JPWO2022210628A1 - - Google Patents

Info

Publication number
JPWO2022210628A1
JPWO2022210628A1 JP2023511325A JP2023511325A JPWO2022210628A1 JP WO2022210628 A1 JPWO2022210628 A1 JP WO2022210628A1 JP 2023511325 A JP2023511325 A JP 2023511325A JP 2023511325 A JP2023511325 A JP 2023511325A JP WO2022210628 A1 JPWO2022210628 A1 JP WO2022210628A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023511325A
Other languages
Japanese (ja)
Other versions
JPWO2022210628A5 (https=
JP7708175B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022210628A1 publication Critical patent/JPWO2022210628A1/ja
Publication of JPWO2022210628A5 publication Critical patent/JPWO2022210628A5/ja
Application granted granted Critical
Publication of JP7708175B2 publication Critical patent/JP7708175B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2023511325A 2021-03-31 2022-03-29 積層セラミックコンデンサ Active JP7708175B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021058926 2021-03-31
JP2021058926 2021-03-31
PCT/JP2022/015247 WO2022210628A1 (ja) 2021-03-31 2022-03-29 積層セラミックコンデンサ

Publications (3)

Publication Number Publication Date
JPWO2022210628A1 true JPWO2022210628A1 (https=) 2022-10-06
JPWO2022210628A5 JPWO2022210628A5 (https=) 2024-01-29
JP7708175B2 JP7708175B2 (ja) 2025-07-15

Family

ID=83459337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511325A Active JP7708175B2 (ja) 2021-03-31 2022-03-29 積層セラミックコンデンサ

Country Status (4)

Country Link
US (1) US12567540B2 (https=)
JP (1) JP7708175B2 (https=)
CN (1) CN116982128A (https=)
WO (1) WO2022210628A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024202203A1 (ja) * 2023-03-30 2024-10-03 太陽誘電株式会社 積層セラミック電子部品、回路基板、および包装体
KR20250162801A (ko) 2023-03-30 2025-11-19 다이요 유덴 가부시키가이샤 적층 세라믹 전자 부품, 회로 기판, 포장체 및 적층 세라믹 전자 부품의 제조 방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012478A (ja) * 1996-06-27 1998-01-16 Kyocera Corp 積層セラミックコンデンサ
JPH10135065A (ja) * 1996-10-31 1998-05-22 Kyocera Corp 積層セラミックコンデンサ
JPH11162777A (ja) * 1997-11-28 1999-06-18 Kyocera Corp 積層セラミックコンデンサ
JP2004128136A (ja) * 2002-10-01 2004-04-22 Hitachi Metals Ltd 積層電子部品
WO2012111592A1 (ja) * 2011-02-14 2012-08-23 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法
JP6104853B2 (ja) * 2014-05-09 2017-03-29 サムソン エレクトロ−メカニックス カンパニーリミテッド． ガラス組成物、それを含有する外部電極用ペースト、及び積層セラミック電子部品
JP2022067608A (ja) * 2020-10-20 2022-05-06 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11283867A (ja) 1998-03-31 1999-10-15 Tdk Corp 電子部品およびその製造方法
JPH11340083A (ja) * 1998-05-29 1999-12-10 Kyocera Corp 積層セラミックコンデンサ
KR101509145B1 (ko) * 2011-03-03 2015-04-07 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서
WO2014024538A1 (ja) * 2012-08-07 2014-02-13 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
KR101836194B1 (ko) * 2013-09-18 2018-03-08 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서 및 그 제조 방법
JP6558083B2 (ja) 2015-06-05 2019-08-14 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP6686676B2 (ja) * 2016-04-28 2020-04-22 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
JP6743602B2 (ja) * 2016-09-09 2020-08-19 株式会社村田製作所 複合電子部品および抵抗素子
JP2019102752A (ja) * 2017-12-07 2019-06-24 太陽誘電株式会社 積層セラミックコンデンサ
KR102439906B1 (ko) 2018-03-29 2022-09-05 삼성전기주식회사 적층형 커패시터
JP7070840B2 (ja) * 2019-03-29 2022-05-18 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP7275951B2 (ja) * 2019-07-16 2023-05-18 株式会社村田製作所 積層セラミックコンデンサ
JP7331659B2 (ja) * 2019-11-25 2023-08-23 Tdk株式会社 積層型電子部品
KR102736492B1 (ko) * 2019-12-27 2024-11-29 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서
JP7492306B2 (ja) * 2020-05-22 2024-05-29 太陽誘電株式会社 セラミック電子部品およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012478A (ja) * 1996-06-27 1998-01-16 Kyocera Corp 積層セラミックコンデンサ
JPH10135065A (ja) * 1996-10-31 1998-05-22 Kyocera Corp 積層セラミックコンデンサ
JPH11162777A (ja) * 1997-11-28 1999-06-18 Kyocera Corp 積層セラミックコンデンサ
JP2004128136A (ja) * 2002-10-01 2004-04-22 Hitachi Metals Ltd 積層電子部品
WO2012111592A1 (ja) * 2011-02-14 2012-08-23 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法
JP6104853B2 (ja) * 2014-05-09 2017-03-29 サムソン エレクトロ−メカニックス カンパニーリミテッド． ガラス組成物、それを含有する外部電極用ペースト、及び積層セラミック電子部品
JP2022067608A (ja) * 2020-10-20 2022-05-06 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品

Also Published As

Publication number Publication date
US20240021371A1 (en) 2024-01-18
CN116982128A (zh) 2023-10-31
JP7708175B2 (ja) 2025-07-15
US12567540B2 (en) 2026-03-03
WO2022210628A1 (ja) 2022-10-06

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