WO2022196261A1 - 有機el表示装置 - Google Patents
有機el表示装置 Download PDFInfo
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- WO2022196261A1 WO2022196261A1 PCT/JP2022/007157 JP2022007157W WO2022196261A1 WO 2022196261 A1 WO2022196261 A1 WO 2022196261A1 JP 2022007157 W JP2022007157 W JP 2022007157W WO 2022196261 A1 WO2022196261 A1 WO 2022196261A1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 162
- 239000000049 pigment Substances 0.000 claims abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000011164 primary particle Substances 0.000 claims abstract description 48
- 239000002245 particle Substances 0.000 claims description 61
- 239000000377 silicon dioxide Substances 0.000 claims description 40
- 150000001875 compounds Chemical class 0.000 claims description 32
- 125000006850 spacer group Chemical group 0.000 claims description 28
- -1 methacryloyl group Chemical group 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 20
- 238000006243 chemical reaction Methods 0.000 claims description 17
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical group [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 7
- 125000004436 sodium atom Chemical group 0.000 claims description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 125000005702 oxyalkylene group Chemical group 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 239000010410 layer Substances 0.000 description 194
- 239000010408 film Substances 0.000 description 104
- 238000005401 electroluminescence Methods 0.000 description 74
- 239000006185 dispersion Substances 0.000 description 59
- 238000000034 method Methods 0.000 description 58
- 239000000203 mixture Substances 0.000 description 58
- 239000007788 liquid Substances 0.000 description 43
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 37
- 238000011156 evaluation Methods 0.000 description 27
- 239000007787 solid Substances 0.000 description 25
- 238000004458 analytical method Methods 0.000 description 22
- 239000000243 solution Substances 0.000 description 20
- 238000002360 preparation method Methods 0.000 description 19
- 239000002904 solvent Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 18
- 238000000576 coating method Methods 0.000 description 16
- 239000011521 glass Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 14
- 229910001316 Ag alloy Inorganic materials 0.000 description 13
- 229910052735 hafnium Inorganic materials 0.000 description 13
- 238000003786 synthesis reaction Methods 0.000 description 11
- 238000011161 development Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 239000003999 initiator Substances 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- 239000002131 composite material Substances 0.000 description 9
- 238000009616 inductively coupled plasma Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000009719 polyimide resin Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- 239000011324 bead Substances 0.000 description 8
- 239000011246 composite particle Substances 0.000 description 8
- 239000002270 dispersing agent Substances 0.000 description 8
- 238000004993 emission spectroscopy Methods 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 238000007740 vapor deposition Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 241000894007 species Species 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 125000005372 silanol group Chemical group 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 239000012860 organic pigment Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229920005575 poly(amic acid) Polymers 0.000 description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 101100489584 Solanum lycopersicum TFT1 gene Proteins 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910000449 hafnium oxide Inorganic materials 0.000 description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 3
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000010954 inorganic particle Substances 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 238000010947 wet-dispersion method Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000001055 blue pigment Substances 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- LRCFXGAMWKDGLA-UHFFFAOYSA-N dioxosilane;hydrate Chemical compound O.O=[Si]=O LRCFXGAMWKDGLA-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- JXDYKVIHCLTXOP-UHFFFAOYSA-N isatin Chemical compound C1=CC=C2C(=O)C(=O)NC2=C1 JXDYKVIHCLTXOP-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 239000001053 orange pigment Substances 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 125000006353 oxyethylene group Chemical group 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000001057 purple pigment Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000001054 red pigment Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 2
- 125000004665 trialkylsilyl group Chemical group 0.000 description 2
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- JLQFVGYYVXALAG-CFEVTAHFSA-N yasmin 28 Chemical compound OC1=CC=C2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1.C([C@]12[C@H]3C[C@H]3[C@H]3[C@H]4[C@@H]([C@]5(CCC(=O)C=C5[C@@H]5C[C@@H]54)C)CC[C@@]31C)CC(=O)O2 JLQFVGYYVXALAG-CFEVTAHFSA-N 0.000 description 2
- 239000001052 yellow pigment Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- YQMXOIAIYXXXEE-UHFFFAOYSA-N 1-benzylpyrrolidin-3-ol Chemical compound C1C(O)CCN1CC1=CC=CC=C1 YQMXOIAIYXXXEE-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- DBRHKXSUGNZOLP-UHFFFAOYSA-N 2-(2-isocyanatoethoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCN=C=O DBRHKXSUGNZOLP-UHFFFAOYSA-N 0.000 description 1
- MCLKERLHVBEZIW-UHFFFAOYSA-N 2-[4-(carboxymethyl)-2,5-dihydroxyphenyl]acetic acid Chemical compound OC(=O)CC1=CC(O)=C(CC(O)=O)C=C1O MCLKERLHVBEZIW-UHFFFAOYSA-N 0.000 description 1
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- UDWIZRDPCQAYRF-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C=C UDWIZRDPCQAYRF-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- ACZGCWSMSTYWDQ-UHFFFAOYSA-N 3h-1-benzofuran-2-one Chemical compound C1=CC=C2OC(=O)CC2=C1 ACZGCWSMSTYWDQ-UHFFFAOYSA-N 0.000 description 1
- BCJIMAHNJOIWKQ-UHFFFAOYSA-N 4-[(1,3-dioxo-2-benzofuran-4-yl)oxy]-2-benzofuran-1,3-dione Chemical compound O=C1OC(=O)C2=C1C=CC=C2OC1=CC=CC2=C1C(=O)OC2=O BCJIMAHNJOIWKQ-UHFFFAOYSA-N 0.000 description 1
- FWTBRYBHCBCJEQ-UHFFFAOYSA-N 4-[(4-phenyldiazenylnaphthalen-1-yl)diazenyl]phenol Chemical compound C1=CC(O)=CC=C1N=NC(C1=CC=CC=C11)=CC=C1N=NC1=CC=CC=C1 FWTBRYBHCBCJEQ-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 101100313164 Caenorhabditis elegans sea-1 gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- IJKVHSBPTUYDLN-UHFFFAOYSA-N dihydroxy(oxo)silane Chemical compound O[Si](O)=O IJKVHSBPTUYDLN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010130 dispersion processing Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005430 electron energy loss spectroscopy Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- FVDOBFPYBSDRKH-UHFFFAOYSA-N perylene-3,4,9,10-tetracarboxylic acid Chemical compound C=12C3=CC=C(C(O)=O)C2=C(C(O)=O)C=CC=1C1=CC=C(C(O)=O)C2=C1C3=CC=C2C(=O)O FVDOBFPYBSDRKH-UHFFFAOYSA-N 0.000 description 1
- 239000003444 phase transfer catalyst Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000004841 transmission electron microscopy energy-dispersive X-ray spectroscopy Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B57/00—Other synthetic dyes of known constitution
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
Definitions
- the present invention relates to an organic EL display device.
- An organic EL display device is a self-luminous display device that emits light by recombination energy of electrons injected from a cathode and holes injected from an anode. is formed in the opening of the pixel division layer.
- Patent Document 1 discloses, for example, a negative photosensitive composition containing an organic black pigment, a polyimide resin, and a fluorene-based acrylate compound. According to Patent Document 1, it is possible to form a pixel division layer having both high light shielding properties and a low taper angle.
- the present invention is an organic EL display device comprising a substrate, a first electrode, a pixel division layer, a luminescent pixel and a second electrode, wherein the pixel division layer comprises (a) an organic black pigment and/or a mixed organic black pigment and (b) silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis/minor axis) of 1.0 to 1.5.
- an organic EL display device with little luminance unevenness is provided.
- FIG. 1 is a cross-sectional view of a TFT substrate in an organic EL display device given as a specific example of an embodiment of the present invention
- FIG. It is a manufacturing process of an organic EL display device including a process of forming a pixel division layer in all examples and comparative examples.
- FIG . 4 is a schematic diagram showing the maximum opening width W1 and the minimum opening width W2 in the openings of the opening width evaluation substrates in all the examples and comparative examples.
- FIG. 12 is a schematic view of the pixel division layer/spacer layer forming substrate in Example 12, viewed from the film surface side and viewed from the cross section.
- a numerical range represented using “to” means a range including the numerical values described before and after “to” as lower and upper limits.
- a pixel division layer means a pixel division layer provided in an organic EL display device, and does not include a black matrix of a liquid crystal display device.
- Visible light means light with a wavelength of 380 nm or more and less than 780 nm
- near-ultraviolet means light with a wavelength of 200 nm or more and less than 380 nm.
- the term “light shielding” refers to the ability to reduce the intensity of transmitted light compared to the intensity of light incident on the cured film in the vertical direction, and the term “light shielding property” refers to the extent to which visible light is shielded.
- the photosensitive composition means an alkali-developable photosensitive composition having sensitivity to near-ultraviolet rays.
- the weight average molecular weight (Mw) is a value analyzed by gel permeation chromatography using tetrahydrofuran as a carrier and converted using a standard polystyrene calibration curve.
- Color Index Generic Name used in the names of some coloring materials is an abbreviation for Color Index Generic Name, and based on the Color Index published by The Society of Dyers and Colorists, regarding coloring materials registered in the Color Index , Color Index Generic Name represents the chemical structure and crystal form of a pigment or dye.
- C.I. I. Carbon black classified as Pigment Black 7 is classified as an inorganic black pigment.
- the solid content means the ratio (% by weight) of components excluding solvent and water in the photosensitive composition.
- light-emitting pixels are usually composed of at least three colors of blue, red, and green, and are designed with high relative luminosity and the shortest dimension of the minor diameter of the aperture. It has been found that in-plane variations in light-emitting pixel size are particularly likely to be visually recognized by the user as luminance unevenness in green pixels.
- the relative luminous efficiency means the strength of the human eye perceiving brightness for each wavelength of light.
- the light-emitting pixel size is determined by the opening width of the opening of the pixel dividing layer due to the laminated structure of the light-emitting element, it is thought that the unevenness in brightness is caused by the large in-plane variation of the opening width.
- the present invention provides an organic EL display device comprising a substrate, a first electrode, a pixel division layer, light-emitting pixels, and a second electrode, wherein the pixel division layer comprises (a) an organic black pigment and/or a mixed-color organic
- the pixel division layer comprises (a) an organic black pigment and/or a mixed-color organic
- the organic EL display device of the present invention comprises a substrate, first electrodes, pixel division layers, light-emitting pixels and second electrodes.
- FIG. 1 shows a cross-sectional view of a TFT substrate in an organic EL display device that is given as a specific example of an embodiment of the present invention.
- TFT1 Bottom gate type or top gate type thin film transistors 1 (hereinafter abbreviated as TFT1) are provided in a matrix on the surface of the substrate 6, and the TFTs are insulated while covering the TFT1 and the wiring 2 connected to the TFT1.
- a layer 3 is formed.
- a flattening layer 4 is formed on the surface of the TFT insulating layer 3 , and a contact hole 7 is provided in the flattening layer 4 to connect the first electrode 5 to the wiring 2 .
- a first electrode 5 is patterned on the surface of the planarizing layer 4 and connected to the wiring 2 .
- a pixel division layer 8 is formed so as to surround the pattern periphery of the first electrode 5 .
- An opening is provided in the pixel division layer 8, and a luminous pixel 9 containing an organic EL luminous material is formed in the opening.
- a second electrode 10 separates the pixel division layer 8 and the luminous pixel 9.
- a film is formed in a state of covering.
- the shape of the opening of the pixel division layer 8 is not particularly limited, and may be square, rectangular, or elliptical.
