WO2022201995A1 - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method Download PDF

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Publication number
WO2022201995A1
WO2022201995A1 PCT/JP2022/006329 JP2022006329W WO2022201995A1 WO 2022201995 A1 WO2022201995 A1 WO 2022201995A1 JP 2022006329 W JP2022006329 W JP 2022006329W WO 2022201995 A1 WO2022201995 A1 WO 2022201995A1
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WIPO (PCT)
Prior art keywords
substrate
processing
dummy
unit
dummy substrate
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PCT/JP2022/006329
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French (fr)
Japanese (ja)
Inventor
裕司 平藤
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Application filed by 株式会社Ｓｃｒｅｅｎホールディングス filed Critical 株式会社Ｓｃｒｅｅｎホールディングス
Priority to KR1020237026670A priority Critical patent/KR20230129035A/en
Priority to CN202280024044.0A priority patent/CN117083703A/en
Publication of WO2022201995A1 publication Critical patent/WO2022201995A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to an apparatus and method for processing substrates.
  • Substrates to be processed include, for example, semiconductor wafers, FPD (Flat Panel Display) substrates such as liquid crystal display devices and organic EL (Electroluminescence) display devices, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. , photomask substrates, ceramic substrates, solar cell substrates, and the like.
  • This substrate processing apparatus includes a carrier holding section that holds a carrier that accommodates substrates, a plurality of processing units that process the substrates, a transport unit that transports the substrates between the carrier and the processing units, and a control unit. .
  • the control device requests the host device to load the dummy carrier holding the dummy substrate.
  • the transport unit transports the dummy substrate from the dummy carrier to the processing unit. The dummy substrate is used to clean the processing unit.
  • the transport unit includes an indexer robot and a main transport robot, and a delivery unit is arranged between them.
  • the indexer robot transports substrates between the carrier and the transfer unit.
  • the main transport robot transports substrates between the delivery unit and the processing units.
  • the indexer robot takes out the dummy substrate from the dummy carrier and transports it to the transfer unit.
  • the dummy substrate is transferred from the transfer unit to the processing unit by the main transfer robot.
  • the main transport robot takes out the dummy substrate from the processing unit and transports it to the delivery unit.
  • the dummy substrate is transported from the transfer unit to the dummy carrier by the indexer robot.
  • the dummy substrate is introduced from the outside of the substrate processing apparatus, transported to the processing unit along the same path as the product substrate, and then unloaded from the processing unit and accommodated in the dummy carrier. Therefore, both the indexer robot and the main transfer robot are used to transfer the dummy substrates, and the dummy substrates are transferred through the transfer unit. As a result, it interferes with the transportation of the product substrates, and the transportation efficiency of the product substrates deteriorates. As a result, the improvement of productivity is hindered.
  • the transport load of the indexer robot and the main transport robot is heavy, and reducing this load is the key to improving productivity. hold
  • the dummy carrier is loaded into the carrier holding portion, the dummy substrate is transferred from there to the processing unit, and the dummy carrier holds the carrier holding portion until the dummy substrate is housed in the carrier after finishing the processing in the processing unit. occupy. Therefore, since the carrier holding portion continues to be occupied by the dummy carrier, there is a possibility that a waiting time will be required before the product substrates are brought in. Therefore, from this point of view as well, improvement in productivity is hindered.
  • one embodiment of the present invention provides a substrate processing apparatus and a substrate processing method that can perform processing using dummy substrates in a processing unit while reducing the influence on the transportation of product substrates.
  • An embodiment of the present invention is a first processing unit having a carrier holding part that holds a carrier that accommodates a substrate or a dummy substrate, and a plurality of first processing units that process the substrate and perform processing using the dummy substrate.
  • a second processing unit group including a plurality of second processing units that process substrates and perform processing using dummy substrates; a first dummy substrate housing part that houses dummy substrates; a second dummy substrate accommodation portion, a substrate placement portion on which a substrate is placed, the plurality of first processing units, the substrate placement portion and the first dummy substrate accommodation portion are configured to be accessible; a first transport unit for transporting a substrate between the first processing unit and the substrate platform, and transporting a dummy substrate between the plurality of first processing units and the first dummy substrate housing; The second processing unit, the substrate platform and the second dummy substrate housing are configured to be accessible, the substrate is transported between the plurality of second processing units and the substrate platform, and the plurality of A second transport unit that
  • a third transport unit for transporting the substrate between the carrier held by the unit and the substrate platform; a first status representing the state of the first processing unit group; and the state of the second processing unit group.
  • a storage unit for storing data including a second status representing the a substrate processing apparatus comprising: a transport control unit that controls transport of substrates or dummy substrates by the first transport unit, the second transport unit, and the third transport unit according to the transport schedule created by the schedule creation unit.
  • the first status includes a prohibition mode in which the first processing units included in the first processing unit group cannot perform processing on a substrate and processing using a dummy substrate, and and a possible mode in which processing on a substrate and processing using a dummy substrate can be performed in the first processing unit.
  • the second status includes a prohibition mode in which the second processing units included in the second processing unit group cannot perform processing on a substrate and processing using a dummy substrate, and and a possible mode in which processing on a substrate and processing using a dummy substrate can be performed in the second processing unit.
  • the schedule creation unit selects a substrate scheduled to be transported to one of the first processing units of the first processing unit group by the first transport unit. (Particularly, a substrate before being discharged from a carrier) is discarded, and the substrate is planned to be transported by the second transport unit to one of the second processing units of the second processing unit group.
  • the schedule creation unit selects a substrate scheduled to be transported by the second transport unit to one of the second processing units of the second processing unit group. (Particularly, the substrate before being discharged from the carrier) is discarded, and the substrate is transported by the first transport unit to one of the first processing units of the first processing unit group.
  • the substrate processing apparatus is provided with the dummy substrate storage section, when the need arises to use the dummy substrate in the processing unit, the dummy substrate storage section and the processing can be performed without the involvement of the third transfer unit. Dummy substrates can be transported between units.
  • the transport load of the third transport unit can be reduced, it is possible to perform processing using dummy substrates while reducing the influence on transport of product substrates.
  • the transport load of the third transport unit involved in transporting all substrates between the first and second groups of processing units each having a plurality of processing units and the carrier held by the carrier holding part is very high. big. Therefore, by reducing the transport load of the third transport unit, the transport efficiency of product substrates can be improved, and productivity can be improved accordingly.
  • the first and second transport units share the transport of substrates between the first and second processing unit groups and the substrate platform, the transport load is smaller than that of the third transport unit. Therefore, from the viewpoint of production efficiency, the fact that the first and second transport units are in charge of transporting dummy substrates does not pose a big problem.
  • the first and second transport units can access the first and second dummy substrate storage units, respectively, the dummy substrates are transported between the dummy substrate storage unit and the processing unit via the substrate platform. can be done without Therefore, interference between the transportation of the dummy substrate and the transportation of the product substrate can be reduced, so that the transportation efficiency of the product substrate is improved, and accordingly the productivity can be improved.
  • the first transport unit transports dummy substrates between the first dummy substrate storage part and the first processing unit group
  • the second transport unit transports the dummy substrates between the second dummy substrate storage part and the second processing unit group.
  • a dummy substrate is transported between groups.
  • the transfer load of the dummy substrates is distributed, so that the interference between the transfer of the product substrates and the transfer of the dummy substrates is suppressed, and the transfer efficiency of the substrates can be improved. Also by this, productivity can be improved.
  • the carrier holding portion is not occupied for a long time by the dummy carrier that accommodates the dummy substrate. As a result, it is possible to suppress waiting time from being carried in the carrier containing substrates for products, so that it is possible to contribute to an improvement in productivity.
  • the prohibition mode and the enable mode can be individually set for the first processing unit group and the second processing unit group, and these modes are the first statuses corresponding to the first processing unit group. and the second status corresponding to the second processing unit group in the storage unit. That is, for the first processing unit group, a first status indicating the prohibited mode or the enabled mode is stored in the storage section, and for the second processing unit group, the second status indicating the disabled mode or the enabled mode is stored in the storage section. .
  • the prohibition mode is an operating state in which neither substrates nor dummy substrates can be processed in the processing unit group.
  • the enabled mode is an operating state in which a substrate can be processed in the processing unit group and processing using a dummy substrate can be executed.
  • the first group of processing units and the second group of processing units are thus individually in inhibit mode or enable mode. That is, if both the first and second processing unit groups are in enable mode, if both the first and second processing unit groups are in inhibit mode, and if one of the first and second processing unit groups is in enable mode and the other is in prohibited mode.
  • the transfer schedule of the substrates scheduled to be processed by the first processing unit group is changed. Specifically, the transfer schedule of the substrate planned to be transferred to the first processing unit group by the first transfer unit is discarded, and the substrate is transferred to the second processing unit group in the enable mode by the second transfer unit. A new transportation schedule for transportation is created. As a result, the substrate can be transported to the second processing units constituting the second processing unit group by the second transport unit, and can be processed in the second processing units.
  • the transfer schedule of the substrates scheduled to be processed by the second processing unit group is changed. Specifically, the transfer schedule of the substrate planned to be transferred to the second processing unit group by the second transfer unit is discarded, and the substrate is transferred to the first processing unit group in the enable mode by the first transfer unit. A new transportation schedule for transportation is created. As a result, the substrate can be transported by the first transport unit to the processing units constituting the first processing unit group, and thus can be processed by the first processing unit group.
  • the first transfer unit is configured so that it cannot access either the second processing unit or the second dummy substrate accommodation section.
  • the second transport unit is configured so as not to be able to access either the first processing unit or the first dummy substrate accommodation section.
  • the third transport unit transports the dummy substrate between the carrier held by the carrier holding part and the substrate mounting part.
  • the first transport unit transports the dummy substrate among the plurality of first processing units, the substrate platform, and the first dummy substrate housing.
  • the second transport unit transports the dummy substrate between the plurality of second processing units, the substrate platform, and the second dummy substrate housing.
  • the storage unit stores usage history information of the dummy substrates accommodated in the first dummy substrate accommodation unit and usage history information of the dummy substrates accommodated in the second dummy substrate accommodation unit. memorize The substrate processing apparatus determines necessity of replacement of the dummy substrates accommodated in the first dummy substrate accommodation unit and the second dummy substrate accommodation unit based on the usage history information stored in the storage unit. When it is determined that the dummy substrate accommodated in the first dummy substrate accommodation portion needs to be replaced, the first status is set to the prohibition mode, and the dummy substrate accommodated in the second dummy substrate accommodation portion is replaced. a status setting unit that sets the second status to the prohibition mode when it is determined that the second status is necessary.
  • the processing unit group including the processing unit becomes the prohibition mode.
  • the first status and the second status are set individually. Therefore, even if one of the first status and the second status is the prohibited mode, if the other is the possible mode, the status of the possible mode is changed. In the processing unit group, the processing of the substrate and the processing using the dummy substrate can be continued.
  • the schedule creation section creates the first dummy substrate holding section between the carrier held by the carrier holding section and the first dummy substrate accommodation section when the first processing unit group is in the inhibit mode.
  • a dummy substrate is transported by the transport unit and the third transport unit, and when the second processing unit group is in the prohibition mode, the carrier held by the carrier holding part and the second dummy substrate accommodating part move between the carrier holding part and the second dummy substrate accommodating part.
  • a transfer schedule is created for transferring the dummy substrates by the second transfer unit and the third transfer unit.
  • the dummy substrates are loaded into and/or unloaded from the dummy substrate storage units corresponding to the processing unit group in the prohibition mode. Therefore, while product substrates are transported and processed in the processing unit group in the enable mode, dummy substrates are carried into the dummy substrate storage units corresponding to the processing unit groups in the prohibition mode, and dummy substrates are transported from the dummy substrate storage units. The substrate can be carried out. Thus, introduction, ejection or replacement of the dummy substrate can be performed without stopping the operation of the entire substrate processing apparatus. As a result, it is possible to avoid stoppage of production due to the introduction, removal or replacement of dummy substrates, thereby enhancing productivity.
  • the substrate platform includes a first substrate platform accessible by the first transport unit and the third transport unit, and a substrate platform accessible by the second transport unit and the third transport unit. and an accessible second substrate rest.
  • the first transport unit transports the substrate between the plurality of first processing units and the first substrate platform, and the plurality of first processing units, the first substrate platform and the first dummy.
  • a dummy substrate is transported between the substrate housing units.
  • the second transport unit transports the substrate between the plurality of second processing units and the second substrate platform, and the plurality of second processing units, the second substrate platform and the second dummy.
  • a dummy substrate is transported between the substrate housing units.
  • the third transport unit transports substrates and dummy substrates between the carrier held by the carrier holding portion and the first substrate mounting portion, and carries the carrier held by the carrier holding portion and the second substrate. The substrate and the dummy substrate are transported to and from the mounting section.
  • the first substrate platform corresponding to the first processing unit group and the second substrate platform corresponding to the second processing unit group are provided.
  • interference occurs between the substrate transfer to the first processing unit group and the dummy substrate transfer to the first dummy substrate accommodation portion, and the substrate transfer to the second processing unit group and the dummy substrate transfer to the second dummy substrate accommodation portion.
  • substrate transfer efficiency increases, and productivity can be improved.
  • the third transfer unit is configured to be able to access the first dummy substrate accommodation section and the second dummy substrate accommodation section
  • the schedule creation section includes the first processing unit.
  • the third transport unit transports the dummy substrates between the carrier held by the carrier holding portion and the first dummy substrate accommodating portion
  • the second processing unit group is in the prohibition mode.
  • a transfer schedule is created for transferring the dummy substrates by the third transfer unit between the carrier held by the carrier holding portion and the second dummy substrate accommodation portion.
  • the third transfer unit can access the first dummy substrate accommodation portion and the second dummy substrate accommodation portion, the carrier held by the carrier holding portion and the first and second dummy substrate accommodation portions directly, i.e. without the involvement of the first or second main transfer robot.
  • introduction, ejection or replacement of dummy substrates can be performed quickly, and the transfer load of the first and second main transfer robots can be reduced, contributing to improved productivity.
  • the substrate processing apparatus includes a first process block layer and a second process block layer located above the first process block layer, wherein the first process block layer has the second process block layer.
  • One processing unit group is arranged, and the second processing unit group is arranged in the second processing block layer.
  • the substrate processing apparatus includes a first processing block section and a second processing block section positioned to the side of the first processing block section, and the first processing block section includes the A first processing unit group is arranged, and the second processing unit group is arranged in the second processing block portion.
  • the first dummy substrate housing portion and the second dummy substrate housing portion overlap the substrate mounting portion in plan view.
  • the space above or below the substrate mounting portion can be used to dispose the dummy substrate accommodating portion so as to overlap the substrate mounting portion in a plan view.
  • the arrangement in which the dummy substrate accommodating portion overlaps the substrate mounting portion in a plan view is specifically an arrangement in which part or all of the dummy substrate accommodated in the dummy substrate accommodating portion overlaps the substrate held in the substrate mounting portion.
  • the first dummy substrate housing portion and the second dummy substrate housing portion are arranged vertically with the substrate mounting portion interposed therebetween.
  • An embodiment of the present invention includes the steps of: transporting a substrate by a first transport unit between a plurality of first processing units belonging to a first processing unit group and a substrate platform according to a transport schedule; in a processing unit, processing the substrates transported by the first transport unit; and performing processing by the first transport unit between the plurality of first processing units and a first dummy substrate accommodation unit according to the transport schedule. transporting a dummy substrate; performing, in the first processing unit, dummy processing using the dummy substrate transported by the first transport unit; transferring the substrate by a second transfer unit between the second processing unit and the substrate platform; and processing the substrate transferred by the second transfer unit in the second processing unit.
  • a transfer schedule of a substrate planned to be transferred to a unit is discarded, and the substrate is transferred to any one of the first processing unit groups by the first transfer unit. and creating the transfer schedule so that the substrate is transferred to a unit.
  • the step of setting the first status includes storing the dummy substrate in the first dummy substrate housing portion based on usage history information of the dummy substrate housed in the first dummy substrate housing portion. It is determined whether or not the dummy substrate needs to be replaced, and when it is determined that the dummy substrate accommodated in the first dummy substrate accommodation portion needs to be replaced, the first status is set to the prohibition mode.
  • the step of setting the second status determines whether or not the dummy substrate accommodated in the second dummy substrate accommodation portion needs to be replaced based on usage history information of the dummy substrate accommodated in the second dummy substrate accommodation portion. When it is determined that the dummy substrate accommodated in the second dummy substrate accommodating portion needs to be replaced, the second status is set to the prohibition mode.
  • FIG. 1 is an illustrative plan view showing the internal configuration of a substrate processing apparatus according to one embodiment of the present invention.
  • FIG. 2 is a schematic longitudinal sectional view seen from the II-II line of FIG.
  • FIG. 3 is a schematic cross-sectional view seen from line III--III in FIG.
  • FIG. 4 is an illustrative elevation view showing the internal configuration of the processing block as seen from direction IV in FIG.
  • FIG. 5 is a diagram for explaining a configuration example of the substrate platform.
  • FIG. 6 is a diagram for explaining a configuration example of a dummy substrate accommodating portion.
  • FIG. 7 is an illustrative cross-sectional view for explaining a configuration example of the processing unit.
  • FIG. 8 is a block diagram for explaining a configuration related to control of the substrate processing apparatus.
  • FIG. 9 is a flowchart for explaining the operation of the controller related to dummy processing.
  • FIG. 10 is a flow chart for explaining an operation example of the transition of the first status of the first processing block layer and the second status of the second processing block layer, and the change of the transfer schedule based thereon.
  • FIG. 11 is a flow chart for explaining an operation example regarding loading of unused dummy substrates into and unloading of used dummy substrates from the dummy substrate accommodating portion.
  • FIG. 12A is a time chart showing an example of the substrate transfer operation when both the first status and the second status are possible modes.
  • FIG. 12B is a time chart showing an example of the substrate transfer operation when the second status transitions from the enabled mode to the prohibited mode.
  • FIG. 12A is a time chart showing an example of the substrate transfer operation when both the first status and the second status are possible modes.
  • FIG. 12B is a time chart showing an example of the substrate transfer operation when the second status transitions from the enabled mode to the prohibited mode.
  • FIG. 13 is an illustrative longitudinal sectional view showing the internal configuration of a substrate processing apparatus according to another embodiment of the invention.
  • FIG. 14 is an illustrative longitudinal sectional view showing the internal configuration of a substrate processing apparatus according to still another embodiment of the invention.
  • FIG. 15 is an illustrative plan view showing the internal configuration of a substrate processing apparatus according to still another embodiment of the invention.
  • FIG. 1 is an illustrative plan view showing the internal configuration of a substrate processing apparatus according to one embodiment of the present invention.
  • FIG. 2 is a schematic longitudinal sectional view seen from the II-II line of FIG.
  • FIG. 3 is a schematic cross-sectional view seen from line III--III in FIG.
  • FIG. 4 is an illustrative elevation view showing a part of the internal configuration as seen from direction IV in FIG.
  • the substrate processing apparatus 1 includes an indexer block 2 and a processing block 3 adjacent to the indexer block 2 in the lateral direction (first horizontal direction X).
  • the indexer block 2 includes multiple (four in this embodiment) carrier holding portions 25 (load ports) and an indexer robot 26 .
  • carrier holding portions 25 load ports
  • indexer robot 26 the side of the carrier holding portion 25 with respect to the first horizontal direction X may be defined as the front side, and the opposite side may be defined as the rear side.
  • the plurality of carrier holding parts 25 are arranged along the second horizontal direction Y orthogonal to the first horizontal direction X.
  • Each carrier holding portion 25 is configured to receive and hold a carrier C automatically conveyed by a carrier conveying mechanism 300 provided in the factory.
  • Each carrier holding portion 25 is configured to hold one carrier C.
  • the carrier C is a substrate container that accommodates substrates W (product substrates) to be processed.
  • An example of a carrier C is a FOUP (Front Opening Unified Pod).
  • the carrier C is configured to hold a plurality of (for example, 25) substrates W in a stacked state.
  • the carrier C is configured to be able to hold a plurality of substrates W in a horizontal posture in a stacked state along the vertical direction Z when held by the carrier holding portion 25 .
  • the carrier holding portion 25 is an example of a container holding portion that holds the carrier C, which is a substrate container.
  • the substrate W is, for example, a semiconductor wafer.
  • the indexer robot 26 is an example of a third transport unit.
  • the indexer robot 26 accesses the carriers C respectively held by the plurality of carrier holding units 25 , loads and unloads the substrates W, and transfers the substrates W between the carrier holding units 25 and the processing block 3 . It is configured.
  • indexer robot 26 is an articulated arm robot with articulated arm 27 .
  • the indexer robot 26 supports a multi-joint arm 27 connecting a plurality of arms 28, one or more hands 29 coupled to the tip of the multi-joint arm 27, and moves up and down while supporting the multi-joint arm 27. and a base portion 30 that moves.
  • a plurality of arms 28 and hands 29 that constitute the articulated arm 27 are capable of swinging about a vertical swing axis set at each base end.
  • a separate actuator (typically an electric motor) is provided for rocking.
  • the processing block 3 includes a plurality of processing block layers BL and BU stacked in the vertical direction Z.
  • the processing blocks 3 are composed of a first layer (lower layer) of processing blocks (hereinafter referred to as “first processing block layer BL”) and a second layer (upper layer) of processing blocks stacked thereabove. layer (hereinafter referred to as "second processing block layer BU").
  • first processing block layer BL lower layer
  • second processing block layer BU second processing block layer
  • the components of the first processing block layer BL will be referred to by reference numerals having the English letter “L” at the end.
  • reference numerals having the English letter “U” at the end are used. The same applies to reference numerals in the attached drawings.
  • the internal configuration in plan view of the first processing block layer BL and the second processing block layer BU are substantially the same. Therefore, in FIG. 1, it should be noted that the configuration of the first processing block layer BL (arrangement in plan view) is expressed by replacing the English letter "U" at the end of the reference numerals with the English letter "L". want to be
  • the first processing block layer BL includes a plurality (12 in this embodiment) of processing units 11L-13L, 21L-23L, 31L-33L, and 41L-43L (hereinafter collectively referred to as the processing units of the first processing block layer BL). (hereinafter referred to as "processing units 11L-43L”), which constitute a first processing unit group.
  • the first processing block layer BL further includes a substrate placement section 6L, a dummy substrate accommodation section 7L, and a main transfer robot 8L.
  • a plurality of processing units 11L-43L perform processing on the substrate W.
  • each of the processing units 11L-43L is a single-wafer type processing unit that processes substrates W one by one.
  • the substrate platform 6L is a unit for temporarily holding the substrate W transferred between the indexer robot 26 and the first processing block layer BL.
  • the dummy substrate storage unit 7L is a unit for holding the dummy substrates DW usable in the processing units 11L-43L inside the substrate processing apparatus 1, and provides a standby place for the dummy substrates DW.
  • the main transfer robot 8L is configured to be able to access the substrate placement section 6L, the processing units 11L-43L and the dummy substrate accommodation section 7L.
  • the main transport robot 8L transports substrates W between the substrate platform 6L and the processing units 11L-43L, and transports dummy substrates DW between the dummy substrate storage unit 7L and the processing units 11L-43L. This is an example of one transport unit.
  • the dummy substrate DW is a substrate having the same shape (for example, circular shape) and size as the substrate W.
  • the dummy substrate DW is different from the substrate W for the product supplied from the carrier C and is not used for manufacturing the actual product.
  • the dummy substrate DW is introduced into the processing unit 11L-43L in order to perform preprocessing (preparation processing) for preparing the environment in the processing unit 11L-43L, unit cleaning processing for cleaning the inside of the processing unit 11L-43L, and the like. is used. Processing using the dummy substrate DW in this manner is hereinafter referred to as “dummy processing”.
  • the aforementioned pretreatment and unit cleaning treatment are maintenance treatments for maintenance of the treatment units 11L-43L, and the dummy treatment includes such maintenance treatments.
  • the plurality of processing units 11L-43L are arranged on both sides of the transport space 52L along the transport space 52L that provides the transport path 51L along which the substrate W is transported by the main transport robot 8L, and face the transport space 52L.
  • the transfer space 52L has a constant width in the second horizontal direction Y and linearly extends in the first horizontal direction X in a direction away from the indexer block 2 in plan view.
  • the transfer space 52L has a height in the vertical direction Z substantially equal to the height of the first processing block layer BL.
  • a first liquid supply section 91, a first processing unit stack S1L, a first exhaust section 101, a second liquid supply section 92, a second A two-processing unit stack S2L and a second exhaust section 102 are arranged along the transport path 51L.
  • a third exhaust section 103, a third processing unit stack S3L, a third liquid supply section 93, a fourth exhaust section 104, and a fourth processing unit stack S4L. and a fourth liquid supply unit 94 are arranged along the transport path 51L. These are arranged so as to partition a substantially rectangular parallelepiped transfer space 52L.
  • Each of the first to fourth processing unit stacks S1L-S4L includes a plurality of stages (three stages in this embodiment) of processing units 11L-13L, 21L-23L, 31L-33L, and 41L-43L stacked in the vertical direction Z. including.
  • the third processing unit stack S3L faces the first processing unit stack S1L across the transport space 52L.
  • the fourth processing unit stack S4L faces the second processing unit stack S2L across the transport space 52L. Therefore, the plurality of processing units 31L to 33L forming the third processing unit stack S3L face the plurality of stages of processing units 11L to 13L forming the first processing unit stack S1L with the transport space 52L interposed therebetween.
  • the plurality of stages of processing units 41L to 43L forming the fourth processing unit stack S4L face the plurality of stages of processing units 21L to 23L forming the second processing unit stack S2L across the transport space 52L.
  • the first processing block layer BL includes 12 processing units 11L-13L, 21L-23L, 31L-33L, 41L-43L, which are arranged in 3 processing unit stacks S1L-S4L. are arranged separately.
  • the transfer space 52L is partitioned from above by intermediate partitions 16 arranged at positions aligned with the upper surfaces of the uppermost processing units 13L, 23L, 33L, and 43L of each of the processing unit stacks S1L-S4L, and the lowermost processing unit. It is partitioned from below by a lower partition wall 15 arranged at a position aligned with the lower surfaces of 11L, 21, 31L, and 41L. All the processing units 11L-43L have a substrate loading/unloading port 37 that opens at a position facing the transport space 52L.
  • the main transport robot 8L transports the substrate W and the dummy substrate DW through the transport space 52L, and loads/loads the substrate W and the dummy substrate DW to/from each processing unit 11L-43L via the substrate load/unload port 37. Carry out.
  • the substrate platform 6L is arranged between the indexer robot 26 and the main transfer robot 8L. More specifically, the substrate platform 6L is arranged at the end of the transfer space 52L on the indexer robot 26 side in plan view.
  • the substrate mounting section 6L is positioned between the first liquid supply section 91 and the third exhaust section 103.
  • the substrate mounting portion 6L is arranged at a height between the middle partition 16 and the lower partition 15 in the vertical direction Z. As shown in FIG. In this embodiment, the substrate mounting portion 6L is arranged near the middle height of the height range from the middle partition 16 to the upper partition 17 .
  • the vertical position of the substrate platform 6L must be within a height range accessible by the indexer robot 26 and within a height range accessible by the main transfer robot 8L.
  • the substrate platform 6L includes an unprocessed substrate platform 61 on which an untreated substrate W is placed, and a processed substrate platform 62 on which a processed substrate W is placed.
  • the unprocessed substrate mounting part 61 and the processed substrate mounting part 62 are stacked in the vertical direction Z. As shown in FIG. It is preferable that the unprocessed substrate mounting part 61 is arranged on the processed substrate mounting part 62 .
  • the unprocessed substrate platform 61 and the processed substrate platform 62 are arranged along the first horizontal direction X on both the indexer robot 26 side and the main transfer robot 8L side.
  • boxes 63,64 open to the outside and substrate holding shelves 65,66 located inside the boxes 63,64.
  • the substrate holding shelves 65 and 66 have a plurality of (for example ten) substrate supporting members 67 and 68 arranged in the vertical direction Z. As shown in FIG.
  • Each of the substrate support members 67 and 68 is configured to support the peripheral portion of the lower surface of one substrate W from below and hold the substrate W in a horizontal posture.
  • the unprocessed substrate platform 61 and the processed substrate platform 62 hold a plurality of (for example, 10) substrates W on their substrate holding shelves 65 and 66 in the vertical direction Z in a horizontal posture. It can be held in a state of being laminated with a space therebetween.
  • a window 4L corresponding to the substrate platform 6L is formed so as to penetrate the rear partition 2a of the indexer block 2 and the front partition 3a of the processing block 3, that is, the adjacent partitions. It is The indexer robot 26 can access the substrate platform 6L through the window 4L to load/unload the substrate W onto/from the substrate platform 6L.
  • the dummy substrate housing portion 7L is provided at a height different from that of the substrate mounting portion 6L, and is arranged below the substrate mounting portion 6L in the transfer space 52L in this embodiment.
  • substrate accommodating parts are provided so that it may overlap with the board
  • the dummy substrate accommodation section 7L is arranged between the lower partition 15 and the middle partition 16, and is arranged within a height range accessible by the main transfer robot 8L.
  • a rear partition wall 2a of the indexer block 2 and a front partition wall 3a of the processing block 3, that is, adjacent partition walls thereof, are located in front of the dummy substrate housing portion 7L, that is, on the indexer block 2 side. These partition walls are not provided with windows corresponding to the dummy substrate housing portions 7L. Therefore, in this embodiment, the indexer robot 26 cannot access the dummy substrate accommodation portion 7L.
  • the configuration of the dummy substrate holding shelf 71 may be substantially the same as the configuration of the substrate holding shelves 65 and 66 of the substrate mounting portion 6L. However, the number of dummy substrates DW that can be held by the dummy substrate holding shelf 71 does not need to be equal to the number of substrates that the substrate holding shelves 65 and 66 can hold.
  • the dummy substrate holding shelf 71 has a plurality of (for example, 12) dummy substrate supporting members 72 arranged in the vertical direction. Each dummy substrate supporting member 72 is configured to support the peripheral portion of the lower surface of one dummy substrate DW from below and hold the dummy substrate DW in a horizontal posture.
  • the dummy substrate housing portion 7L can hold a plurality of (for example, 12) dummy substrates DW on the dummy substrate holding shelf 71 in a state in which they are stacked in the vertical direction Z at intervals in a horizontal posture.
  • the dummy substrate housing portion 7L is composed of a plurality of stages (in this embodiment, the processing units provided in the first processing block layer BL) stacked in the vertical direction so as to house each one dummy substrate DW in a horizontal posture. ) slots (hereinafter referred to as “dummy board slots DL1 to DL12”).
  • a dummy substrate sensor (not shown) may be provided for detecting the presence or absence of the dummy substrate DW in each of the dummy substrate slots DL1-DL12.
  • the dummy substrate accommodation portion 7L does not have a box surrounding the accommodated dummy substrate DW. Of course, there is no problem even if such a box is provided.
  • the main transfer robot 8L is arranged within the transfer space 52L.
  • the main transport robot 8L includes a hand 81 that holds one substrate in a horizontal posture, and a hand drive mechanism 82 that drives the hand 81 .
  • a plurality of (for example, two) hands 81 may be provided.
  • the hand driving mechanism 82 can move the hand 81 in the horizontal directions X and Y and the vertical direction Z, and rotate the hand 81 around the vertical rotation axis.
  • the hand drive mechanism 82 includes two posts 83 , a vertical movement section 84 , a horizontal movement section 85 , a rotation section 86 and an advance/retreat section 87 .
  • a hand 81 is coupled to the advance/retreat portion 87 .
  • the two struts 83 are spaced apart along the first horizontal direction X and fixed to the side walls of the transfer space 52L.
  • the two struts 83 extend along the vertical direction Z and function as rails that guide the vertical movement of the vertical movement section 84 .
  • the vertical moving part 84 has the form of a rail extending in the first horizontal direction X across the two posts 83 and having both ends coupled to the two posts 83 .
  • the vertical moving part 84 is configured to move vertically with respect to the two columns 83 while being guided by the columns 83 .
  • the horizontal moving part 85 is supported on the vertical moving part 84 and configured to move in the first horizontal direction X with respect to the vertical moving part 84 while being guided by the vertical moving part 84 .
  • a rotating portion 86 is supported by the horizontal moving portion 85 .
  • the rotating portion 86 is configured to rotate about a vertical axis of rotation on the horizontal moving portion 85 .
  • a retractable portion 87 is coupled to the rotating portion 86 .
  • the advance/retreat portion 87 advances/retreats horizontally with respect to the axis of rotation, thereby moving the hand 81 horizontally.
  • the main transport robot 8L can transfer the substrate W to and from the substrate platform 6L by allowing the hand 81 to access the substrate platform 6L.
  • the main transfer robot 8L further accesses any processing unit 11L-43L in the first processing block layer BL with the hand 81 to transfer the substrate W or the dummy substrate DW to and from the processing unit 11L-43L. It can be carried out.
  • the main transfer robot 8L can access the dummy substrate housing portion 7L with the hand 81 to transfer the dummy substrate DW to and from the dummy substrate housing portion 7L.
  • the main transfer robot 8L moves the substrate W or the dummy substrate DW held by the hand 81 between the substrate platform 6L, the processing units 11L to 43L, and the dummy substrate accommodation portion 7L in the first processing block layer BL. can be transported.
  • the configuration of the second processing block layer BU is almost the same as the configuration of the first processing block layer BL, so below, duplicate descriptions will be omitted as much as possible, and different configurations will be mainly described.
  • the configuration of the elements with the same names as in the case of the first processing block layer BL is substantially the same.
  • the second processing block layer BU includes a plurality of (12 in this embodiment) processing units 11U-13U, 21U-23U, 31U-33U, and 41U-43U (hereinafter collectively referred to as the processing units of the second processing block layer BU). (hereinafter referred to as "processing units 11U-43U"), which constitute a second processing unit group.
  • the second processing block layer BU further includes a substrate placement section 6U, a dummy substrate accommodation section 7U, and a main transfer robot 8U.
  • the first to fourth liquid supply units 91-94 and the first to fourth exhaust units 101-104 are arranged to extend in the vertical direction Z across the first processing block layer BL and the second processing block layer BU.
  • the arrangement of the plurality of processing units 11U-43U in the second processing block layer BU is substantially the same as the arrangement of the plurality of processing units 11L-43L in the first processing block layer BL.
  • the second processing block layer BU includes first to fourth processing unit stacks S1U-S4U, each of which is a plurality of (three in this embodiment) processing units 11U-13U and 21U- stacked in the vertical direction Z. 23U, 31U-33U, 41U-43U.
  • the first to fourth processing unit stacks S1U to S4U of the second processing block layer BU are arranged to overlap the first to fourth processing unit stacks S1L to S4L of the first processing block layer BL, respectively.
  • the first processing unit stacks S1L and S1U of the first and second processing block layers BL and BU are stacked in the vertical direction Z to form a plurality of stages (six stages in this embodiment) of processing units 11L, 12L
  • a first tower T1 is formed by stacking 13L, 11U, 12U, and 13U.
  • the second processing unit stacks S2L and S2U of the first and second processing block layers BL and BU are stacked in the vertical direction Z to form a plurality of (six in this embodiment) processing units 21L and 22L.
  • 23L, 21U, 22U, and 23U are stacked to form a second tower T2.
  • the third processing unit stacks S3L and S3U of the first and second processing block layers BL and BU are stacked in the vertical direction Z to form a plurality of stages (six stages in this embodiment) of processing units 31L, 32L
  • a third tower T3 is formed by stacking 33L, 31U, 32U, and 33U.
  • the fourth processing unit stacks S4L and S4U of the first and second processing block layers BL and BU are stacked in the vertical direction Z to form a plurality of stages (six stages in this embodiment) of processing units 41L,
  • a fourth tower T4 is formed by stacking 42L, 43L, 41U, 42U, and 43U.
  • the transfer space 52U in the second processing block layer BU is partitioned from below by the middle partition 16 and partitioned from above by the upper partition 17 .
  • the upper partition wall 17 is arranged at a height aligned with the upper surfaces of the uppermost processing units 13U, 23U, 33U, 43U of the first to fourth towers T1-T4.
  • the arrangement of the substrate mounting portion 6U in plan view is the same as in the case of the first processing block layer BL. That is, the substrate platform 6U is arranged between the indexer robot 26 and the main transfer robot 8U, and is arranged at the end of the transfer space 52U on the indexer robot 26 side.
  • the substrate mounting portion 6U of the second processing block layer BU is arranged so as to overlap with the substrate mounting portion 6L of the first processing block layer BL in plan view.
  • the substrate mounting portion 6U is arranged at a height between the intermediate partition wall 16 and the upper partition wall 17 in the vertical direction Z. As shown in FIG. In this embodiment, the substrate mounting portion 6U is arranged below the middle height of the height range from the middle partition 16 to the upper partition 17 .
  • the substrate platform 6U is arranged at the highest position within a height range accessible by the indexer robot 26. As shown in FIG. The vertical position of the substrate platform 6U must be within a height range accessible by the indexer robot 26 and within a height range accessible by the main transfer robot 8U.
  • the substrate platform 6U includes an unprocessed substrate platform 61 on which an unprocessed substrate W is placed and an unprocessed substrate platform 61 on which a processed substrate W is placed. and a substrate mounting portion 62 .
  • the configurations of the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 are the same as those of the substrate mounting portion 6L of the first processing block layer BL (see FIG. 5).
  • a window 4U corresponding to the substrate platform 6U is formed so as to penetrate the rear partition 2a of the indexer block 2 and the front partition 3a of the processing block 3, that is, the adjacent partitions.
  • the indexer robot 26 can access the substrate platform 6U through the window 4U to load/unload the substrate W onto/from the substrate platform 6U.
  • the dummy substrate housing portion 7U is provided at a height different from that of the substrate mounting portion 6U, and is arranged above the substrate mounting portion 6U in the transfer space 52U in this embodiment.
  • the dummy substrate housing portion 7U is provided so as to overlap with the substrate mounting portion 6U in plan view. More specifically, when the substrate W is held by the substrate mounting portion 6U and the dummy substrate DW is held by the dummy substrate housing portion 7U, the substrate W and the dummy substrate DW are arranged to overlap each other in plan view.
  • a dummy substrate housing portion 7U is arranged.
  • Overlapping of the substrate W and the dummy substrate DW in a plan view may be a partial overlapping or an overall overlapping, that is, the dummy substrate DW may overlap the substrate W almost entirely.
  • the dummy substrate housing portion 7U is arranged at a height between the upper partition 17 and the middle partition 16, and is arranged within a height range accessible by the main transfer robot 8U.
  • a rear partition wall 2a of the indexer block 2 and a front partition wall 3a of the processing block 3, that is, adjacent partition walls thereof, are arranged in front of the dummy substrate accommodating portion 7U, that is, on the indexer block 2 side.
  • These partition walls 2a and 3a are not provided with windows corresponding to the dummy substrate housing portions 7U. Therefore, the indexer robot 26 cannot access the dummy substrate accommodation section 7U.
  • the configuration of the dummy substrate accommodation portion 7U may be substantially the same as the configuration of the dummy substrate accommodation portion 7L of the first processing block layer BL (see FIG. 6).
  • the dummy substrate housing portion 7U has a plurality of stages (in this embodiment, the number of processing units provided in the second processing block layer BU) stacked vertically so as to horizontally accommodate one dummy substrate DW each. ) slots (hereinafter referred to as “dummy substrate slots DU1 to DU12”).
  • a dummy substrate sensor may be provided for detecting the presence or absence of the dummy substrate DW in each of the dummy substrate slots DU1-DU12.
  • the main transfer robot 8U is arranged in the transfer space 52U.
  • the main transport robot 8U includes a hand 81 that holds one substrate in a horizontal posture, and a hand driving mechanism 82 that drives the hand 81 .
  • the hand driving mechanism 82 includes two support columns 83 , a vertical moving section 84 , a horizontal moving section 85 , a rotating section 86 and an advancing/retreating section 87 . These configurations are the same as those of the main transfer robot 8L of the first processing block layer BL.
  • the main transfer robot 8U is configured to be able to access the substrate placement section 6U, the processing units 11U to 43U and the dummy substrate accommodation section 7U.
  • the main transport robot 8U transports substrates W between the substrate platform 6U and the processing units 11U-43U, and transports dummy substrates DW between the dummy substrate storage unit 7U and the processing units 11U-43U. This is an example of two transport units.
  • the first processing block layer BL and the second processing block layer BU are separated by an intermediate partition wall 16, and the product substrate W or the dummy substrate DW cannot be transported over the intermediate partition wall 16.
  • the main transfer robot 8L on the first processing block layer BL cannot access any of the processing units 11U to 43U, the dummy substrate storage unit 7U, and the substrate platform 6U on the second processing block layer BU. It is configured.
  • the main transfer robot 8U of the second processing block layer BU cannot access any of the processing units 11L-43L, the dummy substrate storage section 7L, and the substrate placement section 6L of the first processing block layer BL. It has become.
  • the liquid supply units 91-94 define a liquid piping space for accommodating piping for supplying the processing liquid used in the processing units 11L-43L; 11U-43U.
  • a liquid piping space defined by each of the liquid supply units 91 to 94 penetrates in the vertical direction Z through the first processing block layer BL and the second processing block layer BU.
  • Each of the liquid supply units 91-94 has six processing units 11L, 12L, 13L, 11U, 12U, 13U; , 22L, 23L, 21U, 22U, 23U; 31L, 32L, 33L, 31U, 32U, 33U; 41L, 42L, 43L, 41U, 42U, 43U.
  • the liquid supply units 91 to 94 further accommodate processing liquid-related equipment such as valves, a flow meter, a tank for temporarily storing the processing liquid, and a pump for feeding the liquid, which are provided in the piping. may be
  • the exhaust units 101 to 104 define an exhaust piping space that accommodates piping for exhausting the atmosphere inside the processing unit.
  • the exhaust piping space defined by each of the exhaust sections 101 to 104 penetrates in the vertical direction Z through the first processing block layer BL and the second processing block layer BU.
  • Each of the exhaust units 101-104 has six processing units 11L, 12L, 13L, 11U, 12U, 13U; , 22L, 23L, 21U, 22U, 23U; 31L, 32L, 33L, 31U, 32U, 33U;
  • An exhaust pipe 76 is accommodated.
  • the exhaust units 101 to 104 may further accommodate a switching mechanism 77 for switching the exhaust pipe 76 according to the type of processing (more specifically, the type of processing liquid) in the processing unit.
  • the exhaust section 101 includes actuators that drive the switching mechanism 77 .
  • the carrier transport mechanism 300 (see FIG. 1) carries the carrier C containing the unprocessed product substrates W into the carrier holding part 25 and carries out the carrier C containing the processed product substrates W from the carrier holding part 25. works like Further, the carrier transport mechanism 300 loads the supply dummy carrier DC containing the unused dummy substrates DW into the carrier holding unit 25, and after the unused dummy substrates DW are discharged from the supply dummy carrier DC, , to carry out the dummy carrier DC from the carrier holding portion 25 . Further, the carrier transport mechanism 300 carries a recovery dummy carrier DC for recovering the used dummy substrate DW into the carrier holding unit 25, and the used dummy substrate DW is accommodated in the recovery dummy carrier DC. Later, the recovery dummy carrier DC is carried out from the carrier holding portion 25 .
  • the dummy carrier DC may have substantially the same configuration as the carrier C for the product substrates W;
  • the carrier transport mechanism 300 typically includes an overhead hoist transport (OHT).
  • OHT overhead hoist transport
  • the carrier transport mechanism 300 transports the carrier C between the carrier storage space 350 and the carrier holding section 25 (load port). Also, the carrier transport mechanism 300 transports the dummy carrier DC between the dummy carrier storage place 351 and the carrier holding section 25 .
  • the carrier transport mechanism 300 is controlled by the host computer 150 and transports the carrier C and the dummy carrier DC.
  • the host computer 150 is communicably connected to the controller 110 of the substrate processing apparatus 1 via a communication line 170 .
  • the controller 110 controls the indexer robot 26 and the main transport robots 8L and 8U to transport the substrate W and the dummy substrate DW. Further, the controller 110 controls each part of the processing units 11L-43L and 11U-43U to execute substrate processing and dummy processing using the dummy substrate DW in the processing units 11L-43L and 11U-43U.
  • FIG. 7 is an illustrative cross-sectional view for explaining a configuration example of the processing units 11L-43L; 11U-43U (hereinafter collectively referred to as "processing units 11L-43U").
  • the processing units 11L-43U include a unit partition 36 forming a processing chamber 35 (chamber), a processing cup 39 arranged in the unit partition 36, a spin chuck 40 arranged in the processing cup 39, and a spin chuck 40 and a nozzle 55 for supplying the processing liquid to the substrate W or the dummy substrate DW held in the substrate.
  • the unit partition wall 36 includes, for example, a side wall 36a that is substantially rectangular in plan view, a ceiling wall 36b that partitions the upper portion, and a bottom wall 36c that partitions the lower portion.
  • One surface of the side wall 36a faces the transfer space 52U, extends along the first horizontal direction X and the vertical direction Z, and has a substrate loading/unloading port 37 for loading/unloading the substrate W and the dummy substrate DW. is doing.
  • the substrate loading/unloading port 37 may have a slot shape extending in the first horizontal direction X.
  • a shutter 38 is arranged for opening and closing the substrate loading/unloading port 37 .
  • the substrate W and the dummy substrate DW are loaded from a substrate loading/unloading port 37 formed in the unit partition 36 and transferred to the spin chuck 40 .
  • the spin chuck 40 includes a spin base 45 that holds one substrate W or dummy substrate DW in a horizontal posture, and a spin motor 46 that rotates the spin base 45 around a vertical rotation axis.
  • the spin chuck 40 may be of a vacuum type that holds the lower surface of the substrate W or the dummy substrate DW by suction on the upper surface of the spin base 45 .
  • the spin base 45 has a circular planar shape corresponding to the substrate W and the dummy substrate DW, and has three or more holding pins provided at intervals in the circumferential direction on the periphery thereof.
  • a mechanical chuck that grips the substrate W or the dummy substrate DW with pins may be configured.
  • the processing unit 11L-43U includes one or more nozzles 55 for supplying the processing liquid to the substrate W held by the spin chuck 40 or the dummy substrate DW.
  • multiple nozzles 55 are provided. These multiple nozzles 55 may include multiple chemical liquid nozzles that are used to eject multiple types of chemical liquids, respectively.
  • a processing liquid is supplied from the nozzle 55 to the surface of the substrate W or the dummy substrate DW held and rotated by the spin chuck 40 .
  • Nozzle 55 is coupled to processing liquid tubing 56 that is routed through liquid supplies 91-94.
  • the processing liquid pipe 56 is routed through the liquid supplies 91 - 94 and connected to the processing liquid supply source 54 .
  • a valve 59 for opening and closing the flow path is interposed in the middle of the treatment liquid pipe 56 .
  • a pump 60 for sending the processing liquid toward the nozzle 55 is interposed in the middle of the processing liquid pipe 56 .
  • Valves 59 and pumps 60 are located at liquid supplies 91-94.
  • the processing liquid supply source 54 supplies a chemical liquid such as an etchant and a rinse liquid such as pure water (deionized water).
  • multiple processing liquid lines 56 and corresponding multiple nozzles 55 may be provided.
  • Some or all of the plurality of nozzles 55 may have the form of moving nozzles that move along the upper surface of the substrate W or the dummy substrate DW above the substrate W or the dummy substrate DW.
