WO2022176716A1 - セラミック板、及びセラミック板の製造方法 - Google Patents

セラミック板、及びセラミック板の製造方法 Download PDF

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Publication number
WO2022176716A1
WO2022176716A1 PCT/JP2022/004963 JP2022004963W WO2022176716A1 WO 2022176716 A1 WO2022176716 A1 WO 2022176716A1 JP 2022004963 W JP2022004963 W JP 2022004963W WO 2022176716 A1 WO2022176716 A1 WO 2022176716A1
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Prior art keywords
ceramic plate
bending strength
main surface
holes
evaluation
Prior art date
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Ceased
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PCT/JP2022/004963
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English (en)
French (fr)
Japanese (ja)
Inventor
優太 津川
大樹 藤吉
利貴 山縣
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Denka Co Ltd
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Denka Co Ltd
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Publication date
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Priority to CN202280014614.8A priority Critical patent/CN116848633A/zh
Priority to JP2022538170A priority patent/JP7165842B1/ja
Priority to EP22756037.2A priority patent/EP4290570A4/en
Publication of WO2022176716A1 publication Critical patent/WO2022176716A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
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    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
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    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
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    • C04B2237/366—Aluminium nitride
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
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    • C04B2237/368—Silicon nitride
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/638—Removal thereof
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material

Definitions

  • the present disclosure relates to a ceramic plate and a method for manufacturing a ceramic plate.
  • Insulating ceramic plates are sometimes used for circuit boards mounted on electronic devices.
  • a technique described in Patent Document 1 is known.
  • carbon dioxide laser, YAG laser, or the like is used to form scribe lines on the surface of a ceramic plate, and then a metal layer is bonded to the surface to form a composite substrate.
  • the metal layer on the surface of the composite substrate is processed into a circuit pattern by etching. After that, the composite substrate is divided along the scribe lines to manufacture a plurality of circuit boards.
  • the manufacturing process of the circuit board includes various processes after the formation of the scribe lines and between the division of the composite board along the scribe lines. Therefore, if the strength against bending is too weak, the ceramic plate or composite substrate may crack during the process, resulting in a decrease in yield.
  • the present disclosure provides a ceramic board useful for stabilizing the quality of circuit boards and improving the yield, and a method for manufacturing the ceramic board.
  • a ceramic plate has a first principal surface, a second principal surface, and a scribe line configured by a plurality of holes formed in the first principal surface.
  • a value measured by a point bending test, and the secondary bending strength is measured by a three-point bending test with at least a portion of the ceramic plate positioned so that there is no scribe line between the two fulcrums.
  • the first bending strength is 380 MPa or more and 0.56 times or less of the second bending strength.
  • the ceramic plate When dividing the ceramic plate along the scribe lines, if the bending strength of the portion where the scribe lines are formed is too strong, burrs are generated when the ceramic plate is divided, and the circuit board formed by the ceramic plate is damaged. Quality may deteriorate.
  • various processes for forming a circuit board are performed. Therefore, if the bending strength of the portion where the scribe line is formed is too weak, the ceramic plate may crack during the process, resulting in a decrease in yield.
  • the bending strength is adjusted within the above range with respect to the scribe lines, so that the ceramic plate is less likely to crack and less likely to generate burrs when split. Therefore, the present ceramic plate is useful for stabilizing the quality of the circuit board and improving the yield.
  • the maximum length of each of the plurality of holes in the direction orthogonal to the scribe line on the first main surface is 50 ⁇ m to 120 ⁇ m, and the depth of each of the plurality of holes is 1/6 to 1 times the thickness of the ceramic plate. /3 times, and the pitch of the plurality of holes along the scribe line may be 50 ⁇ m to 120 ⁇ m.
  • the hole length, hole depth, and hole pitch are adjusted within the above ranges to prevent cracking of the ceramic plate in the post-process and when splitting. The occurrence of burrs is more reliably suppressed. Therefore, it is more useful for stabilizing the quality of the circuit board and improving the yield.
  • a method for manufacturing a ceramic plate includes a step of selecting a setting condition from among a plurality of processing conditions for forming a scribe line composed of a plurality of holes on one main surface of the ceramic plate. and a step of forming scribe lines on the surface of the substrate for the ceramic plate using a laser beam according to set conditions.
  • Each of the plurality of processing conditions includes the maximum length of each of the plurality of holes in the direction orthogonal to the scribe line on the main surface, the depth of each of the plurality of holes, and the pitch of the plurality of holes along the scribe line. .
