CN117063262A - Resin composition for dicing film substrate, and dicing film - Google Patents
Resin composition for dicing film substrate, and dicing film Download PDFInfo
- Publication number
- CN117063262A CN117063262A CN202280021186.1A CN202280021186A CN117063262A CN 117063262 A CN117063262 A CN 117063262A CN 202280021186 A CN202280021186 A CN 202280021186A CN 117063262 A CN117063262 A CN 117063262A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- styrene
- dicing film
- ethylene
- unsaturated carboxylic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 112
- 239000000758 substrate Substances 0.000 title claims abstract description 59
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 146
- 229920005989 resin Polymers 0.000 claims abstract description 67
- 239000011347 resin Substances 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 66
- 229920000554 ionomer Polymers 0.000 claims abstract description 60
- 229920001577 copolymer Polymers 0.000 claims abstract description 57
- 239000004952 Polyamide Substances 0.000 claims abstract description 41
- 229920002647 polyamide Polymers 0.000 claims abstract description 41
- 239000010410 layer Substances 0.000 claims description 53
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 37
- 239000005977 Ethylene Substances 0.000 claims description 37
- 229920001971 elastomer Polymers 0.000 claims description 29
- 239000000806 elastomer Substances 0.000 claims description 25
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 238000006386 neutralization reaction Methods 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000002585 base Substances 0.000 description 50
- -1 primary amine compound Chemical class 0.000 description 29
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 23
- 229920005604 random copolymer Polymers 0.000 description 20
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 229920000642 polymer Polymers 0.000 description 17
- 239000000178 monomer Substances 0.000 description 15
- 229920001400 block copolymer Polymers 0.000 description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 11
- 239000002253 acid Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 229920006132 styrene block copolymer Polymers 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 125000002947 alkylene group Chemical group 0.000 description 8
- 239000002216 antistatic agent Substances 0.000 description 8
- 150000004678 hydrides Chemical class 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920003048 styrene butadiene rubber Polymers 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 6
- 150000003440 styrenes Chemical class 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 150000001733 carboxylic acid esters Chemical class 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- 238000004566 IR spectroscopy Methods 0.000 description 3
- 229920000305 Nylon 6,10 Polymers 0.000 description 3
- 229920000572 Nylon 6/12 Polymers 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 3
- 239000002174 Styrene-butadiene Substances 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical group 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229920001038 ethylene copolymer Polymers 0.000 description 3
- 229920000578 graft copolymer Polymers 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229910001415 sodium ion Inorganic materials 0.000 description 3
- 239000011115 styrene butadiene Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- 229920003189 Nylon 4,6 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 229920000577 Nylon 6/66 Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- ZMUCVNSKULGPQG-UHFFFAOYSA-N dodecanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCCCC(O)=O ZMUCVNSKULGPQG-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 2
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 229910001425 magnesium ion Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
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- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
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- 229920001567 vinyl ester resin Polymers 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- UYEDESPZQLZMCL-UHFFFAOYSA-N 1,2-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(C)C(C)=CC=C3SC2=C1 UYEDESPZQLZMCL-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- YNSNJGRCQCDRDM-UHFFFAOYSA-N 1-chlorothioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl YNSNJGRCQCDRDM-UHFFFAOYSA-N 0.000 description 1
- CTOHEPRICOKHIV-UHFFFAOYSA-N 1-dodecylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCCCCC CTOHEPRICOKHIV-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- UKQBWWAPJNHIQR-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCC(CO)(CO)CO UKQBWWAPJNHIQR-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- AWQFNUMHFNEWGS-UHFFFAOYSA-N 2-methylprop-1-ene;styrene Chemical group CC(C)=C.C=CC1=CC=CC=C1 AWQFNUMHFNEWGS-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
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- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
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- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
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- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- WAEMQWOKJMHJLA-UHFFFAOYSA-N Manganese(2+) Chemical compound [Mn+2] WAEMQWOKJMHJLA-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920001007 Nylon 4 Polymers 0.000 description 1
- 229920000007 Nylon MXD6 Polymers 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
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- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
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- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 150000001266 acyl halides Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 125000000278 alkyl amino alkyl group Chemical group 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
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- 150000008064 anhydrides Chemical class 0.000 description 1
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- 125000003118 aryl group Chemical group 0.000 description 1
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- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NCMHKCKGHRPLCM-UHFFFAOYSA-N caesium(1+) Chemical compound [Cs+] NCMHKCKGHRPLCM-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- HSOOVEKLGOIEFF-UHFFFAOYSA-N ethenyl nitrate Chemical compound [O-][N+](=O)OC=C HSOOVEKLGOIEFF-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- VEWLDLAARDMXSB-UHFFFAOYSA-N ethenyl sulfate;hydron Chemical compound OS(=O)(=O)OC=C VEWLDLAARDMXSB-UHFFFAOYSA-N 0.000 description 1
- 229920006213 ethylene-alphaolefin copolymer Polymers 0.000 description 1
- 229920005674 ethylene-propylene random copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910001437 manganese ion Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910001419 rubidium ion Inorganic materials 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
- C08L23/0876—Neutralised polymers, i.e. ionomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0869—Acids or derivatives thereof
- C09J123/0876—Neutralised polymers, i.e. ionomers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Dicing (AREA)
Abstract
The invention provides a resin composition for a dicing film substrate, which can realize a dicing film substrate excellent in extensibility at normal temperature and low temperature and further excellent in modulus strength at normal temperature and low temperature. The resin composition for a dicing film-based material, which solves the above-mentioned problems, comprises an ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer, a polyamide (B), and a styrene-based resin (C).
Description
Technical Field
The present invention relates to a resin composition for dicing film base material, and dicing film.
Background
In the production of semiconductor devices such as ICs (integrated circuits), generally, after a semiconductor wafer having a circuit pattern formed thereon is thinned, a dicing step of dividing the semiconductor wafer into chip units is performed. In the dicing step, a wafer processing film (also referred to as a dicing film in this specification) having stretchability is bonded to the back surface of the semiconductor wafer, and the semiconductor wafer is divided into chip units by a dicing blade, a laser, or the like. Then, the dicing film is expanded by an expansion process, thereby expanding the interval between chips and miniaturizing the chips. In this expanding step, for example, an expanding table disposed under the dicing film is pushed up to expand the dicing film, and the chips are divided.
Then, in the pick-up process, only the desired chip is picked up from the dicing film for the desired use. In this pickup step, usually, only the desired chip fine pins are lifted from the dicing film side and picked up.
Here, as a material constituting the dicing film, an ionomer obtained by crosslinking an ethylene- (meth) acrylic acid copolymer with a metal ion is known. For example, patent document 1 describes a radiation-curable adhesive tape for wafer processing, which contains an antistatic resin containing a polyether component and the ionomer. Patent document 2 describes a resin composition for a dicing film base material, which contains: the ionomer described above; copolymers of ethylene, (meth) acrylic acid, and alkyl (meth) acrylates.
Patent document 3 describes an ionomer/polyamide complex comprising an ionomer of a copolymer of ethylene and an α, β -ethylenically unsaturated carboxylic acid, and a polyamide, as a resin composition used for molded parts and the like.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2011-210887
Patent document 2: japanese patent application laid-open No. 2012-89732
Patent document 3: japanese patent laid-open No. 2000-516984
Disclosure of Invention
Problems to be solved by the invention
Here, in the above-described pickup step, it is important that the dicing film around the chip is sufficiently stretched (hereinafter, also referred to as "room temperature stretchability") in order to appropriately pick up only the desired chip. If the dicing film is not sufficiently stretched and the plurality of chips are lifted up by the fine pins, a phenomenon may occur in which chips that are not pickup targets are peeled off from the dicing film. If the room temperature extensibility of the dicing film is low, stress may be applied to the chip in the pick-up step, and the chip may be broken. If these problems occur, the yield of the product decreases or the product defect increases.
