WO2022176914A1 - 液晶ポリマーフィルム、ポリマーフィルム、及び積層体 - Google Patents
液晶ポリマーフィルム、ポリマーフィルム、及び積層体 Download PDFInfo
- Publication number
- WO2022176914A1 WO2022176914A1 PCT/JP2022/006195 JP2022006195W WO2022176914A1 WO 2022176914 A1 WO2022176914 A1 WO 2022176914A1 JP 2022006195 W JP2022006195 W JP 2022006195W WO 2022176914 A1 WO2022176914 A1 WO 2022176914A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- liquid crystal
- crystal polymer
- polymer film
- layer
- Prior art date
Links
- 229920000106 Liquid crystal polymer Polymers 0.000 title claims abstract description 256
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims abstract description 252
- 229920006254 polymer film Polymers 0.000 title claims description 29
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 144
- -1 aromatic diol Chemical class 0.000 claims description 66
- 229910052751 metal Inorganic materials 0.000 claims description 65
- 239000002184 metal Substances 0.000 claims description 65
- 229920000642 polymer Polymers 0.000 claims description 62
- 150000001875 compounds Chemical class 0.000 claims description 59
- 125000003118 aryl group Chemical group 0.000 claims description 44
- 239000012790 adhesive layer Substances 0.000 claims description 42
- 125000000524 functional group Chemical group 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 239000001257 hydrogen Substances 0.000 claims description 23
- 229910052739 hydrogen Inorganic materials 0.000 claims description 23
- 229920001955 polyphenylene ether Polymers 0.000 claims description 16
- 230000003993 interaction Effects 0.000 claims description 14
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 14
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 11
- 125000004122 cyclic group Chemical group 0.000 claims description 11
- 229910052731 fluorine Inorganic materials 0.000 claims description 11
- 125000001931 aliphatic group Chemical group 0.000 claims description 10
- 125000003277 amino group Chemical group 0.000 claims description 10
- 239000011737 fluorine Substances 0.000 claims description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229920006149 polyester-amide block copolymer Polymers 0.000 claims description 6
- 125000002633 imido ester group Chemical group 0.000 claims description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 4
- 125000004018 acid anhydride group Chemical group 0.000 claims description 3
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 claims description 3
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical group O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000003566 oxetanyl group Chemical group 0.000 claims description 3
- 125000002521 alkyl halide group Chemical group 0.000 claims 1
- 238000000034 method Methods 0.000 description 57
- 239000007788 liquid Substances 0.000 description 25
- 229920000728 polyester Polymers 0.000 description 24
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 22
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 21
- 239000000178 monomer Substances 0.000 description 15
- 229920002313 fluoropolymer Polymers 0.000 description 14
- 239000000654 additive Substances 0.000 description 13
- 239000004811 fluoropolymer Substances 0.000 description 13
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 13
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 238000000137 annealing Methods 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 150000002739 metals Chemical class 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- 125000000565 sulfonamide group Chemical group 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 8
- 239000012299 nitrogen atmosphere Substances 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 125000003368 amide group Chemical group 0.000 description 6
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 125000004430 oxygen atom Chemical group O* 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000004711 α-olefin Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000004696 Poly ether ether ketone Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 239000004202 carbamide Substances 0.000 description 5
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000012634 fragment Substances 0.000 description 5
- 125000005462 imide group Chemical group 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 5
- 125000004433 nitrogen atom Chemical group N* 0.000 description 5
- 229920009441 perflouroethylene propylene Polymers 0.000 description 5
- 229920002530 polyetherether ketone Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 5
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 4
- 125000004959 2,6-naphthylene group Chemical group [H]C1=C([H])C2=C([H])C([*:1])=C([H])C([H])=C2C([H])=C1[*:2] 0.000 description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 4
- 150000004984 aromatic diamines Chemical class 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- 230000000977 initiatory effect Effects 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 125000003156 secondary amide group Chemical group 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 125000004434 sulfur atom Chemical group 0.000 description 4
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 4
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 125000004093 cyano group Chemical group *C#N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 3
- 125000004957 naphthylene group Chemical group 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- IZUPBVBPLAPZRR-UHFFFAOYSA-N pentachlorophenol Chemical compound OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl IZUPBVBPLAPZRR-UHFFFAOYSA-N 0.000 description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 3
- 125000005496 phosphonium group Chemical group 0.000 description 3
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 3
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- 125000001749 primary amide group Chemical group 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 229920006367 Neoflon Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical compound FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium group Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 2
- 239000002335 surface treatment layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- BZPCMSSQHRAJCC-UHFFFAOYSA-N 1,2,3,3,4,4,5,5,5-nonafluoro-1-(1,2,3,3,4,4,5,5,5-nonafluoropent-1-enoxy)pent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)=C(F)OC(F)=C(F)C(F)(F)C(F)(F)C(F)(F)F BZPCMSSQHRAJCC-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- MXIAQTJWEQTDRG-UHFFFAOYSA-N 1-ethenoxy-1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)OC=C MXIAQTJWEQTDRG-UHFFFAOYSA-N 0.000 description 1
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 description 1
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- XBNGYFFABRKICK-UHFFFAOYSA-N 2,3,4,5,6-pentafluorophenol Chemical compound OC1=C(F)C(F)=C(F)C(F)=C1F XBNGYFFABRKICK-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- GVEUEBXMTMZVSD-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,6-nonafluorohex-1-ene Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C=C GVEUEBXMTMZVSD-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- JTGCXYYDAVPSFD-UHFFFAOYSA-N 4-(4-hydroxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(O)C=C1 JTGCXYYDAVPSFD-UHFFFAOYSA-N 0.000 description 1
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920001780 ECTFE Polymers 0.000 description 1
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- 101000605068 Lactococcus lactis subsp. cremoris Bacteriocin lactococcin-B Proteins 0.000 description 1
- 239000004976 Lyotropic liquid crystal Substances 0.000 description 1
- 241001082241 Lythrum hyssopifolia Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical class NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 229920008285 Poly(ether ketone) PEK Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 229920006172 Tetrafluoroethylene propylene Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000004442 acylamino group Chemical group 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000005161 aryl oxy carbonyl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- UQSQSQZYBQSBJZ-UHFFFAOYSA-N fluorosulfonic acid Chemical compound OS(F)(=O)=O UQSQSQZYBQSBJZ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000005067 haloformyl group Chemical group 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical group I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000002828 nitro derivatives Chemical class 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical group C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 239000010702 perfluoropolyether Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical group O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 125000005936 piperidyl group Chemical group 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920002852 poly(2,6-dimethyl-1,4-phenylene oxide) polymer Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- SPVXKVOXSXTJOY-UHFFFAOYSA-O selenonium Chemical group [SeH3+] SPVXKVOXSXTJOY-UHFFFAOYSA-O 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- IAHFWCOBPZCAEA-UHFFFAOYSA-N succinonitrile Chemical compound N#CCCC#N IAHFWCOBPZCAEA-UHFFFAOYSA-N 0.000 description 1
- 125000000626 sulfinic acid group Chemical group 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical group S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000004736 wide-angle X-ray diffraction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/12—Polyester-amides
Definitions
- the present disclosure relates to liquid crystal polymer films, polymer films, and laminates.
- Japanese Patent Laid-Open No. 2020-26474 discloses a liquid crystal polyester film containing at least a liquid crystal polyester, wherein the first degree of orientation is a third parallel to the main surface of the liquid crystal polyester film.
- the degree of orientation in one direction is defined as the degree of orientation in a second direction
- the degree of orientation in a second direction parallel to the main surface and perpendicular to the first direction is defined as the degree of orientation in the second direction
- the first degree of orientation and the The first orientation degree/second orientation degree which is the ratio to the second orientation degree, is 0.95 or more and 1.04 or less, and is measured by a wide-angle X-ray scattering method in a direction parallel to the main surface.
- a liquid crystalline polyester film is described in which the degree of third orientation of the liquid crystalline polyester is 60.0% or more.
- plasma treatment see, for example, Japanese Unexamined Patent Application Publication No. 2001-049002
- UV treatment see, for example, Japanese Unexamined Patent Application Publication No. 2000-233448
- a method of surface treatment has also been proposed.
- a liquid crystal polymer film is provided that has excellent adhesion to a layer formed on the liquid crystal polymer film.
- a laminate using the liquid crystal polymer film is provided.
- a polymer film is provided that has excellent adhesion to a layer formed on the polymer film.
- Means for solving the above problems include the following aspects.
- ⁇ 4> The liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 3>, wherein layer A is an adhesive layer containing an adhesive.
- the adhesive contains a compound having a functional group, and the functional group is selected from the group consisting of a group capable of covalent bonding, a group capable of ion bonding, a group capable of hydrogen bonding, and a group capable of dipole interaction.
- the liquid crystal polymer film according to ⁇ 4> which is at least one selected group.
- ⁇ 6> The liquid crystal polymer film according to ⁇ 5>, wherein the functional group is a group capable of covalent bonding.
- Groups capable of covalent bonding include epoxy groups, oxetanyl groups, isocyanate groups, acid anhydride groups, carbodiimide groups, N-hydroxyester groups, glyoxal groups, imidoester groups, halogenated alkyl groups, and thiol groups.
- the liquid crystal polymer film according to ⁇ 6> which is at least one group selected from the group consisting of: ⁇ 8>
- the liquid crystal polymer has at least one structure selected from the group consisting of a structural unit derived from an aromatic hydroxycarboxylic acid, a structural unit derived from an aromatic diol, and a structural unit derived from an aromatic dicarboxylic acid.
- ⁇ 12> The liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 11>, wherein the liquid crystal polymer contains an aromatic polyesteramide.
- ⁇ 13> A laminate comprising the liquid crystal polymer film according to any one of ⁇ 1> to ⁇ 12> and a metal layer or metal wiring disposed on at least one surface of the liquid crystal polymer film.
- the metal layer or the metal wiring has a group capable of interacting with the liquid crystal polymer film on the side in contact with the liquid crystal polymer film.
- the group capable of interacting with the liquid crystal polymer film is an amino group.
- ⁇ 16> The laminate according to any one of ⁇ 13> to ⁇ 15>, wherein the peel strength between the liquid crystal polymer film and the metal layer is 0.5 kN/m or more.
- ⁇ 17> Selected from the group consisting of a fluorine-based polymer, a polymer containing structural units derived from a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, and an aromatic polyether ketone and a layer A disposed on at least one surface of the polymer layer, including a polymer and a material constituting layer A between the polymer layer and layer A A polymer film in which a mixed region is formed.
- liquid crystal polymer film having excellent adhesion to a layer formed on the liquid crystal polymer film it is possible to provide a laminate using the liquid crystal polymer film. Furthermore, according to another embodiment of the present invention, a polymer film having excellent adhesion to a layer formed on the polymer film is provided.
- the term "to" indicating a numerical range is used to include the numerical values before and after it as lower and upper limits.
- the upper limit or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described step by step.
- the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples.
- alkyl group includes not only alkyl groups having no substituents (unsubstituted alkyl groups) but also alkyl groups having substituents (substituted alkyl groups).
- (meth)acrylic is a term used as a concept that includes both acrylic and methacrylic
- (meth)acryloyl is a term that is used as a concept that includes both acryloyl and methacryloyl. is.
- step in this specification is not only an independent step, but even if it cannot be clearly distinguished from other steps, if the intended purpose of the step is achieved included.
- % by mass and % by weight are synonymous, and “parts by mass” and “parts by weight” are synonymous.
- a combination of two or more preferred aspects is a more preferred aspect.
- the weight average molecular weight (Mw) and number average molecular weight (Mn) in the present disclosure use columns of TSKgel GMHxL, TSKgel G4000HxL, and TSKgel G2000HxL (all trade names manufactured by Tosoh Corporation).
- a liquid crystal polymer film according to the present disclosure includes a liquid crystal polymer layer containing a liquid crystal polymer, and a layer A disposed on at least one side of the liquid crystal polymer layer, wherein between the liquid crystal polymer layer and the layer A, a liquid crystal polymer, and the material constituting layer A is formed.
- the present inventors have found that conventional liquid crystal polymer films do not have sufficient adhesion to a layer formed on the liquid crystal polymer film. As a result of intensive studies by the present inventors, the present inventors have found that by adopting the above configuration, it is possible to provide a liquid crystal polymer film having excellent adhesion to a layer formed on the liquid crystal polymer film.
- the liquid crystal polymer film according to the present disclosure in particular, since the mixed region containing the liquid crystal polymer and the material constituting the layer A is formed, delamination between the liquid crystal polymer layer and the layer A is suppressed, and the liquid crystal polymer layer and the layer Adhesion with A is improved.
- the layer A is formed on the liquid crystal polymer film with at least one group selected from the group consisting of a covalent bond, an ionic bond, a hydrogen bond, and a group capable of dipole interaction with the surface of the layer formed on the liquid crystal polymer film.
- a compound having a certain functional group is contained as an adhesive, the adhesion between layer A and the layer formed on the liquid crystal polymer film is improved, so that the liquid crystal polymer film as a whole is formed on the liquid crystal polymer film. It is estimated that it has excellent adhesion to the layer.
- liquid crystal polymer layer comprises liquid crystal polymer.
- liquid crystal polymer is not particularly limited, and known liquid crystal polymers can be used.
- the liquid crystal polymer may be a thermotropic liquid crystal polymer that exhibits liquid crystallinity in a molten state, or a lyotropic liquid crystal polymer that exhibits liquid crystallinity in a solution state.
- the liquid crystal polymer preferably melts at a temperature of 450° C. or less.
- liquid crystalline polymers examples include liquid crystalline polyesters, liquid crystalline polyester amides in which amide bonds are introduced into liquid crystalline polyesters, liquid crystalline polyester ethers in which ether bonds are introduced into liquid crystalline polyesters, and liquid crystalline polyester carbonates in which carbonate bonds are introduced into liquid crystalline polyesters.