  • the step of selecting setting conditions includes forming a plurality of ceramic plates for evaluation each having scribe lines for evaluation formed of a plurality of holes formed on one main surface according to a plurality of processing conditions; By evaluating the bending strength of each of a plurality of evaluation ceramic plates, the first bending strength is 380 MPa or more and the second bending strength is 0.56 times or less from among a plurality of processing conditions. and selecting as a set condition the condition that: The first bending strength is given to the main surface opposite to the main surface on which the scribe lines for evaluation are formed, with one main surface on which the scribe lines for evaluation are formed being supported by two fulcrums.
  • the second bending strength is a value measured by a three-point bending test with at least a portion of the ceramic plate for evaluation placed so that the scribe line for evaluation does not exist between two fulcrums.
  • the first bending strength is 380 MPa or more and 0.56 times or less of the second bending strength. Therefore, the first bending strength can be adjusted within the above range even for a ceramic plate on which scribe lines are formed according to selected conditions.
  • the first bending strength is 380 MPa or more, the ceramic plate is less likely to crack in various processes after forming the scribe lines. is unlikely to occur. Therefore, this manufacturing method is useful for stabilizing the quality of the circuit board formed of the ceramic plate and improving the yield.
  • a ceramic board useful for stabilizing the quality of circuit boards and improving the yield, and a method for manufacturing the ceramic board are provided.
  • FIG. 1 is a perspective view schematically showing an example of a ceramic plate according to one embodiment.
  • FIG. 2 is a schematic diagram showing an example of a cross section of a ceramic plate.
  • FIG. 3 is a schematic diagram showing an example of a cross section of a ceramic plate.
  • FIG. 4 is a schematic diagram showing an example of a scribe line.
  • FIGS. 5A and 5B are schematic diagrams showing examples of scribe lines.
  • FIG. 6 is a cross-sectional view schematically showing an example of a scribe line.
  • FIGS. 7(a) and 7(b) are schematic diagrams for explaining the three-point bending test.
  • FIG. 8 is a flow chart showing an example of a method for manufacturing a circuit board.
  • FIG. 8 is a flow chart showing an example of a method for manufacturing a circuit board.
  • FIG. 9 is a perspective view schematically showing an example of a ceramic plate coated with brazing material.
  • FIG. 10 is a perspective view schematically showing an example of a composite substrate.
  • FIG. 11 is a perspective view schematically showing an example of a composite substrate having a resist pattern formed on its surface.
  • FIG. 12 is a perspective view schematically showing an example of a circuit board.
  • FIG. 13 is a flow chart showing an example of a condition selection method.
  • FIG. 1 schematically shows an example of a ceramic plate according to one embodiment.
  • the ceramic plate 100 shown in FIG. 1 is, for example, a silicon nitride plate or an aluminum nitride plate.
  • the ceramic plate 100 has a flat plate shape.
  • the ceramic plate 100 has a major surface 100A and a major surface 100B that are opposite to each other (opposed to each other).
  • Principal surface 100A is partitioned into a plurality of sections by scribe lines.
  • the principal surface 100A is provided with a plurality of scribe lines L1 and a plurality of scribe lines L2.
  • the principal surface 100B constitutes the second principal surface.
  • Each of the plurality of scribe lines L1 extends along the direction in which one side of the main surface 100A extends (hereinafter referred to as "direction D1").
  • the plurality of scribe lines L1 are arranged at equal intervals along the main surface 100A and along a direction perpendicular to the direction D1 (hereinafter referred to as "direction D2").
  • Each of the plurality of scribe lines L2 extends along the main surface 100A and along the direction D2.
  • the plurality of scribe lines L2 are arranged at regular intervals along the direction D1.
  • the scribe line L1 and the scribe line L2 are orthogonal to each other.
  • a plurality of scribe lines L1 and a plurality of scribe lines L2 divide the ceramic plate 100 into a plurality of (nine in FIG. 1) divisions 10 .
  • the ceramic plate 100 has a plurality of partitions 10 defined by the scribe lines L1 and the scribe lines L2.
  • 2 shows a cross-sectional view along line II-II shown in FIG. 1
  • FIG. 3 shows a cross-sectional view along line III-III shown in FIG.
  • each of the plurality of partitions 10 includes a region of the principal surface 100A surrounded by the scribe lines L1 and L2 and a region of the other principal surface 100B corresponding to the region. and imaginary lines VL1 and VL2 drawn parallel to the thickness direction of the ceramic plate 100 from the scribe lines L1 and L2.