However, patent document 1 does not focus on the stretchability itself of the adhesive tape for wafer processing. In patent document 2, although the heat resistance (e.g., stretchability at 120 ℃) of the cut film is evaluated, the stretchability at normal temperature is not focused on. Further, the ionomer/polyamide complex of patent document 3 contains a large amount of polyamide, and therefore it is difficult to mold it into a film shape.
In addition, in addition to the above-mentioned room temperature stretchability, the resin composition for a dicing film base material is required to have modulus strength of a dicing film at room temperature and low temperature, and may be further required to have stretchability at low temperature. Specifically, in the case of dicing/die bonding an integrated film, a step of dividing and expanding (expanding) the die and the die bonding film at a low temperature is provided, and modulus strength required for division and stretchability required for expansion are required. In addition, at normal temperature, film stretchability required for maintaining a constant modulus strength of the chip gap after dicing and for the pickup process described above is required. However, it has not been attempted to achieve both modulus strength at room temperature and low temperature and extensibility at room temperature and low temperature.
The present invention has been made in view of the above problems. The purpose is to provide a resin composition for a dicing film substrate, and a dicing film, which can realize a dicing film substrate that has excellent stretchability at normal temperature and low temperature and further has excellent modulus strength at normal temperature and low temperature.
Means for solving the problems
Namely, the present invention provides the following resin composition for dicing film base material.
[1] A resin composition for a dicing film substrate, which comprises an ionomer (A) of an ethylene/unsaturated carboxylic acid copolymer, a polyamide (B), and a styrene resin (C).
[2] The resin composition for a cut film substrate according to [1], wherein the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is an ionomer of an ethylene/unsaturated carboxylic acid ester copolymer.
[3] The resin composition for a cut film substrate according to [1] or [2], wherein the amount of the structural units derived from an unsaturated carboxylic acid of the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is 1% by mass or more and 30% by mass or less relative to the amount of the total structural units of the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer.
[4] The resin composition for a cut film substrate according to any one of [1] to [3], wherein the degree of neutralization of the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is 10% to 90%.
[5] The resin composition for a dicing film-based material according to any one of [1] to [4], wherein the styrene-based resin (C) is a styrene-based elastomer.
[6] The resin composition for a dicing film-based material according to any one of [1] to [5], wherein the content of the styrene-based resin (C) is 1% by mass or more and 40% by mass or less.
[7] The resin composition for a cut film substrate according to any one of [1] to [6], wherein the content of the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is equal to or more than the total amount of the content of the polyamide (B) and the content of the styrene resin (C).
[8] The resin composition for a dicing film base material according to any one of [1] to [7], wherein the resin composition is in accordance with JIS K7210: 1999 and a melt flow rate of 0.1g/10 min to 30g/10 min under a load of 2160g at 230 ℃.
The present invention provides the following dicing film base material and dicing film.
[9] A dicing film substrate comprising at least one layer comprising the resin composition for dicing film substrates according to any one of the above [1] to [8 ].
[10] The dicing film substrate according to [9], wherein the layer comprising the resin composition for a dicing film substrate is according to JIS K7127: the average value of 25% modulus in MD and 25% modulus in TD measured at 23 ℃ in 1999 is 7MPa to 13 MPa.
[11] The dicing film substrate according to [9] or [10], wherein the layer comprising the resin composition for a dicing film substrate is in accordance with JIS K7127: the average value of 10% modulus in MD and 10% modulus in TD measured at-15 ℃ in 1999 is 15MPa to 30 MPa.
[12] A dicing film comprising the dicing film base material according to [11] above, and an adhesive layer laminated on at least one surface of the dicing film base material.
Effects of the invention
According to the resin composition for a dicing film substrate of the present invention, a dicing film substrate excellent in stretchability at normal temperature and low temperature and further excellent in modulus strength at normal temperature and low temperature can be realized.
Detailed Description
In the present specification, the numerical range indicated by the term "to" means a range including the numerical values described before and after the term "to" as a lower limit value and an upper limit value. The term "(meth) acrylic acid" is a term used by including both "acrylic acid" and "methacrylic acid", and the term "(meth) acrylic acid ester" is a term used by including both "acrylic acid ester" and "methacrylic acid ester".
1. Resin composition for dicing film base material
The resin composition for dicing film base material of the present application (hereinafter, also simply referred to as "resin composition") is mainly used for dicing film base material, but the use of the resin composition is not limited to dicing film base material.
As described above, the base material for a dicing film is required to have not only modulus strength at normal temperature and low temperature but also stretchability at normal temperature and low temperature. However, it has not been attempted to achieve these simultaneously.
In view of the above, the inventors of the present application have conducted intensive studies and as a result have found that a resin composition comprising an ionomer (a) of an ethylene/unsaturated carboxylic acid copolymer, a polyamide (B) and a styrene resin (C) can provide a cut film substrate having both of modulus strength at normal temperature and low temperature and stretchability at normal temperature and low temperature. The reason is considered as follows. That is, in the conventional resin composition containing different kinds of materials, there are cases where uniformity of each material in the resin composition is low. In addition, when a film is formed, physical properties in particular in the TD direction tend to be lowered due to the influence of orientation. In contrast, the resin composition containing the ionomer (a), the polyamide (B), and the styrene resin (C) has good compatibility, and the properties of each material can be maintained without deteriorating the uniformity. Hereinafter, the components contained in the resin composition will be described, and then the physical properties of the resin composition will be described.
< ionomer of ethylene/unsaturated carboxylic acid copolymer (A) >)
The ionomer (a) of the ethylene/unsaturated carboxylic acid copolymer (hereinafter, also simply referred to as "ionomer (a)") is a material obtained by neutralizing a part or all of the acid contained in the ethylene/unsaturated carboxylic acid copolymer with metal ions, and has a structure in which a plurality of ethylene/unsaturated carboxylic acid copolymers are crosslinked. The resin composition may contain only one kind of the ionomer (a), or may contain two or more kinds of the ionomer (a).
The ethylene/unsaturated carboxylic acid copolymer serving as the main skeleton of the ionomer (a) may be, for example, a copolymer (binary copolymer) of ethylene and an unsaturated carboxylic acid, or a copolymer (multipolymer) obtained by copolymerizing ethylene, an unsaturated carboxylic acid, and a monomer other than these monomers.
The ethylene/unsaturated carboxylic acid copolymer may be a block copolymer or a random copolymer. The ethylene/unsaturated carboxylic acid copolymer may be a graft copolymer obtained by further graft polymerizing a known compound onto a random polymer or a block polymer.
The ethylene/unsaturated carboxylic acid copolymer is preferably a binary random copolymer, a ternary random copolymer, a graft copolymer of a binary random copolymer, or a graft copolymer of a ternary random copolymer, more preferably a binary random copolymer or a ternary random copolymer, and still more preferably a ternary random copolymer.
Examples of the unsaturated carboxylic acid to be used as a raw material of the ethylene-unsaturated carboxylic acid copolymer include unsaturated carboxylic acids having 4 to 8 carbon atoms such as acrylic acid, methacrylic acid, ethacrylic acid, itaconic anhydride, fumaric acid, crotonic acid, maleic anhydride, etc., and among them, acrylic acid or methacrylic acid is preferable from the viewpoints of reactivity, easiness of obtaining, etc.
