WO2022186101A1 - 熱硬化性樹脂用硬化剤組成物、エポキシ樹脂組成物および繊維強化複合材料 - Google Patents
熱硬化性樹脂用硬化剤組成物、エポキシ樹脂組成物および繊維強化複合材料 Download PDFInfo
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- WO2022186101A1 WO2022186101A1 PCT/JP2022/008140 JP2022008140W WO2022186101A1 WO 2022186101 A1 WO2022186101 A1 WO 2022186101A1 JP 2022008140 W JP2022008140 W JP 2022008140W WO 2022186101 A1 WO2022186101 A1 WO 2022186101A1
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- Prior art keywords
- epoxy resin
- curing agent
- resin composition
- composition
- curing
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3227—Compounds containing acyclic nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
Definitions
- the present invention relates to a curing agent composition for thermosetting resins, and more particularly, to a curing agent composition for thermosetting resins that can produce an epoxy resin composition having a long pot life and quick curing properties.
- the present invention also relates to an epoxy resin composition and a fiber-reinforced composite material using the thermosetting resin curing agent composition.
- Fiber reinforced composite materials are lightweight, high strength, and high rigidity, and are used in a wide range of fields such as sports and leisure applications such as fishing rods and golf shafts, and industrial applications such as automobiles and aircraft. used.
- a fiber-reinforced composite material is manufactured by using a thermosetting resin or a thermoplastic resin as a matrix resin and combining this matrix resin with a reinforcing fiber base material.
- a resin transfer molding molding method (hereinafter referred to as , Sometimes referred to as "RTM molding method"), or a method in which a reinforcing fiber base material is impregnated with a matrix resin in advance to form a prepreg (intermediate base material) in a sheet shape, and this is molded into a desired shape. It has been known.
- the RTM molding method has attracted attention because it requires only a few steps and does not require expensive equipment such as an autoclave, so it is possible to manufacture fiber-reinforced composite materials at low cost and with high productivity.
- the matrix resin used in the RTM molding method is an epoxy resin composition containing an epoxy resin and a curing agent.
- aromatic polyamines it is common to use aromatic polyamines as curatives.
- the curing agent and additives are dissolved in the epoxy resin in order to prevent the curing agent from being filtered out when the reinforcing fiber base material is impregnated with the epoxy resin composition. are often stored and used in Such an epoxy resin composition in which a curing agent and additives are dissolved in the epoxy resin is called a one-liquid type epoxy resin composition.
- the reaction between the epoxy resin and the curing agent is relatively easy to occur, and the shelf life is short. Therefore, the one-liquid type epoxy resin composition needs to be stored frozen, which poses a problem in handleability.
- a two-liquid type epoxy resin composition is composed of a main liquid containing an epoxy resin as a main component and a curing agent liquid containing a curing agent as a main component, and is an epoxy resin composition obtained by mixing the two immediately before use. is.
- the curing agent used for the one-component epoxy resin composition can also be used as the curing agent for the two-component epoxy resin composition.
- the aromatic polyamine curing agent used is usually solid, and is likely to cause poor mixing with the main liquid.
- a two-component epoxy resin composition ease of mixing is important because the base liquid and hardener liquid are mixed immediately before use. If the curing agent used for the one-component epoxy resin composition is used as the curing agent for the two-component epoxy resin composition, poor mixing tends to occur. This is because aromatic polyamines used as curing agents in one-liquid epoxy resin compositions are usually solid. For this reason, it is desirable that the curing agent be liquid in the two-liquid type epoxy resin composition.
- Patent Documents 2 and 3 describe epoxy resin compositions using a liquid aromatic polyamine as a curing agent. However, resin cured products obtained from these epoxy resin compositions do not have sufficient mechanical properties such as elastic modulus and fracture toughness.
- Patent Document 4 proposes a fast-curing two-component epoxy resin composition using a compound having two or more aromatic rings having phenolic hydroxyl groups.
- a compound having a phenolic hydroxyl group is added to the epoxy resin composition, the viscosity of the resin composition increases rapidly due to its high reactivity, and the pot life in RTM molding is extremely shortened. It becomes difficult to impregnate the inside with a sufficient amount of the epoxy resin composition. Therefore, a fiber-reinforced composite material produced using such an epoxy resin composition contains many defects such as voids. As a result, there is a problem that the compression performance and damage tolerance of the fiber-reinforced composite material are lowered.
- a two-liquid type epoxy resin composition capable of obtaining a fiber-reinforced composite material or a resin cured product having a sufficiently fast curing property and having the heat resistance and mechanical properties required for industrial applications such as automobiles and aircraft. has not been known so far, and the liquid curing agent used therefor has not been known so far.
- the first object of the present invention is to provide a curing agent composition for thermosetting resins that can produce an epoxy resin composition having a long pot life and sufficiently fast curing properties.
- the present invention aims to provide a curing agent composition for thermosetting resins, which becomes a uniform liquid when heated to a temperature of 200° C. or lower, and can maintain the uniform liquid state at room temperature for a period of one week or longer. Make it an issue.
- a second object of the present invention is to provide an epoxy resin composition that has a low viscosity, a long pot life, and sufficiently fast curing properties.
- an object of the present invention is to provide a two-liquid type epoxy resin composition which has a low viscosity, a long pot life, and a sufficiently rapid curability.
- Another object of the present invention is to provide cured resins and fiber-reinforced composite materials that have the heat resistance and mechanical properties required for industrial applications.
- a first aspect of the present invention is a thermosetting resin curing agent composition containing a curing agent A, a curing agent B and a curing agent C, wherein the curing agent A has two ortho positions to an amino group.
- curing agent B is an aromatic polyamine that is liquid at 25° C.
- curing agent C is , an aromatic polyamine, wherein the aromatic polyamine is an aromatic polyamine having only one electron-donating group at the ortho-position to the amino group or having no substituents at the ortho-position.
- This is a resin curing agent composition.
- the curing agent composition for thermosetting resins of the present invention is used for the production of epoxy resin compositions. At this time, the curing agent composition for thermosetting resins of the present invention is used together with an epoxy resin base agent.
- Epoxy resin D and epoxy resin E are preferably used as the main epoxy resin.
- the epoxy resin composition preferably further contains resin particles F. Epoxy resin D, epoxy resin E and resin particles F will be described later in detail.
- the above epoxy resin composition comprising the thermosetting resin curing agent composition of the present invention, the epoxy resin D, the epoxy resin E and the resin particles F is the second invention of the present invention.
- the second invention of the present invention is an epoxy resin composition containing a curing agent A, a curing agent B, a curing agent C, an epoxy resin D, an epoxy resin E and resin particles F, wherein the curing agent A is an aromatic polyamine having substituents in each of the two ortho-positions to the amino group, said substituents being selected from alkyl groups, aromatic groups and halogen groups; curing agent B is an aromatic polyamine which is liquid at 25°C.
- the curing agent C is an aromatic polyamine, and the aromatic polyamine is an aromatic polyamine that has only one electron-donating group at the ortho-position to the amino group or has no substituents at the ortho-position.
- the epoxy resin D is composed of an epoxy resin composed of a monomer containing 4 or more glycidyl groups
- the epoxy resin E is composed of an epoxy resin composed of a monomer containing 2 or 3 glycidyl groups.
- thermosetting resins that can produce an epoxy resin composition having a long pot life and sufficiently fast curing properties.
- a curing agent composition for thermosetting resins that can produce a two-liquid type epoxy resin composition having a long pot life and sufficiently fast curing properties.
- a curing agent composition for thermosetting resins which becomes a uniform liquid when heated to a temperature of 200° C. or less, and can maintain the uniform liquid state at room temperature for a period of one week or longer. can.
- an epoxy resin composition having a low viscosity, a long pot life, and sufficiently fast curing properties it is possible to provide a two-liquid type epoxy resin composition having a low viscosity, a long pot life, and a sufficiently fast curing property.
- the present invention can provide cured resins and fiber-reinforced composite materials that have the heat resistance and mechanical properties required for industrial applications.
- a fiber reinforced composite material may be abbreviated as "FRP”, and a carbon fiber reinforced composite material as "CFRP”.
- the curing agent composition for thermosetting resins of the present invention is a curing agent composition for thermosetting resins containing curing agent A, curing agent B and curing agent C. This curing agent composition for thermosetting resin becomes a uniform liquid by heating to a temperature of 80 to 200°C.
- the curing agent composition for thermosetting resins of the present invention becomes a uniform liquid at a temperature of 80 to 200° C. After raising the liquid temperature to 200° C., lowering the temperature to 25° C., and allowing it to stand at 25° C. for 1 week, Preferably, it is a uniform liquid even after standing still for 2 weeks (3 weeks in total), and particularly preferably after standing still for 1 month.
- the curing agent for thermosetting resin is substantially liquid. It is not preferable because it becomes difficult to handle as a composition and poor mixing with the main component liquid is likely to occur.
- the total weight of curing agent A, curing agent B and curing agent C is preferably 70 to 100 mass based on the total mass of the curing agent composition for thermosetting resin. %.
- Curing agent A is an aromatic polyamine having two substituents each ortho to the amino group, the substituents being selected from alkyl groups, aromatic groups and halogen groups. Also, curing agent A is solid at 25°C. By containing this curing agent A, when cured as a composition with an epoxy resin, it is possible to obtain an epoxy resin cured product having excellent mechanical properties such as heat resistance, elastic modulus, and fracture toughness.
- a compound represented by the following chemical formula (1) can be used as an aromatic polyamine having substituents at two ortho-positions to an amino group, which is used as the curing agent A.
- R 1 to R 4 are each independently an aliphatic substituent, an aromatic substituent, an alkoxy group or a halogen atom, and at least one substituent has a carbon number Any of 1 to 6 aliphatic substituents, aromatic substituents and halogen atoms.
- aliphatic substituents having 1 to 6 carbon atoms include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group and n-pentyl group. , neopentyl group, n-hexyl group, and cyclohexyl group.
- a phenyl group and a naphthyl group are illustrated as an aromatic substituent.
- the aromatic polyamine of the curing agent A is preferably an aromatic diamine, with 4,4'-diaminodiphenylmethane derivatives being particularly preferred.
- this aromatic polyamine include compounds represented by the following chemical formulas (2) to (5). These may be used alone or in combination.
- Hardener B is an aromatic polyamine that is liquid at 25°C. By containing this aromatic polyamine, it is possible to obtain a curing agent composition for thermosetting resins that can maintain a liquid state at room temperature.
- a phenylenediamine derivative or a 4,4'-diaminodiphenylmethane derivative is preferably used as the aromatic polyamine for the curing agent B.
- this aromatic polyamine include compounds represented by the following chemical formula (6) or (7).
- R 5 to R 8 are each independently a hydrogen atom, an aliphatic substituent, an alkoxy group or a thioalkoxy group, and at least one substituent has 1 to 6 carbon atoms. is either an aliphatic substituent of or a thioalkoxy group.
- R 9 to R 10 are each independently an aliphatic substituent, a methoxy group, an alkoxy group or a thioalkoxy group.
- X is -CH 2 -.
- aromatic polyamine used as the curing agent B include compounds represented by the following chemical formulas (8) to (12). These may be used alone or in combination.
- the mass ratio of curing agent A to curing agent B is preferably 1:99 to 99:1, more preferably 20:80 to 80:20, particularly preferably 40:60 to 70:30. If the proportion of the curing agent A is less than this, mechanical properties such as heat resistance, elastic modulus, and fracture toughness of the resulting resin cured product tend to be insufficient, which is undesirable. On the other hand, if the ratio of the curing agent A is higher than this, it becomes difficult for the obtained curing agent composition for thermosetting resins to maintain a liquid state at room temperature, which is undesirable.
- Curing agent C is an aromatic polyamine having only one electron donating group ortho to the amino group or no substituents ortho to the amino group.
- the electron-donating group of the aromatic polyamine of curing agent C is preferably methyl, ethyl, propyl, isopropyl, methoxy or ethoxy.
- the melting point of the curing agent C is preferably 200°C or lower, more preferably 150°C or lower, and particularly preferably 120°C or lower. If the melting point exceeds 200° C., it becomes difficult to obtain a liquid composition when the curing agent C is mixed with the curing agents A and B, and the obtained curing agent composition for thermosetting resins is cooled at room temperature. It is not preferable because it tends to be difficult to maintain the liquid state.
- the curing agent C is preferably 1 to 43 parts by mass, more preferably 3 to 30 parts by mass with respect to a total of 100 parts by mass of the curing agent A and the curing agent B. parts, particularly preferably 5 to 20 parts by weight. If the content is less than 1 part by mass, it becomes difficult to impart rapid curability to the resulting epoxy resin composition, which is not preferred. On the other hand, when it exceeds 43 parts by mass, the reactivity of the obtained epoxy resin composition becomes excessively high, and the pot life in RTM molding becomes extremely short, which is not preferable.
