WO2022196392A1

WO2022196392A1 - Resin composition for dicing film substrate, dicing film substrate, and dicing film

Info

Publication number: WO2022196392A1
Application number: PCT/JP2022/009398
Authority: WO
Inventors: 重則中野; 孝一西嶋; 雅巳佐久間; 博樹 ▲高▼岡
Original assignee: 三井・ダウポリケミカル株式会社
Priority date: 2021-03-18
Filing date: 2022-03-04
Publication date: 2022-09-22
Also published as: KR20230138017A; TW202302747A; JPWO2022196392A1; CN117063262A

Abstract

The present invention addresses the problem of providing a resin composition for dicing film substrates which is able to form dicing film substrates excellent in terms of ordinary-temperature and low-temperature stretchability and ordinary-temperature and low-temperature modulus strength. The resin composition for dicing film substrates comprises an ionomer (A) of an ethylene/(unsaturated carboxylic acid)-based copolymer, a polyamide (B), and a styrene-based resin (C).

Description

Resin composition for dicing film substrate, dicing film substrate, and dicing film

The present invention relates to a resin composition for a dicing film substrate, a dicing film substrate, and a dicing film.

In the manufacturing process of semiconductor devices such as ICs (integrated circuits), it is common to perform a dicing process to divide the semiconductor wafer into chips after thinning the semiconductor wafer on which the circuit pattern is formed. In the dicing process, an elastic wafer processing film (also referred to as a "dicing film" in this specification) is attached to the back surface of the semiconductor wafer, and the semiconductor wafer is cut into chips using a dicing blade, laser light, or the like. . Then, by expanding the dicing film in the expanding step, the distance between the chips is widened and the chips are divided into small pieces. In the expansion process, for example, an expansion table arranged under the dicing film is pushed up to expand the dicing film and divide the chips.

After that, in the pickup process, only desired chips are picked up from the dicing film and used for desired applications. In the pick-up process, it is common to push up only the desired chip from the dicing film side with a fine pin and pick it up.

Here, ionomer, which is an ethylene/(meth)acrylic acid copolymer crosslinked with metal ions, is known as a material that constitutes the dicing film. For example, Patent Literature 1 describes a radiation-curable adhesive tape for wafer processing containing an antistatic resin containing a polyether component and the ionomer. Patent Document 2 describes a resin composition for a dicing film substrate containing the ionomer, ethylene, (meth)acrylic acid, and a copolymer of (meth)acrylic acid alkyl ester.

Further, as a resin composition used for molded parts and the like, Patent Document 3 describes an ionomer/polyamide blend containing an ionomer of a copolymer of ethylene and α,β-ethylenically unsaturated carboxylic acid and a polyamide. ing.

JP 2011-210887 A JP 2012-89732 A Japanese Patent Publication No. 2000-516984

Here, in order to properly pick up only the desired chips in the above pick-up process, it is important that the dicing film around the chips stretches sufficiently (hereinafter also referred to as "normal temperature elongation"). If the dicing film is not stretched sufficiently and a plurality of chips are pushed up by the fine pins, a phenomenon may occur in which chips that are not to be picked up are separated from the dicing film. In addition, if the dicing film has low elongation at room temperature, stress may be applied to the chip during the pick-up process, which may cause breakage within the chip. When these problems occur, the product yield decreases and product defects increase.

However, in Patent Document 1, there is no description focusing on the extensibility itself of the adhesive tape for wafer processing. Furthermore, Patent Document 2 evaluates the heat resistance of the dicing film (for example, elongation at 120° C.), but does not pay attention to elongation at room temperature. Furthermore, the ionomer/polyamide blend of Patent Document 3 contains a large amount of polyamide, which makes it difficult to form into a film.

In addition to the room-temperature elongation described above, the resin composition for the dicing film substrate is required to have modulus strength of the dicing film at room temperature and low temperature, and may also be required to have elongation at low temperature. Specifically, in the case of a dicing die-bonding integrated film, there is a process of dividing and expanding the chip and the die-bonding film at a low temperature. requested. Further, at room temperature, modulus strength for maintaining a constant chip gap after cutting and film elongation required during the pick-up process as described above are required. However, conventionally, there has been no attempt to achieve both modulus strength at room temperature and low temperature and elongation at room temperature and low temperature.

The present invention has been made in view of the above problems. To provide a resin composition for a dicing film base material, a dicing film base material, and a dicing film capable of realizing a dicing film base material having excellent elongation at room temperature and low temperature and also excellent modulus strength at room temperature and low temperature. and

That is, the present invention provides the following resin composition for dicing film substrates.
[1] A resin composition for a dicing film substrate comprising an ethylene/unsaturated carboxylic acid-based copolymer ionomer (A), a polyamide (B), and a styrene-based resin (C).

[2] The dicing film substrate according to [1], wherein the ethylene/unsaturated carboxylic acid-based copolymer ionomer (A) is an ethylene/unsaturated carboxylic acid/unsaturated carboxylic acid ester copolymer ionomer. resin composition for

[3] The amount of unsaturated carboxylic acid-derived structural units in the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is the total amount of the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer. The resin composition for a dicing film substrate according to [1] or [2], which is 1% by mass or more and 30% by mass or less based on the amount of the structural unit.

[4] The dicing film base according to any one of [1] to [3], wherein the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer has a degree of neutralization of 10% or more and 90% or less. Resin composition for lumber.
[5] The resin composition for a dicing film substrate according to any one of [1] to [4], wherein the styrene resin (C) is a styrene elastomer.

[6] The resin composition for a dicing film substrate according to any one of [1] to [5], wherein the content of the styrene resin (C) is 1% by mass or more and 40% by mass or less.
[7] The content of the ionomer (A) in the ethylene/unsaturated carboxylic acid copolymer is equal to or greater than the total content of the polyamide (B) and the styrene resin (C). The resin composition for a dicing film substrate according to any one of [1] to [6].
[8] According to JIS K 7210: 1999, the melt flow rate measured at 230 ° C. and a load of 2160 g is 0.1 g / 10 minutes or more and 30 g / 10 minutes or less, [1] to [7] The resin composition for a dicing film substrate according to any one of .

The present invention provides the following dicing film substrate and dicing film.
[9] A dicing film substrate comprising at least one layer containing the resin composition for a dicing film substrate according to any one of [1] to [8] above.
[10] The average value of the 25% modulus in the MD direction and the 25% modulus in the TD direction measured at 23°C in accordance with JIS K 7127: 1999 of the layer containing the resin composition for a dicing film substrate is 7 MPa. The dicing film base material according to [9], which is 13 MPa or less.
[11] The average value of the 10% modulus in the MD direction and the 10% modulus in the TD direction measured at −15° C. in accordance with JIS K 7127:1999 of the layer containing the resin composition for a dicing film substrate is The dicing film substrate according to [9] or [10], which is 15 MPa or more and 30 MPa or less.
[12] A dicing film comprising the dicing film substrate of [11] above and an adhesive layer laminated on at least one surface of the dicing film substrate.

