WO2022202220A1 - 磁性体内蔵基板の製造方法 - Google Patents

磁性体内蔵基板の製造方法 Download PDF

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Publication number
WO2022202220A1
WO2022202220A1 PCT/JP2022/009382 JP2022009382W WO2022202220A1 WO 2022202220 A1 WO2022202220 A1 WO 2022202220A1 JP 2022009382 W JP2022009382 W JP 2022009382W WO 2022202220 A1 WO2022202220 A1 WO 2022202220A1
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WIPO (PCT)
Prior art keywords
magnetic
substrate
resin composition
sheet
magnetic sheet
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2022/009382
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English (en)
French (fr)
Japanese (ja)
Inventor
隆行 辻
諒 永塚
雄亮 大石
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2023508908A priority Critical patent/JPWO2022202220A1/ja
Publication of WO2022202220A1 publication Critical patent/WO2022202220A1/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present disclosure relates generally to a method for manufacturing a substrate with embedded magnetic material, and more particularly to a method for manufacturing a substrate with embedded magnetic material using a substrate having through holes.
  • Patent Document 1 discloses a method for manufacturing a hole-filling substrate.
  • the hole-filling substrate includes a support substrate in which a plurality of through holes are formed, and a filling layer formed of a cured product of a resin composition in the through holes.
  • the above method for manufacturing a hole-filling substrate includes a step of printing a resin composition on a support substrate by the following printing method, and a step of curing the resin composition.
  • the above printing method includes an installation process, a supply process, a first printing process, and a second printing process.
  • a mask having hollow openings is installed on a supporting substrate having a plurality of through holes such that one opening communicates with two or more through holes.
  • a resin composition containing an inorganic filler and a thermosetting resin is supplied to the surface of the mask opposite to the support substrate.
  • the inorganic filler contains magnetic powder.
  • the first squeegee is moved relatively along the surface of the mask so that a part of the first squeegee is pushed into the opening, and the through The holes are filled with a resin composition.
  • a second squeegee which is the same as or different from the first squeegee, is moved relatively along the surface of the mask, and onto the resin composition filled in the through-holes, Apply a resin composition.
  • Patent Document 1 the method of manufacturing a hole-filling substrate in Patent Document 1 has a problem that it is difficult to form a filling layer with a high relative magnetic permeability in the through-hole.
  • An object of the present disclosure is to provide a method for manufacturing a magnetic body-embedded substrate, which can manufacture a magnetic body-embedded substrate in which a magnetic body having a high relative magnetic permeability is embedded.
  • a substrate and a magnetic sheet are prepared.
  • the substrate has a first principal surface, a second principal surface opposite to the first principal surface, and a through hole penetrating from the first principal surface to the second principal surface.
  • the magnetic sheet is formed in a sheet form from a magnetic resin composition containing magnetic powder and a thermosetting resin.
  • a laminate is formed by stacking the magnetic sheet on the first main surface of the substrate. The through holes are filled with the magnetic resin composition by hot-pressing the laminate under reduced pressure.
  • FIG. 1A to 1D are schematic cross-sectional views showing each step of the manufacturing method of the magnetic body-embedded substrate according to the first embodiment.
  • 2A to 2D are schematic cross-sectional views showing each step of the manufacturing method of the magnetic body-embedded substrate according to the second embodiment.
  • FIG. 3A is a schematic cross-sectional view showing a method of manufacturing a magnetic body-embedded substrate according to the third embodiment.
  • FIG. 3B is a schematic plan view of a frame used in the manufacturing method of the magnetic material-embedded substrate;
  • the method of manufacturing a hole-filling substrate of Patent Document 1 has a problem that it is difficult to form a filling layer having a high relative magnetic permeability in a through-hole. Therefore, as a result of investigation by the present inventors in order to solve this problem, one of the causes was identified. That is, one of the causes is that the resin composition is pasty. When using a paste-like resin composition, fluidity must be ensured, but an increase in the amount of magnetic powder leads to an increase in viscosity. Therefore, it is difficult to further increase the content of the magnetic powder contained in the resin composition.
  • the present inventors have completed the following method for manufacturing the substrate 1 with a built-in magnetic material.
  • the magnetic body-embedded substrate 1 according to this embodiment can be manufactured as follows.