  • the scribe lines L1 and L2 are not formed on the main surface 100B but are formed on the main surface 100A. Not limited. At least one of the scribe lines L1 and L2 may be formed on both the principal surface 100A and the principal surface 100B opposite to the principal surface 100A.
  • the scribe line L1 is composed of a plurality of holes 20 arranged in a row along its longitudinal direction (direction D1).
  • the scribe line L2 is similarly composed of a plurality of holes 20 arranged in a row along its longitudinal direction (direction D2).
  • the holes 20 adjacent to each other may be connected or separated.
  • the opening edge 20E of the hole 20 on the main surface 100A (the outer edge of the hole 20 on the main surface 100A) may be circular when viewed from the direction orthogonal to the main surface 100A.
  • FIG. 4 illustrates a case where the pitch of the plurality of holes 20 arranged along the longitudinal direction of the scribe line L1 (hereinafter referred to as "arrangement pitch p") substantially matches the diameter of the holes 20.
  • FIG. 5(a) illustrates a case where a part of a hole 20 overlaps another adjacent hole 20 in a state where adjacent holes 20 are connected to each other. In this case, a part of the opening edge 20E of one hole 20 is cut out by another hole 20 . Therefore, the opening edge 20E of one hole 20 does not form a perfect circle, but forms an arc.
  • FIG. 5B illustrates a case where holes 20 adjacent to each other are separated from each other.
  • the opening diameter r on the main surface 100A of each of the plurality of holes 20 may be 50 ⁇ m or more, 60 ⁇ m or more, or 70 ⁇ m or more. There may be. From the viewpoint of maintaining the mechanical strength of the ceramic plate 100, the opening diameter r of each hole 20 may be 120 ⁇ m or less, 110 ⁇ m or less, or 100 ⁇ m or less. The opening diameter r of each of the plurality of holes 20 on the main surface 100A may be 50 ⁇ m to 120 ⁇ m, or may be 60 ⁇ m to 110 ⁇ m.
  • the opening diameter r of the hole 20 of the scribe line L1 is the maximum length of the hole 20 in the direction perpendicular to the scribe line L1 on the main surface 100A (among various opening widths on the main surface 100A, the diameter r is perpendicular to the scribe line L1 and maximum width).
  • the opening diameter r of the hole 20 along the scribe line L2 corresponds to the maximum length of the hole 20 in the direction orthogonal to the scribe line L2 on the main surface 100A.
  • the opening diameter r of the hole 20 corresponds to the diameter of the opening edge 20E.
  • the opening diameter r corresponds to the diameter of the opening edge 20E along the direction orthogonal to the longitudinal direction of the scribe line.
  • the opening diameter r (the diameter of the opening edge 20E) of each of the plurality of holes 20 may be substantially the same or may be different.
  • FIG. 6 shows a cross-sectional view taken along line VI-VI shown in FIG. That is, FIG. 6 is a sectional view of the ceramic plate 100 taken along a plane passing through the centers of the holes 20 of the scribe lines L1 (L2) and perpendicular to the main surface 100A.
  • the hole 20 has a mortar shape that tapers from the main surface 100A (opening edge 20E) toward the inside of the ceramic plate 100 .
  • the depth d of each of the plurality of holes 20 may be 1 ⁇ 6 or more times the thickness T of the ceramic plate 100. It may be 1/5 times or more, or may be 1/4 times or more of the thickness T.
  • the depth d of each hole 20 may be 1/3 times or less the thickness T of the ceramic plate 100, or 3/10 times or less the thickness T. or 4/15 times or less of the thickness T.
  • the depth d may be 1/6 to 1/3 times the thickness T of the ceramic plate 100, or 1/5 to 3/10 times the thickness T.
  • the depth d may be 25 ⁇ m to 330 ⁇ m, 50 ⁇ m to 200 ⁇ m, or 60 ⁇ m to 100 ⁇ m. good too. As shown in FIG.
  • the depth d is defined as the distance in the thickness direction of the ceramic plate 100 from the main surface 100A (opening edge 20E) to the bottom 20B (lowest point) of the hole 20. As shown in FIG.
  • the depth d of each of the multiple holes 20 may be substantially the same or may be different.
  • the arrangement pitch p (see FIG. 4) of the plurality of holes 20 may be 50 ⁇ m or more, 60 ⁇ m or more, or 70 ⁇ m or more. good. From the viewpoint of smooth division along the scribe line, the arrangement pitch p may be 120 ⁇ m or less, 110 ⁇ m or less, or 100 ⁇ m or less.
  • the array pitch p may be 50 ⁇ m to 120 ⁇ m, or 60 ⁇ m to 110 ⁇ m.
