WO2022210628A1 - 積層セラミックコンデンサ - Google Patents

積層セラミックコンデンサ Download PDF

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Publication number
WO2022210628A1
WO2022210628A1 PCT/JP2022/015247 JP2022015247W WO2022210628A1 WO 2022210628 A1 WO2022210628 A1 WO 2022210628A1 JP 2022015247 W JP2022015247 W JP 2022015247W WO 2022210628 A1 WO2022210628 A1 WO 2022210628A1
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WO
WIPO (PCT)
Prior art keywords
electrode
internal
ceramic capacitor
internal electrodes
metal composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/015247
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English (en)
French (fr)
Japanese (ja)
Inventor
徹 若松
大介 濱田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202280018991.9A priority Critical patent/CN116982128A/zh
Priority to JP2023511325A priority patent/JP7708175B2/ja
Publication of WO2022210628A1 publication Critical patent/WO2022210628A1/ja
Priority to US18/373,347 priority patent/US12567540B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • H01G4/0085Fried electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Definitions

  • the present invention relates to a multilayer ceramic capacitor, and more particularly to the metal composition of internal electrodes provided in the multilayer ceramic capacitor.
  • a multilayer ceramic capacitor generally includes a laminate having a plurality of laminated dielectric layers and a plurality of internal electrodes arranged along the interface between the dielectric layers, and an outer surface of the laminate having and a plurality of external electrodes provided and electrically connected to the internal electrodes.
  • the internal electrodes are known to contain Ni as a main component, as described in Japanese Patent Application Laid-Open No. 11-283867 (Patent Document 1), for example.
  • the present invention has been made in view of such problems, and aims to provide a multilayer ceramic capacitor having a thinner dielectric layer and exhibiting excellent reliability even when a voltage having a high electric field strength is applied. With the goal.
  • a multilayer ceramic capacitor according to the present invention includes a laminate having a plurality of laminated dielectric layers made of ceramic and a plurality of internal electrodes respectively arranged along a plurality of interfaces between the dielectric layers; a plurality of external electrodes provided on the external surface of the body and electrically connected to the internal electrodes.
  • the internal electrodes include a plurality of first internal electrodes and a plurality of second internal electrodes alternately arranged in the stacking direction of the laminate, and the external electrodes are first external electrodes electrically connected to the first internal electrodes. an electrode; and a second external electrode electrically connected to the second internal electrode.
  • a voltage is applied between the first external electrode and the second external electrode such that the first internal electrode is a positive electrode and the second internal electrode is a negative electrode.
  • Polarity based on direction is defined, the first internal electrode has a first metal composition containing Ni as a main component, and the second internal electrode has a second metal composition containing Cu as a main component.
  • composition of the first metal and the composition of the second metal differ in at least one of the type and content of the constituent elements.
  • the "main component” refers to the metal element having the highest content, more specifically, having a content of 50% or more.
  • the present invention it is possible to suppress deterioration of the insulation of the multilayer ceramic capacitor when a voltage is applied, and thus obtain a multilayer ceramic capacitor with excellent reliability.
  • metals such as Ni and Cu, which are currently widely used and inexpensive, can be used, so that the cost efficiency of the multilayer ceramic capacitor can be improved. can be done.
  • FIG. 1 is a cross-sectional view schematically showing a laminated ceramic capacitor 1 according to one embodiment of the invention
  • FIG. 2 is a diagram for explaining standard electrode potentials of metal elements contained in each of a first internal electrode (positive electrode) 4 and a second internal electrode (negative electrode) 5 in the multilayer ceramic capacitor 1 shown in FIG. 1;
  • FIG. 1 is a cross-sectional view schematically showing a laminated ceramic capacitor 1 according to one embodiment of the invention
  • FIG. 2 is a diagram for explaining standard electrode potentials of metal elements contained in each of a first internal electrode (positive electrode) 4 and a second internal electrode (negative electrode) 5 in the multilayer ceramic capacitor 1 shown in FIG. 1;
  • the multilayer ceramic capacitor 1 includes a laminate 2.
  • the laminate 2 includes a plurality of laminated dielectric layers 3 made of ceramic and a plurality of internal electrodes 4 and 5 arranged along interfaces between the plurality of dielectric layers 3 .
  • the internal electrodes 4 and 5 are classified into a plurality of first internal electrodes 4 and a plurality of second internal electrodes 5 arranged alternately in the stacking direction of the laminate 3 .
  • External electrodes 6 and 7 are provided on the outer surface of the laminate 2, more specifically, on each end face facing each other.
  • the external electrodes 6 and 7 are classified into a first external electrode 6 electrically connected to the first internal electrode 4 and a second external electrode 7 electrically connected to the second internal electrode 5 .
  • the composition of the internal electrodes 4 and 5 will be described later.
  • the external electrodes 6 and 7 are mainly composed of Ag or Cu, for example.
  • the dielectric layer 3 contains a perovskite-type compound containing Ba and Ti (however, part of Ba may be replaced with Ca, and part of Ti may be replaced with Zr) as a main component. It preferably consists of a body ceramic. In particular, when the main component of the dielectric layer 3 is BaTiO 3 , it exhibits a high dielectric constant, and the multilayer ceramic capacitor 1 exhibits excellent reliability.
  • Dielectric layer 3 may contain, for example, rare earth elements, Mn, Mg, Si, etc. as subcomponents in addition to the main components.
  • the dielectric ceramic raw material powder is produced, for example, by a solid-phase synthesis method. Specifically, first, compound powders such as oxides and carbonates containing constituent elements of the main component are mixed in a predetermined ratio and calcined. In addition to the solid-phase synthesis method, a hydrothermal method or the like may be applied. In addition, the dielectric ceramic may contain alkali metals, transition metals, Cl, S, P, Hf, and the like in amounts that do not interfere with the effects of the present invention.
