WO2022195931A1 - 加工装置、及び加工品の製造方法 - Google Patents

加工装置、及び加工品の製造方法 Download PDF

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Publication number
WO2022195931A1
WO2022195931A1 PCT/JP2021/035885 JP2021035885W WO2022195931A1 WO 2022195931 A1 WO2022195931 A1 WO 2022195931A1 JP 2021035885 W JP2021035885 W JP 2021035885W WO 2022195931 A1 WO2022195931 A1 WO 2022195931A1
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WO
WIPO (PCT)
Prior art keywords
holding
plate
transport
holding plate
conveying
Prior art date
Application number
PCT/JP2021/035885
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
元樹 深井
昌一 片岡
聡子 堀
雄哉 坂上
裕子 山本
翔 吉岡
一郎 今井
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN202180095325.0A priority Critical patent/CN116963871A/zh
Priority to KR1020237029195A priority patent/KR20230135661A/ko
Priority to JP2023506721A priority patent/JPWO2022195931A1/ja
Publication of WO2022195931A1 publication Critical patent/WO2022195931A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0616—Grinders for cutting-off using a tool turning around the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to a processing device and a method for manufacturing a processed product.
  • Patent Document 1 in a cutting apparatus for cutting an object to be cut to manufacture a plurality of individualized products, it has been conceived that a suction jig is detachably attached to a cutting table. It is
  • the suction jig is simply detachable from the cutting table, and an operator needs to perform the work when actually replacing the suction jig.
  • the suction jig is simply detachable from the cutting table, and an operator needs to perform the work when actually replacing the suction jig.
  • there is a problem that not only is the labor cost of the worker high, but also the mounting state varies.
  • the replacement work takes time, and the productivity of the cutting device decreases.
  • the present invention has been made to solve the above problems, and its main object is to automatically replace a holding plate for holding an object to be processed.
  • a processing apparatus includes a processing mechanism for processing an object to be processed, a plate housing unit for housing a holding plate for holding the object to be processed, and the holding plate are detachably attached, A holding base portion that holds the workpiece using the holding plate; and a plate conveying mechanism that conveys the plate between the plate accommodating portion and the holding base portion, wherein the plate conveying mechanism includes the The holding plate removed from the holding base portion is conveyed to the plate accommodating portion, and the holding plate in the plate accommodating portion is conveyed to the holding base portion.
  • the holding plate for holding the workpiece can be automatically replaced.
  • FIG. 1 It is a figure showing typically composition of a cutting device concerning a 1st embodiment of the present invention. It is a perspective view which shows typically the table for cutting of the same embodiment, and its peripheral structure. It is the figure (plan view) seen from the Z direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance. It is the figure (side view) which showed typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance seen from the X direction.
  • FIG. 1 It is a perspective view which shows the holding
  • FIG. 1 It is a perspective view which shows the 1st conveyance mechanism (plate conveyance mechanism) and plate accommodating part of the same embodiment.
  • (a) A view showing the positional relationship between the sticking member storage section and the plate storage section when the sticking member is put in and taken out of the sticking member storage section, and
  • FIG. 1 It is the figure (front view) seen from the Y direction which shows typically the peripheral structure of the table for drying of the same embodiment, and a storage box. It is a schematic diagram which shows operation
  • processing device Sealed substrate (object to be processed)
  • cutting mechanism (processing mechanism) 5 transfer table 6: second holding mechanism (holding mechanism for carrying, second carrying mechanism) 7... Transport moving mechanism (second transport mechanism) 141...
  • Holding table (inspection table) 24 Plate accommodating portion M2 Holding base portion M1 Holding plate 25 Plate conveying mechanism 21 Tray 22 Tray conveying mechanism (first conveying mechanism) 261 Fixing insertion hole 262 Fixing cylinder portion 262a Cylinder main body 262b Mover 262c Elastic body 27 Temporary placement portion 281 Transfer holding hole 282 Cylinder portion 29 for transporting Inspection mechanism 29a Inspection channel 101 Pasting member 102 Placement table 106 Pasting member housing portion 107 Pasting member conveying mechanism 1071... Third holding mechanism (first transport mechanism) 111... Storage box 112... Drying table 116... Cylindrical container 116x... One end opening 117... Container installation part 118... Transport/accommodation mechanism 119... Intermediate table 120... ⁇ First product transport mechanism 121 . . . Second product transport mechanism
  • the processing apparatus of the present invention includes a processing mechanism for processing an object to be processed, a plate housing section for housing a holding plate for holding the object to be processed, and the holding plate detachably attached. a holding base portion for holding the workpiece using the holding plate; and a plate transport mechanism for transporting the plate between the plate accommodating portion and the holding base portion, wherein the plate transport mechanism is and conveying the holding plate removed from the holding base portion to the plate accommodating portion, and conveying the holding plate in the plate accommodating portion to the holding base portion.
  • this processing apparatus since it has a plate transport mechanism that transports the holding plate removed from the holding base portion to the plate accommodating portion and transports the holding plate in the plate accommodating portion to the holding base portion, the holding base portion
  • the holding plate can be automatically exchanged for As a result, labor costs for exchanging holding plates can be reduced.
  • the holding plate since the holding plate is automatically replaced, it is possible to reduce variations in the state of attachment of the holding plate to the holding base portion.
  • the holding plate is automatically exchanged, the time for exchanging the holding plate can be shortened, and the productivity of the processing apparatus can be improved.
  • the plate transport mechanism lifts and transports the holding plate. With this configuration, when the holding plate is conveyed, interference between the holding plate and other members can be avoided, and the holding plate can be easily conveyed.
  • the plate conveying mechanism includes a processing table holding plate for processing the processing object, a drying table holding plate for drying the processing object processed by the processing mechanism, A holding plate for an inspection table for inspecting the processed workpieces, a holding plate for a transfer table on which the processed workpieces are placed before sorting, or the processed workpieces after processing It is desirable to transport at least one of the holding plates of the transport holding mechanism that holds the object for transport. With this configuration, it is possible to automatically replace the holding plates of the processing table, the inspection table, the transfer table, and the carrying mechanism.
  • the processing apparatus of the present invention further includes a processing object transport mechanism that transports the processing object.
  • the plate transport mechanism is configured using the workpiece transport mechanism in order to simplify the device configuration and reduce the device cost while enabling automatic replacement of the holding plate. is desirable.
  • the plate transport mechanism is configured to have a function of transporting the workpiece.
  • the processing apparatus of the present invention can be configured such that the processed object can be accommodated in a tray (also called “tray accommodation”).
  • This processing apparatus further includes a tray transport mechanism that transports a tray on which the processed objects are sorted.
  • the plate transport mechanism is configured using the tray transport mechanism in order to simplify the device configuration and reduce the device cost while enabling automatic replacement of the holding plate. is desirable.
  • the plate conveying mechanism has a function of conveying trays in which processed objects are sorted.
  • the plate transport mechanism includes a first transport mechanism that transports the holding plate between the plate accommodating portion and the temporary placement portion, and a holding plate that transports the holding plate between the temporary placement portion and the holding base portion. It is desirable to have a second transport mechanism for With this configuration, the holding plate is transported by the first transporting mechanism and the second transporting mechanism via the temporary placement section. It is possible to increase the degree of freedom of the transport destination.
  • the plate conveying mechanism is composed of a first conveying mechanism and a second conveying mechanism
  • the first conveying mechanism conveys the pasting member to the mounting table
  • the second conveying mechanism conveys the individual pieces. It is desirable to convey the processed object that has been processed. With this configuration, the device cost can be reduced while simplifying the configuration of the device while enabling automatic exchange of the holding plate.
  • the processing apparatus of the present invention can have a configuration in which individualized workpieces can be accommodated (also called “ring accommodation”) by being attached to an attaching member having an adhesive surface.
  • This processing apparatus further includes a mounting table on which a pasting member having an adhesive surface to which the individualized objects to be processed by the processing mechanism are adhered is placed.
  • This structure WHEREIN It is desirable that the said plate conveyance mechanism can convey the said sticking member to the said mounting table. With this processing apparatus, since the plate conveying mechanism can convey the pasting member to the mounting table, there is no need to provide a conveying mechanism for the pasting member separately from the plate conveying mechanism, and individualized processing can be performed. It is possible to simplify the device configuration of a processing device that stores an object by sticking it on an adhesive surface.
  • the attaching member to which the individualized workpiece is attached may be moved. The handling can be facilitated.
  • the plate transport mechanism includes a first transport mechanism that transports the holding plate between the plate accommodating portion and the temporary placement portion, and a holding plate that transports the holding plate between the temporary placement portion and the holding base portion. It is desirable to have a second transport mechanism for With this configuration, the holding plate is transported by the first transporting mechanism and the second transporting mechanism via the temporary placement section. It is possible to increase the degree of freedom of the transport destination.
  • the plate conveying mechanism is composed of a first conveying mechanism and a second conveying mechanism
  • the first conveying mechanism conveys the pasting member to the mounting table
  • the second conveying mechanism conveys the individual pieces. It is desirable to convey the processed object that has been processed. With this configuration, the device cost can be reduced while simplifying the configuration of the device while enabling automatic exchange of the holding plate.
  • the processing apparatus of the present invention includes a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table; a second holding mechanism for holding the singulated object to convey the singulated object from the processing table; and conveying the pasting member to the mounting table. and a conveying movement mechanism having a common transfer shaft for moving the first holding mechanism, the second holding mechanism and the third holding mechanism. It is desirable to be prepared.
  • the first transport mechanism includes the third holding mechanism and the transport moving mechanism. and the second transport mechanism is preferably configured using the second holding mechanism and the transport moving mechanism.
  • the processing apparatus of the present invention further includes an affixing member accommodating section that accommodates the affixing member.
  • an affixing member accommodating section that accommodates the affixing member.
  • the processing apparatus of the present invention can be configured so that individualized workpieces can be accommodated in a discrete state (also referred to as “bulk accommodation”).
  • This processing apparatus further includes a storage box in which the workpieces separated by the processing mechanism are dropped and stored.
  • the plate transport mechanism can transport the individualized workpieces to the storage box.
  • the plate conveying mechanism can convey the singulated workpieces to the storage box. It is possible to simplify the device configuration of the processing device that drops and stores the processed object. Furthermore, equipment costs can also be reduced.
  • the individualized workpieces are dropped and stored in the storage box, the storage space can be reduced in comparison with the conventional tray storage configuration. This also reduces the footprint of the processing device.
  • the processing apparatus of the present invention can be configured so that individualized workpieces can be accommodated in cylindrical containers (also called "tube accommodation”).
  • cylindrical containers also called “tube accommodation”
  • the cylindrical container is sometimes called a tube, magazine stick, stick magazine, stick, or the like.
  • This processing apparatus includes a container installation section in which a cylindrical container for accommodating the individualized workpieces from one end opening is installed, and the individualized workpieces are placed in the container installation section. It further comprises a transporting/storing mechanism for transporting and storing in the installed cylindrical container.
  • the processing apparatus of the present invention includes the above-described A first holding mechanism for holding an object to be processed, and a second holding mechanism for holding the individualized object to convey the individualized object from the processing table. and a transfer movement mechanism having a common transfer shaft for moving the first holding mechanism and the second holding mechanism, wherein the plate transfer mechanism moves the second holding mechanism and the transfer movement mechanism. It is desirable to be configured using
  • the processing apparatus of the present invention further comprises an inspection mechanism for inspecting the state of attachment of the holding plate to the holding base. is desirable.
  • the inspection mechanism includes an inspection flow path that opens onto a mounting surface on which the holding plate is mounted, and a fluid flow path that is provided in the inspection flow path and that flows from the opening. It would be desirable to have a detection sensor to detect a leak in the air.
  • the detection sensor detects fluid leakage from the opening by measuring the pressure or flow rate of the fluid.
  • the holding base has a fixing cylinder inserted into a fixing insertion hole formed in the holding plate
  • the fixing cylinder part includes a cylinder body inserted into the fixing insertion hole, a mover provided movably at a position protruding from and retracted from the outer peripheral surface of the cylinder body, and the mover. and a position where the mover protrudes in a state in which the fixing cylinder portion is inserted into the fixing insertion hole Accordingly, it is desirable that the holding plate is fixed to the holding base.