Examples of the other monomers to be used as the raw material of the ethylene/unsaturated carboxylic acid copolymer include unsaturated carboxylic acid esters such as alkyl (meth) acrylate; unsaturated hydrocarbons such as propylene, butene, 1, 3-butadiene, pentene, 1, 3-pentadiene and 1-hexene; vinyl esters derived from vinyl acetate, vinyl propionate, and the like; oxides of vinyl sulfuric acid, vinyl nitric acid, and the like; halides such as vinyl chloride and vinyl fluoride; a primary amine compound containing a vinyl group; a vinyl-containing secondary amine compound; carbon monoxide; sulfur dioxide; etc. Among them, from the viewpoints of reactivity, ease of obtaining, and the like, an unsaturated carboxylic acid ester or an unsaturated hydrocarbon is preferable, and an unsaturated carboxylic acid ester is more preferable. Specifically, the ethylene/unsaturated carboxylic acid copolymer that becomes the main skeleton of the ionomer (a) of the present invention is particularly preferably an ethylene/unsaturated carboxylic acid ester copolymer.
Examples of the unsaturated carboxylic acid esters include unsaturated carboxylic acid alkyl esters having an alkyl group having 1 to 12 carbon atoms in the ester moiety. The number of carbon atoms of the alkyl group is more preferably 1 to 8, still more preferably 1 to 4. Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, 2-ethylhexyl, isooctyl, and the like.
Specific examples of the above-mentioned unsaturated carboxylic acid alkyl esters include methyl (meth) acrylate, ethyl (meth) acrylate, isobutyl (meth) acrylate, n-butyl acrylate, isooctyl acrylate, dimethyl maleate, diethyl maleate, and the like.
Specific examples of the ethylene-unsaturated carboxylic acid-based copolymer include copolymers such as ethylene-acrylic acid copolymer and ethylene-methacrylic acid copolymer; terpolymers such as ethylene-methacrylic acid-n-butyl acrylate copolymer and ethylene-methacrylic acid-isobutyl acrylate copolymer; etc.
The ionomer (a) of the present invention is obtained by crosslinking (neutralizing) carboxyl groups contained in the ethylene/unsaturated carboxylic acid copolymer at an arbitrary ratio with metal ions.
The amount of the structural unit derived from the unsaturated carboxylic acid in the ionomer (a), that is, the amount of the structural unit derived from the unsaturated carboxylic acid relative to the total structural units of the ethylene-unsaturated carboxylic acid-based copolymer is preferably 1 mass% or more and 30 mass% or less, more preferably 4 mass% or more and 25 mass% or less, still more preferably 5 mass% or more and 20 mass% or less, and particularly preferably 6 mass% or more and 15 mass% or less. When the amount of the structural unit derived from the unsaturated carboxylic acid in the ionomer (a) is 4 mass% or more, the modulus strength and stretchability tend to be more excellent. On the other hand, when the amount of the structural unit derived from the unsaturated carboxylic acid is 25 mass% or less, the adhesion is less likely to occur, the welding is less likely to occur, and the handling is easier.
When the ionomer (a) contains structural units derived from another monomer (for example, an unsaturated carboxylic acid ester), the amount of the structural units derived from another monomer in the ionomer (a), that is, the amount of the structural units derived from another monomer with respect to the total structural units of the ethylene-unsaturated carboxylic acid-based copolymer is preferably 1 mass% or more and 20 mass% or less, more preferably 5 mass% or more and 15 mass% or less. When the amount of the structural unit derived from the other monomer is 1 mass% or more, the elongation when the resin composition is formed into a base material of a dicing film tends to be good. On the other hand, when the amount of the structural unit derived from the other monomer is 20 mass% or less, the substrate is less likely to adhere or be welded when the resin composition is formed into a substrate for a dicing film.
In addition, in the ionomer (a), the metal ion to neutralize the acid of the ethylene-unsaturated carboxylic acid copolymer is not particularly limited, and examples thereof include lithium ion, sodium ion, potassium ion, rubidium ion, cesium ion, zinc ion, magnesium ion, manganese ion, and the like. Among them, magnesium ion, sodium ion, or zinc ion is preferable, sodium ion or zinc ion is more preferable, and zinc ion is still more preferable from the viewpoint of easiness of obtaining.
The neutralization degree of the ethylene/unsaturated carboxylic acid copolymer in the ionomer (a) is preferably 10% to 90%, more preferably 10% to 85%, and still more preferably 15% to 82%. When the neutralization degree of the ethylene/unsaturated carboxylic acid copolymer is 10% or more, the hardness of the substrate surface becomes high when the resin composition is formed into a substrate for a dicing film. On the other hand, when the neutralization degree is 90% or less, the processability and moldability of the resin composition become good. The degree of neutralization is a ratio of the number of moles of metal ions to the number of moles of acid groups (e.g., carboxyl groups) included in the ethylene/unsaturated carboxylic acid copolymer. The degree of neutralization can be measured by infrared absorption spectroscopy (IR). The unionized carboxyl groups can be quantified by measuring the c=o telescopic absorption peak of the resin by infrared absorption spectroscopy, and the carboxyl groups of the entire resin can be quantified by measuring the c=o telescopic absorption peak of the hydrochloric acid-treated resin. The neutralization degree can be obtained by measuring both, and specifically, can be calculated from the following formula.
Neutralization degree (%) = (1-P1/P2) ×100
P1: c=o telescopic absorption peak height of ethylene copolymer resin
P2: c=o telescopic absorption peak height of hydrochloric acid treated ethylene copolymer resin
The Melt Flow Rate (MFR) of the ionomer (A) is preferably 0.2g/10 min to 20.0g/10 min, more preferably 0.5g/10 min to 20.0g/10 min, still more preferably 0.5g/10 min to 18.0g/10 min. When the melt flow rate of the ionomer (a) is within the aforementioned range, the resin composition is easy to mold. The melt flow rate of the ionomer (a) was in accordance with JIS K7210: 1999 (corresponding to ISO 1133:1997) under a load of 2160g at 190 ℃.
The content of the ionomer (a) in the resin composition is preferably 30 parts by mass or more and 95 parts by mass or less, more preferably 40 parts by mass or more and 90 parts by mass or less, still more preferably 45 parts by mass or more and 90 parts by mass or less, based on 100 parts by mass of the total of the ionomer (a), the polyamide (B) described later, and the styrene resin (C) described later. When the amount of the ionomer (a) is 30 parts by mass or more, the substrate obtained from the resin composition is excellent in extensibility at normal temperature and extensibility at low temperature. On the other hand, when the amount of the ionomer (a) is 95 parts by mass or less, the amounts of the polyamide (B) and the styrene-based resin (C) are sufficiently large, and the modulus strength at normal temperature and low temperature and the elongation at normal temperature and low temperature of the base material obtained from the resin composition are excellent.
The amount of the ionomer (a) in the resin composition is preferably 1.0 to 10 times, more preferably 1.0 to 7 times, the total amount of the polyamide (B) and the styrene resin (C). Thus, the substrate obtained from the resin composition has good expansibility (expandability) at normal temperature and low temperature.
< Polyamide (B) >
The polyamide (B) may be a resin containing 2 or more amide groups. In general, the ionomer (a) tends to have a low melting point and low heat resistance, but by combining such an ionomer (a) with the polyamide (B), the heat resistance of the resin composition and thus the substrate for the dicing film becomes very good. In addition, when the ionomer (a) and the polyamide (B) are combined, good modulus strength and separability can be obtained when the resin composition is formed into a base material of a dicing film.
