuit board body 16 is fixed to the first surface 10a of the base plate 10 via a bonding material or the like.
- the circuit board body 16 is made of an insulating material such as ceramic.
- an insulating material for forming the circuit board main body 16 paper phenol, paper epoxy, glass composite, glass epoxy, glass polyimide, fluororesin, etc. can be used in addition to the above ceramics.
- the circuit pattern C is a pattern of copper foil or the like formed on the surface 16a of the circuit board body 16. More specifically, the circuit pattern C is formed by etching or the like after being fixed to the surface 16a of the circuit board body 16 by adhesion or the like.
- An input circuit (not shown), an output circuit (not shown), and a control circuit (not shown) are formed in the circuit pattern C of this embodiment.
- An input circuit (not shown) is a circuit pattern for inputting a current input from a terminal block 20, which will be described later, to the power semiconductor element 12, which will be described later.
- the output circuit (not shown) is a circuit pattern for outputting the current converted by the power semiconductor element 12 .
- a control circuit (not shown) is a circuit pattern to which a control section (not shown) that generates a control signal for controlling the behavior of the power semiconductor element 12 is connected.
- the terminal block 20 receives current input from a current supply source (not shown) provided outside the power module 1 via a capacitor or the like (not shown). As shown in FIGS. 1 and 2, the terminal block 20 is made of metal such as copper, and is fixed to a circuit pattern C formed on the surface 16a of the circuit board body 16. As shown in FIG. The terminal block 20 has a proximal end surface 20a, a distal end surface 20b, and an intermediate portion 20c.
- the base end surface 20 a is fixed to the surface of the outer surface of the circuit board 15 facing away from the base plate 10 . More specifically, the base end surface 20a is in contact with the input circuit of the circuit pattern C formed on the surface 16a of the circuit board body 16 and is electrically connected to the input circuit of the circuit pattern C. As shown in FIG.
- the distal end surface 20b is a surface located on the opposite side to the proximal end surface 20a. That is, the distal end surface 20b and the proximal end surface 20a are in a back-to-back relationship.
- a bus bar (not shown) or the like which is an external conductor electrically connected to the outside, can be fixed to the tip surface 20b.
- a screw hole T for fastening a bolt is formed in the tip surface 20b of the present embodiment. By forming the screw holes T for fastening bolts, an input bus bar (not shown), which is an external conductor for current input, can be fastened to the tip surface 20b using bolts (not shown) or the like.
- the intermediate portion 20c extends away from the surface 16a of the circuit board 15 and connects the base end surface 20a and the tip end surface 20b.
- the intermediate portion 20c in this embodiment extends from the base end surface 20a in a direction perpendicular to the surface 16a of the circuit board 15 and reaches the tip surface 20b.
- the current flowing from the distal end surface 20b of the terminal block 20 reaches the proximal end surface 20a via the intermediate portion 20c, and flows into the input circuit of the circuit pattern C from the proximal end surface 20a.
- the contour of the terminal block 20 in the cross section perpendicular to the extending direction of the intermediate portion 20c is rectangular (specifically, substantially square).
- a concave portion 20d extending in the direction along the circuit board 15 is formed in the intermediate portion 20c.
- 20 d of recessed parts have the receiving surface 20e which faces the front end surface 20b side.
- the recess 20d in this embodiment has a facing surface 20g arranged to face the receiving surface 20e, and a bottom surface 20f connecting the facing surface 20g and the receiving surface 20e.
- one terminal block 20 is formed with two recesses 20d. These two recesses 20 d are arranged at mutually symmetrical positions in one terminal block 20 .
- the power module 1 of this embodiment has a first terminal block 21 and a second terminal block 22 as two terminal blocks 20 forming PN terminals.
- the first terminal block 21 and the second terminal block 22 are arranged side by side with a space therebetween in the direction along the circuit board 15 .
- first terminal block 21 and the second terminal block 22 of the present embodiment are spaced apart in the direction in which one of the four sides of the circuit board 15 formed in a rectangular shape in plan view extends. They are arranged side by side along this one side.
- the first terminal block 21 and the second terminal block 22 are close to each other in the direction along the circuit board 15 as long as they do not contact each other. That is, the smaller the gap between the first terminal block 21 and the second terminal block 22 in the direction along the circuit board 15, the greater the effect of the magnetic field generated by the current flowing through the first terminal block 21 and the second terminal block 22. Therefore, the inductance can be reduced more effectively.
- the power semiconductor element 12 is, for example, an IGBT, MOSFET, FWD, or the like. In this embodiment, the case where six power semiconductor elements 12 are mounted on the circuit board 15 is illustrated.
- the power semiconductor element 12 includes an input terminal (not shown) and an output terminal (not shown). An input terminal (not shown) is electrically connected to the input circuit of the circuit pattern C formed on the surface 16a of the circuit board body 16 of the base plate 10 via a bonding material or the like.
- one end of a lead frame (not shown) as a conductor is electrically connected to the output terminal (not shown).
- the other end of the lead frame is electrically connected to the output circuit of the circuit pattern C.
- a control signal generated by a control section (not shown) is input to the power semiconductor element 12 .
- the power semiconductor element 12 performs switching according to this control signal.
- Cooler 40 is a device that cools circuit board 15 .
- the cooler 40 is provided on the second surface 10b of the base plate 10 via a bonding material or the like.