- epoxy resin composition The present invention further provides an epoxy resin composition.
- This epoxy resin composition contains the thermosetting resin curing agent composition described above and the epoxy resin main agent described below.
- the total amount of the curing agent contained in the epoxy resin composition of the present invention is an amount suitable for curing all the epoxy resins blended in the epoxy resin composition, depending on the type of epoxy resin and curing agent used. adjusted accordingly.
- This ratio is preferably 0.7 to 1.3, more preferably 0.8 to 1.2, particularly preferably 0.9 to 1.1.
- the ratio of the number of active hydrogens is less than 0.7 or exceeds 1.3, the molar balance between the epoxy groups and the active hydrogens will be disturbed, and the resulting cured resin will have insufficient cross-linking density, resulting in poor heat resistance and elasticity. It is not preferable because the mechanical properties such as modulus and fracture toughness are lowered.
- Epoxy resin main agent contains the epoxy resin described below. Epoxy resin D and epoxy resin E, which will be described later, are particularly preferable as the epoxy resin contained in the epoxy resin main agent, and the embodiment containing both is most preferable.
- the epoxy resin main agent may further contain other components.
- the content of the epoxy resin in the epoxy resin main agent is preferably 30 to 100% by weight, more preferably 50 to 100% by weight, based on the total weight of the epoxy resin main agent.
- Epoxy resins such as tetraglycidyl-4,4'-diaminodiphenylmethane, tetraglycidyl-4,4'-diaminodiphenylsulfone, tetraglycidyl-3,3'-diaminodiphenylsulfone, tetraglycidyl-4,4'-diaminodiphenyl ether, Tetraglycidyl-3,4'-diaminodiphenyl ether, tetrafunctional glycidylamine type epoxy resins, triglycidyl-m-aminophenol, triglycidyl-p-aminophenol, triglycidyl isocyanurate, trifunctional epoxy resins such as di glycidylaniline and its derivatives diglycidyl-o-toluidine, diglycidyl-m-toluidine, diglycidyl-p-
- Epoxy resin may be synthesized as needed. For example, it can be obtained by reacting an aromatic diamine, aminophenol, or diphenol as a raw material with an epihalohydrin such as epichlorohydrin to obtain a halohydrin body, followed by a cyclization reaction using an alkaline compound. can.
- an epihalohydrin such as epichlorohydrin
- epihalohydrin examples include epichlorohydrin, epibromohydrin, and epifluorohydrin. Among them, epichlorohydrin and epibromohydrin are particularly preferable from the viewpoint of reactivity and handleability.
- the molar ratio of aromatic diamine, aminophenol, diphenol and epihalohydrin is preferably 1:1 to 1:30, more preferably 1:3 to 1:20.
- Solvents used in the reaction include alcohol solvents such as ethanol and n-butanol, ketone solvents such as methyl isobutyl ketone and methyl ethyl ketone, aprotic polar solvents such as acetonitrile and N,N-dimethylformamide, and aromatic solvents such as toluene and xylene. group hydrocarbon solvents can be exemplified.
- the amount of the solvent to be used is preferably 1 to 10 times the weight of the aromatic diamine.
- the reaction time is preferably 0.1 to 180 hours, more preferably 0.5 to 24 hours.
- the reaction temperature is preferably 20-100°C, more preferably 40-80°C.
- alkaline compounds used during the cyclization reaction include sodium hydroxide and potassium hydroxide.
- the alkaline compound may be added as a solid or as an aqueous solution.
- phase transfer catalyst may be used during the cyclization reaction.
- Phase transfer catalysts such as quaternary ammonium salts such as tetramethylammonium chloride, tetraethylammonium bromide, benzyltriethylammonium chloride, and tetrabutylammonium hydrogen sulfate; phosphonium compounds such as tributylhexadecylphosphonium bromide and tributyldodecylphosphonium bromide; Crown ethers such as 18-crown-6-ether can be exemplified.
- the epoxy resin main agent may further contain a thermoplastic resin in addition to the epoxy resin.
- the thermoplastic resin improves the fracture toughness and impact resistance of the resulting fiber-reinforced composite material.
- Such a thermoplastic resin may be dissolved in the thermosetting resin curing agent composition during the production process of the thermosetting resin curing agent composition.
- thermoplastic resins examples include polyethersulfone, polysulfone, polyetherimide, and polycarbonate. These may be used alone or in combination of two or more.
- Polyethersulfone or polysulfone having a weight average molecular weight (Mw) in the range of 8000 to 100000 as measured by gel permeation chromatography is particularly preferred as the thermoplastic resin.
- Mw weight average molecular weight
- the resulting FRP has sufficient impact resistance, and when it is 100,000 or less, the epoxy resin composition exhibits good handleability without significantly increasing viscosity. can be obtained.
- the molecular weight distribution of this thermoplastic resin is preferably uniform.
- the polydispersity (Mw/Mn) which is the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), is preferably 1-10, more preferably 1.1-5.
- the thermoplastic resin preferably has a reactive group that is reactive with the epoxy resin or a functional group that forms a hydrogen bond.
- the thermoplastic resin can improve the dissolution stability during the curing process of the epoxy resin.
- fracture toughness, chemical resistance, heat resistance, and resistance to moist heat can be imparted to the fiber-reinforced composite material obtained after curing.
- a hydroxyl group, a carboxylic acid group, an imino group, and an amino group are preferable as the reactive group having reactivity with the epoxy resin.
- the use of hydroxyl-terminated polyethersulfone is particularly preferred because the resulting fiber-reinforced composite material has particularly excellent impact resistance, fracture toughness and solvent resistance.
- the curing agent composition for thermosetting resins of the present invention contains a thermoplastic resin
- its content is appropriately adjusted according to the viscosity.
- the amount is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the curing agent composition for thermosetting resins.
- the amount is 0.1 parts by mass or more, the resulting fiber-reinforced composite material exhibits sufficient fracture toughness and impact resistance.
- thermoplastic resin When the content of the thermoplastic resin is 10 parts by mass or less, the viscosity of the epoxy resin composition does not significantly increase, the impregnation of the reinforcing fiber base material becomes easy, and the properties of the resulting fiber-reinforced composite material are improved. do.
- the thermoplastic resin preferably contains a reactive aromatic oligomer having an amine end group (hereinafter also simply referred to as "aromatic oligomer").
- the epoxy resin composition of the present invention has a high molecular weight due to the curing reaction between the epoxy resin and the curing agent during heat curing.
- the expansion of the two-phase region due to the increase in the molecular weight causes the aromatic oligomer dissolved in the epoxy resin composition to undergo reaction-induced phase separation. Due to this phase separation, a two-phase resin structure in which the cured epoxy resin and the aromatic oligomer are co-continuous is formed in the matrix resin.
- aromatic oligomers have amine end groups, they also react with epoxy resins. Since each phase in this co-continuous two-phase structure is strongly bonded to each other, solvent resistance is also improved.
- the aromatic oligomer known polysulfones having amine end groups and polyether sulfones having amine end groups can be used.
- the amine end groups are primary amine (--NH 2 ) end groups.
- the aromatic oligomer preferably has a weight average molecular weight of 8,000 to 40,000 as measured by gel permeation chromatography.
- the weight average molecular weight is 8000 or more, the effect of improving the toughness of the matrix resin is high. Further, when the weight average molecular weight is 40,000 or less, processing advantages such as facilitating impregnation of the reinforcing fiber base material with the resin composition can be obtained without excessively increasing the viscosity of the resin composition.
- composition ratio of epoxy resin composition Based on the total mass of curing agents contained in the epoxy resin composition, the total amount of curing agent A, curing agent B and curing agent C is preferably 70 to 100% by mass, more preferably 80 to 100% by mass. . If it is less than 70% by mass, the cured resin may have insufficient heat resistance, which is not preferable.
- the mass ratio of curing agent A to curing agent B is preferably 1:99 to 99:1, more preferably 20:80 to 80:20, particularly preferably 40:60 to 70:30. is. If the ratio of the curing agent A is less than 1, the resulting cured product tends to have insufficient mechanical properties such as heat resistance, elastic modulus and fracture toughness, which is undesirable. On the other hand, if the ratio of the curing agent A exceeds 99, it becomes difficult for the obtained curing agent composition for thermosetting resins to maintain a liquid state at room temperature, which is not preferable.
- the curing agent C is preferably 1 to 43 parts by mass, more preferably 3 to 30 parts by mass, more preferably 5 to 100 parts by mass in total of the curing agent A and the curing agent B. 20 parts by mass are contained. If the curing agent C is less than 1 part by mass, it is difficult to impart rapid curability to the resulting epoxy resin composition, which is not preferred. On the other hand, when it exceeds 43 parts by mass, the reactivity of the obtained epoxy resin composition becomes excessively high, and the pot life in RTM molding becomes extremely short, which is not preferable.
- Epoxy resin D The epoxy resin D, which is particularly preferable as the epoxy resin contained in the epoxy resin main component and the epoxy resin composition, will be described in detail below.
- Epoxy resin D is an epoxy resin composed of monomers containing 4 or more glycidyl groups.
- Epoxy resin D may be a homopolymer composed of one type of monomer, a copolymer composed of two or more types of monomers, or a mixture of homopolymers and/or copolymers. .
- the constituent monomer of the epoxy resin D composed of monomers containing 4 or more glycidyl groups is preferably represented by the following chemical formula (13).
- R 1 to R 4 are aliphatic hydrocarbon groups or alicyclic hydrocarbon groups, they preferably have 1 to 4 carbon atoms.
- tetraglycidyl-4,4'-diaminodiphenyl ether As constituent monomers of epoxy resin D, tetraglycidyl-4,4'-diaminodiphenyl ether, tetraglycidyl-4,4'-diaminodiphenylmethane, tetraglycidyl-3,4'-diaminodiphenyl ether and tetraglycidyl-3,3'-diamino
- One or a combination of two or more selected from the group consisting of diphenylmethane is particularly preferred.
- Epoxy resin D is preferably a homopolymer, copolymer or mixture thereof composed of these monomers. It is preferable that R 1 to R 4 are hydrogen atoms, because formation of a special steric structure in the cured resin is less likely to be inhibited. In addition, X is preferably -O- because it facilitates the synthesis of the compound.
- the constituent monomers of epoxy resin D may be synthesized by any method.
- an aromatic diamine and an epihalohydrin such as epichlorohydrin, which are raw materials, are reacted preferably in the presence of an acid catalyst to obtain a tetrahalohydrin body, and then subjected to a cyclization reaction using an alkaline compound.
- an acid catalyst preferably in the presence of an acid catalyst to obtain a tetrahalohydrin body
- an alkaline compound e.g., it can be synthesized by the method described in Examples below.
- aromatic diamines 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 3,4 '-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl methane can be exemplified.
- aromatic diamines in which two aromatic rings having amino groups are linked by an ether bond are preferable, one amino group is para-positioned with respect to the ether bond, and the other amino group is More preferably, it is an ortho-located aromatic diamine.
- aromatic diamines include 3,4'-diaminodiphenyl ether and 3,4'-diaminodiphenyl sulfone.
- epihalohydrin examples include epichlorohydrin, epibromohydrin, and epifluorohydrin.
- epichlorohydrin and epibromohydrin are particularly preferred from the viewpoint of reactivity and handleability.
- the mass ratio of the raw materials, aromatic diamine and epihalohydrin is preferably 1:1 to 1:20, more preferably 1:3 to 1:10.
- Solvents used in the reaction include alcohol solvents such as ethanol and n-butanol, ketone solvents such as methyl isobutyl ketone and methyl ethyl ketone, aprotic polar solvents such as acetonitrile and N,N-dimethylformamide, and aromatic solvents such as toluene and xylene.
- group hydrocarbon solvents can be exemplified.
- Alcohol solvents such as ethanol and n-butanol, and aromatic hydrocarbon solvents such as toluene and xylene are particularly preferred.
- the amount of solvent used is preferably 1 to 10 times the mass of the aromatic diamine.
- Bronsted acids and Lewis acids can be suitably used as acid catalysts.
- Preferred Bronsted acids are ethanol, water and acetic acid, and preferred Lewis acids are titanium tetrachloride, lanthanum nitrate hexahydrate and boron trifluoride diethyl ether complex.
- the reaction time is preferably 0.1 to 180 hours, more preferably 0.5 to 24 hours.
- the reaction temperature is preferably 20-100°C, more preferably 40-80°C.
- alkaline compounds used during the cyclization reaction include sodium hydroxide and potassium hydroxide.
- the alkaline compound may be added as a solid or as an aqueous solution.