  • the plate conveying mechanism has a conveying cylinder portion that is inserted into a conveying holding hole formed in the holding plate.
  • the conveying cylinder portion includes a cylinder body inserted into the conveying holding hole, a mover provided movably at a position protruding from and retracted from the outer peripheral surface of the cylinder body, and the movable element. and an elastic body for exerting a force so that the movable element protrudes from the cylinder main body, and in a state in which the conveying cylinder part is inserted into the conveying insertion hole, the position where the movable element protrudes. Therefore, it is preferable that the holding plate is held by the plate conveying mechanism.
  • a method for manufacturing a processed product using the processing apparatus described above is also an aspect of the present invention.
  • the processing apparatus 100 of the present embodiment is a cutting apparatus that separates a sealed substrate W, which is an object to be processed, into a plurality of products P, which are processed products.
  • the sealed substrate W is a substrate to which electronic elements such as a semiconductor chip, a resistor element, a capacitor element, etc. are connected, and at least the electronic elements are resin-molded so as to be resin-sealed.
  • a lead frame and a printed wiring board can be used as the substrate constituting the sealed substrate W.
  • semiconductor substrates including semiconductor wafers such as silicon wafers
  • metal substrates metal substrates
  • ceramic substrates can be used.
  • a glass substrate, a resin substrate, or the like can be used.
  • the substrates constituting the sealed substrate W may or may not be wired.
  • one surface of the sealed substrate W and the product P of this embodiment becomes a mounting surface to be mounted later.
  • one surface to be mounted later is referred to as a "mounting surface”, and the opposite surface is referred to as a "mark surface”.
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W.
  • a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate
  • a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products
  • a transfer table 5 to which P is transferred a second holding mechanism 6 for holding a plurality of products P to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, and a first holding mechanism 3.
  • the first holding mechanism 3 and the transport moving mechanism 7 constitute a transport mechanism (loader) for transporting the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 transport a plurality of products P.
  • a transport mechanism (unloader) is configured.
  • the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are the X direction as the first direction and the Y direction as the second direction, and the X direction and the Y direction.
  • the perpendicular direction is defined as the Z direction.
  • the horizontal direction in FIG. 1 is the X direction
  • the vertical direction is the Y direction.
  • the X direction is the direction in which the support 812 moves
  • the two cutting tables 2A, 2B are fixed in the X, Y and Z directions.
  • the cutting table 2A can be rotated in the .theta. direction by a rotating mechanism 9A provided below the cutting table 2A.
  • the cutting table 2B can be rotated in the .theta. direction by a rotating mechanism 9B provided under the cutting table 2B.
  • These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that their upper surfaces are positioned on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and their The centers of the upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A and 9B) are arranged on the same straight line extending in the X direction (see FIGS. 2 and 3).
  • the two cutting tables 2A and 2B suck and hold the sealed substrate W, and as shown in FIG.
  • Two vacuum pumps 10A, 10B are arranged.
  • Each vacuum pump 10A, 10B is, for example, a water ring vacuum pump.
  • the pipes (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, and the pipe pressure It is possible to reduce the loss and prevent the deterioration of the adsorption force. As a result, even a very small package of, for example, 1 mm square or less can be reliably attracted to the cutting tables 2A and 2B.
  • the capacities of the vacuum pumps 10A and 10B can be reduced, leading to miniaturization and cost reduction.
  • the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction portions 311 for sucking and holding the sealed substrate W, and a suction portion of the suction head 31. 311 connected to a vacuum pump or vacuum ejector (not shown). Then, the suction head 31 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the substrate supply mechanism 11 includes a substrate accommodating portion 11a in which a plurality of sealed substrates W are accommodated from the outside, and a first holding portion for the sealed substrates W accommodated in the substrate accommodating portion 11a. and a substrate supply part 11b for moving to a holding position RP where the mechanism 3 sucks and holds the substrate.
  • This holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction.
  • the substrate supply mechanism 11 may have a heating unit 11c that presses the sealed substrate W while heating it so as to flatten the sealed substrate W that is sucked by the first holding mechanism 3 .
  • the cutting mechanism 4 as shown in FIGS. 1, 2, and 3, has two rotary tools 40, which are blades 41A, 41B and two spindles 42A, 42B.
  • the two spindle parts 42A and 42B are provided so that their rotation axes are along the Y direction, and the blades 41A and 41B attached to them are arranged so as to face each other (see FIG. 3).
  • the blade 41A of the spindle section 42A and the blade 41B of the spindle section 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. As shown in FIG.
  • the cutting apparatus 100 of the present embodiment includes a liquid supply mechanism 12 having an injection nozzle 12a for injecting cutting water (working fluid) to suppress frictional heat generated by the blades 41A and 41B. is provided.
  • This injection nozzle 12a is supported by, for example, a Z-direction moving unit 83, which will be described later.
  • the transfer table 5 of the present embodiment is a table to which a plurality of products P inspected by an inspection unit 13, which will be described later, are transferred.
  • This transfer table 5 is a so-called index table, and a plurality of products P are temporarily placed thereon before sorting the plurality of products P onto various trays 21 .
  • the transfer table 5 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane.
  • the transfer table 5 is movable back and forth along the Y direction, and can move up to the sorting mechanism 20 .
  • a plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
  • the tray storage unit 23 has three types of trays, for example, a tray 21 before storing the product P, a tray 21 storing a good product P, and a tray 21 storing a defective product P that requires rework. configured to receive a tray;
  • the inspection unit 13 is provided between the cutting tables 2A and 2B and the transfer table 5, and inspects the plurality of products P held by the second holding mechanism 6.
  • the inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the mark surface of the product P and a second inspection unit 132 that inspects the mounting surface of the product P.
  • the first inspection unit 131 is an imaging camera having an optical system for inspecting the mark surface
  • the second inspection unit 132 is an imaging camera having an optical system for inspecting the mounting surface. Note that the first inspection unit 131 and the second inspection unit 132 may be shared.
  • a reversing mechanism 14 for reversing the plurality of products P is provided so that both sides of the plurality of products P can be inspected by the inspection unit 13 (see FIG. 1).
  • the reversing mechanism 14 has a holding table 141 that holds a plurality of products P, and a reversing unit 142 such as a motor that turns the holding table 141 upside down.
  • the second holding mechanism 6 When the second holding mechanism 6 holds a plurality of products P from the cutting tables 2A and 2B, the marked surfaces of the products P face downward. In this state, the mark surface of the products P is inspected by the first inspection unit 131 while the plurality of products P are being conveyed from the cutting tables 2A and 2B to the reversing mechanism 14 . After that, the multiple products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 , and then the reversing mechanism 14 moves to the position of the transfer table 5 . During this movement, the mounting surface of the product P facing downward is inspected by the second inspection unit 132 . After that, the product P is delivered to the transfer table 5 .
  • the second holding mechanism 6 holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the reversing mechanism 14, as shown in FIG.
  • the second holding mechanism 6 is connected to a suction head 61 provided with a plurality of suction portions 611 for sucking and holding a plurality of products P, and the suction portions 611 of the suction head 61 . and a vacuum pump or vacuum ejector (not shown). Then, the suction head 61 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the plurality of products P from the cutting tables 2A and 2B to the holding table 141 .
  • the transportation moving mechanism 7 moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 between at least the cutting tables. It is moved between 2A, 2B and the holding table 141 .
  • the transportation moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5, and the first holding mechanism 3 and the second 2 has a common transfer shaft 71 for moving the holding mechanism 6 .
  • the transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5 ( See Figure 1).
  • the first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the inspection section 13, the reversing mechanism 14, various trays 21, the tray conveying mechanism 22, the tray accommodating section 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later, and the collection container 172 are the same with respect to the transfer shaft 71. provided on the side (front side).
  • the transporting moving mechanism 7 includes a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71; A vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Z direction, and a vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Y direction. and a horizontal movement mechanism 74 for horizontal movement.
  • the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 for guiding the first holding mechanism 3 and the second holding mechanism 6. and a rack-and-pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 .
  • the guide rail 721 extends straight in the X direction along the transfer shaft 71, and, like the transfer shaft 71, allows the first holding mechanism 3 to move above the substrate supply portion 11b of the substrate supply mechanism 11, 2 A holding mechanism 6 is provided within a range in which it can move above the transfer table 5 .
  • the guide rail 721 is slidably provided with a slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a vertical movement mechanism 73 and a horizontal movement mechanism 74 .
  • the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the vertical movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are common to the first holding mechanism 3 and the second holding mechanism 6. provided separately for each.
  • the rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). and a gear 722b.
  • the cam rack 722a is provided on the common transfer shaft 71 and can be varied in length by connecting a plurality of cam rack elements.
  • the pinion gear 722b is provided on the slide member 723 and is called a so-called roller pinion. As shown in FIG. It has a plurality of roller pins 722b2 which are provided at equal intervals in the circumferential direction between the roller bodies 722b1 and are provided so as to be able to roll with respect to the roller body 722b1.
  • the rack-and-pinion mechanism 722 of this embodiment uses the roller pinions described above, two or more roller pins 722b2 come into contact with the cam rack 722a. Positioning accuracy is improved when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.
  • the lifting mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6.
  • the lifting mechanism 73 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, as shown in FIGS. It has a Z-direction guide rail 73a provided along the Z-direction, and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73a.
  • the actuator section 73b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the configuration of the up-and-down movement mechanism 73 of the second holding mechanism 6 is the same as that of the up-and-down movement mechanism 73 of the first holding mechanism 3, as shown in FIG.
  • the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in FIGS.
  • the horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the vertical movement mechanism 73) and the first holding mechanism 3, as shown in FIGS. Y-direction guide rails 74a provided along the Y-direction, elastic bodies 74b for applying force to the first holding mechanism 3 on one side of the Y-direction guide rails 74a, and the first holding mechanism 3. and a cam mechanism 74c for moving to the other side of the Y-direction guide rail 74a.
  • the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.
  • the configuration of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3, as shown in FIG. Further, the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 . Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism or an air cylinder without using the cam mechanism 74c, like the elevation movement mechanism 73. Alternatively, a linear motor may be used.
  • the cutting movement mechanism 8 linearly moves each of the two spindles 42A and 42B in the X, Y and Z directions.
  • the cutting movement mechanism 8 includes an X-direction movement unit 81 that linearly moves the spindles 42A and 42B in the X direction, and a linear movement of the spindles 42A and 42B in the Y direction. and a Z-direction moving portion 83 for linearly moving the spindle portions 42A and 42B in the Z-direction.
  • the X-direction moving part 81 is common to the two cutting tables 2A and 2B, and is provided along the X direction with the two cutting tables 2A and 2B interposed therebetween, as particularly shown in FIGS. a pair of X-direction guide rails 811, and a support body that moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. 812.
  • a pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction.
  • the support 812 is, for example, a portal type and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and beams (beams) bridging the pair of legs. extending in the direction
  • the support 812 is linearly reciprocated along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction.
  • the ball screw mechanism 813 is driven by a drive source (not shown) such as a servomotor.
  • the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Y-direction moving part 82 includes a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. have.
  • the Y-direction slider 822 is driven by, for example, a linear motor 823 and linearly reciprocates on the Y-direction guide rail 821 .
  • two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle parts 42A and 42B are movable in the Y direction independently of each other.
  • the Y-direction slider 822 may be configured to reciprocate by another direct acting mechanism using a ball screw mechanism.
  • the Z-direction moving part 83 moves along a Z-direction guide rail 831 provided along the Z-direction on each Y-direction slider 822 and moves along the Z-direction guide rail 831. and a Z-direction slider 832 that supports the spindle portions 42A and 42B. That is, the Z-direction moving portion 83 is provided corresponding to each spindle portion 42A, 42B.
  • the Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831 .
  • the Z-direction slider 832 may be configured to reciprocate by another direct acting mechanism such as a ball screw mechanism.