  • the substrate 2 and the magnetic sheet 3 are prepared (see FIG. 1A).
  • the substrate 2 has a first major surface 21 , a second major surface 22 and through holes 20 .
  • the magnetic sheet 3 is formed by forming a magnetic resin composition 30 into a sheet.
  • the magnetic resin composition 30 contains magnetic powder and thermosetting resin.
  • the magnetic sheet 3 is overlaid on the first main surface 21 of the substrate 2 to form a laminate 4 (see FIG. 1B).
  • the magnetic resin composition 30 is filled in the through-holes 20 by hot-pressing the laminate 4 under reduced pressure (see FIGS. 1B and 1C).
  • a substrate 1 with a built-in magnetic material is obtained (see FIG. 1D).
  • the magnetic material embedded substrate 1 includes a substrate 2 and a magnetic material embedded in the substrate 2 .
  • the magnetic material is the filling portion 71 filled in the through hole 20 .
  • the filling portion 71 is a cured product of the magnetic resin composition 30 .
  • the magnetic sheet 3 is used in this embodiment. That is, the magnetic resin composition 30 is not paste-like but sheet-like. If the magnetic resin composition 30 is in the form of a paste, it is difficult to spread the magnetic resin composition 30 over the entire first main surface 21 of the substrate 2 unless it has a certain degree of fluidity. On the other hand, if the magnetic resin composition 30 is sheet-like, the magnetic resin composition 30 can be easily spread over the entire first main surface 21 of the substrate 2 . In other words, the magnetic sheet 3 only needs to be placed on the first major surface 21 of the substrate 2 .
  • the magnetic resin composition 30 is in the form of a sheet, fluidity is not particularly required except when hot-pressing, and the magnetic resin composition 30 may be fluidized when hot-pressing. Therefore, if the magnetic resin composition 30 is in the form of a sheet, it becomes easier to increase the amount of the magnetic powder than in the form of a paste.
  • the magnetic material embedded substrate 1 in which a magnetic material having a high relative magnetic permeability is embedded (see FIG. 1D).
  • the manufacturing method of the magnetic body-embedded substrate 1 includes a preparation process, a stacking process, and a filling process.
  • the method for manufacturing the magnetic body-embedded substrate 1 may further include a removal step. These steps will be described in order below.
  • the substrate 2 is a plate-like member extending in the X-axis direction and the Y-axis direction.
  • the substrate 2 is not particularly limited, but examples thereof include metal-clad laminates such as copper-clad laminates (CCL).
  • Metal-clad laminates include double-sided metal-clad laminates and single-sided metal-clad laminates. In this embodiment, a case where a double-sided metal-clad laminate is used as the substrate 2 will be described.
  • the substrate 2 includes a substrate body 23 and at least one or more (two in this embodiment) metal layers 5 .
  • the substrate body 23 is a plate-shaped insulating substrate extending in the X-axis direction and the Y-axis direction.
  • the insulating substrate is not particularly limited as long as it is an electrically insulating substrate.
  • the metal layer 5 is not particularly limited, but includes, for example, a layer containing copper (copper foil, etc.).
  • the metal layer 5 includes a first metal layer 51 and a second metal layer 52 .
  • the first metal layer 51 is adhered to the surface of the substrate body 23 facing in the positive Z-axis direction.
  • the second metal layer 52 is adhered to the surface of the substrate body 23 facing in the negative Z-axis direction.
  • the substrate 2 has a first principal surface 21 , a second principal surface 22 , and at least one (plurality in this embodiment) through holes 20 .
  • the first main surface 21 is a surface facing the positive direction of the Z-axis.
  • the first main surface 21 is the surface of the first metal layer 51 facing in the positive Z-axis direction.
  • the second principal surface 22 exists on the opposite side of the first principal surface 21 . That is, the second main surface 22 is a surface facing in the negative direction of the Z-axis. In the present embodiment, the second main surface 22 is the surface of the second metal layer 52 facing in the negative Z-axis direction.
  • the thickness T2 of the substrate 2 is the length of the substrate 2 in the Z-axis direction (see FIG. 1A). That is, the thickness T2 of the substrate 2 is equal to the distance between the first major surface 21 and the second major surface 22 .