- phase transfer catalyst may be used during the cyclization reaction.
- Phase transfer catalysts such as quaternary ammonium salts such as tetramethylammonium chloride, tetraethylammonium bromide, benzyltriethylammonium chloride, and tetrabutylammonium hydrogen sulfate; phosphonium compounds such as tributylhexadecylphosphonium bromide and tributyldodecylphosphonium bromide; Crown ethers such as 18-crown-6-ether can be exemplified.
- the ratio of the epoxy resin D to the total amount of the epoxy resin (epoxy resin base liquid) is preferably 50 to 90% by mass, particularly preferably 60 to 80% by mass.
- the proportion of the epoxy resin D is 50% by mass or more, the heat resistance and elastic modulus of the obtained cured resin can be further improved. As a result, various mechanical properties of the resulting fiber-reinforced composite material are also improved.
- Epoxy resin E The epoxy resin E, which is particularly preferable as the epoxy resin contained in the epoxy resin main agent and the epoxy resin composition, will be described in detail below.
- Epoxy resin E is an epoxy resin composed of a monomer containing two or three glycidyl groups.
- the viscosity of the epoxy resin composition can be reduced to improve the resin impregnation property of the reinforcing fiber base material, the pot life can be extended, and it can be used in the RTM molding method.
- the degree of freedom in mold design can be increased.
- a constituent monomer of epoxy resin E a monomer having two or three glycidyl groups is used.
- it is an aromatic compound.
- Monomers having two glycidyl groups include diglycidylaniline and its derivatives diglycidyl-o-toluidine, diglycidyl-m-toluidine, diglycidyl-p-toluidine, diglycidyl-xylidine, diglycidyl-mesidine, diglycidyl-anisidine, diglycidyl-phenoxy Aniline, diglycidyl-naphthylamine and derivatives thereof are preferably used.
- diglycidyl-aniline, diglycidyl-o-toluidine, diglycidyl-m-toluidine, diglycidyl-p-toluidine and diglycidyl-phenoxyaniline are more preferably used, and diglycidyl-aniline or diglycidyl-o-toluidine is more preferably used.
- an epoxy resin having a polycyclic aromatic hydrocarbon skeleton is preferable.
- polycyclic aromatic hydrogen cyclic skeletons examples include naphthalene skeletons and anthracene skeletons, and naphthalene skeletons are preferred from the viewpoint of the physical properties of cured resins.
- the polycyclic aromatic hydrocarbon group may have a substituent in addition to the glycidyl group.
- Monomers having a naphthalene skeleton include 1,6-bis(glycidyloxy)naphthalene, 1,5-bis(glycidyloxy)naphthalene, 2,6-bis(glycidyloxy)naphthalene, and 2,7-bis(glycidyloxy)naphthalene. , 2,2′-bis(glycidyloxy)-1,1′-binaphthalene, and 2,7-bis(glycidyloxy)-1-[2-(glycidyloxy)-1-naphthylmethyl]naphthalene. can.
- an epoxy resin containing these compounds as constituent monomers, the viscosity of the epoxy resin composition can be lowered and the heat resistance of the cured resin can be improved.
- the crosslink density of the cured product does not excessively increase, so that the resin can be cured. It is preferable because it can prevent deterioration of the toughness of the object.
- epoxy resins composed of monomers containing two or three glycidyl groups
- aromatic compounds having three glycidyl groups are preferred as constituent monomers of epoxy resin E.
- this epoxy resin a triglycidylaminophenol derivative epoxy resin is preferable.
- triglycidylaminophenol derivative epoxy resins include triglycidyl-m-aminophenol and triglycidyl-p-aminophenol.
- the epoxy resin E preferably contains a triglycidyl isocyanurate derivative epoxy resin.
- triglycidyl isocyanurate derivative epoxy resins include 1,3,5-triglycidyl isocyanurate, 1,3,5-tri(ethylglycidyl) isocyanurate, and 1,3,5-tri(pentylglycidyl) isocyanurate. be able to. By containing these, the heat resistance and elastic modulus of the cured epoxy resin can be improved. Therefore, by using it in combination with the epoxy resin D, it is possible to obtain a resin cured product and a fiber-reinforced composite material that maintain heat resistance and a high elastic modulus.
- epoxy resin E diglycidylaniline, diglycidyl-o-toluidine, triglycidyl-p-aminophenol, triglycidyl-m-aminophenol, 1,6-bis(2,3-epoxypropan-1-yloxy )
- Epoxy resins E are particularly preferably homopolymers, copolymers and mixtures thereof composed of these monomers.
- epoxy resin E examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin.
- the content of the epoxy resin E in the epoxy resin composition of the present invention is preferably 10 to 50% by mass, more preferably 20 to 40% by mass, based on the total mass of the epoxy resin (epoxy resin base liquid). By setting the content of the epoxy resin E relative to the total mass of the epoxy resin within this range, it is possible to produce an epoxy resin composition having a viscosity and pot life suitable for the RTM molding method and having high heat resistance. .
- the epoxy resin composition of the present invention preferably further contains resin particles F.
- the resin particles F will be described below.
- the resin particles F are dispersed in the epoxy resin composition without being dissolved, and are present in the cured resin in a dispersed state even in the cured resin after the epoxy resin composition is cured.
- the resin cured product is used as the sea component, the resin particles F are present in the resin cured product as island components.
- thermoplastic resin particles thermosetting resin particles
- rubber particles can be used as the resin particles F.
- Rubber particles are preferably used.
- rubber particles include silicone rubber, butadiene rubber, styrene-butadiene rubber, and methyl methacrylate-butadiene-styrene rubber.
- Rubber particles used as resin particles F include MX-153 (bisphenol A type epoxy resin with 33% by mass of butadiene rubber monodispersed, manufactured by Kaneka Corporation), MX-257 (bisphenol A type Epoxy resin with 37% by mass of butadiene rubber monodispersed, manufactured by Kaneka Corporation), MX-154 (bisphenol A type epoxy resin with 40% by mass of butadiene rubber monodispersed, stock Kaneka Company), MX-960 (Bisphenol A type epoxy resin with 25% by mass of silicone rubber dispersed in a single dispersion, manufactured by Kaneka Corporation), MX-136 (Bisphenol F type epoxy resin with 25% by mass monodispersed butadiene rubber, manufactured by Kaneka Co., Ltd.), MX-965 (bisphenol F type epoxy resin, monodispersed with 25% by mass of silicone rubber, manufactured by Kaneka Co., Ltd.), MX- 217 (25% by mass of butadiene rubber dispersed in phenol novolak type epoxy resin, manufactured by Kaneka Corporation
- the average particle size of the resin particles F is preferably 1.0 ⁇ m or less, more preferably 0.5 ⁇ m or less, and particularly preferably 0.3 ⁇ m or less.
- the average particle size is preferably 0.03 ⁇ m or more, more preferably 0.05 ⁇ m or more, and particularly preferably 0.08 ⁇ m or more.
- the resin particles F are not filtered out on the surface of the reinforcing fiber base material, and can enter the reinforcing fiber bundle. Impregnation becomes easier. As a result, impregnation failure of the resin can be prevented, and a fiber-reinforced composite material having excellent physical properties can be obtained.
- the content of the resin particles F in the epoxy resin composition of the present invention is preferably 0.1 to 50% by mass, more preferably 0.5 to 20% by mass, particularly preferably 1 to 50% by mass, based on the total amount of the epoxy resin composition. 15% by mass. By setting the content to 0.1% by mass or more, the fracture toughness and impact resistance of the cured resin and fiber composite material can be sufficiently improved.
- the resin particles F can also be used as a masterbatch dispersed in an epoxy resin at a high concentration. In this case, it becomes easy to highly disperse the resin particles F in the epoxy resin composition.
- thermosetting resin curing agent composition and epoxy resin composition of the present invention may further contain other components, such as conductive particles, flame retardants, inorganic fillers, and internal release agents. You may
- Conductive particles include conductive polymer particles such as polyacetylene particles, polyaniline particles, polypyrrole particles, polythiophene particles, polyisothianaphthene particles and polyethylenedioxythiophene particles, carbon particles, carbon fiber particles, metal particles, inorganic materials or organic materials. Particles in which a core material composed of is coated with a conductive substance can be exemplified.
- a phosphorus-based flame retardant can be exemplified as a flame retardant.
- the phosphorus-based flame retardant may contain a phosphorus atom in the molecule, and examples thereof include organic phosphorus compounds such as phosphoric acid esters, condensed phosphoric acid esters, phosphazene compounds and polyphosphates, and red phosphorus.
- inorganic fillers examples include aluminum borate, calcium carbonate, silicon carbonate, silicon nitride, potassium titanate, basic magnesium sulfate, zinc oxide, graphite, calcium sulfate, magnesium borate, magnesium oxide, and silicate minerals. can do. In particular, it is preferable to use silicate minerals. As a commercially available silicate mineral, THIXOTROPIC AGENT DT 5039 (manufactured by Huntsman Japan Co., Ltd.) can be exemplified.
- internal mold release agents include metal soaps, vegetable waxes such as polyethylene wax and carnauba wax, fatty acid ester mold release agents, silicone oils, animal waxes, and fluorine-based nonionic surfactants.
- Commercially available internal release agents include MOLD WIZ (registered trademark), INT1846 (manufactured by AXEL PLASTICS RESEARCH LABORATORIES INC.), Licowax S, Licowax P, Licowax OP, Licowax PE190, Licowax PED (manufactured by Clariant Japan), Stearyl Stea Rate (SL-900A; manufactured by Riken Vitamin Co., Ltd.) can be exemplified.
- the epoxy resin composition of the present invention may contain a thermoplastic resin as a component to be dissolved in the epoxy resin composition.
- the thermoplastic resin improves the fracture toughness and impact resistance of the resulting fiber-reinforced composite material.
- Such thermoplastic resins may be dissolved in the epoxy resin composition during the curing process of the epoxy resin composition.
- thermoplastic resins include polyethersulfone, polysulfone, polyetherimide, and polycarbonate. These may be used alone or in combination of two or more.
- This thermoplastic resin is particularly preferably polyethersulfone or polysulfone having a weight average molecular weight (Mw) in the range of 8000 to 100000 as measured by gel permeation chromatography.
- Mw weight average molecular weight
- the resulting FRP has sufficient impact resistance, and when it is 100,000 or less, the epoxy resin composition exhibits good handleability without significantly increasing viscosity. can get things.
- the molecular weight distribution of this thermoplastic resin is preferably uniform, and the polydispersity (Mw/Mn), which is the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), is preferably 1 to 10, more preferably is 1.1-5.
- the thermoplastic resin preferably has a reactive group that is reactive with the epoxy resin or a functional group that forms a hydrogen bond.
- Such thermoplastic resins can improve the dissolution stability during the curing process of epoxy resins.
- fracture toughness, chemical resistance, heat resistance and resistance to moist heat can be imparted to the fiber-reinforced composite material obtained after curing.
- a hydroxyl group, a carboxylic acid group, an imino group, an amino group, etc. are preferable as the reactive group having reactivity with the epoxy resin.
- the use of hydroxyl-terminated polyethersulfone is more preferable because the resulting fiber-reinforced composite material has particularly excellent impact resistance, fracture toughness and solvent resistance.
- the content of the thermoplastic resin contained in the epoxy resin composition is appropriately adjusted according to the viscosity.
- a thermoplastic resin is contained, it is preferably 0.1 to 10 parts by mass, more preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the epoxy resin contained in the epoxy resin composition, from the viewpoint of impregnation of the reinforcing fiber base material. is 0.5 to 5 parts by mass.
- the resulting fiber-reinforced composite material exhibits sufficient fracture toughness and impact resistance.
- the content is 10 parts by mass or less, the viscosity of the epoxy resin composition does not significantly increase, the impregnation of the reinforcing fiber substrate is facilitated, and the properties of the resulting fiber-reinforced composite material are improved.
- the thermoplastic resin preferably contains a reactive aromatic oligomer having an amine end group (hereinafter also simply referred to as "aromatic oligomer").
- the epoxy resin composition has a high molecular weight due to the curing reaction between the epoxy resin and the curing agent during heat curing.
- the expansion of the two-phase region due to the increase in the molecular weight causes the aromatic oligomer dissolved in the epoxy resin composition to undergo reaction-induced phase separation. Due to this phase separation, a two-phase resin structure in which the cured epoxy resin and the aromatic oligomer are co-continuous is formed in the matrix resin.
- aromatic oligomers have amine end groups, they also react with epoxy resins. Since each phase in this co-continuous two-phase structure is strongly bonded to each other, solvent resistance is also improved.
- the aromatic oligomer known polysulfones having amine end groups and polyether sulfones having amine end groups can be used.