  • the arrangement pitch p may be 0.42 times or more, 0.5 times or more, or 0.6 times or more the opening diameter r.
  • the arrangement pitch p may be 2.4 times or less, 2.0 times or less, or 1.8 times or less the aperture diameter r.
  • the arrangement pitch p of the plurality of holes 20 along the scribe line is defined as the distance between the centers of the holes 20 that are adjacent to each other along the scribe line.
  • the plurality of holes 20 may be arranged along the scribe line so that the arrangement pitch p is substantially constant, or may be arranged along the scribe line such that the arrangement pitch p is partially different.
  • the physical strength against bending of the portion where the scribe line L1 or the scribe line L2 is formed can be evaluated by measuring the bending strength of the ceramic plate 100 by a three-point bending test.
  • the bending strength of a ceramic plate is a value measured by a three-point bending test conforming to JIS R 1601-2008.
  • the anvil 60 is mounted on the anvil 60 while one main surface of a test piece obtained by cutting out a portion of the ceramic plate 100 is supported by two supports 50A and 50B.
  • the bending strength of the test piece (ceramic plate) is measured while a load is applied to the other main surface by .
  • a load point LP (load line) applied to the test piece by the anvil 60 is set to extend along a direction perpendicular to the direction in which the supports 50A and 50B are arranged.
  • the supports 50A, 50B and the anvil 60 are arranged such that the load point LP is positioned between the two fulcrums SP1, SP2 (two support lines) of the two supports 50A, 50B.
  • a load is applied to the test piece while increasing the load from the anvil 60, and the value of the load when the test piece breaks (breaks) is measured as the bending strength.
  • the first bending strength N1 is 380 MPa or more when the first bending strength N1 is a measured value defined below.
  • First bending strength N1 The main surface 100A on which the scribe lines L1 (L2) are formed is supported by two fulcrums SP1 and SP2, and the scribe lines L1 (L2) are along the load point LP applied to the main surface 100B.
  • FIG. 7(b) shows an example of the arrangement of the test piece (hereinafter referred to as "test piece 110") of the ceramic plate 100 when measuring the first bending strength N1.
  • test piece 110 a load is applied by the anvil 60 to the main surface 100B at positions corresponding to the scribe lines L1 (L2) on the main surface 100A.
  • principal surfaces corresponding to the principal surfaces 100A and 100B are also referred to as "main surfaces 100A and 100B.”
  • the test piece 110 is cut out from the ceramic plate 100, for example, so that one side is 40 mm and the scribe line L1 (L2) is positioned substantially in the center.
  • the first bending strength N1 may be 385 MPa or higher, 390 MPa or higher, 395 MPa or higher, or 400 MPa or higher.
  • Second bending strength N2 A value measured by a three-point bending test with the test piece of the ceramic plate 100 arranged so that the scribe line L1 (L2) does not exist between the two fulcrums SP1 and SP2.
  • test piece 120 the test piece of the ceramic plate 100 (hereinafter referred to as "test piece 120") for measuring the second bending strength N2 does not have a scribe line.
  • a test piece 120 is formed by cutting out a region of the ceramic plate 100 where neither of the scribe lines L1 and L2 are formed.
  • the test piece 120 is formed from the ceramic plate 100 before the scribe lines L1 and L2 are formed. That is, the second bending strength N2 measured using the test piece 120 indicates the bending strength of the base material itself forming the ceramic plate 100 .
  • the first bending strength N1 may be 392MPa to 560MPa. In one example, if the second bending strength N2 is 750 MPa, the first bending strength N1 may be 380-420 MPa, or 385-415 MPa. The first bending strength N1 may be 0.54 times or less, 0.52 times or less, or 0.50 times or less the second bending strength N2.
  • the opening diameter r of each of the plurality of holes 20 and the plurality of The depth d of each hole 20 and the arrangement pitch p of the plurality of holes 20 are adjusted.
  • a specific example of a method for adjusting these dimensions will be described later.
  • the ceramic plate 100 (scribe lines L1, L2) is formed such that the first bending strength N1, the opening diameter r, the depth d, and the array pitch p all fall within the numerical ranges described above. be done. In such a ceramic plate 100, both maintenance of mechanical strength and smooth division along the scribe lines L1 and L2 are achieved.
  • the depth d, the arrangement pitch p, and the opening diameter r have been described as an example.
  • the value of the first bending strength N1 (relationship with the second bending strength N2) may be adjusted by adjusting the opening area, depth, pitch, and the like.
  • the length of the short side of the ceramic plate 100 is, for example, 100 mm or more.