  • the thickness T2 of the substrate 2 is not particularly limited, but is, for example, 0.6 mm or more and 1.4 mm or less.
  • the through hole 20 penetrates from the first principal surface 21 to the second principal surface 22 .
  • the length of the through hole 20 in the Z-axis direction is equal to the thickness T2 of the substrate 2 .
  • the shape of the through-hole 20 in the XY plan view is circular, but is not particularly limited.
  • the hole diameter of the through hole 20 is, for example, 200 ⁇ m or more and 800 ⁇ m or less. When the substrate 2 has a plurality of through holes 20, the hole diameters of these through holes 20 may be the same or different.
  • the hole diameters of the plurality of through holes 20 are different, it is easier to fill the through holes 20 with the magnetic resin composition 30 by using the sheet-like magnetic resin composition 30 (that is, the magnetic sheet 3) rather than using the paste-like magnetic resin composition 30. .
  • the through holes 20 are arranged in the X-axis direction and the Y-axis direction.
  • the pitch between the through-holes 20 adjacent in the X-axis direction and the pitch between the through-holes 20 adjacent in the Y-axis direction are not particularly limited.
  • the pitch is the distance between the centers of adjacent through-holes 20 .
  • the plurality of through holes 20 are arranged in a lattice pattern in the XY plan view, but the arrangement of the plurality of through holes 20 is not particularly limited.
  • the magnetic sheet 3 is formed by forming a magnetic resin composition 30 into a sheet.
  • the magnetic resin composition 30 contains magnetic powder and a binder.
  • the binder contains a thermosetting resin. Therefore, the magnetic sheet 3 has thermosetting properties.
  • the binder may further contain at least one of a curing agent, a curing accelerator, a coupling agent, and a dispersing agent.
  • the magnetic powder is not particularly limited, but examples include powders such as permalloy, ferrite, and Fe--Si alloys, and pure iron powder (carbonyl iron powder).
  • Permalloy is an Fe—Ni alloy.
  • ferrites include, but are not particularly limited to, manganese zinc ferrite (MnZn ferrite), manganese ferrite (Mn ferrite), nickel zinc ferrite (NiZn ferrite), and magnetite (magnetite).
  • the average particle size of the magnetic powder is preferably 0.1 ⁇ m or more and 20 ⁇ m or less, more preferably 0.3 ⁇ m or more and 10 ⁇ m or less.
  • the average particle size means the particle size at 50% of the integrated value in the particle size distribution measured based on the particle size distribution measuring device based on the laser scattering/diffraction method, that is, the 50% volume average particle size (D50).
  • the magnetic powder content is preferably 85% by mass or more and 97% by mass or less, more preferably 92% by mass or more and 97% by mass or less, relative to the total mass of the magnetic resin composition 30 .
  • the content of the magnetic powder is 85% by mass or more with respect to the total mass of the magnetic resin composition 30, the relative magnetic permeability of the magnetic material embedded in the magnetic material-embedded substrate 1 can be increased.
  • the content of the magnetic powder is 97% by mass or less with respect to the total mass of the magnetic resin composition 30, fluidization of the magnetic sheet 3 can be prevented from being hindered during hot pressing.
  • the "relative permeability” mainly means the real part ( ⁇ r ′) of the complex relative permeability ( ⁇ r ).
  • the relational expression of the complex relative permeability ( ⁇ r ) can be summarized as follows. That's right.
  • the magnetic powder content is preferably 70% by volume or more and 85% by volume or less, more preferably 73% by volume or more and 83% by volume or less, relative to the total volume of the magnetic resin composition 30 .
  • the content of the magnetic powder is 70% by volume or more with respect to the total volume of the magnetic resin composition 30, the relative magnetic permeability of the magnetic material embedded in the magnetic material-embedded substrate 1 can be increased.
  • the content of the magnetic powder is 85% by volume or less with respect to the total volume of the magnetic resin composition 30, fluidization of the magnetic sheet 3 can be prevented from being hindered during hot pressing.
  • the thermosetting resin preferably contains epoxy resin. This makes it easier to form the magnetic resin composition 30 into a sheet.
  • the epoxy resin is not particularly limited, examples thereof include bisphenol F type epoxy resin.
  • the magnetic sheet 3 preferably contains volatile components.
