WO2022188787A1 - 一种散热优化的半导体光源脱毛仪 - Google Patents

一种散热优化的半导体光源脱毛仪 Download PDF

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Publication number
WO2022188787A1
WO2022188787A1 PCT/CN2022/079797 CN2022079797W WO2022188787A1 WO 2022188787 A1 WO2022188787 A1 WO 2022188787A1 CN 2022079797 W CN2022079797 W CN 2022079797W WO 2022188787 A1 WO2022188787 A1 WO 2022188787A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
light source
hair removal
semiconductor light
heat
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Application number
PCT/CN2022/079797
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English (en)
French (fr)
Inventor
潘少辉
刘建
Original Assignee
深圳市利孚医疗技术有限公司
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Application filed by 深圳市利孚医疗技术有限公司 filed Critical 深圳市利孚医疗技术有限公司
Priority to US17/918,036 priority Critical patent/US20230129185A1/en
Priority to BR112023017659A priority patent/BR112023017659A2/pt
Publication of WO2022188787A1 publication Critical patent/WO2022188787A1/zh

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
    • A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
    • A61B18/203—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser applying laser energy to the outside of the body
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00005—Cooling or heating of the probe or tissue immediately surrounding the probe
    • A61B2018/00011—Cooling or heating of the probe or tissue immediately surrounding the probe with fluids
    • A61B2018/00017—Cooling or heating of the probe or tissue immediately surrounding the probe with fluids with gas
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00005—Cooling or heating of the probe or tissue immediately surrounding the probe
    • A61B2018/00011—Cooling or heating of the probe or tissue immediately surrounding the probe with fluids
    • A61B2018/00023—Cooling or heating of the probe or tissue immediately surrounding the probe with fluids closed, i.e. without wound contact by the fluid
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00005—Cooling or heating of the probe or tissue immediately surrounding the probe
    • A61B2018/00047—Cooling or heating of the probe or tissue immediately surrounding the probe using Peltier effect
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
    • A61B2018/00452—Skin
    • A61B2018/00476—Hair follicles
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/0091—Handpieces of the surgical instrument or device
    • A61B2018/00916—Handpieces of the surgical instrument or device with means for switching or controlling the main function of the instrument or device
    • A61B2018/00922—Handpieces of the surgical instrument or device with means for switching or controlling the main function of the instrument or device by switching or controlling the treatment energy directly within the hand-piece
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
    • A61B2018/1807—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using light other than laser radiation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
    • A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
    • A61B2018/2015—Miscellaneous features
    • A61B2018/202—Laser enclosed in a hand-piece

Definitions

  • the invention relates to the technical field of hair removal instruments, in particular to a semiconductor light source hair removal instrument with optimized heat dissipation.
  • Hair removal instruments also known as epilators, refer to a small electrical appliance used to remove body hair.
  • the hair removal instruments on the market are mainly "women's hair removal instruments", which are used to remove hair from armpit hair, leg hair and other parts, and help women wear Dress up beautifully.
  • the existing hair removal device has the following defects: during the use of the hair removal device, the internal temperature of the body continues to rise, and the body as a whole is relatively closed, which is not conducive to heat dissipation, and is likely to burn out or scald the user.
  • the main technical problem solved by the present invention is to provide a semiconductor light source hair removal device with optimized heat dissipation, which adopts a new heat dissipation design to effectively improve the heat dissipation function of the hair removal device.
  • the embodiment of the present invention provides a semiconductor light source hair removal device with optimized heat dissipation, including a casing, a hair removal component fixed to the casing, a fan, a circuit board and a control power supply board; the casing has an accommodating cavity for accommodating the fan, A circuit board and a control power supply board, the hair removal assembly, the fan, and the control power supply board are electrically connected to the circuit board, at least one heat dissipation port is opened on the outer shell, and the hair removal assembly includes a treatment head, a cooling sheet, a light source chip and A heat dissipation component, the heat dissipation component includes a heat dissipation fin and at least one heat pipe, and the heat pipe connects the cooling fin and/or the light source chip with the heat dissipation fin.
  • the at least one heat dissipation port may include a first heat dissipation port and a second heat dissipation port, and the first heat dissipation port and the second heat dissipation port may be respectively located on two opposite side walls of the housing.