According to the resin composition for a dicing film substrate of the present invention, a dicing film substrate having excellent elongation at room temperature and low temperature and also excellent modulus strength at room temperature and low temperature is realized.

In this specification, a numerical range represented using "~" means a range including the numerical values described before and after "~" as lower and upper limits. In addition, "(meth) acrylic acid" is a notation that includes both "acrylic acid" and "methacrylic acid", and "(meth) acrylate" includes both "acrylate" and "methacrylate". It is a notation that is used inclusively.

1. Dicing film substrate resin composition The resin composition for a dicing film substrate of the present invention (hereinafter also simply referred to as "resin composition") is mainly used as a substrate for a dicing film. The use of the product is not limited to the substrate of the dicing film.

As mentioned above, base materials for dicing films are required to have not only modulus strength at normal and low temperatures, but also elongation at normal and low temperatures. However, no attempt has been made to achieve both of these in the past.

On the other hand, as a result of intensive studies by the present inventors, a resin composition containing an ethylene/unsaturated carboxylic acid copolymer ionomer (A), a polyamide (B), and a styrene resin (C) According to the method, it was found that a dicing film substrate having both modulus strength at room temperature and low temperature and elongation at room temperature and low temperature can be obtained. The reason is considered as follows. That is, conventional resin compositions containing different kinds of materials sometimes have poor uniformity of the respective materials within the resin composition. When it is made into a film, the physical properties in the TD direction tend to deteriorate due to the influence of the orientation. On the other hand, a resin composition containing an ionomer (A), a polyamide (B), and a styrenic resin (C) has good compatibility, and the characteristics of each material can be improved without reducing the homogeneity. It is possible to maintain Each component contained in the resin composition will be described below, and then the physical properties of the resin composition will be described.

<Ionomer (A) of ethylene/unsaturated carboxylic acid copolymer>
The ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer (hereinafter also simply referred to as "ionomer (A)" is an ethylene/unsaturated carboxylic acid copolymer in which part or all of the acid is a metal ion and has a structure in which a plurality of ethylene-unsaturated carboxylic acid copolymers are crosslinked.The resin composition may contain only one ionomer (A), or may contain two or more kinds of ionomers (A). You can stay.

The ethylene/unsaturated carboxylic acid-based copolymer, which is the main skeleton of the ionomer (A), may be a copolymer of ethylene and an unsaturated carboxylic acid, such as a copolymer of ethylene and an unsaturated carboxylic acid. (binary copolymer), for example, it may be a copolymer obtained by copolymerizing ethylene, an unsaturated carboxylic acid, and other monomers (multi-component copolymer). .

The ethylene/unsaturated carboxylic acid-based copolymer may be a block copolymer or a random copolymer. The ethylene/unsaturated carboxylic acid-based copolymer may also be a graft copolymer obtained by graft-polymerizing a known compound to a random polymer or block polymer.

The ethylene/unsaturated carboxylic acid-based copolymer is a binary random copolymer, a ternary random copolymer, a graft copolymer of a binary random copolymer, or a graft copolymer of a ternary random copolymer. A coalescence is preferred, a binary random copolymer or a ternary random copolymer is more preferred, and a ternary random copolymer is even more preferred.

Examples of unsaturated carboxylic acids used as raw materials for the ethylene/unsaturated carboxylic acid copolymer include acrylic acid, methacrylic acid, ethacrylic acid, itaconic acid, itaconic anhydride, fumaric acid, crotonic acid, maleic acid, and maleic anhydride. It includes unsaturated carboxylic acids having 4 to 8 carbon atoms such as acids, and among these, acrylic acid or methacrylic acid is preferable from the viewpoint of reactivity, availability, and the like.

Further, examples of other monomers used as raw materials for the ethylene/unsaturated carboxylic acid copolymer include unsaturated carboxylic acid esters such as (meth)acrylic acid alkyl esters; propylene, butene, and 1,3-butadiene; , pentene, 1,3-pentadiene, 1-hexene and other unsaturated hydrocarbons; vinyl esters derived from vinyl acetate, vinyl propionate and the like; oxides such as vinyl sulfate and vinyl nitrate; halogens such as vinyl chloride and vinyl fluoride compounds; vinyl group-containing primary amine compounds; vinyl group-containing secondary amine compounds; carbon monoxide; sulfur dioxide; Among these, unsaturated carboxylic acid esters or unsaturated hydrocarbons are preferred, and unsaturated carboxylic acid esters are more preferred, from the viewpoint of reactivity, availability, and the like. That is, it is particularly preferable that the ethylene/unsaturated carboxylic acid-based copolymer that forms the main skeleton of the ionomer (A) of the present invention is an ethylene/unsaturated carboxylic acid/unsaturated carboxylic acid ester copolymer.

Examples of unsaturated carboxylic acid esters include unsaturated carboxylic acid alkyl esters having an alkyl group having 1 to 12 carbon atoms in the ester moiety. The number of carbon atoms in the alkyl group is more preferably 1-8, more preferably 1-4. Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, 2-ethylhexyl, isooctyl groups and the like.

Specific examples of the unsaturated carboxylic acid alkyl ester include methyl (meth)acrylate, ethyl (meth)acrylate, isobutyl (meth)acrylate, n-butyl acrylate, isooctyl acrylate, Maleic acid dimethyl ester, maleic acid diethyl ester and the like are included.

Here, specific examples of the ethylene/unsaturated carboxylic acid copolymer include binary copolymers such as ethylene/acrylic acid copolymer and ethylene/methacrylic acid copolymer; ethylene/methacrylic acid/acrylic acid Terpolymers such as n-butyl copolymers and ethylene/methacrylic acid/isobutyl acrylate copolymers;

The ionomer (A) of the present invention is obtained by cross-linking (neutralizing) the carboxyl groups contained in the ethylene/unsaturated carboxylic acid copolymer with metal ions at an arbitrary ratio.