  • the length of the short side of the ceramic plate 100 may be 110 mm or longer, 130 mm or longer, or 150 mm or longer.
  • the length of the long side of the ceramic plate 100 is, for example, 150 mm or longer.
  • the length of the long side of the ceramic plate 100 may be 170 mm or longer, 190 mm or longer, or 220 mm or longer.
  • the main surfaces 100A and 100B may be squares with sides of 100 mm to 220 mm in length.
  • the ceramic plate 100 may have a short side length of 100 mm to 150 mm and a long side length of 150 mm to 220 mm. In this case, in order to maintain the mechanical strength of the ceramic plate 100, the first bending strength N1 is adjusted to 380 MPa or more. The ceramic plate 100 may have a short side longer than 150 mm and a long side longer than 220 mm. In this case, in order to maintain the mechanical strength of the ceramic plate 100, the first bending strength N1 may be adjusted to 400 MPa or more.
  • the manufacturing process of the circuit board includes a manufacturing process (manufacturing method) of the ceramic plate 100 .
  • FIG. 8 is a flow chart showing an example of a method for manufacturing a circuit board.
  • a condition is selected (determined) from a plurality of processing conditions for forming scribe lines on main surface 100A of ceramic plate 100 (S01).
  • scribe lines L1 and L2 are formed on main surface 100A according to selected conditions (hereinafter referred to as "setting conditions").
  • the processing conditions for forming the scribe lines include the opening diameter r of each of the plurality of holes 20 on the main surface 100A, the depth d of each of the plurality of holes 20, and the plurality of holes 20 along the scribe lines L1 (L2). contains an array pitch p of The details of the method of selecting setting conditions will be described later.
  • a substrate containing a ceramic material for example, silicon nitride powder or aluminum nitride powder
  • the base material can be produced, for example, by the following procedure.
  • a green sheet is obtained by forming a slurry containing silicon nitride powder or aluminum nitride powder, binder resin, sintering aid, plasticizer, dispersant, solvent, and the like.
  • Sintering aids include rare earth metals, alkaline earth metals, metal oxides, fluorides, chlorides, nitrates, sulfates, and the like. These may be used alone or in combination of two or more. By using a sintering aid, sintering of the inorganic compound powder can be promoted.
  • binder resins include methyl cellulose, ethyl cellulose, polyvinyl alcohol, polyvinyl butyral, and (meth)acrylic resins.
  • plasticizers include purified glycerin, glycerin trioleate, diethylene glycol, phthalic acid plasticizers such as di-n-butyl phthalate, and dibasic acid plasticizers such as di-2-ethylhexyl sebacate.
  • dispersants include poly(meth)acrylates, (meth)acrylic acid-maleate copolymers, and the like.
  • Solvents include organic solvents such as ethanol and toluene.
  • Examples of slurry forming methods include the doctor blade method and the extrusion method.
  • a green sheet is produced by such a method.
  • the green sheet is then degreased and sintered to obtain a substrate comprising silicon nitride or aluminum nitride.
  • the degreasing may be performed by heating the green sheet at, for example, 400° C. to 800° C. for 0.5 to 20 hours. This makes it possible to reduce the amount of residual organic matter (carbon) while suppressing oxidation and deterioration of silicon nitride or aluminum nitride.
  • Sintering may be performed by heating the green sheet at 1700° C. to 1900° C. in a non-oxidizing gas atmosphere such as nitrogen, argon, ammonia or hydrogen.
  • the above-mentioned degreasing and sintering may be performed while a plurality of green sheets are laminated.
  • a release layer made of a release agent may be provided between the green sheets in order to facilitate separation of the sheets after firing.
  • Boron nitride (BN) for example, can be used as the release agent.
  • the release layer may be formed, for example, by applying a boron nitride powder slurry by a method such as spraying, brushing, roll coating, or screen printing.
  • the number of green sheets to be laminated may be, for example, 10 to 100 or 20 to 80 from the viewpoint of efficient mass production of the base material and sufficient progress of degreasing.
  • a step (S03) of forming scribe lines using a laser beam is performed on the surface of the substrate obtained in the step (S02) according to the conditions set in the step (S01). Specifically, the surface of the substrate obtained in the step (S02) is irradiated with a laser beam to form a plurality of holes, thereby scribing the main surface 100A as shown in FIGS. A ceramic plate 100 having lines L1 and L2 is formed. Examples of laser light include carbon dioxide laser, YAG laser, and fiber laser. Each of the plurality of holes 20 shown in FIGS. 4 and 5 is formed by irradiating the laser light in a plurality of times.