- the amine end groups are primary amine (--NH 2 ) end groups.
- the aromatic oligomer When blending an aromatic oligomer into the epoxy resin composition, the aromatic oligomer preferably has a weight average molecular weight of 8,000 to 40,000 as measured by gel permeation chromatography. When the weight average molecular weight is 8000 or more, the effect of improving the toughness of the matrix resin is high. Moreover, when the weight average molecular weight is 40,000 or less, the viscosity of the resin composition does not become excessively high, and processing advantages such as facilitating impregnation of the reinforcing fiber base material with the resin composition can be obtained.
- the form of the thermoplastic resin before being blended into the epoxy resin composition is preferably particulate.
- the particulate thermoplastic resin can be uniformly blended and dissolved in the resin composition.
- the epoxy resin composition of the present invention can have the following preferred properties.
- the viscosity of the epoxy resin composition of the present invention at 100°C is preferably 300 mPa ⁇ s or less, more preferably 50 mPa ⁇ s or less, still more preferably 30 mPa ⁇ s or less, and particularly preferably 20 mPa ⁇ s or less.
- the viscosity at 100° C. is preferably 0.1 mPa ⁇ s or more, more preferably 0.5 mPa ⁇ s or more.
- the working life of the epoxy resin composition of the present invention varies depending on the molding conditions of the fiber-reinforced composite material.
- the pot life is preferably 40 minutes or more, more preferably It is 60 minutes or longer, more preferably 90 minutes or longer, still more preferably 180 minutes or longer, particularly preferably 300 minutes or longer.
- the pot life is the time until the viscosity reaches 50 mPa ⁇ s when kept at 100°C.
- an epoxy resin composition in which the cured product obtained by curing at 180°C for 30 minutes has a DSC curing degree ⁇ represented by the following formula of 98% or more.
- the epoxy resin composition of the present invention is an epoxy resin composition in which a cured product obtained by curing at 180° C. for 30 minutes has a DSC curing degree ⁇ represented by the above formula of 98% or more.
- the DSC curing degree ⁇ is 98% or more, excellent heat resistance and mechanical properties can be obtained, and changes in properties over time can be suppressed.
- the present invention is also a resin cured product obtained by curing the above epoxy resin composition.
- the cured resin has a glass transition temperature of preferably 150°C or higher, more preferably 180°C or higher, and particularly preferably 200°C or higher. If it is less than 150°C, the heat resistance is insufficient for industrial use, which is not preferable.
- the cured resin has a glass transition temperature of preferably 120°C or higher, more preferably 140°C or higher when water is absorbed. If it is less than 120°C, the heat resistance will be insufficient for industrial use, which is not preferable.
- the cured resin has a flexural modulus of preferably 3.0 GPa or more, more preferably 3.3 GPa or more, and particularly preferably 3.5 GPa or more, as measured by JIS K7171. If it is less than 3.0 GPa, the properties of the fiber-reinforced composite material obtained using the epoxy resin composition tend to deteriorate, which is not preferable.
- the resin cured product obtained by heating the resin composition of the present invention at 180° C. for 40 minutes is , can have the following preferred properties:
- the degree of curing of the cured resin is preferably 70% or more, more preferably 80% or more, and particularly preferably 90% or more.
- the degree of hardening is evaluated by dielectric hardening measurement. Within this range, the fiber-reinforced composite material can be produced with high productivity.
- the cured resin has a glass transition temperature (dry-Tg) in a dry state of preferably 140°C or higher, more preferably 170°C or higher, and particularly preferably 180°C or higher.
- dry-Tg glass transition temperature
- the cured resin has a glass transition temperature (wet-Tg) at the time of saturated water absorption of preferably 120°C or higher, more preferably 150 to 200°C.
- the resin cured product preferably has a room temperature dry flexural modulus (RTD-FM) measured by JIS K7171 of 3.0 GPa or more, more preferably 3.3 to 10.0 GPa, more preferably 3.5 to 9.0 GPa. 0 GPa. With a viscosity of 3.0 GPa or more, the resulting fiber-reinforced composite material has excellent mechanical properties.
- RTD-FM room temperature dry flexural modulus
- the resin cured product preferably has a flexural modulus after water absorption at elevated temperature (HTW-FM) measured by JIS K7171 method of preferably 2.4 GPa or more, more preferably 2.5 to 9.0 GPa, and particularly preferably 2.8 to 2.8 GPa. 8.0 GPa.
- HTW-FM flexural modulus after water absorption at elevated temperature
- the cured resin has a deformation mode I critical stress intensity factor KIc measured by ASTM D5045 of preferably 0.7 MPa ⁇ m 1/2 or more, more preferably 0.8 to 3.0 MPa ⁇ m 1/2 .
- the present invention is also a fiber-reinforced composite material comprising the cured resin and a reinforcing fiber base material.
- This fiber-reinforced composite material can be obtained by compounding and curing a reinforcing fiber base material and the epoxy resin composition of the present invention.
- a carbon reinforcing fiber base material is preferably used as the reinforcing fiber base material. Curing can be performed by heating.
- fibers for the reinforcing fiber base include carbon fiber, glass fiber, aramid fiber, silicon carbide fiber, polyester fiber, ceramic fiber, alumina fiber, boron fiber, metal fiber, mineral fiber, rock fiber, and slag fiber.
- carbon fiber is more preferable because it has good specific strength and specific modulus, and provides a lightweight and high-strength fiber-reinforced composite material.
- PAN polyacrylonitrile
- tensile modulus is preferably 100 to 600 GPa, more preferably 200 to 500 GPa, and even more preferably 230 to 450 GPa.
- the tensile strength is preferably 2000-10000 MPa, more preferably 3000-8000 MPa.
- the diameter of the carbon fibers is preferably 4-20 ⁇ m, more preferably 5-10 ⁇ m.
- the mechanical properties of the resulting fiber-reinforced composite material can be improved.
- the reinforcing fibers are preferably treated with a sizing agent.
- the amount of the sizing agent attached based on the mass of the reinforcing fibers to which the sizing agent is attached is preferably 0.01 to 10% by mass, more preferably 0.05 to 3.0% by mass, and still more preferably 0 .1 to 2.0% by mass.
- the adhesion between the reinforcing fibers and the matrix resin tends to be stronger when the sizing agent is applied in a larger amount.
- the adhesion amount is small, the obtained composite material tends to have excellent interlaminar toughness.
- a reinforcing fiber sheet in which reinforcing fibers are formed into a sheet is preferably used as the reinforcing fiber base material.
- reinforcing fiber sheets include sheets in which a large number of reinforcing fibers are arranged in one direction, bidirectional woven fabrics such as plain weaves and twill weaves, multiaxial woven fabrics, nonwoven fabrics, mats, knits, braids, and paper made from reinforcing fibers. be able to.
- a unidirectional aligned sheet a bidirectional woven fabric, or a multiaxial woven fabric base material in which reinforcing fibers are formed into a sheet shape as continuous fibers, because a fiber-reinforced composite material having more excellent mechanical properties can be obtained.
- the bidirectional woven fabric or multiaxial woven fabric base material may be obtained by laminating and stitching a plurality of unidirectional aligning sheets.
- a nonwoven fabric layer of a thermoplastic resin may be arranged on one side of the unidirectionally arranged sheet and then laminated to form a woven fabric.
- thermoplastic resin nonwoven fabric layers include fibers made of polyester resin fibers, polyamide resin fibers, polyethersulfone resin fibers, polysulfone resin fibers, polyetherimide resin fibers, polycarbonate resin fibers, and resin mixtures thereof.
- the basis weight and the number of layers of the unidirectional alignment sheet can be appropriately set according to the use of the fiber-reinforced composite material.
- the basis weight of the unidirectional alignment sheet is, for example, 100 to 300 g/m 2 , preferably 150 to 250 g/m 2 .
- the thickness of one layer of the unidirectionally aligned sheet of the reinforcing fiber substrate is preferably 0.01 to 3 mm, more preferably 0.05 to 1.5 mm.
- a fiber-reinforced composite material comprising a cured epoxy resin obtained by curing the epoxy resin composition of the present invention and a reinforcing fiber base material.
- the fiber-reinforced composite material provided by the present invention preferably has a post-impact compressive strength CAI (impact energy 30.5 J) measured by ASTM D7136 of preferably 240 MPa or more, more preferably 250 to 400 MPa, further preferably 260 to 380 MPa. is.
- CAI impact energy 30.5 J
- the fiber-reinforced composite material provided by the present invention preferably has a room temperature dry open-hole compressive strength (RTD-OHC) measured by SACMA SRM3 of preferably 260 MPa or more, more preferably 280 to 450 MPa, further preferably 300 to 400 MPa. be.
- RTD-OHC room temperature dry open-hole compressive strength
- the fiber-reinforced composite material provided by the present invention preferably has a perforated compressive strength after temperature rise water absorption (HTW-OHC) measured by SACMA SRM3 of preferably 200 MPa or more, more preferably 220 to 400 MPa, further preferably 240 to 240 MPa. 350 MPa.
- HMW-OHC temperature rise water absorption
- the curing agent composition for thermosetting resins of the present invention can be produced by mixing the curing agent A, the curing agent B and the curing agent C. The order of mixing does not matter.
- the temperature of the thermosetting resin curing agent composition during mixing is preferably 50 to 200°C, more preferably 50 to 150°C, and particularly preferably 80 to 120°C. If the temperature exceeds 200°C, the added components may be thermally decomposed, which is not preferable. On the other hand, when the temperature is lower than 50°C, the solid curing agents A and C do not melt and are difficult to melt into the curing agent B, making it difficult to obtain a liquid curing agent composition for thermosetting resins. It is not preferable.
- thermosetting resin curing agent composition (curing agent liquid) may be in a one-liquid state in which each component is uniformly mixed.
- the epoxy resin base liquid used for producing the epoxy resin composition of the present invention can be produced by mixing the components of the epoxy resin base. The order of mixing does not matter.
- the mixing temperature is, for example, 40 to 200°C, preferably 50 to 100°C, more preferably 50 to 90°C. If the temperature exceeds 200°C, the self-polymerization reaction of the epoxy resin partially progresses, resulting in a decrease in the impregnation property of the reinforcing fiber base material, and the physical properties of the cured product produced using the resulting epoxy resin base liquid are decreased. may do so. On the other hand, when the temperature is less than 40°C, the viscosity of the epoxy resin base agent is high, and mixing may be substantially difficult.
- the resulting epoxy resin main component liquid may be in the form of a single liquid in which each component is uniformly mixed, or may be in the form of a slurry in which some of the components are dispersed as solids.
- the epoxy resin composition of the present invention can be produced by mixing the thermosetting resin curing agent composition (curing agent liquid) and the epoxy resin base liquid. Preferably, it can be produced by further adding resin particles F and mixing. In this case, the resin particles F may be mixed with the epoxy resin base liquid and then mixed with the curing agent liquid, or may be mixed with the curing agent liquid and then mixed with the epoxy resin base liquid.
- the resulting epoxy resin composition may be in a one-liquid state in which each component is uniformly mixed, or may be in a slurry state in which some components are dispersed as solids.
- the temperature during mixing is, for example, 40 to 180°C, preferably 50 to 160°C, more preferably 50 to 120°C. If the temperature exceeds 180° C., the curing reaction proceeds immediately, and the impregnation of the reinforcing fiber substrate may deteriorate, or the physical properties of the cured product may deteriorate. On the other hand, when the temperature is less than 40°C, the viscosity of the epoxy resin base agent is high, and mixing may be substantially difficult.
- mixing may be performed in the atmosphere or under an inert gas atmosphere.
- the atmosphere it is preferably carried out in an atmosphere in which temperature and humidity are controlled, preferably in a temperature controlled constant temperature of 30° C. or less or in a low humidity atmosphere of relative humidity of 50% RH or less.
- a fiber-reinforced composite material is obtained by combining the epoxy resin composition and the reinforcing fiber base material. This compositing may be performed during molding of the fiber-reinforced composite material, or may be performed in advance before molding.
- resin transfer molding method (hereinafter also referred to as "RTM method"), hand lay-up method, filament winding method, pultrusion method, autoclave molding method, and press molding method can be used.
- the epoxy resin composition of the present invention is particularly suitable for the RTM method.
- the RTM method is a method for obtaining a fiber-reinforced composite material by impregnating a reinforcing fiber base material placed in a mold with a liquid epoxy resin composition and curing the composition. From the viewpoint of efficiently obtaining a fiber-reinforced composite material with a complicated shape, the RTM method is a preferable molding method.
- the mold used in the RTM method may be a closed mold made of rigid material, or an open mold made of rigid material and a flexible film (bag). In the latter case, the reinforcing fiber substrate can be placed between an open mold of rigid material and the flexible film.
