WO2022201995A1 - Dispositif de traitement de substrat et procédé de traitement de substrat - Google Patents
Dispositif de traitement de substrat et procédé de traitement de substrat Download PDFInfo
- Publication number
- WO2022201995A1 WO2022201995A1 PCT/JP2022/006329 JP2022006329W WO2022201995A1 WO 2022201995 A1 WO2022201995 A1 WO 2022201995A1 JP 2022006329 W JP2022006329 W JP 2022006329W WO 2022201995 A1 WO2022201995 A1 WO 2022201995A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- processing
- dummy
- unit
- dummy substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 1198
- 238000012545 processing Methods 0.000 title claims abstract description 1005
- 238000003672 processing method Methods 0.000 title claims description 3
- 230000004308 accommodation Effects 0.000 claims abstract description 89
- 238000003860 storage Methods 0.000 claims abstract description 56
- 230000032258 transport Effects 0.000 claims description 264
- 238000012546 transfer Methods 0.000 claims description 221
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000005192 partition Methods 0.000 description 60
- 239000007788 liquid Substances 0.000 description 58
- 238000000034 method Methods 0.000 description 41
- 230000008569 process Effects 0.000 description 40
- 238000004140 cleaning Methods 0.000 description 24
- 238000007781 pre-processing Methods 0.000 description 16
- 230000007704 transition Effects 0.000 description 16
- 238000012423 maintenance Methods 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 15
- 238000011084 recovery Methods 0.000 description 13
- 230000007723 transport mechanism Effects 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000004364 calculation method Methods 0.000 description 7
- 230000006872 improvement Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000011282 treatment Methods 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012384 transportation and delivery Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000011418 maintenance treatment Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000013439 planning Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Un dispositif de traitement de substrat comprend : une section de maintien de support qui maintient un support ; un premier groupe d'unités de traitement ; un second groupe d'unités de traitement ; une première section de réception de substrat factice ; une seconde section de réception de substrat factice ; une section de placement de substrat ; une première unité de transport qui transporte un substrat entre une première unité de traitement et la section de placement de substrat et transporte un substrat factice entre la première unité de traitement et la première section de réception de substrat factice ; une deuxième unité de transport qui transporte un substrat entre une seconde unité de traitement et la section de placement de substrat et transporte un substrat factice entre la seconde unité de traitement et la seconde section de réception de substrat factice ; une troisième unité de transport qui transporte un substrat entre le support et la section de placement de substrat ; une section de stockage qui stocke des données comprenant un premier statut qui indique l'état du premier groupe d'unités de traitement et un second statut qui indique l'état du second groupe d'unités de traitement ; une section de préparation de programme qui prépare un programme de transport ; et une section de commande de transport qui commande, en fonction du programme de transport, le transport effectué par la première unité de transport, la deuxième unité de transport et la troisième unité de transport.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202280024044.0A CN117083703A (zh) | 2021-03-23 | 2022-02-17 | 基板处理装置以及基板处理方法 |
| KR1020237026670A KR20230129035A (ko) | 2021-03-23 | 2022-02-17 | 기판 처리 장치 및 기판 처리 방법 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-049170 | 2021-03-23 | ||
| JP2021049170A JP2022147779A (ja) | 2021-03-23 | 2021-03-23 | 基板処理装置および基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022201995A1 true WO2022201995A1 (fr) | 2022-09-29 |
Family
ID=83396883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2022/006329 WO2022201995A1 (fr) | 2021-03-23 | 2022-02-17 | Dispositif de traitement de substrat et procédé de traitement de substrat |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2022147779A (fr) |
| KR (1) | KR20230129035A (fr) |
| CN (1) | CN117083703A (fr) |
| TW (1) | TWI802326B (fr) |
| WO (1) | WO2022201995A1 (fr) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004146450A (ja) * | 2002-10-22 | 2004-05-20 | Tokyo Electron Ltd | 基板処理装置 |
| JP2004304116A (ja) * | 2003-04-01 | 2004-10-28 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2010123733A (ja) * | 2008-11-19 | 2010-06-03 | Tokyo Electron Ltd | 基板処理装置及びその処理方法、並びに記憶媒体 |
| JP2017041506A (ja) * | 2015-08-18 | 2017-02-23 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP2021044482A (ja) * | 2019-09-13 | 2021-03-18 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7091222B2 (ja) * | 2018-10-23 | 2022-06-27 | 株式会社Ｓｃｒｅｅｎホールディングス | 熱処理方法および熱処理装置 |
-
2021
- 2021-03-23 JP JP2021049170A patent/JP2022147779A/ja active Pending
-
2022
- 2022-02-17 KR KR1020237026670A patent/KR20230129035A/ko unknown
- 2022-02-17 WO PCT/JP2022/006329 patent/WO2022201995A1/fr active Application Filing
- 2022-02-17 CN CN202280024044.0A patent/CN117083703A/zh active Pending
- 2022-03-21 TW TW111110277A patent/TWI802326B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004146450A (ja) * | 2002-10-22 | 2004-05-20 | Tokyo Electron Ltd | 基板処理装置 |
| JP2004304116A (ja) * | 2003-04-01 | 2004-10-28 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2010123733A (ja) * | 2008-11-19 | 2010-06-03 | Tokyo Electron Ltd | 基板処理装置及びその処理方法、並びに記憶媒体 |
| JP2017041506A (ja) * | 2015-08-18 | 2017-02-23 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP2021044482A (ja) * | 2019-09-13 | 2021-03-18 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230129035A (ko) | 2023-09-05 |
| CN117083703A (zh) | 2023-11-17 |
| JP2022147779A (ja) | 2022-10-06 |
| TWI802326B (zh) | 2023-05-11 |
| TW202245041A (zh) | 2022-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5212165B2 (ja) | 基板処理装置 | |
| JP5505384B2 (ja) | 基板処理装置、基板処理方法および記憶媒体 | |
| JP2008078616A (ja) | カセット蓄積量を増加させた処理装置 | |
| JP2016201526A (ja) | 基板処理システム | |
| WO2018016257A1 (fr) | Dispositif de traitement de substrat | |
| JP2010245127A (ja) | 基板交換方法及び基板処理装置 | |
| JP2019068058A (ja) | 基板処理装置及び基板処理方法 | |
| JP5610009B2 (ja) | 基板処理装置 | |
| KR102570393B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
| JP2020109786A (ja) | 基板処理装置および基板搬送方法 | |
| WO2022201995A1 (fr) | Dispositif de traitement de substrat et procédé de traitement de substrat | |
| WO2022201887A1 (fr) | Appareil de traitement de substrat et procédé de traitement de substrat | |
| WO2022201953A1 (fr) | Dispositif de traitement de substrat, système de traitement de substrat et procédé de traitement de substrat | |
| JP6656305B2 (ja) | 基板処理装置 | |
| WO2024042815A1 (fr) | Appareil de traitement de substrat | |
| WO2024062695A1 (fr) | Appareil de traitement de substrat | |
| TW202414664A (zh) | 基板處理裝置 | |
| TW202341320A (zh) | 用於混合式基板接合系統的foup或卡匣儲存器 | |
| KR20050102967A (ko) | 기판세정장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22774795 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 20237026670 Country of ref document: KR Kind code of ref document: A |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 1020237026670 Country of ref document: KR |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 202280024044.0 Country of ref document: CN |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 22774795 Country of ref document: EP Kind code of ref document: A1 |