  • the movable nozzle has a structure in which the base end of a horizontal nozzle arm 57 is supported by a swing shaft 58 arranged on the side of the spin chuck 40, and the swing shaft 58 is rotated around the vertical axis. (see Figure 1).
  • Some or all of the plurality of nozzles 55 may be fixed nozzles whose relative positions to the spin chuck 40 remain unchanged.
  • the atmosphere inside the unit partition 36 is exhausted through the exhaust connection pipe 75 penetrating the unit partition 36 .
  • the exhaust connection pipe 75 is connected to an exhaust pipe 76 arranged in the exhaust sections 101-104.
  • the exhaust connection pipe 75 may be connected to a plurality of exhaust pipes 76 via a switching mechanism 77 .
  • the switching mechanism 77 switches the exhaust gas from the exhaust connection pipe 75 to an exhaust gas pre-associated with the type of processing liquid in accordance with the type of processing liquid (for example, the type of chemical liquid) discharged from the plurality of nozzles 55 . It operates to lead to piping 76 .
  • FIG. 8 is a block diagram for explaining the control configuration of the substrate processing apparatus 1.
  • the substrate processing apparatus 1 has a controller 110 .
  • Controller 110 may be a computer including processor 111 (CPU) and memory 112 (storage unit).
  • Processor 111 executes program 120 stored in memory 112 .
  • the controller 110 functions as a schedule creating unit that creates a transport schedule for the substrate transport operation of transporting the substrate W and the dummy substrate DW by the indexer robot 26 and the main transport robots 8L and 8U. It also functions as a transport control unit that controls the transport of the substrate W and the dummy substrate DW based on the transport schedule.
  • the controller 110 has a function as a substrate processing control section that realizes a substrate processing operation for processing the substrate W by the processing units 11L-43U.
  • the controller 110 further has a function as a dummy processing control section that realizes a dummy processing operation of executing dummy processing using the dummy substrates DW in the processing units 11L-43U.
  • the controller 110 controls various control objects provided in the substrate processing apparatus 1 for these substrate transport operations, substrate processing operations, and dummy processing operations.
  • the objects to be controlled include the drive units provided in the indexer robot 26, the main transfer robots 8L and 8U, the processing units 11L-43U, and the like.
  • objects controlled by the controller 110 include the valves 59 and the pumps 60 arranged in the liquid supply units 91-94, and actuators arranged in the exhaust units 101-104.
  • the data 130 includes product recipes 131 for processing substrates W for production and dummy processing recipes 132 for dummy processing using dummy substrates DW.
  • the product recipe 131 is data that defines the transport operation of the substrate W and the processing details for the substrate W.
  • the dummy processing recipe 132 is data that defines the transfer operation of the dummy substrate DW and the processing content using the dummy substrate DW.
  • the controller 110 controls the controlled object according to the product recipe 131 when processing the substrate W, and controls the controlled object according to the dummy processing recipe 132 when executing the dummy processing.
  • the product recipe 131 may be provided by data communication from a host computer 150 communicatively connected to the controller 110 and stored in the memory 112 .
  • Dummy processing recipes 132 may likewise be communicated from host computer 150 and stored in memory 112 .
  • these recipes 131 and 132 may be input or edited by an operator using a user interface 140 connected to the controller 110 .
  • the dummy processing recipe 132 may be automatically generated by the controller 110 according to the content of the product recipe 131 .
  • Both the product recipe 131 and the dummy process recipe 132 need not be of one type, and multiple product recipes 131 or multiple dummy process recipes 132 may be stored in the memory 112 .
  • the dummy processing recipe 132 includes a preprocessing recipe that defines preprocessing for performing the same processing on the dummy substrate DW as that for the product substrate W.
  • the pretreatment recipe may be a recipe obtained by replacing the product substrate W with the dummy substrate DW in the product recipe 131 as the substrate to be carried into the processing unit 11L-43U.
  • Such a pretreatment recipe may be automatically generated by controller 110 based on product recipe 131 . For example, when a process of supplying a high-temperature processing liquid to the substrate W is performed, the high-temperature processing liquid can be guided to the nozzle 55 by performing preprocessing, and the high-temperature processing liquid can be applied to the pipe 56 and the processing liquid.
  • the interior of unit 11L-43U can be heated.
  • the processing liquid at an appropriate temperature can be supplied to the product substrate W in an environment in which the temperature is appropriately controlled.
  • the pretreatment is an example of preparatory processing for preparing the processing environment of the processing units 11L-43U so as to properly process the substrate W for the product.
  • the dummy processing recipe 132 includes a unit cleaning recipe for cleaning the inside of the processing units 11L-43U while holding the dummy substrate DW on the spin chuck 40.
  • FIG. In the unit cleaning process performed according to the unit cleaning recipe, the spin chuck 40 holds and rotates the dummy substrate DW, and in this state, a cleaning liquid (chemical or pure water) is supplied to the dummy substrate DW. As a result, the cleaning liquid subjected to centrifugal force on the dummy substrate DW scatters around the spin chuck 40 and cleans the inside of the processing cup 39 .
  • a cleaning liquid chemical or pure water
  • the incident position of the cleaning liquid on the inner wall surface of the processing cup 39 changes up and down, so that the inner wall surface of the processing cup 39 can be cleaned efficiently.
  • the dummy substrate DW is arranged above the upper end of the processing cup 39 by the vertical movement of the processing cup 39 or the vertical movement of the spin chuck 40, and the cleaning liquid is supplied to the inside of the processing chamber 35 outside the processing cup 39 to perform processing.
  • the interior of chamber 35 can also be cleaned.
  • the data 130 stored in the memory 112 further includes a dummy board table 133 that associates the plurality of processing units 11L-43U with the dummy board slots DL1-DL12, DU1-DU12 of the dummy board storage units 7L, 7U.
  • a unique dummy board slot number (dummy board slot identification information) is assigned to each of the plurality of dummy board slots DL1 to DL12 and DU1 to DU12.
  • One dummy substrate slot number is associated with each processing unit 11L-43U.
  • the dummy substrate table 133 includes a plurality (12 in this embodiment) of the processing units 11L-43U of the first processing block layer BL and a plurality of (12 in this embodiment) of the dummy substrate housing portions 7L of the first processing block layer BL. 12) dummy substrate slot numbers are associated one-to-one.
  • the dummy substrate table 133 includes a plurality of (12 in this embodiment) processing units 11L-43U of the second processing block layer BU and a plurality of (in this embodiment, 12) dummy substrate storage units 7U of the second processing block layer BU. 12 in the form) are associated one-to-one with the dummy board slot numbers.
  • the dummy substrate table 133 includes a plurality of (24 in this embodiment) processing units 11L-43U provided in the substrate processing apparatus 1 and a plurality of (24 in this embodiment) slots of the dummy substrate storage units 7L and 7U. numbers are associated one-to-one.
  • the data 130 stored in the memory 112 further includes dummy board history data 134 .
  • the dummy board history data 134 is data representing the usage history of the dummy boards DW accommodated in the dummy board slots DL1 to DL12 and DU1 to DU12 corresponding to the plurality of dummy board slot numbers of the dummy board accommodation units 7L and 7U. historical information).
  • the usage history includes the number of times the dummy substrate DW was used for processing in the processing units 11L-43U (cumulative count), the usage time (cumulative time) during which the dummy substrate DW was used for processing in the processing units 11L-43U, It is preferable that the dummy substrate DW contains at least one history of processing details received in the processing units 11L-43U.
  • the data 130 stored in the memory 112 further includes unit usage history data 135 representing the unit usage history of each of the processing units 11L-43U.
  • Unit usage history data 135 preferably includes the number of substrates processed by each processing unit 11L-43U and the non-use duration representing the continuous time during which each processing unit 11L-43U is not used for substrate processing. Since the internal environment of the processing units 11L-43U gradually deteriorates as substrate processing is repeated, it is preferable to set an appropriate upper limit for the number of substrates that can be processed continuously without requiring maintenance. In addition, the internal environment of the processing units 11L-43U gradually deteriorates as the time during which the substrates W are not processed increases.
  • the chemical liquid adhering to the inner wall or the like of the processing cup 39 may dry and crystallize, causing particles.
  • the temperature of the pipe 56 or the nozzle 55 decreases when the flow of the processing liquid is interrupted for a long time due to continued non-use. Therefore, when the treatment liquid is discharged next time, the heat of the treatment liquid is taken away by the pipe 56 or the nozzle 55, and the temperature of the treatment liquid immediately after the discharge may not be appropriate. Therefore, it is preferable to set an appropriate upper limit for the duration of non-use as well. By comparing the unit usage history data 135 (the number of processed substrates, duration of non-use, etc.) with corresponding set values, it is possible to determine whether or not maintenance is required for the processing units 11L-43U.
  • the data 130 stored in the memory 112 further includes a first status 141 representing the state of the first processing block layer BL (first processing unit group) and a state of the second processing block layer BU (second processing unit group). and a second status 142 representing .
  • the first status 141 includes prohibited mode and enabled mode.
  • the second status 142 includes prohibited mode and enabled mode.
  • the start of processing on the substrate W means unloading (dispensing) the substrate W to be processed by the processing units 11L-43L from the carrier C
  • the start of dummy processing means the processing by the processing units 11L-43L. This means that the dummy substrate DW used for the dummy processing in 43L is unloaded (taken out) from the first dummy substrate housing portion 7L.
  • the start of processing on the substrate W means unloading (dispensing) the substrate W to be processed by the processing units 11U-43U from the carrier C, and the start of dummy processing means the processing units 11U-43U. It means carrying out (discharging) the dummy substrate DW used for the dummy processing in 43U from the second dummy substrate housing portion 7U.
  • the second status 142 is in the enabled mode, both the processing of the substrate W and the dummy processing in the processing units 11U to 43U included in the second processing block layer BU are permitted, and these processing can be newly started.
  • the controller 110 determines whether it is necessary to replace the dummy substrates DW stored in the dummy substrate storage units 7L and 7U. It has a function as a status setting unit that sets the status 142 .
  • FIG. 9 is a flowchart for explaining the operation of the controller 110 related to dummy processing. Controller 110 executes the processing of FIG. 9 in parallel or sequentially for each of the plurality of processing units 11L-43U.
  • the controller 110 determines whether or not the product substrate W is being processed in the target processing unit 11L-43U (step A1).
  • the controller 110 controls the processing unit 11L-43U.
  • the unit usage history data 135 it is determined whether or not the number of processed substrates has reached the set value (step A2).
  • the controller 110 determines that the unit cleaning execution condition (an example of the maintenance execution condition) is satisfied, and cleans the processing units 11L-43U.
  • unit cleaning processing (an example of maintenance processing) is executed according to the unit cleaning recipe (step A3). Further, the controller 110 resets the substrate processing number of the processing unit to an initial value (for example, 0) and updates the unit usage history data 135 (step A4).
  • the unit cleaning process is an example of the dummy process, and includes a transfer schedule creation step A30, a dummy substrate loading step A31, a dummy processing step A32, and a dummy substrate accommodation step A33.
  • the transfer schedule creation step A30 is a step of creating a transfer plan (transfer schedule) for dummy processing.
  • the dummy substrate loading step A31 is a step of controlling the main transport robots 8L and 8U according to the created transport schedule. As a result, the main transport robots 8L and 8U unload the dummy substrates DW from the corresponding dummy substrate slots DL1-DL12 and DU1-DU12, transport them to the processing units 11L-43U, and load them into the processing units.
  • the dummy processing step A32 is a step of executing processing using the dummy substrate DW in the processing unit, and here, cleaning processing of the inside of the processing unit.
  • the dummy substrate accommodation step A33 is a step of carrying out the dummy substrate DW from the processing unit after cleaning the inside of the processing unit and transporting the dummy substrate DW to the original dummy substrate slots DL1 to DL12 and DU1 to DU12 according to the transportation schedule.
  • the controller 110 refers to the dummy substrate table 133, identifies the dummy substrate slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and performs the dummy substrate loading step A31 and the dummy substrate accommodating step A33. create a delivery schedule for
  • the controller 110 determines whether or not preprocessing is necessary to prepare the processing environment (processing conditions) of the processing units 11L-43U (steps A5 and A6). Specifically, the controller 110 checks whether a processing request (processing reservation) for a product substrate has been given from the host computer 150 (step A5). When a product substrate processing request is given (step A5: YES), the controller 110 determines whether the non-use duration of the processing unit 11L-43U has reached a set value (step A6).
  • step A6 determines that pretreatment is necessary, that is, pretreatment execution conditions (an example of maintenance execution conditions) are satisfied.
  • the controller 110 executes pretreatment according to the pretreatment recipe (step A7). Specifically, the controller 110 refers to the dummy substrate table 133 to identify the dummy substrate slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and based thereon, to perform preprocessing. A transportation schedule is created (transportation schedule creation step A70). Then, the controller 110 controls the main transport robots 8L and 8U according to the created transport schedule to carry out the dummy substrate DW from the specified dummy substrate slot, and transports the dummy substrate DW to the processing unit 11L-43U. (dummy substrate loading step A71).
  • the host computer 150 executes the same processing as the product substrate W on the dummy substrate DW in the processing unit 11L-43U (dummy processing step A72).
  • the host computer 150 controls the main transfer robots 8L and 8U according to the transfer schedule to take out the dummy substrate DW from the processing units 11L to 43U, transfer it to the original dummy substrate slot, and transfer the dummy substrate DW to the original dummy substrate slot.
  • the slot accommodates the dummy substrate DW (dummy substrate accommodation step A73).
  • the controller 110 resets the non-use duration to the initial value (for example, 0) and updates the unit usage history data 135 (step A8).
  • the controller 110 executes preprocessing.
  • the preprocessing includes transportation of the dummy substrate DW (step A71) and dummy processing using it (step A72). Therefore, the carrier C containing the product substrates W is held by the carrier holding unit 25, and the indexer robot 26 picks up the substrates W to be processed from the carrier C and transports them to the substrate mounting units 6L and 6U.
  • preprocessing dummy substrate loading step A71 and/or dummy processing step A72
  • the indexer robot 26 is not involved in transporting the dummy substrate DW. Therefore, the dummy substrates DW are transported inside the processing block 3 and the preprocessing is executed without interfering with the transportation of the product substrates W by the indexer robot 26 .
  • FIG. 9 shows the loading step A20 of the product substrate W by the indexer robot 26, but it does not mean that the relationship with the pretreatment step A7 is as illustrated.
  • the product substrate loading step A20 can be performed (started) prior to or in parallel with the preprocessing step A7, and the product substrate loading step A20 is performed after the preprocessing step A7. It may be started (started).
  • the pretreatment recipe defines the pretreatment to be performed on the dummy substrate DW, which should be performed on the product substrate W. Therefore, the dummy substrate DW is consumed by performing the pretreatment on the dummy substrate DW. Specifically, the surface of the dummy substrate DW is etched and the thickness of the dummy substrate DW is reduced by subjecting the dummy substrate DW to pretreatment using a chemical solution having an etching action. Therefore, when the pretreatment recipe is executed, the controller 110 updates the dummy substrate history data 134 of the dummy substrate slots DL1-DL12, DU1-DU12 associated with the processing units 11L-43U (step A9). For example, if the dummy substrate history data 134 includes usage count data, the usage count data is incremented.
  • the controller 110 executes control according to the product recipe (step A12). Specifically, the controller 110 creates a transport schedule for product substrate processing (transport schedule creation step A120), and controls the indexer robot 26 and the main transport robots 8L and 8U according to the transport schedule. Then, the indexer robot 26 picks up the product substrate W from the carrier C and places it on the substrate platforms 6L and 6U. Then, the main transport robots 8L and 8U take out the substrates W from the substrate platforms 6L and 6U and transport them to the processing units 11L-43U (substrate loading step A121).
  • transport schedule creation step A120 transport schedule for product substrate processing
  • the indexer robot 26 picks up the product substrate W from the carrier C and places it on the substrate platforms 6L and 6U.
  • the main transport robots 8L and 8U take out the substrates W from the substrate platforms 6L and 6U and transport them to the processing units 11L-43U (substrate loading step A121).
  • processing step A122 processing using a processing liquid (chemical liquid, rinse liquid, etc.) is performed on the substrate W (processing step A122).
  • the main transport robots 8L and 8U take out the processed substrates W according to the transport schedule and transport them to the substrate platforms 6L and 6U. (substrate accommodation step A123).
  • step A13: YES unprocessed substrate W
  • step A14: YES the process returns to step A3 and the unit cleaning process is executed. If it is not continuous processing (step A13: NO), the process returns and the processing from step A1 is repeated.
  • step A5 determines whether the duration of the standby state, that is, the non-use duration has reached a set value (step A15). ). If the non-use continuation time has not reached the set value, it will be in a standby state. When the non-use duration time reaches the set value (step A15: YES), the controller 110 executes preset maintenance processing (step A16).
  • the maintenance process may be a unit cleaning process. As in the case of step A3, this unit cleaning process may be a process using the dummy substrate DW (a type of dummy process), or may be a process without using the dummy substrate DW.
  • the maintenance process may be a process similar to the pre-process. Also, the maintenance process may be another process.
  • the maintenance process is mainly a process for maintaining the environment in the processing chamber 35 of the processing units 11L-43U in a state suitable for processing the product substrates W, and is set in advance by the user of the substrate processing apparatus 1. It may be processing.
  • the maintenance processing includes a transfer schedule creation step A160 for creating a transfer plan (transfer schedule) for the processing, and a corresponding dummy substrate according to the transfer plan.
  • step A7 When there is no processing request (processing reservation) from the host computer 150, the controller 110 cannot automatically plan preprocessing similar to the product recipe 131. Therefore, even if maintenance processing (step A16) is executed as needed, when there is a processing request (processing reservation) from host computer 150, preprocessing (step A7) corresponding to the product processing can be executed. preferable.
  • the dummy substrates DW are previously introduced into the substrate processing apparatus 1 and accommodated in the dummy substrate accommodation units 7L and 7U.
  • the supply dummy carrier DC containing the dummy substrate DW is transferred to the carrier holding unit 25 by the carrier transport mechanism 300 (see FIG. 1) provided in the factory.
  • the indexer robot 26 takes out the dummy substrate DW from the supply dummy carrier DC and transports it to the substrate platforms 6L and 6U.
  • the main transport robot 8L of the first processing block layer BL transports and stores the dummy substrate DW from the substrate platform 6L to the dummy substrate storage unit 7L.
  • the main transport robot 8U of the second processing block layer BU transports and stores the dummy substrate DW from the substrate platform 6U to the dummy substrate storage unit 7U.
  • the controller 110 creates a transfer schedule for introducing the dummy substrates DW, and controls the indexer robot 26 and the main transfer robots 8L and 8U according to the transfer schedule, thereby achieving the transfer operation as described above.
  • the controller 110 When a new dummy board DW is introduced and accommodated in the dummy board accommodation units 7L and 7U, the controller 110 initializes the dummy board history data 134 corresponding to the dummy board slot in which the new dummy board DW is accommodated. reset to
  • the main transfer robots 8L and 8U and the indexer robot 26 move the dummy substrates DW from the dummy substrate storage units 7L and 7U to the recovery dummy carrier DC held by the carrier holding unit 25.
  • a substrate DW is transported. Specifically, when the dummy substrate DW to be replaced is accommodated in the dummy substrate accommodation portion 7L of the first processing block layer BL, the main transfer robot 8L moves from the dummy substrate accommodation portion 7L to the substrate placement portion 6L. and the dummy substrate DW.
  • the main transfer robot 8U transfers the dummy substrate DW from the dummy substrate accommodation portion 7U to the substrate platform 6U. to convey.
  • the indexer robot 26 transports the dummy substrates DW placed on the substrate placement units 6L and 6U to the recovery dummy carrier DC held by the carrier holding unit 25 and accommodates them therein. Similar operations are repeated when a plurality of dummy substrates DW are to be replaced.
  • the controller 110 creates a transport schedule for exchanging (discharging) the dummy substrates DW, and controls the indexer robot 26 and the main transport robots 8L and 8U according to the transport schedule, thereby achieving the transport operation as described above. .
  • FIG. 10 is a flowchart for explaining an operation example of setting the first status 141 and the second status 142 and changing the transfer schedule based on them. Give an example.
  • the controller 110 refers to the dummy board history data 134 and calculates status data indicating whether or not the dummy board DW needs to be replaced (step S1).
  • a calculation formula for calculating the status data is stored in the memory 112 .
  • the calculation formula may be stored in memory 112 in the form of a table. For example, when the number of times of use reaches a predetermined threshold, the status data becomes a value indicating replacement required. Status data is calculated for all the dummy substrates DW accommodated in the dummy substrate accommodation units 7L and 7U.
  • the calculation formula for calculating the status data is not necessarily common among the plurality of dummy substrates DW.
  • a plurality of dummy substrates DW are associated one-to-one with a plurality of processing units.
  • the processing of the product substrate W and the dummy processing performed in each processing unit are not necessarily common. Therefore, the calculation formula can be individually set for each dummy substrate DW corresponding to each processing unit. That is, a plurality of calculation formulas are stored in the memory 112, and status data is calculated using a calculation formula corresponding to each dummy substrate DW (that is, corresponding to each processing unit).
  • the controller 110 calculates status data and stores the latest status data in the memory 112 each time each dummy substrate DW is used in the corresponding processing unit, that is, each time the dummy substrate history data 134 is updated.
  • the controller 110 functions as a judgment unit that judges whether the replacement of the dummy substrate DW is necessary based on the status data. Specifically, it is determined whether or not the status data of any dummy board DW in the first dummy board accommodation section 7L is a value indicating that replacement is required (step S2), and if any of the dummy board accommodation sections 7U is It is determined whether or not the status data of the dummy substrate DW is a value indicating that replacement is required (steps S3 and S4). Further, the controller 110 performs a function as a status setting section that sets the first status 141 and the second status 142 to the enabled mode or the prohibited mode based on the above determination (steps S5 to S8).
  • the status of the processing block layers BL and BU corresponding to the dummy substrate housing portions 7L and 7U having the dummy substrate DW whose status data indicates that replacement is required is set to the prohibition mode.
  • the status data of the processing block layers BL and BU corresponding to the dummy substrate housing units 7L and 7U whose status data does not indicate that replacement is necessary for any of the dummy substrates DW is set to the possible mode. However, if it is the same as the previous status, the previous value is maintained.
  • the status data of any dummy board DW in the first dummy board accommodation portion 7L is a value indicating that replacement is required (step S2: YES), and the status data of any one of the second dummy board accommodation portions 7U If the status data of the dummy substrate DW in 1 is a value indicating that replacement is necessary (step S3: YES), both the first status 141 and the second status 142 are set to the prohibition mode (step S5).
  • the status data of any dummy board DW in the first dummy board housing portion 7L is a value indicating that replacement is required (step S2: YES)
  • the status data of any dummy board DW in the second dummy board housing portion 7U is If the status data does not indicate that replacement is necessary either (step S3: NO), the first status 141 is set to prohibition mode, and the second status 142 is set to enable mode (step S6).
  • step S7 both the first status 141 and the second status 142 are set to the possible mode (step S7).
  • the status data of any dummy board DW in the first dummy board accommodation portion 7L is not a value indicating that replacement is required (step S2: NO), and the status data of any dummy board DW in the second dummy board accommodation portion 7U is If the status data indicates that replacement is required (step S4: YES), the first status 141 is set to the enabled mode and the second status 142 is set to the prohibited mode (step S8).
  • step S4 If any dummy board DW needs to be replaced (YES in step S2, YES in step S3, or YES in step S4), the controller 110 instructs the host computer 150 to replace the dummy board DW.
  • a requested dummy board replacement request is transmitted (step S11).
  • the dummy board replacement request is made by specifying the dummy board DW that needs to be replaced, more specifically, by specifying the slot in which the dummy board DW is accommodated.
  • the controller 110 does not repeatedly transmit a replacement request for the dummy board DW for which the dummy board replacement request has already been sent to the host computer 150, and the status data newly becomes a value indicating that the replacement is required.
  • a dummy board replacement request is transmitted to the host computer 150 regarding the dummy board DW.
  • the dummy board DW whose status data has a value indicating that it needs to be replaced is excluded from new calculation targets until the dummy board history data 134 is reset. You may do so.
  • step S6 the controller 110 plans to transfer from the carrier C to the processing units of the first processing block layer BL.
  • the transfer schedule is discarded and the transfer schedule is changed to transfer the wafer W to the processing unit of the second processing block layer BU (step S9).
  • the controller 110 discards the transfer schedule for the dummy substrates DW scheduled to be transferred from the first dummy substrate accommodation section 7L to the processing units of the first processing block layer BL.
  • the controller 110 determines the transfer schedule of the substrates W already delivered from the carrier C and the dummy substrates DW already delivered from the first dummy substrate accommodation portion 7L, that is, the substrates for which processing including transportation has started. It is preferable to maintain the transfer schedule for W and DW. In this way, the transition of the first status 141 to the prohibition mode prohibits both the processing of the substrate W in the processing units of the first processing block layer BL and the dummy processing, and the processing in the processing units of the first processing block layer BL is prohibited. The substrate W that was planned to be processed will be transported to the processing unit of the second processing block layer BU in the enable mode and processed.
  • the controller 110 transfers from the carrier C to the processing units of the second processing block layer BU.
  • the transport schedule is discarded and changed to a transport schedule for transporting the wafer W to the processing unit of the first processing block layer BL (step S10).
  • the controller 110 discards the transfer schedule for the dummy substrates DW scheduled to be transferred from the second dummy substrate storage unit 7U to the processing units of the second processing block layer BU.
  • the controller 110 determines the transport schedule of the substrates W already delivered from the carrier C and the dummy substrates DW already delivered from the second dummy substrate accommodation unit 7U, that is, the substrates for which processing including transport has started. It is preferable to maintain the transfer schedule for W and DW. In this way, the second status 142 transitions to the prohibition mode, thereby prohibiting both the processing of the substrate W in the processing units of the second processing block layer BU and the dummy processing, and processing in the processing units of the second processing block layer BU.
  • the substrate W that was planned to be processed is transported to the processing unit of the first processing block layer BL in the enable mode and processed.
  • the host computer 150 When the host computer 150 receives a dummy substrate replacement request from the substrate processing apparatus 1, it determines whether any of the carrier holding units 25 of the substrate processing apparatus 1 holds the recovery dummy carrier DC. If none of the carrier holding portions 25 holds the recovery dummy carrier DC, the host computer 150 plans the supply of the recovery dummy carrier DC by the carrier transport mechanism 300, and operates the carrier transport mechanism 300 according to the plan. Let If the recovery dummy carrier DC is held by any of the carrier holding portions 25, the host computer 150 determines whether or not the supply dummy carrier DC is held by any of the carrier holding portions 25 of the substrate processing apparatus 1. to decide. If none of the carrier holding portions 25 holds the supply dummy carrier DC, the host computer plans the supply of the supply dummy carrier DC by the carrier transport mechanism 300, and operates the carrier transport mechanism 300 according to the plan. .
  • FIG. 11 is a flowchart for explaining an example of a dummy substrate replacement operation that is performed when the first processing block layer BL or the second processing block layer BU is in the prohibition mode.
  • the controller 110 of the substrate processing apparatus 1 loads the used dummy substrate DW into the recovery dummy carrier DC when the recovery dummy carrier DC is held by one of the carrier holding units 25 (step S21: YES). (Step S22). That is, the used dummy substrates DW are transported from the dummy substrate storage units 7L, 7U to the substrate placement units 6L, 6U by the main transport robots 8U, 8L, and transferred from the substrate placement units 6L, 6U by the indexer robot 26 to the collecting dummy substrates DW.
  • the controller 110 of the substrate processing apparatus 1 removes the unused dummy substrate DW from the dummy supply carrier DC when the supply dummy carrier DC is held by one of the carrier holding units 25 (step S23: YES). It operates so as to be conveyed to the storage units 7L and 7U (step S24). That is, the unused dummy substrates DW are transferred from the supply dummy carrier DC to the substrate placement units 6L and 6U by the indexer robot 26, and transferred from the substrate placement units 6L and 6U to the dummy substrate storage unit 7L by the main transfer robots 8L and 8U. , 7U, and carried into the dummy substrate accommodating portions 7L, 7U.
  • the status data (step S1 in FIG. 10) calculated for the dummy board DW in the corresponding slot no longer indicates the need for replacement.
  • the first status 141 is set to the possible mode (steps S7 and S8).
  • the second status 142 is set to the possible mode. (steps S6 and S7).
  • FIG. 12A is a time chart for explaining an example of the substrate transfer operation when both the first status 141 of the first processing block layer BL and the second status 142 of the second processing block layer BU are in the enabled mode.
  • the indexer robot 26 picks up the substrate W1 from one of the carriers C held by the carrier holder 25 and places the picked substrate W1 on the substrate platform 6L of the first processing block layer BL.
  • This substrate W1 is picked up by the main transfer robot 8L and carried into one processing unit L1 of the processing units 11L-43L in the first processing block layer BL.
  • the main transport robot 8L takes out the processed substrate W1 and places it on the substrate platform 6L.
  • the indexer robot 26 takes out the processed substrate W1 from the substrate platform 6L and carries it into one of the carriers C held by the carrier holder 25 .
  • the indexer robot 26 also picks up another substrate W2 from one carrier C held by the carrier holding section 25, and places the picked-up substrate W2 on the substrate platform 6U of the second processing block layer BU.
  • This substrate W2 is picked up by the main transfer robot 8U and carried into one processing unit U1 among the processing units 11U to 43U in the second processing block layer BU.
  • the main transport robot 8U takes out the processed substrate W2 and places it on the substrate platform 6U.
  • the indexer robot 26 takes out the processed substrate W ⁇ b>2 from the substrate platform 6 ⁇ /b>U and carries it into one of the carriers C held by the carrier holder 25 .
  • next substrate W3 is carried into one processing unit L2 of the processing units 11L-43L provided in the first processing block layer BL and processed.
  • next wafer W4 is carried into one of the processing units 11U-43U provided in the second processing block layer BU and processed.
  • the product substrates W are processed in parallel in both the first processing block layer BL and the second processing block layer BU.
  • the controller 110 When both the first processing block layer BL and the second processing block layer BU are in the enabled mode, the controller 110 creates a transport schedule for the transport operation as described above, and according to the transport schedule, the indexer robot 26 and the main robot 26 are transported. It controls the transfer robots 8L and 8U.
  • FIG. 12B is a time chart for explaining an example of the substrate transfer operation when the status of one of the processing blocks transitions from the possible mode to the prohibited mode.
  • the first status 141 corresponding to the first processing block layer BL is maintained in the enabled mode
  • the second status 142 corresponding to the second processing block layer BU transitions from the enabled mode to the prohibited mode. is doing.
  • a transfer schedule as shown in FIG. 12A is created and the transfer and processing of substrates W are proceeding according to the transfer schedule.
  • the dummy substrate DW needs to be replaced in the second processing block layer BU.
  • the second status 142 corresponding to the second processing block layer BU transitions from the enabled mode to the prohibited mode.
  • the controller 110 discards the existing transfer schedule (see FIG. 12A) regarding the substrates W that have not been taken out from the carrier C at time t1, and changes it to the transfer schedule shown in FIG. 12B.
  • the transfer schedule for the plan to transfer to the second processing block layer BU which has not been discharged from the carrier C at time t1 and whose status is the prohibition mode is discarded.
  • the substrate W2 has already been unloaded from the carrier C and has started to be transported. Therefore, the substrate W2 is transported in accordance with the existing transport schedule, is loaded into one of the processing units U1 in the second processing block layer BU in the prohibition mode, and is processed. It is unloaded and transported to the carrier C. That is, the substrate W2 is transferred in the same manner as in FIG. 12A.
  • Substrate W3 is unloaded from carrier C after time t1, but since it is scheduled to be processed in the first processing block layer BL in the enable mode, its transport schedule remains unchanged and is transported in the same manner as in FIG. 12A. be done.
  • substrate W4 is planned to be transferred to one processing unit U2 of the second processing block layer BU in the existing transfer schedule (see FIG. 12A), but this plan is discarded.
  • the controller 110 creates a transfer schedule for transferring the substrate W4 to one of the processing units 11L to 43L included in the first processing block layer BL in the possible mode, and according to this transfer schedule, the indexer It controls the robot 26 and the main transfer robot 8L. Specifically, the indexer robot 26 takes out the substrate W4 from the carrier C and places it on the substrate platform 6L of the first processing block layer BL. This substrate W4 is picked up by the main transfer robot 8L and carried into one processing unit U3 in the first processing block layer BL.
  • the main transport robot 8L takes out the processed substrate W4 and places it on the substrate platform 6L.
  • the indexer robot 26 takes out the processed substrate W4 from the substrate platform 6L and carries it into one of the carriers C held by the carrier holder 25. As shown in FIG.
  • Subsequent wafers W that are planned to be transferred to the processing unit U2 of the second processing block layer BU according to the existing transfer schedule (see FIG. 12A) are also similarly It is transported to a processing unit and processed.
  • the controller 110 creates a transport schedule for planning the replacement of the dummy substrates DW with respect to the second processing block layer BU in the prohibition mode, and controls the main transport robot 8U and the indexer robot 26 accordingly (see FIG. 11). .
  • the controller 110 creates a transport schedule for planning the replacement of the dummy substrates DW with respect to the second processing block layer BU in the prohibition mode, and controls the main transport robot 8U and the indexer robot 26 accordingly (see FIG. 11). .
  • the controller 110 creates a transport schedule for planning the replacement of the dummy substrates DW with respect to the second processing block layer BU in the prohibition mode, and controls the main transport robot 8U and the indexer robot 26 accordingly (see FIG. 11). .
  • the controller 110 creates a transport schedule for planning the replacement of the dummy substrates DW with respect to the second processing block layer BU in the prohibition mode, and controls the main transport robot 8U and the indexer robot 26 accordingly (see FIG. 11). .
  • the controller 110 creates
  • the indexer robot 26 takes out the used dummy substrate DW from the substrate platform 6U and carries it into the recovery dummy carrier DC. Further, when the carrier holding portion 25 holds a supply dummy carrier DC containing unused dummy substrates DW, the indexer robot 26 moves one unused dummy substrate DW to the supply dummy carrier DC. , and placed on the substrate placement portion 6U. The main transport robot 8U takes out the unused dummy substrate DW and carries it into the dummy substrate storage section 7U. Thus, one dummy substrate DW in the dummy substrate housing portion 7U can be replaced. Similar operations are repeated when it is necessary to replace another dummy substrate DW.
  • the product substrate W can be continuously processed in the first processing block layer BL in the enable mode.
  • the description of the operation when the first processing block layer BL transitions from the enable mode to the prohibition mode can be read by exchanging the configuration of the first processing block layer BL and the configuration of the second processing block layer BU in the above description. Since it is obtained by
  • the processing block 3 laterally adjacent to the indexer block 2 is configured by stacking a plurality of processing block layers BL and BU in the vertical direction Z.
  • Dummy substrate housing portions 7L and 7U for housing dummy substrates DW are provided in the respective processing block layers BL and BU. Since the dummy substrates DW can be accommodated inside the processing block layers BL, BU, when it becomes necessary to use the dummy substrates DW in the processing units 11L-43U, the dummy substrate accommodation units 7L, 7U can be stored without the involvement of the indexer robot 26. and the processing unit 11L-43U.
  • the transport load of the indexer robot 26 can be reduced, processing using the dummy substrates DW can be performed while reducing the influence on the transport of the product substrates W.
  • the transport load of the indexer robot 26 that transports the substrate W between the plurality of processing block layers BL, BU each having the plurality of processing units 11L-43L, 11U-43U and the carrier holder 25 is extremely large. Therefore, by reducing the transport load of the indexer robot 26, the transport efficiency of the product substrates W is improved, and the productivity can be improved accordingly.
  • the main transport robots 8L and 8U of the processing block layers BL and BU are in charge of transporting the substrates W within the processing block layers BL and BU, so the transport load is smaller than that of the indexer robot 26. Therefore, the fact that the main transport robots 8L and 8U are in charge of transporting the dummy substrates DW inside the processing block layers BL and BU is not a big problem from the viewpoint of production efficiency.
  • the transfer of the dummy substrate DW between the dummy substrate storage units 7L and 7U and the processing units 11L-43U is performed by the indexer robot 26 and the processing unit 11L-43U. This can be done without going through the substrate mounting parts 6L, 6U for transferring the substrate to and from the block layers BL, BU. Therefore, interference between the transportation of the dummy substrates DW and the transportation of the product substrates W can be reduced, so that the transportation efficiency of the product substrates W is improved, and accordingly the productivity can be improved.
  • the carrier holding portion 25 is not occupied for a long time by the dummy carrier that accommodates the dummy substrate DW. As a result, it is possible to suppress the waiting time for carrying in the carrier C containing the substrates W for products, so that it is possible to contribute to the improvement of productivity.
  • the plurality of processing units 11L-43L and 11U-43U are arranged along the transport paths 51L and 51U along which the substrates W are transported by the main transport robots 8L and 8U. , are arranged on both sides of the transport paths 51L and 51U, and are stacked in the vertical direction Z and arranged. Therefore, the arrangement of the plurality of processing units 11L-43U in the processing block layers BL, BU is designed so that the main transfer robots 8L, 8U can efficiently transfer substrates. Thereby, it can contribute to improvement in productivity.
  • the substrate placement units 6L, 6U and the dummy substrate storage units 7L, 7U are both arranged between the indexer robot 26 and the main transfer robots 8L, 8U.
  • substrates W can be efficiently transferred between the indexer robot 26 and the main transfer robots 8L, 8U via the substrate platforms 6L, 6U.
  • the dummy substrate storage units 7L and 7U can be arranged at positions that do not interfere with the transport of the substrates W by the indexer robot 26 and the transport of the substrates W by the main transport robots 8L and 8U. Therefore, the dummy substrates DW can be held in the processing block layers BL and BU without affecting the transportation of the substrates W for products.
  • the dummy substrate housing portions 7L, 7U and the substrate placement portions 6L, 6U are arranged three-dimensionally with mutually different heights.
  • the spaces in the processing block layers BL, BU can be effectively used, and the dummy substrate housing portions 7L, 7U can be appropriately arranged in the processing block layers BL, BU.
  • the arrangement of the dummy substrate housing portions 7L and 7U that does not hinder the transportation of the product substrate W is realized.
  • the dummy substrate housing portions 7L and 7U are arranged so as to overlap the substrate mounting portions 6L and 6U in plan view.
  • the dummy substrate housing portions 7L and 7U are arranged using the space above or below the substrate mounting portions 6L and 6U.
  • the dummy substrate housing portions 7L and 7U are arranged so as not to hinder the transportation of the product substrate W, and the spaces in the processing block layers BL and BU are effectively used to effectively store the dummy substrate housing portions 7L and 7U. 7U has been placed.
  • the arrangement in which the dummy substrate housing portions 7L and 7U overlap the substrate mounting portions 6L and 6U in a plan view is, specifically, part or The arrangement may be such that all of them overlap the substrates W held on the substrate rests 6L and 6U.
  • the second processing block layer BU (upper processing block layer) is laminated on the first processing block layer BL (lower processing block layer).
  • the dummy substrate housing portion 7L is positioned below the substrate mounting portion 6L.
  • the dummy substrate housing portion 7U is located below the substrate mounting portion 6U.
  • the dummy substrate housing portions 7L, 7U of each of the processing block layers BL, BU have the same number of processing units 11L to 43L, 11U to 43U included in the processing block layers BL, BU. It includes dummy board slots DL1-DL12, DU1-DU12. Each dummy substrate slot DL1-DL12, DU1-DU12 is configured to hold one dummy substrate DW. As a result, the same number of dummy substrates DW as the processing units 11L to 43L and 11U to 43U can be held in each of the processing block layers BL and BU.
  • the main transfer robots 8L and 8U quickly load the dummy substrate DW into the processing unit and can be processed. Since the indexer robot 26 is not involved in the loading of the dummy substrates DW, it is possible to suppress or prevent the transportation of the product substrates W from being affected.
  • the plurality of processing units 11L-43L, 11U-43U of each processing block layer BL, BU and the plurality of dummy substrate slots DL1-DL12, DU1-DU12 of the processing block layer are one-to-one. is mapped to Then, the main transfer robots 8L, 8U transfer the dummy substrates DW between the corresponding dummy substrate slots DL1-DL12, DU1-DU12 and the processing units 11L-43L, 11U-43U.
  • the dummy substrate DW held in the dummy substrate slot can be a dedicated dummy substrate for the corresponding processing unit. This facilitates management of the usage history of the dummy substrate DW.
  • the controller 110 controls the main transfer robots 8L and 8U when dummy processing conditions (unit cleaning execution conditions, pretreatment execution conditions, maintenance execution conditions) are satisfied, and The dummy substrates DW are transported from 7L, 7U to the processing units 11L-43L, 11U-43U, and dummy processing is executed in the processing units.
  • dummy processing can be started by transporting the dummy substrate DW within the processing block layers BL and BU, so that the dummy processing can be started quickly while suppressing or preventing the influence on the transportation of the product substrate W. .
  • the controller 110 controls each part of the substrate processing apparatus 1 to perform the following steps. That is, in each of the processing block layers BL and BU, the main transfer robots 8L and 8U transfer the dummy substrates DW accommodated in the dummy substrate accommodation units 7L and 7U in the processing block layer to a plurality of processing units in the processing block layer.
  • a dummy substrate carrying-in process (steps A31, A71, A161) is carried out to carry in one of 11L-43L and 11U-43U.
  • the dummy processing steps steps A32, A72, A162 are performed in the processing unit to perform dummy processing using the loaded dummy substrate DW.
  • the main transfer robots 8L, 8U take out the dummy substrates DW from the processing units and carry them to the dummy substrate storage units 7L, 7U (steps A33, A73, A163).
  • the wafers W placed on the substrate platforms 6L, 6U of the processing block layers BL, BU are carried into any of the plurality of processing units 11L-43L, 11U-43U of the processing block layers BL, BU.
  • a process is performed (step A121).
  • a step of processing the loaded substrate W in the processing unit is executed (step A122).
  • the processing using the dummy substrate DW can be performed in the processing units 11L-43L and 11U-43U of the processing block layers BL and BU while reducing the transport load of the indexer robot 26.
  • FIG. Thereby, production efficiency can be improved.
  • a substrate carrying-in step In parallel with step A20), or prior to the substrate loading step (step A20), the aforementioned dummy substrate loading step (step A71) may be performed.
  • the indexer robot 26 carries the product substrates W into the processing block layers BL and BU, while the dummy substrates DW are carried into the processing units 11L-43L and 11U-43U in the respective processing block layers BL and BU. be able to. Since the indexer robot 26 does not have to be involved in the loading of the dummy substrate DW, it is possible to perform the processing within the processing block layers BL and BU without waiting for the transport of the substrate W by the indexer robot 26 or in parallel with the transport of the substrate. Transfer of the dummy substrate DW can be performed. Therefore, the transport load of the indexer robot 26 can be reduced, and the dummy substrate DW can be quickly transported to the processing units in the processing block layers BL and BU.
  • the above-described dummy processing step (step A72) may be performed.
  • the transport load of the indexer robot 26 can be reduced, and dummy processing can be started quickly in the processing block layers BL and BU.
  • the transfer of the dummy substrate DW and subsequent dummy processing can be started at an appropriate time.
  • the environment in the processing units 11L-43L and 11U-43U can be adjusted at an appropriate time, so that when the carrier C housing the product substrate W is carried into the carrier holding section 25, the Processing of the substrate W can begin. This can contribute to improvement in productivity.
  • a prohibition mode and an enable mode can be individually set for the first processing block layer BL and the second processing block layer BU, and these modes correspond to the first processing block layer BL. It is stored in the memory 112 as the first status 141 and the second status 142 corresponding to the second processing block layer BU. The first processing block layer BL and the second processing block layer BU are thus individually in inhibited or enabled mode.
  • the transfer schedule of the substrates W scheduled to be processed in the first processing block layer BL is changed. is changed. Specifically, the transfer schedule of the substrate W planned to be transferred to the processing units 11L-43L of the first processing block layer BL by the main transfer robot 8L is discarded, and the substrate W is transferred to the second processing block layer BU. A new transport schedule is created for transporting the wafer to the main transport robot 8U and transporting it to the processing units 11U-43U of the second processing block layer BU. As a result, the substrate W can be processed in the second processing block layer BU.
  • the transfer schedule of the wafers W scheduled to be processed by the second processing block layer BU is changed. . Specifically, the transfer schedule of the substrate W planned to be transferred to the processing units 11U-43U of the second processing block layer BU by the main transfer robot 8U is discarded, and the substrate W is transferred to the first processing block layer BL. A new transport schedule is created for transporting the wafer to the main transport robot 8L and transporting it to the processing units 11L-43L of the first processing block layer BL. As a result, the substrate W can be processed in the first processing block layer BL.
  • FIG. 13 is a schematic longitudinal sectional view for explaining the configuration of the substrate processing apparatus according to the second embodiment of the present invention, showing the configuration in a longitudinal section corresponding to the longitudinal section of FIG.
  • the intermediate partition wall 16 separating the first processing block layer BL and the second processing block layer BU is removed.
  • the pillars 83 that guide the vertical movement of the main transfer robots 8L and 8U extend vertically over the first processing block layer BL and the second processing block layer BU.
  • the main transport robots 8L and 8U are configured to be able to move up and down with a larger stroke than in the case of the first embodiment.
  • the controller 110 controls the operations of the main transfer robots 8L and 8U so that they do not interfere with each other.
  • the two substrate mounting portions 6U and 6L in the first embodiment are replaced with one substrate mounting portion 6.
  • the substrate platform 6 is shared by the first processing block layer BL and the second processing block layer BU. That is, the main transfer robot 8L of the first processing block layer BL can access the substrate platform 6, and the product substrates are transferred between the substrate platform 6 and the processing units 11L-43L of the first processing block layer BL. Carry W. Further, the main transport robot 8L transports the dummy substrate DW between the substrate placement section 6, the processing units 11L-43L, and the dummy substrate storage section 7L.
  • the main transfer robot 8U of the second processing block layer BU can access the substrate platform 6 and transfer products between the substrate platform 6 and the processing units 11U-43U of the second processing block layer BU.
  • a substrate W is transported.
  • the main transport robot 8U transports the dummy substrate DW between the substrate platform 6, the processing units 11U to 43U, and the dummy substrate housing portion 7U.
  • the substrate platform 6 includes an unprocessed substrate platform 61 and a processed substrate platform 62 .
  • the substrate placement part 6 is shared by the first and second processing block layers BL and BU, the unprocessed substrate placement part 61 and the processed substrate placement part 62 are the same as those in the first embodiment.
  • the substrate holding shelves 65 and 66 provided on the substrate platform 6 may be arranged such that at least one (that is, some or all) of the slots can be accessed by both of the main transfer robots 8L and 8U. . More specifically, substrate holding shelf 65 (see FIG.
  • unprocessed substrate platform 61 has at least one (that is, some or all) slots accessible by both main transfer robots 8L and 8U. It may be arranged as Similarly, the substrate holding shelf 66 (see FIG. 5) of the processed substrate platform 62 is arranged such that at least one (that is, some or all) slots are accessible by both main transfer robots 8L and 8U. It may be said that
  • the substrate placement section 6 is preferably arranged so that it can be accessed by the indexer robot 26 . More specifically, the indexer robot 26 can access all the slots of the substrate holding shelves 65 and 66 of the substrate platform 6 so that the product substrates W or the dummy substrates DW can be loaded into and unloaded from them. preferably configured.