- rigid materials include metals such as steel and aluminum, fiber-reinforced plastics, wood, and gypsum.
- Polyamide, polyimide, polyester, fluororesin, and silicone resin, for example, can be used as the material of the flexible film.
- a suction port may be provided separately from the injection port and connected to a vacuum pump for suction.
- the epoxy resin composition may be injected only at atmospheric pressure without using special pressurizing means by suction. This method can be preferably used because a large-sized member can be manufactured by providing a plurality of suction ports.
- suction may be performed to inject the epoxy resin only at atmospheric pressure without using special pressurization means.
- Use of a resin diffusion medium is effective in achieving good impregnation by injection only at atmospheric pressure.
- the reinforcing fiber base material is impregnated with the epoxy resin composition, and then heat-cured.
- the mold temperature during heat curing is generally higher than the mold temperature during injection of the epoxy resin composition, preferably 80 to 200°C.
- the heat curing time is preferably 1 minute to 20 hours.
- the mold is demolded and the fiber reinforced composite material is taken out.
- the resulting fiber-reinforced composite material may then be post-cured by heating at a higher temperature.
- the temperature for this post-curing is preferably 150 to 200° C., and the time is preferably 1 minute to 4 hours.
- the impregnation pressure when the reinforcing fiber base material is impregnated with the epoxy resin composition by the RTM method is appropriately determined in consideration of the viscosity and resin flow of the resin composition.
- a specific impregnation pressure is, for example, 0.001 to 10 MPa, preferably 0.01 to 1 MPa.
- the viscosity of the epoxy resin composition at 100° C. is preferably 1 to 200 mPa ⁇ s, more preferably 1 to 50 mPa ⁇ s, still more preferably 1 to 30 mPa ⁇ s, Particularly preferably, it is 1 to 20 mPa ⁇ s. If it exceeds 200 mPa ⁇ s, it becomes difficult to impregnate the reinforcing fiber base material with the epoxy resin composition.
- the timing of mixing the curing agent liquid and the epoxy resin base liquid to obtain the epoxy resin composition is preferably immediately before impregnating the reinforcing fiber base material with the epoxy resin composition.
- the viscosity of the epoxy resin composition is increased by being mixed immediately before impregnation to form an epoxy resin composition.
- a sufficient amount of the epoxy resin composition can be impregnated inside the reinforcing fiber base material before the coating. Therefore, the produced fiber-reinforced composite material does not contain defects such as voids, and is excellent in compression performance and damage tolerance.
- a method for producing a fiber-reinforced composite material comprising a step of impregnating a reinforcing fiber base material with the epoxy resin composition of the present invention to form an impregnated base material, and a step of curing the impregnated base material obtained in the step.
- the step of impregnating the reinforcing fiber base material with the epoxy resin composition of the present invention to form an impregnated base material includes impregnating the reinforcing fiber base material placed in the mold with the epoxy resin composition of the present invention. It is preferable that the step of curing the impregnated base material obtained in the step is a step of heat-curing the impregnated base material.
- a step of preparing the epoxy resin composition of the present invention is included immediately before the step of impregnating the reinforcing fiber base material with the epoxy resin composition of the present invention to form an impregnated base material.
- a fiber reinforced composite material is sometimes abbreviated as "FRP", and a carbon fiber reinforced composite material as "CFRP”.
- FRP fiber reinforced composite material
- CFRP carbon fiber reinforced composite material
- Curing agent A 4,4'-diamino-3,3'-diisopropyl-5,5'-dimethyldiphenylmethane (Lonzacure M-MIPA (product name) manufactured by Lonza, hereinafter abbreviated as "M-MIPA", melting point 70 ° C., 25 solid at °C) ⁇ 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane (MED-J (product name) manufactured by Kumiai Chemical Co., Ltd., hereinafter abbreviated as "MED-J”, melting point 76 ° C., 25 solid at °C)
- Curing agent B ⁇ Diethyltoluenediamine (Heart Cure 10 (product name) manufactured by Kumiai Chemical Co., Ltd., hereinafter abbreviated as “DETDA”, liquid at 25 ° C.) ⁇ Dimethylthiotoluene diamine (K
- Heart Cure 30 (product name), hereinafter abbreviated as “DMTDA”, liquid at 25 ° C.) ⁇ 4,4'-diamino-3,3'-diethyldiphenylmethane (Kayahard AA (product name) manufactured by Nippon Kayaku Co., Ltd., hereinafter abbreviated as "Kayahard AA”, liquid at 25 ° C.) (3) Curing agent C 3,4'-diaminodiphenyl ether (manufactured by Teijin Limited, hereinafter abbreviated as "3,4'-DAPE”, melting point 80°C, solid at 25°C) ⁇ 2,2-bis[4-(4-aminophenoxy)phenyl]propane (manufactured by Tokyo Chemical Industry Co., Ltd., hereinafter abbreviated as “BAPP”, melting point 129 ° C., solid at 25 ° C.) ⁇ 1,3-bis(4-aminophenoxy)benzene (
- Epoxy resin E ⁇ N,N-diglycidyl-o-toluidine (GOT (product name) manufactured by Nippon Kayaku Co., Ltd., hereinafter abbreviated as “GOT”) ⁇ N,N-diglycidylaniline (GAN (product name) manufactured by Nippon Kayaku Co., Ltd., hereinafter abbreviated as “GAN”) ⁇ Triglycidyl-p-aminophenol (Araldite MY0510 (product name) manufactured by Huntsman, hereinafter abbreviated as “TG-pAP”) ⁇ 1,6-bis(glycidyloxy)naphthalene (HP-4032SS (product name) manufactured by DIC, hereinafter abbreviated as “1,6-DON”) ⁇ 1,3,5-triglycidyl isocyanurate (TEPIC-S (product name) manufactured by Nissan Chemical Co., Ltd., hereinafter abbreviated as “TEPIC”) - Bisphenol A-diglycid
- ⁇ Carbon fiber multiaxial fabric 2 The carbon fibers 1 aligned in one direction are made into a sheet of 190 g / m 2 per layer, and the nonwoven fabric 1 is arranged on one side of the sheet-shaped carbon fibers, (-45 / V / 90/V/+45/V/0/V) and stitched (carbon fiber total basis weight of woven fabric base material: 760 g/m 2 ).
- V represents the nonwoven fabric 1.
- (A-1-2) Liquid Retention Properties of Curing Agent Composition The curing agent composition prepared above was stored at room temperature for 1 week, and precipitation of solid components was visually observed. “OK” was given when there was no precipitation, and “NG” was given when precipitation was observed.
- the resin cured product obtained above was cut into a size of 50 mm ⁇ 6 mm ⁇ 2 mm to prepare a test piece.
- a pressure cooker HASTEST PC-422R8, manufactured by Espec Co., Ltd.
- the prepared test piece was subjected to water absorption treatment under the conditions of 121° C. and 24 hours of water vapor saturation.
- a dynamic viscoelasticity measuring device Rheogel-E400 manufactured by UBM the measurement frequency is 1 Hz, the temperature increase rate is 5 ° C./min, and the strain is 0.0167%.
- the storage elastic modulus E' of the test piece subjected to water absorption treatment was measured.
- Log E′ was plotted against temperature, and the temperature obtained from the intersection of the approximate straight line of the flat region of log E′ and the approximate straight line of the transition region of E′ was recorded as the glass transition temperature (Tg).
- RTD-FM room temperature dry resin flexural modulus
- the cured resin material obtained above was cut into a size of 50 mm ⁇ 8 mm (width W) ⁇ 4 mm to prepare a test piece.
- the crack length a was adjusted so that 0.45 ⁇ a/W ⁇ 0.55.
- the fracture surface after the fracture test was observed with an optical microscope, and the length to the tip of the crack and the average value of the crack lengths on both surfaces of the test piece were adopted.
- thermosetting resin (B-1) Characteristics of curing agent composition for thermosetting resin (B-1-1) Preparation of curing agent composition for thermosetting resin The mixture was mixed at 80° C. for 30 minutes using a stirrer to prepare a curing agent composition for thermosetting resin (curing agent liquid).
- Epoxy Resin Main Component Epoxy resin and resin particles were weighed in proportions shown in Tables 4 to 6, and mixed with a stirrer at 80° C. for 30 minutes to prepare an epoxy resin main component liquid. .
- the storage elastic modulus E' of the test piece subjected to water absorption treatment was measured.
- Log E′ was plotted against temperature, and the temperature obtained from the intersection of the approximate straight line of the flat region of log E′ and the approximate straight line of the transition region of E′ was recorded as the glass transition temperature (wet-Tg).
- RTD-FM room temperature dry resin flexural modulus
- the cured resin material obtained above was cut into a size of 50 mm x 8 mm (width W) x 4 mm to prepare a test piece.
- the crack length a was adjusted so that 0.45 ⁇ a/W ⁇ 0.55.
- the fracture surface after the fracture test was observed with an optical microscope, and the length to the tip of the crack and the average value of the crack lengths on both surfaces of the test piece were adopted.
- a peel cloth Release Ply C which is a base material with a releasability function
- Resin Flow 90HT manufactured by AIRTECH
- the hose for forming the resin inlet and resin outlet was placed, the whole was covered with nylon bag film, sealed with sealant tape, and the inside was evacuated.
- the aluminum plate was heated to 120° C., the pressure inside the bag was reduced to 5 torr or less, and then the epoxy resin composition prepared above was heated to 100° C. and injected into the vacuum system through the resin inlet.
- the injected epoxy resin composition was filled in the bag and impregnated into the laminate, and the temperature was raised to 180°C and held at 180°C for 40 minutes to obtain CFRP.
- RTD-OHC Room temperature dry open-hole compressive strength
- the CFRP obtained in (B-3-1) above is cut to a size of 38.1 mm in width and 304.8 mm in length to form a test piece precursor, and a diameter of 6.35 mm is provided at the center of the test piece precursor. to obtain test pieces for room temperature dry hole compressive strength (RTD-OHC) test.
- the test was conducted at an ambient temperature of 25° C. according to SACMA SRM3, and the open hole compressive strength was calculated from the maximum point load.
- (B-4) Average particle size The cross section of the cured resin is observed with a scanning electron microscope or a transmission electron microscope at a magnification of 25,000, and the diameter of at least 50 particles is measured to determine the particle size of the resin particles. The average particle size was obtained by averaging them. When the particles were not perfectly circular, the maximum diameter of the particles was taken as the particle diameter of the particles.
- Example 1 (Preparation of curing agent composition for thermosetting resin) Curing agents were weighed in proportions shown in Table 1, and mixed using a stirrer at a temperature of 90° C. for 60 minutes to prepare a curing agent composition for thermosetting resins.
- thermosetting resin curing agent composition prepared above, the epoxy resin, and the particulate rubber component were weighed at the ratios shown in Table 1, and mixed with a stirrer at 80°C for 60 minutes to obtain an epoxy resin composition. was prepared.
- the epoxy group of the epoxy resin and the active hydrogen of the curing agent are equivalent.
- Table 1 shows the evaluation results of the properties of the thermosetting resin curing agent composition, the epoxy resin composition and the resin cured product.
- the thermosetting resin curing agent composition remained liquid for a period of one week or more.
- the epoxy resin composition exhibited a low viscosity of 24 mPa ⁇ s at 100° C., and the pot life exceeded 120 minutes.
- ">120" in the table means exceeding 120.
- the degree of cure ⁇ was 100%, indicating rapid curability.
- the cured resin had a wet-Tg of 156° C., a flexural modulus of 3.4 GPa, and a KIc of 0.86 MPa ⁇ m 1/2 , demonstrating high mechanical properties.
- Examples 2 to 22 It was carried out in the same manner as in Example 1, except that the composition was changed as shown in Tables 1 and 2.
- the epoxy resin compositions were prepared at 90° C. for Examples 2-9 and 15-22 and at 110° C. for Examples 10-14.
- Tables 1 and 2 show the properties of the thermosetting resin curing agent composition, the epoxy resin composition and the resin cured product.
- the thermosetting resin curing agent composition remained liquid for a period of one week or longer.
- the epoxy resin composition exhibited a low viscosity of 32 mPa ⁇ s or less at 100° C., and the pot life was 80 minutes or more.
- the degree of cure ⁇ was 100% in all cases, indicating rapid curability.
- the cured resin had a wet-Tg of 150° C. or higher, a flexural modulus of 3.2 GPa or higher, and a KIc of 0.81 MPa ⁇ m 1/2 or higher, showing high mechanical properties.
- Examples 23 to 25 The procedure was carried out in the same manner as in Example 1, except that the composition was changed as shown in Table 3.