- the opening width of the opening may be appropriately determined according to the size of the light-emitting pixel 9, which will be described later.
- the minor axis may be 10 to 50 ⁇ m.
- the optical density per 1 ⁇ m film thickness of the pixel dividing layer provided in the organic EL display device of the present invention is preferably 0.5 or more in order to suppress external light reflection and increase the value as a display device. , is more preferably 0.7 or more. 1.5 or less is preferable, and 1.2 or less is more preferable, in order to suppress luminance unevenness.
- the optical density per 1 ⁇ m film thickness as used herein is a value calculated from the following formula by measuring the incident light intensity and the transmitted light intensity using an optical densitometer (manufactured by X-Rite; X-Rite 361T). is divided by the value of the film thickness and rounded off to the second decimal point, and the higher the optical density, the higher the light shielding property.
- optical density log10 ( I0 /I) I 0 : incident light intensity I: transmitted light intensity.
- the film thickness of the pixel dividing layer 8 is usually 1 to 4 ⁇ m, and the taper angle of the end portion of the pixel dividing layer at the boundary with the opening of the pixel dividing layer increases the film-forming properties of the second electrode 10 to form a light-emitting pixel.
- the angle is preferably 15° or more, and more preferably 20° or more, in order to suppress deterioration of the light-shielding properties of the end portions of the pixel dividing layer.
- the pixel division layer is preferably formed by a photolithographic method using an alkali-developable photosensitive composition in order to reduce luminance unevenness.
- the photosensitive composition may be either a negative photosensitive composition or a positive photosensitive composition.
- a negative photosensitive composition is preferable because it is excellent. That is, the pixel division layer included in the organic EL display device of the present invention is preferably a cured film formed of a negative photosensitive composition.
- a method for forming a pixel dividing layer using a negative photosensitive composition includes a coating step of applying the negative photosensitive composition to obtain a coating film, and pattern exposure to actinic radiation through a negative exposure mask. an exposure step of obtaining an exposed film having an exposed portion and an unexposed portion in the plane thereof, a developing step of removing the film in the unexposed portion by developing with an alkaline developer to obtain a developed film, and heating.
- a method including a curing step of obtaining a cured film by heat curing is preferred.
- a spin coater or a slit coater can be preferably used as a coating device used in the coating process because of its excellent thin film coating properties.
- pin gap pre-baking or contact pre-baking may be performed.
- the prebaking temperature is preferably 50 to 150° C.
- the prebaking time is preferably 30 seconds to 5 minutes.
- Examples of exposure apparatuses used in the exposure process include steppers, mirror projection mask aligners (MPA), and parallel light mask aligners (PLA).
- the actinic radiation irradiated during exposure includes j-line (wavelength 313 nm), i-line (wavelength 365 nm), h-line (wavelength 405 nm) or g-line (wavelength 436 nm) of a mercury lamp, i-line or at least i-line.
- a mixed line containing is more preferred.
- a negative type exposure mask for example, a thin film having a shielding property made of a metal such as chromium is formed in a pattern on one surface of a substrate such as glass, quartz, or film that is translucent at the exposure wavelength. An exposed film having an exposed portion and an unexposed portion in its plane can be obtained by performing pattern exposure by transmitting actinic rays only through the openings of the mask.
- the exposed area here refers to the exposed area
- the unexposed area refers to the unexposed area
- Examples of the developing method in the developing process include methods such as showering, dipping, and puddle, and include a method of immersing the exposed film for 10 seconds to 3 minutes.
- the paddle method is preferable for improving the in-plane uniformity of the opening width of the opening.
- TMAH tetramethylammonium hydroxide aqueous solution
- the developed film is thermally cured by heating, and at the same time, moisture is volatilized to obtain a cured film.
- Heating devices include, for example, hot air ovens and IR ovens.
- the heating temperature is preferably 200 to 350°C, more preferably 220 to 280°C under atmospheric pressure. Since the deformation and/or fusion of component (b) occurs at 800 to 1200°C, the primary particle size and aspect ratio of component (b) are maintained before and after the curing step by setting the heating temperature range to 350°C or less. be able to. The primary particle size and aspect ratio of component (b) will be described later.
- the organic EL display device of the present invention preferably further comprises a spacer layer on at least part of the surface of the pixel division layer.
- the spacer layer is a columnar layer formed in a panel display area of an organic EL display device with a formation area of 30% or less of the formation area of the pixel division layer.
- the spacer layer reduces the contact area between the pixel dividing layer and the vapor deposition mask when forming the luminescent pixels 9 to be described later. Increase equipment productivity.
- a photolithography method is preferable, and for example, the same method as the above-described method for forming the pixel division layer can be applied.
- the thickness of the spacer layer is preferably 0.5 to 2.0 ⁇ m.
- the light-emitting pixels 9 are made by arranging different types of pixels having respective light-emitting peak wavelengths in the three primary colors of blue, red, and green, all over the surface.
- blue, red, and green color filters may be arranged in combination on the front surface of the display section.
- the peak wavelength of the red region normally displayed is 560 to 700 nm
- the peak wavelength of the blue region is 420 to 500 nm
- the peak wavelength of the green region is 500 to 550 nm.
- the emitted light may have any peak wavelength.
- the organic EL light-emitting material constituting the light-emitting pixel a material obtained by combining a hole-transporting layer and/or an electron-transporting layer in addition to the light-emitting layer can be preferably used.
- a method for patterning luminescent pixels includes a mask vapor deposition method.
- the mask vapor deposition method is a method of vapor-depositing and patterning an organic compound using a vapor deposition mask. Specifically, vapor deposition is performed by arranging a vapor deposition mask having a desired pattern as an opening on the substrate side. mentioned. In order to obtain a highly precise deposition pattern, it is important to have a highly flat deposition mask in close contact with the substrate. A technique of bringing the mask into close contact with the substrate or the like can be used. Etching methods, mechanical polishing, sandblasting, sintering, laser processing, and the use of photosensitive resin are examples of methods for manufacturing vapor deposition masks. It is preferable to use an etching method or an electroforming method because of their superiority.
- conductive metal oxides such as zinc oxide, tin oxide, indium oxide, indium tin oxide (ITO), and indium zinc oxide (IZO) can be used.
- ITO can be preferably used because of its excellent properties.
- a method for patterning the ITO first, an ITO film is formed on the entire surface by a sputtering method, and then a positive resist material for etching is patterned by a photolithography method to obtain a resist pattern on the ITO film.
- the ITO referred to here includes so-called amorphous ITO.
- a positive resist material for etching a positive photosensitive composition containing an alkali-soluble novolac resin can be used.
- an aqueous solution containing nitric acid and hydrochloric acid or an aqueous oxalic acid solution can be used.
- IS-3 both of which are manufactured by Sasaki Chemicals Co., Ltd.).
- an organic amine-based aqueous solution can be used as the resist stripping solution, and commercially available products include, for example, "Anlast” (registered trademark) M6, Anlast M6B, TN-1-5, and M71-2 (both of which are Sanwaka Junyaku Research Institute).
- the organic EL display device of the present invention is a top emission type organic EL display device
- the first electrode 5 has a laminated structure of ITO/silver alloy/ITO in order to improve light reflectivity and adhesion to the substrate.
- the second electrode 10 may be made of any material as long as it is a layer that can function as an electrode.
- a layer made of aluminum can be preferably used in terms of excellent light reflectivity.
- a layer made of a silver alloy made of silver/magnesium can be preferably used in terms of excellent light transmittance.
- the second electrode can be obtained by forming a film over the entire surface by sputtering.
- the light extraction direction of the organic EL display device of the present invention may be a bottom emission type organic EL display device in which light emitted from the light emitting pixel is extracted to the substrate side through the substrate 6, or the first electrode It may be a top-emission type organic EL display device in which emitted light is extracted to the opposite side of the substrate 6 via the substrate 6, and is not particularly limited.
- a rigid type organic EL display device that cannot be bent can be obtained.
- the glass an alkali-free glass having an alkali metal element content of less than 0.5% and containing silicon as a main component can be suitably used. Among them, those having a small coefficient of thermal expansion and excellent dimensional stability in high-temperature processes at 250° C. or higher are preferred. 100 (manufactured by Asahi Glass Co., Ltd.), and its thickness is usually 0.1 to 0.5 mm from the viewpoint of physical durability.
- a bendable flexible type organic EL display device can be obtained.
- a substrate made of a polyimide resin having high flexibility and excellent mechanical strength can be suitably used.
- a method of applying and then heating to imidize the polyamic acid to convert it into a polyimide resin, and then peeling off the temporary support with a laser or the like can be used.
- the polyamic acid used in this case can be synthesized by reacting a tetracarboxylic dianhydride and a diamine compound in an amide solvent such as N-methyl-2-pyrrolidone.
- a polyamic acid having a residue of an aromatic tetracarboxylic dianhydride and a residue of an aromatic diamine compound is preferred in that it has a small molecular weight and excellent dimensional stability.
- a specific example is a polyamic acid having a residue of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and a residue of p-phenylenediamine. Its thickness is usually 10 to 40 ⁇ m, and the thickness of the substrate 6 can be reduced as compared with the case of using the alkali-free glass.
- the pixel division layer included in the organic EL display device of the present invention contains (a) an organic black pigment and/or a mixed organic black pigment (hereinafter sometimes referred to as component (a)).
- component (a) has the effect of imparting light shielding properties to the pixel division layer.
- organic black pigments examples include benzodifuranone-based black pigments, perylene-based black pigments, and azomethine-based black pigments.
- benzodifuranone-based black pigments examples include pigments disclosed in International Publication No. 2009/010521. Irgaphor Black (registered trademark) S0100CF and Experimental Black 582 (both manufactured by BASF) can be preferably used as commercially available benzodifuranone-based black pigments composed of the compound represented by formula (3) described later.
- perylene-based black pigments for example, C.I. I. Pigment Black 31, C.I. I. Pigment Black 32, perylenetetracarboxylic acid benzimidazole or derivatives thereof, pigments disclosed in WO 2005/078023 can be mentioned.
- Spectrasense (registered trademark) Black S0084, L0086, K0087, and K0088 can be used as commercially available products.
- azomethine-based black pigments examples include pigments disclosed in US Patent Application Publication No. 2002-121228.
- Chromo Fine Black A1103 manufactured by Dainichiseika Kogyo Co., Ltd.
- Dainichiseika Kogyo Co., Ltd. can be used.
- the mixed color organic black pigment includes (a-1) at least one organic pigment selected from organic yellow pigments, organic red pigments and organic orange pigments (hereinafter sometimes referred to as component (a-1)); (a-2) containing at least one organic pigment selected from organic blue pigments and organic purple pigments (hereinafter sometimes referred to as component (a-2)), and containing component (a-1) and component (a); It means a pigment mixture in which the content of component (a-2) is 20% by weight or more relative to the total amount of components -2).
- organic yellow pigments include C.I. I. Pigment Yellow 24, 120, 138, 139, 151, 175, 180, 185, 181, 192, 193, 194.
- organic orange pigments include C.I. I. Pigment Orange 13, 36, 43, 60, 61, 62, 64, 71, 72.
- organic red pigments include C.I. I. Pigment Red 122, 123, 149, 178, 177, 179, 180, 189, 190, 202, 209, 254, 255, 264.
- organic blue pigments include C.I. I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:6, 16, 25, 56, 57, 60, 61, 64, 65, 66, 75, 79, 80.
- organic purple pigments include C.I. I. Pigment Violet 19, 23, 29, 32, 37.
