TWI796175B - Substrate processing device, substrate processing system, and substrate processing method - Google Patents

Abstract

The substrate processing device includes: a carrier holding part, which holds the carrier; a processing unit, which processes the substrate and performs processing using a dummy substrate; a dummy substrate storage part; a substrate loading part; The substrate is transported between the substrate placement parts, and the dummy substrate is transported between the processing unit, the dummy substrate storage part and the substrate placement part; the second transfer unit is used to transport the substrate between the carrier holding part and the substrate placement part; The memory part stores the use history information of the simulation substrate; the use period notification part notifies the use period information of the simulation substrate based on the use history information; the schedule creation part creates a transportation schedule, which is used to recycle the The dummy substrate is notified of the expiration date information; and the transfer control unit controls the transfer of the substrate or the dummy substrate by the first transfer unit and the second transfer unit according to the transfer schedule.

Description

Substrate processing device, substrate processing system, and substrate processing method

This application claims priority to Japanese Patent Application JP2021-049169 filed on Mar. 23, 2021, and uses all the disclosures of Japanese Patent Application JP2021-049169 for this application.

The present invention relates to an apparatus, system and method for processing substrates. The substrates to be processed are, for example, semiconductor wafers, liquid crystal display devices, and organic EL (electroluminescence; electroluminescence) display devices, such as flat panel display (FPD) substrates, optical disk substrates, and magnetic disk substrates. , Substrates for optical magnetic disks, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

In the manufacturing process of a semiconductor device, a substrate processing apparatus for processing a substrate like a semiconductor wafer is used. An example of such a substrate processing apparatus is disclosed in Patent Document 1. Such a substrate processing device includes: a carrier (carrier) holding part, which holds a carrier for accommodating a substrate; a plurality of processing units, which process the substrate; and a transport unit, which transports the substrate between the carrier and the processing unit; and control unit. When the non-use duration of the processing unit reaches a predetermined time, the control device requests the host device to move in a dummy carrier holding a dummy substrate. When the dummy carrier is carried into the carrier holding part, the transfer unit transfers the dummy substrate from the dummy carrier to the processing unit. Cleaning of the process unit is performed using this dummy substrate.

The transfer unit includes an indexer robot and a main transfer robot, and a transfer unit is arranged between the indexer robot and the main transfer robot. The indexing robot handles substrates between the carrier and the transfer unit. The main transfer robot transfers the substrates between the transfer unit and the processing unit. When the dummy carrier is placed on the carrier holding portion, the index robot takes out the dummy substrate from the dummy carrier and transports it to the transfer unit. The dummy substrate is transported from the transfer unit to the processing unit by the main transport robot. When the unit cleaning process using the dummy substrate is completed, the main transfer robot takes out the dummy substrate from the processing unit and transfers it to the transfer unit. The dummy substrate is transported from the transfer unit to the dummy carrier by an indexing robot. When all the dummy substrates are accommodated in the dummy carrier, the dummy carrier is taken out from the carrier holding portion. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-41506.

[Problem to be Solved by the Invention]

In this way, the dummy substrate is introduced from the outside of the substrate processing apparatus, transported to the processing unit through the same path as the product substrate, and unloaded from the processing unit to be accommodated in the dummy carrier. Therefore, both the index robot and the main transfer robot are used for conveyance of the dummy substrate, and the dummy substrate is conveyed by the transfer unit. This interferes with the conveyance of the product substrate, thereby deteriorating the conveyance efficiency of the product substrate, and as a result, improvement of productivity is hindered. In particular, in a substrate processing apparatus configured to increase the number of processing units and process multiple product substrates in parallel, the transfer load of the index robot and the main transfer robot becomes larger, and the reduction of the transfer load of the index robot and the main transfer robot is The key to productivity improvement.

In addition, the dummy carrier is carried into the carrier holding part, and the dummy carrier will occupy the carrier holding part until the dummy substrate is transported from the dummy carrier to the processing unit and the dummy substrate is stored in the processing unit after the processing in the processing unit is completed. up to the carrier. Therefore, since the dummy carrier continues to occupy the carrier holding portion, there may be a possibility of a standby time for carrying in a product substrate. Therefore, improvement of productivity is also hindered from such a viewpoint. Therefore, one embodiment of the present invention is to provide a substrate processing apparatus, a substrate processing system, and a substrate processing method, which can reduce the influence on the conveyance of substrates for products, and can perform processing using dummy substrates in the processing unit. . [Means to solve the problem]

One of the embodiments of the present invention provides a substrate processing device, which includes: a carrier holding part, which holds a carrier for accommodating a substrate or a dummy substrate; a processing unit, which processes a substrate and performs processing using a dummy substrate; a dummy substrate The accommodating part accommodates the dummy substrate; the substrate loading part is used for placing the substrate; the first transport unit is capable of accessing the aforementioned processing unit, the aforementioned dummy substrate storage part, and the aforementioned substrate loading part, between the aforementioned processing unit and the aforementioned The substrate is transported between the substrate placement parts, and the dummy substrate is transported between the aforementioned processing unit, the aforementioned dummy substrate storage part, and the aforementioned substrate placement part; the second transport unit is capable of accessing the aforementioned carrier holding part and the aforementioned substrate carrier The placement part transports the substrate between the carrier holding part and the substrate placing part; the memory part memorizes the use history information of the dummy substrate stored in the dummy substrate storage part; the service life notification part is based on the memory The aforementioned use history information in the aforementioned memory unit notifies the service life information of the dummy substrate stored in the aforementioned dummy substrate storage unit; Transport schedule, and create a transport schedule for transporting and recovering the dummy substrate notified of the aforementioned service life information from the aforementioned dummy substrate storage unit to the aforementioned carrier holding unit; and the transport control unit is created in accordance with the aforementioned schedule The transfer of the substrate or the dummy substrate by the first transfer unit and the second transfer unit is controlled according to the transfer schedule created by the department.

According to this configuration, since the substrate processing apparatus is equipped with a dummy substrate storage section, when a dummy substrate needs to be used in a processing unit, it can be transported between the dummy substrate storage section and the processing unit without the participation of the second transport unit. Simulation substrate. Therefore, since the conveyance load of the second conveyance unit can be reduced, the influence on conveyance of the substrate for a product can be reduced, and processing using a dummy substrate can be performed. In addition, unlike the case of Patent Document 1, the carrier holding portion is not occupied for a long time by the dummy carrier for accommodating the dummy substrate. Thereby, since it is possible to suppress a standby time for carrying in a carrier that accommodates a substrate for a product, it contributes to improvement of productivity.

In addition, in the present embodiment, the usage history information of the dummy board stored in the dummy board storage unit is stored in the storage unit, and the use period information of the dummy board is notified based on the usage history information of the dummy board. Furthermore, a transport schedule (recovery transport schedule) for transporting the dummy substrate to which the expiration date information has been notified is transported from the dummy substrate accommodating section and collected to the carrier holding section is created. The first transport unit and the second transport unit are controlled based on the transport schedule, thereby transporting the dummy substrate to which the expiration date information has been notified from the dummy substrate accommodating portion to the carrier holding portion. In this way, when the dummy substrate reaches its expiration date, the dummy substrate can be automatically discharged.

The notification of the expiration date information can notify the gist that the dummy board will become unusable, and can also notify the gist that the dummy board will become unusable soon. The notification of the lifespan information may also be in the form of a dummy substrate replacement request for requesting replacement of the dummy substrate. The dummy substrate replacement request may also include a dummy substrate recycling request, and the dummy substrate recycling request is used to request recycling of a used dummy substrate. The dummy substrate recycling request can also be a dummy substrate recycling reservation, and the dummy substrate recycling reservation is used to designate the recycling time of the used dummy substrate. In addition, the dummy substrate replacement request may also include a dummy substrate supply request, and the dummy substrate supply request is used to request the supply of unused dummy substrates. The dummy board supply request may also be a dummy board supply reservation, and the dummy board supply reservation is used to designate the supply time of unused dummy boards.

In one embodiment of the present invention, the memory unit memorizes at least one of the number of times of use, the time of use, and the state of consumption of the dummy substrate as the use history information. In one embodiment of the present invention, the aforementioned memory unit stores the aforementioned usage history information and the usage period threshold value information corresponding to the aforementioned usage history information. In one of the embodiments of the present invention, the dummy substrate storage unit stores a plurality of dummy substrates; the memory unit stores the usage history information and the usage limit value information for each dummy substrate. With such a configuration, it is possible to individually manage the lifespan of a plurality of dummy substrates.

In one of the embodiments of the present invention, there are a plurality of the aforementioned processing units; the corresponding relationship between the plurality of the aforementioned dummy substrates and the plurality of the aforementioned processing units is pre-established; Information. In a specific example, a plurality of dummy boards and a plurality of processing units are associated one-to-one. In this way, since there is no situation that the dummy substrate is shared by a plurality of processing units, the mutual influence of the plurality of processing units through the dummy substrate can be avoided. For example, even if the processing environment in one processing unit is polluted, the contamination can be prevented from being brought into other processing units via the dummy substrate.

In one embodiment of the present invention, the service life notification unit compares the service history information with the service life threshold value information, and notifies the service life information of the dummy substrate based on the comparison result. With such a configuration, by comparing the usage history information with the usage limit value information, it is possible to appropriately notify the usage life information of the dummy substrate. In one embodiment of the present invention, the aforementioned substrate processing apparatus further includes: a notification unit that notifies the user of the expiration date of the dummy substrate stored in the dummy substrate storage unit based on the use history information stored in the memory unit Information. With such a configuration, it is possible to appropriately notify the user of the life-span information of the dummy substrate and draw the user's attention.

One of the embodiments of the present invention provides a substrate processing system, which includes: a substrate processing device having the above-mentioned characteristics; a carrier transport unit that moves into the dummy carrier for recycling used dummy substrates. To the aforementioned carrier holding unit; and the host computer (host computer), which receives the notification of the aforementioned expiration date information from the aforementioned expiration date notification unit, and plans to move the dummy carrier for recycling into the aforementioned carrier handling unit Carrying the dummy carrier for recycling in the carrier holding part, and carrying the dummy carrier for recycling into the carrier holding part by the carrier transfer unit according to the plan above, and instructing the simulation to the substrate processing device Recycling and transportation of substrates.

According to this configuration, the expiration date information is notified from the substrate processing apparatus to the host computer. In this way, the host computer plans the operation of the carrier transfer unit and controls the carrier transfer unit according to the plan, thereby using the dummy carrier for recycling the used dummy substrate to be loaded into the carrier holder of the substrate processing device. department. Therefore, the dummy carrier for recycling can be supplied to the substrate processing apparatus at an appropriate time based on the expiration date information notified from the substrate processing apparatus to the host computer. That is, since the dummy carriers for recovery can be automatically and timely supplied, downtime of the substrate processing apparatus can be shortened to improve productivity.

In addition, since the host computer instructs the substrate processing device to collect and transport the dummy substrate, the substrate processing device can timely plan and execute the recovery and transportation of the dummy substrate, that is, it can timely plan and execute the dummy substrate that will be used up. It is conveyed from the dummy substrate storage unit to the dummy carrier for collection. That is, it is possible to integrate the timing of carrying in the dummy carrier for recovery and starting the recovery and transport of the dummy substrates in the substrate processing apparatus. Thereby, since the time that the dummy carrier for recycling occupies the carrier holding portion can be shortened, the carrier holding portion can be quickly released for the carrier for storing product substrates. Thereby, since unprocessed product substrates can be efficiently loaded into the substrate processing apparatus and processed product substrates can be efficiently collected, productivity can be improved.

In addition, in this specification, "integration" of time series does not necessarily refer to temporal consistency, but refers to the generation of corresponding events within a predetermined time allowed from the viewpoint of productivity. In one embodiment of the present invention, the host computer obtains information related to the recycling of dummy substrates toward the dummy carrier for recycling from the substrate processing device, and plans to use the dummy substrate from the dummy carrier that is accommodated by the carrier transfer unit. The dummy carrier for recovery of the completed dummy substrate is carried out from the carrier holding part, and the dummy carrier for recycling is carried out from the carrier holding part by the carrier transport unit based on the aforementioned plan.

According to this configuration, the host computer is provided with the information related to the collection of the dummy substrate to the dummy carrier for recycling from the substrate processing device, whereby the host computer plans the carrying out of the dummy carrier for recycling by the carrier transfer unit. , and follow the plan to control the carrier handling unit. Therefore, it is possible to automatically and timely unload the dummy susceptor for recovery from the susceptor holding unit of the substrate processing apparatus. Specifically, the dummy carrier for recycling can be unloaded from the carrier holding section at a timing aligned with the completion of loading of the dummy substrate into the dummy carrier for recycling. This shortens the time that the dummy carrier used for recovering the dummy substrate occupies the carrier holding portion, so that the carrier holding portion can be quickly released for the carrier for storing the product substrate. Thereby, since unprocessed product substrates can be efficiently loaded into the substrate processing apparatus and processed product substrates can be efficiently collected, productivity can be improved.

In one embodiment of the present invention, the schedule creation unit further creates a transport schedule for transporting usable dummy substrates from the carrier holding unit to the dummy substrate storage unit; the carrier transport unit is Operates in such a manner as to carry a dummy carrier for supply containing a usable dummy substrate into the carrier holding portion; the host computer is designed to carry in the dummy carrier for supply by the carrier transport unit Transferring the dummy carrier for supply to the carrier holding part, and carrying the dummy carrier for supply into the carrier holding part by the carrier transfer unit based on the aforementioned plan, and instructing the substrate processing device Supply and transport of usable dummy substrates.

According to this structure, the host computer creates a plan for carrying the dummy carrier for supply, which accommodates the usable dummy substrate, into the carrier holding part of the substrate processing apparatus through the carrier transfer unit, and follows the above-mentioned plan. Draw to control the movement of the carrier handling unit. Thereby, the dummy carrier for supply is automatically and timely supplied to a substrate processing apparatus. In the substrate processing apparatus, a transport schedule (supply transport schedule) for transporting the dummy substrate from the supply dummy carrier to the dummy substrate storage unit is created, and the dummy substrate is transported according to the transport schedule. Specifically, the usable dummy substrate is conveyed from the dummy carrier for supply to the dummy substrate storage unit by the first conveying unit and/or the second conveying unit. In this way, since the dummy substrate can be automatically and timely supplied to the substrate processing apparatus, downtime of the substrate processing apparatus due to a shortage of usable dummy substrates can be shortened. Thereby, it can contribute to improvement of productivity.

In addition, since the host computer instructs the substrate processing apparatus to supply and transport dummy substrates, the substrate processing apparatus can timely plan and execute the supply and transportation of dummy substrates, that is, it can timely plan and execute dummy substrates from available dummy substrates. The transfer of the dummy substrate carrier for the supply of dummy substrates to the accommodating part is simulated. Therefore, the supply and transport of the dummy substrates in the substrate processing apparatus can be started at a timing consistent with the loading of the dummy carrier for supply. Thereby, since the time that the dummy carrier for supply occupies the carrier holding part can be shortened, the carrier holding part can be released quickly for the carrier used for accommodating the product substrate. Thereby, since unprocessed product substrates can be efficiently loaded into the substrate processing apparatus and processed product substrates can be efficiently collected, productivity can be improved.

In one embodiment of the present invention, the host computer obtains information related to the unloading of the dummy substrate from the dummy carrier for supply from the substrate processing device, and plans to transfer the dummy substrate from the dummy carrier for supply to the dummy substrate by the carrier transfer unit. The dummy carrier is carried out from the carrier holding portion of the dummy carrier, and the dummy carrier for supply is carried out from the carrier holding portion by the carrier transport unit based on the aforementioned plan.

According to this configuration, the host computer is provided with information related to the unloading of the dummy substrate from the dummy carrier for supply from the substrate processing apparatus, and the host computer plans the unloading of the dummy carrier for supply based on this, and follows the plan. Draw to move the carrier transfer unit. Thereby, the dummy carrier for supply can be unloaded from the carrier holding part at the timing aligned with the completion of unloading of the dummy substrate from the dummy carrier for supply. In this way, the dummy susceptors for supply can be automatically and timely unloaded from the susceptor holding unit of the substrate processing apparatus. Therefore, since the time that the dummy carrier for supplying the dummy substrate occupies the carrier holding portion can be shortened, the carrier holding portion can be quickly released for holding the carrier for accommodating the product substrate. Thereby, since unprocessed product substrates can be efficiently loaded into the substrate processing apparatus and processed product substrates can be efficiently collected, productivity can be improved.