- the cooler 40 in this embodiment has a cooler housing 41 , a coolant inlet portion 42 and a coolant outlet portion 43 .
- the cooler housing 41 is bonded to the second surface 10b of the base plate 10 via a bonding material or the like. A flow path through which the coolant W flows is formed inside the cooler housing 41 .
- the coolant inlet portion 42 guides the coolant W supplied from a coolant supply device (not shown) provided outside the power module 1 to the interior of the cooler housing 41 .
- the coolant outlet portion 43 discharges the coolant W that has flowed through the cooler housing 41 from the coolant inlet portion 42 to the outside.
- the refrigerant discharged from the refrigerant outlet portion 43 is returned to, for example, the refrigerant supply device.
- the heat of the power semiconductor element 12 is transmitted to the coolant W through the circuit pattern C, the circuit board body 16, the base plate 10, the cooler housing 41, etc., and the power semiconductor element 12 is cooled.
- Solder or a sintered material can be used for joining the base plate 10 and the circuit board main body 16, joining the power semiconductor element 12 and the circuit pattern C, and joining the base plate 10 and the cooler housing 41.
- powder or a bonding material such as an adhesive can be used.
- materials for the cooler housing 41, the coolant inlet portion 42, and the coolant outlet portion 43 for example, aluminum, iron, copper, ceramics, or the like can be used.
- the output conductor 30 is a conductor that outputs the current converted by the power semiconductor element 12 .
- the output conductor 30 has a base portion 31 and a connection portion 32 .
- the base portion 31 is a conductor serving as an output bus bar for current output, extending from the outside of the base plate 10 toward the circuit board 15 provided on the first surface 10a.
- a bolt fastening hole B is formed in the outer end of the base 31 .
- An output wiring (not shown) for current output is bolted to the outer end of the base 31 .
- the connecting portion 32 is connected to the inner end portion of the base portion 31, extends from the inner end portion to reach the circuit pattern C area, and is electrically connected to the output circuit of the circuit pattern C formed on the surface 16a of the substrate body. It is connected to the.
- FIG. 3 is a perspective view of the power module according to this embodiment, showing a state in which a reinforcing portion is provided.
- the reinforcing portion 50 is fixed to a portion of the circuit board 15 and the base plate 10 to reinforce the terminal block 20 .
- the reinforcing portion 50 is made of a synthetic resin material.
- the reinforcing portion 50 covers the intermediate portion 20c of the terminal block 20 from the outside and surrounds the circuit board 15 at least from the outside. That is, the reinforcing portion 50 forms a case surrounding the circuit board 15 in the direction along the circuit board 15 .
- the reinforcing portion 50 is fixed to the first surface 10a of the base plate 10 and a partial surface 16a of the circuit board body 16 via an adhesive or the like.
- an insulating material such as PPS (polyphenylene sulfide) can be used as a synthetic resin material for the reinforcing portion 50 .
- PPS polyphenylene sulfide
- an insulating material other than PPS may be employed for the reinforcing portion 50 .
- the reinforcing portion 50 surrounds the circuit board 15 from the outside.
- a space is defined by the reinforcing portion 50 and the circuit board 15 .
- the space defined by the reinforcing portion 50 and the circuit board 15 will be referred to as a potting space P in this embodiment.
- a potting material is poured into the potting space P from the outside (potting), and at least the circuit pattern C provided on the surface 16a of the circuit board body 16 and the power semiconductor element 12 are sealed.
- FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3.
- the reinforcing portion 50 in the present embodiment is molded so as to be inserted into the recess 20d formed in the intermediate portion 20c of the terminal block 20.
- the reinforcing portion 50 is formed with a restraining surface 50a facing the receiving surface 20e in the direction in which the intermediate portion 20c of the terminal block 20 extends.
- the pressing surface 50 a restricts the displacement of the terminal block 20 in the direction away from the surface 16 a of the circuit board 15 .
- the reinforcing portion 50 in this embodiment also has a restricting surface 50b that faces the facing surface 20g of the concave portion 20d.
- a restricting surface 50b that faces the facing surface 20g, displacement of the terminal block 20 toward the surface 16a of the circuit board 15 is also regulated.
- the manufacturing method includes at least a terminal block forming step S1, a reinforcing portion forming step S2, a circuit board mounting step S3, and a potting step S4.
- the terminal block forming step S1 is a step of forming the terminal block 20 described above.
- a substantially rectangular parallelepiped metal is prepared.
- two substantially rectangular parallelepiped metals are prepared.
- a screw hole T is formed in one of the two surfaces facing the longitudinal direction of the substantially rectangular parallelepiped metal.
- the surface on which the screw hole T is formed becomes the distal end surface 20b, and the surface on which the screw hole T is not formed becomes the proximal end surface 20a.
- a groove-shaped concave portion 20d is formed between the proximal end surface 20a and the distal end surface 20b of the substantially rectangular parallelepiped metal in which the screw hole T is formed, that is, in the intermediate portion 20c.
- the base end surface 20a capable of being fixed to the circuit board 15
- the distal end surface 20b capable of fixing an external conductor electrically connected to the outside
- the base end surface 20a and the distal end surface 20b are electrically connected.
- Two terminal blocks 20 are formed, each of which has a concave portion 20d having a receiving surface 20e facing the tip surface 20b in the intermediate portion 20c.
- the two terminal blocks 20 formed in the terminal block molding step S1 are integrally molded so as to cover the reinforcement portion 50 made of synthetic resin.
