WO2022195800A1 - Procédé de montage de pièce électronique et dispositif de montage de pièce électronique - Google Patents

Procédé de montage de pièce électronique et dispositif de montage de pièce électronique Download PDF

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Publication number
WO2022195800A1
WO2022195800A1 PCT/JP2021/011050 JP2021011050W WO2022195800A1 WO 2022195800 A1 WO2022195800 A1 WO 2022195800A1 JP 2021011050 W JP2021011050 W JP 2021011050W WO 2022195800 A1 WO2022195800 A1 WO 2022195800A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
conductive paste
conductive fluid
resin
curing
Prior art date
Application number
PCT/JP2021/011050
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English (en)
Japanese (ja)
Inventor
亮二郎 富永
謙磁 塚田
良崇 橋本
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to JP2023506622A priority Critical patent/JPWO2022195800A1/ja
Priority to PCT/JP2021/011050 priority patent/WO2022195800A1/fr
Publication of WO2022195800A1 publication Critical patent/WO2022195800A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Definitions

  • the present invention relates to an electronic component mounting method, etc., in which a conductive fluid is applied to metal wiring arranged on a resin layer, and an electrode is brought into contact with the conductive fluid to mount an electronic component.
  • the purpose of this specification is to properly mount electronic components so that they are electrically connected to metal wiring.
  • the present specification provides a step of applying a conductive fluid to a position where an electrode of a first electronic component is to be mounted in a metal wiring arranged on a resin layer; a first curing step of curing a conductive fluid; applying a conductive fluid to a position where a component body of the first electronic component is to be mounted on the resin layer; and metal wiring arranged on the resin layer.
  • a method for mounting an electronic component comprising:
  • the present specification includes a coating device for coating a conductive fluid, a curing device for curing the conductive fluid coated by the coating device, a mounting device for mounting an electronic component, and a control device.
  • the control device comprises a step of applying a conductive fluid to a position where an electrode of a first electronic component is to be mounted on a metal wiring arranged on a resin layer, and a first step of curing the applied conductive fluid.
  • a curing step in which a conductive fluid is applied to a position where the component body of the first electronic component is to be mounted on the resin layer, and a second electronic component is applied to the metal wiring arranged on the resin layer.
  • a step of applying a conductive fluid to a position where an electrode is to be mounted bringing the electrode of the first electronic component into contact with the conductive fluid hardened in the first hardening step; a step of placing the first electronic component by bringing the component body of the first electronic component into contact with the conductive fluid applied to the scheduled mounting position of the second electronic component; and a scheduled mounting position of the electrode of the second electronic component.
  • a component placement apparatus is disclosed.
  • the first electronic component is mounted by bringing the electrode into contact with the hardened conductive fluid and bringing the component body into contact with the unhardened conductive fluid.
  • the second electronic component is mounted with the electrodes in contact with the uncured conductive fluid.
  • FIG. 4 is a cross-sectional view showing a heat-sensitive release film stuck on a base
  • FIG. 4 is a cross-sectional view showing a circuit board on which a resin laminate is formed
  • FIG. 4 is a cross-sectional view showing a circuit board in which wiring is formed on a resin laminate
  • FIG. 4 is a cross-sectional view showing a circuit board in which a resin layered body is further formed on the resin layered body
  • FIG. 2 is a cross-sectional view showing a circuit board with conductive paste applied on wiring
  • FIG. 2 is a cross-sectional view showing a circuit board on which two electronic components are mounted
  • FIG. 4 is a cross-sectional view showing a heat-sensitive release film stuck on a base
  • FIG. 4 is a cross-sectional view showing a circuit board on which a resin laminate is formed
  • FIG. 4 is a cross-sectional view showing a circuit board in which wiring is formed on a resin laminate
  • FIG. 4 is a cross-section
  • FIG. 2 is a cross-sectional view showing a circuit board in which a conductive paste is applied on wiring and a resin laminate;
  • FIG. 2 is a cross-sectional view showing a circuit board on which two electronic components are mounted;
  • FIG. 2 is a cross-sectional view showing a circuit board in which a thermosetting resin is injected between the upper surface of a resin laminate and the lower surface of a component body of an electronic component;
  • FIG. 4 is a cross-sectional view showing the circuit board with the electronic component pressed against the resin laminate;
  • FIG. 4 is a cross-sectional view showing a circuit board on which small electronic components are mounted;
  • FIG. 4 is a cross-sectional view showing a circuit board on which small electronic components are mounted;
  • FIG. 4 is a cross-sectional view showing a circuit board on which small electronic components are mounted;
  • FIG. 2 is a cross-sectional view showing a circuit board on which two electronic components are mounted;
  • FIG. 2 is a cross-sectional view showing a circuit board in which a thermosetting resin is injected between the upper surface of a resin laminate and the lower surface of a component body of an electronic component;
  • FIG. 4 is a cross-sectional view showing the circuit board with the electronic component pressed against the resin laminate;
  • FIG. 4 is a cross-sectional view showing a circuit board in which a conductive paste is applied to positions where electrodes of a large electronic component are to be mounted;
  • FIG. 2 is a cross-sectional view showing a circuit board in a state where a conductive paste is applied to positions where a component body of a large electronic component and an electrode of a small electronic component are to be mounted;
  • the circuit forming apparatus 10 includes a conveying device 20, a first shaping unit 22, a second shaping unit 23, a third shaping unit 24, a fourth shaping unit 25, a compression unit 26, a mounting unit 27, and a control unit. a device (see FIG. 2) 28;
  • the conveying device 20 , the first shaping unit 22 , the second shaping unit 23 , the third shaping unit 24 , the fourth shaping unit 25 , the compression unit 26 and the mounting unit 27 are arranged on the base 29 of the circuit forming device 10 .