- the liquid crystal polymer is preferably a polymer having an aromatic ring, more preferably an aromatic polyester or an aromatic polyesteramide, and an aromatic polyesteramide. is more preferred.
- the liquid crystal polymer may be a polymer obtained by introducing an isocyanate-derived bond such as an imide bond, a carbodiimide bond, or an isocyanurate bond into an aromatic polyester or an aromatic polyesteramide. Further, the liquid crystal polymer is preferably a wholly aromatic liquid crystal polymer using only aromatic compounds as raw material monomers.
- liquid crystal polymers include, for example: 1) (i) an aromatic hydroxycarboxylic acid, (ii) an aromatic dicarboxylic acid, and (iii) at least one compound selected from the group consisting of an aromatic diol, an aromatic hydroxylamine and an aromatic diamine; A product obtained by polycondensation. 2) Those obtained by polycondensing a plurality of types of aromatic hydroxycarboxylic acids. 3) Polycondensation of (i) an aromatic dicarboxylic acid and (ii) at least one compound selected from the group consisting of aromatic diols, aromatic hydroxylamines and aromatic diamines.
- Examples of polymerizable derivatives of compounds having a carboxy group such as aromatic hydroxycarboxylic acids and aromatic dicarboxylic acids include those obtained by converting the carboxy group to an alkoxycarbonyl group or an aryloxycarbonyl group (ester), carboxy Examples thereof include those obtained by converting a group to a haloformyl group (acid halides) and those obtained by converting a carboxy group to an acyloxycarbonyl group (acid anhydrides).
- Examples of polymerizable derivatives of compounds having a hydroxy group such as aromatic hydroxycarboxylic acids, aromatic diols and aromatic hydroxyamines include those obtained by acylating the hydroxy group to convert it to an acyloxy group (acylated product). is mentioned.
- Examples of polymerizable derivatives of compounds having an amino group such as aromatic hydroxylamines and aromatic diamines include those obtained by acylating the amino group to convert it to an acylamino group (acylated product).
- the liquid crystal polymer preferably contains a structural unit derived from an aromatic hydroxycarboxylic acid.
- the liquid crystal polymer includes structural units derived from aromatic hydroxycarboxylic acids, structural units derived from aromatic diols, and aromatic It preferably contains at least one structural unit selected from the group consisting of structural units derived from dicarboxylic acids.
- the liquid crystal polymer is a structural unit represented by any one of the following formulas (1) to (3) (hereinafter, the structural unit represented by formula (1) may be referred to as unit (1), etc.) and more preferably have a structural unit represented by the following formula (1), a structural unit represented by the following formula (1), and a structural unit represented by the following formula (2), It is particularly preferable to have a structural unit represented by the following formula (2).
- Ar 1 represents a phenylene group, naphthylene group or biphenylylene group
- Ar 2 and Ar 3 each independently represent a phenylene group, naphthylene group, biphenylylene group or the following formula (4) represents a group represented by and each hydrogen atom in the above groups represented by Ar 1 to Ar 3 may be independently substituted with a halogen atom, an alkyl group or an aryl group.
- Ar 4 and Ar 5 each independently represent a phenylene group or a naphthylene group, and Z represents an oxygen atom, a sulfur atom, a carbonyl group, a sulfonyl group, or an alkylene group.
- the halogen atoms include fluorine, chlorine, bromine and iodine atoms.
- alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, s-butyl group, t-butyl group, n-hexyl group, 2-ethylhexyl group, n-octyl group and n-decyl group, preferably having 1 to 10 carbon atoms.
- aryl group examples include phenyl group, o-tolyl group, m-tolyl group, p-tolyl group, 1-naphthyl group and 2-naphthyl group, preferably having 6 to 20 carbon atoms. be.
- the number thereof is preferably 2 or less, more preferably 1, independently for each of the above groups represented by Ar 1 , Ar 2 or Ar 3 . is one.
- alkylene group examples include methylene group, 1,1-ethanediyl group, 1-methyl-1,1-ethanediyl group, 1,1-butanediyl group and 2-ethyl-1,1-hexanediyl group. , preferably has 1 to 10 carbon atoms.
- Unit (1) is a structural unit derived from a predetermined aromatic hydroxycarboxylic acid.
- Unit (1) includes a structural unit in which Ar 1 is a p-phenylene group (a structural unit derived from p-hydroxybenzoic acid) and a structural unit in which Ar 1 is a 2,6-naphthylene group (6-hydroxy-2 -a structural unit derived from naphthoic acid), or a structural unit in which Ar 1 is a 4,4'-biphenylylene group (a structural unit derived from 4'-hydroxy-4-biphenylcarboxylic acid), and Ar 1 is p
- a structural unit that is a -phenylene group or a 2,6-naphthylene group is more preferable.
- Unit (2) is a structural unit derived from a predetermined aromatic dicarboxylic acid.
- Unit (2) includes a structural unit in which Ar 2 is a p-phenylene group (structural unit derived from terephthalic acid), a structural unit in which Ar 2 is an m-phenylene group (structural unit derived from isophthalic acid), Ar 2 is a 2,6-naphthylene group (a structural unit derived from 2,6-naphthalenedicarboxylic acid), or a structural unit in which Ar 2 is a diphenyl ether-4,4'-diyl group (diphenyl ether-4, 4′-dicarboxylic acid) is preferable, and a structural unit in which Ar 2 is a p-phenylene group or a 2,6-naphthylene group is more preferable.
- Unit (3) is a structural unit derived from a predetermined aromatic diol.
- the unit (3) includes a structural unit in which Ar 3 is a p-phenylene group (a structural unit derived from hydroquinone), a structural unit in which Ar 3 is a m-phenylene group (a structural unit derived from isophthalic acid), or Structural units in which Ar 3 is a 4,4'-biphenylylene group (structural units derived from 4,4'-dihydroxybiphenyl) are preferred.
- the liquid crystal polymer preferably contains at least one selected from the group consisting of structural units derived from p-hydroxybenzoic acid and structural units derived from 6-hydroxy-2-naphthoic acid. Further, the liquid crystal polymer consists of a structural unit derived from 6-hydroxy-2-naphthoic acid, a structural unit derived from an aromatic diol compound, a structural unit derived from terephthalic acid, and a structural unit derived from naphthalenedicarboxylic acid. It preferably contains at least one selected from the group.
- the content of structural units derived from aromatic hydroxycarboxylic acid is the total amount of all structural units (by dividing the mass of each structural unit constituting the liquid crystal polymer by the formula weight of each structural unit, the substance of each structural unit It is preferably 30 mol% or more, more preferably 30 mol% to 80 mol%, still more preferably 30 mol% to 60 mol%, and particularly preferably is 30 mol % to 40 mol %.
- the content of structural units derived from an aromatic dicarboxylic acid is preferably 35 mol% or less, more preferably 10 mol% to 35 mol%, still more preferably 20 mol% to 35%, based on the total amount of all structural units.
- the content of structural units derived from an aromatic diol is preferably 35 mol% or less, more preferably 10 mol% to 35 mol%, still more preferably 20 mol% to 35 mol%, based on the total amount of all structural units. %, particularly preferably 30 mol % to 35 mol %.
- Heat resistance, strength and rigidity tend to improve as the content of structural units derived from aromatic hydroxycarboxylic acid increases, but if the content is too high, the solubility in solvents tends to decrease.
- the ratio of the content of structural units derived from aromatic dicarboxylic acids to the content of structural units derived from aromatic diols is [content of structural units derived from aromatic dicarboxylic acids]/[derived from aromatic diols
- the content of the structural unit to form] (mol/mol), preferably 0.9/1 to 1/0.9, more preferably 0.95/1 to 1/0.95, still more preferably 0.95/1 to 1/0.95. 98/1 to 1/0.98.
- the liquid crystal polymer may independently have two or more types of structural units derived from an aromatic hydroxycarboxylic acid, structural units derived from an aromatic dicarboxylic acid, and structural units derived from an aromatic diol.
- the liquid crystal polymer may have structural units other than the above structural units, but the content thereof is preferably 10 mol% or less, more preferably 5 mol% or less, relative to the total amount of all structural units. is.
- the liquid crystal polymer is preferably produced by melt-polymerizing raw material monomers corresponding to the structural units that constitute the liquid crystal polymer.
- the melt polymerization may be carried out in the presence of a catalyst, examples of which include metal compounds such as magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, antimony trioxide, Nitrogen-containing heterocyclic compounds such as 4-(dimethylamino)pyridine and 1-methylimidazole are included, and nitrogen-containing heterocyclic compounds are preferably used.
- the melt polymerization may be further subjected to solid phase polymerization, if necessary.
- the liquid crystal polymer is preferably a liquid crystal polymer soluble in a specific organic solvent (hereinafter also referred to as "soluble liquid crystal polymer").
- the soluble liquid crystalline polymer in the present disclosure can be made from N-methyl-2-pyrrolidone, N,N-dimethylacetamide, ⁇ -butyrolactone, dimethylformamide, ethylene glycol monobutyl ether and ethylene glycol monoethyl ether at 25°C. It is preferably a liquid crystal polymer that dissolves in 100 g of at least one solvent selected from the group consisting of 0.1 g or more.
- the liquid crystal polymer is preferably a liquid crystal polymer that exhibits liquid crystallinity in a molten state. From the viewpoint of dielectric loss tangent and breaking strength, the liquid crystal polymer preferably has a melting point Tm of 280° C. or higher, more preferably 300° C. or higher, further preferably 315° C. or higher, and 330° C. or higher. 400° C. is particularly preferred.
- the melting point Tm also called flow temperature or flow temperature
- the melting point Tm is obtained by melting a liquid crystal polymer while increasing the temperature at a rate of 4°C/min under a load of 9.8 MPa (100 kg/cm 2 ) using a capillary rheometer.
- the temperature at which a viscosity of 4,800 Pa s (48,000 poise) is exhibited when extruded from a nozzle with an inner diameter of 1 mm and a length of 10 mm and serves as a measure of the molecular weight of a liquid crystal polymer (Edited by Naoyuki Koide, "Liquid Crystal Polymer -Synthesis/Molding/Application-", CMC Co., Ltd., June 5, 1987, p.95).
- the liquid crystal polymer preferably has a weight average molecular weight of 13,000 or less, more preferably 3,000 to 13,000, even more preferably 5,000 to 12,000, and 5,000 to 10 ,000 is particularly preferred.
- the heat-treated film is excellent in thermal conductivity, heat resistance, strength and rigidity in the thickness direction.
- the liquid crystal polymer preferably has a dielectric loss tangent of 0.005 or less, more preferably 0.004 or less, and 0.0035 or less from the viewpoint of the dielectric loss tangent of the liquid crystal polymer film and the adhesion to metals. More preferably, more than 0 and 0.003 or less is particularly preferable.
- the liquid crystal polymer film may contain only one type of liquid crystal polymer, or may contain two or more types.
- the content of the liquid crystal polymer in the liquid crystal polymer layer is preferably 50% by mass or more, preferably 70% by mass, based on the total mass of the liquid crystal polymer film, from the viewpoint of the dielectric loss tangent of the liquid crystal polymer film and adhesion to metal. % or more, and even more preferably 90 mass % or more.
- the upper limit of the content of the liquid crystal polymer is not particularly limited, and may be 100% by mass. That is, the liquid crystal polymer layer may be a layer made of liquid crystal polymer.
- the liquid crystal polymer layer may contain additives other than the liquid crystal polymer.
- additives known additives can be used. Specific examples include leveling agents, antifoaming agents, antioxidants, ultraviolet absorbers, flame retardants, coloring agents, fillers, and the like.
- liquid crystal polymer layer may contain other resins other than the liquid crystal polymer as other additives.
- thermoplastic resins such as polypropylene, polyamide, polyester, polyphenylene sulfide, polyetherketone, polycarbonate, polyethersulfone, polyphenylene ether and its modified products, and polyetherimide
- Elastomers such as polymers
- thermosetting resins such as phenol resins, epoxy resins, polyimide resins, and cyanate resins.
- the total content of other additives in the liquid crystal polymer layer is preferably 25 parts by mass or less, more preferably 10 parts by mass or less, and still more preferably 5 parts by mass with respect to 100 parts by mass of the liquid crystal polymer content. It is below the department.
- the liquid crystal polymer layer may be free of other additives.
- the average thickness of the liquid crystal polymer layer is not particularly limited, but is preferably 5 ⁇ m to 90 ⁇ m, more preferably 10 ⁇ m to 70 ⁇ m, from the viewpoint of the dielectric loss tangent of the liquid crystal polymer film and adhesion to metal. , between 10 ⁇ m and 50 ⁇ m.
- a method for measuring the average thickness of each layer in the liquid crystal polymer film according to the present disclosure is as follows.
- the liquid crystal polymer film is cut along a plane perpendicular to the surface direction of the liquid crystal polymer film, the thickness is measured at 5 or more points in the cross section, and the average value thereof is taken as the average thickness.
- a liquid crystal polymer film according to the present disclosure includes a layer A disposed on at least one side of the liquid crystal polymer layer.
- Layer A may be placed on only one side of the liquid crystal polymer layer, or may be placed on both sides of the liquid crystal polymer layer.
- the material constituting layer A is not particularly limited, and may be either an organic substance or an inorganic substance, or a combination of an organic substance and an inorganic substance.
- Layer A is preferably an adhesive layer containing an adhesive from the viewpoint of adhesion to metal.
- thermosetting resin is preferably used as the adhesive.
- thermosetting resins include epoxy resins, phenol resins, unsaturated imide resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, allyl resins, dicyclopentadiene resins, silicone resins. resins, triazine resins, melamine resins, and the like.
- the thermosetting resin is not particularly limited to these, and known thermosetting resins can be used. These thermosetting resins can be used alone or in combination of multiple types.
- a commercially available thermosetting resin-containing adhesive can also be used.
- the adhesive preferably contains a compound having a functional group.