The amount of unsaturated carboxylic acid-derived structural units in the ionomer (A), that is, the amount of unsaturated carboxylic acid-derived structural units with respect to all structural units of the ethylene/unsaturated carboxylic acid copolymer is 1% by mass or more. 30% by mass or less is preferable, 4% by mass or more and 25% by mass or less is more preferable, 5% by mass or more and 20% by mass or less is even more preferable, and 6% by mass or more and 15% by mass or less is particularly preferable. When the amount of unsaturated carboxylic acid-derived structural units in the ionomer (A) is 4% by mass or more, the modulus strength and elongation tend to be better. On the other hand, when the amount of the structural unit derived from the unsaturated carboxylic acid is 25% by mass or less, blocking is difficult to occur, fusion is difficult to occur, and handling is easy.

Furthermore, when the ionomer (A) contains structural units derived from other monomers (e.g., unsaturated carboxylic acid esters), the amount of structural units derived from other monomers in the ionomer (A), that is, ethylene The amount of structural units derived from other monomers is preferably 1% by mass or more and 20% by mass or less, more preferably 5% by mass or more and 15% by mass or less, relative to all the structural units of the unsaturated carboxylic acid-based copolymer. When the amount of structural units derived from other monomers is 1% by mass or more, elongation when the resin composition is used as a base material for a dicing film tends to be good. On the other hand, when the amount of structural units derived from other monomers is 20% by mass or less, when the resin composition is used as a base material for a dicing film, the base material is difficult to block, and fusion and the like are also likely to occur. Hard to come by.

In the ionomer (A), the metal ion that neutralizes the acid of the ethylene/unsaturated carboxylic acid copolymer is not particularly limited, but examples thereof include lithium ion, sodium ion, potassium ion, rubidium ion, Cesium ions, zinc ions, magnesium ions, manganese ions, etc. are included. Among these, magnesium ion, sodium ion, or zinc ion is preferable, sodium ion or zinc ion is more preferable, and zinc ion is still more preferable from the viewpoint of availability.

The degree of neutralization of the ethylene/unsaturated carboxylic acid copolymer in the ionomer (A) is preferably 10% or more and 90% or less, more preferably 10% or more and 85% or less, and even more preferably 15% or more and 82% or less. When the degree of neutralization of the ethylene/unsaturated carboxylic acid-based copolymer is 10% or more, when the resin composition is used as a base material for a dicing film, the surface hardness of the base material increases. On the other hand, when the degree of neutralization is 90% or less, the processability and moldability of the resin composition are improved. The degree of neutralization is the ratio of the number of moles of metal ions to the number of moles of acid groups (for example, carboxyl groups) possessed by the ethylene/unsaturated carboxylic acid copolymer. The degree of neutralization can be measured by infrared absorption spectrum (IR). By measuring the C=O stretching absorption peak of the resin using the infrared absorption spectrum, the non-ionized carboxy groups can be quantified. groups can be quantified. By measuring both, the degree of neutralization can be obtained, and specifically, it can be calculated by the following formula.
Neutralization degree (%) = (1-P1/P2) x 100
P1: C=O stretching absorption peak height of ethylene copolymer resin P2: C=O stretching absorption peak height of hydrochloric acid-treated ethylene copolymer resin

Further, the melt flow rate (MFR) of the ionomer (A) is preferably 0.2 g/10 min or more and 20.0 g/10 min or less, more preferably 0.5 g/10 min or more and 20.0 g/10 min or less, More preferably 0.5 g/10 minutes or more and 18.0 g/10 minutes or less. When the melt flow rate of the ionomer (A) is within the above range, it becomes easier to mold the resin composition. The melt flow rate of the ionomer (A) is a value measured at 190°C under a load of 2160g according to JIS K 7210:1999 (equivalent to ISO 1133:1997).

Here, the content of the ionomer (A) in the resin composition is 30 parts by mass with respect to a total of 100 parts by mass of the ionomer (A), the polyamide (B) described later, and the styrene resin (C) described later. 95 mass parts or less is preferable, 40 mass parts or more and 90 mass parts or less are preferable, and 45 mass parts or more and 90 mass parts or less are more preferable. When the amount of the ionomer (A) is 30 parts by mass or more, the elongation at room temperature and the elongation at low temperature of the substrate obtained from the resin composition are improved. On the other hand, when the amount of the ionomer (A) is 95 parts by mass or less, the amounts of the polyamide (B) and the styrene resin (C) are relatively large enough, and the substrate obtained from the resin composition And the modulus strength at low temperature and the elongation at normal temperature and low temperature are improved.

Further, the amount of the ionomer (A) in the resin composition is preferably at least the sum of the amount of the polyamide (B) and the amount of the styrene resin (C), and the amount of the polyamide (B) and the amount of the styrene resin (C) It is preferably 1.0 to 10 times, more preferably 1.0 to 7 times the total amount. As a result, the expandability (expandability) of the base material obtained from the resin composition at room temperature and low temperature is improved.

<Polyamide (B)>
Polyamide (B) may be a resin containing two or more amide groups. In general, the ionomer (A) described above tends to have a low melting point and low heat resistance. The heat resistance of the substrate for the dicing film becomes very good. Further, when the ionomer (A) and the polyamide (B) are combined, good modulus strength and severability can be obtained when the resin composition is used as a base material for a dicing film.

The polyamide (B) may be a polycondensate of dicarboxylic acid and diamine. Examples of dicarboxylic acids include oxalic acid, adipic acid, sebacic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, 1,4-cyclohexanedicarboxylic acid, and the like. Examples of diamines include ethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, decamethylenediamine, 1,4-cyclohexyldiamine, m-xylylenediamine, and the like.

Polyamide (B) is a ring-opening polymer of cyclic lactams such as ε-caprolactam and ω-laurolactam, and 6-aminocaproic acid, 9-aminononanoic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and the like. It may be a polycondensate of aminocarboxylic acid or the like, or may be a copolymer of the above cyclic lactam, dicarboxylic acid and diamine.

Specific examples of polyamide (B) include nylon 4, nylon 6, nylon 46, nylon 66, nylon 610, nylon 612, nylon 6T, nylon 11, nylon 12, nylon MXD6, nylon 46, or copolymers thereof ( For example, nylon 6/66, nylon 6/12, nylon 6/610, nylon 66/12, nylon 6/66/610) and the like are included. Among these, nylon 6 and nylon 6/12 are preferable from the viewpoint of improvement of low-temperature cutting property and availability.

The melting point of the polyamide (B) is preferably 160°C or higher and 250°C or lower, more preferably 170°C or higher and 240°C or lower, and even more preferably 180°C or higher and 235°C or lower. When the melting point of the polyamide (B) is 160° C. or higher, the heat resistance of the substrate for a dicing film obtained from the resin composition tends to be good. On the other hand, when the melting point of the polyamide (B) is 250° C. or lower, the processability of the resin composition is improved. The melting point of the polyamide (B) is measured, for example, by a differential scanning calorimeter (DSC) or the like.