  • the base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the lateral direction of the base 29 is the Y-axis direction, and both the X-axis direction and the Y-axis direction are perpendicular to each other.
  • the direction will be referred to as the Z-axis direction for explanation.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32 .
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36 .
  • the X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and by driving the electromagnetic motor 38, the X-axis slider 36 moves to any position in the X-axis direction.
  • the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52 .
  • the Y-axis slide rail 50 is arranged on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36 .
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and by driving the electromagnetic motor 56, the stage 52 moves to any position in the Y-axis direction. As a result, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32 .
  • the stage 52 has a base 60, a holding device 62, an elevating device (see FIG. 2) 64, and a heater (see FIG. 2) 66.
  • the base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface thereof.
  • the holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Both edges of the substrate placed on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held.
  • the lifting device 64 is arranged below the base 60 and lifts the base 60 up and down.
  • a heater 66 is built in the base 60 and heats the substrate placed on the base 60 to an arbitrary temperature.
  • the first shaping unit 22 is a unit that shapes the wiring of the circuit board, and has a first printing section 72 and a baking section 74 .
  • the first printing unit 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 linearly ejects the metal ink.
  • the metal ink is prepared by dispersing nanometer-sized metal particles such as silver particles in a solvent. The surfaces of the fine metal particles are coated with a dispersant to prevent aggregation in the solvent.
  • the inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using piezoelectric elements.
  • the baking unit 74 has an infrared irradiation device (see FIG. 2) 78.
  • the infrared irradiation device 78 is a device for irradiating the ejected metal ink with infrared rays, and the metal ink irradiated with the infrared rays is baked to form wiring.
  • Baking metal ink means that the solvent is vaporized and the protective film of the metal fine particles, that is, the dispersing agent is decomposed, by applying energy, and the metal fine particles come into contact or fuse to become conductive. This is a phenomenon in which the rate increases. Then, by baking the metal ink, a metal wiring is formed.
  • the second molding unit 23 is a unit for molding the resin layer of the circuit board, and has a second printing section 84 and a curing section 86 .
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 ejects ultraviolet curable resin.
  • An ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be, for example, a piezo system using piezoelectric elements, or a thermal system in which resin is heated to generate bubbles and ejected from a plurality of nozzles.
  • the curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the upper surface of the ultraviolet curable resin ejected by the inkjet head 88. For example, the surface of the ultraviolet curable resin is leveled and the surplus resin is scraped off with a roller or a blade. to make the thickness of the UV curable resin uniform.
  • the irradiation device 92 has a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curable resin with ultraviolet rays. As a result, the discharged ultraviolet curable resin is cured to form a resin layer.
  • the third molding unit 24 is a unit for molding the connecting portion between the electrodes of the electronic component and the wiring on the circuit board, and has the third printing portion 100 .
  • the third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 ejects the conductive paste.
  • the conductive paste is made by dispersing micrometer-sized metal particles in a resin that hardens when heated at a relatively low temperature. Incidentally, the metal particles are in the form of flakes, and the viscosity of the conductive paste is relatively higher than that of the metal ink.
  • the discharge amount of the conductive paste by the dispenser 106 is controlled by the inner diameter of the needle, the discharge pressure, and the discharge time.
  • the conductive paste discharged by the dispenser 106 is heated by the heater 66 built in the base 60, and the resin in the heated conductive paste is cured.
  • the resin hardens and shrinks, and the flake-like metal particles dispersed in the resin come into contact with each other. Thereby, the conductive paste exhibits conductivity.
  • the resin of the conductive paste is an organic adhesive, and exhibits adhesive strength when cured by heating.
  • the fourth molding unit 25 is a unit for molding resin for fixing electronic components to circuit boards, and has a fourth printing unit 110 .
  • the fourth printing unit 110 has a dispenser (see FIG. 2) 116, and the dispenser 116 dispenses thermosetting resin.
  • a thermosetting resin is a resin that is cured by heating.
  • the dispenser 116 is, for example, a piezo system using a piezoelectric element. The thermosetting resin discharged by the dispenser 116 is heated by the heater 66 built in the base 60 and hardened.
  • the compression unit 26 is a unit for compressing the circuit board and has a compression section 120 .
  • the compression section 120 has a compression plate (see FIG. 12) 122, a rubber sheet (see FIG. 12) 124, and a cylinder (see FIG. 2) 126.
  • the rubber sheet 124 is made of silicone rubber and has a thick sheet shape.
  • the compression plate 122 is made of steel and has a plate shape.
