TWI802326B - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The substrate processing device includes: a carrier holding part for holding the carrier; a first processing unit group; a second processing unit group; a first dummy substrate storage part; a second dummy substrate storage part; The unit transports the substrate between the first processing unit and the substrate loading part, and transports the dummy substrate between the first processing unit and the first dummy substrate storage part; the second transfer unit is connected between the second processing unit and the substrate The substrate is transported between the placement parts, and the dummy substrate is transported between the second processing unit and the second dummy substrate storage part; the third transport unit is used to transport the substrate between the carrier and the substrate placement part; the memory part is Memorize data including the first state and the second state, the first state represents the state of the first processing unit group, the second state represents the state of the second processing unit group; the schedule creation part creates a transport schedule ; and a transport control unit that controls the transport performed by the first transport unit, the second transport unit, and the third transport unit according to the transport schedule.

Description

Substrate processing apparatus and substrate processing method

This application claims the priority of Japanese Patent Application JP2021-049170 filed on Mar. 23, 2021, and uses all the disclosures of Japanese Patent Application JP2021-049170 for this application.

The invention relates to a device and method for processing a substrate. The substrates to be processed are, for example, semiconductor wafers, liquid crystal display devices, and organic EL (electroluminescence; electroluminescence) display devices, such as flat panel display (FPD) substrates, optical disk substrates, and magnetic disk substrates. , Substrates for optical magnetic disks, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

In the manufacturing process of a semiconductor device, a substrate processing apparatus for processing a substrate like a semiconductor wafer is used. An example of such a substrate processing apparatus is disclosed in Patent Document 1. Such a substrate processing device includes: a carrier (carrier) holding part, which holds a carrier for accommodating a substrate; a plurality of processing units, which process the substrate; and a transport unit, which transports the substrate between the carrier and the processing unit; and control unit. When the non-use duration of the processing unit reaches a predetermined time, the control device requests the host device to move in a dummy carrier holding a dummy substrate. When the dummy carrier is carried into the carrier holding part, the transfer unit transfers the dummy substrate from the dummy carrier to the processing unit. Cleaning of the process unit is performed using this dummy substrate.

The handling unit consists of an indexer robot and a main handling robot, and A transfer unit is disposed between the index robot and the main transfer robot. The indexing robot handles substrates between the carrier and the transfer unit. The main transfer robot transfers the substrates between the transfer unit and the processing unit.

When the dummy carrier is placed on the carrier holding portion, the index robot takes out the dummy substrate from the dummy carrier and transports it to the transfer unit. The dummy substrate is transported from the transfer unit to the processing unit by the main transport robot. When the unit cleaning process using the dummy substrate is completed, the main transfer robot takes out the dummy substrate from the processing unit and transfers it to the transfer unit. The dummy substrate is transported from the transfer unit to the dummy carrier by an indexing robot. When all the dummy substrates are accommodated in the dummy carrier, the dummy carrier is taken out from the carrier holding portion.

[Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-41506.

In this way, the dummy substrate is introduced from the outside of the substrate processing apparatus, transported to the processing unit through the same path as the product substrate, and unloaded from the processing unit to be accommodated in the dummy carrier. Therefore, both the index robot and the main transfer robot are used for conveyance of the dummy substrate, and the dummy substrate is conveyed by the transfer unit. This interferes with the conveyance of the product substrate, thereby deteriorating the conveyance efficiency of the product substrate, and as a result, improvement of productivity is hindered.

In particular, in a substrate processing apparatus configured to increase the number of processing units and process multiple product substrates in parallel, the load on the index robot and the main transfer robot increases, and the index machine The reduction of the handling burden of humans and the main handling robot is the key to improving productivity.

In addition, the dummy carrier is carried into the carrier holding part, and the dummy carrier will occupy the carrier holding part until the dummy substrate is transported from the dummy carrier to the processing unit and the dummy substrate is stored in the processing unit after the processing in the processing unit is completed. up to the carrier. Therefore, since the dummy carrier continues to occupy the carrier holding portion, there may be a possibility of a standby time for carrying in a product substrate. Therefore, improvement of productivity is also hindered from such a viewpoint.

Therefore, one embodiment of the present invention is to provide a substrate processing apparatus and a substrate processing method which can reduce the influence on the conveyance of substrates for products and can perform processing using a dummy substrate in a processing unit.

One embodiment of the present invention provides a substrate processing device, which includes: a carrier holding part for holding a carrier, the carrier is used to accommodate a substrate or a dummy substrate; the first processing unit group has a plurality of first A processing unit, a plurality of first processing units processing a substrate and performing a process using a simulation substrate; a second processing unit group having a plurality of second processing units, a plurality of the second processing units processing a substrate and performing a process using simulation The processing of the substrate; the first dummy substrate storage part is for accommodating dummy substrates; the second dummy substrate storage part is for accommodating dummy substrates; the substrate loading part is for placing substrates; A plurality of the first processing units, the substrate loading unit, and the first dummy substrate storage unit transport substrates between the plurality of first processing units and the substrate loading unit, and transfer the substrates between the plurality of first processing units and the plurality of first processing units The dummy substrate is transported between the first dummy substrate storage unit; the second transport unit is configured to be able to access a plurality of the second processing units, the aforementioned substrate loading unit, and the second dummy substrate storage unit, in a plurality of The substrate is transported between the second processing unit and the substrate mounting section. plate, and transport the dummy substrate between the plurality of second processing units and the second dummy substrate storage unit; the third transport unit is capable of accessing the carrier held by the carrier holding unit and the substrate placement unit The substrate is transported between the aforementioned carrier held by the aforementioned carrier holding portion and the aforementioned substrate placing portion; the memory portion stores data including a first status (first status) and a second status (second status), and the aforementioned second status The first state represents the state of the first processing unit group, the second state represents the state of the second processing unit group; The transfer schedule of the substrate or the dummy substrate by the transfer unit; and the transfer control unit controls the first transfer unit, the second transfer unit, and the third transfer unit according to the transfer schedule created by the schedule creation unit Handling of substrates or dummy substrates for units. The foregoing first state includes: a first prohibition mode, in which neither the processing for the substrate nor the processing using a dummy substrate can be performed in the foregoing first processing unit included in the foregoing first processing unit group; and the first permitting mode, which is The processing on the substrate and the processing using the dummy substrate can be performed in the first processing unit included in the first processing unit group. The foregoing second state includes: a second prohibition mode, in which neither the processing of the substrate nor the processing using a dummy substrate can be performed in the foregoing second processing unit included in the foregoing second processing unit group; and the second permitting mode, in which The processing of the substrate and the processing using the dummy substrate can be performed in the second processing unit included in the second processing unit group. When the first state changes from the first allowed mode to the first prohibited mode, the schedule creation unit is discarded and transported by the first transport unit to any one of the first processing units in the first processing unit group The planned transport schedule of the substrate (especially the substrate before being discharged from the carrier) is made in such a way that the aforementioned substrate is transported by the aforementioned second transport unit to any one of the aforementioned second processing units in the aforementioned second processing unit group The transportation schedule planned by the method. When the aforementioned second state changes from the second allowed mode to the second prohibited mode, the aforementioned The schedule creation part discards the transport of the substrates (especially the substrates before being discharged from the carrier) that are planned to be transported by the second transport unit to any one of the second processing units in the second processing unit group. schedule, and make a transfer schedule planned in such a way that the substrate is transferred by the first transfer unit to any one of the first processing units in the first processing unit group.

According to this configuration, since the dummy substrate storage unit is provided in the substrate processing apparatus, when a dummy substrate needs to be used in the processing unit, it can be transported between the dummy substrate storage unit and the processing unit without the participation of the third transfer unit. Simulation substrate.

Therefore, since the conveyance load of the third conveyance unit can be reduced, the influence on the conveyance of the substrate for a product can be reduced, and processing using a dummy substrate can be performed. In particular, the transport load of the third transport unit that participates in transporting all the substrates between the first processing unit group and the second processing unit group each having a plurality of processing units and the carrier held by the carrier holding portion is constant. big. Therefore, by reducing the conveying load of the third conveying unit, the conveying efficiency of the substrates for products can be improved, and productivity can be improved correspondingly. Since the first transport unit and the second transport unit share the responsibility of transporting the substrate between the first processing unit group and the second processing unit group and the substrate mounting unit, the transport load is smaller than that of the third transport unit. Therefore, from the viewpoint of production efficiency, it is not a big problem that the first transport unit and the second transport unit are responsible for transporting the dummy substrate.

In addition, since the first transfer unit and the second transfer unit can respectively access the first dummy substrate storage part and the second dummy substrate storage part, the transfer of the dummy substrate between the dummy substrate storage part and the processing unit does not need to pass through the substrate The loading part can be carried out. Therefore, since the interference between the conveyance of the dummy substrate and the conveyance of the substrate for the product can be reduced, the conveyance efficiency of the substrate for the product can be improved, and the productivity can be improved accordingly.

Furthermore, in this embodiment, the first transport unit is located in the first dummy substrate storage section. The dummy substrate is conveyed between the first processing unit group, and the second conveying unit is used to convey the dummy substrate between the second dummy substrate storage part and the second processing unit group. Thereby, since the burden of conveying the dummy substrates is distributed, interference between conveyance of the substrates for products and conveyance of the dummy substrates can be suppressed, and thus the efficiency of conveying the substrates can be improved. Accordingly, productivity can be improved.

Furthermore, unlike the case of Patent Document 1, the carrier holding portion is not occupied for a long time by the dummy carrier for accommodating the dummy substrate. Thereby, since it is possible to suppress a waiting time for carrying in a carrier that accommodates a substrate for a product, it is possible to contribute to improvement of productivity.

Furthermore, in this embodiment, the first prohibition mode and the first permitting mode and the second prohibition mode and the second permitting mode can be individually set for the first processing unit group and the second processing unit group, and these modes are used as the same as the first processing unit group. The first state corresponding to a processing unit group and the second state corresponding to the second processing unit group are stored in the memory part. That is to say, for the first processing unit group, the first state for representing the first prohibition mode or the first permission mode is stored in the memory portion; for the second processing unit group, the memory portion is stored for representing the second prohibition mode or The second state of the second allowed mode. The first prohibition mode and the second prohibition mode are operation states in which neither the substrate nor the dummy substrate can be processed in the first processing unit group and the second processing unit group. The first allowable mode and the second allowable mode are operating states in which substrates can be processed in the first processing unit group and the second processing unit group and processes using dummy substrates can be performed. Therefore, the first processing unit group and the second processing unit group respectively become the first prohibited mode or the first permitted mode and the second prohibited mode or the second permitted mode. That is, there may be a situation where both the first processing unit group and the second processing unit group are in the first permission mode and the second permission mode, and both the first processing unit group and the second processing unit group are in the first prohibition mode and the second processing unit group. The case of two prohibited modes and the case where one of the first processing unit group and the second processing unit group is in the first permitted mode or the second permitted mode and the other is in the first prohibited mode or the second prohibited mode.

Therefore, in this embodiment, when the first state, that is, the operating state of the first processing unit group transitions from the first allowed mode to the first prohibited mode, the substrate whose processing is planned to be performed by the first processing unit group is changed. Moving schedule. Specifically, the transfer schedule of the substrate planned to be transferred to the first processing unit group by the first transfer unit is discarded, and recreated to transfer the substrate to the second allowable mode by the second transfer unit The transportation schedule of the second processing unit group. As a result, since the substrate can be transported by the second transport unit to the second processing unit constituting the second processing unit group, it can be processed in the second processing unit. In the second state, that is, when the operating state of the second processing unit group is shifted from the second permitted mode to the second prohibited mode, the transfer schedule of the substrate for which the processing by the second processing unit group is planned is changed in the same way. Specifically, the transfer schedule of the substrate planned to be transferred to the second processing unit group by the second transfer unit is discarded, and recreated to transfer the substrate to the first allowable mode by the first transfer unit The transportation schedule of the first processing unit group. As a result, since the substrate can be transported by the first transport unit to the first processing unit constituting the first processing unit group, it can be processed in the first processing unit.

In this way, even if one of the first processing unit group and the second processing unit group migrates from the first permission mode to the first prohibition mode or from the second permission mode to the second prohibition mode, the other party's first permission mode can The transfer and processing of the substrate continue in the processing unit group in the first mode or the second allowable mode. Thereby, since the downtime (down time) of the whole substrate processing apparatus can be reduced, productivity can be improved.

In one embodiment of the present invention, the first transport unit is configured such that neither the second processing unit nor the second dummy substrate storage section can be accessed. In addition, in one of the embodiments of the present invention, the second transport unit is configured such that neither the first processing unit nor the first dummy substrate storage section can be accessed.

In one of the embodiments of the present invention, the aforementioned third handling unit is held by the carrier The dummy substrate is transported between the carrier held by the holding part and the substrate placing part. In addition, the first transport unit transports the dummy substrate between the plurality of first processing units, the substrate loading portion, and the first dummy substrate storage portion. In addition, the second transport unit transports the dummy substrate between the plurality of second processing units, the substrate loading unit, and the second dummy substrate storage unit. Thereby, the unused dummy substrate can be introduced into the first dummy substrate storage part and the second dummy substrate storage part via the substrate loading part, and the used dummy substrate can be taken out of the first dummy substrate storage part via the substrate loading part. And the second dummy substrate storage part is carried out toward the carrier.

In one embodiment of the present invention, the memory unit stores the use history information of the dummy substrate stored in the first dummy substrate storage unit and the use history information of the dummy substrate stored in the second dummy substrate storage unit. . The substrate processing apparatus further includes: a state setting unit for judging whether it is necessary to replace the dummy substrates stored in the first dummy substrate storage unit and the second dummy substrate storage unit based on the use history information stored in the storage unit. , when it is determined that it is necessary to replace the dummy substrate stored in the first dummy substrate storage section, the first state is set to the first prohibition mode, and when it is determined that it is necessary to replace the dummy substrate stored in the second dummy substrate storage section At this time, the aforementioned second state is set to the second prohibition mode.

With this configuration, it is possible to appropriately determine whether the dummy board needs to be replaced based on the history of use of the dummy board, and accordingly, the first state and the second state can be appropriately set to the first prohibition mode and the second prohibition mode. That is, when the dummy substrate needs to be replaced, the processing using the dummy substrate cannot be performed in the processing unit, so the state of the processing unit group including the processing unit becomes the first prohibition mode or the second prohibition mode. As mentioned above, since the first state and the second state can be set individually, even if one of the first state and the second state becomes the first prohibition mode or the second prohibition mode, only the other one of the first state and the second state for the first allowed mode or The second allowable mode means that the processing unit group that can continue in the state of the first allowable mode or the second allowable mode is able to continue the processing of the substrate and the process using the dummy substrate. On the other hand, the dummy board of the dummy board storage part corresponding to the processing unit group in the first prohibition mode or the second prohibition mode can be replaced. In this way, even if it becomes necessary to replace the dummy substrate, since the processing of the substrate can be continued, productivity can also be improved.

In one embodiment of the present invention, the schedule creation unit creates a transport schedule, and the transport schedule is used to, when the first processing unit group is in the first prohibition mode, by the first transport unit and The third transfer unit transfers the dummy substrate between the carrier held by the carrier holding unit and the first dummy substrate storage unit, and when the second processing unit group is in the second prohibition mode, the second transfer unit The unit and the third transport unit transport the dummy substrate between the carrier held by the carrier holding unit and the second dummy substrate storage unit.

According to such a configuration, the dummy substrate is carried in and/or carried out to the dummy substrate storage unit corresponding to the processing unit group in the first prohibition mode or the second prohibition mode. Therefore, the conveyance and processing of the substrate for the product can be carried out in the processing unit group of the first permission mode or the second permission mode, and on the other hand, the dummy substrate can be carried into the processing unit of the first prohibition mode or the second prohibition mode. The dummy substrate storage unit corresponding to the group and the dummy substrate storage unit corresponding to the processing unit group in the first prohibition mode or the second prohibition mode are unloaded from the dummy substrate storage unit. Thereby, the dummy substrate can be introduced, ejected, or replaced without stopping the operation of the entire substrate processing apparatus. Thereby, production stoppage due to introduction, ejection, or replacement of dummy substrates can be avoided, thereby improving productivity.

In an embodiment of the present invention, the aforementioned substrate placement section includes: a first substrate placement section that can be accessed by the aforementioned first transport unit and the aforementioned third transport unit; and a second substrate placement section that can Access to the second transport unit and the third transport unit. The aforementioned first handling The unit transports substrates between the plurality of first processing units and the first substrate placement unit, and transfers substrates between the plurality of first processing units, the first substrate placement unit, and the first dummy substrate storage unit. Handling the dummy substrate. The second transfer unit transfers the substrate between the plurality of the second processing units and the second substrate placement unit, and transfers the substrate between the plurality of the second processing units, the second substrate placement unit and the second dummy substrate. Transfer dummy substrates between storage units. The third transport unit transports the substrate and the dummy substrate between the carrier held by the carrier holding unit and the first substrate mounting unit, and transfers the substrate and the dummy substrate between the carrier held by the carrier holding unit and the second substrate. Transfer substrates and dummy substrates between loading units.

According to such a structure, the 1st board|substrate mounting part corresponding to the 1st processing unit group and the 2nd board|substrate mounting part corresponding to the 2nd processing unit group are provided. Thereby, the transportation of the substrates to the first processing unit group, the transportation of the dummy substrates to the first dummy substrate accommodating part, the transportation of the substrates to the second processing unit group and the dummy substrates to the second dummy substrate accommodating part can be reduced. Interference between transfers. Thereby, since board|substrate conveyance efficiency improves, productivity can be improved.