The density of the polyamide (B) is preferably 1060 kg/m ³ or more and 1220 kg/m ³ or less, more preferably 1080 kg/m ³ or more and 1200 kg/m ³ or less, and even more preferably 1100 kg/m ³ or more and 1180 kg/m ³ or less. The density of polyamide (B) is measured according to ISO 1183-3.

The content of the polyamide (B) is preferably 5 parts by mass or more and less than 40 parts by mass with respect to a total of 100 parts by mass of the ionomer (A), the polyamide (B), and the styrene resin (C) described later. , preferably 5 parts by mass or more and 35 parts by mass or less, more preferably 5 parts by mass or more and 30 parts by mass or less. When the amount of the polyamide (B) is 5 parts by mass or more, the heat resistance and low-temperature modulus strength of the substrate obtained from the resin composition are improved. On the other hand, when the amount of polyamide (B) is less than 40 parts by mass, the moldability of the resin composition is improved.

<Styrene resin (C)>
The styrene-based resin (C) may be a resin having at least styrene as a constituent unit, and may be a homopolymer of styrene or a polymer of styrene and other monomers. Examples of the styrene-based resin (C) include styrene-based elastomers, ABS-based resins that are copolymers of acrylonitrile and styrene, and polystyrene. Among these, styrene-based elastomers are preferred. A styrene-based elastomer refers to a styrene-based polymer that is a rubber elastic body at room temperature.

Examples of the above styrene-based elastomers include block copolymers containing a hard segment composed of a styrene block (styrene polymer) and a soft segment composed of an alkylene block, or hydrogenated products thereof; random copolymers of styrene and alkylene; A polymer or a hydrogenated product thereof; or an acid-modified styrene-based elastomer obtained by acid-modifying the styrene-based elastomer.

The styrene block in the above block copolymer may be a site where two or more styrenes are polymerized, and the alkylene block may be a site where two or more alkenes are polymerized. The alkylene block may be a homopolymer of one alkene or a copolymer of two or more alkenes.

Examples of the above block copolymers include styrene-butadiene block copolymer (SB), styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene block copolymer (SI), styrene-isoprene-styrene Block copolymers (SIS) are included.

As described above, the styrene-based elastomer may be a hydrogenated product of the above block copolymer. In the hydrogenated product, both the styrene block and the alkylene block may be hydrogenated, or only one of the styrene block and the alkylene block may be hydrogenated, and one of the styrene block and the alkylene block may be hydrogenated. Only part may be hydrogenated.

Specific examples of hydrogenated block copolymers include styrene-ethylene-butylene block copolymer (SEB), which is a hydrogenated product of styrene-butadiene block copolymer (SB), styrene-butadiene-styrene block Styrene-ethylene-butylene-styrene block copolymer (SEBS), hydrogenated copolymer (SBS), styrene-ethylene-propylene, hydrogenated styrene-isoprene-styrene block copolymer (SIS) - Styrene block copolymers (SEPS), etc. are included.

As described above, examples of styrene-based elastomers include random copolymers of styrene and alkylene. Examples include styrene-butadiene random copolymers, styrene-isoprene random copolymers, styrene-ethylene-butylene random copolymers, styrene-ethylene-propylene random copolymers, styrene-isobutylene random copolymers, styrene - including ethylene-isoprene random copolymers.

As described above, the styrene-based elastomer may be a hydrogenated product of the above random copolymer. Examples include hydrogenated styrene-butadiene random copolymers (HSBR) and the like.

Hydrogenated products are preferred among the above-described styrene elastomers that have not been acid-modified, and styrene-ethylene/butylene-styrene block copolymers (SEBS) and styrene-ethylene/propylene-styrene block copolymers ( SEPS) is more preferable, and a styrene-ethylene-butylene-styrene block copolymer (SEBS) can improve the low-temperature elongation and normal-temperature elongation of the base material for a dicing film obtained from the resin composition. Especially preferred.

On the other hand, the styrene elastomer is an acid-modified styrene elastomer obtained by graft-modifying the block copolymer, random polymer, or hydrogenated product thereof with an unsaturated carboxylic acid or a derivative thereof, as described above. There may be. The acid-modified styrene-based elastomer may be obtained by graft-modifying the block copolymer, random polymer, or hydrogenated product thereof with one type of unsaturated carboxylic acid or derivative thereof. may be graft-modified with an unsaturated carboxylic acid or a derivative thereof.

Examples of unsaturated carboxylic acids graft-polymerized to the above block copolymers and random copolymers include (meth)acrylic acid, 2-ethylacrylic acid, crotonic acid, maleic acid, fumaric acid, and itaconic acid. included. On the other hand, examples of unsaturated carboxylic acid derivatives graft-polymerized onto styrene elastomers include acid anhydrides such as maleic anhydride, phthalic anhydride and itaconic anhydride; acid esters such as monomethyl maleate and monoethyl maleate; acid amides; ; acid halides; and the like. Among these, maleic acid or maleic anhydride is preferable from the viewpoint of reactivity with the styrene-based elastomer.

The acid-modified styrene-based elastomer can be obtained by graft-polymerizing the block copolymer, random copolymer, or the like with an unsaturated carboxylic acid or a derivative thereof in the presence of a radical initiator. Any known radical initiator can be used as long as it is used for the graft reaction of polyolefins.

The acid value of the acid-modified styrene-based elastomer is preferably more than 0 mg CH ₃ ONa/g and less than 20 mg CH ₃ ONa/g, more preferably more than 0 mg CH ₃ ONa/g and less than 11 mg CH ₃ ONa/g, and 0.5 mg CH ₃ ONa/g. more preferably 11 mg CH ₃ ONa/g or less. When the acid value of the acid-modified styrene-based elastomer is within this range, the elongation at low temperature and normal temperature tends to be good.

Further, examples of styrene-based resins (C) also include ABS-based resins. ABS resins are resins containing structural units derived from acrylonitrile and structural units derived from styrene. Styrenic polymers are included. Specific examples of ABS resins include rubber components such as polybutadiene, styrene-butadiene rubber, ethylene-propylene-diene rubber, styrene and acrylonitrile, and optionally methyl methacrylate, α-methylstyrene, ethylenebismaleimide, maleimide, and the like. Graft polymerization of other monomers is included.

Examples of the styrene-based resin (C) also include polystyrene, which is mainly polymerized from styrene. Examples of polystyrene include general-use polystyrene synthesized by production methods such as suspension polymerization and continuous polymerization, as well as impact-resistant polystyrene obtained by grafting styrene onto rubber components such as butadiene rubber. be

Regardless of which resin the styrene-based resin (C) is, its melt flake is preferably 0.1 g/10 minutes to 100 g/10 minutes, more preferably 0.5 g/10 minutes to 50 g/10 minutes. The above melt flow rate is a value measured at 230°C under a load of 2160g in accordance with JIS K 7210:1999 (equivalent to ISO 1133:1997).