  • a rubber sheet 124 is attached to the lower surface of the compression plate 122, and the compression plate 122 is pressed against the circuit board by the operation of the cylinder 126. As shown in FIG. As a result, the circuit board is compressed by the compression plate 122 via the rubber sheet 124 .
  • the force for compressing the substrate can be controllably changed.
  • the mounting unit 27 is a unit for mounting electronic components on the circuit board, and has a supply section 130 and a mounting section 132 .
  • the supply unit 130 has a plurality of tape feeders (see FIG. 2) 134 that feed taped electronic components one by one, and supplies the electronic components at the supply position.
  • the supply unit 130 is not limited to the tape feeder 134, and may be a tray-type supply device that picks up and supplies electronic components from a tray.
  • the supply unit 130 may be configured to include both a tape type and a tray type, or other types of supply devices.
  • the mounting unit 132 has a mounting head (see FIG. 2) 136 and a moving device (see FIG. 2) 138.
  • the mounting head 136 has a suction nozzle (not shown) for sucking and holding the electronic component.
  • the suction nozzle is supplied with negative pressure from a positive/negative pressure supply device (not shown), and sucks and holds the electronic component by sucking air. Then, the electronic component is released by supplying a slight positive pressure from the positive/negative pressure supply device.
  • the moving device 138 moves the mounting head 136 between the position where the electronic components are supplied by the tape feeder 134 and the substrate placed on the base 60 .
  • the mounting section 132 the electronic component supplied from the tape feeder 134 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.
  • the control device 28 also includes a controller 140 and a plurality of drive circuits 142, as shown in FIG.
  • the plurality of drive circuits 142 includes the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the heater 66, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispenser 106, It is connected to dispenser 116 , cylinder 126 , tape feeder 134 , mounting head 136 and moving device 138 .
  • the controller 140 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 142 . Accordingly, the controller 140 controls the operations of the conveying device 20 , the first shaping unit 22 , the second shaping unit 23 , the third shaping unit 24 , the fourth shaping unit 25 , the compression unit 26 , and the mounting unit 27 .
  • the resin laminate is formed on the base 60 and wiring is formed on the upper surface of the resin laminate by the above-described configuration. Then, the electrodes of the electronic components are electrically connected to the wiring through the conductive paste, and the electronic components are fixed with resin to form the circuit board.
  • a heat-sensitive release film 150 is first laid as shown in FIG. Since the heat-sensitive peeling film 150 has adhesiveness, it adheres appropriately to the upper surface of the base 60 .
  • a circuit board is formed on the heat-sensitive peeling film 150, and the close contact of the heat-sensitive peeling film 150 to the base 60 prevents displacement of the circuit board during circuit formation. Since the adhesiveness of the heat-sensitive peeling film 150 is reduced by heating, after the circuit board is formed on the heat-sensitive peeling film 150, the heat-sensitive peeling film 150 is heated so that the heat-sensitive peeling film 150 is heated. The heat-sensitive peeling film 150 can be easily peeled off from the base 60 together with the formed circuit board.
  • the stage 52 is moved below the second modeling unit 23. Then, in the second modeling unit 23, a resin laminate 152 is formed on the heat-sensitive peeling film 150, as shown in FIG.
  • the resin layered body 152 is formed by repeating the ejection of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet ray by the irradiation device 92 to the ejected ultraviolet curable resin.
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the upper surface of the heat-sensitive release film 150 .
  • the ultraviolet curable resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curable resin becomes uniform.
  • the irradiation device 92 irradiates the thin film-like ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 153 is formed on the thermal release film 150 .
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin resin layer 153 .
  • the flattening device 90 flattens the thin film of the ultraviolet curable resin
  • the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film with ultraviolet rays, thereby forming a thin film on the resin layer 153 .
  • a thin film resin layer 153 is laminated. In this way, the ejection of the ultraviolet curable resin onto the thin resin layer 153 and the irradiation of ultraviolet rays are repeated, and the resin laminate 152 is formed by stacking a plurality of resin layers 153 .
  • the stage 52 is moved below the first modeling unit 22 .
  • the inkjet head 76 linearly ejects the metal ink 160 onto the upper surface of the resin laminate 152 according to the circuit pattern, as shown in FIG.
  • the infrared irradiation device 78 irradiates the metal ink 160 ejected according to the circuit pattern with infrared rays in the baking section 74 of the first modeling unit 22 .
  • the metal ink 160 is baked and the wiring 162 is formed on the upper surface of the resin laminate 152 .
  • FIG. 5 three wirings 162 are formed, and when distinguishing between the three wirings 162, the wiring on the left side in FIG. 162c, and the wiring on the right side is described as wiring 162c.
  • the inkjet head 88 ejects the ultraviolet curable resin in a thin film so that the ends of the three wirings 162 are exposed.
  • the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curable resin becomes uniform.
  • the irradiation device 92 irradiates the thin film-like ultraviolet curable resin with ultraviolet rays. Thereby, a resin layer 156 is formed on the resin laminate 152 as shown in FIG.
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin only on the upper portion of the resin layer 156 .
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the resin layer 156 so that the ends of the three wirings 162 are exposed.