  • the housing may include an upper case and a lower case that are connected to each other, the first heat dissipation port may be provided on the upper case, and the second heat dissipation port may be provided on the lower case.
  • the lower part of the lower shell may be provided with a handle, and a button may be provided on the handle.
  • the handle can be hollow, and the control power board can be installed in the handle.
  • control power board can be connected with the handle by screws; the buttons can be used to control the hair removal assembly and the operation of the fan.
  • the at least one heat pipe includes a first heat pipe and a second heat pipe, and both the first heat pipe and the second heat pipe may be thermally conductively connected to the heat dissipation fin.
  • the first heat pipe may be in a U-shaped tubular shape, and two free sections of the first heat pipe may pass through the heat dissipation fins.
  • the second heat pipe may be stepped, including a middle section and a first section and a second section respectively connected to both sides of the middle section, the first section and the second section
  • the segments may extend in opposite directions from both ends of the intermediate segment, respectively.
  • the first section of the second heat pipe may be located between two free sections of the first heat pipe.
  • the light source chip may be disposed at the closed end of the first heat pipe and the middle section of the second heat pipe.
  • a sealing seat and a heat insulating sheet disposed between the treatment head and the sealing seat may also be included.
  • a fixing member may also be included, the fixing member is arranged above the fan, and the heat dissipation member is arranged above the fixing member.
  • the air outlet of the fan faces the folded heat dissipation fins.
  • the light source chip adopts an ultra-thin beryllium oxide ceramic heat sink supplemented by an artificial diamond film coating, and the ceramic heat sink is brazed to the at least one heat pipe.
  • the treatment head, the heat insulation sheet, and the sealing seat can be connected by screws to isolate external dust, and the light source chip is concentric with the light outlet of the treatment head.
  • the first heat pipe, the second heat pipe and the heat dissipation fins may be directly riveted and brazed; the heat dissipation fins may be folded heat dissipation fins.
  • an insulating pressing plate may also be included, the insulating pressing plate presses the cold end of the cooling sheet against the treatment head, the hot end of the cooling sheet is close to the second heat pipe, and the second heat pipe presses the cooling sheet The heat is conducted to the cooling fins.
  • the fan may be an axial flow fan.
  • control power board may be a multi-phase interleaved parallel design.
  • the design adopts a new heat dissipation design, which greatly improves the heat dissipation function of the epilation device; avoids the heat transfer of the wire heating to the chip, and reduces the heat load of the chip; and satisfies the requirements of the lower temperature of the light source chip , to achieve the best cooling effect.
  • FIG. 1 is an exploded view of a semiconductor light source hair removal device with optimized heat dissipation according to an embodiment of the present invention.
  • FIG. 2 is an exploded view of a hair removal component of a semiconductor light source hair removal device with optimized heat dissipation according to an embodiment of the present invention.
  • FIG. 3 is a perspective view of a semiconductor light source hair removal device with optimized heat dissipation according to an embodiment of the present invention.
  • a semiconductor light source hair removal device with optimized heat dissipation includes a housing 1 , a hair removal assembly 2 disposed in the housing 1 , a fan 4 , a circuit board 5 and a control power board 6 .
  • the housing 1 has an accommodating cavity therein.
  • the depilation assembly 2, the fan 4 and the control power board 6 are arranged in the accommodating cavity.
  • the depilatory assembly 2 , the fan 4 , and the control power board 6 are electrically connected to the circuit board 5 .
  • the fan 4 is an axial flow fan. It can be understood that, in other embodiments, the fan may also be a centrifugal fan.
  • the circuit board 5 is preferably a PCB board.
  • the hair removal assembly 2 includes a treatment head 20 , a sealing seat 22 , a chip board 23 , a cooling sheet 24 , a light source chip 25 and a heat dissipation member 26 .
  • the casing 1 is provided with an opening 13 extending through the side wall thereof, and the treatment head 20 protrudes through the opening 13 .
  • the sealing seat 22 is disposed at the opening 13 for sealing the accommodating cavity.
  • the cold end of the cooling sheet 24 is connected to the treatment head 20 , and the hot end is connected to the heat dissipation member 26 .
  • an insulating pressing plate 29 is disposed under the cooling sheet 24 to press the cold end and the hot end of the cooling sheet 24 to the treatment head 20 and the heat dissipation member 26 respectively.