- a synthetic resin material is prepared.
- PPS for example, is adopted as the synthetic resin used in the reinforcing portion molding step S2 of the present embodiment.
- a synthetic resin other than PPS may be employed in the reinforcing portion molding step S2.
- the synthetic resin material is heated and melted, and a special mold or the like is used to enter the synthetic resin into the concave portions 20d of the two terminal blocks 20, thereby forming the intermediate portions 20c of the terminal blocks 20. Let it be fed so as to cover it from the outside. After that, the synthetic resin is cured. Thereby, the reinforcing portion 50 is formed integrally with the two terminal blocks 20 .
- a molding method such as insert molding can be used, but a molding method other than insert molding may be employed.
- circuit board mounting process In the circuit board mounting step S3, the two terminal blocks 20 integrally formed with the reinforcing portions 50 are mounted on the circuit board 15 fixed to the base plate 10 in the reinforcing portion forming step S2.
- the circuit board 15 fixed to the base plate 10 on which the terminal block 20 is mounted is prepared.
- a bonding material is applied to predetermined mounting locations of the circuit pattern C formed on the circuit board 15 .
- the bonding material used in the circuit board mounting step S3 include cream solder, but materials other than cream solder may be used as the bonding material in the circuit board mounting step S3.
- the reinforcing portion 50 is mounted on the base plate 10 so that the base end surface 20a of the terminal block 20 contacts the bonding material applied to the mounting location of the circuit board 15. Then, they are placed in a furnace heated to a predetermined temperature for a predetermined period of time. As a result, the bonding material between the base end surface 20a and the circuit pattern C melts, completing the soldering.
- a reflow furnace for example, is adopted as the furnace used in the circuit board mounting step S3.
- a furnace other than the reflow furnace may be employed in the circuit board mounting step S3.
- potting process In the potting step S4, a predetermined amount of liquid potting material is poured into the potting space P, and the potting material is cured.
- a potting material is prepared.
- silicon gel or epoxy resin can be used as the potting material.
- a synthetic resin other than silicone gel or epoxy resin may be used as the potting material.
- the reinforcing portion 50 and the base plate 10 are adhered with an adhesive or the like without any gap.
- the reinforcing portion 50 is fixed to the base plate 10 and the space between the reinforcing portion 50 and the base plate 10 is sealed. That is, when the potting material is poured into the potting space P, the potting material does not leak out of the potting space P.
- the predetermined amount here means an amount that can cover at least the circuit pattern C formed on the surface 16a of the circuit board body 16 and the power semiconductor element 12 mounted on the circuit pattern C to such an extent that they are not exposed.
- the power module 1 is manufactured through the above series of steps.
- the power module 1 is a power module 1 that converts and outputs input power, and includes a circuit board 15 on which a power semiconductor element 12 is mounted and a base plate to which the circuit board 15 is fixed. 10, a proximal surface 20a fixed to the surface of the circuit board 15 facing away from the base plate 10, a distal surface 20b capable of fixing an external conductor electrically connected to the outside, and the circuit board.
- terminal block 20 having an intermediate portion 20c extending away from surface 16a of terminal block 15 and electrically connecting proximal end surface 20a and distal end surface 20b; , and a reinforcing portion 50 that reinforces the terminal block 20.
- the intermediate portion 20c of the terminal block 20 has a receiving surface 20e facing the front end surface 20b, and the reinforcing portion 50 receives in the extending direction of the intermediate portion 20c. It has a restraining surface 50a which is provided so as to face the surface 20e and which regulates the displacement of the terminal block 20 in the direction away from the surface 16a of the circuit board 15. As shown in FIG.
- the reinforcing portion 50 also serves as a case surrounding the circuit board 15 .
- the number of parts can be reduced compared to the case where the reinforcing portion 50 and the case surrounding the circuit board 15 are separately provided.
- the power module 1 can be kept safe.
- the intermediate portion 20c has the recess 20d extending in the direction along the circuit board 15, and the recess 20d has the receiving surface 20e.
- the power module 1 according to the first embodiment is provided so as to contact the surface of the base plate 10 facing the opposite side to the surface to which the circuit board 15 is fixed, and cools at least the circuit board 15. 40 are further provided.
- the terminal block 20 fixed to the circuit board 15 can also be cooled using the cooler 40 . Therefore, it is possible to cool the external conductor connected to the terminal block 20 through the terminal block 20 as well.
- the potting space P is defined by the reinforcing portion 50 and the circuit board 15 . Therefore, by pouring the potting material into the potting space P defined by the reinforcing portion 50 and the circuit board 15, the circuit pattern C provided on the surface 16a of the circuit board body 16 and the power semiconductor element 12 can be easily sealed. can do.
- the method for manufacturing the power module 1 according to the first embodiment includes a base end surface 20a that can be fixed to the circuit board 15, a front end surface 20b that can fix an external conductor electrically connected to the outside, and a base end surface.
- the reinforcing portion 50 that reinforces the terminal block 20 can be easily formed.
- FIG. 6 A power module and a method for manufacturing the power module according to the second embodiment of the present disclosure will be described below with reference to FIGS. 6 and 7.
- FIG. The reinforcing portion described in the second embodiment is partially different in the configuration of the reinforcing portion 50 included in the power module 1 of the first embodiment. Components similar to those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
- FIG. 6 is a perspective view of the power module according to the second embodiment.