  • a volatile component is a component that has volatility and becomes gaseous in the atmosphere.
  • volatile components include volatile organic compounds (VOCs).
  • Volatile organic compounds include, but are not limited to, methyl ethyl ketone (MEK) and N,N-dimethylformamide (DMF).
  • MEK methyl ethyl ketone
  • DMF N,N-dimethylformamide
  • the content of volatile components can be measured as a weight loss rate when the magnetic resin composition 30 is heated at 160°C for 15 minutes.
  • the content of the volatile component is preferably 0.05 parts by mass or more and 1 part by mass or less, more preferably 0.05 parts by mass or more and 0.5 parts by mass, with respect to 100 parts by mass of the magnetic resin composition 30. Part by mass or less.
  • the content of the volatile component is 0.05 parts by mass or more with respect to 100 parts by mass of the magnetic resin composition 30, the fluidity of the magnetic sheet 3 fluidized during hot pressing can be enhanced.
  • the content of the volatile component is 1 part by mass or less with respect to 100 parts by mass of the magnetic resin composition 30, generation of voids can be suppressed. That is, voids are less likely to occur in the magnetic resin composition 30 filled in the through-holes 20 .
  • the melt viscosity of the magnetic sheet 3 at 175°C is preferably 10 Pa ⁇ s or more and 10000 Pa ⁇ s or less, more preferably 50 Pa ⁇ s or more and less than 3000 Pa ⁇ s.
  • the melt viscosity of the magnetic sheet 3 at 175° C. is 10 Pa ⁇ s or more, it is possible to suppress the occurrence of molding defects such as burrs.
  • the fluidized magnetic sheet 3 can be prevented from unnecessarily flowing on the first main surface 21 of the substrate 2 , and the entry of the magnetic resin composition 30 into the through-holes 20 can be promoted.
  • the melt viscosity of the magnetic sheet 3 at 175° C. can be measured by the Koka flow tester method.
  • the thickness T3 of the magnetic sheet 3 is preferably 0.1 to 0.8 times the thickness T2 of the substrate 2, more preferably 0.1 to 0.6 times the thickness T2 of the substrate 2. (see FIG. 1A).
  • the thickness T3 of the magnetic sheet 3 is 0.1 times or more the thickness T2 of the substrate 2, it is possible to prevent the through-holes 20 from being filled with the magnetic resin composition 30 .
  • the thickness T3 of the magnetic sheet 3 is 0.8 times or less the thickness T3 of the substrate 2, warping of the substrate 1 with a built-in magnetic material can be suppressed.
  • the magnetic resin composition 30 is less likely to remain on the first main surface 21 of the substrate 1 with a built-in magnetic body at the stage after hot pressing, so that the isotropy of the substrate 1 with a built-in magnetic body is maintained and warping is reduced. be done.
  • the magnetic sheet 3 is laminated on the first main surface 21 of the substrate 2 to form a laminate 4 (see FIG. 1B). Specifically, the magnetic sheet 3 covers the through hole 20 opening in the first main surface 21 . In this manner, the magnetic sheet 3 exists on the Z-axis positive side of the plurality of through holes 20 at the stage before hot pressing.
  • release films 6 are laminated on both sides of the laminate 4 .
  • the release film 6 include, but are not particularly limited to, a PET film, a fluororesin film, and the like.
  • the release film 6 includes a first release film 61 and a second release film 62 .
  • the first release film 61 is overlaid on the surface of the laminate 4 (specifically, the magnetic sheet 3) facing the positive direction of the Z axis.
  • the second release film 62 is overlaid on the surface of the laminate 4 (specifically, the second metal layer 52) facing in the negative Z-axis direction.
  • the through-holes 20 are filled with the magnetic resin composition 30 by hot-pressing the laminate 4 in the thickness direction (Z-axis direction) in an atmosphere under reduced pressure. (See FIGS. 1B and 1C).
  • the magnetic resin composition 30 can be applied to the plurality of through holes 20 simply by hot pressing. Can be filled in bulk. Therefore, it is excellent in workability.
  • the magnetic resin composition 30 inside the through hole 20 is cured to become the filling portion 71 (magnetic material). That is, the filling portion 71 is a cured product of the magnetic resin composition 30 present inside the through-hole 20 .
