WO2022181134A1 - 熱伝導性組成物、熱伝導性部材、バッテリモジュール - Google Patents
熱伝導性組成物、熱伝導性部材、バッテリモジュール Download PDFInfo
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- WO2022181134A1 WO2022181134A1 PCT/JP2022/002051 JP2022002051W WO2022181134A1 WO 2022181134 A1 WO2022181134 A1 WO 2022181134A1 JP 2022002051 W JP2022002051 W JP 2022002051W WO 2022181134 A1 WO2022181134 A1 WO 2022181134A1
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- thermally conductive
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- 239000000203 mixture Substances 0.000 title claims abstract description 75
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 85
- -1 polysiloxane Polymers 0.000 claims abstract description 77
- 150000001875 compounds Chemical class 0.000 claims abstract description 51
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 33
- 239000011231 conductive filler Substances 0.000 claims abstract description 30
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 28
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 28
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 18
- 239000001257 hydrogen Substances 0.000 claims abstract description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 33
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 10
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 abstract description 21
- 229920001155 polypropylene Polymers 0.000 abstract description 21
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 description 68
- 239000002245 particle Substances 0.000 description 33
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 22
- 238000007259 addition reaction Methods 0.000 description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 16
- 239000007809 chemical reaction catalyst Substances 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- 239000003054 catalyst Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 229910052697 platinum Inorganic materials 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- HMVBQEAJQVQOTI-UHFFFAOYSA-N 3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)C=C(C)C#C HMVBQEAJQVQOTI-UHFFFAOYSA-N 0.000 description 1
- MQSZOZMNAJHVML-UHFFFAOYSA-N 3-phenylbut-1-yn-1-ol Chemical compound OC#CC(C)C1=CC=CC=C1 MQSZOZMNAJHVML-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
- H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
- H01M50/211—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for pouch cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present invention relates to a thermally conductive composition, a thermally conductive member, and a battery module using the thermally conductive member as a gap material.
- a curable thermally conductive composition is filled between a heating element and a radiator, and then cured to form a cured product that is used as a thermally conductive member that transfers heat generated by the heating element to the radiator. It is Since the curable thermally conductive composition is fluid, it can fill any gap between the heat generating element and the heat dissipating element. Therefore, the formed thermally conductive member can reliably fill the gap even if the gap between the heating element and the radiator is not uniform, and is used as a thermally conductive gap material.
- thermally conductive member as a gap material in a battery module.
- the thermally conductive member is disposed between the battery cell, which is a heat generator, and the module housing, which is a radiator, and serves to radiate the heat of the battery cell to the outside. It is also used to fix the battery cells between the battery cells and maintain the separated state.
- Thermally conductive materials have a certain degree of adhesiveness, and many of them adhere to adherends such as heating elements and radiators to the extent that they do not slip off or fall off.
- the body is also made into a fitting structure and fixed with screws or the like.
- Patent Document 2 contains a curable organopolysiloxane, an alkoxysilane compound, and a thermally conductive filler, and the alkoxysilane compound is an alkoxysilane containing a long-chain alkenyl group having 8 to 18 carbon atoms. , discloses a thermally conductive composition, which is described as having excellent adhesion to adherends.
- an object of the present invention is to provide a thermally conductive composition capable of forming a thermally conductive member having excellent thermal conductivity and high adhesion to polypropylene.
- the present inventors have found (A) an organopolysiloxane having at least two alkenyl groups, (B) a hydrogen organopolysiloxane having at least two hydrosilyl groups, (C) a thermally conductive filler, and (D)
- the inventors have found that the above problems can be solved by a thermally conductive composition containing a polysiloxane compound having at least one alkyl group having 4 or more carbon atoms, and have completed the present invention below. That is, the present invention provides the following [1] to [8].
- a thermally conductive member obtained by curing the thermally conductive composition according to any one of [1] to [6] above.
- thermoly conductive composition that is excellent in thermal conductivity and capable of forming a thermally conductive member with high adhesion to polypropylene.
- FIG. 1 is a perspective view showing a representative configuration of a battery module according to the present invention
- FIG. 3 is a perspective view showing a typical configuration of battery cells included in the battery module
- the thermally conductive composition of the present invention comprises (A) an organopolysiloxane having at least two alkenyl groups, (B) a hydrogen organopolysiloxane having at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) contains a polysiloxane compound having at least one alkyl group having 4 or more carbon atoms;
- the thermally conductive member of the present invention is formed by curing the thermally conductive composition.
- the thermally conductive member formed from the thermally conductive composition of the present invention has a high adhesion to polypropylene. Since the polysiloxane compound (D) has a polysiloxane structure, it is compatible with the silicone matrix formed by the reaction of the components (A) and (B). Furthermore, (D) the polysiloxane compound has an alkyl group with 4 or more carbon atoms, so that it has a high affinity for polypropylene. As a result, it is thought that the surface energy of the silicone matrix that constitutes the thermally conductive member is lowered, and the adhesion to polypropylene is improved.
- the thermally conductive composition of the present invention comprises (A) an organopolysiloxane having at least two alkenyl groups (hereinafter also referred to as component (A)), and (B) a hydrogen organopolysiloxane having at least two hydrosilyl groups ( (hereinafter also referred to as component (B)).
- component (A) component and (B) component are different components from the (D) component mentioned later.
- the (A) component is generally used as a main agent, and the (B) component as a curing agent.
- Components (A) and (B) react and cure through an addition reaction to form a matrix made of silicone rubber. Since silicone rubber is easily deformed by compression, the thermally conductive member of the present invention can be easily assembled between the heating element and the radiator.
- Component (A) is not particularly limited as long as it is an organopolysiloxane having at least two alkenyl groups in one molecule.
- the number of alkenyl groups in one molecule of component (A) is preferably 2-20, more preferably 2-10.
- alkenyl groups in component (A) include those having 2 to 8 carbon atoms, such as vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl and octenyl groups.
- a component may use only 1 type and may use 2 or more types together.
- Component (B) is not particularly limited as long as it is a hydrogen organopolysiloxane having at least two hydrosilyl groups in one molecule.
- a hydrosilyl group means a hydrogen atom (SiH group) bonded to a silicon atom.
- the number of hydrosilyl groups per molecule in component (B) is preferably 2-100, more preferably 2-50.
- Component may use only 1 type, and can use 2 or more types together.