In one embodiment of the present invention, the third transfer unit is configured to be able to access the first dummy substrate storage unit and the second dummy substrate storage unit; the schedule creation unit creates a transfer schedule, and the transfer The scheduling is used to transfer the dummy substrate between the carrier held by the carrier holding part and the first dummy substrate storage part by the third transfer unit when the first processing unit group is in the first prohibition mode , when the second processing unit group is in the second prohibition mode, the dummy substrate is transferred between the carrier held by the carrier holding unit and the second dummy substrate storage unit by the third transfer unit.

According to this configuration, since the third transfer unit can access the first dummy substrate storage section and the second dummy substrate storage section, it is possible to use the first main transfer robot and the second main transfer robot The non-participating method directly transports the dummy substrate between the carrier held by the carrier holding part and the first dummy substrate storage part and the second dummy substrate storage part. Thereby, the introduction, discharge or replacement of the dummy substrate can be quickly performed, and the load on the first main transfer robot and the second main transfer robot can be reduced, thereby contributing to improvement of productivity.

In one of the embodiments of the present invention, the substrate processing device includes: a first processing block layer; and a second processing block layer located above the first processing block layer; The block layer is configured with the aforementioned first processing unit group, and the aforementioned second processing block layer is configured with the aforementioned second processing unit group.

In one of the embodiments of the present invention, the aforementioned substrate processing apparatus includes: a first processing block; and a second processing block, which is located on the side of the first processing block; The first processing unit group is arranged in the block portion, and the second processing unit group is arranged in the second processing block portion.

In one embodiment of the present invention, the first dummy substrate storage section and the second dummy substrate storage section overlap the substrate mounting section in plan view.

According to such a configuration, the dummy base accommodating portion can be arranged so as to overlap with the substrate mounting portion in plan view by utilizing the space above or below the substrate mounting portion. Thereby, the arrangement of the dummy substrate accommodating portion without hindering the conveyance of the substrate for products can be realized, and the arrangement with good space utilization efficiency can be realized.

The arrangement in which the dummy substrate storage unit overlaps with the substrate placement unit in a plan view may specifically be an arrangement in which a part or all of the dummy substrates accommodated in the dummy substrate storage unit overlap with the substrates held in the substrate placement unit.

In one embodiment of the present invention, the first dummy substrate storage section and the second dummy substrate storage section are arranged vertically and separately with the substrate placement section interposed therebetween.

One embodiment of the present invention provides a method for processing a substrate, which includes: following a transfer schedule, using a first transfer unit to transfer a substrate between a plurality of first processing units belonging to a first processing unit group and a substrate loading unit The process; the process of processing the substrates transported by the first transport unit in the aforementioned first processing unit; according to the aforementioned transport schedule, the plurality of the aforementioned first processing units and the first dummy substrate storage section are processed by the first transport unit The process of transporting the dummy substrate between them; the process of performing the simulation process using the dummy substrate transported by the first transport unit in the aforementioned first processing unit; following the aforementioned transport schedule, by the second transport unit belonging to the second The process of transporting substrates between the plurality of second processing units of the processing unit group and the aforementioned substrate loading unit; the process of handling the substrates transported by the aforementioned second transporting unit in the aforementioned second processing unit; following the aforementioned transport schedule, by A process of transporting dummy substrates between the plurality of second processing units and a second dummy substrate storage section by the second transport unit; performing a process using a dummy substrate transported by the second transport unit in the second processing unit The process of simulation processing; according to the above-mentioned transport schedule, the process of transporting the substrate between the carrier held by the carrier holding part and the aforementioned substrate loading part by the third transport unit; setting the first for the aforementioned first processing unit group In the process of the state, the aforementioned first state includes: a first prohibition mode, which means that neither the processing of the substrate nor the processing of the dummy substrate can be performed in the aforementioned first processing unit included in the aforementioned first processing unit group; and the first The allowed mode is capable of performing processing on the substrate and processing using a dummy substrate in the first processing unit included in the first processing unit group; setting the second state for the second processing unit group, the second The status includes: a second prohibition mode, neither of which can perform the processing of the substrate and the processing of the dummy substrate in the aforementioned second processing unit included in the aforementioned second processing unit group; The aforementioned second processing unit included in the second processing unit group performs processing for the substrate and processing using a dummy substrate; when the aforementioned first state changes from the first permission mode to the first prohibition mode, the discarded The transfer schedule of the substrate (especially the substrate before being discharged from the carrier) planned in such a way that the first transfer unit is transferred to any one of the first processing units in the first processing unit group is made according to the aforementioned The process of the transfer schedule planned by the way that the substrate is transferred by the second transfer unit to any one of the second processing units in the second processing unit group; and when the second status changes from the second permission mode to the second In the prohibition mode, discard the transfer row of the substrates (especially the substrates before being discharged from the carrier) that are planned to be transferred to any one of the second processing units in the second processing unit group by the second transfer unit. process, and create a transfer schedule planned in such a way that the substrate is transferred by the first transfer unit to any one of the first processing units in the first processing unit group.

In one embodiment of the present invention, the process for setting the first state is to judge whether it is necessary to replace the dummy substrate stored in the first dummy substrate storage part based on the use history information of the dummy substrate stored in the first dummy substrate storage part. The dummy substrate in the substrate storage section sets the first state to the first prohibition mode when it is determined that the dummy substrate stored in the first dummy substrate storage section needs to be replaced. The procedure for setting the aforementioned second state is based on the use history information of the dummy substrate stored in the second dummy substrate storage section to determine whether it is necessary to replace the dummy substrate stored in the second dummy substrate storage section. When it is necessary to replace the dummy substrate stored in the second dummy substrate accommodating portion, the second state is set to the second prohibition mode.

The above object and other objects, features, aspects and advantages will be more clearly understood through the following detailed description of the present invention with reference to the accompanying drawings.

1: Substrate processing device

2: Index block

2a: Rear Bulkhead

3: Processing blocks

3a: front next door

4L, 4U, 5L, 5U: window

6, 6L, 6U: Substrate mounting part

6A: The first substrate loading part

6B: The second substrate loading part

7A: The first dummy substrate storage unit

7B: Second Dummy Substrate Storage Unit

7L: The first dummy substrate storage unit

7U: The second dummy substrate storage unit

8A: The first main handling robot

8B: The second main handling robot

8L, 8U: Main handling robot

11L to 13L, 21L to 23L, 31L to 33L, 41L to 43L, 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U, L1 to L3, U1 to U3: Processing unit

15: next door

16: middle partition

17: next door

18: Next to the center

25: Carrier holding part

26: Indexing Bots

27:Multi-joint arm

28: arm

29,81: hand

30: abutment

35: Processing room

36: Next door to the unit

36a: side wall

36b: top wall

36c: bottom wall

37: Substrate loading and unloading port

38: door stop

39: Handling Hood

40: Rotation fixture

45: Rotation base

46: Rotation motor

51L, 51U: Transport path

52L, 52U: transport space

53A: The first handling space

53B: Second handling space

54: Treatment liquid supply source

55: Nozzle

56: Treatment liquid piping

57:Nozzle arm

58: Oscillating shaft

59: Valve

60: pump

61: unprocessed substrate loading part

62: Processed substrate loading unit

63,64: boxes

65,66: Substrate holder

67,68: Substrate support member

71:Simulation substrate holder

72:Simulation substrate support member

75: Exhaust connecting pipe

76: Exhaust piping

77:Switch mechanism

82:Hand drive mechanism

83: Pillar

84: Vertical movement department

85: Horizontal movement department

86:Rotation

87: Advance and retreat

91: The first liquid supply unit

92: Second liquid supply part

93: The third liquid supply unit

94: The fourth liquid supply unit

101: The first exhaust part

102: The second exhaust part

103: The third exhaust part

104: The fourth exhaust part

110: Controller

111: Processor

112: memory

120: program

130: Information

131: Product prescription

132: Simulation processing prescription

133: Simulation substrate table

134: Simulation substrate history data

135: Unit usage history data

140: User Interface

141: first state

142: second state

150: host computer

170: communication line

300: carrier handling mechanism

350: Carrier Placement

351: Simulation carrier placement

A7: Preprocessing steps

A20: Product substrate loading steps

A30, A70, A120, A160: Procedures for making transport schedule

A31, A71: Steps for moving the simulation substrate

A32, A72: Simulation processing steps

A33, A73: Dummy substrate containment steps

A121: Substrate loading procedure

A122: Processing steps

A123: Substrate containment procedure

B1: The first processing block department

B2: The second processing block

BL: The first processing block layer

BU: the second processing block layer

C: carrier

DC: Dummy Carrier

DL1 to DL12, DU1 to DU12: Dummy base slots

DW: Dummy Substrate

G1: The first processing unit group

G2: The second processing unit group

S1L, S1U: first processing unit stack

S2L, S2U: second processing unit stack

S3L, S3U: third processing unit stack

S4L, S4U: fourth processing unit stack

t1: time

T1: The first tower

T2: the second tower

T3: The third tower

T4: The fourth tower

W, W1 to W4: product substrate (substrate)

X: the first horizontal direction

Y: the second horizontal direction

Z: up and down direction

[FIG. 1] It is a schematic plan view which shows the internal structure of the substrate processing apparatus which is one embodiment of this invention.

[ Fig. 2 ] is a schematic longitudinal sectional view viewed from line II-II in Fig. 1 .

[ Fig. 3 ] is a schematic cross-sectional view viewed from line III-III in Fig. 1 .

[ Fig. 4 ] is a schematic elevational view showing the internal configuration of the processing block viewed from the IV direction in Fig. 1 .

[FIG. 5] It is a figure for demonstrating the structure example of a board|substrate mounting part.

[FIG. 6] It is a figure for demonstrating the example of the structure of a dummy board|substrate accommodating part.

[ Fig. 7 ] is a schematic cross-sectional view for explaining a configuration example of a processing unit.

[FIG. 8] It is a block diagram for demonstrating the structure related to the control of a substrate processing apparatus.

[ Fig. 9 ] is a flowchart for explaining the operation of the controller related to the simulation process.

[ FIG. 10 ] is a flow chart for explaining the transition of the first state of the first processing block layer and the second state of the second processing block layer and an operation example of changing the transfer schedule based on these transitions.

[ FIG. 11 ] is a flow chart for explaining an example of operations related to loading of unused dummy substrates into the dummy substrate storage unit and unloading of used dummy substrates from the dummy substrate storage unit.

[ FIG. 12A ] is a timing chart showing an example of the substrate transfer operation when the first state and the second state are both the first allowable mode and the second allowable mode.

[ FIG. 12B ] is a timing chart showing an example of the substrate transfer operation when the second state transitions from the second allowed mode to the second prohibited mode.

[ Fig. 13] Fig. 13 is a schematic longitudinal sectional view showing an internal structure of a substrate processing apparatus according to still another embodiment of the present invention.

[ Fig. 14 ] is a schematic plan view showing an internal configuration of a substrate processing apparatus according to another embodiment of the present invention.

[FIG. 15] It is a schematic plan view which shows the internal structure of the substrate processing apparatus of another embodiment of this invention.

FIG. 1 is a schematic plan view showing the internal structure of a substrate processing apparatus according to one embodiment of the present invention. Fig. 2 is a schematic longitudinal sectional view viewed from line II-II in Fig. 1 . Fig. 3 is a schematic cross-sectional view viewed from line III-III in Fig. 1 . FIG. 4 is a schematic elevational view showing the internal structure of the processing block viewed from the IV direction of FIG. 1 .

The substrate processing apparatus 1 includes an index block 2 and a processing block 3 , and the processing block 3 is adjacent to the index block 2 in a horizontal direction (a first horizontal direction X).

The index block 2 includes a plurality of (four in this embodiment) carrier holders 25 (load ports) and an index robot 26 . Hereinafter, for the convenience of description, with respect to the first horizontal direction X, the side of the carrier holding portion 25 may be defined as the front and the side opposite to the side of the carrier holding portion 25 will be defined as the rear.

The plurality of carrier holding parts 25 are arranged along the second horizontal direction Y perpendicular to the first horizontal direction X. Each carrier holding part 25 is comprised so that it can accommodate and hold the carrier C automatically conveyed by the carrier conveyance mechanism 300 equipped in a factory. Each carrier holding portion 25 is configured to hold one carrier C. As shown in FIG. The carrier C is a substrate storage container that accommodates a substrate W (hereinafter also referred to as a product substrate W) to be processed. An example of the carrier C is a FOUP (Front Opening Unified Pod; Front Opening Unified Pod). The carrier C is configured to hold a plurality of (for example, 25) substrates W in a stacked state. More specifically, the carrier C is configured to hold a plurality of substrates W in a stacked state along the vertical direction Z in a horizontal posture when held by the carrier holding portion 25 . The carrier holding portion 25 is an example of a container holding portion, and is used to hold the carrier C belonging to the substrate container. The substrate W is, for example, a semiconductor wafer.

The index robot 26 is an example of the third transport unit. The index robot 26 is configured to be able to access the carriers C respectively held by the plurality of carrier holding parts 25, to carry the substrate W in or out, and to transfer the substrate W between the carrier holding part 25 and the processing block 3. . In the present embodiment, the index robot 26 is a multi-joint arm robot including a multi-joint arm 27 . Specifically, the indexing robot 26 includes: a multi-joint arm 27 that connects a plurality of arms 28; more than one hand 29 that is coupled to the front end of the multi-joint arm 27; and a base part 30 that supports the multi-joint arm 27 and make the multi-joint arm 27 move up and down. A plurality of arms 28 and hands 29 constituting the multi-joint arm 27 are capable of swinging around a vertical swing axis set at each base end. individual actuators (typically electric motors).

The processing block 3 includes a plurality of first processing block layers BL and second processing block layers BU stacked in the vertical direction Z. In this embodiment, the processing block 3 includes a processing block layer (hereinafter referred to as "the first processing block layer BL") of the first layer (lower layer) and a layer stacked above the first processing block layer BL. The processing block layer of the second layer (upper layer) (hereinafter referred to as "second processing block layer BU"). Hereinafter, when distinguishing the constituent elements of the first processing block layer BL from the constituent elements of the second processing block layer BU, the constituent elements of the first processing block layer BL are used with the component symbols with the English letter "L" at the end , for the constituent elements of the second processing block layer BU, the component symbols with the English word "U" at the end are used. The same applies to the reference symbols in the drawings.

The internal configurations in plan view of the first processing block layer BL and the second processing block layer BU are substantially the same. Therefore, in FIG. 1 , please note that the configuration of the first processing block layer BL (arrangement in plan view) is represented by replacing the English character “U” at the end of the element code with the English character “L”.

The first processing block layer BL includes a plurality (12 in this embodiment) of processing units 11L to 13L, 21L to 23L, 31L to 33L, 41L to 43L (hereinafter collectively referred to as "processing units 11L to 43L" when processing units of the first processing block layer BL), a plurality of processing units 11L to 13L, 21L to 23L, 31L to 33L and 41L to 43L constitute the first processing unit group. The first processing block layer BL further includes a substrate placement unit 6L, a dummy substrate storage unit 7L, and a main transfer robot 8L. The plurality of processing units 11L to 43L process the substrate W. In this embodiment, each of the processing units 11L to 43L is a blade type processing unit for processing the substrate W one by one. The substrate mounting part 6L is a unit for temporarily holding the substrate W transferred between the index robot 26 and the first processing block layer BL. The dummy substrate storage unit 7L provides a standby place for the dummy substrates DW, and is a unit for holding the dummy substrates DW usable in the processing units 11L to 43L in advance in the substrate processing apparatus 1 . The main transfer robot 8L is configured to be able to access the substrate placement portion 6L, the processing units 11L to 43L, and the dummy substrate storage portion 7L. The main transport robot 8L is an example of a first transport unit for transporting the substrate W between the substrate mounting section 6L and the processing units 11L to 43L and transporting the dummy substrate DW between the dummy substrate storage section 7L and the processing units 11L to 43L. .

The so-called dummy substrate DW is a substrate having the same shape (for example, circular shape) and size as the substrate W. The dummy substrate DW is different from the substrate W for a product supplied from the carrier C, and is not used for manufacturing an actual product. The dummy substrate DW is introduced into the processing units 11L to 43L in order to perform preprocessing (preparation processing) for adjusting the environment in the processing units 11L to 43L and unit cleaning processing for cleaning the processing units 11L to 43L, etc. to use. Hereinafter, such processing using the dummy substrate DW is referred to as "dummy processing". The preprocessing and unit cleaning processes described above are maintenance processes for maintaining the processing units 11L to 43L, and the simulation process includes such maintenance processes.

A plurality of processing units 11L to 43L are arranged on both sides of the transport space 52L along the transport space 52L and face the transport space 52L. The transport space 52L provides a transport path 51L, and the transport path 51L is a path for the main transport robot 8L to transport the substrate W. . When viewed from above, the handling space 52L is tied to the second level The direction Y has a fixed width and extends linearly along the first horizontal direction X toward a direction away from the index block 2 . The transfer space 52L has a height substantially equal to the height of the first processing block layer BL in the vertical direction Z. In a plan view, on one side of the transport space 52L, the first liquid supply unit 91, the first processing unit stacking unit S1L, and the first exhaust unit 101 are arranged sequentially along the transport path 51L from the side close to the index block 2. , the second liquid supply part 92 , the second processing unit stack part S2L, and the second exhaust part 102 . On the other side of the transport space 52L, the third exhaust unit 103, the third processing unit stacking unit S3L, the third liquid supply unit 93, the fourth The exhaust unit 104 , the fourth processing unit stacking unit S4L, and the fourth liquid supply unit 94 . These members are arranged so as to partition the substantially cubic conveyance space 52L.