  • the positional relationship between the moving mechanism 8 for cutting and the transfer shaft 71 is such that the transfer shaft 71 is arranged above the moving mechanism 8 for cutting so as to cross the moving mechanism 8 for cutting. ing. Specifically, the transfer shaft 71 is arranged above the support 812 so as to cross the support 812 , and the transfer shaft 71 and the support 812 have a positional relationship of crossing each other.
  • the cutting apparatus 100 of the present embodiment further includes a processing waste storage section 17 that stores processing waste S such as offcuts generated by cutting the sealed substrate W, as shown in FIG.
  • the processing waste container 17 is provided below the cutting tables 2A and 2B, and is a guide chute having an upper opening 171X surrounding the cutting tables 2A and 2B in plan view. 171 and a collection container 172 for collecting the processing waste S guided by the guide shooter 171 .
  • the recovery rate of the processing waste S can be improved.
  • the guide shooter 171 guides the processing waste S scattered or dropped from the cutting tables 2A, 2B to the collection container 172.
  • the upper opening 171X of the guide shooter 171 surrounds the cutting tables 2A and 2B (see FIG. 3)
  • it is difficult to remove the processing waste S, and the collection rate of the processing waste S is further improved. can be improved.
  • the guide shooter 171 is provided so as to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4). is configured to protect
  • the processing waste container 17 is shared by the two cutting tables 2A and 2B, but may be provided for each of the cutting tables 2A and 2B.
  • the collection container 172 is for collecting the processing waste S that has passed through the guide shooter 171 by its own weight.
  • the two collection containers 172 are arranged on the front side of the transfer shaft, and configured to be independently removable from the front side of the cutting device 100 . With this configuration, it is possible to improve maintainability such as disposal of the processing waste S. Considering the size of the sealed substrate W, the size and amount of the processing waste S, the workability, etc., one collection container 172 may be provided under the entire cutting table, or three collection containers may be provided. You may divide
  • the processing waste storage section 17 has a separating section 173 for separating cutting water and processing waste.
  • a filter such as a perforated plate that allows cutting water to pass through the bottom surface of the collection container 172 may be provided.
  • the separation unit 173 allows the processing waste S to be collected without accumulating cutting water in the collection container 172 .
  • the cutting apparatus 100 of the present embodiment includes a first cleaning mechanism 18 that cleans the upper surface side (mounting surface) of the plurality of products P held by the cutting tables 2A and 2B. is further provided.
  • the first cleaning mechanism 18 cleans the upper surfaces of the products P (see FIG. 5) by spray nozzles 18a (see FIG. 5) for spraying cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. mounting surface).
  • the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3, as shown in FIG.
  • the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71 .
  • an elevation movement mechanism 181 for vertically moving the first cleaning mechanism 18 in the Z direction.
  • the lifting mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.
  • the cutting apparatus 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (mark surface) of the plurality of products P held by the second holding mechanism 6, as shown in FIG. .
  • the second cleaning mechanism 19 is provided between the cutting table 2B and the inspection section 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. By doing so, the lower surface side (mark surface) of the product P is cleaned. That is, while the second holding mechanism 6 is being moved along the transfer shaft 71, the second cleaning mechanism 19 cleans the lower surface side (mark surface) of the product P. As shown in FIG.
  • FIG. 9 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 10.
  • all the operations of the cutting apparatus 100 such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, replacement of the holding plate M1 described later, and the like. Control is performed by the control unit CTL (see FIG. 1).
  • the substrate supply unit 11b of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 11a toward the holding position RP held by the first holding mechanism 3.
  • the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 holds the sealed substrate W by suction.
  • the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction holding, and the sealed substrate W is released.
  • a substrate W is placed on the cutting tables 2A and 2B.
  • the main moving mechanism 72 adjusts the position of the sealed substrate W in the X direction
  • the horizontal moving mechanism 74 adjusts the position of the sealed substrate W in the Y direction.
  • the cutting tables 2A and 2B hold the sealed substrate W by suction.
  • the elevation movement mechanism 73 moves the first holding mechanism 3 to the cutting movement mechanism 8 (support body 812). Raise to a position where there is no physical interference.
  • the support body 812 is retracted from the cutting table 2B to the transfer table 5 side. It is not necessary to raise and lower the first holding mechanism 3 at this time.
  • the cutting movement mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate to form the sealed substrate W in a grid pattern. Cut and individualize.
  • the transfer mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (mounting surface) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transfer mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.
  • the transfer movement mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 holds the plurality of products P by suction.
  • the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 .
  • the second cleaning mechanism 19 cleans the lower surfaces (marked surfaces) of the plurality of products P held by the second holding mechanism 6 .
  • the plurality of products P held by the second holding mechanism 6 are inspected on the lower surface side (marked surface) by the inspection unit 131, and then transferred to the reversing mechanism 14, where the marks are processed by the reversing mechanism 14. After the face is sucked and held, it is inverted. After the reversal, the reversing mechanism 14 is moved, and the mounting surface of the product P is inspected by the inspection section 132 . After being inspected on both sides in this manner, the product P is transferred from the reversing mechanism 14 to the transfer table 5 . A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
  • the cutting apparatus 100 of this embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P.
  • FIG. 1 ⁇ Automatic Exchange Function of Holding Plate M1> Furthermore, the cutting apparatus 100 of this embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P.
  • cutting tables 2A and 2B for cutting the sealed substrate W an inspection table (holding table 141) for inspecting the product P, and the product P before sorting.
  • the transfer table 5 to be placed on the substrate and the holding mechanism for carrying (the second holding mechanism 6) for carrying the product P are exchangeable, and the holding plate M1 is detachable. and a holding base portion M2 that holds the sealed substrate W or product P using a holding plate M1.
  • FIG. 10 shows the holding plates M1 and holding base portions M2 of the cutting tables 2A and 2B as representatives, the holding table 141, the transfer table 5 and the second holding mechanism 6 also have holding plates.
  • the configuration with M1 and holding base M2 is the same.
  • the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2.
  • a plate transport mechanism 25 is provided.
  • the holding plate M1 is formed with a suction portion (suction hole) (not shown) for sucking the sealed substrate W or the product P, and is mounted on the holding base portion M2 by being attached to the holding base portion M2.
  • the sealed substrate W or the product P is sucked through the suction channel M21 (see FIG. 10).
  • the holding plate M1 is used for the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6.
  • the configuration of the adsorption section is different.
  • the holding plate M1 is used for the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6.
  • the configuration of the adsorption unit may be shared and made the same.
  • the various holding plates M1 have different shapes, configurations of suction portions, etc. for each sealed substrate W or product P, and are selected according to the sealed substrate W or product P.
  • the cutting device 100 is provided with a fixing mechanism 26 for detachably attaching the holding plate M1 to the holding base portion M2.
  • the fixing mechanism 26 includes a fixing insertion hole 261 formed in the holding plate M1 and a fixing insertion hole 261 provided in the holding base portion M2 and inserted into the fixing insertion hole 261 formed in the holding plate M1. It has a cylinder portion 262 .
  • the fixing cylinder part 262 is a so-called chuck cylinder, and as shown in FIG. It has a spherical mover 262b that is movably provided at a position where it is positioned at the position where it is positioned, and an elastic body 262c that applies a force to the mover 262b so that the mover 262b protrudes from the cylinder body 262a.
  • the mover 262b is configured to be switched between the protruded position (FIG. 12(a)) and the retracted position (FIG. 12(b)).
  • the fixing cylinder portion 262 has a piston portion 262d.
  • the piston part 262d is interposed between the movable element 262b and the elastic body 262c inside the cylinder main body 262a, and moves inside the cylinder main body 262a by means of compressed air, thereby protruding and retracting the movable element 262b. Switch between positions.
  • the piston portion 262d moves inside the cylinder body 262a against the force received from the elastic body 262c, and moves the mover 262b to the retracted position (FIG. 12(b)).
  • the force received from the elastic body 262c moves inside the cylinder body 262a to move the mover 262b to the projecting position (FIG. 12(a)).
  • the fixing insertion hole 261 formed in the holding plate M1 is in a state in which the fixing cylinder portion 262 is inserted, and when the mover 262b is at a protruded position, It has a convex portion 261a that catches the mover 262b and prevents the fixing cylinder portion 262 from coming off.
  • the protruding portion 261a catches the mover 262b at the projected position, but does not catch the mover 262b at the retracted position. Therefore, when the fixing cylinder portion 262 is inserted into the fixing insertion hole 261, the holding plate M1 is fixed to the holding base portion M2 by setting the mover 262b to a protruding position (Fig. 12(a)).
  • the plate accommodating portion 24 accommodates the holding plates M1 before and after replacement (before and after use), and as shown in FIG. 11, has a slide shelf portion 241 on which each holding plate M1 is placed.
  • the slide racks 241 on the upper side accommodate new holding plates M1 before replacement
  • the slide shelves 241 on the lower side accommodate old holding plates M1 after replacement. and For example, by sliding the target slide shelf 241 forward by the plate transport mechanism 25, the used old holding plate M1 is placed on the slide shelf 241, or , a new holding plate M1 before use is taken out.
  • a hook portion 241a is provided on the front side portion of the slide shelf portion 241, and the slide shelf portion 241 is pulled out using the hook portion 241a.
  • the plate conveying mechanism 25 conveys the holding plate M1 removed from the holding base portion M2 to the plate accommodating portion 24, and conveys the holding plate M1 in the plate accommodating portion 24 to the holding base portion M2. Further, the plate transport mechanism 25 can lift and transport the holding plate M1. More specifically, the plate transport mechanism 25 can transport the holding plate M1 in the horizontal direction at the elevated position where the holding plate M1 is held and raised from above.
  • the "up position” means that the holding plate M1 is raised from the position of the holding plate M1 attached to the holding base portion M2 to be replaced or from the lowest position of the holding plate M1 that can be taken during transportation. It means the position of the height where the
  • the plate conveying mechanism 25 includes a first conveying mechanism 25a for conveying the holding plate M1 between the plate accommodating portion 24 and the temporary placing portion 27, the temporary placing portion 27 and the holding base. and a second transport mechanism 25b that transports the holding plate M1 to and from the portion M2.
  • the temporary placement section 27 of this embodiment is the holding table 141 of the reversing mechanism 14 .
  • the transfer table 5 may be used as the temporary placement section 27 , or the temporary placement section 27 may be provided separately from the holding table 141 and the transfer table 5 .
  • the first transport mechanism 25a is configured using the tray transport mechanism 22, and is capable of transporting the tray 21 for sorting the workpieces W (products P) after processing.
  • the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7 (workpiece transport mechanism), and can transport the workpiece W.
  • the plate transport mechanism 25 (the first transport mechanism 25a and the second transport mechanism 25b) is configured to move in the X direction by the common transfer shaft 71 described above. Also, the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the tray transport mechanism 22 which is the first transport mechanism 25a, as shown in FIG.
  • it has a plate holding portion 221b such as a holding claw for holding the holding plate M1.
  • tray holding portions 221a are provided on a pair of opposing sides facing each other, and plate holding portions 221b are provided on a different pair of opposing sides.
  • the plate holding portion 221b may be configured using the above-described catch cylinder.
  • the tray transport mechanism 22 is configured such that the plate holding portion 221b can be moved up and down, and can transport the holding plate M1 in a state in which the plate holding portion 221b holding the holding plate M1 is raised to the raised position. can.
  • the tray transport mechanism 22 has the same configuration as the transport moving mechanism 7 of the first holding mechanism 3 and the second holding mechanism 6 . That is, as shown in FIG. 11, the tray transport mechanism 22 includes the above-described main moving mechanism 72 that moves the tray holding mechanism in the X direction along the transfer shaft 71, and the tray holding mechanism 221 that moves in the Z direction with respect to the transfer shaft 71. and a horizontal movement mechanism 76 for horizontally moving the tray holding mechanism 221 in the Y direction with respect to the transfer shaft 71 .
  • the vertical movement mechanism 75 and the horizontal movement mechanism 76 are linear motion mechanisms such as those using a rack and pinion mechanism, a ball screw mechanism, a linear motor, or an air cylinder. configured to move back and forth.