  • the heat dissipation component 26 includes at least one heat pipe and heat dissipation fins 261 .
  • the two parts of the heat pipe are respectively connected with the cooling fins 24 and the cooling fins 261, and are used for rapidly conducting the heat on the cooling fins 24 to the cooling fins 261 for heat dissipation.
  • the casing 1 includes an upper casing 11 and a lower casing 12 , and the upper casing 11 and the lower casing 12 are connected in an upper and lower enclosure.
  • the upper case 11 is provided with a first heat dissipation port 111
  • the lower surface of the lower case 12 is provided with a second heat dissipation port 122 .
  • the fan generates airflow when working, and the arrangement of the first heat dissipation port 111 and the second heat dissipation port 122 is conducive to the formation of convection between the air in the accommodating cavity and the outside air, and the heat in the accommodating cavity is dissipated to the outside.
  • the heat in the accommodating cavity can be quickly and efficiently dissipated in combination with the airflow generated when the fan is working.
  • the first heat dissipation port 111 and the second heat dissipation port 122 are formed by a plurality of grooves spaced apart from each other.
  • a handle 121 is also connected to the middle of the bottom end of the lower shell 12 .
  • the handle 121 extends downward and gradually narrows to form a streamlined shape.
  • the handle 121 is hollow, and the upper shell 11 , the lower shell 12 and the handle 121 enclose a generally T-shaped accommodating cavity, that is, the accommodating cavity includes a first accommodating cavity and a second accommodating cavity that communicate with each other. accommodating cavity.
  • the first accommodating cavity is enclosed by the upper shell 11 and the lower shell 12
  • the second accommodating cavity is defined by the handle 121 .
  • the depilation assembly 2, the fan 4, and the circuit board 5 are installed in the first accommodating cavity.
  • the control power board 6 is installed in the second accommodating cavity.
  • a button 1211 is provided outside the handle 121 .
  • the second heat dissipation port 122 is arranged around the handle 121 .
  • the epilation apparatus of this embodiment further includes a heat insulation sheet 21 disposed between the treatment head 20 and the sealing seat 22 .
  • the treatment head 20 and the sealing seat 22 are isolated by the heat insulation sheet 21 to prevent the heat of the sealing seat 22 from being directly conducted to the treatment head 20 .
  • the epilation apparatus of this embodiment further includes a fixing member 3 , and the hair removal assembly 2 is mounted on the upper surface of the fixing member 3 .
  • the fixing member 3 is disposed between the fan and the heat dissipation fins 261 for fixing the heat dissipation fins 261 .
  • the air outlet of the fan 4 faces the cooling fins 261 .
  • the heat dissipation fins 261 are substantially facing the first heat dissipation port 111 .
  • the heat pipe includes a first heat pipe 262 and a second heat pipe 263 .
  • the cooling fins 261 are preferably folded cooling fins.
  • the heat dissipation fins 261 are in the shape of a rectangular parallelepiped as a whole.
  • the first heat pipe 262 is in the shape of a U-shaped tube, and two free sections pass through the lower surface of the heat dissipation fins 261 respectively.
  • the second heat pipe 263 has a stepped shape and includes a middle section 2631 and a first section 2632 and a second section 2633 extending from both ends of the middle section 2631 in directions away from each other.
  • the first section 2632 also passes through the heat dissipation fins 261 and is substantially on the same plane as the first heat pipe 262 .
  • the first section 2632 is located between the two free sections of the first heat pipe 262 .
  • the middle section 2631 of the second heat pipe is perpendicular to the first section 2632 and the second section 2633 , respectively, and the middle section 2631 substantially corresponds to the closed end of the first heat pipe 262 .
  • the second section 2633 is closely attached to the hot end of the cooling chip 24 .
  • the light source chip 25 is disposed at the closed end of the first heat pipe 262 and the middle section 2631 of the second heat pipe 263 .
  • the light source chip 25 and the chip board 23 are welded with gold wires; the light source chip 25 adopts an ultra-thin beryllium oxide ceramic heat sink, supplemented by an artificial diamond film coating, and the ceramic heat sink is brazed with the first heat pipe 26, and The light source chip 25 is used to emit laser light for hair removal.
  • the treatment head 20 , the heat insulating sheet 21 , and the sealing seat 22 are connected by screws to isolate external dust and ensure the concentricity between the light source chip 25 and the light outlet of the treatment head 20 .