  • the holes 20 may be formed in burst pulse mode or in cycle pulse mode. Burst pulse mode is performed in the following procedure. A first hole 20 is formed by irradiating the same position with laser light in a plurality of times. Subsequently, the second hole 20 is formed by irradiating the laser light several times so as to be adjacent to the first hole 20 . This forms two holes 20 adjacent to each other. This procedure is repeated multiple times to form n holes 20 (n is a positive integer equal to or greater than 2). In this manner, a scribe line L1 (L2) composed of n holes 20 can be formed. When the laser beam is irradiated twice to form one hole 20 , the laser beam is divided into (2 ⁇ n) times to form n holes 20 .
  • the cycle pulse mode is performed, for example, by the following procedure.
  • the first to n-th holes 20 are formed by one laser beam irradiation. After that, the first to n-th holes 20 are again irradiated with laser light once. In this case also, the laser beam is applied (2 ⁇ n) times in order to form n holes 20 .
  • the laser beam may be irradiated three times or more to form each hole 20 . From the viewpoint of work efficiency, the number of laser beam irradiations for forming each hole 20 may be 10 times or less.
  • the method of forming the holes 20 is not limited to the above two methods. For example, burst pulse mode and cycle pulse mode may be combined.
  • the irradiation interval of the multiple times of laser light irradiation for forming one hole 20 is 1200 ⁇ s or more (850 Hz or less) in order to secure the cooling time of the ceramic plate 100 heated by the laser light irradiation. 1500 ⁇ s or more (670 Hz or less).
  • the energy of the laser light irradiated per time may be less than 70 mJ, may be 50 mJ or less, or may be 30 mJ or less. By reducing the energy irradiated per time in this manner, burning of the ceramic plate (formation of an oxygen-rich layer, which is a foreign substance) can be suppressed. From the viewpoint of efficiently forming the holes 20, the energy of the laser beam irradiated per time may be 5 mJ or more, or may be 10 mJ or more.
  • the pulse width of the laser light may be 30 ⁇ s to 200 ⁇ s from the viewpoint of reducing damage to the ceramic plate 100 while forming a sufficiently large hole 20 in the main surface 100A of the ceramic plate 100. seconds to 150 ⁇ s.
  • the ceramic plate 100 can be obtained.
  • the scribe lines L1 and L2 will be cutting lines when dividing the ceramic plate 100 (circuit board) in a later process.
  • the method for manufacturing the ceramic plate 100 includes the steps (S01 to S03) described above.
  • a step (S04) of applying paste brazing material to the pair of main surfaces 100A and 100B of the ceramic plate 100 is performed.
  • the main surfaces 100A and 100B of the ceramic plate 100 are coated with a paste-like brazing material by a roll coater method, a screen printing method, a transfer method, or the like.
  • the brazing material contains, for example, metal components such as silver and titanium, an organic solvent, a binder, and the like.
  • the brazing material may have a viscosity of, for example, 5 Pa ⁇ s to 20 Pa ⁇ s.
  • the content of the organic solvent in the brazing material may be, for example, 5% to 25% by mass, and the content of the binder may be, for example, 2% to 15% by mass.
  • FIG. 9 is a perspective view showing an example of the ceramic plate 100 to which the brazing material 140 is applied. As shown in FIG. 9, the brazing material 140 may be applied to each compartment 10 independently. Although only the main surface 100A side is shown in FIG. 9, the brazing material 140 may be applied to the main surface 100B side as well. A brazing material may be applied to the entire surface of the main surface 100A and the main surface 100B.
  • a step (S05) of forming a composite substrate is performed by bonding a pair of metal plates to the ceramic plate 100 coated with the brazing material 140 .
  • metal plates are attached to the principal surfaces 100A and 100B of the ceramic plate 100 coated with the brazing filler metal 140 to obtain a joined body.
  • the bonded body is heated in a heating furnace to sufficiently bond the ceramic plate 100 and the pair of metal plates, thereby obtaining a composite substrate.
  • FIG. 10 is a perspective view showing an example of a composite substrate according to one embodiment.
  • the composite substrate 200 includes a pair of metal plates 210 arranged to face each other, and a ceramic plate 100 positioned between the pair of metal plates 210 .
  • a pair of metal plates 210 are joined to the ceramic plate 100 so as to cover the principal surfaces 100A and 100B of the ceramic plate 100 .
  • Metal plate 210 may be a copper plate.
  • the shape and size of the ceramic plate 100 and the metal plate 210 may be the same or different.
  • the method for manufacturing the composite substrate 200 includes the steps (S01 to S05) described above.