- the functional group is at least one group selected from the group consisting of a group capable of covalent bonding, a group capable of ion bonding, a group capable of hydrogen bonding, and a group capable of dipole interaction. preferable.
- the number of functional groups in the compound having a functional group may be 1 or more, and may be 2 or more.
- the compound having a functional group may have only one type of functional group, or may have two or more types of functional groups.
- a compound having a functional group may be a low-molecular-weight compound or a high-molecular-weight compound. From the viewpoint of adhesion to metals, the compound having a functional group is preferably a polymer compound.
- the compound having a functional group is preferably a polymer having a weight average molecular weight of 1,000 or more, more preferably a polymer having a weight average molecular weight of 2,000 or more.
- a polymer having an average molecular weight of 3,000 or more is more preferable, and a polymer having a weight average molecular weight of 5,000 or more and 200,000 or less is particularly preferable.
- the functional group is preferably a group capable of covalent bonding. Moreover, from the viewpoint of storage stability and handleability, the functional group is preferably a group capable of ion bonding, a group capable of hydrogen bonding, or a group capable of dipole interaction.
- the group capable of covalent bonding is not particularly limited as long as it is a group capable of forming a covalent bond. groups, halogenated alkyl groups, thiol groups, hydroxy groups, carboxy groups, amino groups, amide groups, isocyanate groups, aldehyde groups, sulfonic acid groups and the like.
- the surface of the metal to be bonded has a group that forms a pair with the functional group of the compound having the functional group.
- a combination of covalently bondable groups a combination of a functional group of a compound having a functional group and a group possessed on the surface of a metal
- the other is hydroxy groups, amino groups, and the like.
- the other may be an amino group or the like.
- -Group capable of ion bonding- Groups capable of ion bonding include cationic groups and anionic groups.
- the cationic group is preferably an onium group.
- onium groups include ammonium groups, pyridinium groups, phosphonium groups, oxonium groups, sulfonium groups, selenonium groups, iodonium groups, and the like. Among them, from the viewpoint of adhesion to metals, an ammonium group, a pyridinium group, a phosphonium group, or a sulfonium group is preferred, an ammonium group or a phosphonium group is more preferred, and an ammonium group is particularly preferred.
- the anionic group is not particularly limited, and examples thereof include phenolic hydroxyl group, carboxy group, -SO 3 H, -OSO 3 H, -PO 3 H, -OPO 3 H 2 , -CONHSO 2 -, and -SO 2 NHSO. 2 - and the like.
- a phosphoric acid group, a phosphonic acid group, a phosphinic acid group, a sulfuric acid group, a sulfonic acid group, a sulfinic acid group or a carboxy group is preferable, and a phosphoric acid group or a carboxy group is more preferable.
- a carboxy group is more preferred.
- a combination of groups capable of ion bonding (a combination of a functional group of a compound having a functional group and a group possessed on the surface of a metal), specifically, for example, when one has an acidic group, the other has a base a sexual group.
- the acidic group include a carboxy group, a sulfo group, a phosphoric acid group and the like, and a carboxy group is preferred.
- examples of groups capable of ionically bonding with the carboxy group include a tertiary amino group, a pyridyl group, and a piperidyl group.
- a group capable of hydrogen bonding includes a group having a hydrogen bond donating site and a group having a hydrogen bond accepting site.
- the hydrogen bond donating site may have any structure as long as it has an active hydrogen atom capable of hydrogen bonding, but preferably has a structure represented by XH.
- X represents a heteroatom, preferably a nitrogen atom or an oxygen atom.
- the hydrogen bond donating site includes a hydroxy group, a carboxy group, a primary amide group, a secondary amide group, a primary amino group, a secondary amino group, a primary A sulfonamide group, a secondary sulfonamide group, an imide group, a urea bond, and preferably at least one structure selected from the group consisting of a urethane bond, a hydroxy group, a carboxyl group, and a primary amide group.
- secondary amide group, primary sulfonamide group, secondary sulfonamide group, maleimide group, urea bond and more preferably at least one structure selected from the group consisting of urethane bond, At least one structure selected from the group consisting of a hydroxy group, a carboxyl group, a primary amide group, a secondary amide group, a primary sulfonamide group, a secondary sulfonamide group, and a maleimide group. is more preferred, and at least one structure selected from the group consisting of a hydroxy group and a secondary amide group is particularly preferred.
- the hydrogen bond-accepting site preferably has a structure containing an atom having a lone pair of electrons, more preferably a structure containing an oxygen atom having a lone pair of electrons, a carbonyl group (carboxy group, amide group , an imide group, a urea bond, a carbonyl structure such as a urethane bond.), and a sulfonyl group (including a sulfonyl structure such as a sulfonamide group.) At least one structure selected from the group consisting of A carbonyl group (including carbonyl structures such as a carboxy group, an amide group, an imide group, a urea bond, and a urethane bond) is particularly preferred.
- the group capable of hydrogen bonding is preferably a group having both the hydrogen bond donating site and the hydrogen bond accepting site, and is a carboxy group, an amide group, an imide group, a urea bond, a urethane bond, or a sulfonamide group. and more preferably a carboxy group, an amide group, an imide group, or a sulfonamide group.
- a combination of groups capable of hydrogen bonding (a combination of a functional group of a compound having a functional group and a group possessed on the surface of a metal), specifically, when one of them has a group having a hydrogen bond donating site,
- the other includes groups having hydrogen bond accepting sites.
- groups having hydrogen bond accepting sites for example, when one of is a carboxy group, an amide group, a carboxy group, and the like can be mentioned.
- one is, for example, a phenolic hydroxyl group
- the other may be a phenolic hydroxyl group.
- the group capable of dipole interaction has a polarized structure other than the structure represented by XH (X represents a heteroatom and is a nitrogen atom or an oxygen atom) in the above hydrogen bondable group. Any group may be used, and a group in which atoms having different electronegativities are bonded is preferably exemplified.
- the combination of atoms with different electronegativities is preferably a combination of at least one atom selected from the group consisting of an oxygen atom, a nitrogen atom, a sulfur atom, and a halogen atom and a carbon atom.
- a combination of at least one atom selected from the group consisting of sulfur atoms and a carbon atom is more preferred.
- a combination of groups capable of dipole interaction a combination of a functional group of a compound having a functional group and a group possessed on the surface of a metal
- a combination of the same groups capable of dipole interaction is preferred.
- one is, for example, a cyano group the other is a cyano group.
- one is, for example, a sulfonic acid amide group the other may be a sulfonic acid amide group.
- the compound having a functional group is preferably a polyfunctional epoxy compound or a polyfunctional epoxy compound polymer, and is preferably a bifunctional epoxy compound or a bifunctional epoxy compound polymer. and particularly preferably a polymer of a bifunctional epoxy compound.
- the adhesive layer may contain only one type of adhesive, or may contain two or more types.
- the content of the adhesive in the adhesive layer is preferably 50% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass, based on the total mass of the liquid crystal polymer film, from the viewpoint of adhesion to metals. % by mass or more is more preferable.
- the upper limit of the adhesive content is not particularly limited, and may be 100% by mass. That is, the adhesive layer may be a layer made of an adhesive.
- the adhesive layer may contain additives other than the adhesive.
- additives known additives can be used. Specific examples include leveling agents, antifoaming agents, antioxidants, ultraviolet absorbers, flame retardants, coloring agents, fillers, and the like.
- the average thickness of layer A is not particularly limited, but from the viewpoint of adhesion to metal, it is preferably 5 ⁇ m to 90 ⁇ m, more preferably 10 ⁇ m to 70 ⁇ m, and particularly preferably 15 ⁇ m to 30 ⁇ m. .
- ⁇ Mixed area> In the liquid crystal polymer film according to the present disclosure, a mixed region containing the liquid crystal polymer and the material constituting the layer A is formed between the liquid crystal polymer layer and the layer A.
- the liquid crystal polymer film according to the present disclosure has excellent adhesion to the layer formed on the liquid crystal polymer film.
- Whether or not a mixed region is formed in the liquid crystal polymer film can be confirmed by the following method.
- the liquid crystal polymer film is cut in an oblique direction, and the resulting cross-sectional sample is evaluated using TOF-SIMS (time-of-flight secondary ion mass spectrometry), and a fragment derived from the liquid crystal polymer layer and a fragment derived from layer A. are observed at the same time as the mixed region. In addition, the existence of the fragment is determined at the detection limit or higher.
- TOF-SIMS time-of-flight secondary ion mass spectrometry
- the average thickness of the mixed region is preferably 1 nm to 10 ⁇ m, more preferably 100 nm to 5 ⁇ m, even more preferably 300 nm to 2 ⁇ m, from the viewpoint of adhesion to metal.
- the average thickness of the liquid crystal polymer film according to the present disclosure is preferably 6 ⁇ m to 200 ⁇ m, more preferably 12 ⁇ m to 100 ⁇ m, from the viewpoint of strength, dielectric loss tangent of the polymer film, and adhesion to metal. 20 ⁇ m to 60 ⁇ m is particularly preferred.
- the average thickness of the liquid crystal polymer film is measured at any five points using an adhesive film thickness gauge, for example, an electronic micrometer (product name "KG3001A", manufactured by Anritsu), and the average value thereof is taken.
- an adhesive film thickness gauge for example, an electronic micrometer (product name "KG3001A”, manufactured by Anritsu), and the average value thereof is taken.
- the dielectric loss tangent of the liquid crystal polymer film according to the present disclosure is preferably 0.005 or less, more preferably more than 0 and 0.003 or less.
- the method for producing the liquid crystal polymer film according to the present disclosure is not particularly limited, and known methods can be referred to.
- the method for producing a liquid crystal polymer film according to the present disclosure includes, for example, a step of forming a liquid crystal polymer-containing material into a film (hereinafter also referred to as a film forming step), and a material that constitutes the layer A on the formed film.
- a mixed region containing the liquid crystal polymer and the material constituting the layer A is formed between the liquid crystal polymer layer and the layer A.
- a formed liquid crystal polymer film can be obtained.
- a film-forming method in the film-forming process for example, a casting method, a coating method, an extrusion method, and the like are preferably used.
- the film-forming method is preferably a casting method.
- solvents include halogenated hydrocarbons such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,2,2-tetrachloroethane, 1-chlorobutane, chlorobenzene and o-dichlorobenzene; Halogenated phenols such as p-chlorophenol, pentachlorophenol, pentafluorophenol; ethers such as diethyl ether, tetrahydrofuran, 1,4-dioxane; ketones such as acetone and cyclohexanone; esters such as ethyl acetate and ⁇ -butyrolactone; Carbonates such as carbonate and propylene carbonate; Amines such as triethylamine; Nitrogen-containing heterocyclic aromatic compounds such as pyridine; Nitriles such as acetonitrile and succinonitrile; N,N-dimethylformamide, N,N-d
- a solvent mainly composed of an aprotic compound particularly an aprotic compound having no halogen atom, because of its low corrosiveness and ease of handling. It is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass.
- amides such as N,N-dimethylformamide, N,N-dimethylacetamide, tetramethylurea, N-methylpyrrolidone, etc., or ⁇ -butyrolactone, etc., can be used because they easily dissolve the liquid crystal polymer.
- Esters are preferably used, more preferably N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.
- the solvent it is preferable to use a solvent mainly composed of a compound having a boiling point of 220° C. or lower at 1 atm because it is easy to remove. is preferably 50% to 100% by mass, more preferably 70% to 100% by mass, and particularly preferably 90% to 100% by mass.
- the aprotic compound it is preferable to use a compound having a boiling point of 220° C. or lower at 1 atm.
- a support may be used when the film is formed by the casting method, the coating method, the extrusion method, or the like.
- a metal layer (metal foil) or the like used in a laminate to be described later it may be used as it is without being peeled off.
- the support include glass plates, resin films, and metal foils. Among them, a resin film is preferable, and a polyimide (PI) film is particularly preferable because of its excellent heat resistance, easy application of the composition, and easy peeling from the liquid crystal polymer.
- the support preferably has a surface treatment layer formed on its surface so that it can be easily peeled off.
- the surface treatment layer preferably contains a fluororesin.
- the average thickness of the support is not particularly limited, but is preferably 25 ⁇ m or more and 75 ⁇ m or less, more preferably 50 ⁇ m or more and 75 ⁇ m.
- the method for removing at least part of the solvent from the cast or applied film composition is not particularly limited, and a known drying method can be used.
- the coating process, stretching process, and annealing process are not particularly limited, and generally known methods can be used.
- Liquid crystal polymer films according to the present disclosure can be used in a variety of applications. Among others, it can be suitably used for films for electronic parts such as printed wiring boards, and more suitably for flexible printed circuit boards. Further, the liquid crystal polymer film according to the present disclosure can be suitably used as a liquid crystal polymer film for metal adhesion.
- the laminate according to the present disclosure may be a laminate including the liquid crystal polymer film according to the present disclosure.
- the liquid crystal polymer film according to the present disclosure has excellent adhesion to layers formed on the liquid crystal polymer film. Therefore, the laminate according to the present disclosure preferably has the liquid crystal polymer film according to the present disclosure and a layer arranged on at least one surface of the liquid crystal polymer film.
- the layer arranged on at least one side of the liquid crystal polymer film is not particularly limited, and examples thereof include a polymer layer and a metal layer.
- the layer arranged on at least one surface of the liquid crystal polymer film may be a coating layer.
- the layer arranged on at least one surface of the liquid crystal polymer film may be arranged on the entire surface of the liquid crystal polymer film, or may be arranged only on a part of the liquid crystal polymer film.
- the laminate according to the present disclosure preferably has the liquid crystal polymer film according to the present disclosure and a metal layer or metal wiring arranged on at least one surface of the liquid crystal polymer film.
- the metal layer or metal wiring is preferably arranged on the layer A (for example, adhesive layer) side of the liquid crystal polymer film.