- Component (B) preferably contains hydrogen organopolysiloxane (B X ) having a hydrosilyl group content of 2 mmol/g or more (hereinafter also referred to as component (B X )).
- the hydrosilyl group content of component (B X ) is preferably 4 mmol/g or more, more preferably 6 mmol/g or more.
- the content of the (B X ) component may be adjusted so as to obtain the desired hardness of the cured product. Specifically, when the cured product is desired to be hardened, the content of the ( Bx ) component is increased, and when the cured product is desired to be soft, the content of the ( Bx ) component is decreased.
- the components (A) and (B) are preferably liquid before curing. Being in a liquid state before curing facilitates high filling of the thermally conductive filler.
- the term "liquid” refers to a liquid at room temperature (23°C) and 1 atmosphere.
- the addition reaction of components (A) and (B) is preferably carried out in the presence of an addition reaction catalyst, and the addition reaction catalyst is preferably a platinum catalyst.
- the thermally conductive composition of the present invention contains (C) a thermally conductive filler.
- C) a thermally conductive filler By containing the thermally conductive filler, the thermal conductivity of the thermally conductive member formed from the thermally conductive composition is improved.
- Thermally conductive fillers include, for example, metals, metal oxides, metal nitrides, metal hydroxides, carbon materials, oxides other than metals, nitrides, and carbides.
- the shape of the (C) thermally conductive filler may be spherical or amorphous powder.
- thermally conductive filler metals such as aluminum, copper, and nickel; metal oxides such as aluminum oxide, magnesium oxide, and zinc oxide represented by alumina; and metal nitrides such as aluminum nitride.
- Metal hydroxides include aluminum hydroxide.
- spherical graphite etc. are mentioned as a carbon material.
- oxides, nitrides, and carbides other than metals include quartz, boron nitride, and silicon carbide.
- aluminum oxide is preferable from the viewpoint of improving the heat dissipation property of the thermally conductive member, and aluminum hydroxide is preferable when it is desired to improve flame retardancy.
- Thermally conductive fillers may be used singly or in combination of two or more.
- the average particle diameter of the thermally conductive filler (C) is preferably 0.1 to 200 ⁇ m, more preferably 0.5 to 100 ⁇ m, even more preferably 1 to 70 ⁇ m.
- the thermally conductive filler is a combination of a small particle size thermally conductive filler with an average particle size of 0.1 ⁇ m or more and 5 ⁇ m or less and a large particle size thermally conductive filler with an average particle size of more than 5 ⁇ m and 200 ⁇ m or less. preferably.
- the filling rate can be increased by using thermally conductive fillers with different average particle sizes.
- the volume ratio of the small particle size thermally conductive filler to the large particle size thermally conductive filler is preferably 0.05 to 5. , more preferably 0.1 to 1, more preferably 0.2 to 0.8.
- the average particle size of the (C) thermally conductive filler can be measured by observing with an electron microscope or the like. More specifically, for example, using an electron microscope or an optical microscope, the particle size of 50 arbitrary (C) thermally conductive fillers is measured, and the average value (arithmetic average value) is taken as the average particle size. can do.
- the content of the thermally conductive filler (C) is preferably 150 to 3000 parts by mass, more preferably 100 parts by mass in total of the components (A), (B) and (D) the polysiloxane compound 200 to 2000 parts by mass, more preferably 300 to 1000 parts by mass.
- C By setting the content of the thermally conductive filler to the above lower limit or more, a certain thermal conductivity can be imparted to the thermally conductive member. By setting the content of the thermally conductive filler (C) to the above upper limit or less, the thermally conductive filler (C) can be appropriately dispersed in the thermally conductive member. In addition, it is possible to prevent the viscosity of the thermally conductive composition from becoming higher than necessary.
- the thermally conductive composition of the present invention contains (D) a polysiloxane compound having at least one alkyl group having 4 or more carbon atoms ((D) polysiloxane compound). (D) By containing the polysiloxane compound, the adhesion of the thermally conductive member formed from the thermally conductive composition to polypropylene is improved.
- the polysiloxane compound may have at least one alkyl group having 4 or more carbon atoms, but from the viewpoint of adhesion to polypropylene and ease of production of the compound, the carbon in the (D) polysiloxane compound
- the number of alkyl groups having a number of 4 or more is preferably 1 to 3, more preferably 1 to 2, still more preferably 1.
- the alkyl group having 4 or more carbon atoms is not particularly limited as long as it has 4 or more carbon atoms, and may be linear or branched.
- the number of carbon atoms in the alkyl group having 4 or more carbon atoms is preferably 4 or more and 30 or less, more preferably 4 or more and 12 or less, still more preferably 4 or more and 8 or less, and particularly preferably 4. That is, a butyl group is particularly preferable as the alkyl group having 4 or more carbon atoms.
- the polysiloxane compound has a plurality of alkyl groups having 4 or more carbon atoms
- the plurality of alkyl groups having 4 or more carbon atoms may be the same or different.
- the alkyl group having 4 or more carbon atoms is present at the end of (D) the polysiloxane compound.
- at least one alkyl group with 4 or more carbon atoms is preferably present at the end of (D) the polysiloxane compound.
- the polysiloxane compound preferably has a reactive group capable of reacting with the component (A) or component (B).
- the polysiloxane compound (D) is more likely to be linked to the components (A) and (B) by chemical bonding, so that the surface energy of the silicone matrix is more likely to decrease.
- the polysiloxane compound (D) since the polysiloxane compound (D) has an alkyl group having 4 or more carbon atoms, the affinity between the silicone matrix and polypropylene is further improved, resulting in excellent adhesion between the two.
- the reactive group capable of reacting with component (A) or component (B) is not particularly limited, but should be a reactive group selected from the group consisting of (meth)acryloyl groups, alkenyl groups, and hydrosilyl groups (SiH groups). is preferred.
- (Meth)acryloyl groups and alkenyl groups are reactive groups capable of reacting with component (B), and hydrosilyl groups (SiH groups) are reactive groups capable of reacting with component (A).
- a (meth)acryloyl group means an acryloyl group or a methacryloyl group.
- alkenyl groups include those having 2 to 8 carbon atoms, such as vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl and octenyl groups.
- these reactive groups a (meth)acryloyl group is preferred, and a methacryloyl group is more preferred.
- the number of reactive groups possessed by the (D) polysiloxane compound may be one or two or more, but preferably one. .
- the (D) polysiloxane compound in the present invention is preferably a compound represented by the following formula (1).