The first processing unit stack S1L to the fourth processing unit stack S4L respectively include a plurality of stages (in this embodiment, three stages) of processing units 11L to 13L, 21L to 23L, 31L to 33L, and 41L stacked in the vertical direction Z. to 43L. The third processing unit stack portion S3L is opposed to the first processing unit stack portion S1L across the conveyance space 52L. The fourth processing unit stacking portion S4L is opposed to the second processing unit stacking portion S2L across the conveyance space 52L. Therefore, the plurality of processing units 31L to 33L constituting the third processing unit stack S3L are opposite to the plurality of stages of processing units 11L to 13L constituting the first processing unit stack S1L across the transport space 52L. Similarly, the plurality of processing units 41L to 43L constituting the fourth processing unit stack S4L are opposite to the plurality of processing units 21L to 23L constituting the second processing unit stack S2L across the transport space 52L. In this embodiment, the first processing block layer BL includes 12 processing units 11L to 13L, 21L to 23L, 31L to 33L, and 41L to 43L, and three of these components are separately arranged in four first processing units. The unit stack S1L to the fourth processing unit stack S4L.

The carrying space 52L is partitioned from above by the middle partition wall 16 and partitioned from below by the lower partition wall 15. Next, the middle partition wall 16 is disposed at a position integrated with the upper surfaces of the uppermost processing units 13L, 23L, 33L, 43L of the first processing unit stack S1L to the fourth processing unit stack S4L, and the lower partition wall 15 is disposed It is at a position integrated with the lower surface of the processing units 11L, 21L, 31L, and 41L at the lowest stage. All of the processing units 11L to 43L have a substrate loading and unloading port 37, and the substrate loading and unloading port 37 opens at a position facing the transfer space 52L. The main transport robot 8L transports the substrate W and the dummy substrate DW through the transport space 52L, loads the substrate W and the dummy substrate DW into the processing units 11L to 43L through the substrate loading and unloading port 37, and unloads the substrate W and the dummy substrate DW from the processing units 11L to 43L. Substrate DW.

The substrate placement unit 6L is arranged between the index robot 26 and the main transfer robot 8L. More specifically, the substrate placement unit 6L is arranged at an end portion on the index robot 26 side in the transfer space 52L in plan view. In the present embodiment, the substrate placement unit 6L is located between the first liquid supply unit 91 and the third exhaust unit 103 . The substrate mounting portion 6L is arranged at a height between the intermediate partition wall 16 and the lower partition wall 15 in the up-down direction Z. In the present embodiment, the substrate mounting portion 6L is arranged near the middle height in the height range from the intermediate partition wall 16 to the upper partition wall 17 . The vertical position of the board mounting section 6L needs to be within a height range accessible by the index robot 26 and within a height range accessible by the main transfer robot 8L.

The substrate placement unit 6L includes: an unprocessed substrate placement unit 61 on which an unprocessed substrate W is placed; and a processed substrate placement unit 62 on which a processed substrate W is placed. The unprocessed substrate mounting part 61 and the processed substrate mounting part 62 are stacked in the vertical direction Z. Preferably, the unprocessed substrate placement part 61 is disposed on the processed substrate placement part 62 .

As shown in the enlarged configuration example in FIG. 5 , the unprocessed substrate placement unit 61 and the processed substrate placement unit 62 include boxes 63 and 64 along the first horizontal direction X and on the side of the indexing robot 26 and Both sides of the main transfer robot 8L are open; and substrate holders 65 , 66 are disposed inside boxes 63 , 64 . The substrate holders 65 and 66 have a plurality of (for example, ten) substrate support members 67 and 68 arranged in the vertical direction Z. Each of the substrate supporting members 67 and 68 is configured to support the peripheral portion of the lower surface of one substrate W from below and hold the substrate W in a horizontal posture. Thereby, the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 can stack a plurality of (for example, 10) substrates W in a horizontal posture on these substrate holders 65 and 66 with intervals in the vertical direction Z, respectively. state to hold a plurality of substrates W.

As shown in Figure 2, in the mode of penetrating the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is to say, forming a connection with the substrate in the manner of penetrating the partition wall adjacent to the index block 2 and the processing block 3 The mounting portion 6L corresponds to the window 4L. The index robot 26 can access the substrate mounting portion 6L through the window 4L, and can carry in and out the substrate W from the substrate mounting portion 6L.

The dummy substrate housing portion 7L is provided at a different height from the substrate mounting portion 6L, and is disposed below the substrate mounting portion 6L in the transfer space 52L in the present embodiment. The dummy substrate housing portion 7L is provided so as to overlap with the substrate mounting portion 6L in plan view. More specifically, when the substrate W is held by the substrate mounting portion 6L and the dummy substrate DW is held by the dummy substrate storage portion 7L, the dummy substrate storage portion 7L is arranged so that the substrate W and the dummy substrate DW overlap each other in plan view. The overlapping of the substrate W and the dummy substrate DW in plan view may be partial or overall, that is, the dummy substrate DW may overlap substantially the entirety of the substrate W.

The dummy substrate storage unit 7L is arranged between the lower partition wall 15 and the intermediate partition wall 16, and the main transfer robot 8L is arranged within a height range that can be accessed. The rear partition wall 2 a of the index block 2 and the front partition wall 3 a of the processing block 3 , that is, the partition wall adjacent to the index block 2 and the processing block 3 , are located in front of the dummy substrate storage portion 7L, that is, on the side of the index block 2 . No windows corresponding to the dummy substrate housing portion 7L are provided in these partition walls. Therefore, in the present embodiment, the index robot 26 cannot access the dummy substrate storage section 7L.

As shown in the enlarged configuration example in FIG. 6 , the dummy board storage unit 7L is equipped with Cage 71. The configuration of the dummy substrate holder 71 may be substantially the same as the configuration of the substrate holders 65 and 66 of the substrate mount portion 6L. However, the number of dummy substrates DW that can be held by the dummy substrate holder 71 is not necessarily equal to the number of substrates that can be held by the substrate holders 65 and 66 . Specifically, the dummy substrate holder 71 has a plurality of (for example, 12) dummy substrate support members 72 arranged in the vertical direction. Each of the dummy substrate supporting members 72 is configured to support the peripheral portion of the lower surface of one dummy substrate DW from below and hold the dummy substrate DW in a horizontal posture. The dummy substrate storage unit 7L can hold a plurality of dummy substrates DW in a state where the dummy substrate holders 71 are stacked horizontally with intervals in the vertical direction Z. That is, the dummy board storage section 7L has a plurality of stages (in this embodiment, the same number as the number of processing units included in the first processing block layer BL) slots (hereinafter referred to as "dummy board slots DL1 to DL1"). DL12"), a plurality of slots are stacked in the up and down direction in a manner of accommodating each dummy substrate DW in a horizontal posture. A dummy substrate sensor (not shown) may also be provided, and the dummy substrate sensor is used to detect whether there is a dummy substrate DW in each of the dummy substrate slots DL1 to DL12. In this embodiment, the dummy board storage part 7L is different from the board|substrate mounting part 6L, and the box which surrounds the dummy board|substrate DW accommodated does not need to be provided. Of course, such a box may also be provided.

As shown in FIG. 2 , the main transfer robot 8L is arranged in the transfer space 52L. The main transfer robot 8L includes: a hand 81 for holding a substrate in a horizontal posture; and a hand driving mechanism 82 for driving the hand 81 . A plurality of (for example, two) hands 81 may be provided. The hand driving mechanism 82 can move the hand 81 in the first horizontal direction X, the second horizontal direction Y, and the vertical direction Z, and make the hand 81 revolve around the vertical rotation axis. The hand driving mechanism 82 includes two pillars 83 , a vertical movement part 84 , a horizontal movement part 85 , a rotation part 86 and an advancing and retreating part 87 . The hand part 81 is coupled to the advancing and retreating part 87 . When a plurality of hands 81 are provided, it is preferable to provide a plurality of advancing and retreating portions 87 corresponding to the plurality of hands 81 .

The two pillars 83 are arranged at intervals along the first horizontal direction X and are respectively fixed on The side wall of the transport space 52L. The two pillars 83 extend in the vertical direction Z, and function as guide rails for guiding the vertical movement of the vertical movement part 84 . The vertical moving part 84 is in the form of a guide rail, extends in the first horizontal direction X across the two pillars 83 , and is connected to the two pillars 83 at both ends. The vertical movement unit 84 is configured to move in the vertical direction with respect to the pillars 83 while being guided by the two pillars 83 . The horizontal movement unit 85 is supported by the vertical movement unit 84 and is configured to move in the first horizontal direction X relative to the vertical movement unit 84 while being guided by the vertical movement unit 84 . The rotating part 86 is supported by the horizontal moving part 85 . The rotation unit 86 is configured to rotate around a vertical rotation axis on the horizontal movement unit 85 . The advancing and retreating portion 87 is coupled to the rotating portion 86 . The advancing and retreating portion 87 advances and retreats in the horizontal direction relative to the rotation axis, whereby the hand 81 advances and retreats in the horizontal direction.

With such a configuration, the main transfer robot 8L can make the hand 81 access the substrate placement part 6L, and transfer the substrate W between the main transfer robot 8L and the substrate placement part 6L. The main transfer robot 8L can further enable the hand 81 to access any processing units 11L to 43L in the first processing block layer BL, and can perform substrate W or simulation between the main transfer robot 8L and the processing units 11L to 43L. Substrate DW transfer. In addition, the main transfer robot 8L enables the hand 81 to access the dummy substrate storage section 7L, and transfers the dummy substrate DW between the main transfer robot 8L and the dummy substrate storage section 7L. Furthermore, the main transfer robot 8L can transfer the substrate W held by the hand 81 or the dummy substrate DW between the substrate mounting part 6L, the processing units 11L to 43L, and the dummy substrate storage part 7L in the first processing block layer BL. .

Since the configuration of the second processing block layer BU is substantially the same as that of the first processing block layer BL, repeated descriptions will be omitted as much as possible below, and different configurations will be mainly described. The configuration of the elements with the same names as in the case of the first processing block layer BL is substantially the same.

The second processing block layer BU is composed of a plurality of (12 in this embodiment) processing units 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U (hereinafter collectively referred to as the processing of the second processing block layer BU) one It is called "processing units 11U to 43U" in Yuan Dynasty), and a plurality of processing units 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U constitute the second processing unit group. The second processing block level BU further includes a substrate placement part 6U, a dummy substrate storage part 7U, and a main transfer robot 8U. The first liquid supply part 91 to the fourth liquid supply part 94 and the first exhaust part 101 to the fourth exhaust part 104 are throughout the first processing block layer BL and the second processing block layer BU and along the vertical direction Z configuration.

The configuration of the plurality of processing units 11U to 43U in the second processing block layer BU is substantially equal to the configuration of the plurality of processing units 11L to 43L in the first processing block layer BL. The second processing block layer BU is equipped with the first processing unit stacking part S1U to the fourth processing unit stacking part S4U, and the first processing unit stacking part S1U to the fourth processing unit stacking part S4U are respectively equipped with a plurality of layers stacked in the vertical direction Z. Stage (three stages in this embodiment) processing units 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U.

The first processing unit stacking portion S1U to the fourth processing unit stacking portion S4U of the second processing block layer BU are respectively connected to the first processing unit stacking portion S1L to the fourth processing unit of the first processing block layer BL when viewed from the top. The stacked parts S4L are arranged so as to overlap each other. Moreover, the first processing unit stacks S1L, S1U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a first tower T1, and the first tower T1 is stacked with a plurality of Segment (six in this embodiment) processing units 11L, 12L, 13L, 11U, 12U, 13U. Similarly, the second processing unit stacks S2L, S2U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a second tower T2, and the second tower T2 is stacked with Multiple stages (six stages in this embodiment) processing units 21L, 22L, 23L, 21U, 22U, 23U. Furthermore, the third processing unit stacks S3L, S3U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a third tower T3, and the third tower T3 is stacked with Multiple stages (6 stages in this embodiment) processing units 31L, 32L, 33L, 31U, 32U, 33U. Likewise, the fourth processing unit stacks S4L, S4U of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a fourth tower T4, and the fourth tower T4 is stacked There are a plurality of stages (six stages in this embodiment) of processing units 41L, 42L, 43L, 41U, 42U, and 43U.

The transportation space 52U, which is defined in the second processing block layer BU and used to provide the transportation path 51U, overlaps with the transportation space 52L of the first processing block layer BL. The transfer space 52U in the second processing block layer BU is partitioned from below by the middle partition wall 16 and partitioned from above by the upper partition wall 17 . The upper partition wall 17 is disposed at a height integrated with the upper surfaces of the uppermost processing units 13U, 23U, 33U, and 43U of the first to fourth towers T1 to T4.

The arrangement of the substrate mount portion 6U in plan view is the same as that of the first processing block layer BL. That is, the substrate placement unit 6U is arranged between the index robot 26 and the main transfer robot 8U, and is arranged at an end portion on the side of the index robot 26 in the transfer space 52U. The substrate mounting part 6U of the second processing block layer BU is arranged so as to overlap the substrate mounting part 6L of the first processing block layer BL in plan view. The board|substrate mounting part 6U is arrange|positioned at the height between the intermediate partition wall 16 and the upper partition wall 17 in the up-down direction Z. In the present embodiment, the substrate mounting portion 6U is disposed below the middle height of the height range from the intermediate partition wall 16 to the upper partition wall 17 . More specifically, the substrate placement unit 6U is arranged at the highest position within the height range accessible by the index robot 26 . The vertical direction position of the board|substrate mounting part 6U needs to be within the height range which the index robot 26 can access, and the main transfer robot 8U must fall within the height range which can access. As in the case of the first processing block layer BL, the substrate mount portion 6U includes: an unprocessed substrate mount portion 61 for mounting an unprocessed substrate W; and a processed substrate mount portion 62 for mount The processed substrate W. The configurations of the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 are the same as those of the substrate mounting portion 6L of the first processing block layer BL (see FIG. 5 ).

In such a way as to pass through the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, That is, the window 4U corresponding to the substrate mounting portion 6U is formed so as to penetrate through the partition wall adjacent to the index block 2 and the processing block 3 . The index robot 26 can access the substrate mounting portion 6U through the window 4U, and can carry in and out the substrate W from the substrate mounting portion 6U.

The dummy substrate storage unit 7U is provided at a different height from the substrate placement unit 6U, and is disposed above the substrate placement unit 6U in the transfer space 52U in the present embodiment. The dummy substrate housing portion 7U is provided so as to overlap with the substrate mounting portion 6U in plan view. More specifically, when the substrate W is held by the substrate mounting portion 6U and the dummy substrate DW is held by the dummy substrate storage portion 7U, the dummy substrate storage portion 7U is arranged so that the substrate W and the dummy substrate DW overlap each other in plan view. The overlapping of the substrate W and the dummy substrate DW in plan view may be partial or overall, that is, the dummy substrate DW may overlap substantially the entirety of the substrate W. The dummy substrate storage unit 7U is arranged at a height between the upper partition wall 17 and the middle partition wall 16, and the main transfer robot 8U is arranged within a height range that can be accessed. The rear partition wall 2 a of the index block 2 and the front partition wall 3 a of the processing block 3 , that is, the partition wall adjacent to the index block 2 and the processing block 3 , are located in front of the dummy substrate storage portion 7U, that is, on the side of the index block 2 . No window corresponding to the dummy substrate storage portion 7U is provided in the rear partition wall 2a and the front partition wall 3a. Therefore, the index robot 26 cannot access the dummy substrate storage unit 7U.

The configuration of the dummy substrate storage unit 7U may be substantially the same as the configuration of the dummy substrate storage unit 7L of the first processing block layer BL (see FIG. 6 ). The dummy substrate storage section 7U has a plurality of slots (in this embodiment, the same number as the number of processing units included in the second processing block layer BU) slots (hereinafter referred to as "dummy substrate slots DU1 to DU12") , the plurality of slots are stacked up and down in the manner of accommodating each dummy substrate DW in a horizontal posture. It may also be provided with a dummy substrate sensor, which is used to detect whether there is a dummy substrate DW in each of the dummy substrate slots DU1 to DU12 .

The main transport robot 8U is arranged in the transport space 52U. Main handling robot 8U package Including: a hand 81 for holding a substrate in a horizontal posture; and a hand driving mechanism 82 for driving the hand 81 . The hand driving mechanism 82 includes two pillars 83 , a vertical movement part 84 , a horizontal movement part 85 , a rotation part 86 and an advancing and retreating part 87 . These configurations are the same as those of the main transfer robot 8L of the first processing block layer BL. The main transfer robot 8U is configured to be able to access the substrate placement unit 6U, the processing units 11U to 43U, and the dummy substrate storage unit 7U. The main transfer robot 8U is an example of the second transfer unit for transferring the substrate W between the substrate mounting portion 6U and the processing units 11U to 43U and for transferring the dummy substrate DW between the dummy substrate storage portion 7U and the processing units 11U to 43U. .