  • the first heat pipe 26 , the second heat pipe 28 and the heat dissipation fins 27 are directly riveted and brazed.
  • the heat dissipation fins 27 are used to dissipate heat from the light source chip 25 and the cooling fins 24 , and are preferably folded and scattered fins.
  • the heat dissipation fins are folded heat dissipation fins of different thicknesses.
  • the insulating pressing plate 29 presses the cold end of the cooling sheet 24 on the treatment head 20 , and the hot end of the cooling sheet 24 is close to the second heat pipe 28 for heat dissipation.
  • control power board 6 and the handle 121 are connected by screws.
  • the button 1211 is used to control the hair removal assembly 2 and the operation of the fan, that is, laser hair removal.
  • control power board 6 is a multi-phase staggered parallel design.
  • the energy is set to an appropriate gear, the therapeutic head 20 is close to the part to be treated, and the light-emitting treatment can be performed by pressing the button 1211;
  • the heat generated by 24 is dissipated through the first heat pipe 26 , the second heat pipe 28 and the heat dissipation fins 27 ; it provides an effective guarantee for the continuous and efficient operation of the light source chip 25 to meet the requirements of the lower temperature of the light source chip 25 , thereby satisfying the Thermal optimization requirements.

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  • Health & Medical Sciences (AREA)
  • Surgery (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
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Abstract

一种散热优化的半导体光源脱毛仪，包括外壳(1)、固定至外壳(1)的脱毛组件(2)、风机(4)、电路板(5)和控制电源板(6)；外壳(1)具有一容置腔，用于收容风机(4)、电路板(5)和控制电源板(6)，脱毛组件(2)、风机(4)、控制电源板(6)与电路板(5)电连接，外壳(1)上开设有至少一散热口，脱毛组件(2)包括治疗头(20)、制冷片(24)、光源芯片(25)和散热部件(26)，散热部件(26)包括散热鳍片(261)和至少一热管，热管将制冷片(24)和/或光源芯片(25)与散热鳍片(261)连接。脱毛仪采用新的散热设计，大幅提高了散热功能，避免了导线发热对芯片的热传递，降低芯片的热负荷，满足了光源芯片较低温度的要求，能达到最优冷却的效果。