  • the multilayer ceramic capacitor 1 is manufactured, for example, as follows.
  • a ceramic slurry is prepared using the dielectric ceramic raw material powder obtained as described above.
  • a ceramic green sheet is formed by a sheet forming method or the like.
  • a conductive paste to be each of the internal electrodes 4 and 5 is applied by printing or the like onto predetermined ceramic green sheets among the plurality of ceramic green sheets.
  • After laminating a plurality of ceramic green sheets they are pressure-bonded to obtain a green laminate.
  • the green laminate is then fired.
  • the dielectric layer 3 made of dielectric ceramic is obtained.
  • external electrodes 6 and 7 are formed on the end faces of the laminate 3 by baking or the like.
  • the voltage applied between the first external electrode 6 and the second external electrode 7 is adjusted such that the first internal electrode 4 is the positive electrode and the second internal electrode 5 is the negative electrode.
  • a first feature is that the polarity is determined based on the direction of application. Therefore, although not shown, it is preferable that, for example, the outer surface of the multilayer ceramic capacitor 1 is provided with a mark indicating polarity.
  • the multilayer ceramic capacitor to which the present invention is applied is not limited to the two-terminal type having the first external electrode 6 and the second external electrode 7 as shown in FIG. It may be of a multi-terminal type. In this case, between specific two sets of external electrodes selected from three or more external electrodes, that is, at least one first external A voltage may be applied between the electrode and at least one second external electrode.
  • a second feature of the multilayer ceramic capacitor 1 is that the metal compositions of the first internal electrodes 4 and the second internal electrodes 5 are selected as follows. That is, the first internal electrode 4 serving as a positive electrode has a first metal composition containing Ni as a main component, and the second internal electrode 5 serving as a negative electrode has a second metal composition containing Cu as a main component.
  • the trigger is negative electrode segregation of oxygen ions (positive segregation of oxygen vacancies) associated with voltage application. Therefore, it is expected that deterioration of the insulation of the multilayer ceramic capacitor can be suppressed by suppressing the negative electrode segregation of oxygen ions. Therefore, it is conceivable that the positive electrode contains an element whose oxide is stable and the negative electrode contains an element whose oxide is unstable. Based on this idea, negative electrode segregation can be suppressed by causing a reduction reaction (release of oxygen ions) at the negative electrode.
  • a metal element whose valence is likely to increase is present on the side of the first internal electrode 4 serving as the positive electrode.
  • a metal element whose valence is likely to decrease (having a high standard electrode potential) is used on the side of the second internal electrode 5 serving as the negative electrode.
  • the standard electrode potential is a value specific to an element. The lower the value, the more stable the oxide, and the higher the value, the more unstable the oxide.
  • the second internal electrode 5 on the negative electrode side contains a metal element with a standard electrode potential higher than the standard electrode potential of the metal element on the first internal electrode 4 on the positive electrode side.
  • the standard electrode potential of the first metal composition of the first internal electrode 4 on the positive electrode side may be included in the range of A
  • the standard electrode potential of the second metal composition of the second internal electrode 5 on the negative electrode side The potential should be included in the range of B.
  • Ni is -0.26V
  • Sn is -0.14V, +0.34 V for Cu
  • Ru is +0.46V
  • Rh is +0.76V
  • Ag is +0.8V
  • Os is +0.9V, +0.92 V for Pd
  • Ir is +1.16V, +1.19 V for Pt
  • Au is +1.52V.
  • Ni which is the main component of the first metal composition of the first internal electrode 4
  • Sn which may be an additional component
  • Cu which is the main component of the second metal composition of the electrode 5
  • Cu which is the main component of the second metal composition of the second internal electrode 5, which is the negative electrode
  • at least one metal element of Au, Pt, Ir, Pd, Os, Ag, Rh, and Ru, which are additive components are A reduction reaction (release of oxygen ions) is caused in the second internal electrode 5, which is the negative electrode, so that segregation of oxygen ions to the negative electrode can be suppressed.
  • this embodiment attention is paid to the oxidation-reduction reaction in the internal electrodes 4 and 5, and this oxidation-reduction reaction is used to segregate the oxygen ions on the negative electrode (positive segregation of oxygen vacancies) due to voltage application. is suppressed, and as a result, deterioration of the insulation of the multilayer ceramic capacitor when a voltage is applied can be suppressed, so that a highly reliable multilayer ceramic capacitor can be obtained.
  • the first metal composition of the first internal electrode 4 may contain Sn as an additive component.
  • Sn is included, the reliability of the multilayer ceramic capacitor 1 when a voltage is applied can be further improved.
  • the second metal composition of the second internal electrode 5 may include at least one metal element selected from Au, Pt, Ir, Pd, Os, Ag, Rh, and Ru, which has a higher standard electrode potential than Cu, as an additive component. .
  • the higher the standard electrode potential the more unstable the oxide.
  • Rh, Ag, Os, Pd, Ir, Pt, and Au the effect of suppressing negative electrode segregation of oxygen ions becomes higher.
  • Au, Pt, Ir, Pd, Os, Ag, Rh and Ru are noble metals.
  • the first metal composition of the first internal electrode 4 contains a plurality of metal elements
  • the second metal composition of the second internal electrode 5 contains a plurality of metal elements
  • these metal elements are Although it is contained in the conductive paste applied on the ceramic green sheets during the manufacturing of the multilayer ceramic capacitor 1, it is contained in the conductive paste in advance in the form of an alloy or intermetallic compound containing a plurality of metal elements. Alternatively, they may be contained in the conductive paste in the form of separate metal elements.
  • the multilayer ceramic capacitor 1 as a product It is preferable that these metal elements are alloyed at the stage of (1).