The first processing block layer BL and the second processing block layer BU are partitioned by the intermediate partition wall 16 , and the product substrate W or the dummy substrate DW cannot be transported across the intermediate partition wall 16 . In other words, the main transfer robot 8L of the first processing block layer BL is configured so that none of the processing units 11U to 43U, the dummy substrate storage portion 7U, and the substrate mounting portion 6U of the second processing block layer BU can be accessed. Similarly, the main transfer robot 8U of the second processing block layer BU is configured such that none of the processing units 11L to 43L, the dummy substrate storage portion 7L, and the substrate mounting portion 6L of the first processing block layer BL can access.

The first liquid supply unit 91 to the fourth liquid supply unit 94 define a liquid piping space, and the liquid piping space accommodates a group of piping for supplying processing liquid used in the processing units 11L to 43L, 11U to 43U. The liquid piping space partitioned by each of the first liquid supply part 91 to the fourth liquid supply part 94 penetrates the first processing block layer BL and the second processing block layer BU in the vertical direction Z. Each of the first liquid supply part 91 to the fourth liquid supply part 94 accommodates the processing liquid piping 56, and the processing liquid piping 56 is stacked in six stages at the same position in the vertical direction Z in a plan view to form the first tower T1 to the second tower T1. Six processing units of four towers T4 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U, 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L, 43L, 41U, 42U, and 43U supply processing liquid. The first liquid supply part 91 to the fourth liquid supply part 94 can also be further accommodated together. Liquid-related equipment and processing liquid-related equipment are valve groups, flow meters, tanks for temporarily storing processing liquid, pumps for transporting liquid, etc. installed in the middle of the piping.

The first exhaust section 101 to the fourth exhaust section 104 define an exhaust piping space, and the exhaust piping space accommodates a group of piping for exhausting the atmosphere inside the processing unit. The exhaust piping space partitioned by each of the first exhaust part 101 to the fourth exhaust part 104 penetrates the first processing block layer BL and the second processing block layer BU in the vertical direction Z. Each of the first exhaust section 101 to the fourth exhaust section 104 accommodates exhaust pipes 76, and the exhaust pipes 76 are used to form the first tower by stacking six sections from the same position in the vertical direction Z in a plan view. Six processing units 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U, 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L from T1 to the fourth tower T4 , 43L, 41U, 42U, and 43U are guided to exhaust equipment outside the substrate processing apparatus 1 . A switching mechanism 77 can also be further accommodated in the first exhaust part 101 to the fourth exhaust part 104, and the switching mechanism 77 is configured according to the type of processing in the processing unit (more specifically, the type of processing liquid). The exhaust piping 76 is switched. Although not shown, the first exhaust unit 101 includes an actuator group for driving the switching mechanism 77 .

The carrier transport mechanism 300 (see FIG. 1 ) operates in such a manner that the carrier C containing the unprocessed product substrate W is carried into the carrier holding part 25, and the carrier C containing the processed product substrate W is moved into the carrier holding part 25. Take out from the carrier holding part 25. In addition, the carrier transport mechanism 300 is operated so that the supply dummy carrier DC storing the unused dummy substrate DW is carried into the carrier holding part 25, and the unused dummy substrate DW is transferred from the supply dummy carrier DC to the carrier holding part 25. After the dummy carrier DC is removed, the dummy carrier DC is carried out from the carrier holding part 25 . Furthermore, the carrier transport mechanism 300 is operated in such a manner that the dummy carrier DC for recovering the used dummy substrate DW is loaded into the carrier holding unit 25 and stored in the used dummy substrate DW. To the dummy bearer for this recovery After loading the dummy carrier DC, the dummy carrier DC for recovery is carried out from the carrier holding unit 25 . The dummy carrier DC may have substantially the same configuration as the carrier C for the product substrate W.

Typically, the carrier transport mechanism 300 includes an overhead traveling unmanned transport tool (OHT: Overhead Hoist Transport; overhead transport device). The carrier transfer mechanism 300 transfers the carrier C between the carrier placement place 350 and the carrier holding part 25 (loading port). In addition, the carrier transport mechanism 300 transports the dummy carrier DC between the dummy carrier placement place 351 and the carrier holding part 25 .

The carrier transport mechanism 300 is controlled by the host computer 150 to transport the carrier C and the dummy carrier DC. The host computer 150 is communicably connected to the controller 110 of the substrate processing apparatus 1 via the communication line 170 .

The controller 110 controls the index robot 26 and the main transfer robots 8L and 8U to transfer the substrate W and the dummy substrate DW. In addition, the controller 110 controls each part of the processing units 11L to 43L, 11U to 43U to execute the substrate processing in the processing units 11L to 43L, 11U to 43U and the dummy processing using the dummy substrate DW.

FIG. 7 is a schematic cross-sectional view for explaining a configuration example of the processing units 11L to 43L, 11U to 43U (hereinafter collectively referred to as “processing units 11L to 43U”). The processing units 11L to 43U include: a unit partition 36 forming a processing chamber 35 (chamber); a processing cup 39 disposed in the unit partition 36; a spin chuck 40 forming a processing chamber 35 (chamber); It is arranged in the processing cover 39 ; and the nozzle 55 supplies the processing liquid to the substrate W or the dummy substrate DW held by the rotary jig 40 .

The cell partition wall 36 includes: a side wall 36a, which is, for example, substantially rectangular in plan view; a top wall 36b, which is above the section; and a bottom wall 36c, which is below the section. One side of the side wall 36a has a substrate loading and unloading port 37 facing the transportation space 52U and extending along the first horizontal direction X and the vertical direction Z for loading and unloading the substrate W and the dummy substrate DW. The substrate loading and unloading port 37 may also have The slot shape extending in the first horizontal direction X. A shutter 38 for opening and closing the substrate loading and unloading port 37 is arranged. The substrate W and the dummy substrate DW are carried in from the substrate carry-in/out port 37 formed in the cell partition wall 36 and transferred to the rotation jig 40 .

The spin fixture 40 includes: a spin base (spin base) 45, which holds a substrate W or a dummy substrate DW in a horizontal posture; and a spin motor (spin motor) 46, which makes the spin base 45 rotate around a vertical rotation axis. . The autorotation jig 40 can also be a vacuum type jig, which is used to absorb and hold the lower surface of the substrate W or the dummy substrate DW on the upper surface of the autorotation base 45 . In addition, the rotation base 45 may also constitute a mechanical jig, which has a circular planar shape corresponding to the substrate W or the dummy substrate DW, and is provided with three or more holding pins arranged at intervals in the circumferential direction of the peripheral portion. , the substrate W or the dummy substrate DW is held by these holding pins.

The processing units 11L to 43U include one or more nozzles 55 , and supply the processing liquid to the substrate W or the dummy substrate DW held by the rotary chuck 40 . In this embodiment, a plurality of nozzles 55 are provided. The plurality of nozzles 55 may also include: a plurality of chemical liquid nozzles, which are used to spray a plurality of types of chemical liquids respectively.

The processing liquid is supplied from the nozzle 55 to the surface of the rotating substrate W or the dummy substrate DW held by the rotation chuck 40 . The nozzle 55 is connected to the processing liquid pipe 56 arranged through the first liquid supply part 91 to the fourth liquid supply part 94 . The processing liquid pipe 56 is looped through the first liquid supply part 91 to the fourth liquid supply part 94 and connected to the processing liquid supply source 54 . A valve 59 for opening and closing the flow path of the processing liquid piping 56 is interposed in the middle of the processing liquid piping 56 . In addition, a pump 60 for sending the processing liquid toward the nozzle 55 is interposed in the middle of the processing liquid piping 56 . The valve 59 and the pump 60 are arranged in the first liquid supply part 91 to the fourth liquid supply part 94 . The processing liquid supply source 54 supplies chemical liquid such as etching liquid or cleaning liquid such as pure water (deionized water). A plurality of treatment liquid piping 56 and a plurality of corresponding spray nozzles may also be provided in response to the type of treatment liquid. Mouth 55. Some or all of the plurality of nozzles 55 may have the form of a moving nozzle that moves above the substrate W or the dummy substrate DW along the upper surface of the substrate W or the dummy substrate DW. The moving nozzle may also have a structure (refer to FIG. 1 ) in which a base end of a horizontal nozzle arm 57 is supported by a swing shaft 58 disposed on the side of the rotation jig 40 so that the swing shaft 58 rotates around a vertical axis. Some or all of the plurality of nozzles 55 may be fixed nozzles whose relative positions with respect to the rotary jig 40 do not change.

The atmosphere in the unit partition wall 36 is exhausted through the exhaust connection pipe 75 penetrating the unit partition wall 36 . The exhaust connection pipe 75 is connected to the exhaust pipes 76 arranged in the first exhaust section 101 to the fourth exhaust section 104 . The exhaust connection pipe 75 may be connected to a plurality of exhaust pipes 76 via a switching mechanism 77 . The switching mechanism 77 is operated in the following manner: For example, in response to the type of processing liquid (such as the type of chemical liquid) ejected from the plurality of nozzles 55, the exhaust from the exhaust connection pipe 75 is guided to the area assigned in advance corresponding to the processing. Exhaust piping 76 for the type of liquid.

FIG. 8 is a block diagram for explaining the structure related to the control of the substrate processing apparatus 1 . The substrate processing apparatus 1 includes a controller 110 . The controller 110 may also be a computer including a processor 111 (CPU (Central Processing Unit; Central Processing Unit)) and a memory 112 (memory unit). The processor 111 executes the program 120 stored in the memory 112 . Thus, the controller 110 has a function as a schedule creation unit and a function as a transport control unit; the schedule creation unit creates a transport schedule for use by the index robot 26 and the main transport robot 8L and 8U transport the substrate W or the dummy substrate DW; the transport control unit controls the transport of the substrate W and the dummy substrate DW based on the transport schedule created by the schedule creation unit. Furthermore, the controller 110 has a function as a substrate processing control unit, and the substrate processing control unit implements a substrate processing operation in which the substrate W is processed by the processing units 11L to 43U. The controller 110 further has a function as a simulation processing control unit, and the simulation processing control unit The control unit realizes a simulation processing operation that executes simulation processing using the dummy substrate DW in the processing units 11L to 43U. For these substrate transport operations, substrate processing operations, and simulation processing operations, the controller 110 controls various control objects included in the substrate processing apparatus 1 . The controlled objects include driving units included in the index robot 26 , the main transfer robots 8L and 8U, and the processing units 11L to 43U. Moreover, the control object of the controller 110 includes: the actuator group, which is arranged in the first exhaust part 101 to the fourth exhaust part 104, and includes the actuator group arranged in the first liquid supply part 91 to the fourth liquid supply part. 94 valve 95 and pump 60.

Various data 130 are stored in the memory 112 . The data 130 includes: a products recipe (products recipe) 131 for processing the substrate W for products; and a dummy processing recipe 132 for dummy processing using the dummy substrate DW. The product recipe 131 is data for specifying the transport operation of the substrate W and the processing content of the substrate W. The simulation processing recipe 132 is data for specifying the transfer operation of the dummy board DW and the content of processing using the dummy board DW. The controller 110 controls the control object according to the product recipe 131 when processing the substrate W; and controls the control object according to the simulation processing recipe 132 when executing the simulation process.

Product recipe 131 may also be assigned and stored in memory 112 by data communication from host computer 150 communicatively connected to controller 110 . The simulation processing recipe 132 can also be given and stored in the memory 112 through data communication from the host computer 150 in the same way. In addition, these product recipes 131 and simulation processing recipes 132 can also be input or edited by the operator using the user interface 140 connected to the controller 110 . The simulation processing recipe 132 can also be automatically generated by the controller 110 according to the contents of the product recipe 131 . The product recipe 131 and the simulation processing recipe 132 do not need to be of the same type, and a plurality of product recipes 131 or a plurality of simulation processing recipes 132 can also be stored in the memory 112 .

For example, the simulation processing prescription 132 includes: a preprocessing prescription, which specifies preprocessing, In this pretreatment, the same treatment as that of the substrate W for the product is performed on the dummy substrate DW. The preprocessing recipe may be a recipe for replacing substrates carried into the processing units 11L to 43U from the substrates W for products with dummy substrates DW in the product recipe 131 . Such a pretreatment recipe can also be automatically generated by the controller 110 based on the product recipe 131 . For example, in the case of performing a process for supplying a high-temperature processing liquid to the substrate W, by performing pre-processing, the high-temperature processing liquid can be guided to the nozzle 55, and the processing liquid piping can be heated by the high-temperature processing liquid. 56 and the interior of the processing units 11L to 43U. Thereby, the processing liquid at an appropriate temperature can be supplied to the substrate W for a product in an environment with appropriate temperature control. In this way, the pre-processing is an example of pre-processing, and the processing environments of the processing units 11L to 43U are adjusted in order to properly process the substrate W for products.

Furthermore, the dummy processing recipe 132 includes a unit cleaning recipe for cleaning the inside of the processing units 11L to 43U while holding the dummy substrate DW in the rotary jig 40 . In the unit cleaning process according to the unit cleaning recipe, the dummy substrate DW is held and rotated by the rotary jig 40 , and a cleaning solution (chemical solution or pure water) is supplied to the dummy substrate DW in this state. Thereby, the cleaning solution subjected to the centrifugal force on the dummy substrate DW is scattered around the rotation jig 40 to clean the inside of the processing cover 39 . Since the injection position of the cleaning liquid with respect to the inner wall surface of the processing cover 39 is vertically changed by moving the processing cover 39 up and down as required, the inner wall surface of the processing cover 39 can be cleaned efficiently. In addition, the dummy substrate DW can be arranged above the upper end of the processing cover 39 by the vertical movement of the processing cover 39 or the vertical movement of the rotation jig 40, and the cleaning solution can be supplied to the inside of the processing chamber 35 outside the processing cover 39. , thereby cleaning the inside of the processing chamber 35.

The data 130 stored in the memory 112 further includes: a dummy board table 133 , which associates a plurality of processing units 11L to 43U with the dummy board slots DL1 to DL12 and DU1 to DU12 of the dummy board storage parts 7L and 7U. In multiple dummy base slots DL1 to DL12, DU1 to DU12 Each is accompanied by a unique dummy board slot number (dummy board slot identification information). Also, a corresponding one of the dummy board slot numbers is assigned to each of the processing units 11L to 43U. The dummy substrate table 133 is a list of a plurality (12 in this embodiment) of the processing units 11L to 43U of the first processing block layer BL and a plurality of ( In the present embodiment, there are 12) dummy substrate slot numbers are assigned one-to-one correspondence. In addition, the dummy substrate table 133 is a combination of a plurality of (12 in this embodiment) processing units 11L to 43U of the second processing block layer BU and a plurality of dummy substrate storage parts 7U of the second processing block layer BU. Each (12 in the present embodiment) dummy substrate slot numbers are assigned a one-to-one correspondence. Therefore, the dummy substrate table 133 is a list of a plurality of (24 in this embodiment) processing units 11L to 43U included in the substrate processing apparatus 1 and a plurality of dummy substrate storage units 7L and 7U (in this embodiment, 24) Slot numbers are given one-to-one correspondence.

The data 130 stored in the memory 112 further includes simulated substrate history data 134 . The dummy board history data 134 includes data (usage history information) for indicating the usage history of the dummy board DW, which is accommodated to correspond to a plurality of dummy board slot numbers of the dummy board storage parts 7L and 7U, respectively. Dummy baseboard slots DL1 to DL12, DU1 to DU12. Preferably, the usage history includes the number of times (cumulative times) when the dummy substrate DW is used in the processing of the processing units 11L to 43U, the usage time (cumulative time) of the dummy substrate DW being used in the processing of the processing units 11L to 43U, and the simulation At least one of the histories of the processing contents received by the substrate DW in the processing units 11L to 43U.

The data 130 stored in the memory 112 further includes: unit usage history data 135 , which represents the unit usage history of each processing unit 11L to 43U. Preferably, the unit use history data 135 includes the number of substrates processed by each processing unit 11L to 43U and the non-use duration, which represents the continuous time that each processing unit 11L to 43U is not used for substrate processing. Since the internal environment of the processing units 11L to 43U will gradually deteriorate due to repeated substrate processing, Therefore, it is preferable to set an appropriate upper limit on the number of substrates that can be processed continuously without maintenance. In addition, when the time for which the substrate W is not processed becomes longer, the environment inside the processing units 11L to 43U gradually deteriorates. Specifically, the chemical solution adhering to the inner wall of the processing cover 39 or the like dries and crystallizes to cause particles. Also, in the case of using a treatment liquid whose temperature is higher than room temperature, if the flow of the treatment liquid is blocked for a long time due to the continuation of non-use, the temperature of the treatment liquid pipe 56 or the nozzle 55 will drop. Therefore, when the processing liquid is discharged next time, the heat of the processing liquid is taken away by the processing liquid pipe 56 or the nozzle 55, and the temperature of the processing liquid just discharged may become inappropriate. Therefore, it is preferable to set an appropriate upper limit also for the non-use duration. Comparing the unit use history data 135 (the number of substrates processed, the non-use duration, etc.) with the corresponding set values, it can be determined whether the processing units 11L to 43U need to be maintained.

The data 130 stored in the memory 112 further includes: a first state 141 representing the state of the first processing block layer BL (first processing unit group); and a second state 142 representing the second processing block layer Status of the BU (second processing unit group). The first state 141 includes a first disabled mode and a first enabled mode. Likewise, the second state 142 includes a second disabled mode and a second enabled mode.