- X is an organic group having a reactive group.
- At least one of B, C, and D is a group represented by the following formula (2), and the rest are methyl groups or phenyl groups.
- the multiple groups represented by formula (2) may be the same or different. Among them, it is preferable that one or two of B, C and D are groups represented by the following formula (2) and the remainder are methyl groups.
- R 1 and R 2 are each independently a methyl group or a phenyl group. At least one of R 3 , R 4 , and R 5 is an alkyl group having 4 or more carbon atoms, and the rest are each independently a methyl group, a phenyl group, or X (that is, an organic group having the reactive group described above). and preferably each residue is independently a methyl group or a phenyl group. * means a bond that bonds with Si in Formula (1).
- n is an integer from 9 to 130; Among them, it is preferable that R 3 is an alkyl group having 4 or more carbon atoms, R 4 and R 5 are each independently a methyl group or a phenyl group, and both R 4 and R 5 are methyl groups. more preferred.
- the number of carbon atoms in the alkyl group having 4 or more carbon atoms is preferably 4 or more and 30 or less, more preferably 4 or more and 12 or less, still more preferably 4 or more and 8 or less, and particularly preferably 4. That is, a butyl group is particularly preferable as the alkyl group having 4 or more carbon atoms.
- the reactive group possessed by X is the same as the reactive group described above as a reactive group capable of reacting with component (A) or component (B).
- X is preferably an organic group having 2 to 50 carbon atoms having a reactive group, more preferably an organic group having 3 to 15 carbon atoms having a reactive group.
- X is preferably any one of X 1 to X 6 below.
- A is a reactive group.
- A is preferably a reactive group selected from the group consisting of a (meth)acryloyl group, an alkenyl group, and a hydrosilyl group (SiH group), more preferably a (meth)acryloyl group, and a methacryloyl group. is more preferred.
- n1 is an integer of 1-2.
- n2 is an integer of 1-6, preferably an integer of 2-4. * represents a bond that bonds to Si in formula (1).
- X is preferably X 2 from the viewpoint of enhancing the adhesion of the thermally conductive member to polypropylene.
- the content of the (D) polysiloxane compound in the thermally conductive composition is preferably 0.1 to 30 parts per 100 parts by mass in total of the components (A), (B) and (D) the polysiloxane compound. parts by mass, more preferably 0.5 to 20 parts by mass, and even more preferably 1 to 10 parts by mass.
- additives can be contained in the thermally conductive composition of the present invention.
- additives include catalysts, dispersants, flame retardants, plasticizers, curing retarders, antioxidants, colorants and the like.
- the form of the thermally conductive composition of the present invention may be a one-pack type or a two-pack type consisting of a combination of a first agent and a second agent, but the two-pack type is preferred from the viewpoint of storage stability.
- the mass ratio of the first agent to the second agent is preferably 1 or a value close to 1, specifically 0.1. 9 to 1.1 are preferred, and 0.95 to 1.05 are more preferred.
- the viscosity ratio between the first agent and the second agent is also preferably 1 or a value close to 1. Specifically, 0.5 to 2.0 is preferred, and 0.8 to 1.2 is more preferred.
- the two-part type thermally conductive composition comprises (A) an organopolysiloxane having at least two alkenyl groups (component A) (main agent), and the second agent (B ) containing a hydrogen organopolysiloxane (component B) (curing agent) having at least two hydrosilyl groups;
- the addition reaction catalyst is contained in the first part and not contained in the second part.
- the first part and the second part are excellent in storage stability before mixing, and after mixing, the reaction is accelerated and can be rapidly cured, and the thermally conductive member obtained by curing.
- Various physical properties can be improved. The reason for this is not clear, but it is presumed that the addition reaction catalyst such as a platinum catalyst is coordinated with the alkenyl group, which is the addition reaction site of the component (A), and the curing proceeds easily.
- the thermally conductive filler is preferably contained in at least one of the first part and the second part, but is preferably contained in both the first part and the second part.
- Including the thermally conductive filler in both the first part and the second part makes it easier to mix the first part and the second part.
- the mass ratio and viscosity ratio of the second agent to the first agent when producing the thermally conductive composition can be set to 1 or a value close to 1, the composition can be easily used as a two-liquid type.
- the second agent contains the (A) component. The mass ratio and viscosity It becomes easier to adjust the ratio to 1 or a value close to 1.
- the first agent should not contain component (B), which is a curing agent.
- the second agent contains component (A) and a small amount of an addition reaction catalyst in addition to component (B)
- a curing retarder is added to prevent addition reaction curing during storage.
- the second agent contains a small amount of an addition reaction catalyst
- curing retardation is required in order to suppress the reaction between the component (B) and the component (A) due to the addition reaction catalyst during storage. agents can be added.
- a curing retarder for example, carbon-carbon such as 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, phenylbutynol, 1-ethynyl-1-cyclohexanol Alcohol derivatives having a triple bond, enyne compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexene-1-yne, tetramethyltetravinylcyclotetrasiloxane, tetramethyltetrahexenylcyclo alkenyl group-containing low molecular weight siloxanes such as tetrasiloxane; Silanes are exemplified.
- the second agent may contain an addition reaction catalyst in such an amount that the reaction is not accelerated at room temperature.
- a platinum catalyst such as chloroplatinic acid, a complex of chloroplatinic acid with an olefin, vinylsiloxane or an acetylene compound, which is used as an addition reaction catalyst, acts on the curing agent (B) to initiate the reaction. It has an activating function that enhances sexuality. As a means for avoiding unnecessary activation of the curing agent during storage of the second agent, it is most effective not to contain an addition reaction catalyst in the second agent.
- the polysiloxane compound may be contained in either the first agent or the second agent, or both.
- a method for blending (D) the polysiloxane compound according to the type of the reactive group. should be decided.
- the reactive group possessed by the polysiloxane compound is a group capable of reacting with the component (B) (e.g., (meth)acryloyl group or alkenyl group), from the viewpoint of storage stability, the (D) polysiloxane compound is It is preferably blended in the first agent.
- the reactive group of the polysiloxane compound (D) is a group capable of reacting with the component (A) (for example, a hydrosilyl group)
- the polysiloxane compound (D) is added to the second agent from the viewpoint of storage stability. is preferred.
- the curing temperature may be selected according to the type and amount of component (B) used as a curing agent, and the type and amount of addition reaction catalyst added.