  • the flattening device 90 flattens the thin film of the ultraviolet curable resin
  • the irradiation device 92 irradiates the thin film of the ultraviolet curable resin with ultraviolet rays, thereby forming the resin layer 156 on the resin layer 156 . are stacked.
  • the discharge of the ultraviolet curable resin onto the resin layer 156 and the irradiation of ultraviolet rays are repeated, and the resin laminate 157 is formed by laminating a plurality of resin layers 156 .
  • a resin layered body 157 is formed on the resin layered body 152 , and a step portion between the resin layered bodies 152 and 157 functions as a cavity 154 .
  • the stage 52 is moved below the third modeling unit 24 . Then, in the third printing unit 100 of the third modeling unit 24, the dispenser 106, as shown in FIG. A conductive paste 166 is dispensed onto the edges.
  • the electronic component When the conductive paste 166 is discharged to the end of the wiring 162 in this manner, the electronic component is placed on the resin laminate 152 so that the electrodes are in contact with the conductive paste 166 in the conventional method. , the conductive paste 166 is heated and cured after the electronic component is placed. Specifically, when the conductive paste 166 is discharged to the end of the wiring 162 , the stage 52 is moved below the mounting unit 27 . In the mounting unit 27 , an electronic component (see FIG. 8) 172 is supplied by the tape feeder 134 and the electronic component 172 is held by the suction nozzle of the mounting head 136 .
  • the electronic component 172 is composed of a component body 176 and two electrodes 178 arranged on the lower surface of the component body 176 .
  • the mounting head 136 is moved by the moving device 138, and the electronic component 172 held by the suction nozzle is placed on the upper surface of the resin laminate 152, as shown in FIG.
  • two electronic components 172 are placed on the upper surface of the resin laminate 152, and the two electronic components 172 have different sizes. Therefore, a small-sized electronic component is described as an electronic component 172a, and a large-sized electronic component is described as an electronic component 172b.
  • the electronic component 172a is placed so that the two electrodes 178 of the electronic component 172a are in contact with the conductive paste 166 discharged to the ends of the two wirings 162a and 162b.
  • the electronic component 172b is placed so that the two electrodes 178 of the electronic component 172b are in contact with the conductive paste 166 discharged to the ends of the two wirings 162b and 162c. Then, when the two electronic components 172a and 172b are placed on the upper surface of the resin laminate 152, the heater 66 incorporated in the base 60 heats the resin laminate 152 at 105 degrees for one hour. As a result, the conductive paste 166 is heated through the resin layered body 152 and hardened, thereby exhibiting conductivity and electrically connecting the electronic component 172 to the wiring.
  • the electronic component 172 is mounted after the conductive paste 166 is discharged onto the wiring 162 and before the conductive paste 166 is cured.
  • the electronic component 172 was mounted so that the electrode 178 was in contact with the conductive paste 166 that was not hardened. Then, the conductive paste 166 in contact with the electrode 178 is heated and cured.
  • the conductive paste loses its conductivity when deformed or stressed during thermal curing. Therefore, if the circuit board is formed by the conventional method, the electrical conductivity between the wiring 162 and the electrode 178 of the electronic component 172 cannot be ensured appropriately.
  • the conductive paste 166 is heated and hardened by the heater 66 in a state where the conductive paste 166 is not deformed and no stress is applied. Thereby, it is possible to prevent a decrease in conductivity when the conductive paste 166 is cured.
  • the dispenser 106 in the third printing unit 100 moves the bottom surface of the cavity 154 between the wirings 162a and 162b, that is, the top surface of the resin laminate 152, as shown in FIG. Then, the conductive paste 170 is discharged onto the upper surface of the resin laminate 152 between the wiring 162b and the wiring 162c. Then, when the conductive paste 170 is discharged onto the upper surface of the resin laminate 152, the stage 52 is moved below the mounting unit 27 while the conductive paste 170 is not heated and is in an uncured state. That is, the conductive paste 166 discharged onto the wiring 162 is heated and cured, but the conductive paste 170 discharged onto the resin layered body 152 is not heated and is in an uncured state. It is moved below the mounting unit 27 .
  • the tape feeder 134 supplies the electronic components 172a and 172b. is placed on Specifically, as shown in FIG. 10, the electronic component 172a is placed so that the electrodes 178 are in contact with the conductive paste 166 in a hardened state on the wirings 162a and 162b. At this time, the component body 176 of the electronic component 172a is ejected between the wirings 162a and 162b and comes into contact with the uncured conductive paste 170. Then, as shown in FIG. Further, the electronic component 172b is placed so that the electrodes 178 are in contact with the conductive paste 166 in a hardened state on the wirings 162b and 162c.
  • the component body 176 of the electronic component 172b is ejected between the wirings 162b and 162c and comes into contact with the conductive paste 170 in an uncured state.
  • the conductive paste 166 is discharged to the position where the electrode 178 is to be mounted on the wiring 162
  • the conductive paste 170 is discharged to the position where the component body 176 is to be mounted. Therefore, when the electronic component 172 is placed on the resin laminate 152, the electrodes 178 come into contact with the conductive paste 166 in a cured state on the wiring 162, and the component body 176 becomes conductive in an uncured state.