When the first state 141 is the first prohibition mode, the processing of the substrate W and the simulation processing cannot be performed in the processing units 11L to 43L included in the first processing block layer BL. More precisely, the processing of the substrate W and the simulation processing cannot be restarted. In this embodiment, the start of the processing of the substrate W means that the substrates to be processed in the processing units 11L to 43L are carried out (discharged) from the carrier C, and the start of the dummy processing means that the substrates are loaded from the first dummy substrate storage unit 7L. The dummy substrates DW used in the dummy processing of the processing units 11L to 43L are carried out (discharged). When the first state 141 is the first permission mode, the processing and simulation processing of the substrate W in the processing units 11L to 43L included in the first processing block layer BL are both permitted and restarted.

When the second state 142 is the second prohibition mode, the processing of the substrate W and the simulation processing cannot be performed in the processing units 11U to 43U included in the second processing block layer BU. More precisely, the processing of the substrate W and the simulation processing cannot be restarted. In this embodiment, the start of the processing of the substrate W refers to the unloading (discharging) of the substrates to be processed in the processing units 11U to 43U from the carrier C, and the start of the dummy processing refers to the process from the second dummy substrate storage unit 7U. The dummy substrates DW used in the dummy processing of the processing units 11U to 43U are carried out (discharged). When the second state 142 is the second permission mode, the processing and simulation processing of the substrate W in the processing units 11U to 43U contained in the second processing block layer BU are both allowed and restarted.

The controller 110 has a function as a state setting unit, which judges based on the dummy board history data 134 whether it is necessary to replace the dummy boards DW stored in the dummy board storage parts 7L, 7U, and sets the first DW based on this judgment. state 141 and a second state 142 .

FIG. 9 is a flowchart for explaining the operation of the controller 110 related to the simulation process. The controller 110 executes the process of FIG. 9 in parallel or sequentially for each of the plurality of processing units 11L to 43U.

The controller 110 judges whether or not the processing of the substrate W for a product is performed in the target processing units 11L to 43U (step A1 ). When the processing of the substrate W in the processing units 11L to 43U is completed and the processed substrate W is carried out from the processing units 11L to 43U (step A1: No), the controller 110 refers to the unit use history of the processing units 11L to 43U Data 135 to determine whether the number of substrates processed has reached the set value (step A2). When the number of substrates to be processed is equal to or greater than the set value (step A2: Yes), the controller 110 judges that the unit cleaning execution condition (an example of the maintenance execution condition) is sufficient, and follows to clean the inside of the processing units 11L to 43U. The unit cleaning recipe executes unit cleaning processing (an example of maintenance processing) (step A3). In addition, the controller 110 resets the number of substrates processed by the processing unit to an initial value (for example, zero) and updates the unit use history data 135 (step A4 ).

The unit cleaning process is an example of a simulation process, and includes a transfer schedule creation step A30, a dummy board loading step A31, a dummy processing step A32, and a dummy board storage step A33. The transportation schedule creation step A30 is a step for creating a transportation plan (transportation schedule) for simulation processing. The dummy substrate loading step A31 is a step of controlling the main transport robots 8L and 8U according to the created transport schedule. Thereby, the main transfer robots 8L, 8U unload the dummy substrate DW from the corresponding dummy substrate slots DL1 to DL12 , DU1 to DU12 , and carry it toward and into the processing units 11L to 43U. The dummy processing step A32 is a step for executing processing using the dummy substrate DW in the processing unit, and here is cleaning processing inside the processing unit. Dummy substrate storage step A33 is the following step: after cleaning the inside of the processing unit, the dummy substrate DW is carried out from the processing unit according to the transport schedule, and transported and stored in the original dummy substrate slots DL1 to DL12, DU1 to DU12 . The controller 110 refers to the dummy board table 133 to specify the dummy board slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and creates a transfer schedule for the dummy board loading step A31 and the dummy board receiving step A33 .

When the unit cleaning process is finished, the controller 110 judges whether pre-processing for adjusting the processing environment (processing conditions) of the processing units 11L to 43U is necessary (steps A5, A6). Specifically, the controller 110 checks whether or not a processing request (processing reservation) for a product substrate has been given from the host computer 150 (step A5). When given a processing request for a product substrate (step A5: Yes), the controller 110 judges whether the non-use duration of the processing units 11L to 43U has reached a set value (step A6). In the case where the non-use duration is more than the set value (step A6: Yes), that is, in the case where the processing units 11L to 43U have not been used for a substrate W for a product for a predetermined long time, the controller 110 determines that Preprocessing is required, that is, it is determined that the preprocessing execution condition (an example of maintenance execution condition) is sufficient.

When it is judged that pretreatment is required, the controller 110 executes the pretreatment according to the pretreatment prescription. processing (preprocessing step A7). Specifically, the controller 110 refers to the dummy board table 133 to specify the dummy board slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and accordingly creates a transfer schedule for preprocessing (transfer schedule program making step A70). Furthermore, the controller 110 controls the main transport robots 8L and 8U to carry out the dummy substrate DW from the specified dummy substrate slots according to the created transfer schedule, and transfers the dummy substrate DW to the processing units 11L to 43U (simulation Substrate loading step A71). After the transfer of the dummy substrate DW, the host computer 150 executes the same processing as that for the substrate W for a product on the dummy substrate DW in the processing units 11L to 43U (simulation processing step A72 ). When the processing ends, the host computer 150 controls the main transfer robots 8L and 8U according to the transfer schedule, takes out the dummy substrate DW from the processing units 11L to 43U, and transfers it to the original dummy substrate slot, so that the dummy substrate DW is stored. to the dummy board slot (dummy board accommodation step A73). Thus, when performing the preprocessing, the controller 110 resets the non-use duration to an initial value (for example, zero) and updates the unit usage history data 135 (step A8 ).

As described above, the controller 110 executes the pre-processing when a processing request (processing reservation) is given to the product substrate W. The preprocessing includes conveyance of the dummy substrate DW (dummy substrate loading step A71 ) and simulation processing using the dummy substrate DW (simulation processing step A72 ). Therefore, preprocessing (simulation substrate loading step A71 and/or simulation processing step A72) is performed in parallel with the substrate loading operation (product substrate loading step A20) or preprocessing (simulation processing step A72) is performed before the substrate loading operation (product substrate loading step A20). Substrate loading step A71 and/or simulation processing step A72); the substrate loading operation (product substrate loading step A20) is to hold the carrier C containing the product substrate W in the carrier holding part 25, and the indexing robot 26 is loaded from the carrier C The substrate W to be processed is taken out and conveyed toward the substrate placement parts 6L, 6U. At this time, the index robot 26 does not participate in the conveyance of the dummy substrate DW. Therefore, the transfer of the product substrate W by the index robot 26 is not hindered, and the dummy substrate DW can be transferred inside the processing block 3 and Perform preprocessing.

In addition, although the product substrate carrying-in step A20 performed by the index robot 26 is shown in FIG. 9 for convenience of description, it does not mean that the front-rear relationship with the preprocessing step A7 is as shown in the figure. The product substrate carrying-in step A20 can also be performed (started) before the preprocessing step A7 or in parallel with the preprocessing step A7, and the product substrate carrying-in step A20 can also be performed (started) after the preprocessing step A7 as described above.

The preprocessing recipe prescribes the preprocessing which performs the processing corresponding to the substrate W for a product on the dummy substrate DW. Therefore, preprocessing is performed on the dummy substrate DW, whereby the dummy substrate DW is consumed. Specifically, the dummy substrate DW is pretreated with a chemical solution having an etching effect, whereby the surface of the dummy substrate DW is etched and the thickness of the dummy substrate DW is reduced. Therefore, when executing the preprocessing recipe, the controller 110 updates the dummy board history data 134 assigned to the dummy board slots DL1-DL12, DU1-DU12 corresponding to the processing units 11L-43U (step A9). For example, in the case that the simulated substrate history data 134 includes the use count data, the use count data is incremented.

When the preprocessing is finished, the controller 110 performs control according to the product prescription (step A12). Specifically, the controller 110 creates a transfer schedule for product substrate processing (transfer schedule creating step A120 ), and controls the index robot 26 and the main transfer robots 8L and 8U according to the transfer schedule. Thereby, the index robot 26 takes out the product substrate W from the carrier C, and mounts it on the substrate placement parts 6L, 6U. Next, the main transfer robots 8L, 8U take out the substrate W from the substrate placement parts 6L, 6U, and transfer it to the processing units 11L to 43U (substrate carrying-in step A121 ). Next, processing using a processing liquid (chemical liquid, cleaning liquid, etc.) is performed on the substrate W in the processing units 11L to 43U (processing step A122 ). After completion, according to the transport schedule, the main transport robots 8L and 8U take out the processed substrates W and transport them to the substrate placement parts 6L and 6U, and The lead robot 26 stores the processed substrate W in the carrier C (substrate storage step A123 ). When there is an unprocessed substrate W (in the case of continuous processing of a plurality of substrates W) (step A13: Yes), the same operation is repeated. During this period, when the number of substrates processed by the processing unit reaches the set value (step A14: Yes), return to step A3 and perform unit cleaning. In the case of not continuous processing (step A13: NO), return to and repeat the processing starting from step A1.

If there is no processing request (processing reservation) from the host computer 150 (step A5: No), then the controller 110 judges whether the duration of the standby state, that is, the non-use duration has reached the set value (step A15). If the non-use duration does not reach the set value, it will enter the standby state. When the non-use duration reaches the set value (step A15: Yes), the controller 110 executes a preset maintenance process (step A16). The maintenance treatment may also be unit cleaning treatment. As in the case of step A3, the unit cleaning process may be a process using the dummy substrate DW (a type of dummy process), or may be a process not using the dummy substrate DW. In addition, the maintenance processing may be similar to the pre-processing. In addition, maintenance processing may be other processing. The maintenance process is mainly a process for maintaining the environment in the processing chamber 35 of the processing units 11L to 43U in a state suitable for processing the substrate W for products, and may be a process previously set by the user of the substrate processing apparatus 1 . In the case where the simulation process using the dummy substrate DW is performed as the maintenance process, the maintenance process includes: a transport schedule creation step A160 of creating a transport plan (transport schedule) for the maintenance process; and a step A161 of following this The handling plan is to take out the dummy substrate DW from the corresponding dummy substrate slot and move it into the processing unit; step A162 is to perform simulation processing using the dummy substrate DW in the processing unit; and step A163 is to perform after the processing of step A162 , according to the transport schedule, the dummy substrate DW is accommodated in the corresponding dummy substrate slot.

When there is no processing request (processing reservation) from the host computer 150, the controller 110 cannot automatically plan the same preprocessing as the product prescription 131. Therefore, it is better to perform the Maintenance processing is performed (step A16), and when there is a processing request (processing reservation) from the host computer 150, preprocessing corresponding to the product processing is executed (preprocessing step A7).

The dummy substrate DW is introduced into the inside of the substrate processing apparatus 1 in advance and accommodated in the dummy substrate storage parts 7L, 7U. Specifically, the supply dummy carrier DC containing the dummy substrate DW is transferred to the carrier holding unit 25 by, for example, a carrier transport mechanism 300 (see FIG. 1 ) provided in the factory. The index robot 26 takes out the dummy substrate DW from the dummy carrier DC for supply, and conveys it to the substrate mounting parts 6L, 6U. The main transport robot 8L of the first processing block layer BL transports and stores the dummy substrate DW from the substrate loading unit 6L to the dummy substrate storage unit 7L. The main transport robot 8U of the second processing block layer BU transports and accommodates the dummy substrate DW from the substrate mounting portion 6U to the dummy substrate storage portion 7U. The controller 110 creates a transfer schedule for importing the dummy substrate DW, and controls the index robot 26 and the main transfer robots 8L, 8U according to the transfer schedule, thereby achieving the transfer operation described above.

When a new dummy board DW is imported and accommodated in the dummy board storage parts 7L, 7U, the controller 110 resets the dummy board history data 134 corresponding to the dummy board slot in which the new dummy board DW is housed. initial value.

When the dummy substrate DW in the substrate processing apparatus 1 is replaced, the dummy substrate DW is conveyed from the dummy substrate storage parts 7L and 7U by the main transport robots 8L and 8U and the index robot 26 to the recycling space held by the carrier holding part 25. Emulate the bearer DC. Specifically, when the dummy substrate DW to be replaced is accommodated in the dummy substrate storage section 7L of the first processing block layer BL, the main transport robot 8L transports the dummy substrate DW from the dummy substrate storage section 7L to the substrate mounting unit 7L. Department 6L. When the dummy substrate DW to be exchanged is stored in the dummy substrate storage section 7U of the second processing block layer BU, the main transfer robot 8U transports the dummy substrate DW from the dummy substrate storage section 7U to the substrate mounting section 6U. The indexing robot 26 transports and stores the dummy substrate DW placed on the substrate loading units 6L and 6U in the return area held by the carrier holding unit 25 . The accepted dummy bearer DC. When a plurality of dummy substrates DW are to be replaced, the same operation is repeated. The controller 110 creates a transfer schedule for replacing (discharging) the dummy substrate DW, and controls the index robot 26 and the main transfer robots 8L and 8U according to the transfer schedule, thereby achieving the transfer operation described above.

FIG. 10 is a flow chart illustrating an example of the operation of setting the first state 141 and the second state 142 and changing the transport schedule based on these settings, and shows the processing repeatedly executed by the controller 110 in a predetermined control cycle. example.

The controller 110 refers to the dummy board history data 134 to calculate a status table indicating whether the dummy board DW needs to be replaced (step S1 ). The calculation formula used to calculate the state data is stored in the memory 112 . The calculated expression may also be stored in the memory 112 in the form of a table. For example, when the number of times of use reaches a predetermined threshold, the status data becomes a value indicating that it needs to be replaced. The state table is calculated for all the dummy substrates DW stored in the dummy substrate storage units 7L and 7U. The calculation formula for calculating the state data is not necessarily common among a plurality of dummy boards DW. As described above, a plurality of dummy boards DW are assigned one-to-one correspondence to a plurality of processing units. The processing of the product substrate W and the simulation processing performed in each processing unit are not necessarily common. Therefore, calculation formulas can be individually set for each dummy substrate DW corresponding to each processing unit. That is, a plurality of calculation formulas are stored in the memory 112, and the state data is calculated using the calculation formula corresponding to each dummy board DW (that is, corresponding to each processing unit). The controller 110 can also calculate the state data and store the latest state data in the memory 112 each time each dummy substrate DW is used in the corresponding processing unit, that is, each time the dummy substrate history data 134 is updated.

The controller 110 functions as a judging unit that judges whether the dummy substrate DW needs to be replaced based on the state data. Specifically, it is judged that the first dummy substrate storage unit 7L Whether the state data of any one of the dummy substrates DW in the second dummy substrate storage part 7U is a value indicating that it needs to be replaced (step S2), and judging whether the state data of any one of the dummy substrates DW in the second dummy substrate accommodating part 7U is a value indicating that it needs to be replaced (steps S3, S4). The controller 110 further functions as a state setting unit (step S5 to step S8), and the state setting unit sets the first state 141 and the second state 142 to the first allowable mode and the second allowable mode or A first prohibition mode and a second prohibition mode. Specifically, the states of the first processing block layer BL and the second processing block layer BU corresponding to a certain dummy substrate storage portion 7L, 7U having status data indicating that a dummy substrate DW needs to be replaced are set as The first prohibition mode, the second prohibition mode. In addition, the states of the first processing block layer BL and the second processing block layer BU corresponding to the dummy substrate accommodating parts 7L and 7U whose state data of all the dummy substrates DW are not values indicating that they need to be replaced are set to the second A permission mode and a second permission mode. However, the previous value can be maintained as long as it is the same as the previous state.

More specifically, the state data of any one of the dummy substrates DW in the first dummy substrate accommodating portion 7L is a value indicating that replacement is required (step S2: Yes), and any one of the dummy substrate accommodating portions 7U in the second dummy substrate accommodating portion 7U is simulated. When the state data of the substrate DW is a value indicating that replacement is required (step S3: Yes), both the first state 141 and the second state 142 are set to the first prohibition mode and the second prohibition mode (step S5). In addition, the state data of any one of the dummy substrates DW in the first dummy substrate accommodating portion 7L is a value indicating the need for replacement (step S2: Yes), and the status data of any one of the dummy substrates DW in the second dummy substrate accommodating portion 7U State data all are not in the situation that is used to represent the value that needs to be replaced (step S3: No), first state 141 is set to the first prohibited mode and the second state 142 is set to the second allowed mode (step S6 ). Furthermore, the state data of any one of the dummy substrates DW in the first dummy substrate accommodating portion 7L is not a value indicating the need for replacement (step S2: No), and any one of the second dummy substrate accommodating portion 7U is simulated. In the case where none of the status data of the substrate DW is used to indicate the value that needs to be replaced (step S4: No), the first state 141 and the second state 142 are both set to the first allowed mode and the second allowed mode (step S7). Moreover, the state data of any one of the dummy substrates DW in the first dummy substrate accommodating portion 7L is not a value indicating the need for replacement (step S2: No), and any one of the dummy substrates in the second dummy substrate accommodating portion 7U The state data of DW is in the situation (step S4: Yes) in order to represent the value that needs to be replaced, and first state 141 is set to the first permission mode and second state 142 is set to the second prohibition mode (step S8 ).