The polyamide (B) may be a polycondensate of a dicarboxylic acid and a diamine. Examples of dicarboxylic acids include oxalic acid, adipic acid, sebacic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, 1, 4-cyclohexanedicarboxylic acid, and the like. Examples of the diamine include ethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, decamethylenediamine, 1, 4-cyclohexyldiamine, m-xylylenediamine, and the like.
The polyamide (B) may be a ring-opening polymer of a cyclic lactam such as epsilon-caprolactam or omega-laurolactam, or a polycondensate of an aminocarboxylic acid such as 6-aminocaproic acid, 9-aminononanoic acid, 11-aminoundecanoic acid or 12-aminododecanoic acid, or a copolymer of the above cyclic lactam, dicarboxylic acid and diamine.
Specific examples of the polyamide (B) include nylon 4, nylon 6, nylon 46, nylon 66, nylon 610, nylon 612, nylon 6T, nylon 11, nylon 12, nylon MXD6, nylon 46, or copolymers thereof (e.g., nylon 6/66, nylon 6/12, nylon 6/610, nylon 66/12, nylon 6/66/610), and the like. Among them, nylon 6 and nylon 6/12 are preferable from the viewpoint of improving the low-temperature division properties and easiness of obtaining.
The melting point of the polyamide (B) is preferably 160℃to 250℃inclusive, more preferably 170℃to 240℃inclusive, and still more preferably 180℃to 235℃inclusive. When the melting point of the polyamide (B) is 160 ℃ or higher, the heat resistance of the base material for a dicing film obtained from the resin composition tends to be good. On the other hand, when the melting point of the polyamide (B) is 250℃or lower, the processability of the resin composition becomes good. The melting point of the polyamide (B) can be measured, for example, by a Differential Scanning Calorimeter (DSC) or the like.
The density of the polyamide (B) is preferably 1060kg/m 3 1220kg/m above 3 Hereinafter, 1080kg/m is more preferable 3 Above 1200kg/m 3 Hereinafter, it is more preferably 1100kg/m 3 Above 1180kg/m 3 The following is given. The density of the polyamide (B) can be determined in accordance with ISO 1183-3.
The content of the polyamide (B) is preferably 5 parts by mass or more and less than 40 parts by mass, preferably 5 parts by mass or more and 35 parts by mass or less, more preferably 5 parts by mass or more and 30 parts by mass or less, based on 100 parts by mass of the total of the ionomer (a), the polyamide (B) and the styrene resin (C) described later. When the amount of the polyamide (B) is 5 parts by mass or more, the heat resistance and low-temperature modulus strength of the base material obtained from the resin composition become good. On the other hand, if the amount of the polyamide (B) is less than 40 parts by mass, the moldability of the resin composition becomes good.
< styrene resin (C) >)
The styrene resin (C) may be a homopolymer of styrene or a polymer of styrene and another monomer as long as it has at least styrene as a structural unit. Examples of the styrene-based resin (C) include styrene-based elastomers, ABS-based resins as copolymers of acrylonitrile and styrene, polystyrene, and the like. Among them, styrene-based elastomers are preferable. The styrene-based elastomer means a styrene-based polymer that is a rubber elastomer at room temperature.
Examples of the above-mentioned styrene-based elastomer include: a block copolymer comprising a hard segment formed of a styrene block (styrene polymer) and a soft segment formed of an alkylene block, or a hydride thereof; random copolymers of styrene and alkylene, or hydrides thereof; or an acid-modified styrene elastomer obtained by acid-modifying the styrene elastomer.
The block copolymer may have a styrene block of 2 or more sites polymerized with styrene and an alkylene block of 2 or more sites polymerized with olefin. The alkylene block may be a homopolymer of one kind of olefin or a copolymer of two or more kinds of olefins.
Examples of the above block copolymers include styrene-butadiene block copolymers (SB), styrene-butadiene-styrene block copolymers (SBS), styrene-isoprene block copolymers (SI), styrene-isoprene-styrene block copolymers (SIS).
As described above, the styrene-based elastomer may be a hydride of the block copolymer. In the hydrogenated product, both the styrene block and the alkylene block may be hydrogenated, only either the styrene block or the alkylene block may be hydrogenated, or only a part of the styrene block and the alkylene block may be hydrogenated.
Specific examples of the hydrogenated product of the block copolymer include a styrene-ethylene-butene block copolymer (SEB) which is a hydrogenated product of a styrene-butadiene block copolymer (SB), a styrene-ethylene-butene-styrene block copolymer (SEBs) which is a hydrogenated product of a styrene-butadiene-styrene block copolymer (SBs), a styrene-ethylene-propylene-styrene block copolymer (SEPS) which is a hydrogenated product of a styrene-isoprene-styrene block copolymer (SIS), and the like.
As described above, examples of the styrene-based elastomer also include random copolymers of styrene and alkylene groups. Examples thereof include styrene-butadiene random copolymers, styrene-isoprene random copolymers, styrene-ethylene-butene random copolymers, styrene-ethylene-propylene random copolymers, styrene-isobutylene random copolymers, styrene-ethylene-isoprene random copolymers, and the like.
As described above, the styrene-based elastomer may be a hydride of the random copolymer. Examples thereof include a Hydride (HSBR) of a styrene-butadiene random copolymer and the like.
Among the above, the styrene-based elastomer which is not acid-modified, is preferably a hydride, and more preferably a styrene-ethylene-butene-styrene block copolymer (SEBS) and a styrene-ethylene-propylene-styrene block copolymer (SEPS), and the styrene-ethylene-butene-styrene block copolymer (SEBS) is particularly preferable from the viewpoint of being capable of improving the low-temperature stretchability and the room-temperature stretchability of a substrate for a dicing film obtained from the resin composition.
On the other hand, as described above, the styrene-based elastomer may be an acid-modified styrene-based elastomer obtained by graft-modifying an elastomer formed of the above block copolymer or random polymer, or a hydride thereof, with an unsaturated carboxylic acid or a derivative thereof. The acid-modified styrene-based elastomer may be obtained by graft-modifying the block copolymer or random polymer or a hydrogenated product thereof with one unsaturated carboxylic acid or a derivative thereof, or may be obtained by graft-modifying the block copolymer or random polymer or a hydrogenated product thereof with two or more unsaturated carboxylic acids or a derivative thereof.
Examples of the unsaturated carboxylic acid to be graft polymerized with the above block copolymer, random copolymer, etc. include (meth) acrylic acid, 2-ethacrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, etc. On the other hand, examples of the unsaturated carboxylic acid derivative graft-polymerized with the styrene-based elastomer include: anhydrides such as maleic anhydride, phthalic anhydride, itaconic anhydride, and the like; acid esters such as monomethyl maleate and monoethyl maleate; an amide; an acyl halide; etc. Among them, maleic acid or maleic anhydride is preferable from the viewpoint of reactivity with a styrene-based elastomer and the like.
The acid-modified styrene-based elastomer can be obtained by graft-polymerizing the block copolymer, random copolymer, or the like with an unsaturated carboxylic acid or a derivative thereof in the presence of a radical initiator. The radical initiator may be any radical initiator that can be used for the grafting reaction of polyolefin, and known compounds can be used.