Description

一种散热优化的半导体光源脱毛仪 技术领域
本发明涉及脱毛仪技术领域，特别涉及一种散热优化的半导体光源脱毛仪。
 背景技术
脱毛仪也称脱毛器，是指用于去除体毛的一种小电器，市场上的脱毛仪主要为“女用脱毛仪”，用于去除腋毛、腿毛等部位的毛发，有助于女性穿着打扮的美观。
现有的脱毛仪存在以下缺陷：脱毛仪使用过程中,机身内部温度持续升高,而机身整体较为封闭,不利于散热,容易导致烧坏或烫到使用者。
 技术问题
本发明主要解决的技术问题是提供一种散热优化的半导体光源脱毛仪，其采用新的散热设计，有效提高脱毛仪的散热功能。
 技术解决方案
本发明实施例提供一种散热优化的半导体光源脱毛仪，包括外壳、固定至外壳的脱毛组件、风机、电路板和控制电源板；所述外壳具有一容置腔，用于收容所述风机、电路板和控制电源板，所述脱毛组件、风机、控制电源板与所述电路板电连接，所述外壳上开设有至少一散热口，所述脱毛组件包括治疗头、制冷片、光源芯片和散热部件，所述散热部件包括散热鳍片和至少一热管，所述热管将所述制冷片和/或所述光源芯片与所述散热鳍片连接。
在一些实施例中，所述至少一散热口可以包括第一散热口和第二散热口，所述第一散热口和第二散热口可以分别位于外壳的两相对侧壁上。
在一些实施例中，所述外壳可以包括相互连接的上壳和下壳，所述第一散热口可以设置于所述上壳上，所述第二散热口可以设置于所述下壳上。
在一些实施例中，所述下壳的下部可以设有手柄，所述手柄上可以设有按键。
在一些实施例中，所述手柄可以呈中空状，所述控制电源板可以装在手柄内。
在一些实施例中，所述控制电源板可以与手柄通过螺丝连接；所述按键可以用于控制脱毛组件、风机工作。
在一些实施例中，所述至少一热管包括第一热管和第二热管，所述第一热管和第二热管可以均与所述散热鳍片热传导连接。
在一些实施例中，所述第一热管可以呈U形管状，所述第一热管的两自由段可以穿设于所述散热鳍片内。
在一些实施例中，所述第二热管可以呈台阶状，包括中间区段和分别连接于中间区段两侧的第一区段和第二区段，所述第一区段和第二区段可以分别自中间区段的两端沿相背离的方向延伸。
在一些实施例中，所述第二热管的第一区段可以位于第一热管的两自由段之间。
在一些实施例中，所述光源芯片可以设置于所述第一热管的闭合端与第二热管的中间区段处。
在一些实施例中，还可以包括一密封座和设置于所述治疗头与密封座之间的隔热片。
在一些实施例中，还可以包括一固定件，所述固定件设置于风机的上方，所述散热部件设置于固定件上方。
在一些实施例中，所述风机的出风口朝向所述折叠散热鳍片。
在一些实施例中，所述光源芯片采用超薄氧化铍陶瓷热沉，辅以人工金刚石薄膜镀层，陶瓷热沉与所述至少一热管钎焊。
在一些实施例中，所述治疗头、隔热片、密封座可以通过螺丝连接，隔绝外部粉尘，且光源芯片与治疗头的出光口同心。
在一些实施例中，所述第一热管、第二热管与散热鳍片可以直接铆紧钎焊；所述散热鳍片可以为折叠散热鳍片。
在一些实施例中，还可以包括一绝缘压板，所述绝缘压板将制冷片的冷端压紧于治疗头上，制冷片的热端紧贴第二热管，所述第二热管将所制冷片的热量传导至所述散热鳍片。
在一些实施例中，所述风机可以为轴流风机。
在一些实施例中，所述控制电源板可以为多相交错并联设计。
 有益效果
本发明实施例的有益效果在于：本设计采用新的散热设计，大幅提高脱毛仪的散热功能；避免了导线发热对芯片的热传递，降低芯片的热负荷；满足了光源芯片较低温度的要求，达到最优冷却的效果。
 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，而描述中的附图是本发明的一些实施例，对于本领域普通技术人员来说，在不付出创造性劳动的前提下，还可以根据这些附图获得其他附图。
图1是本发明一实施例的散热优化的半导体光源脱毛仪的爆炸图。
图2是本发明一实施例的散热优化的半导体光源脱毛仪的脱毛组件的爆炸图。
图3是本发明一实施例的散热优化的半导体光源脱毛仪的立体图。
 本发明的实施方式
下面结合实施例，并参照附图，对本发明目的的实现、功能特点及优点作在一些实施例中明。
如图1至图3所示，本发明一实施例提供的散热优化的半导体光源脱毛仪，包括外壳1、设置于外壳1内的脱毛组件2、风机4、电路板5和控制电源板6。所述外壳1内具有容置腔。所述脱毛组件2、风机4和控制电源板6设置于所述容置腔内。所述脱毛组件2、风机4、控制电源板6与电路板5电连接。本实施例中，所述风机4为轴流风机。可以理解地，在其他实施例中，风机也可以是离心风机。所述电路板5优选为PCB板。