- component (B) used as a curing agent
- the first part and the second part may be mixed and cured simply by leaving them at room temperature, but it is also possible to select a form in which curing is accelerated by heating. .
- a thermally conductive member can be formed by curing the thermally conductive composition of the present invention.
- the hardness of the thermally conductive member (that is, the cured product of the thermally conductive composition) is a value measured by a JIS K 6253 type E hardness tester (hereinafter referred to as "E hardness"), for example 30 to 90, preferably 35-80, more preferably 40-70.
- E hardness a JIS K 6253 type E hardness tester
- the adhesiveness between the thermally conductive member and polypropylene is improved. It is presumed that this is because cohesive failure is suppressed because the thermally conductive member has a certain hardness.
- the flexibility to follow the shape of the heating element or radiator and the adhesion to the heating element or radiator are sufficiently improved. can be secured.
- the thermal conductivity of the thermally conductive member (that is, the cured product of the thermally conductive composition) is preferably 1.0 W/m ⁇ K or more, more preferably 1.5 W/m ⁇ K or more. , 2.0 W/m ⁇ K or more. By making it more than these lower limits, thermal conductivity becomes favorable. Therefore, when used as a gap material for battery cell modules, for example, heat generated from the battery cells can be efficiently transferred to the module housing via the gap material. rise can be suppressed. The higher the thermal conductivity of the thermally conductive member, the better.
- a battery module includes an interstitial material made of a thermally conductive member, a plurality of battery cells, and a module housing for storing the plurality of battery cells, wherein the interstitial material is provided inside the module housing. placed.
- a gap material made of a thermally conductive member is filled between the battery cells and between the battery cell and the module housing, and the filled gap material adheres to the battery cell and the module housing.
- the gap material between the battery cells has a function of maintaining the separated state between the battery cells.
- the gap material between the battery cells and the module housing is in close contact with both the battery cells and the module housing, and has the function of transferring heat generated in the battery cells to the module housing.
- FIG. 1 shows a specific configuration of the battery module.
- FIG. 2 shows a specific configuration of each battery cell.
- a plurality of battery cells 11 are arranged inside the battery module 10 .
- Each battery cell 11 is laminated and enclosed in a flexible outer film, and the overall shape is a flat body that is thin compared to its height and width.
- the positive electrode 11a and the negative electrode 11b are exposed to the outside, and the central portion 11c of the flat surface is formed thicker than the crimped end portions 11d.
- each battery cell 11 is arranged such that its flat surfaces face each other.
- the interstitial material 13 is not filled so as to cover the entire plurality of battery cells 11 stored inside the module housing 12 .
- the interstitial material 13 is filled so as to fill the interstices present in a portion (bottom side portion) inside the module housing 12 .
- the gap material 13 is filled between the battery cells 11 and between the battery cells 11 and the module housing 12 , and is in close contact with the surface of the battery cells 11 and the inner surface of the module housing 12 in this portion.
- the interstitial material 13 filled between the battery cells 11 is adhered to the surfaces of both battery cells 11, and the interstitial material 13 itself has the hardness described above, so that it has appropriate elasticity and flexibility. Therefore, even if an external force displacing the interval between the battery cells 11 is applied, strain deformation due to the external force can be alleviated. Therefore, the gap material 13 has a function of keeping the battery cells 11 separated from each other.
- a gap material 13 filling a gap between the battery cell 11 and the inner surface of the module housing 12 is also tightly adhered to the surface of the battery cell 11 and the inner surface of the module housing 12 .
- the heat generated inside the battery cell 11 passes through the interstitial material 13 adhered to the surface of the battery cell 11 and passes through the module housing 12 which is in close contact with the other surface of the interstitial material 13 . communicated internally.
- the gap material 13 in the battery module 10 may be formed by applying a liquid thermally conductive composition using a general dispenser and then curing the liquid thermally conductive composition. .
- a liquid thermally conductive composition using a general dispenser and then curing the liquid thermally conductive composition.
- the two-liquid type is easy to store, and if it is mixed immediately before use, it is difficult to harden during the work of applying with a dispenser, and can be quickly hardened after application.
- Application by a dispenser is also preferable in that the liquid thermally conductive composition can be filled relatively deep inside the housing 12 of the battery module 10 .
- the gap material 13 covering the battery cells 11 preferably covers 20 to 40% of each battery cell 11 on one side of the battery cell 11 . By making it 20% or more, the battery cells 11 can be stably held. In addition, by sufficiently covering the battery cells that generate a large amount of heat, heat radiation efficiency is improved. On the other hand, by making it 40% or less, heat generated from the battery cells 11 can be efficiently radiated, and an increase in weight and deterioration of workability can be prevented. In order to improve heat radiation efficiency, it is preferable to cover the side of the battery cell 11 on which the electrodes 11a and 11b are located with the gap material 13, and it is more preferable to cover the entire electrodes 11a and 11b with the gap material 13.
- the battery module 10 can release heat generated from the battery cells 11 to the module housing 12 via the gap material 13 .
- the interstitial material 13 is also preferably used in a battery pack with multiple battery modules 10 therein.
- a battery pack generally includes a plurality of battery modules 10 and a battery pack housing that accommodates the plurality of battery modules 10 .
- a gap material 13 can be provided between the battery module 10 and the housing of the battery pack.
- the thermally conductive member of the present invention is used for the gap material 13, even if the module housing 12 or the housing of the battery pack is made of polypropylene, the adhesion is improved. Therefore, even if the thermally conductive member of the present invention is subject to vibration or shock when the automobile starts, stops, or travels, problems such as falling off from the module housing 12 or the housing of the battery pack are unlikely to occur. can be maintained well.
- Tensile shear bond strength was evaluated by measuring tensile shear strength as follows. The tensile shear strength was measured according to the tensile shear test of JIS K6850:1999. For the test piece, prepare two sheets of an aluminum plate and a polypropylene plate with a length of 100 mm, a width of 25 mm, and a thickness of 2 mm. It was prepared by applying a liquid thermally conductive composition so as to obtain the above, and curing the composition by standing at 25° C. for 24 hours.
- a tensile test was performed at a room temperature of 25 ° C. and a tensile speed of 100 mm / min to measure the tensile shear strength. The point was evaluated as the tensile shear bond strength.
- the thermally conductive member was measured with a JIS K 6253 type E hardness tester.
- thermo conductivity A plate having a thickness of 20 mm was cut from the thermally conductive member, and thermal conductivity was measured based on ASTM D5470.