In one of the embodiments of the present invention, the aforementioned carrier transport unit transports the dummy carrier for recycling or the dummy carrier for supply between the aforementioned carrier holding portion and a dummy carrier placement place different from the aforementioned carrier holding portion. Simulation bearer. One embodiment of the present invention provides a substrate processing method, which includes: using a first transport unit to transport the substrate between the processing unit and the substrate mounting part; The process of using the substrate; the process of transporting the dummy substrate between the processing unit and the dummy substrate storage unit by the first transport unit; executing the simulation process using the dummy substrate transported by the first transport unit in the processing unit process; the process of transporting the substrate between the carrier held by the carrier holding part and the aforementioned substrate placing part by the second transport unit; the process of recording the use history information of the dummy substrate accommodated in the aforementioned dummy substrate accommodating part The process of judging the service life of the aforementioned dummy substrate based on the aforementioned use history information; the recycling and transporting process is used to transport and recycle the dummy substrate that has reached the service life from the aforementioned dummy substrate storage part to the aforementioned carrier based on the judgment of the aforementioned service life and the dummy carrier loading process for recycling is based on the judgment of the aforementioned service life, and the dummy carrier for the recycling of the used dummy substrate is moved into the carrier holding unit by the carrier transport unit. department.

In one embodiment of the present invention, the aforementioned substrate processing method further includes the following step: in a sequence that is integrated with the completion of loading of the dummy substrate in the aforementioned recycling and transporting process into the aforementioned dummy carrier for recycling, by the aforementioned carrier The container transport unit carries out the dummy carrier for recovery from the carrier holding part. In one embodiment of the present invention, the aforementioned substrate processing method further includes: a supply dummy carrier carrying-in process, based on the judgment of the aforementioned service life, using the aforementioned carrier transport unit to accommodate the usable dummy substrate The dummy substrates for supply are carried into the susceptor holding part; and the supply and transfer process is based on the determination of the expiration date, transporting the usable dummy substrates from the susceptor holding part to the dummy substrate accommodating part.

In one embodiment of the present invention, the aforementioned substrate processing method further includes the step of: using the aforementioned carrier in a sequence that is integrated with the completion of unloading of the dummy substrate in the aforementioned supply and transfer process from the aforementioned supply dummy carrier. The carrier transport unit carries out the dummy carrier for supply from the carrier holding part. In one embodiment of the present invention, a plurality of the processing units are provided; and the dummy substrate storage unit accommodates a plurality of dummy substrates having a predetermined correspondence relationship with the plurality of the processing units. The above object and other objects, features, aspects and advantages will be more clearly understood through the following detailed description of the present invention with reference to the accompanying drawings.

FIG. 1 is a schematic plan view showing the internal structure of a substrate processing apparatus according to one embodiment of the present invention. Fig. 2 is a schematic longitudinal sectional view viewed from line II-II in Fig. 1 . Fig. 3 is a schematic cross-sectional view viewed from line III-III in Fig. 1 . FIG. 4 is a schematic elevational view showing the internal structure of the processing block viewed from the IV direction of FIG. 1 .

The substrate processing apparatus 1 includes an index block 2 and a processing block 3 , and the processing block 3 is adjacent to the index block 2 in a horizontal direction (a first horizontal direction X). The index block 2 includes a plurality of (four in this embodiment) carrier holders 25 (load ports) and an index robot 26 . Hereinafter, for the convenience of description, with respect to the first horizontal direction X, the side of the carrier holding portion 25 may be defined as the front and the side opposite to the side of the carrier holding portion 25 will be defined as the rear.

The plurality of carrier holding parts 25 are arranged along the second horizontal direction Y perpendicular to the first horizontal direction X. Each carrier holding part 25 is comprised so that it may accommodate and hold the carrier C automatically conveyed by the carrier conveyance mechanism 300 (an example of a carrier conveyance means) provided in a factory. Each carrier holding portion 25 is configured to hold one carrier C. As shown in FIG. The carrier C is a substrate storage container that accommodates a substrate W (hereinafter also referred to as a product substrate W) to be processed. An example of the carrier C is a FOUP (Front Opening Unified Pod; Front Opening Unified Pod). The carrier C is configured to hold a plurality of (for example, 25) substrates W in a stacked state. More specifically, the carrier C is configured to hold a plurality of substrates W in a stacked state along the vertical direction Z in a horizontal posture when held by the carrier holding portion 25 . The carrier holding part 25 is an example of a container holding part, and holds the carrier C belonging to the substrate container. The substrate W is, for example, a semiconductor wafer.

The index robot 26 is an example of the second transport unit. The index robot 26 is configured to be able to access the carriers C respectively held by the plurality of carrier holding parts 25, to carry the substrate W in or out, and to transfer the substrate W between the carrier holding part 25 and the processing block 3. . In the present embodiment, the index robot 26 is a multi-joint arm robot including a multi-joint arm 27 . Specifically, the indexing robot 26 includes: a multi-joint arm 27 that connects a plurality of arms 28; more than one hand 29 that is coupled to the front end of the multi-joint arm 27; and a base part 30 that supports the multi-joint arm 27 and make the multi-joint arm 27 move up and down. A plurality of arms 28 and hands 29 constituting the multi-joint arm 27 are capable of swinging around a vertical swing axis set at each base end. individual actuators (typically electric motors).

The processing block 3 includes a plurality of first processing block layers BL and second processing block layers BU stacked in the vertical direction Z. In this embodiment, the processing block 3 includes a processing block layer (hereinafter referred to as "the first processing block layer BL") of the first layer (lower layer) and a layer stacked above the first processing block layer BL. The processing block layer of the second layer (upper layer) (hereinafter referred to as "second processing block layer BU"). Hereinafter, when distinguishing the constituent elements of the first processing block layer BL from the constituent elements of the second processing block layer BU, the constituent elements of the first processing block layer BL are used with the component symbols with the English letter "L" at the end , for the constituent elements of the second processing block layer BU, the component symbols with the English word "U" at the end are used. The same applies to the reference symbols in the drawings.

The internal configurations in plan view of the first processing block layer BL and the second processing block layer BU are substantially the same. Therefore, in FIG. 1 , please note that the configuration of the first processing block layer BL (arrangement in plan view) is represented by replacing the English character “U” at the end of the element code with the English character “L”. The first processing block layer BL includes a plurality of (12 in this embodiment) processing units 11L to 13L, 21L to 23L, 31L to 33L, 41L to 43L (hereinafter collectively referred to as the processing of the first processing block layer BL) The units are referred to as "processing units 11L to 43L"), and a plurality of processing units 11L to 13L, 21L to 23L, 31L to 33L, and 41L to 43L constitute the first processing unit group. The first processing block layer BL further includes a substrate placement unit 6L, a dummy substrate storage unit 7L, and a main transfer robot 8L. The plurality of processing units 11L to 43L process the substrate W. In this embodiment, each of the processing units 11L to 43L is a blade type processing unit for processing the substrate W one by one. The substrate mounting part 6L is a unit for temporarily holding the substrate W transferred between the index robot 26 and the first processing block layer BL. The dummy substrate storage unit 7L provides a standby place for the dummy substrates DW, and is a unit for holding the dummy substrates DW usable in the processing units 11L to 43L in advance in the substrate processing apparatus 1 . The main transfer robot 8L is configured to be able to access the substrate placement portion 6L, the processing units 11L to 43L, and the dummy substrate storage portion 7L. The main transport robot 8L is an example of a first transport unit for transporting the substrate W between the substrate mounting section 6L and the processing units 11L to 43L and transporting the dummy substrate DW between the dummy substrate storage section 7L and the processing units 11L to 43L. .

The so-called dummy substrate DW is a substrate having the same shape (for example, circular shape) and size as the substrate W. The dummy substrate DW is different from the substrate W for a product supplied from the carrier C, and is not used for manufacturing an actual product. The dummy substrate DW is introduced into the processing units 11L to 43L in order to perform preprocessing (preparation processing) for adjusting the environment in the processing units 11L to 43L and unit cleaning processing for cleaning the processing units 11L to 43L. to use. Hereinafter, such processing using the dummy substrate DW is referred to as "dummy processing". The preprocessing and unit cleaning processes described above are maintenance processes for maintaining the processing units 11L to 43L, and the simulation process includes such maintenance processes.

A plurality of processing units 11L to 43L are disposed on both sides of the transport space 52L along the transport space 52L and face the transport space 52L. The transport space 52L provides a transport path 51L, and the transport path 51L is used to transport the substrate W by the main transport robot 8L. the path. When viewed from above, the transfer space 52L has a constant width in the second horizontal direction Y, and linearly extends in a direction away from the index block 2 along the first horizontal direction X. The transfer space 52L has a height substantially equal to the height of the first processing block layer BL in the vertical direction Z. In a plan view, on one side of the transport space 52L, the first liquid supply unit 91, the first processing unit stacking unit S1L, and the first exhaust unit 101 are arranged sequentially along the transport path 51L from the side close to the index block 2. , the second liquid supply part 92 , the second processing unit stack part S2L, and the second exhaust part 102 . On the other side of the transport space 52L, the third exhaust unit 103, the third processing unit stacking unit S3L, the third liquid supply unit 93, the fourth The exhaust unit 104 , the fourth processing unit stacking unit S4L, and the fourth liquid supply unit 94 . These members are arranged so as to partition the substantially cubic conveyance space 52L.

The first processing unit stack S1L to the fourth processing unit stack S4L respectively include a plurality of stages (in this embodiment, three stages) of processing units 11L to 13L, 21L to 23L, 31L to 33L, and 41L stacked in the vertical direction Z. to 43L. The third processing unit stack portion S3L is opposed to the first processing unit stack portion S1L across the conveyance space 52L. The fourth processing unit stacking portion S4L is opposed to the second processing unit stacking portion S2L across the conveyance space 52L. Therefore, the plurality of processing units 31L to 33L constituting the third processing unit stack S3L are opposite to the plurality of stages of processing units 11L to 13L constituting the first processing unit stack S1L across the transport space 52L. Similarly, the plurality of processing units 41L to 43L constituting the fourth processing unit stack S4L are opposite to the plurality of processing units 21L to 23L constituting the second processing unit stack S2L across the transport space 52L. In this embodiment, the first processing block layer BL includes 12 processing units 11L to 13L, 21L to 23L, 31L to 33L, and 41L to 43L, and three of these components are separately arranged in four first processing units. The unit stack S1L to the fourth processing unit stack S4L.

The transfer space 52L is partitioned from above by the middle partition wall 16 and partitioned from below by the lower partition wall 15. The middle partition wall 16 is arranged on the uppermost processing unit 13L of each of the first processing unit stacking portion S1L to the fourth processing unit stacking portion S4L. , 23L, 33L, 43L upper surfaces are integrated, and the lower partition wall 15 is arranged at a position integrated with the lower surface of the lowermost processing units 11L, 21L, 31L, 41L. All of the processing units 11L to 43L have a substrate loading and unloading port 37, and the substrate loading and unloading port 37 opens at a position facing the transfer space 52L. The main transport robot 8L transports the substrate W and the dummy substrate DW through the transport space 52L, loads the substrate W and the dummy substrate DW into the processing units 11L to 43L through the substrate loading and unloading port 37, and unloads the substrate W and the dummy substrate DW from the processing units 11L to 43L. Substrate DW.

The substrate placement unit 6L is arranged between the index robot 26 and the main transfer robot 8L. More specifically, the substrate placement unit 6L is arranged at an end portion on the index robot 26 side in the transfer space 52L in plan view. In the present embodiment, the substrate placement unit 6L is located between the first liquid supply unit 91 and the third exhaust unit 103 . The substrate mounting portion 6L is arranged at a height between the intermediate partition wall 16 and the lower partition wall 15 in the up-down direction Z. In the present embodiment, the substrate mounting portion 6L is arranged near the middle height in the height range from the intermediate partition wall 16 to the upper partition wall 17 . The vertical position of the board mounting section 6L needs to be within a height range accessible by the index robot 26 and within a height range accessible by the main transfer robot 8L.

The substrate placement unit 6L includes: an unprocessed substrate placement unit 61 on which an unprocessed substrate W is placed; and a processed substrate placement unit 62 on which a processed substrate W is placed. The unprocessed substrate mounting part 61 and the processed substrate mounting part 62 are stacked in the vertical direction Z. Preferably, the unprocessed substrate placement part 61 is disposed on the processed substrate placement part 62 . As shown in the enlarged configuration example in FIG. 5 , the unprocessed substrate placement unit 61 and the processed substrate placement unit 62 include: boxes 63 and 64 along the first horizontal direction X and on the side of the indexing robot 26 and Both sides of the main transfer robot 8L are open; and substrate holders 65 , 66 are disposed inside boxes 63 , 64 . The substrate holders 65 and 66 have a plurality of (for example, ten) substrate support members 67 and 68 arranged in the vertical direction Z. Each of the substrate supporting members 67 and 68 is configured to support the peripheral portion of the lower surface of one substrate W from below and hold the substrate W in a horizontal posture. Thereby, the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 can stack a plurality of (for example, 10) substrates W in a horizontal posture on these substrate holders 65 and 66 with intervals in the vertical direction Z, respectively. state to hold a plurality of substrates W.

As shown in Figure 2, in the mode of penetrating the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is to say, forming a connection with the substrate in the manner of penetrating the partition wall adjacent to the index block 2 and the processing block 3 The mounting portion 6L corresponds to the window 4L. The index robot 26 can access the substrate mounting portion 6L through the window 4L, and can carry in and out the substrate W from the substrate mounting portion 6L.

The dummy substrate housing portion 7L is provided at a different height from the substrate mounting portion 6L, and is disposed below the substrate mounting portion 6L in the transfer space 52L in the present embodiment. The dummy substrate housing portion 7L is provided so as to overlap with the substrate mounting portion 6L in plan view. More specifically, when the substrate W is held by the substrate mounting portion 6L and the dummy substrate DW is held by the dummy substrate storage portion 7L, the dummy substrate storage portion 7L is arranged so that the substrate W and the dummy substrate DW overlap each other in plan view. The overlapping of the substrate W and the dummy substrate DW in plan view may be partial or overall, that is, the dummy substrate DW may overlap substantially the entirety of the substrate W.

The dummy substrate storage unit 7L is arranged between the lower partition wall 15 and the intermediate partition wall 16, and the main transfer robot 8L is arranged within a height range that can be accessed. The rear partition wall 2 a of the index block 2 and the front partition wall 3 a of the processing block 3 , that is, the partition wall adjacent to the index block 2 and the processing block 3 , are located in front of the dummy substrate storage portion 7L, that is, on the side of the index block 2 . No windows corresponding to the dummy substrate housing portion 7L are provided in these partition walls. Therefore, in the present embodiment, the index robot 26 cannot access the dummy substrate storage section 7L.

As shown in the enlarged configuration example in FIG. 6 , the dummy substrate storage unit 7L includes a dummy substrate holder 71 . The configuration of the dummy substrate holder 71 may be substantially the same as the configuration of the substrate holders 65 and 66 of the substrate mount portion 6L. However, the number of dummy substrates DW that can be held by the dummy substrate holder 71 is not necessarily equal to the number of substrates that can be held by the substrate holders 65 and 66 . Specifically, the dummy substrate holder 71 has a plurality of (for example, 12) dummy substrate support members 72 arranged in the vertical direction. Each of the dummy substrate supporting members 72 is configured to support the peripheral portion of the lower surface of one dummy substrate DW from below and hold the dummy substrate DW in a horizontal posture. The dummy substrate storage unit 7L can hold a plurality of dummy substrates DW in a state where the dummy substrate holders 71 are stacked horizontally with intervals in the vertical direction Z. That is, the dummy board storage section 7L has a plurality of stages (in this embodiment, the same number as the number of processing units included in the first processing block layer BL) slots (hereinafter referred to as "dummy board slots DL1 to DL1"). DL12"), a plurality of slots are stacked in the up and down direction in a manner of accommodating each dummy substrate DW in a horizontal posture. A dummy substrate sensor (not shown) may also be provided, and the dummy substrate sensor is used to detect whether there is a dummy substrate DW in each of the dummy substrate slots DL1 to DL12. In this embodiment, the dummy board storage part 7L is different from the board|substrate mounting part 6L, and the box which surrounds the dummy board|substrate DW accommodated does not need to be provided. Of course, such a box may also be provided.