  • step (S06) a resist pattern is formed by photolithography. Specifically, first, a photosensitive resist is printed on the surface of the composite substrate. Then, a resist pattern having a predetermined shape is formed using an exposure device. The resist may be negative or positive. Uncured resist is removed, for example, by washing.
  • FIG. 11 is a perspective view showing an example of a composite substrate 200 having a resist pattern 230 formed on its surface 200A. Although FIG. 11 shows only the surface 200A side, a similar resist pattern may be formed on the surface 200B side as well.
  • the resist pattern 230 is formed on the surface 200 ⁇ /b>A and the surface 200 ⁇ /b>B in areas corresponding to the partitions 10 of the ceramic plate 100 .
  • an etching step (S07) is performed to remove portions of the metal plate 210 that are not covered with the resist pattern 230 .
  • the main surface 100A and the main surface 100B of the ceramic plate 100 are exposed at this portion.
  • the resist pattern 230 is removed to form an independent conductor for each partition 10 .
  • a circuit board is obtained by the above steps (S01 to S07).
  • FIG. 12 is a perspective view showing an example of a circuit board 300 according to one embodiment.
  • the circuit board 300 includes a ceramic plate 100 and conductor portions 250 arranged to face each other with the ceramic plate 100 interposed therebetween.
  • the conductor part 250 is provided independently for each partition part 10 on the main surface 100A and the main surface 100B. That is, a pair of conductor portions 250 arranged to face each other is provided for each partition portion 10 .
  • the circuit board 300 is divided (cut) along the scribe lines L1 and L2 into a plurality of divided boards.
  • Each divided board (each circuit board in a divided state) is used as a component such as a power module.
  • an electronic component is mounted on the conductor portion 250 of the divided substrate.
  • FIG. 13 is a flow chart showing an example of a method for setting conditions in the above step (S01).
  • this method of setting conditions at least one of the various conditions included in the processing conditions (set values of opening diameter r, depth d, and array pitch p) is changed in multiple stages, and at each stage of change, A plurality of evaluation ceramic plates are produced as evaluation samples.
  • a plurality of evaluation ceramic plates are produced as evaluation samples.
  • at least one of various conditions is set to a mutually different value.
  • the arrangement pitch p is changed in steps while the opening diameter r and the depth d are fixed to a constant value will be exemplified. It should be noted that which condition is to be changed and the width to be changed may be set in advance by an operator or the like.
  • processing conditions are set to initial values, and scribe lines for evaluation composed of a plurality of holes are formed according to the processing conditions, thereby fabricating a ceramic plate for evaluation (S11). .
  • evaluation ceramic plates are repeatedly manufactured under the same processing conditions until a predetermined number (for example, 2 to 10) of evaluation ceramic plates are manufactured under one processing condition (S11, S12).
  • a predetermined number for example, 2 to 10
  • evaluation ceramic plates are produced, and evaluation items described later, for example, can be evaluated using average values.
  • the bending strength of a plurality of evaluation ceramic plates is evaluated (S15). Specifically, first, the above-described second bending strength N2 (strength against bending of the base material itself which is not affected by the scribe line) is measured for the ceramic plate for evaluation by a three-point bending test. Any evaluation ceramic plate may be used when measuring the second bending strength N2. In addition, the second bending strength N2 may be measured before the step (S11). Next, the first bending strength N1 (strength against bending of the scribe line forming portion) is measured by a three-point bending test for each step (for each processing condition) in which the arrangement pitch p is changed.
  • the bending strength measurement method for the evaluation ceramic plate is the same as the measurement method for the ceramic plate 100 described above.
  • the first bending strength N1 is measured by a three-point bending test using a test piece obtained from each of a plurality of ceramic plates for evaluation at each stage in which the arrangement pitch p is changed. Then, the average value of the measured values of each test piece obtained from a plurality of evaluation ceramic plates is calculated as the first bending strength N1 for the stage (processing condition).
  • a condition in which the first bending strength N1 falls within a predetermined numerical range is selected as a setting condition from among the changed processing conditions (out of a plurality of processing conditions) (S16). More specifically, among the plurality of steps (values) that are changed for the arrangement pitch p, the value at which the first bending strength N1 is 380 MPa or more and 0.56 times or less than the second bending strength N2 is selected. In addition, when there are multiple conditions included in the above numerical range, any one value may be selected by the operator. Through the above steps (S11 to S16), a combination of various conditions is selected such that the first bending strength N1 is 380 MPa or more and 0.56 times or less as large as the second bending strength N2. Then, as described above, scribe lines L1 and L2 are formed on main surface 100A according to the selected conditions (setting conditions).