  • Contact paste 170 is .
  • the electronic component 172a is electrically connected to the two wirings 162a and 162b, and the electronic component 172b is connected to the two wirings 162b and 162c. electrically connected.
  • the electronic component 172 is mounted so that the electrodes 178 are in contact with the hardened conductive paste 166, the contact area between the electrodes 178 and the conductive paste 166 is small at this point.
  • the component body 176 of the electronic component 172 contacts the uncured conductive paste 170, the contact area between the component body 176 and the conductive paste 170 increases to some extent.
  • the adhesive force of the conductive paste 170 fixes the electronic component 172 to the upper surface of the resin laminate 152 in the component body 176 . Then, the resin laminate 152 is heated at 105° C. for one hour by the heater 66 incorporated in the base 60 . Thereby, the conductive paste 170 is heated through the resin layered body 152 and hardened.
  • thermosetting resin 180 is enclosed between the upper surface of the resin laminate 152 and the lower surface of the component body 176 of the electronic component 172 . That is, the thermosetting resin 180 is sealed between the top surface of the resin laminate 152 and the bottom surface of the component body 176 .
  • the amount of thermosetting resin 180 discharged from dispenser 116 is controlled so that thermosetting resin 180 does not protrude from between the upper surface of resin laminate 152 and the lower surface of component body 176 .
  • the resin laminate 152 is heated at 70° C.
  • thermosetting resin 180 is heated through the resin laminate 152 and cured. Note that the thermosetting resin 180 is not completely cured even if it is heated at 70 degrees for 30 minutes. Therefore, the thermosetting resin 180 is in a semi-cured state at this point.
  • thermosetting resin 180 injected between the upper surface of the resin laminate 152 and the lower surface of the component body 176 is semi-cured in this manner, the stage 52 is moved below the compression unit 26 . 12, the electronic component 172 mounted on the resin laminate 152 is compressed downward by the compression plate 122 via the rubber sheet 124 in the compression portion 120 of the compression unit 26. As shown in FIG. During compression by the compression plate 122, the operation of the cylinder 126 is controlled, and the compression force by the compression plate 122 is set to 200 kgf. Two electronic components 172 a and 172 b are mounted in cavity 154 of resin laminate 152 , but cavity 154 has a depth smaller than the height of these two electronic components 172 .
  • the upper surfaces of the two electronic components 172a,b extend upward from the cavity 154, and the two electronic components 172 can be compressed downward by the compression plate 122.
  • the heater 66 built into the base 60 heats the resin laminate 152 at 85 degrees for 45 minutes.
  • the thermosetting resin 180 is heated through the resin laminate 152 and cured.
  • the thermosetting resin 180 is completely cured by being heated at 85 degrees for 45 minutes.
  • the thermosetting resin 180 is completely cured while being enclosed between the upper surface of the resin laminate 152 and the lower surface of the component body 176 .
  • the electronic component 172 is in contact with the electrode 178.
  • the conductive paste 166 is deformed and the contact area between the electrode 178 and the conductive paste 166 is increased.
  • the conductive paste 166 has a low Young's modulus in the cured state.
  • the Young's modulus is a constant of proportionality between strain and stress in the elastic range, and is the ratio of stress to strain. Therefore, when an object with a high Young's modulus and an object with a low Young's modulus are deformed by the same stress, the object with a low Young's modulus deforms more than the object with a high Young's modulus. That is, an object with a low Young's modulus is easily deformed.
  • the conductive paste 166 with a low Young's modulus is pressed by the electrode 178 and deformed, increasing the contact area between the electrode 178 and the conductive paste 166 .
  • This ensures electrical connection between the electronic component 172 and the wiring 162 .
  • the conductive paste 170 in contact with the component body 176 of the electronic component 172 is also deformed, and the component body 176 is deformed. and the contact area with the conductive paste 170 also increases.
  • the electronic component 172 can be preferably fixed to the resin laminate 152 by the adhesive force of the conductive paste 170 .
  • the electronic component 172 placed on the upper surface of the resin laminate 152 is electrically connected to the wiring by the conductive paste 166, and is fixed by the adhesive force of the conductive paste 170, so that the circuit board is attached to the base 60. It is formed on the thermal release film 150 on the upper surface. Then, in order to peel off the heat-sensitive peeling film 150 from the formed circuit board, the heat-sensitive peeling film 150 is heated at 130° C. for one hour by the heater 66 incorporated in the base 60 . As a result, the adhesiveness of the heat-sensitive peeling film 150 is reduced, and the circuit board 200 can be easily peeled off from the base 60 together with the heat-sensitive peeling film 150 . Then, the formation of the circuit board is completed by peeling the heat-sensitive peeling film 150 from the circuit board.
  • the electrical conductivity between the wiring 162 and the electrode 178 of the electronic component 172 can be properly ensured compared to a circuit board formed by a conventional method.
  • the conventional method when the conductive paste 166 is discharged onto the wiring 162, the conductive paste 166 is mounted after the electronic component 172 is mounted so that the conductive paste 166 and the electrodes 178 are in contact with each other. is heated and hardened.