As shown in FIG. 2 , the main transfer robot 8L is arranged in the transfer space 52L. The main transfer robot 8L includes: a hand 81 for holding a substrate in a horizontal posture; and a hand driving mechanism 82 for driving the hand 81 . A plurality of (for example, two) hands 81 may be provided. The hand driving mechanism 82 can move the hand 81 in the first horizontal direction X, the second horizontal direction Y, and the vertical direction Z, and make the hand 81 revolve around the vertical rotation axis. The hand driving mechanism 82 includes two pillars 83 , a vertical movement part 84 , a horizontal movement part 85 , a rotation part 86 and an advancing and retreating part 87 . The hand part 81 is coupled to the advancing and retreating part 87 . When a plurality of hands 81 are provided, it is preferable to provide a plurality of advancing and retreating portions 87 corresponding to the plurality of hands 81 .

The two pillars 83 are arranged at intervals along the first horizontal direction X, and are respectively fixed to the side walls of the conveyance space 52L. The two pillars 83 extend in the vertical direction Z, and function as guide rails for guiding the vertical movement of the vertical movement part 84 . The vertical moving part 84 is in the form of a guide rail, extends in the first horizontal direction X across the two pillars 83 , and is connected to the two pillars 83 at both ends. The vertical movement unit 84 is configured to move in the vertical direction with respect to the pillars 83 while being guided by the two pillars 83 . The horizontal movement unit 85 is supported by the vertical movement unit 84 and is configured to move in the first horizontal direction X relative to the vertical movement unit 84 while being guided by the vertical movement unit 84 . The rotating part 86 is supported by the horizontal moving part 85 . The rotation unit 86 is configured to rotate around a vertical rotation axis on the horizontal movement unit 85 . The advancing and retreating portion 87 is coupled to the rotating portion 86 . The advancing and retreating portion 87 advances and retreats in the horizontal direction relative to the rotation axis, whereby the hand 81 advances and retreats in the horizontal direction.

With such a configuration, the main transfer robot 8L can make the hand 81 access the substrate placement part 6L, and transfer the substrate W between the main transfer robot 8L and the substrate placement part 6L. The main transfer robot 8L can further enable the hand 81 to access any processing units 11L to 43L in the first processing block layer BL, and can perform substrate W or simulation between the main transfer robot 8L and the processing units 11L to 43L. Substrate DW transfer. In addition, the main transfer robot 8L enables the hand 81 to access the dummy substrate storage section 7L, and transfers the dummy substrate DW between the main transfer robot 8L and the dummy substrate storage section 7L. Furthermore, the main transfer robot 8L can transfer the substrate W held by the hand 81 or the dummy substrate DW between the substrate mounting part 6L, the processing units 11L to 43L, and the dummy substrate storage part 7L in the first processing block layer BL. .

Since the configuration of the second processing block layer BU is substantially the same as that of the first processing block layer BL, repeated descriptions will be omitted as much as possible below, and different configurations will be mainly described. The configuration of the elements with the same names as in the case of the first processing block layer BL is substantially the same. The second processing block layer BU is composed of a plurality of (12 in this embodiment) processing units 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U (hereinafter collectively referred to as the processing of the second processing block layer BU) The units are referred to as “processing units 11U to 43U”), and a plurality of processing units 11U to 13U, 21U to 23U, 31U to 33U, and 41U to 43U constitute the second processing unit group. The second processing block layer BU further includes a substrate placement part 6U, a dummy substrate storage part 7U, and a main transfer robot 8U. The first liquid supply part 91 to the fourth liquid supply part 94 and the first exhaust part 101 to the fourth exhaust part 104 are throughout the first processing block layer BL and the second processing block layer BU and along the vertical direction Z configuration.

The configuration of the plurality of processing units 11U to 43U in the second processing block layer BU is substantially equal to the configuration of the plurality of processing units 11L to 43L in the first processing block layer BL. The second processing block layer BU is equipped with the first processing unit stacking part S1U to the fourth processing unit stacking part S4U, and the first processing unit stacking part S1U to the fourth processing unit stacking part S4U are respectively equipped with a plurality of layers stacked in the vertical direction Z. Stage (three stages in this embodiment) processing units 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U.

The first processing unit stacking portion S1U to the fourth processing unit stacking portion S4U of the second processing block layer BU are respectively connected to the first processing unit stacking portion S1L to the fourth processing unit of the first processing block layer BL when viewed from the top. The stacked parts S4L are arranged so as to overlap each other. Moreover, the first processing unit stacks S1L, S1U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a first tower T1, and the first tower T1 is stacked with a plurality of Segment (six in this embodiment) processing units 11L, 12L, 13L, 11U, 12U, 13U. Similarly, the second processing unit stacks S2L, S2U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a second tower T2, and the second tower T2 is stacked with Multiple stages (six stages in this embodiment) processing units 21L, 22L, 23L, 21U, 22U, 23U. Furthermore, the third processing unit stacks S3L, S3U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a third tower T3, and the third tower T3 is stacked with Multiple stages (six stages in this embodiment) processing units 31L, 32L, 33L, 31U, 32U, 33U. Likewise, the fourth processing unit stacks S4L, S4U of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a fourth tower T4, and the fourth tower T4 is stacked There are a plurality of stages (six stages in this embodiment) of processing units 41L, 42L, 43L, 41U, 42U, and 43U.

The transportation space 52U, which is defined in the second processing block layer BU and used to provide the transportation path 51U, overlaps with the transportation space 52L of the first processing block layer BL. The transfer space 52U in the second processing block layer BU is partitioned from below by the middle partition wall 16 and partitioned from above by the upper partition wall 17 . The upper partition wall 17 is disposed at a height integrated with the upper surfaces of the uppermost processing units 13U, 23U, 33U, and 43U of the first to fourth towers T1 to T4.

The arrangement of the substrate mount portion 6U in plan view is the same as that of the first processing block layer BL. That is, the substrate placement unit 6U is arranged between the index robot 26 and the main transfer robot 8U, and is arranged at an end portion on the side of the index robot 26 in the transfer space 52U. The substrate mounting part 6U of the second processing block layer BU is arranged so as to overlap the substrate mounting part 6L of the first processing block layer BL in plan view. The board|substrate mounting part 6U is arrange|positioned at the height between the intermediate partition wall 16 and the upper partition wall 17 in the up-down direction Z. In the present embodiment, the substrate mounting portion 6U is disposed below the middle height of the height range from the intermediate partition wall 16 to the upper partition wall 17 . More specifically, the substrate placement unit 6U is arranged at the highest position within the height range accessible by the index robot 26 . The vertical direction position of the board|substrate mounting part 6U needs to be within the height range which the index robot 26 can access, and the main transfer robot 8U must fall within the height range which can access. As in the case of the first processing block layer BL, the substrate mounting portion 6U includes: an unprocessed substrate mounting portion 61 for mounting an unprocessed substrate W; and a processed substrate mounting portion 62 for mounting The processed substrate W. The configurations of the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 are the same as those of the substrate mounting portion 6L of the first processing block layer BL (see FIG. 5 ).

In the way of penetrating the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is, penetrating through the partition wall adjacent to the index block 2 and the processing block 3, a corresponding substrate mounting portion 6U is formed. Windows 4U. The index area robot 26 can access the substrate mounting part 6U through the window 4U, and can carry in and out the substrate W from the substrate mounting part 6U. The dummy substrate storage unit 7U is provided at a different height from the substrate placement unit 6U, and is disposed above the substrate placement unit 6U in the transfer space 52U in the present embodiment. The dummy substrate housing portion 7U is provided so as to overlap with the substrate mounting portion 6U in plan view. More specifically, when the substrate W is held by the substrate mounting portion 6U and the dummy substrate DW is held by the dummy substrate storage portion 7U, the dummy substrate storage portion 7U is arranged so that the substrate W and the dummy substrate DW overlap each other in plan view. The overlapping of the substrate W and the dummy substrate DW in plan view may be partial or overall, that is, the dummy substrate DW may overlap substantially the entirety of the substrate W. The dummy substrate storage unit 7U is arranged at a height between the upper partition wall 17 and the middle partition wall 16, and the main transfer robot 8U is arranged within a height range that can be accessed. The rear partition wall 2 a of the index block 2 and the front partition wall 3 a of the processing block 3 , that is, the partition wall adjacent to the index block 2 and the processing block 3 , are located in front of the dummy substrate housing portion 7U, that is, on the side of the index block 2 . No window corresponding to the dummy substrate storage portion 7U is provided in the rear partition wall 2a and the front partition wall 3a. Therefore, the index robot 26 cannot access the dummy substrate storage unit 7U.

The configuration of the dummy substrate storage unit 7U may be substantially the same as the configuration of the dummy substrate storage unit 7L of the first processing block layer BL (see FIG. 6 ). The dummy substrate housing section 7U has a plurality of slots (in this embodiment, the same number as the number of processing units included in the second processing block layer BU) slots (hereinafter referred to as "dummy substrate slots DU1 to DU12") , the plurality of slots are stacked up and down in the manner of accommodating each dummy substrate DW in a horizontal posture. It may also be provided with a dummy substrate sensor, which is used to detect whether there is a dummy substrate DW in each of the dummy substrate slots DU1 to DU12 .

The main transport robot 8U is arranged in the transport space 52U. The main transfer robot 8U includes: a hand 81 for holding a substrate in a horizontal posture; and a hand driving mechanism 82 for driving the hand 81 . The hand driving mechanism 82 includes two pillars 83 , a vertical movement part 84 , a horizontal movement part 85 , a rotation part 86 and an advancing and retreating part 87 . These configurations are the same as those of the main transfer robot 8L of the first processing block layer BL. The main transfer robot 8U is configured to be able to access the substrate placement unit 6U, the processing units 11U to 43U, and the dummy substrate storage unit 7U. The main transfer robot 8U is an example of a first transfer unit for transferring the substrate W between the substrate mounting portion 6U and the processing units 11U to 43U and for transferring the dummy substrate DW between the dummy substrate storage portion 7U and the processing units 11U to 43U. .

The first processing block layer BL and the second processing block layer BU are partitioned by the intermediate partition wall 16 , and the product substrate W or the dummy substrate DW cannot be transported across the intermediate partition wall 16 . In other words, the main transfer robot 8L of the first processing block layer BL is configured so that none of the processing units 11U to 43U, the dummy substrate storage portion 7U, and the substrate mounting portion 6U of the second processing block layer BU can be accessed. Similarly, the main transfer robot 8U of the second processing block layer BU is configured such that none of the processing units 11L to 43L, the dummy substrate storage portion 7L, and the substrate mounting portion 6L of the first processing block layer BL can access.

The first liquid supply unit 91 to the fourth liquid supply unit 94 define a liquid piping space, and the liquid piping space accommodates a group of piping for supplying processing liquid used in the processing units 11L to 43L, 11U to 43U. The liquid piping space partitioned by each of the first liquid supply part 91 to the fourth liquid supply part 94 penetrates the first processing block layer BL and the second processing block layer BU in the vertical direction Z. Each of the first liquid supply part 91 to the fourth liquid supply part 94 accommodates the processing liquid piping 56, and the processing liquid piping 56 is stacked in six stages at the same position in the vertical direction Z in a plan view to form the first tower T1 to the second tower T1. Six processing units of four towers T4 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U, 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L, 43L, 41U, 42U, and 43U supply processing liquid. The first liquid supply part 91 to the fourth liquid supply part 94 may further contain processing liquid-related equipment. The processing liquid-related equipment is a group of valves and flowmeters installed in the middle of the piping to temporarily store the processing liquid. Tanks for tanks, pumps for transporting liquids, etc.

The first exhaust section 101 to the fourth exhaust section 104 define an exhaust piping space, and the exhaust piping space accommodates a group of piping for exhausting the atmosphere inside the processing unit. The exhaust piping space partitioned by each of the first exhaust part 101 to the fourth exhaust part 104 penetrates the first processing block layer BL and the second processing block layer BU in the vertical direction Z. Each of the first exhaust section 101 to the fourth exhaust section 104 accommodates exhaust pipes 76, and the exhaust pipes 76 are used to form the first tower by stacking six sections from the same position in the vertical direction Z in a plan view. Six processing units 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U, 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L from T1 to the fourth tower T4 , 43L, 41U, 42U, and 43U are guided to exhaust equipment outside the substrate processing apparatus 1 . A switching mechanism 77 can also be further accommodated in the first exhaust part 101 to the fourth exhaust part 104, and the switching mechanism 77 is configured according to the type of processing in the processing unit (more specifically, the type of processing liquid). The exhaust piping 76 is switched. Although not shown, the first exhaust unit 101 includes an actuator group for driving the switching mechanism 77 .

The carrier transport mechanism 300 (see FIG. 1 ) operates in such a manner that the carrier C containing the unprocessed product substrate W is carried into the carrier holding part 25, and the carrier C containing the processed product substrate W is moved into the carrier holding part 25. Take out from the carrier holding part 25. In addition, the carrier transport mechanism 300 is operated so that the supply dummy carrier DC storing the unused dummy substrate DW is carried into the carrier holding part 25, and the unused dummy substrate DW is transferred from the supply dummy carrier DC to the carrier holding part 25. After the dummy carrier DC is removed, the dummy carrier DC is carried out from the carrier holding part 25 . Furthermore, the carrier transport mechanism 300 is operated in such a manner that the dummy carrier DC for recovering the used dummy substrate DW is loaded into the carrier holding unit 25 and stored in the used dummy substrate DW. After reaching the dummy carrier DC for recovery, the dummy carrier DC for recovery is carried out from the carrier holding unit 25 . The dummy carrier DC may have substantially the same configuration as the carrier C for the product substrate W.

Typically, the carrier transport mechanism 300 includes an overhead traveling unmanned transport tool (OHT: Overhead Hoist Transport; suspended transport device). The carrier transfer mechanism 300 transfers the carrier C between the carrier placement place 350 and the carrier holding part 25 (loading port). In addition, the carrier transport mechanism 300 transports the dummy carrier DC between the dummy carrier placement place 351 and the carrier holding part 25 .

The carrier transport mechanism 300 is controlled by the host computer 150 to transport the carrier C and the dummy carrier DC. The host computer 150 can communicate with the controller 110 of the substrate processing apparatus 1 through the communication line 170 . The controller 110 controls the index robot 26 and the main transfer robots 8L and 8U to transfer the substrate W and the dummy substrate DW. In addition, the controller 110 controls each part of the processing units 11L to 43L, 11U to 43U to execute the substrate processing in the processing units 11L to 43L, 11U to 43U and the dummy processing using the dummy substrate DW.

FIG. 7 is a schematic cross-sectional view for explaining a configuration example of the processing units 11L to 43L, 11U to 43U (hereinafter collectively referred to as “processing units 11L to 43U”). The processing units 11L to 43U include: a unit partition 36 forming a processing chamber 35 (chamber); a processing cup 39 disposed in the unit partition 36; a spin chuck 40 forming a processing chamber 35 (chamber); It is arranged in the processing cover 39 ; and the nozzle 55 supplies the processing liquid to the substrate W or the dummy substrate DW held by the rotary jig 40 .

The cell partition wall 36 includes: a side wall 36a, which is, for example, substantially rectangular in plan view; a top wall 36b, which is above the section; and a bottom wall 36c, which is below the section. One side of the side wall 36a has a substrate loading and unloading port 37 facing the transportation space 52U and extending along the first horizontal direction X and the vertical direction Z for loading and unloading the substrate W and the dummy substrate DW. The substrate loading/unloading port 37 may have a slot shape extending in the first horizontal direction X. A shutter 38 for opening and closing the substrate loading and unloading port 37 is arranged. The substrate W and the dummy substrate DW are carried in from the substrate carry-in/out port 37 formed in the cell partition wall 36 and transferred to the rotation jig 40 .

The spin fixture 40 includes: a spin base (spin base) 45, which holds a substrate W or a dummy substrate DW in a horizontal posture; and a spin motor (spin motor) 46, which makes the spin base 45 rotate around a vertical rotation axis. . The autorotation jig 40 can also be a vacuum type jig, which is used to absorb and hold the lower surface of the substrate W or the dummy substrate DW on the upper surface of the autorotation base 45 . In addition, the rotation base 45 may also constitute a mechanical jig, which has a circular planar shape corresponding to the substrate W or the dummy substrate DW, and is provided with three or more holding pins arranged at intervals in the circumferential direction of the peripheral portion. , the substrate W or the dummy substrate DW is held by these holding pins.