- Examples 1-3, 7-9 A first agent and a second agent having the following compositions were prepared, and the first agent and the second agent were mixed at a mass ratio of 1:1 to obtain a thermally conductive composition having the composition shown in Table 1.
- the obtained thermally conductive composition was cured by being left at room temperature (23° C.) for 24 hours to obtain a thermally conductive member.
- Examples 4-6 A first agent and a second agent having the following compositions were prepared, and the first agent and the second agent were mixed at a mass ratio of 1:1 to obtain a thermally conductive composition having the composition shown in Table 1. The obtained thermally conductive composition was cured by being left at room temperature (23° C.) for 24 hours to obtain a thermally conductive member.
- thermoly conductive composition having the composition shown in Table 1.
- the obtained thermally conductive composition was cured by being left at room temperature (23° C.) for 24 hours to obtain a thermally conductive member.
- ⁇ First Agent> Organopolysiloxane A having at least two alkenyl groups - A polydimethylsiloxane having two methacrylate groups without having an alkyl group having 4 or more carbon atoms as a comparative compound (comparative compound of (D) polysiloxane compound) ⁇ Aluminum hydroxide C1 (average particle size 1 ⁇ m) ⁇ Aluminum hydroxide C2 (average particle size 54 ⁇ m) ⁇ Trace amount of platinum catalyst ⁇ Second agent> - Organopolysiloxane A having at least two alkenyl groups - Hydrogen organopolysiloxane B1 having at least two hydrosilyl groups - Hydrogen organopolysiloxane B2 having at least two hydrosilyl groups ⁇ Aluminum hydroxide C1 (average particle size 1 ⁇ m) ⁇ Aluminum hydroxide C2 (average particle size 54 ⁇ m)
- thermally conductive members of Examples 1 to 9 formed from the thermally conductive composition of the present invention containing (D) a polysiloxane compound had high tensile shear bond strength and excellent adhesion to polypropylene.
- the amount of the (D) polysiloxane compound is the same, as the E hardness value of the thermally conductive member increases, the tensile shear bond strength increases. It was found that the adhesive strength to polypropylene was improved.
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Abstract
Description
熱伝導性部材は、一定の粘着性を備えており、発熱体及び放熱体などの被着体からズレたり脱落しない程度に密着するものが多く、より強固に固定する場合は、発熱体及び放熱体を嵌合構造にしたり、ネジ等で固定することも行われている。
しかしながら、従来用いられていた熱伝導性部材は、ポリプロピレンに対する接着力が弱く、剥がれ等の不具合が生じやすいことが分かった。
[2]前記(D)ポリシロキサン化合物が、前記(A)成分または(B)成分と反応できる反応基を備える、上記[1]に記載の熱伝導性組成物。
[3]前記反応基が(メタ)アクリロイル基である、上記[1]又は[2]に記載の熱伝導性組成物。
[4]前記(D)ポリシロキサン化合物が備える前記アルキル基の炭素数が4以上30以下である、上記[1]~[3]のいずれかに記載の熱伝導性組成物。
[5]前記(D)ポリシロキサン化合物が備える前記アルキル基の炭素数が4以上8以下である、上記[1]~[4]のいずれかに記載の熱伝導性組成物。
[6]前記(D)ポリシロキサン化合物が備える前記アルキル基がブチル基である、上記[1]~[5]のいずれかに記載の熱伝導性組成物。
[7]上記[1]~[6]のいずれかに記載の熱伝導性組成物を硬化してなる熱伝導性部材。
[8]上記[7]に記載の熱伝導性部材からなる間隙材と、複数のバッテリセルと、前記複数のバッテリセルを格納するモジュール筐体とを備え、前記間隙材がモジュール筐体の内部に配置されるバッテリモジュール。
以下、本発明の熱伝導性組成物について詳しく説明する。
本発明の熱伝導性組成物は、(A)アルケニル基を少なくとも2つ有するオルガノポリシロキサン、(B)ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサン、(C)熱伝導性充填材、及び(D)炭素数4以上のアルキル基を少なくとも1つ備えるポリシロキサン化合物を含む。該熱伝導性組成物を硬化させることにより本発明の熱伝導性部材が形成される。
本発明の熱伝導性組成物により形成された熱伝導性部材が、ポリプロピレンに対して接着力が高い理由は定かではないが、以下のように推定される。(D)ポリシロキサン化合物はポリシロキサン構造を有するため、(A)成分及び(B)成分の反応により形成されるシリコーンマトリックスと相溶する。さらに(D)ポリシロキサン化合物は炭素数4以上のアルキル基を備えることにより、ポリプロピレンに対する親和性が高い。その結果、熱伝導性部材を構成するシリコーンマトリックスの表面エネルギーが低下して、ポリプロピレンとの接着力が向上すると考えられる。
本発明の熱伝導性組成物は、(A)アルケニル基を少なくとも2つ有するオルガノポリシロキサン(以下(A)成分ともいう)、及び(B)ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサン(以下(B)成分ともいう)を含有する。なお、(A)成分及び(B)成分は、後述する(D)成分とは異なる成分である。