  • the second holding mechanism 6 serving as the second conveying mechanism 25b includes a conveying cylinder portion 282 inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1.
  • the fixing cylinder portion 262 of the holding base portion M2 of the second holding mechanism 6 is used to configure the transfer cylinder portion 282 .
  • the transport holding hole 281 has the same configuration as the fixing insertion hole 261 of the fixing mechanism 26 described above. Note that the holding hole 281 for transportation and the insertion hole 261 for fixing are arranged upside down.
  • the second holding mechanism 6 may use holding claws that are hooked on the edge of the holding plate M1 to hold it, instead of the conveying cylinder portion 282 .
  • the second holding mechanism 6 is configured such that the portion holding the holding plate M1 can be moved up and down, and the holding plate M1 can be transported in a state in which the portion holding the holding plate M1 is raised to the raised position. can.
  • the cutting device 100 of this embodiment further includes an inspection mechanism 29 that inspects the attachment state of the holding plate M1 to the holding base portion M2.
  • the inspection mechanism 29 includes an inspection channel 29a that opens onto the mounting surface M22 on which the holding plate M1 is mounted, and a detection sensor (not shown) that is provided in the inspection channel 29a and detects fluid leakage from the opening. ).
  • the inspection channel 29a has an opening formed in the mounting surface M22 of the holding base portion M2, and is supplied with compressed air.
  • the detection sensor detects the leakage of compressed air from the opening by detecting the pressure or flow rate of the compressed air flowing through the inspection flow path 29a.
  • the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using an identifier such as an RFID provided on the holding plate M1 in the first transport mechanism 25a (tray It is read by an identifier reader (not shown) provided in the transport mechanism 22).
  • an identifier such as an RFID provided on the holding plate M1 in the first transport mechanism 25a (tray It is read by an identifier reader (not shown) provided in the transport mechanism 22).
  • the holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the first transport mechanism 25a (tray transport mechanism 22) and transported to the plate accommodating section 24 in the raised position.
  • first transport mechanism 25a tunnel transport mechanism 22
  • compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixation of the fixing mechanism 26.
  • the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24 and conveys it to the holding base portion M2 of the holding table 141 in the state of the raised position,
  • the holding plate M1 is lowered and placed.
  • the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1.
  • the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
  • the holding plate M1 of the transfer table 5 is removed, and the holding plate M1 is lifted by the first transport mechanism 25a (tray transport mechanism 22) and transported to the plate accommodating section 24 in the raised position.
  • first transport mechanism 25a tunnel transport mechanism 22
  • compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the retracted position, thereby releasing the fixation of the fixing mechanism 26.
  • the first transport mechanism 25a takes out the new holding plate M1 of the transfer table 5 from the plate accommodating part 24 and transports it to the holding base part M2 of the transfer table 5 in the state of being in the raised position. Then, the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
  • the order of replacement of the holding plate M1 of the holding table 141 and replacement of the holding plate M1 of the transfer table 5 is not limited to the above.
  • a new holding plate M1 may be attached to each of the holding table 141 and the transfer table 5 after removing the holding plate M1.
  • the holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the second conveying mechanism 25b (the conveying moving mechanism 7 and the second holding mechanism 6) to the elevated position. 27, and the holding plate M1 is lowered and placed thereon.
  • the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 so that the mover 262b is retracted to release the fixation of the fixing mechanism 26.
  • the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding table 141 in advance.
  • the first transport mechanism 25a (tray transport mechanism 22) lifts the holding plates M1 of the cutting tables 2A and 2B placed on the holding table 141 and transports them to the plate accommodating section 24 in the raised position. Then, the holding plate M1 is lowered and accommodated.
  • the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plates M1 of the cutting tables 2A and 2B from the plate accommodating portion 24, and the holding table serving as the temporary placing portion 27 is moved to the raised position. 141, and the holding plate M1 is lowered and placed thereon.
  • the second transport mechanism 25b moves the new holding plate M1 placed on the holding table 141 to the holding base portion M2 of the cutting tables 2A and 2B at the raised position.
  • the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
  • the transport moving mechanism 7 moves the second holding mechanism 6 to the holding table 141, which is the temporary placement unit 27, and lowers the holding plate M1. , and the holding plate M1 is placed on the holding table 141, which is the temporary placement unit 27. As shown in FIG. When removing the holding plate M1 of the second holding mechanism 6, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixing of the fixing mechanism 26.
  • the first conveying mechanism 25a (tray conveying mechanism 22) raises the holding plate M1 of the second holding mechanism 6 placed on the holding table 141 and conveys it to the plate accommodating section 24 in a raised position. , the holding plate M1 is lowered and accommodated.
  • the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding plate M1 of the holding table 141 in advance.
  • the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plate M1 of the second holding mechanism 6 from the plate accommodating portion 24 and places it on the holding table 141, which is the temporary placing portion 27, in a raised position. Then, the holding plate M1 is lowered and placed.
  • the second holding mechanism 6 is moved to the holding table 141 by the transfer moving mechanism 7, the holding base portion M2 is lowered, and the new holding plate M1 placed on the holding table 141 is attached.
  • the fixing cylinder portion 262 provided in the holding base portion M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transportation moving mechanism 7 .
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the second holding mechanism 6. As shown in FIG.
  • replacement of the transfer table 5, the holding table 141, the cutting tables 2A and 2B, and the holding plate M1 of the second holding mechanism 6 may be performed as a series of operations.
  • the transfer table 5, the holding table 141, the second holding mechanism 6, and the holding plates M1 of the cutting tables 2A and 2B are removed in this order, and then the cutting tables 2A and 2B, the second holding mechanism 6, and the holding table are removed.
  • 141 and the holding plate M1 of the transfer table 5 may be attached in this order.
  • the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate M1 in the plate accommodating portion 24 is conveyed to the holding base portion M2. Since the plate conveying mechanism 25 is provided, the holding plate M1 can be automatically exchanged with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2.
  • the plate transport mechanism 25 includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, and a holding mechanism between the temporary placement portion 27 and the holding base portion M2. Since it has the second transport mechanism 25b for transporting the plate M1, the degree of freedom of the transport destination of the holding plate M1 can be increased compared to the case where the plate transport mechanism 25 is composed of one transport mechanism.
  • the first transport mechanism 25a is configured using the tray transport mechanism 22, the device configuration can be simplified and the device cost can be reduced.
  • the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, the device configuration can be simplified and the device cost can be reduced.
  • the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A and 2B and the transfer table 5. Since the cutting mechanism 4 is moved in the horizontal plane by the moving mechanism 8 in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction, the cutting tables 2A and 2B are not moved in the X direction and the Y direction.
  • the sealed substrate W can be processed. Therefore, the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member can be eliminated without moving the cutting tables 2A and 2B by the ball screw mechanism.
  • the configuration of the cutting device 100 can be simplified.
  • the cutting tables 2A and 2B can be configured so as not to move in the X and Y directions, and the footprint of the cutting device 100 can be reduced.
  • the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the carrying mechanism (second holding mechanism 6) are Although it was configured to be replaced automatically, at least one of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the holding mechanism for transportation (second holding mechanism 6) It is good also as a structure which exchanges automatically.
  • the plate conveying mechanism 25 of the first embodiment has the first conveying mechanism 25a and the second conveying mechanism 25b, it may have a single conveying mechanism. Further, the plate transport mechanism 25 may be configured without the tray transport mechanism 22, or may be configured without the second holding mechanism 6 and transport moving mechanism 7 (processing object transport mechanism).
  • This cutting apparatus 100 does not have a tray transport mechanism 22, and various trays 21 are moved below the plate accommodating section 24 by the tray moving mechanism TM, thereby sorting the products P by the sorting mechanism 20.
  • the tray moving mechanism TM includes a transport rail TM1 extending along the Y direction, a moving mechanism (not shown) for moving the tray 21 on the transport rail TM1, and a moving mechanism TM2 for moving the various trays 21 in the X direction. and a moving mechanism TM3 that is provided for each tray 21 and moves each tray 21 in the Z direction.
  • the plate transport mechanism 25 can be configured using the second holding mechanism 6 and transport moving mechanism 7 .
  • the plate accommodating portion 24 of the first embodiment includes the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the conveying holding mechanism (second holding mechanism 6).
  • the holding plate M1 is accommodated, a plurality of dedicated plate accommodating portions 24 may be provided according to the type of the holding plate M1.
  • the transfer table 5 of the first embodiment is an index table that is temporarily placed before sorting into the various trays 21, but the transfer table 5 may be used as the holding table 141 of the reversing mechanism 14. .
  • the grooves may be formed without cutting the sealed substrate on the cutting tables 2A and 2B.
  • the sealed substrate W grooved by the cutting tables 2A and 2B may be returned to the substrate supply section 11b by the first holding mechanism 3 and the transfer movement mechanism 7.
  • the sealed substrate W returned to the substrate supply section 11b may be accommodated in the substrate accommodation section 11a.
  • the cutting apparatus 100 of the second embodiment can store a plurality of products P by attaching them to the sticking member 101 having an adhesive surface 101x (also called "ring storage"), unlike the tray storage of the first embodiment. is configured as
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W.
  • a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate
  • a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products
  • a transfer table 5 to which P is transferred a second holding mechanism 6 for holding a plurality of products P to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, and a first holding mechanism 3. and a transfer movement mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held on the cutting tables 2A and 2B.
  • a moving mechanism for processing (moving mechanism for processing) 8 .
  • a plurality of products P are temporarily placed on the transfer table 5 of the second embodiment before the plurality of products P are attached to an attaching member 101, which will be described later. 17 and 18, the transfer table 5 is provided movably along the Y direction, and is positioned at a transfer position X1 where a plurality of products P are placed by the second holding mechanism 6. , and a pick-up position X2 where a plurality of products P are conveyed by the pasting conveying mechanism 103 .
  • the transfer position X1 is set on the front side of the transfer shaft 71, and is a position where the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. is set on the back side of the transfer shaft 71 .
  • the transfer shaft 71 of the transfer mechanism 7 allows the first holding mechanism 3 to move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 to move above the transfer table 5.
  • the pasting member transport mechanism 107 which will be described later, extends in a range in which it can move between the pasting member transport position X ⁇ b>3 and the guide rail 108 .
  • a mounting table 102 , an application member storage section 106 and an application member conveying mechanism 107 which will be described later, are also provided on the same side (front side) of the transfer shaft 71 with respect to the transfer shaft 71 .
  • the cutting device 100 of the second embodiment includes a mounting table 102 on which a sticking member 101 having an adhesive surface 101x to which a plurality of products P are to be stuck is placed, and a plurality of a pasting conveying mechanism 103 for conveying the product P from the transfer table 5 to the pasting member 101 placed on the placing table 102 .
  • two mounting tables 102 are provided along the X direction (see FIG. 17), and the sticking member 101 is mounted on each mounting table 102 .
  • the two mounting tables 102 are arranged such that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction).
  • the two mounting tables 102 are provided movably along the Y direction, and are positioned at a pasting member transfer position where the pasting member conveying mechanism 107 transfers the pasting member 101. It moves between X3 and a sticking position X4 where a plurality of products P are transported by the transport mechanism 103 for sticking.
  • the two mounting tables 102 move independently of each other between the attaching member conveying position X3 and the attaching position X4.
  • the pasting member conveying position X3 is set on the front side of the transfer shaft 71, and the pasting position X4 is set on the far side of the transfer shaft 71.
  • the mounting table 102 at the sticking position X4 and the transfer table 5 at the take-out position X2 are arranged along the X direction (see FIG. 17).
  • the sticking member 101 includes, for example, an annular or rectangular frame-shaped member 101a and a resin sheet 101b having an adhesive surface 101x disposed inside the frame-shaped member 101a.
  • the frame member 101a is made of metal such as stainless steel.
  • the resin sheet 101b includes, for example, a sheet-like base material 101b1 made of resin and an adhesive layer (adhesive layer) 101b2 made of an adhesive applied to the upper surface of the sheet-like base material 101b1.