所述脱毛组件2包括治疗头20、密封座22、芯片板23、制冷片24、光源芯片25和散热部件26。具体地，如图1、图2所示，所述外壳1设有贯穿其侧壁的开口13，所述治疗头20经所述开口13伸出。所述密封座22设置在所述开口13处，用于密封所述容置腔。
所述制冷片24冷端连接所述治疗头20，热端连接所述散热部件26，制冷片24产生的热量传导至所述散热部件26，并经由所述散热部件26将热量散发出去。优选地，一绝缘压板29设置于所述制冷片24下方，将所述制冷片24的冷端和热端分别压紧于所述治疗头20和所述散热部件26。
本实施例中，所述散热部件26包括至少一热管和散热鳍片261。所述热管的两部分分别与制冷片24和散热鳍片261相连，用于将制冷片24上的热量快速传导至散热鳍片261进行散热。
外壳1包括上壳11、下壳12，所述上壳11与下壳12上下合围连接。优选地，所述上壳11设有第一散热口111，所述下壳12的下面设有第二散热口122。风机工作时产生气流，第一散热口111和第二散热口122的设置有利于容置腔内的空气与外界空气形成对流，将容置腔内的热量散发至外界。本实施例中，配合风机工作时产生的气流，能够快速且高效地将容置腔内的热量散发出去。优选地，所述第一散热口111和第二散热口122均由多个相互间隔的槽构成。
本实施例中，所述下壳12的底端中部还连接有一手柄121。优选地，所述手柄121向下延伸并逐渐收窄形成流线型。本实施例中，手柄121呈中空状，所述上壳11，下壳12及手柄121围合成大致呈T形的容置腔，即容置腔包括相互连通的第一容置腔和第二容置腔。所述第一容置腔由上壳11和下壳12合围而成，第二容置腔由手柄121限定。优选地，所述脱毛组件2、风机4、和电路板5装在第一容置腔内。所述控制电源板6装于第二容置腔内。所述手柄121外设有按键1211。
优选地，所述第二散热口122环绕手柄121设置。
优选地，本实施例的脱毛仪还包括设置于所述治疗头20与密封座22之间的隔热片21。所述治疗头20与密封座22之间通过隔热片21隔离，避免密封座22的热量直接传导到治疗头20上。
优选地，本实施例的脱毛仪还包括一固定件3，所述脱毛组件2装在固定件3的上面。具体地，所述固定件3设置于风机和散热鳍片261之间，用于固定所述散热鳍片261。优选地，所述风机4的出风口朝向所述散热鳍片261。优选地，所述散热鳍片261大致正对所述第一散热口111。
如图3所示，本实施例中，热管包括第一热管262和第二热管263。所述散热鳍片261优选为折叠散热鳍片。散热鳍片261整体呈长方体形。
所述第一热管262呈U形管状，两自由段分别穿设于所述散热鳍片261的下表面。所述第二热管263呈台阶形，包括中间区段2631及与自所述中间区段2631的两端沿背离彼此的方向延伸的第一区段2632和第二区段2633。其中第一区段2632也穿设于散热鳍片261内，与第一热管262大致位于同一平面。优选地，所述第一区段2632位于所述第一热管262的两自由段之间。
所述第二热管的中间区段2631分别垂直于所述第一区段2632和第二区段2633，所述中间区段2631大致对应于所述第一热管262的闭合端处。第二区段2633紧贴于所述制冷片24的热端。优选地，所述光源芯片25设置于所述第一热管262的闭合端与第二热管263的中间区段2631处。通过两热管的联合作用，能有效将光源芯片25产生的热量传导到热管，进行散热。
优选地，所述光源芯片25与芯片板23通过金线焊接；所述光源芯片25采用超薄氧化铍陶瓷热沉，辅以人工金刚石薄膜镀层，陶瓷热沉与第一热管26钎焊，且光源芯片25用于发射激光，进行脱毛。
优选地，所述治疗头20、隔热片21、密封座22通过螺丝连接，隔绝外部粉尘，且确保光源芯片25与治疗头20出光口的同心度。
如图1、图2所示，所述第一热管26、第二热管28与散热鳍片27直接铆紧钎焊。所述散热鳍片27用于使光源芯片25、制冷片24散热，其优选为折叠散执鳍片。本实施例中，散热鳍片为非等厚折叠散热鳍片。
如图1、图2所示，所述绝缘压板29将制冷片24的冷端压紧于治疗头20上，制冷片24的热端紧贴第二热管28，用于散热。
在一些实施例中，如图1至图3所示，所述控制电源板6与手柄121通过螺丝连接。所述按键1211用于控制脱毛组件2、风机工作即激光脱毛。
如图1、图2所示，所述控制电源板6为多相交错并联设计。
本实施例的治疗仪工作时，将能量设置至适当档位，治疗头20贴紧需要治疗部位，按压按键1211即可进行出光治疗；在出光治疗过程中，能有效将光源芯片25、制冷片24所产生的热量，通过第一热管26、第二热管28、散热鳍片27散出去；为光源芯片25持续高效的工作，提供有效保证，以满足光源芯片25较低温度的要求，从而满足散热优化的要求。