(A)成分におけるアルケニル基としては、例えば炭素数2~8のものが挙げられ、ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基、オクテニル基などが挙げられる。
(A)成分は1種のみを使用してもよいし、2種以上を併用してもよい。
(B)成分は、1種のみを使用してもよいし、2種以上を併用することができる。
(B)成分としては、(BX)ヒドロシリル基の含有率が2mmol/g以上のハイドロジェンオルガノポリシロキサン(以下、(BX)成分ともいう)を含むことが好ましい。これにより、形成される熱伝導性部材の硬度が高まり、ポリプロピレンに対する接着性が向上しやすくなる。
(BX)成分のヒドロシリル基の含有率は好ましくは4mmol/g以上であり、より好ましくは6mmol/g以上である。
(BX)成分の含有量は、所望の硬化物の硬さとなるように(BX)成分の量を調整すれば良い。具体的には、硬化物を硬くしたいときは(BX)成分の含有量を増やし、柔らかくしたいときには(BX)成分の含有量を少なくすれば良い。
本発明の熱伝導性組成物は、(C)熱伝導性充填材を含有する。(C)熱伝導性充填材を含有することにより、熱伝導性組成物により形成される熱伝導性部材の熱伝導性が向上する。
(C)熱伝導性充填材としては、例えば、金属、金属酸化物、金属窒化物、金属水酸化物、炭素材料、金属以外の酸化物、窒化物、炭化物などが挙げられる。また、(C)熱伝導性充填材の形状は、球状、不定形の粉末などが挙げられる。
(C)熱伝導性充填材において、金属としては、アルミニウム、銅、ニッケルなど、金属酸化物としては、アルミナに代表される酸化アルミニウム、酸化マグネシウム、酸化亜鉛など、金属窒化物としては窒化アルミニウムなどを例示することができる。金属水酸化物としては、水酸化アルミニウムが挙げられる。さらに、炭素材料としては球状黒鉛などが挙げられる。金属以外の酸化物、窒化物、炭化物としては、石英、窒化ホウ素、炭化ケイ素などが挙げられる。これらの中でも、熱伝導性部材の放熱性向上の観点から、酸化アルミニウムが好ましく、難燃性を高めたい場合には水酸化アルミニウムが好ましい。
(C)熱伝導性充填材は、上記したものを1種単独で使用してもよいし、2種以上を併用してもよい。
(C)熱伝導性充填材は、平均粒径が0.1μm以上5μm以下の小粒径熱伝導性充填材と、平均粒径が5μm超200μm以下の大粒径熱伝導性充填材を併用することが好ましい。平均粒径の異なる熱伝導性充填材を使用することにより、充填率を高めることができる。小粒径熱伝導性充填材と大粒径熱伝導性充填材の体積比(小粒径熱伝導性充填材/大粒径熱伝導性充填材)は、好ましくは0.05~5であり、より好ましくは0.1~1であり、さらに好ましくは0.2~0.8である。
なお、(C)熱伝導性充填材の平均粒径は、電子顕微鏡等で観察して測定できる。より具体的には、例えば電子顕微鏡や光学顕微鏡を用いて、任意の(C)熱伝導性充填材50個の粒径を測定して、その平均値(相加平均値)を平均粒径とすることができる。
本発明の熱伝導性組成物は、(D)炭素数4以上のアルキル基を少なくとも1つ備えるポリシロキサン化合物((D)ポリシロキサン化合物)を含有する。(D)ポリシロキサン化合物を含有することにより、熱伝導性組成物により形成される熱伝導性部材のポリプロピレンに対する接着性が向上する。
(D)ポリシロキサン化合物は、炭素数4以上のアルキル基を少なくとも1つ備えていればよいが、ポリプロピレンに対する接着性や化合物の製造し易さの観点などから、(D)ポリシロキサン化合物における炭素数4以上のアルキル基の数は、好ましくは1~3個であり、より好ましくは1~2個であり、さらに好ましくは1個である。
(D)ポリシロキサン化合物が炭素数4以上のアルキル基を複数備える場合は、該複数の炭素数4以上のアルキル基は同一であっても異なっていてもよい。
(A)成分または(B)成分と反応できる反応基としては、特に限定されないが、(メタ)アクリロイル基、アルケニル基、及びヒドロシリル基(SiH基)からなる群から選択される反応基であることが好ましい。(メタ)アクリロイル基及びアルケニル基は(B)成分と反応できる反応基であり、ヒドロシリル基(SiH基)は(A)成分と反応できる反応基である。
(メタ)アクリロイル基は、アクリロイル基又はメタクリロイル基を意味する。
アルケニル基としては、例えば炭素数2~8のものが挙げられ、ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基、オクテニル基などが挙げられる。
これら反応基の中でも、(メタ)アクリロイル基が好ましく、メタクリロイル基がより好ましい。
(D)ポリシロキサン化合物が反応基を有する場合は、(D)ポリシロキサン化合物が有する反応基の数は1つであっても、2以上であってもよいが、1つであることが好ましい。
Xは反応基を有する有機基である。B、C、Dのうち少なくとも一つは以下の式(2)で表される基であり、残余はメチル基又はフェニル基である。式(2)で表される基が複数存在する場合は、該複数の式(2)で表される基は同一であっても異なっていてもよい。中でも、B、C、Dのうち一つ又は二つが以下の式(2)で表される基であり、残余がメチル基であることが好ましい。
R1及びR2はそれぞれ独立してメチル基又はフェニル基である。R3、R4、及びR5のうち少なくとも一つは炭素数4以上のアルキル基であり、残余はそれぞれ独立してメチル基、フェニル基、又はX(すなわち上記した反応基を有する有機基)であり、好ましくは、残余はそれぞれ独立してメチル基又はフェニル基である。*は式(1)のSiと結合する結合手を意味する。nは9~130の整数である。
中でも、R3が炭素数4以上のアルキル基であり、R4及びR5がそれぞれ独立して、メチル基又はフェニル基であることが好ましく、R4及びR5が共にメチル基であることがより好ましい。
炭素数4以上のアルキル基の炭素数は、好ましくは4以上30以下であり、より好ましくは4以上12以下であり、さらに好ましくは4以上8以下であり、特に好ましくは4である。すなわち、炭素数4以上のアルキル基としてはブチル基が特に好ましい。
上記X1~X6において、Aは反応基である。Aは、(メタ)アクリロイル基、アルケニル基、及びヒドロシリル基(SiH基)からなる群から選択される反応基であることが好ましく、(メタ)アクリロイル基であることがより好ましく、メタクリロイル基であることがさらに好ましい。n1は1~2の整数である。n2は1~6の整数であり、2~4の整数であることが好ましい。*は式(1)のSiと結合する結合手を表す。
上記X1~X6の中でも、熱伝導性部材のポリプロピレンに対する接着性を高める観点から、XはX2であることが好ましい。
2液型の熱伝導性組成物において、第1剤と第2剤の質量比(第2剤/第1剤)は、1又は1に近い値であることが好ましく、具体的には0.9~1.1が好ましく、0.95~1.05がより好ましい。このように、第1剤と第2剤の質量比を1又は1に近い値とすることで、熱伝導性組成物の調製が容易になる。また、2液型の熱伝導性組成物において、第1剤と第2剤の粘度比(第2剤/第1剤)も、1又は1に近い値であることが好ましく、具体的には0.5~2.0が好ましく、0.8~1.2がより好ましい。このように、第1剤と第2剤の質量比を1又は1に近い値とすることで、熱伝導性組成物を均一に混合しやすくなる。なお、質量比や粘度比を調整する方法は後述する。
付加反応触媒は第1剤に含有され、第2剤には含有されないことが好ましい。そうすることで、第1剤と第2剤とは混合前は保存安定性に優れ、混合後には反応が促進され、速やかに硬化するものとすることができ、硬化により得られる熱伝導性部材の各種物性を良好にできる。その要因は定かではないが、白金触媒などの付加反応触媒が、(A)成分の付加反応部位である、アルケニル基に配位した状態となり、硬化が進行しやすいためと推定される。