- the metal layer or metal wiring may be a known metal layer or metal wiring, but is preferably a copper layer or copper wiring, for example.
- the method for attaching the liquid crystal polymer film and the metal layer according to the present disclosure is not particularly limited, and a known lamination method can be used.
- the peel strength between the liquid crystal polymer film and the metal layer shall be measured by the following method.
- a 1.0 cm wide peeling test piece was prepared from the laminate of the liquid crystal polymer film and the metal layer, the polymer film was fixed to a flat plate with double-sided adhesive tape, and the 180 ° method was performed according to JIS C 5016 (1994).
- the strength (kN/m) is measured when the polymer film is peeled from the metal layer at a speed of 50 mm/min.
- the metal layer is preferably a copper layer.
- the copper layer is preferably a rolled copper foil formed by a rolling method or an electrolytic copper foil formed by an electrolytic method, and more preferably a rolled copper foil from the viewpoint of bending resistance.
- the metal layer or metal wiring preferably has a group capable of interacting with the liquid crystal polymer film on the side that contacts the liquid crystal polymer film.
- the adhesive contains a compound having a functional group
- the interactive group is, for example, an amino group and an epoxy group, or a hydroxy group and an epoxy group. Groups corresponding to functional groups are preferred.
- Examples of groups capable of interacting include the groups exemplified as functional groups in the compounds having the above functional groups.
- the interactable group is preferably a group capable of covalent bonding, more preferably an amino group or a hydroxy group, and an amino group. is particularly preferred.
- etching it is also preferable to process the metal layer in the laminate according to the present disclosure into a desired circuit pattern by, for example, etching to form a flexible printed circuit board.
- the etching method is not particularly limited, and known etching methods can be used.
- the polymer film according to the present disclosure includes a fluorine-based polymer, a polymer containing structural units derived from a compound having a cycloaliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, and an aromatic polyether ketone. a polymer layer containing at least one polymer selected from the group consisting of; a layer A disposed on at least one surface of the polymer layer; A mixed region with constituent materials is formed
- the polymer layer includes a fluorine-based polymer, a polymer containing structural units derived from a compound having a cycloaliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether and an aromatic It contains at least one polymer selected from the group consisting of polyetherketones.
- Fluorinated polymer examples include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, perfluoroalkoxy fluororesin, ethylene tetrafluoride/propylene hexafluoride copolymer, ethylene/tetrafluoride Examples include ethylene copolymers, ethylene/chlorotrifluoroethylene copolymers, and the like. Among them, polytetrafluoroethylene is preferred.
- Fluoropolymers also include fluorinated ⁇ -olefin monomers, i.e. ⁇ -olefin monomers containing at least one fluorine atom, and optionally non-fluorinated ethylene reactive with the fluorinated ⁇ -olefin monomers. Homopolymers and copolymers containing constitutional units derived from polyunsaturated monomers are included.
- vinyl ether eg, perfluoromethyl vinyl ether, perfluoropropyl vinyl ether, perfluorooctyl vinyl ether
- fluorine-based polymers include polychlorotrifluoroethylene (PCTFE), poly(chlorotrifluoroethylene-propylene), poly(ethylene-tetrafluoroethylene) (ETFE), poly(ethylene-chlorotrifluoroethylene) (ECTFE), Poly(hexafluoropropylene), poly(tetrafluoroethylene) (PTFE), poly(tetrafluoroethylene-ethylene-propylene), poly(tetrafluoroethylene-hexafluoropropylene) (FEP), poly(tetrafluoroethylene-propylene) (FEPM), poly(tetrafluoroethylene-perfluoropropylene vinyl ether), poly(tetrafluoroethylene-perfluoroalkyl vinyl ether) (PFA) (e.g.
- the fluorine-based polymer may be used singly or in combination of two or more.
- the fluoropolymer is preferably at least one of FEP, PFA, ETFE, or PTFE.
- FEP is available from DuPont under the trade name TEFLON FEP or from Daikin Industries, Ltd. under the trade name NEOFLON FEP;
- PFA is the trade name of NEOFLON PFA from Daikin Industries, Ltd., the trade name of Teflon (registered trademark) PFA (TEFLON (registered trademark) PFA) from DuPont, or Solvay Solexis. Solexis) under the trade name of HYFLON PFA.
- the fluoropolymer preferably contains PTFE.
- the PTFE can comprise PTFE homopolymer, partially modified PTFE homopolymer, or a combination comprising either or both of these.
- the partially modified PTFE homopolymer preferably contains less than 1% by weight of units derived from comonomers other than tetrafluoroethylene, based on the total weight of the polymer.
- the fluoropolymer may be a crosslinkable fluoropolymer having crosslinkable groups.
- the crosslinkable fluoropolymer can be crosslinked by conventionally known crosslinking methods.
- One representative crosslinkable fluoropolymer is a fluoropolymer having (meth)acryloxy groups.
- R is a fluorine-based oligomer chain having two or more structural units derived from a fluorinated ⁇ -olefin monomer or a non-fluorinated monoethylenically unsaturated monomer
- R' is H or - CH 3 and n is 1-4.
- R may be a fluorine-based oligomer chain containing constitutional units derived from tetrafluoroethylene.
- Forming a crosslinked fluoropolymer network by exposing a fluoropolymer having (meth)acryloxy groups to a free radical source to initiate a radical crosslinking reaction through the (meth)acryloxy groups on the fluoropolymer.
- the free radical source is not particularly limited, but preferably includes a photoradical polymerization initiator or an organic peroxide. Suitable radical photoinitiators and organic peroxides are well known in the art.
- Crosslinkable fluoropolymers are commercially available, for example, Viton B manufactured by DuPont.
- thermoplastic resin having a structural unit formed from is exemplified, and is also called a thermoplastic cyclic olefin resin.
- a polymer containing a structural unit derived from a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond is a ring-opening polymer of the above cyclic olefin or a ring-opening using two or more cyclic olefins. It may be a hydrogenated copolymer, or an addition polymer of a cyclic olefin and a chain olefin or an aromatic compound having an ethylenically unsaturated bond such as a vinyl group.
- a polar group may be introduced into the polymer containing structural units derived from a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond.
- a polymer containing structural units derived from a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond may be used singly or in combination of two or more. .
- the ring structure of the cycloaliphatic hydrocarbon group may be a monocyclic ring, a condensed ring in which two or more rings are condensed, or a bridged ring.
- the ring structure of the cycloaliphatic hydrocarbon group includes a cyclopentane ring, cyclohexane ring, cyclooctane ring, isoboron ring, norbornane ring, dicyclopentane ring and the like.
- a compound having a cycloaliphatic hydrocarbon group and a group having an ethylenically unsaturated bond may be a monofunctional ethylenically unsaturated compound or a polyfunctional ethylenically unsaturated compound.
- the number of cycloaliphatic hydrocarbon groups in a compound having a cycloaliphatic hydrocarbon group and a group having an ethylenically unsaturated bond may be 1 or more, and may be 2 or more.
- a polymer containing structural units derived from a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond contains at least one cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond. It may be a polymer obtained by polymerizing a compound having two or more cycloaliphatic hydrocarbon groups and a group having an ethylenically unsaturated bond.
- It may be a polymer obtained by polymerizing a compound having However, it may be a copolymer with another ethylenically unsaturated compound having no cycloaliphatic hydrocarbon group. Moreover, the polymer containing structural units derived from a compound having a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond is preferably a cycloolefin polymer.
- the weight-average molecular weight (Mw) of the polyphenylene ether is preferably 500 to 5,000, preferably 500 to 3,000, from the viewpoint of heat resistance and film formation when thermosetting after film formation. Preferably. Also, when not thermally cured, it is not particularly limited, but it is preferably from 3,000 to 100,000, preferably from 5,000 to 50,000.
- the average number of phenolic hydroxyl groups at the ends of the molecules per molecule is preferably 1 to 5 from the viewpoint of dielectric loss tangent and heat resistance, and 1.5. It is more preferable that the number is from 1 to 3.
- the number of hydroxyl groups or phenolic hydroxyl groups of polyphenylene ether can be known, for example, from the standard values of polyphenylene ether products. Further, the number of terminal hydroxyl groups or the number of terminal phenolic hydroxyl groups includes, for example, a numerical value representing the average value of hydroxyl groups or phenolic hydroxyl groups per molecule of all polyphenylene ethers present in 1 mol of polyphenylene ether. One type of polyphenylene ether may be used alone, or two or more types may be used in combination.
- polyphenylene ether examples include polyphenylene ether composed of 2,6-dimethylphenol and at least one of difunctional phenol and trifunctional phenol, poly(2,6-dimethyl-1,4-phenylene oxide), and the like. and polyphenylene ether as main components. More specifically, for example, it is preferably a compound having a structure represented by formula (PPE).
- X represents an alkylene group having 1 to 3 carbon atoms or a single bond
- m represents an integer of 0 to 20
- n represents an integer of 0 to 20
- Sum represents an integer from 1-30.
- alkylene group for X include a dimethylmethylene group.
- Aromatic polyether ketone is not particularly limited, and known aromatic polyether ketones can be used.
- the aromatic polyetherketone is preferably polyetheretherketone.
- Polyether ether ketone is a type of aromatic polyether ketone, and is a polymer in which bonds are arranged in the order of ether bond, ether bond and carbonyl bond (ketone). Each bond is preferably connected by a divalent aromatic group.
- Aromatic polyether ketones may be used singly or in combination of two or more.
- aromatic polyether ketone examples include polyether ether ketone (PEEK) having a chemical structure represented by the following formula (P1) and polyether ketone (PEK) having a chemical structure represented by the following formula (P2). , a polyether ketone ketone (PEKK) having a chemical structure represented by the following formula (P3), a polyether ether ketone ketone (PEEKK) having a chemical structure represented by the following formula (P4), and the following formula (P5) Polyether ketone ether ketone ketone (PEKEKK) having the chemical structure depicted.
- n in each of formulas (P1) to (P5) is preferably 10 or more, more preferably 20 or more.
- n is preferably 5,000 or less, more preferably 1,000 or less, from the viewpoint of easy production of aromatic polyetherketone. That is, n is preferably 10 to 5,000, more preferably 20 to 1,000.
- a polymer film according to the present disclosure includes a layer A disposed on at least one side of the polymer layer.
- Layer A may be placed on only one side of the polymer layer or on both sides of the liquid crystal polymer layer.
- Preferred aspects of Layer A are the same as the preferred aspects of Layer A in the above liquid crystal polymer film.
- ⁇ Mixed area> In the polymer film according to the present disclosure, a mixed region containing the polymer and the material that constitutes Layer A is formed between the polymer layer and Layer A.
- the polymer film according to the present disclosure has excellent adhesion to the layer formed on the polymer film.
- Whether or not a mixed region is formed in the polymer film can be confirmed by the same method as for the mixed region in the liquid crystal polymer film.
- the average thickness of the mixed region is preferably 1 nm to 10 ⁇ m, more preferably 100 nm to 5 ⁇ m, even more preferably 300 nm to 2 ⁇ m, from the viewpoint of adhesion to metal.
- the average thickness of the polymer film according to the present disclosure is preferably 6 ⁇ m to 200 ⁇ m, more preferably 12 ⁇ m to 100 ⁇ m, from the viewpoint of strength, dielectric loss tangent of the polymer film, and adhesion to metal, and 20 ⁇ m. ⁇ 60 ⁇ m is particularly preferred.
- the dielectric loss tangent of the polymer film according to the present disclosure is preferably 0.005 or less, more preferably more than 0 and 0.003 or less.
- the polymer film according to the present disclosure can be a laminate, like the liquid crystal polymer film.
- LC-A liquid crystal polymer produced according to the following production method
- LC-B liquid crystal polymer produced according to the following production method
- the liquid crystalline polyester (B1) obtained above was heated from room temperature to 160° C. over 2 hours and 20 minutes in a nitrogen atmosphere, then from 160° C. to 180° C. over 3 hours and 20 minutes. The mixture was held for 5 hours for solid phase polymerization, cooled, and then pulverized with a pulverizer to obtain a powdery liquid crystalline polyester (B2).
- the flow initiation temperature of this liquid crystalline polyester (B2) was 220°C.
- the liquid crystalline polyester (B2) obtained above was heated in a nitrogen atmosphere from room temperature (23° C.) to 180° C. over 1 hour and 25 minutes, and then from 180° C. to 255° C. over 6 hours and 40 minutes. , and held at 255° C. for 5 hours for solid phase polymerization, followed by cooling to obtain a powdery liquid crystalline polyester (LC-A).
- the flow initiation temperature of the liquid crystalline polyester (LC-A) was 302°C. Further, the melting point of this liquid crystal polyester (LC-A) was measured using a differential scanning calorimeter, and the result was 311°C.
- ⁇ Polymer> P-1 An aqueous dispersion of commercially available polytetrafluoroethylene (PTFE) particles (Polyflon PTFE D-711, average particle size 0.30 ⁇ m, solid content concentration 60%, manufactured by Daikin Industries, Ltd.) was prepared, and the solid content is shown in Table 1. It was used so that the amount of PTFE particles.
- PTFE polytetrafluoroethylene
- F-1 Commercially available low dielectric loss tangent filler with an average particle size of 600 nm (specially treated fused spherical silica, manufactured by Denka Co., Ltd.)
- ⁇ Composition for adhesive layer> M-1: Commercially available low dielectric adhesive (varnish of SLK (manufactured by Shin-Etsu Chemical Co., Ltd.) containing mainly polymer-type curable compounds M-2: Commercially available low dielectric adhesive (thermoplastic polyimide varnish PIAD 100H, Arakawa Chemical manufactured by Kogyo Co., Ltd.)
- Examples 1 to 3, Examples 5 to 8 In Examples 1 to 3 and Examples 5 to 8, films were formed using a casting method (solution film forming method).