Regardless of which resin the styrene-based resin (C) is, the Tan δ peak temperature is −60° C. or higher from the viewpoint of improving the low-temperature elongation and normal-temperature elongation of the resulting dicing film base material. is preferred, -20°C or higher is more preferred, -10°C or higher is even more preferred, and 0°C or higher is particularly preferred. The above Tan δ peak temperature is the temperature showing the peak value in a dynamic viscoelasticity test (temperature dependent measurement 10 Hz) in accordance with JIS K 6394 (equivalent to ISO 4664-1:2005).

The amount of the styrene resin (C) is preferably 1 part by mass or more and 40 parts by mass or less with respect to a total of 100 parts by mass of the ionomer (A) described above, the polyamide (B) described above, and the styrene resin (C). , more preferably 2 parts by mass or more and 40 parts by mass or less, and more preferably 3 parts by mass or more and 35 parts by mass or less. When the amount of the styrene-based resin (C) is 1 part by mass or more, the room-temperature elongation and low-temperature elongation of the substrate obtained from the resin composition are improved. On the other hand, when the amount of the styrene-based resin (C) is 40 parts by mass or less, the film formability of the resin composition is improved.

In the resin composition of the present invention, the total content of the ethylene/unsaturated carboxylic acid copolymer ionomer (A), polyamide (B) and styrenic resin (C) is the total mass of the resin components of the resin composition. When the is 100% by mass, it is preferably 80% by mass to 100% by mass, more preferably 85% by mass to 100% by mass, and even more preferably 90% by mass to 100% by mass. , more preferably more than 95% by mass and 100% by mass or less, particularly preferably 98% by mass to 100% by mass, and particularly preferably 99% by mass to 100% by mass or less.

<Other polymers and additives>
If necessary, the resin composition may contain other polymers, various additives, antistatic agents, ultraviolet absorbers, fillers, etc., as long as the effects of the present invention are not impaired.

Examples of other polymers include polyolefins such as polyethylene and polypropylene. The amount of other polymers in the resin composition is preferably 20 parts by mass or less with respect to a total of 100 parts by mass of the ionomer (A), polyamide (B) and styrenic resin (C).

On the other hand, examples of additives include antioxidants, heat stabilizers, light stabilizers, pigments, dyes, lubricants, antiblocking agents, antifungal agents, antibacterial agents, flame retardants, auxiliary flame retardants, crosslinkers, crosslinkers, Auxiliaries, foaming agents, foaming aids, fiber reinforcements, and the like are included.

Examples of antistatic agents include low-molecular-weight antistatic agents and high-molecular-weight antistatic agents, but high-molecular-weight antistatic agents are preferred. Examples of polymeric antistatic agents include vinyl copolymers having sulfonates in the molecule, alkylsulfonates, alkylbenzenesulfonates, betaine, and the like. Other examples of polymeric antistatic agents also include inorganic protonic acid salts of polyethers, polyamide elastomers, polyester elastomers, polyether amides, or polyether ester amides. Salts of inorganic protonic acids include alkali metal, alkaline earth metal, zinc, or ammonium salts.

Examples of UV absorbers include benzophenone-based, benzoate-based, benzotriazole-based, cyanoacrylate-based, hindered amine-based, and the like.

Examples of fillers include silica, clay, calcium carbonate, barium sulfate, glass beads, and talc.

The amounts of additives, antistatic agents, ultraviolet absorbers, and fillers are appropriately selected according to their type.

<Method for producing resin composition and physical properties of resin composition>
The method for producing the resin composition of the present invention is not particularly limited, and ionomer (A), polyamide (B), and styrenic resin (C), and if necessary, other polymers, additives, etc. can be mixed. There is no particular limitation as long as it is a method. For example, all the components may be dry-blended and then melt-kneaded, or some components may be kneaded first and then the components added later.

The shape of the resin composition after kneading is not particularly limited.

According to JIS K 7210: 1999 (equivalent to ISO 1133: 1997), the melt flow rate of the resin composition measured at 230°C and a load of 2160 g is 0.1 g/10 min or more and 30 g/10 min or less. is preferred, 0.2 g/10 min or more and 15 g/10 min or less is more preferred, 0.5 g/10 min or more and 10 g/10 min or less is even more preferred, and 1.0 g/10 min or more and 7 g/10 min or less is even more preferred. . When the melt flow rate of the resin composition is within this range, the modulus strength at room temperature and low temperature and the elongation at room temperature and low temperature of the substrate obtained from the resin composition tend to be good.

2. Dicing Film Substrate The dicing substrate may be a substrate having at least one layer containing the resin composition described above. Since the dicing film base material has a layer containing the above resin composition, it exhibits excellent modulus strength and elongation at room temperature and low temperature. The dicing film substrate is suitably used as a dicing film substrate, but is not limited to this application.

The structure of the dicing film substrate is not particularly limited, and may have only one layer containing the resin composition described above, or may have two or more layers containing the resin composition described above. Furthermore, other resin layers may be laminated as necessary.

Examples of dicing film substrates include a laminate having a single-layer structure consisting of only a layer containing the resin composition described above; a laminate having a two-layer structure consisting of two layers, a layer containing the resin composition described above and another resin layer. a body; a laminate having a three-layer structure consisting of three layers: a layer containing the resin composition described above/another resin layer/a layer containing the resin composition described above; Moreover, the dicing film substrate may further include a layer containing an adhesive, an adhesive sheet, etc., in addition to the above.

Here, the layer containing the above-described resin composition may be a layer consisting only of the above-described resin composition, and the above-described resin composition and other components within a range that does not impair the object and effect of the present invention. Although it may be a layer containing, it is preferable that the layer is substantially made of the above-described resin composition from the viewpoint of elongation and modulus strength of the dicing film substrate.

The thickness of the layer containing the above resin composition is not particularly limited, but from the viewpoint of improving the strength, modulus strength, elongation, etc. of the dicing film substrate, it is preferably 50 μm or more and 200 μm or less, and 60 μm or more and 180 μm or less. more preferred.