The acid value of the acid-modified styrene-based elastomer is preferably greater than 0mgCH 3 ONa/g and less than 20mgCH 3 ONa/g, more preferably greater than 0mgCH 3 ONa/g and less than 11mgCH 3 ONa/g, more preferably 0.5mgCH 3 ONa/g of 11mgCH 3 ONa/g or less. When the acid value of the acid-modified styrene-based elastomer is in this range, the stretchability at low temperature and normal temperature is easily improved.
Examples of the styrene-based resin (C) include ABS-based resins. The ABS resin is a resin containing a structural unit derived from acrylonitrile and a structural unit derived from styrene, and examples thereof include rubber-reinforced styrene polymers synthesized by various production methods such as a blending method, a grafting method, or a grafting/blending method. Specific examples of ABS resins include resins obtained by graft polymerizing styrene and acrylonitrile, and other monomers such as methyl methacrylate, α -methylstyrene, ethylene bismaleimide, and maleimide, as needed, onto a rubber component such as polybutadiene, styrene-butadiene rubber, ethylene-propylene-diene rubber, and the like.
Examples of the styrene-based resin (C) include polystyrene obtained by polymerizing mainly styrene. Examples of polystyrene include, in addition to general polystyrene synthesized by a production method such as a suspension polymerization method or a continuous polymerization method, high-impact polystyrene obtained by graft polymerizing styrene to a rubber component such as butadiene rubber.
When the styrene-based resin (C) is any resin, the melt flow rate thereof is preferably 0.1g/10 min to 100g/10 min, more preferably 0.5g/10 min to 50g/10 min. The above melt flow rate is in accordance with JIS K7210: 1999 (corresponding to ISO 1133:1997) under a load of 2160g at 230 ℃.
When the styrene resin (C) is any resin, the Tan δ peak temperature is preferably-60 ℃ or higher, more preferably-20 ℃ or higher, still more preferably-10 ℃ or higher, particularly preferably 0 ℃ or higher, from the viewpoint that the low-temperature stretchability and the room-temperature stretchability of the obtained base material for a cut film can be improved. The Tan delta peak temperature is a temperature at which a peak is exhibited in a dynamic viscoelasticity test (temperature-dependent measurement of 10 Hz) in accordance with JIS K6394 (equivalent to ISO 4664-1:2005).
The amount of the styrene resin (C) is preferably 1 part by mass or more and 40 parts by mass or less, more preferably 2 parts by mass or more and 40 parts by mass or less, still more preferably 3 parts by mass or more and 35 parts by mass or less, relative to 100 parts by mass of the total of the ionomer (a), the polyamide (B) and the styrene resin (C). When the amount of the styrene-based resin (C) is 1 part by mass or more, the substrate obtained from the resin composition is excellent in normal-temperature stretchability and low-temperature stretchability. On the other hand, when the amount of the styrene-based resin (C) is 40 parts by mass or less, the film formability of the resin composition becomes good.
In the resin composition of the present invention, when the total mass of the resin components of the resin composition is 100% by mass, the total content of the ionomer (a) of the ethylene/unsaturated carboxylic acid copolymer, the polyamide (B) and the styrene resin (C) is preferably 80 to 100% by mass, more preferably 85 to 100% by mass, still more preferably 90 to 100% by mass, still more preferably more than 95 to 100% by mass, particularly preferably 98 to 100% by mass, and particularly preferably 99 to 100% by mass.
< other polymers and additives >
The resin composition may contain other polymers, various additives, antistatic agents, ultraviolet absorbers, filler, and the like as necessary within a range that does not impair the effects of the present invention.
Examples of other polymers include polyolefins such as polyethylene, polypropylene, and the like. The amount of the other polymer in the resin composition is preferably 20 parts by mass or less based on 100 parts by mass of the total of the ionomer (a), the polyamide (B), and the styrene resin (C).
On the other hand, examples of the additives include antioxidants, heat stabilizers, light stabilizers, pigments, dyes, lubricants, antiblocking agents, mildewcides, antibacterial agents, flame retardants, flame retardant aids, crosslinking agents, crosslinking aids, foaming agents, foaming aids, fiber reinforcing materials, and the like.
Examples of the antistatic agent include a low molecular type antistatic agent and a high molecular type antistatic agent, but a high molecular type antistatic agent is preferable. Examples of the high molecular type antistatic agent include vinyl copolymers having sulfonate in the molecule, alkyl sulfonate, alkylbenzenesulfonate, betaine, and the like. Further, other examples of the high molecular antistatic agent include polyether, polyamide elastomer, polyester elastomer, polyether amide, or salt of inorganic protonic acid of polyether ester amide. Examples of the salt of the inorganic proton acid include an alkali metal salt, an alkaline earth metal salt, a zinc salt, and an ammonium salt.
Examples of the ultraviolet absorber include benzophenone-based, benzoate-based, benzotriazole-based, cyanoacrylate-based, hindered amine-based and the like.
Examples of filler materials include silica, clay, calcium carbonate, barium sulfate, glass beads, talc, and the like.
The amounts of the additives, antistatic agents, ultraviolet absorbers, and filler materials may be appropriately selected according to the kind thereof.
< method for producing resin composition and physical Properties of resin composition >
The method for producing the resin composition of the present invention is not particularly limited as long as the ionomer (a), the polyamide (B), the styrene resin (C), and other polymers and additives which may be used if necessary, can be mixed. For example, all the components may be dry-blended and then melt-kneaded, or a part of the components may be kneaded and then the following components may be added.
The shape of the resin composition after kneading is not particularly limited, and may be, for example, pellet-like, or may be processed into a long or monolithic sheet-like shape.
The resin composition is in accordance with JIS K7210: 1999 The melt flow rate measured at 230℃under a load of 2160g (equivalent to ISO 1133:1997) is preferably 0.1g/10 min to 30g/10 min, more preferably 0.2g/10 min to 15g/10 min, still more preferably 0.5g/10 min to 10g/10 min, still more preferably 1.0g/10 min to 7g/10 min. When the melt flow rate of the resin composition is within this range, the modulus strength at ordinary temperature and low temperature and the stretchability at ordinary temperature and low temperature of the base material obtained from the resin composition are easily improved.
2. Cutting film substrate
The dicing substrate may be a substrate having at least one layer comprising the above resin composition. Since the dicing film base material has a layer containing the resin composition, the dicing film base material exhibits excellent modulus strength and extensibility at normal temperature and low temperature. The dicing film substrate is suitable for use as a substrate for dicing films, but is not limited to this use.
The structure of the dicing film base material is not particularly limited, and may have only one layer containing the resin composition, or may have 2 or more layers containing the resin composition. Further, other resin layers may be laminated as needed.
Examples of the dicing film substrate include: a laminate having a single-layer structure formed only from a layer containing the resin composition; a laminate having a two-layer structure formed of 2 layers including the layer of the resin composition and the other resin layer; a three-layer laminate formed of 3 layers of the layer containing the resin composition/other resin layer/layer containing the resin composition; etc. The dicing film base material may further contain a layer containing an adhesive, an adhesive sheet, or the like, in addition to the above.
Here, the layer containing the resin composition may be a layer formed only from the resin composition, or may be a layer containing the resin composition and other components within a range that does not impair the object and effect of the present invention, but from the viewpoint of the stretchability and modulus strength of the dicing film base material, a layer formed substantially from the resin composition is preferable.
The thickness of the layer containing the resin composition is not particularly limited, but is preferably 50 μm to 200 μm, more preferably 60 μm to 180 μm, from the viewpoint of improving the strength, modulus strength, stretchability, etc. of the cut film substrate.