  • the electronic component is mounted using a step of heating and curing the conductive paste 166 after the electronic component 172 is mounted (hereinafter referred to as a “post-curing process”).
  • the new method when the conductive paste 166 is discharged onto the wiring 162, the conductive paste 166 is heated and cured before the electronic component 172 is mounted.
  • electronic components are mounted using a step of heating and curing the conductive paste 166 (hereinafter referred to as a “pre-curing process”) before the electronic components 172 are mounted.
  • pre-curing process a step of heating and curing the conductive paste 166
  • it is possible to heat and harden the conductive paste 166 in a state where the conductive paste 166 is not deformed and stress is not applied, and the conductive paste 166 becomes It is possible to prevent a decrease in conductivity during curing.
  • the conductive paste 170 is applied to the mounting position of the component body 176 before the electronic component 172 is mounted, and the conductive paste 170 is not heated. That is, before the electronic component 172 is mounted, the conductive paste 166 applied to the intended mounting position of the electrode 178 is heated, but the conductive paste 170 applied to the intended mounting position of the component body 176 is not heated. . Therefore, when the electronic component 172 is mounted, the component body 176 comes into contact with the conductive paste 170 in an uncured state, so that the contact area between the component body 176 and the conductive paste 170 increases to some extent. Thereby, the electronic component 172 can be fixed to the resin laminate 152 by the adhesive force of the conductive paste 170 .
  • the electrical conductivity between the wiring 162 and the electrode 178 of the electronic component 172 is properly ensured, and the adhesive force of the conductive paste 170 makes the mounted electronic component It is possible to prevent the electronic component from being misaligned.
  • the number of discharges of the conductive paste increases compared to the case of using the post-curing process, so the discharge time of the conductive paste becomes longer.
  • the conductive paste 166 is applied to the positions where the two electrodes 178 of the electronic component 172 are to be mounted, and the conductive paste 170 is applied to the position where the component body 176 of the electronic component 172 is to be mounted. . That is, in the pre-curing process, the conductive paste 166 is applied to two locations and the conductive paste 170 is applied to one location, so that the conductive paste is applied to a total of three locations. On the other hand, in the post-curing process, the conductive paste 166 is applied only to the positions where the two electrodes 178 of the electronic component 172 are to be mounted, so the conductive paste is applied to two positions.
  • the number of locations where the conductive paste is discharged in the pre-curing process is 1.5 times the number of locations where the conductive paste is discharged in the post-curing process. It is longer than the discharge time of the conductive paste in the post-curing process.
  • the circuit forming apparatus 10 selectively performs the post-curing process and the pre-curing process according to the size of the electronic component.
  • the conductive paste loses its conductivity when deformed or stressed during heat curing.
  • the amount of thermal expansion during heating of small electronic components is smaller than the amount of thermal expansion during heating of large electronic components. Therefore, even if the conductive paste is heated with a small electronic component attached, the stress on the conductive paste is small compared to the case where the conductive paste is heated with a large electronic component attached. .
  • a post-curing process is used when mounting electronic components smaller than a preset size (hereinafter referred to as "set size"), and mounting electronic components larger than the set size. Sometimes a pre-curing process is used.
  • a part size with a maximum length of 1.6 mm on one side is set.
  • component sizes include “3216”, “2012”, “1608”, “1005", “0603”, etc.
  • component sizes smaller than the set size are “1608” and "1005".
  • “0603”, and component sizes larger than the set size are “3216” and “2012”. Therefore, the pre-curing process is used when mounting electronic components of component sizes "1608", “1005" and "0603”, and the post-curing process is used when mounting electronic components of component sizes "3216” and "2012”.
  • the component size of the electronic component 172a is equal to or smaller than the set size, and the component size of the electronic component 172b is larger than the set size. Therefore, the electronic components 172a smaller than the set size are mounted using the post-curing process, and the electronic components 172b larger than the set size are mounted using the pre-curing process.
  • the conductive paste 170 is discharged to the planned mounting position of the component body 176 .
  • an electronic component 172b larger than the set size is placed on the resin laminate 152, as shown in FIG.
  • the conductive paste 166 hardened on the wiring 162b and the wiring 162c is brought into contact with the electrode 178, and the unhardened conductive paste 170 discharged onto the resin layered body 152 is brought into contact with the component body 176.
  • the electronic component 172b is mounted on the resin layered body 152 so as to do so.
  • the conductive paste 170 is heated by the heater 66 and hardened.
  • thermosetting resin 180 is injected between the electronic component 172 and the resin layered body 152 and heated by the heater 66.
  • the curable resin 180 is semi-cured.
  • the compression unit 26 as shown in FIG. 17, the electronic component 172 mounted on the resin laminate 152 is compressed downward by the compression plate 122 via the rubber sheet 124, and heated by the heater 66.
  • the thermosetting resin 180 is cured. This forms a circuit.
  • the electronic components 172a having a size smaller than the set size are mounted by the post-curing process, and the electronic components 172b larger than the set size are mounted by the pre-curing process. It is possible to shorten the ejection time of the adhesive paste. However, even if the discharge time of the conductive paste can be shortened, there is a possibility that the circuit formation time cannot be shortened.
