WO2022186285A1 - Adhésif en film, film de fixation de puce/découpage de puce intégré, dispositif à semi-conducteur, et procédé de production de dispositif à semi-conducteur - Google Patents

Adhésif en film, film de fixation de puce/découpage de puce intégré, dispositif à semi-conducteur, et procédé de production de dispositif à semi-conducteur Download PDF

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Publication number
WO2022186285A1
WO2022186285A1 PCT/JP2022/008906 JP2022008906W WO2022186285A1 WO 2022186285 A1 WO2022186285 A1 WO 2022186285A1 JP 2022008906 W JP2022008906 W JP 2022008906W WO 2022186285 A1 WO2022186285 A1 WO 2022186285A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
film
semiconductor element
semiconductor
semiconductor device
Prior art date
Application number
PCT/JP2022/008906
Other languages
English (en)
Japanese (ja)
Inventor
翔太 青柳
和弘 山本
奏美 中村
紘平 谷口
Original Assignee
昭和電工マテリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電工マテリアルズ株式会社 filed Critical 昭和電工マテリアルズ株式会社
Priority to KR1020237023164A priority Critical patent/KR20230157294A/ko
Priority to CN202280010958.1A priority patent/CN116783258A/zh
Priority to JP2023503917A priority patent/JPWO2022186285A1/ja
Publication of WO2022186285A1 publication Critical patent/WO2022186285A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention concerne un adhésif en film. Cet adhésif en film contient une résine thermodurcissable, un agent de durcissement et un élastomère. La résine thermodurcissable contient une résine époxy qui a un squelette fluorène.
PCT/JP2022/008906 2021-03-05 2022-03-02 Adhésif en film, film de fixation de puce/découpage de puce intégré, dispositif à semi-conducteur, et procédé de production de dispositif à semi-conducteur WO2022186285A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020237023164A KR20230157294A (ko) 2021-03-05 2022-03-02 필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체장치 및 그 제조 방법
CN202280010958.1A CN116783258A (zh) 2021-03-05 2022-03-02 膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法
JP2023503917A JPWO2022186285A1 (fr) 2021-03-05 2022-03-02

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021035424 2021-03-05
JP2021-035424 2021-03-05

Publications (1)

Publication Number Publication Date
WO2022186285A1 true WO2022186285A1 (fr) 2022-09-09

Family

ID=83154625

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/008906 WO2022186285A1 (fr) 2021-03-05 2022-03-02 Adhésif en film, film de fixation de puce/découpage de puce intégré, dispositif à semi-conducteur, et procédé de production de dispositif à semi-conducteur

Country Status (5)

Country Link
JP (1) JPWO2022186285A1 (fr)
KR (1) KR20230157294A (fr)
CN (1) CN116783258A (fr)
TW (1) TW202244230A (fr)
WO (1) WO2022186285A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018225773A1 (fr) * 2017-06-07 2018-12-13 田中貴金属工業株式会社 Composition adhésive thermoconductrice et électroconductrice
JP2019172996A (ja) * 2018-03-28 2019-10-10 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
JP2020033419A (ja) * 2018-08-28 2020-03-05 日東電工株式会社 表面保護フィルム用基材、該基材の製造方法、該基材を用いた表面保護フィルム、および表面保護フィルム付光学フィルム
WO2020183581A1 (fr) * 2019-03-11 2020-09-17 日立化成株式会社 Composition d'agent adhésif, agent adhésif de type film, feuille adhésive et procédé de fabrication de dispositif à semi-conducteur
JP2021011512A (ja) * 2019-07-03 2021-02-04 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接着シート、ダイシング・ダイボンディング一体型接着シート、並びに半導体装置及びその製造方法
JP2021015161A (ja) * 2019-07-10 2021-02-12 互応化学工業株式会社 感光性接着剤組成物、ドライフィルム、及び多層基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2015211080A (ja) 2014-04-24 2015-11-24 日東電工株式会社 半導体装置の製造方法
JP6445315B2 (ja) 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018225773A1 (fr) * 2017-06-07 2018-12-13 田中貴金属工業株式会社 Composition adhésive thermoconductrice et électroconductrice
JP2019172996A (ja) * 2018-03-28 2019-10-10 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
JP2020033419A (ja) * 2018-08-28 2020-03-05 日東電工株式会社 表面保護フィルム用基材、該基材の製造方法、該基材を用いた表面保護フィルム、および表面保護フィルム付光学フィルム
WO2020183581A1 (fr) * 2019-03-11 2020-09-17 日立化成株式会社 Composition d'agent adhésif, agent adhésif de type film, feuille adhésive et procédé de fabrication de dispositif à semi-conducteur
JP2021011512A (ja) * 2019-07-03 2021-02-04 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接着シート、ダイシング・ダイボンディング一体型接着シート、並びに半導体装置及びその製造方法
JP2021015161A (ja) * 2019-07-10 2021-02-12 互応化学工業株式会社 感光性接着剤組成物、ドライフィルム、及び多層基板の製造方法

Also Published As

Publication number Publication date
JPWO2022186285A1 (fr) 2022-09-09
KR20230157294A (ko) 2023-11-16
CN116783258A (zh) 2023-09-19
TW202244230A (zh) 2022-11-16

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