  • a vacuum hot press, a vacuum laminator, a compression molding device, or the like can be used in the filling step.
  • Post-curing may be performed after the filling step, if necessary.
  • the post-curing conditions are not particularly limited, but are, for example, 130° C. or higher and 200° C. or lower and 0.5 hours or longer and 8 hours or shorter.
  • the degree of pressure reduction is preferably ⁇ 101 kPa or more and ⁇ 50 kPa or less, more preferably ⁇ 101 kPa or more and ⁇ 70 kPa or less in gauge pressure.
  • the gauge pressure is the difference between the absolute pressure and the atmospheric pressure, and is a relative pressure with the atmospheric pressure as a reference of zero pressure.
  • the temperature during hot pressing is preferably 80°C or higher and 220°C or lower, more preferably 130°C or higher and 180°C or lower. Fluidization of the magnetic sheet 3 can be promoted by setting the temperature at the time of hot pressing to 80° C. or higher. On the other hand, by setting the temperature at the time of hot pressing to 220° C. or lower, deformation of the through-holes 20 can be suppressed.
  • the temperature during hot pressing may be constant at a predetermined temperature within the range of 80° C. or higher and 220° C. or lower, or may be increased within the range of 80° C. or higher and 220° C. or lower.
  • the pressure applied to the laminate 4 during hot pressing is preferably 0.5 MPa or more and 20 MPa or less, more preferably 1 MPa or more and 10 MPa or less. Fluidization of the magnetic sheet 3 can be promoted by applying a pressure of 0.5 MPa or more to the laminate 4 during hot pressing. On the other hand, deformation of the through-holes 20 can be suppressed by applying a pressure of 20 MPa or less to the laminate 4 when hot-pressing.
  • the pressure applied to the laminate 4 during hot pressing may be a predetermined constant pressure within the range of 0.5 MPa or more and 5 MPa or less, or may be increased within the range of 0.5 MPa or more and 5 MPa or less.
  • the hot press time is preferably 60 seconds or more and 7200 seconds or less, more preferably 180 seconds or more and 3600 seconds or less.
  • the non-filling portion 72 may remain on the first major surface 21 of the substrate 2 (see FIG. 1C).
  • the non-filling portion 72 is a cured product of the magnetic resin composition 30 existing outside the through-hole 20 .
  • the non-filling portion 72 is removed.
  • the removal method is not particularly limited, but examples thereof include polishing and the like. Polishing is not particularly limited, but examples include polishing with a whetstone, buffing, and the like.
  • the release film 6 is peeled off to expose the non-filling portion 72, and the non-filling portion 72 is removed from the first main surface 21 of the substrate 2 by polishing or the like.
  • a substrate 1 with a built-in magnetic material is obtained (see FIG. 1D).
  • the magnetic material embedded substrate 1 includes a substrate 2 and a magnetic material embedded in the substrate 2 .
  • the magnetic material is the filling portion 71 filled in the through hole 20 .
  • the filling portion 71 is a cured product of the magnetic resin composition 30 .
  • the magnetic sheet 3 is used in this embodiment. That is, the magnetic resin composition 30 is not paste-like but sheet-like. If the magnetic resin composition 30 is in the form of a paste, it is difficult to spread the magnetic resin composition 30 over the entire first main surface 21 of the substrate 2 unless it has a certain degree of fluidity.
  • the magnetic resin composition 30 is sheet-like, the magnetic resin composition 30 can be easily spread over the entire first main surface 21 of the substrate 2 . In other words, the magnetic sheet 3 only needs to be placed on the first major surface 21 of the substrate 2 .
  • the magnetic resin composition 30 is in the form of a sheet, fluidity is not particularly required except when hot-pressing, and the magnetic resin composition 30 may be fluidized when hot-pressing. Therefore, if the magnetic resin composition 30 is in the form of a sheet, it becomes easier to increase the amount of the magnetic powder than in the form of a paste.
  • the magnetic material-embedded substrate 1 in which a magnetic material having a high relative magnetic permeability is embedded.
  • the relative magnetic permeability at 100 MHz of the substrate 1 with a built-in magnetic material is preferably more than 15 and 50 or less, more preferably 20 or more and 50 or less.
  • the relative magnetic permeability at high frequencies is high.