以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换，而这些修改或替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。
为了使发明的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。

Claims (20)

  1. 一种散热优化的半导体光源脱毛仪，其特征在于，包括外壳、固定至外壳的脱毛组件、风机、电路板和控制电源板；所述外壳具有一容置腔，用于收容所述风机、电路板和控制电源板，所述脱毛组件、风机、控制电源板与所述电路板电连接，所述外壳上开设有至少一散热口，所述脱毛组件包括治疗头、制冷片、光源芯片和散热部件，所述散热部件包括散热鳍片和至少一热管，所述热管将所述制冷片和/或所述光源芯片与所述散热鳍片连接。
  2. 根据权利要求1所述的散热优化的半导体光源脱毛仪，其特征在于，所述至少一散热口包括第一散热口和第二散热口，所述第一散热口和第二散热口分别位于外壳的两相对侧壁上。
  3. 根据权利要求2所述的散热优化的半导体光源脱毛仪，其特征在于，所述外壳包括相互连接的上壳和下壳，所述第一散热口设置于所述上壳上，所述第二散热口设置于所述下壳上。
  4. 根据权利要求3所述的散热优化的半导体光源脱毛仪，其特征在于，所述下壳的下部设有手柄，所述手柄上设有按键。
  5. 根据权利要求4所述的散热优化的半导体光源脱毛仪，其特征在于，所述手柄呈中空状，所述控制电源板装在手柄内。
  6. 根据权利要求5所述的散热优化的半导体光源脱毛仪，其特征在于，所述控制电源板与手柄通过螺丝连接；所述按键用于控制脱毛组件、风机工作。
  7. 根据权利要求1所述的散热优化的半导体光源脱毛仪，其特征在于，所述至少一热管包括第一热管和第二热管，所述第一热管和第二热管均与所述散热鳍片热传导连接。
  8. 根据权利要求7所述的散热优化的半导体光源脱毛仪，其特征在于，所述第一热管呈U形管状，所述第一热管的两自由段穿设于所述散热鳍片内。
  9. 根据权利要求8所述的散热优化的半导体光源脱毛仪，其特征在于，所述第二热管呈台阶状，包括中间区段和分别连接于中间区段两侧的第一区段和第二区段，所述第一区段和第二区段分别自中间区段的两端沿相背离的方向延伸。
  10. 根据权利要求9所述的散热优化的半导体光源脱毛仪，其特征在于，所述第二热管的第一区段位于第一热管的两自由段之间。
  11. 根据权利要求10所述的散热优化的半导体光源脱毛仪，其特征在于，所述光源芯片设置于所述第一热管的闭合端与第二热管的中间区段处。
  12. 根据权利要求至1至10任一项所述的散热优化的半导体光源脱毛仪，其特征在于，还包括一密封座和设置于所述治疗头与密封座之间的隔热片。
  13. 根据权利要求1至10任一项所述散热优化的半导体光源脱毛仪，其特征在于，还包括一固定件，所述固定件设置于风机的上方，所述散热部件设置于固定件上方。
  14. 根据权利要求1至10任一项所述的散热优化的半导体光源脱毛仪，其特征在于，所述风机的出风口朝向所述散热鳍片。
  15. 根据权利要求1至10任一项所述的散热优化的半导体光源脱毛仪，其特征在于，所述光源芯片采用超薄氧化铍陶瓷热沉，辅以人工金刚石薄膜镀层，陶瓷热沉与所述至少一热管钎焊。
  16. 根据权利要求12所述的散热优化的半导体光源脱毛仪，其特征在于，所述治疗头、隔热片、密封座通过螺丝连接，隔绝外部粉尘，且光源芯片与治疗头出光口同心。
  17. 根据权利要求7至10任一项所述的散热优化的半导体光源脱毛仪，其特征在于，所述第一热管、第二热管与散热鳍片直接铆紧钎焊；所述散热鳍片为折叠散热鳍片。
  18. 根据权利要求7至10任一项所述的散热优化的半导体光源脱毛仪，其特征在于，还包括一绝缘压板，所述绝缘压板将制冷片的冷端压紧于治疗头上，所述制冷片的热端紧贴第二热管，所述第二热管将所制冷片的热量传导至所述散热鳍片。
  19. 根据权利要求1至18任一项所述的散热优化的半导体光源脱毛仪，其特征在于，所述风机为轴流风机。
  20. 根据权利要求1至19任一项所述的散热优化的半导体光源脱毛仪，其特征在于，所述控制电源板为多相交错并联设计。
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