The average value of the 25% modulus in the MD direction (Machi ne Direction (machine direction)) and the 25% modulus in the TD direction (Transverse Directio n (transverse direction)) of the layer containing the resin composition is preferably 7MPa to 13MPa, more preferably 8MPa to 12MPa, measured at 23 ℃. When the average value of the 25% modulus at 23 ℃ is within this range, the stretchability of the cut film base material at normal temperature tends to be good. The 25% modulus is: a film having a thickness of 100 μm, a TD direction length of 10mm, and a MD direction length of 180mm and having the same composition as the layer containing the above resin composition was prepared, and the film was prepared according to JIS K7127: 1999 (corresponding to ISO 527-3:1995) the value measured for the film using Shimadzu bench precision universal tester AG-X as a measuring device. The test speed was set at 300 mm/min.
On the other hand, the average value of the 10% modulus in the MD and the 10% modulus in the TD of the layer containing the resin composition measured at-15℃is preferably 15MPa to 30MPa, more preferably 17MPa to 27 MPa. When the average value of the 10% modulus at-15 ℃ is within this range, the cut film base material at low temperature tends to be excellent in the splitting property and stretchability. The 10% modulus is: a film having a thickness of 100 μm, a TD direction length of 10mm, and a MD direction length of 180mm and having the same composition as the layer containing the above resin composition was prepared, and the film was prepared according to JIS K7127: 1999 (corresponding to ISO 527-3:1995) the value measured for the film using Shimadzu bench precision universal tester AG-X as a measuring device. The test speed was set at 500 mm/min.
For the layer comprising the resin composition, it is preferable that the 300% modulus in the MD direction and the 300% modulus in the TD direction are both measurable at 23 ℃. If the 300% modulus in the MD direction at 23℃and the 300% modulus in the TD direction at 23℃are both measurable, the chip is less likely to be stressed and is less likely to be broken in the pick-up step. The 300% modulus is: a film having a thickness of 100 μm, a TD direction length of 10mm, and a MD direction length of 180mm and having the same composition as the layer containing the above resin composition was prepared, and the film was prepared according to JIS K7127: 1999 (corresponding to ISO 527-3:1995) the value measured for the film using Shimadzu bench precision universal tester AG-X as a measuring device. The test speed was set at 300 mm/min.
For the layer comprising the resin composition, it is preferable that the 200% modulus in MD and the 200% modulus in TD are both measurable at-15 ℃. If the modulus at-15 ℃ in the MD direction of 200% and the modulus at-15 ℃ in the TD direction of 200% can be measured, the dicing and the expanding (expanding) can be easily performed in the step of dicing and expanding (expanding) the die-bonding film at a low temperature. The 200% modulus is: a film having a thickness of 100 μm, a TD direction length of 10mm, and a MD direction length of 180mm and having the same composition as the layer containing the above resin composition was prepared, and the film was prepared according to JIS K7127: 1999 (corresponding to ISO 527-3:1995) the value measured for the film using Shimadzu bench precision universal tester AG-X as a measuring device. The test speed was set at 500 mm/min.
On the other hand, examples of the other resin layer include a layer containing a Linear Low Density Polyethylene (LLDPE), a Low Density Polyethylene (LDPE), an ethylene-alpha olefin copolymer, polypropylene, an ethylene-unsaturated carboxylic acid copolymer or an ionomer thereof, an ethylene-unsaturated carboxylic acid alkyl ester terpolymer or an ionomer thereof, an ethylene-unsaturated carboxylic acid alkyl ester copolymer, an ethylene-vinyl ester copolymer, an ethylene-unsaturated carboxylic acid alkyl ester-carbon monoxide copolymer, an unsaturated carboxylic acid graft thereof, polyvinyl chloride, or the like. The other resin layer may contain only one kind of the above-mentioned resin, or may contain two or more kinds of the above-mentioned resins.
The thickness of the other resin layer is not particularly limited, but is preferably 10 μm to 100 μm, more preferably 15 μm to 80 μm, from the viewpoint of not impairing the modulus strength and stretchability of the layer containing the resin composition.
Here, the thickness of the entire dicing film base material is preferably 50 μm or more from the viewpoint of holding a frame at the time of dicing, and is preferably 200 μm or less from the viewpoint of expandability (expandability) in view of use as a constituent member of the dicing film.
The surface of the cut film substrate may be subjected to various treatments, for example, corona treatment or the like. In addition, electron beam irradiation may be performed.
The method for producing the dicing film base material is not particularly limited, and can be produced by a known molding method. For example, in the case of producing a cut film base material formed only from a layer containing the above resin composition, the above resin composition and the like may be molded by a conventionally known T-die casting method, T-die rolling method, inflation molding method, extrusion lamination method, calender molding method and the like.
On the other hand, when the cut film base material is a laminate of a layer containing the above resin composition and another resin layer, the above resin composition and the other resin may be molded by a coextrusion lamination method or the like. The layer containing the resin composition and the other resin layer may be produced separately, and may be bonded with an adhesive, an adhesive sheet, or the like. Examples of the material of the adhesive or the adhesive sheet include various ethylene copolymers, unsaturated carboxylic acid grafts thereof, and the like. In the case where the dicing film base material is a laminate of a layer containing the above resin composition and another resin layer, any one of the layer containing the above resin composition and the other resin layer may be formed first, and the other layer may be formed on the one layer by using a T-die film forming machine, an extrusion coating forming machine, or the like, and laminated.
3. Cutting film
The dicing film of the present invention may include the dicing film base material described above and an adhesive layer laminated on at least one surface thereof, and may include other structures as necessary. In the case where the dicing film base material is formed of a plurality of layers, it is preferable that a layer containing the resin composition in the dicing film base material is laminated with the adhesive layer.
The adhesive constituting the adhesive layer may be an adhesive for an adhesive layer of a usual dicing film. Examples of the binder include: rubber-based, acrylic-based, silicone-based, polyvinyl ether-based adhesives; a radiation-curable adhesive; and heat-foamable adhesives. Among them, in view of the releasability of the dicing film from the semiconductor wafer, the adhesive layer preferably contains a radiation-curable adhesive, more preferably contains an ultraviolet-curable adhesive.
The ultraviolet curable pressure-sensitive adhesive generally contains a radically polymerizable compound (monomer, oligomer, or polymer) capable of undergoing radical polymerization, and a photopolymerization initiator, and if necessary, contains additives such as a crosslinking agent, an adhesion promoter, a filler, an aging inhibitor, and a colorant.
Examples of the radical polymerizable compound include: monomers or oligomers of alkyl (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, and isononyl (meth) acrylate; monomers or oligomers of hydroxyalkyl (meth) acrylates such as hydroxyethyl (meth) acrylate, hydroxybutyl (meth) acrylate, and hydroxyhexyl (meth) acrylate; the above alkyl (meth) acrylate and/or hydroxyalkyl (meth) acrylate, and a comonomer or oligomer with other monomers (e.g., (meth) acrylic acid, itaconic acid, maleic anhydride, (meth) acrylamide, N-hydroxymethylamide (meth) acrylate, alkylaminoalkyl (meth) acrylate, vinyl acetate, styrene, acrylonitrile, etc.); ester monomers of (meth) acrylic acid and polyhydric alcohol such as glycidyl (meth) acrylate trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tetraethyleneglycol di (meth) acrylate, 1, 6-hexanediol (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and oligomers thereof; isocyanurates such as 2-propenyl di-3-butenyl cyanurate, 2-hydroxyethyl bis (2-acryloyloxyethyl) isocyanurate, tris (2-methacryloyloxyethyl) isocyanurate, and tris (2-methacryloyloxyethyl) isocyanurate.