- the reinforcing portion 150 of the power module 1A of this embodiment is made of a potting material, and the power module 1A further includes an insulating case 60.
- the power module 1A further includes an insulating case 60.
- the insulating case 60 surrounds the circuit board 15 from the outside.
- a potting space P is defined by the insulating case 60 and the circuit board 15 .
- the terminal block 20, the power semiconductor element 12, and the connection portion 32 of the output conductor 30 are arranged.
- the insulating case 60 is adhered to the first surface 10a of the base plate 10 via an adhesive or the like.
- the insulating case 60 can be made of, for example, an insulating material such as PPS, which is a synthetic resin.
- the insulating case 60 may be made of an insulating material other than PPS.
- the reinforcing portion 150 in this embodiment is made of a potting material.
- the reinforcing part 150 is formed in the potting space P. As shown in FIG. More specifically, the reinforcing portion 150 extends from the surface 16a of the circuit board body 16 to at least a position spaced apart from the surface 16a of the circuit board 15 by the receiving surface 20e of the recess 20d of the terminal block 20 so as to fill the potting space P. is formed in
- the reinforcing portion 150 is formed so as to enter the concave portion 20d formed in the intermediate portion 20c of the terminal block 20, like the reinforcing portion 150 of the first embodiment.
- the reinforcing portion 150 has a restraining surface 50a facing the receiving surface 20e in the direction in which the intermediate portion 20c of the terminal block 20 extends.
- an epoxy resin or the like can be used for the reinforcing portion 150, but a material other than the epoxy resin may be used.
- the manufacturing method includes at least a terminal block forming step S1, a circuit board mounting step S2a, a case mounting step S3a, and a reinforcing portion forming step S4a.
- the terminal block forming step S1 is the same as that of the first embodiment, so the explanation is omitted.
- circuit board mounting process After the terminal block forming step S1, a circuit board mounting step S2a is performed. In the circuit board mounting step S ⁇ b>2 a , the terminal block 20 is mounted on the circuit board 15 fixed to the base plate 10 .
- the circuit board 15 fixed to the base plate 10 on which the terminal block 20 is mounted is prepared.
- a bonding material is applied to predetermined mounting locations on the circuit pattern C formed on the circuit board 15 .
- the terminal block 20 is mounted on the circuit board 15 so that the base end surface 20a of the terminal block 20 is in contact with the bonding material applied to the mounting portion of the circuit board 15 .
- they are placed in a furnace heated to a predetermined temperature for a predetermined period of time.
- the bonding material between the base end surface 20 a and the circuit pattern C melts, completing the soldering, and the terminal block 20 is mounted on the circuit board 15 .
- the insulating case 60 is attached to the circuit board 15 on which the terminal block 20 is mounted.
- the insulating case 60 is prepared.
- the insulating case 60 can be molded by injection molding or the like using a dedicated mold or the like. It should be noted that the method of manufacturing the insulating case 60 may be a molding method other than injection molding.
- the insulating case 60 is adhered to the base plate 10 with an adhesive or the like so as to cover the circuit board 15 on which the terminal block 20 is mounted from the outside.
- the insulating case 60 is attached to the base plate 10 by the above procedure.
- a potting material is prepared as a material for forming the reinforcing portion 150.
- epoxy resin or the like can be used as the potting material used in the reinforcing portion forming step S4a.
- a synthetic resin other than the epoxy resin may be used as the potting material.
- a predetermined amount of potting material is poured into the potting space P in the reinforcing portion forming step S4a. At that time, the potting material is poured into at least the recess 20 d formed in the intermediate portion 20 c of the terminal block 20 . Then, the poured potting material is cured. The hardened potting material becomes the reinforcing portion 150 .
- the power module 1A is manufactured.
- the reinforcing portion 150 is made of potting material.
- the reinforcing portion 150 that enters the recess 20d of the terminal block 20 by a simple method called potting. Therefore, the man-hours in manufacturing the power module 1A can be reduced. Moreover, the circuit board 15 , the terminal block 20 , the power semiconductor element 12 , and the insulating case 60 are united by the reinforcing portion 150 by potting. As a result, the strength of the power module 1A can be improved against vibrations or the like that occur in the circuit board 15 during operation of the inverter.
- FIG. 8 shows a modification of the terminal block of the power module according to the embodiment of the present disclosure.
- FIG. 8 shows a state in which the reinforcing portion is removed.
- the power modules 1 and 1A in each of the above embodiments may include, as the terminal block 20, a first terminal block 21 and a second terminal block 22 that do not have the groove-shaped recess 20d as shown in FIG.
- the first terminal block 21 and the second terminal block 22 in this modification are arranged side by side with an interval in the direction along the circuit board 15, as in the first and second embodiments.
- the receiving surface 20e of the concave portion 20d of the intermediate portion 20c of the first terminal block 21 is provided closer to the second terminal block 22 than the tip surface 20b of the first terminal block 21 is.
- the receiving surface 20e of the concave portion 20d of the intermediate portion 20c of the second terminal block 22 is provided closer to the first terminal block 21 than the tip surface 20b of the second terminal block 22 is.
- the distance between the end surfaces 20b of the first terminal block 21 and the second terminal block 22 can be set larger than the distance between the receiving surfaces 20e of the respective receiving surfaces 20e. Therefore, it is possible to reduce the inductance while securing the insulation distance between the bolt fastening holes B that are connected to the input bus bar. Furthermore, since the first terminal block 21 and the second terminal block 22 have the receiving surface 20e, the effects described in the above embodiment can be realized.