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2022/015247 2021-03-31 2022-03-29 積層セラミックコンデンサ Ceased WO2022210628A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202280018991.9A CN116982128A (zh) 2021-03-31 2022-03-29 层叠陶瓷电容器
JP2023511325A JP7708175B2 (ja) 2021-03-31 2022-03-29 積層セラミックコンデンサ
US18/373,347 US12567540B2 (en) 2021-03-31 2023-09-27 Multilayer ceramic capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-058926 2021-03-31
JP2021058926 2021-03-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/373,347 Continuation US12567540B2 (en) 2021-03-31 2023-09-27 Multilayer ceramic capacitor

Publications (1)

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WO2022210628A1 true WO2022210628A1 (ja) 2022-10-06

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PCT/JP2022/015247 Ceased WO2022210628A1 (ja) 2021-03-31 2022-03-29 積層セラミックコンデンサ

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US (1) US12567540B2 (https=)
JP (1) JP7708175B2 (https=)
CN (1) CN116982128A (https=)
WO (1) WO2022210628A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024202203A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、および包装体
WO2024202204A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、包装体、および積層セラミック電子部品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012478A (ja) * 1996-06-27 1998-01-16 Kyocera Corp 積層セラミックコンデンサ
JPH11162777A (ja) * 1997-11-28 1999-06-18 Kyocera Corp 積層セラミックコンデンサ
JPH11340083A (ja) * 1998-05-29 1999-12-10 Kyocera Corp 積層セラミックコンデンサ

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JPH11283867A (ja) 1998-03-31 1999-10-15 Tdk Corp 電子部品およびその製造方法
JP4143961B2 (ja) 2002-10-01 2008-09-03 日立金属株式会社 積層電子部品
DE112012000798B4 (de) 2011-02-14 2024-05-29 Murata Manufacturing Co., Ltd. Verfahren zum Herstellen eines mehrschichtigen Keramikkondensators
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KR102107032B1 (ko) 2014-05-09 2020-05-07 삼성전기주식회사 글래스 조성물, 이를 포함하는 외부전극용 페이스트 및 적층 세라믹 전자부품
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JP6686676B2 (ja) * 2016-04-28 2020-04-22 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
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JP7070840B2 (ja) * 2019-03-29 2022-05-18 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP7275951B2 (ja) * 2019-07-16 2023-05-18 株式会社村田製作所 積層セラミックコンデンサ
JP7331659B2 (ja) * 2019-11-25 2023-08-23 Tdk株式会社 積層型電子部品
KR102736492B1 (ko) * 2019-12-27 2024-11-29 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서
JP7492306B2 (ja) * 2020-05-22 2024-05-29 太陽誘電株式会社 セラミック電子部品およびその製造方法
KR102724891B1 (ko) * 2020-10-20 2024-11-01 삼성전기주식회사 적층형 전자 부품

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Publication number Priority date Publication date Assignee Title
JPH1012478A (ja) * 1996-06-27 1998-01-16 Kyocera Corp 積層セラミックコンデンサ
JPH11162777A (ja) * 1997-11-28 1999-06-18 Kyocera Corp 積層セラミックコンデンサ
JPH11340083A (ja) * 1998-05-29 1999-12-10 Kyocera Corp 積層セラミックコンデンサ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024202203A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、および包装体
WO2024202204A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、包装体、および積層セラミック電子部品の製造方法
KR20250162801A (ko) 2023-03-30 2025-11-19 다이요 유덴 가부시키가이샤 적층 세라믹 전자 부품, 회로 기판, 포장체 및 적층 세라믹 전자 부품의 제조 방법

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Publication number Publication date
US20240021371A1 (en) 2024-01-18
CN116982128A (zh) 2023-10-31
JP7708175B2 (ja) 2025-07-15
US12567540B2 (en) 2026-03-03
JPWO2022210628A1 (https=) 2022-10-06

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