The processing units 11L to 43U include one or more nozzles 55 , and supply the processing liquid to the substrate W or the dummy substrate DW held by the rotary chuck 40 . In this embodiment, a plurality of nozzles 55 are provided. The plurality of nozzles 55 may also include: a plurality of chemical liquid nozzles, which are used to spray a plurality of types of chemical liquids respectively. The processing liquid is supplied from the nozzle 55 to the surface of the rotating substrate W or the dummy substrate DW held by the rotation chuck 40 . The nozzle 55 is connected to the processing liquid pipe 56 arranged through the first liquid supply part 91 to the fourth liquid supply part 94 . The processing liquid pipe 56 is looped through the first liquid supply part 91 to the fourth liquid supply part 94 and connected to the processing liquid supply source 54 . A valve 59 for opening and closing the flow path of the processing liquid piping 56 is interposed in the middle of the processing liquid piping 56 . In addition, a pump 60 for sending the processing liquid toward the nozzle 55 is interposed in the middle of the processing liquid piping 56 . The valve 59 and the pump 60 are arranged in the first liquid supply part 91 to the fourth liquid supply part 94 . The processing liquid supply source 54 supplies chemical liquid such as etching liquid or cleaning liquid such as pure water (deionized water). A plurality of processing liquid piping 56 and a corresponding plurality of nozzles 55 may also be provided according to the type of processing liquid. Part or all of the plurality of nozzles 55 may be in the form of a moving nozzle that moves above the substrate W or the dummy substrate DW along the upper surface of the substrate W or the dummy substrate DW. The moving nozzle may also have a structure (refer to FIG. 1 ) in which a base end of a horizontal nozzle arm 57 is supported by a swing shaft 58 disposed on the side of the rotation jig 40 so that the swing shaft 58 rotates around a vertical axis. Some or all of the plurality of nozzles 55 may be fixed nozzles whose relative positions with respect to the rotary jig 40 do not change.

The atmosphere in the unit partition wall 36 is exhausted through the exhaust connection pipe 75 penetrating the unit partition wall 36 . The exhaust connection pipe 75 is connected to the exhaust pipes 76 arranged in the first exhaust section 101 to the fourth exhaust section 104 . The exhaust connection pipe 75 may be connected to a plurality of exhaust pipes 76 via a switching mechanism 77 . The switching mechanism 77 is operated in the following manner: For example, in response to the type of processing liquid (such as the type of chemical liquid) ejected from the plurality of nozzles 55, the exhaust from the exhaust connection pipe 75 is guided to the area assigned in advance corresponding to the processing. Exhaust piping 76 for the type of liquid.

FIG. 8 is a block diagram for explaining the structure related to the control of the substrate processing apparatus 1 . The substrate processing apparatus 1 includes a controller 110 . The controller 110 may also be a computer including a processor 111 (CPU (Central Processing Unit; Central Processing Unit)) and a memory 112 (memory unit). The processor 111 executes the program 120 stored in the memory 112 . Thus, the controller 110 has a function as a schedule creation unit and a function as a transport control unit; the schedule creation unit creates a transport schedule for use by the index robot 26 and the main transport robot 8L and 8U transport the substrate W or the dummy substrate DW; the transport control unit controls the transport of the substrate W and the dummy substrate DW based on the transport schedule created by the schedule creation unit. Furthermore, the controller 110 has a function as a substrate processing control unit, and the substrate processing control unit implements a substrate processing operation in which the substrate W is processed by the processing units 11L to 43U. The controller 110 further functions as a dummy processing control unit that realizes a dummy processing operation that executes a dummy process using the dummy substrate DW in the processing units 11L to 43U. For these substrate transport operations, substrate processing operations, and simulation processing operations, the controller 110 controls various control objects included in the substrate processing apparatus 1 . Control objects include driving units included in the index robot 26 , the main transfer robots 8L and 8U, and the processing units 11L to 43U. Moreover, the control object of the controller 110 includes: the actuator group, which is arranged in the first exhaust part 101 to the fourth exhaust part 104, and includes the actuator group arranged in the first liquid supply part 91 to the fourth liquid supply part. 94 valve 95 and pump 60.

Various data 130 are stored in the memory 112 . The data 130 includes: a products recipe (products recipe) 131 for processing the substrate W for products; and a dummy processing recipe 132 for dummy processing using the dummy substrate DW. The product recipe 131 is data for specifying the transport operation of the substrate W and the processing content of the substrate W. The simulation processing recipe 132 is data for specifying the transfer operation of the dummy board DW and the content of processing using the dummy board DW. The controller 110 controls the control object according to the product recipe 131 when processing the substrate W; and controls the control object according to the simulation processing recipe 132 when executing the simulation process.

Product recipe 131 may also be assigned and stored in memory 112 by data communication from host computer 150 communicatively connected to controller 110 . The simulation processing recipe 132 can also be given and stored in the memory 112 through data communication from the host computer 150 in the same way. In addition, these product recipes 131 and simulation processing recipes 132 can also be input or edited by the operator using the user interface 140 connected to the controller 110 . The simulation processing recipe 132 can also be automatically generated by the controller 110 according to the contents of the product recipe 131 . The product recipe 131 and the simulation processing recipe 132 do not need to be of the same type, and a plurality of product recipes 131 or a plurality of simulation processing recipes 132 can also be stored in the memory 112 . The user interface 140 includes, for example, an input device and a display device. The user interface 140 is an example of a notification unit, which is used to arouse various attentions of the user. For example, the user interface 140 notifies the user by displaying an attention call message or the like when the dummy board DW has reached the expiration date and needs to be replaced.

For example, the simulation processing recipe 132 includes a preprocessing recipe that prescribes preprocessing in which the same processing as that of the substrate W for the product is performed on the dummy substrate DW. The preprocessing recipe may be a recipe for replacing substrates carried into the processing units 11L to 43U from the substrates W for products with dummy substrates DW in the product recipe 131 . Such a pretreatment recipe can also be automatically generated by the controller 110 based on the product recipe 131 . For example, in the case of performing a process for supplying a high-temperature processing liquid to the substrate W, by performing pre-processing, the high-temperature processing liquid can be guided to the nozzle 55, and the processing liquid piping can be heated by the high-temperature processing liquid. 56 and the interior of the processing units 11L to 43U. Thereby, the processing liquid at an appropriate temperature can be supplied to the substrate W for a product in an environment with appropriate temperature control. In this way, the pre-processing is an example of pre-processing, and the processing environments of the processing units 11L to 43U are adjusted in order to properly process the substrate W for products.

Furthermore, the dummy processing recipe 132 includes a unit cleaning recipe for cleaning the inside of the processing units 11L to 43U while holding the dummy substrate DW in the rotary jig 40 . In the unit cleaning process according to the unit cleaning recipe, the dummy substrate DW is held and rotated by the rotary jig 40 , and a cleaning solution (chemical solution or pure water) is supplied to the dummy substrate DW in this state. Thereby, the cleaning solution subjected to the centrifugal force on the dummy substrate DW is scattered around the rotation jig 40 to clean the inside of the processing cover 39 . Since the injection position of the cleaning solution relative to the inner wall surface of the processing cover 39 is vertically changed by moving the processing cover 39 up and down as required, the inner wall surface of the processing cover 39 can be cleaned efficiently. In addition, the dummy substrate DW can be arranged above the upper end of the processing cover 39 by the vertical movement of the processing cover 39 or the vertical movement of the rotation jig 40, and the cleaning solution can be supplied to the inside of the processing chamber 35 outside the processing cover 39. , thereby cleaning the inside of the processing chamber 35.

The data 130 stored in the memory 112 further includes: a dummy board table 133 , which associates a plurality of processing units 11L to 43U with the dummy board slots DL1 to DL12 and DU1 to DU12 of the dummy board storage parts 7L and 7U. Unique dummy board slot numbers (dummy board slot identification information) are attached to the plurality of dummy board slots DL1 to DL12, DU1 to DU12 respectively. Also, a corresponding one of the dummy board slot numbers is assigned to each of the processing units 11L to 43U. The dummy substrate table 133 is a list of a plurality (12 in this embodiment) of the processing units 11L to 43U of the first processing block layer BL and a plurality of ( In the present embodiment, there are 12) dummy substrate slot numbers are assigned one-to-one correspondence. In addition, the dummy substrate table 133 is a combination of a plurality of (12 in this embodiment) processing units 11L to 43U of the second processing block layer BU and a plurality of dummy substrate storage parts 7U of the second processing block layer BU. Each (12 in the present embodiment) dummy substrate slot numbers are assigned a one-to-one correspondence. Therefore, the dummy substrate table 133 is a list of a plurality of (24 in this embodiment) processing units 11L to 43U included in the substrate processing apparatus 1 and a plurality of dummy substrate storage units 7L and 7U (in this embodiment, 24) Slot numbers are given one-to-one correspondence.

The data 130 stored in the memory 112 further includes simulated substrate history data 134 . The dummy board history data 134 includes data (usage history information) for indicating the use history of the dummy board DW, which is accommodated to correspond to a plurality of dummy board slot numbers of the dummy board storage parts 7L and 7U, respectively. Dummy baseboard slots DL1 to DL12, DU1 to DU12. Preferably, the usage history includes the number of times (cumulative times) when the dummy substrate DW is used in the processing of the processing units 11L to 43U, the usage time (cumulative time) of the dummy substrate DW being used in the processing of the processing units 11L to 43U, and the simulation At least one of the histories of the processing contents received by the substrate DW in the processing units 11L to 43U. The history of the processing content can be used as information showing the consumption state of the dummy substrate DW. The number of times of use and the time of use may also be information for indicating the consumption state of the dummy substrate DW. Another example of the information for showing the consumption state of the dummy substrate DW is the thickness of the dummy substrate DW. The thickness of the dummy substrate DW can be calculated from the use history information, and can also be detected by disposing dummy substrate thickness sensors in the dummy substrate accommodating parts 7L and 7U, for example.

The data 130 stored in the memory 112 includes: threshold value data 136 (lifetime threshold value information), which is used for comparison with the simulated substrate history data 134 (especially usage history information). Threshold value data 136 may include a use count threshold for comparison with use times, and may also include a use time threshold for comparison with use time. In addition, the threshold data 136 may also include consumption status thresholds for comparison with the consumption status of the simulated substrate DW. For example, the consumption state information of the dummy substrate DW can be calculated based on the use history information of the dummy substrate DW, and the usage period of the dummy substrate DW can be determined by comparing the consumption state information with the consumption state threshold value. The consumption status information of the dummy substrate DW can also be the thickness of the dummy substrate DW.

The data 130 stored in the memory 112 further includes: unit usage history data 135 , which represents the unit usage history of each processing unit 11L to 43U. Preferably, the unit use history data 135 includes the number of substrates processed by each processing unit 11L to 43U and the non-use duration, which represents the continuous time that each processing unit 11L to 43U is not used for substrate processing. Since the internal environment of the processing units 11L to 43U gradually deteriorates due to repeated substrate processing, it is preferable to set an appropriate upper limit on the number of substrates that can be continuously processed without maintenance. In addition, when the time for which the substrate W is not processed becomes longer, the environment inside the processing units 11L to 43U gradually deteriorates. Specifically, the chemical solution adhering to the inner wall of the processing cover 39 or the like dries and crystallizes to cause particles. Also, in the case of using a treatment liquid whose temperature is higher than room temperature, if the flow of the treatment liquid is blocked for a long time due to the continuation of non-use, the temperature of the treatment liquid pipe 56 or the nozzle 55 will drop. Therefore, when the processing liquid is discharged next time, the heat of the processing liquid is taken away by the processing liquid pipe 56 or the nozzle 55, and the temperature of the processing liquid just discharged may become inappropriate. Therefore, it is preferable to set an appropriate upper limit also for the non-use duration. Comparing the unit use history data 135 (the number of substrates processed, the non-use duration, etc.) with the corresponding set values, it can be determined whether the processing units 11L to 43U need to be maintained.

FIG. 9 is a flowchart for explaining the operation of the controller 110 related to the simulation process. The controller 110 executes the process of FIG. 9 in parallel or sequentially for each of the plurality of processing units 11L to 43U. The controller 110 judges whether or not the processing of the substrate W for a product is performed in the target processing units 11L to 43U (step A1 ). When the processing of the substrate W in the processing units 11L to 43U is completed and the processed substrate W is carried out from the processing units 11L to 43U (step A1: No), the controller 110 refers to the unit use history of the processing units 11L to 43U Data 135 to determine whether the number of substrates processed has reached the set value (step A2). When the number of substrates to be processed is equal to or greater than the set value (step A2: Yes), the controller 110 judges that the unit cleaning execution condition (an example of the maintenance execution condition) is sufficient, and follows to clean the inside of the processing units 11L to 43U. The unit cleaning recipe executes unit cleaning processing (an example of maintenance processing) (step A3). In addition, the controller 110 resets the number of substrates processed by the processing unit to an initial value (for example, zero) and updates the unit use history data 135 (step A4 ).

The unit cleaning process is an example of a simulation process, and includes a transfer schedule creation step A30, a dummy board loading step A31, a dummy processing step A32, and a dummy board storage step A33. The transportation schedule creation step A30 is a step for creating a transportation plan (transportation schedule) for simulation processing. The dummy substrate loading step A31 is a step of controlling the main transport robots 8L and 8U according to the created transport schedule. Thereby, the main transfer robots 8L, 8U unload the dummy substrate DW from the corresponding dummy substrate slots DL1 to DL12 , DU1 to DU12 , and carry it toward and into the processing units 11L to 43U. The dummy processing step A32 is a step for executing processing using the dummy substrate DW in the processing unit, and here is cleaning processing inside the processing unit. Dummy substrate storage step A33 is the following step: after cleaning the inside of the processing unit, the dummy substrate DW is carried out from the processing unit according to the transport schedule, and transported and stored in the original dummy substrate slots DL1 to DL12, DU1 to DU12 . The controller 110 refers to the dummy board table 133 to specify the dummy board slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and creates a transfer schedule for the dummy board loading step A31 and the dummy board receiving step A33 .

When the unit cleaning process is finished, the controller 110 judges whether pre-processing for adjusting the processing environment (processing conditions) of the processing units 11L to 43U is necessary (steps A5, A6). Specifically, the controller 110 checks whether or not a processing request (processing reservation) for a product substrate has been given from the host computer 150 (step A5). When given a processing request for a product substrate (step A5: Yes), the controller 110 judges whether the non-use duration of the processing units 11L to 43U has reached a set value (step A6). In the case where the non-use duration is more than the set value (step A6: Yes), that is, in the case where the processing units 11L to 43U have not been used for a substrate W for a product for a predetermined long time, the controller 110 determines that Preprocessing is required, that is, it is determined that the preprocessing execution condition (an example of maintenance execution condition) is sufficient.

When it is determined that pre-processing is required, the controller 110 executes pre-processing according to the pre-processing recipe (pre-processing step A7). Specifically, the controller 110 refers to the dummy board table 133 to specify the dummy board slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and accordingly creates a transfer schedule for preprocessing (transfer schedule program making step A70). Furthermore, the controller 110 controls the main transport robots 8L and 8U to carry out the dummy substrate DW from the specified dummy substrate slots according to the created transfer schedule, and transfers the dummy substrate DW to the processing units 11L to 43U (simulation Substrate loading step A71). After the transfer of the dummy substrate DW, the host computer 150 executes the same processing as that for the substrate W for a product on the dummy substrate DW in the processing units 11L to 43U (simulation processing step A72 ). When the processing ends, the host computer 150 controls the main transfer robots 8L and 8U according to the transfer schedule, takes out the dummy substrate DW from the processing units 11L to 43U and transfers it to the original dummy substrate slot, and stores the dummy substrate DW. to the dummy board slot (dummy board accommodation step A73). Thus, when performing the preprocessing, the controller 110 resets the non-use duration to an initial value (for example, zero) and updates the unit usage history data 135 (step A8 ).

As described above, the controller 110 executes the pre-processing when a processing request (processing reservation) is given to the product substrate W. The preprocessing includes conveyance of the dummy substrate DW (dummy substrate loading step A71 ) and simulation processing using the dummy substrate DW (simulation processing step A72 ). Therefore, preprocessing (simulation substrate loading step A71 and/or simulation processing step A72) is performed in parallel with the substrate loading operation (product substrate loading step A20) or preprocessing (simulation processing step A72) is performed before the substrate loading operation (product substrate loading step A20). Substrate loading step A71 and/or simulation processing step A72); the substrate loading operation (product substrate loading step A20) is to hold the carrier C containing the product substrate W in the carrier holding part 25, and the indexing robot 26 moves from the carrier C The substrate W to be processed is taken out and conveyed toward the substrate placement parts 6L, 6U. At this time, the index robot 26 does not participate in the conveyance of the dummy substrate DW. Therefore, the transfer of the product substrate W by the index robot 26 is not hindered, and the dummy substrate DW can be transferred and pre-processed inside the processing block 3 .