  • FIG. 14 is a longitudinal sectional view for explaining the configuration of a substrate processing apparatus according to the third embodiment of the present invention, showing the configuration in a longitudinal section corresponding to the longitudinal section of FIG.
  • adjacent partition walls 2a and 3a of the indexer block 2 and the processing block 3 are provided with windows 4L and 4U corresponding to the substrate mounting portions 6L and 6U, respectively. Corresponding windows are not formed.
  • windows 5L and 5U corresponding to the dummy substrate housing portions 7L and 7U are added to the partition walls 2a and 3a.
  • the indexer robot 26 can directly access the dummy substrate housing portions 7L and 7U to retrieve the dummy substrate DW. can be brought in. Furthermore, when the used dummy substrates DW are unloaded from the processing block layers BL, BU, the indexer robot 26 can directly access the dummy substrate storage units 7L, 7U to unload the dummy substrates. Neither of the main transfer robots 8L, 8U need to be involved in loading/unloading the dummy substrate DW. Therefore, it is possible to reduce the transport load of the main transport robots 8L and 8U and improve productivity.
  • the controller 110 transports the dummy substrate DW by the indexer robot 26 between the dummy carrier DC held by the carrier holding portion 25 and the first dummy substrate accommodation portion 7L when the first processing block layer BL is in the prohibition mode.
  • a transportation schedule is created for the indexer robot 26, and the indexer robot 26 is controlled according to the transportation schedule.
  • the controller 110 causes the indexer robot 26 to move the dummy substrate DW between the dummy carrier DC held by the carrier holding portion 25 and the second dummy substrate accommodation portion 7U when the second processing block layer BU is in the prohibition mode. is created, and the indexer robot 26 is controlled according to the transportation schedule.
  • FIG. 15 is an illustrative plan view showing the internal configuration of a substrate processing apparatus according to the fourth embodiment of the invention.
  • the plurality of processing units 11L-43U are divided into a first processing unit group provided in the lower processing block layer BL and a second processing unit group provided in the upper processing block layer BU. with a horizontal intermediate partition 16 between them.
  • the middle partition 16 that vertically partitions the space within the processing block 3 is not provided, and instead a central partition 18 that horizontally partitions the space within the processing block 3 is provided. It is
  • the central partition wall 18 divides the space inside the processing block 3 into left and right when viewed from the carrier holding portion 25 side in the first horizontal direction X from the front.
  • the center partition 18 is a plate-like partition extending along the first horizontal direction X and the vertical direction Z near the center of the processing block 3 in the second horizontal direction Y (horizontal direction).
  • the central partition wall 18 forms a first processing block portion B1 arranged on one side and a second processing block portion B2 arranged on the other side. That is, the first processing block portion B1 and the second processing block portion B2 are arranged laterally of each other.
  • the plurality of processing units 11L-43U provided in the processing block 3 are divided into a first processing unit group G1 included in the first processing block portion B1 and a second processing unit group G2 included in the second processing block portion B2. are divided. Since the arrangement of the plurality of processing units 11L-43U is similar to that of the first embodiment, in FIG. 15 the plurality of processing units 11L-43U are given the same reference numerals as in FIG.
  • the first processing unit group G1 is composed of a plurality of processing units 11L, 12L, 13L, 11U, 12U, 13U; ing.
  • the second processing unit group G2 is composed of a plurality of processing units 31L, 32L, 33L, 31U, 32U, 33U; ing.
  • a first main transfer robot 8A is provided on one side of the central partition wall 18 corresponding to the first processing unit group G1.
  • the first main transfer robot 8A operates within the first transfer space 53A partitioned between the central partition 18 and the first processing unit group G1, thereby transferring the product substrates W and the dummy substrates DW to the first transfer space. It is transported through space 53A.
  • a second main transfer robot 8B is provided on the other side of the central partition wall 18 corresponding to the second processing unit group G2.
  • the second main transfer robot 8B operates within the second transfer space 53B partitioned between the central partition wall 18 and the second processing unit group G2, thereby transferring the product substrates W and the dummy substrates DW to the second transfer space. Transported through space 53B.
  • the configurations of the first main transfer robot 8A and the second main transfer robot 8B are substantially the same as in the case of the second embodiment shown in FIG. .
  • the struts 83 that guide vertical movement are fixed to the central partition wall 18 .
  • a first substrate platform 6A is provided at the end adjacent to the indexer block 2 of the first transfer space 53A corresponding to the first processing unit group G1. Further, the first dummy substrate accommodation portion 7A is arranged above and/or below the first substrate placement portion 6A so as to partially or wholly overlap with the first substrate placement portion 6A in plan view.
  • a second substrate platform 6B is provided at the end adjacent to the indexer block 2 of the second transfer space 53B corresponding to the second processing unit group G2. Further, the second dummy substrate accommodation portion 7B is arranged above and/or below the second substrate placement portion 6B so as to partially or wholly overlap the second substrate placement portion 6B in plan view.
  • the first main transfer robot 8A can access the plurality of processing units that constitute the first processing unit group G1, the first substrate placement section 6A and the first dummy substrate storage section 7A. Thereby, the first main transport robot 8A transports the product substrate W between the plurality of processing units forming the first processing unit group G1 and the first substrate platform 6A. The first main transport robot 8A also transports the dummy substrates DW among the plurality of processing units, the first substrate platform 6A, and the first dummy substrate accommodation portion 7A that make up the first processing unit group G1. In this embodiment, the first main transfer robot 8A cannot access any of the second processing unit group G2, the second substrate platform 6B and the second dummy substrate storage 7B.
  • the second main transfer robot 8B can access the plurality of processing units, the second substrate placement section 6B and the second dummy substrate storage section 7B that make up the second processing unit group G2.
  • the second main transport robot 8B transports the product substrate W between the plurality of processing units forming the second processing unit group G2 and the second substrate platform 6B.
  • the second main transport robot 8B transports the dummy substrates DW among the plurality of processing units, the second substrate placement section 6B and the second dummy substrate storage section 7B that constitute the second processing unit group G2.
  • the second main transfer robot 8B cannot access any of the first processing unit group G1, the first substrate platform 6A and the first dummy substrate storage 7A.
  • the indexer robot 26 can access the carriers C, DC, the first substrate platform 6A and the second substrate platform 6B held by the carrier holding part 25, and the product substrate W and the dummy substrate DW therebetween. to convey.
  • the indexer robot 26 cannot access either the first dummy substrate accommodation portion 7A or the second dummy substrate accommodation portion 7B in this embodiment.
  • the indexer robot 26 cannot access the first processing unit group G1 and the second processing unit group G2.
  • the first status 141 and the second status 142 are sent to the first processing block section B1 and the second processing block section B2. Can be set. Then, when the status of one of the processing block units changes from the possible mode to the prohibit mode, the transfer schedule for the wafer W planned to be carried into the processing block unit in the prohibit mode is discarded, and the wafer W is transferred to the other process in the possible mode. A new transport schedule for transporting to the block unit is created. Thereby, the processing of the substrate W can be continued by utilizing the processing block unit in the possible mode.
  • This fourth embodiment is modified according to the second embodiment described above (see FIG. 13), and the indexer robot 26, the first A substrate platform that can be accessed in common by the main transfer robot 8A and the second main transfer robot 8B may be provided.
  • a notch may be provided at the end of the central partition wall 18 on the indexer block 2 side to dispose a substrate platform shared by the first processing unit group G1 and the second processing unit group G2.
  • the fourth embodiment is modified according to the above-described third embodiment (see FIG. 14) so that the indexer robot 26 can access the first dummy substrate housing portion 7A and the second dummy substrate housing portion 7B.
  • the indexer robot 26 can load/unload the dummy substrates DW into/from the first dummy substrate storage portion 7A and the second dummy substrate storage portion 7B without involvement of the first main transfer robot 8A and the second main transfer robot 8B. can do
  • the present invention can also be implemented in other forms.
  • the configuration of the processing block 3 is configured by stacking two processing block layers BL and BU. Blocks may be constructed.
  • the processing block layers BL and BU are stacked in three stages is shown.
  • the processing units 11L to 43U are arranged on both sides of the transport paths 51L and 51U is shown, but the processing units are arranged on one side of the transport paths 51L and 51U.
  • two processing units are arranged along the transport paths 51L and 51U on one side of the transport paths 51L and 51U, but one processing unit is arranged. may be arranged, and three or more processing units may be arranged.
  • the dummy substrate slots DL1 to DL12 and DU1 which are the same in number as the processing units 11L to 43L and 11U to 43U, are provided in the dummy substrate housing portions 7L and 7U of the respective processing block layers BL and BU.
  • -DU 12 are provided and correspond one-to-one to the processing units 11L-43L and 11U-43U.
  • the number of dummy substrate slots in each processing block layer BL, BU may be made smaller than the number of processing units so that one dummy substrate slot may be associated with a plurality of processing units.
  • the status of the corresponding processing unit group is set to the prohibition mode on condition that the dummy substrates DW accommodated in the dummy substrate accommodation units 7L and 7U need to be replaced.
  • the status of the processing unit group may be changed to the prohibited mode based on other predetermined conditions.

Abstract

This substrate processing device comprises: a carrier holding section that holds a carrier; a first processing unit group; a second processing unit group; a first dummy substrate accommodation section; a second dummy substrate accommodation section; a substrate placement section; a first conveyance unit that conveys a substrate between a first processing unit and the substrate placement section and conveys a dummy substrate between the first processing unit and the first dummy substrate accommodation section; a second conveyance unit that conveys a substrate between a second processing unit and the substrate placement section and conveys a dummy substrate between the second processing unit and the second dummy substrate accommodation section; a third conveyance unit that conveys a substrate between the carrier and the substrate placement section; a storage section that stores data including a first status which indicates the state of the first processing unit group and a second status which indicates the state of the second processing unit group; a schedule preparation section that prepares a conveyance schedule; and a conveyance control section that controls, according to the conveyance schedule, the conveyance carried out by the first conveyance unit, the second conveyance unit, and the third conveyance unit.

Description

基板処理装置および基板処理方法SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 関連出願Related application
　この出願は、２０２１年３月２３日提出の日本国特許出願２０２１－０４９１７０号に基づく優先権を主張しており、この出願の全内容はここに引用により組み込まれるものとする。 This application claims priority based on Japanese Patent Application No. 2021-049170 filed on March 23, 2021, and the entire contents of this application are incorporated herein by reference.
　この発明は、基板を処理する装置および方法に関する。処理の対象となる基板には、たとえば、半導体ウエハ、液晶表示装置および有機ＥＬ(Electroluminescence)表示装置等のＦＰＤ(Flat Panel Display)用基板、光ディスク用基板、磁気ディスク用基板、光磁気ディスク用基板、フォトマスク用基板、セラミック基板、太陽電池用基板等が含まれる。 The present invention relates to an apparatus and method for processing substrates. Substrates to be processed include, for example, semiconductor wafers, FPD (Flat Panel Display) substrates such as liquid crystal display devices and organic EL (Electroluminescence) display devices, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. , photomask substrates, ceramic substrates, solar cell substrates, and the like.
　半導体装置の製造工程においては、半導体ウエハのような基板を処理する基板処理装置が用いられる。このような基板処理装置の一例は、特許文献１に開示されている。この基板処理装置は、基板を収容するキャリヤを保持するキャリヤ保持部と、基板を処理する複数の処理ユニットと、キャリヤと処理ユニットとの間で基板を搬送する搬送ユニットと、制御ユニットとを含む。処理ユニットの不使用継続時間が所定時間に達すると、制御装置は、ホスト装置に対して、ダミー基板を保持したダミーキャリヤの搬入を要求する。ダミーキャリヤがキャリヤ保持部に搬入されると、搬送ユニットは、ダミーキャリヤから処理ユニットへとダミー基板を搬送する。そのダミー基板を用いて処理ユニットの洗浄が行われる。 In the manufacturing process of semiconductor devices, substrate processing equipment that processes substrates such as semiconductor wafers is used. An example of such a substrate processing apparatus is disclosed in Japanese Unexamined Patent Application Publication No. 2002-200012. This substrate processing apparatus includes a carrier holding section that holds a carrier that accommodates substrates, a plurality of processing units that process the substrates, a transport unit that transports the substrates between the carrier and the processing units, and a control unit. . When the non-use duration of the processing unit reaches a predetermined time, the control device requests the host device to load the dummy carrier holding the dummy substrate. When the dummy carrier is loaded into the carrier holding section, the transport unit transports the dummy substrate from the dummy carrier to the processing unit. The dummy substrate is used to clean the processing unit.
　搬送ユニットは、インデクサロボットと、主搬送ロボットとを含み、これらの間に受け渡しユニットが配置されている。インデクサロボットは、キャリヤと受け渡しユニットとの間で基板を搬送する。主搬送ロボットは、受け渡しユニットと処理ユニットとの間で基板を搬送する。 The transport unit includes an indexer robot and a main transport robot, and a delivery unit is arranged between them. The indexer robot transports substrates between the carrier and the transfer unit. The main transport robot transports substrates between the delivery unit and the processing units.
　ダミーキャリヤがキャリヤ保持部に置かれると、インデクサロボットはダミーキャリヤからダミー基板を取り出して受け渡しユニットまで搬送する。そのダミー基板は、主搬送ロボットによって、受け渡しユニットから処理ユニットへと搬送される。ダミー基板を用いたユニット洗浄処理が終了すると、主搬送ロボットは、ダミー基板を処理ユニットから取り出して受け渡しユニットへと搬送する。そのダミー基板は、インデクサロボットによって、受け渡しユニットからダミーキャリヤへと搬送される。全てのダミー基板がダミーキャリヤに収容されると、ダミーキャリヤがキャリヤ保持部から搬出される。 When the dummy carrier is placed on the carrier holding part, the indexer robot takes out the dummy substrate from the dummy carrier and transports it to the transfer unit. The dummy substrate is transferred from the transfer unit to the processing unit by the main transfer robot. When the unit cleaning process using the dummy substrate is completed, the main transport robot takes out the dummy substrate from the processing unit and transports it to the delivery unit. The dummy substrate is transported from the transfer unit to the dummy carrier by the indexer robot. When all the dummy substrates are accommodated in the dummy carrier, the dummy carrier is unloaded from the carrier holding section.
特開２０１７－４１５０６号公報JP 2017-41506 A
　このように、ダミー基板が基板処理装置の外部から導入され、製品基板と同じ経路を通って処理ユニットに搬送され、かつ処理ユニットから搬出されてダミーキャリヤに収容される。したがって、ダミー基板の搬送のためにインデクサロボットおよび主搬送ロボットの両方が用いられ、かつ受け渡しユニットを通ってダミー基板が搬送される。それにより、製品基板の搬送と干渉し、製品基板の搬送効率が悪くなり、結果として、生産性の向上が妨げられる。 Thus, the dummy substrate is introduced from the outside of the substrate processing apparatus, transported to the processing unit along the same path as the product substrate, and then unloaded from the processing unit and accommodated in the dummy carrier. Therefore, both the indexer robot and the main transfer robot are used to transfer the dummy substrates, and the dummy substrates are transferred through the transfer unit. As a result, it interferes with the transportation of the product substrates, and the transportation efficiency of the product substrates deteriorates. As a result, the improvement of productivity is hindered.
　とりわけ、処理ユニットの数を増やして多数枚の製品基板を並行処理するように構成された基板処理装置においては、インデクサロボットおよび主搬送ロボットの搬送負荷が大きく、その軽減が生産性向上の鍵を握る。 In particular, in a substrate processing apparatus configured to process a large number of product substrates in parallel by increasing the number of processing units, the transport load of the indexer robot and the main transport robot is heavy, and reducing this load is the key to improving productivity. hold
　また、ダミーキャリヤがキャリヤ保持部に搬入され、そこからダミー基板が処理ユニットへと搬送され、処理ユニットでの処理を終えて当該ダミー基板がキャリヤに収容されるまで、ダミーキャリヤがキャリヤ保持部を占有する。したがって、ダミーキャリヤによるキャリヤ保持部の占有が続くので、製品基板の搬入に待機時間が生じるおそれがある。したがって、この観点からも、生産性の向上が妨げられている。 In addition, the dummy carrier is loaded into the carrier holding portion, the dummy substrate is transferred from there to the processing unit, and the dummy carrier holds the carrier holding portion until the dummy substrate is housed in the carrier after finishing the processing in the processing unit. occupy. Therefore, since the carrier holding portion continues to be occupied by the dummy carrier, there is a possibility that a waiting time will be required before the product substrates are brought in. Therefore, from this point of view as well, improvement in productivity is hindered.
　そこで、この発明の一実施形態は、製品用の基板の搬送への影響を軽減しながら、ダミー基板を用いた処理を処理ユニット内で行うことができる基板処理装置および基板処理方法を提供する。 Therefore, one embodiment of the present invention provides a substrate processing apparatus and a substrate processing method that can perform processing using dummy substrates in a processing unit while reducing the influence on the transportation of product substrates.
　この発明の一実施形態は、基板またはダミー基板を収容するキャリヤを保持するキャリヤ保持部と、基板を処理し、かつダミー基板を用いる処理を実行する複数の第１処理ユニットを有する第１処理ユニット群と、基板を処理し、かつダミー基板を用いる処理を実行する複数の第２処理ユニットを有する第２処理ユニット群と、ダミー基板を収容する第１ダミー基板収容部と、ダミー基板を収容する第２ダミー基板収容部と、基板が載置される基板載置部と、前記複数の第１処理ユニット、前記基板載置部および前記第１ダミー基板収容部にアクセス可能に構成され、前記複数の第１処理ユニットおよび前記基板載置部の間で基板を搬送し、前記複数の第１処理ユニットおよび前記第１ダミー基板収容部の間でダミー基板を搬送する第１搬送ユニットと、前記複数の第２処理ユニット、前記基板載置部および前記第２ダミー基板収容部にアクセス可能に構成され、前記複数の第２処理ユニットおよび前記基板載置部の間で基板を搬送し、前記複数の第２処理ユニットおよび前記第２ダミー基板収容部の間でダミー基板を搬送する第２搬送ユニットと、前記キャリヤ保持部に保持されたキャリヤおよび前記基板載置部にアクセス可能であり、前記キャリヤ保持部に保持されたキャリヤと前記基板載置部との間で、基板を搬送する第３搬送ユニットと、前記第１処理ユニット群の状態を表す第１ステータスと、前記第２処理ユニット群の状態を表す第２ステータスとを含むデータを記憶する記憶部と、前記第１搬送ユニット、前記第２搬送ユニットおよび前記第３搬送ユニットによる基板またはダミー基板の搬送スケジュールを作成するスケジュール作成部と、前記スケジュール作成部によって作成された搬送スケジュールに従って、前記第１搬送ユニット、前記第２搬送ユニットおよび前記第３搬送ユニットによる基板またはダミー基板の搬送を制御する搬送制御部と、を含む、基板処理装置を提供する。前記第１ステータスは、前記第１処理ユニット群に含まれる前記第１処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理をいずれも実行することができない禁止モードと、前記第１処理ユニット群に含まれる前記第１処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理を実行することができる可能モードとを含む。前記第２ステータスは、前記第２処理ユニット群に含まれる前記第２処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理をいずれも実行することができない禁止モードと、前記第２処理ユニット群に含まれる前記第２処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理を実行することができる可能モードとを含む。前記第１ステータスが可能モードから禁止モードになると、前記スケジュール作成部は、前記第１搬送ユニットによって前記第１処理ユニット群のいずれかの前記第１処理ユニットに搬送されるように計画された基板（とくにキャリヤから払い出し前の基板）の搬送スケジュールを破棄し、当該基板が前記第２搬送ユニットによって前記第２処理ユニット群のいずれかの前記第２処理ユニットに搬送されるように計画する搬送スケジュールを作成する。前記第２ステータスが可能モードから禁止モードになると、前記スケジュール作成部は、前記第２搬送ユニットよって前記第２処理ユニット群のいずれかの前記第２処理ユニットに搬送されるように計画された基板（とくにキャリヤから払い出し前の基板）の搬送スケジュールを破棄し、当該基板が前記第１搬送ユニットによって前記第１処理ユニット群のいずれかの前記第１処理ユニットに搬送されるように計画する搬送スケジュールを作成する。 An embodiment of the present invention is a first processing unit having a carrier holding part that holds a carrier that accommodates a substrate or a dummy substrate, and a plurality of first processing units that process the substrate and perform processing using the dummy substrate. a second processing unit group including a plurality of second processing units that process substrates and perform processing using dummy substrates; a first dummy substrate housing part that houses dummy substrates; a second dummy substrate accommodation portion, a substrate placement portion on which a substrate is placed, the plurality of first processing units, the substrate placement portion and the first dummy substrate accommodation portion are configured to be accessible; a first transport unit for transporting a substrate between the first processing unit and the substrate platform, and transporting a dummy substrate between the plurality of first processing units and the first dummy substrate housing; The second processing unit, the substrate platform and the second dummy substrate housing are configured to be accessible, the substrate is transported between the plurality of second processing units and the substrate platform, and the plurality of A second transport unit that transports dummy substrates between a second processing unit and the second dummy substrate housing portion, a carrier held by the carrier holding portion, and the substrate mounting portion are accessible to hold the carrier. a third transport unit for transporting the substrate between the carrier held by the unit and the substrate platform; a first status representing the state of the first processing unit group; and the state of the second processing unit group. a storage unit for storing data including a second status representing the a substrate processing apparatus comprising: a transport control unit that controls transport of substrates or dummy substrates by the first transport unit, the second transport unit, and the third transport unit according to the transport schedule created by the schedule creation unit. offer. The first status includes a prohibition mode in which the first processing units included in the first processing unit group cannot perform processing on a substrate and processing using a dummy substrate, and and a possible mode in which processing on a substrate and processing using a dummy substrate can be performed in the first processing unit. The second status includes a prohibition mode in which the second processing units included in the second processing unit group cannot perform processing on a substrate and processing using a dummy substrate, and and a possible mode in which processing on a substrate and processing using a dummy substrate can be performed in the second processing unit. When the first status changes from the enable mode to the prohibition mode, the schedule creation unit selects a substrate scheduled to be transported to one of the first processing units of the first processing unit group by the first transport unit. (Particularly, a substrate before being discharged from a carrier) is discarded, and the substrate is planned to be transported by the second transport unit to one of the second processing units of the second processing unit group. to create When the second status changes from the enable mode to the prohibition mode, the schedule creation unit selects a substrate scheduled to be transported by the second transport unit to one of the second processing units of the second processing unit group. (Particularly, the substrate before being discharged from the carrier) is discarded, and the substrate is transported by the first transport unit to one of the first processing units of the first processing unit group. to create
　この構成によれば、基板処理装置内にダミー基板収容部を備えているので、処理ユニットにおいてダミー基板を使用する必要が生じたときには、第３搬送ユニットの関与なしに、ダミー基板収容部と処理ユニットとの間でダミー基板を搬送できる。 According to this configuration, since the substrate processing apparatus is provided with the dummy substrate storage section, when the need arises to use the dummy substrate in the processing unit, the dummy substrate storage section and the processing can be performed without the involvement of the third transfer unit. Dummy substrates can be transported between units.
　したがって、第３搬送ユニットの搬送負荷を軽減できるので、製品用の基板の搬送への影響を軽減しながら、ダミー基板を用いる処理を行える。とりわけ、複数の処理ユニットをそれぞれ有する第１および第２処理ユニット群とキャリヤ保持部に保持されるキャリヤとの間での全ての基板の搬送に関与する第３搬送ユニットの搬送負荷は、非常に大きい。したがって、第３搬送ユニットの搬送負荷を軽減することによって、製品用の基板の搬送効率が良くなり、それに応じて、生産性を向上できる。第１および第２搬送ユニットは、第１および第２処理ユニット群と基板載置部との間の基板の搬送を分担して受け持つので、第３搬送ユニットに比較して搬送負荷が小さい。したがって、第１および第２搬送ユニットがダミー基板の搬送を受け持つことは、生産効率の観点から、大きな問題とはならない。 Therefore, since the transport load of the third transport unit can be reduced, it is possible to perform processing using dummy substrates while reducing the influence on transport of product substrates. In particular, the transport load of the third transport unit involved in transporting all substrates between the first and second groups of processing units each having a plurality of processing units and the carrier held by the carrier holding part is very high. big. Therefore, by reducing the transport load of the third transport unit, the transport efficiency of product substrates can be improved, and productivity can be improved accordingly. Since the first and second transport units share the transport of substrates between the first and second processing unit groups and the substrate platform, the transport load is smaller than that of the third transport unit. Therefore, from the viewpoint of production efficiency, the fact that the first and second transport units are in charge of transporting dummy substrates does not pose a big problem.
　また、第１および第２搬送ユニットは、それぞれ第１および第２ダミー基板収容部にアクセスできるので、ダミー基板収容部と処理ユニットとの間のダミー基板の搬送は、基板載置部を経由することなく行える。したがって、ダミー基板の搬送と製品用の基板の搬送との干渉を低減できるので、製品用の基板の搬送効率が良くなり、それに応じて、生産性を向上できる。 Also, since the first and second transport units can access the first and second dummy substrate storage units, respectively, the dummy substrates are transported between the dummy substrate storage unit and the processing unit via the substrate platform. can be done without Therefore, interference between the transportation of the dummy substrate and the transportation of the product substrate can be reduced, so that the transportation efficiency of the product substrate is improved, and accordingly the productivity can be improved.
　さらに、この実施形態では、第１搬送ユニットが第１ダミー基板収容部と第１処理ユニット群との間でダミー基板を搬送し、第２搬送ユニットが第２ダミー基板収容部と第２処理ユニット群との間でダミー基板を搬送する。それにより、ダミー基板の搬送負荷が分散されるので、製品用の基板の搬送とダミー基板の搬送との干渉を抑制して、基板の搬送効率を向上できる。これによっても、生産性を向上することができる。 Furthermore, in this embodiment, the first transport unit transports dummy substrates between the first dummy substrate storage part and the first processing unit group, and the second transport unit transports the dummy substrates between the second dummy substrate storage part and the second processing unit group. A dummy substrate is transported between groups. As a result, the transfer load of the dummy substrates is distributed, so that the interference between the transfer of the product substrates and the transfer of the dummy substrates is suppressed, and the transfer efficiency of the substrates can be improved. Also by this, productivity can be improved.
　さらに、特許文献１の場合とは異なり、ダミー基板を収容するダミーキャリヤによってキャリヤ保持部が長時間に亘って占有されることもない。それにより、製品用の基板を収容したキャリヤの搬入に待機時間が生じることを抑制できるので、生産性の向上に寄与することができる。 Furthermore, unlike the case of Patent Document 1, the carrier holding portion is not occupied for a long time by the dummy carrier that accommodates the dummy substrate. As a result, it is possible to suppress waiting time from being carried in the carrier containing substrates for products, so that it is possible to contribute to an improvement in productivity.
　しかも、この実施形態では、第１処理ユニット群および第２処理ユニット群に対して、個別に禁止モードおよび可能モードが設定可能であり、これらのモードは第１処理ユニット群に対応する第１ステータスおよび第２処理ユニット群に対応する第２ステータスとして、記憶部に記憶される。すなわち、第１処理ユニット群について、禁止モードまたは可能モードを表す第１ステータスが記憶部に記憶され、第２処理ユニット群について、禁止モードまたは可能モードを表す第２ステータスが記憶部に記憶される。禁止モードは、当該処理ユニット群において基板およびダミー基板のいずれも処理することができない動作状態である。可能モードは、当該処理ユニット群において基板を処理でき、かつダミー基板を用いる処理を実行することができる動作状態である。第１処理ユニット群および第２処理ユニット群は、したがって、個別に、禁止モードまたは可能モードとなる。すなわち、第１および第２処理ユニット群の両方が可能モードである場合、第１および第２処理ユニット群の両方が禁止モードである場合、ならびに第１および第２処理ユニット群の一方が可能モードで他方が禁止モードである場合があり得る。 Moreover, in this embodiment, the prohibition mode and the enable mode can be individually set for the first processing unit group and the second processing unit group, and these modes are the first statuses corresponding to the first processing unit group. and the second status corresponding to the second processing unit group in the storage unit. That is, for the first processing unit group, a first status indicating the prohibited mode or the enabled mode is stored in the storage section, and for the second processing unit group, the second status indicating the disabled mode or the enabled mode is stored in the storage section. . The prohibition mode is an operating state in which neither substrates nor dummy substrates can be processed in the processing unit group. The enabled mode is an operating state in which a substrate can be processed in the processing unit group and processing using a dummy substrate can be executed. The first group of processing units and the second group of processing units are thus individually in inhibit mode or enable mode. That is, if both the first and second processing unit groups are in enable mode, if both the first and second processing unit groups are in inhibit mode, and if one of the first and second processing unit groups is in enable mode and the other is in prohibited mode.
　そこで、この実施形態では、第１ステータス、すなわち第１処理ユニット群の動作状態が可能モードから禁止モードに遷移すると、第１処理ユニット群による処理が計画された基板の搬送スケジュールが変更される。具体的には、第１搬送ユニットによって第１処理ユニット群に搬送されるように計画された基板の搬送スケジュールが破棄され、当該基板を第２搬送ユニットによって、可能モードの第２処理ユニット群に搬送するための搬送スケジュールが新たに作成される。その結果、当該基板は、第２搬送ユニットによって、第２処理ユニット群を構成する第２処理ユニットへと搬送できるので、第２処理ユニットにおいて処理することが可能となる。第２ステータス、すなわち第２処理ユニット群の動作状態が可能モードから禁止モードに遷移する場合も同様に、第２処理ユニット群による処理が計画された基板の搬送スケジュールが変更される。具体的には、第２搬送ユニットによって第２処理ユニット群に搬送されるように計画された基板の搬送スケジュールが破棄され、当該基板を第１搬送ユニットによって、可能モードの第１処理ユニット群に搬送するための搬送スケジュールが新たに作成される。その結果、当該基板は、第１搬送ユニットによって、第１処理ユニット群を構成する処理ユニットへと搬送できるので、第１処理ユニット群によって処理することが可能となる。 Therefore, in this embodiment, when the first status, that is, the operating state of the first processing unit group transitions from the enabled mode to the prohibited mode, the transfer schedule of the substrates scheduled to be processed by the first processing unit group is changed. Specifically, the transfer schedule of the substrate planned to be transferred to the first processing unit group by the first transfer unit is discarded, and the substrate is transferred to the second processing unit group in the enable mode by the second transfer unit. A new transportation schedule for transportation is created. As a result, the substrate can be transported to the second processing units constituting the second processing unit group by the second transport unit, and can be processed in the second processing units. Similarly, when the second status, that is, the operation state of the second processing unit group transitions from the enabled mode to the prohibited mode, the transfer schedule of the substrates scheduled to be processed by the second processing unit group is changed. Specifically, the transfer schedule of the substrate planned to be transferred to the second processing unit group by the second transfer unit is discarded, and the substrate is transferred to the first processing unit group in the enable mode by the first transfer unit. A new transportation schedule for transportation is created. As a result, the substrate can be transported by the first transport unit to the processing units constituting the first processing unit group, and thus can be processed by the first processing unit group.
　このようにして、第１および第２処理ユニット群の一方が可能モードから禁止モードに遷移しても、他方の可能モードの処理ユニット群において、基板の搬送および処理を継続できる。それにより、基板処理装置全体のダウンタイムを少なくできるので、生産性を高めることができる。 In this way, even if one of the first and second processing unit groups transitions from the enabled mode to the prohibited mode, the other processing unit group in the enabled mode can continue to transport and process substrates. As a result, downtime of the substrate processing apparatus as a whole can be reduced, and productivity can be improved.
　この発明の一実施形態では、第１搬送ユニットは、第２処理ユニットおよび第２ダミー基板収容部のいずれにもアクセスできないように構成されている。また、この発明の一実施形態では、第２搬送ユニットは、第１処理ユニットおよび第１ダミー基板収容部のいずれにもアクセスできないように構成されている。 In one embodiment of the present invention, the first transfer unit is configured so that it cannot access either the second processing unit or the second dummy substrate accommodation section. Further, in one embodiment of the present invention, the second transport unit is configured so as not to be able to access either the first processing unit or the first dummy substrate accommodation section.
　この発明の一実施形態では、前記第３搬送ユニットは、キャリヤ保持部に保持されたキャリヤと前記基板載置部との間でダミー基板を搬送する。また、第１搬送ユニットは、前記複数の第１処理ユニット、前記基板載置部および前記第１ダミー基板収容部の間でダミー基板を搬送する。また、第２搬送ユニットは、前記複数の第２処理ユニット、前記基板載置部および前記第２ダミー基板収容部の間でダミー基板を搬送する。これにより、基板載置部を経由して、未使用のダミー基板を第１ダミー基板収容部および第２ダミー基板収容部に導入したり、使用済みのダミー基板を第１ダミー基板収容部および第２ダミー基板収容部からキャリヤへと排出したりすることができる。 In one embodiment of the invention, the third transport unit transports the dummy substrate between the carrier held by the carrier holding part and the substrate mounting part. Also, the first transport unit transports the dummy substrate among the plurality of first processing units, the substrate platform, and the first dummy substrate housing. Also, the second transport unit transports the dummy substrate between the plurality of second processing units, the substrate platform, and the second dummy substrate housing. Thus, an unused dummy substrate can be introduced into the first dummy substrate accommodation portion and the second dummy substrate accommodation portion via the substrate placement portion, or a used dummy substrate can be introduced into the first dummy substrate accommodation portion and the second dummy substrate accommodation portion. 2 can be discharged from the dummy substrate accommodation section to the carrier.
　この発明の一実施形態では、前記記憶部は、前記第１ダミー基板収容部に収容されるダミー基板の使用履歴情報と、前記第２ダミー基板収容部に収容されるダミー基板の使用履歴情報とを記憶する。前記基板処理装置は、前記記憶部に記憶されている前記使用履歴情報に基づいて、前記第１ダミー基板収容部および前記第２ダミー基板収容部に収容されるダミー基板の交換の要否を判断し、前記第１ダミー基板収容部に収容されるダミー基板の交換が必要であると判断されると前記第１ステータスを禁止モードとし、前記第２ダミー基板収容部に収容されるダミー基板の交換が必要であると判断されると前記第２ステータスを禁止モードとする、ステータス設定部をさらに含む。 In one embodiment of the present invention, the storage unit stores usage history information of the dummy substrates accommodated in the first dummy substrate accommodation unit and usage history information of the dummy substrates accommodated in the second dummy substrate accommodation unit. memorize The substrate processing apparatus determines necessity of replacement of the dummy substrates accommodated in the first dummy substrate accommodation unit and the second dummy substrate accommodation unit based on the usage history information stored in the storage unit. When it is determined that the dummy substrate accommodated in the first dummy substrate accommodation portion needs to be replaced, the first status is set to the prohibition mode, and the dummy substrate accommodated in the second dummy substrate accommodation portion is replaced. a status setting unit that sets the second status to the prohibition mode when it is determined that the second status is necessary.
　この構成により、ダミー基板の使用履歴に基づいてダミー基板の交換の要否が適切に判断され、それに応じて、第１ステータスおよび第２ステータスを適切に禁止モードに設定できる。すなわち、ダミー基板の交換が必要になると、処理ユニットにおいてダミー基板を用いた処理を行うことができなくなるので、当該処理ユニットを含む処理ユニット群のステータスが禁止モードとなる。前述のとおり、第１ステータスおよび第２ステータスは個別に設定されるので、第１ステータスおよび第２ステータスの一方が禁止モードとなっても、他方が可能モードであれば、当該可能モードのステータスの処理ユニット群において、基板に対する処理およびダミー基板を用いた処理を継続できる。その一方で、禁止モードの処理ユニット群に対応するダミー基板収容部のダミー基板を交換することができる。こうして、ダミー基板の交換が必要になったときでも、基板の処理を継続できるので、生産性を向上することができる。 With this configuration, it is possible to appropriately determine whether or not the dummy substrate needs to be replaced based on the usage history of the dummy substrate, and accordingly set the first status and the second status to the prohibition mode. That is, when the dummy substrate needs to be replaced, processing using the dummy substrate cannot be performed in the processing unit, so the status of the processing unit group including the processing unit becomes the prohibition mode. As described above, the first status and the second status are set individually. Therefore, even if one of the first status and the second status is the prohibited mode, if the other is the possible mode, the status of the possible mode is changed. In the processing unit group, the processing of the substrate and the processing using the dummy substrate can be continued. On the other hand, it is possible to replace the dummy substrates in the dummy substrate housing portions corresponding to the processing unit group in the prohibition mode. In this way, even when it becomes necessary to replace the dummy substrate, the processing of the substrate can be continued, so that the productivity can be improved.
　この発明の一実施形態では、前記スケジュール作成部は、前記第１処理ユニット群が禁止モードのときに前記キャリヤ保持部に保持されたキャリヤと前記第１ダミー基板収容部との間で前記第１搬送ユニットおよび前記第３搬送ユニットによってダミー基板を搬送し、前記第２処理ユニット群が禁止モードのときに前記キャリヤ保持部に保持されたキャリヤと前記第２ダミー基板収容部との間で前記第２搬送ユニットおよび前記第３搬送ユニットによってダミー基板を搬送するための搬送スケジュールを作成する。 In one embodiment of the present invention, the schedule creation section creates the first dummy substrate holding section between the carrier held by the carrier holding section and the first dummy substrate accommodation section when the first processing unit group is in the inhibit mode. A dummy substrate is transported by the transport unit and the third transport unit, and when the second processing unit group is in the prohibition mode, the carrier held by the carrier holding part and the second dummy substrate accommodating part move between the carrier holding part and the second dummy substrate accommodating part. A transfer schedule is created for transferring the dummy substrates by the second transfer unit and the third transfer unit.
　この構成によれば、禁止モードの処理ユニット群に対応するダミー基板収容部に対して、ダミー基板の搬入および／または搬出が行われる。したがって、可能モードの処理ユニット群において製品用の基板の搬送および処理を行う一方で、禁止モードの処理ユニット群に対応したダミー基板収容部にダミー基板を搬入したり、当該ダミー基板収容部からダミー基板を搬出したりすることができる。これにより、基板処理装置全体の動作を停止させることなく、ダミー基板の導入、排出または交換を行うことができる。それにより、ダミー基板の導入、排出または交換に起因する生産停止を回避できるので、生産性を高めることができる。 According to this configuration, the dummy substrates are loaded into and/or unloaded from the dummy substrate storage units corresponding to the processing unit group in the prohibition mode. Therefore, while product substrates are transported and processed in the processing unit group in the enable mode, dummy substrates are carried into the dummy substrate storage units corresponding to the processing unit groups in the prohibition mode, and dummy substrates are transported from the dummy substrate storage units. The substrate can be carried out. Thus, introduction, ejection or replacement of the dummy substrate can be performed without stopping the operation of the entire substrate processing apparatus. As a result, it is possible to avoid stoppage of production due to the introduction, removal or replacement of dummy substrates, thereby enhancing productivity.
　この発明の一実施形態では、前記基板載置部は、前記第１搬送ユニットおよび前記第３搬送ユニットがアクセス可能な第１基板載置部と、前記第２搬送ユニットおよび前記第３搬送ユニットがアクセス可能な第２基板載置部とを含む。前記第１搬送ユニットは、前記複数の第１処理ユニットおよび前記第１基板載置部の間で基板を搬送し、前記複数の第１処理ユニット、前記第１基板載置部および前記第１ダミー基板収容部の間でダミー基板を搬送する。前記第２搬送ユニットは、前記複数の第２処理ユニットおよび前記第２基板載置部の間で基板を搬送し、前記複数の第２処理ユニット、前記第２基板載置部および前記第２ダミー基板収容部の間でダミー基板を搬送する。前記第３搬送ユニットは、前記キャリヤ保持部に保持されたキャリヤと前記第１基板載置部との間で基板およびダミー基板を搬送し、前記キャリヤ保持部に保持されたキャリヤと前記第２基板載置部との間で基板およびダミー基板を搬送する。 In one embodiment of the present invention, the substrate platform includes a first substrate platform accessible by the first transport unit and the third transport unit, and a substrate platform accessible by the second transport unit and the third transport unit. and an accessible second substrate rest. The first transport unit transports the substrate between the plurality of first processing units and the first substrate platform, and the plurality of first processing units, the first substrate platform and the first dummy. A dummy substrate is transported between the substrate housing units. The second transport unit transports the substrate between the plurality of second processing units and the second substrate platform, and the plurality of second processing units, the second substrate platform and the second dummy. A dummy substrate is transported between the substrate housing units. The third transport unit transports substrates and dummy substrates between the carrier held by the carrier holding portion and the first substrate mounting portion, and carries the carrier held by the carrier holding portion and the second substrate. The substrate and the dummy substrate are transported to and from the mounting section.
　この構成によれば、第１処理ユニット群に対応した第１基板載置部と、第２処理ユニット群に対応した第２基板載置部とが設けられている。それにより、第１処理ユニット群に対する基板の搬送および第１ダミー基板収容部に対するダミー基板の搬送と、第２処理ユニット群に対する基板の搬送および第２ダミー基板収容部に対するダミー基板の搬送との干渉を少なくすることができる。それにより、基板搬送効率が高まるので、生産性を高めることができる。 According to this configuration, the first substrate platform corresponding to the first processing unit group and the second substrate platform corresponding to the second processing unit group are provided. As a result, interference occurs between the substrate transfer to the first processing unit group and the dummy substrate transfer to the first dummy substrate accommodation portion, and the substrate transfer to the second processing unit group and the dummy substrate transfer to the second dummy substrate accommodation portion. can be reduced. As a result, substrate transfer efficiency increases, and productivity can be improved.
　この発明の一実施形態では、前記第３搬送ユニットが、前記第１ダミー基板収容部および前記第２ダミー基板収容部にアクセス可能に構成されており、前記スケジュール作成部は、前記第１処理ユニット群が禁止モードのときに前記キャリヤ保持部に保持されたキャリヤと前記第１ダミー基板収容部との間で前記第３搬送ユニットによってダミー基板を搬送し、前記第２処理ユニット群が禁止モードのときに前記キャリヤ保持部に保持されたキャリヤと前記第２ダミー基板収容部との間で前記第３搬送ユニットによってダミー基板を搬送するための搬送スケジュールを作成する。 In one embodiment of the present invention, the third transfer unit is configured to be able to access the first dummy substrate accommodation section and the second dummy substrate accommodation section, and the schedule creation section includes the first processing unit. When the group is in the prohibition mode, the third transport unit transports the dummy substrates between the carrier held by the carrier holding portion and the first dummy substrate accommodating portion, and the second processing unit group is in the prohibition mode. Sometimes, a transfer schedule is created for transferring the dummy substrates by the third transfer unit between the carrier held by the carrier holding portion and the second dummy substrate accommodation portion.
　この構成によれば、第３搬送ユニットが第１ダミー基板収容部と第２ダミー基板収容部とにアクセス可能であるので、キャリヤ保持部に保持されたキャリヤと第１および第２ダミー基板収容部との間でダミー基板を直接的に、すなわち、第１または第２主搬送ロボットの関与なしに、搬送することができる。これにより、ダミー基板の導入、排出または交換を速やかに行うことができ、かつ第１および第２主搬送ロボットの搬送負荷を軽減して、生産性の向上に寄与できる。 According to this configuration, since the third transfer unit can access the first dummy substrate accommodation portion and the second dummy substrate accommodation portion, the carrier held by the carrier holding portion and the first and second dummy substrate accommodation portions directly, i.e. without the involvement of the first or second main transfer robot. As a result, introduction, ejection or replacement of dummy substrates can be performed quickly, and the transfer load of the first and second main transfer robots can be reduced, contributing to improved productivity.
　この発明の一実施形態では、前記基板処理装置は、第１処理ブロック層と、前記第１処理ブロック層の上方に位置する第２処理ブロック層とを含み、前記第１処理ブロック層に前記第１処理ユニット群が配置されており、前記第２処理ブロック層に前記第２処理ユニット群が配置されている。 In one embodiment of the present invention, the substrate processing apparatus includes a first process block layer and a second process block layer located above the first process block layer, wherein the first process block layer has the second process block layer. One processing unit group is arranged, and the second processing unit group is arranged in the second processing block layer.
　この発明の一実施形態では、前記基板処理装置は、第１処理ブロック部と、前記第１処理ブロック部の側方に位置する第２処理ブロック部とを含み、前記第１処理ブロック部に前記第１処理ユニット群が配置されており、前記第２処理ブロック部に前記第２処理ユニット群が配置されている。 In one embodiment of the present invention, the substrate processing apparatus includes a first processing block section and a second processing block section positioned to the side of the first processing block section, and the first processing block section includes the A first processing unit group is arranged, and the second processing unit group is arranged in the second processing block portion.
　この発明の一実施形態では、前記第１ダミー基板収容部および前記第２ダミー基板収容部が、平面視において、前記基板載置部と重なっている。 In one embodiment of the present invention, the first dummy substrate housing portion and the second dummy substrate housing portion overlap the substrate mounting portion in plan view.
　この構成によれば、基板載置部の上方または下方の空間を利用して、平面視において基板載置部と重なるようにダミー基板収容部を配置できる。これにより、製品用の基板の搬送を阻害しないダミー基板収容部の配置を実現でき、かつ空間利用効率のよい配置を達成できる。 According to this configuration, the space above or below the substrate mounting portion can be used to dispose the dummy substrate accommodating portion so as to overlap the substrate mounting portion in a plan view. As a result, it is possible to realize an arrangement of the dummy substrate accommodating portions that does not hinder the transportation of the product substrates, and to achieve an arrangement with good space utilization efficiency.
　ダミー基板収容部が平面視において基板載置部に重なり合う配置は、具体的には、ダミー基板収容部に収容されたダミー基板の一部または全部が基板載置部に保持された基板に重なり合う配置であってもよい。 The arrangement in which the dummy substrate accommodating portion overlaps the substrate mounting portion in a plan view is specifically an arrangement in which part or all of the dummy substrate accommodated in the dummy substrate accommodating portion overlaps the substrate held in the substrate mounting portion. may be
　この発明の一実施形態では、前記第１ダミー基板収容部および前記第２ダミー基板収容部が、前記基板載置部を挟んで上下に振り分けて配置されている。 In one embodiment of the present invention, the first dummy substrate housing portion and the second dummy substrate housing portion are arranged vertically with the substrate mounting portion interposed therebetween.
