WO2022176675A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
WO2022176675A1
WO2022176675A1 PCT/JP2022/004703 JP2022004703W WO2022176675A1 WO 2022176675 A1 WO2022176675 A1 WO 2022176675A1 JP 2022004703 W JP2022004703 W JP 2022004703W WO 2022176675 A1 WO2022176675 A1 WO 2022176675A1
Authority
WO
WIPO (PCT)
Prior art keywords
transistor
transistors
circuit pattern
region
connection portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/004703
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
洋 江草
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2023500740A priority Critical patent/JPWO2022176675A1/ja
Publication of WO2022176675A1 publication Critical patent/WO2022176675A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present disclosure relates to semiconductor devices.
  • Patent Document 1 As a semiconductor device used in a power module, a semiconductor device has been proposed in which two regions in a wiring connected to a plurality of transistors face each other in order to reduce variations in inductance among the plurality of transistors.
  • a semiconductor device of the present disclosure includes a P bus bar having a first main surface, an N bus bar having a second main surface, a plurality of first circuit patterns, a plurality of second circuit patterns, a plurality of first transistors, wherein each of the plurality of first circuit patterns includes a first connection portion connected to the P bus, and each of the plurality of second circuit patterns includes a second connection portion connected to the N bus.
  • each of the plurality of first transistors is electrically connected between the first connection portion and the second connection portion, and the first main surface and the second main surface are parallel to each other; , at least a portion of the first main surface and at least a portion of the second main surface face each other, and between the plurality of first transistors, from the first connecting portion via the first transistor , the inductance in the current path leading to the second connecting portion is equivalent.
  • FIG. 1 is a top view showing the semiconductor device according to the first embodiment.
  • FIG. 2 is a cross-sectional view (Part 1) showing the semiconductor device according to the first embodiment.
  • FIG. 3 is a cross-sectional view (part 2) showing the semiconductor device according to the first embodiment.
  • FIG. 4 is a circuit diagram showing the semiconductor device according to the first embodiment.
  • FIG. 5 is a diagram showing an example of current paths in the semiconductor device according to the first embodiment.
  • FIG. 6 is a top view showing the semiconductor device according to the second embodiment.
  • FIG. 7 is a top view showing the semiconductor device according to the third embodiment.
  • FIG. 8 is a top view showing the semiconductor device according to the fourth embodiment.
  • An object of the present disclosure is to provide a semiconductor device capable of reducing variations in inductance.
  • a semiconductor device includes a P busbar having a first main surface, an N busbar having a second main surface, a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of first transistors, wherein the plurality of first circuit patterns each include a first connection portion connected to the P bus, and the plurality of second circuit patterns are each connected to the N bus.
  • each of the plurality of first transistors is electrically connected between the first connection portion and the second connection portion, and the first main surface and the second at least a portion of the first main surface and at least a portion of the second main surface face each other; between the plurality of first transistors, from the first connecting portion; The inductance in the current path through the first transistor to the second connection is equivalent.
  • the first main surface and the second main surface are parallel, and at least part of the first main surface and at least part of the second main surface face each other. Therefore, the current flowing through the P bus to the first connection and the current flowing from the second connection to the N bus are opposite to each other. magnetic fields cancel each other out. Therefore, the difference in inductance between the P bus and the N bus is almost eliminated. Therefore, the inductances on the P bus and the N bus are equivalent among the plurality of transistors. In addition, among the plurality of first transistors, the inductances in the current paths from the first connecting portion to the second connecting portion via the first transistors are equivalent. Therefore, variations in inductance among the plurality of first transistors can be reduced.
  • a plurality of second transistors are provided, and the plurality of second transistors are connected in series to the first transistor between the first connection section and the second connection section, respectively. and an inductance in a current path from the first connecting portion to the second connecting portion via the first transistor and the second transistor between the plurality of sets of the first transistors and the second transistors may be equivalent. In this case, variations in inductance among the plurality of second transistors can be reduced.
  • the first transistor is provided on the first circuit pattern
  • the second transistor is provided on the third circuit pattern.
  • the first transistor can easily dissipate heat through the first circuit pattern
  • the second transistor can easily dissipate heat through the third circuit pattern.
  • the first circuit pattern, the third circuit pattern and the second circuit extending from the first connection portion to the second connection portion via the first transistor and the second transistor A shape of a portion of a pattern through which current flows may be equivalent among a plurality of pairs of the first transistors and the second transistors.
  • the first circuit pattern and the second circuit pattern are provided between the plurality of sets.
  • the positions of the first transistor and the second transistor on the circuit pattern and the third circuit pattern are different. Therefore, the inductance tends to vary.
  • the inductance of the portion where the current flows is set between the plurality of sets of the first transistors and the second transistors. Easy to align.
  • a plurality of third transistors and a plurality of fourth transistors are provided, and the plurality of third transistors are connected between the first connection section and the second connection section, respectively.
  • the plurality of fourth transistors are electrically connected in parallel to the first transistor and the second transistor, and each of the plurality of fourth transistors is in series with the third transistor between the first connection and the second connection.
  • the current capacity can be increased while reducing variations in inductance among the plurality of second transistors and variations in inductance among the plurality of fourth transistors.
  • a set of the first transistor and the second transistor and a set of the third transistor and the fourth transistor can be provided between one first connection portion and one second connection portion. Therefore, if the total number of transistors is the same, the numbers of the first connecting portion and the second connecting portion can be reduced.
  • the first circuit pattern, the third circuit pattern and the second circuit extending from the first connection portion to the second connection portion via the first transistor and the second transistor a shape of a portion of a pattern through which current flows;
  • the shape of the portion through which the current flows in the two circuit patterns may be equivalent between the set of the plurality of first transistors and the second transistors and the set of the plurality of third transistors and the fourth transistor. good. In this case, it is easy to match the inductance of the portion through which the current flows among the sets of the plurality of third transistors and fourth transistors.