In addition, although the product substrate carrying-in step A20 performed by the index robot 26 is shown in FIG. 9 for convenience of description, it does not mean that the front-rear relationship with the preprocessing step A7 is as shown in the figure. The product substrate carrying-in step A20 can also be performed (started) before the preprocessing step A7 or in parallel with the preprocessing step A7, and the product substrate carrying-in step A20 can also be performed (started) after the preprocessing step A7 as described above.

The preprocessing recipe prescribes the preprocessing which performs the processing corresponding to the substrate W for a product on the dummy substrate DW. Therefore, preprocessing is performed on the dummy substrate DW, whereby the dummy substrate DW is consumed. Specifically, the dummy substrate DW is pretreated with a chemical solution having an etching effect, whereby the surface of the dummy substrate DW is etched and the thickness of the dummy substrate DW is reduced. Therefore, when executing the preprocessing recipe, the controller 110 updates the dummy board history data 134 assigned to the dummy board slots DL1-DL12, DU1-DU12 corresponding to the processing units 11L-43U (step A9). For example, in the case that the simulated substrate history data 134 includes the use count data, the use count data is incremented.

When the preprocessing is finished, the controller 110 performs control according to the product prescription (step A12). Specifically, the controller 110 creates a transfer schedule for product substrate processing (transfer schedule creating step A120 ), and controls the index robot 26 and the main transfer robots 8L and 8U according to the transfer schedule. Thereby, the index robot 26 takes out the product substrate W from the carrier C, and mounts it on the substrate placement parts 6L, 6U. Next, the main transfer robots 8L, 8U take out the substrate W from the substrate placement parts 6L, 6U, and transfer it to the processing units 11L to 43U (substrate carrying-in step A121 ). Next, processing using a processing liquid (chemical liquid, cleaning liquid, etc.) is performed on the substrate W in the processing units 11L to 43U (processing step A122 ). After completion, according to the transport schedule, the main transport robots 8L, 8U take out the processed substrate W and transport it to the substrate placement parts 6L, 6U, and the index robot 26 stores the processed substrate W into the carrier C (substrate Containment Procedure A123). When there is an unprocessed substrate W (in the case of continuous processing of a plurality of substrates W) (step A13: Yes), the same operation is repeated. During this period, when the number of substrates processed by the processing unit reaches the set value (step A14: Yes), return to step A3 and perform unit cleaning. In the case of not continuous processing (step A13: NO), return to and repeat the processing starting from step A1.

If there is no processing request (processing reservation) from the host computer 150 (step A5: No), then the controller 110 judges whether the duration of the standby state, that is, the non-use duration has reached the set value (step A15). If the non-use duration does not reach the set value, it will enter the standby state. When the non-use duration reaches the set value (step A15: Yes), the controller 110 executes a preset maintenance process (step A16). The maintenance treatment may also be unit cleaning treatment. As in the case of step A3, the unit cleaning process may be a process using the dummy substrate DW (a type of dummy process), or may be a process not using the dummy substrate DW. In addition, the maintenance processing may be similar to the pre-processing. In addition, maintenance processing may be other processing. The maintenance process is mainly a process for maintaining the environment in the processing chamber 35 of the processing units 11L to 43U in a state suitable for processing the substrate W for products, and may be a process previously set by the user of the substrate processing apparatus 1 . In the case where the simulation process using the dummy substrate DW is performed as the maintenance process, the maintenance process includes: a transport schedule creation step A160 of creating a transport plan (transport schedule) for the maintenance process; and a step A161 of following this The handling plan is to take out the dummy substrate DW from the corresponding dummy substrate slot and move it into the processing unit; step A162 is to perform simulation processing using the dummy substrate DW in the processing unit; and step A163 is to perform after the processing of step A162 , according to the transport schedule, the dummy substrate DW is accommodated in the corresponding dummy substrate slot.

When there is no processing request (processing reservation) from the host computer 150, the controller 110 cannot automatically plan the same preprocessing as the product prescription 131. Therefore, it is preferable to perform preprocessing corresponding to the product processing (preprocessing step A7) when there is a processing request (processing reservation) from the host computer 150 even if maintenance processing is performed at any time (step A16).

The dummy substrate DW is introduced into the inside of the substrate processing apparatus 1 in advance and accommodated in the dummy substrate storage parts 7L, 7U. Specifically, the supply dummy carrier DC containing the dummy substrate DW is transferred to the carrier holding unit 25 by, for example, a carrier transport mechanism 300 (see FIG. 1 ) provided in the factory. The index robot 26 takes out the dummy substrate DW from the dummy carrier DC for supply, and conveys it to the substrate mounting parts 6L, 6U. The main transport robot 8L of the first processing block layer BL transports and stores the dummy substrate DW from the substrate loading unit 6L to the dummy substrate storage unit 7L. The main transport robot 8U of the second processing block layer BU transports and accommodates the dummy substrate DW from the substrate mounting portion 6U to the dummy substrate storage portion 7U. The controller 110 creates a transfer schedule (supply transfer schedule) for importing the dummy substrate DW, and controls the index robot 26 and the main transfer robots 8L and 8U according to the transfer schedule, thereby achieving the transfer operation described above .

When a new dummy board DW is imported and accommodated in the dummy board storage parts 7L, 7U, the controller 110 resets the dummy board history data 134 corresponding to the dummy board slot in which the new dummy board DW is housed. initial value. When the dummy substrate DW in the substrate processing apparatus 1 is replaced, the dummy substrate DW is conveyed from the dummy substrate storage parts 7L and 7U by the main transfer robots 8L and 8U and the index robot 26 to the recycling space held by the carrier holding part 25. Emulate the bearer DC. Specifically, when the dummy substrate DW to be replaced is accommodated in the dummy substrate storage section 7L of the first processing block layer BL, the main transport robot 8L transports the dummy substrate DW from the dummy substrate storage section 7L to the substrate mounting unit 7L. Department 6L. When the dummy substrate DW to be exchanged is stored in the dummy substrate storage section 7U of the second processing block layer BU, the main transfer robot 8U transports the dummy substrate DW from the dummy substrate storage section 7U to the substrate mounting section 6U. The index robot 26 transports and accommodates the dummy substrate DW placed on the substrate placement units 6L and 6U in the dummy carrier DC for recovery held by the carrier holding unit 25 . When a plurality of dummy substrates DW are to be replaced, the same operation is repeated. The controller 110 creates a transfer schedule (recovery transfer schedule) for replacing (discharging) the dummy substrate DW, and controls the index robot 26 and the main transfer robots 8L and 8U according to the transfer schedule, thereby achieving the above-described moving action.

10A and 10B are flowcharts for explaining the processing related to the replacement of the dummy substrate in the substrate processing apparatus. FIG. 10A shows an example of processing by the controller 110 of the substrate processing apparatus 1 , and FIG. 10B shows an example of processing by the host computer 150 . The controller 110 of the substrate processing apparatus 1 plans simulation processing (such as cleaning of a processing unit using the dummy substrate DW; simulation cleaning) (step S1), and updates the dummy substrate history data 134 in the memory 112 (step S2). The controller 110 further compares the dummy substrate history data 134 with the threshold value data 136, and determines whether the dummy substrate DW has reached the service life (step S3).

As described above, the dummy board history data 134 is created for each slot of the dummy board housing 7L, 7U, that is, for each dummy board DW, and shows the use history of each dummy board DW. In the present embodiment, a plurality of processing units and a plurality of slots of the plurality of dummy board storage parts 7L, 7U are associated one-to-one, so each dummy board DW is used for the dummy processing of only one processing unit. Therefore, when the controller 110 plans the simulation process (step S1), the simulated substrate history data 134 is updated (step S2), and based on the updated simulated substrate history data 134, it is judged whether the dummy substrate DW has reached the expiration date (step S3 ). For example, the dummy substrate history data 134 may also include usage times data of the dummy substrate DW. When the controller 110 plans the simulation processing of a certain processing unit (step S1 ), it increments and updates the usage count data of the dummy substrate DW corresponding to the processing unit (step S2 ). Next, the controller 110 judges that the dummy substrate DW has reached the expiration date when the use count data reaches a predetermined use count threshold value (an example of the threshold value data 136 ) (step S3: Yes).

When the dummy substrate DW has reached the usage limit (step S3: Yes), the controller 110 plans replacement of the dummy substrate DW (step S4). Furthermore, the controller 110 displays on the user interface 140 that the dummy substrate DW has reached the expiration date, and notifies the user for calling attention (step S5). As long as the dummy board DW has not reached the expiration date (step S3: No), the planning of dummy board replacement (step S4) and the notification for calling attention (step S5) can be omitted.

The controller 110 controls the transfer of the dummy substrate DW and the processing of the processing unit according to the simulation processing plan (step S6 ). Specifically, the controller 110 controls the main transport robots 8L, 8U to transport the dummy substrate DW from the dummy substrate storage parts 7L, 7U to the processing unit, and controls the processing unit to perform processing using the dummy substrate DW (for example, a chamber cleaning treatment).

When the controller 110 needs to replace the dummy substrate DW (step S7: Yes), that is, when the replacement of the dummy substrate DW is planned (step S4), it sends a dummy substrate replacement request to the host computer 150 (step S8; as a control function of the expiration date notifying part of device 110). When there is no plan to replace the dummy board (step S7: No), the dummy board replacement request is not sent.

When there is a dummy board replacement request (step S11: Yes), the host computer 150 determines whether to start replacement of the dummy board DW (step S12). For example, if it is desired that the processing of the product substrate W is given priority over the replacement of the dummy substrate DW, the determination is negative, and the dummy substrate replacement request remains. As long as it is determined that the replacement of the dummy substrate DW should be started (step S12: Yes), the host computer 150 controls the carrier transfer mechanism 300 to place the dummy carrier DC for recovery and the dummy carrier DC for supply from the dummy carrier. The carrier 351 is transported to the carrier holding unit 25 of the substrate processing apparatus 1 .

More specifically, the host computer 150 judges whether there is a dummy carrier DC for recycling in the dummy carrier placement place 351 (step S13), and if not, performs the process of preparing the dummy carrier DC for recycling ( Step S14). Such processing may also be alarm processing (notification that the dummy carrier DC for recycling is required) for urging the user to prepare the dummy carrier DC for recycling. After such processing, the host computer 150 plans the transfer of the dummy carrier DC for recovery by the carrier transfer mechanism 300, and instructs the carrier transfer mechanism 300 to execute the plan (step S15). If there is a dummy carrier DC for recovery in the dummy carrier placement place 351 (step S13: Yes), the processing of step S14 can be omitted. In addition, the host computer 150 judges whether there is a dummy carrier DC for supply in the dummy carrier place 351 (step S16), and if not, performs processing for preparing a dummy carrier DC for supply (step S17) . Such processing may be alarm processing (notification that the dummy carrier DC for supply is required) for prompting the user to prepare the dummy carrier DC for supply. After such processing, the host computer 150 plans the transfer of the dummy carrier DC for the supply of the carrier transfer mechanism 300, and instructs the carrier transfer mechanism 300 to execute the plan (step S18). If the dummy carrier DC for supply exists in the dummy carrier placement place 351 (step S16: YES), the process of step S17 can be omitted.

The dummy substrate replacement plan (step S4) performed by the controller 110 of the substrate processing apparatus 1 includes creating a collection and transportation schedule when the dummy carrier DC for recycling is held in the carrier holding section 25. The dummy substrate DW that has reached the expiration date is conveyed from the dummy substrate storage parts 7L and 7U to the dummy substrate carrier DC for recycling. The controller 110 controls the main transport robots 8L, 8U and the index robot 26 according to the recycling transport schedule. Thereby, the main transport robots 8L, 8U transport the dummy substrate DW that has reached the expiration date from the dummy substrate accommodating parts 7L, 7U to the substrate mounting parts 6L, 6U, and the index robot 26 places the dummy substrate DW from the substrate mounting part. The parts 6L and 6U are transported to the dummy carrier DC for recovery.

The dummy substrate replacement plan (step S4) performed by the controller 110 of the substrate processing apparatus 1 includes creating a supply and transfer schedule when the dummy carrier DC for supply is held in the carrier holding section 25. The unused dummy substrate DW is conveyed from the supply dummy substrate carrier DC to the dummy substrate storage parts 7L, 7U. The controller 110 controls the index robot 26 and the main transport robots 8L, 8U according to the supply and transport schedule. Thereby, the index transport robot 26 transports the unused dummy substrate DW from the supply dummy carrier DC to the substrate mounting portions 6L, 6U, and the main transport robots 8L, 8U transport the dummy substrate DW from the substrate mounting portion 6L and 6U are transported to the dummy substrate storage units 7L and 7U.

The recovery operation of the used dummy substrate DW and the supply operation of the unused dummy substrate DW may be performed separately in time, and some or all of these operations may be performed in a temporally overlapping manner. FIG. 11 is a timing chart for explaining an example of a specific operation. First, the simulation processing operation represented by grid-shaped blocks in FIG. 11 is as follows. The dummy substrate DW corresponding to the processing unit to be subjected to the simulation process is taken out from the dummy substrate storage units 7L, 7U by the main transport robots 8L, 8U, and carried into the target processing unit. When the processing unit finishes processing (dummy processing) using the dummy substrate DW, the dummy substrate DW is taken out by the main transfer robots 8L, 8U and stored in the dummy substrate storage parts 7L, 7U.

In the case where the dummy substrate DW has reached the expiration date due to the dummy processing, the controller 110 of the substrate processing apparatus 1 plans the dummy processing, for example, to the host computer 150 when the dummy substrate DW is discharged from the dummy substrate storage parts 7L, 7U. A dummy board replacement request (lifetime information) is sent (time t1). Taking this as an opportunity, the dummy substrate recovery operation represented by the horizontally striped squares in FIG. 11 is performed. The dummy board DW has reached the expiration date because it was used in the last dummy process. That is, the expiration date is reached after the simulation process performed at time t1.

The host computer 150 that has received the dummy substrate replacement request plans and executes the transfer of the dummy carrier DC for recovery while the dummy process is being performed in the substrate processing apparatus 1 . That is, when the dummy substrate replacement request is accepted at time t1, the host computer 150 executes a process for preparing the dummy carrier DC for recycling during T1 (refer to step S14 in FIG. 10B ). At time t2 after the DC is placed in the dummy carrier place 351 , the carrier transfer mechanism 300 is instructed to move the dummy carrier DC for recovery. Thus, the carrier transport mechanism 300 transports the dummy carrier DC for recovery from the dummy carrier placement place 351 to the carrier holding unit 25 of the substrate processing apparatus 1 during the period T2 from the time t2. That is, the carrier transfer mechanism 300 takes out the dummy carrier DC for recycling from the dummy carrier placement place 351 and transfers it to the substrate processing apparatus 1, and carries the dummy carrier DC for recycling into a plurality of carrier holding parts. One of the carrier holders LP1 in 25. When the dummy carrier DC for recovery is loaded into the carrier holding unit 25 , the host computer 150 instructs the controller 110 of the substrate processing apparatus 1 to collect and transport the dummy substrate DW at time t3 .

It is preferable to end the simulation processing operation during the above-mentioned period T2. In other words, it is preferable that the host computer 150 plans the recycling dummy carrier DC by the carrier transfer mechanism 300 in such a manner that the dummy carrier DC for recycling is transferred to the carrier holding portion LP1 while the dummy processing operation is being performed in the substrate processing apparatus 1. The handling of the simulated carrier DC. Furthermore, it is preferable that the loading of the dummy carrier DC for recovery into the carrier holding portion 25 is completed substantially simultaneously with the end of the dummy processing operation (the dummy substrate DW to be replaced is stored in the dummy substrate storage portions 7L, 7U).