  • An inductor component can be manufactured by processing the substrate 1 with a built-in magnetic material.
  • the method of processing is not particularly limited. Since the magnetic material embedded substrate 1 contains a magnetic material having a high relative magnetic permeability, an inductor component having a high inductance can be obtained by using this magnetic material as a core.
  • the second embodiment differs from the first embodiment in that two magnetic sheets 3 are prepared.
  • the two magnetic sheets 3 are a first magnetic sheet 31 and a second magnetic sheet 32 (see FIG. 2A).
  • the sum of the thickness T31 of the first magnetic sheet 31 and the thickness T32 of the second magnetic sheet 32 is preferably 0.1 to 0.8 times the thickness T2 of the substrate 2, More preferably, it differs from the first embodiment in that it is 0.1 to 0.6 times the thickness T2 of the substrate 2 .
  • the sum of the thickness T31 of the first magnetic sheet 31 and the thickness T32 of the second magnetic sheet 32 is not less than 0.1 times the thickness T2 of the substrate 2, so that the magnetic resin composition 30 can flow into the through-hole 20. Unfilling can be suppressed.
  • the warping of the substrate 1 containing the magnetic material is suppressed. can do. That is, the magnetic resin composition 30 is less likely to remain on the first main surface 21 and the second main surface 22 of the substrate 1 with a built-in magnetic body at the stage after hot pressing, so that the isotropy of the substrate 1 with a built-in magnetic body is improved. is maintained and warpage is reduced.
  • the magnetic sheets 3 are laminated on both sides of the substrate 2 to form the laminate 4 (see FIGS. 2A and 2B).
  • the laminate 4 is formed by stacking the first magnetic sheet 31 on the first main surface 21 of the substrate 2 and stacking the second magnetic sheet 32 on the second main surface 22 of the substrate 2 .
  • the release films 6 are overlaid on both sides of the laminate 4 .
  • the first release film 61 is overlaid on the surface of the laminate 4 (specifically, the first magnetic sheet 31) facing the positive direction of the Z axis.
  • the second release film 62 is overlaid on the surface of the laminate 4 (specifically, the second magnetic sheet 32) facing in the negative Z-axis direction.
  • the filling process of the second embodiment is substantially the same as the filling process of the first embodiment, including conditions such as the degree of pressure reduction.
  • the plurality of through-holes 20 can be made magnetic by simply hot-pressing.
  • the resin composition 30 can be filled all at once. Therefore, workability is further improved.
  • the non-filling portion 72 may remain on the first main surface 21 and the second main surface 22 of the substrate 2 (see FIG. 2C). In the removing step, the non-filling portion 72 is removed.
  • the release film 6 is peeled off to expose the non-filling portion 72, and the non-filling portion 72 is removed from the first main surface 21 and the second main surface 22 of the substrate 2 by polishing or the like. do.
  • the same magnetic material-embedded substrate 1 as in the first embodiment is obtained (see FIG. 2D).
  • the magnetic body-embedded substrate 1 containing a magnetic body with high relative magnetic permeability can be manufactured in the same manner as in the first embodiment. be able to. Furthermore, by processing the substrate 1 with a built-in magnetic material obtained in the second embodiment, an inductor component with high inductance can be obtained as in the first embodiment.
  • the preparation process of the third embodiment is the same as the preparation process of the first embodiment. That is, the substrate 2 and the magnetic sheet 3 are also prepared in the preparation process of the third embodiment (see FIG. 3A).
  • the lamination step of the third embodiment differs from that of the first embodiment in that a frame 8 and a panel 9 are used.
  • the magnetic sheet 3 is laminated on the first main surface 21 of the substrate 2 to form the laminate 4 (see FIG. 3A).
  • the release films 6 (the first release film 61 and the second release film 62) are overlaid on both surfaces of the laminate 4. As shown in FIG.
  • the first release film 61 is also overlaid on the outer surface of the magnetic sheet 3 .
  • the frame 8 is arranged so as to surround the outer periphery of the magnetic sheet 3 in XY plan view. Furthermore, the end plate 9 (first end plate 91) is placed on the surface of the first release film 61 and the frame 8 facing the positive Z-axis direction, and the end plate 9 is placed on the surface of the second release film 62 facing the negative Z-axis direction. (Second panel 92) is stacked.