- Example 1 the above liquid crystal polymer was added to N-methylpyrrolidone, and the mixture was stirred at 140° C. for 4 hours under a nitrogen atmosphere to obtain a liquid crystal polymer solution.
- the solid content concentration was set to 8% by mass.
- Example 5 the above liquid crystal polymer and the above additive were added to N-methylpyrrolidone and stirred at 140° C. for 4 hours in a nitrogen atmosphere to obtain a liquid crystal polymer solution.
- the additive was added so that the additive content in the liquid crystal polymer layer was the amount shown in Table 1.
- the solid content concentration was set to 11% by mass.
- the solution was passed through a sintered fiber metal filter with a nominal pore size of 10 ⁇ m and then through a sintered fiber filter with a nominal pore size of 10 ⁇ m to obtain a liquid crystal polymer solution.
- annealing process The film on which the adhesive layer 1 was formed was held by a tenter and stretched by 15% in the horizontal direction. After that, a heat treatment was performed in which the temperature was raised from room temperature to 270° C. at a rate of 1° C./min in a nitrogen atmosphere and held at that temperature for 2 hours.
- the manufacturing method is as follows.
- a copper foil (CF-T9DA-SV-18, manufactured by Fukuda Metal Foil & Powder Co., Ltd., thickness 18 ⁇ m, surface roughness Rz 0.85 ⁇ m on the bonding surface (treated surface)) is used to form the adhesive layer of the liquid crystal polymer film.
- Lamination is performed for 1 minute under conditions of 140 ° C. and a lamination pressure of 0.4 MPa using a laminator ("Vacuum Laminator V-130" manufactured by Nikko Materials Co., Ltd.), copper foil A laminate precursor was obtained.
- thermocompression bonding process Using a thermocompression bonding machine (“MP-SNL” manufactured by Toyo Seiki Seisakusho Co., Ltd.), the obtained copper clad laminate precursor is thermocompression bonded at 300° C. and 4.5 MPa for 10 minutes to form a copper clad laminate. A plate was made.
- Example 4 a film was formed using an extrusion method (melt film forming method).
- Adhesive layer composition M-1 was applied to the obtained film so that the thickness of the adhesive layer was 1/10 of the thickness shown in Table 1, and dried to form an adhesive layer 1.
- annealing process The film on which the adhesive layer was formed was held by a tenter and stretched by 15% in the horizontal direction. After that, a heat treatment was performed in which the temperature was raised from room temperature to 270° C. at a rate of 1° C./min in a nitrogen atmosphere and held at that temperature for 2 hours.
- a copper-clad laminate was produced in the same manner as in Example 1 using the obtained liquid crystal polymer film.
- Example 9 a film was formed using a coating method.
- Film forming process The dispersion is applied to the treated surface of a copper foil (CF-T4X-SV-18, thickness 18 ⁇ m, manufactured by Fukuda Metal Foil & Powder Co., Ltd.) by a reverse gravure method, and dried at 120° C. for 10 minutes. , to obtain a film precursor.
- a copper foil CF-T4X-SV-18, thickness 18 ⁇ m, manufactured by Fukuda Metal Foil & Powder Co., Ltd.
- Comparative example 1 In Comparative Example 1, the stretching process and the annealing process were performed after the film forming process, and the adhesive layer was formed after the annealing process. Each step was performed in the same manner as in Example 1 to obtain a liquid crystal polymer film. A copper-clad laminate was produced in the same manner as in Example 1 using the obtained liquid crystal polymer film.
- Comparative example 2 In Comparative Example 2, the stretching process and the annealing process were performed after the film formation process, and the adhesive layer was formed after the annealing process. Each step was performed in the same manner as in Example 4 to obtain a liquid crystal polymer film. A copper-clad laminate was produced in the same manner as in Example 1 using the obtained liquid crystal polymer film.
- Table 1 shows the measurement results of the dielectric loss tangent of the liquid crystal polymer film and the peel strength of the copper-clad laminate.
- Table 1 shows the type and thickness of the liquid crystal polymer film, the type, formation timing and thickness of the adhesive layer, and the film forming method are described for the liquid crystal polymer film.
- the formation timing of the adhesive layer is indicated as "A" when the adhesive layer is formed immediately after the film formation process, and as "B” when it is formed immediately after the annealing process.
- Examples 1 to 8 since it was confirmed that a mixed region containing the liquid crystal polymer and the adhesive was formed in the liquid crystal polymer film, the thickness of the mixed region was described.
- Example 9 it was confirmed that a mixed region containing the polymer and the adhesive was formed in the polymer film, so the thickness of the mixed region was described.
- the liquid crystal polymer film is cut in an oblique direction, and the obtained cross-sectional sample is measured by TOF-SIMS (time-of-flight secondary ion mass spectroscopy). analysis method), and a portion where a fragment derived from the liquid crystal polymer layer and a fragment derived from the layer A were simultaneously observed was judged to be a mixed region.
- TOF-SIMS time-of-flight secondary ion mass spectroscopy
- a liquid crystal polymer layer containing a liquid crystal polymer and a layer A disposed on at least one surface of the liquid crystal polymer layer were included, and the liquid crystal polymer layer and the layer A Since a mixed region containing the liquid crystal polymer and the material constituting the layer A is formed between them, it was found that the liquid crystal polymer film and the metal have excellent adhesiveness.
- Example 9 includes a polymer layer comprising a polymer, and a layer A disposed on at least one side of the polymer layer, between the polymer layer and layer A, a liquid crystal polymer, and It was found that the adhesion between the polymer film and the metal was excellent due to the formation of the mixed region containing the materials constituting the layer A.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
Abstract
Description
従来、回路基板に用いられる絶縁材料として、ポリイミドが多く用いられてきたが、高耐熱性及び低吸水性であり、かつ、高周波帯域での損失が小さい液晶ポリマーが注目されている。
本発明の実施形態によれば、液晶ポリマーフィルム上に形成される層との密着性に優れる液晶ポリマーフィルムが提供される。
また、本発明の実施形態によれば、上記液晶ポリマーフィルムを用いた積層体が提供される。
さらに、本発明の実施形態によれば、ポリマーフィルム上に形成される層との密着性に優れるポリマーフィルムが提供される。
<1>液晶ポリマーを含む液晶ポリマー層と、液晶ポリマー層の少なくとも一方の面上に配置された層Aを含み、液晶ポリマー層と層Aとの間に、液晶ポリマー、及び層Aを構成する材料とを含む混合領域が形成されている、液晶ポリマーフィルム。
<2>混合領域の平均厚みは、1nm~10μmである、<1>に記載の液晶ポリマーフィルム。
<3>誘電正接が0.005以下である、<1>又は<2>に記載の液晶ポリマーフィルム。
<4>層Aは、接着剤を含む接着層である、<1>~<3>のいずれか1つに記載の液晶ポリマーフィルム。
<5>接着剤は、官能基を有する化合物を含み、官能基は、共有結合可能な基、イオン結合可能な基、水素結合可能な基、及び、双極子相互作用可能な基からなる群より選択される少なくとも1種の基である、<4>に記載の液晶ポリマーフィルム。
<6>官能基は、共有結合可能な基である、<5>に記載の液晶ポリマーフィルム。
<7>共有結合可能な基は、エポキシ基、オキセタニル基、イソシアネート基、酸無水物基、カルボジイミド基、N-ヒドロキシエステル基、グリオキサール基、イミドエステル基、ハロゲン化アルキル基、及び、チオール基からなる群より選択される少なくとも1種の基である、<6>に記載の液晶ポリマーフィルム。
<8>官能基は、イオン結合可能な基、水素結合可能な基、又は、双極子相互作用可能な基である、<5>に記載の液晶ポリマーフィルム。
<9>液晶ポリマーは、融点が280℃以上である、<1>~<8>のいずれか1つに記載の液晶ポリマーフィルム。
<10>液晶ポリマーは、芳香族ヒドロキシカルボン酸に由来する構成単位を含む、<1>~<9>のいずれか1つに記載の液晶ポリマーフィルム。