  • the upper surface of the adhesive layer (adhesive layer) 101b2 is the adhesive surface 101x.
  • the pasting conveying mechanism 103 conveys a plurality of products P from the transfer table 5 moved to the take-out position X2 to the pasting member 101 placed on the placing table 102 moved to the pasting position X4.
  • the pasting conveying mechanism 103 includes a product suction mechanism 1031 for sucking a plurality of products P held on the transfer table 5, for example, in each row, and the product suction mechanism 1031. and a moving mechanism 1032 for adsorption that moves 1031 along the X direction.
  • a product suction mechanism 1031 for sucking a plurality of products P held on the transfer table 5, for example, in each row
  • the product suction mechanism 1031 for example, in each row
  • a moving mechanism 1032 for adsorption that moves 1031 along the X direction.
  • two pasting conveying mechanisms 103 are provided, and the respective pasting conveying mechanisms 103 are configured to be driven independently of each other.
  • the product suction mechanism 1031 is connected to a suction head 1031A provided with a plurality of suction portions 1031a for individually sucking and holding a plurality of products P, and the suction portion 1031a of the suction head 1031A. and a vacuum pump or vacuum ejector (not shown).
  • the product adsorption mechanism 1031 is configured such that each adsorption portion 1031a adsorbs one product P.
  • the plurality of suction portions 1031a are configured to be able to move up and down independently of each other, and each suction portion 1031a descends to individually suck the product P. As shown in FIG.
  • the suction moving mechanism 1032 includes an X-direction moving portion 1032a for moving the product suction mechanism 1031 in the X direction and a Z-direction moving portion 1032b for moving the product suction mechanism 1031 in the Z direction.
  • the suction moving mechanism 1032 may have a Y-direction moving unit that moves the product suction mechanism 1031 in the Y direction.
  • the X-direction moving portion 1032a moves along an X-direction guide rail 1032a1 provided along the X direction on the far side of the transfer shaft 71, and along the X-direction guide rail 1032a1, moves through the Z-direction moving portion 1032b. and a support 1032 a 2 that supports the product suction mechanism 1031 .
  • the support 1032a2 is linearly reciprocated along the X direction on the X direction guide rail 1032a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servomotor.
  • the support 1032a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Z-direction moving portion 1032b moves along a Z-direction guide rail 1032b1 provided along the Z-direction on the support 1032a2 and the product suction mechanism 1031.
  • Z-direction slider 1032b2 to support.
  • the Z-direction slider 1032b2 linearly reciprocates along the Z-direction on the Z-direction guide rail 1032b1 by, for example, a ball screw mechanism (not shown) extending in the Z-direction.
  • the Z-direction slider 1032b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the first imaging unit 201 is an imaging camera that images the product P sucked and held by the product suction mechanism 1031 of the pasting conveying mechanism 103 from below, and images the lower surface (mark surface) of the product P. Also, the first imaging unit 201 is provided so as to be movable in the front-rear direction (Y direction). Thereby, it is configured such that the position of the product P sucked and held by each of the two pasting conveying mechanisms 103 can be confirmed.
  • each pasting conveying mechanism 103 is provided with a second imaging section 202 for confirming the position where the product P is pasted on the pasting member 101, as shown in FIG.
  • the second imaging unit 202 is an imaging camera that captures an image of the sticking member 101 on the mounting table 102 at the sticking position X4 from above, and images the top surface (adhesive surface 101x) of the sticking member 101 .
  • the product P is aligned with the application member 101 and conveyed for application.
  • the mechanism 103 affixes the product P to the adhesive surface 101 x of the affixing member 101 .
  • the position alignment of the product P is performed by the adsorption moving mechanism 1032 of the pasting transport mechanism 103, the rotating mechanism (not shown) provided in the pasting transport mechanism 103, or the moving mechanism (not shown) of the mounting table 102. Alternatively, it can be performed by a rotating mechanism (not shown) provided on the mounting table 102 .
  • the cutting device 100 of the present embodiment has an affixing member accommodation unit 106 that accommodates the affixing member 101, and conveys the affixing member 101 between the mounting table 102 and the affixing member accommodation unit 106.
  • a pasting member conveying mechanism 107 is provided.
  • the sticking member storage part 106 stores an empty sticking member 101 to which the product P is not stuck, and also stores the pasted sticking member 101 to which the product P is stuck.
  • the adhesive member storage unit 106 is arranged in a line along the X direction with the placement table 102 at the adhesive member transport position X3 (see FIG. 17).
  • a pair of guide rails 108 for taking the sticking member 101 into and out of the sticking member housing portion 106 is provided at the opening of the sticking member housing portion 106.
  • the pair of guide rails 108, on which the sticking member 101 is placed, are provided in front of the opening of the sticking member accommodating portion 106 along the X direction.
  • the pasting member conveying mechanism 107 conveys the pasting member 101 between the placing table 102 located at the pasting member conveying position X3 and the pasting member storage section 106 .
  • the application member conveying mechanism 107 includes a third holding mechanism 1071 that sucks and holds the frame-shaped member 101a of the application member 101, and the third holding mechanism 1071 that moves at least in the X direction and the Z direction. and a moving mechanism 1072 for moving in the direction.
  • the third holding mechanism 1071 includes a suction head 1071A provided with a plurality of suction portions 1071a for sucking and holding the application member 101, and a vacuum pump or vacuum ejector (not shown) connected to the suction portions 1071a of the suction head 1071A. ).
  • the moving mechanism 1072 is configured using the main moving mechanism 72 of the transporting moving mechanism 7 , and the third holding mechanism 1071 moves along the common transfer shaft 71 . Further, the moving mechanism 1072 has an up-and-down moving mechanism 1072a similar to the up-and-down moving mechanism 73 of the moving mechanism 7 for transportation. Note that the moving mechanism 1072 may have a Y-direction moving mechanism that moves the third holding mechanism 1071 in the Y direction.
  • FIG. 17 An example of the operation of the cutting device 100 of the second embodiment will be described with reference to FIGS. 9, 17 to 19 and 21.
  • FIG. 17 all operations of the cutting device 100, such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, cleaning of the product P, and accommodation of the product P in the ring, are performed. Operation and control are performed by the control unit CTL (see FIG. 17).
  • the operations from transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, and inspecting the product P are the same as in the first embodiment. (see FIG. 9).
  • the product P is transferred from the reversing mechanism 14 to the transfer table 5 .
  • the transfer table 5 on which a plurality of products P are placed moves to the take-out position X2 (see FIGS. 17, 18 and 19).
  • an empty pasting member 101 is transported from the pasting member container 106 by the pasting member transport mechanism 107 to the placement table 102 at the pasting member transport position X3. Then, the mounting table 102 carrying the empty sticking member 101 moves to the sticking position X4 (see FIGS. 18 and 19).
  • the pasting transport mechanism 103 sucks and holds the product P from the transfer table 5 located at the take-out position X2. Then, it moves above the first imaging unit 201 . Thereby, the position of the product P in the pasting conveying mechanism 103 is confirmed by the first imaging unit 201 . In addition, the pasting conveying mechanism 103 is moved to confirm the position where the product P is pasted on the pasting member 101 on the mounting table 102 at the pasting position X4 by the second imaging unit 202 . The pasting conveying mechanism 103 then sticks the held product P onto the pasting member 101 . This operation is repeated multiple times until the allowable number of products P that can be stuck on the sticking member 101 are stuck, or until all the multiple products P on the transfer table 5 are stuck.
  • the mounting table 102 moves to the attaching member conveying position X3, as shown in FIGS.
  • the applied member conveying mechanism 107 conveys the pasted applied member 101 placed on the mounting table 102 to the applied member housing portion 106 .
  • the pasted member conveying mechanism 107 places the pasted pasted pasted member 101 on a pair of guide rails 108 provided in the pasted member accommodating portion 106 .
  • the pasted member 101 is housed in the pasted member housing portion 106. As shown in FIG.
  • the pasting member conveying mechanism 107 draws out the pasting member 101 from the pasting member housing portion 106 and places it on the pair of guide rails 108 . , sucks and holds the empty sticking member 101 placed on the pair of guide rails 108 and transports it to the placing table 102 at the sticking member transport position X3.
  • the cutting apparatus 100 of the second embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, as in the first embodiment.
  • the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6 each have a holding plate M1 and a holding base portion M2. ing.
  • the specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
  • the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2.
  • a plate transport mechanism 25 is provided.
  • the cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
  • the plate accommodating portion 24 of this embodiment has the same configuration as that of the first embodiment, but as shown in FIG.
  • the plate accommodating portion 24 of this embodiment is provided above the attaching member accommodating portion 106 .
  • the plate accommodating portion 24 and the sticking member accommodating portion 106 are configured to be movable up and down in the vertical direction (Z direction).
  • an elevation movement section 109 for vertically moving the plate housing section 24 and an elevation movement section 110 for vertically moving the pasting member housing section 106 are provided, and the plate housing section 24 and the pasting member housing section 106 are independent of each other. It is configured to be able to move up and down.
  • the up-and-down moving units 109 and 110 may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the plate accommodating portion 24 and the attaching member accommodating portion 106 may be integrally moved up and down by a common up-and-down movement mechanism.
  • the application member 101 is arranged at the desired height position H1 by the moving unit 110 , and the application member 101 is taken in and out of the application member storage unit 106 by the application member conveying mechanism 107 .
  • the holding plate M1 is to be put in and taken out of the plate accommodating portion 24, as shown in FIG. is placed at a desired height position H2 by the up-and-down moving unit 109, and the holding plate M1 is taken in and out of the plate accommodating unit 24 by the plate conveying mechanism 25.
  • the height position H2 of the plate accommodating portion 24 is positioned higher than the height position H1 of the attaching member accommodating portion 106 so that the attaching member conveying mechanism 107 does not interfere with the guide rail 108 .
  • the plate transport mechanism 25 of this embodiment includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, the temporary placement portion 27 and the holding portion 25a. and a second transport mechanism 25b that transports the holding plate M1 to and from the base portion M2.
  • the temporary placement section 27 of this embodiment is the holding table 141 of the reversing mechanism 14 .
  • the transfer table 5 may be used as the temporary placement section 27 , or the temporary placement section 27 may be provided separately from the holding table 141 and the transfer table 5 .
  • the first transport mechanism 25a of the second embodiment is configured using the pasting member transport mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072).
  • the first transport mechanism 25a of the second embodiment can transport the sticking member 101 to which the processed workpiece W (product P) is to be stuck.
  • the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, and can transport the workpiece W, as in the first embodiment. That is, the plate transport mechanism 25 (the first transport mechanism 25a and the second transport mechanism 25b) is configured to move in the X direction by the common transfer shaft 71 described above. Also, the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the pasting member conveying mechanism 107 which serves as the first conveying mechanism 25a, as shown in FIG. It has a cylinder portion 1071b.
  • the attaching member conveying mechanism 107 is configured such that the portion that holds the holding plate M1 can be raised and lowered, and the holding plate M1 can be conveyed in a state in which the portion holding the holding plate M1 is raised to the raised position. can.
  • the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using an identifier such as an RFID provided on the holding plate M1 to the first transport mechanism 25a (plate It is read by an identifier reader (not shown) provided in the transport mechanism 25). Also, in this replacement operation, as shown in FIG. The holding plate M1 is taken in and out of the plate accommodating portion 24 by the plate conveying mechanism 25. As shown in FIG.
  • the holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (applying member conveying mechanism 107) and conveyed to the plate accommodating section 24 in a raised position.
  • first conveying mechanism 25a applying member conveying mechanism 1057
  • second conveying mechanism 107 conveyed to the plate accommodating section 24 in a raised position.
  • the first conveying mechanism 25a (attachment member conveying mechanism 107) takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24 and conveys it to the holding base portion M2 of the holding table 141 in the state of being in the raised position. , the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
  • the holding plate M1 of the transfer table 5 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (applied member conveying mechanism 107) to the raised position and conveyed to the plate accommodating section 24.