In addition, the average value of the 25% modulus in the MD direction (machine direction) and the 25% modulus in the TD direction (transverse direction) measured at 23°C of the layer containing the resin composition is preferably 7 MPa or more and 13 MPa or less, and 8 MPa or more and 12 MPa. The following are more preferred. When the average value of the 25% modulus at 23°C is within this range, the dicing film substrate tends to have good elongation at room temperature. The above 25% modulus is obtained by preparing a film having a thickness of 100 μm, a length in the TD direction of 10 mm, and a length in the MD direction of 180 mm, which has the same composition as the layer containing the resin composition. -3: Equivalent to 1995), and is a value measured by a Shimadzu desk-top precision universal testing machine AG-X, which is a measuring device. The test speed shall be 300 mm/min.

On the other hand, the average value of the 10% modulus in the MD direction and the 10% modulus in the TD direction measured at −15° C. of the layer containing the resin composition is preferably 15 MPa or more and 30 MPa or less, more preferably 17 MPa or more and 27 MPa or less. When the average value of 10% modulus at −15° C. is within the above range, the dicing film substrate tends to have good splittability and elongation at low temperatures. The above 10% modulus is obtained by preparing a film having the same composition as the layer containing the resin composition and having a thickness of 100 μm, a length in the TD direction of 10 mm, and a length in the MD direction of 180 mm. -3: Equivalent to 1995), and is a value measured by a Shimadzu desk-top precision universal testing machine AG-X, which is a measuring device. The test speed shall be 500 mm/min.

For the layer containing the resin composition, it is preferable that both the 300% modulus in the MD direction and the 300% modulus in the TD direction are measurable at 23°C. If both the 300% modulus in the MD direction at 23° C. and the 300% modulus in the TD direction at 23° C. can be measured, stress is less likely to be applied to the chip during the pick-up process, and damage within the chip is less likely to occur. The 300% modulus is determined by preparing a film having the same composition as the layer containing the resin composition and having a thickness of 100 μm, a length in the TD direction of 10 mm, and a length in the MD direction of 180 mm. -3: Equivalent to 1995), and is a value measured by a Shimadzu desk-top precision universal testing machine AG-X, which is a measuring device. The test speed shall be 300 mm/min.

For the layer containing the resin composition, it is preferable that both the 200% modulus in the MD direction and the 200% modulus in the TD direction are measurable at -15°C. If both the 200% modulus in the MD direction at −15° C. and the 200% modulus in the TD direction at −15° C. can be measured, it is possible to divide and expand the chip and the die bond film at a low temperature. It is easy to carry out expansion (expanding) well. The 200% modulus is determined by preparing a film having the same composition as the layer containing the resin composition and having a thickness of 100 μm, a length in the TD direction of 10 mm, and a length in the MD direction of 180 mm. -3: Equivalent to 1995), and is a value measured by a Shimadzu desk-top precision universal testing machine AG-X, which is a measuring device. The test speed shall be 500 mm/min.

On the other hand, examples of other resin layers include linear low-density polyethylene (LLDPE), low-density polyethylene (LDPE), ethylene/α-olefin copolymer, polypropylene, ethylene/unsaturated carboxylic acid copolymer or ionomer thereof. , ethylene/unsaturated carboxylic acid/unsaturated carboxylic acid alkyl ester terpolymer or its ionomer, ethylene/unsaturated carboxylic acid alkyl ester copolymer, ethylene/vinyl ester copolymer, ethylene/unsaturated carboxylic acid alkyl ester Layers containing ester-carbon monoxide copolymers, unsaturated carboxylic acid grafts thereof, polyvinyl chloride and the like are included. The other resin layer may contain only one type of the above resin, or may contain two or more types thereof.

Although the thickness of the other resin layer is not particularly limited, it is preferably 10 μm or more and 100 μm or less, more preferably 15 μm or more and 80 μm or less, from the viewpoint of not impairing the modulus strength and elongation of the layer containing the resin composition.

Here, the thickness of the entire dicing film substrate is preferably 50 μm or more from the viewpoint of frame retention during dicing, and 200 μm or less from the viewpoint of extensibility (expandability), considering that it is used as a constituent member of the dicing film.

The surface of the dicing film substrate may be subjected to various treatments, such as corona treatment. Further, electron beam irradiation may be performed.

The manufacturing method of the dicing film base material is not particularly limited, and it can be manufactured by a known molding method. For example, when producing a dicing film substrate consisting of only a layer containing the above-described resin composition, conventionally known T die casting molding method, T die nip molding method, inflation molding method, extrusion lamination method, calendar molding method, etc. The resin composition or the like may be molded.

On the other hand, when the dicing film substrate is a laminate of a layer containing the resin composition described above and another resin layer, the resin composition described above and the other resin are subjected to a coextrusion lamination method or the like. It can be molded by Alternatively, the layer containing the resin composition described above and the other resin layer may be prepared separately, and then bonded together with an adhesive, an adhesive sheet, or the like. Examples of materials for adhesives and adhesive sheets include various ethylene copolymers and unsaturated carboxylic acid-grafted products thereof. Further, when the dicing film substrate is a laminate of a layer containing the above resin composition and another resin layer, either one of the layer containing the above resin composition and the other resin layer is Alternatively, one layer may be formed first, and the other layer may be formed on the one layer by using a T-die film forming machine, an extrusion coating forming machine, or the like, and laminated.

3. Dicing film The dicing film of the present invention only needs to comprise the above-described dicing film substrate and an adhesive layer laminated on at least one surface thereof, and may contain other configurations as necessary. . In addition, when the dicing film substrate is composed of multiple layers, it is preferable that the layer containing the resin composition in the dicing film substrate and the adhesive layer are laminated.

The adhesive that constitutes the adhesive layer can be the adhesive for the adhesive layer of a general dicing film. Examples of adhesives include rubber-based, acrylic-based, silicone-based, and polyvinyl ether-based adhesives; radiation-curable adhesives; heat-foaming adhesives, and the like. Above all, considering the releasability of the dicing film from the semiconductor wafer, the adhesive layer preferably contains a radiation-curable adhesive, and more preferably contains an ultraviolet-curable adhesive.

UV-curable adhesives usually contain a radically polymerizable compound (which may be a monomer, an oligomer, or a polymer) and a photopolymerization initiator, and optionally a crosslinking agent, a tackifier, and a filler. agents, anti-aging agents, and additives such as coloring agents.