　この発明の一実施形態は、搬送スケジュールに従って、第１処理ユニット群に属する複数の第１処理ユニットと基板載置部との間で、第１搬送ユニットによって基板を搬送する工程と、前記第１処理ユニットにおいて、前記第１搬送ユニットによって搬送された基板を処理する工程と、前記搬送スケジュールに従って、前記複数の第１処理ユニットと第１ダミー基板収容部との間で、前記第１搬送ユニットによってダミー基板を搬送する工程と、前記第１処理ユニットにおいて、前記第１搬送ユニットによって搬送されたダミー基板を用いたダミー処理を実行する工程と、前記搬送スケジュールに従って、第２処理ユニット群に属する複数の第２処理ユニットと前記基板載置部との間で、第２搬送ユニットによって基板を搬送する工程と、前記第２処理ユニットにおいて、前記第２搬送ユニットによって搬送された基板を処理する工程と、前記搬送スケジュールに従って、前記複数の第２処理ユニットと第２ダミー基板収容部との間で、前記第２搬送ユニットによってダミー基板を搬送する工程と、前記第２処理ユニットにおいて、前記第２搬送ユニットによって搬送されたダミー基板を用いたダミー処理を実行する工程と、前記搬送スケジュールに従って、キャリヤ保持部に保持されたキャリヤと前記基板載置部との間で、第３搬送ユニットによって基板を搬送する工程と、前記第１処理ユニット群に対して、前記第１処理ユニット群に含まれる前記第１処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理をいずれも実行することができない禁止モードと、前記第１処理ユニット群に含まれる前記第１処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理を実行することができる可能モードとを含む第１ステータスを設定する工程と、前記第２処理ユニット群に対して、前記第２処理ユニット群に含まれる前記第２処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理をいずれも実行することができない禁止モードと、前記第２処理ユニット群に含まれる前記第２処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理を実行することができる可能モードとを含む第２ステータスを設定する工程と、前記第１ステータスが可能モードから禁止モードになると、前記第１搬送ユニットによって前記第１処理ユニット群のいずれかの前記第１処理ユニットに搬送されるように計画された基板（とくにキャリヤから払い出し前の基板）の搬送スケジュールを破棄し、当該基板が前記第２搬送ユニットによって前記第２処理ユニット群のいずれかの前記第２処理ユニットに搬送されるように、前記搬送スケジュールを作成する工程と、前記第２ステータスが可能モードから禁止モードになると、前記第２搬送ユニットよって前記第２処理ユニット群のいずれかの前記第２処理ユニットに搬送されるように計画された基板（とくにキャリヤから払い出し前の基板）の搬送スケジュールを破棄し、当該基板が前記第１搬送ユニットによって前記第１処理ユニット群のいずれかの前記第１処理ユニットに搬送されるように、前記搬送スケジュールを作成する工程と、を含む、基板処理方法を提供する。 An embodiment of the present invention includes the steps of: transporting a substrate by a first transport unit between a plurality of first processing units belonging to a first processing unit group and a substrate platform according to a transport schedule; in a processing unit, processing the substrates transported by the first transport unit; and performing processing by the first transport unit between the plurality of first processing units and a first dummy substrate accommodation unit according to the transport schedule. transporting a dummy substrate; performing, in the first processing unit, dummy processing using the dummy substrate transported by the first transport unit; transferring the substrate by a second transfer unit between the second processing unit and the substrate platform; and processing the substrate transferred by the second transfer unit in the second processing unit. a step of transporting the dummy substrates by the second transport unit between the plurality of second processing units and a second dummy substrate accommodation part according to the transport schedule; performing dummy processing using a dummy substrate transported by the unit; and transporting the substrate by a third transport unit between the carrier held by the carrier holding part and the substrate platform according to the transport schedule. a prohibition mode in which neither processing on a substrate nor processing using a dummy substrate can be performed in the first processing units included in the first processing unit group, for the first processing unit group; setting a first status including a possible mode in which the first processing units included in the first processing unit group can perform processing on a substrate and processing using a dummy substrate; and setting the second processing unit group. , a prohibition mode in which neither processing on a substrate nor processing using a dummy substrate can be performed in the second processing unit included in the second processing unit group, and the setting a second status including a possible mode in which processing on a substrate and processing using a dummy substrate can be performed in a second processing unit; any of the first processing units of the first processing unit group by the transport unit; canceling a transfer schedule of a substrate (especially a substrate before being discharged from a carrier) scheduled to be transferred to a carrier, and transferring the substrate to any one of the second processing unit groups by the second transfer unit; creating the transfer schedule so as to be transferred to the unit; and performing the second processing of any one of the second processing units by the second transfer unit when the second status changes from the enable mode to the prohibition mode. A transfer schedule of a substrate planned to be transferred to a unit (especially a substrate before being discharged from a carrier) is discarded, and the substrate is transferred to any one of the first processing unit groups by the first transfer unit. and creating the transfer schedule so that the substrate is transferred to a unit.
　この発明の一実施形態では、前記第１ステータスを設定する工程は、前記第１ダミー基板収容部に収容されるダミー基板の使用履歴情報に基づいて、前記第１ダミー基板収容部に収容されるダミー基板の交換の要否を判断し、前記第１ダミー基板収容部に収容されるダミー基板の交換が必要であると判断されると前記第１ステータスを禁止モードとする。前記第２ステータスを設定する工程は、前記第２ダミー基板収容部に収容されるダミー基板の使用履歴情報に基づいて、前記第２ダミー基板収容部に収容されるダミー基板の交換の要否を判断し、前記第２ダミー基板収容部に収容されるダミー基板の交換が必要であると判断されると前記第２ステータスを禁止モードとする。 In one embodiment of the present invention, the step of setting the first status includes storing the dummy substrate in the first dummy substrate housing portion based on usage history information of the dummy substrate housed in the first dummy substrate housing portion. It is determined whether or not the dummy substrate needs to be replaced, and when it is determined that the dummy substrate accommodated in the first dummy substrate accommodation portion needs to be replaced, the first status is set to the prohibition mode. The step of setting the second status determines whether or not the dummy substrate accommodated in the second dummy substrate accommodation portion needs to be replaced based on usage history information of the dummy substrate accommodated in the second dummy substrate accommodation portion. When it is determined that the dummy substrate accommodated in the second dummy substrate accommodating portion needs to be replaced, the second status is set to the prohibition mode.
　本発明における上述の、またはさらに他の目的、特徴および効果は、添付図面を参照して次に述べる実施形態の説明により明らかにされる。 The above and further objects, features and effects of the present invention will be made clear by the following description of the embodiments with reference to the accompanying drawings.
図１は、この発明の一実施形態に係る基板処理装置の内部構成を示す図解的な平面図である。FIG. 1 is an illustrative plan view showing the internal configuration of a substrate processing apparatus according to one embodiment of the present invention. 図２は、図１のII－II線から見た図解的な縦断面図である。FIG. 2 is a schematic longitudinal sectional view seen from the II-II line of FIG. 図３は、図１のIII－III線から見た図解的な横断面図である。FIG. 3 is a schematic cross-sectional view seen from line III--III in FIG. 図４は、図１のIV方向から見て処理ブロックの内部構成を示す図解的な立面図である。FIG. 4 is an illustrative elevation view showing the internal configuration of the processing block as seen from direction IV in FIG. 図５は、基板載置部の構成例を説明するための図である。FIG. 5 is a diagram for explaining a configuration example of the substrate platform. 図６は、ダミー基板収容部の構成例を説明するための図である。FIG. 6 is a diagram for explaining a configuration example of a dummy substrate accommodating portion. 図７は、処理ユニットの構成例を説明するための図解的な断面図である。FIG. 7 is an illustrative cross-sectional view for explaining a configuration example of the processing unit. 図８は、基板処理装置の制御に関する構成を説明するためのブロック図である。FIG. 8 is a block diagram for explaining a configuration related to control of the substrate processing apparatus. 図９は、ダミー処理に関連するコントローラの動作を説明するためのフローチャートである。FIG. 9 is a flowchart for explaining the operation of the controller related to dummy processing. 図１０は、第１処理ブロック層の第１ステータスおよび第２処理ブロック層の第２ステータスの遷移、ならびにそれらに基づく搬送スケジュールの変更についての動作例を説明するためのフローチャートである。FIG. 10 is a flow chart for explaining an operation example of the transition of the first status of the first processing block layer and the second status of the second processing block layer, and the change of the transfer schedule based thereon. 図１１は、ダミー基板収容部に対する未使用のダミー基板の搬入および使用済みダミー基板の搬出に関する動作例を説明するためのフローチャートである。FIG. 11 is a flow chart for explaining an operation example regarding loading of unused dummy substrates into and unloading of used dummy substrates from the dummy substrate accommodating portion. 図１２Ａは、第１ステータスおよび第２ステータスがいずれも可能モードであるときの基板搬送動作の一例を示すタイムチャートである。FIG. 12A is a time chart showing an example of the substrate transfer operation when both the first status and the second status are possible modes. 図１２Ｂは、第２ステータスが可能モードから禁止モードに遷移する場合の基板搬送動作の一例を示すタイムチャートである。FIG. 12B is a time chart showing an example of the substrate transfer operation when the second status transitions from the enabled mode to the prohibited mode. 図１３は、この発明の他の実施形態に係る基板処理装置の内部構成を示す図解的な縦断面図である。FIG. 13 is an illustrative longitudinal sectional view showing the internal configuration of a substrate processing apparatus according to another embodiment of the invention. 図１４は、この発明のさらに他の実施形態に係る基板処理装置の内部構成を示す図解的な縦断面図である。FIG. 14 is an illustrative longitudinal sectional view showing the internal configuration of a substrate processing apparatus according to still another embodiment of the invention. 図１５は、この発明のさらに他の実施形態に係る基板処理装置の内部構成を示す図解的な平面図である。FIG. 15 is an illustrative plan view showing the internal configuration of a substrate processing apparatus according to still another embodiment of the invention.
　図１は、この発明の一実施形態に係る基板処理装置の内部構成を示す図解的な平面図である。図２は、図１のII－II線から見た図解的な縦断面図である。図３は、図１のIII－III線から見た図解的な横断面図である。図４は、図１のIV方向から見て一部の内部構成を示す図解的な立面図である。 FIG. 1 is an illustrative plan view showing the internal configuration of a substrate processing apparatus according to one embodiment of the present invention. FIG. 2 is a schematic longitudinal sectional view seen from the II-II line of FIG. FIG. 3 is a schematic cross-sectional view seen from line III--III in FIG. FIG. 4 is an illustrative elevation view showing a part of the internal configuration as seen from direction IV in FIG.
　基板処理装置１は、インデクサブロック２と、インデクサブロック２の横方向（第１水平方向Ｘ）に隣接された処理ブロック３とを含む。 The substrate processing apparatus 1 includes an indexer block 2 and a processing block 3 adjacent to the indexer block 2 in the lateral direction (first horizontal direction X).
　インデクサブロック２は、複数（この実施形態では４個）のキャリヤ保持部２５（ロードポート）と、インデクサロボット２６とを含む。以下では、便宜的に、第１水平方向Ｘに関してキャリヤ保持部２５の側を前方と定義し、その反対側を後方と定義して説明する場合がある。 The indexer block 2 includes multiple (four in this embodiment) carrier holding portions 25 (load ports) and an indexer robot 26 . Hereinafter, for the sake of convenience, the side of the carrier holding portion 25 with respect to the first horizontal direction X may be defined as the front side, and the opposite side may be defined as the rear side.
　複数のキャリヤ保持部２５は、第１水平方向Ｘに直交する第２水平方向Ｙに沿って配列されている。各キャリヤ保持部２５は、工場内に備えられたキャリヤ搬送機構３００によって自動搬送されるキャリヤＣを受け容れて保持できるように構成されている。各キャリヤ保持部２５は、一つのキャリヤＣを保持できるように構成されている。キャリヤＣは、処理対象の基板Ｗ（製品基板）を収容する基板収容器である。キャリヤＣの一例は、ＦＯＵＰ(Front Opening Unified Pod)である。キャリヤＣは、複数枚（たとえば２５枚）の基板Ｗを積層状態で保持できるように構成されている。より具体的には、キャリヤＣは、キャリヤ保持部２５に保持されたときに、複数枚の基板Ｗを水平姿勢で上下方向Ｚに沿って積層状態で保持できるように構成されている。キャリヤ保持部２５は、基板収容器であるキャリヤＣを保持する収容器保持部の一例である。基板Ｗは、たとえば、半導体ウエハである。 The plurality of carrier holding parts 25 are arranged along the second horizontal direction Y orthogonal to the first horizontal direction X. Each carrier holding portion 25 is configured to receive and hold a carrier C automatically conveyed by a carrier conveying mechanism 300 provided in the factory. Each carrier holding portion 25 is configured to hold one carrier C. As shown in FIG. The carrier C is a substrate container that accommodates substrates W (product substrates) to be processed. An example of a carrier C is a FOUP (Front Opening Unified Pod). The carrier C is configured to hold a plurality of (for example, 25) substrates W in a stacked state. More specifically, the carrier C is configured to be able to hold a plurality of substrates W in a horizontal posture in a stacked state along the vertical direction Z when held by the carrier holding portion 25 . The carrier holding portion 25 is an example of a container holding portion that holds the carrier C, which is a substrate container. The substrate W is, for example, a semiconductor wafer.
　インデクサロボット２６は、第３搬送ユニットの一例である。インデクサロボット２６は、複数のキャリヤ保持部２５にそれぞれ保持されるキャリヤＣにアクセスして、基板Ｗを搬入／搬出し、キャリヤ保持部２５と処理ブロック３との間で基板Ｗを搬送できるように構成されている。この実施形態では、インデクサロボット２６は、多関節アーム２７を備えた多関節アームロボットである。具体的には、インデクサロボット２６は、複数のアーム２８を連結した多関節アーム２７と、多関節アーム２７の先端に結合された一つ以上のハンド２９と、多関節アーム２７を支持して上下動する基台部３０とを含む。多関節アーム２７を構成する複数のアーム２８およびハンド２９は、各基端部に設定された垂直な揺動軸線まわりに揺動可能であり、図示は省略するが、各アーム２８およびハンド２９を揺動するための個別のアクチュエータ（典型的には電動モータ）が備えられている。 The indexer robot 26 is an example of a third transport unit. The indexer robot 26 accesses the carriers C respectively held by the plurality of carrier holding units 25 , loads and unloads the substrates W, and transfers the substrates W between the carrier holding units 25 and the processing block 3 . It is configured. In this embodiment, indexer robot 26 is an articulated arm robot with articulated arm 27 . Specifically, the indexer robot 26 supports a multi-joint arm 27 connecting a plurality of arms 28, one or more hands 29 coupled to the tip of the multi-joint arm 27, and moves up and down while supporting the multi-joint arm 27. and a base portion 30 that moves. A plurality of arms 28 and hands 29 that constitute the articulated arm 27 are capable of swinging about a vertical swing axis set at each base end. A separate actuator (typically an electric motor) is provided for rocking.
　処理ブロック３は、上下方向Ｚに積層された複数の処理ブロック層ＢＬ，ＢＵを含む。この実施形態では、処理ブロック３は、第１層（下層）の処理ブロック層（以下「第１処理ブロック層ＢＬ」という。）と、その上方に積層された第２層（上層）の処理ブロック層（以下「第２処理ブロック層ＢＵ」という。）とを含む。以下では、第１処理ブロック層ＢＬの構成要素と第２処理ブロック層ＢＵとの構成要素を区別するときには、第１処理ブロック層ＢＬの構成要素については英文字「Ｌ」を末尾に有する参照符号を用い、第２処理ブロック層ＢＵの構成要素については英文字「Ｕ」末尾に有する参照符号を用いる。添付図面中の参照符号も同様である。 The processing block 3 includes a plurality of processing block layers BL and BU stacked in the vertical direction Z. In this embodiment, the processing blocks 3 are composed of a first layer (lower layer) of processing blocks (hereinafter referred to as “first processing block layer BL”) and a second layer (upper layer) of processing blocks stacked thereabove. layer (hereinafter referred to as "second processing block layer BU"). Hereinafter, when distinguishing between the components of the first processing block layer BL and the components of the second processing block layer BU, the components of the first processing block layer BL will be referred to by reference numerals having the English letter “L” at the end. , and for the components of the second processing block layer BU, reference numerals having the English letter "U" at the end are used. The same applies to reference numerals in the attached drawings.
　第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵの平面視における内部構成は実質的に同じである。したがって、図１において、参照符号の末尾の英文字「Ｕ」を英文字「Ｌ」に置き換えて読むことにより、第１処理ブロック層ＢＬの構成（平面視における配置）が表されることに留意されたい。 The internal configuration in plan view of the first processing block layer BL and the second processing block layer BU are substantially the same. Therefore, in FIG. 1, it should be noted that the configuration of the first processing block layer BL (arrangement in plan view) is expressed by replacing the English letter "U" at the end of the reference numerals with the English letter "L". want to be
　第１処理ブロック層ＢＬは、複数（この実施形態では、１２個）の処理ユニット１１Ｌ－１３Ｌ，２１Ｌ－２３Ｌ，３１Ｌ－３３Ｌ，４１Ｌ－４３Ｌ（以下、第１処理ブロック層ＢＬの処理ユニットを総称するときには「処理ユニット１１Ｌ－４３Ｌ」という。）を含み、これらは第１処理ユニット群を構成している。第１処理ブロック層ＢＬは、さらに、基板載置部６Ｌと、ダミー基板収容部７Ｌと、主搬送ロボット８Ｌとを含む。複数の処理ユニット１１Ｌ－４３Ｌは、基板Ｗに対して処理を行う。この実施形態では、各処理ユニット１１Ｌ－４３Ｌは、基板Ｗを１枚ずつ処理する枚葉型処理ユニットである。基板載置部６Ｌは、インデクサロボット２６と第１処理ブロック層ＢＬとの間で受け渡しされる基板Ｗを一時保持するためのユニットである。ダミー基板収容部７Ｌは、処理ユニット１１Ｌ－４３Ｌにおいて使用可能なダミー基板ＤＷを基板処理装置１の内部で保持しておくためのユニットであり、ダミー基板ＤＷの待機場所を提供する。主搬送ロボット８Ｌは、基板載置部６Ｌ、処理ユニット１１Ｌ－４３Ｌおよびダミー基板収容部７Ｌにアクセス可能に構成されている。主搬送ロボット８Ｌは、基板載置部６Ｌと処理ユニット１１Ｌ－４３Ｌとの間で基板Ｗを搬送し、かつダミー基板収容部７Ｌと処理ユニット１１Ｌ－４３Ｌとの間でダミー基板ＤＷを搬送する第１搬送ユニットの一例である。 The first processing block layer BL includes a plurality (12 in this embodiment) of processing units 11L-13L, 21L-23L, 31L-33L, and 41L-43L (hereinafter collectively referred to as the processing units of the first processing block layer BL). (hereinafter referred to as "processing units 11L-43L"), which constitute a first processing unit group. The first processing block layer BL further includes a substrate placement section 6L, a dummy substrate accommodation section 7L, and a main transfer robot 8L. A plurality of processing units 11L-43L perform processing on the substrate W. FIG. In this embodiment, each of the processing units 11L-43L is a single-wafer type processing unit that processes substrates W one by one. The substrate platform 6L is a unit for temporarily holding the substrate W transferred between the indexer robot 26 and the first processing block layer BL. The dummy substrate storage unit 7L is a unit for holding the dummy substrates DW usable in the processing units 11L-43L inside the substrate processing apparatus 1, and provides a standby place for the dummy substrates DW. The main transfer robot 8L is configured to be able to access the substrate placement section 6L, the processing units 11L-43L and the dummy substrate accommodation section 7L. The main transport robot 8L transports substrates W between the substrate platform 6L and the processing units 11L-43L, and transports dummy substrates DW between the dummy substrate storage unit 7L and the processing units 11L-43L. This is an example of one transport unit.
　ダミー基板ＤＷとは、基板Ｗと同様の形状（たとえば円形）および大きさを有する基板である。ダミー基板ＤＷは、キャリヤＣから供給される製品用の基板Ｗとは異なり、実際の製品の製造には利用されない。ダミー基板ＤＷは、処理ユニット１１Ｌ－４３Ｌ内の環境を整える前処理（準備処理）、処理ユニット１１Ｌ－４３Ｌ内を洗浄するためのユニット洗浄処理などを実行するために、処理ユニット１１Ｌ－４３Ｌに導入されて用いられる。このようにダミー基板ＤＷを用いる処理を、以下では「ダミー処理」という。前述の前処理およびユニット洗浄処理は、処理ユニット１１Ｌ－４３Ｌのメンテナンスのためのメンテナンス処理であり、ダミー処理はこのようなメンテナンス処理を含む。 The dummy substrate DW is a substrate having the same shape (for example, circular shape) and size as the substrate W. The dummy substrate DW is different from the substrate W for the product supplied from the carrier C and is not used for manufacturing the actual product. The dummy substrate DW is introduced into the processing unit 11L-43L in order to perform preprocessing (preparation processing) for preparing the environment in the processing unit 11L-43L, unit cleaning processing for cleaning the inside of the processing unit 11L-43L, and the like. is used. Processing using the dummy substrate DW in this manner is hereinafter referred to as “dummy processing”. The aforementioned pretreatment and unit cleaning treatment are maintenance treatments for maintenance of the treatment units 11L-43L, and the dummy treatment includes such maintenance treatments.
　複数の処理ユニット１１Ｌ－４３Ｌは、主搬送ロボット８Ｌによって基板Ｗが搬送される搬送経路５１Ｌを提供する搬送空間５２Ｌに沿って、当該搬送空間５２Ｌの両側に配列され、搬送空間５２Ｌに臨んでいる。搬送空間５２Ｌは、平面視において、第２水平方向Ｙに一定の幅を有し、第１水平方向Ｘに沿ってインデクサブロック２から離れる方向に直線的に延びている。搬送空間５２Ｌは、上下方向Ｚに関して、第１処理ブロック層ＢＬの高さとほぼ同等の高さを有している。平面視において、搬送空間５２Ｌの一方側には、インデクサブロック２に近い側から順に、第１液供給部９１、第１処理ユニットスタックＳ１Ｌ、第１排気部１０１、第２液供給部９２、第２処理ユニットスタックＳ２Ｌおよび第２排気部１０２が、搬送経路５１Ｌに沿って配列されている。搬送空間５２Ｌの他方側には、インデクサブロック２に近い側から順に、第３排気部１０３、第３処理ユニットスタックＳ３Ｌ、第３液供給部９３、第４排気部１０４、第４処理ユニットスタックＳ４Ｌおよび第４液供給部９４が、搬送経路５１Ｌに沿って配列されている。これらがほぼ直方体形状の搬送空間５２Ｌを区画するように配列されている。 The plurality of processing units 11L-43L are arranged on both sides of the transport space 52L along the transport space 52L that provides the transport path 51L along which the substrate W is transported by the main transport robot 8L, and face the transport space 52L. . The transfer space 52L has a constant width in the second horizontal direction Y and linearly extends in the first horizontal direction X in a direction away from the indexer block 2 in plan view. The transfer space 52L has a height in the vertical direction Z substantially equal to the height of the first processing block layer BL. In a plan view, on one side of the transfer space 52L, in order from the side closer to the indexer block 2, a first liquid supply section 91, a first processing unit stack S1L, a first exhaust section 101, a second liquid supply section 92, a second A two-processing unit stack S2L and a second exhaust section 102 are arranged along the transport path 51L. On the other side of the transfer space 52L, in order from the side closer to the indexer block 2, there are a third exhaust section 103, a third processing unit stack S3L, a third liquid supply section 93, a fourth exhaust section 104, and a fourth processing unit stack S4L. and a fourth liquid supply unit 94 are arranged along the transport path 51L. These are arranged so as to partition a substantially rectangular parallelepiped transfer space 52L.
　第１～第４処理ユニットスタックＳ１Ｌ－Ｓ４Ｌは、それぞれ、上下方向Ｚに積層された複数段（この実施形態では３段）の処理ユニット１１Ｌ－１３Ｌ，２１Ｌ－２３Ｌ，３１Ｌ－３３Ｌ，４１Ｌ－４３Ｌを含む。第３処理ユニットスタックＳ３Ｌは、搬送空間５２Ｌを挟んで第１処理ユニットスタックＳ１Ｌに対向している。第４処理ユニットスタックＳ４Ｌは、搬送空間５２Ｌを挟んで第２処理ユニットスタックＳ２Ｌに対向している。したがって、第３処理ユニットスタックＳ３Ｌを構成する複数の処理ユニット３１Ｌ－３３Ｌは、第１処理ユニットスタックＳ１Ｌを構成する複数段の処理ユニット１１Ｌ－１３Ｌに搬送空間５２Ｌを挟んで対向している。同様に、第４処理ユニットスタックＳ４Ｌを構成する複数段の処理ユニット４１Ｌ－４３Ｌは、第２処理ユニットスタックＳ２Ｌを構成する複数段の処理ユニット２１Ｌ－２３Ｌに搬送空間５２Ｌを挟んで対向している。この実施形態では、第１処理ブロック層ＢＬは、１２個の処理ユニット１１Ｌ－１３Ｌ，２１Ｌ－２３Ｌ，３１Ｌ－３３Ｌ，４１Ｌ－４３Ｌを含み、これらが、４つの処理ユニットスタックＳ１Ｌ－Ｓ４Ｌに３個ずつ分かれて配置されている。 Each of the first to fourth processing unit stacks S1L-S4L includes a plurality of stages (three stages in this embodiment) of processing units 11L-13L, 21L-23L, 31L-33L, and 41L-43L stacked in the vertical direction Z. including. The third processing unit stack S3L faces the first processing unit stack S1L across the transport space 52L. The fourth processing unit stack S4L faces the second processing unit stack S2L across the transport space 52L. Therefore, the plurality of processing units 31L to 33L forming the third processing unit stack S3L face the plurality of stages of processing units 11L to 13L forming the first processing unit stack S1L with the transport space 52L interposed therebetween. Similarly, the plurality of stages of processing units 41L to 43L forming the fourth processing unit stack S4L face the plurality of stages of processing units 21L to 23L forming the second processing unit stack S2L across the transport space 52L. . In this embodiment, the first processing block layer BL includes 12 processing units 11L-13L, 21L-23L, 31L-33L, 41L-43L, which are arranged in 3 processing unit stacks S1L-S4L. are arranged separately.
　搬送空間５２Ｌは、各処理ユニットスタックＳ１Ｌ－Ｓ４Ｌの最上段の処理ユニット１３Ｌ，２３Ｌ，３３Ｌ，４３Ｌの上面と整合する位置に配置された中間隔壁１６によって上方から区画され、かつ最下段の処理ユニット１１Ｌ，２１，３１Ｌ，４１Ｌの下面と整合する位置に配置された下隔壁１５によって下方から区画されている。全ての処理ユニット１１Ｌ－４３Ｌは、搬送空間５２Ｌに臨む位置に開口した基板搬入／搬出口３７を有している。主搬送ロボット８Ｌは、搬送空間５２Ｌを通って基板Ｗおよびダミー基板ＤＷを搬送し、基板搬入／搬出口３７を介して、各処理ユニット１１Ｌ－４３Ｌに対して基板Ｗおよびダミー基板ＤＷを搬入／搬出する。 The transfer space 52L is partitioned from above by intermediate partitions 16 arranged at positions aligned with the upper surfaces of the uppermost processing units 13L, 23L, 33L, and 43L of each of the processing unit stacks S1L-S4L, and the lowermost processing unit. It is partitioned from below by a lower partition wall 15 arranged at a position aligned with the lower surfaces of 11L, 21, 31L, and 41L. All the processing units 11L-43L have a substrate loading/unloading port 37 that opens at a position facing the transport space 52L. The main transport robot 8L transports the substrate W and the dummy substrate DW through the transport space 52L, and loads/loads the substrate W and the dummy substrate DW to/from each processing unit 11L-43L via the substrate load/unload port 37. Carry out.
　基板載置部６Ｌは、インデクサロボット２６と主搬送ロボット８Ｌとの間に配置されている。より具体的には、基板載置部６Ｌは、平面視において、搬送空間５２Ｌ内のインデクサロボット２６側の端部に配置されている。この実施形態では、第１液供給部９１と第３排気部１０３との間に基板載置部６Ｌが位置している。基板載置部６Ｌは、上下方向Ｚに関して、中間隔壁１６と下隔壁１５との間の高さに配置されている。この実施形態では、基板載置部６Ｌは、中間隔壁１６から上隔壁１７までの高さ範囲の中間高さ付近に配置されている。基板載置部６Ｌの上下方向位置は、インデクサロボット２６によるアクセスが可能な高さ範囲内であって、かつ主搬送ロボット８Ｌによってアクセス可能な高さ範囲内である必要がある。 The substrate platform 6L is arranged between the indexer robot 26 and the main transfer robot 8L. More specifically, the substrate platform 6L is arranged at the end of the transfer space 52L on the indexer robot 26 side in plan view. In this embodiment, the substrate mounting section 6L is positioned between the first liquid supply section 91 and the third exhaust section 103. As shown in FIG. The substrate mounting portion 6L is arranged at a height between the middle partition 16 and the lower partition 15 in the vertical direction Z. As shown in FIG. In this embodiment, the substrate mounting portion 6L is arranged near the middle height of the height range from the middle partition 16 to the upper partition 17 . The vertical position of the substrate platform 6L must be within a height range accessible by the indexer robot 26 and within a height range accessible by the main transfer robot 8L.
　基板載置部６Ｌは、未処理の基板Ｗが載置される未処理基板載置部６１と、処理済みの基板Ｗが載置される既処理基板載置部６２とを含む。未処理基板載置部６１および既処理基板載置部６２は、上下方向Ｚに積層されている。未処理基板載置部６１が既処理基板載置部６２の上に配置されることが好ましい。 The substrate platform 6L includes an unprocessed substrate platform 61 on which an untreated substrate W is placed, and a processed substrate platform 62 on which a processed substrate W is placed. The unprocessed substrate mounting part 61 and the processed substrate mounting part 62 are stacked in the vertical direction Z. As shown in FIG. It is preferable that the unprocessed substrate mounting part 61 is arranged on the processed substrate mounting part 62 .
　図５に拡大して構成例を示すように、未処理基板載置部６１および既処理基板載置部６２は、第１水平方向Ｘに沿ってインデクサロボット２６側および主搬送ロボット８Ｌ側の両方に開放した箱６３，６４と、箱６３，６４の内部に配置された基板保持棚６５，６６とを含む。基板保持棚６５，６６は、上下方向Ｚに配列された複数（たとえば１０個）の基板支持部材６７，６８を有する。各基板支持部材６７，６８は、１枚の基板Ｗの下面周縁部を下方から支持して、当該基板Ｗを水平姿勢で保持するように構成されている。それにより、未処理基板載置部６１および既処理基板載置部６２は、それぞれ、それらの基板保持棚６５，６６に、複数枚（たとえば１０枚）の基板Ｗを水平姿勢で上下方向Ｚに間隔を空けて積層した状態で保持することができる。 5, the unprocessed substrate platform 61 and the processed substrate platform 62 are arranged along the first horizontal direction X on both the indexer robot 26 side and the main transfer robot 8L side. boxes 63,64 open to the outside and substrate holding shelves 65,66 located inside the boxes 63,64. The substrate holding shelves 65 and 66 have a plurality of (for example ten) substrate supporting members 67 and 68 arranged in the vertical direction Z. As shown in FIG. Each of the substrate support members 67 and 68 is configured to support the peripheral portion of the lower surface of one substrate W from below and hold the substrate W in a horizontal posture. As a result, the unprocessed substrate platform 61 and the processed substrate platform 62 hold a plurality of (for example, 10) substrates W on their substrate holding shelves 65 and 66 in the vertical direction Z in a horizontal posture. It can be held in a state of being laminated with a space therebetween.
　図２に表れているように、インデクサブロック２の後隔壁２ａおよび処理ブロック３の前隔壁３ａ、すなわち、それらの隣接する隔壁を貫通するように、基板載置部６Ｌに対応する窓４Ｌが形成されている。インデクサロボット２６は、この窓４Ｌを介して、基板載置部６Ｌにアクセスして、基板載置部６Ｌに対して基板Ｗの搬入／搬出を行うことができる。 As shown in FIG. 2, a window 4L corresponding to the substrate platform 6L is formed so as to penetrate the rear partition 2a of the indexer block 2 and the front partition 3a of the processing block 3, that is, the adjacent partitions. It is The indexer robot 26 can access the substrate platform 6L through the window 4L to load/unload the substrate W onto/from the substrate platform 6L.
　ダミー基板収容部７Ｌは、基板載置部６Ｌとは異なる高さに設けられており、この実施形態では搬送空間５２Ｌ内において、基板載置部６Ｌの下方に配置されている。ダミー基板収容部７Ｌは、平面視において、基板載置部６Ｌと重なり合うように設けられている。より具体的には、基板載置部６Ｌに基板Ｗが保持され、ダミー基板収容部７Ｌにダミー基板ＤＷが保持されているとき、平面視において、基板Ｗとダミー基板ＤＷとが重なり合うように、ダミー基板収容部７Ｌが配置されている。基板Ｗとダミー基板ＤＷとの平面視における重なり合いは、部分的な重なり合いであってもよいし、全体的な重なり合い、すなわち、ダミー基板ＤＷが基板Ｗのほぼ全体に重なっていてもよい。 The dummy substrate housing portion 7L is provided at a height different from that of the substrate mounting portion 6L, and is arranged below the substrate mounting portion 6L in the transfer space 52L in this embodiment. 7 L of dummy board|substrate accommodating parts are provided so that it may overlap with the board|substrate mounting part 6L in planar view. More specifically, when the substrate W is held in the substrate mounting portion 6L and the dummy substrate DW is held in the dummy substrate housing portion 7L, the substrate W and the dummy substrate DW are arranged to overlap each other in plan view. 7 L of dummy board|substrate accommodating parts are arrange|positioned. Overlapping of the substrate W and the dummy substrate DW in a plan view may be a partial overlapping or an overall overlapping, that is, the dummy substrate DW may overlap the substrate W almost entirely.
　ダミー基板収容部７Ｌは、下隔壁１５と中間隔壁１６との間に配置されており、主搬送ロボット８Ｌがアクセス可能な高さ範囲内に配置されている。ダミー基板収容部７Ｌの前方、すなわち、インデクサブロック２側には、インデクサブロック２の後隔壁２ａおよび処理ブロック３の前隔壁３ａ、すなわち、それらの隣接する隔壁が位置している。これらの隔壁には、ダミー基板収容部７Ｌに対応する窓は設けられていない。したがって、この実施形態では、インデクサロボット２６は、ダミー基板収容部７Ｌに対してアクセスすることはできない。 The dummy substrate accommodation section 7L is arranged between the lower partition 15 and the middle partition 16, and is arranged within a height range accessible by the main transfer robot 8L. A rear partition wall 2a of the indexer block 2 and a front partition wall 3a of the processing block 3, that is, adjacent partition walls thereof, are located in front of the dummy substrate housing portion 7L, that is, on the indexer block 2 side. These partition walls are not provided with windows corresponding to the dummy substrate housing portions 7L. Therefore, in this embodiment, the indexer robot 26 cannot access the dummy substrate accommodation portion 7L.
　図６に拡大して構成例を示すように、ダミー基板収容部７Ｌは、ダミー基板保持棚７１を備えている。ダミー基板保持棚７１の構成は、基板載置部６Ｌの基板保持棚６５，６６の構成と実質的に同様であってもよい。ただし、ダミー基板保持棚７１が保持可能なダミー基板ＤＷの枚数は、基板保持棚６５，６６が保持可能な基板枚数と等しい必要はない。具体的には、ダミー基板保持棚７１は、上下方向に配列された複数（たとえば１２個）のダミー基板支持部材７２を有する。各ダミー基板支持部材７２は、１枚のダミー基板ＤＷの下面周縁部を下方から支持して、当該ダミー基板ＤＷを水平姿勢で保持するように構成されている。ダミー基板収容部７Ｌは、ダミー基板保持棚７１に、複数枚（たとえば１２枚）のダミー基板ＤＷを水平姿勢で上下方向Ｚに間隔を空けて積層した状態で保持することができる。すなわち、ダミー基板収容部７Ｌは、各１枚のダミー基板ＤＷを水平姿勢で収容するように上下方向に積層された複数段（この実施形態では、第１処理ブロック層ＢＬに備えられた処理ユニットの数と同数）のスロット（以下「ダミー基板スロットＤＬ１－ＤＬ１２」という。）を有している。各ダミー基板スロットＤＬ１－ＤＬ１２におけるダミー基板ＤＷの有無を検出するためのダミー基板センサ（図示せず）が備えられていてもよい。ダミー基板収容部７Ｌは、この実施形態では、基板載置部６Ｌとは異なり、収容しているダミー基板ＤＷを囲う箱を備えていない。むろん、このような箱が備えられても差し支えない。 As shown in an enlarged configuration example in FIG. The configuration of the dummy substrate holding shelf 71 may be substantially the same as the configuration of the substrate holding shelves 65 and 66 of the substrate mounting portion 6L. However, the number of dummy substrates DW that can be held by the dummy substrate holding shelf 71 does not need to be equal to the number of substrates that the substrate holding shelves 65 and 66 can hold. Specifically, the dummy substrate holding shelf 71 has a plurality of (for example, 12) dummy substrate supporting members 72 arranged in the vertical direction. Each dummy substrate supporting member 72 is configured to support the peripheral portion of the lower surface of one dummy substrate DW from below and hold the dummy substrate DW in a horizontal posture. The dummy substrate housing portion 7L can hold a plurality of (for example, 12) dummy substrates DW on the dummy substrate holding shelf 71 in a state in which they are stacked in the vertical direction Z at intervals in a horizontal posture. In other words, the dummy substrate housing portion 7L is composed of a plurality of stages (in this embodiment, the processing units provided in the first processing block layer BL) stacked in the vertical direction so as to house each one dummy substrate DW in a horizontal posture. ) slots (hereinafter referred to as “dummy board slots DL1 to DL12”). A dummy substrate sensor (not shown) may be provided for detecting the presence or absence of the dummy substrate DW in each of the dummy substrate slots DL1-DL12. In this embodiment, unlike the substrate mounting portion 6L, the dummy substrate accommodation portion 7L does not have a box surrounding the accommodated dummy substrate DW. Of course, there is no problem even if such a box is provided.
　図２に表れているように、主搬送ロボット８Ｌは、搬送空間５２Ｌ内に配置されている。主搬送ロボット８Ｌは、１枚の基板を水平姿勢で保持するハンド８１と、ハンド８１を駆動するハンド駆動機構８２とを含む。複数個（たとえば２個）のハンド８１が備えられていてもよい。ハンド駆動機構８２は、ハンド８１を水平方向Ｘ，Ｙおよび上下方向Ｚに移動し、かつ鉛直回転軸線まわりにハンド８１を旋回させることができる。ハンド駆動機構８２は、２つの支柱８３と、垂直移動部８４と、水平移動部８５と、回転部８６と、進退部８７とを含む。進退部８７にハンド８１が結合されている。複数個のハンド８１が設けられる場合には、それらに対応する複数の進退部８７が設けられることが好ましい。 As shown in FIG. 2, the main transfer robot 8L is arranged within the transfer space 52L. The main transport robot 8L includes a hand 81 that holds one substrate in a horizontal posture, and a hand drive mechanism 82 that drives the hand 81 . A plurality of (for example, two) hands 81 may be provided. The hand driving mechanism 82 can move the hand 81 in the horizontal directions X and Y and the vertical direction Z, and rotate the hand 81 around the vertical rotation axis. The hand drive mechanism 82 includes two posts 83 , a vertical movement section 84 , a horizontal movement section 85 , a rotation section 86 and an advance/retreat section 87 . A hand 81 is coupled to the advance/retreat portion 87 . When a plurality of hands 81 are provided, it is preferable to provide a plurality of advance/retreat sections 87 corresponding to them.
　２つの支柱８３は、第１水平方向Ｘに沿って間隔を空けて配置され、搬送空間５２Ｌの側壁にそれぞれ固定されている。２つの支柱８３は、上下方向Ｚに沿って延びており、垂直移動部８４の垂直移動をガイドするレールとしての機能を有している。垂直移動部８４は、２つの支柱８３に渡って第１水平方向Ｘに延び、２つの支柱８３に両端部が結合されたレールの形態を有している。垂直移動部８４は、２つの支柱８３に案内されながら、支柱８３に対して上下方向に移動するように構成されている。水平移動部８５は、垂直移動部８４上に支持され、垂直移動部８４によって案内されながら、垂直移動部８４に対して第１水平方向Ｘに移動するように構成されている。水平移動部８５に回転部８６が支持されている。回転部８６は、水平移動部８５上で、鉛直な回転軸線まわりに回転するように構成されている。回転部８６に進退部８７が結合されている。進退部８７は、回転軸線に対して水平方向に進退し、それによって、ハンド８１を水平方向に進退させる。 The two struts 83 are spaced apart along the first horizontal direction X and fixed to the side walls of the transfer space 52L. The two struts 83 extend along the vertical direction Z and function as rails that guide the vertical movement of the vertical movement section 84 . The vertical moving part 84 has the form of a rail extending in the first horizontal direction X across the two posts 83 and having both ends coupled to the two posts 83 . The vertical moving part 84 is configured to move vertically with respect to the two columns 83 while being guided by the columns 83 . The horizontal moving part 85 is supported on the vertical moving part 84 and configured to move in the first horizontal direction X with respect to the vertical moving part 84 while being guided by the vertical moving part 84 . A rotating portion 86 is supported by the horizontal moving portion 85 . The rotating portion 86 is configured to rotate about a vertical axis of rotation on the horizontal moving portion 85 . A retractable portion 87 is coupled to the rotating portion 86 . The advance/retreat portion 87 advances/retreats horizontally with respect to the axis of rotation, thereby moving the hand 81 horizontally.
　このような構成により、主搬送ロボット８Ｌは、基板載置部６Ｌにハンド８１をアクセスさせて基板載置部６Ｌとの間で基板Ｗの受け渡しを行うことができる。主搬送ロボット８Ｌは、さらに、第１処理ブロック層ＢＬ内の任意の処理ユニット１１Ｌ－４３Ｌにハンド８１をアクセスさせて、当該処理ユニット１１Ｌ－４３Ｌとの間で基板Ｗまたはダミー基板ＤＷの受け渡しを行うことができる。また、主搬送ロボット８Ｌは、ダミー基板収容部７Ｌにハンド８１をアクセスさせて、ダミー基板収容部７Ｌとの間でダミー基板ＤＷの受け渡しを行うことができる。そして、主搬送ロボット８Ｌは、ハンド８１に保持した基板Ｗまたはダミー基板ＤＷを、第１処理ブロック層ＢＬ内において、基板載置部６Ｌ、処理ユニット１１Ｌ－４３Ｌおよびダミー基板収容部７Ｌの間で搬送することができる。 With such a configuration, the main transport robot 8L can transfer the substrate W to and from the substrate platform 6L by allowing the hand 81 to access the substrate platform 6L. The main transfer robot 8L further accesses any processing unit 11L-43L in the first processing block layer BL with the hand 81 to transfer the substrate W or the dummy substrate DW to and from the processing unit 11L-43L. It can be carried out. In addition, the main transfer robot 8L can access the dummy substrate housing portion 7L with the hand 81 to transfer the dummy substrate DW to and from the dummy substrate housing portion 7L. Then, the main transfer robot 8L moves the substrate W or the dummy substrate DW held by the hand 81 between the substrate platform 6L, the processing units 11L to 43L, and the dummy substrate accommodation portion 7L in the first processing block layer BL. can be transported.
　第２処理ブロック層ＢＵの構成は、第１処理ブロック層ＢＬの構成とほぼ同様であるので、以下では、可能なかぎり重複する説明を省き、異なる構成について主として説明する。第１処理ブロック層ＢＬの場合と同一名称を付する要素の構成は、実質的に同じである。 The configuration of the second processing block layer BU is almost the same as the configuration of the first processing block layer BL, so below, duplicate descriptions will be omitted as much as possible, and different configurations will be mainly described. The configuration of the elements with the same names as in the case of the first processing block layer BL is substantially the same.
　第２処理ブロック層ＢＵは、複数（この実施形態では、１２個）の処理ユニット１１Ｕ－１３Ｕ，２１Ｕ－２３Ｕ，３１Ｕ－３３Ｕ，４１Ｕ－４３Ｕ（以下、第２処理ブロック層ＢＵの処理ユニットを総称するときには「処理ユニット１１Ｕ－４３Ｕ」という。）を含み、これらは第２処理ユニット群を構成している。第２処理ブロック層ＢＵは、さらに、基板載置部６Ｕと、ダミー基板収容部７Ｕと、主搬送ロボット８Ｕとを含む。第１～第４液供給部９１－９４、第１～第４排気部１０１－１０４は、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵに渡って、上下方向Ｚに延びて配置されている。 The second processing block layer BU includes a plurality of (12 in this embodiment) processing units 11U-13U, 21U-23U, 31U-33U, and 41U-43U (hereinafter collectively referred to as the processing units of the second processing block layer BU). (hereinafter referred to as "processing units 11U-43U"), which constitute a second processing unit group. The second processing block layer BU further includes a substrate placement section 6U, a dummy substrate accommodation section 7U, and a main transfer robot 8U. The first to fourth liquid supply units 91-94 and the first to fourth exhaust units 101-104 are arranged to extend in the vertical direction Z across the first processing block layer BL and the second processing block layer BU. there is
　第２処理ブロック層ＢＵ内における複数の処理ユニット１１Ｕ－４３Ｕの配置は、第１処理ブロック層ＢＬ内の複数の処理ユニット１１Ｌ－４３Ｌの配置と実質的に同等である。第２処理ブロック層ＢＵは、第１～第４処理ユニットスタックＳ１Ｕ－Ｓ４Ｕを備え、これらはそれぞれ上下方向Ｚに積層された複数段（この実施形態では３段）処理ユニット１１Ｕ－１３Ｕ，２１Ｕ－２３Ｕ，３１Ｕ－３３Ｕ，４１Ｕ－４３Ｕを備えている。 The arrangement of the plurality of processing units 11U-43U in the second processing block layer BU is substantially the same as the arrangement of the plurality of processing units 11L-43L in the first processing block layer BL. The second processing block layer BU includes first to fourth processing unit stacks S1U-S4U, each of which is a plurality of (three in this embodiment) processing units 11U-13U and 21U- stacked in the vertical direction Z. 23U, 31U-33U, 41U-43U.
　平面視において、第２処理ブロック層ＢＵの第１～第４処理ユニットスタックＳ１Ｕ－Ｓ４Ｕは、第１処理ブロック層ＢＬの第１～第４処理ユニットスタックＳ１Ｌ－Ｓ４Ｌとそれぞれ重なるように配置されている。そして、第１および第２処理ブロック層ＢＬ，ＢＵのそれぞれの第１処理ユニットスタックＳ１Ｌ，Ｓ１Ｕが上下方向Ｚに積層されて、複数段（この実施形態では６段）の処理ユニット１１Ｌ，１２Ｌ，１３Ｌ，１１Ｕ，１２Ｕ，１３Ｕが積層された第１タワーＴ１が形成されている。同様に、第１および第２処理ブロック層ＢＬ，ＢＵのそれぞれの第２処理ユニットスタックＳ２Ｌ，Ｓ２Ｕが上下方向Ｚに積層されて、複数段（この実施形態では６段）の処理ユニット２１Ｌ，２２Ｌ，２３Ｌ，２１Ｕ，２２Ｕ，２３Ｕが積層された第２タワーＴ２が形成されている。さらに、第１および第２処理ブロック層ＢＬ，ＢＵのそれぞれの第３処理ユニットスタックＳ３Ｌ，Ｓ３Ｕが上下方向Ｚに積層されて、複数段（この実施形態では６段）の処理ユニット３１Ｌ，３２Ｌ，３３Ｌ，３１Ｕ，３２Ｕ，３３Ｕが積層された第３タワーＴ３が形成されている。さらに同様に、第１および第２処理ブロック層ＢＬ，ＢＵのそれぞれの第４処理ユニットスタックＳ４Ｌ，Ｓ４Ｕが上下方向Ｚに積層されて、複数段（この実施形態では６段）の処理ユニット４１Ｌ，４２Ｌ，４３Ｌ，４１Ｕ，４２Ｕ，４３Ｕが積層された第４タワーＴ４が形成されている。 In plan view, the first to fourth processing unit stacks S1U to S4U of the second processing block layer BU are arranged to overlap the first to fourth processing unit stacks S1L to S4L of the first processing block layer BL, respectively. there is Then, the first processing unit stacks S1L and S1U of the first and second processing block layers BL and BU are stacked in the vertical direction Z to form a plurality of stages (six stages in this embodiment) of processing units 11L, 12L, A first tower T1 is formed by stacking 13L, 11U, 12U, and 13U. Similarly, the second processing unit stacks S2L and S2U of the first and second processing block layers BL and BU are stacked in the vertical direction Z to form a plurality of (six in this embodiment) processing units 21L and 22L. , 23L, 21U, 22U, and 23U are stacked to form a second tower T2. Furthermore, the third processing unit stacks S3L and S3U of the first and second processing block layers BL and BU are stacked in the vertical direction Z to form a plurality of stages (six stages in this embodiment) of processing units 31L, 32L, A third tower T3 is formed by stacking 33L, 31U, 32U, and 33U. Furthermore, similarly, the fourth processing unit stacks S4L and S4U of the first and second processing block layers BL and BU are stacked in the vertical direction Z to form a plurality of stages (six stages in this embodiment) of processing units 41L, A fourth tower T4 is formed by stacking 42L, 43L, 41U, 42U, and 43U.