- the tip surface 20b of the terminal block 20 is configured to have a screw hole T for bolt fastening, but the configuration is not limited to a configuration in which the screw hole T is cut.
- a configuration in which a male screw portion protruding from the tip surface 20b is formed may be employed.
- the intermediate portions 20c of the two terminal blocks 20 each have two recesses 20d, but the number of recesses 20d is not limited to two.
- the number of recesses 20d may be one, or three or more.
- the recess 20d of the intermediate portion 20c extends in the direction along the circuit board 15, but the configuration is not limited to this.
- the power modules 1 and 1A are used as inverters, but they are not limited to inverters.
- the power modules 1 and 1A may constitute part of a converter that receives an alternating current and outputs a direct current, or a step-up circuit of a regulator that changes the magnitude of the voltage of the direct current.
- the order of the steps in the second embodiment is not limited to the above, and the order of the circuit board mounting step S2a and the case attaching step S3a may be different.
- the power modules 1 and 1A are power modules 1 and 1A that convert input power and output it, and include a circuit board 15 on which a power semiconductor element 12 is mounted, and the circuit board 15 mounted with the power semiconductor element 12; A base plate 10 to which a substrate 15 is fixed, a base end surface 20a fixed to a surface of the circuit board 15 facing away from the base plate 10, and an external conductor electrically connected to the outside are fixed.
- terminal block 20 having a flexible distal surface 20b and an intermediate portion 20c extending away from surface 16a of circuit board 15 to electrically connect proximal surface 20a and distal surface 20b; a reinforcing portion 50 fixed to at least one of the substrate 15 and the base plate 10 to reinforce the terminal block 20;
- the reinforcing portion 50 is provided so as to face the receiving surface 20e in the direction in which the intermediate portion 20c extends, and extends the terminal block 20 in the direction away from the surface 16a of the circuit board 15. has a restraining surface 50a that regulates the displacement of the
- the power module 1 according to the second aspect is the power module 1 of (1), and the reinforcing portion 50 may also serve as a case surrounding the circuit board 15 .
- the number of parts can be reduced compared to the case where the reinforcing portion 50 and the case surrounding the circuit board 15 are separately provided. Moreover, by surrounding the circuit board 15 with the reinforcing portion 50, the power module 1 can be kept safe.
- a power module 1A according to a third aspect is the power module 1A of (1), and the reinforcing portion 150 may be made of a potting material.
- the reinforcing portion 150 that enters the recess 20d of the terminal block 20 by a simple method called potting. Therefore, the man-hours in manufacturing the power module 1A can be reduced. Moreover, the circuit board 15 , the terminal block 20 , the power semiconductor element 12 , and the insulating case 60 are united by the reinforcing portion 150 by potting. As a result, the strength of the power module 1A can be improved against vibrations or the like that occur in the circuit board 15 during operation of the inverter.
- the power modules 1 and 1A according to the fourth aspect are the power modules 1 and 1A according to any one of (1) to (3), wherein the intermediate portion 20c extends along the circuit board 15. It may have an extending recess 20d, said recess 20d comprising said receiving surface 20e.
- the power modules 1, 1A according to the fifth aspect are the power modules 1, 1A according to any one of (1) to (3), wherein the terminal block 20 is a first terminal block forming a PN terminal. 21 and a second terminal block 22, wherein the first terminal block 21 and the second terminal block 22 are arranged side by side with an interval in a direction along the circuit board 15, and the first terminal block
- the receiving surface 20e of 21 is provided closer to the second terminal block 22 than the tip surface 20b of the first terminal block 21, and the receiving surface 20e of the second terminal block 22 is located closer to the second terminal block.
- 22 may be provided closer to the first terminal block 21 than the tip surface 20 b of the terminal block 22 .
- the distance between the end surfaces 20b of the first terminal block 21 and the second terminal block 22 can be made larger than the distance between the receiving surfaces 20e. Therefore, it is possible to reduce the inductance while securing the insulation distance between the bolt fastening holes B that are connected to the input bus bar. Furthermore, since the first terminal block 21 and the second terminal block 22 have the receiving surface 20e, the effects described in the above embodiment can be realized.
- the power modules 1, 1A according to the sixth aspect are the power modules 1, 1A according to any one of (1) to (5), wherein the surface of the base plate 10 to which the circuit board 15 is fixed and the may further include a cooler 40 that is provided in contact with the surface facing the opposite side to cool at least the circuit board 15 .
- the terminal block 20 fixed to the circuit board 15 can also be cooled using the cooler 40 . Therefore, it is possible to cool the external conductor connected to the terminal block 20 through the terminal block 20 as well.
- the method of manufacturing the power modules 1 and 1A according to the seventh aspect includes a base end surface 20a that can be fixed to the circuit board 15, a front end surface 20b that can fix an external conductor electrically connected to the outside, an intermediate portion 20c electrically connecting the base end surface 20a and the tip end surface 20b, and a recess 20d having a receiving surface 20e facing the tip end surface 20b is provided in the intermediate portion 20c. and a liquid synthetic resin is supplied so as to enter the recess 20d and to cover the intermediate portion 20c of the terminal block 20, and is cured. and reinforcing portion forming steps S ⁇ b>2 and S ⁇ b>4 a for forming the reinforcing portion 50 .