The controller 110 instructed to collect and transport the dummy substrate DW is used as a recycling and transportation schedule for storing dummy substrates DW used in the simulation process and reaching the expiration date in the dummy substrate storage units 7L and 7U Afterwards, the used dummy substrate DW is transported from the dummy substrate storage parts 7L and 7U to the dummy carrier DC for recovery, and the controller 110 carries out the transport of the dummy substrate DW according to the recovery and transport schedule. Specifically, after the used dummy substrates DW are stored in the dummy substrate storage parts 7L and 7U, the main transfer robots 8L and 8U take out the used dummy substrates DW from the dummy substrate storage parts 7L and 7U and place them on the substrates. Mounting parts 6L, 6U. The used dummy substrate DW is taken out by the index robot 26 and carried into the dummy carrier DC for recovery held in the carrier holding part LP1. When the used dummy substrate DW is accommodated in the dummy carrier DC for recycling, the controller 110 notifies the host computer 150 that the dummy carrier DC for recycling is ready to be unloaded at time t5. Receiving such a notification, the host computer 150 instructs the carrier transport mechanism 300 to transport the dummy carrier DC for recovery. Thereby, the carrier transport mechanism 300 takes out the dummy carrier DC for recovery from the carrier holding part 25 and transports it to the dummy carrier placement place 351 .

In this way, the used dummy board DW is recovered, and a dummy board supply operation for supplying an unused dummy board DW to replace the used dummy board DW is performed. In FIG. 11 , the simulated substrate supply operation is shown by hatched blocks. The host computer 150 plans and executes supply of unused dummy substrates DW to the substrate processing apparatus 1 . Specifically, the host computer 150 functions as a plan to transport the supply dummy carrier DC containing the unused dummy substrate DW from the dummy carrier place 351 to the carrier holding unit 25 of the substrate processing apparatus 1. , and instructs the carrier transport mechanism 300 to transport the dummy carrier DC for supply at time t4 according to the plan. Thereby, the carrier transport mechanism 300 transports the dummy carrier DC for supply from the dummy carrier place 351 to the substrate processing apparatus 1, and carries it into one of the carrier holding parts LP2 among the plurality of carrier holding parts 25. . When the supply dummy carrier DC is loaded into the carrier holding unit LP2, the host computer 150 instructs the controller 110 of the substrate processing apparatus 1 to supply and transport the dummy substrate DW at time t6.

Although an example in which the dummy carrier DC for recovery and the dummy carrier DC for supply are held in different carrier holding parts LP1 and LP2 is shown in FIG. 11 , it may also be configured as: In the plan of carrying in the dummy carrier DC for supply after the unloading of the dummy carrier DC, the dummy carrier DC for supply is loaded into the carrier holding part LP1 of the dummy carrier DC for recovery that has been unloaded.

The controller 110 of the substrate processing apparatus 1 having received the supply and transport instruction of the dummy substrate DW creates a supply and transport row for transporting the unused dummy substrate DW from the supply dummy carrier DC to the dummy substrate storage parts 7L and 7U. The index robot 26 and the main transfer robots 8L, 8U are controlled according to the supply and transfer schedule. Therefore, the index robot 26 takes out the unused dummy substrate DW from the dummy carrier DC for supply, and carries it in to the substrate placement parts 6L, 6U. Thereafter, the main transport robots 8L, 8U transport the unused dummy substrates DW from the substrate placement parts 6L, 6U to the dummy substrate storage parts 7L, 7U.

At time t7 after the unused dummy substrate DW has been unloaded from the dummy carrier DC for supply, the controller 110 of the substrate processing apparatus 1 notifies the host computer 150 that the dummy carrier DC for supply is ready to be unloaded. . The host computer 150 receives the notification and instructs the carrier transport mechanism 300 to transport and supply the dummy carrier DC (time t8). Thereby, the carrier transport mechanism 300 unloads the dummy carrier DC for supply from the carrier holding unit 25 of the substrate processing apparatus 1 and carries it into the dummy carrier placement place 351 .

In this way, through the communication between the controller 110 of the substrate processing apparatus 1 and the host computer 150, the dummy carrier DC for recovery and the dummy carrier DC for supply are carried into the substrate processing apparatus by the carrier transport mechanism 300 in a timely manner. 1 and carried out from the carrier holding unit 25 of the substrate processing apparatus 1. Thereby, the replacement|exchange of the dummy board|substrate DW can be performed automatically and without trouble. In addition, since the time during which the dummy carrier DC occupies the carrier holding portion 25 can be shortened, the time during which the carrier C for accommodating the product substrate W can be held by the carrier holding portion 25 becomes longer. Thereby, productivity can be improved.

The replacement of the dummy substrate DW may be performed one by one, or the replacement of a plurality of dummy substrates DW may be collectively performed. In this case, a plurality of used dummy substrates DW are loaded into one dummy carrier DC for recycling. In addition, the supply dummy carrier DC containing a plurality of unused dummy substrates DW is carried into the carrier holding unit 25, and the plurality of dummy substrates DW is introduced into the dummy substrate from the supply dummy carrier DC. Containment units 7L, 7U.

As described above, according to the present embodiment, the processing block 3 adjacent to the index block 2 in the lateral direction is configured by stacking a plurality of first processing block layers BL and second processing block layers BU in the vertical direction Z. Moreover, the dummy substrate storage parts 7L and 7U for accommodating the dummy substrate DW are provided in each of the first processing block layer BL and the second processing block layer BU. Since the dummy substrate DW can be accommodated inside the first processing block layer BL and the second processing block layer BU, when a need arises to use the dummy substrate DW in the processing units 11L to 43U, the index robot 26 can be used without participation. Method The dummy substrate DW is conveyed between the dummy substrate storage units 7L, 7U and the processing units 11L to 43U.

Therefore, since the conveyance load of the index robot 26 can be reduced, the processing using the dummy substrate DW can be performed while reducing the influence on the substrate W for a product. In particular, an indexing robot for transferring a substrate W between a plurality of first processing block layers BL, a second processing block layer BU having a plurality of processing units 11L to 43L, 11U to 43U, respectively, and a carrier holding portion 25 The handling burden of 26 is very large. Therefore, by reducing the conveyance load of the index robot 26, the conveyance efficiency of the substrate W for products is improved, and productivity can be improved accordingly. Since the main transfer robots 8L and 8U of the first processing block layer BL and the second processing block layer BU are responsible for the transportation of the substrate W in the first processing block layer BL and the second processing block layer BU, Therefore, compared with the index robot 26, the load of transportation is small. Therefore, from the viewpoint of production efficiency, it is not a big problem that the main transfer robots 8L and 8U are responsible for transferring the dummy substrate DW inside the first processing block layer BL and the second processing block layer BU.

In addition, since the dummy substrate storage parts 7L and 7U are located in the first processing block layer BL and the second processing block layer BU, the dummy substrate DW between the dummy substrate storage parts 7L and 7U and the processing units 11L to 43U The transfer system can be performed without passing through the substrate mounting parts 6L and 6U for substrate transfer between the index robot 26 and the first processing block layer BL and the second processing block layer BU. Therefore, since the interference between the conveyance of the dummy substrate DW and the conveyance of the substrate for the product can be reduced, the conveyance efficiency of the substrate for the product can be improved, and the productivity can be improved accordingly.

Furthermore, unlike the case of Patent Document 1, the carrier holding portion 25 is not occupied for a long time by the dummy carrier DC for accommodating the dummy substrate DW. Thereby, since it is possible to suppress a standby time for carrying in the carrier C that accommodates the substrate W for a product, it is possible to contribute to an improvement in productivity. In addition, in this embodiment, in the first processing block layer BL and the second processing block layer BU, a plurality of processing units 11L to 43L, 11U to 43U are transported along the substrate by the main transporter 8L, 8U. The conveyance paths 51L and 51U of W are arranged on both sides of the conveyance paths 51L and 51U, and are arranged in a stacked manner in the vertical direction Z. Therefore, the arrangement of the plurality of processing units 11L to 43U in the first processing block layer BL and the second processing block layer BU can be designed so that substrate transfer by the main transfer robots 8L and 8U is efficiently performed. Thereby, it can contribute to improvement of productivity.

In addition, in the present embodiment, both the substrate placement parts 6L, 6U and the dummy substrate storage parts 7L, 7U are arranged between the index robot 26 and the main transfer robots 8L, 8U. Thereby, the substrate W can be efficiently transferred between the index robot 26 and the main transfer robots 8L and 8U via the substrate mounts 6L and 6U. Furthermore, the dummy substrate storage units 7L, 7U can be arranged at positions where they do not interfere with the conveyance of the substrate W by the index robot 26 and the conveyance of the substrate W by the main conveyance robots 8L, 8U. Therefore, the dummy substrate DW can be held in the first processing block layer BL and the second processing block layer BU without affecting the conveyance of the substrate W of the product.

More specifically, in the present embodiment, the dummy substrate storage parts 7L, 7U and the substrate mounting parts 6L, 6U are three-dimensionally arranged with a height shifted from each other. Thereby, the space in the first processing block layer BL and the second processing block layer BU can be effectively used, and the dummy substrate storage parts 7L and 7U can be appropriately arranged in the first processing block layer BL and the second processing block layer. Process within the block layer BU. As a result, the arrangement of the dummy substrate storage parts 7L, 7U that does not hinder the conveyance of the substrate W for products is realized.

In addition, in this embodiment, the dummy board|substrate accommodating part 7L, 7U is arrange|positioned so that it may overlap with the board|substrate mounting part 6L, 6U in planar view. Thereby, the dummy substrate accommodating parts 7L, 7U are arranged using the space above or below the substrate mounting parts 6L, 6U. Thereby, the arrangement of the dummy substrate storage parts 7L, 7U that does not hinder the conveyance of the substrate W for products can be realized, and the space in the first processing block layer BL and the second processing block layer BU can be effectively utilized for the arrangement. The dummy board storage parts 7L, 7U. As described above, the dummy board storage parts 7L, 7U may be arranged to overlap with the board mounting parts 6L, 6U in a plan view. Specifically, a part or all of the dummy board DW housed in the dummy board storage parts 7L, 7U may also be used. It is arranged to overlap with the substrates held by the substrate mounting parts 6L and 6U.

More specifically, in this embodiment, the second processing block layer BU (upper processing block layer) is stacked on the first processing block layer BL (lower processing block layer). Moreover, in the first processing block layer BL, the dummy substrate storage part 7L is located below the substrate placement part 6L. On the other hand, in the second processing block layer BU, the dummy substrate accommodating portion 7U is located below the substrate mounting portion 6U. Thereby, the height difference between the substrate mounting part 6L of the first processing block layer BL and the substrate mounting part 6U of the second processing block layer BU can be reduced. Thereby, since the board|substrate conveyance stroke of the up-down direction Z by the index robot 26 can be shortened, the conveyance load of the index robot 26 can be reduced. Therefore, the conveyance efficiency of the substrate W for products can be improved, contributing to improvement of productivity.

In addition, in this embodiment, the dummy substrate storage parts 7L and 7U of the first processing block layer BL and the second processing block layer BU include The plurality of processing units 11L to 43L, 11U to 43U have the same number of dummy substrate slots DL1 to DL12, DU1 to DU12. Furthermore, each of the dummy board slots DL1 to DL12 and DU1 to DU12 is configured to hold one dummy board DW. Thereby, the same number of dummy substrates DW as the number of processing units 11L to 43L, 11U to 43U can be held in each of the first processing block layer BL and the second processing block layer BU. Therefore, as long as there is a need to carry the dummy substrate DW into any of the processing units 11L to 43L, 11U to 43U, the main transfer robots 8L and 8U can quickly carry the dummy substrate DW into the processing unit and perform simulation processing. Since the index robot 26 does not participate in the carrying-in of the dummy substrate DW, it is possible to suppress or prevent the influence on the conveyance of the substrate W for products.

Furthermore, in this embodiment, the plurality of processing units 11L to 43L, 11U to 43U of the first processing block layer BL and the second processing block layer BU and the plurality of dummy substrate slots of the processing block layer DL1 to DL12 and DU1 to DU12 are in one-to-one correspondence. Also, the main transport robots 8L, 8U transport the dummy substrate DW between the corresponding dummy substrate slots DL1 to DL12, DU1 to DU12 and the processing units 11L to 43L, 11U to 43U. With this configuration, the dummy board DW held by the dummy board socket can be used as a dedicated dummy board for the corresponding processing unit. This makes it easy to manage the history of use of the dummy board DW.

In addition, in the present embodiment, the controller 110 controls the main transfer robots 8L, 8U when the simulation processing conditions (unit cleaning execution conditions, preprocessing execution conditions, maintenance execution conditions) are sufficient, and the dummy substrate storage parts 7L, 7U The dummy substrate DW is conveyed toward the processing units 11L to 43L, 11U to 43U, and the dummy processing is executed in the processing units. In this way, since the dummy process can be started by conveying the dummy substrate DW in the first processing block layer BL and the second processing block layer BU, it is possible to quickly suppress or prevent the influence on the conveyance of the substrate W for products. to start the simulation process.

In addition, according to the present embodiment, the controller 110 controls each part of the substrate processing apparatus 1 to execute the following steps. That is, in each of the first processing block layer BL and the second processing block layer BU, the dummy substrate carrying-in process (steps A31, A71, A161) is performed, and the dummy substrate carrying-in process is to be housed by the main transfer robots 8L and 8U. The dummy substrate DW in the dummy substrate accommodating parts 7L and 7U in the processing block layer is carried into any one of the plurality of processing units 11L to 43L and 11U to 43U in the processing block layer. Next, a simulation processing step (steps A32, A72, A162) of performing simulation processing using the loaded dummy substrate DW in the processing unit is executed. Furthermore, after the simulation process, the main transport robots 8L, 8U take out the dummy substrate DW from the processing unit and transport it to the dummy substrate storage parts 7L, 7U (steps A33, A73, A163). In addition, the substrate W placed on the substrate mounting parts 6L and 6U of the first processing block layer BL and the second processing block layer BU is carried into the first processing block layer BL and the second processing block layer. A process of any one of the plurality of processing units 11L to 43L, 11U to 43U of the layer BU (step A121). Next, a process of processing the substrate W carried in in the processing unit is performed (step A122). Thereby, the processing using the dummy substrate DW can be performed in the processing units 11L to 43L, 11U to 43U of the first processing block layer BL and the second processing block layer BU while reducing the load on the indexing robot 26. . Thereby, production efficiency can be improved.

Under the control of the controller 110, the dummy board loading process (dummy board loading process A71) may be performed in parallel with the board loading process (product board loading process A20) or the simulation may be performed before the board loading process (product board loading process A20). Substrate carrying-in process (dummy substrate carrying-in process A71) in which the index robot 26 takes out the substrate W from the carrier C held by the carrier holding part 25 and carries it into any one of the first processing areas The block layer BL and the second processing block layer BU have substrate mounts 6L, 6U. Thereby, the substrate W for the product can be carried into the first processing block layer BL and the second processing block layer BU by the indexing robot 26, and on the other hand, it can be processed in each of the first processing block layer BL and the second processing block layer. In the block layer BU, the dummy substrate DW is carried into the processing units 11L to 43L, 11U to 43U. Since the indexing robot 26 may not participate in the loading of the dummy substrate DW, there is no need to wait for the substrate W to be transported by the indexing robot 26 or in parallel with the transporting of the substrate W by the indexing robot 26 to process the first processing block layer BL, the second The transfer of the dummy substrate DW is performed in the processing block layer BU. Therefore, the load on the index robot 26 can be reduced, and the dummy substrate DW can be quickly conveyed to the processing unit in the first processing block layer BL and the second processing block layer BU.

Furthermore, the simulation processing step (simulation processing step A72) may be executed in parallel with the substrate carrying-in step (product substrate carrying-in step A20) or the simulation may be performed before the substrate carrying-in step (product substrate carrying-in step A20) under the control of the controller 110. In the processing step (simulation processing step A72 ), the substrate carrying-in step (product substrate carrying-in step A20 ) is carried in the substrate W for a product by the index robot 26 to the substrate mounting parts 6L, 6U. Thereby, the load of the index robot 26 can be lightened, and simulation processing can be started rapidly in the 1st processing block layer BL, and the 2nd processing block layer BU. For example, when a substrate processing request is received from the host computer 150 , the transfer of the simulation substrate DW and the subsequent simulation processing can be started at an appropriate timing in response thereto. Thereby, since the environment in the processing units 11L to 43L, 11U to 43U can be adjusted at an appropriate time, when the carrier C containing the substrate W for the product is loaded into the carrier holding part 25, the process can be quickly started. Substrate W processing. Thereby, it contributes to improvement of productivity.