- the preparation of the epoxy resin composition was carried out at 90° C. for Examples 23 and 25 and at 110° C. for Example 24.
- Table 3 shows the properties of the thermosetting resin curing agent composition, the resin composition, and the resin cured product.
- the thermosetting resin curing agent composition remained liquid for a period of one week or longer.
- the degree of cure ⁇ was 100% in all cases, indicating rapid curability.
- the wet-Tg of the cured resin was 156° C. or higher, and the flexural modulus was 3.2 GPa or higher, indicating high mechanical properties.
- Example 31 (Preparation of epoxy resin composition)
- Epoxy resin and resin particles F were weighed in proportions shown in Table 4 and mixed at 80° C. for 30 minutes using a stirrer to prepare an epoxy resin base liquid.
- Curing agent components were weighed in proportions shown in Table 4 and mixed at 80° C. for 30 minutes using a stirrer to prepare a curing agent composition for thermosetting resin (curing agent liquid).
- the separately prepared epoxy resin base liquid and thermosetting resin curing agent composition (curing agent liquid) were mixed using a stirrer at 80° C. for 30 minutes to prepare an epoxy resin composition.
- Table 4 shows the properties of the resulting epoxy resin composition.
- the glycidyl groups of the epoxy resin and the amino groups of the curing agent are equivalent.
- Table 4 shows the properties of the obtained cured resin.
- the cured resin had a wet-Tg of 150° C. or higher, a flexural modulus of 3.0 GPa or higher, and a KIc of 0.7 MPa ⁇ m 1/2 or higher, showing high mechanical properties.
- the carbon fiber multiaxial fabric 1 and the carbon fiber multiaxial fabric 2 were cut to 300 x 300 mm, and three sheets of the carbon fiber multiaxial fabric 1 were placed on a release-treated aluminum plate of 500 x 500 mm. Three sheets of the multiaxial fabric 2, totaling six sheets, were stacked to form a laminate.
- a peel cloth Release Ply C which is a base material with a releasability function
- Resin Flow 90HT manufactured by AIRTECH
- the hose for forming the resin inlet and resin outlet was placed, the whole was covered with nylon bag film, sealed with sealant tape, and the inside was evacuated.
- the aluminum plate was heated to 120° C., the pressure inside the bag was reduced to 5 torr or less, and then the epoxy resin composition prepared above was heated to 100° C. and injected into the vacuum system through the resin inlet.
- CFRP carbon fiber reinforced composite material
- Examples 32 to 37 The procedure was carried out in the same manner as in Example 31, except that the composition was changed as shown in Table 4. Table 4 shows the evaluation results.
- Examples 38 to 44 The procedure was carried out in the same manner as in Example 31, except that the composition was changed as shown in Table 5. Table 5 shows the evaluation results.
- Reference Example 1 is an example in which the epoxy resin D is not used.
- Reference Example 2 is an example in which the epoxy resin E is not used.
- Reference Example 3 is an example in which the resin particles F are not used.
- the curing agent composition for thermosetting resins and the epoxy resin composition of the present invention By using the curing agent composition for thermosetting resins and the epoxy resin composition of the present invention, cured resins and fiber-reinforced composite materials having excellent mechanical properties can be produced.
- the curing agent composition for thermosetting resin and the epoxy resin composition of the present invention have a low viscosity and a long usable life, so that they are easy to handle during molding and have a short curing time, so they have excellent quality.
- a fiber-reinforced composite material having mechanical properties can be produced with higher productivity than before. The resulting fiber-reinforced composite material can be used, for example, as members of automobiles and aircraft.
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Abstract
Description
本発明の熱硬化性樹脂用硬化剤組成物は、硬化剤A、硬化剤Bおよび硬化剤Cを含有してなる熱硬化性樹脂用硬化剤組成物である。この熱硬化性樹脂用硬化剤組成物は、80~200℃の温度に加熱することで均一な液体となる。
硬化剤Aは、アミノ基に対する2つのオルト位にそれぞれ置換基を有する芳香族ポリアミンであり、該置換基はアルキル基、芳香族基およびハロゲン基から選択される。また、硬化剤Aは25℃で固体である。この硬化剤Aを含有することで、エポキシ樹脂との組成物として硬化させたときに、優れた耐熱性や弾性率、破壊靭性などの力学的特性を備えるエポキシ樹脂硬化物を得ることができる。
硬化剤Bは、25℃で液体である芳香族ポリアミンである。この芳香族ポリアミンを含有することで、室温で液体の状態を保持することができる熱硬化性樹脂用硬化剤組成物を得ることができる。
硬化剤Cは、芳香族ポリアミンであり、該芳香族ポリアミンは、アミノ基に対するオルト位に電子供与基をただ一つ有するかオルト位に置換基を有しない芳香族ポリアミンである。硬化剤Cの芳香族ポリアミンの電子供与基は、好ましくはメチル基、エチル基、プロピル基、イソプロピル基、メトキシ基またはエトキシ基である。この硬化剤Cを含有することで、得られるエポキシ樹脂組成物の硬化反応が促進され、エポキシ樹脂組成物に、速硬化性を付与することができる。
本発明によれば、さらにエポキシ樹脂組成物が提供される。このエポキシ樹脂組成物は、上記の熱硬化性樹脂用硬化剤組成物と、以下に説明するエポキシ樹脂主剤とを含む。
エポキシ樹脂主剤は、以下に説明するエポキシ樹脂を含む。エポキシ樹脂主剤に含有されるエポキシ樹脂として特に好ましいものは、さらに後に説明するエポキシ樹脂Dおよびエポキシ樹脂Eであり、両者を含有する態様が最も好ましい。
エポキシ樹脂として、テトラグリシジル-4,4’-ジアミノジフェニルメタン、テトラグリシジル-4,4’-ジアミノジフェニルスルホン、テトラグリシジル-3,3’-ジアミノジフェニルスルホン、テトラグリシジル-4,4’-ジアミノジフェニルエーテル、テトラグリシジル-3,4’-ジアミノジフェニルエーテル、などの4官能グリシジルアミン型エポキシ樹脂、トリグリシジル-m-アミノフェノール、トリグリシジル-p-アミノフェノール、イソシアヌル酸トリグリシジル、などの3官能エポキシ樹脂、ジグリシジルアニリンやその誘導体であるジグリシジル-o-トルイジン、ジグリシジル-m-トルイジン、ジグリシジル-p-トルイジン、ジグリシジル-キシリジン、ジグリシジル-メシジン、ジグリシジル-アニシジン、ジグリシジル-フェノキシアニリン、あるいはジグリシジル-ナフチルアミンおよびその誘導体、ビスフェノールAジグリシジルエーテル、ビスフェノールFジグリシジルエーテル、ビスフェノールSジグリシジルエーテル、レゾルシノールジグリシジルエーテル、1,6-ナフタレンジオールジグリシジルエーテル、などの2官能エポキシ樹脂、が例示される。これらのエポキシ樹脂は、単独で用いてもよく、複数のエポキシ樹脂を混合して用いてもよい。
エポキシ樹脂主剤は、エポキシ樹脂の他に、さらに熱可塑性樹脂を含んでいてもよい。熱可塑性樹脂は、得られる繊維強化複合材料の破壊靭性や耐衝撃性を向上させる。かかる熱可塑性樹脂は、熱硬化性樹脂用硬化剤組成物の製造過程で、熱硬化性樹脂用硬化剤組成物中に溶解させてもよい。
エポキシ樹脂組成物に含まれる硬化剤の全質量を基準として、硬化剤A、硬化剤Bおよび硬化剤Cの合計量は、好ましくは70~100質量%、さらに好ましくは80~100質量%である。70質量%未満であると樹脂硬化物の耐熱性が不十分となる可能性があり好ましくない。
以下、エポキシ樹脂主剤およびエポキシ樹脂組成物に含有されるエポキシ樹脂として特に好ましいものであるエポキシ樹脂Dについて詳しく説明する。
R1~R4が、脂肪族炭化水素基または脂環式炭化水素基である場合、その炭素数は1~4であることが好ましい。
以下、エポキシ樹脂主剤およびエポキシ樹脂組成物に含有されるエポキシ樹脂として特に好ましいものであるエポキシ樹脂Eについて詳しく説明する。
本発明のエポキシ樹脂組成物は、好ましくはさらに樹脂粒子Fを含有する。以下、この樹脂粒子Fについて説明する。
本発明の熱硬化性樹脂用硬化剤組成物およびエポキシ樹脂組成物は、さらにその他の成分を含有してもよく、例えば、導電性粒子、難燃剤、無機系充填剤、内部離型剤を含有してもよい。
本発明のエポキシ樹脂組成物は、以下の好ましい性質を備えることができる。