- the reinforcing portion 50 that reinforces the terminal block 20 can be easily formed.
- the present disclosure it is possible to provide a power module that can be miniaturized without reducing the reliability of the terminals, and a method of manufacturing the power module.
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Abstract
Description
本願は、2021年4月6日に日本に出願された特願2021-064919号について優先権を主張し、その内容をここに援用する。
しかしながら、上記特許文献1に記載のパワーモジュールの入力端子や出力端子には、導体の締結による荷重や振動等の外乱による荷重が加わる場合がある。そのため、これらの荷重に耐えられる十分な強度を有する必要があり、端子の信頼性を低下させることなく更なる小型化を図ることが困難になっている。
(パワーモジュール)
以下、本開示の第一実施形態に係るパワーモジュール、及びパワーモジュールの製造方法について、図面を参照して説明する。
本実施形態のパワーモジュールは、入力された電力を変換して出力するインバータやコンバータ等の電力変換器の一部を構成している。本実施形態においては、パワーモジュールが、直流電流を入力とし、交流電流を出力とするインバータの一部を構成する場合を一例にして説明する。
図1に示すように、本実施形態のパワーモジュール1は、ベースプレート10と、回路基板15と、端子ブロック20と、パワー半導体素子12と、冷却器40と、出力導体30と、補強部50(図3参照)と、を備えている。
ベースプレート10は、平板状を成す部材である。ベースプレート10は、第一面10a及び該第一面10aの裏側に位置する第二面10bを有している。即ち、ベースプレート10の第一面10aと第二面10bとは背合わせになっている。本実施形態において、ベースプレート10には、例えば銅が採用される。なお、ベースプレート10には、銅以外の金属が採用されてもよい。
回路基板15は、回路基板本体16と、回路パターンCと、を有している。
回路基板本体16は、平板状を成している。この回路基板本体16は、表面16aと、この表面16aの裏側に位置する裏面16bと、を有している。回路基板本体16の裏面16bは、ベースプレート10の第一面10aに接合材等を介して固定されている。回路基板本体16は、例えばセラミック等の絶縁材料により形成されている。なお、回路基板本体16を形成する絶縁材料としては、上記セラミック以外にも、紙フェノール、紙エポキシ、ガラスコンポジット、ガラスエポキシ、ガラスポリイミド、フッ素樹脂等を用いることができる。
端子ブロック20は、パワーモジュール1外部に設けられている電流供給源(図示省略)からコンデンサ等(図示省略)を介して入力される電流を受け入れる。図1、図2に示すように、端子ブロック20は、銅などの金属からなり、回路基板本体16の表面16a上に形成された回路パターンCに固定されている。端子ブロック20は、基端面20aと、先端面20bと、中間部20cと、を有している。
パワー半導体素子12は、例えば、IGBTやMOSFET、FWD等である。本実施形態においては、六つのパワー半導体素子12が回路基板15に実装されている場合を例示している。パワー半導体素子12は、入力用端子(図示省略)と、出力用端子(図示省略)とを備えている。入力用端子(図示省略)は、ベースプレート10の回路基板本体16の表面16aに形成されている回路パターンCの入力回路に、接合材等を介して電気的に接続されている。
冷却器40は、回路基板15を冷却する装置である。冷却器40は、接合材等を介して、ベースプレート10の第二面10bに設けられている。本実施形態における冷却器40は、冷却器筐体41と、冷媒入口部42と、冷媒出口部43と、を有している。
出力導体30は、パワー半導体素子12によって変換された電流を出力する導体である。出力導体30は、基部31と、接続部32と、を有している。
図3は、本実施形態に係るパワーモジュールの斜視図であって、補強部を設けた状態を示している。
図3に示すように、補強部50は、回路基板15の一部、及びベースプレート10に固定されて端子ブロック20を補強している。補強部50は、合成樹脂材料により形成されている。補強部50は、端子ブロック20の中間部20cを外側から覆うとともに、回路基板15を少なくとも外側から囲っている。即ち、補強部50は、回路基板15に沿う方向において、回路基板15の周囲を囲むケースを成している。補強部50は、ベースプレート10の第一面10a及び回路基板本体16の一部の表面16aに接着剤等を介して固定されている。
図4に示すように、本実施形態における補強部50は、端子ブロック20の中間部20cに形成された凹部20d内に入り込むように成形されている。これにより、補強部50には、端子ブロック20の中間部20cの延びる方向で受け面20eと対向する抑え面50aが形成されている。抑え面50aは、回路基板15の表面16aから離間する方向への端子ブロック20の変位を規制している。
次に、本実施形態のパワーモジュール1の製造方法について図5に示すフローチャートを用いて説明する。当該製造方法は、少なくとも、端子ブロック成形工程S1と、補強部成形工程S2と、回路基板実装工程S3と、ポッティング工程S4と、を含む。
端子ブロック成形工程S1は、上述の端子ブロック20を成形する工程である。
この端子ブロック成形工程S1においては、はじめに、略直方体形状の金属を用意する。本実施形態においては、二つの略直方体形状の金属を用意する。
補強部成形工程S2においては、端子ブロック成形工程S1により形成された二つの端子ブロック20に対して、合成樹脂である補強部50を覆うように一体に成形する。