Examples of radically polymerizable compounds include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, (meth)acrylic Monomers or oligomers of (meth)acrylic acid alkyl esters such as isononyl acid; (meth)acrylate hydroxyalkyl esters such as hydroxyethyl (meth)acrylate, hydroxybutyl (meth)acrylate, and hydroxyhexyl (meth)acrylate Monomers or oligomers; the above (meth)acrylic acid alkyl esters and/or (meth)acrylic acid hydroxyalkyl esters and other monomers such as (meth)acrylic acid, itaconic acid, maleic anhydride, (meth)acrylic acid amide, (meth)acrylic acid N-hydroxymethylamide, (meth)acrylic acid alkylaminoalkyl ester, vinyl acetate, styrene, acrylonitrile, etc.); (Meth) acrylate, pentaerythritol tri(meth) acrylate, tetraethylene glycol di(meth) acrylate, 1,6-hexanediol (meth) acrylate, neopentyl glycol di(meth) acrylate, dipentaerythritol hexa(meth) Ester monomers of (meth)acrylic acid and polyhydric alcohols such as acrylates, and oligomers thereof; -methacryloxyethyl) isocyanurate, tris(2-methacryloxyethyl) isocyanurate, and the like.

Specific examples of photopolymerization initiators include benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; aromatic ketones such as α-hydroxycyclohexylphenyl ketone; aromatic ketals such as benzyl dimethyl ketal. ; Thioxanthones such as polyvinylbenzophenone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone and diethylthioxanthone are included.

Examples of cross-linking agents include polyisocyanate compounds, melamine resins, urea resins, polyamines, and carboxyl group-containing polymers.

The thickness of the adhesive layer is appropriately selected according to the type of adhesive, preferably 3 to 100 μm, more preferably 3 to 50 μm.

Also, the adhesive layer of the dicing film may be protected by a separator. When the adhesive layer is protected with a separator, the surface of the adhesive layer can be kept smooth. In addition, the dicing film can be easily handled and transported, and a label can be processed on the separator. The separator is peeled off when using the dicing film.

The separator may be paper, or a synthetic resin film such as polyethylene, polypropylene, polyethylene terephthalate, or the like. In addition, the surface of the separator that comes into contact with the adhesive layer may be subjected to release treatment such as silicone treatment or fluorine treatment, as necessary, in order to enhance the releasability from the adhesive layer. The thickness of the separator is usually 10 to 200 μm, preferably about 25 to 100 μm.

The method for producing the dicing film is not particularly limited, and for example, it may be produced by applying an adhesive to the above-mentioned dicing base material by a known method. At this time, the adhesive can be applied by a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, or the like. Alternatively, an adhesive layer may be formed by applying an adhesive onto a release sheet, and the adhesive layer may be transferred to the dicing film substrate to laminate the dicing film substrate and the adhesive layer. Alternatively, the dicing film base material and the adhesive layer may be formed at the same time by co-extrusion or the like.

The present invention will be described below with reference to examples. The examples should not be construed as limiting the scope of the present invention.

[Preparation of materials]
The following components were used for each component.
<Ionomer (A) of ethylene/unsaturated carboxylic acid copolymer>
IO: ionomer of ethylene/methacrylic acid/butyl acrylate copolymer (content of structural units derived from ethylene: 80% by mass, content of structural units derived from methacrylic acid: 10% by mass, butyl acrylate Content of structural units derived from: 10% by mass, degree of neutralization: 70% zinc, MFR measured at 190 ° C. and 2160 g load in accordance with JIS K 7210: 1999 (equivalent to ISO 1133: 1997): 1 g /10 minutes)

<Polyamide (B)>
PA: Nylon 6 (manufactured by Ube Industries, Ltd., 1022B (trade name), melting point: 215° C. to 225° C., density: 1140 kg/m ³ )

<Styrene resin (C)>
Styrene resin 1: SEBS (styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals, SOE S1611 (trade name), JIS K 7210: 1999 (equivalent to ISO 1133: 1997) , MFR measured at 230 ° C., 2160 g load: 12.0 g / 10 minutes, Tan δ peak temperature: 9 ° C.)
・ Styrene resin 2: HSBR (hydrogenated styrene-butadiene random copolymer (manufactured by JSR, DYNARON 1320P (trade name), JIS K 7210: 1999 (equivalent to ISO 1133: 1997), 230 ° C. , MFR measured at 2160 g load: 3.5 g / 10 minutes, Tan δ peak temperature: -15 ° C.)
Styrene resin 3: SEBS (styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals, Tuftec H1041 (trade name), JIS K 7210: 1999 (equivalent to ISO 1133: 1997), 230 ° C., MFR measured at 2160 g load: 5.0 g/10 min, Tan δ peak temperature: -45 ° C.)
Styrene resin 4: acid-modified SEBS (maleic anhydride-modified styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals, Tuftec M1913 (trade name), acid value: 10 mg CH ₃ ONa/g, JIS K 7210 : 1999 (equivalent to ISO 1133:1997), MFR measured at 230 ° C., 2160 g load: 5.0 g / 10 minutes, Tan δ peak temperature: -40 ° C.)
・ Styrene resin 5: SEPS (styrene-ethylene/propylene-styrene block copolymer (manufactured by Kuraray Co., Ltd., Septon 2002, JIS K 7210: 1999 (equivalent to ISO 1133: 1997)), 230 ° C., 2160 g load Measured MFR: 70.0 g/10 min)

<Others>
EMAA: ethylene/methacrylic acid copolymer (content of structural units derived from ethylene: 91% by mass, content of structural units derived from methacrylic acid: 9% by mass, JIS K 7210: 1999 (ISO 1133: 1997), MFR measured at 190 ° C., 2160 g load: 3 g / 10 minutes)
・ TPU: Thermoplastic polyurethane elastomer (manufactured by Tosoh Corporation, Miractran P485RSUI (trade name))

[Examples 1 to 13 and Comparative Examples 1 to 7]
An ethylene/unsaturated carboxylic acid copolymer ionomer (A), a polyamide (B), and a styrene resin (C) were dry-blended at the ratios (mass ratios) shown in Table 1. Next, the dry-blended mixture was put into the resin inlet of a 30 mmφ twin-screw extruder and melt-kneaded at a die temperature of 230° C. to obtain a resin composition for a dicing film substrate. The obtained resin composition for a dicing film substrate was measured for MFR at 230° C. (190° C. only in Comparative Example 1) under a load of 2160 g in accordance with JIS K 7210:1999 (corresponding to ISO 1133:1997). Table 1 shows the results.

[evaluation]
The obtained resin composition for a dicing film substrate was molded at a processing temperature of 230° C. using a 40 mmφ T die film molding machine to prepare a T die film having a thickness of 100 μm. The resulting T-die film was used as a dicing film substrate and evaluated by the following methods. Table 1 shows the results.

(1) Modulus Strength at Room Temperature The dicing film substrate was cut into strips of 10 mm width×180 mm length. In accordance with JIS K 7127: 1999 (equivalent to ISO 527-3: 1995), using Shimadzu desktop precision universal testing machine AG-X as a measuring device, the MD direction (machine direction) of the sample (dicing film substrate) ) and TD (Transverse Direction), the 25% modulus was measured at 23°C. The chuck-to-chuck distance was 100 mm, and the test speed was 300 mm/min.