- the component (a) contained in the pixel division layer included in the organic EL display device of the present invention contains an organic black pigment in order to reduce luminance unevenness.
- the organic black pigment preferably contains a compound represented by formula (1) or formula (2) and/or an isomer thereof.
- Component (a) contained in the pixel division layer more preferably contains a compound represented by formula (3) or an isomer thereof.
- the compounds represented by formulas (1) to (3) are synthesized by reacting 2,5-dihydroxy-1,4-benzenediacetic acid with isatin or a derivative thereof in the presence of an acidic catalyst, and converted into a pigment. can be obtained with
- R 1 to R 10 each independently represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms.
- the component corresponding to the component (a) may be finely processed by a known method such as a solvent salt milling method or an acid paste method in order to further suppress luminance unevenness.
- a solvent salt milling method or an acid paste method in order to further suppress luminance unevenness.
- the compound represented by the formula (4) or a salt thereof is allowed to coexist and adsorb to the surface of the pigment, thereby making it easier to suppress luminance unevenness in some cases.
- n and m each independently represents an integer from 0 to 2. However, n+m ⁇ 1 is satisfied.
- the component (a) contains a benzodifuranone-based black pigment, it is preferable to have a silica-containing coating layer on the surface of the pigment in order to improve developability and suppress development residues in the openings.
- the silica contained in the coating layer referred to herein is not the component (b) but a part of the component (a).
- the content of component (a) is preferably 1% by weight or more, more preferably 10% by weight or more, in the pixel dividing layer in order to develop high light-shielding properties. It is preferably 50% by weight or less, more preferably 30% by weight or less, in order to reduce luminance unevenness.
- the pixel division layer included in the organic EL display device of the present invention includes (b) silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis/minor axis) of 1.0 to 1.5 (hereinafter , sometimes referred to as component (b)).
- component (b) silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis/minor axis) of 1.0 to 1.5
- component (b) silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis/minor axis) of 1.0 to 1.5
- component (b) silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis/minor axis) of 1.0 to 1.5
- primary particle diameter refers to the long diameter of a particle
- silica particles having a primary particle diameter of 5 to 30 nm refer to those having a primary particle diameter
- the term "aspect ratio (major axis/minor axis)" as used herein refers to a value obtained by dividing the major axis by the minor axis of a primary particle of silica particles and then rounding off to the second decimal place.
- Silica particles having an aspect ratio of 0 to 1.5 refer to particles having an aspect ratio within the range of 1.0 to 1.5.
- the component (b) has the effect of increasing the uniformity of the opening width of the opening and reducing uneven brightness.
- the silica particles referred to here are particles having a pure content of SiO2 of 90% by weight or more in the weight excluding water, particles made of silicon dioxide (anhydrous silicic acid), and silicon dioxide hydrate (hydrous silicic acid). and particles of quartz glass.
- the form of hydrated silicic acid is not particularly limited, and particles made of orthosilicic acid, metasilicic acid and/or metadisilicic acid also correspond to the silica particles referred to here.
- the weight excluding water means the weight of the particles minus the weight of water in the particles.
- a surface treatment agent applied as a shell to at least a part of the surface of a particle not containing SiO 2 as a core such as a particle made of an organic polymer, an organic pigment or an inorganic pigment
- the coating layer is defined as not corresponding to silica particles by itself, regardless of the pure content of SiO 2 even if it contains SiO 2 .
- core-shell type composite particles containing SiO 2 in the core and having a pure SiO 2 content of 90% by weight or more in the weight excluding water are defined as silica particles. That is, the component (b) is filled as particles dispersed in the pixel division layer.
- the structure of the particles of component (b) is not particularly limited, and may have internal voids.
- Silica particles other than the particles made of silicon dioxide, the particles made of silicon dioxide hydrate, and the particles made of quartz glass have, for example, a pure SiO 2 content of 90% by weight or more in the weight excluding water.
- silica particles made of a composite oxide of silicon and metal examples include zirconium, titanium, and cerium. However, as far as silica particles containing hafnium atoms are concerned, it is defined as a mixture of silica particles and component (c).
- the component (b) more preferably contains silica particles having a primary particle diameter of 5 to 20 nm, more preferably silica particles having a primary particle diameter of 5 to 15 nm. preferable. It is more preferable to contain silica particles having an aspect ratio of 1.0 to 1.3, more preferably 1.0 to 1.2. In addition, when the aspect ratio is 1.0, it can be regarded as spherical silica particles.
- Silica particles other than component (b) and component (b) are obtained by thinly slicing the pixel division layer and spacer layer as an observation sample, preferably by ion milling, more preferably by pretreatment by focused ion beam (FIB) processing.
- a transmission electron microscope-energy dispersive X-ray was used to examine the cross section, which was polished to improve smoothness, in a range of 0.2 to 0.8 ⁇ m in the film depth direction from the outermost layer of the pixel dividing layer or spacer layer.
- TEM-EDX Transmission electron microscopy--electron energy loss spectroscopy (TEM-EELS) or scanning transmission electron microscopy--energy dispersive X-ray spectroscopy (STEM-EDX) can also be used for analysis.
- TEM-EDX transmission electron microscope-energy dispersive X-ray spectroscopy
- the diameter is regarded as the major axis.
- Representative values indicating the characteristics of the silica particles corresponding to component (b) include the average primary particle diameter, that is, the average major diameter, rounded to the first decimal place, and the average aspect ratio. A value obtained by calculating the average value of the aspect ratios of individual silica particles corresponding to the component (b) and rounding off to the second decimal place is used.
- the SiO 2 fraction that is in contact with the surface of particles such as particles made of polymers, organic pigments and/or inorganic pigments is excluded from the analysis.
- the long diameter and aspect ratio of silica particles contained in the spacer layer can also be measured in the same manner.
- the pixel dividing layer included in the organic EL display device of the present invention may further include silica particles not corresponding to the component (b), i.e., silica particles having a primary particle diameter of less than 5 nm or exceeding 30 nm, and an aspect ratio (major diameter /minor diameter) of more than 1.5 may be contained.
- Silica particles that do not correspond to the component (b) include, for example, “ADMAFINE” (registered trademark) SO-E2, SO-E4 (both of which are manufactured by Admatec), KE-P10, KE-S10 (both of which are (manufactured by Nippon Shokubai Co., Ltd.).
- the average primary particle size of the silica particles contained in the pixel dividing layer included in the organic EL display device of the present invention is preferably 5 to 30 nm, more preferably 5 to 25 ⁇ m, from the viewpoint of suppressing luminance unevenness.
- the average aspect ratio (major axis/minor axis) is preferably 1.0 to 1.3, more preferably 1.0 to 1.2. That is, even if the pixel division layer of the organic EL display device of the present invention contains silica particles that do not correspond to the component (b), the average primary particle diameter of all the silica particles contained is 5 to 30 nm. and an average aspect ratio (major axis/minor axis) of 1.0 to 1.3.
- silica particles as used herein includes both the component (b) and silica particles that do not correspond to the component (b).
- the average primary particle diameter here means 0 in the film depth direction from the outermost layer of the pixel division layer under the condition of 50000 times magnification by transmission electron microscope-energy dispersive X-ray spectroscopy (TEM-EDX) as described above. All silica particles obtained by randomly acquiring 30 images of cross sections located in the range of 0.2 to 0.8 ⁇ m using an image analysis type particle size distribution analyzer “Mac-View” (manufactured by MOUNTECH). It means the value obtained by rounding off the first decimal place of the average value of the major axis of .
- the "average aspect ratio (major axis/minor axis)" as used herein refers to the average value obtained by dividing the major axis by the minor axis of each primary particle of all silica particles obtained at random in the same image. It means the value rounded off to the second decimal place.
- the silica particles having an average primary particle diameter of 5 to 30 nm refer to those having an average primary particle diameter within the range of 5 to 30 nm, and the silica particles having an average aspect ratio of 1.0 to 1.3 mean that the average It means that the aspect ratio is within the range of 1.0 to 1.3.
- the specific surface area of component (b) corresponding to the primary particle size is preferably 50 to 500 m 2 /g, more preferably 200 to 400 m 2 /g.
- the specific surface area referred to here is the specific surface area measured by the BET method using nitrogen as an adsorption gas.
- the surface of component (b) may be porous or non-porous and may have internal surface area.
- Functional groups that the component (b) has on its surface include, for example, reactive residues of surface modifying groups containing ethylenically unsaturated double bond groups, silanol groups, alkoxysilyl groups, trialkylsilyl groups, and diphenylsilyl groups. mentioned. Above all, it is preferable to have a reactive residue of a surface modification group containing an ethylenically unsaturated double bond group in order to further reduce luminance unevenness.
- the reaction residue of the surface modifying group containing an ethylenically unsaturated double bond group as used herein means that the ethylenically unsaturated double bond group of the surface modifying group containing an ethylenically unsaturated double bond group reacts with light and/or Alternatively, it means a group remaining after radical polymerization reaction by heat.
- the component (b) contains silica particles having on the particle surface a reaction residue of a surface modifying group containing an ethylenically unsaturated double bond group, and reaction of the surface modifying group containing the ethylenically unsaturated double bond group. More preferably, the residue has a structure represented by formula (19) and/or a structure represented by formula (20).
- the reaction residue of the surface modifying group containing the ethylenically unsaturated double bond group is a residue generated by a radical polymerization reaction with a compound having two or more radically polymerizable groups in the molecule, which will be described later. .
- R16 represents a hydrogen atom or a methyl group.
- R 17 represents a divalent hydrocarbon group having 1 to 7 carbon atoms.
- j and k are integers and each independently represents 0 or 1; However, if j is 1, then k is 1.
- * 1 represents the bonding site with the carbon atom.
- * 2 represents a bonding site with an oxygen atom bonded to a silicon atom, which the silica particle has on the particle surface.
- R 18 represents an alkyl group having 1 to 3 carbon atoms.
- R 19 represents a hydrogen atom or a methyl group.
- R 20 represents an oxyalkylene group having 1 to 3 carbon atoms.
- r is an integer representing 1 to 4; * 3 represents the bonding site with the carbon atom.
- * 4 represents a bonding site with an oxygen atom bonded to a silicon atom, which the silica particle has on the particle surface.
- Component (b) having a structure represented by formula (19) is a surface modifying group derived from an organic alkoxysilane compound having an ethylenically unsaturated double bond group, and dehydration condensation with silanol groups on the surface of silica particles. It can be obtained by introducing a reaction and subjecting the ethylenically unsaturated double bond group contained in the surface modifying group to a radical polymerization reaction with light and/or heat.
- Organic alkoxysilane compounds having an ethylenically unsaturated double bond group include, for example, vinyltrimethoxysilane, vinyltriethoxysilane, p-styryltrimethoxysilane, p-styryltriethoxysilane, 3-methacryloxypropylmethyldimethoxy Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropylmethyldimethoxysilane, 3-acryloxypropylmethyldiethoxysilane, 3 -acryloxypropyltrimethoxysilane, 3-acryloxypropyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane.
- Component (b), in which the reaction residue has a structure represented by formula (20), is a surface modifying group derived from an isocyanate compound having an ethylenically unsaturated double bond group, and a silanol group on the silica particle surface. It can be obtained by subjecting an ethylenically unsaturated double bond group contained in a surface modifying group to a radical polymerization reaction with light and/or heat.
- Isocyanate compounds having an ethylenically unsaturated double bond group include, for example, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, and 2-(2-methacryloyloxyethyloxy)ethyl isocyanate.