なお、補強部成形工程S2においては、インサート成型等の成形方法を用いることができるが、インサート成型以外の成形方法を採用してもよい。
回路基板実装工程S3においては、ベースプレート10に固定されている回路基板15に対して、補強部成形工程S2により補強部50を一体に成形した二つの端子ブロック20を実装する。
次に、回路基板15に形成された回路パターンCの所定の実装箇所に接合材を塗布する。回路基板実装工程S3で用いられる接合材としては、例えばクリーム半田等を例示することができるが、クリーム半田以外の材料を回路基板実装工程S3における接合材に採用してもよい。
上記手順により、回路基板15に対して、補強部50が成形された端子ブロック20が実装される。
ポッティング工程S4においては、ポッティング空間Pに液状のポッティング材を所定量流し込み、ポッティング材を硬化させる。
上記第一実施形態に係るパワーモジュール1は、入力された電力を変換して出力するパワーモジュール1であって、パワー半導体素子12が実装された回路基板15と、回路基板15が固定されるベースプレート10と、回路基板15の外面のうち、ベースプレート10とは反対側を向く面に固定された基端面20aと、外部に電気的に接続された外部導体を固定可能な先端面20bと、回路基板15の表面16aから離間する方向に延びて基端面20aと先端面20bとを電気的に接続する中間部20cとを有する端子ブロック20と、回路基板15とベースプレート10との少なくとも一方に固定されて、端子ブロック20を補強する補強部50と、を備え、端子ブロック20の中間部20cは、先端面20b側を向く受け面20eを有し、補強部50は、中間部20cの延びる方向で受け面20eと対向するように設けられて、回路基板15の表面16aから離間する方向への端子ブロック20の変位を規制する抑え面50aを有している。
上記構成によれば、補強部50と回路基板15を囲むケースとを個別に設ける場合と比較して、部品点数を削減することができる。また、補強部50によって回路基板15を囲むことで、パワーモジュール1を安全に保つことができる。
上記構成によれば、冷却器40を用いて回路基板15に固定された端子ブロック20も冷却することができる。したがって、端子ブロック20を介して、端子ブロック20に接続された外部導体も冷却することが可能となる。
したがって、補強部50と回路基板15とによって画成されたポッティング空間Pにポッティング材を流し込むことで、回路基板本体16の表面16aに設けられた回路パターンC及びパワー半導体素子12を容易に封止することができる。
以下、本開示の第二実施形態に係るパワーモジュール、及びパワーモジュールの製造方法について図6及び図7を参照して説明する。第二実施形態で説明する補強部は、第一実施形態のパワーモジュール1が備える補強部50の構成が一部異なる。第一実施形態と同様の構成要素については同一の符号を付して詳細な説明を省略する。
図6に示すように、本実施形態のパワーモジュール1Aの補強部150は、ポッティング材からなり、パワーモジュール1Aは、絶縁ケース60をさらに備えている。
絶縁ケース60は、回路基板15を外側から囲んでいる。これら絶縁ケース60と回路基板15とによってポッティング空間Pが画成されている。本実施形態におけるポッティング空間Pには、端子ブロック20、パワー半導体素子12、及び出力導体30の接続部32が配置されている。絶縁ケース60は、ベースプレート10の第一面10aに接着剤等を介して接着されている。絶縁ケース60は、例えば、合成樹脂であるPPS等の絶縁材料により形成することができる。なお、PPS以外の絶縁材料により絶縁ケース60を形成してもよい。
本実施形態における補強部150は、ポッティング材からなる。補強部150は、ポッティング空間Pに形成されている。
より詳しくは、補強部150は、回路基板本体16の表面16aから、少なくとも端子ブロック20の凹部20dが有する受け面20eよりも回路基板15の表面16aから離間した位置まで、ポッティング空間Pを満たすように形成されている。
次に、本実施形態のパワーモジュール1Aの製造方法について、図7に示すフローチャートを用いて説明する。当該製造方法は、少なくとも、端子ブロック成形工程S1と、回路基板実装工程S2aと、ケース取り付け工程S3aと、補強部成形工程S4aと、を含む。なお、端子ブロック成形工程S1については、第一実施形態と同様のため、説明を省略する。
端子ブロック成形工程S1の後に、回路基板実装工程S2aを実行する。
回路基板実装工程S2aにおいては、ベースプレート10に固定されている回路基板15に対して、端子ブロック20を実装する。
次に、回路基板15に形成された回路パターンCにおける所定の実装箇所に接合材を塗布する。そして、端子ブロック20の基端面20aが、回路基板15の実装箇所に塗布された接合材に接触するように、端子ブロック20を回路基板15に搭載する。その後、これらを所定の温度に温められた炉の内部に所定の時間入れる。これにより、基端面20aと回路パターンCとの間の接合材が溶けて半田付けが完了し、回路基板15に対して、端子ブロック20が実装される。
ケース取り付け工程S3aにおいては、端子ブロック20が実装された上記回路基板15に対して絶縁ケース60を取り付ける。
このケース取り付け工程S3aにおいては、はじめに、絶縁ケース60を用意する。絶縁ケース60は、専用の金型等を用いた射出成型等によって成形することができる。なお、絶縁ケース60の作製方法は、射出成型ではない他の成形方法であってもよい。
上記手順により、ベースプレート10に対して絶縁ケース60が取り付けられる。
補強部成形工程S4aにおいては、ポッティング空間Pに、液状のポッティング材を所定量流し込み、ポッティング材を硬化させて補強部150を成形する。
この補強部成形工程S4aにおいては、はじめに、補強部150を成形するため材料としてポッティング材を用意する。補強部成形工程S4aで用いるポッティング材としては、例えばエポキシ樹脂等を採用することができる。なお、エポキシ樹脂以外の合成樹脂を、ポッティング材として採用してもよい。