  • the evaluation result of the first bending strength N1 is the average value of the first bending strength N1 measured for each of the five ceramic plates for evaluation.
  • the evaluation result of the first bending strength N1 is the average value of the first bending strength N1 measured for each of the five ceramic plates for evaluation.
  • the second bending strength N2 of the evaluation ceramic plate was 750 MPa. From the above evaluation results, in conditions 2, 3, and 4, the first bending strength N1 is within the range of 380 MPa to 420 MPa. Therefore, in this case, 85 ⁇ m, 100 ⁇ m or 115 ⁇ m is selected as the set value of the array pitch p.
  • the ceramic plate 100 is a ceramic plate having a main surface 100A, a main surface 100B, and scribe lines L1 and L2 formed by a plurality of holes 20 formed in the main surface 100A. At least a part of the ceramic plate 100 is adjusted so that the first bending strength N1 is supported by the two fulcrums SP1 and SP2 of the main surface 100A, and the scribe lines L1 and L2 are along the load point LP applied to the main surface 100B.
  • the second bending strength N2 is a value measured by a three-point bending test in the arranged state, and at least a part of the ceramic plate 100 is arranged so that no scribe line exists between the two fulcrums SP1 and SP2.
  • the first bending strength N1 is not less than 380 MPa and not more than 0.56 times the second bending strength N2 as measured by a three-point bending test.
  • the ceramic plate 100 described above the lower limit of the first bending strength N1 is adjusted to the above value with respect to the scribe lines L1 and L2, so that the ceramic plate 100 is hard to break.
  • the ceramic plate 100 described above is useful for stabilizing the quality of the circuit board and improving the yield.
  • the maximum length (opening diameter r) of each of the plurality of holes 20 in the direction perpendicular to the scribe lines L1 and L2 on the main surface 100A is 50 ⁇ m to 120 ⁇ m, and the depth d of each of the plurality of holes 20 is the ceramic plate. It may be 1/6 to 1/3 times the thickness T of 100, and the array pitch p of the plurality of holes 20 along the scribe lines L1 and L2 may be 50 ⁇ m to 120 ⁇ m. With respect to the scribe lines L1 and L2, in addition to adjusting the bending strength, the opening diameter r of the holes, the depth d of the holes, and the arrangement pitch p of the holes 20 are adjusted within the above ranges. Cracking of the plate 100 and generation of burrs during division are more reliably suppressed. Therefore, it is more useful for stabilizing the quality of the circuit board and improving the yield.
  • setting conditions are selected from processing conditions for forming the scribe lines L1 and L2 formed by the plurality of holes 20 on the main surface 100A of the ceramic plate 100. and forming scribe lines L1 and L2 on the surface of the substrate for the ceramic plate 100 using a laser beam according to set conditions.
  • the processing conditions include the maximum length (aperture diameter r) of each of the plurality of holes 20 in the direction perpendicular to the scribe lines L1 and L2 on the main surface 100A, the depth d of each of the plurality of holes 20, and the scribe lines L1 and L2.
  • the array pitch p of the plurality of holes 20 along L2 is included.
  • the step of selecting setting conditions includes forming a plurality of ceramic plates for evaluation in which scribe lines for evaluation composed of a plurality of holes 20 are formed on one main surface while changing processing conditions.
  • processing conditions are selected such that the first bending strength N1 is 380 MPa or more and 0.56 times or less as large as the second bending strength N2. Therefore, the first bending strength N1 of the ceramic plate 100 on which the scribe lines L1 and L2 are formed according to the selected processing conditions can also be adjusted within the above range.
  • the first bending strength N1 is 380 MPa or more
  • the ceramic plate is less likely to crack in various processes after forming the scribe line. Burrs are less likely to occur after splitting. Therefore, this manufacturing method is useful for stabilizing the quality of the circuit board formed of the ceramic plate and improving the yield.
  • each division part 10 does not need to be the same, and each division part 10 may have a different shape.
  • the ceramic plate 100 and the composite substrate may have a shape other than the quadrangular prism shape.
  • any surface treatment may be applied to the conductor portion 250 of the circuit board 300 .
  • a part of the surface of the conductor part 250 may be covered with a protective layer such as a solder resist, and the other part of the surface of the conductor part 250 may be plated.
  • SYMBOLS 100... Ceramic plate, 100A, 100B... Main surface, 20... Hole, L1, L2... Scribe line, r... Opening diameter of hole, d... Depth of hole, T... Thickness of ceramic plate, p... Plural holes array pitch.

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