Specific examples of the photopolymerization initiator include: benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether and benzoin isobutyl ether; aromatic ketones such as α -hydroxycyclohexyl phenyl ketone; aromatic ketals such as benzil dimethyl ketal; thioxanthones such as polyvinylbenzophenone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, and the like.
Examples of the crosslinking agent include polyisocyanate compounds, melamine resins, urea resins, polyamines, carboxyl group-containing polymers, and the like.
The thickness of the adhesive layer may be appropriately selected depending on the kind of adhesive, and is preferably 3 to 100. Mu.m, more preferably 3 to 50. Mu.m.
In addition, the adhesive layer of the dicing film may be protected by a separator. If the adhesive layer is protected by the separator, the surface of the adhesive layer can be kept smooth. In addition, the operation and transportation of the cut film are easy, and the label processing can be performed on the separator. The membrane is peeled off when using a dicing film.
The separator may be paper, or a synthetic resin film such as polyethylene, polypropylene, polyethylene terephthalate, or the like. In addition, the separator may be subjected to a mold release treatment such as a silicone treatment or a fluorine treatment as necessary in order to improve the releasability from the adhesive layer on the surface thereof in contact with the adhesive layer. The thickness of the separator is usually about 10 to 200. Mu.m, preferably about 25 to 100. Mu.m.
The method for producing the dicing film is not particularly limited, and for example, the dicing film can be produced by applying an adhesive to the dicing substrate by a known method. In this case, the adhesive may be applied by a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a blade coater, a spray coater, or the like. Alternatively, an adhesive may be applied to the release sheet to form an adhesive layer, the adhesive layer may be transferred to the dicing film base material, and the dicing film base material and the adhesive layer may be laminated. In addition, the dicing film base material and the adhesive layer may be formed simultaneously by coextrusion or the like.
Examples
The present invention will be described below with reference to examples. The scope of the invention is not to be interpreted in a limiting manner by the examples.
[ preparation of materials ]
The following components were used as the respective components.
< ionomer of ethylene/unsaturated carboxylic acid copolymer (A) >)
IO: ionomer of ethylene-methacrylic acid-butyl acrylate copolymer (content of structural unit derived from ethylene: 80% by mass, content of structural unit derived from methacrylic acid: 10% by mass, content of structural unit derived from butyl acrylate: 10% by mass, degree of neutralization: 70% zinc, MFR measured in accordance with JIS K7210:1999 (equivalent to ISO 1133:1997) under load of 2160g at 190 ℃ C.: 1g/10 min)
< Polyamide (B) >
PA: nylon 6 (1022B (trade name) manufactured by yu gaku corporation),melting point: 215 ℃ to 225 ℃, density: 1140kg/m 3 )
< styrene resin (C) >)
Styrene resin 1: SEBS (styrene-ethylene-butene-styrene Block copolymer (manufactured by Asahi chemical Co., ltd., S.O.E.S1611 (trade name)), MFR measured at 230℃under a load of 2160g in accordance with JIS K7210:1999 (equivalent to ISO 1133:1997: 12.0g/10 min, tan delta peak temperature: 9 ℃ C.)
Styrene resin 2: HSBR (hydride of styrene-butadiene random copolymer (manufactured by JSR Co., ltd., DYNARON 1320P (trade name)), MFR measured under a load of 2160g at 230℃in accordance with JIS K7210:1999 (equivalent to ISO 1133:1997: 3.5g/10 min, tan delta peak temperature: -15 ℃ C.)
Styrene resin 3: SEBS (styrene-ethylene-butene-styrene Block copolymer (Tuftec H1041 (trade name) manufactured by Asahi chemical Co., ltd.) having MFR of 5.0g/10 min, tan delta peak temperature of-45 ℃ C.) measured under a load of 2160g at 230 ℃ C. According to JIS K7210:1999 (corresponding to ISO 1133:1997)
Styrene resin 4: acid-modified SEBS (maleic anhydride-modified styrene-ethylene-butene-styrene Block copolymer (Tuftec M1913 (trade name), manufactured by Asahi chemical Co., ltd.) acid value: 10mgCH 3 ONa/g, according to JIS K7210: 1999 (equivalent to IS O1133: 1997) and MFR measured at 230 ℃ C. Under a load of 2160 g: 5.0g/10 min, tan delta peak temperature: -40 DEG C
Styrene resin 5: SEPS (styrene-ethylene-propylene-styrene Block copolymer (manufactured by KURARAY Co., ltd., SEPTON 2002), MF R of 70.0g/10 min measured under a load of 2160g at 230℃in accordance with JIS K7210:1999 (equivalent to ISO 1133:1997)), and a preparation method thereof
< others >
EMAA: ethylene/methacrylic acid copolymer (content of structural unit derived from ethylene: 91% by mass, content of structural unit derived from methacrylic acid: 9% by mass), MFR measured according to JIS K7210:1999 (equivalent to ISO 1133:1997) under load of 190 ℃ C., 2160 g: 3g/10 min)
TPU: thermoplastic polyurethane elastomer (manufactured by TOSOH Co., ltd., MIRACTRAN P485RSUI (trade name))
Examples 1 to 13 and comparative examples 1 to 7
The ionomer (a) of the ethylene/unsaturated carboxylic acid copolymer, the polyamide (B) and the styrene resin (C) were dry-blended in the proportions (mass ratio) shown in table 1. Next, the dry-blended mixture was fed into a resin feed port of a 30mm phi twin-screw extruder, and melt-kneaded at a die temperature of 230℃to obtain a resin composition for a cut film base material. The obtained resin composition for a cut film substrate was prepared according to JIS K7210: 1999 (equivalent to ISO 1133:1997), MFR was measured at 230℃under a load of 2160g (190℃only in comparative example 1). The results are shown in Table 1.
[ evaluation ]
The obtained cut film base material was molded with a resin composition at a processing temperature of 230℃using a 40mm phi T film molding machine to prepare a T film having a thickness of 100. Mu.m. The obtained T-die film was used as a dicing film base material, and evaluated by the following method. The results are shown in Table 1.
(1) Modulus Strength at Normal temperature
The cut film base material was cut into a long strip of 10mm wide by 180mm long. According to JIS K7127: 1999 (corresponding to ISO 527-3:1995), 25% modulus was measured at 23℃in the MD (Machine Direction) and TD (Transverse Direction) directions of a sample (cut film substrate) using an Shimadzu type precision universal tester AG-X as a measuring device. The distance between chucks was set to 100mm and the test speed was set to 300 mm/min.
The 25% modulus in the MD direction and the 25% modulus in the TD direction obtained by the above test were averaged, and the room temperature modulus strength of the cut film base material was evaluated based on the following criteria.
A (good): 8MPa to 12MPa
B (slightly good): 7MPa or more and less than 8MPa, or more than 12MPa and 13MPa or less
C (bad): less than 7MPa or greater than 13MPa
(2) Low temperature modulus strength
The cut film base material was cut into a long strip of 10mm wide by 180mm long. According to JIS K7127: 1999 (corresponding to ISO 527-3:1995), 10% modulus was measured at-15℃in the MD and TD directions of the sample (cut film substrate) using an Shimadzu type precision universal tester AG-X as a measuring device. The distance between chucks was set to 100mm and the test speed was set to 500 mm/min.
The 10% modulus in the MD direction and the 10% modulus in the TD direction obtained by the above test were averaged, and the low-temperature modulus strength of the cut film substrate was evaluated according to the following criteria.