  • the pre-curing process and the post-curing process are selectively performed according to the size of the component, from discharging the conductive paste 166 onto the wiring 162 to thermally curing the electronic component 172 while compressing it.
  • Eight steps are performed until the hardening resin is cured. That is, the step of discharging conductive paste 166 onto wiring 162 (FIG. 7), the step of curing conductive paste 166 (FIG. 7), the step of placing small electronic components 172a (FIG. 13), and the step of Discharge step (FIG. 14), placement step of large electronic component 172b (FIG. 15), curing step of conductive paste 170 (FIG. 15), injection step of thermosetting resin (FIG.
  • thermosetting resin curing step (FIG. 17)
  • the discharge time of the conductive paste can be shortened. Even if it can be achieved, there is a possibility that the circuit formation time cannot be shortened.
  • the discharge of the conductive paste 166 to the planned mounting position of the electrode of the small electronic component 172a and the discharge of the conductive paste 170 to the planned mounting position of the component body of the large electronic component 172b are the same.
  • Timing that is, execution in one process shortens the circuit formation time. Specifically, when the conductive paste 166 is discharged to the end of the wiring 162, as shown in FIG. The conductive paste 166 was discharged both to the position where the electrode 178 was to be mounted.
  • the circuit formation time as shown in FIG.
  • the conductive paste 166 is discharged only to the positions where the electrodes 178 of the large electronic component 172b are to be mounted, and the electrodes 178 of the small electronic component 172a are to be mounted.
  • the conductive paste 166 is not ejected to the position. Then, when the conductive paste 166 is discharged only to the positions where the electrodes 178 of the large electronic component 172b are to be mounted, the conductive paste 166 is heated by the heater 66 and hardened.
  • the conductive paste 170 is discharged at the planned mounting position of the component body 176 of the large electronic component 172b, and the conductive paste 166 is also discharged at the planned mounting position of the electrode 178 of the small electronic component 172a. Dispensed. At this point, the conductive paste 166 ejected to the planned mounting position of the electrode 178 has hardened with respect to the conductive paste discharged to the planned mounting position of the large electronic component 172b. The applied conductive paste 170 is uncured. On the other hand, with respect to the conductive paste ejected onto the planned mounting position of the small electronic component 172a, the conductive paste 166 ejected onto the planned mounting position of the electrode 178 is uncured.
  • the large electronic component 172b is placed in the resin laminate such that the electrode 178 contacts the hardened conductive paste 166 and the component body 176 contacts the unhardened conductive paste 170. 152.
  • a small electronic component 172 a is placed on the resin laminate 152 such that the electrodes 178 are in contact with the uncured conductive paste 166 .
  • the heater 66 heats the uncured conductive paste 166 in contact with the electrode 178 of the small electronic component 172a and the uncured conductive paste 170 in contact with the component body 176 of the large electronic component 172b. harden.
  • thermosetting resin 180 is injected between the electronic component 172 and the resin laminate 152 and heated by the heater 66 so that the thermosetting resin 180 is semi-cured. do.
  • the electronic component 172 mounted on the resin laminate 152 is compressed downward by the compression plate 122 via the rubber sheet 124, and heated by the heater 66.
  • Thermosetting resin 180 is cured. This forms a circuit.
  • the conductive paste 166 is discharged onto the wiring 162, and the thermosetting process is performed while the electronic components 172 are compressed. Seven steps are performed until the resin hardens. That is, a step of discharging the conductive paste 166 to the planned mounting position of the electrode of the large electronic component 172b (FIG. 18), a step of curing the conductive paste 166 (FIG. 18), a planned mounting position of the component body of the large electronic component 172b, and A step of discharging conductive paste to the mounting position of the electrode of the small electronic component 172a (FIG. 19), a step of placing two electronic components (FIG.
  • the first application unit 210 is a functional unit for discharging the conductive paste 166 to the positions where the electrodes of the large electronic component 172b are to be mounted.
  • the first hardening part 212 is a functional part for hardening the conductive paste 166 that has been discharged to the mounting position of the electrode of the large electronic component 172b.
  • the second application part 214 is a functional part for discharging the conductive paste to the planned mounting position of the component body of the large electronic component 172b and the planned mounting position of the electrode of the small electronic component 172a.
  • the first mounting portion 216 is placed on the resin laminate 152 so that the large electronic component 172 b contacts the hardened conductive paste 166 with the electrode 178 and the component body 176 contacts the unhardened conductive paste 170 . It is a functional part for placing on the .
  • the second mounting portion 218 is a functional portion for mounting the small electronic component 172 a on the resin laminate 152 so that the electrodes 178 are in contact with the uncured conductive paste 166 .
  • the second curing section 220 is a functional section for curing the conductive pastes 166 and 170 that have been discharged to the mounting positions of the component body of the large electronic component 172b and the electrodes of the small electronic component 172a.
  • the injection part 222 is a functional part for injecting a thermosetting resin between the electronic component 172 and the resin laminate 152 .
  • the compression curing section 224 is a functional section for curing the thermosetting resin while compressing the electronic component.