- a surface modifying group derived from an organic alkoxysilane compound having an ethylenically unsaturated double bond group and a surface modifying group derived from an isocyanate compound having an ethylenically unsaturated double bond group are added to the surface of the silica particles.
- the component (b) preferably has a trialkylsilyl group. It is more preferable to have Trimethylsilyl groups can be introduced into component (b) by converting hydrogen atoms in the surface silanol groups of silica particles into trimethylsilyl groups using a trimethylsilylating agent. Examples of the trimethylsilylating agent include hexamethyldisilazane and trimethylalkoxysilane, which can be introduced by deammonification reaction and dehydration condensation reaction, respectively. By improving the dispersion stability of the component (b), it may be possible to more stably reduce the luminance unevenness.
- the component (b) preferably contains silica particles having sodium atoms.
- Existence forms of sodium atoms include, for example, ions (Na + ) and salts with silanol groups (Si—ONa).
- the content of sodium atoms is preferably 100 to 5000 ppm by weight in component (b).
- Silica particles having sodium atoms can be synthesized by reacting sodium silicate, which is strongly alkaline as a silicon source, with a mineral acid, which is a strong acid, under alkaline conditions.
- the sodium atoms contained in the silica particles can be detected at the central portion corresponding to the intersection of the major axis and the minor axis in cross-sectional imaging of the primary particles using the aforementioned TEM-EDX.
- the content of the component (b) is preferably 1 to 50% by weight, more preferably 5 to 20% by weight in terms of SiO 2 , in the pixel division layer in order to suppress luminance unevenness. From the same point of view, all silica components in the pixel division layer are preferably 1 to 50% by weight, more preferably 7 to 30% by weight in terms of SiO 2 .
- the content in terms of SiO 2 means the content calculated by excluding the weight of water in the silica particles, which varies depending on the heat history, based on the common technical knowledge of those skilled in the art.
- the content of component (b) with respect to 100 parts by weight of component (a) is preferably 20 to 70 parts by weight, more preferably 30 to 50 parts by weight in terms of SiO 2 in order to reduce uneven brightness. That is, in the organic EL display device of the present invention, it is preferable that the content of the component (b) relative to the component (a) in the pixel division layer is 20 to 70 parts by weight in terms of SiO 2 .
- the pixel division layer included in the organic EL display device of the present invention further includes (c) hafnium atoms (hereinafter sometimes referred to as the (c) component). It is preferably contained in the pixel division layer at 1 to 50 weight ppm, and more preferably contained in the pixel division layer at 1 to 30 weight ppm. Component (c) is preferably contained in the pixel division layer as inorganic particles containing hafnium atoms.
- Examples of the inorganic particles containing the component (c) include hafnium oxide (HfO 2 ), a composite oxide of a metal other than hafnium and hafnium, a solid solution of an oxide of a metal other than hafnium and hafnium oxide, hafnium oxynitride, A composite oxynitride of a metal other than hafnium and hafnium, and a solid solution of an oxynitride of a metal other than hafnium and hafnium oxynitride can be mentioned.
- hafnium oxide (HfO 2 ) or a composite oxide of a metal other than hafnium and hafnium is preferable in terms of an excellent effect of reducing luminance unevenness, and a composite oxide of zirconium and hafnium (ZrO 2 —HfO 2 ) is more preferred.
- the inorganic particles containing the component (c) commercial products available in powder form can be used. (manufactured by Kojundo Chemical Laboratory Co., Ltd.).
- the surface of the grinding media containing the component (c) is wet-polished with mechanical energy to form fine particles as the component (a).
- Component (c) may be included in the finally obtained pixel division layer by co-dispersion.
- the content of component (c) is determined by shaving a portion of the pixel division layer from the outermost layer to a depth of 0.2 to 0.8 ⁇ m and heating the ash in an electric furnace at a temperature of 800° C. or higher. It can be quantified by ICP (inductively coupled plasma) emission spectrometry using the solution obtained by heating and dissolving with dilute nitric acid after thermal decomposition with sulfuric acid, nitric acid and hydrofluoric acid as an analysis sample. can. PS3520VDDII (manufactured by Hitachi High-Tech Science) can be used as an analyzer.
- the pixel division layer included in the organic EL display device of the present invention should further contain (d) a phenol resin (hereinafter sometimes referred to as the (d) component).
- the phenolic resin referred to here means a resin having a repeating unit having a phenol skeleton.
- Component (d) includes, for example, a resin having a repeating unit represented by formula (5) and a resin having a repeating unit represented by formula (6).
- R 11 and R 12 each independently represent a methylene group or a CH—Ar group.
- Ar represents a phenyl group or a substituted phenyl group. * represents a binding site.
- Component (d) can be easily synthesized by a known method, and an aldehyde compound such as formaldehyde and benzaldehyde is added to a compound having a phenol skeleton such as phenol, o-cresol, m-cresol, p-cresol and xyresol. , can be obtained by reacting in the presence of an acidic catalyst.
- an aldehyde compound such as formaldehyde and benzaldehyde
- a compound having a phenol skeleton such as phenol, o-cresol, m-cresol, p-cresol and xyresol.
- At least part of the component (d) in the pixel division layer may form a three-dimensional network structure by thermal crosslinking in the curing step.
- the pixel dividing layer included in the organic EL display device of the present invention further includes (e) a repeating unit having an acryloyl group or methacryloyl group and a trifluoromethyl group (CF 3 ). It is preferable to contain a resin (hereinafter sometimes referred to as component (e)) having Further, it is preferable that the repeating unit having the acryloyl group or methacryloyl group and the trifluoromethyl group (CF 3 ) has a structure represented by formula (7).
- R13 represents a hydrogen atom or a methyl group. * represents a binding site.
- a specific example of the repeating unit having an acryloyl group or methacryloyl group and a trifluoromethyl group (--CF 3 ) is preferably a repeating unit represented by formula (8).
- R 14 and R 15 each independently represent a hydrogen atom or a methyl group.
- R 16 represents a divalent hydrocarbon group. * represents a binding site.
- R 16 is preferably a residue of a compound having two epoxy groups in the molecule, and specific examples of R 16 include cyclic structures represented by formulas (9) to (11). A structure having is preferably exemplified.
- * represents a bonding site with an oxygen atom.
- * represents a bonding site with an oxygen atom.
- the epoxy groups of a compound having two epoxy groups in the molecule are reacted with acrylic acid or methacrylic acid.
- a second step there is a method of reacting a dicarboxylic acid anhydride having a trifluoromethyl group with a hydroxyl group generated by ring-opening of an epoxy group. It is desirable to use a phase transfer catalyst to improve the reaction rate, and commercially available products include tetraalkylammonium bromide and tetraalkylammonium chloride.
- the pixel dividing layer included in the organic EL display device of the present invention includes resins other than the components (d) and (e), a dispersant, and a cured product of a compound having two or more radically polymerizable groups in the molecule, which will be described later. , a photopolymerization initiator or a decomposition product thereof.
- the finally obtained pixel division layer can contain the components (a) to (e). .
- the negative photosensitive composition for forming the pixel dividing layer contains a compound having two or more radically polymerizable groups in the molecule and a photopolymerization initiator as a photosensitive agent for expressing negative photosensitive property. It is desirable to Compounds having six radically polymerizable groups in the molecule include, for example, "KAYARAD” (registered trademark) DPHA, DPCA-20, DPCA-30, DPCA-60, DPCA-120 (all of which are Nippon Kayaku ( Co., Ltd.).
- Examples of compounds having four radically polymerizable groups in the molecule include “Light Acrylate” (registered trademark) PE-4A (manufactured by Kyoeisha Chemical Co., Ltd.).
- Compounds having three radically polymerizable groups in the molecule include, for example, “Aronix” (registered trademark) M-215 and M-315 (both of which are manufactured by Toagosei Co., Ltd.).
- Compounds having two radically polymerizable groups in the molecule include, for example, "OGSOL” (registered trademark) EA-0200, EA-0250P-LT, GA-2800, GA-5060P (both of which are Osaka Gas Chemicals ( Co., Ltd.) and A-BPEF (manufactured by Shin-Nakamura Chemical Co., Ltd.).
- OGSOL registered trademark
- EA-0200 EA-0250P-LT
- GA-2800 GA-5060P
- GA-5060P both of which are Osaka Gas Chemicals ( Co., Ltd.)
- A-BPEF manufactured by Shin-Nakamura Chemical Co., Ltd.
- the photopolymerization initiator examples include oxime ester-based photopolymerization initiators, alkylphenone-based photopolymerization initiators, and acylphosphine oxide-based photopolymerization initiators.
- oxime ester-based photopolymerization initiators are preferable in that they can improve the deep-part curability of the film.
- oxime ester-based photopolymerization initiators include "Adekacruz" (registered trademark) NCI-831E (manufactured by ADEKA Corporation, hereinafter referred to as "NCI-831E") and "Irgacure” (registered trademark) OXE01. , OXE02, OXE03, OXE04 (all manufactured by BASF), and oxime ester photopolymerization initiators described in International Publication No. 2016/008384.
- the negative photosensitive composition for forming the pixel dividing layer may contain resins other than the above-described components (e) and (d).
- Resins other than the aforementioned components (e) and (d) include (meth)acrylic resins, epoxy (meth)acrylate resins, polyimide resins, polyimide precursors, and polysiloxane resins. From the standpoint of alkali developability, the weight average molecular weight (Mw) of these resins is preferably 1,000 or more and 150,000 or less.
- the negative photosensitive composition may further contain a solvent.
- a solvent By containing a solvent, the viscosity, thixotropy, etc. of the negative photosensitive composition can be adjusted, and the film thickness uniformity of the coating film can be improved.
- solvents include propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA”), 3-methoxybutyl acetate (hereinafter referred to as "MBA”). ) and methyl ethyl ketone (hereinafter referred to as “MEK”) are preferred.
- a pigment dispersion containing component (a) is prepared by a wet dispersion treatment, then a dispersion containing component (b) and, if necessary, component (d). , (e) component, solvent and other components are mixed with a pigment dispersion, stirred and, if necessary, filtered through a filter.
- Component (b) may be subjected to wet dispersion treatment in the presence of component (a).
- a wet media dispersing machine or a wet medialess dispersing machine may be used. preferred to use.
- wet media dispersers include "Revomill” (registered trademark) (manufactured by Asada Iron Works), “Nano Getter” (registered trademark) (manufactured by Ashizawa Fine Tech), “DYNO-MILL” (registered trademark) (Willy A Bachofen), “Spike Mill” (registered trademark) (manufactured by Inoue Seisakusho Co., Ltd.), “Sand Grinder” (registered trademark) (manufactured by DuPont), “Ultra Apex Mill Advance” (registered trademark) (manufactured by ) manufactured by Hiroshima Metal & Machinery) and “NEO-Alpha Mill” (registered trademark) (manufactured by AIMEX Co., Ltd.).
- hafnium oxide (HfO 2 ) or a composite oxide of zirconia and hafnium (ZrO 2 —HfO 2 ) is used as the pulverizing media for wet media dispersion processing. It is preferable to use ceramic beads having a pure content of 90% by weight or more.
- the diameter of the grinding media is preferably 0.03 to 0.5 mm ⁇ , and the higher the sphericity, the better.
- the spacer layer preferably contains silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis/minor axis) of 1.0 to 1.5. It is more preferable to contain silica particles having a primary particle size of 5 to 20 nm, and more preferably to contain silica particles having a primary particle size of 5 to 15 nm. It is more preferable to contain silica particles having an aspect ratio of 1.0 to 1.3, more preferably 1.0 to 1.2.