A (good): 17MPa to 28MPa
B (slightly good): 15MPa or more and less than 17MPa, or more than 28MP a and 30MPa or less
C (bad): less than 15MPa or more than 30MPa
(3) Extensibility at normal temperature
The cut film base material was cut into a long strip of 10mm wide by 180mm long. According to JIS K7127:1999 (equivalent to ISO 527-3:1995), the 300% modulus was measured at 23℃in the MD and TD directions of the measurement object using an Shimadzu-type precision universal tester AG-X as a measurement device.
For the measurement results obtained, the room temperature extensibility of the cut film base material was evaluated according to the following criteria.
A (good): can determine 300% modulus at 23 DEG C
C (bad): the cut film substrate breaks during the measurement and the 300% modulus cannot be measured at 23 DEG C
(4) Low temperature extensibility
The cut film substrate was cut into strips 10mm wide by 180mm long. According to JIS K7127:1999 (equivalent to ISO 527-3:1995), 200% modulus was measured at-15℃in the MD and TD directions of the measurement object using Shimadzu type precision universal tester AG-X as a measurement device.
For the measurement results obtained, the low-temperature stretchability of the cut film base material was evaluated according to the following criteria.
A (good): can measure 200% modulus at-15 DEG C
C (bad): the cut film substrate breaks during the measurement and the 200% modulus cannot be measured at-15℃
TABLE 1
As is clear from table 1, the resin compositions for dicing film base materials of examples 1 to 13, which used the ionomer (a) comprising an ethylene-unsaturated carboxylic acid copolymer, the polyamide (B) and the styrene resin (C), were excellent in normal temperature modulus strength, low temperature modulus strength, normal temperature stretchability, and low temperature stretchability.
In contrast, in comparative example 1, which does not contain the polyamide (B) and the styrene-based resin (C), the room temperature extensibility is low. In comparative example 2, which does not contain the polyamide (B), the low-temperature modulus strength is low. In comparative example 3 containing no styrene resin (C), both of the room temperature extensibility and the low temperature extensibility were low. In comparative examples 4 to 7, which do not contain the ionomer (a) of the ethylene/unsaturated carboxylic acid copolymer, the room temperature extensibility and the low temperature extensibility are low.
From the above results, it was confirmed that the resin composition for a dicing film base material according to the present invention can realize a dicing film base material excellent in normal temperature modulus strength, low temperature modulus strength, normal temperature stretchability, and low temperature stretchability.
The present application claims priority based on Japanese patent application No. 2021-44998 filed on 18/3/2021. The disclosure of this application is incorporated in its entirety into the present description.
Industrial applicability
According to the resin composition for a dicing film substrate of the present application, a dicing film substrate excellent in stretchability at normal temperature and low temperature and further excellent in modulus strength at normal temperature and low temperature can be realized. Therefore, the method is very useful in the field of manufacturing semiconductor devices.
Claims (12)
1. A resin composition for dicing a film substrate, comprising:
an ionomer (A) of an ethylene/unsaturated carboxylic acid copolymer,
polyamide (B), and
a styrene resin (C).
2. The resin composition for a cut film substrate according to claim 1, wherein the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is an ionomer of an ethylene/unsaturated carboxylic acid ester copolymer.
3. The resin composition for a dicing film-based material according to claim 1 or 2, wherein the amount of the structural units derived from an unsaturated carboxylic acid of the ionomer (a) of the ethylene-unsaturated carboxylic acid copolymer is 1% by mass or more and 30% by mass or less relative to the amount of the total structural units of the ionomer (a) of the ethylene-unsaturated carboxylic acid copolymer.
4. The resin composition for a cut film substrate according to any one of claims 1 to 3, wherein the degree of neutralization of the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is 10% to 90%.
5. The resin composition for a dicing film-based material according to any one of claims 1 to 4, wherein the styrene-based resin (C) is a styrene-based elastomer.
6. The resin composition for a dicing film-based material according to any one of claims 1 to 5, wherein the content of the styrene-based resin (C) is 1 mass% or more and 40 mass% or less.
7. The resin composition for a cut film substrate according to any one of claims 1 to 6, wherein the content of the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer is equal to or more than the total amount of the content of the polyamide (B) and the content of the styrene resin (C).
8. The resin composition for cutting a film substrate according to any one of claims 1 to 7, wherein the resin composition is in accordance with JIS K7210: 1999 and a melt flow rate of 0.1g/10 min to 30g/10 min under a load of 2160g at 230 ℃.
9. A dicing film substrate having at least one layer comprising the resin composition for dicing film substrates according to any one of claims 1 to 8.
10. The dicing film substrate according to claim 9, wherein the layer comprising the resin composition for dicing film substrate is according to JIS K7127: the average value of 25% modulus in MD and 25% modulus in TD measured at 23 ℃ in 1999 is 7MPa to 13 MPa.
11. The dicing film substrate according to claim 9 or 10, wherein the layer comprising the resin composition for dicing film substrate is according to JIS K7127: the average value of 10% modulus in MD and 10% modulus in TD measured at-15 ℃ in 1999 is 15MP a to 30 MPa.
12. A dicing film, having:
the cut film substrate of claim 11, and
and an adhesive layer laminated on at least one surface of the dicing film base material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021044998 | 2021-03-18 | ||
| JP2021-044998 | 2021-03-18 | ||
| PCT/JP2022/009398 WO2022196392A1 (en) | 2021-03-18 | 2022-03-04 | Resin composition for dicing film substrate, dicing film substrate, and dicing film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117063262A true CN117063262A (en) | 2023-11-14 |
Family
ID=83320360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280021186.1A Pending CN117063262A (en) | 2021-03-18 | 2022-03-04 | Resin composition for dicing film substrate, and dicing film |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022196392A1 (en) |
| KR (1) | KR20230138017A (en) |
| CN (1) | CN117063262A (en) |
| TW (1) | TW202302747A (en) |
| WO (1) | WO2022196392A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011210887A (en) | 2010-03-29 | 2011-10-20 | Furukawa Electric Co Ltd:The | Adhesive tape for processing radiation curing wafer |
| JP5666875B2 (en) | 2010-10-21 | 2015-02-12 | アキレス株式会社 | Base film for tape for semiconductor manufacturing process |
| JP6554708B2 (en) * | 2015-11-20 | 2019-08-07 | 三井・ダウポリケミカル株式会社 | Resin composition for dicing film substrate, dicing film substrate and dicing film |
| JP6667671B2 (en) * | 2016-12-27 | 2020-03-18 | 三井・ダウポリケミカル株式会社 | Dicing film substrate and dicing film |
| KR102483810B1 (en) * | 2018-08-08 | 2023-01-03 | 미츠이·다우 폴리케미칼 가부시키가이샤 | Resin composition for dicing film substrate, dicing film substrate and dicing film |
-
2022
- 2022-03-04 CN CN202280021186.1A patent/CN117063262A/en active Pending
- 2022-03-04 KR KR1020237030144A patent/KR20230138017A/en unknown
- 2022-03-04 WO PCT/JP2022/009398 patent/WO2022196392A1/en active Application Filing
- 2022-03-04 JP JP2023506968A patent/JPWO2022196392A1/ja active Pending
- 2022-03-14 TW TW111109147A patent/TW202302747A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2022196392A1 (en) | 2022-09-22 |
| TW202302747A (en) | 2023-01-16 |
| KR20230138017A (en) | 2023-10-05 |
| WO2022196392A1 (en) | 2022-09-22 |
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