  • the frame body 8 and the end plate 9 will be described in order below.
  • the frame body 8 is arranged so as to surround the outer periphery of the magnetic sheet 3 in the XY plan view during the lamination process (see FIG. 3A).
  • the material of the frame 8 is not particularly limited, but examples include stainless steel.
  • the frame body 8 is a plate-shaped member having a fitting hole 80 and extending in the X-axis direction and the Y-axis direction.
  • the fitting hole 80 penetrates in the Z-axis direction.
  • the shape of the fitting hole 80 in XY plan view is substantially the same as the shape (outer shape) of the magnetic sheet 3 in XY plan view. For example, if the shape (outer shape) of the magnetic sheet 3 in XY plane view is rectangular, the shape of the fitting hole 80 in XY plane view is also rectangular (see FIG. 3B).
  • the release film 6 (first release film 6 in this embodiment) is placed between the magnetic sheet 3 and the frame 8.
  • a mold film 61) may be interposed.
  • the first release film 61 may be interposed between the outer surface of the magnetic sheet 3 and the inner surface of the fitting hole 80 of the frame 8 . That is, the size of the fitting hole 80 in the XY plane view may be larger than the size of the magnetic sheet 3 in the XY plane view by the thickness of the release film 6 .
  • the shape (outer shape) of the frame body 8 in the XY plan view is rectangular in the present embodiment (see FIG. 3B), but is not particularly limited.
  • the thickness of the frame 8 is the length of the frame 8 in the Z-axis direction.
  • the thickness of the frame 8 is preferably equal to or greater than the thickness T3 of the magnetic sheet 3 .
  • the thickness of the frame 8 is equal to or greater than the thickness T3 of the magnetic sheet 3 .
  • the thickness of the frame 8 is equal to or less than the sum of the thickness T2 of the substrate 2 and the thickness T3 of the magnetic sheet 3 .
  • the end plate 9 is superimposed on the surfaces of the first release film 61 and the frame 8 that face the positive Z-axis and the surface of the second release film 62 that faces the negative Z-axis.
  • the material of the end plate 9 is not particularly limited, examples thereof include stainless steel.
  • the surface of the end plate 9 facing the release film 6 is mirror-polished. As a result, the surface of the laminate 4 is less likely to be scratched during hot pressing, and heat is more easily transferred to the laminate 4 uniformly.
  • the panel 9 includes a first panel 91 and a second panel 92 .
  • the first end plate 91 is overlaid on the first release film 61 .
  • the second end plate 92 is overlaid on the second release film 62 . Note that the end plate 9 can also be used in the first and second embodiments.
  • the filling process of the third embodiment is substantially the same as the filling process of the first embodiment, including conditions such as the degree of pressure reduction.
  • the frame 8 exists so as to surround the outer periphery of the magnetic sheet 3 in the XY plane view, so that the fluidized magnetic sheet 3 is placed on the first main surface 21 of the substrate 2. It suppresses unnecessary flow and makes it easier to apply pressure in the Z-axis direction to the magnetic sheet 3 by hot pressing. Therefore, entry of the magnetic resin composition 30 into the through-holes 20 can be promoted.
  • the magnetic body-embedded substrate 1 in which a magnetic body having a high relative magnetic permeability is built in is similar to the first and second embodiments. can be manufactured.
  • the frame 8 since the frame 8 is used, it is possible to suppress the magnetic resin composition 30 from flowing out from the first main surface 21 of the substrate 2 during hot pressing. That is, at the time of hot pressing, the fluidized magnetic sheet 3 flows on the first main surface 21 of the substrate 2 by the presence of the frame 8 so as to surround the outer periphery of the magnetic sheet 3 in the XY plan view. This makes it easier to apply pressure in the Z-axis direction to the magnetic sheet 3 by hot pressing. Therefore, entry of the magnetic resin composition 30 into the through-holes 20 can be promoted.
  • an inductor component with high inductance can be obtained as in the first and second embodiments.
  • a double-sided metal-clad laminate is used as the substrate 2, but a single-sided metal-clad laminate may be used.
  • Substrate 2 may not have metal layer 5 .
  • release films 6 are placed on both sides of the laminate 4 in the above embodiment, the release films 6 may not be used.