- the organic EL display device of the present invention comprises a spacer layer on at least part of the surface of the pixel dividing layer, the spacer layer having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis/minor axis ) contains 1.0 to 1.5 silica particles.
- a negative photosensitive composition can be used as the photosensitive composition for forming the spacer layer.
- the same negative photosensitive composition for forming the pixel division layer as described above not only can the adhesion between the pixel division layer and the spacer layer be improved, Waste liquid can be reduced, and the environmental burden can be reduced.
- a silver alloy (99.00% by weight of silver and 1.00% by weight of copper) film was formed on the entire surface of an alkali-free glass substrate of 150 mm in length and 150 mm in width by sputtering. Further, an ITO film was formed on the entire surface by a sputtering method to obtain a glass substrate having a silver alloy film/ITO film on the entire surface of the alkali-free glass substrate.
- a spin coater is used to apply the negative photosensitive composition to a glass having a silver alloy film/ITO film by adjusting the number of rotations so that the thickness of the finally obtained pixel division layer is 1.5 ⁇ m.
- a coated film was obtained by coating the surface of the substrate on the silver alloy film/ITO film side. Furthermore, using a hot plate, the coating film was prebaked at 100° C. under atmospheric pressure for 120 seconds to obtain a prebaked film.
- an exposure amount of 20 to 120 mJ (mJ/cm 2 : The exposure amount is changed stepwise every 10 mJ within the range of i-line conversion value), and the pre-baked film is pattern-exposed to g, h, and i mixed lines of an ultra-high pressure mercury lamp, and the exposed part and the unexposed part are in-plane. was obtained.
- the pattern exposure was performed by bringing a negative exposure mask into contact with the surface of the prebaked film.
- a compact developing device for photolithography AD-2000; manufactured by Takizawa Sangyo Co., Ltd.
- development was performed with a 2.38% by weight TMAH aqueous solution by a paddle method.
- the puddle method referred to here is a method in which a developing solution is shower-coated on the surface of the exposed film for 10 seconds, and then the substrate is allowed to stand still until a predetermined developing time is reached for development.
- the development time was determined by multiplying the time required for the unexposed portion of the film to dissolve and remove in the film depth direction by 1.5. Further, after rinsing with deionized water by a shower method for 30 seconds, the substrate was idled at 200 rpm for 30 seconds and dried to obtain a developed film-formed substrate having a patterned developed film. Then, using a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.), the developed film was heated at 250° C. for 1 hour in a nitrogen atmosphere to obtain a cured film.
- a high-temperature inert gas oven IH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.
- the average value of the opening widths of 10 openings in each exposure area is within the range of 30.0 ⁇ 0.1 ⁇ m.
- the OD value of the optical density evaluation substrate was regarded as the OD value of the cured film.
- the thickness of the cured film is measured at 3 points in the plane using a stylus type film thickness measuring device (Tokyo Seimitsu Co., Ltd.; Surfcom), and the average value is rounded to the second decimal place. I asked for the number up to the first place.
- AA No luminance unevenness is observed.
- A Very slight luminance unevenness is observed.
- B Brightness unevenness is slightly observed.
- C Brightness unevenness is observed.
- D Remarkable luminance unevenness is observed.
- E One or more unlit pixels are observed.
- Table 1 shows the cross-sectional analysis results of the pixel division layer corresponding to each silica particle dispersion used in Examples and Comparative Examples.
- MEK-ST-40 Silica particle dispersion containing component (b) (manufactured by Nissan Chemical Industries, Ltd.). The solvent species is methyl ethyl ketone. The content of component (b) is 38% by weight in 100% by weight of silica particles.
- OSCAL-1421 Silica particle dispersion containing component (b) (manufactured by Nikki Shokubai & Chemicals Co., Ltd.).
- the solvent species is isopropyl alcohol.
- MEK-ST-L Silica particle dispersion containing component (b) (manufactured by Nissan Chemical Industries, Ltd.). The solvent species is methyl ethyl ketone.
- Silica particle dispersion A Silica particle dispersion containing component (b) (Synthesis Example 3). The solvent species is methyl ethyl ketone.
- Silica particle dispersion B Silica particle dispersion containing component (b) (Synthesis Example 4). The solvent species is methyl ethyl ketone.
- TRULYA Silica particle dispersion containing no component (b) (Nikki Shokubai Chemical Industry Co., Ltd.
- the solvent type is isopropyl alcohol.
- MEK-ST-ZL Silica particle dispersion containing no component (b) (manufactured by Nissan Chemical Industries, Ltd.). The solvent species is methyl ethyl ketone.
- ATLAS 100 Particles that do not contain component (b) and are neither pigments nor silica particles.
- ATLAS registered trademark 100 (manufactured by CABOT).
- S0100 Irgaphor Black® S0100CF.
- a benzodifuranone-based black pigment comprising a compound represented by formula (3).
- (a) corresponds to the component.
- Bk-CBF1 A surface-coated benzofuranone-based black pigment Bk-CBF1 disclosed in Coating Example 1 of WO2018/181311.
- the amount of silica coated is 10.0 parts by weight in terms of SiO2
- the amount of alumina coated is in terms of Al2O3 . 2.0 parts by weight.
- (a) corresponds to the component.
- Pigment Dispersant 1 Pigment Dispersant 1 (solid content: 100% by weight) disclosed in Synthesis Example 2 of JP-A-2020/70352.
- ZCR-1569H A PGMEA solution of an epoxy acrylate resin having a biphenyl skeleton in its main chain. Solid content 70% by weight (manufactured by Nippon Kayaku Co., Ltd.).
- TR4020G resin having a repeating unit represented by formula (5). Solid content 100% by weight (manufactured by Asahi Yukizai Co., Ltd.). (d) corresponds to the component.
- AH-106 PGMEA solution of methacrylic polyol resin. Solid content 35% by weight (manufactured by Soken Chemical Co., Ltd.).
- DPCA-60 A compound having six radically polymerizable groups in the molecule. Solid content 100% by weight (manufactured by Nippon Kayaku Co., Ltd.).
- GA-5060P A PGMEA solution of a compound having two radically polymerizable groups in its molecule. Solid content 62% by weight (manufactured by Osaka Gas Chemicals Co., Ltd.).
- A-BPEF A PGMEA solution of a compound having one fluorene skeleton in the molecule, two oxyethylene chains, and two radically polymerizable groups in the molecule (manufactured by Shin-Nakamura Chemical Co., Ltd. ). Solids content 50% by weight.
- a solution was prepared by dissolving 31.02 g of oxydiphthalic anhydride in 50.00 g of N-methylpyrrolidone, added to the solution in the three-necked flask, stirred at a liquid temperature of 20°C for 1 hour, and then 50°C. and stirred for 4 hours. Then, 15 g of xylene was added, and the mixture was stirred at 150° C. for 5 hours while azeotroping the by-product water together with xylene.
- the reaction solution was put into 3 L of deionized water, and the precipitated solid precipitate was obtained by filtration.
- the resulting solid precipitate was washed with deionized water three times and dried in a vacuum dryer at 80° C. for 24 hours to obtain a polyimide resin A.
- the polyimide resin A was powdery with a solid content of 100% by weight, and had a weight average molecular weight (Mw) of 27,000.
- This resin solution was solvent-diluted with PGMEA so that the solid content was 30% by weight, and this was used as epoxy acrylate resin solution B.
- a solution was prepared by dissolving 3.00 g of 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.) as a surface modifier in 50.00 g of methyl ethyl ketone, and this was added for 10 minutes. The mixture was added dropwise by amount and stirred for 2 hours while maintaining the liquid temperature at 50°C to allow the dehydration condensation reaction to proceed, and then cooled to 25°C.
- 3-methacryloxypropyltrimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd.
- silica particle dispersion liquid A containing 20% by weight was obtained.
- a solution was prepared by dissolving 3.00 g of 2-methacryloyloxyethyl isocyanate (manufactured by Showa Denko Co., Ltd.) as a surface modifier in 50.00 g of methyl ethyl ketone. The mixture was added dropwise to the solution, and the mixture was stirred for 3 hours while maintaining the liquid temperature at 50°C to advance the urethanization reaction, and then cooled to 25°C.
- 2-methacryloyloxyethyl isocyanate manufactured by Showa Denko Co., Ltd.
- silica particle dispersion liquid B containing 20% by weight was obtained.
- the preliminary stirring liquid was sent to a vertical bead mill filled in a vessel with a filling rate of 75% by volume, and the first wet media dispersion treatment was performed in a circulation system at a peripheral speed of 8 m/s for 3 hours.
- Preparation Example 2 Preparation of Pigment Dispersion Liquid 2
- the first wet media dispersion treatment was performed at a peripheral speed of 9 m / s for 10 hours by replacing the 0.4 mm ⁇ composite oxide grinding media with 0.3 mm ⁇ silicon nitride grinding media;
- a pigment dispersion 2 having a solid content of 20.00% by weight was obtained in the same manner as in Preparation Example 1, except that the wet media dispersion treatment was not performed.
- Table 2 shows the blending weight of each raw material.
- Pigment Dispersion Liquid 4 was prepared by the following procedure. 34.50 g of SOLSPERSE20000 (manufactured by Lubrizol, solid content 100% by weight) as a dispersant and 782.00 g of MBA as a solvent were mixed, stirred for 10 minutes, and then mixed with 103.50 g of S0100. After stirring for 30 minutes, a horizontal bead mill filled with zirconia beads of 0.40 mm was used to perform a wet media dispersion treatment so that the number average particle diameter was 100 nm. got Table 2 shows the blending weight of each raw material. The number average particle size was measured using a zeta potential/particle size/molecular weight analyzer (Zetasizer Nano ZS, manufactured by Sysmex Corporation).
- Pigment Dispersion Liquid 5 was prepared by the following procedure. 27.60 g of SOLSPERSE20000, 782.00 g of MBA, and 27.60 g of polyimide resin A were mixed and stirred for 10 minutes, then 82.80 g of Bk-CBF1 were mixed and stirred for 30 minutes, and 0.60 g of Bk-CBF1 was mixed and stirred for 30 minutes.
- Example 1 Under a yellow light, 0.38 g of OXE03 was added as a photopolymerization initiator to a mixed solvent of 8.50 g of MBA and 16.16 g of PGMEA, and dissolved by stirring for 10 minutes. 1.88 g of MEK-ST was added thereto as the component (b) and dissolved by stirring for 10 minutes. Then add 4.61 g of ZAH-106, 0.45 g of TR4020G, 0.38 g of DPCA-60 and 0.97 g of GA-5060P and stir for 30 minutes to obtain a clear preparation. rice field. 16.69 g of Pigment Dispersion Liquid 1 was mixed with this prepared liquid and stirred for 30 minutes to prepare negative photosensitive composition 1 having a solid content of 15.00% by weight. Table 3 shows the blending weight of each raw material.
- Negative photosensitive composition 1 was applied to the surface of a transparent glass substrate Tempax (manufactured by AGC Techno Glass Co., Ltd.) so that the thickness of the cured film finally obtained was 1.5 ⁇ m.
- a coating film was obtained by coating with a spin coater while adjusting the number of coatings, and pre-baking the coating film at 100° C. under atmospheric pressure for 120 seconds using a hot plate (SCW-636; manufactured by Dainippon Screen Mfg. Co., Ltd.).