In addition, in the present embodiment, the memory 112 of the controller 110 stores the use history information (dummy board history data 134 ) of the dummy board DW stored in the dummy board storage parts 7L, 7U, and based on the dummy board DW The use history information (dummy board history data 134) sends a dummy board replacement request to the host computer 150 (notification of use period information). Furthermore, a collection and transport schedule is created for transporting and collecting the dummy substrate DW to be exchanged from the dummy substrate storage parts 7L and 7U to the carrier holding part 25 . Based on this collection and transportation schedule, the main transportation robots 8L and 8U and the index robot 26 are controlled to transport the dummy substrate DW to be replaced from the dummy substrate storage parts 7L and 7U to the carrier holding part 25 and collect it into the dummy substrate for recycling. Carrier DC. In this manner, when the dummy substrate DW reaches its expiration date, the dummy substrate DW can be automatically ejected.

In this embodiment, the dummy board replacement request is an example of notification of use-life information. The dummy board replacement request is a notification that the dummy board DW will become unusable or a report that the dummy board DW will become unusable soon. In this embodiment, the dummy board replacement request is a dummy board recycling request, and the dummy board recycling request is used to request recycling of the used dummy board DW. More precisely, the dummy board replacement request may also be a dummy board recycling reservation, which specifies the used dummy board DW because it is required to collect the used dummy board DW after the last simulation process is completed. recycling period. In addition, in this embodiment, the dummy board replacement request may also be a dummy board supply request, and the dummy board supply request is for requesting supply of an unused dummy board DW. Furthermore, in the present embodiment, the dummy board supply request may be a dummy board supply reservation for requesting the supply of unused dummy boards DW to be replaced with the used dummy boards DW after the last dummy process is completed. Substrate DW, therefore designate the supply period of unused dummy substrate DW.

In addition, the threshold value data 136 can also be formulated in such a way that the dummy substrate DW has reached the usage limit due to performing a predetermined number of times of the dummy processing, instead of judging the usage period by the remaining one dummy processing. This enables the host computer 150 to request (reserve) replacement of the dummy substrate DW with sufficient room, so that the collection plan for the used dummy substrate DW and the supply plan for the unused dummy substrate DW can be properly executed, thereby enabling The dummy substrate DW is recovered and supplied in a timely manner.

In addition, in the present embodiment, a plurality of dummy boards DW and a plurality of processing units are associated on a one-to-one basis. Thereby, since the dummy substrate DW is not shared by a plurality of processing units, it is possible to avoid the mutual influence of a plurality of processing units through the dummy substrate DW. For example, even if the processing environment in one processing unit is polluted, the contamination can be prevented from being brought into other processing units via the dummy substrate DW.

In addition, in this embodiment, the host computer 150 that has received the dummy substrate replacement request from the substrate processing apparatus 1 plans the operation of the carrier conveying mechanism 300 and controls the carrier conveying mechanism 300 according to the plan, thereby enabling The dummy substrate DW for recycling the used dummy substrate DW is loaded into the carrier holding unit 25 of the substrate processing apparatus 1 . Therefore, the dummy carrier DC for recovery can be supplied to the substrate processing apparatus 1 at an appropriate timing based on a dummy substrate replacement request (notification of service life information) from the substrate processing apparatus 1 to the host computer 150 . That is, since the dummy carrier DC for recovery can be automatically and timely supplied, the downtime of the substrate processing apparatus 1 can be shortened and productivity can be improved.

In addition, since the host computer 150 instructs the substrate processing apparatus 1 to collect and transport the dummy substrate DW, the substrate processing apparatus 1 can timely plan and execute the collection and transportation of the dummy substrate DW, that is, it can timely plan and execute the dummy substrate DW. The used dummy substrate DW is conveyed from the dummy substrate storage parts 7L and 7U to the dummy carrier DC for collection. That is, the timing of carrying in the dummy carrier DC for recovery and starting the recovery and conveyance of the dummy substrate DW in the substrate processing apparatus 1 can be integrated. Furthermore, the host computer 150 is notified of the completion of collection of the dummy substrate DW to the dummy carrier DC for recycling from the substrate processing apparatus 1, and the host computer 150 plans the dummy carrier for recycling by the carrier transport mechanism 300 accordingly. The carrier DC is moved out, and the carrier transfer mechanism 300 is controlled according to the plan. Therefore, it is possible to automatically and timely unload the dummy carrier DC for recovery from the carrier holding unit 25 of the substrate processing apparatus 1 . Specifically, the dummy carrier DC for recovery can be carried out from the carrier holding unit 25 in a timing aligned with the completion of carrying in the dummy substrate DW into the dummy carrier DC for recovery. Thereby, since the time that the dummy carrier DC for recovery occupies the carrier holding portion 25 can be shortened, the carrier holding portion 25 can be quickly released to accommodate the carrier C for storing the product substrate W. Thereby, since the unprocessed product substrate W can be efficiently input into the substrate processing apparatus 1 and the processed product substrate W can be recovered efficiently, productivity can be improved.

In addition, the "integration" of time series does not necessarily refer to temporal consistency, but refers to the generation of corresponding events within a predetermined time allowed from a productivity point of view. The predetermined time in this case is, for example, about one minute. The same applies to the description below. Furthermore, the host computer 150 creates a plan for transporting the supply dummy carrier DC containing the usable dummy substrate DW to the carrier holding unit 25 of the substrate processing apparatus 1 by the carrier transport unit 300, And follow the plan to control the action of the carrier transport mechanism 300 . Thereby, the supply dummy carrier DC is automatically and timely supplied to the substrate processing apparatus 1 . In the substrate processing apparatus 1 , a supply and transport schedule for transporting the dummy substrate DW from the supply dummy carrier DC to the dummy substrate storage units 7L, 7U is created, and the dummy substrate DW is transported according to the supply and transport schedule. In this way, since the dummy substrate DW can be automatically and timely supplied to the substrate processing apparatus 1 , downtime of the substrate processing apparatus 1 due to, for example, a shortage of usable dummy substrate DW can be shortened. Thereby, it can contribute to improvement of productivity.

In addition, since the host computer 150 instructs the substrate processing apparatus 1 to supply and transport the dummy substrate DW, the substrate processing apparatus 1 can plan and execute the supply and transportation of the dummy substrate DW in a timely manner, that is, can plan and execute the dummy substrate DW in a timely manner. The dummy substrate carrier DC for supplying the usable dummy substrate DW is conveyed to the dummy substrate accommodating parts 7L and 7U. Therefore, the supply and conveyance of the dummy substrate DW in the substrate processing apparatus 1 can be started at a timing consistent with the loading of the dummy carrier DC for supply. Furthermore, the host computer 150 is notified of the completion of the unloading of the dummy substrate DW from the supply dummy substrate carrier DC from the substrate processing apparatus 1, and the host computer 150 makes the unloading of the supply dummy substrate DC according to the plan and follows the plan. The carrier transport mechanism 300 is operated. Thereby, the dummy carrier DC for supply can be carried out from the carrier holding|maintenance part 25 at the timing matched with the completion|finish of carrying out of the dummy board|substrate DW from the dummy carrier DC for supply. In this manner, the supply dummy carrier DC can be automatically and timely unloaded from the carrier holding unit 25 of the substrate processing apparatus 1 . Therefore, since the time during which the dummy carrier DC for supply occupies the carrier holding portion 25 can be shortened, the carrier holding portion 25 can be released quickly for holding the carrier C for accommodating the product substrate W. Thereby, since the unprocessed product substrate W can be efficiently input into the substrate processing apparatus 1 and the processed product substrate W can be recovered efficiently, productivity can be improved.

12 is a schematic vertical sectional view for explaining the structure of a substrate processing apparatus according to a second embodiment of the present invention, and shows the structure in a vertical section corresponding to the vertical section in FIG. 2 . When compared with the above-mentioned first embodiment, in this embodiment, the partition wall 16 for distinguishing the first processing block layer BL from the second processing block layer BU is removed. Furthermore, the pillars 83 for guiding the vertical movements of the main transfer robots 8L and 8U extend up and down throughout the first processing block layer BL and the second processing block layer BU. Thereby, the main transfer robots 8L and 8U are configured to be able to move up and down with a stroke larger than that of the first embodiment. Of course, the controller 110 controls the actions of the main transport robots 8L, 8U so that the main transport robots 8L, 8U do not interfere with each other.

In addition, in this embodiment, the two substrate mounting parts 6U and 6L in the first embodiment are replaced with one substrate mounting part 6 . The substrate mounting part 6 is shared between the first processing block layer BL and the second processing block layer BU. That is, the main transfer robot 8L of the first processing block layer BL can access the substrate mounting part 6, and transfer products between the substrate mounting part 6 and the processing units 11L to 43L of the first processing block layer BL. Substrate W. In addition, the main transport robot 8L transports the dummy substrate DW between the substrate mounting section 6 , the processing units 11L to 43L, and the dummy substrate storage section 7L. Similarly, the main transfer robot 8U of the second processing block layer BU can access the substrate mounting part 6, and transfer products between the substrate mounting part 6 and the processing units 11U to 43U of the second processing block layer BU. Substrate W. In addition, the main transport robot 8U transports the dummy substrate DW between the substrate mounting section 6 , the processing units 11U to 43U, and the dummy substrate storage section 7U.

The substrate placement unit 6 includes an unprocessed substrate placement unit 61 and a processed substrate placement unit 62 . However, since the substrate mounting portion 6 is shared by the first processing block layer BL and the second processing block layer BU, it is preferable that the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 respectively have The substrate holders 65, 66 have more slots than in the case of the first embodiment. Preferably, at least one (that is, a part or all) of the slots of the substrate holders 65 and 66 included in the substrate mounting unit 6 is arranged so as to be accessible by both main transfer robots 8L and 8U. More specifically, it is preferable that at least one (that is, a part or all) of the slots of the substrate holder 65 (refer to FIG. 5 ) of the unprocessed substrate placement part 61 is arranged so that it can be used by both main transfer robots 8L and 8U. access. Similarly, it is preferable that at least one (that is, a part or all) of the slots of the substrate holder 66 (see FIG. 5 ) of the processed substrate loading unit 62 is arranged so that it can be stored by both main transfer robots 8L and 8U. Pick.

Preferably, the substrate placement part 6 is configured to be accessible by the indexing robot 26 . More specifically, it is preferable that the index robot 26 is configured to be able to access all the slots of the substrate holders 65, 66 of the substrate placement unit 6, and to be able to carry the product substrate W or the dummy substrate DW into these slots. slots or move from these slots. 13 is a vertical sectional view for explaining the structure of a substrate processing apparatus according to a third embodiment of the present invention, and shows the structure in a vertical section corresponding to the vertical section in FIG. 2 . In the first embodiment, the windows 4L, 4U corresponding to the substrate placement parts 6L, 6U are formed on the rear partition wall 2a and the front partition wall 3a adjacent to the index block 2 and the processing block 3, and windows 4L, 4U corresponding to the substrate placement parts 6L, 6U are not formed. The corresponding windows of the board housing parts 7L and 7U. On the other hand, in the present embodiment, windows 5L, 5U corresponding to the dummy substrate storage portions 7L, 7U are added to the rear partition wall 2a and the front partition wall 3a.

By providing such additional windows 5L, 5U, when introducing the dummy substrate DW into the first processing block layer BL and the second processing block layer BU, the index robot 26 can directly access the dummy substrate storage part 7L, 7U and moved into the dummy substrate DW. Furthermore, when unloading the used dummy substrate DW from the first processing block layer BL and the second processing block layer BU, the index robot 26 can directly access the dummy substrate storage parts 7L, 7U and unload the dummy substrate DW. Neither the main transfer robots 8L nor 8U need to participate in carrying in and carrying out such a dummy substrate DW. Therefore, the conveyance burden of the main conveyance robots 8L, 8U can be reduced, and productivity can be improved.

Fig. 14 is a schematic plan view showing the internal structure of a substrate processing apparatus according to a fourth embodiment of the present invention. In the first embodiment, the plurality of processing units 11L to 43U are divided into a first processing unit group and a second processing unit group, and a horizontal middle is provided between the first processing unit group and the second processing unit group. In the next wall 16 , the first processing unit group is arranged on the first processing block layer BL at the lower stage, and the second processing unit group is arranged on the second processing block layer BU at the upper stage. On the other hand, in this embodiment, the middle partition wall 16 for dividing the space in the processing block 3 up and down is not provided, but a central wall 16 for dividing the space in the processing block 3 in the horizontal direction is provided instead. 18 next door.

The central partition wall 18 divides the space in the processing block 3 to the left and right when viewed from the side of the carrier holding portion 25 in a plan view in the first horizontal direction X. The central partition wall 18 is a flat partition wall and extends along the first horizontal direction X and the vertical direction Z near the center of the processing block 3 in the second horizontal direction Y (left-right direction). The central partition 18 is formed: the first processing block B1 is disposed on one side of the central partition 18 ; and the second processing block B2 is disposed on the other side of the central partition 18 . That is, the first processing block part B1 and the second processing block part B2 are arranged on the sides of each other. The plurality of processing units 11L to 43U included in the processing block 3 are divided into: a first processing unit group G1 included in the first processing block part B1; and a second processing unit group G2 included in the second processing unit group G2. Process block part B2. Since the configuration of the plurality of processing units 11L to 43U is similar to that of the first embodiment, in FIG. 14 the same reference numerals as in FIG. 1 are assigned to the plurality of processing units 11L to 43U. The first processing unit group G1 is composed of a plurality of processing units 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U for forming the first tower T1 and the second tower T2 . The second processing unit group G2 is composed of a plurality of processing units 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L, 43L, 41U, 42U, 43U for forming the third tower T3 and the fourth tower T4 .

Corresponding to the first processing unit group G1, a first main transfer robot 8A is installed on one side of the central partition wall 18 . The first main transport robot 8A operates in the first transport space 53A partitioned between the central partition wall 18 and the first processing unit group G1, whereby the product substrate W and the dummy substrate DW are transported through the first transport space 53A. Similarly, corresponding to the second processing unit group G2, the second main transfer robot 8B is installed on the other side of the central partition wall 18 . The second main transport robot 8B operates in the second transport space 53B partitioned between the central partition wall 18 and the second processing unit group G2, whereby the product substrate W and the dummy substrate DW are transported through the second transport space 53B. Since the configurations of the first main transfer robot 8A and the second main transfer robot 8B are substantially the same as those of the second embodiment shown in FIG. 12 , corresponding components are denoted by the same reference numerals and descriptions thereof are omitted. However, in this embodiment, the pillar 83 for guiding the movement in the vertical direction is fixed to the central partition wall 18 .

Furthermore, corresponding to the first processing unit group G1 , a first substrate mounting portion 6A is provided at an end portion adjacent to the index block 2 in the first transfer space 53A. Furthermore, the first dummy substrate housing portion 7A is arranged above and/or below the first substrate mounting portion 6A so as to partially or completely overlap the first substrate mounting portion 6A in plan view. Similarly, corresponding to the second processing unit group G2, a second substrate mounting portion 6B is provided at an end portion adjacent to the index block 2 in the second transfer space 53B. In addition, the second dummy substrate accommodating portion 7B is disposed above and/or below the second substrate mounting portion 6B so as to partially or completely overlap the second substrate mounting portion 6B in plan view.

The first main transfer robot 8A can access a plurality of processing units constituting the first processing unit group G1 , the first substrate loading unit 6A, and the first dummy substrate storage unit 7A. Thereby, the first main transfer robot 8A transfers the product substrate W between the plurality of processing units constituting the first processing unit group G1 and the first substrate placement unit 6A. In addition, the first main transport robot 8A transports the dummy substrate DW between the processing units constituting the first processing unit group G1 , the first substrate loading unit 6A, and the first dummy substrate storage unit 7A. In the present embodiment, none of the first main transfer robot 8A can access the second processing unit group G2, the second substrate placement unit 6B, and the second dummy substrate storage unit 7B.

Similarly, the second main transfer robot 8B can access a plurality of processing units constituting the second processing unit group G2 , the second substrate placement part 6B, and the second dummy substrate storage part 7B. Thereby, the second main transfer robot 8B transfers the product substrate W between the plurality of processing units constituting the second processing unit group G2 and the second substrate mounting unit 6B. In addition, the second main transport robot 8B transports the dummy substrate DW between the processing units constituting the second processing unit group G2 , the second substrate loading unit 6B, and the second dummy substrate storage unit 7B. In this embodiment, none of the second main transfer robot 8B can access the first processing unit group G1 , the first substrate placement unit 6A, and the first dummy substrate storage unit 7A.