また、第2剤は、(A)成分を含有することが好ましい。第2剤が硬化剤である(B)成分に加えて主剤である(A)成分も含有することで、熱伝導性組成物を作製する際の第1剤に対する第2剤の質量比および粘度比を1又は1に近い値に調整しやすくなる。一方で、第1剤には、硬化剤である(B)成分が含有されないとよい。
具体的には、第2剤中に、微量の付加反応触媒が含有されている際、保存中、付加反応触媒による(B)成分と(A)成分との反応を抑制するために、硬化遅延剤を添加することができる。硬化遅延剤として、例えば、3-メチル-1-ブチン-3-オール、3,5-ジメチル-1-ヘキシン-3-オール、フェニルブチノール、1-エチニル-1-シクロヘキサノール等の炭素-炭素三重結合を有するアルコール誘導体、3-メチル-3-ペンテン-1-イン、3,5-ジメチル-3-ヘキセン-1-イン等のエンイン化合物、テトラメチルテトラビニルシクロテトラシロキサン、テトラメチルテトラヘキセニルシクロテトラシロキサン等のアルケニル基含有低分子量シロキサン、メチル-トリス(3-メチル-1-ブチン-3-オキシ)シラン、ビニル-トリス(3-メチル-1-ブチン-3-オキシ)シラン等のアルキン含有シランが例示される。
また、第2剤には、硬化遅延剤が含有されない場合でも、常温時は反応が促進されない程度の量の付加反応触媒が含有されてもよい。
付加反応触媒として利用される、例えば、塩化白金酸、塩化白金酸とオレフィン類、ビニルシロキサン又はアセチレン化合物との錯化合物等の白金触媒は、硬化剤である(B)成分に作用し、その反応性を高める活性化の機能を有している。第2剤を保存中、硬化剤の不要な活性化を回避する手段としては、第2剤中に付加反応触媒を含有しないことが最も有効である。
(D)ポリシロキサン化合物が有する反応基が(B)成分と反応できる基(例えば、(メタ)アクリロイル基又はアルケニル基)である場合は、保存安定性の観点から(D)ポリシロキサン化合物は、第1剤に配合することが好ましい。また(D)ポリシロキサン化合物が有する反応基が(A)成分と反応できる基(例えば、ヒドロシリル基)である場合は、保存安定性の観点から(D)ポリシロキサン化合物は第2剤に配合することが好ましい。
本発明の熱伝導性組成物を硬化することで、熱伝導性部材を形成することができる。熱伝導性部材(すなわち、熱伝導性組成物の硬化物)の硬度は、JIS K 6253のタイプEの硬度計によって測定される値(以下「E硬度」という)で例えば30~90、好ましくは35~80、より好ましくは40~70である。
熱伝導性部材のE硬度を上記下限値以上とすることで、熱伝導性部材とポリプロピレンとの接着性が向上する。これは、熱伝導性部材が一定の硬さを備えるため、凝集破壊が抑制されるからと推定される。また、熱伝導性部材のE硬度を上記上限値以下とすることで、発熱体や放熱体の形状に沿って良好に追従する柔軟性と、発熱体や放熱体との密着性とを十分に確保することができる。
本発明に係るバッテリモジュールは、熱伝導性部材からなる間隙材と、複数のバッテリセルと、前記複数のバッテリセルを格納するモジュール筐体とを備え、前記間隙材は、モジュール筐体の内部に配置される。
熱伝導性部材からなる間隙材は、バッテリセル相互間、及びバッテリセルとモジュール筐体間に充填されており、充填されている間隙材は、バッテリセル、及びモジュール筐体に密着する。これにより、バッテリセル間の間隙材は、バッテリセル相互間の離間状態を保持する機能を有している。また、バッテリセルとモジュール筐体との間の間隙材は、バッテリセルとモジュール筐体の双方に密着し、バッテリセルで発生する熱をモジュール筐体に伝える機能を有している。
バッテリセル11とモジュール筐体12の内面との間の間隙に充填されている間隙材13も、バッテリセル11の表面と、モジュール筐体12の内面に、密に接着されている。その結果、バッテリセル11の内部で発生する熱は、バッテリセル11の表面に接着している間隙材13を経由して、該間隙材13の他の面により密着されているモジュール筐体12の内面へと伝えられる。
間隙材13は、複数のバッテリモジュール10を内部に備えるバッテリパックに使用することも好ましい。バッテリパックは、一般には、複数のバッテリモジュール10と、該複数のバッテリモジュール10を収容するバッテリパックの筐体とを備える。該バッテリパックにおいて、バッテリモジュール10とバッテリパックの筐体との間に間隙材13を設けることができる。これにより、上記のとおりモジュール筐体12に逃がした熱をさらに、バッテリパックの筐体に逃がすことができ、効果的な放熱が可能となる。
また、間隙材13に本発明の熱伝導性部材を用いているので、モジュール筐体12又はバッテリパックの筐体がポリプロピレン製であったとしても、接着性が良好になる。そのため、本発明の熱伝導性部材は、例えば自動車の発進や停止、走行時に振動や衝撃を受けても、モジュール筐体12又はバッテリパックの筐体から脱落するなどの不具合が生じ難く、放熱性を良好に維持することが可能となる。
引張せん断接着強さは、以下のように引張せん断強さを測定することで評価した。
引張せん断強さは、JIS K6850:1999の引張せん断試験に準拠して測定した。試験片は、縦100mm、横25mm、厚さ2mmのアルミニウム板とポリプロピレン板の2枚を準備し、互いの先端が縦横25mm×25mmの長さで重なる状態に配置し、その間に厚さが2mmとなるように、液状の熱伝導性組成物を塗布して、25℃で24時間、常置して硬化させることで作製した。その後、引張試験機(東洋精機製作所「STROGRAPH VE50」)を用いて、室温25℃、引張速度100mm/minの条件で引張試験を行い、引張せん断強さを測定し、引張せん断強さが最大となる点を引張せん断接着強さとして評価した。
熱伝導性部材を、JIS K 6253のタイプEの硬度計によって測定した。
熱伝導性部材を厚さ20mmの板状に切り出し、ASTM D5470に基づいて熱伝導率を測定した。
下記の組成の第1剤及び第2剤を用意し、第1剤及び第2剤を質量比1:1で混合して、表1に記載の組成の熱伝導性組成物を得た。得られた熱伝導性組成物を室温(23℃)で24時間放置することで硬化させて熱伝導性部材を得た。
<第1剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・下記式(3)で示す構造のポリシロキサン化合物D1
n=63、分子量5,000
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
・微量の白金触媒
<第2剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB1
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB2
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
なお、ハイドロジェンオルガノポリシロキサンB1及びB2は、SiH基の含有率が異なる硬化剤であり、ハイドロジェンオルガノポリシロキサンB2のSiH基の含有率は7mmol/gであり、粘度は30cStである。
下記の組成の第1剤及び第2剤を用意し、第1剤及び第2剤を質量比1:1で混合して、表1に記載の組成の熱伝導性組成物を得た。得られた熱伝導性組成物を室温(23℃)で24時間放置することで硬化させて熱伝導性部材を得た。
<第1剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・下記式(4)で示す構造のポリシロキサン化合物D2
n=130、分子量10,000
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
・微量の白金触媒
<第2剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB1
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB2
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