(ただし、ΔHは20℃/分間の昇温速度でDSC測定を行った際に確認される硬化反応に伴う発熱量であり、ΔH未硬化は未硬化のエポキシ樹脂組成物のΔHであり、ΔH硬化物は樹脂硬化物のΔHである。)
すなわち、本発明のエポキシ樹脂組成物は、180℃で30分間硬化させて得られる硬化物の、上記式で表されるDSC硬化度αが98%以上である、エポキシ樹脂組成物である。DSC硬化度αが98%以上であることで、優れた耐熱性および力学的特性を得ることができるとともに、経時的な特性の変化を抑制することができる。
本発明はまた、上記のエポキシ樹脂組成物を硬化させて得られる樹脂硬化物である。
本発明はまた、上記の樹脂硬化物および強化繊維基材を含む繊維強化複合材料である。この繊維強化複合材料は、強化繊維基材と、本発明のエポキシ樹脂組成物とを複合化して硬化させることにより得ることができる。強化繊維基材として、好ましくは炭素強化繊維基材を用いる。硬化は加熱より行うことができる。
以下、熱硬化性樹脂用硬化剤組成物(硬化剤液)、エポキシ樹脂主剤液、エポキシ樹脂組成物の順に説明する。
本発明の熱硬化性樹脂用硬化剤組成物は、硬化剤Aと硬化剤Bと硬化剤Cとを混合することにより、製造することができる。混合の順序は問わない。
本発明のエポキシ樹脂組成物の製造に用いるエポキシ樹脂主剤液は、エポキシ樹脂主剤の成分を混合することにより製造することができる。混合の順序は問わない。
本発明のエポキシ樹脂組成物は、上記の熱硬化性樹脂用硬化剤組成物(硬化剤液)とエポキシ樹脂主剤液とを混合することにより製造することができる。好ましくはさらに樹脂粒子Fを加えて混合することにより製造することができる。この場合、樹脂粒子Fは、エポキシ樹脂主剤液に混合してから硬化剤液と混合してもよく、硬化剤液に混合してからエポキシ樹脂主剤液と混合してもよい。
熱硬化性樹脂用硬化剤組成物(硬化剤液)、エポキシ樹脂主剤液、エポキシ樹脂組成物のいずれの製造においても、混合に用いる装置として、従来公知のものを用いることができる。ロールミル、プラネタリーミキサー、ニーダー、エクストルーダー、バンバリーミキサー、攪拌翼を備えた混合容器、横型混合槽を例示することができる。
エポキシ樹脂組成物と強化繊維基材とを複合化して繊維強化複合材料を得る。この複合化は、繊維強化複合材料の成形時に行ってもよく、成型前に予め行ってもよい。
1.エポキシ樹脂組成物の原料
原料として、以下のものを用いた。
(1) 硬化剤A
・4,4’-ジアミノ-3,3’-ジイソプロピル-5,5’-ジメチルジフェニルメタン(ロンザ社製 Lonzacure M-MIPA(製品名)、以下「M-MIPA」と略記する、融点70℃、25℃で固体)
・4,4’-ジアミノ-3,3’-ジエチル-5,5’-ジメチルジフェニルメタン(クミアイ化学社製 MED-J(製品名)、以下「MED-J」と略記する、融点76℃、25℃で固体)
(2) 硬化剤B
・ジエチルトルエンジアミン(クミアイ化学社製 ハートキュア10(製品名)、以下「DETDA」と略記する、25℃で液体)
・ジメチルチオトルエンジアミン(クミアイ化学社製 ハートキュア30(製品名)、以下「DMTDA」と略記する、25℃で液体)
・4,4’-ジアミノ-3,3’-ジエチルジフェニルメタン(日本化薬社製 カヤハードA-A(製品名)、以下「カヤハードAA」と略記する、25℃で液体)
(3) 硬化剤C
・3,4’-ジアミノジフェニルエーテル(帝人社製、以下「3,4’-DAPE」と略記する、融点80℃、25℃で固体)
・2,2-ビス[4-(4-アミノフェノキシ)フェニル]プロパン(東京化成工業社製、以下「BAPP」と略記する、融点129℃、25℃で固体)
・1,3-ビス(4-アミノフェノキシ)ベンゼン(東京化成工業社製、以下「TPE-R」と略記する、融点116℃、25℃で固体)
・1,3-ビス(3-アミノフェノキシ)ベンゼン(東京化成工業社製、以下「APB」と略記する、融点108℃、25℃で固体)
・2,6-ジアミノトルエン(東京化成工業社製、以下「DAT」と略記する、融点106℃、25℃で固体)
・m-フェニレンジアミン(富士フイルム和光純薬社製、以下「MPD」と略記する、融点65℃、25℃で固体)
(4) エポキシ樹脂D
・テトラグリシジル-4,4’-ジアミノジフェニルメタン(ハンツマン社製 Araldite MY721(製品名)、以下「4,4’-TGDDM」と略記する。)
・テトラグリシジル-3,4’-ジアミノジフェニルエーテル(これは、下記の合成例1に記載の方法で合成した。以下「3,4’-TGDDE」と略記する。)
〔合成例1〕 3,4’-TGDDEの合成
温度計、滴下漏斗、冷却管および攪拌機を取り付けた四つ口フラスコに、エピクロロヒドリン1110.2g(12.0mol)を仕込み、窒素パージを行いながら温度を70℃まで上げて、これにエタノール1000gに溶解させた3,4’-ジアミノジフェニルエーテル200.2g(1.0mol)を4時間かけて滴下した。さらに6時間撹拌し、付加反応を完結させ、N,N,N’,N’-テトラキス(2-ヒドロキシ-3-クロロプロピル)-3,4’-ジアミノジフェニルエーテルを得た。続いて、フラスコ内温度を25℃に下げてから、これに48%NaOH水溶液500.0g(6.0mol)を2時間で滴下してさらに1時間撹拌した。環化反応が終わってからエタノールを留去して、400gのトルエンで抽出を行い5%食塩水で2回洗浄を行った。有機層からトルエンとエピクロロヒドリンを減圧下で除くと、3,4’-TGDDEを主成分とする褐色の粘性液体が361.7g(収率85.2%)得られた。主生成物である3,4’-TGDDEの純度は、84%(HPLC面積%)であった。
(5) エポキシ樹脂E
・N,N-ジグリシジル-o-トルイジン(日本化薬社製 GOT(製品名)、以下「GOT」と略記する)
・N,N-ジグリシジルアニリン(日本化薬社製 GAN(製品名)、以下「GAN」と略記する)
・トリグリシジル-p-アミノフェノール(ハンツマン社製 Araldite MY0510(製品名)、以下「TG-pAP」と略記する)
・1,6-ビス(グリシジルオキシ)ナフタレン(DIC社製 HP-4032SS(製品名)、以下「1,6-DON」と略記する)
・1,3,5-トリグリシジルイソシアヌレート(日産化学社製 TEPIC-S(製品名)、以下「TEPIC」と略記する)
・ビスフェノールA-ジグリシジルエーテル(三菱化学社製 jER825(製品名)、以下「DGEBA」と略記する)
(6) 樹脂粒子F(粒子状ゴム成分)
・MX-416(株式会社カネカ製 MX-416(製品名)、グリシジルアミン型4官能エポキシ樹脂へ粒子状ブタジエンゴム成分を25質量%の濃度となる様に分散させたマスターバッチ)(この製品中のグリシジルアミン型4官能エポキシ樹脂は、本発明のエポキシ樹脂Dに相当)
(7) 炭素繊維ストランド
・炭素繊維1:“テナックス(登録商標)”IMS65 E23 830tex(炭素繊維ストランド、引張強度 5.8GPa、引張弾性率 290GPa、サイジング剤付着量 1.2質量%、帝人(株)製)
(8) 熱可塑性樹脂不織布
・不織布1:ポリアミド12樹脂を使用し、スパンボンド法で作製した繊維目付が5g/m2の不織布
(9) 炭素繊維多層織物
・炭素繊維多軸織物1:一方向に引き揃えた炭素繊維1を1層あたり190g/m2のシート状にして、このシート状炭素繊維の片面に不織布1を配置し、(+45/V/90/V/-45/V/0/V)の角度で4枚積層しステッチしたもの(織物基材の炭素繊維総目付760g/m2)。
・炭素繊維多軸織物2:一方向に引き揃えた炭素繊維1を1層あたり190g/m2のシート状にして、シート状炭素繊維の片面に不織布1を配置し、(-45/V/90/V/+45/V/0/V)の角度で4枚積層しステッチしたもの(織物基材の炭素繊維総目付760g/m2)。ここで、Vは不織布1を表す。
2.評価方法
評価は、以下の方法で行った。
(A) 硬化剤組成物およびエポキシ樹脂組成物の評価方法
実施例1~25および比較例1~6の評価は、以下のとおり行った。
(A-1-1) 硬化剤組成物の調製
表1乃至3に記載する割合で硬化剤を計量し、撹拌機を用いて90~110℃の適切な温度で、60分間混合し、硬化剤組成物を調製した。
上記で調製した硬化剤組成物を、室温で1週間保管し、目視で固体成分の析出を確認した。析出がないものを「OK」、析出の認められたものを「NG」とした。
(A-2-1) エポキシ樹脂組成物の調製
上記で調製した硬化剤組成物と、エポキシ樹脂、粒子状ゴム成分を表1乃至3に記載する割合で計量し、撹拌機を用いて80℃で60分間混合し、エポキシ樹脂組成物を調製した。なお、表1乃至3に記載の組成において、エポキシ樹脂のエポキシ基と硬化剤の活性水素は当量となる。
初期粘度の測定は、東機産業株式会社製B型粘度計TVB-15Mを用い、100℃の条件にて行った。測定開始直後の最小測定値を初期粘度とし、粘度が50mPa・sに到達した時間を可使時間とした。
(A-3-1) 樹脂硬化物の作成
上記で調製したエポキシ樹脂組成物を真空中で脱泡した後、4mm厚のシリコン樹脂製スペーサーにより厚み4mmになるように設定したステンレス製モールド中に注入した。180℃の温度で30分硬化させ、厚さ4mmの樹脂硬化物を得た。
DSC測定を行い、硬化度αを、以下の式を用いて算出した。
α=(ΔH未硬化-ΔH硬化物)/ΔH未硬化×100
(ただし、ΔHは20℃/分間の昇温速度でDSC測定を行った際に確認される硬化反応に伴う発熱量であり、ΔH未硬化はエポキシ樹脂組成物のΔHであり、ΔH硬化物は樹脂硬化物のΔHである。)
(A-3-3) 吸水後ガラス転移温度(wet-Tg)
SACMA 18R-94法に準じて、ガラス転移温度を測定した。上記で得た樹脂硬化物を、寸法50mm×6mm×2mmで切り出して試験片として準備した。プレッシャークッカー(エスペック社製、HASTEST PC-422R8)を用い、121℃、24時間の条件にて、水蒸気飽和の条件にて、準備した試験片の吸水処理を行った。UBM社製動的粘弾性測定装置Rheogel-E400を用い、測定周波数1Hz、昇温速度5℃/分、ひずみ0.0167%の条件で、チャック間の距離を30mmとし、50℃からゴム弾性領域まで、吸水処理した試験片の貯蔵弾性率E’を測定した。logE’を温度に対してプロットし、logE’の平坦領域の近似直線と、E’が転移する領域の近似直線との交点から求められる温度をガラス転移温度(Tg)として記録した。
JIS K7171法に準じて、試験を実施した。上記で得た樹脂硬化物を、寸法80mm×10mm×4mm(厚みh)で切り出して試験片として準備した。25℃の環境温度で、支点間距離Lは、16×h(厚み)、試験速度2mm/minで曲げ試験を行い、曲げ強度と曲げ弾性率を測定した。
ASTM D5045に従い、万能試験機(島津製作所製オートグラフ)を用いて靱性(KIc)を測定した。
(B) 熱硬化性樹脂用硬化剤組成物およびエポキシ樹脂組成物の特性
実施例31~44、比較例11~15および参考例1~3の評価は、以下のとおり行った。
(B-1-1) 熱硬化性樹脂用硬化剤組成物の調製
表4乃至6に記載する割合で硬化剤成分を計量し、撹拌機を用いて80℃で30分間混合して、熱硬化性樹脂用硬化剤組成物(硬化剤液)を調製した。
表4乃至6に記載する割合でエポキシ樹脂および樹脂粒子を計量し、撹拌機を用いて80℃で30分間混合し、エポキシ樹脂主剤液を調製した。
上記の熱硬化性樹脂用硬化剤組成物とエポキシ樹脂主剤液とを、撹拌機を用いて80℃で30分間混合し、エポキシ樹脂組成物を調製した。なお、表4乃至6に記載の組成において、エポキシ樹脂のグリシジル基と硬化剤のアミノ基は当量となる。
上記で調製した熱硬化性樹脂用硬化剤組成物(硬化剤液)を、25℃で1週間静置保管し、目視で固体成分の析出を確認した。析出がないものを「OK」、析出の認められたものを「NG」とした。
初期粘度の測定は、東機産業株式会社製B型粘度計TVB-15Mを用い、100℃の条件にて行った。測定開始直後の最小測定値を初期粘度とし、粘度が50mPa・sに到達した時間を可使時間とした。
硬化特性は、NETZSCH社製誘電分析装置DEA288 Ionicを用い、未硬化樹脂の180℃40分間加熱後の樹脂硬化物のDEA硬化度αを下記式で評価した。この硬化度が90%以上の場合に、40分間硬化特性を有するエポキシ樹脂組成物であると評価することができる。
=(logε”0-logε”t=40)/(logε”0-logε”∞)×100
(ただし、ε”0は測定開始時の誘電損失の最大値であり、ε”t=40は測定時間が40分の時の誘電損失値であり、ε”∞は測定時間が180分の時の誘電損失値である。)
測定条件
測定温度 :180±2℃等温
測定周波数 :1Hz
測定センサー :NETZSCH社製IDEX 115/35
(B-2) 樹脂硬化物の特性
(B-2-1) 樹脂硬化物の作成
上記で調製したエポキシ樹脂組成物を真空中で60分間脱泡した後、4mm厚のテフロン樹脂製スペーサーにより厚み4mmになるように設定したステンレス製モールド中に注入した。180℃の温度で40分間、加熱硬化させ、厚さ4mmの樹脂硬化物を得た。
SACMA 18R-94法に準じて、ガラス転移温度を測定した。上記で得た樹脂硬化物を寸法50mm×6mm×2mmで切り出して試験片として準備した。プレッシャークッカー(エスペック社製、HASTEST PC-422R8)を用い、121℃、24時間の条件にて、水蒸気飽和の条件にて、準備した試験片の吸水処理を行った。UBM社製動的粘弾性測定装置Rheogel-E400を用い、測定周波数1Hz、昇温速度5℃/分、ひずみ0.0167%の条件で、チャック間の距離を30mmとし、50℃からゴム弾性領域まで、吸水処理した試験片の貯蔵弾性率E’を測定した。logE’を温度に対してプロットし、logE’の平坦領域の近似直線と、E’が転移する領域の近似直線との交点から求められる温度をガラス転移温度(wet-Tg)として記録した。