上記工程を経ることにより、パワーモジュール1Aが製造される。
上記第二実施形態に係るパワーモジュール1Aにおいて、補強部150は、ポッティング材からなっている。
図8は、本開示の実施形態に係るパワーモジュールの端子ブロックの変形例を示す。図8では、補強部を除いた状態を示している。
上記各実施形態におけるパワーモジュール1,1Aは、端子ブロック20として、図8に示すような溝状の凹部20dを有していない第一端子ブロック21及び第二端子ブロック22を備えてもよい。
以上、本開示の実施形態及び変形例について図面を参照して詳述したが、具体的な構成は各実施形態の構成に限られるものではなく、本開示の要旨を逸脱しない範囲内での構成の付加、省略、置換、及びその他の変更が可能である。また、本開示は実施形態によって限定されることはない。
また、上記実施形態では、中間部20cが有する凹部20dは、回路基板15に沿う方向に延びているが、この構成に限定されることはない。
実施形態に記載のパワーモジュールは、例えば以下のように把握される。
Claims (7)
- 入力された電力を変換して出力するパワーモジュールであって、
パワー半導体素子が実装された回路基板と、
前記回路基板が固定されるベースプレートと、
前記回路基板の外面のうち、前記ベースプレートとは反対側を向く面に固定された基端面と、外部に電気的に接続された外部導体を固定可能な先端面と、前記回路基板の表面から離間する方向に延びて前記基端面と前記先端面とを電気的に接続する中間部とを有する端子ブロックと、
前記回路基板と前記ベースプレートとの少なくとも一方に固定されて、前記端子ブロックを補強する補強部と、を備え、
前記端子ブロックの前記中間部は、前記先端面側を向く受け面を有し、
前記補強部は、
前記中間部の延びる方向で前記受け面と対向するように設けられて、前記回路基板の前記表面から離間する方向への前記端子ブロックの変位を規制する抑え面を有するパワーモジュール。 - 前記補強部は、前記回路基板の周囲を囲むケースを兼ねる請求項1に記載のパワーモジュール。
- 前記補強部は、ポッティング材からなる請求項1に記載のパワーモジュール。
- 前記中間部は、前記回路基板に沿う方向に延びる凹部を有し、
前記凹部が前記受け面を備えている請求項1から3のいずれか一項に記載のパワーモジュール。 - 前記端子ブロックとして、PN端子を成す第一端子ブロック及び第二端子ブロックを備え、
前記第一端子ブロックと前記第二端子ブロックとは、前記回路基板に沿う方向に互いに間隔をあけて並設され、
前記第一端子ブロックの前記受け面は、前記第一端子ブロックの前記先端面よりも前記第二端子ブロック側に設けられ、
前記第二端子ブロックの前記受け面は、前記第二端子ブロックの前記先端面よりも前記第一端子ブロック側に設けられている請求項1から3のいずれか一項に記載のパワーモジュール。 - 前記ベースプレートの前記回路基板が固定される面とは反対側を向く面に接触するように設けられて、少なくとも前記回路基板を冷却する冷却器をさらに備える請求項1から5のいずれか一項に記載のパワーモジュール。
- 回路基板に固定可能な基端面と、外部に電気的に接続された外部導体を固定可能な先端面と、前記基端面と前記先端面とを電気的に接続する中間部と、を備え、前記先端面側を向く受け面を有した凹部を前記中間部に備えた端子ブロックを成形する端子ブロック成形工程と、
液状の合成樹脂を、前記凹部の内部に入り込むように供給するとともに、前記端子ブロックの前記中間部を覆うように供給して硬化させて補強部を成形する補強部成形工程と、を含むパワーモジュールの製造方法。
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JP2000183281A (ja) * | 1998-12-18 | 2000-06-30 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP3198019U (ja) * | 2015-04-01 | 2015-06-11 | 富士電機株式会社 | 半導体装置 |
JP2019071502A (ja) | 2019-02-20 | 2019-05-09 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2019129201A (ja) * | 2018-01-23 | 2019-08-01 | 三菱電機株式会社 | 半導体装置、および、半導体装置の製造方法 |
JP2021052068A (ja) * | 2019-09-24 | 2021-04-01 | 株式会社東芝 | パワーモジュール |
JP2021064919A (ja) | 2019-10-17 | 2021-04-22 | シャープ株式会社 | 画像形成装置、受信通知システム、受信通知方法及びプログラム |
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JP2000183281A (ja) * | 1998-12-18 | 2000-06-30 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP3198019U (ja) * | 2015-04-01 | 2015-06-11 | 富士電機株式会社 | 半導体装置 |
JP2019129201A (ja) * | 2018-01-23 | 2019-08-01 | 三菱電機株式会社 | 半導体装置、および、半導体装置の製造方法 |
JP2019071502A (ja) | 2019-02-20 | 2019-05-09 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2021052068A (ja) * | 2019-09-24 | 2021-04-01 | 株式会社東芝 | パワーモジュール |
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