The indexing robot 26 is able to access the carrier C held by the carrier holding unit 25, the dummy carrier DC, the first substrate placement unit 6A, and the second substrate placement unit 6B, and it can access the carrier C, the dummy carrier DC , The product substrate W and the dummy substrate DW are conveyed between the first substrate mounting part 6A and the second substrate mounting part 6B. In this embodiment, neither the index robot 26 can access the first dummy substrate storage unit 7A nor the second dummy substrate storage unit 7B. Of course, neither the indexing robot 26 can access the first processing unit group G1 or the second processing unit group G2.

The fourth embodiment can also be modified in the same manner as the second embodiment (see FIG. 12 ) described above, and a substrate that can be accessed in common by the index robot 26, the first main transfer robot 8A, and the second main transfer robot 8B is provided. The mounting portion is used instead of the first substrate mounting portion 6A and the second substrate mounting portion 6B. For example, a notch can be provided at the end of the central partition wall 18 on the index block 2 side, and a substrate mounting portion shared by the first processing unit group G1 and the second processing unit group G2 can be arranged.

In addition, the fourth embodiment may be modified like the above-described third embodiment (see FIG. 13 ), so that the index robot 26 can access the first dummy board storage unit 7A and the second dummy board storage unit 7B. Thereby, the dummy substrate DW can be carried in and out of the first dummy substrate storage section 7A and the second dummy substrate storage section 7B by the index robot 26 without the participation of the first main transfer robot 8A and the second main transfer robot 8B. .

Although four embodiments of the present invention have been described above, the present invention can also be implemented in other forms. For example, in the above-mentioned first embodiment, etc., although the configuration of the processing block 3 composed of the first processing block layer BL and the second processing block layer BU stacked in two layers is shown, three or more layers of processing blocks may be stacked. block layer to form processing blocks. In addition, although the above-mentioned first embodiment and the like show an example of a processing unit arrangement in which the first processing block layer BL and the second processing block layer BU are stacked in three stages, each processing block layer includes The processing units may be stacked in two stages, or may be stacked in four or more stages, or all the processing units may be arranged in one stage. Furthermore, although the example in which the processing units 11L to 43U are arranged on both sides of the conveyance paths 51L and 51U was shown in the first embodiment, the processing units may be arranged on one side of the conveyance paths 51L and 51U. In addition, although two processing units are arranged on one side of the conveyance paths 51L, 51U along the conveyance paths 51L, 51U in the above-mentioned first embodiment, one processing unit may be arranged, or three or more may be arranged. processing unit.

Furthermore, in the above-mentioned first embodiment, etc., the dummy substrate storage parts 7L and 7U of the first processing block layer BL and the second processing block layer BU are provided with the same A number of dummy base slots DL1 to DL12 , DU1 to DU12 correspond one-to-one to the processing units 11L to 43L, 11U to 43U. However, it is also possible to set the number of dummy substrate slots in each of the first processing block layer BL and the second processing block layer BU to be less than the number of processing units, and assign one dummy substrate slot corresponding to a plurality of processing unit.

In addition, in the above-mentioned embodiment, although the example of the substrate processing apparatus in which the plurality of processing units are divided into a plurality of processing unit groups is shown, the present invention can also be applied to a plurality of processing units by one main transfer robot. A substrate processing apparatus that transfers a substrate W or a dummy substrate DW. Furthermore, the number of processing units may also be one. Although the embodiments of the present invention have been described in detail, these embodiments are only specific examples for clarifying the technical content of the present invention. limited by the scope of the patent.

1: Substrate processing device 2: Indexing Bots 2a: Rear Bulkhead 3: Processing blocks 3a: front next door 4L, 4U, 5L, 5U: window 6, 6L, 6U: Substrate mounting part 6A: The first substrate loading part 6B: The second substrate loading part 7A: The first dummy substrate storage unit 7B: Second Dummy Substrate Storage Unit 7L, 7U: dummy board housing 8A: The first main handling robot 8B: The second main handling robot 8L, 8U: Main handling robot 11L to 13L, 21L to 23L, 31L to 33L, 41L to 43L, 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U: Processing Unit 15: next door 16: middle partition 17: next door 18: Next to the center 25, LP1, LP2: Carrier holding part 26: Indexing Bots 27:Multi-joint arm 28: arm 29,81: hand 30: abutment 35: Processing room 36: Next door to the unit 36a: side wall 36b: top wall 36c: bottom wall 37: Substrate loading and unloading port 38: door stop 39: Handling Hood 40: Rotation fixture 45: Rotation base 46: Rotation motor 51L, 51U: Transport path 52L, 52U: transport space 53A: The first handling space 53B: Second handling space 54: Treatment liquid supply source 55: Nozzle 56: Treatment liquid piping 57:Nozzle arm 58: Oscillating shaft 59: valve 60: pump 61: unprocessed substrate loading part 62: Processed substrate loading unit 63,64: boxes 65,66: Substrate holder 67,68: Substrate support member 71:Simulation substrate holder 72:Simulation substrate support member 75: Exhaust connecting pipe 76: Exhaust piping 77:Switch mechanism 82:Hand drive mechanism 83: Pillar 84: Vertical movement department 85: Horizontal movement department 86:Rotation 87: Advance and retreat 91: The first liquid supply unit 92: Second liquid supply unit 93: The third liquid supply unit 94: The fourth liquid supply unit 101: The first exhaust part 102: The second exhaust part 103: The third exhaust part 104: The fourth exhaust part 110: Controller 111: Processor 112: Memory 120: program 130: Information 131: Product prescription 132: Simulation processing prescription 133: Simulation substrate table 134: Simulation substrate history data 135: Unit usage history data 136:Threshold data 140: User Interface 150: host computer 170: communication line 300: carrier handling mechanism 350: Carrier Placement 351: Simulation carrier placement A7: Preprocessing steps A20: Product substrate loading steps A30, A70, A120, A160: Procedures for making transport schedule A31, A71: Steps for moving the simulation substrate A32, A72: Simulation processing steps A33, A73: Dummy substrate containment steps A121: Substrate loading procedure A122: Processing steps A123: Substrate containment procedure B1: The first processing block department B2: The second processing block BL: The first processing block layer BU: the second processing block layer C: carrier DC: Dummy Carrier DL1 to DL12, DU1 to DU12: Dummy base slots DW: Dummy Substrate G1: The first processing unit group G2: The second processing unit group S1L, S1U: first processing unit stack S2L, S2U: second processing unit stack S3L, S3U: third processing unit stack S4L, S4U: fourth processing unit stack t1 to t8: time T1: The first tower T2: the second tower T3: The third tower T4: The fourth tower W: Product substrate (substrate) X: the first horizontal direction Y: the second horizontal direction Z: up and down direction

[FIG. 1] It is a schematic plan view which shows the internal structure of the substrate processing apparatus which is one embodiment of this invention. [ Fig. 2 ] is a schematic longitudinal sectional view viewed from line II-II in Fig. 1 . [ Fig. 3 ] is a schematic cross-sectional view viewed from line III-III in Fig. 1 . [ Fig. 4 ] is a schematic elevational view showing the internal configuration of the processing block viewed from the IV direction in Fig. 1 . [FIG. 5] It is a figure for demonstrating the structure example of a board|substrate mounting part. [FIG. 6] It is a figure for demonstrating the example of the structure of a dummy board|substrate accommodating part. [ Fig. 7 ] is a schematic cross-sectional view for explaining a configuration example of a processing unit. [FIG. 8] It is a block diagram for demonstrating the structure related to the control of a substrate processing apparatus. [ Fig. 9 ] is a flowchart for explaining the operation of the controller related to the simulation process. [FIG. 10A] is a flowchart for explaining the processing related to the replacement of the dummy substrate in the substrate processing apparatus. [FIG. 10B] It is a flowchart for explaining the process related to the replacement|exchange of the dummy board|substrate in a board|substrate processing apparatus. [FIG. 11] It is a timing chart for demonstrating an example of the concrete operation|movement of the dummy board|substrate replacement|exchange. [ Fig. 12] Fig. 12 is a schematic longitudinal sectional view showing an internal structure of a substrate processing apparatus according to another embodiment of the present invention. [ Fig. 13] Fig. 13 is a schematic longitudinal sectional view showing an internal structure of a substrate processing apparatus according to still another embodiment of the present invention. [ Fig. 14 ] is a schematic plan view showing an internal configuration of a substrate processing apparatus according to another embodiment of the present invention.

1: Substrate processing device

2: Indexing Bots

2a: Rear Bulkhead

3: Processing blocks

3a: front next door

4L, 4U: window

6L, 6U: Substrate mounting section

7L, 7U: dummy board housing

8L, 8U: Main handling robot

11L, 11U, 12L, 12U, 13L, 13U, 21L, 21U, 22L, 22U, 23L, 23U: processing unit

15: next door

16: middle partition

17: next door

25: Carrier holding part

26: Indexing Bots

27:Multi-joint arm

28: arm

29,81: hand

30: abutment

37: export

51L, 51U: Transport path

52L, 52U: transport space

61: unprocessed substrate loading part

62: Processed substrate loading unit

71:Simulation substrate holder

82:Hand drive mechanism

83: Pillar

84: Vertical movement department

85: Horizontal movement department

86:Rotation

87: Advance and retreat

92: Second liquid supply part

101: the first exhaust part (exhaust part)

102: the second exhaust part (exhaust part)

BL: The first processing block layer (processing block layer)

BU: The second processing block layer (processing block layer)

C: carrier

DW: Dummy Substrate

S1L, S1U: first processing unit stack

S2L, S2U: second processing unit stack

T1: The first tower

T2: the second tower

W: Product substrate (substrate)

X: the first horizontal direction

Y: the second horizontal direction

Z: up and down direction

Claims (17)

A substrate processing device, comprising: The carrier holding part is used to hold the carrier for accommodating the substrate or the dummy substrate; a processing unit processing a substrate and performing processing using a dummy substrate; The dummy substrate storage part is for accommodating the dummy substrate; The substrate loading part is used for loading the substrate; The first transfer unit is capable of accessing the processing unit, the dummy substrate storage unit, and the substrate placement unit, transports the substrate between the processing unit and the substrate placement unit, and stores the dummy substrate in the processing unit and the dummy substrate placement unit. Transport the dummy substrate between the part and the aforementioned substrate loading part; The second transport unit is capable of accessing the carrier holding part and the substrate placing part, and transports the substrate between the carrier holding part and the substrate placing part; The memory unit stores the use history information of the dummy substrate stored in the dummy substrate storage unit; The use-expiration notifying part notifies the use-expiration information of the dummy substrate stored in the dummy substrate storage part based on the aforementioned usage history information memorized in the aforementioned memory part; The schedule creation unit creates a transport schedule for the substrate or dummy substrate by the first transport unit and the second transport unit, and creates a transfer schedule for transporting the dummy substrate notified of the expiration date information from the dummy substrate storage unit. And return to the transportation schedule of the aforementioned carrier holding part; and The transport control unit controls the transport of the substrate or the dummy substrate by the first transport unit and the second transport unit according to the transport schedule created by the schedule creation unit. The substrate processing device as described in claim 1, wherein the memory unit memorizes at least one of the number of times of use, use time, and consumption state of the dummy substrate as the use history information. The substrate processing device as described in claim 1, wherein the memory unit stores the use history information and the service life threshold value information corresponding to the use history information. The substrate processing device as described in Claim 3, wherein the aforementioned dummy substrate storage section accommodates a plurality of dummy substrates; The aforementioned memory unit memorizes the aforementioned usage history information and the aforementioned usage period threshold value information for each simulated substrate. The substrate processing device as described in Claim 4, which is equipped with a plurality of the aforementioned processing units; The corresponding relationship between the plurality of the aforementioned dummy substrates and the plurality of the aforementioned processing units is pre-established; The aforesaid memory unit memorizes the information used to represent the aforesaid corresponding relationship. In the substrate processing apparatus described in Claim 3, wherein the service life notification unit compares the service history information with the service life threshold value information, and notifies the service life information of the dummy substrate based on the comparison result. The substrate processing device as described in any one of Claims 1 to 6, further comprising: a notification unit for notifying the user of the dummy substrate stored in the dummy substrate storage part based on the use history information stored in the memory part expiration information for . A substrate processing system comprising: A substrate processing device as described in any one of Claims 1 to 7; The carrier transport unit is used to move the dummy carrier used for recycling the used dummy substrate into the aforementioned carrier holding part; and The host computer receives the notification of the expiration date information from the expiration date notification part, and plans to move the dummy carrier for recycling into the dummy carrier for recycling of the carrier holding part by the carrier transfer unit According to the above-mentioned plan, the dummy carrier for recycling is moved into the carrier holding part by the carrier transfer unit, and the recycling and transfer of the dummy substrate is instructed to the substrate processing device. The substrate processing system as described in claim 8, wherein the host computer obtains information related to the recycling of dummy substrates to the dummy carrier for recycling from the substrate processing device, and plans to transfer the dummy substrate from the storage to the dummy carrier through the carrier transfer unit The dummy carrier for recovery of used dummy substrates is carried out from the carrier holding part, and the dummy carrier for recycling is carried out from the carrier holding part by the carrier transport unit based on the aforementioned plan. The substrate processing system as described in claim 8, wherein the schedule creation unit further creates a transport schedule for transporting usable dummy substrates from the carrier holding unit to the dummy substrate storage unit; The carrier conveying unit is operated to carry a dummy carrier for supply that accommodates a usable dummy substrate into the carrier holding portion; The host computer is designed to transport the dummy carrier for supply into the carrier holding part by the carrier transfer unit, and transfers the dummy carrier by the carrier based on the aforementioned plan. The unit carries a supply dummy carrier into the carrier holding unit, and instructs the substrate processing apparatus to supply and transport a usable dummy substrate. The substrate processing system as described in claim 10, wherein the host computer obtains from the substrate processing device information related to the unloading of the dummy substrate from the dummy carrier for supply, and plans to transfer the dummy substrate from the dummy carrier through the carrier transfer unit. The dummy carrier for supply is unloaded from the carrier holding portion, and the dummy carrier for supply is carried out from the carrier holding portion by the carrier transport unit based on the aforementioned plan. The substrate processing system as described in Claim 8, wherein the carrier transport unit transports the dummy carrier for recovery or supplies between the carrier holding part and the dummy carrier placement different from the carrier holding part. The emulation bearer used. A substrate processing method, comprising: a process of transporting the substrate between the processing unit and the substrate mounting portion by the first transport unit; A process of processing the substrates conveyed by the first conveying unit in the foregoing processing unit; a process of transporting the dummy substrate between the aforementioned processing unit and the dummy substrate storage portion by the aforementioned first transport unit; A step of performing a simulation process using a dummy substrate transported by the first transport unit in the processing unit; a process of transferring the substrate between the carrier held by the carrier holding portion and the substrate mounting portion by the second transfer unit; The process of recording the use history information of the dummy substrate stored in the dummy substrate storage section; The process of judging the service life of the aforementioned dummy substrate based on the aforementioned usage history information; The recovering and transporting process is for transporting and recovering the dummy substrates that have reached the expiration date from the dummy substrate storage part to the carrier holding part based on the judgment of the usage limit; and The recycling dummy carrier carrying-in process is based on the determination of the above-mentioned service life, and the recycling dummy carrier for accommodating the used dummy substrate is carried into the carrier holding part by the carrier transfer unit. The substrate processing method as described in claim 13, further comprising the following step: using the carrier transport unit in a sequence that is integrated with the completion of loading of the dummy substrate in the recycling and transporting process into the dummy carrier for recycling The dummy carrier for recycling is carried out from the carrier holding part. The substrate processing method as described in Claim 13, further comprising: The dummy susceptor carrying-in process for supply is based on the determination of the service life, and the dummy substrate for supply, which accommodates the usable dummy substrate, is carried into the susceptor holding part by the susceptor conveying unit; In the supply and transfer process, the usable dummy substrate is transferred from the carrier holding portion to the dummy substrate storage portion based on the determination of the usage period. The substrate processing method as described in claim 15, further comprising the step of: using the carrier conveying unit at a time sequence that is integrated with the completion of unloading of the dummy substrate in the supply and conveying process from the dummy carrier for supply The dummy carrier for supply is carried out from the carrier holding part. The substrate processing method as described in claim 13, wherein a plurality of the aforementioned processing units are provided; The aforementioned dummy substrate storage unit stores a plurality of pieces of dummy substrates that have preset correspondences with the plurality of aforementioned processing units.

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