  • the circuit forming apparatus 10 is an example of an electronic component mounting apparatus.
  • the control device 28 is an example of a control device.
  • Heater 66 is an example of a curing device.
  • Dispenser 106 is an example of a coating device.
  • the mounting head 136 is an example of a mounting device.
  • the resin laminate 152 is an example of a resin layer.
  • the wiring 162 is an example of metal wiring.
  • Conductive pastes 166 and 170 are examples of conductive fluids.
  • Electronic component 172a is an example of a second electronic component.
  • Electronic component 172b is an example of a first electronic component.
  • the component body 176 is an example of a component body.
  • Electrode 178 is an example of an electrode.
  • Thermosetting resin 180 is an example of a curable resin.
  • the present invention is not limited to the above embodiments, and can be implemented in various aspects with various modifications and improvements based on the knowledge of those skilled in the art.
  • the pre-curing process and the post-curing process are selectively executed according to the part size, but the pre-curing process and the post-curing process are selectively executed according to the characteristics of the part.
  • the pre-curing process and the post-curing process are selectively executed according to the characteristics of the part.
  • a pre-curing process may be employed in some cases.
  • the set size is set to a component size with a maximum length of 1.6 mm on one side.
  • Various numerical values such as the area of the upper surface and the volume of the part can be set as the set size.
  • the conductive paste 166 is used as the fluid for electrically connecting the wiring 162 and the electrode 178 of the electronic component 172, but various fluids may be used as long as they exhibit conductivity. It is possible to adopt.
  • ultraviolet curable resin and thermosetting resin are used as curable resins, but they may be formed of two-liquid mixed curable resins, thermoplastic resins, and the like.
  • an ultraviolet curable resin is used as the resin forming the resin laminate 152 and a thermosetting resin is used as the resin for fixing the electronic component 172 . That is, although the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different curable resins, the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different. The same curable resin may be used.
  • the conductive paste is discharged by the dispenser 106, but may be transferred by a transfer device or the like. Alternatively, the conductive paste may be printed by screen printing.
  • Circuit forming device (electronic component mounting device) 28: Control device 66: Heater (curing device) 106: Dispenser (coating device) 136: Mounting head (mounting device) 152: Resin laminate (resin layer) 162: Wiring (Metal wiring) 166: Conductive paste (conductive fluid) 170: Conductive paste (conductive fluid) 172a: Electronic component (second electronic component) 172b: Electronic component (first electronic component) 176: Component body 178: Electrode 180: Thermosetting resin (hardening resin)

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de montage de pièce électronique comprenant : une étape consistant à appliquer un fluide conducteur à des positions de montage planifiées pour des électrodes d'une première pièce électronique sur un câblage métallique disposé sur une couche de résine ; une première étape de durcissement pour durcir le fluide conducteur appliqué ; une étape consistant à appliquer un fluide conducteur à une position de montage planifiée pour un corps de partie de la première pièce électronique sur la couche de résine et à appliquer en outre un fluide conducteur à des positions de montage planifiées pour des électrodes d'une seconde pièce électronique sur le câblage métallique disposé sur la couche de résine ; une étape pour mettre en contact les électrodes de la première pièce électronique avec le fluide conducteur durci dans la première étape de durcissement et en outre en contact avec le corps de partie de la première pièce électronique avec le fluide conducteur appliqué à la position de montage planifiée pour le corps de partie de la première pièce électronique, ce qui permet de placer la première pièce électronique ; une étape consistant à mettre en contact les électrodes de la seconde pièce électronique avec le fluide conducteur appliqué aux positions de montage planifiées pour les électrodes de la seconde pièce électronique, ce qui permet de placer la seconde pièce électronique ; et une seconde étape de durcissement pour le durcissement, après que la première pièce électronique et la seconde pièce électronique sont placées, le fluide conducteur appliqué à la position de montage planifiée pour le corps de partie de la première pièce électronique et aux positions de montage planifiées pour les électrodes de la seconde pièce électronique.
PCT/JP2021/011050 2021-03-18 2021-03-18 Procédé de montage de pièce électronique et dispositif de montage de pièce électronique WO2022195800A1 (fr)

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JP2023506622A JPWO2022195800A1 (fr) 2021-03-18 2021-03-18
PCT/JP2021/011050 WO2022195800A1 (fr) 2021-03-18 2021-03-18 Procédé de montage de pièce électronique et dispositif de montage de pièce électronique

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005032742A (ja) * 2003-07-07 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品実装構造および電子部品実装方法
JP2007115904A (ja) * 2005-10-20 2007-05-10 Renesas Technology Corp 半導体装置の製造方法
JP2017216312A (ja) * 2016-05-31 2017-12-07 パナソニックＩｐマネジメント株式会社 電子部品実装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005032742A (ja) * 2003-07-07 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品実装構造および電子部品実装方法
JP2007115904A (ja) * 2005-10-20 2007-05-10 Renesas Technology Corp 半導体装置の製造方法
JP2017216312A (ja) * 2016-05-31 2017-12-07 パナソニックＩｐマネジメント株式会社 電子部品実装方法

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