  • the first conveying mechanism 25a applied member conveying mechanism 107
  • compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the retracted position, thereby releasing the fixation of the fixing mechanism 26.
  • the first conveying mechanism 25a (attached member conveying mechanism 107) takes out the new holding plate M1 of the transfer table 5 from the plate accommodating portion 24 and places it on the holding base portion M2 of the transfer table 5 in the state of being in the raised position. Then, the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
  • the order of replacement of the holding plate M1 of the holding table 141 and replacement of the holding plate M1 of the transfer table 5 is not limited to the above.
  • a new holding plate M1 may be attached to each of the holding table 141 and the transfer table 5 after removing the holding plate M1.
  • the holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the second conveying mechanism 25b (the conveying moving mechanism 7 and the second holding mechanism 6) to the elevated position. 27, and the holding plate M1 is lowered and placed thereon.
  • the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 so that the mover 262b is retracted to release the fixation of the fixing mechanism 26.
  • the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding plate M1 of the holding table 141 in advance.
  • the first transport mechanism 25a (applied member transport mechanism 107) lifts the holding plates M1 of the cutting tables 2A and 2B placed on the holding table 141 to the raised position, and moves them into the plate accommodating section 24. Then, the holding plate M1 is lowered and accommodated.
  • the first conveying mechanism 25a (applied member conveying mechanism 107) takes out the new holding plate M1 of the cutting tables 2A and 2B from the plate accommodating portion 24, and in a state where the holding plate M1 is in the elevated position, the temporary holding portion 27 holds the plate. It is conveyed to the table 141, and the holding plate M1 is lowered and placed thereon.
  • the second transport mechanism 25b moves the new holding plate M1 placed on the holding table 141 to the holding base portion M2 of the cutting tables 2A and 2B at the raised position.
  • the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
  • the transport moving mechanism 7 moves the second holding mechanism 6 to the holding table 141, which is the temporary placement section 27, and lowers the holding plate M1. , and the holding plate M1 is placed on the holding table 141, which is the temporary placement unit 27. As shown in FIG. When removing the holding plate M1 of the second holding mechanism 6, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixing of the fixing mechanism 26.
  • the first conveying mechanism 25a (attachment member conveying mechanism 107) raises the holding plate M1 of the second holding mechanism 6 placed on the holding table 141 and conveys it to the plate accommodating section 24 in a state of the raised position. Then, the holding plate M1 is lowered and accommodated.
  • the first conveying mechanism 25a (attachment member conveying mechanism 107) takes out the new holding plate M1 of the second holding mechanism 6 from the plate accommodating portion 24 and moves the holding table 141, which is the temporary placing portion 27, to the raised position. , and the holding plate M1 is lowered and placed thereon.
  • the second holding mechanism 6 is moved to the holding table 141 by the transfer moving mechanism 7, the holding base portion M2 is lowered, and the new holding plate M1 placed on the holding table 141 is attached.
  • the fixing cylinder portion 262 provided in the holding base portion M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transportation moving mechanism 7 .
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the second holding mechanism 6. As shown in FIG.
  • the holding plate M1 of the second holding mechanism 6 serving as the second transport mechanism 25b and the holding plate M1 of the holding table 141 are removed in advance.
  • the holding plate M1 of the holding table 141 is removed in advance.
  • replacement of the transfer table 5, the holding table 141, the cutting tables 2A and 2B, and the holding plate M1 of the second holding mechanism 6 may be performed as a series of operations.
  • the transfer table 5, the holding table 141, the second holding mechanism 6, and the holding plates M1 of the cutting tables 2A and 2B are removed in this order, and then the cutting tables 2A and 2B, the second holding mechanism 6, and the holding table are removed.
  • 141 and the holding plate M1 of the transfer table 5 may be attached in this order.
  • the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate in the plate accommodating portion 24 is Since the plate transport mechanism 25 transports M1 to the holding base portion M2, the holding plate M1 can be automatically replaced with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the second embodiment, the effects produced by the same configuration as in the first embodiment are the same.
  • the plate conveying mechanism 25 can convey the pasting member 101 to the mounting table 102, there is no need to provide a conveying mechanism for the pasting member separately from the plate conveying mechanism 25.
  • the device configuration of the cutting device 100 to be housed can be simplified. Furthermore, equipment costs can also be reduced.
  • a post-process such as a sputtering process or a mounting process is performed on a plurality of products P
  • the sticking member 101 to which the plurality of products P are stuck can be moved, thereby facilitating handling. can be done.
  • the plate transport mechanism 25 includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, and a holding mechanism 25a that transports the holding plate M1 between the temporary placement portion 27 and the holding base portion M2. Since it has the second transport mechanism 25b for transporting the plate M1, the degree of freedom of the transport destination of the holding plate M1 can be increased compared to the case where the plate transport mechanism 25 is composed of one transport mechanism.
  • the first conveying mechanism 25a is configured using the pasting member conveying mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072), the device configuration can be simplified and the device cost can be reduced.
  • the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, the device configuration can be simplified and the device cost can be reduced.
  • the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the conveying holding mechanism (second holding mechanism 6) are Although it was configured to be replaced automatically, at least one of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the holding mechanism for transportation (second holding mechanism 6) It is good also as a structure which exchanges automatically.
  • the plate conveying mechanism 25 of the second embodiment has the first conveying mechanism 25a and the second conveying mechanism 25b, it may have a single conveying mechanism. Further, the plate conveying mechanism 25 may be configured without using the pasting member conveying mechanism 107, or may be configured without using the second holding mechanism 6 and the conveying moving mechanism 7 (processing object conveying mechanism).
  • the plate accommodating portion 24 is placed at a position accessible to the second holding mechanism 6 (for example, the transfer table 5 (index table) and the place where the pasting member 101 is placed).
  • the plate conveying mechanism 25 can be composed of the second holding mechanism 6 and the conveying moving mechanism 7 without using the pasting member conveying mechanism 107 .
  • the plate accommodating portion 24 of the second embodiment accommodates the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the second holding mechanism 6.
  • a plurality of dedicated plate accommodating portions 24 may be provided.
  • FIG. 1 a configuration in which a plurality of (specifically, two) mounting tables 102 are provided has been described, but as shown in FIG. Also good.
  • two guide rails 108A and 108B may be provided on the upper and lower sides of the opening of the adhesive member accommodating section 106.
  • the upper guide rails 108A are configured so that the mutual spacing can be expanded and contracted by an expansion and contraction mechanism (not shown).
  • the interval between the upper guide rails 108A is expanded by the expansion/reduction mechanism (see FIG. 26(b)).
  • the pasting member conveying mechanism 107 descends between the upper guide rails 108A, pulls out the empty pasting member 101 from the pasting member accommodating portion 106, and temporarily places it on the lower guide rail 108B.
  • the pasting member conveying mechanism 107 moves to the mounting table 102 located at the pasting member conveying position X3 and receives the pasted pasted pasted member 101 .
  • the applied member conveying mechanism 107 places the applied applied member 101 on the upper guide rail 108 ⁇ /b>A and pushes the applied member 101 into the applied member accommodating portion 106 .
  • the interval between the upper guide rails 108A is expanded by the expansion/reduction mechanism.
  • the pasting member conveying mechanism 107 descends between the upper guide rails 108A, receives the empty pasting member 101 placed on the lower guide rail 108B, and conveys it to the placing table 102.
  • the configuration has two pasting conveying mechanisms 103 , but a configuration having one pasting conveying mechanism 103 may be employed.
  • the first imaging unit 201 is common to the two pasting conveying mechanisms 103, the first photographing unit 201 may be provided for each of the two pasting conveying mechanisms 103.
  • the transfer table 5 of the second embodiment is an index table that is temporarily placed before being attached to the sticking member 101, but the transfer table 5 can be used as the holding table 141 of the reversing mechanism 14. good.
  • the cutting device 100 of the third embodiment can accommodate a plurality of products P in a discrete state (also called "bulk accommodation"). is configured as
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W.
  • a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate
  • a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B
  • a plurality of products A second holding mechanism 6 for holding a plurality of products P to transport P from the cutting tables 2A and 2B to the storage box 111, and a common transfer for moving the first holding mechanism 3 and the second holding mechanism 6.
  • a transfer movement mechanism 7 having a shaft 71 and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 with respect to the sealed substrate W held by the cutting tables 2A and 2B.
  • the second holding mechanism 6 of the third embodiment holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A, 2B to the drying table 112 or storage box 111. It is something to do.
  • the second holding mechanism 6, as shown in FIG. 8, has the same configuration as in the first and second embodiments. Then, the suction head 61 is moved to a desired position by a transport movement mechanism 7 or the like, which will be described later, so that the plurality of products P are transported from the cutting tables 2A and 2B to the drying table 112. to the storage box 111.
  • the transport moving mechanism 7 of the third embodiment moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6. are moved at least between the cutting tables 2A and 2B and the storage box 111. As shown in FIG. 27, the transport moving mechanism 7 of the third embodiment moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6. are moved at least between the cutting tables 2A and 2B and the storage box 111. As shown in FIG.
  • the transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the storage box 111 ( See Figure 27).
  • a storage box 111 and a drying table 112, which will be described later, are also provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the guide rail 721 of the main moving mechanism 72 extends straight in the X direction along the transfer shaft 71, and similarly to the transfer shaft 71, the first holding mechanism 3 is positioned at the substrate supply portion 11b of the substrate supply mechanism 11. While being able to move upward, the second holding mechanism 6 is provided within a range capable of moving upward of the storage box 111 .
  • the cutting device 100 of the third embodiment has a function of further drying the multiple products P cleaned by the second cleaning mechanism 19 .
  • the cutting apparatus 100 includes a drying table 112 for drying a plurality of products P and a drying table 112 for drying the plurality of products P placed on the drying table 112.
  • a mechanism 113 and a drying moving mechanism 114 for moving the drying mechanism 113 along the drying table 112 are provided.
  • a plurality of products P are transported and placed on the drying table 112 by the second holding mechanism 6 and transport moving mechanism 7 .
  • This drying table 112 holds a plurality of products P by suction.
  • the drying table 112 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane.
  • the drying table 112 of this embodiment has a rectangular shape in a plan view, but may have another shape.
  • the drying mechanism 113 jets compressed air, which is a gas, from above the drying table 112 to dry the plurality of products P adsorbed and held on the drying table 112 .
  • This drying mechanism 113 has an injection nozzle 113a for injecting compressed air onto the plurality of products P held on the drying table 112 .
  • the injection nozzle 113a of this embodiment has a linearly extending slit-shaped opening facing the drying table 112 (see FIG. 28). It may have a plurality of openings that are aligned with each other.
  • the drying mechanism 113 of this embodiment is configured to inject compressed air in the moving direction of the drying movement mechanism 114 (see FIG. 28).
  • the direction in which the compressed air is jetted by the jet nozzle 113a is directed to the movement direction of the drying movement mechanism 114 (here, from the front side to the back side in the Y direction).
  • the jet nozzle 113a of the drying mechanism 113 is inclined at, for example, less than 30 degrees with respect to the arrangement direction of the plurality of products P held on the drying table 112 along the X direction. are placed.
  • a plurality of products P are arranged in a matrix in the X direction and the Y direction.
  • the compressed air is injected at an angle. This makes it easy to blow off the water remaining between the adjacent products P from the products P. Thereby, the drying of the plurality of products P is promoted.
  • the slit-shaped opening of the injection nozzle 113a of the drying mechanism 113 may be provided so as to be slightly inclined toward the drying table 112 so that the compressed air is blown away in the moving direction of the drying mechanism 113.
  • the drying movement mechanism 114 moves the drying mechanism 113 above the drying table 112 in the Y direction.
  • the drying movement mechanism 114 of this embodiment reciprocates the drying mechanism 113 in the Y direction with respect to the drying table 112 .
  • the drying movement mechanism 114 includes a Y-direction guide rail 1141 extending in the Y-direction and a slide that moves along the Y-direction guide rail 1141 and holds the drying mechanism 113. It has a member 1142 and a drive section (not shown) that moves the slide member 1142 along the Y-direction guide rail 1141 .