In the case that any dummy substrate DW needs to be replaced (Yes in step S2, yes in step S3, or yes in step S4), the controller 110 sends a request to the host computer 150 to replace the dummy substrate DW. A board replacement request is simulated (step S11). The dummy board replacement request is performed by specifying the dummy board DW to be replaced, more specifically, specifying the slot in which the dummy board DW is accommodated. The controller 110 does not repeatedly send a replacement request to the host computer 150 for the dummy substrate DW that has already sent a dummy substrate replacement request, but sends a replacement request to the host computer 150 for the dummy substrate DW whose status data has changed to a value indicating that replacement is required. Simulates baseboard replacement requests. For example, it may also be configured such that when calculating the status data (step S1), the dummy board DW whose status data becomes a value indicating that replacement is required is excluded from the new calculation object until the dummy board history data 134 is reset.

In the case where the first state 141 transitions from the first enabled mode to the first disabled mode and the second state 142 is the second enabled mode (step S6), the controller 110 is discarded for transport from the carrier C to the first processing area The transfer schedule of the substrate W planned by the processing units of the block layer BL is changed to the transfer schedule for transferring the substrate W to the processing units of the second processing block layer BU (step S9 ). In addition, the controller 110 cancels the transport schedule of the dummy substrate DW planned to be transported from the first dummy substrate storage unit 7L to the processing unit of the first processing block layer BL. At this time, it is preferable that the controller 110 maintains the substrate W that has been discharged from the carrier C and the substrate W that has been discharged from the first dummy substrate storage portion 7L. The transfer schedule of the dummy substrate DW is maintained, that is, the transfer schedule of the substrate W and the dummy substrate DW that have already started processing including transfer is maintained. In this way, by transitioning from the first state 141 to the first prohibited mode, the processing and simulation processing of the substrate W of the processing unit in the first processing block layer BL are prohibited, and it is planned that the processing of the substrate W in the processing unit of the first processing block layer BL The substrate W processed by the processing unit is transported to the processing unit of the second processing block layer BU in the second allowable mode and processed.

Likewise, in the case where the second state 142 transitions from the second enabled mode to the second disabled mode and the first state 141 is the first enabled mode (step S8), the controller 110 is discarded to be transported from the carrier C to the second prohibited mode. The transfer schedule of the substrate W planned in the manner of processing the processing unit of the second processing block layer BU is changed to the transfer schedule for transferring the substrate W to the processing unit of the first processing block layer BL (step S10 ). In addition, the controller 110 cancels the transport schedule of the dummy substrate DW planned to be transported from the second dummy substrate accommodating part 7U to the processing unit of the second processing block layer BU. At this time, it is preferable that the controller 110 maintains the transport schedule of the substrates W already discharged from the carrier C and the dummy substrates DW discharged from the second dummy substrate storage section 7U, that is, maintains the process that has already started including the transfer. The transfer schedule of substrate W and dummy substrate DW. In this way, by transitioning from the second state 142 to the second prohibition mode, the processing and simulation processing of the substrate W of the processing unit in the second processing block layer BU are prohibited, and it is planned to be in the second processing block layer BU The substrate W processed by the processing unit is transported to the processing unit of the first processing block layer BL in the first allowable mode and processed.

The host computer 150 determines whether any of the carrier holding units 25 of the substrate processing apparatus 1 holds a dummy carrier DC for recovery when receiving a dummy substrate replacement request from the substrate processing apparatus 1 . If all the carrier holders 25 do not hold the dummy carrier DC for recovery, the host computer 150 plans the supply of the dummy carrier DC for recovery by the carrier transport mechanism 300, and uses the dummy carrier DC according to the plan. The carrier transport mechanism 300 operates. If any of the carrier holders 25 holds a simulation for recycling carrier DC, the host computer 150 determines whether any of the carrier holding units 25 of the substrate processing apparatus 1 holds a dummy carrier DC for supply. If all the carrier holding parts 25 do not hold the dummy carrier DC for supply, the host computer 150 plans the supply of the dummy carrier DC for supply by the carrier transfer mechanism 300, and uses the plan according to the plan. The carrier transport mechanism 300 operates.

FIG. 11 is a flow chart for explaining an example of the replacement operation of the dummy substrate executed when the first processing block layer BL or the second processing block layer BU is in the first prohibition mode or the second prohibition mode. The controller 110 of the substrate processing apparatus 1 operates in such a manner that when the dummy carrier DC for recycling is held by any one of the carrier holding parts 25 (step S21: Yes), the used dummy substrate DW is loaded into the dummy carrier DC for recycling. The simulated carrier DC (step S22). That is, the used dummy substrate DW is conveyed from the dummy substrate accommodating parts 7L and 7U to the substrate mounting parts 6L and 6U by the main transfer robots 8U and 8L, and is conveyed from the substrate mounting parts 6L and 6U by the index robot 26 and Contained in the dummy carrier DC for recovery. The controller 110 of the substrate processing apparatus 1 operates in such a manner that when the dummy carrier DC for supply is held by any one of the carrier holding sections 25 (step S23: Yes), the unused dummy substrate DW is transferred from the dummy carrier DC for supply. The dummy carrier DC is conveyed to the dummy board storage parts 7L and 7U (step S24). That is, the unused dummy substrate DW is carried by the index robot 26 from the dummy carrier DC for supply to the substrate placement parts 6L, 6U, and is carried in from the substrate placement parts 6L, 6U by the main transfer robots 8L, 8U. The dummy board storage parts 7L, 7U.

When the dummy board DW in a certain slot of the dummy board storage unit 7L, 7U is replaced with an unused dummy board DW, the dummy board corresponding to the slot (that is, corresponding to the dummy board DW accommodated in the slot) The substrate history data 134 is reset to the initial value (step S25).

The dummy board history data 134 is reset to the initial value, whereby the calculated state data (step S1 of FIG. 10 ) of the dummy board DW for the slot becomes a value that does not indicate the need for replacement. Next, when the state data of any one of the dummy substrates DW in the first dummy substrate accommodating portion 7L is not When indicating the value that needs to be replaced (step S2: No), the first state 141 is set to the first permission mode (steps S7, S8). Similarly, when the state data of any one of the dummy substrates DW in the second dummy substrate accommodating portion 7U is not a value indicating that it needs to be replaced (step S3: No; step S4: No), the second state 142 is set Set to the second permission mode (steps S6, S7).

FIG. 12A is used to illustrate the substrate handling operation in the case where both the first state 141 of the first processing block layer BL and the second state 142 of the second processing block layer BU are both the first allowable mode and the second allowable mode. Timing diagram of an example of . The index robot 26 takes out the substrate W1 from one of the carriers C held by the carrier holding unit 25 and places the taken out substrate W1 on the substrate loading unit 6L of the first processing block layer BL. The substrate W1 is taken out by the main transfer robot 8L and carried into one processing unit L1 among the processing units 11L to 43L in the first processing block layer BL. When the processing of the processing unit L1 is completed, the main transfer robot 8L takes out the processed substrate W1 and places it on the substrate mounting unit 6L. The index robot 26 takes out the processed substrate W1 from the substrate mounting unit 6L and carries it into one of the carriers C held by the carrier holding unit 25 .

In addition, the index robot 26 takes out another substrate W2 from one of the carriers C held by the carrier holding unit 25 and places the taken-out substrate W2 on the substrate loading unit of the second processing block layer BU. 6U. The substrate W2 is taken out by the main transport robot 8U and carried into one processing unit U1 among the processing units 11U to 43U in the second processing block layer BU. When the processing of the processing unit U1 is completed, the main transfer robot 8U takes out the processed substrate W2 and places it on the substrate mounting unit 6U. The index robot 26 takes out the processed substrate W2 from the substrate mounting unit 6U and carries it into one of the carriers C held by the carrier holding unit 25 .

Similarly, the next substrate W3 is carried into and processed in one processing unit L2 among the processing units 11L to 43L included in the first processing block layer BL. In addition, the next board W4 series was moved It is transported to one processing unit U2 among the processing units 11U to 43U included in the second processing block layer BU and processed.

In this way, the processing of the product substrate W is performed in parallel on both the first processing block layer BL and the second processing block layer BU.

When both the first processing block layer BL and the second processing block layer BU are in the first allowable mode and the second allowable mode, the controller 110 creates a transfer schedule for the transfer action described above, and follows the transfer schedule. The index robot 26 and the main transfer robots 8L, 8U are controlled by scheduling.

FIG. 12B is a timing chart for explaining an example of a substrate transfer operation when the state of one processing block transitions from the first enabled mode to the first disabled mode or from the second enabled mode to the second disabled mode. In this example, it is assumed that the first state 141 corresponding to the first processing block layer BL is maintained in the first enabled mode and the second state 142 corresponding to the second processing block layer BU transitions from the second enabled mode to the first enabled mode. 2. Circumstances of prohibited mode. Furthermore, it is assumed that a transport schedule as shown in FIG. 12A is created, and the substrate W is transported and processed according to the transport schedule.

Assume that at time t1 after the substrate W2 is taken out of the carrier C by the indexing robot 26 and before the substrate W4 is taken out of the carrier C by the indexing robot 26, it becomes necessary to replace the dummy substrate DW in the second processing block layer BU . Therefore, at time t1, the second state 142 corresponding to the second processing block layer BU is transitioned from the second enabled mode to the second disabled mode.

In this case, the controller 110 discards the existing transfer schedule (see FIG. 12A ) related to the substrate W that has not been taken out from the carrier C at time t1, and changes it to the transfer schedule shown in FIG. 12B as an example. Procedure. In particular, the transfer schedule planned so as not to be discharged from the carrier C at time t1 and transferred to the second processing block layer BU whose state has become the second prohibition mode is discarded.

At time t1, the substrate W2 has already been unloaded from the carrier C, and the conveyance is started. therefore, The substrate W2 is transported according to the existing transport schedule and carried into a processing unit U1 in the second processing block layer BU in the second prohibition mode to be processed, and the processed substrate W2 is carried out from the processing unit U1 and transported to carrier C. That is, the board|substrate W2 is conveyed similarly to the case of FIG. 12A.

Although the substrate W3 is discharged from the carrier C after the time t1, since the processing of the first processing block layer BL in the first allowable mode is planned, the transfer schedule is maintained and processed in the same manner as in the case of FIG. 12A transport.

On the other hand, in the existing transport schedule (see FIG. 12A ), although it is planned that the substrate W4 is transported to a processing unit U2 of the second processing block layer BU, this plan is discarded. Furthermore, the controller 110 creates a transfer schedule for transferring the substrate W4 to one processing unit L3 among the processing units 11L to 43L included in the first processing block layer BL in the first allowable mode, and follows the transfer schedule. The program controls the index robot 26 and the main transfer robot 8L. Specifically, the index robot 26 takes out the substrate W4 from the carrier C and places it on the substrate placement portion 6L of the first processing block layer BL. The substrate W4 is taken out by the main transfer robot 8L and carried into one processing unit U3 in the first processing block layer BL. When the processing of the processing unit U3 is finished, the main transfer robot 8L takes out the processed substrate W4 and places it on the substrate mounting unit 6L. The index robot 26 takes out the processed substrate W4 from the substrate mounting unit 6L and carries it into one of the carriers C held by the carrier holding unit 25 .

In the existing transport schedule (refer to FIG. 12A ), the substrate W after the processing unit U2 that is planned to move to the second processing block layer BU is also transported to the first processing area of the first allowable mode. The processing units of the block layer BL are processed in parallel.

On the other hand, the controller 110 creates a transfer schedule for planning the replacement of the dummy substrate DW for the second processing block layer BU in the second prohibition mode, and controls the main transfer robot 8U and the indexing robot 8U according to the transfer schedule. Robot 26 (refer to FIG. 11 ). In this way, the dummy board replacement described below is performed. held in the carrier When the part 25 holds the dummy carrier DC for collecting the used dummy substrate DW, the main transfer robot 8U in the second processing block floor BU takes out the used dummy substrate DW to be replaced from the dummy substrate storage part 7U. The dummy substrate DW is placed on the substrate mounting portion 6U. The index robot 26 takes out the used dummy substrate DW from the substrate loading unit 6U, and carries it into the dummy carrier DC for recycling. In addition, in the case where the carrier holder 25 holds a supply dummy carrier DC accommodating an unused dummy substrate DW, the index robot 26 takes out one piece of unused dummy substrate DW from the supply dummy carrier DC. And it is mounted on the board|substrate mounting part 6U. The main transfer robot 8U takes out an unused dummy substrate DW and carries it into the dummy substrate storage unit 7U. In this manner, one dummy substrate DW in the dummy substrate storage unit 7U can be replaced. In addition, when it is necessary to replace another dummy board DW, the same operation is repeated.

In this way, the dummy substrate DW can be replaced in the second processing block layer BU in the second prohibition mode, and on the other hand, the product substrate W can be continuously processed in the first processing block layer BL in the first permission mode. .

Since the description of the action in the case of the transition of the first processing block layer BL from the first enabled mode to the first prohibited mode is made by combining the composition of the first processing block layer BL with the second processing block in the above description The configuration of the layer BU can be obtained by replacing the description, so the description is omitted.

As described above, according to the present embodiment, the processing blocks 3 adjacent to the index block 2 in the lateral direction are configured by stacking a plurality of first processing block layers BL and second processing block layers BU in the vertical direction Z. Moreover, the dummy substrate storage parts 7L and 7U for accommodating the dummy substrate DW are provided in each of the first processing block layer BL and the second processing block layer BU. Since the dummy substrate DW can be accommodated inside the first processing block layer BL and the second processing block layer BU, when a need arises to use the dummy substrate DW in the processing units 11L to 43U, the index robot 26 can be used without participation. way in the dummy board housing The dummy substrate DW is conveyed between 7L and 7U and the processing units 11L to 43U.

Therefore, since the conveyance load of the index robot 26 can be reduced, the processing using the dummy substrate DW can be performed while reducing the influence on the substrate W for a product. In particular, an indexing robot for transferring a substrate W between a plurality of first processing block layers BL, a second processing block layer BU having a plurality of processing units 11L to 43L, 11U to 43U, respectively, and a carrier holding portion 25 The handling burden of 26 is very large. Therefore, by reducing the conveyance load of the index robot 26, the conveyance efficiency of the substrate W for products is improved, and productivity can be improved accordingly. Since the main transfer robots 8L and 8U of the first processing block layer BL and the second processing block layer BU are responsible for the transportation of the substrate W in the first processing block layer BL and the second processing block layer BU, Therefore, compared with the index robot 26, the load of transportation is small. Therefore, from the viewpoint of production efficiency, it is not a big problem that the main transfer robots 8L and 8U are responsible for transferring the dummy substrate DW inside the first processing block layer BL and the second processing block layer BU.

In addition, since the dummy substrate storage parts 7L and 7U are located in the first processing block layer BL and the second processing block layer BU, the dummy substrate DW between the dummy substrate storage parts 7L and 7U and the processing units 11L to 43U The transfer system can be performed without passing through the substrate mounting parts 6L and 6U for substrate transfer between the index robot 26 and the first processing block layer BL and the second processing block layer BU. Therefore, since the interference between the conveyance of the dummy substrate DW and the conveyance of the substrate W for the product can be reduced, the conveyance efficiency of the substrate W for the product can be improved, and productivity can be improved accordingly.

Furthermore, unlike the case of Patent Document 1, the carrier holding portion 25 is not occupied for a long time by the dummy carrier DC for accommodating the dummy substrate DW. Thereby, since it is possible to suppress a standby time for carrying in the carrier C that accommodates the substrate W for a product, it is possible to contribute to an improvement in productivity.

In addition, in this embodiment, in the first processing block layer BL and the second processing block layer BU, a plurality of processing units 11L to 43L, 11U to 43U are transported along the substrate by the main transporter 8L, 8U. of W The conveyance paths 51L and 51U are arranged on both sides of the conveyance paths 51L and 51U, and are arranged in a stacked manner in the vertical direction Z. Therefore, the arrangement of the plurality of processing units 11L to 43U in the first processing block layer BL and the second processing block layer BU can be designed so that substrate transfer by the main transfer robots 8L and 8U is efficiently performed. Thereby, it can contribute to improvement of productivity.

In addition, in the present embodiment, both the substrate placement parts 6L, 6U and the dummy substrate storage parts 7L, 7U are arranged between the index robot 26 and the main transfer robots 8L, 8U. Thereby, the substrate W can be efficiently transferred between the index robot 26 and the main transfer robots 8L and 8U via the substrate mounts 6L and 6U. Furthermore, the dummy substrate storage units 7L, 7U can be arranged at positions where they do not interfere with the conveyance of the substrate W by the index robot 26 and the conveyance of the substrate W by the main conveyance robots 8L, 8U. Therefore, the dummy substrate DW can be held in the first processing block layer BL and the second processing block layer BU without affecting the conveyance of the substrate W for products.

More specifically, in the present embodiment, the dummy substrate storage parts 7L, 7U and the substrate mounting parts 6L, 6U are three-dimensionally arranged with a height shifted from each other. Thereby, the space in the first processing block layer BL and the second processing block layer BU can be effectively used, and the dummy substrate storage parts 7L and 7U can be appropriately arranged in the first processing block layer BL and the second processing block layer. Process within the block layer BU. As a result, the arrangement of the dummy substrate storage parts 7L, 7U that does not hinder the conveyance of the substrate W for products is realized.