- the entire surface of the pre-baked film was irradiated with the g, h, and i mixed rays of an ultra-high pressure mercury lamp at the optimum exposure dose determined by the method described above to obtain an exposed film.
- development, rinsing and drying were carried out in the same manner as in the calculation of the optimum exposure dose to obtain a solid developed film.
- FIG. 2 shows a manufacturing process of an organic EL display including a process of forming a pixel division layer.
- a silver alloy (99.00% by weight of silver and 1.00% by weight of copper alloy) was deposited on the surface of the non-alkali glass substrate 11 with a length of 70 mm and a width of 70 mm by sputtering.
- etching was performed by immersing it in a silver alloy etching solution SEA-1 at a liquid temperature of 30° C. to obtain a patterned silver alloy film 12 with a film thickness of 50 nm. Further, an ITO film was formed over the entire surface by a sputtering method.
- Negative photosensitive composition 1 is applied to the surface of the first electrode forming substrate using a spin coater while adjusting the number of rotations so that the thickness of the finally obtained pixel division layer is 1.5 ⁇ m. Then, a coating film was obtained. Furthermore, using a hot plate, the coating film was prebaked at 100° C. under atmospheric pressure for 120 seconds to obtain a prebaked film. Using a double-sided alignment single-sided exposure apparatus, pre-bake with the optimum exposure amount obtained by the above method through a negative exposure mask (220 square light-shielding parts of 30.0 ⁇ m in length and 30.0 ⁇ m in width). The film was pattern-exposed to obtain an exposed film.
- the pattern exposure was performed by bringing a negative exposure mask into contact with the surface of the prebaked film.
- development, rinsing and drying were carried out in the same manner as in calculating the optimum exposure amount to obtain a patterned developed film.
- the developed film was heated at 250° C. for 1 hour in a nitrogen atmosphere to obtain a film thickness of 1.5 ⁇ m with 220 openings in an area of 30 mm long/30 mm wide at the center of the first electrode forming substrate.
- a pixel division layer forming substrate having the pixel division layer 14 was obtained.
- Table 4 shows the results of evaluating the opening width by the method described above.
- the pixels are exposed to the evaporation source under the evaporation condition of the degree of vacuum of 1 ⁇ 10 ⁇ 3 Pa or less.
- the split layer forming substrate is rotated, and first, the compound (HT-1) represented by the formula (13) is deposited as a hole injection layer to a thickness of 10 nm, and the compound (HT-1) represented by the formula (14) as a hole transport layer. -2) was deposited to a thickness of 50 nm.
- the compound (GH-1) represented by the formula (15) as a host material and the compound (GD-1) represented by the formula (16) as a dopant material are applied to a thickness of 40 nm on the light-emitting layer. evaporated. Then, as electron transport materials, the compound (ET-1) represented by the formula (17) and the compound (LiQ) represented by the formula (18) were laminated at a volume ratio of 1:1 to a thickness of 40 nm. .
- a silver/magnesium alloy (volume ratio: 10:1) was vapor-deposited to a thickness of 150 nm to form the second electrode 16 .
- a cap-shaped glass plate was adhered and sealed using an epoxy resin adhesive to obtain an organic EL display device in which green light emitting pixels were arranged.
- the crystal oscillation layer is suitable for thin films of less than 100 nm.
- the brightness unevenness of the manufactured organic EL display device was evaluated by the method described above. After evaluating luminance unevenness, the organic EL display device was disassembled, and the content of component (c) in the pixel division layer was quantified by ICP emission spectrometry (hafnium atom detection lower limit: 0.2 ppm by weight). , 3.0 ppm by weight. It was also confirmed by TEM-EDX analysis that the pixel division layer contained the component (b). In addition to the primary particle size and aspect ratio of component (b), the average primary particle size (nm) and average aspect ratio of silica particles were measured. Table 4 shows the above evaluation results.
- Example 2 Using OSCAL-1421 or MEK-ST-L instead of MEK-ST-40, negative photosensitive compositions 2 and 3 were prepared in the same amounts as in Example 1.
- the optical density of the cured film, the aperture width of the pixel division layer, and the luminance unevenness of the organic EL display device were evaluated by the method, and the content of component (c) in the pixel division layer was quantified. It was also confirmed by TEM-EDX analysis that the pixel division layer contained the component (b).
- the average primary particle size (nm) and average aspect ratio of silica particles were measured. Table 4 shows the above evaluation results.
- Examples 4--7 Using the pigment dispersions 1 to 3 and the epoxy acrylate resin solution B, negative photosensitive compositions 4 to 7 were prepared in the amounts shown in Table 5, respectively, and the optical density of the cured film was determined in the same manner as in Example 1. , the opening width of the pixel division layer, and the brightness unevenness of the organic EL display device were evaluated, and the content of the component (c) in the pixel division layer was quantified. It was also confirmed by TEM-EDX analysis that the pixel division layer contained the component (b). In addition to the primary particle size and aspect ratio of component (b), the average primary particle size (nm) and average aspect ratio of silica particles were measured. Table 6 shows the above evaluation results.
- Example 2 The same methods as in Example 1 were used to evaluate the optical density of the cured film, the aperture width of the pixel dividing layer, and the luminance unevenness of the organic EL display device.
- Component (c) was not detected in the pixel division layer in analysis by ICP emission spectrometry (detection lower limit of less than 0.2 ppm by weight). It was also confirmed by TEM-EDX analysis that the pixel division layer did not contain the component (b). Table 8 shows the above evaluation results.
- Pigment Dispersion Liquid 5 was used instead of Pigment Dispersion Liquid 4, and negative photosensitive compositions 9 were prepared in the amounts shown in Table 7.
- the aperture width of the pixel dividing layer and the luminance unevenness of the organic EL display device were evaluated.
- Component (c) was not detected in the pixel dividing layer in analysis by ICP emission spectrometry. It was also confirmed by TEM-EDX analysis that the pixel division layer did not contain the component (b).
- Table 8 shows the above evaluation results.
- Pigment Dispersion 2 was used instead of Pigment Dispersion 1, and THRULYA or MEK-ST-ZL was used instead of MEK-ST-40.
- 1 to 11 were prepared, and the optical density of the cured film, the aperture width of the pixel dividing layer, and the brightness unevenness of the organic EL display device were evaluated in the same manner as in Example 1.
- Component (c) was not detected in the pixel dividing layer in analysis by ICP emission spectrometry. It was also confirmed by TEM-EDX analysis that the pixel division layer did not contain the component (b).
- Table 8 shows the measurement results of the average primary particle diameter (nm) and average aspect ratio of silica particles. Table 8 shows the above evaluation results.
- Example 8 A negative photosensitive composition 12 was prepared in the same manner as in Example 1 using Silica Particle Dispersion Liquid A in place of MEK-ST-40, and the optical density, The aperture width of the pixel dividing layer and the luminance unevenness of the organic EL display device were evaluated. Table 10 shows the evaluation results.
- the content of the component (c) in the pixel division layer was 3.0 ppm by weight in the analysis by ICP emission spectrometry.
- the pixel dividing layer obtained from the negative photosensitive composition 12 has R 16 in formula (19) being a methyl group, It was a pixel division layer containing component (b) having a structure in which R 17 was a propylene group, j and k were 1, m was 3, and n was 0 as a reaction residue. Further, analysis was performed by TEM-EDX, and in addition to the primary particle size and aspect ratio of the component (b), the average primary particle size (nm) and average aspect ratio of silica particles were measured. Table 10 shows the above evaluation results.
- Example 9 A negative photosensitive composition 13 was prepared in the same manner as in Example 1 using Silica Particle Dispersion Liquid B in place of MEK-ST-40, and the optical density, The aperture width of the pixel dividing layer and the luminance unevenness of the organic EL display device were evaluated. Table 10 shows the evaluation results.
- the content of the component (c) in the pixel division layer was 3.0 ppm by weight in the analysis by ICP emission spectrometry. Analyzed by 29 Si nuclear magnetic resonance, 1 H nuclear magnetic resonance and TEM-EDX, the pixel dividing layer obtained from the negative photosensitive composition 13 has a structure represented by formula (20) in which R 19 is a methyl group, R 20 is an oxyethylene group, and r is 1 as a reaction residue.
- the average primary particle size (nm) and average aspect ratio of silica particles were also measured by TEM-EDX. Table 10 shows the above evaluation results.
- Negative photosensitive compositions 16 and 17 were prepared in the same manner as in Example 1, with the compounding amounts shown in Table 11 and varying the content of component (b), and the optical density of the cured film and the pixel division layer were obtained in the same manner as in Example 1.
- the aperture width and luminance unevenness of the organic EL display device were evaluated, and the content of component (c) in the pixel division layer was quantified. It was also confirmed by TEM-EDX analysis that the pixel division layer contained the component (b).
- the average primary particle size (nm) and average aspect ratio of silica particles were measured. Table 12 shows the above evaluation results.
- Example 12 A pixel division layer forming substrate having a pixel division layer 17 was additionally produced in the same manner as in Example 1 using the negative photosensitive composition 1 .
- Negative type photosensitive composition 1 was applied to pixel division layer 17 and pixel division layer 17 by adjusting the number of rotations using a spin coater so that the thickness of the finally obtained pixel division layer was 1.8 ⁇ m. was applied to the entire surface of the opening 18 to obtain a coating film. Furthermore, using a hot plate, the coating film was prebaked at 100° C. under atmospheric pressure for 120 seconds to obtain a prebaked film. Using a double-sided alignment single-sided exposure apparatus, a development film, which will be described later, has a length of 45.0 ⁇ m and a width of 45.0 ⁇ m. Width: An exposed film was obtained by subjecting the prebaked film to pattern exposure so as to have a width of 45.0 ⁇ m.
- FIG. 4 A pixel dividing layer/spacer layer forming substrate (FIG. 4) was obtained.
- Table 13 shows the result of evaluation of the aperture width of the pixel division layer by the method described above.
- an organic EL layer 15 and a second electrode 16 were formed in the same manner as in Example 1 except that a pixel dividing layer/spacer layer forming substrate was used instead of the pixel dividing layer forming substrate having the pixel dividing layer 14 .
- a pixel dividing layer/spacer layer forming substrate was used instead of the pixel dividing layer forming substrate having the pixel dividing layer 14 .
- the spacer layer contained silica particles having a primary particle diameter of 12 nm and an aspect ratio of 1.1. Table 13 shows the above evaluation results.
- the primary particle size and aspect ratio of the silica particles in the spacer layer were measured in the same manner as the method for measuring the component (b) in the pixel division layer in Example 1.
- Example 9 A pixel division layer forming substrate having a pixel division layer 17 was additionally produced in the same manner as in Example 1 except that the negative photosensitive composition 8 was used. Next, a pixel division layer/spacer layer forming substrate and an organic EL display device were produced in the same manner as in Example 12 except that negative photosensitive composition 8 was used instead of negative photosensitive composition 1. The luminance unevenness was evaluated, and the content of component (c) in the pixel division layer was quantified. It was also confirmed by TEM-EDX analysis that the spacer layer did not contain silica particles. Table 13 shows the evaluation results.
- the organic EL display device having the pixel division layer containing the component (b) in Examples 1 to 11 is the same as the organic EL display device having the pixel division layer not containing the component (b) in Comparative Examples 1 to 8.
- the value of the difference W3 between the maximum aperture width W1 and the minimum aperture width W2 at the aperture was small, and the unevenness in brightness was small.
