JPWO2022202220A1 - - Google Patents

Info

Publication number
JPWO2022202220A1
JPWO2022202220A1 JP2023508908A JP2023508908A JPWO2022202220A1 JP WO2022202220 A1 JPWO2022202220 A1 JP WO2022202220A1 JP 2023508908 A JP2023508908 A JP 2023508908A JP 2023508908 A JP2023508908 A JP 2023508908A JP WO2022202220 A1 JPWO2022202220 A1 JP WO2022202220A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023508908A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202220A1 publication Critical patent/JPWO2022202220A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Hard Magnetic Materials (AREA)
JP2023508908A 2021-03-26 2022-03-04 Pending JPWO2022202220A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021054316 2021-03-26
PCT/JP2022/009382 WO2022202220A1 (ja) 2021-03-26 2022-03-04 磁性体内蔵基板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022202220A1 true JPWO2022202220A1 (https=) 2022-09-29

Family

ID=83396963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508908A Pending JPWO2022202220A1 (https=) 2021-03-26 2022-03-04

Country Status (2)

Country Link
JP (1) JPWO2022202220A1 (https=)
WO (1) WO2022202220A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121175767A (zh) * 2023-05-26 2025-12-19 株式会社力森诺科 磁性浆料、电路部件、电路部件的制造方法
WO2024252941A1 (ja) * 2023-06-09 2024-12-12 パナソニックＩｐマネジメント株式会社 電子部品内蔵基板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013212642A (ja) * 2012-04-02 2013-10-17 Panasonic Corp 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ
JP2014187360A (ja) * 2013-02-21 2014-10-02 Ajinomoto Co Inc 部品内蔵回路板の製造方法、および半導体装置
WO2016117237A1 (ja) * 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2017011185A (ja) * 2015-06-24 2017-01-12 株式会社村田製作所 コイル部品の製造方法およびコイル部品
JP2020088285A (ja) * 2018-11-29 2020-06-04 味の素株式会社 基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013212642A (ja) * 2012-04-02 2013-10-17 Panasonic Corp 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ
JP2014187360A (ja) * 2013-02-21 2014-10-02 Ajinomoto Co Inc 部品内蔵回路板の製造方法、および半導体装置
WO2016117237A1 (ja) * 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2017011185A (ja) * 2015-06-24 2017-01-12 株式会社村田製作所 コイル部品の製造方法およびコイル部品
JP2020088285A (ja) * 2018-11-29 2020-06-04 味の素株式会社 基板の製造方法

Also Published As

Publication number Publication date
WO2022202220A1 (ja) 2022-09-29

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