In addition, in this embodiment, the dummy board|substrate accommodating part 7L, 7U is arrange|positioned so that it may overlap with the board|substrate mounting part 6L, 6U in planar view. Thereby, the dummy substrate accommodating parts 7L, 7U are arranged using the space above or below the substrate mounting parts 6L, 6U. Thereby, the arrangement of the dummy substrate storage parts 7L, 7U that does not hinder the conveyance of the substrate W for products can be realized, and the space in the first processing block layer BL and the second processing block layer BU can be effectively utilized for the arrangement. The dummy board storage parts 7L, 7U. As described above, the arrangement of the dummy substrate storage parts 7L, 7U overlapping with the substrate placement parts 6L, 6U in a plan view is specific and specific. In other words, a part or all of the dummy substrate DW accommodated in the dummy substrate accommodating portions 7L, 7U may be arranged to overlap the substrate W held by the substrate mounting portions 6L, 6U.

More specifically, in this embodiment, the second processing block layer BU (upper processing block layer) is stacked on the first processing block layer BL (lower processing block layer). Moreover, in the first processing block layer BL, the dummy substrate storage part 7L is located below the substrate placement part 6L. On the other hand, in the second processing block layer BU, the dummy substrate accommodating portion 7U is located below the substrate mounting portion 6U. Thereby, the height difference between the substrate mounting part 6L of the first processing block layer BL and the substrate mounting part 6U of the second processing block layer BU can be reduced. Thereby, since the board|substrate conveyance stroke of the up-down direction Z by the index robot 26 can be shortened, the conveyance load of the index robot 26 can be reduced. Therefore, the conveyance efficiency of the substrate W for products can be improved, contributing to improvement of productivity.

In addition, in this embodiment, the dummy substrate storage parts 7L and 7U of the first processing block layer BL and the second processing block layer BU include The plurality of processing units 11L to 43L, 11U to 43U have the same number of dummy substrate slots DL1 to DL12, DU1 to DU12. Furthermore, each of the dummy board slots DL1 to DL12 and DU1 to DU12 is configured to hold one dummy board DW. Thereby, the same number of dummy substrates DW as the number of processing units 11L to 43L, 11U to 43U can be held in each of the first processing block layer BL and the second processing block layer BU. Therefore, as long as there is a need to carry the dummy substrate DW into any one of the processing units 11L to 43L, 11U to 43U, the main transfer robots 8L and 8U can quickly carry the dummy substrate DW into the processing unit for simulation processing. Since the index robot 26 does not participate in the carrying-in of the dummy substrate DW, it is possible to suppress or prevent the influence on the conveyance of the substrate W for products.

Furthermore, in this embodiment, the plurality of processing units 11L to 43L, 11U to 43U of the first processing block layer BL and the second processing block layer BU and the plurality of simulation bases of the processing block layer The board slots DL1 to DL12 and DU1 to DU12 are in one-to-one correspondence. Also, the main transport robots 8L, 8U transport the dummy substrate DW between the corresponding dummy substrate slots DL1 to DL12, DU1 to DU12 and the processing units 11L to 43L, 11U to 43U. With this configuration, the dummy board DW held by the dummy board socket can be used as a dedicated dummy board for the corresponding processing unit. This makes it easy to manage the history of use of the dummy board DW.

In addition, in this embodiment, the controller 110 controls the main transfer robots 8L, 8U when the simulation processing conditions (unit cleaning execution conditions, preprocessing execution conditions, maintenance execution conditions) are sufficient, and the dummy substrate storage parts 7L, 7U The dummy substrate DW is conveyed toward the processing units 11L to 43L, 11U to 43U, and the dummy processing is executed in the processing units. In this way, since the dummy process can be started by conveying the dummy substrate DW in the first processing block layer BL and the second processing block layer BU, it is possible to quickly suppress or prevent the influence on the conveyance of the substrate W for products. to start the simulation process.

In addition, according to the present embodiment, the controller 110 controls each part of the substrate processing apparatus 1 to execute the following steps. That is, the dummy substrate loading process (steps A31, A71, A161) is executed in each of the first processing block layer BL and the second processing block layer BU, and the dummy substrate loading process (steps A31, A71, A161) is the main The transfer robots 8L, 8U carry the dummy substrate DW accommodated in the dummy substrate storage parts 7L, 7U in the processing block layer to any one of the plurality of processing units 11L to 43L, 11U to 43U in the processing block layer. By. Next, a simulation processing step (steps A32, A72, A162) of performing simulation processing using the loaded dummy substrate DW in the processing unit is executed. Furthermore, after the simulation process, the main transport robots 8L, 8U take out the dummy substrate DW from the processing unit and transport it to the dummy substrate storage parts 7L, 7U (steps A33, A73, A163). In addition, the substrate W placed on the substrate mounting parts 6L and 6U of the first processing block layer BL and the second processing block layer BU is carried into the first processing block layer BL and the second processing block layer. Layer BU complex A process of any one of the plurality of processing units 11L to 43L, 11U to 43U (step A121 ). Next, a process of processing the substrate W carried in in the processing unit is performed (step A122). Thereby, the processing using the dummy substrate DW can be performed in the processing units 11L to 43L, 11U to 43U of the first processing block layer BL and the second processing block layer BU while reducing the load on the indexing robot 26. . Thereby, production efficiency can be improved.

Under the control of the controller 110, the dummy board loading process (dummy board loading process A71) may be performed in parallel with the board loading process (product board loading process A20) or the simulation may be performed before the board loading process (product board loading process A20). Substrate carrying-in process (dummy substrate carrying-in process A71) in which the index robot 26 takes out the substrate W from the carrier C held by the carrier holding part 25 and carries it into any one of the first processing areas The block layer BL and the second processing block layer BU have substrate mounts 6L, 6U. Thereby, the substrate W for the product can be carried into the first processing block layer BL and the second processing block layer BU by the indexing robot 26, and on the other hand, it can be processed in each of the first processing block layer BL and the second processing block layer. In the block layer BU, the dummy substrate DW is carried into the processing units 11L to 43L, 11U to 43U. Since the indexing robot 26 may not participate in the loading of the dummy substrate DW, there is no need to wait for the substrate W to be transported by the indexing robot 26 or in parallel with the transporting of the substrate W by the indexing robot 26 to process the first processing block layer BL, the second The transfer of the dummy substrate DW is performed in the processing block layer BU. Therefore, the load on the index robot 26 can be reduced, and the dummy substrate DW can be quickly conveyed to the processing unit in the first processing block layer BL and the second processing block layer BU.

Furthermore, the simulation processing step (simulation processing step A72) may be executed in parallel with the substrate carrying-in step (product substrate carrying-in step A20) or the simulation may be performed before the substrate carrying-in step (product substrate carrying-in step A20) under the control of the controller 110. Processing process (simulation processing step A72), the substrate carrying process (product substrate carrying process A20) is to use the index robot 26 to carry the substrate W for the product into the substrate loading process. Set part 6L, 6U. Thereby, the conveyance load of the index robot 26 can be reduced, and the simulation process can be started rapidly in the 1st processing block layer BL, and the 2nd processing block layer BU. For example, when a substrate processing request is received from the host computer 150 , the transfer of the simulation substrate DW and the subsequent simulation processing can be started at an appropriate timing in response thereto. Thereby, since the environment in the processing units 11L to 43L, 11U to 43U can be adjusted at an appropriate time, when the carrier C containing the substrate W for the product is loaded into the carrier holding part 25, the process can be quickly started. Substrate W processing. Thereby, it contributes to improvement of productivity.

In addition, in this embodiment, the first prohibited mode and the first permitted mode, the second prohibited mode and the second permitted mode can be individually set for the first processing block layer BL and the second processing block layer BU, and these modes It is stored in the memory 112 as a first state 141 corresponding to the first processing block layer BL and a second state 142 corresponding to the second processing block layer BU. Therefore, the first processing block layer BL and the second processing block layer BU respectively become the first forbidden mode and the second forbidden mode or the first allowed mode and the second allowed mode. That is, there will be a situation where both the first processing block layer BL and the second processing block layer BU are in the first allowed mode and the second allowed mode, the first processing block layer BL and the second processing block layer BU When both are in the first prohibited mode and the second prohibited mode, one of the first processing block layer BL and the second processing block layer BU is in the first permitted mode or the second permitted mode and the other is in the first prohibited mode Or the case of the second forbidden mode.

Therefore, in this embodiment, when the first state 141, that is, the operating state of the first processing block layer BL transitions from the first allowed mode to the first prohibited mode, the change is planned in the first processing block layer Transfer schedule of substrate W for BL processing. Specifically, the transfer schedule of the substrate W planned so as to be transferred to the processing units 11L to 43L of the first processing block layer BL by the main transfer robot 8L is discarded, and newly created for carrying the substrate W into the The second processing block layer BU is transferred to the transfer schedule of the processing units 11U to 43U of the second processing block layer BU by the main transfer robot 8U. result, The substrate W can be processed in the second processing block layer BL. When the second state 142, that is, the operating state of the second processing block layer BU shifts from the second allowed mode to the second prohibited mode, the substrates that are planned to be processed at the second processing block layer BU are also changed in the same way. W's handling schedule. Specifically, the transfer schedule of the substrate W planned so as to be transferred to the processing units 11U to 43U of the second processing block layer BU by the main transfer robot 8U is discarded, and the transfer schedule for carrying the substrate W into the second processing block layer BU is recreated. The first processing block layer BL is transferred to the transfer schedule of the processing units 11L to 43L of the first processing block layer BL by the main transfer robot 8L. As a result, the substrate W can be processed in the first processing block layer BL.

In this way, even if one of the first processing block layer BL and the second processing block layer BU migrates from the first permitted mode to the first prohibited mode or from the second permitted mode to the second prohibited mode, the other party can In the first processing block layer BL or the second processing block layer BU in the first allowable mode or the second allowable mode, the conveyance and processing of the product substrate W are continued. Thereby, since the downtime of the substrate processing apparatus 1 can be reduced, productivity can be improved.

13 is a schematic vertical sectional view for explaining the structure of a substrate processing apparatus according to a second embodiment of the present invention, and shows the structure in a vertical section corresponding to the vertical section in FIG. 2 . When compared with the above-mentioned first embodiment, in this embodiment, the partition wall 16 for distinguishing the first processing block layer BL from the second processing block layer BU is removed. Furthermore, the pillars 83 for guiding the vertical movements of the main transfer robots 8L and 8U extend up and down throughout the first processing block layer BL and the second processing block layer BU. Thereby, the main transfer robots 8L and 8U are configured to be able to move up and down with a stroke larger than that of the first embodiment. Of course, the controller 110 controls the actions of the main transport robots 8L, 8U so that the main transport robots 8L, 8U do not interfere with each other.

In addition, in this embodiment, the two substrate mounting parts 6U and 6L in the first embodiment are replaced with one substrate mounting part 6 . The substrate mounting part 6 is located between the first processing block layer BL and the second The processing block layer BU is shared. That is, the main transfer robot 8L of the first processing block layer BL can access the substrate mounting part 6, and transfer products between the substrate mounting part 6 and the processing units 11L to 43L of the first processing block layer BL. Substrate W. In addition, the main transport robot 8L transports the dummy substrate DW between the substrate mounting section 6 , the processing units 11L to 43L, and the dummy substrate storage section 7L. Similarly, the main transfer robot 8U of the second processing block layer BU can access the substrate mounting part 6, and transfer products between the substrate mounting part 6 and the processing units 11U to 43U of the second processing block layer BU. Substrate W. In addition, the main transport robot 8U transports the dummy substrate DW between the substrate mounting section 6 , the processing units 11U to 43U, and the dummy substrate storage section 7U.

The substrate placement unit 6 includes an unprocessed substrate placement unit 61 and a processed substrate placement unit 62 . However, since the substrate mounting portion 6 is shared by the first processing block layer BL and the second processing block layer BU, it is preferable that the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 respectively have The substrate holders 65, 66 have more slots than in the case of the first embodiment. It is preferable that at least one (that is, a part or all) of the slots of the substrate holders 65 and 66 included in the substrate mounting unit 6 is arranged so as to be accessible by both main transfer robots 8L and 8U. More specifically, it is preferable that at least one (that is, a part or all) of the slots of the substrate holder 65 (refer to FIG. 5 ) of the unprocessed substrate placement part 61 is arranged so that it can be used by both main transfer robots 8L and 8U. access. Similarly, it is preferable that at least one (that is, a part or all) of the slots of the substrate holder 66 (see FIG. 5 ) of the processed substrate loading unit 62 is arranged so that it can be stored by both main transfer robots 8L and 8U. Pick.

Preferably, the substrate placement part 6 is configured to be accessible by the indexing robot 26 . More specifically, it is preferable that the index robot 26 is configured to be able to access all the slots of the substrate holders 65, 66 of the substrate placement unit 6, and to be able to carry the product substrate W or the dummy substrate DW into these slots. slots or move from these slots.

Fig. 14 is a longitudinal sectional view illustrating the structure of a substrate processing apparatus according to a third embodiment of the present invention Figure, and shows the composition in the longitudinal section corresponding to the longitudinal section in Fig. 2. In the first embodiment, the windows 4L, 4U corresponding to the substrate placement parts 6L, 6U are formed on the rear partition wall 2a and the front partition wall 3a adjacent to the index block 2 and the processing block 3, and windows 4L, 4U corresponding to the substrate placement parts 6L, 6U are not formed. The corresponding windows of the board housing parts 7L and 7U. On the other hand, in the present embodiment, windows 5L, 5U corresponding to the dummy substrate storage portions 7L, 7U are added to the rear partition wall 2a and the front partition wall 3a.

By providing such additional windows 5L, 5U, when introducing the dummy substrate DW into the first processing block layer BL and the second processing block layer BU, the index robot 26 can directly access the dummy substrate storage part 7L, 7U and moved into the dummy substrate DW. Furthermore, when unloading the used dummy substrate DW from the first processing block layer BL and the second processing block layer BU, the index robot 26 can directly access the dummy substrate storage parts 7L, 7U and unload the dummy substrate DW. Neither the main transfer robots 8L nor 8U need to participate in carrying in and carrying out such a dummy substrate DW. Therefore, the conveyance burden of the main conveyance robots 8L, 8U can be reduced, and productivity can be improved.

When the first processing block layer BL is in the first prohibition mode, the controller 110 is configured to allow the index robot 26 to move between the dummy carrier DC held by the carrier holding part 25 and the first dummy substrate storage part 7L. Transport the transport schedule of the simulated substrate DW, and control the indexing robot 26 according to the transport schedule. Similarly, when the second processing block layer BU is in the second prohibited mode, the controller 110 makes the dummy carrier DC and the second dummy substrate storage part held by the carrier holding part 25 by the indexing robot 26 Transfer the transfer schedule of the dummy substrate DW between 7U, and control the indexing robot 26 according to the transfer schedule.

Fig. 15 is a schematic plan view showing the internal structure of a substrate processing apparatus according to a fourth embodiment of the present invention. In the first embodiment, the plurality of processing units 11L to 43U are divided into a first processing unit group and a second processing unit group, and between the first processing unit group and the second processing unit group A horizontal intermediate partition wall 16 is arranged between them, the first processing unit group is arranged on the first processing block layer BL in the lower section, and the second processing unit group is arranged in the second processing block layer BU in the upper section. On the other hand, in this embodiment, the middle partition wall 16 for dividing the space in the processing block 3 up and down is not provided, but a central wall 16 for dividing the space in the processing block 3 in the horizontal direction is provided instead. 18 next door.

The central partition wall 18 divides the space in the processing block 3 to the left and right when viewed from the side of the carrier holding portion 25 in a plan view in the first horizontal direction X. The central partition wall 18 is a flat partition wall and extends along the first horizontal direction X and the vertical direction Z near the center of the processing block 3 in the second horizontal direction Y (left-right direction). The central partition 18 is formed: the first processing block B1 is disposed on one side of the central partition 18 ; and the second processing block B2 is disposed on the other side of the central partition 18 . That is, the first processing block part B1 and the second processing block part B2 are arranged on the sides of each other. The plurality of processing units 11L to 43U included in the processing block 3 are divided into: a first processing unit group G1 included in the first processing block part B1; and a second processing unit group G2 included in the second processing unit group G2. Process block part B2. Since the configuration of the plurality of processing units 11L to 43U is similar to that of the first embodiment, in FIG. 15 the same reference numerals as those in FIG. 1 are attached to the plurality of processing units 11L to 43U. The first processing unit group G1 is composed of a plurality of processing units 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U for forming the first tower T1 and the second tower T2 . The second processing unit group G2 is composed of a plurality of processing units 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L, 43L, 41U, 42U, 43U for forming the third tower T3 and the fourth tower T4 .

Corresponding to the first processing unit group G1, a first main transfer robot 8A is installed on one side of the central partition wall 18 . The first main transport robot 8A operates in the first transport space 53A partitioned between the central partition wall 18 and the first processing unit group G1, whereby the product substrate W and the dummy substrate DW are transported through the first transport space 53A. Similarly, corresponding to the second processing unit group G2, in the central partition 18 The other side of is provided with the second main transfer robot 8B. The second main transport robot 8B operates in the second transport space 53B partitioned between the central partition wall 18 and the second processing unit group G2, whereby the product substrate W and the dummy substrate DW are transported through the second transport space 53B. Since the configurations of the first main transfer robot 8A and the second main transfer robot 8B are substantially the same as those of the second embodiment shown in FIG. 13 , corresponding components are assigned the same reference numerals and descriptions thereof are omitted. However, in this embodiment, the pillar 83 for guiding the movement in the vertical direction is fixed to the central partition wall 18 .