<11>液晶ポリマーは、芳香族ヒドロキシカルボン酸に由来する構成単位、芳香族ジオールに由来する構成単位、及び、芳香族ジカルボン酸に由来する構成単位からなる群より選択される少なくとも1種の構成単位を含む、<1>~<10>のいずれか1つに記載の液晶ポリマーフィルム。
<12>液晶ポリマーは、芳香族ポリエステルアミドを含む、<1>~<11>のいずれか1つに記載の液晶ポリマーフィルム。
<13><1>~<12>のいずれか1つに記載の液晶ポリマーフィルムと、液晶ポリマーフィルムの少なくとも一方の面に配置された金属層又は金属配線と、を有する積層体。
<14>金属層又は金属配線は、液晶ポリマーフィルムと接する側の面に、液晶ポリマーフィルムと相互作用可能な基を有する、<13>に記載の積層体。
<15>液晶ポリマーフィルムと相互作用可能な基は、アミノ基である、<14>に記載の積層体。
<16>液晶ポリマーフィルムと、金属層との剥離強度は、0.5kN/m以上である<13>~<15>のいずれか1つに記載の積層体。
<17>フッ素系ポリマー、環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体、ポリフェニレンエーテル、及び芳香族ポリエーテルケトンよりなる群から選ばれる少なくとも1種のポリマーを含むポリマー層と、ポリマー層の少なくとも一方の面上に配置された層Aを含み、ポリマー層と層Aとの間に、ポリマー、及び層Aを構成する材料を含む混合領域が形成されている、ポリマーフィルム。
また、本発明の他の実施形態によれば、上記液晶ポリマーフィルムを用いた積層体を提供することができる。
さらに、本発明の他の実施形態によれば、ポリマーフィルム上に形成される層との密着性に優れるポリマーフィルムが提供される。
なお、本明細書において、数値範囲を示す「~」とはその前後に記載される数値を下限値及び上限値として含む意味で使用される。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
また、本明細書における基(原子団)の表記において、置換及び無置換を記していない表記は、置換基を有さないものと共に置換基を有するものをも包含するものである。例えば「アルキル基」とは、置換基を有さないアルキル基(無置換アルキル基)のみならず、置換基を有するアルキル基(置換アルキル基)をも包含するものである。
本明細書において、「(メタ)アクリル」は、アクリル及びメタクリルの両方を包含する概念で用いられる語であり、「(メタ)アクリロイル」は、アクリロイル及びメタクリロイルの両方を包含する概念として用いられる語である。
また、本明細書中の「工程」の用語は、独立した工程だけではなく、他の工程と明確に区別できない場合であっても、その工程の所期の目的が達成されれば本用語に含まれる。 また、本開示において、「質量%」と「重量%」とは同義であり、「質量部」と「重量部」とは同義である。
更に、本開示において、2以上の好ましい態様の組み合わせは、より好ましい態様である。
また、本開示における重量平均分子量(Mw)及び数平均分子量(Mn)は、特に断りのない限り、TSKgel GMHxL、TSKgel G4000HxL、TSKgel G2000HxL(何れも東ソー(株)製の商品名)のカラムを使用したゲルパーミエーションクロマトグラフィ(GPC)分析装置により、溶剤THF(テトラヒドロフラン)、示差屈折計により検出し、標準物質としてポリスチレンを用いて換算した分子量である。
以下、本開示を詳細に説明する。
本開示に係る液晶ポリマーフィルムは、液晶ポリマーを含む液晶ポリマー層と、液晶ポリマー層の少なくとも一方の面上に配置された層Aを含み、液晶ポリマー層と層Aとの間に、液晶ポリマー、及び層Aを構成する材料とを含む混合領域が形成されている。
本発明者が鋭意検討した結果、上記構成をとることにより、液晶ポリマーフィルム上に形成される層との密着性に優れる液晶ポリマーフィルムを提供できることを見出した。
本開示に係る液晶ポリマーフィルムは、特に、液晶ポリマー及び層Aを構成する材料を含む混合領域が形成されているため、液晶ポリマー層と層Aとの層間剥離が抑制され、液晶ポリマー層と層Aとの密着性が向上する。さらに、層Aが、液晶ポリマーフィルム上に形成される層の表面と、共有結合、イオン結合、水素結合、及び、双極子相互作用可能な基からなる群より選択される少なくとも1種の基である官能基を有する化合物を接着剤として含む場合には、層Aと液晶ポリマーフィルム上に形成される層との密着性が向上することにより、液晶ポリマーフィルム全体として液晶ポリマーフィルム上に形成される層との密着性に優れると推定している。
本開示に係る液晶ポリマーフィルムにおいて、液晶ポリマー層は液晶ポリマーを含む。
また、液晶ポリマーは、液晶性、及び、熱膨張係数の観点から、芳香環を有するポリマーであることが好ましく、芳香族ポリエステル又は芳香族ポリエステルアミドであることがより好ましく、芳香族ポリエステルアミドであることがさらに好ましい。
更に、液晶ポリマーは、芳香族ポリエステル又は芳香族ポリエステルアミドに、更にイミド結合、カルボジイミド結合やイソシアヌレート結合などのイソシアネート由来の結合等が導入されたポリマーであってもよい。
また、液晶ポリマーは、原料モノマーとして芳香族化合物のみを用いてなる全芳香族液晶ポリマーであることが好ましい。
1)(i)芳香族ヒドロキシカルボン酸と、(ii)芳香族ジカルボン酸と、(iii)芳香族ジオール、芳香族ヒドロキシアミン及び芳香族ジアミンよりなる群から選ばれる少なくとも1種の化合物と、を重縮合させてなるもの。
2)複数種の芳香族ヒドロキシカルボン酸を重縮合させてなるもの。
3)(i)芳香族ジカルボン酸と、(ii)芳香族ジオール、芳香族ヒドロキシアミン及び芳香族ジアミンよりなる群から選ばれる少なくとも1種の化合物と、を重縮合させてなるもの。
4)(i)ポリエチレンテレフタレート等のポリエステルと、(ii)芳香族ヒドロキシカルボン酸と、を重縮合させてなるもの。
ここで、芳香族ヒドロキシカルボン酸、芳香族ジカルボン酸、芳香族ジオール、芳香族ヒドロキシアミン及び芳香族ジアミンはそれぞれ独立に、その一部又は全部に代えて、その重縮合可能な誘導体が用いられてもよい。
芳香族ヒドロキシカルボン酸、芳香族ジオール及び芳香族ヒドロキシアミンのようなヒドロキシ基を有する化合物の重合可能な誘導体の例としては、ヒドロキシ基をアシル化してアシルオキシ基に変換してなるもの(アシル化物)が挙げられる。
芳香族ヒドロキシアミン及び芳香族ジアミンのようなアミノ基を有する化合物の重合可能な誘導体の例としては、アミノ基をアシル化してアシルアミノ基に変換してなるもの(アシル化物)が挙げられる。
式(1) -O-Ar1-CO-
式(2) -CO-Ar2-CO-
式(3) -O-Ar3-O-
式(1)~式(3)中、Ar1は、フェニレン基、ナフチレン基又はビフェニリレン基を表し、Ar2及びAr3はそれぞれ独立に、フェニレン基、ナフチレン基、ビフェニリレン基又は下記式(4)で表される基を表し、Ar1~Ar3で表される上記基にある水素原子は、それぞれ独立に、ハロゲン原子、アルキル基又はアリール基で置換されていてもよい。
式(4) -Ar4-Z-Ar5-
式(4)中、Ar4及びAr5はそれぞれ独立に、フェニレン基又はナフチレン基を表し、Zは、酸素原子、硫黄原子、カルボニル基、スルホニル基又はアルキレン基を表す。
上記アルキル基の例としては、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、イソブチル基、s-ブチル基、t-ブチル基、n-ヘキシル基、2-エチルヘキシル基、n-オクチル基及びn-デシル基が挙げられ、その炭素数は、好ましくは1~10である。
上記アリール基の例としては、フェニル基、o-トリル基、m-トリル基、p-トリル基、1-ナフチル基及び2-ナフチル基が挙げられ、その炭素数は、好ましくは6~20である。
上記水素原子がこれらの基で置換されている場合、その数は、Ar1、Ar2又はAr3で表される上記基毎にそれぞれ独立に、好ましくは2個以下であり、より好ましくは1個である。
単位(1)としては、Ar1がp-フェニレン基である構成単位(p-ヒドロキシ安息香酸に由来する構成単位)、Ar1が2,6-ナフチレン基である構成単位(6-ヒドロキシ-2-ナフトエ酸に由来する構成単位)、又は、Ar1が4,4’-ビフェニリレン基(4’-ヒドロキシ-4-ビフェニルカルボン酸に由来する構成単位)である構成単位が好ましく、Ar1がp-フェニレン基又は2,6-ナフチレン基である構成単位がより好ましい。
単位(2)としては、Ar2がp-フェニレン基である構成単位(テレフタル酸に由来する構成単位)、Ar2がm-フェニレン基である構成単位(イソフタル酸に由来する構成単位)、Ar2が2,6-ナフチレン基である構成単位(2,6-ナフタレンジカルボン酸に由来する構成単位)、又は、Ar2がジフェニルエーテル-4,4’-ジイル基である構成単位(ジフェニルエーテル-4,4’-ジカルボン酸に由来する構成単位)が好ましく、Ar2がp-フェニレン基又は2,6-ナフチレン基である構成単位がより好ましい。
単位(3)としては、Ar3がp-フェニレン基である構成単位(ヒドロキノンに由来する構成単位)、Ar3がm-フェニレン基である構成単位(イソフタル酸に由来する構成単位)、又は、Ar3が4,4’-ビフェニリレン基である構成単位(4,4’-ジヒドロキシビフェニルに由来する構成単位)が好ましい。
芳香族ジカルボン酸に由来する構成単位の含有量は、全構成単位の合計量に対して、好ましくは35モル%以下、より好ましくは10モル%~35モル%、更に好ましくは20モル%~35モル%、特に好ましくは30モル%~35モル%である。
芳香族ジオールに由来する構成単位の含有量は、全構成単位の合計量に対して、好ましくは35モル%以下、より好ましくは10モル%~35モル%、更に好ましくは20モル%~35モル%、特に好ましくは30モル%~35モル%である。
芳香族ヒドロキシカルボン酸に由来する構成単位の含有量が多いほど、耐熱性、強度及び剛性が向上し易いが、あまり多いと、溶媒に対する溶解性が低くなり易い。
具体的には、本開示における可溶性液晶ポリマーは、25℃において、N-メチル-2-ピロリドン、N,N-ジメチルアセトアミド、γ-ブチロラクトン、ジメチルホルムアミド、エチレングリコールモノブチルエーテル及びエチレングリコールモノエチルエーテルよりなる群から選ばれる少なくとも1種の溶媒100gに、0.1g以上溶解する液晶ポリマーであることが好ましい。
液晶ポリマーは、溶融状態で液晶性を示す液晶ポリマーであることが好ましい。液晶ポリマーは、誘電正接、及び、破断強度の観点から、融点Tmが280℃以上であることが好ましく、300℃以上であることよりが好ましく、315℃以上であることが更に好ましく、330℃~400℃であることが特に好ましい。
液晶ポリマーは、重量平均分子量が13,000以下であることが好ましく、3,000~13,000であることがより好ましく、5,000~12,000であること更に好ましく、5,000~10,000であることが特に好ましい。この液晶ポリマーの重量平均分子量が上記範囲であると、熱処理後のフィルムにおいて、厚み方向の熱伝導性、耐熱性、強度及び剛性に優れる。
液晶ポリマーは、液晶ポリマーフィルムの誘電正接、及び、金属との密着性の観点から、誘電正接が0.005以下であることが好ましく、0.004以下であることがより好ましく、0.0035以下であることが更に好ましく、0を超え0.003以下であることが特に好ましい。
誘電正接の測定は周波数10GHzで共振摂動法により実施する。ネットワークアナライザ(Agilent Technology社製「E8363B」)に10GHzの空洞共振器((株)関東電子応用開発CP531)を接続し、空洞共振器に液晶ポリマー又は液晶ポリマーフィルムのサンプル(幅:2.0mm×長さ:80mmを挿入し、温度25℃、湿度60%RH環境下、96時間の挿入前後の共振周波数の変化から、液晶ポリマー又は液晶ポリマーフィルムの誘電正接を測定する。
その他の添加剤としては、公知の添加剤を用いることができる。具体的には、例えば、レベリング剤、消泡剤、酸化防止剤、紫外線吸収剤、難燃剤、着色剤、フィラー等が挙げられる。
液晶ポリマーフィルムを、液晶ポリマーフィルムの面方向に垂直な面で切断し、その断面において、5点以上厚みを測定し、それらの平均値を平均厚みとする。
本開示に係る液晶ポリマーフィルムは、液晶ポリマー層の少なくとも一方の面上に配置された層Aを含む。層Aは、液晶ポリマー層の一方の面のみに配置されていてもよく、液晶ポリマー層の両方の面に配置されていてもよい。
上記接着剤としては、熱硬化性樹脂が好適に挙げられる。
熱硬化性樹脂としては、例えば、エポキシ樹脂、フェノール樹脂、不飽和イミド樹脂、シアネート樹脂、イソシアネート樹脂、ベンゾオキサジン樹脂、オキセタン樹脂、アミノ樹脂、不飽和ポリエステル樹脂、アリル樹脂、ジシクロペンタジエン樹脂、シリコーン樹脂、トリアジン樹脂及びメラミン樹脂等が挙げられる。また、熱硬化性樹脂としては、特にこれらに制限されず、公知の熱硬化性樹脂を使用できる。これらの熱硬化性樹脂は、単独で、又は複数種を併用して用いることができる。
また、上記接着剤としては、市販の熱硬化性樹脂含有接着剤を用いることもできる。
官能基を有する化合物における官能基は、共有結合可能な基、イオン結合可能な基、水素結合可能な基、及び、双極子相互作用可能な基からなる群より選択される少なくとも1種の基であることが好ましい。
また、保存安定性、及び、取り扱い性の観点からは、官能基は、イオン結合可能な基、水素結合可能な基、又は、双極子相互作用可能な基であることが好ましい。
共有結合可能な基としては、共有結合が形成可能な基であれば特に制限はなく、例えば、エポキシ基、オキセタニル基、イソシアネート基、酸無水物基、カルボジイミド基、N-ヒドロキシエステル基、イミドエステル基、ハロゲン化アルキル基、チオール基、ヒドロキシ基、カルボキシ基、アミノ基、アミド基、イソシアネート基、アルデヒド基、スルホン酸基等を挙げることができる。中でも、金属との密着性の観点から、共有結合可能な基は、エポキシ基、オキセタニル基、イソシアネート基、酸無水物基、カルボジイミド基、N-ヒドロキシエステル基、グリオキサール基、イミドエステル基、ハロゲン化アルキル基、及び、チオール基からなる群より選択される少なくとも1種の基であることが好ましい。
共有結合可能な基の組み合わせ(官能基を有する化合物の官能基と、金属の表面に有する基との組み合わせ)として、具体的には、一方が、例えば、エポキシ基である場合、他方は、ヒドロキシ基、アミノ基等が挙げられる。
また、一方が、例えば、N-ヒドロキシエステル基又はイミドエステル基である場合、他方は、アミノ基等が挙げられる。
イオン結合可能な基としては、カチオン性基、アニオン性基等が挙げられる。
上記カチオン性基としては、オニウム基であることが好ましい。オニウム基の例は、アンモニウム基、ピリジニウム基、ホスホニウム基、オキソニウム基、スルホニウム基、セレノニウム基、ヨードニウム基等が挙げられる。中でも、金属との密着性の観点から、アンモニウム基、ピリジニウム基、ホスホニウム基、又は、スルホニウム基が好ましく、アンモニウム基、又は、ホスホニウム基がより好ましく、アンモニウム基が特に好ましい。
アニオン性基としては、特に制限はなく、例えば、フェノール性水酸基、カルボキシ基、-SO3H、-OSO3H、-PO3H、-OPO3H2、-CONHSO2-、-SO2NHSO2-等が挙げられる。これらの中でも、リン酸基、ホスホン酸基、ホスフィン酸基、硫酸基、スルホン酸基、スルフィン酸基又はカルボキシ基であることが好ましく、リン酸基、又は、カルボキシ基であることがより好ましく、カルボキシ基であることが更に好ましい。
上記酸性基としては、例えば、カルボキシ基、スルホ基、リン酸基等が挙げられ、カルボキシ基であることが好ましい。
また、一方が、例えば、カルボキシ基である場合、カルボキシ基とイオン結合可能な基としては、第三級アミノ基、ピリジル基、及びピペリジル基が挙げられる。
水素結合可能な基としては、水素結合供与性部位を有する基、水素結合受容性部位を有する基が挙げられる。
上記水素結合供与性部位は、水素結合可能な活性水素原子を有する構造であればよいが、X-Hで表される構造であることが好ましい。
Xは、ヘテロ原子を表し、窒素原子、又は、酸素原子であることが好ましい。
上記水素結合供与性部位は、金属との密着性の観点から、ヒドロキシ基、カルボキシ基、第一級アミド基、第二級アミド基、第一級アミノ基、第二級アミノ基、第一級スルホンアミド基、第二級スルホンアミド基、イミド基、ウレア結合、及び、ウレタン結合からなる群より選択される少なくとも1種の構造であることが好ましく、ヒドロキシ基、カルボキシ基、第一級アミド基、第二級アミド基、第一級スルホンアミド基、第二級スルホンアミド基、マレイミド基、ウレア結合、及び、ウレタン結合からなる群より選択される少なくとも1種の構造であることがより好ましく、ヒドロキシ基、カルボキシ基、第一級アミド基、第二級アミド基、第一級スルホンアミド基、第二級スルホンアミド基、及び、マレイミド基からなる群より選択される少なくとも1種の構造であることが更に好ましく、ヒドロキシ基、及び、第二級アミド基からなる群より選択される少なくとも1種の構造であることが特に好ましい。