　第２処理ブロック層ＢＵ内に区画されて搬送経路５１Ｕを提供する搬送空間５２Ｕは、第１処理ブロック層ＢＬの搬送空間５２Ｌと重なっている。第２処理ブロック層ＢＵ内の搬送空間５２Ｕは、中間隔壁１６によって下方から区画され、上隔壁１７によって上方から区画されている。上隔壁１７は、第１～第４タワーＴ１－Ｔ４の最上段の処理ユニット１３Ｕ，２３Ｕ，３３Ｕ，４３Ｕの上面と整合する高さに配置されている。 A transport space 52U that is partitioned in the second processing block layer BU and provides a transport path 51U overlaps the transport space 52L of the first processing block layer BL. The transfer space 52U in the second processing block layer BU is partitioned from below by the middle partition 16 and partitioned from above by the upper partition 17 . The upper partition wall 17 is arranged at a height aligned with the upper surfaces of the uppermost processing units 13U, 23U, 33U, 43U of the first to fourth towers T1-T4.
　平面視における基板載置部６Ｕの配置は、第１処理ブロック層ＢＬの場合と同様である。すなわち、基板載置部６Ｕは、インデクサロボット２６と主搬送ロボット８Ｕとの間に配置されており、搬送空間５２Ｕ内のインデクサロボット２６側の端部に配置されている。第２処理ブロック層ＢＵの基板載置部６Ｕは、平面視において、第１処理ブロック層ＢＬの基板載置部６Ｌと重なるように配置されている。基板載置部６Ｕは、上下方向Ｚに関して、中間隔壁１６と上隔壁１７との間の高さに配置されている。この実施形態では、基板載置部６Ｕは、中間隔壁１６から上隔壁１７までの高さ範囲の中間高さよりも下方に配置されている。より具体的には、基板載置部６Ｕは、インデクサロボット２６によってアクセス可能な高さ範囲内で最も高い位置に配置されている。基板載置部６Ｕの上下方向位置は、インデクサロボット２６によるアクセスが可能な高さ範囲内であって、かつ主搬送ロボット８Ｕによってアクセス可能な高さ範囲内である必要がある。第１処理ブロック層ＢＬの場合と同様に、基板載置部６Ｕは、未処理の基板Ｗが載置される未処理基板載置部６１と、処理済みの基板Ｗが載置される既処理基板載置部６２とを含む。未処理基板載置部６１および既処理基板載置部６２の構成は、第１処理ブロック層ＢＬの基板載置部６Ｌの場合と同様である（図５参照）。 The arrangement of the substrate mounting portion 6U in plan view is the same as in the case of the first processing block layer BL. That is, the substrate platform 6U is arranged between the indexer robot 26 and the main transfer robot 8U, and is arranged at the end of the transfer space 52U on the indexer robot 26 side. The substrate mounting portion 6U of the second processing block layer BU is arranged so as to overlap with the substrate mounting portion 6L of the first processing block layer BL in plan view. The substrate mounting portion 6U is arranged at a height between the intermediate partition wall 16 and the upper partition wall 17 in the vertical direction Z. As shown in FIG. In this embodiment, the substrate mounting portion 6U is arranged below the middle height of the height range from the middle partition 16 to the upper partition 17 . More specifically, the substrate platform 6U is arranged at the highest position within a height range accessible by the indexer robot 26. As shown in FIG. The vertical position of the substrate platform 6U must be within a height range accessible by the indexer robot 26 and within a height range accessible by the main transfer robot 8U. As in the case of the first processing block layer BL, the substrate platform 6U includes an unprocessed substrate platform 61 on which an unprocessed substrate W is placed and an unprocessed substrate platform 61 on which a processed substrate W is placed. and a substrate mounting portion 62 . The configurations of the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 are the same as those of the substrate mounting portion 6L of the first processing block layer BL (see FIG. 5).
　インデクサブロック２の後隔壁２ａおよび処理ブロック３の前隔壁３ａ、すなわち、それらの隣接する隔壁を貫通するように、基板載置部６Ｕに対応する窓４Ｕが形成されている。インデクサロボット２６は、この窓４Ｕを介して、基板載置部６Ｕにアクセスして、基板載置部６Ｕに対して基板Ｗの搬入／搬出を行うことができる。 A window 4U corresponding to the substrate platform 6U is formed so as to penetrate the rear partition 2a of the indexer block 2 and the front partition 3a of the processing block 3, that is, the adjacent partitions. The indexer robot 26 can access the substrate platform 6U through the window 4U to load/unload the substrate W onto/from the substrate platform 6U.
　ダミー基板収容部７Ｕは、基板載置部６Ｕとは異なる高さに設けられており、この実施形態では搬送空間５２Ｕ内において、基板載置部６Ｕの上方に配置されている。ダミー基板収容部７Ｕは、平面視において、基板載置部６Ｕと重なり合うように設けられている。より具体的には、基板載置部６Ｕに基板Ｗが保持され、ダミー基板収容部７Ｕにダミー基板ＤＷが保持されているとき、平面視において、基板Ｗとダミー基板ＤＷとが重なり合うように、ダミー基板収容部７Ｕが配置されている。基板Ｗとダミー基板ＤＷとの平面視における重なり合いは、部分的な重なり合いであってもよいし、全体的な重なり合い、すなわち、ダミー基板ＤＷが基板Ｗのほぼ全体に重なっていてもよい。ダミー基板収容部７Ｕは、上隔壁１７と中間隔壁１６との間の高さに配置されており、主搬送ロボット８Ｕがアクセス可能な高さ範囲内に配置されている。ダミー基板収容部７Ｕの前方、すなわち、インデクサブロック２側には、インデクサブロック２の後隔壁２ａおよび処理ブロック３の前隔壁３ａ、すなわち、それらの隣接する隔壁が配置されている。これらの隔壁２ａ，３ａには、ダミー基板収容部７Ｕに対応する窓は設けられていない。したがって、インデクサロボット２６は、ダミー基板収容部７Ｕに対してアクセスすることはできない。 The dummy substrate housing portion 7U is provided at a height different from that of the substrate mounting portion 6U, and is arranged above the substrate mounting portion 6U in the transfer space 52U in this embodiment. The dummy substrate housing portion 7U is provided so as to overlap with the substrate mounting portion 6U in plan view. More specifically, when the substrate W is held by the substrate mounting portion 6U and the dummy substrate DW is held by the dummy substrate housing portion 7U, the substrate W and the dummy substrate DW are arranged to overlap each other in plan view. A dummy substrate housing portion 7U is arranged. Overlapping of the substrate W and the dummy substrate DW in a plan view may be a partial overlapping or an overall overlapping, that is, the dummy substrate DW may overlap the substrate W almost entirely. The dummy substrate housing portion 7U is arranged at a height between the upper partition 17 and the middle partition 16, and is arranged within a height range accessible by the main transfer robot 8U. A rear partition wall 2a of the indexer block 2 and a front partition wall 3a of the processing block 3, that is, adjacent partition walls thereof, are arranged in front of the dummy substrate accommodating portion 7U, that is, on the indexer block 2 side. These partition walls 2a and 3a are not provided with windows corresponding to the dummy substrate housing portions 7U. Therefore, the indexer robot 26 cannot access the dummy substrate accommodation section 7U.
　ダミー基板収容部７Ｕの構成は、第１処理ブロック層ＢＬのダミー基板収容部７Ｌの構成と実質的に同じであってもよい（図６参照）。ダミー基板収容部７Ｕは、各１枚のダミー基板ＤＷを水平姿勢で収容するように上下方向に積層された複数段（この実施形態では、第２処理ブロック層ＢＵに備えられた処理ユニットの数と同数）のスロット（以下「ダミー基板スロットＤＵ１－ＤＵ１２」という。）を有している。各ダミー基板スロットＤＵ１－ＤＵ１２におけるダミー基板ＤＷの有無を検出するためのダミー基板センサが備えられていてもよい。 The configuration of the dummy substrate accommodation portion 7U may be substantially the same as the configuration of the dummy substrate accommodation portion 7L of the first processing block layer BL (see FIG. 6). The dummy substrate housing portion 7U has a plurality of stages (in this embodiment, the number of processing units provided in the second processing block layer BU) stacked vertically so as to horizontally accommodate one dummy substrate DW each. ) slots (hereinafter referred to as “dummy substrate slots DU1 to DU12”). A dummy substrate sensor may be provided for detecting the presence or absence of the dummy substrate DW in each of the dummy substrate slots DU1-DU12.
　主搬送ロボット８Ｕは、搬送空間５２Ｕ内に配置されている。主搬送ロボット８Ｕは、１枚の基板を水平姿勢で保持するハンド８１と、ハンド８１を駆動するハンド駆動機構８２とを含む。ハンド駆動機構８２は、２つの支柱８３と、垂直移動部８４と、水平移動部８５と、回転部８６と、進退部８７とを含む。これらの構成は、第１処理ブロック層ＢＬの主搬送ロボット８Ｌと同様である。主搬送ロボット８Ｕは、基板載置部６Ｕ、処理ユニット１１Ｕ－４３Ｕおよびダミー基板収容部７Ｕにアクセス可能に構成されている。主搬送ロボット８Ｕは、基板載置部６Ｕと処理ユニット１１Ｕ－４３Ｕとの間で基板Ｗを搬送し、かつダミー基板収容部７Ｕと処理ユニット１１Ｕ－４３Ｕとの間でダミー基板ＤＷを搬送する第２搬送ユニットの一例である。 The main transfer robot 8U is arranged in the transfer space 52U. The main transport robot 8U includes a hand 81 that holds one substrate in a horizontal posture, and a hand driving mechanism 82 that drives the hand 81 . The hand driving mechanism 82 includes two support columns 83 , a vertical moving section 84 , a horizontal moving section 85 , a rotating section 86 and an advancing/retreating section 87 . These configurations are the same as those of the main transfer robot 8L of the first processing block layer BL. The main transfer robot 8U is configured to be able to access the substrate placement section 6U, the processing units 11U to 43U and the dummy substrate accommodation section 7U. The main transport robot 8U transports substrates W between the substrate platform 6U and the processing units 11U-43U, and transports dummy substrates DW between the dummy substrate storage unit 7U and the processing units 11U-43U. This is an example of two transport units.
　第１処理ブロック層ＢＬと第２処理ブロック層ＢＵとは、中間隔壁１６によって区画されており、この中間隔壁１６を超えて製品基板Ｗまたはダミー基板ＤＷを搬送することはできない。換言すれば、第１処理ブロック層ＢＬの主搬送ロボット８Ｌは、第２処理ブロック層ＢＵの処理ユニット１１Ｕ－４３Ｕ、ダミー基板収容部７Ｕおよび基板載置部６Ｕのいずれにもアクセスすることができない構成となっている。同様に、第２処理ブロック層ＢＵの主搬送ロボット８Ｕは、第１処理ブロック層ＢＬの処理ユニット１１Ｌ－４３Ｌ、ダミー基板収容部７Ｌおよび基板載置部６Ｌのいずれにもアクセスすることができない構成となっている。 The first processing block layer BL and the second processing block layer BU are separated by an intermediate partition wall 16, and the product substrate W or the dummy substrate DW cannot be transported over the intermediate partition wall 16. In other words, the main transfer robot 8L on the first processing block layer BL cannot access any of the processing units 11U to 43U, the dummy substrate storage unit 7U, and the substrate platform 6U on the second processing block layer BU. It is configured. Similarly, the main transfer robot 8U of the second processing block layer BU cannot access any of the processing units 11L-43L, the dummy substrate storage section 7L, and the substrate placement section 6L of the first processing block layer BL. It has become.
　液供給部９１－９４は、処理ユニット１１Ｌ－４３Ｌ；１１Ｕ－４３Ｕで用いられる処理液を供給するための配管類を収容する液配管スペースを区画している。各液供給部９１－９４が区画する液配管スペースは、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵを上下方向Ｚに貫通している。各液供給部９１－９４には、平面視において同じ位置で上下方向Ｚに６段に積層されてタワーＴ１－Ｔ４を形成する６つの処理ユニット１１Ｌ，１２Ｌ，１３Ｌ，１１Ｕ，１２Ｕ，１３Ｕ；２１Ｌ，２２Ｌ，２３Ｌ，２１Ｕ，２２Ｕ，２３Ｕ；３１Ｌ，３２Ｌ，３３Ｌ，３１Ｕ，３２Ｕ，３３Ｕ；４１Ｌ，４２Ｌ，４３Ｌ，４１Ｕ，４２Ｕ，４３Ｕに処理液を供給する配管５６が収容されている。液供給部９１－９４には、さらに、配管途中に設けられたバルブ類、流量計、処理液を一時貯留するためのタンク、送液のためのポンプ等の処理液関連機器が併せて収容されていてもよい。 The liquid supply units 91-94 define a liquid piping space for accommodating piping for supplying the processing liquid used in the processing units 11L-43L; 11U-43U. A liquid piping space defined by each of the liquid supply units 91 to 94 penetrates in the vertical direction Z through the first processing block layer BL and the second processing block layer BU. Each of the liquid supply units 91-94 has six processing units 11L, 12L, 13L, 11U, 12U, 13U; , 22L, 23L, 21U, 22U, 23U; 31L, 32L, 33L, 31U, 32U, 33U; 41L, 42L, 43L, 41U, 42U, 43U. The liquid supply units 91 to 94 further accommodate processing liquid-related equipment such as valves, a flow meter, a tank for temporarily storing the processing liquid, and a pump for feeding the liquid, which are provided in the piping. may be
　排気部１０１－１０４は、処理ユニット内部の雰囲気を排気するための配管類を収容する排気配管スペースを区画している。各排気部１０１－１０４が区画する排気配管スペースは、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵを上下方向Ｚに貫通している。各排気部１０１－１０４には、平面視において、同じ位置で上下方向Ｚに６段に積層されてタワーＴ１－Ｔ４を形成する６つの処理ユニット１１Ｌ，１２Ｌ，１３Ｌ，１１Ｕ，１２Ｕ，１３Ｕ；２１Ｌ，２２Ｌ，２３Ｌ，２１Ｕ，２２Ｕ，２３Ｕ；３１Ｌ，３２Ｌ，３３Ｌ，３１Ｕ，３２Ｕ，３３Ｕ；４１Ｌ，４２Ｌ，４３Ｌ，４１Ｕ，４２Ｕ，４３からの排気を基板処理装置１外の排気設備に導くための排気配管７６が収容されている。排気部１０１－１０４は、さらに、処理ユニット内での処理の種類（より具体的には処理液の種類）に応じて、排気配管７６を切り換える切り換え機構７７が併せて収容されていてもよい。図示は省略するが、排気部１０１は、切り換え機構７７を駆動するアクチュエータ類を含む。 The exhaust units 101 to 104 define an exhaust piping space that accommodates piping for exhausting the atmosphere inside the processing unit. The exhaust piping space defined by each of the exhaust sections 101 to 104 penetrates in the vertical direction Z through the first processing block layer BL and the second processing block layer BU. Each of the exhaust units 101-104 has six processing units 11L, 12L, 13L, 11U, 12U, 13U; , 22L, 23L, 21U, 22U, 23U; 31L, 32L, 33L, 31U, 32U, 33U; An exhaust pipe 76 is accommodated. The exhaust units 101 to 104 may further accommodate a switching mechanism 77 for switching the exhaust pipe 76 according to the type of processing (more specifically, the type of processing liquid) in the processing unit. Although not shown, the exhaust section 101 includes actuators that drive the switching mechanism 77 .
　キャリヤ搬送機構３００（図１参照）は、未処理の製品基板Ｗを収容したキャリヤＣをキャリヤ保持部２５に搬入し、処理済みの製品基板Ｗを収容したキャリヤＣをキャリヤ保持部２５から搬出するように動作する。また、キャリヤ搬送機構３００は、未使用のダミー基板ＤＷを収容した供給用ダミーキャリヤＤＣをキャリヤ保持部２５に搬入し、未使用のダミー基板ＤＷが当該供給用ダミーキャリヤＤＣから払い出された後に、当該ダミーキャリヤＤＣをキャリヤ保持部２５から搬出するように動作する。さらに、キャリヤ搬送機構３００は、使用済みのダミー基板ＤＷを回収するための回収用ダミーキャリヤＤＣをキャリヤ保持部２５に搬入し、使用済みのダミー基板ＤＷが当該回収用ダミーキャリヤＤＣに収容された後に、当該回収用ダミーキャリヤＤＣをキャリヤ保持部２５から搬出するように動作する。ダミーキャリヤＤＣは、製品基板ＷのためのキャリヤＣと実質的に同様の構成を有していてもよい。 The carrier transport mechanism 300 (see FIG. 1) carries the carrier C containing the unprocessed product substrates W into the carrier holding part 25 and carries out the carrier C containing the processed product substrates W from the carrier holding part 25. works like Further, the carrier transport mechanism 300 loads the supply dummy carrier DC containing the unused dummy substrates DW into the carrier holding unit 25, and after the unused dummy substrates DW are discharged from the supply dummy carrier DC, , to carry out the dummy carrier DC from the carrier holding portion 25 . Further, the carrier transport mechanism 300 carries a recovery dummy carrier DC for recovering the used dummy substrate DW into the carrier holding unit 25, and the used dummy substrate DW is accommodated in the recovery dummy carrier DC. Later, the recovery dummy carrier DC is carried out from the carrier holding portion 25 . The dummy carrier DC may have substantially the same configuration as the carrier C for the product substrates W;
　キャリヤ搬送機構３００は、典型的には、天井走行式無人搬送車（OHT: Overhead Hoist Transport）を含む。キャリヤ搬送機構３００は、キャリヤ置き場３５０とキャリヤ保持部２５（ロードポート）との間でキャリヤＣを搬送する。また、キャリヤ搬送機構３００は、ダミーキャリヤ置き場３５１とキャリヤ保持部２５との間でダミーキャリヤＤＣを搬送する。 The carrier transport mechanism 300 typically includes an overhead hoist transport (OHT). The carrier transport mechanism 300 transports the carrier C between the carrier storage space 350 and the carrier holding section 25 (load port). Also, the carrier transport mechanism 300 transports the dummy carrier DC between the dummy carrier storage place 351 and the carrier holding section 25 .
　キャリヤ搬送機構３００は、ホストコンピュータ１５０によって制御され、キャリヤＣおよびダミーキャリヤＤＣを搬送する。ホストコンピュータ１５０は、通信線１７０を介して基板処理装置１のコントローラ１１０と通信可能に接続されている。 The carrier transport mechanism 300 is controlled by the host computer 150 and transports the carrier C and the dummy carrier DC. The host computer 150 is communicably connected to the controller 110 of the substrate processing apparatus 1 via a communication line 170 .
　コントローラ１１０は、インデクサロボット２６および主搬送ロボット８Ｌ，８Ｕを制御して基板Ｗおよびダミー基板ＤＷの搬送を行わせる。また、コントローラ１１０は、処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕの各部を制御して、処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕにおける基板処理およびダミー基板ＤＷを用いたダミー処理を実行させる。 The controller 110 controls the indexer robot 26 and the main transport robots 8L and 8U to transport the substrate W and the dummy substrate DW. Further, the controller 110 controls each part of the processing units 11L-43L and 11U-43U to execute substrate processing and dummy processing using the dummy substrate DW in the processing units 11L-43L and 11U-43U.
　図７は、処理ユニット１１Ｌ－４３Ｌ；１１Ｕ－４３Ｕ（以下、総称するときには「処理ユニット１１Ｌ－４３Ｕ」という。）の構成例を説明するための図解的な断面図である。処理ユニット１１Ｌ－４３Ｕは、処理室３５（チャンバ）を形成するユニット隔壁３６と、ユニット隔壁３６内に配置された処理カップ３９と、処理カップ３９内に配置されたスピンチャック４０と、スピンチャック４０に保持された基板Ｗまたはダミー基板ＤＷに処理液を供給するノズル５５とを含む。 FIG. 7 is an illustrative cross-sectional view for explaining a configuration example of the processing units 11L-43L; 11U-43U (hereinafter collectively referred to as "processing units 11L-43U"). The processing units 11L-43U include a unit partition 36 forming a processing chamber 35 (chamber), a processing cup 39 arranged in the unit partition 36, a spin chuck 40 arranged in the processing cup 39, and a spin chuck 40 and a nozzle 55 for supplying the processing liquid to the substrate W or the dummy substrate DW held in the substrate.
　ユニット隔壁３６は、たとえば平面視においてほぼ矩形をなす側壁３６ａと、上方を区画する天壁３６ｂと、下方を区画する底壁３６ｃとを含む。側壁３６ａの一面は、搬送空間５２Ｕに臨んで、第１水平方向Ｘおよび上下方向Ｚに沿って延びており、基板Ｗおよびダミー基板ＤＷを搬入／搬出するための基板搬入／搬出口３７を有している。基板搬入／搬出口３７は、第１水平方向Ｘに延びたスロット形状を有していてもよい。基板搬入／搬出口３７を開閉するためのシャッタ３８が配置されている。基板Ｗおよびダミー基板ＤＷは、ユニット隔壁３６に形成された基板搬入／搬出口３７から搬入されてスピンチャック４０に渡される。 The unit partition wall 36 includes, for example, a side wall 36a that is substantially rectangular in plan view, a ceiling wall 36b that partitions the upper portion, and a bottom wall 36c that partitions the lower portion. One surface of the side wall 36a faces the transfer space 52U, extends along the first horizontal direction X and the vertical direction Z, and has a substrate loading/unloading port 37 for loading/unloading the substrate W and the dummy substrate DW. is doing. The substrate loading/unloading port 37 may have a slot shape extending in the first horizontal direction X. As shown in FIG. A shutter 38 is arranged for opening and closing the substrate loading/unloading port 37 . The substrate W and the dummy substrate DW are loaded from a substrate loading/unloading port 37 formed in the unit partition 36 and transferred to the spin chuck 40 .
　スピンチャック４０は、１枚の基板Ｗまたはダミー基板ＤＷを水平姿勢で保持するスピンベース４５と、スピンベース４５を鉛直な回転軸線まわりに回転するスピンモータ４６とを含む。スピンチャック４０は、スピンベース４５の上面に基板Ｗまたはダミー基板ＤＷの下面を吸着して保持するバキューム型であってもよい。また、スピンベース４５は、基板Ｗおよびダミー基板ＤＷに対応する円形の平面形状を有し、その周縁部に周方向に間隔を空けて設けられた３つ以上の保持ピンを備え、それらの保持ピンによって基板Ｗまたはダミー基板ＤＷを握持するメカニカル型のチャックを構成していてもよい。 The spin chuck 40 includes a spin base 45 that holds one substrate W or dummy substrate DW in a horizontal posture, and a spin motor 46 that rotates the spin base 45 around a vertical rotation axis. The spin chuck 40 may be of a vacuum type that holds the lower surface of the substrate W or the dummy substrate DW by suction on the upper surface of the spin base 45 . In addition, the spin base 45 has a circular planar shape corresponding to the substrate W and the dummy substrate DW, and has three or more holding pins provided at intervals in the circumferential direction on the periphery thereof. A mechanical chuck that grips the substrate W or the dummy substrate DW with pins may be configured.
　処理ユニット１１Ｌ－４３Ｕは、スピンチャック４０に保持された基板Ｗまたはダミー基板ＤＷに処理液を供給する１つ以上のノズル５５を含む。この実施形態では、複数のノズル５５が備えられている。これらの複数のノズル５５は、複数種類の薬液をそれぞれ吐出するために用いられる複数の薬液ノズルを含んでいてもよい。 The processing unit 11L-43U includes one or more nozzles 55 for supplying the processing liquid to the substrate W held by the spin chuck 40 or the dummy substrate DW. In this embodiment, multiple nozzles 55 are provided. These multiple nozzles 55 may include multiple chemical liquid nozzles that are used to eject multiple types of chemical liquids, respectively.
　スピンチャック４０によって保持されて回転されている基板Ｗまたはダミー基板ＤＷの表面にノズル５５から処理液が供給される。ノズル５５は、液供給部９１－９４を通って配置される処理液配管５６に結合されている。処理液配管５６は、液供給部９１－９４を通って引き回され、処理液供給源５４に接続される。処理液配管５６の途中には、その流路を開閉するバルブ５９が介装されている。また、処理液配管５６の途中には、ノズル５５に向かって処理液を送るためのポンプ６０が介装されている。バルブ５９およびポンプ６０は、液供給部９１－９４に配置されている。処理液供給源５４は、エッチング液等の薬液や、純水（脱イオン水）等のリンス液を供給する。処理液の種類に応じて、複数の処理液配管５６および対応する複数のノズル５５が設けられてもよい。複数のノズル５５の一部または全部は、基板Ｗまたはダミー基板ＤＷの上方で基板Ｗまたはダミー基板ＤＷの上面に沿って移動する移動ノズルの形態を有していてもよい。移動ノズルは、スピンチャック４０の側方に配置された揺動軸５８によって、水平なノズルアーム５７の基端部を支持し、揺動軸５８を鉛直軸線まわりに回動させる構造を有していてもよい（図１参照）。複数のノズル５５の一部または全部は、スピンチャック４０に対する相対位置が不変の固定ノズルであってもよい。 A processing liquid is supplied from the nozzle 55 to the surface of the substrate W or the dummy substrate DW held and rotated by the spin chuck 40 . Nozzle 55 is coupled to processing liquid tubing 56 that is routed through liquid supplies 91-94. The processing liquid pipe 56 is routed through the liquid supplies 91 - 94 and connected to the processing liquid supply source 54 . A valve 59 for opening and closing the flow path is interposed in the middle of the treatment liquid pipe 56 . A pump 60 for sending the processing liquid toward the nozzle 55 is interposed in the middle of the processing liquid pipe 56 . Valves 59 and pumps 60 are located at liquid supplies 91-94. The processing liquid supply source 54 supplies a chemical liquid such as an etchant and a rinse liquid such as pure water (deionized water). Depending on the type of processing liquid, multiple processing liquid lines 56 and corresponding multiple nozzles 55 may be provided. Some or all of the plurality of nozzles 55 may have the form of moving nozzles that move along the upper surface of the substrate W or the dummy substrate DW above the substrate W or the dummy substrate DW. The movable nozzle has a structure in which the base end of a horizontal nozzle arm 57 is supported by a swing shaft 58 arranged on the side of the spin chuck 40, and the swing shaft 58 is rotated around the vertical axis. (see Figure 1). Some or all of the plurality of nozzles 55 may be fixed nozzles whose relative positions to the spin chuck 40 remain unchanged.
　ユニット隔壁３６内の雰囲気は、ユニット隔壁３６を貫通する排気接続管７５を介して排気される。排気接続管７５は、排気部１０１－１０４に配置された排気配管７６に接続されている。排気接続管７５は、切り換え機構７７を介して複数の排気配管７６に接続されていてもよい。切り換え機構７７は、たとえば、複数のノズル５５から吐出される処理液の種類（たとえば薬液の種類）に応じて、排気接続管７５からの排気を、当該処理液の種類に予め対応付けられた排気配管７６に導くように動作する。 The atmosphere inside the unit partition 36 is exhausted through the exhaust connection pipe 75 penetrating the unit partition 36 . The exhaust connection pipe 75 is connected to an exhaust pipe 76 arranged in the exhaust sections 101-104. The exhaust connection pipe 75 may be connected to a plurality of exhaust pipes 76 via a switching mechanism 77 . For example, the switching mechanism 77 switches the exhaust gas from the exhaust connection pipe 75 to an exhaust gas pre-associated with the type of processing liquid in accordance with the type of processing liquid (for example, the type of chemical liquid) discharged from the plurality of nozzles 55 . It operates to lead to piping 76 .
　図８は、基板処理装置１の制御に関する構成を説明するためのブロック図である。基板処理装置１は、コントローラ１１０を備えている。コントローラ１１０は、プロセッサ１１１（ＣＰＵ）およびメモリ１１２（記憶部）を含むコンピュータであってもよい。プロセッサ１１１は、メモリ１１２に格納されたプログラム１２０を実行する。それによって、コントローラ１１０は、インデクサロボット２６および主搬送ロボット８Ｌ，８Ｕによって基板Ｗおよびダミー基板ＤＷを搬送する基板搬送動作のための搬送スケジュールを作成するスケジュール作成部としての機能と、その作成された搬送スケジュールに基づいて基板Ｗおよびダミー基板ＤＷの搬送を制御する搬送制御部としての機能とを有している。さらに、コントローラ１１０は、処理ユニット１１Ｌ－４３Ｕによって基板Ｗを処理する基板処理動作を実現する基板処理制御部としての機能を有している。コントローラ１１０は、さらに、処理ユニット１１Ｌ－４３Ｕにおいてダミー基板ＤＷを用いたダミー処理を実行するダミー処理動作を実現するダミー処理制御部としての機能を有している。これらの基板搬送動作、基板処理動作およびダミー処理動作のために、コントローラ１１０は、基板処理装置１に備えられた様々な制御対象を制御する。制御対象は、インデクサロボット２６、主搬送ロボット８Ｌ，８Ｕ、処理ユニット１１Ｌ－４３Ｕ等に備えられた駆動部を含む。さらに、コントローラ１１０の制御対象は、液供給部９１－９４に配置されたバルブ５９およびポンプ６０を含み、排気部１０１－１０４に配置されたアクチュエータ類を含む。 FIG. 8 is a block diagram for explaining the control configuration of the substrate processing apparatus 1. As shown in FIG. The substrate processing apparatus 1 has a controller 110 . Controller 110 may be a computer including processor 111 (CPU) and memory 112 (storage unit). Processor 111 executes program 120 stored in memory 112 . Thereby, the controller 110 functions as a schedule creating unit that creates a transport schedule for the substrate transport operation of transporting the substrate W and the dummy substrate DW by the indexer robot 26 and the main transport robots 8L and 8U. It also functions as a transport control unit that controls the transport of the substrate W and the dummy substrate DW based on the transport schedule. Further, the controller 110 has a function as a substrate processing control section that realizes a substrate processing operation for processing the substrate W by the processing units 11L-43U. The controller 110 further has a function as a dummy processing control section that realizes a dummy processing operation of executing dummy processing using the dummy substrates DW in the processing units 11L-43U. The controller 110 controls various control objects provided in the substrate processing apparatus 1 for these substrate transport operations, substrate processing operations, and dummy processing operations. The objects to be controlled include the drive units provided in the indexer robot 26, the main transfer robots 8L and 8U, the processing units 11L-43U, and the like. Further, objects controlled by the controller 110 include the valves 59 and the pumps 60 arranged in the liquid supply units 91-94, and actuators arranged in the exhaust units 101-104.
　メモリ１１２には、各種のデータ１３０が格納されている。データ１３０は、製品用の基板Ｗを処理するための製品レシピ１３１と、ダミー基板ＤＷを用いるダミー処理のためのダミー処理レシピ１３２とを含む。製品レシピ１３１は、基板Ｗの搬送動作および基板Ｗに対する処理内容を規定するデータである。ダミー処理レシピ１３２は、ダミー基板ＤＷの搬送動作およびダミー基板ＤＷを用いる処理内容を規定するデータである。コントローラ１１０は、基板Ｗを処理するときには、製品レシピ１３１に従って制御対象を制御し、ダミー処理を実行するときには、ダミー処理レシピ１３２に従って制御対象を制御する。 Various data 130 are stored in the memory 112 . The data 130 includes product recipes 131 for processing substrates W for production and dummy processing recipes 132 for dummy processing using dummy substrates DW. The product recipe 131 is data that defines the transport operation of the substrate W and the processing details for the substrate W. FIG. The dummy processing recipe 132 is data that defines the transfer operation of the dummy substrate DW and the processing content using the dummy substrate DW. The controller 110 controls the controlled object according to the product recipe 131 when processing the substrate W, and controls the controlled object according to the dummy processing recipe 132 when executing the dummy processing.
　製品レシピ１３１は、コントローラ１１０に通信可能に接続されたホストコンピュータ１５０からのデータ通信によって与えられ、メモリ１１２に格納されてもよい。ダミー処理レシピ１３２も同様に、ホストコンピュータ１５０から通信によって与えられ、メモリ１１２に格納されてもよい。また、これらのレシピ１３１，１３２は、コントローラ１１０に接続されたユーザインタフェース１４０を用いて、操作者が入力または編集してもよい。ダミー処理レシピ１３２は、製品レシピ１３１の内容に応じて、コントローラ１１０が自動生成してもよい。製品レシピ１３１およびダミー処理レシピ１３２のいずれについても、一種類である必要はなく、複数の製品レシピ１３１または複数のダミー処理レシピ１３２がメモリ１１２に格納されてもよい。 The product recipe 131 may be provided by data communication from a host computer 150 communicatively connected to the controller 110 and stored in the memory 112 . Dummy processing recipes 132 may likewise be communicated from host computer 150 and stored in memory 112 . Also, these recipes 131 and 132 may be input or edited by an operator using a user interface 140 connected to the controller 110 . The dummy processing recipe 132 may be automatically generated by the controller 110 according to the content of the product recipe 131 . Both the product recipe 131 and the dummy process recipe 132 need not be of one type, and multiple product recipes 131 or multiple dummy process recipes 132 may be stored in the memory 112 .
　たとえば、ダミー処理レシピ１３２は、製品用の基板Ｗと同様の処理をダミー基板ＤＷに対して実施する前処理を規定する前処理レシピを含む。前処理レシピは、製品レシピ１３１において、処理ユニット１１Ｌ－４３Ｕに搬入する基板を製品用の基板Ｗからダミー基板ＤＷに置き換えたレシピであってもよい。このような前処理レシピは、コントローラ１１０が、製品レシピ１３１に基づいて自動生成してもよい。たとえば、基板Ｗに対して高温の処理液を供給する処理を行う場合、前処理を実行することによって、高温の処理液をノズル５５まで導くことができ、かつ高温の処理液によって配管５６および処理ユニット１１Ｌ－４３Ｕの内部を温めることができる。それにより、製品用の基板Ｗに対して、適切に温度管理された環境で、適切な温度の処理液を供給できる。このように、前処理は、製品用の基板Ｗを適切に処理するために処理ユニット１１Ｌ－４３Ｕの処理環境を整えるための準備処理の一例である。 For example, the dummy processing recipe 132 includes a preprocessing recipe that defines preprocessing for performing the same processing on the dummy substrate DW as that for the product substrate W. The pretreatment recipe may be a recipe obtained by replacing the product substrate W with the dummy substrate DW in the product recipe 131 as the substrate to be carried into the processing unit 11L-43U. Such a pretreatment recipe may be automatically generated by controller 110 based on product recipe 131 . For example, when a process of supplying a high-temperature processing liquid to the substrate W is performed, the high-temperature processing liquid can be guided to the nozzle 55 by performing preprocessing, and the high-temperature processing liquid can be applied to the pipe 56 and the processing liquid. The interior of unit 11L-43U can be heated. As a result, the processing liquid at an appropriate temperature can be supplied to the product substrate W in an environment in which the temperature is appropriately controlled. Thus, the pretreatment is an example of preparatory processing for preparing the processing environment of the processing units 11L-43U so as to properly process the substrate W for the product.
　また、ダミー処理レシピ１３２は、ダミー基板ＤＷをスピンチャック４０に保持させて処理ユニット１１Ｌ－４３Ｕの内部を洗浄するユニット洗浄レシピを含む。ユニット洗浄レシピに従って行われるユニット洗浄処理は、スピンチャック４０にダミー基板ＤＷを保持させて回転し、その状態で、洗浄液（薬液または純水）をダミー基板ＤＷに供給する。それにより、ダミー基板ＤＷ上で遠心力を受けた洗浄液がスピンチャック４０の周囲に飛散し、処理カップ３９の内部を洗浄する。必要に応じて、処理カップ３９を上下動させることにより、処理カップ３９の内壁面に対する洗浄液の入射位置が上下に変化するので、処理カップ３９の内壁面を効率的に洗浄できる。また、処理カップ３９の上下動またはスピンチャック４０の上下動によって、ダミー基板ＤＷを処理カップ３９の上端よりも上方に配置し、処理カップ３９外の処理室３５の内部に洗浄液を供給し、処理室３５の内部を洗浄することもできる。 Also, the dummy processing recipe 132 includes a unit cleaning recipe for cleaning the inside of the processing units 11L-43U while holding the dummy substrate DW on the spin chuck 40. FIG. In the unit cleaning process performed according to the unit cleaning recipe, the spin chuck 40 holds and rotates the dummy substrate DW, and in this state, a cleaning liquid (chemical or pure water) is supplied to the dummy substrate DW. As a result, the cleaning liquid subjected to centrifugal force on the dummy substrate DW scatters around the spin chuck 40 and cleans the inside of the processing cup 39 . By moving the processing cup 39 up and down as necessary, the incident position of the cleaning liquid on the inner wall surface of the processing cup 39 changes up and down, so that the inner wall surface of the processing cup 39 can be cleaned efficiently. Further, the dummy substrate DW is arranged above the upper end of the processing cup 39 by the vertical movement of the processing cup 39 or the vertical movement of the spin chuck 40, and the cleaning liquid is supplied to the inside of the processing chamber 35 outside the processing cup 39 to perform processing. The interior of chamber 35 can also be cleaned.
　メモリ１１２に格納されるデータ１３０は、さらに、複数の処理ユニット１１Ｌ－４３Ｕとダミー基板収容部７Ｌ，７Ｕのダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２とを対応付けるダミー基板テーブル１３３を含む。複数のダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２にはそれぞれ一意のダミー基板スロット番号（ダミー基板スロット識別情報）が付されている。そして、各処理ユニット１１Ｌ－４３Ｕに対して、一つのダミー基板スロット番号が対応付けられている。ダミー基板テーブル１３３は、第１処理ブロック層ＢＬの複数（この実施形態では１２個）の処理ユニット１１Ｌ－４３Ｕと、当該第１処理ブロック層ＢＬのダミー基板収容部７Ｌの複数（この実施形態では１２個）のダミー基板スロット番号とを、１対１に対応付ける。また、ダミー基板テーブル１３３は、第２処理ブロック層ＢＵの複数（この実施形態では１２個）の処理ユニット１１Ｌ－４３Ｕと、当該第２処理ブロック層ＢＵのダミー基板収容部７Ｕの複数（この実施形態では１２個）のダミー基板スロット番号とを１対１に対応付ける。したがって、ダミー基板テーブル１３３は、基板処理装置１が備える複数（この実施形態では２４個）の処理ユニット１１Ｌ－４３Ｕと、ダミー基板収容部７Ｌ，７Ｕの複数（この実施形態では２４個）のスロット番号とを１対１に対応付けている。 The data 130 stored in the memory 112 further includes a dummy board table 133 that associates the plurality of processing units 11L-43U with the dummy board slots DL1-DL12, DU1-DU12 of the dummy board storage units 7L, 7U. A unique dummy board slot number (dummy board slot identification information) is assigned to each of the plurality of dummy board slots DL1 to DL12 and DU1 to DU12. One dummy substrate slot number is associated with each processing unit 11L-43U. The dummy substrate table 133 includes a plurality (12 in this embodiment) of the processing units 11L-43U of the first processing block layer BL and a plurality of (12 in this embodiment) of the dummy substrate housing portions 7L of the first processing block layer BL. 12) dummy substrate slot numbers are associated one-to-one. The dummy substrate table 133 includes a plurality of (12 in this embodiment) processing units 11L-43U of the second processing block layer BU and a plurality of (in this embodiment, 12) dummy substrate storage units 7U of the second processing block layer BU. 12 in the form) are associated one-to-one with the dummy board slot numbers. Therefore, the dummy substrate table 133 includes a plurality of (24 in this embodiment) processing units 11L-43U provided in the substrate processing apparatus 1 and a plurality of (24 in this embodiment) slots of the dummy substrate storage units 7L and 7U. numbers are associated one-to-one.
　メモリ１１２に格納されるデータ１３０は、さらに、ダミー基板履歴データ１３４を含む。ダミー基板履歴データ１３４は、ダミー基板収容部７Ｌ，７Ｕの複数のダミー基板スロット番号にそれぞれ対応するダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２に収容されるダミー基板ＤＷの使用履歴を表すデータ（使用履歴情報）を含む。使用履歴は、ダミー基板ＤＷが処理ユニット１１Ｌ－４３Ｕでの処理に用いられた使用回数（累積回数）、ダミー基板ＤＷが処理ユニット１１Ｌ－４３Ｕでの処理に用いられた使用時間（累積時間）、ダミー基板ＤＷが処理ユニット１１Ｌ－４３Ｕで受けた処理内容の履歴の少なくとも一つを含むことが好ましい。 The data 130 stored in the memory 112 further includes dummy board history data 134 . The dummy board history data 134 is data representing the usage history of the dummy boards DW accommodated in the dummy board slots DL1 to DL12 and DU1 to DU12 corresponding to the plurality of dummy board slot numbers of the dummy board accommodation units 7L and 7U. historical information). The usage history includes the number of times the dummy substrate DW was used for processing in the processing units 11L-43U (cumulative count), the usage time (cumulative time) during which the dummy substrate DW was used for processing in the processing units 11L-43U, It is preferable that the dummy substrate DW contains at least one history of processing details received in the processing units 11L-43U.
　メモリ１１２に格納されるデータ１３０は、さらに、各処理ユニット１１Ｌ－４３Ｕのユニット使用履歴を表すユニット使用履歴データ１３５を含む。ユニット使用履歴データ１３５は、各処理ユニット１１Ｌ－４３Ｕの基板処理枚数、および各処理ユニット１１Ｌ－４３Ｕが基板処理のために使用されていない連続時間を表す不使用継続時間を含むことが好ましい。処理ユニット１１Ｌ－４３Ｕの内部の環境は、基板処理を繰り返すことによって徐々に悪化するので、メンテナンスを要することなく連続して処理できる基板枚数には適切な上限を設定することが好ましい。また、処理ユニット１１Ｌ－４３Ｕの内部の環境は、基板Ｗを処理していない時間が長くなると、徐々に劣化する。具体的には、処理カップ３９の内壁等に付着した薬液が乾燥して結晶化し、パーティクルの原因となる場合がある。また、室温よりも高い温度の高温の処理液が用いられる場合には、不使用状態の継続によって、処理液の流通が長時間にわたって遮断されると、配管５６またはノズル５５の温度が低下する。そのため、次に処理液を吐出するときに、処理液の熱が配管５６またはノズル５５で奪われ、吐出直後の処理液の温度が適切でなくなる場合がある。したがって、不使用継続時間に関しても、適切な上限を設定することが好ましい。ユニット使用履歴データ１３５（基板処理枚数、不使用継続時間等）を、対応する設定値と比較することにより、処理ユニット１１Ｌ－４３Ｕに対するメンテナンスの要否を判断できる。 The data 130 stored in the memory 112 further includes unit usage history data 135 representing the unit usage history of each of the processing units 11L-43U. Unit usage history data 135 preferably includes the number of substrates processed by each processing unit 11L-43U and the non-use duration representing the continuous time during which each processing unit 11L-43U is not used for substrate processing. Since the internal environment of the processing units 11L-43U gradually deteriorates as substrate processing is repeated, it is preferable to set an appropriate upper limit for the number of substrates that can be processed continuously without requiring maintenance. In addition, the internal environment of the processing units 11L-43U gradually deteriorates as the time during which the substrates W are not processed increases. Specifically, the chemical liquid adhering to the inner wall or the like of the processing cup 39 may dry and crystallize, causing particles. In addition, when a high-temperature processing liquid having a temperature higher than room temperature is used, the temperature of the pipe 56 or the nozzle 55 decreases when the flow of the processing liquid is interrupted for a long time due to continued non-use. Therefore, when the treatment liquid is discharged next time, the heat of the treatment liquid is taken away by the pipe 56 or the nozzle 55, and the temperature of the treatment liquid immediately after the discharge may not be appropriate. Therefore, it is preferable to set an appropriate upper limit for the duration of non-use as well. By comparing the unit usage history data 135 (the number of processed substrates, duration of non-use, etc.) with corresponding set values, it is possible to determine whether or not maintenance is required for the processing units 11L-43U.
　メモリ１１２に格納されるデータ１３０は、さらに、第１処理ブロック層ＢＬ（第１処理ユニット群）の状態を表す第１ステータス１４１と、第２処理ブロック層ＢＵ（第２処理ユニット群）の状態を表す第２ステータス１４２とを含む。第１ステータス１４１は、禁止モードおよび可能モードを含む。同様に、第２ステータス１４２は、禁止モードおよび可能モードを含む。 The data 130 stored in the memory 112 further includes a first status 141 representing the state of the first processing block layer BL (first processing unit group) and a state of the second processing block layer BU (second processing unit group). and a second status 142 representing . The first status 141 includes prohibited mode and enabled mode. Similarly, the second status 142 includes prohibited mode and enabled mode.
　第１ステータス１４１が禁止モードのとき、第１処理ブロック層ＢＬに含まれる処理ユニット１１Ｌ－４３Ｌにおいて基板Ｗに対する処理およびダミー処理をいずれも実行することができない。より正確には、基板Ｗに対する処理を新たに開始したり、ダミー処理を新たに開始したりすることができない。基板Ｗに対する処理の開始とは、この実施形態では、処理ユニット１１Ｌ－４３Ｌで処理すべき基板ＷをキャリヤＣから搬出する（払い出す）ことをいい、ダミー処理の開始とは、処理ユニット１１Ｌ－４３Ｌでのダミー処理に用いるダミー基板ＤＷを第１ダミー基板収容部７Ｌから搬出する（払い出す）ことをいう。第１ステータス１４１が可能モードのとき、第１処理ブロック層ＢＬに含まれる処理ユニット１１Ｌ－４３Ｌにおける基板Ｗの処理およびダミー処理がいずれも許容され、それらの処理を新たに開始することができる。 When the first status 141 is in the prohibition mode, neither processing on the substrate W nor dummy processing can be performed in the processing units 11L-43L included in the first processing block layer BL. More precisely, it is not possible to newly start the processing for the substrate W or to newly start the dummy processing. In this embodiment, the start of processing on the substrate W means unloading (dispensing) the substrate W to be processed by the processing units 11L-43L from the carrier C, and the start of dummy processing means the processing by the processing units 11L-43L. This means that the dummy substrate DW used for the dummy processing in 43L is unloaded (taken out) from the first dummy substrate housing portion 7L. When the first status 141 is in the enable mode, both the processing of the substrate W and the dummy processing in the processing units 11L-43L included in the first processing block layer BL are permitted, and these processing can be started again.