The 25% modulus in the MD direction and the 25% modulus in the TD direction obtained by the above tests were averaged, and the room temperature modulus strength of the dicing film substrate was evaluated according to the following criteria.
A (good): 8 MPa or more and 12 MPa or less B (slightly good): 7 MPa or more and less than 8 MPa, or more than 12 MPa and 13 MPa or less C (poor): less than 7 MPa or more than 13 MPa

(2) Low Temperature Modulus Strength The dicing film substrate was cut into strips of 10 mm width×180 mm length. In accordance with JIS K 7127: 1999 (equivalent to ISO 527-3: 1995), using a Shimadzu desktop precision universal testing machine AG-X as a measuring device, the MD direction and TD direction of the sample (dicing film substrate) , the 10% modulus was measured at -15°C. The chuck-to-chuck distance was 100 mm, and the test speed was 500 mm/min.

The 10% modulus in the MD direction and the 10% modulus in the TD direction obtained by the above tests were averaged, and the low-temperature modulus strength of the dicing film substrate was evaluated according to the following criteria.
A (good): 17 MPa or more and 28 MPa or less B (slightly good): 15 MPa or more and less than 17 MPa, or more than 28 MPa and 30 MPa or less C (poor): less than 15 MPa or more than 30 MPa

(3) Elongation at Room Temperature The dicing film substrate was cut into strips of 10 mm width×180 mm length. In accordance with JIS K 7127: 1999 (equivalent to ISO 527-3: 1995), using Shimadzu desktop precision universal testing machine AG-X as a measuring device, 23 in each of the MD and TD directions of the object to be measured 300% modulus was measured at °C.

Regarding the obtained measurement results, the room-temperature elongation of the dicing film substrate was evaluated according to the following criteria.
A (Good): 300% modulus can be measured at 23 ° C. C (Poor): The dicing film substrate was broken during measurement, and 300% modulus could not be measured at 23 ° C.

(4) Elongation at Low Temperature A dicing film base material was cut into strips having a width of 10 mm and a length of 180 mm. In accordance with JIS K 7127: 1999 (equivalent to ISO 527-3: 1995), using Shimadzu desktop precision universal testing machine AG-X as a measuring device, for each of the MD direction and TD direction of the measurement object, - 200% modulus was measured at 15°C.

Regarding the obtained measurement results, the low-temperature elongation of the dicing film substrate was evaluated according to the following criteria.
A (Good): 200% modulus can be measured at -15°C C (Poor): The dicing film substrate was broken during measurement, and 200% modulus could not be measured at -15°C

As is clear from Table 1, the dicing film base of Examples 1 to 13 containing an ethylene/unsaturated carboxylic acid copolymer ionomer (A), a polyamide (B), and a styrene resin (C) The dicing film substrate using the resin composition for material was excellent in room-temperature modulus strength, low-temperature modulus strength, room-temperature elongation, and low-temperature elongation.

On the other hand, in Comparative Example 1, which does not contain polyamide (B) and styrene-based resin (C), elongation at room temperature was low. Moreover, in Comparative Example 2, which did not contain polyamide (B), the low-temperature modulus strength was low. Furthermore, in Comparative Example 3, which does not contain the styrene-based resin (C), both room-temperature elongation and low-temperature elongation were low. Furthermore, in Comparative Examples 4 to 7, which did not contain the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer, both the normal temperature elongation and the low temperature elongation were low.

From the above results, it was confirmed that the resin composition for a dicing film substrate of the present invention can realize a dicing film substrate excellent in room-temperature modulus strength, low-temperature modulus strength, room-temperature elongation, and low-temperature elongation. .

This application claims priority based on Japanese Patent Application No. 2021-44998 filed on March 18, 2021. All contents described in the specification of the application are incorporated herein by reference.

According to the resin composition for a dicing film substrate of the present invention, a dicing film substrate having excellent elongation at room temperature and low temperature and also excellent modulus strength at room temperature and low temperature is realized. Therefore, it is very useful in the field of manufacturing semiconductor devices.

Claims

an ethylene/unsaturated carboxylic acid-based copolymer ionomer (A);
Polyamide (B);
a styrene-based resin (C);
A resin composition for a dicing film substrate comprising:
The ethylene/unsaturated carboxylic acid-based copolymer ionomer (A) is an ethylene/unsaturated carboxylic acid/unsaturated carboxylic acid ester copolymer ionomer,
The resin composition for a dicing film substrate according to claim 1.
The amount of the constituent units derived from the unsaturated carboxylic acid in the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is the total amount of the constituent units of the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer. 1% by mass or more and 30% by mass or less with respect to the amount,
The resin composition for a dicing film substrate according to claim 1 or 2.
The degree of neutralization of the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is 10% or more and 90% or less.
The resin composition for a dicing film substrate according to any one of claims 1 to 3.
The styrene-based resin (C) is a styrene-based elastomer,
The resin composition for a dicing film substrate according to any one of claims 1 to 4.
The content of the styrene resin (C) is 1% by mass or more and 40% by mass or less,
The resin composition for a dicing film substrate according to any one of claims 1 to 5.
The content of the ionomer (A) in the ethylene/unsaturated carboxylic acid copolymer is equal to or greater than the total amount of the content of the polyamide (B) and the content of the styrene resin (C).
The resin composition for a dicing film substrate according to any one of claims 1 to 6.
According to JIS K 7210: 1999, the melt flow rate measured at 230 ° C. and a load of 2160 g is 0.1 g / 10 minutes or more and 30 g / 10 minutes or less.
The resin composition for a dicing film substrate according to any one of claims 1 to 7.
Having at least one layer containing the resin composition for a dicing film substrate according to any one of claims 1 to 8,
Dicing film substrate.
The average value of the 25% modulus in the MD direction and the 25% modulus in the TD direction measured at 23° C. in accordance with JIS K 7127:1999 of the layer containing the resin composition for a dicing film substrate is 7 MPa or more and 13 MPa or less. is
The dicing film substrate according to claim 9.
The average value of the 10% modulus in the MD direction and the 10% modulus in the TD direction measured at −15° C. in accordance with JIS K 7127:1999 of the layer containing the resin composition for a dicing film substrate is 15 MPa or more and 30 MPa. is the following
The dicing film substrate according to claim 9 or 10.
A dicing film substrate according to claim 11;
an adhesive layer laminated on at least one surface of the dicing film substrate;
having
dicing film.