  • the drive unit may be, for example, one using a ball screw mechanism, one using an air cylinder, or one using a linear motor.
  • the drying moving mechanism 114 moves the drying mechanism 113 to one side of the drying table 112 in the Y direction ( For example, it is retracted to the front side). Then, when a plurality of products P are placed and held on the drying table 112, the drying mechanism 113 starts jetting compressed air, and the drying moving mechanism 114 moves the drying mechanism 113 to the other side in the Y direction (for example, back). As a result, the plurality of products P held on the drying table 112 are dried. When the drying movement mechanism 114 moves the drying mechanism 113 from the other side in the Y direction (back side) to the one side in the Y direction (front side), the drying mechanism 113 stops jetting the gas. Note that the drying mechanism 113 may be configured to jet compressed air not only on the outward path but also on the return path.
  • the storage box 111 stores a plurality of products P in a discrete state (so-called bulk storage).
  • the storage box 111 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane.
  • This storage box 111 further includes a scraping member 115 that scrapes off the plurality of products P from the second holding mechanism 6 .
  • the storage box 111 has a rectangular upper opening 111X in plan view (see FIG. 28).
  • the scraping member 115 is fixed to one side of the upper opening 111X of the storage box 111 .
  • the product P is scraped off and dropped to be stored in the storage box 111 .
  • the storage box 111 of the present embodiment is provided between the drying table 112 and a plate storage portion 24 that stores a holding plate M1, which will be described later, in the X direction. is provided on one side of the drying table 112 side of the upper opening 111X. As a result, the second holding mechanism 6 does not interfere with the plate accommodating portion 24 when the product P is scraped off.
  • the scraping member 115 extends upward from one side of the upper opening 111X on the drying table 112 side (see FIG. 29). Further, the scraping member 115 may be any member as long as it scrapes off the product P that does not separate from the second holding mechanism 6 that has been released from suction. It may be in the shape of a flat plate.
  • the storage box 111 is arranged on the front side of the transfer shaft 71, and a handle 1111 (see FIG. 28) is provided on the outer surface of the storage box 111 on the front side. It is designed so that it can be removed from the With this configuration, it is possible to improve maintainability such as taking out and recovering the product P.
  • the direction in which the storage box 111 is taken out is not limited to the front side.
  • FIG. 30 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 100.
  • the operation of the cutting device 100 for example, transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, drying the product P, scraping off the product P, etc. , all operations and controls are performed by the controller CTL (see FIG. 27).
  • the operations from transporting the sealed substrate W, cutting the sealed substrate W, and cleaning the product P are the same as in the first embodiment.
  • the transfer mechanism 7 moves the second holding mechanism 6 to the drying table 112, the second holding mechanism 6 releases the suction holding, and the plurality of products P are moved to the drying table 112. It is placed on the table 112 .
  • the drying table 112 holds the sealed substrate W by suction.
  • the transport moving mechanism 7 retracts the second holding mechanism 6 to a position that does not interfere with the movement of the drying mechanism 113 .
  • the drying movement mechanism 114 reciprocates the drying mechanism 113 in the Y direction, and the drying mechanism 113 jets compressed air, thereby drying the plurality of products P.
  • the number of reciprocations of the drying mechanism 113 by the drying movement mechanism 114 can be set as appropriate, and may be one time or a plurality of times.
  • the transfer mechanism 7 moves the second holding mechanism 6 to the drying table 112, and the second holding mechanism 6 holds the plurality of products P from the drying table 112 by suction. After that, the transportation moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the storage box 111 .
  • the second holding mechanism 6 releases suction holding of the plurality of products P above the upper opening 111X of the storage box 111 .
  • the transfer mechanism 7 moves the second holding mechanism 6 to the scraping member 115 so that the product P remaining on the second holding mechanism 6 without falling from the second holding mechanism 6 hits the scraping member 115 . relative to the drying table 112 side.
  • the second holding mechanism 6 in order to reliably scrape off the product P, is moved with respect to the scraping member 115 so that the scraping member 115 contacts the lower surface, which is the suction surface of the second holding mechanism 6 . Let As a result, a plurality of products P are dropped and stored in the storage box 111 .
  • the cutting apparatus 100 of the third embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, as in the first and second embodiments.
  • the cutting tables 2A and 2B, the drying table 112 and the second holding mechanism 6 have the holding plate M1 and the holding base portion M2.
  • the specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
  • the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2.
  • a plate transport mechanism 25 is provided.
  • the cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
  • the plate conveying mechanism 25 of the third embodiment is configured using the second holding mechanism 6 and the conveying moving mechanism 7, and can convey a plurality of products P.
  • the second holding mechanism 6 and the transport moving mechanism 7 have the function of transporting the holding plate M1.
  • the plate transport mechanism 25 is configured to move in the X direction by the common transfer shaft 71 described above.
  • the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the second holding mechanism 6 that constitutes the plate conveying mechanism 25 is a conveying cylinder that is inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1. It has a portion 282 (see FIG. 13).
  • the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
  • the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
  • the holding plates of the cutting tables 2A and 2B or the drying table 112 are exchanged.
  • the plate transport mechanism 25 (transport moving mechanism 7 and second holding mechanism 6) takes out new holding plates M1 of the cutting tables 2A and 2B from the plate housing section 24, and holds the cutting tables 2A and 2B. It is conveyed to the base portion M2 in the raised position, and the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
  • the plate conveying mechanism 25 takes out the new holding plate M1 of the drying table 112 from the plate accommodating portion 24, and places it on the holding base portion M2 of the drying table 112.
  • the substrate is transported in the raised position, and the holding plate M1 is lowered and placed.
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the drying table 112. As shown in FIG.
  • the exchange of the holding plate M1 of the second holding mechanism 6, the cutting tables 2A and 2B, and the drying table 112 is a series of operations.
  • the holding plate M1 on at least one of the drying tables 112 may be exchanged individually.
  • the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and Since the plate conveying mechanism 25 that conveys the holding plate M1 to the holding base portion M2 is provided, the holding plate M1 can be automatically exchanged with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the third embodiment, the effects produced by the same configuration as in the first and second embodiments are the same.
  • the plate transport mechanism 25 can transport a plurality of products P to the storage box 111, there is no need to provide a product transport mechanism separate from the plate transport mechanism 25, and bulk storage can be performed.
  • the device configuration of the cutting device 100 can be simplified. Furthermore, equipment costs can also be reduced.
  • the size of the storage space can be reduced as compared with the conventional tray storage structure. This also allows the footprint of the cutting device 100 to be reduced.
  • the holding plates M1 of the cutting tables 2A and 2B, the drying table 112, and the holding mechanism (second holding mechanism 6) are automatically exchanged. At least one of 2A, 2B, drying table 112, and holding mechanism (second holding mechanism 6) may be automatically replaced.
  • the plate transport mechanism 25 of the third embodiment may be configured without using the second holding mechanism 6 and transport moving mechanism 7 .
  • the plate accommodating portion 24 of the third embodiment accommodates the holding plates M1 of the cutting tables 2A and 2B, the drying table 112, and the holding mechanism (second holding mechanism 6).
  • a plurality of dedicated plate accommodating portions 24 may be provided according to the type of holding plate M1.
  • the second holding mechanism 6 may jet gas to drop the plurality of products P. can.
  • the scraping member 115 may be fixed to another member, or the scraping member 115 may be configured to be movable so as to be attached to the second holding mechanism 6. A plurality of products P may be scraped off by moving the scraping member 115 .
  • the cutting device 100 of the fourth embodiment accommodates a plurality of products P in a cylindrical container 116 (also called “tube accommodation”).
  • a cylindrical container 116 may be called a tube, magazine stick, stick magazine, stick, or the like.
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and the sealed substrate W on the cutting tables 2A and 2B.
  • a first holding mechanism 3 that holds the sealed substrate W for transportation
  • a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products P a transfer table 5 to which the are transferred
  • a second holding mechanism 6 for holding a plurality of products P in order to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5
  • a transfer moving mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held by the cutting tables 2A and 2B.
  • a moving mechanism (processing moving mechanism) 8 is provided.
  • a plurality of products P are temporarily placed on the transfer table 5 of the present embodiment before the plurality of products P are accommodated in a cylindrical container 116, which will be described later.
  • the transfer table 5 is provided so as to be movable along the Y direction.
  • the storage mechanism 118 moves between the pick-up position X2 where a plurality of products P are transported.
  • the transfer position X1 is set on the front side of the transfer shaft 71, and is a position where the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. is set on the back side of the transfer shaft 71 .
  • the cutting apparatus 100 of the present embodiment includes a container setting portion 117 in which a cylindrical container 116 containing a plurality of products P from one end opening 116x is set, and a plurality of products P.
  • a transfer/accommodation mechanism 118 is provided for conveying P from the transfer table 5 to a cylindrical container 116 installed in the container installation portion 117 and accommodating the same.
  • the empty cylindrical container 116 in which the product P is not stored is installed in the container setting part 117, and the product P is inserted from one end opening 116x of the cylindrical container 116 by the transporting/receiving mechanism 118.
  • the container installation unit 117 of the present embodiment includes an empty container storage unit 117a that stores an empty cylindrical container 116, and an empty cylindrical container 116 that is sent out from the empty container storage unit 117a. , an insertion position setting portion 117b for setting an empty cylindrical container 116 at an insertion position where the products P are inserted from one end opening 116x, and a filled cylinder filled with the products P or containing a desired number of products P. and a stored container storage portion 117c that stores the shaped container 116 therein.
  • the cylindrical container 116 accommodates a plurality of products P in a row.
  • the cylindrical container 116 has a shape extending linearly and has a space for accommodating the product P therein.
  • the cross-sectional shape of the cylindrical container 116 orthogonal to the longitudinal direction is a shape corresponding to the cross-sectional shape of the product P.
  • the cylindrical container 116 shown in FIG. 34 has a configuration in which a part of the side peripheral wall extending along the longitudinal direction is open, but the configuration may be such that the side peripheral wall is closed.
  • the cylindrical container 116 may have a configuration in which a plurality of products P are arranged in a row, or a configuration in which a plurality of products P are arranged in a plurality of rows. Furthermore, the cylindrical container 116 may be made of resin or may be made of metal. Also, although FIG. 34 shows a form in which the product P has leads, it may be of a non-lead type such as QFN.
  • the transport/accommodation mechanism 118 includes an intermediate table 119 on which a plurality of products P are temporarily placed, and a transfer table 5 located at the pick-up position X2 for transferring the plurality of products P to the intermediate table. 119, and a second product transport mechanism that transports a plurality of products P from the intermediate table 119 to the cylindrical container 116 installed in the insertion position installation portion 117b of the container installation portion 117 and accommodates them therein. 121.
  • the intermediate table 119 temporarily places the product P transported by the first product transport mechanism 120 from the transfer table 5 at the take-out position X2.
  • the product P temporarily placed on the intermediate table 119 is transported by the second product transport mechanism 121 to the cylindrical container 116 placed on the container placement section 117 .
  • the intermediate table 119 of this embodiment is fixed in the X and Y directions, it may be configured to be movable.
  • the first product transport mechanism 120 transports a predetermined number (for example, one) of a plurality of products P to the intermediate table 119 from the transfer table 5 moved to the take-out position X2.
  • the first product transport mechanism 120 includes a product suction mechanism 1201 that suctions a predetermined number (for example, one) of a plurality of products P held on the transfer table 5, and a product suction mechanism 1201 that and a moving mechanism 1202 for adsorption that moves the mechanism 1201 along the X direction.
  • a product suction mechanism 1201 that suctions a predetermined number (for example, one) of a plurality of products P held on the transfer table 5
  • a product suction mechanism 1201 that and a moving mechanism 1202 for adsorption that moves the mechanism 1201 along the X direction.
  • the product suction mechanism 1201 includes a suction head 1201A provided with a suction portion 1201a for sucking and holding a plurality of products P, and a vacuum pump or vacuum pump connected to the suction portion 1201a of the suction head 1201A. and a vacuum ejector (not shown).