　第２ステータス１４２が禁止モードのとき、第２処理ブロック層ＢＵに含まれる処理ユニット１１Ｕ－４３Ｕにおいて基板Ｗに対する処理およびダミー処理をいずれも実行することができない。より正確には、基板Ｗに対する処理を新たに開始したり、ダミー処理を新たに開始したりすることができない。基板Ｗに対する処理の開始とは、この実施形態では、処理ユニット１１Ｕ－４３Ｕで処理すべき基板ＷをキャリヤＣから搬出する（払い出す）ことをいい、ダミー処理の開始とは、処理ユニット１１Ｕ－４３Ｕでのダミー処理に用いるダミー基板ＤＷを第２ダミー基板収容部７Ｕから搬出する（払い出す）ことをいう。第２ステータス１４２が可能モードのとき、第２処理ブロック層ＢＵに含まれる処理ユニット１１Ｕ－４３Ｕにおける基板Ｗの処理およびダミー処理がいずれも許容され、それらの処理を新たに開始することができる。 When the second status 142 is in the prohibition mode, none of the processing units 11U to 43U included in the second processing block layer BU and the dummy processing for the substrate W can be executed. More precisely, it is not possible to newly start the processing for the substrate W or to newly start the dummy processing. In this embodiment, the start of processing on the substrate W means unloading (dispensing) the substrate W to be processed by the processing units 11U-43U from the carrier C, and the start of dummy processing means the processing units 11U-43U. It means carrying out (discharging) the dummy substrate DW used for the dummy processing in 43U from the second dummy substrate housing portion 7U. When the second status 142 is in the enabled mode, both the processing of the substrate W and the dummy processing in the processing units 11U to 43U included in the second processing block layer BU are permitted, and these processing can be newly started.
　コントローラ１１０は、ダミー基板履歴データ１３４に基づいて、ダミー基板収容部７Ｌ，７Ｕに格納されているダミー基板ＤＷの交換の要否を判断し、その判断に基づいて、第１ステータス１４１および第２ステータス１４２を設定するステータス設定部としての機能を有している。 Based on the dummy substrate history data 134, the controller 110 determines whether it is necessary to replace the dummy substrates DW stored in the dummy substrate storage units 7L and 7U. It has a function as a status setting unit that sets the status 142 .
　図９は、ダミー処理に関連するコントローラ１１０の動作を説明するためのフローチャートである。コントローラ１１０は、複数の処理ユニット１１Ｌ－４３Ｕのそれぞれに関して、図９の処理を、並行して、または順次に実行する。 FIG. 9 is a flowchart for explaining the operation of the controller 110 related to dummy processing. Controller 110 executes the processing of FIG. 9 in parallel or sequentially for each of the plurality of processing units 11L-43U.
　コントローラ１１０は、対象の処理ユニット１１Ｌ－４３Ｕにおいて、製品用の基板Ｗの処理が実行されているかどうかを判断する（ステップＡ１）。処理ユニット１１Ｌ－４３Ｕにおいて、基板Ｗの処理が終了し、その処理済みの基板Ｗが処理ユニット１１Ｌ－４３Ｕから搬出されると（ステップＡ１：ＮＯ）、コントローラ１１０は、当該処理ユニット１１Ｌ－４３Ｕのユニット使用履歴データ１３５を参照し、基板処理枚数が設定値に達したかどうかを判断する（ステップＡ２）。基板処理枚数が設定値以上のときは（ステップＡ２：ＹＥＳ）、コントローラ１１０は、ユニット洗浄実行条件（メンテナンス実行条件の一例）が充足されたものと判断して、処理ユニット１１Ｌ－４３Ｕの内部を洗浄するためにユニット洗浄レシピに従ってユニット洗浄処理（メンテナンス処理の一例）を実行する（ステップＡ３）。また、コントローラ１１０は、当該処理ユニットの基板処理枚数を初期値（たとえば０）にリセットして、ユニット使用履歴データ１３５を更新する（ステップＡ４）。 The controller 110 determines whether or not the product substrate W is being processed in the target processing unit 11L-43U (step A1). In the processing unit 11L-43U, when the processing of the substrate W is completed and the processed substrate W is unloaded from the processing unit 11L-43U (step A1: NO), the controller 110 controls the processing unit 11L-43U. By referring to the unit usage history data 135, it is determined whether or not the number of processed substrates has reached the set value (step A2). When the number of processed substrates is equal to or greater than the set value (step A2: YES), the controller 110 determines that the unit cleaning execution condition (an example of the maintenance execution condition) is satisfied, and cleans the processing units 11L-43U. For cleaning, unit cleaning processing (an example of maintenance processing) is executed according to the unit cleaning recipe (step A3). Further, the controller 110 resets the substrate processing number of the processing unit to an initial value (for example, 0) and updates the unit usage history data 135 (step A4).
　ユニット洗浄処理は、ダミー処理の一例であり、搬送スケジュール作成ステップＡ３０と、ダミー基板搬入ステップＡ３１と、ダミー処理ステップＡ３２と、ダミー基板収容ステップＡ３３とを含む。搬送スケジュール作成ステップＡ３０は、ダミー処理のための搬送計画（搬送スケジュール）を作成するステップである。ダミー基板搬入ステップＡ３１は、作成された搬送スケジュールに従って、主搬送ロボット８Ｌ，８Ｕを制御するステップである。それにより、主搬送ロボット８Ｌ，８Ｕが、対応するダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２からダミー基板ＤＷを搬出し、処理ユニット１１Ｌ－４３Ｕへ搬送して当該処理ユニットに搬入する。ダミー処理ステップＡ３２は、当該処理ユニットにおいて、ダミー基板ＤＷを用いる処理を実行するステップであり、ここでは、当該処理ユニットの内部の洗浄処理である。ダミー基板収容ステップＡ３３は、処理ユニット内部の洗浄の後に、搬送スケジュールに従って、当該処理ユニットからダミー基板ＤＷを搬出し、元のダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２まで搬送して収容するステップである。コントローラ１１０は、ダミー基板テーブル１３３を参照して、当該処理ユニット１１Ｌ－４３Ｕに対応するダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２を特定して、ダミー基板搬入ステップＡ３１およびダミー基板収容ステップＡ３３のための搬送スケジュールを作成する。 The unit cleaning process is an example of the dummy process, and includes a transfer schedule creation step A30, a dummy substrate loading step A31, a dummy processing step A32, and a dummy substrate accommodation step A33. The transfer schedule creation step A30 is a step of creating a transfer plan (transfer schedule) for dummy processing. The dummy substrate loading step A31 is a step of controlling the main transport robots 8L and 8U according to the created transport schedule. As a result, the main transport robots 8L and 8U unload the dummy substrates DW from the corresponding dummy substrate slots DL1-DL12 and DU1-DU12, transport them to the processing units 11L-43U, and load them into the processing units. The dummy processing step A32 is a step of executing processing using the dummy substrate DW in the processing unit, and here, cleaning processing of the inside of the processing unit. The dummy substrate accommodation step A33 is a step of carrying out the dummy substrate DW from the processing unit after cleaning the inside of the processing unit and transporting the dummy substrate DW to the original dummy substrate slots DL1 to DL12 and DU1 to DU12 according to the transportation schedule. be. The controller 110 refers to the dummy substrate table 133, identifies the dummy substrate slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and performs the dummy substrate loading step A31 and the dummy substrate accommodating step A33. create a delivery schedule for
　ユニット洗浄処理を終えると、コントローラ１１０は、処理ユニット１１Ｌ－４３Ｕの処理環境（処理条件）を整えるための前処理が必要かどうかを判断する（ステップＡ５，Ａ６）。具体的には、コントローラ１１０は、ホストコンピュータ１５０から製品基板の処理要求（処理予約）が与えられたかどうかを調べる（ステップＡ５）。製品基板の処理要求が与えられると（ステップＡ５：ＹＥＳ）、コントローラ１１０は、当該処理ユニット１１Ｌ－４３Ｕの不使用継続時間が設定値に達したかどうかを判断する（ステップＡ６）。不使用継続時間が設定値以上の場合（ステップＡ６：ＹＥＳ）、すなわち、処理ユニット１１Ｌ－４３Ｕが所定の長時間を超えて製品用の基板Ｗのために使用されていない場合には、コントローラ１１０は、前処理が必要である、すなわち、前処理実行条件（メンテナンス実行条件の一例）が充足されていると判断する。 After finishing the unit cleaning process, the controller 110 determines whether or not preprocessing is necessary to prepare the processing environment (processing conditions) of the processing units 11L-43U (steps A5 and A6). Specifically, the controller 110 checks whether a processing request (processing reservation) for a product substrate has been given from the host computer 150 (step A5). When a product substrate processing request is given (step A5: YES), the controller 110 determines whether the non-use duration of the processing unit 11L-43U has reached a set value (step A6). If the non-use duration time is equal to or greater than the set value (step A6: YES), that is, if the processing unit 11L-43U has not been used for product substrates W for a longer than a predetermined length of time, the controller 110 determines that pretreatment is necessary, that is, pretreatment execution conditions (an example of maintenance execution conditions) are satisfied.
　前処理が必要であると判断されると、コントローラ１１０は、前処理レシピに従って前処理を実行する（ステップＡ７）。具体的には、コントローラ１１０は、ダミー基板テーブル１３３を参照して、当該処理ユニット１１Ｌ－４３Ｕに対応するダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２を特定し、それに基づいて、前処理のための搬送スケジュールを作成する（搬送スケジュール作成ステップＡ７０）。そして、コントローラ１１０は、作成された搬送スケジュールに従って主搬送ロボット８Ｌ，８Ｕを制御し、当該特定されたダミー基板スロットからダミー基板ＤＷを搬出させ、そのダミー基板ＤＷを当該処理ユニット１１Ｌ－４３Ｕに搬送させる（ダミー基板搬入ステップＡ７１）。その搬送の後、ホストコンピュータ１５０は、当該処理ユニット１１Ｌ－４３Ｕにおいて、ダミー基板ＤＷに対して、製品用の基板Ｗに対する処理と同様の処理を実行する（ダミー処理ステップＡ７２）。その処理が終了すると、ホストコンピュータ１５０は、搬送スケジュールに従って主搬送ロボット８Ｌ，８Ｕを制御し、当該処理ユニット１１Ｌ－４３Ｕからダミー基板ＤＷを取り出して、元のダミー基板スロットまで搬送させ、そのダミー基板スロットにそのダミー基板ＤＷを収容させる（ダミー基板収容ステップＡ７３）。こうして、前処理を実行すると、コントローラ１１０は、不使用継続時間を初期値（たとえば０）にリセットして、ユニット使用履歴データ１３５を更新する（ステップＡ８）。 When it is determined that pretreatment is necessary, the controller 110 executes pretreatment according to the pretreatment recipe (step A7). Specifically, the controller 110 refers to the dummy substrate table 133 to identify the dummy substrate slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and based thereon, to perform preprocessing. A transportation schedule is created (transportation schedule creation step A70). Then, the controller 110 controls the main transport robots 8L and 8U according to the created transport schedule to carry out the dummy substrate DW from the specified dummy substrate slot, and transports the dummy substrate DW to the processing unit 11L-43U. (dummy substrate loading step A71). After the transfer, the host computer 150 executes the same processing as the product substrate W on the dummy substrate DW in the processing unit 11L-43U (dummy processing step A72). When the processing is completed, the host computer 150 controls the main transfer robots 8L and 8U according to the transfer schedule to take out the dummy substrate DW from the processing units 11L to 43U, transfer it to the original dummy substrate slot, and transfer the dummy substrate DW to the original dummy substrate slot. The slot accommodates the dummy substrate DW (dummy substrate accommodation step A73). After executing the preprocessing in this manner, the controller 110 resets the non-use duration to the initial value (for example, 0) and updates the unit usage history data 135 (step A8).
　上記のように、製品基板Ｗの処理要求（処理予約）が与えられた時点で、コントローラ１１０は、前処理を実行する。前処理は、ダミー基板ＤＷの搬送（ステップＡ７１）およびそれを用いるダミー処理（ステップＡ７２）を含む。そのため、製品基板Ｗを収容したキャリヤＣがキャリヤ保持部２５に保持され、インデクサロボット２６がそのキャリヤＣから処理対象の基板Ｗを取り出して基板載置部６Ｌ，６Ｕへと搬送する基板搬入動作（ステップＡ２０）と並行して、あるいはそれ以前に前処理（ダミー基板搬入ステップＡ７１および／またはダミー処理ステップＡ７２）が実行されることになる。このとき、インデクサロボット２６はダミー基板ＤＷの搬送に関与しない。したがって、インデクサロボット２６による製品基板Ｗの搬送を阻害することなく、処理ブロック３の内部でダミー基板ＤＷを搬送して、前処理が実行される。 As described above, when a processing request (processing reservation) for the product substrate W is given, the controller 110 executes preprocessing. The preprocessing includes transportation of the dummy substrate DW (step A71) and dummy processing using it (step A72). Therefore, the carrier C containing the product substrates W is held by the carrier holding unit 25, and the indexer robot 26 picks up the substrates W to be processed from the carrier C and transports them to the substrate mounting units 6L and 6U. In parallel with or before step A20), preprocessing (dummy substrate loading step A71 and/or dummy processing step A72) is performed. At this time, the indexer robot 26 is not involved in transporting the dummy substrate DW. Therefore, the dummy substrates DW are transported inside the processing block 3 and the preprocessing is executed without interfering with the transportation of the product substrates W by the indexer robot 26 .
　なお、便宜的に、図９にインデクサロボット２６による製品基板Ｗの搬入ステップＡ２０を表してあるが、前処理ステップＡ７との前後関係が図示のとおりになることを意味するものではない。前処理ステップＡ７に先立って、またはそれと並行して製品基板搬入ステップＡ２０が行われ得る（開始し得る）ことは前述のとおりであり、また、前処理ステップＡ７の後に製品基板搬入ステップＡ２０が行われる（開始される）こともあり得る。 For the sake of convenience, FIG. 9 shows the loading step A20 of the product substrate W by the indexer robot 26, but it does not mean that the relationship with the pretreatment step A7 is as illustrated. As described above, the product substrate loading step A20 can be performed (started) prior to or in parallel with the preprocessing step A7, and the product substrate loading step A20 is performed after the preprocessing step A7. It may be started (started).
　前処理レシピは、製品用の基板Ｗに対して行うべき処理をダミー基板ＤＷに対して行う前処理を規定している。そのため、前処理をダミー基板ＤＷに対して実行することにより、ダミー基板ＤＷが消耗する。具体的には、エッチング作用を有する薬液を用いる前処理をダミー基板ＤＷに対して行うことにより、ダミー基板ＤＷの表面がエッチングされ、ダミー基板ＤＷの厚みが減少する。そこで、前処理レシピを実行すると、コントローラ１１０は、当該処理ユニット１１Ｌ－４３Ｕに対応付けられたダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２のダミー基板履歴データ１３４を更新する（ステップＡ９）。たとえば、ダミー基板履歴データ１３４が使用回数データを含む場合には、使用回数データをインクリメントする。 The pretreatment recipe defines the pretreatment to be performed on the dummy substrate DW, which should be performed on the product substrate W. Therefore, the dummy substrate DW is consumed by performing the pretreatment on the dummy substrate DW. Specifically, the surface of the dummy substrate DW is etched and the thickness of the dummy substrate DW is reduced by subjecting the dummy substrate DW to pretreatment using a chemical solution having an etching action. Therefore, when the pretreatment recipe is executed, the controller 110 updates the dummy substrate history data 134 of the dummy substrate slots DL1-DL12, DU1-DU12 associated with the processing units 11L-43U (step A9). For example, if the dummy substrate history data 134 includes usage count data, the usage count data is incremented.
　前処理を終えると、コントローラ１１０は、製品レシピに従う制御を実行する（ステップＡ１２）。具体的には、コントローラ１１０は、製品基板処理のための搬送スケジュールを作成し（搬送スケジュール作成ステップＡ１２０）、その搬送スケジュールに従って、インデクサロボット２６および主搬送ロボット８Ｌ，８Ｕを制御する。それより、インデクサロボット２６は、キャリヤＣから製品基板Ｗを取り出して、基板載置部６Ｌ，６Ｕに載置する。そして、主搬送ロボット８Ｌ，８Ｕは、基板載置部６Ｌ，６Ｕから基板Ｗを取り出して処理ユニット１１Ｌ－４３Ｕに搬送する（基板搬入ステップＡ１２１）。そして、処理ユニット１１Ｌ－４３Ｕにおいて、処理液（薬液、リンス液等）を用いた処理が基板Ｗに対して実行される（処理ステップＡ１２２）。その終了後には、搬送スケジュールに従い、主搬送ロボット８Ｌ，８Ｕは、処理済みの基板Ｗを取り出して、基板載置部６Ｌ，６Ｕまで搬送し、インデクサロボット２６は、その処理済みの基板Ｗをキャリヤに収容する（基板収容ステップＡ１２３）。未処理の基板Ｗが存在する場合（複数枚の基板Ｗの連続処理の場合）には（ステップＡ１３：ＹＥＳ）、同様の動作が繰り返される。その間に、当該処理ユニットでの基板処理枚数が設定値に達すると（ステップＡ１４：ＹＥＳ）、ステップＡ３に戻って、ユニット洗浄処理が実行される。連続処理でない場合（ステップＡ１３：ＮＯ）には、リターンして、ステップＡ１からの処理が繰り返される。 After completing the preprocessing, the controller 110 executes control according to the product recipe (step A12). Specifically, the controller 110 creates a transport schedule for product substrate processing (transport schedule creation step A120), and controls the indexer robot 26 and the main transport robots 8L and 8U according to the transport schedule. Then, the indexer robot 26 picks up the product substrate W from the carrier C and places it on the substrate platforms 6L and 6U. Then, the main transport robots 8L and 8U take out the substrates W from the substrate platforms 6L and 6U and transport them to the processing units 11L-43U (substrate loading step A121). Then, in the processing unit 11L-43U, processing using a processing liquid (chemical liquid, rinse liquid, etc.) is performed on the substrate W (processing step A122). After that, the main transport robots 8L and 8U take out the processed substrates W according to the transport schedule and transport them to the substrate platforms 6L and 6U. (substrate accommodation step A123). When there is an unprocessed substrate W (in the case of continuous processing of a plurality of substrates W) (step A13: YES), the same operation is repeated. In the meantime, when the number of processed substrates in the processing unit reaches the set value (step A14: YES), the process returns to step A3 and the unit cleaning process is executed. If it is not continuous processing (step A13: NO), the process returns and the processing from step A1 is repeated.
　ホストコンピュータ１５０からの処理要求（処理予約）がなければ（ステップＡ５：ＮＯ）、コントローラ１１０は、待機状態の継続時間、すなわち不使用継続時間が設定値に達したかどうかを判断する（ステップＡ１５）。不使用継続時間が設定値に達していなければ、待機状態となる。不使用継続時間が設定値に達すると（ステップＡ１５：ＹＥＳ）、コントローラ１１０は、予め設定されているメンテナンス処理を実行する（ステップＡ１６）。メンテナンス処理は、ユニット洗浄処理であってもよい。このユニット洗浄処理は、ステップＡ３の場合と同様に、ダミー基板ＤＷを用いた処理（ダミー処理の一種）であってもよいし、ダミー基板ＤＷを用いない処理であってもよい。また、メンテナンス処理は、前処理と類似の処理であってもよい。また、メンテナンス処理は、その他の処理であってもよい。メンテナンス処理は、主として、処理ユニット１１Ｌ－４３Ｕの処理室３５内の環境を製品用の基板Ｗの処理に適した状態に保持するための処理であり、基板処理装置１の使用者が予め設定する処理であってもよい。ダミー基板ＤＷを用いるダミー処理をメンテナンス処理として行う場合には、メンテナンス処理は、当該処理のための搬送計画（搬送スケジュール）を作成する搬送スケジュール作成ステップＡ１６０と、その搬送計画に従って、対応するダミー基板スロットからダミー基板ＤＷを取り出して当該処理ユニットに搬入するステップＡ１６１と、処理ユニット内でダミー基板ＤＷを用いたダミー処理を行うステップＡ１６２と、その処理後に、搬送スケジュールに従って、ダミー基板ＤＷを対応するダミー基板スロットに収容するステップＡ１６３とを含む。 If there is no processing request (processing reservation) from the host computer 150 (step A5: NO), the controller 110 determines whether the duration of the standby state, that is, the non-use duration has reached a set value (step A15). ). If the non-use continuation time has not reached the set value, it will be in a standby state. When the non-use duration time reaches the set value (step A15: YES), the controller 110 executes preset maintenance processing (step A16). The maintenance process may be a unit cleaning process. As in the case of step A3, this unit cleaning process may be a process using the dummy substrate DW (a type of dummy process), or may be a process without using the dummy substrate DW. Also, the maintenance process may be a process similar to the pre-process. Also, the maintenance process may be another process. The maintenance process is mainly a process for maintaining the environment in the processing chamber 35 of the processing units 11L-43U in a state suitable for processing the product substrates W, and is set in advance by the user of the substrate processing apparatus 1. It may be processing. When dummy processing using dummy substrates DW is performed as maintenance processing, the maintenance processing includes a transfer schedule creation step A160 for creating a transfer plan (transfer schedule) for the processing, and a corresponding dummy substrate according to the transfer plan. A step A161 of taking out the dummy substrate DW from the slot and loading it into the processing unit, a step A162 of performing dummy processing using the dummy substrate DW in the processing unit, and after the processing, handling the dummy substrate DW according to the transfer schedule. and step A163 of accommodating the dummy board slot.
　ホストコンピュータ１５０からの処理要求（処理予約）がない時点では、コントローラ１１０が製品レシピ１３１と同様の前処理を自動的に計画することはできない。したがって、メンテナンス処理（ステップＡ１６）を随時に実行していても、ホストコンピュータ１５０からの処理要求（処理予約）があったときには、その製品処理に対応した前処理（ステップＡ７）を実行することが好ましい。 When there is no processing request (processing reservation) from the host computer 150, the controller 110 cannot automatically plan preprocessing similar to the product recipe 131. Therefore, even if maintenance processing (step A16) is executed as needed, when there is a processing request (processing reservation) from host computer 150, preprocessing (step A7) corresponding to the product processing can be executed. preferable.
　ダミー基板ＤＷは、予め基板処理装置１の内部に導入されて、ダミー基板収容部７Ｌ，７Ｕに収容される。具体的には、たとえば、工場内に備えられたキャリヤ搬送機構３００（図１参照）によって、ダミー基板ＤＷを収容した供給用ダミーキャリヤＤＣがキャリヤ保持部２５に渡される。インデクサロボット２６は、その供給用ダミーキャリヤＤＣからダミー基板ＤＷを取り出して、基板載置部６Ｌ，６Ｕに搬送する。第１処理ブロック層ＢＬの主搬送ロボット８Ｌは、基板載置部６Ｌからダミー基板収容部７Ｌへとダミー基板ＤＷを搬送して収容する。第２処理ブロック層ＢＵの主搬送ロボット８Ｕは、基板載置部６Ｕからダミー基板収容部７Ｕへとダミー基板ＤＷを搬送して収容する。コントローラ１１０は、ダミー基板ＤＷの導入のための搬送スケジュールを作成し、その搬送スケジュールに従ってインデクサロボット２６および主搬送ロボット８Ｌ，８Ｕを制御することによって、前述のような搬送動作を達成する。 The dummy substrates DW are previously introduced into the substrate processing apparatus 1 and accommodated in the dummy substrate accommodation units 7L and 7U. Specifically, for example, the supply dummy carrier DC containing the dummy substrate DW is transferred to the carrier holding unit 25 by the carrier transport mechanism 300 (see FIG. 1) provided in the factory. The indexer robot 26 takes out the dummy substrate DW from the supply dummy carrier DC and transports it to the substrate platforms 6L and 6U. The main transport robot 8L of the first processing block layer BL transports and stores the dummy substrate DW from the substrate platform 6L to the dummy substrate storage unit 7L. The main transport robot 8U of the second processing block layer BU transports and stores the dummy substrate DW from the substrate platform 6U to the dummy substrate storage unit 7U. The controller 110 creates a transfer schedule for introducing the dummy substrates DW, and controls the indexer robot 26 and the main transfer robots 8L and 8U according to the transfer schedule, thereby achieving the transfer operation as described above.
　新たなダミー基板ＤＷが導入されてダミー基板収容部７Ｌ，７Ｕに収容されると、コントローラ１１０は、その新たなダミー基板ＤＷが収容されたダミー基板スロットに対応するダミー基板履歴データ１３４を初期値にリセットする。 When a new dummy board DW is introduced and accommodated in the dummy board accommodation units 7L and 7U, the controller 110 initializes the dummy board history data 134 corresponding to the dummy board slot in which the new dummy board DW is accommodated. reset to
　基板処理装置１内のダミー基板ＤＷを交換するときには、主搬送ロボット８Ｌ，８Ｕおよびインデクサロボット２６によって、ダミー基板収容部７Ｌ，７Ｕからキャリヤ保持部２５に保持された回収用ダミーキャリヤＤＣへとダミー基板ＤＷが搬送される。具体的には、交換対象のダミー基板ＤＷが、第１処理ブロック層ＢＬのダミー基板収容部７Ｌに収容されているときには、主搬送ロボット８Ｌは、ダミー基板収容部７Ｌから基板載置部６Ｌへと当該ダミー基板ＤＷを搬送する。交換対象のダミー基板ＤＷが、第２処理ブロック層ＢＵのダミー基板収容部７Ｕに収容されているときには、主搬送ロボット８Ｕは、ダミー基板収容部７Ｕから基板載置部６Ｕへと当該ダミー基板ＤＷを搬送する。インデクサロボット２６は、基板載置部６Ｌ，６Ｕに置かれたダミー基板ＤＷをキャリヤ保持部２５に保持された回収用ダミーキャリヤＤＣへと搬送して収容する。複数枚のダミー基板ＤＷが交換対象であるときには、同様の動作が繰り返される。コントローラ１１０は、ダミー基板ＤＷの交換（排出）のための搬送スケジュールを作成し、その搬送スケジュールに従ってインデクサロボット２６および主搬送ロボット８Ｌ，８Ｕを制御することによって、前述のような搬送動作を達成する。 When replacing the dummy substrate DW in the substrate processing apparatus 1, the main transfer robots 8L and 8U and the indexer robot 26 move the dummy substrates DW from the dummy substrate storage units 7L and 7U to the recovery dummy carrier DC held by the carrier holding unit 25. A substrate DW is transported. Specifically, when the dummy substrate DW to be replaced is accommodated in the dummy substrate accommodation portion 7L of the first processing block layer BL, the main transfer robot 8L moves from the dummy substrate accommodation portion 7L to the substrate placement portion 6L. and the dummy substrate DW. When the dummy substrate DW to be replaced is accommodated in the dummy substrate accommodation portion 7U of the second processing block layer BU, the main transfer robot 8U transfers the dummy substrate DW from the dummy substrate accommodation portion 7U to the substrate platform 6U. to convey. The indexer robot 26 transports the dummy substrates DW placed on the substrate placement units 6L and 6U to the recovery dummy carrier DC held by the carrier holding unit 25 and accommodates them therein. Similar operations are repeated when a plurality of dummy substrates DW are to be replaced. The controller 110 creates a transport schedule for exchanging (discharging) the dummy substrates DW, and controls the indexer robot 26 and the main transport robots 8L and 8U according to the transport schedule, thereby achieving the transport operation as described above. .
　図１０は、第１ステータス１４１および第２ステータス１４２の設定、ならびにそれらに基づく搬送スケジュールの変更についての動作例を説明するためのフローチャートであり、コントローラ１１０が所定の制御周期で繰り返し実行する処理の例を示す。 FIG. 10 is a flowchart for explaining an operation example of setting the first status 141 and the second status 142 and changing the transfer schedule based on them. Give an example.
　コントローラ１１０は、ダミー基板履歴データ１３４を参照して、ダミー基板ＤＷの交換要否を表すステータスデータを算出する（ステップＳ１）。ステータスデータを算出するための算出式は、メモリ１１２に格納されている。算出式は、テーブルの形式でメモリ１１２に格納されていてもよい。たとえば、使用回数が所定の閾値に達すると、ステータスデータは交換要を表す値となる。ステータスデータは、ダミー基板収容部７Ｌ，７Ｕに収容されている全てのダミー基板ＤＷに対して算出される。ステータスデータを算出するための算出式は、複数のダミー基板ＤＷの間で共通とは限らない。前述のとおり、複数の処理ユニットに対して複数のダミー基板ＤＷが一対一に対応付けられている。各処理ユニットにおいて実行される製品基板Ｗの処理およびダミー処理は共通とは限らない。そこで、個々の処理ユニットに対応する個々のダミー基板ＤＷに対して個別に算出式を設定することができるようになっている。すなわち、メモリ１１２に複数の算出式が格納されており、各ダミー基板ＤＷに対応する（すなわち、各処理ユニットに対応する）算出式を用いてステータスデータが算出される。コントローラ１１０は、各ダミー基板ＤＷが対応する処理ユニットで使用されるごとに、すなわち、ダミー基板履歴データ１３４が更新されるたびに、ステータスデータを算出し、最新のステータスデータをメモリ１１２に格納してもよい。 The controller 110 refers to the dummy board history data 134 and calculates status data indicating whether or not the dummy board DW needs to be replaced (step S1). A calculation formula for calculating the status data is stored in the memory 112 . The calculation formula may be stored in memory 112 in the form of a table. For example, when the number of times of use reaches a predetermined threshold, the status data becomes a value indicating replacement required. Status data is calculated for all the dummy substrates DW accommodated in the dummy substrate accommodation units 7L and 7U. The calculation formula for calculating the status data is not necessarily common among the plurality of dummy substrates DW. As described above, a plurality of dummy substrates DW are associated one-to-one with a plurality of processing units. The processing of the product substrate W and the dummy processing performed in each processing unit are not necessarily common. Therefore, the calculation formula can be individually set for each dummy substrate DW corresponding to each processing unit. That is, a plurality of calculation formulas are stored in the memory 112, and status data is calculated using a calculation formula corresponding to each dummy substrate DW (that is, corresponding to each processing unit). The controller 110 calculates status data and stores the latest status data in the memory 112 each time each dummy substrate DW is used in the corresponding processing unit, that is, each time the dummy substrate history data 134 is updated. may
　コントローラ１１０は、ステータスデータに基づいて、ダミー基板ＤＷの交換が必要かどうかを判断する判断部としての機能を実行する。具体的には、第１ダミー基板収容部７Ｌのいずれかのダミー基板ＤＷのステータスデータが交換要を表す値かどうかを判断し（ステップＳ２）、かつ第２ダミー基板収容部７Ｕのいずれかのダミー基板ＤＷのステータスデータが交換要を表す値かどうかを判断する（ステップＳ３，Ｓ４）。コントローラ１１０は、さらに、上記判断に基づき、第１ステータス１４１および第２ステータス１４２を可能モードまたは禁止モードに設定するステータス設定部としての機能を実行する（ステップＳ５～Ｓ８）。具体的には、ステータスデータが交換要を表すダミー基板ＤＷのあるダミー基板収容部７Ｌ，７Ｕに対応する処理ブロック層ＢＬ，ＢＵのステータスが禁止モードに設定される。また、いずれのダミー基板ＤＷのステータスデータも交換要を表す値でないダミー基板収容部７Ｌ，７Ｕに対応する処理ブロック層ＢＬ，ＢＵのステータスが可能モードに設定される。ただし、従前のステータスと同じであれば、従前の値が維持される。 The controller 110 functions as a judgment unit that judges whether the replacement of the dummy substrate DW is necessary based on the status data. Specifically, it is determined whether or not the status data of any dummy board DW in the first dummy board accommodation section 7L is a value indicating that replacement is required (step S2), and if any of the dummy board accommodation sections 7U is It is determined whether or not the status data of the dummy substrate DW is a value indicating that replacement is required (steps S3 and S4). Further, the controller 110 performs a function as a status setting section that sets the first status 141 and the second status 142 to the enabled mode or the prohibited mode based on the above determination (steps S5 to S8). Specifically, the status of the processing block layers BL and BU corresponding to the dummy substrate housing portions 7L and 7U having the dummy substrate DW whose status data indicates that replacement is required is set to the prohibition mode. In addition, the status data of the processing block layers BL and BU corresponding to the dummy substrate housing units 7L and 7U whose status data does not indicate that replacement is necessary for any of the dummy substrates DW is set to the possible mode. However, if it is the same as the previous status, the previous value is maintained.
　より具体的には、第１ダミー基板収容部７Ｌのいずれかのダミー基板ＤＷのステータスデータが交換要を表す値であり（ステップＳ２：ＹＥＳ）、かつ、第２ダミー基板収容部７Ｕのいずれかのダミー基板ＤＷのステータスデータが交換要を表す値である場合（ステップＳ３：ＹＥＳ）には、第１ステータス１４１および第２ステータス１４２がいずれも禁止モードに設定される（ステップＳ５）。また、第１ダミー基板収容部７Ｌのいずれかのダミー基板ＤＷのステータスデータが交換要を表す値であり（ステップＳ２：ＹＥＳ）、かつ、第２ダミー基板収容部７Ｕのいずれのダミー基板ＤＷのステータスデータも交換要を表す値でない場合（ステップＳ３：ＮＯ）には、第１ステータス１４１が禁止モードに設定され、第２ステータス１４２が可能モードに設定される（ステップＳ６）。さらに、第１ダミー基板収容部７Ｌのいずれのダミー基板ＤＷのステータスデータも交換要を表す値でなく（ステップＳ２：ＮＯ）、かつ第２ダミー基板収容部７Ｕのいずれのダミー基板ＤＷのステータスデータも交換要を表す値でない場合（ステップＳ４：ＮＯ）には、第１ステータス１４１および第２ステータス１４２がいずれも可能モードに設定される（ステップＳ７）。そして、第１ダミー基板収容部７Ｌのいずれかのダミー基板ＤＷのステータスデータも交換要を表す値でなく（ステップＳ２：ＮＯ）、かつ第２ダミー基板収容部７Ｕのいずれかのダミー基板ＤＷのステータスデータが交換要を表す値である場合（ステップＳ４：ＹＥＳ）には、第１ステータス１４１は可能モードに設定され、第２ステータス１４２は禁止モードに設定される（ステップＳ８）。 More specifically, the status data of any dummy board DW in the first dummy board accommodation portion 7L is a value indicating that replacement is required (step S2: YES), and the status data of any one of the second dummy board accommodation portions 7U If the status data of the dummy substrate DW in 1 is a value indicating that replacement is necessary (step S3: YES), both the first status 141 and the second status 142 are set to the prohibition mode (step S5). In addition, the status data of any dummy board DW in the first dummy board housing portion 7L is a value indicating that replacement is required (step S2: YES), and the status data of any dummy board DW in the second dummy board housing portion 7U is If the status data does not indicate that replacement is necessary either (step S3: NO), the first status 141 is set to prohibition mode, and the second status 142 is set to enable mode (step S6). Further, the status data of any dummy board DW in the first dummy board housing portion 7L is not a value indicating that replacement is required (step S2: NO), and the status data of any dummy board DW in the second dummy board housing portion 7U is not a value indicating that replacement is necessary (step S4: NO), both the first status 141 and the second status 142 are set to the possible mode (step S7). The status data of any dummy board DW in the first dummy board accommodation portion 7L is not a value indicating that replacement is required (step S2: NO), and the status data of any dummy board DW in the second dummy board accommodation portion 7U is If the status data indicates that replacement is required (step S4: YES), the first status 141 is set to the enabled mode and the second status 142 is set to the prohibited mode (step S8).
　いずれかのダミー基板ＤＷの交換が必要である場合（ステップＳ２でＹＥＳ、ステップＳ３でＹＥＳ、またはステップＳ４でＹＥＳ）には、コントローラ１１０は、ホストコンピュータ１５０に対して、ダミー基板ＤＷの交換を要求するダミー基板交換要求を送信する（ステップＳ１１）。ダミー基板交換要求は、交換が必要なダミー基板ＤＷを特定して、より具体的には、当該ダミー基板ＤＷが収容されているスロットを特定して行われる。コントローラ１１０は、ホストコンピュータ１５０に対してすでにダミー基板交換要求を送信しているダミー基板ＤＷについては、繰り返し交換要求を送信することはせず、ステータスデータが新たに交換要を表す値となったダミー基板ＤＷに関して、ダミー基板交換要求をホストコンピュータ１５０に送信する。たとえば、ステータスデータを算出するときに（ステップＳ１）、ステータスデータが交換要を表す値となったダミー基板ＤＷについては、そのダミー基板履歴データ１３４がリセットされるまで、新たな算出対象から除外するようにしてもよい。 If any dummy board DW needs to be replaced (YES in step S2, YES in step S3, or YES in step S4), the controller 110 instructs the host computer 150 to replace the dummy board DW. A requested dummy board replacement request is transmitted (step S11). The dummy board replacement request is made by specifying the dummy board DW that needs to be replaced, more specifically, by specifying the slot in which the dummy board DW is accommodated. The controller 110 does not repeatedly transmit a replacement request for the dummy board DW for which the dummy board replacement request has already been sent to the host computer 150, and the status data newly becomes a value indicating that the replacement is required. A dummy board replacement request is transmitted to the host computer 150 regarding the dummy board DW. For example, when calculating the status data (step S1), the dummy board DW whose status data has a value indicating that it needs to be replaced is excluded from new calculation targets until the dummy board history data 134 is reset. You may do so.
　第１ステータス１４１が可能モードから禁止モードに遷移し、第２ステータス１４２が可能モードである場合（ステップＳ６）、コントローラ１１０は、キャリヤＣから第１処理ブロック層ＢＬの処理ユニットへと搬送する計画の基板Ｗについては、その搬送スケジュールを破棄し、当該基板Ｗを第２処理ブロック層ＢＵの処理ユニットへと搬送する搬送スケジュールに変更する（ステップＳ９）。また、コントローラ１１０は、第１ダミー基板収容部７Ｌから第１処理ブロック層ＢＬの処理ユニットへ搬送する計画のダミー基板ＤＷについては、その搬送スケジュールを破棄する。このとき、コントローラ１１０は、キャリヤＣからすでに払い出された基板Ｗおよび第１ダミー基板収容部７Ｌからすでに払い出されたダミー基板ＤＷの搬送スケジュール、すなわち、搬送を含めた処理が開始された基板Ｗ，ＤＷについての搬送スケジュールは、そのまま維持することが好ましい。こうして、第１ステータス１４１が禁止モードに遷移することにより、第１処理ブロック層ＢＬの処理ユニットでの基板Ｗの処理およびダミー処理がいずれも禁止され、第１処理ブロック層ＢＬの処理ユニットで処理される計画であった基板Ｗは、可能モードの第２処理ブロック層ＢＵの処理ユニットへと搬送されて処理されることになる。 If the first status 141 transitions from the enabled mode to the prohibited mode and the second status 142 is the enabled mode (step S6), the controller 110 plans to transfer from the carrier C to the processing units of the first processing block layer BL. For the wafer W in , the transfer schedule is discarded and the transfer schedule is changed to transfer the wafer W to the processing unit of the second processing block layer BU (step S9). In addition, the controller 110 discards the transfer schedule for the dummy substrates DW scheduled to be transferred from the first dummy substrate accommodation section 7L to the processing units of the first processing block layer BL. At this time, the controller 110 determines the transfer schedule of the substrates W already delivered from the carrier C and the dummy substrates DW already delivered from the first dummy substrate accommodation portion 7L, that is, the substrates for which processing including transportation has started. It is preferable to maintain the transfer schedule for W and DW. In this way, the transition of the first status 141 to the prohibition mode prohibits both the processing of the substrate W in the processing units of the first processing block layer BL and the dummy processing, and the processing in the processing units of the first processing block layer BL is prohibited. The substrate W that was planned to be processed will be transported to the processing unit of the second processing block layer BU in the enable mode and processed.
　同様に、第２ステータス１４２が可能モードから禁止モードに遷移し、第１ステータス１４１が可能モードである場合（ステップＳ８）、コントローラ１１０は、キャリヤＣから第２処理ブロック層ＢＵの処理ユニットへと搬送する計画の基板Ｗについては、その搬送スケジュールを破棄し、当該基板Ｗを第１処理ブロック層ＢＬの処理ユニットへと搬送する搬送スケジュールに変更する（ステップＳ１０）。また、コントローラ１１０は、第２ダミー基板収容部７Ｕから第２処理ブロック層ＢＵの処理ユニットへ搬送する計画のダミー基板ＤＷについては、その搬送スケジュールを破棄する。このとき、コントローラ１１０は、キャリヤＣからすでに払い出された基板Ｗおよび第２ダミー基板収容部７Ｕからすでに払い出されたダミー基板ＤＷの搬送スケジュール、すなわち、搬送を含めた処理が開始された基板Ｗ，ＤＷについての搬送スケジュールは、そのまま維持することが好ましい。こうして、第２ステータス１４２が禁止モードに遷移することにより、第２処理ブロック層ＢＵの処理ユニットでの基板Ｗの処理およびダミー処理がいずれも禁止され、第２処理ブロック層ＢＵの処理ユニットで処理される計画であった基板Ｗは、可能モードの第１処理ブロック層ＢＬの処理ユニットへと搬送されて処理されることになる。 Similarly, when the second status 142 transitions from the enabled mode to the prohibited mode and the first status 141 is the enabled mode (step S8), the controller 110 transfers from the carrier C to the processing units of the second processing block layer BU. For the wafer W planned to be transported, the transport schedule is discarded and changed to a transport schedule for transporting the wafer W to the processing unit of the first processing block layer BL (step S10). In addition, the controller 110 discards the transfer schedule for the dummy substrates DW scheduled to be transferred from the second dummy substrate storage unit 7U to the processing units of the second processing block layer BU. At this time, the controller 110 determines the transport schedule of the substrates W already delivered from the carrier C and the dummy substrates DW already delivered from the second dummy substrate accommodation unit 7U, that is, the substrates for which processing including transport has started. It is preferable to maintain the transfer schedule for W and DW. In this way, the second status 142 transitions to the prohibition mode, thereby prohibiting both the processing of the substrate W in the processing units of the second processing block layer BU and the dummy processing, and processing in the processing units of the second processing block layer BU. The substrate W that was planned to be processed is transported to the processing unit of the first processing block layer BL in the enable mode and processed.
　ホストコンピュータ１５０は、基板処理装置１からダミー基板交換要求を受けると、基板処理装置１のキャリヤ保持部２５のいずれかに回収用ダミーキャリヤＤＣが保持されているかどうかを判断する。いずれのキャリヤ保持部２５にも回収用ダミーキャリヤＤＣが保持されていなければ、ホストコンピュータ１５０は、キャリヤ搬送機構３００による回収用ダミーキャリヤＤＣの供給を計画し、その計画に従ってキャリヤ搬送機構３００を作動させる。回収用ダミーキャリヤＤＣがいずれかのキャリヤ保持部２５に保持されていれば、ホストコンピュータ１５０は、基板処理装置１のキャリヤ保持部２５のいずれかに供給用ダミーキャリヤＤＣが保持されているかどうかを判断する。いずれのキャリヤ保持部２５にも供給用ダミーキャリヤＤＣが保持されていなければ、ホストコンピュータは、キャリヤ搬送機構３００による供給用ダミーキャリヤＤＣの供給を計画し、その計画に従ってキャリヤ搬送機構３００を作動させる。 When the host computer 150 receives a dummy substrate replacement request from the substrate processing apparatus 1, it determines whether any of the carrier holding units 25 of the substrate processing apparatus 1 holds the recovery dummy carrier DC. If none of the carrier holding portions 25 holds the recovery dummy carrier DC, the host computer 150 plans the supply of the recovery dummy carrier DC by the carrier transport mechanism 300, and operates the carrier transport mechanism 300 according to the plan. Let If the recovery dummy carrier DC is held by any of the carrier holding portions 25, the host computer 150 determines whether or not the supply dummy carrier DC is held by any of the carrier holding portions 25 of the substrate processing apparatus 1. to decide. If none of the carrier holding portions 25 holds the supply dummy carrier DC, the host computer plans the supply of the supply dummy carrier DC by the carrier transport mechanism 300, and operates the carrier transport mechanism 300 according to the plan. .
　図１１は、第１処理ブロック層ＢＬまたは第２処理ブロック層ＢＵが禁止モードのときに実行されるダミー基板の交換動作例を説明するためのフローチャートである。基板処理装置１のコントローラ１１０は、回収用ダミーキャリヤＤＣがいずれかのキャリヤ保持部２５に保持されているときに（ステップＳ２１：ＹＥＳ）、使用済みダミー基板ＤＷを回収用ダミーキャリヤＤＣに搬入するように動作する（ステップＳ２２）。すなわち、使用済みダミー基板ＤＷは、主搬送ロボット８Ｕ，８Ｌによってダミー基板収容部７Ｌ，７Ｕから基板載置部６Ｌ，６Ｕに搬送され、インデクサロボット２６によって基板載置部６Ｌ，６Ｕから回収用ダミーキャリヤＤＣに搬送されて収容される。基板処理装置１のコントローラ１１０は、供給用ダミーキャリヤＤＣがいずれかのキャリヤ保持部２５に保持されているときに（ステップＳ２３：ＹＥＳ）、未使用ダミー基板ＤＷを供給用ダミーキャリヤＤＣからダミー基板収容部７Ｌ，７Ｕに搬送するように動作する（ステップＳ２４）。すなわち、未使用ダミー基板ＤＷは、インデクサロボット２６によって供給用ダミーキャリヤＤＣから基板載置部６Ｌ，６Ｕに搬送され、主搬送ロボット８Ｌ，８Ｕによって基板載置部６Ｌ，６Ｕからダミー基板収容部７Ｌ，７Ｕに搬送され、当該ダミー基板収容部７Ｌ，７Ｕに搬入される。 FIG. 11 is a flowchart for explaining an example of a dummy substrate replacement operation that is performed when the first processing block layer BL or the second processing block layer BU is in the prohibition mode. The controller 110 of the substrate processing apparatus 1 loads the used dummy substrate DW into the recovery dummy carrier DC when the recovery dummy carrier DC is held by one of the carrier holding units 25 (step S21: YES). (Step S22). That is, the used dummy substrates DW are transported from the dummy substrate storage units 7L, 7U to the substrate placement units 6L, 6U by the main transport robots 8U, 8L, and transferred from the substrate placement units 6L, 6U by the indexer robot 26 to the collecting dummy substrates DW. It is transported and housed in the carrier DC. The controller 110 of the substrate processing apparatus 1 removes the unused dummy substrate DW from the dummy supply carrier DC when the supply dummy carrier DC is held by one of the carrier holding units 25 (step S23: YES). It operates so as to be conveyed to the storage units 7L and 7U (step S24). That is, the unused dummy substrates DW are transferred from the supply dummy carrier DC to the substrate placement units 6L and 6U by the indexer robot 26, and transferred from the substrate placement units 6L and 6U to the dummy substrate storage unit 7L by the main transfer robots 8L and 8U. , 7U, and carried into the dummy substrate accommodating portions 7L, 7U.
　ダミー基板収容部７Ｌ，７Ｕの或るスロットのダミー基板ＤＷが未使用のダミー基板ＤＷと交換されると、当該スロットに対応する（すなわち、当該スロットに収容されたダミー基板ＤＷに対応する）ダミー基板履歴データ１３４は初期値にリセットされる（ステップＳ２５）。 When the dummy board DW in a certain slot of the dummy board accommodation units 7L and 7U is replaced with an unused dummy board DW, a dummy corresponding to the slot (that is, corresponding to the dummy board DW accommodated in the slot) is replaced. The board history data 134 is reset to the initial value (step S25).