- Comparative Examples 7 and 8 containing organic-inorganic composite particles that do not correspond to the (b) component even if silica is contained the effect of reducing the value of the difference W3 is not observed. The effect of the present invention was not obtained due to the problem of generating pixels.
- Example 12 having a spacer layer
- the silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis/minor axis) of 1.0 to 1.5 were used. It was found that the average value of the aperture width of the pixel division layer and the value of the difference W3 in Example 1 could be maintained, which is superior to Comparative Example 9. From the above, it was confirmed that the organic EL display device of the present invention is useful.
- TFTs 2 Wiring 3: TFT insulating layer 4: Flattening layer 5: First electrode 6: Substrate 7: Contact hole 8: Pixel division layer 9: Light emitting pixel 10: Second electrode 11: Non-alkali glass substrate 12: Silver alloy film 13: ITO film 14: Pixel division layer 15: Organic EL layer 16: Second electrode 17: Pixel division layer 18: Opening 19: Spacer layer 20: Non-alkali glass substrate 21: Silver alloy film 22: ITO film
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Abstract
Description
すなわち、本発明は、基板、第一電極、画素分割層、発光画素および第二電極を具備する有機EL表示装置であって、該画素分割層が、(a)有機黒色顔料および/または混色有機黒色顔料と、(b)一次粒子径が5~30nmであり、かつアスペクト比(長径/短径)が1.0~1.5のシリカ粒子とを含有する有機EL表示装置である。
I0:入射光強度
I:透過光強度。
ただし、n+m≧1を満たす。
また、(a)成分がベンゾジフラノン系黒色顔料を含有する場合、現像性を高めて開口部における現像残渣を抑制するため、その顔料表面にシリカを含有する被覆層を有することが好ましい。ここでいう被覆層中に含有するシリカは(b)成分ではなく、(a)成分を構成する一部とする。
(b)成分は開口部の開口幅の均一性を高めて輝度ムラを低減する効果を奏する。
*2はシリカ粒子が粒子表面に有する、ケイ素原子と結合した酸素原子との結合部位を表す。R18は炭素原子数1~3のアルキル基を表す。m、nは整数であり、mは1~3を表し、nは0~2を表す。ただし、m+n=3を満たす。
*4はシリカ粒子が粒子表面に有する、ケイ素原子と結合した酸素原子との結合部位を表す。
すなわち、本発明の有機EL表示装置は、画素分割層中、(a)成分に対する前記(b)成分の含有量がSiO2換算で20~70重量部であることが好ましい。
R16は、二価の炭化水素基を表す。*は結合部位を表す。
まず、各実施例および比較例における評価方法について説明する。
縦150mm/横150mmの無アルカリガラス基板の表面に、スパッタ法により銀合金(99.00重量%の銀と、1.00重量%の銅からなる合金)を全面成膜した。さらに、スパッタ法によりITO膜を全面成膜し、無アルカリガラス基板の表面の全面に銀合金膜/ITO膜を具備するガラス基板を得た。
実施例1~11、比較例1~8で得られた、厚さ1.5μmの硬化膜を形成した光学濃度評価用基板について、光学濃度計(X-Rite社製;X-Rite 361T)を用いて膜面側から面内3箇所において全光学濃度(Total OD値)を測定して平均値を算出し、その数値を1.5で除した値を、小数点第二位を四捨五入した小数点第一位までの数値を、硬化膜の厚さ1.0μmあたりのOD値(OD/μm)とした。OD/μmが高いほど遮光性に優れた硬化膜であるとの基準で評価を行った。硬化膜を形成していないテンパックスのOD値を別途測定した結果、0.00であったため、光学濃度評価用基板のOD値を、硬化膜のOD値とみなした。硬化膜の厚さは、触針式膜厚測定装置(東京精密(株);サーフコム)を用いて、面内3箇所において測定し、その平均値の小数点第二位を四捨五入して、小数点第一位までの数値を求めた。
実施例1~12、比較例1~9で得られた膜厚1.5μmの画素分割層を形成した画素分割層形成基板および画素分割層/スペーサー層形成基板について、FPD検査顕微鏡を用いて観察し、面内10箇所の開口部の開口幅を測長した(図3)。最大開口幅W1(μm)から最小開口幅W2(μm)を差し引いた値W3(μm)の値が小さいほど優れているとし、3.0未満を合格、3.0以上を不合格とした。
実施例1~12、比較例1~9で得られた有機EL表示装置を、10mA/cm2の直流駆動により発光させて、縦16mm/横16mmのエリア内に形成した画素部において、中央部に位置する画素部20箇所を、倍率50倍でモニター上に拡大表示させて観察し、面内の輝度のムラを以下の判定基準に基づいて評価した。AAおよびA~Cを合格、Dを不合格とした。なお、非点灯画素が1箇所以上観られる場合は輝度ムラの程度によらず評価をEとし、不合格とした。
AA:輝度ムラが観られない。
A:輝度ムラが極めて僅かに観られる。
B:輝度ムラが僅かに観られる。
C:輝度ムラが観られる。
D:輝度ムラが顕著に観られる。
E:非点灯画素が1箇所以上観られる。
各シリカ粒子分散液中のシリカ粒子の含有量(重量%)に加えて、実施例および比較例で使用した各シリカ粒子分散液に対応する画素分割層の断面解析結果を表1に示す。
「MEK-ST-40」:(b)成分を含有するシリカ粒子分散液(日産化学工業(株)製)。溶剤種はメチルエチルケトンである。シリカ粒子100重量%中、(b)成分の含有量は38重量%である。
「OSCAL-1421」:(b)成分を含有するシリカ粒子分散液(日揮触媒化成工業(株)製)。溶剤種はイソプロピルアルコールである。
「MEK-ST-L」:(b)成分を含有するシリカ粒子分散液(日産化学工業(株)製)。溶剤種はメチルエチルケトンである。
「シリカ粒子分散液A」:(b)成分を含有するシリカ粒子分散液(合成例3)。溶剤種はメチルエチルケトンである。
「シリカ粒子分散液B」:(b)成分を含有するシリカ粒子分散液(合成例4)。溶剤種はメチルエチルケトンである。
「THRULYA」:(b)成分を含有しないシリカ粒子分散液(日揮触媒化成工業(株)。溶剤種はイソプロピルアルコールである。
「MEK-ST-ZL」:(b)成分を含有しないシリカ粒子分散液(日産化学工業(株)製)。溶剤種はメチルエチルケトンである。
「ATLAS100」:(b)成分を含有せず、顔料にもシリカ粒子にも該当しない粒子。“ATLAS”(登録商標)100(CABOT社製)。シリカを含む被覆層が、有機ポリマー粒子の表面の一部に埋没するように固定化された一次粒子形状を有する有機無機複合粒子(シリカ:ポリマー=重量比率70:30、平均一次粒子径100nm、一次粒子径の分布範囲70~130nm、固形分100重量%)
「Bk-CBF1」:国際公開第2018/181311号の被覆例1で開示された表面被覆ベンゾフラノン系黒色顔料Bk-CBF1。式(3)で表される化合物からなるベンゾジフラノン系黒色顔料100重量部に対してシリカの被覆量がSiO2換算値で10.0重量部であり、アルミナの被覆量がAl2O3換算で2.0重量部。(a)成分に相当する。
「顔料分散剤1」:特開2020/70352号の合成例2で開示された顔料分散剤1(固形分100重量%)。直鎖状ポリアルキレンアミン構造とポリエーテル系高分子鎖とを有するポリマー型分散剤。
「ZCR-1569H」:主鎖にビフェニル骨格を有するエポキシアクリレート樹脂のPGMEA溶液。固形分70重量%(日本化薬(株)製)。
「TR4020G」:式(5)で表される繰り返し単位を有する樹脂。固形分100重量%(旭有機材(株)製)。(d)成分に相当する。
「ZAH-106」:メタクリル系ポリオール樹脂のPGMEA溶液。固形分35重量%(綜研化学(株)製)。
「DPCA-60」:ラジカル重合性基を分子内に6つ有する化合物。固形分100重量%(日本化薬(株)製)。
「GA-5060P」:ラジカル重合性基を分子内に2つ有する化合物のPGMEA溶液。固形分62重量%(大阪ガスケミカル(株)製)。
「A-BPEF」:分子内にフルオレン骨格を1つ有し、オキシエチレン鎖を2つ有し、ラジカル重合性基を分子内に2つ有する化合物のPGMEA溶液(新中村化学工業(株)製)。固形分50重量%。
乾燥窒素気流下、31.13g(0.085mol)の2,2-ビス(3-アミノ-4-ヒドロキシフェニル)ヘキサフルオロプロパンと、1.24g(0.0050mol)の1,3-ビス(3-アミノプロピル)テトラメチルジシロキサンと、2.18g(0.02mol)の3-アミノフェノールとを、三口フラスコ中で150.00gのN-メチルピロリドンに溶解させた。
116.88gのPGMEAを入れた三口フラスコ中に、51.27g(0.20mol)の1,4-シクロヘキサンジメタノールジグリシジルエーテルであるCDMDG(昭和電工(株)製)と、28.84g(0.40mol)のアクリル酸と、重合禁止剤として0.05gのメトキノンと、触媒として0.01gのテトラブチルアンモニウムブロミドとを添加し、攪拌しながら液温を100℃に昇温させ、4時間攪拌して反応させた後、加温を停止し液温を30℃に冷却した。
溶剤として104.50gのメチルエチルケトンを入れた三口フラスコ中に、(b)成分を含有するシリカ粒子分散液として142.50gのMEK-ST-40を添加し、さらに重合禁止剤として0.01gのメトキノンを添加して10分間攪拌した後に液温を50℃に昇温した。
104.50gのメチルエチルケトンを入れた三口フラスコ中に、142.50gのMEK-ST-40を添加し、さらに0.01gのメトキノンを添加して10分間攪拌した後に液温を50℃に昇温した。
溶剤である770.00gのPGMEAに、30.00gの顔料分散剤1を添加し、5分間攪拌した後に、100.00gのZCR-1569Hを添加して30分間撹拌した。さらに、(a)成分として、100.00gのS0100を添加した後、30分間撹拌して予備攪拌液を得た。
0.4mmφの複合酸化物からなる粉砕メディアを、0.3mmφの窒化ケイ素からなる粉砕メディアに替えて、第一の湿式メディア分散処理を周速9m/sで10時間行ったことと、第二の湿式メディア分散処理を行わなかったこと以外は調製例1と同様にして、固形分20.00重量%の顔料分散液2を得た。各原料の配合重量を表2に示す。
溶剤である770.00gのPGMEAに、30.00gの顔料分散剤1を添加し、5分間攪拌した後に、100.00gのZCR-1569Hを添加して30分間撹拌した。さらに、40.00gのC.I.ピグメントレッド177と、40.00gのC.I.ピグメントブルー15:6と、20.00gのC.I.ピグメントイエロー24とを順に添加した後、30分間撹拌して予備攪拌液を得た。
特許文献1に開示された調製例1の方法に従い、以下の手順で顔料分散液4を調製した。