  • the product adsorption mechanism 1201 is configured such that each adsorption portion 1201a adsorbs one product P.
  • the plurality of suction units 1201a are configured to be able to move up and down independently of each other, and each suction unit 1201a can be lowered to suck the product P individually.
  • An imaging camera 203 for confirming the state of the product P to be sucked is provided below the first product transport mechanism 120 .
  • the suction moving mechanism 1202 includes an X-direction moving portion 1202a for moving the product suction mechanism 1201 in the X direction and a Z-direction moving portion 1202b for moving the product suction mechanism 1201 in the Z direction.
  • the suction moving mechanism 1202 may have a Y-direction moving unit that moves the product suction mechanism 1201 in the Y direction.
  • the X-direction moving portion 1202a moves along an X-direction guide rail 1202a1 provided along the X direction on the back side of the transfer shaft 71, and moves along the X-direction guide rail 1202a1, and moves through the Z-direction moving portion 1202b. and a support 1202 a 2 that supports the product suction mechanism 1201 .
  • the support 1202a2 is linearly reciprocated along the X direction on the X direction guide rail 1202a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servomotor.
  • the support 1202a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Z-direction moving portion 1202b includes a Z-direction guide rail 1202b1 provided along the Z-direction on the support 1202a2, and a Z-direction slider 1202b2 that moves along the Z-direction guide rail 1202b1 and supports the product suction mechanism 1201. have.
  • the Z-direction slider 1202b2 linearly reciprocates along the Z-direction on the Z-direction guide rail 1202b1 by, for example, a ball screw mechanism (not shown) extending in the Z-direction.
  • the Z-direction slider 1202b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the second product transport mechanism 121 transports the product P placed on the intermediate table 119 to the cylindrical container 116 placed on the insertion position setting portion 117b of the container setting portion 117. , the product P is inserted from one end opening 116x of the cylindrical container 116 and accommodated therein.
  • the second product transport mechanism 121 includes a pressing member 121a that presses the product P placed on the intermediate table 119, and a drive unit 121b that moves the pressing member 121a along the Y direction.
  • the drive unit 121b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the second product transport mechanism 121 may have a product guide portion that guides the product P to the one end opening portion 116x of the cylindrical container 116 .
  • a mechanism for lifting and lowering the pressing member 121a may be provided.
  • FIG. 9 ⁇ Example of operation of cutting device>
  • all the operations of the cutting apparatus 100 such as transport of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, cleaning of the product P, accommodation of the product P in the tube, etc. Control is performed by the controller CTL (see FIG. 33).
  • the operations from transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, and inspecting the product P are the same as in the first embodiment. is.
  • the product P is transferred from the reversing mechanism 14 to the transfer table 5 .
  • the transfer table 5 on which a plurality of products P are placed moves to the pick-up position X2 (see FIGS. 33 and 35).
  • an empty cylindrical container 116 is installed in the insertion position installation portion 117b of the container installation portion 117 (see FIGS. 32 and 34).
  • the first product transport mechanism 120 sucks and holds the product P from the transfer table 5 located at the pick-up position X2. After that, the first product transport mechanism 120 moves the product P to the intermediate table 119 , releases the product P from the suction holding, and places the product P on the intermediate table 119 .
  • the product P placed on the intermediate table 119 is inserted into the cylindrical container 116 and accommodated by the second product transport mechanism 121 .
  • the stored cylindrical container 116 in the insertion position setting portion 117b is While being moved to the container accommodating portion 117c, the empty cylindrical container 116 is delivered from the empty container accommodating portion 117a and installed in the insertion position setting portion 117b.
  • the cutting apparatus 100 of the fourth embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, like the first embodiment.
  • the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6 each have a holding plate M1 and a holding base portion M2. ing.
  • the specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
  • the cutting apparatus 100 includes a plate accommodating portion 24 that accommodates the holding plate M1, and a plate accommodating portion 24 that holds the holding plate M1, as shown in FIGS.
  • a plate conveying mechanism 25 for conveying between the base portions M2 is provided.
  • the cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
  • the plate conveying mechanism 25 of the fourth embodiment is configured using the second holding mechanism 6 and the conveying moving mechanism 7, and can convey a plurality of products P.
  • the second holding mechanism 6 and the transport moving mechanism 7 have the function of transporting the holding plate M1.
  • the plate transport mechanism 25 is configured to move in the X direction by the common transfer shaft 71 described above.
  • the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the second holding mechanism 6 that constitutes the plate conveying mechanism 25 is a conveying cylinder that is inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1. It has a portion 282 (see FIG. 13).
  • the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
  • the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
  • the holding plates of the cutting tables 2A and 2B or the holding table 141 are exchanged.
  • the plate transport mechanism 25 (transport moving mechanism 7 and second holding mechanism 6) takes out new holding plates M1 of the cutting tables 2A and 2B from the plate housing section 24, and holds the cutting tables 2A and 2B. It is conveyed to the base portion M2 in the raised position, and the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
  • the plate conveying mechanism 25 takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24, and moves it to the holding base portion M2 of the holding table 141 at the raised position.
  • the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projected position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
  • the plate transport mechanism 25 (the transport moving mechanism 7 and the second holding mechanism 6) takes out the new holding plate M1 of the transfer table 5 from the plate accommodating part 24, and puts it on the holding base part M2 of the transfer table 5.
  • the substrate is transported in the raised position, and the holding plate M1 is lowered and placed.
  • the fixing cylinder portion 262 when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
  • the order of the replacement operation of the holding plates M1 of the cutting tables 2A and 2B, the replacement operation of the holding plates M1 of the holding table 141, and the replacement operation of the holding plates M1 of the transfer table 5 can be changed as appropriate. be. Also, the holding plate M1 is removed from the holding base portion M2 of the cutting tables 2A and 2B, the holding table 141 and the transfer table 5, and then the holding bases of the cutting tables 2A and 2B, the holding table 141 and the transfer table 5 are removed. A new retaining plate M1 can also be attached to the portion M2.
  • the exchange of the second holding mechanism 6, the cutting tables 2A and 2B, the holding table 141, and the holding plate M1 of the transfer table 5 is a series of operations.
  • the holding plate M1 in at least one of 2A, 2B, the holding table 141, or the transfer table 5 may be exchanged individually.
  • the holding plate M1 of the second holding mechanism 6 constituting the plate transport mechanism 25 is removed in advance. can be considered.
  • the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate M1 in the plate accommodating portion 24 is transported. Since the plate transport mechanism 25 transports the holding plate M1 to the holding base portion M2, the holding plate M1 can be automatically replaced with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the fourth embodiment, the effects produced by the same configuration as in the first to third embodiments are the same.
  • the plurality of products P are transported from the transfer table 5 to the cylindrical container 116 installed in the container installation section 117 by the transporting/storage mechanism 118, and the cylindrical container 116 is A plurality of products P can be accommodated from one end opening 116x of 116 .
  • the plate conveying mechanism 25 is configured using the second holding mechanism 6 and the conveying moving mechanism 7, so that the device configuration can be simplified and the device cost can be reduced. .
  • the container installation portion 117 is provided on the back side of the transfer shaft 71 , but may be provided on the front side of the transfer shaft 71 .
  • cylindrical container 116 installed in the container installation portion 117 may be provided along the Y direction instead of the X direction, or may be provided along another direction. Also good.
  • a twin-cut table system and a twin-spindle configuration cutting device have been described. It may be a cutting device having a twin-spindle configuration.
  • the cutting device (processing device) 100 can be connected between the second cleaning mechanism 19 and the inspection unit 13 or the drying table 112. It can be a modular configuration that can be separated and connected (detachable) between them. In this case, for example, between the module on the side of the second cleaning mechanism 19 and the module on the side of the inspection section 13 or the module on the side of the drying table 112, a module that performs a different type of inspection from that of the inspection section 13 may be provided. can be added.
  • the cutting device (processing device) 100 may have a module configuration that can be separated and connected (detachable) at any point, and the modules to be added may be modules with various functions other than inspection. .
  • processing apparatus of the present invention may perform processing other than cutting, and may perform other mechanical processing such as cutting and grinding.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Turning (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
PCT/JP2021/035885 2021-03-18 2021-09-29 加工装置、及び加工品の製造方法 WO2022195931A1 (ja)

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Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06135546A (ja) * 1992-10-29 1994-05-17 Oki Electric Ind Co Ltd Ｉｃパッケージの飛び出し防止機構
JP2003266263A (ja) * 2003-04-14 2003-09-24 Kosmek Ltd データム機能付きクランプ装置
JP2008511164A (ja) * 2004-08-23 2008-04-10 ロッコ・システムズ・プライベイト・リミテッド 集積回路ダイシング装置のチャック用供給機構
JP2010118376A (ja) * 2008-11-11 2010-05-27 Disco Abrasive Syst Ltd 搬送機構
WO2010137072A1 (ja) * 2009-05-27 2010-12-02 上野精機株式会社 分類装置
JP2014138011A (ja) * 2013-01-15 2014-07-28 Tokyo Electron Ltd 基板収納処理装置及び基板収納処理方法並びに基板収納処理用記憶媒体
JP2015033729A (ja) * 2013-08-08 2015-02-19 パスカルエンジニアリング株式会社 クランプ装置
JP2015188024A (ja) * 2014-03-27 2015-10-29 Ｔｏｗａ株式会社 検査用治具、切断装置及び切断方法
JP2016054256A (ja) * 2014-09-04 2016-04-14 Ｔｏｗａ株式会社 切断装置並びに吸着機構及びこれを用いる装置
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP2019051645A (ja) * 2017-09-15 2019-04-04 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JP2019202353A (ja) * 2018-05-21 2019-11-28 株式会社ディスコ 切削装置
KR102138003B1 (ko) * 2019-09-09 2020-07-27 제너셈(주) 컨버전 키트 자동 교환 시스템
KR102146784B1 (ko) * 2019-06-18 2020-08-21 제너셈(주) 대상체 공급 방법
KR102167500B1 (ko) * 2019-09-09 2020-10-19 제너셈(주) 흡착 모듈

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
JP6430170B2 (ja) 2014-08-12 2018-11-28 Ｔｏｗａ株式会社 切断装置及び切断方法並びに吸着機構及びこれを用いる装置

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06135546A (ja) * 1992-10-29 1994-05-17 Oki Electric Ind Co Ltd Ｉｃパッケージの飛び出し防止機構
JP2003266263A (ja) * 2003-04-14 2003-09-24 Kosmek Ltd データム機能付きクランプ装置
JP2008511164A (ja) * 2004-08-23 2008-04-10 ロッコ・システムズ・プライベイト・リミテッド 集積回路ダイシング装置のチャック用供給機構
JP2010118376A (ja) * 2008-11-11 2010-05-27 Disco Abrasive Syst Ltd 搬送機構
WO2010137072A1 (ja) * 2009-05-27 2010-12-02 上野精機株式会社 分類装置
JP2014138011A (ja) * 2013-01-15 2014-07-28 Tokyo Electron Ltd 基板収納処理装置及び基板収納処理方法並びに基板収納処理用記憶媒体
JP2015033729A (ja) * 2013-08-08 2015-02-19 パスカルエンジニアリング株式会社 クランプ装置
JP2015188024A (ja) * 2014-03-27 2015-10-29 Ｔｏｗａ株式会社 検査用治具、切断装置及び切断方法
JP2016054256A (ja) * 2014-09-04 2016-04-14 Ｔｏｗａ株式会社 切断装置並びに吸着機構及びこれを用いる装置
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP2019051645A (ja) * 2017-09-15 2019-04-04 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JP2019202353A (ja) * 2018-05-21 2019-11-28 株式会社ディスコ 切削装置
KR102146784B1 (ko) * 2019-06-18 2020-08-21 제너셈(주) 대상체 공급 방법
KR102138003B1 (ko) * 2019-09-09 2020-07-27 제너셈(주) 컨버전 키트 자동 교환 시스템
KR102167500B1 (ko) * 2019-09-09 2020-10-19 제너셈(주) 흡착 모듈

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TWI785840B (zh) 2022-12-01

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