例えば、の一方がカルボキシ基である場合、アミド基、カルボキシ基等が挙げられる。
また、一方が、例えば、フェノール性水酸基である場合、他方は、フェノール性水酸等が挙げられる。
双極子相互作用可能な基としては、上記水素結合可能な基におけるX-H(Xは、ヘテロ原子を表し、窒素原子、又は、酸素原子)で表される構造以外の分極した構造を有した基であればよく、電気陰性度の異なる原子が結合された基が好適に挙げられる。
電気陰性度の異なる原子の組み合わせとしては、酸素原子、窒素原子、硫黄原子、及びハロゲン原子からなる群より選択される少なくとも1種の原子と炭素原子との組み合わせが好ましく、酸素原子、窒素原子、及び、硫黄原子からなる群より選択される少なくとも1種の原子と炭素原子との組み合わせがより好ましい。
中でも、金属との密着性の観点から、窒素原子と炭素原子との組み合わせ、炭素原子と、窒素原子、酸素原子及び硫黄原子との組み合わせが好ましく、具体的には、シアノ基、シアヌル基、スルホン酸アミド基がより好ましい。
一方が、例えば、シアノ基である場合、他方は、シアノ基が挙げられる。
また、一方が、例えば、スルホン酸アミド基である場合、他方は、スルホン酸アミド基が挙げられる。
接着層における接着剤の含有量は、金属との密着性の観点から、液晶ポリマーフィルムの全質量に対し、50質量%以上であることが好ましく、80質量%以上であることがより好ましく、90質量%以上であることが更に好ましい。接着剤の含有量の上限値は特に限定されず、100質量%であってもよい。すなわち、接着層は、接着剤からなる層であってもよい。
その他の添加剤としては、公知の添加剤を用いることができる。具体的には、例えば、レベリング剤、消泡剤、酸化防止剤、紫外線吸収剤、難燃剤、着色剤、フィラー等が挙げられる。
本開示に係る液晶ポリマーフィルムでは、液晶ポリマー層と層Aとの間に、液晶ポリマー、及び層Aを構成する材料を含む混合領域が形成されている。
本開示に係る液晶ポリマーフィルムの製造方法は、特に制限はなく、公知の方法を参照することができる。
3~5である化合物の割合は、好ましくは50質量%~100質量%、より好ましくは70質量%~100質量%、特に好ましくは90質量%~100質量%である。
上記非プロトン性化合物として、双極子モーメントが3~5である化合物を用いることが好ましい。
上記非プロトン性化合物として、1気圧における沸点が220℃以下である化合物を用いることが好ましい。
支持体としては、例えば、ガラス板、樹脂フィルム又は金属箔が挙げられる。中でも、樹脂フィルムが好ましく、特に、耐熱性に優れ、組成物を塗布し易く、また、液晶ポリマーから剥離し易いことから、ポリイミド(PI)フィルムが好ましい。
ポリイミド(PI)フィルムの市販品の例としては、宇部興産(株)製U-ピレックスS及びU-ピレックスR、東レデュポン(株)製カプトン、並びに、SKCコーロンPI社製IF30、IF70及びLV300等が挙げられる。
また、支持体は、容易に剥離できるように、表面に表面処理層が形成されていることが好ましい。表面処理層は、フッ素樹脂を含むことが好ましい。
支持体の平均厚みは、特に制限はないが、好ましくは25μm以上75μm以下であり、より好ましくは50μm以上75μmである。
本開示に係る液晶ポリマーフィルムは、種々の用途に用いることができる。中でも、プリント配線板などの電子部品用フィルムに好適に用いることができ、フレキシブルプリント回路基板により好適に用いることができる。
また、本開示に係る液晶ポリマーフィルムは、金属接着用液晶ポリマーフィルムとして好適に用いることができる。
本開示に係る積層体は、本開示に係る液晶ポリマーフィルムを含む積層体であればよい。本開示に係る液晶ポリマーフィルムは、液晶ポリマーフィルム上に形成される層との密着性に優れる。したがって、本開示に係る積層体は、本開示に係る液晶ポリマーフィルムと、上記液晶ポリマーフィルムの少なくとも一方の面に配置された層と、を有することが好ましい。液晶ポリマーフィルムの少なくとも一方の面に配置される層は特に限定されず、例えば、ポリマー層及び金属層が挙げられる。液晶ポリマーフィルムの少なくとも一方の面に配置される層は、塗工層であってもよい。
液晶ポリマーフィルムと金属層との積層体から1.0cm幅の剥離用試験片を作製し、ポリマーフィルムを両面接着テープで平板に固定し、JIS C 5016(1994)に準じて180°法により、50mm/分の速度で金属層からポリマーフィルムを剥離したときの強度(kN/m)を測定する。
本開示に係るポリマーフィルムは、フッ素系ポリマー、環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体、ポリフェニレンエーテル、及び芳香族ポリエーテルケトンよりなる群から選ばれる少なくとも1種のポリマーを含むポリマー層と、ポリマー層の少なくとも一方の面上に配置された層Aを含み、ポリマー層と層Aとの間に、ポリマー、及び層Aを構成する材料を含む混合領域が形成されている
本開示に係るポリマーフィルムにおいて、ポリマー層は、フッ素系ポリマー、環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体、ポリフェニレンエーテル及び芳香族ポリエーテルケトンよりなる群から選ばれる少なくとも1種のポリマーを含む。
フッ素系ポリマーとしては、例えば、ポリテトラフルオロエチレン、ポリクロロトリフルオロエチレン、ポリフッ化ビニリデン、ポリフッ化ビニル、ペルフルオロアルコキシフッ素樹脂、四フッ化エチレン/六フッ化プロピレン共重合体、エチレン/四フッ化エチレン共重合体、エチレン/クロロトリフルオロエチレン共重合体等が挙げられる。
中でも、ポリテトラフルオロエチレンが好ましく挙げられる。
フッ素化α-オレフィンモノマーとしては、CF2=CF2、CHF=CF2、CH2=CF2、CHCl=CHF、CClF=CF2、CCl2=CF2、CClF=CClF、CHF=CCl2、CH2=CClF、CCl2=CClF、CF3CF=CF2、CF3CF=CHF、CF3CH=CF2、CF3CH=CH2、CHF2CH=CHF、CF3CF=CF2、パーフルオロ(炭素数2~8のアルキル)ビニルエーテル(例えば、パーフルオロメチルビニルエーテル、パーフルオロプロピルビニルエーテル、パーフルオロオクチルビニルエーテル)等が挙げられる。中でも、テトラフルオロエチレン(CF2=CF2)、クロロトリフルオロエチレン(CClF=CF2)、(パーフルオロブチル)エチレン、フッ化ビニリデン(CH2=CF2)、及び、ヘキサフルオロプロピレン(CF2=CFCF3)よりなる群から選ばれた少なくとも1種のモノマーが好ましい。
非フッ素化モノエチレン性不飽和モノマーとしては、エチレン、プロピレン、ブテン、エチレン性不飽和芳香族モノマー(例えば、スチレン及びα-メチルスチレン)等が挙げられる。
フッ素化α-オレフィンモノマーは、1種単独で使用してもよいし、2種以上を併用してもよい。
また、非フッ素化エチレン性不飽和モノマーは、1種単独で使用してもよいし、2種以上を併用してもよい。
フッ素系ポリマーは、1種単独で使用してもよいし、2種以上を併用してもよい。
H2C=CR’COO-(CH2)n-R-(CH2)n-OOCR’=CH2
で表すことができ、式中、Rは、フッ素化α-オレフィンモノマー又は非フッ素化モノエチレン性不飽和モノマーに由来する構成単位を2以上有するフッ素系オリゴマー鎖であり、R’はH又は-CH3であり、nは1~4である。Rは、テトラフルオロエチレンに由来する構成単位を含むフッ素系オリゴマー鎖であってよい。
環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体の例としては、例えば、ノルボルネン又は多環ノルボルネン系モノマーのような環状オレフィンからなるモノマーから形成される構成単位を有する熱可塑性の樹脂が挙げられ、熱可塑性環状オレフィン系樹脂とも呼ばれる。
環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体は、上記環状オレフィンの開環重合体や2種以上の環状オレフィンを用いた開環共重合体の水素添加物であってもよく、環状オレフィンと、鎖状オレフィン又はビニル基の如きエチレン性不飽和結合を有する芳香族化合物などとの付加重合体であってもよい。また、環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体には、極性基が導入されていてもよい。
環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体は、1種単独で使用してもよいし、2種以上を併用してもよい。
環状脂肪族炭化水素基の環構造としては、シクロペンタン環、シクロヘキサン環、シクロオクタン環、イソボロン環、ノルボルナン環、ジシクロペンタン環等が挙げられる。
環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物は、単官能エチレン性不飽和化合物であっても、多官能エチレン性不飽和化合物であってもよい。
環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物における環状脂肪族炭化水素基の数は、1以上であればよく、2以上有していてもよい。
環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体は、少なくとも1種の環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物を重合してなる重合体であればよく、2種以上の環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物を重合してなる重合体であってもよいし、環状脂肪族炭化水素基を有しない他のエチレン性不飽和化合物との共重合体であってもよい。
また、環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体は、シクロオレフィンポリマーであることが好ましい。
ポリフェニレンエーテルの重量平均分子量(Mw)は、製膜後に熱硬化する場合には、耐熱性、及び、膜形成性の観点から、500~5,000であることが好ましく、500~3,000であることが好ましい。また、熱硬化しない場合には、特に限定されないが、3,000~100,000であることが好ましく、5,000~50,000であることが好ましい。
ポリフェニレンエーテルとしては、分子末端のフェノール性水酸基の1分子当たりの平均個数(末端水酸基数)が、誘電正接、及び、耐熱性の観点から、1個~5個であることが好ましく、1.5個~3個であることがより好ましい。
ポリフェニレンエーテルの水酸基数又はフェノール性水酸基は、例えば、ポリフェニレンエーテルの製品の規格値からわかる。また、末端水酸基数又は末端フェノール性水酸基数としては、例えば、ポリフェニレンエーテル1モル中に存在する全てのポリフェニレンエーテルの1分子あたりの水酸基又はフェノール性水酸基の平均値を表した数値等が挙げられる。
ポリフェニレンエーテルは、1種単独で使用してもよいし、2種以上を併用してもよい。
上記Xにおける上記アルキレン基としては、例えば、ジメチルメチレン基等が挙げられる。
芳香族ポリエーテルケトンとしては、特に限定されず、公知の芳香族ポリエーテルケトンを用いることができる。
芳香族ポリエーテルケトンは、ポリエーテルエーテルケトンであることが好ましい。
ポリエーテルエーテルケトンは、芳香族ポリエーテルケトンの1種であり、エーテル結合、エーテル結合、カルボニル結合(ケトン)の順に結合が配置されたポリマーである。各結合間は、2価の芳香族基により連結されていることが好ましい。
芳香族ポリエーテルケトンは、1種単独で使用してもよいし、2種以上を併用してもよい。
本開示に係るポリマーフィルムは、ポリマー層の少なくとも一方の面上に配置された層Aを含む。層Aは、ポリマー層の一方の面のみに配置されていてもよく、液晶ポリマー層の両方の面に配置されていてもよい。層Aの好ましい態様は、上記液晶ポリマーフィルムにおける層Aの好ましい態様と同様である。
本開示に係るポリマーフィルムでは、ポリマー層と層Aとの間に、ポリマー、及び層Aを構成する材料を含む混合領域が形成されている。
[誘電正接]
誘電正接の測定は周波数10GHzで共振摂動法により実施した。ネットワークアナライザ(Agilent Technology社製「E8363B」)に10GHzの空洞共振器((株)関東電子応用開発CP531)を接続し、空洞共振器にフィルムのサンプル(幅:2.0mm×長さ:80mmを挿入し、温度25℃、湿度60%RH環境下、96時間の挿入前後の共振周波数の変化からフィルムの誘電正接を測定した。
液晶ポリマーフィルムと銅層との積層体から1.0cm幅の剥離用試験片を作製し、液晶ポリマーフィルムを両面接着テープで平板に固定し、JIS C 5016(1994)に準じて180°法により、50mm/分の速度で液晶ポリマーフィルムから銅層を剥離したときの強度(kN/m)を測定した。
<液晶ポリマー>
LC-A:下記製造方法に従って作製した液晶ポリマー
LC-B:下記製造方法に従って作製した液晶ポリマー
攪拌装置、トルクメータ、窒素ガス導入管、温度計及び還流冷却器を備えた反応器に、6-ヒドロキシ-2-ナフトエ酸940.9g(5.0モル)、4-ヒドロキシアセトアミノフェン377.9g(2.5モル)、イソフタル酸415.3g(2.5モル)及び無水酢酸867.8g(8.4モル)を入れ、反応器内のガスを窒素ガスで置換した後、窒素ガス気流下、撹拌しながら、室温(23℃)から140℃まで60分かけて昇温し、140℃で3時間還流させた。
次いで、副生酢酸及び未反応の無水酢酸を留去しながら、150℃から300℃まで5時間かけて昇温し、300℃で30分保持した後、反応器から内容物を取り出し、室温まで冷却した。得られた固形物を、粉砕機で粉砕して、粉末状の液晶ポリエステル(B1)を得た。この液晶ポリエステル(B1)の流動開始温度は、193.3℃であった。
撹拌装置、トルクメータ、窒素ガス導入管、温度計及び還流冷却器を備えた反応器に、2-ヒドロキシ-6-ナフトエ酸1034.99g(5.5モル)、2,6-ナフタレンジカルボン酸378.33g(1.75モル)、テレフタル酸83.07g(0.5モル)、ヒドロキノン272.52g(2.475モル、2,6-ナフタレンジカルボン酸及びテレフタル酸の合計モル量に対して0.225モル過剰)、無水酢酸1226.87g(12モル)、及び触媒として1-メチルイミダゾール0.17gを入れた。反応器内のガスを窒素ガスで置換した後、窒素ガス気流下、撹拌しながら、室温から145℃まで15分かけて昇温し、145℃で1時間還流させた。
P-1:
市販のポリテトラフルオロエチレン(PTFE)粒子の水分散液(ポリフロンPTFE D-711、平均粒径0.30μm、固形分濃度60%、ダイキン工業(株)製)を、固形分が表1に記載の量になるように用いた。
F-1:市販の平均粒径600nmの低誘電正接フィラー(特殊処理溶融球状シリカ、デンカ(株)製)
M-1:市販の低誘電接着剤(ポリマー型の硬化性化合物を主として含むSLK(信越化学工業社製)のワニス
M-2:市販の低誘電接着剤(熱可塑性ポリイミドワニスPIAD 100H、荒川化学工業(株)製)
実施例1~実施例3、実施例5~実施例8では、流延法(溶液製膜法)を用いて、製膜した。
実施例1~3及び実施例6~実施例8では、上記液晶ポリマーをN-メチルピロリドンに加え、窒素雰囲気下、140℃4時間撹拌し、液晶ポリマー溶液を得た。固形分濃度は8質量%とした。
実施例5では、上記液晶ポリマー、及び、上記添加剤をN-メチルピロリドンに加え、窒素雰囲気下、140℃4時間撹拌し、液晶ポリマー溶液を得た。添加剤は、液晶ポリマー層中の添加剤の含有量が表1に記載の量となるように加えた。固形分濃度は11質量%とした。
次に、上記溶液を、公称孔径10μmの焼結繊維金属フィルターに通過させ、更に、公称孔径10μmの焼結繊維フィルターに通過させ、液晶ポリマー溶液を得た。
得られた液晶ポリマー溶液を、流延ダイに送液し、ステンレス製ベルト(支持体)上に流延した。残留溶剤量が25質量%になった時点で支持体から剥離し、ウェブに10%のドローをかけながら搬送し、フィルムを得た。
接着層の厚みが表1に記載の厚みの1/10となるように、得られたフィルムに、表1に記載の接着層用組成物を塗布し、乾燥させて、接着層1を形成した。