下記の組成の第1剤及び第2剤を用意し、第1剤及び第2剤を質量比1:1で混合して、表1に記載の組成の熱伝導性組成物を得た。得られた熱伝導性組成物を室温(23℃)で24時間放置することで硬化させて熱伝導性部材を得た。
<第1剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
・微量の白金触媒
<第2剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB1
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
下記の組成の第1剤及び第2剤を用意し、第1剤及び第2剤を質量比1:1で混合して、表1に記載の組成の熱伝導性組成物を得た。得られた熱伝導性組成物を室温(23℃)で24時間放置することで硬化させて熱伝導性部材を得た。
<第1剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
・微量の白金触媒
<第2剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB1
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB2
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
下記の組成の第1剤及び第2剤を用意し、第1剤及び第2剤を質量比1:1で混合して、表1に記載の組成の熱伝導性組成物を得た。得られた熱伝導性組成物を室温(23℃)で24時間放置することで硬化させて熱伝導性部材を得た。
<第1剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・比較化合物として炭素数4以上のアルキル基を有さず、2つのメタアクリレート基を有するポリジメチルシロキサン((D)ポリシロキサン化合物の比較化合物)
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
・微量の白金触媒
<第2剤>
・アルケニル基を少なくとも2つ有するオルガノポリシロキサンA
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB1
・ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンB2
・水酸化アルミニウムC1(平均粒径1μm)
・水酸化アルミニウムC2(平均粒径54μm)
一方、(D)ポリシロキサン化合物を含まない比較例1~3の熱伝導性組成物から形成された熱伝導性部材は、引張せん断接着強さが低くなり、ポリプロピレンに対する接着性が低下することがわかった。
11 バッテリセル
12 バッテリモジュールの筐体(モジュール筐体)
13 間隙材
Claims (6)
- (A)アルケニル基を少なくとも2つ有するオルガノポリシロキサンと、
(B)ヒドロシリル基を少なくとも2つ有するハイドロジェンオルガノポリシロキサンと、
(C)熱伝導性充填材と、
(D)炭素数4以上のアルキル基を少なくとも1つ備えるポリシロキサン化合物と、
を含む熱伝導性組成物。 - 前記(D)ポリシロキサン化合物が、前記(A)成分または(B)成分と反応できる反応基を備える、請求項1に記載の熱伝導性組成物。
- 前記反応基が(メタ)アクリロイル基である、請求項2に記載の熱伝導性組成物。
- 前記(D)ポリシロキサン化合物が備える前記アルキル基がブチル基である、請求項1~3のいずれかに記載の熱伝導性組成物。
- 請求項1~4のいずれかに記載の熱伝導性組成物を硬化してなる熱伝導性部材。
- 請求項5に記載の熱伝導性部材からなる間隙材と、複数のバッテリセルと、前記複数のバッテリセルを格納するモジュール筐体とを備え、前記間隙材がモジュール筐体の内部に配置されるバッテリモジュール。
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CN202280010570.1A CN116761851A (zh) | 2021-02-26 | 2022-01-20 | 导热性组合物、导热性构件、电池模块 |
EP22759177.3A EP4300569A1 (en) | 2021-02-26 | 2022-01-20 | Heat-conductive composition, heat-conductive member, and battery module |
JP2022533630A JP7179398B1 (ja) | 2021-02-26 | 2022-01-20 | 熱伝導性組成物、熱伝導性部材、バッテリモジュール |
US18/273,131 US20240132766A1 (en) | 2021-02-26 | 2022-01-20 | Heat-conductive composition, heat-conductive member, and battery module |
KR1020237025767A KR20230150791A (ko) | 2021-02-26 | 2022-01-20 | 열전도성 조성물, 열전도성 부재, 배터리 모듈 |
JP2022179512A JP2023016821A (ja) | 2021-02-26 | 2022-11-09 | 熱伝導性組成物、熱伝導性部材、バッテリモジュール |
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US11780983B2 (en) | 2017-02-08 | 2023-10-10 | Elkem Silicones USA Corp. | Secondary battery pack with improved thermal management |
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- 2022-01-20 EP EP22759177.3A patent/EP4300569A1/en active Pending
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JP2008056761A (ja) * | 2006-08-30 | 2008-03-13 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーン組成物及びその硬化物 |
JP2016079301A (ja) * | 2014-10-17 | 2016-05-16 | 信越化学工業株式会社 | 剥離シート用軽剥離添加剤及び剥離シート用オルガノポリシロキサン組成物並びに剥離シート |
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US11780983B2 (en) | 2017-02-08 | 2023-10-10 | Elkem Silicones USA Corp. | Secondary battery pack with improved thermal management |
US11905385B2 (en) | 2017-02-08 | 2024-02-20 | Elkem Silicones USA Corp. | Secondary battery pack with improved thermal management |
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JP2023016821A (ja) | 2023-02-02 |
EP4300569A1 (en) | 2024-01-03 |
KR20230150791A (ko) | 2023-10-31 |
CN116761851A (zh) | 2023-09-15 |
US20240132766A1 (en) | 2024-04-25 |
JP7179398B1 (ja) | 2022-11-29 |
JPWO2022181134A1 (ja) | 2022-09-01 |
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