  • one laminated body 4 is hot pressed in the thickness direction (Z-axis direction), but a plurality of laminated bodies 4 are arranged in the thickness direction and hot pressed at once. good too.
  • a plurality of substrates 1 with built-in magnetic bodies can be obtained at once. That is, the productivity of the substrate 1 with a built-in magnetic body can be improved.
  • Substrate As a substrate, a copper-clad laminate (manufactured by Panasonic Corporation, product number “R-1515W”, rectangular, 60 mm ⁇ 60 mm ⁇ 1 mm thick) was prepared. The substrate has through holes (hole diameter: 0.35 mm, pitch: 0.45 mm).
  • Magnetic Sheet A magnetic sheet was obtained by forming a magnetic resin composition into a sheet.
  • the magnetic powder, binder and volatile components contained in the magnetic resin composition are as follows. These contents are as shown in Table 1.
  • the binder also contains an appropriate amount of curing agent and the like.
  • the thickness of the magnetic sheet is 0.5 times the thickness of the substrate.
  • Magnetic paste was obtained by making a magnetic resin composition into a paste.
  • the magnetic powder and binder contained in the magnetic resin composition are as described above. These contents are as shown in Table 1.
  • Magnetic paste was supplied to one side of the substrate, and the through-holes of the substrate were filled with the magnetic paste by vacuum printing using a squeegee to manufacture the substrate with built-in magnetic material.
  • A The through-hole is filled with a filling portion, and almost no unfilling is observed.
  • B The through-hole is filled with a filling portion, but slight unfilling is observed.
  • C Clear unfilling of the through-hole. can be seen.
  • A Virtually no voids are observed in the portion filled with through-holes.
  • B Voids are slightly observed in the portion filled with through-holes.
  • C Voids are clearly observed in the portion filled with through-holes.
  • each example had a higher relative magnetic permeability of the magnetic material embedded in the magnetic material-embedded substrate than each comparative example.
  • Examples 1 to 4 in which the content of volatile components is 0.05 parts by mass or more and 1 part by mass or less with respect to 100 parts by mass of the magnetic resin composition, are more filled than Examples 5 and 6. Good results were obtained in terms of hardness and the presence or absence of voids.

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  • Microelectronics & Electronic Packaging (AREA)
  • Hard Magnetic Materials (AREA)
PCT/JP2022/009382 2021-03-26 2022-03-04 磁性体内蔵基板の製造方法 Ceased WO2022202220A1 (ja)

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Cited By (2)

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WO2024247505A1 (ja) * 2023-05-26 2024-12-05 株式会社レゾナック 磁性ペースト、回路部材、回路部材の製造方法
WO2024252941A1 (ja) * 2023-06-09 2024-12-12 パナソニックＩｐマネジメント株式会社 電子部品内蔵基板の製造方法

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Publication number Priority date Publication date Assignee Title
JP2013212642A (ja) * 2012-04-02 2013-10-17 Panasonic Corp 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ
JP2014187360A (ja) * 2013-02-21 2014-10-02 Ajinomoto Co Inc 部品内蔵回路板の製造方法、および半導体装置
WO2016117237A1 (ja) * 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2017011185A (ja) * 2015-06-24 2017-01-12 株式会社村田製作所 コイル部品の製造方法およびコイル部品
JP2020088285A (ja) * 2018-11-29 2020-06-04 味の素株式会社 基板の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013212642A (ja) * 2012-04-02 2013-10-17 Panasonic Corp 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ
JP2014187360A (ja) * 2013-02-21 2014-10-02 Ajinomoto Co Inc 部品内蔵回路板の製造方法、および半導体装置
WO2016117237A1 (ja) * 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2017011185A (ja) * 2015-06-24 2017-01-12 株式会社村田製作所 コイル部品の製造方法およびコイル部品
JP2020088285A (ja) * 2018-11-29 2020-06-04 味の素株式会社 基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024247505A1 (ja) * 2023-05-26 2024-12-05 株式会社レゾナック 磁性ペースト、回路部材、回路部材の製造方法
WO2024252941A1 (ja) * 2023-06-09 2024-12-12 パナソニックＩｐマネジメント株式会社 電子部品内蔵基板の製造方法

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