接着層1が形成されたフィルムを、テンターで把持して横方向に15%延伸した。その後、窒素雰囲気下で室温から270℃まで1℃/分で昇温し、その温度で2時間保持する熱処理を行った。
接着層の厚みが表1に記載の厚みとなるように、接着層1の上に、更に表1に記載の接着層用組成物を塗布し、乾燥させて、液晶ポリマーフィルムを得た。
銅箔(福田金属箔粉工業(株)製、CF-T9DA-SV-18、厚み18μm、貼り付け面(処理面)の表面粗さRz0.85μm)を上記液晶ポリマーフィルムの接着層が形成された面に接するように載せ、ラミネータ(ニッコー・マテリアルズ社製「真空ラミネータV-130」)を使用して、140℃及びラミネート圧0.4MPaの条件で1分間のラミネート処理を行い、銅箔積層板前駆体を得た。
熱圧着機((株)東洋精機製作所製「MP-SNL」)を用いて、得られた銅張積層板前駆体を300℃4.5MPaの条件で10分間熱圧着することにより、銅張積層板を作製した。
実施例4では、押出法(溶融製膜法)を用いて、製膜した。
上記液晶ポリマー、80℃の窒素フロー雰囲気下で乾燥した後、二軸押出機を用いて窒素雰囲気下でペレット化した。得られたペレットは、80℃の乾燥空気で乾燥させてから用いた。
得られたペレットを、スクリュー径50mmの二軸押出機の同一供給口からシリンダー内に供給し、340℃~350℃で加熱混練して混練物を得た。続けて、混練物をTダイに送液し、溶融状態のフィルム状の混練物を吐出させ、10%のドローをかけながらチルロールで引き取り、固化させてフィルムを得た。
接着層の厚みが表1に記載の厚みの1/10となるように、得られたフィルムに接着層用組成物M-1を塗布し、乾燥させて、接着層1を形成した。
接着層が形成されたフィルムを、テンターで把持して横方向に15%延伸した。その後、窒素雰囲気下で室温から270℃まで1℃/分で昇温し、その温度で2時間保持する熱処理を行った。
接着層の厚みが表1に記載の厚みとなるように、接着層1の上に、更に表1に記載の接着層用組成物を塗布し、乾燥させて、液晶ポリマーフィルムを得た。
実施例9では、塗布法を用いて、製膜した。
-製膜工程-
分散液を、銅箔(福田金属箔粉工業(株)製、CF-T4X-SV-18、厚み18μm)の処理面上に、リバースグラビア法で塗布し、120℃にて10分間乾燥して、フィルム前駆体を得た。
接着層の厚みが表2に記載の厚みの1/10となるように、得られたフィルム前駆体に、表2に記載の接着層用組成物を塗布し、乾燥させて、接着層1を形成した。
接着層1が形成されたフィルム前駆体を、窒素雰囲気下で380℃にて5分間加熱した。
接着層の厚みが表2に記載の厚みとなるように、接着層1の上に、更に表2に記載の接着層用組成物を塗布し、乾燥させて、銅箔/ポリマーフィルムの積層体を得た。
比較例1では、製膜工程を行った後、続けて、延伸工程、アニール工程を行い、アニール工程の後に、接着層を形成した。各工程については、実施例1と同様の方法で行い、液晶ポリマーフィルムを得た。得られた液晶ポリマーフィルムを用いて、実施例1と同様の方法で、銅張積層板を作製した。
比較例2では、製膜工程を行った後、続けて、延伸工程、アニール工程を行い、アニール工程の後に、接着層を形成した。各工程については、実施例4と同様の方法で行い、液晶ポリマーフィルムを得た。得られた液晶ポリマーフィルムを用いて、実施例1と同様の方法で、銅張積層板を作製した。
Claims (17)
- 液晶ポリマーを含む液晶ポリマー層と、
前記液晶ポリマー層の少なくとも一方の面上に配置された層Aを含み、
前記液晶ポリマー層と前記層Aとの間に、前記液晶ポリマー、及び前記層Aを構成する材料を含む混合領域が形成されている、液晶ポリマーフィルム。 - 前記混合領域の平均厚みは、1nm~10μmである、請求項1に記載の液晶ポリマーフィルム。
- 誘電正接が0.005以下である、請求項1又は請求項2に記載の液晶ポリマーフィルム。
- 前記層Aは、接着剤を含む接着層である、請求項1~請求項3のいずれか1項に記載の液晶ポリマーフィルム。
- 前記接着剤は、官能基を有する化合物を含み、
前記官能基は、共有結合可能な基、イオン結合可能な基、水素結合可能な基、及び、双極子相互作用可能な基からなる群より選択される少なくとも1種の基である、請求項4に記載の液晶ポリマーフィルム。 - 前記官能基は、共有結合可能な基である、請求項5に記載の液晶ポリマーフィルム。
- 前記共有結合可能な基は、エポキシ基、オキセタニル基、イソシアネート基、酸無水物基、カルボジイミド基、N-ヒドロキシエステル基、グリオキサール基、イミドエステル基、ハロゲン化アルキル基、及び、チオール基からなる群より選択される少なくとも1種の基である、請求項6に記載の液晶ポリマーフィルム。
- 前記官能基は、イオン結合可能な基、水素結合可能な基、又は、双極子相互作用可能な基である、請求項5に記載の液晶ポリマーフィルム。
- 前記液晶ポリマーは、融点が280℃以上である、請求項1~請求項8のいずれか1項に記載の液晶ポリマーフィルム。
- 前記液晶ポリマーは、芳香族ヒドロキシカルボン酸に由来する構成単位を含む、請求項1~請求項9のいずれか1項に記載の液晶ポリマーフィルム。
- 前記液晶ポリマーは、芳香族ヒドロキシカルボン酸に由来する構成単位、芳香族ジオールに由来する構成単位、及び、芳香族ジカルボン酸に由来する構成単位からなる群より選択される少なくとも1種の構成単位を含む、請求項1~請求項9のいずれか1項に記載の液晶ポリマーフィルム。
- 前記液晶ポリマーは、芳香族ポリエステルアミドを含む、請求項1~請求項11のいずれか1項に記載の液晶ポリマーフィルム。
- 請求項1~請求項12のいずれか1項に記載の液晶ポリマーフィルムと、前記液晶ポリマーフィルムの少なくとも一方の面に配置された金属層又は金属配線と、を有する積層体。
- 前記金属層又は金属配線は、前記液晶ポリマーフィルムと接する側の面に、前記液晶ポリマーフィルムと相互作用可能な基を有する、請求項13に記載の積層体。
- 前記液晶ポリマーフィルムと相互作用可能な基は、アミノ基である、請求項14に記載の積層体。
- 前記液晶ポリマーフィルムと、前記金属層との剥離強度は、0.5kN/m以上である請求項13~請求項15のいずれか1項に記載の積層体。
- フッ素系ポリマー、環状脂肪族炭化水素基とエチレン性不飽和結合を有する基とを有する化合物に由来する構成単位を含む重合体、ポリフェニレンエーテル、及び芳香族ポリエーテルケトンよりなる群から選ばれる少なくとも1種のポリマーを含むポリマー層と、
前記ポリマー層の少なくとも一方の面上に配置された層Aを含み、
前記ポリマー層と前記層Aとの間に、前記ポリマー、及び前記層Aを構成する材料を含む混合領域が形成されている、ポリマーフィルム。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020237023080A KR20230116047A (ko) | 2021-02-18 | 2022-02-16 | 액정 폴리머 필름, 폴리머 필름, 및 적층체 |
JP2023500900A JPWO2022176914A1 (ja) | 2021-02-18 | 2022-02-16 | |
CN202280009811.0A CN116669950A (zh) | 2021-02-18 | 2022-02-16 | 液晶聚合物膜、聚合物膜及层叠体 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021024494 | 2021-02-18 | ||
JP2021-024494 | 2021-02-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022176914A1 true WO2022176914A1 (ja) | 2022-08-25 |
Family
ID=82930599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/006195 WO2022176914A1 (ja) | 2021-02-18 | 2022-02-16 | 液晶ポリマーフィルム、ポリマーフィルム、及び積層体 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022176914A1 (ja) |
KR (1) | KR20230116047A (ja) |
CN (1) | CN116669950A (ja) |
TW (1) | TW202243911A (ja) |
WO (1) | WO2022176914A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005041044A (ja) * | 2003-07-25 | 2005-02-17 | Nitto Denko Corp | 液晶フィルム、液晶配向フィルムの製造方法および画像表示装置 |
JP2007152886A (ja) * | 2005-12-08 | 2007-06-21 | Fujifilm Corp | 積層シート及びその製造方法 |
JP2010046830A (ja) * | 2008-08-19 | 2010-03-04 | Junkosha Co Ltd | ガスバリアフィルムの製造方法、ガスバリアフィルム及びガスバリアバッグ |
JP2016117281A (ja) * | 2014-12-18 | 2016-06-30 | 住友化学株式会社 | 三層フィルム、三層フィルムの製造方法、積層板及びプリント回路基板 |
WO2017130721A1 (ja) * | 2016-01-27 | 2017-08-03 | 株式会社新技術研究所 | 表面改質ポリエステル系樹脂を含む銅または銅合金物品および製造方法 |
WO2017179542A1 (ja) * | 2016-04-11 | 2017-10-19 | 旭硝子株式会社 | 積層体、プリント基板、および積層体の製造方法 |
JP2020132849A (ja) * | 2019-02-15 | 2020-08-31 | 住友化学株式会社 | 液晶ポリエステル粉末、液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法 |
-
2022
- 2022-02-16 JP JP2023500900A patent/JPWO2022176914A1/ja active Pending
- 2022-02-16 CN CN202280009811.0A patent/CN116669950A/zh active Pending
- 2022-02-16 KR KR1020237023080A patent/KR20230116047A/ko unknown
- 2022-02-16 WO PCT/JP2022/006195 patent/WO2022176914A1/ja active Application Filing
- 2022-02-17 TW TW111105881A patent/TW202243911A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005041044A (ja) * | 2003-07-25 | 2005-02-17 | Nitto Denko Corp | 液晶フィルム、液晶配向フィルムの製造方法および画像表示装置 |
JP2007152886A (ja) * | 2005-12-08 | 2007-06-21 | Fujifilm Corp | 積層シート及びその製造方法 |
JP2010046830A (ja) * | 2008-08-19 | 2010-03-04 | Junkosha Co Ltd | ガスバリアフィルムの製造方法、ガスバリアフィルム及びガスバリアバッグ |
JP2016117281A (ja) * | 2014-12-18 | 2016-06-30 | 住友化学株式会社 | 三層フィルム、三層フィルムの製造方法、積層板及びプリント回路基板 |
WO2017130721A1 (ja) * | 2016-01-27 | 2017-08-03 | 株式会社新技術研究所 | 表面改質ポリエステル系樹脂を含む銅または銅合金物品および製造方法 |
WO2017179542A1 (ja) * | 2016-04-11 | 2017-10-19 | 旭硝子株式会社 | 積層体、プリント基板、および積層体の製造方法 |
JP2020132849A (ja) * | 2019-02-15 | 2020-08-31 | 住友化学株式会社 | 液晶ポリエステル粉末、液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN116669950A (zh) | 2023-08-29 |
KR20230116047A (ko) | 2023-08-03 |
TW202243911A (zh) | 2022-11-16 |
JPWO2022176914A1 (ja) | 2022-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2022163776A1 (ja) | ポリマーフィルム、並びに、積層体及びその製造方法 | |
WO2022138665A1 (ja) | ポリマーフィルム、並びに、積層体及びその製造方法 | |
US20230321953A1 (en) | Liquid crystal polymer film, method for manufacturing same, and laminate | |
US20230321958A1 (en) | Liquid crystal polymer film, polymer film, and laminate | |
US20230286250A1 (en) | Film and laminate | |
US20230292434A1 (en) | Liquid crystal polymer film, polymer film, and laminate | |
US20230278317A1 (en) | Polymer film and laminate | |
JP2022184736A (ja) | 配線基板及び配線基板の製造方法 | |
WO2022176914A1 (ja) | 液晶ポリマーフィルム、ポリマーフィルム、及び積層体 | |
JP2022126429A (ja) | ポリマーフィルム及び積層体 | |
WO2022138666A1 (ja) | 積層体、及び、ポリマーフィルム | |
WO2023191012A1 (ja) | フィルム、並びに、積層体及びその製造方法 | |
WO2023191011A1 (ja) | フィルム、及び、積層体 | |
WO2023191010A1 (ja) | フィルム、及び、積層体 | |
WO2024095641A1 (ja) | ポリマーフィルム及び積層体 | |
WO2023145784A1 (ja) | 配線基板及びその製造方法、フィルム、並びに、積層体 | |
WO2024048728A1 (ja) | フィルム、及び、積層体 | |
WO2023233878A1 (ja) | フィルム及び積層体 | |
JP2024034319A (ja) | フィルム、及び、積層体 | |
WO2024048729A1 (ja) | フィルム及びその製造方法、並びに、積層体 | |
WO2023162658A1 (ja) | メタマテリアル及び積層体 | |
WO2023210471A1 (ja) | フィルム及び積層体 | |
JP2023034130A (ja) | ポリマーフィルム及びその製造方法、並びに、積層体 | |
WO2024048727A1 (ja) | 積層体、フィルム、熱硬化性フィルム、及び、配線基板の製造方法 | |
CN116568753A (zh) | 液晶聚合物膜、聚合物膜及层叠体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22756232 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20237023080 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202280009811.0 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2023500900 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 22756232 Country of ref document: EP Kind code of ref document: A1 |