分散剤として、34.50gのSOLSPERSE20000(ルーブリゾール社製:固形分100重量%)と、溶剤として、782.00gのMBAを混合し、10分間攪拌した後、103.50gのS0100を混合して30分間攪拌し、0.40mmのジルコニアビーズが充填された横型ビーズミルを用いて、数平均粒子径が100nmとなるように湿式メディア分散処理を行い、固形分15.00重量%の顔料分散液4を得た。各原料の配合重量を表2に示す。なお、数平均粒子径はゼータ電位・粒子径・分子量測定装置(ゼータサイザーナノZS、シスメックス(株)製)を用いて測定した。
特許文献1に開示された調製例9の方法に従い、以下の手順で顔料分散液5を調製した。27.60gのSOLSPERSE20000と、782.00gのMBAと、27.60gのポリイミド樹脂Aとを混合し、10分間攪拌した後、82.80gのBk-CBF1を混合して30分間攪拌し、0.40mmφのジルコニアビーズが充填された横型ビーズミルを用いて、調製例4と同様に数平均粒子径が100nmとなるように湿式メディア分散処理を行い、固形分15.00重量%の顔料分散液5を得た。各原料の配合重量を表2に示す。
900.00gの溶剤であるPGMEAに、10.00gの顔料分散剤1を添加し、30分間撹拌した。さらに、90.00gのATLAS100を添加した後、30分間撹拌して予備攪拌液を得た。0.3mmφの窒化ケイ素からなる粉砕メディアが充填率75体積%でベッセル内に充填された縦型ビーズミルに予備攪拌液を送液し、吐出速度300mL/min、周速7m/sで2パス分散処理を行い、(b)成分を含有しない固形分10.00重量%の有機無機複合体粒子分散液1を得た。各原料の配合重量を表2に示す。
黄色灯下、8.50gのMBAと、16.16gのPGMEAとの混合溶剤中に、光重合開始剤として、0.38gのOXE03を添加して10分間攪拌して溶解させた。そこに、(b)成分として、1.88gのMEK-STを添加し10分間攪拌して溶解させた。次いで、4.61gのZAH-106と、0.45gのTR4020Gと、0.38gのDPCA-60と、0.97gのGA-5060Pとを添加して30分間攪拌し、透明の調合液を得た。
この調合液に16.69gの顔料分散液1を混合して30分間撹拌して、固形分15.00重量%であるネガ型感光性組成物1を調製した。各原料の配合重量を表3に示す。
図2に、画素分割層の形成工程を含む有機EL表示装置の作製工程を示す。
MEK-ST-40に替えて、OSCAL-1421またはMEK-ST-Lを用いて、表3に示す配合量で、ネガ型感光性組成物2~3をそれぞれ調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価し、画素分割層中の(c)成分の含有量を定量した。また、TEM-EDXで解析し、画素分割層が(b)成分を含有することを確認した。(b)成分の一次粒子径およびアスペクト比に加えて、シリカ粒子の平均一次粒子径(nm)および平均アスペクト比を測定した。以上の評価結果を表4に示す。
顔料分散液1~3、エポキシアクリレート樹脂溶液Bを用い、表5に示す配合量で、ネガ型感光性組成物4~7をそれぞれ調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価し、画素分割層中の(c)成分の含有量を定量した。また、TEM-EDXで解析し、画素分割層が(b)成分を含有することを確認した。(b)成分の一次粒子径およびアスペクト比に加えて、シリカ粒子の平均一次粒子径(nm)および平均アスペクト比を測定した。以上の評価結果を表6に示す。
黄色灯下、6.38gのMBAと、23.20gのPGMEAとの混合溶剤中に、0.57gのNCI-831を添加して10分間攪拌して溶解させた。これに、3.08gのポリイミド樹脂Aと、1.18gのKAYARAD DPHAと、0.95gのA-BPEFとを添加して攪拌し調合液を得た。この調合液と14.65gの顔料分散液4とを混合して30分間撹拌して、固形分15.00重量%であるネガ型感光性組成物8を調製した。各原料の配合重量を表7に示す。実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価した。ICP発光分光分析法による分析において画素分割層中、(c)成分は検出されなかった(検出下限値0.2重量ppm未満)。また、TEM-EDXで解析し、画素分割層が(b)成分を含有しないことを確認した。以上の評価結果を表8に示す。
顔料分散液4に替えて、顔料分散液5を用いて、表7に示す配合量で、ネガ型感光性組成物9をそれぞれ調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価した。ICP発光分光分析法による分析において画素分割層中、(c)成分は検出されなかった。また、TEM-EDXで解析し、画素分割層が(b)成分を含有しないことを確認した。以上の評価結果を表8に示す。
顔料分散液1に替えて、顔料分散液2を用い、MEK-ST-40に替えて、THRULYAまたはMEK-ST-ZLを用いて、表7に示す配合量で、ネガ型感光性組成物10~11をそれぞれ調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価した。ICP発光分光分析法による分析において画素分割層中、(c)成分は検出されなかった。また、TEM-EDXで解析し、画素分割層が(b)成分を含有しないことを確認した。シリカ粒子の平均一次粒子径(nm)および平均アスペクト比の測定結果を表8に示す。以上の評価結果を表8に示す。
MEK-ST-40に替えて、シリカ粒子分散液Aを用いて表9に示す配合量で、ネガ型感光性組成物12を調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価した。評価結果を表10に示す。ICP発光分光分析法による分析において画素分割層中、(c)成分の含有量は3.0重量ppmであった。
29Si核磁気共鳴法、1H核磁気共鳴法およびTEM-EDXで分析し、ネガ型感光性組成物12から得られた画素分割層は、式(19)におけるR16がメチル基であり、R17がプロピレン基であり、jおよびkがそれぞれ1であり、mが3であり、nが0である構造を反応残基として有する(b)成分を含有する画素分割層であった。また、TEM-EDXで解析し、(b)成分の一次粒子径およびアスペクト比に加えて、シリカ粒子の平均一次粒子径(nm)および平均アスペクト比を測定した。以上の評価結果を表10に示す。
MEK-ST-40に替えて、シリカ粒子分散液Bを用いて表9に示す配合量で、ネガ型感光性組成物13を調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価した。評価結果を表10に示す。ICP発光分光分析法による分析において画素分割層中、(c)成分の含有量は3.0重量ppmであった。
29Si核磁気共鳴法、1H核磁気共鳴法およびTEM-EDXで分析し、ネガ型感光性組成物13から得られた画素分割層は、式(20)で表される構造において、R19がメチル基であり、R20がオキシエチレン基であり、rが1である構造を反応残基として有する(b)成分を含有する画素分割層であった。また、TEM-EDXで解析し、(b)成分の一次粒子径およびアスペクト比の測定結果に加えて、シリカ粒子の平均一次粒子径(nm)および平均アスペクト比を測定した。以上の評価結果を表10に示す。
顔料分散液1に替えて、顔料分散液2を用い、MEK-ST-40に替えて、MEK-ST-ZLを用いて、表9に示す配合量で、ネガ型感光性組成物14~15をそれぞれ調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価した。評価結果を表10に示す。ICP発光分光分析法による分析において画素分割層中、(c)成分は検出されなかった。また、TEM-EDXで解析し、画素分割層が(b)成分を含有しないことを確認し、シリカ粒子の平均一次粒子径(nm)および平均アスペクト比を測定した。以上の評価結果を表10に示す。
表11に示す配合量で、(b)成分の含有量を変えてネガ型感光性組成物16~17をそれぞれ調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価し、画素分割層中の(c)成分の含有量を定量した。また、TEM-EDXで解析し、画素分割層が(b)成分を含有することを確認した。(b)成分の一次粒子径およびアスペクト比に加えて、シリカ粒子の平均一次粒子径(nm)および平均アスペクト比を測定した。以上の評価結果を表12に示す。
顔料分散液1に替えて顔料分散液2を用い、MEK-ST-40に替えて有機無機複合体粒子分散液1を用いた以外は実施例1と同様にして、表11に示す配合量でネガ型感光性組成物18~19を調製し、実施例1と同様の方法で硬化膜の光学濃度、画素分割層の開口幅、有機EL表示装置の輝度ムラを評価し、画素分割層中の(c)成分の含有量を定量した。また、TEM-EDXで解析し、画素分割層が(b)成分を含有しないことを確認した。以上の評価結果を表12に示す。
ネガ型感光性組成物1を用いて実施例1と同一の方法で、画素分割層17を具備する画素分割層形成基板を追加で作製した。
ネガ型感光性組成物8を用いた以外は実施例1と同一の方法で、画素分割層17を具備する画素分割層形成基板を追加で作製した。次いで、ネガ型感光性組成物1に替えてネガ型感光性組成物8を用いた以外は実施例12と同一の方法で、画素分割層/スペーサー層形成基板および有機EL表示装置を作製して輝度ムラを評価し、画素分割層中の(c)成分の含有量を定量した。また、TEM-EDXで解析し、スペーサー層がシリカ粒子を含有しないことを確認した。評価結果を表13に示す。
以上から、本発明の有機EL表示装置が有用であることが確認された。
2:配線
3:TFT絶縁層
4:平坦化層
5:第一電極
6:基板
7:コンタクトホール
8:画素分割層
9:発光画素
10:第二電極
11:無アルカリガラス基板
12:銀合金膜
13:ITO膜
14:画素分割層
15:有機EL層
16:第二電極
17:画素分割層
18:開口部
19:スペーサー層
20:無アルカリガラス基板
21:銀合金膜
22:ITO膜
Claims (12)
- 基板、第一電極、画素分割層、発光画素および第二電極を具備する有機EL表示装置であって、該画素分割層が、(a)有機黒色顔料および/または混色有機黒色顔料と、(b)一次粒子径が5~30nmであり、かつアスペクト比(長径/短径)が1.0~1.5のシリカ粒子とを含有する有機EL表示装置。
- 前記画素分割層が含有するシリカ粒子の平均一次粒子径が5~30nmであり、かつ平均アスペクト比(長径/短径)が1.0~1.3である請求項1に記載の有機EL表示装置。
- 前記(a)成分100重量部に対する前記(b)成分の含有量がSiO2換算で20~70重量部である請求項1または2に記載の有機EL表示装置。
- 前記(b)成分が、ナトリウム原子を有するシリカ粒子を含有する請求項1~3のいずれかに記載の有機EL表示装置。
- さらに、前記画素分割層の表面の少なくとも一部にスペーサー層を具備し、該スペーサー層が、一次粒子径が5~30nmであり、かつアスペクト比(長径/短径)が1.0~1.5のシリカ粒子を含有する請求項1~4のいずれかに記載の有機EL表示装置。
- 前記(b)成分が、エチレン性不飽和二重結合基を含む表面修飾基の反応残基を粒子表面に有するシリカ粒子を含有し、該エチレン性不飽和二重結合基を含む表面修飾基の反応残基が式(19)で表される構造および/または式(20)で表される構造を有する請求項1~6のいずれかに記載の有機EL表示装置。
*2はシリカ粒子が粒子表面に有する、ケイ素原子と結合した酸素原子との結合部位を表す。R18は炭素原子数1~3のアルキル基を表す。m、nは整数であり、mは1~3を表し、nは0~2を表す。ただし、m+n=3を満たす。)
*4はシリカ粒子が粒子表面に有する、ケイ素原子と結合した酸素原子との結合部位を表す。) - 前記画素分割層が、(c)ハフニウム原子を1~50重量ppm含有する請求項1~7のいずれかに記載の有機EL表示装置。
- 前記画素分割層が、(d)フェノール樹脂を含有する請求項1~8のいずれかに記載の有機EL表示装置。
- 前記画素分割層が、(e)アクリロイル基またはメタクリロイル基と、トリフルオロメチル基とを有する繰り返し単位を有する樹脂を含有する請求項1~9のいずれかに記載の有機EL表示装置。
- 前記画素分割層の膜厚1μmあたりの光学濃度が0.7~1.2である請求項1~11のいずれかに記載の有機EL表示装置。
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