Furthermore, corresponding to the first processing unit group G1 , a first substrate mounting portion 6A is provided at an end portion adjacent to the index block 2 in the first transfer space 53A. Furthermore, the first dummy substrate housing portion 7A is arranged above and/or below the first substrate mounting portion 6A so as to partially or completely overlap the first substrate mounting portion 6A in plan view. Similarly, corresponding to the second processing unit group G2, a second substrate mounting portion 6B is provided at an end portion adjacent to the index block 2 in the second transfer space 53B. In addition, the second dummy substrate accommodating portion 7B is disposed above and/or below the second substrate mounting portion 6B so as to partially or completely overlap the second substrate mounting portion 6B in plan view.

The first main transfer robot 8A can access a plurality of processing units constituting the first processing unit group G1 , the first substrate loading unit 6A, and the first dummy substrate storage unit 7A. Thereby, the first main transfer robot 8A transfers the product substrate W between the plurality of processing units constituting the first processing unit group G1 and the first substrate placement unit 6A. In addition, the first main transport robot 8A transports the dummy substrate DW between the processing units constituting the first processing unit group G1 , the first substrate loading unit 6A, and the first dummy substrate storage unit 7A. In the present embodiment, none of the first main transfer robot 8A can access the second processing unit group G2, the second substrate placement unit 6B, and the second dummy substrate storage unit 7B.

Similarly, the second main transfer robot 8B can access a plurality of processing units constituting the second processing unit group G2 , the second substrate placement part 6B, and the second dummy substrate storage part 7B. borrow Here, the second main transfer robot 8B transfers the product substrate W between a plurality of processing units constituting the second processing unit group G2 and the second substrate placement unit 6B. In addition, the second main transport robot 8B transports the dummy substrate DW between the processing units constituting the second processing unit group G2 , the second substrate loading unit 6B, and the second dummy substrate storage unit 7B. In this embodiment, none of the second main transfer robot 8B can access the first processing unit group G1 , the first substrate placement unit 6A, and the first dummy substrate storage unit 7A.

The indexing robot 26 is able to access the carrier C held by the carrier holding unit 25, the dummy carrier DC, the first substrate placement unit 6A, and the second substrate placement unit 6B, and it can access the carrier C, the dummy carrier DC , The product substrate W and the dummy substrate DW are conveyed between the first substrate mounting part 6A and the second substrate mounting part 6B. In this embodiment, neither the index robot 26 can access the first dummy substrate storage unit 7A nor the second dummy substrate storage unit 7B. Of course, neither the indexing robot 26 can access the first processing unit group G1 or the second processing unit group G2.

Also in the substrate processing apparatus 1 having such a configuration, the first state 141 and the second state 142 can be set for the first processing block unit B1 and the second processing block unit B2 as in the case of the first embodiment. Moreover, when the state of one processing block part transitions from the first enabled mode to the first disabled mode or from the second enabled mode to the second disabled mode, discard and move to the first disabled mode or the second disabled mode. The transfer schedule related to the substrate W planned in the processing block of the prohibition mode is recreated to carry the substrate W into the other processing block of the first allowable mode or the second allowable mode. schedule. Thereby, the processing of the substrate W can be continued using the processing block in the first allowable mode or the second allowable mode.

The fourth embodiment can also be modified in the same manner as the second embodiment (see FIG. 13 ) described above, and a substrate that can be accessed in common by the index robot 26, the first main transfer robot 8A, and the second main transfer robot 8B is provided. Mounting part, instead of the first substrate mounting part 6A and the second substrate mounting Part 6B. For example, a notch can be provided at the end of the central partition wall 18 on the index block 2 side, and a substrate mounting portion shared by the first processing unit group G1 and the second processing unit group G2 can be arranged.

In addition, the fourth embodiment may be modified like the above-described third embodiment (see FIG. 14 ), so that the index robot 26 can access the first dummy board storage unit 7A and the second dummy board storage unit 7B. Thereby, the dummy substrate DW can be carried in and out of the first dummy substrate storage section 7A and the second dummy substrate storage section 7B by the index robot 26 without the participation of the first main transfer robot 8A and the second main transfer robot 8B. .

Although four embodiments of the present invention have been described above, the present invention can also be implemented in other forms. For example, in the above-mentioned first embodiment, etc., although the configuration of the processing block 3 composed of the first processing block layer BL and the second processing block layer BU stacked in two layers is shown, three or more layers of processing blocks may be stacked. block layer to form processing blocks. In addition, although the above-mentioned first embodiment and the like show an example of a processing unit arrangement in which the first processing block layer BL and the second processing block layer BU are stacked in three stages, each processing block layer includes The processing units may be stacked in two stages, or may be stacked in four or more stages, or all the processing units may be arranged in one stage. Furthermore, although the example in which the processing units 11L to 43U are arranged on both sides of the conveyance paths 51L and 51U was shown in the first embodiment, the processing units may be arranged on one side of the conveyance paths 51L and 51U. In addition, although two processing units are arranged on one side of the conveyance paths 51L, 51U along the conveyance paths 51L, 51U in the above-mentioned first embodiment, one processing unit may be arranged, or three or more may be arranged. processing unit.

Furthermore, in the above-mentioned first embodiment, etc., the dummy substrate storage parts 7L and 7U of the first processing block layer BL and the second processing block layer BU are provided with the same Number of dummy base slots DL1 to DL12, DU1 to DU12, these dummy base slots DL1 The processing units 11L to 43L, 11U to 43U correspond one-to-one to DL12, DU1 to DU12. However, it is also possible to set the number of dummy substrate slots in each of the first processing block layer BL and the second processing block layer BU to be less than the number of processing units, and assign one dummy substrate slot corresponding to a plurality of processing unit.

In addition, in the above-mentioned embodiment, although it is shown that the state of the corresponding processing unit group is set to the first prohibition mode or the second prohibition mode on the condition that the dummy substrate DW accommodated in the dummy substrate accommodating portions 7L, 7U becomes a state requiring replacement. An example of the two prohibition modes, however, the state of the processing unit group may be transferred to the first prohibition mode or the second prohibition mode based on other pre-established conditions.

Although the embodiments of the present invention have been described in detail, these embodiments are only specific examples for clarifying the technical content of the present invention. limited by the scope of the patent.

1: Substrate processing device

2: Indexing Bots

2a: Rear Bulkhead

3: Processing blocks

3a: front next door

4L, 4U: window

6L, 6U: Substrate mounting section

7L, 7U: dummy board housing

8L, 8U: Main handling robot

11L, 11U, 12L, 12U, 13L, 13U, 21L, 21U, 22L, 22U, 23L, 23U: processing unit

15: next door

16: middle partition

17: next door

25: Carrier holding part

26: Indexing Bots

27:Multi-joint arm

28: arm

29,81: hand

30: abutment

37: export

51L, 51U: Transport path

52L, 52U: transport space

61: unprocessed substrate loading part

62: Processed substrate loading unit

71:Simulation substrate holder

82:Hand drive mechanism

83: Pillar

84: Vertical movement department

85: Horizontal movement department

86:Rotation

87: Advance and retreat

92: Second liquid supply part

101: The first exhaust part (exhaust part)

102: the second exhaust part (exhaust part)

BL: The first processing block layer (processing block layer)

BU: The second processing block layer (processing block layer)

C: carrier

DW: Dummy Substrate

S1L, S1U: first processing unit stack

S2L, S2U: second processing unit stack

T1: The first tower

T2: the second tower

W: Product substrate (substrate)

X: the first horizontal direction

Y: the second horizontal direction

Z: up and down direction

Claims (10)

A substrate processing device, comprising: a carrier holding part for holding a carrier, the carrier is used to accommodate a substrate or a dummy substrate; a first processing unit group has a plurality of first processing units, a plurality of the first The processing unit processes the substrate and performs processing using the dummy substrate; the second processing unit group has a plurality of second processing units, and the plurality of second processing units process the substrate and execute processing using the dummy substrate; the first dummy substrate The accommodating part is for accommodating dummy substrates; the second dummy substrate accommodating part is for accommodating dummy substrates; the substrate loading part is for placing substrates; the first transport unit is configured to be able to access a plurality of the first processing units, The substrate loading section and the first dummy substrate storage section transport substrates between the plurality of first processing units and the substrate loading section, and transfer the substrate between the plurality of first processing units and the first dummy substrate storage section. Transporting dummy substrates between them; the second conveying unit is configured to be able to access a plurality of the aforementioned second processing units, the aforementioned substrate loading portion, and the aforementioned second dummy substrate accommodating portion, between the plurality of aforementioned second processing units and the aforementioned substrate The substrate is transported between the loading parts, and the dummy substrate is transported between the plurality of the second processing units and the second dummy substrate storage part; the third transfer unit is capable of accessing the carrier held by the carrier holding part and the substrate placement unit for transferring the substrate between the carrier held by the carrier holding unit and the substrate placement unit; The memory unit stores data including a first state and a second state, the first state represents the state of the first processing unit group, and the second state represents the state of the second processing unit group; the schedule creation unit , is to make the transfer schedule of the substrate or dummy substrate by the first transfer unit, the second transfer unit, and the third transfer unit; and the transfer control unit follows the transfer schedule created by the schedule creation unit To control the handling of substrates or simulated substrates by the aforementioned first handling unit, the aforementioned second handling unit, and the aforementioned third handling unit; processing of the substrate and processing using the dummy substrate are performed in the aforementioned first processing unit included; and a first allowable mode capable of performing processing of the substrate in the aforementioned first processing unit included in the aforementioned first processing unit group and processing using a dummy substrate; the aforementioned second state includes: a second prohibition mode, which means that neither the processing of the substrate nor the processing of using the dummy substrate can be performed in the aforementioned second processing unit included in the aforementioned second processing unit group; And the second permission mode is capable of performing the processing for the substrate and the processing using the dummy substrate in the aforementioned second processing unit included in the aforementioned second processing unit group; when the aforementioned first state changes from the first permission mode to the first prohibition In the mode, the schedule creation unit discards the transfer schedule of the substrates planned so as to be transferred by the first transfer unit to any one of the first processing units in the first processing unit group, and creates the transfer schedule based on the aforementioned The substrate is transported by the second transport unit to any one of the second processing units in the second processing unit group. Planned transfer schedule; when the aforementioned second state changes from the second allowed mode to the second prohibited mode, the aforementioned schedule creation department is discarded to be transported by the aforementioned second transport unit to any one of the aforementioned second processing unit groups The transfer schedule of the substrate planned by the method of the second processing unit is made in such a way that the substrate is transferred by the first transfer unit to any one of the first processing units in the first processing unit group transport schedule. The substrate processing device as described in claim 1, wherein the memory unit stores the use history information of the dummy substrate stored in the first dummy substrate storage unit and the use of the dummy substrate stored in the second dummy substrate storage unit History information; the aforementioned substrate processing device further includes: a state setting unit, based on the aforementioned usage history information stored in the aforementioned memory unit, to determine whether it is necessary to replace the ones stored in the aforementioned first dummy substrate storage unit and the aforementioned second dummy substrate storage unit. When it is determined that it is necessary to replace the dummy substrate stored in the first dummy substrate accommodating section, the first state is set to the first prohibition mode, and when it is determined that it is necessary to replace the dummy substrate stored in the second dummy substrate accommodating section The aforementioned second state is set to the second prohibition mode when simulating the substrate. The substrate processing apparatus as described in claim 1, wherein the schedule creation unit creates a transport schedule, and the transport schedule is used to perform the first transport operation when the first processing unit group is in the first prohibition mode. The unit and the third transport unit transport the dummy substrate between the carrier held by the carrier holding unit and the first dummy substrate storage unit, and when the second processing unit group is in the second prohibition mode, by the first dummy substrate The second transport unit and the third transport unit transport the dummy substrate between the carrier held by the carrier holding unit and the second dummy substrate storage unit. The substrate processing device as described in claim 1, wherein the substrate placing part includes Including: the first substrate loading part, which can be accessed by the first transport unit and the third transport unit; and the second substrate loading part, which can be accessed by the second transport unit and the third transport unit The aforementioned first transport unit transports the substrate between the plurality of the aforementioned first processing units and the aforementioned first substrate placement parts, and transfers the substrate between the plurality of the aforementioned first processing units, the aforementioned first substrate placement parts and the aforementioned first simulation The dummy substrate is transported between the substrate storage parts; the second transport unit transports the substrate between the plurality of the second processing units and the second substrate loading part, and the plurality of the second processing units, the second substrate The dummy substrate is transported between the loading unit and the second dummy substrate storage unit; the third transport unit transports the substrate and the dummy substrate between the carrier held by the carrier holding unit and the first substrate loading unit, And the substrate and the dummy substrate are conveyed between the carrier held by the carrier holding part and the second substrate mounting part. The substrate processing apparatus as described in claim 1, wherein the third transfer unit is configured to be able to access the first dummy substrate storage unit and the second dummy substrate storage unit; the schedule creation unit creates a transfer schedule, The transfer schedule is used to transfer between the carrier held by the carrier holding part and the first dummy substrate storage part by the third transfer unit when the first processing unit group is in the first prohibition mode The dummy substrate is conveyed by the third conveying unit between the carrier held by the carrier holding portion and the second dummy substrate accommodating portion when the second processing unit group is in the second prohibition mode. The substrate processing device as described in claim 1, which includes: a first processing block layer; and The second processing block layer is located above the first processing block layer; the first processing unit group is arranged on the first processing block layer; the second processing unit group is arranged on the second processing block layer unit group. The substrate processing device as described in claim 1, which includes: a first processing block; and a second processing block, which is located on the side of the first processing block; The first processing unit group is arranged; the second processing unit group is arranged in the second processing block. The substrate processing apparatus according to any one of claims 1 to 7, wherein the first dummy substrate storage section and the second dummy substrate storage section overlap the substrate mounting section when viewed from above. A method for processing a substrate, comprising: following a transfer schedule, using a first transfer unit to transfer a substrate between a plurality of first processing units belonging to a first processing unit group and a substrate mounting portion; The process of processing the substrates transported by the first transport unit in the unit; the process of transporting the dummy substrates between the plurality of first processing units and the first dummy substrate storage part by the first transport unit according to the transport schedule; In the aforementioned first processing unit, the process of performing simulation processing using the simulated substrate transported by the aforementioned first transport unit; according to the aforementioned transport schedule, by the second transport unit in the plurality of second process units belonging to the second processing unit group A process of transporting substrates between the processing unit and the substrate loading unit; a process of processing the substrates transported by the second transport unit in the second processing unit; According to the aforementioned transport schedule, the process of transporting dummy substrates between the plurality of aforementioned second processing units and the second dummy substrate storage parts by the aforementioned second transporting unit; The process of simulation processing of the simulated substrate transported by the transport unit; according to the aforementioned transport schedule, the process of transporting the substrate between the carrier held by the carrier holding part and the aforementioned substrate placing part by the third transport unit; for the aforementioned 1st A process of setting a first state of a processing unit group, the aforementioned first state includes: a first prohibition mode, neither of which can execute the processing of the substrate and use simulation in the aforementioned first processing unit included in the aforementioned first processing unit group processing of the substrate; and a first allowable mode capable of performing processing of the substrate and processing using a dummy substrate in the aforementioned first processing unit included in the aforementioned first processing unit group; setting the second for the aforementioned second processing unit group The process of the state, the aforementioned second state includes: the second prohibition mode, which means that the processing of the substrate and the processing of the dummy substrate cannot be performed in the aforementioned second processing unit included in the aforementioned second processing unit group; and the second The permission mode is capable of performing the processing for the substrate and the processing using the dummy substrate in the aforementioned second processing unit included in the aforementioned second processing unit group; when the aforementioned first state changes from the first permission mode to the first prohibition mode, Abandoning the transfer schedule of the substrates planned to be transferred by the first transfer unit to any one of the first processing units in the first processing unit group, and making a transfer schedule for the substrates to be transferred by the second transfer unit Any one of the above-mentioned second processing unit group in the above-mentioned second processing unit is the process of the transportation schedule planned by the method; and when the above-mentioned second state changes from the second allowed mode to the second prohibited mode, it is discarded so as to be discarded by the aforementioned second processing unit The transfer schedule of the substrates planned in such a way that the second transfer unit transfers to any one of the second processing units in the second processing unit group, and the substrate is transferred to the first processing unit by the first transfer unit The transportation schedule planned by any one of the aforementioned first processing units in the group. The substrate processing method as described in Claim 9, wherein the process for setting the first state is based on the use history information of the dummy substrate stored in the first dummy substrate storage part to determine whether it is necessary to replace the dummy substrate stored in the first dummy substrate storage part. A dummy substrate in a dummy substrate accommodating section, when it is determined that the dummy substrate stored in the first dummy substrate accommodating section needs to be replaced, the aforementioned first state is set to a first prohibition mode; the process for setting the aforementioned second state is Based on the use history information of the dummy substrate stored in the second dummy substrate storage section, it is determined whether it is necessary to replace the dummy substrate stored in the second dummy substrate storage section, and when it is determined that it is necessary to replace the dummy substrate stored in the second dummy substrate The aforementioned second state is set to the second prohibition mode when the dummy substrate of the storage unit is used.

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