　ダミー基板履歴データ１３４が初期値にリセットされることにより、該当スロットのダミー基板ＤＷについて算出されるステータスデータ（図１０のステップＳ１）は交換要を示す値でなくなる。そして、第１ダミー基板収容部７Ｌのいずれのダミー基板ＤＷのステータスデータも交換要を示す値でなくなると（ステップＳ２：ＮＯ）、第１ステータス１４１が可能モードに設定される（ステップＳ７，Ｓ８）。同様に、第２ダミー基板収容部７Ｕのいずれのダミー基板ＤＷのステータスデータも交換要を示すデータでなくなると（ステップＳ３：ＮＯ、ステップＳ４：ＮＯ）、第２ステータス１４２が可能モードに設定される（ステップＳ６，Ｓ７）。 By resetting the dummy board history data 134 to the initial value, the status data (step S1 in FIG. 10) calculated for the dummy board DW in the corresponding slot no longer indicates the need for replacement. Then, when the status data of any dummy substrate DW in the first dummy substrate housing portion 7L does not indicate the need for replacement (step S2: NO), the first status 141 is set to the possible mode (steps S7 and S8). ). Similarly, when the status data of any of the dummy substrates DW in the second dummy substrate housing portion 7U no longer indicates the need for replacement (step S3: NO, step S4: NO), the second status 142 is set to the possible mode. (steps S6 and S7).
　図１２Ａは、第１処理ブロック層ＢＬの第１ステータス１４１および第２処理ブロック層ＢＵの第２ステータス１４２の両方が可能モードである場合の基板搬送動作の一例を説明するためのタイムチャートである。インデクサロボット２６は、キャリヤ保持部２５に保持されたキャリヤＣの一つから基板Ｗ１を取り出し、その取り出した基板Ｗ１を第１処理ブロック層ＢＬの基板載置部６Ｌに載置する。この基板Ｗ１は、主搬送ロボット８Ｌによって取り出され、第１処理ブロック層ＢＬ内の処理ユニット１１Ｌ－４３Ｌのうちの一つの処理ユニットＬ１に搬入される。当該処理ユニットＬ１での処理が終わると、主搬送ロボット８Ｌは、その処理済みの基板Ｗ１を取り出して、基板載置部６Ｌに載置する。インデクサロボット２６は、その処理済みの基板Ｗ１を基板載置部６Ｌから取り出し、キャリヤ保持部２５に保持されたキャリヤＣの一つに搬入する。 FIG. 12A is a time chart for explaining an example of the substrate transfer operation when both the first status 141 of the first processing block layer BL and the second status 142 of the second processing block layer BU are in the enabled mode. . The indexer robot 26 picks up the substrate W1 from one of the carriers C held by the carrier holder 25 and places the picked substrate W1 on the substrate platform 6L of the first processing block layer BL. This substrate W1 is picked up by the main transfer robot 8L and carried into one processing unit L1 of the processing units 11L-43L in the first processing block layer BL. When the processing in the processing unit L1 is finished, the main transport robot 8L takes out the processed substrate W1 and places it on the substrate platform 6L. The indexer robot 26 takes out the processed substrate W1 from the substrate platform 6L and carries it into one of the carriers C held by the carrier holder 25 .
　また、インデクサロボット２６は、キャリヤ保持部２５に保持された一つのキャリヤＣから別の基板Ｗ２を取り出し、その取り出した基板Ｗ２を第２処理ブロック層ＢＵの基板載置部６Ｕに載置する。この基板Ｗ２は、主搬送ロボット８Ｕによって取り出され、第２処理ブロック層ＢＵ内の処理ユニット１１Ｕ－４３Ｕのうちの一つの処理ユニットＵ１に搬入される。当該処理ユニットＵ１での処理が終わると、主搬送ロボット８Ｕは、その処理済みの基板Ｗ２を取り出して、基板載置部６Ｕに載置する。インデクサロボット２６は、その処理済みの基板Ｗ２を基板載置部６Ｕから取り出し、キャリヤ保持部２５に保持されたキャリヤＣの一つに搬入する。 The indexer robot 26 also picks up another substrate W2 from one carrier C held by the carrier holding section 25, and places the picked-up substrate W2 on the substrate platform 6U of the second processing block layer BU. This substrate W2 is picked up by the main transfer robot 8U and carried into one processing unit U1 among the processing units 11U to 43U in the second processing block layer BU. When the processing in the processing unit U1 is finished, the main transport robot 8U takes out the processed substrate W2 and places it on the substrate platform 6U. The indexer robot 26 takes out the processed substrate W<b>2 from the substrate platform 6</b>U and carries it into one of the carriers C held by the carrier holder 25 .
　同様にして、次の基板Ｗ３が第１処理ブロック層ＢＬに備えられた処理ユニット１１Ｌ－４３Ｌのうちの一つの処理ユニットＬ２に搬入されて処理される。また、その次の基板Ｗ４が第２処理ブロック層ＢＵに備えられた処理ユニット１１Ｕ－４３Ｕのうちの一つの処理ユニットＵ２に搬入されて処理される。 Similarly, the next substrate W3 is carried into one processing unit L2 of the processing units 11L-43L provided in the first processing block layer BL and processed. Further, the next wafer W4 is carried into one of the processing units 11U-43U provided in the second processing block layer BU and processed.
　このようにして、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵの両方で製品基板Ｗに対する処理が並行して行われる。 In this way, the product substrates W are processed in parallel in both the first processing block layer BL and the second processing block layer BU.
　第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵの両方が可能モードのとき、コントローラ１１０は、上記のような搬送動作のための搬送スケジュールを作成し、その搬送スケジュールに従って、インデクサロボット２６および主搬送ロボット８Ｌ，８Ｕを制御する。 When both the first processing block layer BL and the second processing block layer BU are in the enabled mode, the controller 110 creates a transport schedule for the transport operation as described above, and according to the transport schedule, the indexer robot 26 and the main robot 26 are transported. It controls the transfer robots 8L and 8U.
　図１２Ｂは、処理ブロックの一方のステータスが可能モードから禁止モードに遷移する場合の基板搬送動作の一例を説明するためのタイムチャートである。この例では、第１処理ブロック層ＢＬに対応する第１ステータス１４１が可能モードで維持され、第２処理ブロック層ＢＵに対応する第２ステータス１４２が、可能モードから禁止モードに遷移する場合を想定している。さらに、前述の図１２Ａに示すような搬送スケジュールが作成され、その搬送スケジュールに従って基板Ｗの搬送および処理が進行している場合を想定している。 FIG. 12B is a time chart for explaining an example of the substrate transfer operation when the status of one of the processing blocks transitions from the possible mode to the prohibited mode. In this example, it is assumed that the first status 141 corresponding to the first processing block layer BL is maintained in the enabled mode, and the second status 142 corresponding to the second processing block layer BU transitions from the enabled mode to the prohibited mode. is doing. Further, it is assumed that a transfer schedule as shown in FIG. 12A is created and the transfer and processing of substrates W are proceeding according to the transfer schedule.
　基板Ｗ２がインデクサロボット２６によってキャリヤＣから取り出された後で、かつ基板Ｗ４がインデクサロボット２６によってキャリヤＣから取り出される前の時刻ｔ１において、第２処理ブロック層ＢＵにおいて、ダミー基板ＤＷの交換が必要になった場合を想定する。すると、時刻ｔ１において、第２処理ブロック層ＢＵに対応する第２ステータス１４２が、可能モードから禁止モードに遷移する。 At time t1 after the substrate W2 is picked up from the carrier C by the indexer robot 26 and before the substrate W4 is picked up from the carrier C by the indexer robot 26, the dummy substrate DW needs to be replaced in the second processing block layer BU. Assume that the Then, at time t1, the second status 142 corresponding to the second processing block layer BU transitions from the enabled mode to the prohibited mode.
　この場合、コントローラ１１０は、時刻ｔ１においてキャリヤＣから取り出されていない基板Ｗに関する既存の搬送スケジュール（図１２Ａ参照）を破棄し、図１２Ｂに一例を示す搬送スケジュールに変更する。とくに、時刻ｔ１においてキャリヤＣから払い出されておらず、かつステータスが禁止モードとなった第２処理ブロック層ＢＵに搬送する計画の搬送スケジュールが破棄される。 In this case, the controller 110 discards the existing transfer schedule (see FIG. 12A) regarding the substrates W that have not been taken out from the carrier C at time t1, and changes it to the transfer schedule shown in FIG. 12B. In particular, the transfer schedule for the plan to transfer to the second processing block layer BU which has not been discharged from the carrier C at time t1 and whose status is the prohibition mode is discarded.
　時刻ｔ１において、基板Ｗ２は、すでにキャリヤＣから搬出されており、その搬送が始まっている。そこで、基板Ｗ２については、既存の搬送スケジュールに従って搬送され、禁止モードの第２処理ブロック層ＢＵ内の一つの処理ユニットＵ１に搬入されて処理され、処理後の基板Ｗ２は、当該処理ユニットＵ１から搬出されて、キャリヤＣへと搬送される。すなわち、図１２Ａの場合と同様に基板Ｗ２が搬送される。 At time t1, the substrate W2 has already been unloaded from the carrier C and has started to be transported. Therefore, the substrate W2 is transported in accordance with the existing transport schedule, is loaded into one of the processing units U1 in the second processing block layer BU in the prohibition mode, and is processed. It is unloaded and transported to the carrier C. That is, the substrate W2 is transferred in the same manner as in FIG. 12A.
　基板Ｗ３は、時刻ｔ１の後にキャリヤＣから払い出されるが、可能モードの第１処理ブロック層ＢＬでの処理が計画されているので、その搬送スケジュールはそのまま維持され、図１２Ａの場合と同様に搬送される。 Substrate W3 is unloaded from carrier C after time t1, but since it is scheduled to be processed in the first processing block layer BL in the enable mode, its transport schedule remains unchanged and is transported in the same manner as in FIG. 12A. be done.
　一方、基板Ｗ４は、既存の搬送スケジュール（図１２Ａ参照）では、第２処理ブロック層ＢＵの一つの処理ユニットＵ２に搬送される計画であるが、この計画が破棄される。そして、コントローラ１１０は、可能モードの第１処理ブロック層ＢＬに含まれる処理ユニット１１Ｌ－４３Ｌのうちの一つの処理ユニットＬ３へと基板Ｗ４を搬送する搬送スケジュールを作成し、この搬送スケジュールに従って、インデクサロボット２６および主搬送ロボット８Ｌを制御する。具体的には、インデクサロボット２６は、基板Ｗ４をキャリヤＣから取り出して、第１処理ブロック層ＢＬの基板載置部６Ｌに載置する。この基板Ｗ４は、主搬送ロボット８Ｌによって取り出され、第１処理ブロック層ＢＬ内の一つの処理ユニットＵ３に搬入される。当該処理ユニットＵ３での処理が終わると、主搬送ロボット８Ｌは、その処理済みの基板Ｗ４を取り出して、基板載置部６Ｌに載置する。インデクサロボット２６は、その処理済みの基板Ｗ４を基板載置部６Ｌから取り出し、キャリヤ保持部２５に保持されたキャリヤＣの一つに搬入する。 On the other hand, substrate W4 is planned to be transferred to one processing unit U2 of the second processing block layer BU in the existing transfer schedule (see FIG. 12A), but this plan is discarded. Then, the controller 110 creates a transfer schedule for transferring the substrate W4 to one of the processing units 11L to 43L included in the first processing block layer BL in the possible mode, and according to this transfer schedule, the indexer It controls the robot 26 and the main transfer robot 8L. Specifically, the indexer robot 26 takes out the substrate W4 from the carrier C and places it on the substrate platform 6L of the first processing block layer BL. This substrate W4 is picked up by the main transfer robot 8L and carried into one processing unit U3 in the first processing block layer BL. When the processing in the processing unit U3 is finished, the main transport robot 8L takes out the processed substrate W4 and places it on the substrate platform 6L. The indexer robot 26 takes out the processed substrate W4 from the substrate platform 6L and carries it into one of the carriers C held by the carrier holder 25. As shown in FIG.
　既存の搬送スケジュール（図１２Ａ参照）では第２処理ブロック層ＢＵの処理ユニットＵ２へと搬送される計画とされているその後の基板Ｗについても同様に、可能モードである第１処理ブロック層ＢＬの処理ユニットへと搬送されて処理される。 Subsequent wafers W that are planned to be transferred to the processing unit U2 of the second processing block layer BU according to the existing transfer schedule (see FIG. 12A) are also similarly It is transported to a processing unit and processed.
　一方、コントローラ１１０は、禁止モードの第２処理ブロック層ＢＵに関して、ダミー基板ＤＷの交換を計画する搬送スケジュールを作成し、それに従って、主搬送ロボット８Ｕおよびインデクサロボット２６を制御する（図１１参照）。それにより、次のようなダミー基板交換が行われる。キャリヤ保持部２５に使用済みのダミー基板ＤＷを回収するための回収用ダミーキャリヤＤＣが保持されている場合に、第２処理ブロック層ＢＵにおける主搬送ロボット８Ｕは、ダミー基板収容部７Ｕから交換対象の使用済みダミー基板ＤＷを取り出し、そのダミー基板ＤＷを基板載置部６Ｕに載置する。インデクサロボット２６は、その使用済みダミー基板ＤＷを基板載置部６Ｕから取り出して、回収用ダミーキャリヤＤＣに搬入する。また、キャリヤ保持部２５に未使用のダミー基板ＤＷを収容した供給用ダミーキャリヤＤＣが保持されている場合に、インデクサロボット２６は、一枚の未使用のダミー基板ＤＷをその供給用ダミーキャリヤＤＣから取り出して、基板載置部６Ｕに載置する。主搬送ロボット８Ｕは、その未使用ダミー基板ＤＷを取り出して、ダミー基板収容部７Ｕに搬入する。こうして、ダミー基板収容部７Ｕ内の一枚のダミー基板ＤＷを交換することができる。さらに別のダミー基板ＤＷの交換を要するときには、同様の動作が繰り返される。 On the other hand, the controller 110 creates a transport schedule for planning the replacement of the dummy substrates DW with respect to the second processing block layer BU in the prohibition mode, and controls the main transport robot 8U and the indexer robot 26 accordingly (see FIG. 11). . As a result, the following dummy substrate replacement is performed. When the recovery dummy carrier DC for recovering the used dummy substrate DW is held in the carrier holding portion 25, the main transfer robot 8U in the second processing block layer BU is replaced from the dummy substrate accommodation portion 7U. The used dummy substrate DW is taken out, and the dummy substrate DW is placed on the substrate platform 6U. The indexer robot 26 takes out the used dummy substrate DW from the substrate platform 6U and carries it into the recovery dummy carrier DC. Further, when the carrier holding portion 25 holds a supply dummy carrier DC containing unused dummy substrates DW, the indexer robot 26 moves one unused dummy substrate DW to the supply dummy carrier DC. , and placed on the substrate placement portion 6U. The main transport robot 8U takes out the unused dummy substrate DW and carries it into the dummy substrate storage section 7U. Thus, one dummy substrate DW in the dummy substrate housing portion 7U can be replaced. Similar operations are repeated when it is necessary to replace another dummy substrate DW.
　このようにして、禁止モードの第２処理ブロック層ＢＵにおいてダミー基板ＤＷの交換を行う一方で、可能モードの第１処理ブロック層ＢＬにおいては、製品基板Ｗに対する処理を継続して行うことができる。 In this manner, while the dummy substrate DW is replaced in the second processing block layer BU in the prohibition mode, the product substrate W can be continuously processed in the first processing block layer BL in the enable mode. .
　第１処理ブロック層ＢＬが可能モードから禁止モードに遷移する場合の動作の説明は、前述の説明において、第１処理ブロック層ＢＬの構成と第２処理ブロック層ＢＵの構成とを交換して読み替えることによって得られるので、省略する。 The description of the operation when the first processing block layer BL transitions from the enable mode to the prohibition mode can be read by exchanging the configuration of the first processing block layer BL and the configuration of the second processing block layer BU in the above description. Since it is obtained by
　以上のように、この実施形態によれば、インデクサブロック２の横方向に隣接された処理ブロック３は、複数の処理ブロック層ＢＬ，ＢＵを上下方向Ｚに積層して構成されている。そして、各処理ブロック層ＢＬ，ＢＵに、ダミー基板ＤＷを収容するダミー基板収容部７Ｌ，７Ｕが備えられている。処理ブロック層ＢＬ，ＢＵの内部にダミー基板ＤＷを収容できるので、処理ユニット１１Ｌ－４３Ｕにおいてダミー基板ＤＷを使用する必要が生じたときには、インデクサロボット２６の関与なしに、ダミー基板収容部７Ｌ，７Ｕと処理ユニット１１Ｌ－４３Ｕとの間でダミー基板ＤＷを搬送できる。 As described above, according to this embodiment, the processing block 3 laterally adjacent to the indexer block 2 is configured by stacking a plurality of processing block layers BL and BU in the vertical direction Z. Dummy substrate housing portions 7L and 7U for housing dummy substrates DW are provided in the respective processing block layers BL and BU. Since the dummy substrates DW can be accommodated inside the processing block layers BL, BU, when it becomes necessary to use the dummy substrates DW in the processing units 11L-43U, the dummy substrate accommodation units 7L, 7U can be stored without the involvement of the indexer robot 26. and the processing unit 11L-43U.
　したがって、インデクサロボット２６の搬送負荷を軽減できるので、製品用の基板Ｗの搬送への影響を軽減しながら、ダミー基板ＤＷを用いる処理を行える。とりわけ、複数の処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕをそれぞれ有する複数の処理ブロック層ＢＬ，ＢＵとキャリヤ保持部２５との間で基板Ｗを搬送するインデクサロボット２６の搬送負荷は、非常に大きい。したがって、インデクサロボット２６の搬送負荷を軽減することによって、製品用の基板Ｗの搬送効率が良くなり、それに応じて、生産性を向上できる。各処理ブロック層ＢＬ，ＢＵの主搬送ロボット８Ｌ，８Ｕは、当該処理ブロック層ＢＬ，ＢＵ内での基板Ｗの搬送を受け持つので、インデクサロボット２６に比較して搬送負荷が小さい。したがって、主搬送ロボット８Ｌ，８Ｕが処理ブロック層ＢＬ，ＢＵの内部でダミー基板ＤＷの搬送を受け持つことは、生産効率の観点から、大きな問題とはならない。 Therefore, since the transport load of the indexer robot 26 can be reduced, processing using the dummy substrates DW can be performed while reducing the influence on the transport of the product substrates W. In particular, the transport load of the indexer robot 26 that transports the substrate W between the plurality of processing block layers BL, BU each having the plurality of processing units 11L-43L, 11U-43U and the carrier holder 25 is extremely large. Therefore, by reducing the transport load of the indexer robot 26, the transport efficiency of the product substrates W is improved, and the productivity can be improved accordingly. The main transport robots 8L and 8U of the processing block layers BL and BU are in charge of transporting the substrates W within the processing block layers BL and BU, so the transport load is smaller than that of the indexer robot 26. Therefore, the fact that the main transport robots 8L and 8U are in charge of transporting the dummy substrates DW inside the processing block layers BL and BU is not a big problem from the viewpoint of production efficiency.
　また、ダミー基板収容部７Ｌ，７Ｕは処理ブロック層ＢＬ，ＢＵ内にあるので、ダミー基板収容部７Ｌ，７Ｕと処理ユニット１１Ｌ－４３Ｕとの間のダミー基板ＤＷの搬送は、インデクサロボット２６と処理ブロック層ＢＬ，ＢＵとの間の基板受渡しのための基板載置部６Ｌ，６Ｕを経由することなく行える。したがって、ダミー基板ＤＷの搬送と製品用の基板Ｗの搬送との干渉を低減できるので、製品用の基板Ｗの搬送効率が良くなり、それに応じて、生産性を向上できる。 In addition, since the dummy substrate storage units 7L and 7U are located in the processing block layers BL and BU, the transfer of the dummy substrate DW between the dummy substrate storage units 7L and 7U and the processing units 11L-43U is performed by the indexer robot 26 and the processing unit 11L-43U. This can be done without going through the substrate mounting parts 6L, 6U for transferring the substrate to and from the block layers BL, BU. Therefore, interference between the transportation of the dummy substrates DW and the transportation of the product substrates W can be reduced, so that the transportation efficiency of the product substrates W is improved, and accordingly the productivity can be improved.
　さらに、特許文献１の場合とは異なり、ダミー基板ＤＷを収容するダミーキャリヤによってキャリヤ保持部２５が長時間に亘って占有されることもない。それにより、製品用の基板Ｗを収容したキャリヤＣの搬入に待機時間が生じることを抑制できるので、生産性の向上に寄与することができる。 Furthermore, unlike the case of Patent Document 1, the carrier holding portion 25 is not occupied for a long time by the dummy carrier that accommodates the dummy substrate DW. As a result, it is possible to suppress the waiting time for carrying in the carrier C containing the substrates W for products, so that it is possible to contribute to the improvement of productivity.
　また、この実施形態では、各処理ブロック層ＢＬ，ＢＵにおいて、複数の処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕが、主搬送ロボット８Ｌ，８Ｕによって基板Ｗが搬送される搬送経路５１Ｌ，５１Ｕに沿って、搬送経路５１Ｌ，５１Ｕの両側に配列され、かつ上下方向Ｚに積層されて配列されている。したがって、主搬送ロボット８Ｌ，８Ｕによる基板搬送を効率的に行えるように処理ブロック層ＢＬ，ＢＵ内での複数の処理ユニット１１Ｌ－４３Ｕの配置が設計されている。それにより、生産性の向上に寄与することができる。 In this embodiment, in each of the processing block layers BL and BU, the plurality of processing units 11L-43L and 11U-43U are arranged along the transport paths 51L and 51U along which the substrates W are transported by the main transport robots 8L and 8U. , are arranged on both sides of the transport paths 51L and 51U, and are stacked in the vertical direction Z and arranged. Therefore, the arrangement of the plurality of processing units 11L-43U in the processing block layers BL, BU is designed so that the main transfer robots 8L, 8U can efficiently transfer substrates. Thereby, it can contribute to improvement in productivity.
　また、この実施形態では、基板載置部６Ｌ，６Ｕおよびダミー基板収容部７Ｌ，７Ｕは、いずれも、インデクサロボット２６と主搬送ロボット８Ｌ，８Ｕとの間に配置されている。それにより、基板載置部６Ｌ，６Ｕを経由して行われる、インデクサロボット２６と主搬送ロボット８Ｌ，８Ｕとの間の基板Ｗの搬送を効率的に行える。そして、ダミー基板収容部７Ｌ，７Ｕを、インデクサロボット２６による基板Ｗの搬送、および主搬送ロボット８Ｌ，８Ｕによる基板Ｗの搬送と干渉しない位置に配置できる。したがって、製品用の基板Ｗの搬送に影響を与えることなく、処理ブロック層ＢＬ，ＢＵ内にダミー基板ＤＷを保持することができる。 Also, in this embodiment, the substrate placement units 6L, 6U and the dummy substrate storage units 7L, 7U are both arranged between the indexer robot 26 and the main transfer robots 8L, 8U. As a result, substrates W can be efficiently transferred between the indexer robot 26 and the main transfer robots 8L, 8U via the substrate platforms 6L, 6U. The dummy substrate storage units 7L and 7U can be arranged at positions that do not interfere with the transport of the substrates W by the indexer robot 26 and the transport of the substrates W by the main transport robots 8L and 8U. Therefore, the dummy substrates DW can be held in the processing block layers BL and BU without affecting the transportation of the substrates W for products.
　より具体的には、この実施形態では、ダミー基板収容部７Ｌ，７Ｕと基板載置部６Ｌ，６Ｕとは、互いに高さを異ならせて立体的に配置されている。それにより、処理ブロック層ＢＬ，ＢＵ内の空間を有効に利用して、ダミー基板収容部７Ｌ，７Ｕを処理ブロック層ＢＬ，ＢＵ内に適切に配置できる。その結果、製品用の基板Ｗの搬送を阻害しないダミー基板収容部７Ｌ，７Ｕの配置が実現されている。 More specifically, in this embodiment, the dummy substrate housing portions 7L, 7U and the substrate placement portions 6L, 6U are arranged three-dimensionally with mutually different heights. As a result, the spaces in the processing block layers BL, BU can be effectively used, and the dummy substrate housing portions 7L, 7U can be appropriately arranged in the processing block layers BL, BU. As a result, the arrangement of the dummy substrate housing portions 7L and 7U that does not hinder the transportation of the product substrate W is realized.
　さらに、この実施形態では、ダミー基板収容部７Ｌ，７Ｕが、平面視において、基板載置部６Ｌ，６Ｕと重なるように配置されている。これにより、基板載置部６Ｌ，６Ｕの上方または下方の空間を利用して、ダミー基板収容部７Ｌ，７Ｕが配置されている。それにより、製品用の基板Ｗの搬送を阻害しないダミー基板収容部７Ｌ，７Ｕの配置を実現しており、処理ブロック層ＢＬ，ＢＵ内の空間を有効に利用して、ダミー基板収容部７Ｌ，７Ｕを配置できている。前述のとおり、ダミー基板収容部７Ｌ，７Ｕが平面視において基板載置部６Ｌ，６Ｕに重なり合う配置は、具体的には、ダミー基板収容部７Ｌ，７Ｕに収容されたダミー基板ＤＷの一部または全部が基板載置部６Ｌ，６Ｕに保持された基板Ｗに重なり合う配置であってもよい。 Furthermore, in this embodiment, the dummy substrate housing portions 7L and 7U are arranged so as to overlap the substrate mounting portions 6L and 6U in plan view. As a result, the dummy substrate housing portions 7L and 7U are arranged using the space above or below the substrate mounting portions 6L and 6U. As a result, the dummy substrate housing portions 7L and 7U are arranged so as not to hinder the transportation of the product substrate W, and the spaces in the processing block layers BL and BU are effectively used to effectively store the dummy substrate housing portions 7L and 7U. 7U has been placed. As described above, the arrangement in which the dummy substrate housing portions 7L and 7U overlap the substrate mounting portions 6L and 6U in a plan view is, specifically, part or The arrangement may be such that all of them overlap the substrates W held on the substrate rests 6L and 6U.
　さらに具体的には、この実施形態では、第１処理ブロック層ＢＬ（下層の処理ブロック層）の上に第２処理ブロック層ＢＵ（上層の処理ブロック層）が積層されている。そして、第１処理ブロック層ＢＬにおいては、ダミー基板収容部７Ｌが基板載置部６Ｌの下方に位置している。その一方で、第２処理ブロック層ＢＵにおいては、ダミー基板収容部７Ｕが基板載置部６Ｕの下方に位置している。これにより、第１処理ブロック層ＢＬの基板載置部６Ｌと第２処理ブロック層ＢＵとの基板載置部６Ｕの間の高低差を少なくすることができる。それにより、インデクサロボット２６による上下方向Ｚの基板搬送ストロークを短くすることができるので、インデクサロボット２６の搬送負荷を軽減できる。したがって、製品用の基板Ｗの搬送効率を高めて、生産性の向上に寄与できる。 More specifically, in this embodiment, the second processing block layer BU (upper processing block layer) is laminated on the first processing block layer BL (lower processing block layer). In the first processing block layer BL, the dummy substrate housing portion 7L is positioned below the substrate mounting portion 6L. On the other hand, in the second processing block layer BU, the dummy substrate housing portion 7U is located below the substrate mounting portion 6U. Thereby, the height difference between the substrate platform 6L of the first processing block layer BL and the substrate platform 6U of the second processing block layer BU can be reduced. As a result, the substrate transfer stroke in the vertical direction Z by the indexer robot 26 can be shortened, so the transfer load of the indexer robot 26 can be reduced. Therefore, it is possible to improve the efficiency of transporting the product substrate W and contribute to the improvement of productivity.
　また、この実施形態では、各処理ブロック層ＢＬ，ＢＵのダミー基板収容部７Ｌ，７Ｕは、当該処理ブロック層ＢＬ，ＢＵに含まれる複数の処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕと同数の複数のダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２を含む。そして、各ダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２は１枚のダミー基板ＤＷを保持するように構成されている。これにより、各処理ブロック層ＢＬ，ＢＵ内で処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕと同数のダミー基板ＤＷを保持しておくことができる。したがって、いずれかの処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕにダミー基板ＤＷを搬入する必要が生じれば、主搬送ロボット８Ｌ，８Ｕにより、当該処理ユニットに速やかにダミー基板ＤＷを搬入して、ダミー処理を行うことができる。ダミー基板ＤＷの搬入にインデクサロボット２６は関与しないので、製品用の基板Ｗの搬送への影響を抑制または防止できる。 Further, in this embodiment, the dummy substrate housing portions 7L, 7U of each of the processing block layers BL, BU have the same number of processing units 11L to 43L, 11U to 43U included in the processing block layers BL, BU. It includes dummy board slots DL1-DL12, DU1-DU12. Each dummy substrate slot DL1-DL12, DU1-DU12 is configured to hold one dummy substrate DW. As a result, the same number of dummy substrates DW as the processing units 11L to 43L and 11U to 43U can be held in each of the processing block layers BL and BU. Therefore, if it becomes necessary to load the dummy substrate DW into any of the processing units 11L-43L and 11U-43U, the main transfer robots 8L and 8U quickly load the dummy substrate DW into the processing unit and can be processed. Since the indexer robot 26 is not involved in the loading of the dummy substrates DW, it is possible to suppress or prevent the transportation of the product substrates W from being affected.
　さらに、この実施形態では、各処理ブロック層ＢＬ，ＢＵの複数の処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕと当該処理ブロック層の複数のダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２とが、１対１に対応付けられている。そして、主搬送ロボット８Ｌ，８Ｕは、互いに対応するダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２と処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕとの間でダミー基板ＤＷを搬送する。この構成により、ダミー基板スロットに保持されるダミー基板ＤＷは、対応する処理ユニットのための専用のダミー基板とすることができる。それにより、ダミー基板ＤＷの使用履歴の管理が容易になる。 Furthermore, in this embodiment, the plurality of processing units 11L-43L, 11U-43U of each processing block layer BL, BU and the plurality of dummy substrate slots DL1-DL12, DU1-DU12 of the processing block layer are one-to-one. is mapped to Then, the main transfer robots 8L, 8U transfer the dummy substrates DW between the corresponding dummy substrate slots DL1-DL12, DU1-DU12 and the processing units 11L-43L, 11U-43U. With this configuration, the dummy substrate DW held in the dummy substrate slot can be a dedicated dummy substrate for the corresponding processing unit. This facilitates management of the usage history of the dummy substrate DW.
　また、この実施形態では、コントローラ１１０は、ダミー処理条件（ユニット洗浄実行条件、前処理実行条件、メンテナンス実行条件）が充足されると、主搬送ロボット８Ｌ，８Ｕを制御して、ダミー基板収容部７Ｌ，７Ｕから処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕへとダミー基板ＤＷを搬送させ、その処理ユニットにおいてダミー処理を実行させる。このように、処理ブロック層ＢＬ，ＢＵ内でのダミー基板ＤＷの搬送によってダミー処理を開始できるので、製品用の基板Ｗの搬送への影響を抑制または防止しながら、速やかにダミー処理を開始できる。 Further, in this embodiment, the controller 110 controls the main transfer robots 8L and 8U when dummy processing conditions (unit cleaning execution conditions, pretreatment execution conditions, maintenance execution conditions) are satisfied, and The dummy substrates DW are transported from 7L, 7U to the processing units 11L-43L, 11U-43U, and dummy processing is executed in the processing units. In this manner, the dummy processing can be started by transporting the dummy substrate DW within the processing block layers BL and BU, so that the dummy processing can be started quickly while suppressing or preventing the influence on the transportation of the product substrate W. .
　また、この実施形態によれば、コントローラ１１０が基板処理装置１の各部を制御することによって、次のような工程が実行される。すなわち、各処理ブロック層ＢＬ，ＢＵ内において、主搬送ロボット８Ｌ，８Ｕが当該処理ブロック層内のダミー基板収容部７Ｌ，７Ｕに収容されたダミー基板ＤＷを当該処理ブロック層内の複数の処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕのいずれかに搬入するダミー基板搬入工程（ステップＡ３１，Ａ７１，Ａ１６１）が実行される。そして、当該処理ユニット内で当該搬入されたダミー基板ＤＷを用いたダミー処理を行うダミー処理工程（ステップＡ３２，Ａ７２，Ａ１６２）が実行される。さらに、ダミー処理後に主搬送ロボット８Ｌ，８Ｕがダミー基板ＤＷを処理ユニットから取り出してダミー基板収容部７Ｌ，７Ｕまで搬送する工程が実行される（ステップＡ３３，Ａ７３，Ａ１６３）。また、当該処理ブロック層ＢＬ，ＢＵの基板載置部６Ｌ，６Ｕに載置された基板Ｗを当該処理ブロック層ＢＬ，ＢＵの複数の処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕのいずれかに搬入する工程が実行される（ステップＡ１２１）。そして、当該処理ユニット内で当該搬入された基板Ｗを処理する工程が実行される（ステップＡ１２２）。これにより、インデクサロボット２６の搬送負荷を軽減しながら、ダミー基板ＤＷを用いた処理を各処理ブロック層ＢＬ，ＢＵの処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕにおいて行うことができる。それにより、生産効率を向上できる。 Further, according to this embodiment, the controller 110 controls each part of the substrate processing apparatus 1 to perform the following steps. That is, in each of the processing block layers BL and BU, the main transfer robots 8L and 8U transfer the dummy substrates DW accommodated in the dummy substrate accommodation units 7L and 7U in the processing block layer to a plurality of processing units in the processing block layer. A dummy substrate carrying-in process (steps A31, A71, A161) is carried out to carry in one of 11L-43L and 11U-43U. Then, the dummy processing steps (steps A32, A72, A162) are performed in the processing unit to perform dummy processing using the loaded dummy substrate DW. Further, after the dummy processing, the main transfer robots 8L, 8U take out the dummy substrates DW from the processing units and carry them to the dummy substrate storage units 7L, 7U (steps A33, A73, A163). In addition, the wafers W placed on the substrate platforms 6L, 6U of the processing block layers BL, BU are carried into any of the plurality of processing units 11L-43L, 11U-43U of the processing block layers BL, BU. A process is performed (step A121). Then, a step of processing the loaded substrate W in the processing unit is executed (step A122). As a result, the processing using the dummy substrate DW can be performed in the processing units 11L-43L and 11U-43U of the processing block layers BL and BU while reducing the transport load of the indexer robot 26. FIG. Thereby, production efficiency can be improved.
　コントローラ１１０の制御によって、インデクサロボット２６がキャリヤ保持部２５に保持されたキャリヤＣから基板Ｗを取り出していずれかの処理ブロック層ＢＬ，ＢＵの基板載置部６Ｌ，６Ｕに搬入する基板搬入工程（ステップＡ２０）と並行して、または当該基板搬入工程（ステップＡ２０）に先立って、前述のダミー基板搬入工程（ステップＡ７１）が実行されてもよい。これにより、インデクサロボット２６によって製品用の基板Ｗを処理ブロック層ＢＬ，ＢＵに搬入する一方で、各処理ブロック層ＢＬ，ＢＵ内ではダミー基板ＤＷを処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕに搬入することができる。インデクサロボット２６は、ダミー基板ＤＷの搬入に関与しなくてもよいので、インデクサロボット２６による基板Ｗの搬送を待たずに、またはその基板搬送と並行して、処理ブロック層ＢＬ，ＢＵ内でのダミー基板ＤＷの搬送を行うことができる。したがって、インデクサロボット２６の搬送負荷を軽減できるうえに、処理ブロック層ＢＬ，ＢＵ内ではダミー基板ＤＷを速やかに処理ユニットへと搬送できる。 Under the control of the controller 110, a substrate carrying-in step ( In parallel with step A20), or prior to the substrate loading step (step A20), the aforementioned dummy substrate loading step (step A71) may be performed. As a result, the indexer robot 26 carries the product substrates W into the processing block layers BL and BU, while the dummy substrates DW are carried into the processing units 11L-43L and 11U-43U in the respective processing block layers BL and BU. be able to. Since the indexer robot 26 does not have to be involved in the loading of the dummy substrate DW, it is possible to perform the processing within the processing block layers BL and BU without waiting for the transport of the substrate W by the indexer robot 26 or in parallel with the transport of the substrate. Transfer of the dummy substrate DW can be performed. Therefore, the transport load of the indexer robot 26 can be reduced, and the dummy substrate DW can be quickly transported to the processing units in the processing block layers BL and BU.
　さらに、コントローラ１１０の制御によって、製品用の基板Ｗをインデクサロボット２６によって基板載置部６Ｌ，６Ｕに搬入する基板搬入工程（ステップＡ２０）と並行して、または当該基板搬入工程に先立って、前述のダミー処理工程（ステップＡ７２）が実行されてもよい。これにより、インデクサロボット２６の搬送負荷を軽減できるうえに、処理ブロック層ＢＬ，ＢＵ内では、ダミー処理を速やかに開始できる。たとえば、ホストコンピュータ１５０から基板処理の要求を受けると、それに応答して、適切な時期に、ダミー基板ＤＷの搬送およびそれに続くダミー処理を開始できる。それにより、処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕ内の環境を適切な時期に整えることができるので、製品用の基板Ｗを収容したキャリヤＣがキャリヤ保持部２５に搬入されると、速やかに、基板Ｗの処理を始めることができる。これにより、生産性の向上に寄与できる。 Furthermore, under the control of the controller 110, in parallel with the substrate loading step (step A20) of loading the product substrate W into the substrate mounting portions 6L and 6U by the indexer robot 26, or prior to the substrate loading step, the above-described dummy processing step (step A72) may be performed. As a result, the transport load of the indexer robot 26 can be reduced, and dummy processing can be started quickly in the processing block layers BL and BU. For example, when a substrate processing request is received from the host computer 150, in response to the request, the transfer of the dummy substrate DW and subsequent dummy processing can be started at an appropriate time. As a result, the environment in the processing units 11L-43L and 11U-43U can be adjusted at an appropriate time, so that when the carrier C housing the product substrate W is carried into the carrier holding section 25, the Processing of the substrate W can begin. This can contribute to improvement in productivity.
　また、この実施形態では、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵに対して、個別に禁止モードおよび可能モードが設定可能であり、これらのモードは第１処理ブロック層ＢＬに対応する第１ステータス１４１および第２処理ブロック層ＢＵに対応する第２ステータス１４２として、メモリ１１２に記憶される。第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵは、したがって、個別に、禁止モードまたは可能モードとなる。すなわち、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵの両方が可能モードである場合、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵの両方が禁止モードである場合、ならびに第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵの一方が可能モードで他方が禁止モードである場合があり得る。 In addition, in this embodiment, a prohibition mode and an enable mode can be individually set for the first processing block layer BL and the second processing block layer BU, and these modes correspond to the first processing block layer BL. It is stored in the memory 112 as the first status 141 and the second status 142 corresponding to the second processing block layer BU. The first processing block layer BL and the second processing block layer BU are thus individually in inhibited or enabled mode. That is, when both the first processing block layer BL and the second processing block layer BU are in the enable mode, when both the first processing block layer BL and the second processing block layer BU are in the prohibit mode, and when the first processing block layer BL and the second processing block layer BU are both in the prohibit mode It is possible that one of the block layer BL and the second processing block layer BU is in enable mode and the other is in prohibit mode.
　そこで、この実施形態では、第１ステータス１４１、すなわち第１処理ブロック層ＢＬの動作状態が可能モードから禁止モードに遷移すると、第１処理ブロック層ＢＬでの処理が計画された基板Ｗの搬送スケジュールが変更される。具体的には、主搬送ロボット８Ｌによって第１処理ブロック層ＢＬの処理ユニット１１Ｌ－４３Ｌに搬送されるように計画された基板Ｗの搬送スケジュールが破棄され、当該基板Ｗを第２処理ブロック層ＢＵに搬入し、主搬送ロボット８Ｕによって、第２処理ブロック層ＢＵの処理ユニット１１Ｕ－４３Ｕに搬送するための搬送スケジュールが新たに作成される。その結果、当該基板Ｗは、第２処理ブロック層ＢＵにおいて処理することが可能となる。第２ステータス１４２、すなわち第２処理ブロック層ＢＵの動作状態が可能モードから禁止モードに遷移する場合も同様に、第２処理ブロック層ＢＵによる処理が計画された基板Ｗの搬送スケジュールが変更される。具体的には、主搬送ロボット８Ｕによって第２処理ブロック層ＢＵの処理ユニット１１Ｕ－４３Ｕに搬送されるように計画された基板Ｗの搬送スケジュールが破棄され、当該基板Ｗを第１処理ブロック層ＢＬに搬入し、主搬送ロボット８Ｌによって、第１処理ブロック層ＢＬの処理ユニット１１Ｌ－４３Ｌに搬送するための搬送スケジュールが新たに作成される。その結果、当該基板Ｗは、第１処理ブロック層ＢＬで処理することが可能となる。 Therefore, in this embodiment, when the first status 141, that is, the operation state of the first processing block layer BL transitions from the enabled mode to the prohibited mode, the transfer schedule of the substrates W scheduled to be processed in the first processing block layer BL is changed. is changed. Specifically, the transfer schedule of the substrate W planned to be transferred to the processing units 11L-43L of the first processing block layer BL by the main transfer robot 8L is discarded, and the substrate W is transferred to the second processing block layer BU. A new transport schedule is created for transporting the wafer to the main transport robot 8U and transporting it to the processing units 11U-43U of the second processing block layer BU. As a result, the substrate W can be processed in the second processing block layer BU. Similarly, when the second status 142, that is, the operation state of the second processing block layer BU transitions from the enabled mode to the prohibited mode, the transfer schedule of the wafers W scheduled to be processed by the second processing block layer BU is changed. . Specifically, the transfer schedule of the substrate W planned to be transferred to the processing units 11U-43U of the second processing block layer BU by the main transfer robot 8U is discarded, and the substrate W is transferred to the first processing block layer BL. A new transport schedule is created for transporting the wafer to the main transport robot 8L and transporting it to the processing units 11L-43L of the first processing block layer BL. As a result, the substrate W can be processed in the first processing block layer BL.
　このようにして、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵの一方が可能モードから禁止モードに遷移しても、他方の可能モードの処理ブロック層において、製品基板Ｗの搬送および処理を継続できる。それにより、基板処理装置１のダウンタイムを少なくできるので、生産性を高めることができる。 In this manner, even if one of the first processing block layer BL and the second processing block layer BU transitions from the enabled mode to the prohibited mode, the transfer and processing of the product substrate W can be continued in the processing block layer in the other enabled mode. can continue. As a result, downtime of the substrate processing apparatus 1 can be reduced, and productivity can be improved.
　図１３は、この発明の第２の実施形態に係る基板処理装置の構成を説明するための図解的な縦断面図であり、図２の縦断面に相当する縦断面における構成を示す。前述の第１の実施形態と比較すると、この実施形態では、第１処理ブロック層ＢＬと第２処理ブロック層ＢＵとを区分する中間隔壁１６が取り払われている。さらに、主搬送ロボット８Ｌ，８Ｕの上下動を案内する支柱８３は、第１処理ブロック層ＢＬおよび第２処理ブロック層ＢＵに渡って上下に延びている。それにより、主搬送ロボット８Ｌ，８Ｕは、第１の実施形態の場合よりも大きなストロークで上下動することができるように構成されている。むろん、コントローラ１１０は、主搬送ロボット８Ｌ，８Ｕが互いに干渉しないように、それらの動作を制御する。 FIG. 13 is a schematic longitudinal sectional view for explaining the configuration of the substrate processing apparatus according to the second embodiment of the present invention, showing the configuration in a longitudinal section corresponding to the longitudinal section of FIG. Compared with the first embodiment described above, in this embodiment, the intermediate partition wall 16 separating the first processing block layer BL and the second processing block layer BU is removed. Furthermore, the pillars 83 that guide the vertical movement of the main transfer robots 8L and 8U extend vertically over the first processing block layer BL and the second processing block layer BU. Thereby, the main transport robots 8L and 8U are configured to be able to move up and down with a larger stroke than in the case of the first embodiment. Of course, the controller 110 controls the operations of the main transfer robots 8L and 8U so that they do not interfere with each other.
　また、この実施形態では、第１の実施形態における２つの基板載置部６Ｕ，６Ｌが一つの基板載置部６に置き換えられている。基板載置部６は、第１処理ブロック層ＢＬと第２処理ブロック層ＢＵとで共用される。すなわち、第１処理ブロック層ＢＬの主搬送ロボット８Ｌは、基板載置部６にアクセス可能であり、基板載置部６と第１処理ブロック層ＢＬの処理ユニット１１Ｌ－４３Ｌとの間で製品基板Ｗを搬送する。また、主搬送ロボット８Ｌは、基板載置部６と、処理ユニット１１Ｌ－４３Ｌと、ダミー基板収容部７Ｌとの間でダミー基板ＤＷを搬送する。同様に、第２処理ブロック層ＢＵの主搬送ロボット８Ｕは、基板載置部６にアクセス可能であり、基板載置部６と第２処理ブロック層ＢＵの処理ユニット１１Ｕ－４３Ｕとの間で製品基板Ｗを搬送する。また、主搬送ロボット８Ｕは、基板載置部６と、処理ユニット１１Ｕ－４３Ｕと、ダミー基板収容部７Ｕとの間でダミー基板ＤＷを搬送する。 Also, in this embodiment, the two substrate mounting portions 6U and 6L in the first embodiment are replaced with one substrate mounting portion 6. The substrate platform 6 is shared by the first processing block layer BL and the second processing block layer BU. That is, the main transfer robot 8L of the first processing block layer BL can access the substrate platform 6, and the product substrates are transferred between the substrate platform 6 and the processing units 11L-43L of the first processing block layer BL. Carry W. Further, the main transport robot 8L transports the dummy substrate DW between the substrate placement section 6, the processing units 11L-43L, and the dummy substrate storage section 7L. Similarly, the main transfer robot 8U of the second processing block layer BU can access the substrate platform 6 and transfer products between the substrate platform 6 and the processing units 11U-43U of the second processing block layer BU. A substrate W is transported. Further, the main transport robot 8U transports the dummy substrate DW between the substrate platform 6, the processing units 11U to 43U, and the dummy substrate housing portion 7U.