JIS K7171法に準じて、試験を実施した。上記で得た樹脂硬化物を、寸法80mm×10mm×4mm(厚みh)に切り出して試験片として準備した。25℃の環境温度で、支点間距離Lは、16×h(厚み)、試験速度2mm/minで曲げ試験を行い、曲げ強度と曲げ弾性率を測定した。
ASTM D5045に従い、万能試験機(島津製作所製オートグラフ)を用いて靱性(KIc)を測定した。
(B-3-1) CFRPの作成
炭素繊維多軸織物1および炭素繊維多軸織物2を300×300mmにカットし、500×500mmの離型処理したアルミ板の上に、炭素繊維多軸織物1を3枚、炭素繊維多軸織物2を3枚、合計6枚重ねて積層体とした。
上記で得られたCFRPを、幅101.6mm×長さ152.4mmの寸法に切断し、衝撃後圧縮強度(CAI)試験の試験片を得た。試験はASTM D7136に従い実施した。衝撃試験では、落錘型衝撃試験機(インストロン社製 Dynatup)を用いて、試験片に30.5Jの衝撃エネルギーを与えた。衝撃後、試験片の損傷面積は、超音波探傷試験機(クラウトクレーマー社製 SDS3600、HIS3/HF)にて測定した。強度試験では、前記の衝撃後の試験片の、上から25.4mm、サイドから25.4mmの位置に、歪みゲージを左右各1本ずつ貼付し、同様に表裏に合計4本/体の歪みゲージを貼付けた後、試験機(島津製作所製オートグラフ)のクロスヘッド速度を1.27mm/minとして、試験片の破断まで荷重を負荷した。
上記の(B-3-1)で得られたCFRPを、幅38.1mm×長さ304.8mmの寸法で切断して試験片前駆体とし、該試験片前駆体の中心に直径6.35mmの穴あけ加工を施し、室温乾燥有孔圧縮強度(RTD-OHC)試験の試験片を得た。試験は、SACMA SRM3に則って、25℃の環境温度で実施し、最大点荷重から有孔圧縮強度を算出した。
樹脂硬化物の断面を走査型電子顕微鏡または透過型電子顕微鏡により2万5000倍で観察し、少なくとも50個の粒子の直径を測定して樹脂粒子の粒子径として、それを平均することにより平均粒子径を求めた。粒子が真円状でない場合は、粒子の最大径をその粒子の粒子径とした。
(熱硬化性樹脂用硬化剤組成物の調製)
表1に記載する割合で硬化剤を計量し、撹拌機を用いて90℃の温度で60分間混合し、熱硬化性樹脂用硬化剤組成物を調製した。
上記で調製した熱硬化性樹脂用硬化剤組成物と、エポキシ樹脂、粒子状ゴム成分を表1に記載する割合で計量し、撹拌機を用いて80℃で60分間混合し、エポキシ樹脂組成物を調製した。なお、表1に記載の組成においては、エポキシ樹脂のエポキシ基と硬化剤の活性水素は当量となる。
上記で調製したエポキシ樹脂組成物を、真空中で脱泡し、その後、4mm厚のシリコン樹脂製スペーサーにより厚み4mmになるように設定されたステンレス製モールド中に注入した。180℃の温度で30分間硬化させ、厚さ4mmの樹脂硬化物を得た。
表1および2に記載のとおり組成を変更した他は実施例1と同様に実施した。エポキシ樹脂組成物の調製は、実施例2~9および実施例15~22では90℃、実施例10~14では110℃で実施した。熱硬化性樹脂用硬化剤組成物、エポキシ樹脂組成物および樹脂硬化物の特性を表1および2に示した。いずれの例でも、熱硬化性樹脂用硬化剤組成物は、1週間以上の期間、液状を保持していた。エポキシ樹脂組成物は、100℃において32mPa・s以下の低粘度を示し、可使時間はいずれも80分間以上となった。硬化度αは、いずれも100%となり、速硬化性を示した。樹脂硬化物のwet-Tgは150℃以上、曲げ弾性率は3.2GPa以上、KIcは0.81MPa・m1/2以上であり、高い力学的特性を示した。
表3に記載のとおり組成を変更した他は実施例1と同様に実施した。エポキシ樹脂組成物の調製は、実施例23および実施例25では90℃、実施例24では110℃で実施した。熱硬化性樹脂用硬化剤組成物、樹脂組成物、樹脂硬化物の特性を表3に示した。熱硬化性樹脂用硬化剤組成物は、1週間以上の期間、液状を保持していた。硬化度αは、いずれも100%となり、速硬化性を示した。樹脂硬化物のwet-Tgは156℃以上、曲げ弾性率は3.2GPa以上と高い力学的特性を示した。
表3に記載のとおり組成を変更した他は実施例1と同様に実施した。熱硬化性樹脂用硬化剤組成物の特性を表3に示した。いずれの例でも1週間以内に固体が析出してきた。
表3に記載のとおり組成を変更した他は実施例1と同様に実施した。樹脂硬化物の特性を表3に示した。いずれ例でも硬化度αが98未満となり、速硬化性が不十分であった。
(エポキシ樹脂組成物の調製)
表4に記載する割合でエポキシ樹脂、樹脂粒子Fを計量し、撹拌機を用いて80℃で30分間混合し、エポキシ樹脂主剤液を調製した。表4に記載する割合で硬化剤成分を計量し、撹拌機を用いて80℃で30分間混合し、熱硬化性樹脂用硬化剤組成物(硬化剤液)を調製した。これら別々に調製したエポキシ樹脂主剤液と熱硬化性樹脂用硬化剤組成物(硬化剤液)とを、撹拌機を用いて80℃で30分間混合して、エポキシ樹脂組成物を調製した。
上記で得られたエポキシ樹脂組成物を真空中で60分間脱泡した後、4mm厚のテフロン樹脂製スペーサーにより厚み4mmになるように設定したステンレス製モールド中に注入した。180℃の温度で40分間、加熱硬化させ、厚さ4mmの樹脂硬化物を得た。
つぎに、炭素繊維多軸織物1および炭素繊維多軸織物2を300×300mmにカットし、500×500mmの離型処理したアルミ板の上に、炭素繊維多軸織物1を3枚、炭素繊維多軸織物2を3枚、合計6枚重ねて積層体とした。
表4に記載のとおり組成を変更した他は実施例31と同様に実施した。評価結果を表4に示す。
表5に記載のとおり組成を変更した他は実施例31と同様に実施した。評価結果を表5に示す。
表6に記載のとおり組成を変更した他は実施例31と同様に実施した。評価結果を表6に示す。
Claims (23)
- 硬化剤A、硬化剤Bおよび硬化剤Cを含有してなる熱硬化性樹脂用硬化剤組成物であって、硬化剤Aは、アミノ基に対する2つのオルト位にそれぞれ置換基を有する芳香族ポリアミンであり、該置換基はアルキル基、芳香族基およびハロゲン基から選択され、硬化剤Bは、25℃で液体である芳香族ポリアミンであり、硬化剤Cは、芳香族ポリアミンであり、該芳香族ポリアミンは、アミノ基に対するオルト位に電子供与基をただ一つ有するかオルト位に置換基を有しない芳香族ポリアミンであることを特徴とする、熱硬化性樹脂用硬化剤組成物。
- 熱硬化性樹脂用硬化剤組成物の全質量を基準として、硬化剤A、硬化剤Bおよび硬化剤Cの合計が70~100質量%を占め、硬化剤Aと硬化剤Bの質量比率が1:99~99:1であり、硬化剤Aと硬化剤Bとの合計100質量部に対して硬化剤Cが1~43質量部である、請求項1に記載の熱硬化性樹脂用硬化剤組成物。
- 硬化剤Cの芳香族ポリアミンの電子供与基が、メチル基、エチル基、プロピル基、イソプロピル基、メトキシ基またはエトキシ基である、請求項1に記載の熱硬化性樹脂用硬化剤組成物。
- 硬化剤Cの芳香族ポリアミンの融点が150℃以下である、請求項3に記載の熱硬化性樹脂用硬化剤組成物。
- 硬化剤Aの芳香族ポリアミンが芳香族ジアミンである、請求項1に記載の熱硬化性樹脂用硬化剤組成物。
- 硬化剤Aの芳香族ジアミンが4,4’-ジアミノジフェニルメタン誘導体である、請求項5に記載の熱硬化性樹脂用硬化剤組成物。
- 硬化剤Bの芳香族ポリアミンが、フェニレンジアミン誘導体または4,4’-ジアミノジフェニルメタン誘導体である、請求項1に記載の熱硬化性樹脂用硬化剤組成物。
- 80~200℃の温度で均一な液体となり、かつ液温を200℃に昇温後に25℃に降温させて25℃で1週間静置した後において均一な液体である、請求項1に記載の熱硬化性樹脂用硬化剤組成物。
- 熱硬化性樹脂用硬化剤組成物およびエポキシ樹脂主剤を含有するエポキシ樹脂組成物であって、熱硬化性樹脂用硬化剤組成物が請求項1に記載の熱硬化性樹脂用硬化剤組成物である、エポキシ樹脂組成物。
- 硬化剤A、硬化剤B、硬化剤C、エポキシ樹脂D、エポキシ樹脂Eおよび樹脂粒子Fを含有してなるエポキシ樹脂組成物であって、硬化剤Aは、アミノ基に対する2つのオルト位にそれぞれ置換基を有する芳香族ポリアミンであり、該置換基はアルキル基、芳香族基およびハロゲン基から選択され、硬化剤Bは、25℃で液体である芳香族ポリアミンであり、硬化剤Cは、芳香族ポリアミンであり、該芳香族ポリアミンは、アミノ基に対するオルト位に電子供与基をただ一つ有するかオルト位に置換基を有しない芳香族ポリアミンであり、エポキシ樹脂Dは、グリシジル基を4つ以上含むモノマーから構成されるエポキシ樹脂から構成され、エポキシ樹脂Eは、グリシジル基を2つまたは3つ含むモノマーから構成されるエポキシ樹脂から構成されることを特徴とする、エポキシ樹脂組成物。
- エポキシ樹脂Dのグリシジル基を4つ以上含むモノマーが、テトラグリシジル-4,4’-ジアミノジフェニルエーテル、テトラグリシジル-4,4’-ジアミノジフェニルメタン、テトラグリシジル-3,4’-ジアミノジフェニルエーテルおよびテトラグリシジル-3,3’-ジアミノジフェニルメタンからなる群から選択される1種または2種以上の組み合わせである、請求項11に記載のエポキシ樹脂組成物。
- エポキシ樹脂組成物に含まれるエポキシ樹脂の全質量を基準として、エポキシ樹脂Dが50~90質量%含有される、請求項10に記載の樹脂組成物。
- エポキシ樹脂Eのグリシジル基を2つまたは3つ含むモノマーが、ジグリシジルアニリン、ジグリシジル-o-トルイジン、トリグリシジル-p-アミノフェノール、トリグリシジル-m-アミノフェノール、1,6-ビス(2,3-エポキシプロパン-1-イルオキシ)ナフタレンおよび1,3,5-トリグリシジルイソシアヌレートからなる群から選択される1種または2種以上の組み合わせである、請求項10に記載のエポキシ樹脂組成物。
- 樹脂粒子Fの平均粒子径が1.0μm以下である、請求項10に記載のエポキシ樹脂組成物。
- エポキシ樹脂組成物中の総エポキシ基の数と熱硬化性樹脂用硬化剤組成物に含まれる活性水素の数の比率が0.7~1.3である、請求項10に記載のエポキシ樹脂組成物。
- 180℃で30分間硬化させて得られる硬化物の、下記式で表されるDSC硬化度αが98%以上である、請求項10に記載のエポキシ樹脂組成物。
α=(ΔH未硬化-ΔH硬化物)/ΔH未硬化×100
(ただし、ΔHは20℃/分間の昇温速度でDSC測定を行った際に確認される硬化反応に伴う発熱量であり、ΔH未硬化は未硬化のエポキシ樹脂組成物のΔHであり、ΔH硬化物は樹脂硬化物のΔHである。) - 誘電硬化度測定によって評価される、180℃40分間加熱後の硬化度が70%以上である、請求項10に記載のエポキシ樹脂組成物。
- 請求項10に記載のエポキシ樹脂組成物を硬化させて得られる樹脂硬化物。
- 請求項10に記載のエポキシ樹脂組成物を硬化して成る樹脂硬化物と、強化繊維基材と、を含んで構成される繊維強化複合材料。
- 強化繊維基材が炭素強化繊維基材である請求項20に記載の繊維強化複合材料。
- 強化繊維基材と、請求項10に記載のエポキシ樹脂組成物と、を複合化して硬化させる繊維強化複合材料の製造方法。
- 請求項10に記載のエポキシ樹脂組成物を、型内に配置した強化繊維基材へ含浸させた後、加熱硬化する工程を含む繊維強化複合材料の製造方法。
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JPS4630592B1 (ja) * | 1968-02-02 | 1971-09-06 | ||
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JPH0317559B2 (ja) | 1986-12-22 | 1991-03-08 | Ebara Infuiruko Kk | |
JP2010150310A (ja) * | 2008-12-24 | 2010-07-08 | Toray Ind Inc | エポキシ樹脂組成物、繊維強化複合材料およびその製造方法 |
JP2013159618A (ja) * | 2012-02-01 | 2013-08-19 | Toray Ind Inc | エポキシ樹脂組成物、繊維強化複合材料およびそれらの製造方法 |
JP2020527180A (ja) * | 2017-07-12 | 2020-09-03 | ヘクセル コンポジッツ、リミテッド | 樹脂硬化剤系の改善 |
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JPS4630592B1 (ja) * | 1968-02-02 | 1971-09-06 | ||
JPS4714149B1 (ja) * | 1969-01-21 | 1972-04-27 | ||
JPH0317559B2 (ja) | 1986-12-22 | 1991-03-08 | Ebara Infuiruko Kk | |
JP2010150310A (ja) * | 2008-12-24 | 2010-07-08 | Toray Ind Inc | エポキシ樹脂組成物、繊維強化複合材料およびその製造方法 |
JP2013159618A (ja) * | 2012-02-01 | 2013-08-19 | Toray Ind Inc | エポキシ樹脂組成物、繊維強化複合材料およびそれらの製造方法 |
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