　基板載置部６は、未処理基板載置部６１および既処理基板載置部６２を備えている。ただし、基板載置部６は、第１および第２処理ブロック層ＢＬ，ＢＵで共用されるので、未処理基板載置部６１および既処理基板載置部６２は、それぞれ、第１の実施形態の場合よりも多くのスロットを有する基板保持棚６５，６６を備えていることが好ましい。基板載置部６に備えられる基板保持棚６５，６６は、少なくとも１つ（すなわち、一部または全部）のスロットが、両方の主搬送ロボット８Ｌ，８Ｕによってアクセス可能な配置とされていてもよい。より詳細には、未処理基板載置部６１の基板保持棚６５（図５参照）は、少なくとも一つ（すなわち、一部または全部）のスロットが、両方の主搬送ロボット８Ｌ，８Ｕによってアクセス可能な配置とされていてもよい。同様に、既処理基板載置部６２の基板保持棚６６（図５参照）は、少なくとも一つ（すなわち、一部または全部）のスロットが、両方の主搬送ロボット８Ｌ，８Ｕによってアクセス可能な配置とされていてもよい。 The substrate platform 6 includes an unprocessed substrate platform 61 and a processed substrate platform 62 . However, since the substrate placement part 6 is shared by the first and second processing block layers BL and BU, the unprocessed substrate placement part 61 and the processed substrate placement part 62 are the same as those in the first embodiment. It is preferable to have substrate holding shelves 65, 66 with more slots than in . The substrate holding shelves 65 and 66 provided on the substrate platform 6 may be arranged such that at least one (that is, some or all) of the slots can be accessed by both of the main transfer robots 8L and 8U. . More specifically, substrate holding shelf 65 (see FIG. 5) of unprocessed substrate platform 61 has at least one (that is, some or all) slots accessible by both main transfer robots 8L and 8U. It may be arranged as Similarly, the substrate holding shelf 66 (see FIG. 5) of the processed substrate platform 62 is arranged such that at least one (that is, some or all) slots are accessible by both main transfer robots 8L and 8U. It may be said that
　基板載置部６は、インデクサロボット２６によってアクセス可能な配置とされていることが好ましい。より詳細には、インデクサロボット２６は、基板載置部６の基板保持棚６５，６６の全てのスロットにアクセス可能であり、それらに対して製品基板Ｗまたはダミー基板ＤＷを搬入および搬出できるように構成されていることが好ましい。 The substrate placement section 6 is preferably arranged so that it can be accessed by the indexer robot 26 . More specifically, the indexer robot 26 can access all the slots of the substrate holding shelves 65 and 66 of the substrate platform 6 so that the product substrates W or the dummy substrates DW can be loaded into and unloaded from them. preferably configured.
　図１４は、この発明の第３の実施形態に係る基板処理装置の構成を説明するための縦断面図であり、図２の縦断面に相当する縦断面における構成を示す。第１の実施形態では、インデクサブロック２および処理ブロック３の隣接する隔壁２ａ，３ａには、基板載置部６Ｌ，６Ｕに対応する窓４Ｌ，４Ｕが形成され、ダミー基板収容部７Ｌ，７Ｕに対応する窓は形成されていない。これに対して、この実施形態では、ダミー基板収容部７Ｌ，７Ｕに対応する窓５Ｌ，５Ｕが隔壁２ａ，３ａに追加されている。 FIG. 14 is a longitudinal sectional view for explaining the configuration of a substrate processing apparatus according to the third embodiment of the present invention, showing the configuration in a longitudinal section corresponding to the longitudinal section of FIG. In the first embodiment, adjacent partition walls 2a and 3a of the indexer block 2 and the processing block 3 are provided with windows 4L and 4U corresponding to the substrate mounting portions 6L and 6U, respectively. Corresponding windows are not formed. On the other hand, in this embodiment, windows 5L and 5U corresponding to the dummy substrate housing portions 7L and 7U are added to the partition walls 2a and 3a.
　このような追加の窓５Ｌ，５Ｕを設けることにより、ダミー基板ＤＷを処理ブロック層ＢＬ，ＢＵに導入するときに、インデクサロボット２６がダミー基板収容部７Ｌ，７Ｕに直接アクセスして、ダミー基板ＤＷを搬入することができる。さらに、使用済みのダミー基板ＤＷを処理ブロック層ＢＬ，ＢＵから搬出するときに、インデクサロボット２６がダミー基板収容部７Ｌ，７Ｕに直接アクセスして、ダミー基板を搬出することができる。このようなダミー基板ＤＷの搬入／搬出の際に、主搬送ロボット８Ｌ，８Ｕはいずれも関与する必要がない。したがって、主搬送ロボット８Ｌ，８Ｕの搬送負荷を軽減して生産性の向上を図ることができる。 By providing such additional windows 5L and 5U, when introducing the dummy substrate DW into the processing block layers BL and BU, the indexer robot 26 can directly access the dummy substrate housing portions 7L and 7U to retrieve the dummy substrate DW. can be brought in. Furthermore, when the used dummy substrates DW are unloaded from the processing block layers BL, BU, the indexer robot 26 can directly access the dummy substrate storage units 7L, 7U to unload the dummy substrates. Neither of the main transfer robots 8L, 8U need to be involved in loading/unloading the dummy substrate DW. Therefore, it is possible to reduce the transport load of the main transport robots 8L and 8U and improve productivity.
　コントローラ１１０は、第１処理ブロック層ＢＬが禁止モードのときに、キャリヤ保持部２５に保持されたダミーキャリヤＤＣと第１ダミー基板収容部７Ｌとの間でインデクサロボット２６によってダミー基板ＤＷを搬送するための搬送スケジュールを作成し、その搬送スケジュールに従ってインデクサロボット２６を制御する。同様に、コントローラ１１０は、第２処理ブロック層ＢＵが禁止モードのときに、キャリヤ保持部２５に保持されたダミーキャリヤＤＣと第２ダミー基板収容部７Ｕとの間でインデクサロボット２６によってダミー基板ＤＷを搬送するための搬送スケジュールを作成し、その搬送スケジュールに従ってインデクサロボット２６を制御する。 The controller 110 transports the dummy substrate DW by the indexer robot 26 between the dummy carrier DC held by the carrier holding portion 25 and the first dummy substrate accommodation portion 7L when the first processing block layer BL is in the prohibition mode. A transportation schedule is created for the indexer robot 26, and the indexer robot 26 is controlled according to the transportation schedule. Similarly, the controller 110 causes the indexer robot 26 to move the dummy substrate DW between the dummy carrier DC held by the carrier holding portion 25 and the second dummy substrate accommodation portion 7U when the second processing block layer BU is in the prohibition mode. is created, and the indexer robot 26 is controlled according to the transportation schedule.
　図１５は、この発明の第４の実施形態に係る基板処理装置の内部構成を示す図解的な平面図である。第１の実施形態では、複数の処理ユニット１１Ｌ－４３Ｕは、下段の処理ブロック層ＢＬに備えられる第１処理ユニット群と、上段の処理ブロック層ＢＵに備えられる第２処理ユニット群とに区分されており、それらの間に水平な中間隔壁１６が設けられている。これに対して、この実施形態では、処理ブロック３内の空間を上下に区分する中間隔壁１６は設けられておらず、代わり、処理ブロック３内の空間を水平方向に区分する中央隔壁１８が備えられている。 FIG. 15 is an illustrative plan view showing the internal configuration of a substrate processing apparatus according to the fourth embodiment of the invention. In the first embodiment, the plurality of processing units 11L-43U are divided into a first processing unit group provided in the lower processing block layer BL and a second processing unit group provided in the upper processing block layer BU. with a horizontal intermediate partition 16 between them. On the other hand, in this embodiment, the middle partition 16 that vertically partitions the space within the processing block 3 is not provided, and instead a central partition 18 that horizontally partitions the space within the processing block 3 is provided. It is
　中央隔壁１８は、キャリヤ保持部２５側から第１水平方向Ｘに見た正面視において、処理ブロック３内の空間を左右に区分している。中央隔壁１８は、処理ブロック３の第２水平方向Ｙ（左右方向）に関する中央付近において、第１水平方向Ｘおよび上下方向Ｚに沿って延びる平板状の隔壁である。中央隔壁１８は、その一方側に配置された第１処理ブロック部Ｂ１と、その他方側に配置された第２処理ブロック部Ｂ２とを形成している。すなわち、第１処理ブロック部Ｂ１および第２処理ブロック部Ｂ２は、互いの側方に配置されている。処理ブロック３に備えられた複数の処理ユニット１１Ｌ－４３Ｕは、第１処理ブロック部Ｂ１に含まれる第１処理ユニット群Ｇ１と、第２処理ブロック部Ｂ２に含まれる第２処理ユニット群Ｇ２とに区分されている。複数の処理ユニット１１Ｌ－４３Ｕの配置は、第１の実施形態と類似しているので、図１５では、複数の処理ユニット１１Ｌ－４３Ｕに図１と同じ参照符号を付してある。第１処理ユニット群Ｇ１は、第１タワーＴ１および第２タワーＴ２を形成する複数の処理ユニット１１Ｌ，１２Ｌ，１３Ｌ，１１Ｕ，１２Ｕ，１３Ｕ；２１Ｌ，２２Ｌ，２３Ｌ，２１Ｕ，２２Ｕ，２３Ｕで構成されている。第２処理ユニット群Ｇ２は、第３タワーＴ３および第４タワーＴ４を構成する複数の処理ユニット３１Ｌ，３２Ｌ，３３Ｌ，３１Ｕ，３２Ｕ，３３Ｕ；４１Ｌ，４２Ｌ，４３Ｌ，４１Ｕ，４２Ｕ，４３Ｕで構成されている。 The central partition wall 18 divides the space inside the processing block 3 into left and right when viewed from the carrier holding portion 25 side in the first horizontal direction X from the front. The center partition 18 is a plate-like partition extending along the first horizontal direction X and the vertical direction Z near the center of the processing block 3 in the second horizontal direction Y (horizontal direction). The central partition wall 18 forms a first processing block portion B1 arranged on one side and a second processing block portion B2 arranged on the other side. That is, the first processing block portion B1 and the second processing block portion B2 are arranged laterally of each other. The plurality of processing units 11L-43U provided in the processing block 3 are divided into a first processing unit group G1 included in the first processing block portion B1 and a second processing unit group G2 included in the second processing block portion B2. are divided. Since the arrangement of the plurality of processing units 11L-43U is similar to that of the first embodiment, in FIG. 15 the plurality of processing units 11L-43U are given the same reference numerals as in FIG. The first processing unit group G1 is composed of a plurality of processing units 11L, 12L, 13L, 11U, 12U, 13U; ing. The second processing unit group G2 is composed of a plurality of processing units 31L, 32L, 33L, 31U, 32U, 33U; ing.
　第１処理ユニット群Ｇ１に対応して、中央隔壁１８の一方側に第１主搬送ロボット８Ａが設けられている。第１主搬送ロボット８Ａは、中央隔壁１８と第１処理ユニット群Ｇ１との間に区画された第１搬送空間５３Ａ内で動作し、それにより、製品基板Ｗおよびダミー基板ＤＷは、第１搬送空間５３Ａを通って搬送される。同様に、第２処理ユニット群Ｇ２に対応して、中央隔壁１８の他方側に第２主搬送ロボット８Ｂが設けられている。第２主搬送ロボット８Ｂは、中央隔壁１８と第２処理ユニット群Ｇ２との間に区画された第２搬送空間５３Ｂ内で動作し、それにより、製品基板Ｗおよびダミー基板ＤＷは、第２搬送空間５３Ｂを通って搬送される。第１主搬送ロボット８Ａおよび第２主搬送ロボット８Ｂの構成は、図１３に示した第２実施形態の場合とほぼ同様であるので、対応構成部分に同じ参照符号を付して説明を省略する。ただし、この実施形態では、上下方向移動をガイドする支柱８３は、中央隔壁１８に固定されている。 A first main transfer robot 8A is provided on one side of the central partition wall 18 corresponding to the first processing unit group G1. The first main transfer robot 8A operates within the first transfer space 53A partitioned between the central partition 18 and the first processing unit group G1, thereby transferring the product substrates W and the dummy substrates DW to the first transfer space. It is transported through space 53A. Similarly, a second main transfer robot 8B is provided on the other side of the central partition wall 18 corresponding to the second processing unit group G2. The second main transfer robot 8B operates within the second transfer space 53B partitioned between the central partition wall 18 and the second processing unit group G2, thereby transferring the product substrates W and the dummy substrates DW to the second transfer space. Transported through space 53B. The configurations of the first main transfer robot 8A and the second main transfer robot 8B are substantially the same as in the case of the second embodiment shown in FIG. . However, in this embodiment, the struts 83 that guide vertical movement are fixed to the central partition wall 18 .
　さらに、第１処理ユニット群Ｇ１に対応して、第１搬送空間５３Ａのインデクサブロック２に隣接する端部には、第１基板載置部６Ａが設けられている。さらに、平面視において第１基板載置部６Ａと一部または全部が重なるように、第１基板載置部６Ａの上方および／または下方に第１ダミー基板収容部７Ａが配置されている。同様に、第２処理ユニット群Ｇ２に対応して、第２搬送空間５３Ｂのインデクサブロック２に隣接する端部には、第２基板載置部６Ｂが設けられている。さらに、平面視において第２基板載置部６Ｂと一部または全部が重なるように、第２基板載置部６Ｂの上方および／または下方に第２ダミー基板収容部７Ｂが配置されている。 Furthermore, a first substrate platform 6A is provided at the end adjacent to the indexer block 2 of the first transfer space 53A corresponding to the first processing unit group G1. Further, the first dummy substrate accommodation portion 7A is arranged above and/or below the first substrate placement portion 6A so as to partially or wholly overlap with the first substrate placement portion 6A in plan view. Similarly, a second substrate platform 6B is provided at the end adjacent to the indexer block 2 of the second transfer space 53B corresponding to the second processing unit group G2. Further, the second dummy substrate accommodation portion 7B is arranged above and/or below the second substrate placement portion 6B so as to partially or wholly overlap the second substrate placement portion 6B in plan view.
　第１主搬送ロボット８Ａは、第１処理ユニット群Ｇ１を構成する複数の処理ユニット、第１基板載置部６Ａおよび第１ダミー基板収容部７Ａにアクセス可能である。それにより、第１主搬送ロボット８Ａは、第１処理ユニット群Ｇ１を構成する複数の処理ユニットおよび第１基板載置部６Ａの間で製品基板Ｗを搬送する。また、第１主搬送ロボット８Ａは、第１処理ユニット群Ｇ１を構成する複数の処理ユニット、第１基板載置部６Ａおよび第１ダミー基板収容部７Ａの間でダミー基板ＤＷを搬送する。第１主搬送ロボット８Ａは、この実施形態では、第２処理ユニット群Ｇ２、第２基板載置部６Ｂおよび第２ダミー基板収容部７Ｂのいずれにもアクセスすることはできない。 The first main transfer robot 8A can access the plurality of processing units that constitute the first processing unit group G1, the first substrate placement section 6A and the first dummy substrate storage section 7A. Thereby, the first main transport robot 8A transports the product substrate W between the plurality of processing units forming the first processing unit group G1 and the first substrate platform 6A. The first main transport robot 8A also transports the dummy substrates DW among the plurality of processing units, the first substrate platform 6A, and the first dummy substrate accommodation portion 7A that make up the first processing unit group G1. In this embodiment, the first main transfer robot 8A cannot access any of the second processing unit group G2, the second substrate platform 6B and the second dummy substrate storage 7B.
　同様に、第２主搬送ロボット８Ｂは、第２処理ユニット群Ｇ２を構成する複数の処理ユニット、第２基板載置部６Ｂおよび第２ダミー基板収容部７Ｂにアクセス可能である。それにより、第２主搬送ロボット８Ｂは、第２処理ユニット群Ｇ２を構成する複数の処理ユニットおよび第２基板載置部６Ｂの間で製品基板Ｗを搬送する。また、第２主搬送ロボット８Ｂは、第２処理ユニット群Ｇ２を構成する複数の処理ユニット、第２基板載置部６Ｂおよび第２ダミー基板収容部７Ｂの間でダミー基板ＤＷを搬送する。第２主搬送ロボット８Ｂは、この実施形態では、第１処理ユニット群Ｇ１、第１基板載置部６Ａおよび第１ダミー基板収容部７Ａのいずれにもアクセスすることはできない。 Similarly, the second main transfer robot 8B can access the plurality of processing units, the second substrate placement section 6B and the second dummy substrate storage section 7B that make up the second processing unit group G2. Thereby, the second main transport robot 8B transports the product substrate W between the plurality of processing units forming the second processing unit group G2 and the second substrate platform 6B. Further, the second main transport robot 8B transports the dummy substrates DW among the plurality of processing units, the second substrate placement section 6B and the second dummy substrate storage section 7B that constitute the second processing unit group G2. In this embodiment, the second main transfer robot 8B cannot access any of the first processing unit group G1, the first substrate platform 6A and the first dummy substrate storage 7A.
　インデクサロボット２６は、キャリヤ保持部２５に保持されたキャリヤＣ，ＤＣ、第１基板載置部６Ａおよび第２基板載置部６Ｂにアクセス可能であり、それらの間で製品基板Ｗおよびダミー基板ＤＷを搬送する。インデクサロボット２６は、この実施形態では、第１ダミー基板収容部７Ａおよび第２ダミー基板収容部７Ｂのいずれにもアクセスすることができない。むろん、インデクサロボット２６は、第１処理ユニット群Ｇ１および第２処理ユニット群Ｇ２にアクセスすることもできない。 The indexer robot 26 can access the carriers C, DC, the first substrate platform 6A and the second substrate platform 6B held by the carrier holding part 25, and the product substrate W and the dummy substrate DW therebetween. to convey. The indexer robot 26 cannot access either the first dummy substrate accommodation portion 7A or the second dummy substrate accommodation portion 7B in this embodiment. Of course, the indexer robot 26 cannot access the first processing unit group G1 and the second processing unit group G2.
　このような構成の基板処理装置１においても、第１の実施形態の場合と同様にして、第１処理ブロック部Ｂ１および第２処理ブロック部Ｂ２に対して第１ステータス１４１および第２ステータス１４２を設定できる。そして、一方の処理ブロック部のステータスが可能モードから禁止モードに遷移すると、その禁止モードの処理ブロック部へ搬入する計画の基板Ｗに関する搬送スケジュールが破棄され、当該基板Ｗを可能モードの他方の処理ブロック部に搬入する搬送スケジュールが新たに作成される。それにより、可能モードの処理ブロック部を活用して、基板Ｗの処理を継続することができる。 In the substrate processing apparatus 1 having such a configuration, similarly to the first embodiment, the first status 141 and the second status 142 are sent to the first processing block section B1 and the second processing block section B2. Can be set. Then, when the status of one of the processing block units changes from the possible mode to the prohibit mode, the transfer schedule for the wafer W planned to be carried into the processing block unit in the prohibit mode is discarded, and the wafer W is transferred to the other process in the possible mode. A new transport schedule for transporting to the block unit is created. Thereby, the processing of the substrate W can be continued by utilizing the processing block unit in the possible mode.
　この第４の実施形態を前述の第２の実施形態（図１３参照）にならって変形し、第１基板載置部６Ａおよび第２基板載置部６Ｂに代えて、インデクサロボット２６、第１主搬送ロボット８Ａおよび第２主搬送ロボット８Ｂが共通にアクセス可能な基板載置部を設けてもよい。たとえば、中央隔壁１８のインデクサブロック２側の端部に切り欠きを設けて、第１処理ユニット群Ｇ１および第２処理ユニット群Ｇ２で共用される基板載置部を配置することができる。 This fourth embodiment is modified according to the second embodiment described above (see FIG. 13), and the indexer robot 26, the first A substrate platform that can be accessed in common by the main transfer robot 8A and the second main transfer robot 8B may be provided. For example, a notch may be provided at the end of the central partition wall 18 on the indexer block 2 side to dispose a substrate platform shared by the first processing unit group G1 and the second processing unit group G2.
　また、第４の実施形態を前述の第３の実施形態（図１４参照）にならって変形し、インデクサロボット２６が第１ダミー基板収容部７Ａおよび第２ダミー基板収容部７Ｂにアクセス可能な構成としてもよい。それにより、第１主搬送ロボット８Ａおよび第２主搬送ロボット８Ｂの関与なしに、インデクサロボット２６によって、第１ダミー基板収容部７Ａおよび第２ダミー基板収容部７Ｂに対するダミー基板ＤＷの搬入／搬出を行える。 Further, the fourth embodiment is modified according to the above-described third embodiment (see FIG. 14) so that the indexer robot 26 can access the first dummy substrate housing portion 7A and the second dummy substrate housing portion 7B. may be As a result, the indexer robot 26 can load/unload the dummy substrates DW into/from the first dummy substrate storage portion 7A and the second dummy substrate storage portion 7B without involvement of the first main transfer robot 8A and the second main transfer robot 8B. can do
　以上、この発明の４つの実施形態について説明してきたが、この発明は、さらに他の形態で実施することもできる。たとえば、前述の第１の実施形態などでは、２層の処理ブロック層ＢＬ，ＢＵを積層して構成された処理ブロック３の構成を示したが、３層以上の処理ブロック層が積層されて処理ブロックが構成されてもよい。また、前述の第１の実施形態などでは、各処理ブロック層ＢＬ，ＢＵが３段に積層された処理ユニット配置を有する例を示したが、各処理ブロック層に含まれる処理ユニットは、２段に積層されてもよいし、４段以上に積層されてもよいし、１段に全ての処理ユニットが配置されてもよい。さらに、前述の第１の実施形態などでは、搬送経路５１Ｌ，５１Ｕの両側に処理ユニット１１Ｌ－４３Ｕが配置された例を示したが、搬送経路５１Ｌ，５１Ｕの一方側に処理ユニットが配置されてもよい。また、前述の第１の実施形態などでは、搬送経路５１Ｌ，５１Ｕの一方側に当該搬送経路５１Ｌ，５１Ｕに沿って、２個の処理ユニットが配置されているが、１個の処理ユニットが配置されてもよく、３個以上の処理ユニットが配置されてもよい。 Although four embodiments of the present invention have been described above, the present invention can also be implemented in other forms. For example, in the above-described first embodiment, etc., the configuration of the processing block 3 is configured by stacking two processing block layers BL and BU. Blocks may be constructed. Further, in the above-described first embodiment and the like, an example in which the processing block layers BL and BU are stacked in three stages is shown. , may be stacked in four or more stages, or all the processing units may be arranged in one stage. Furthermore, in the above-described first embodiment and the like, an example in which the processing units 11L to 43U are arranged on both sides of the transport paths 51L and 51U is shown, but the processing units are arranged on one side of the transport paths 51L and 51U. good too. In addition, in the above-described first embodiment and the like, two processing units are arranged along the transport paths 51L and 51U on one side of the transport paths 51L and 51U, but one processing unit is arranged. may be arranged, and three or more processing units may be arranged.
　さらに、前述の第１の実施形態などでは、各処理ブロック層ＢＬ，ＢＵのダミー基板収容部７Ｌ，７Ｕには、処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕと同数のダミー基板スロットＤＬ１－ＤＬ１２，ＤＵ１－ＤＵ１２を設け、それらが処理ユニット１１Ｌ－４３Ｌ，１１Ｕ－４３Ｕに１対１に対応している。しかし、たとえば、各処理ブロック層ＢＬ，ＢＵにおけるダミー基板スロットの数を処理ユニットの数よりも少なくして、一つのダミー基板スロットを複数の処理ユニットに対応付けるようにしてもよい。 Furthermore, in the above-described first embodiment and the like, the dummy substrate slots DL1 to DL12 and DU1, which are the same in number as the processing units 11L to 43L and 11U to 43U, are provided in the dummy substrate housing portions 7L and 7U of the respective processing block layers BL and BU. -DU 12 are provided and correspond one-to-one to the processing units 11L-43L and 11U-43U. However, for example, the number of dummy substrate slots in each processing block layer BL, BU may be made smaller than the number of processing units so that one dummy substrate slot may be associated with a plurality of processing units.
　また、前述の実施形態では、ダミー基板収容部７Ｌ，７Ｕに収容されているダミー基板ＤＷが交換を要する状態になることを条件に、対応する処理ユニット群のステータスを禁止モードに設定する例を示したが、予め定める他の条件に基づいて、処理ユニット群のステータスを禁止モードに遷移させることとしてもよい。 In the above-described embodiment, the status of the corresponding processing unit group is set to the prohibition mode on condition that the dummy substrates DW accommodated in the dummy substrate accommodation units 7L and 7U need to be replaced. Although shown, the status of the processing unit group may be changed to the prohibited mode based on other predetermined conditions.
　本発明の実施形態について詳細に説明してきたが、これらは本発明の技術的内容を明らかにするために用いられた具体例に過ぎず、本発明はこれらの具体例に限定して解釈されるべきではなく、本発明の範囲は添付の請求の範囲によってのみ限定される。 Although the embodiments of the present invention have been described in detail, these are merely specific examples used to clarify the technical content of the present invention, and the present invention should be construed as being limited to these specific examples. should not, the scope of the invention is limited only by the appended claims.
　Ｃ　キャリヤ
　ＤＣ　ダミーキャリヤ
　Ｗ　基板（製品基板）
　ＤＷ　ダミー基板
　１　基板処理装置
　２　インデクサブロック
　２５　キャリヤ保持部
　２６　インデクサロボット
　３　処理ブロック
　ＢＬ　第１処理ブロック層
　　１１Ｌ－１３Ｌ　処理ユニット
　　２１Ｌ－２３Ｌ　処理ユニット
　　３１Ｌ－３３Ｌ　処理ユニット
　　４１Ｌ－４３Ｌ　処理ユニット
　　６Ｌ　基板載置部
　　７Ｌ　ダミー基板収容部
　　ＤＬ１－ＤＬ１２　ダミー基板スロット
　　８Ｌ　主搬送ロボット
　　５１Ｌ　搬送経路
　　５２Ｌ　搬送空間
　ＢＵ　第２処理ブロック層
　　１１Ｕ－１３Ｕ　処理ユニット
　　２１Ｕ－２３Ｕ　処理ユニット
　　３１Ｕ－３３Ｕ　処理ユニット
　　４１Ｕ－４３Ｕ　処理ユニット
　　６Ｕ　基板載置部
　　７Ｕ　ダミー基板収容部
　　ＤＵ１－ＤＵ１２　ダミー基板スロット
　　８Ｕ　主搬送ロボット
　　５１Ｕ　搬送経路
　　５２Ｕ　搬送空間
　Ｂ１　第１処理ブロック部
　Ｂ２　第２処理ブロック部
　Ｇ１　第１処理ユニット群
　Ｇ２　第２処理ユニット群
　８Ａ　第１主搬送ロボット
　８Ｂ　第２主搬送ロボット
　６　　基板載置部
　６Ａ　第１基板載置部
　６Ｂ　第２基板載置部
　７Ａ　第１ダミー基板収容部
　７Ｂ　第２ダミー基板収容部
　１１０　コントローラ
　１４１　第１ステータス
　１４２　第２ステータス
　１５０　ホストコンピュータ
　３００　キャリヤ搬送機構
  C Carrier DC Dummy carrier W Substrate (product substrate)
DW Dummy substrate 1 Substrate processing device 2 Indexer block 25 Carrier holder 26 Indexer robot 3 Processing block BL First processing block layer 11L-13L Processing unit 21L-23L Processing unit 31L-33L Processing unit 41L-43L Processing unit 6L Substrate placement Part 7L Dummy substrate storage part DL1-DL12 Dummy substrate slot 8L Main transfer robot 51L Transfer path 52L Transfer space BU Second processing block layer 11U-13U Processing unit 21U-23U Processing unit 31U-33U Processing unit 41U-43U Processing unit 6U Substrate Placement section 7U Dummy substrate accommodation section DU1-DU12 Dummy substrate slot 8U Main transfer robot 51U Transfer path 52U Transfer space B1 First processing block section B2 Second processing block section G1 First processing unit group G2 Second processing unit group 8A 1 main transfer robot 8B second main transfer robot 6 substrate placement part 6A first substrate placement part 6B second substrate placement part 7A first dummy substrate storage part 7B second dummy substrate storage part 110 controller 141 first status 142 Second status 150 Host computer 300 Carrier transport mechanism

Claims (10)

  1. 　基板またはダミー基板を収容するキャリヤを保持するキャリヤ保持部と、
    　基板を処理し、かつダミー基板を用いる処理を実行する複数の第１処理ユニットを有する第１処理ユニット群と、
    　基板を処理し、かつダミー基板を用いる処理を実行する複数の第２処理ユニットを有する第２処理ユニット群と、
    　ダミー基板を収容する第１ダミー基板収容部と、
    　ダミー基板を収容する第２ダミー基板収容部と、
    　基板が載置される基板載置部と、
    　前記複数の第１処理ユニット、前記基板載置部および前記第１ダミー基板収容部にアクセス可能に構成され、前記複数の第１処理ユニットおよび前記基板載置部の間で基板を搬送し、前記複数の第１処理ユニットおよび前記第１ダミー基板収容部の間でダミー基板を搬送する第１搬送ユニットと、
    　前記複数の第２処理ユニット、前記基板載置部および前記第２ダミー基板収容部にアクセス可能に構成され、前記複数の第２処理ユニットおよび前記基板載置部の間で基板を搬送し、前記複数の第２処理ユニットおよび前記第２ダミー基板収容部の間でダミー基板を搬送する第２搬送ユニットと、
    　前記キャリヤ保持部に保持されたキャリヤおよび前記基板載置部にアクセス可能であり、前記キャリヤ保持部に保持されたキャリヤと前記基板載置部との間で、基板を搬送する第３搬送ユニットと、
    　前記第１処理ユニット群の状態を表す第１ステータスと、前記第２処理ユニット群の状態を表す第２ステータスとを含むデータを記憶する記憶部と、
    　前記第１搬送ユニット、前記第２搬送ユニットおよび前記第３搬送ユニットによる基板またはダミー基板の搬送スケジュールを作成するスケジュール作成部と、
    　前記スケジュール作成部によって作成された搬送スケジュールに従って、前記第１搬送ユニット、前記第２搬送ユニットおよび前記第３搬送ユニットによる基板またはダミー基板の搬送を制御する搬送制御部と、を含み、
    　前記第１ステータスは、前記第１処理ユニット群に含まれる前記第１処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理をいずれも実行することができない禁止モードと、前記第１処理ユニット群に含まれる前記第１処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理を実行することができる可能モードとを含み、
    　前記第２ステータスは、前記第２処理ユニット群に含まれる前記第２処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理をいずれも実行することができない禁止モードと、前記第２処理ユニット群に含まれる前記第２処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理を実行することができる可能モードとを含み、
    　前記第１ステータスが可能モードから禁止モードになると、前記スケジュール作成部は、前記第１搬送ユニットによって前記第１処理ユニット群のいずれかの前記第１処理ユニットに搬送されるように計画された基板の搬送スケジュールを破棄し、当該基板が前記第２搬送ユニットによって前記第２処理ユニット群のいずれかの前記第２処理ユニットに搬送されるように計画する搬送スケジュールを作成し、
    　前記第２ステータスが可能モードから禁止モードになると、前記スケジュール作成部は、前記第２搬送ユニットよって前記第２処理ユニット群のいずれかの前記第２処理ユニットに搬送されるように計画された基板の搬送スケジュールを破棄し、当該基板が前記第１搬送ユニットによって前記第１処理ユニット群のいずれかの前記第１処理ユニットに搬送されるように計画する搬送スケジュールを作成する、基板処理装置。     a carrier holder that holds a carrier that accommodates a substrate or a dummy substrate;
    a first processing unit group having a plurality of first processing units for processing the substrate and performing processing using the dummy substrate;
    a second processing unit group having a plurality of second processing units for processing the substrate and performing processing using the dummy substrate;
    a first dummy substrate housing part for housing a dummy substrate;
    a second dummy substrate housing part for housing a dummy substrate;
    a substrate mounting portion on which the substrate is mounted;
    The plurality of first processing units, the substrate platform, and the first dummy substrate housing are configured to be accessible, and the substrate is transported between the plurality of first processing units and the substrate platform, and the a first transport unit that transports dummy substrates between the plurality of first processing units and the first dummy substrate housing;
    The plurality of second processing units, the substrate platform, and the second dummy substrate housing are configured to be accessible, and the substrate is transported between the plurality of second processing units and the substrate platform, and the a second transport unit that transports the dummy substrate between the plurality of second processing units and the second dummy substrate housing;
    a third transport unit accessible to the carrier held by the carrier holding part and the substrate platform, and transporting the substrate between the carrier held by the carrier holding part and the substrate platform; ,
    a storage unit that stores data including a first status representing the state of the first processing unit group and a second status representing the state of the second processing unit group;
    a schedule creation unit that creates a schedule for transporting substrates or dummy substrates by the first transport unit, the second transport unit, and the third transport unit;
    a transport control unit that controls transport of the substrate or the dummy substrate by the first transport unit, the second transport unit, and the third transport unit according to the transport schedule created by the schedule creation unit;
    The first status includes a prohibition mode in which the first processing units included in the first processing unit group cannot perform processing on a substrate and processing using a dummy substrate, and a possible mode capable of performing processing on a substrate and processing using a dummy substrate in the first processing unit,
    The second status includes a prohibition mode in which the second processing units included in the second processing unit group cannot perform processing on a substrate and processing using a dummy substrate, and a possible mode capable of performing processing on a substrate and processing using a dummy substrate in the second processing unit,
    When the first status changes from the enable mode to the prohibition mode, the schedule creation unit selects a substrate scheduled to be transported to one of the first processing units of the first processing unit group by the first transport unit. discarding the transfer schedule of and creating a transfer schedule that plans to transfer the substrate to one of the second processing units of the second processing unit group by the second transfer unit;
    When the second status changes from the enable mode to the prohibition mode, the schedule creation unit selects a substrate scheduled to be transported by the second transport unit to one of the second processing units of the second processing unit group. and create a transfer schedule that plans to transfer the substrate to one of the first processing units of the first processing unit group by the first transfer unit.
  2. 　前記記憶部は、前記第１ダミー基板収容部に収容されるダミー基板の使用履歴情報と、前記第２ダミー基板収容部に収容されるダミー基板の使用履歴情報とを記憶し、
    　前記記憶部に記憶されている前記使用履歴情報に基づいて、前記第１ダミー基板収容部および前記第２ダミー基板収容部に収容されるダミー基板の交換の要否を判断し、前記第１ダミー基板収容部に収容されるダミー基板の交換が必要であると判断されると前記第１ステータスを禁止モードとし、前記第２ダミー基板収容部に収容されるダミー基板の交換が必要であると判断されると前記第２ステータスを禁止モードとする、ステータス設定部をさらに含む、請求項１に記載の基板処理装置。     The storage unit stores usage history information of the dummy substrates accommodated in the first dummy substrate accommodation unit and usage history information of the dummy substrates accommodated in the second dummy substrate accommodation unit,
    Based on the usage history information stored in the storage unit, it is determined whether or not the dummy substrates accommodated in the first dummy substrate accommodation unit and the second dummy substrate accommodation unit need to be replaced, and the first dummy is determined. When it is determined that the dummy substrate accommodated in the substrate accommodating portion needs to be replaced, the first status is set to the prohibition mode, and it is determined that the dummy substrate accommodated in the second dummy substrate accommodating portion needs to be replaced. 2. The substrate processing apparatus according to claim 1, further comprising a status setting unit that sets said second status to a prohibition mode when said second status is set.
  3. 　前記スケジュール作成部は、前記第１処理ユニット群が禁止モードのときに前記キャリヤ保持部に保持されたキャリヤと前記第１ダミー基板収容部との間で前記第１搬送ユニットおよび前記第３搬送ユニットによってダミー基板を搬送し、前記第２処理ユニット群が禁止モードのときに前記キャリヤ保持部に保持されたキャリヤと前記第２ダミー基板収容部との間で前記第２搬送ユニットおよび前記第３搬送ユニットによってダミー基板を搬送するための搬送スケジュールを作成する、請求項１または２に記載の基板処理装置。 The schedule creation section is configured to transfer the first transfer unit and the third transfer unit between the carrier held by the carrier holding section and the first dummy substrate accommodation section when the first processing unit group is in the prohibition mode. and transports the dummy substrate by the second transport unit and the third transport unit between the carrier held by the carrier holding part and the second dummy substrate accommodating part when the second processing unit group is in the prohibition mode. 3. The substrate processing apparatus according to claim 1, wherein a transport schedule for transporting the dummy substrate is created by the unit.
  4. 　前記基板載置部は、前記第１搬送ユニットおよび前記第３搬送ユニットがアクセス可能な第１基板載置部と、前記第２搬送ユニットおよび前記第３搬送ユニットがアクセス可能な第２基板載置部とを含み、
    　前記第１搬送ユニットは、前記複数の第１処理ユニットおよび前記第１基板載置部の間で基板を搬送し、前記複数の第１処理ユニット、前記第１基板載置部および前記第１ダミー基板収容部の間でダミー基板を搬送し、
    　前記第２搬送ユニットは、前記複数の第２処理ユニットおよび前記第２基板載置部の間で基板を搬送し、前記複数の第２処理ユニット、前記第２基板載置部および前記第２ダミー基板収容部の間でダミー基板を搬送し、
    　前記第３搬送ユニットは、前記キャリヤ保持部に保持されたキャリヤと前記第１基板載置部との間で基板およびダミー基板を搬送し、前記キャリヤ保持部に保持されたキャリヤと前記第２基板載置部との間で基板およびダミー基板を搬送する、請求項１～３のいずれか一項に記載の基板処理装置。     The substrate platform includes a first substrate platform accessible by the first transport unit and the third transport unit, and a second substrate platform accessible by the second transport unit and the third transport unit. and
    The first transport unit transports the substrate between the plurality of first processing units and the first substrate platform, and the plurality of first processing units, the first substrate platform and the first dummy. Transfer the dummy substrate between the substrate housing units,
    The second transport unit transports the substrate between the plurality of second processing units and the second substrate platform, and the plurality of second processing units, the second substrate platform and the second dummy. Transfer the dummy substrate between the substrate housing units,
    The third transport unit transports substrates and dummy substrates between the carrier held by the carrier holding portion and the first substrate mounting portion, and carries the carrier held by the carrier holding portion and the second substrate. 4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate and the dummy substrate are transported to and from the receiver.
  5. 　前記第３搬送ユニットが、前記第１ダミー基板収容部および前記第２ダミー基板収容部にアクセス可能に構成されており、
    　前記スケジュール作成部は、前記第１処理ユニット群が禁止モードのときに前記キャリヤ保持部に保持されたキャリヤと前記第１ダミー基板収容部との間で前記第３搬送ユニットによってダミー基板を搬送し、前記第２処理ユニット群が禁止モードのときに前記キャリヤ保持部に保持されたキャリヤと前記第２ダミー基板収容部との間で前記第３搬送ユニットによってダミー基板を搬送するための搬送スケジュールを作成する、請求項１または２に記載の基板処理装置。     The third transport unit is configured to be able to access the first dummy substrate housing portion and the second dummy substrate housing portion,
    The schedule creating section transports dummy substrates by the third transport unit between the carrier held by the carrier holding section and the first dummy substrate accommodating section when the first processing unit group is in the prohibition mode. and a transfer schedule for transferring the dummy substrates by the third transfer unit between the carrier held by the carrier holding portion and the second dummy substrate accommodation portion when the second processing unit group is in the prohibition mode. 3. The substrate processing apparatus according to claim 1 or 2, which is prepared.
  6. 　第１処理ブロック層と、前記第１処理ブロック層の上方に位置する第２処理ブロック層とを含み、
    　前記第１処理ブロック層に前記第１処理ユニット群が配置されており、
    　前記第２処理ブロック層に前記第２処理ユニット群が配置されている、請求項１～５のいずれか一項に記載の基板処理装置。     a first processing block layer and a second processing block layer positioned above the first processing block layer;
    The first processing unit group is arranged in the first processing block layer,
    6. The substrate processing apparatus according to claim 1, wherein said second processing unit group is arranged in said second processing block layer.
  7. 　第１処理ブロック部と、前記第１処理ブロック部の側方に位置する第２処理ブロック部とを含み、
    　前記第１処理ブロック部に前記第１処理ユニット群が配置されており、
    　前記第２処理ブロック部に前記第２処理ユニット群が配置されている、請求項１～５のいずれか一項に記載の基板処理装置。     including a first processing block unit and a second processing block unit positioned to the side of the first processing block unit,
    The first processing unit group is arranged in the first processing block,
    6. The substrate processing apparatus according to claim 1, wherein said second processing unit group is arranged in said second processing block.
  8. 　前記第１ダミー基板収容部および前記第２ダミー基板収容部が、平面視において、前記基板載置部と重なっている、請求項１～７のいずれか一項に記載の基板処理装置。 The substrate processing apparatus according to any one of claims 1 to 7, wherein said first dummy substrate housing portion and said second dummy substrate housing portion overlap said substrate mounting portion in plan view.
  9. 　搬送スケジュールに従って、第１処理ユニット群に属する複数の第１処理ユニットと基板載置部との間で、第１搬送ユニットによって基板を搬送する工程と、
    　前記第１処理ユニットにおいて、前記第１搬送ユニットによって搬送された基板を処理する工程と、
    　前記搬送スケジュールに従って、前記複数の第１処理ユニットと第１ダミー基板収容部との間で、前記第１搬送ユニットによってダミー基板を搬送する工程と、
    　前記第１処理ユニットにおいて、前記第１搬送ユニットによって搬送されたダミー基板を用いたダミー処理を実行する工程と、
    　前記搬送スケジュールに従って、第２処理ユニット群に属する複数の第２処理ユニットと前記基板載置部との間で、第２搬送ユニットによって基板を搬送する工程と、
    　前記第２処理ユニットにおいて、前記第２搬送ユニットによって搬送された基板を処理する工程と、
    　前記搬送スケジュールに従って、前記複数の第２処理ユニットと第２ダミー基板収容部との間で、前記第２搬送ユニットによってダミー基板を搬送する工程と、
    　前記第２処理ユニットにおいて、前記第２搬送ユニットによって搬送されたダミー基板を用いたダミー処理を実行する工程と、
    　前記搬送スケジュールに従って、キャリヤ保持部に保持されたキャリヤと前記基板載置部との間で、第３搬送ユニットによって基板を搬送する工程と、
    　前記第１処理ユニット群に対して、前記第１処理ユニット群に含まれる前記第１処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理をいずれも実行することができない禁止モードと、前記第１処理ユニット群に含まれる前記第１処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理を実行することができる可能モードとを含む第１ステータスを設定する工程と、
    　前記第２処理ユニット群に対して、前記第２処理ユニット群に含まれる前記第２処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理をいずれも実行することができない禁止モードと、前記第２処理ユニット群に含まれる前記第２処理ユニットにおいて基板に対する処理およびダミー基板を用いる処理を実行することができる可能モードとを含む第２ステータスを設定する工程と、
    　前記第１ステータスが可能モードから禁止モードになると、前記第１搬送ユニットによって前記第１処理ユニット群のいずれかの前記第１処理ユニットに搬送されるように計画された基板の搬送スケジュールを破棄し、当該基板が前記第２搬送ユニットによって前記第２処理ユニット群のいずれかの前記第２処理ユニットに搬送されるように、前記搬送スケジュールを作成する工程と、
    　前記第２ステータスが可能モードから禁止モードになると、前記第２搬送ユニットよって前記第２処理ユニット群のいずれかの前記第２処理ユニットに搬送されるように計画された基板の搬送スケジュールを破棄し、当該基板が前記第１搬送ユニットによって前記第１処理ユニット群のいずれかの前記第１処理ユニットに搬送されるように、前記搬送スケジュールを作成する工程と、を含む、基板処理方法。     transporting the substrate by the first transport unit between the plurality of first processing units belonging to the first processing unit group and the substrate platform according to the transport schedule;
    processing the substrate transported by the first transport unit in the first processing unit;
    transporting the dummy substrates by the first transport unit between the plurality of first processing units and the first dummy substrate housing according to the transport schedule;
    performing dummy processing in the first processing unit using the dummy substrate transported by the first transport unit;
    a step of transporting a substrate by a second transport unit between a plurality of second processing units belonging to a second processing unit group and the substrate platform according to the transport schedule;
    processing the substrate transported by the second transport unit in the second processing unit;
    a step of transporting dummy substrates by the second transport unit between the plurality of second processing units and a second dummy substrate accommodation unit according to the transport schedule;
    performing dummy processing in the second processing unit using the dummy substrate transported by the second transport unit;
    a step of transporting the substrate by a third transport unit between the carrier held by the carrier holding part and the substrate platform according to the transport schedule;
    a prohibition mode in which the first processing units included in the first processing unit group cannot perform processing on a substrate and processing using a dummy substrate for the first processing unit group; setting a first status including a possible mode in which the first processing unit included in the unit group can perform processing on a substrate and processing using a dummy substrate;
    a prohibition mode in which neither processing on a substrate nor processing using a dummy substrate can be performed in the second processing units included in the second processing unit group; and the second processing. setting a second status including a possible mode in which the second processing unit included in the unit group can perform processing on the substrate and processing using the dummy substrate;
    When the first status changes from the enabled mode to the prohibited mode, canceling the transfer schedule of the substrates planned to be transferred to any one of the first processing units of the first processing unit group by the first transfer unit. creating the transport schedule such that the substrate is transported by the second transport unit to one of the second processing units of the second processing unit group;
    When the second status changes from the enabled mode to the prohibited mode, canceling the transfer schedule of the substrates planned to be transferred to any of the second processing units of the second processing unit group by the second transfer unit. and creating the transport schedule so that the substrate is transported by the first transport unit to one of the first processing units of the first processing unit group.
  10. 　前記第１ステータスを設定する工程は、前記第１ダミー基板収容部に収容されるダミー基板の使用履歴情報に基づいて、前記第１ダミー基板収容部に収容されるダミー基板の交換の要否を判断し、前記第１ダミー基板収容部に収容されるダミー基板の交換が必要であると判断されると前記第１ステータスを禁止モードとし、
    　前記第２ステータスを設定する工程は、前記第２ダミー基板収容部に収容されるダミー基板の使用履歴情報に基づいて、前記第２ダミー基板収容部に収容されるダミー基板の交換の要否を判断し、前記第２ダミー基板収容部に収容されるダミー基板の交換が必要であると判断されると前記第２ステータスを禁止モードとする、請求項９に記載の基板処理方法。     The step of setting the first status determines whether or not the dummy substrate accommodated in the first dummy substrate accommodation portion needs to be replaced based on usage history information of the dummy substrate accommodated in the first dummy substrate accommodation portion. determining, and if it is determined that replacement of the dummy substrate accommodated in the first dummy substrate accommodating portion is necessary, setting the first status to a prohibition mode;
    The step of setting the second status determines whether or not the dummy substrate accommodated in the second dummy substrate accommodation portion needs to be replaced based on usage history information of the dummy substrate accommodated in the second dummy substrate accommodation portion. 10. The substrate processing method according to claim 9, wherein said second status is set to a prohibition mode when it is determined that said dummy substrate accommodated in said second dummy substrate accommodating portion needs to be replaced.
PCT/JP2022/006329 2021-03-23 2022-02-17 Substrate processing device and substrate processing method WO2022201995A1 (en)

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Publication number Priority date Publication date Assignee Title
JP2004146450A (en) * 2002-10-22 2004-05-20 Tokyo Electron Ltd Substrate processing apparatus
JP2004304116A (en) * 2003-04-01 2004-10-28 Hitachi Kokusai Electric Inc Substrate processing apparatus
JP2010123733A (en) * 2008-11-19 2010-06-03 Tokyo Electron Ltd Substrate processing apparatus and processing method thereof, and storage medium
JP2017041506A (en) * 2015-08-18 2017-02-23 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP2021044482A (en) * 2019-09-13 2021-03-18 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus

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JP7091222B2 (en) * 2018-10-23 2022-06-27 株式会社Ｓｃｒｅｅｎホールディングス Heat treatment method and heat treatment equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146450A (en) * 2002-10-22 2004-05-20 Tokyo Electron Ltd Substrate processing apparatus
JP2004304116A (en) * 2003-04-01 2004-10-28 Hitachi Kokusai Electric Inc Substrate processing apparatus
JP2010123733A (en) * 2008-11-19 2010-06-03 Tokyo Electron Ltd Substrate processing apparatus and processing method thereof, and storage medium
JP2017041506A (en) * 2015-08-18 2017-02-23 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP2021044482A (en) * 2019-09-13 2021-03-18 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus

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