  • the first circuit pattern, the third circuit pattern, and the second circuit pattern are symmetrical about the straight line connecting the first connection portion and the second connection portion.
  • the shape of the portion through which the current flows is axisymmetric
  • the set of the first transistor and the second transistor is arranged on the first direction side of the axis of symmetry
  • the first direction of the axis of symmetry is opposite to the first direction
  • a set of the third transistor and the fourth transistor may be arranged on the second direction side of the . In this case, it is easy to make the inductance in the current path of the set of the first and second transistors equivalent to the inductance in the current path of the set of the third and fourth transistors.
  • a plurality of pairs of the third transistor and the fourth transistor may be connected between the first connection portion and the second connection portion.
  • the inductances can be uniform among the plurality of third transistors, and the inductances can be uniform among the plurality of fourth transistors.
  • the current capacity can be increased while reducing variations in inductance.
  • a plurality of said second transistors may be connected between said first connecting part and said second connecting part.
  • the inductances can be made uniform among the plurality of second transistors.
  • the current capacity can be increased while reducing variations in inductance.
  • a plurality of the first transistors may be connected between the first connecting portion and the second connecting portion.
  • the inductances can be made uniform among the plurality of first transistors.
  • the current capacity can be increased while reducing variations in inductance.
  • the first connecting portion and the second connecting portion have the first main surface of the P bus and the second main surface of the N bus facing each other. It may be placed within the section. Since the inductance between the P bus and the N bus is canceled, no difference in inductance occurs in the section where the first main surface and the second main surface face each other. Therefore, by arranging the first connection portion and the second connection portion within this section, it is possible to further reduce variations in inductance.
  • a diode may be connected in parallel to any one of the first transistor, the second transistor, the third transistor, or the fourth transistor.
  • the current can be circulated not only in the body diode of the transistor, but also in the diode.
  • an insulated gate bipolar transistor (IGBT) having no body diode or the like can be used as the transistor.
  • a plane including the X1-X2 direction and the Y1-Y2 direction is the XY plane
  • a plane including the Y1-Y2 direction and the Z1-Z2 direction is the YZ plane
  • a plane including the Z1-Z2 direction and the X1-X2 direction is the ZX plane.
  • the Z1 direction is defined as the upward direction
  • the Z2 direction is defined as the downward direction.
  • planar viewing means viewing an object from the Z1 side.
  • equivalent inductance means that one inductance is 50% or more and 150% or less of the other inductance. For example, if one inductance is 20 nH and the other inductance is 10 nH or more and 30 nH, it can be said that these inductances are equivalent.
  • equivalent current paths mean that the inductance of one current path is 50% or more and 150% or less of the inductance of the other current path.
  • FIG. 1 is a top view showing the semiconductor device according to the first embodiment.
  • 2 and 3 are cross-sectional views showing the semiconductor device according to the first embodiment. 2 shows a cross section along line II-II in FIG. 1, and
  • FIG. 3 shows a cross section along line III-III in FIG.
  • FIG. 4 is a circuit diagram showing the semiconductor device according to the first embodiment.
  • the semiconductor device 100 mainly includes an insulating substrate 1, an O bus 10, a P bus 11, an N bus 12, a first transistor Tr1, and a first transistor Tr1. It has two transistors Tr2, a third transistor Tr3, and a fourth transistor Tr4.
  • the O bus 10 is connected to the O terminal
  • the P bus 11 is connected to the P terminal
  • the N bus 12 is connected to the N terminal.
  • the semiconductor device 100 includes a first region 21, a second region 22, and a third region 23 arranged in the X1-X2 direction.
  • the second region 22 is arranged on the X1 side of the third region 23
  • the first region 21 is arranged on the X1 side of the second region 22 .
  • a first circuit pattern 31, a second circuit pattern 32, and a third circuit pattern 33 are formed on the Z1 side surface of the insulating substrate 1 in each of the first region 21, the second region 22, and the third region 23. It is
  • the first circuit pattern 31, the second circuit pattern 32, and the third circuit pattern 33 are symmetrical about a straight line extending in the Y1-Y2 direction in each of the first region 21, the second region 22, and the third region 23 in plan view.
  • the first circuit pattern 31 has a convex shape in plan view, and includes a convex portion 31A that protrudes toward the Y1 side.
  • the second circuit pattern 32 has a rectangular shape in plan view, and is arranged on the Y1 side of the convex portion 31A.
  • the third circuit pattern 33 has a concave shape in plan view, and includes a concave portion 33A that is concave from the Y2 side to the Y1 side.
  • a convex portion 31A and a second circuit pattern 32 are arranged inside the concave portion 33A.
  • the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33 have the same shape and size. Further, the positions of the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33 in the Y1-Y2 direction are the same among the first area 21, the second area 22 and the third area 23.
  • FIG. 1 is a diagrammatic representation of the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33 in the Y1-Y2 direction.
  • the first transistor Tr1, the second transistor Tr2, the third transistor Tr3, and the fourth transistor Tr4 are provided in the first area 21, the second area 22, and the third area 23, respectively.
  • the first transistor Tr 1 and the third transistor Tr 3 are provided on the first circuit pattern 31
  • the second transistor Tr 2 and the fourth transistor Tr 4 are provided on the third circuit pattern 33 .
  • Each drain of the first transistor Tr1 and the third transistor Tr3 is connected to the first circuit pattern 31 via a bonding material such as solder
  • each drain of the second transistor Tr2 and the fourth transistor Tr4 is connected to a bonding material such as solder.
  • Each drain may be bonded to each circuit pattern with a sintered material containing silver (Ag) or copper (Cu).
  • Each drain may be indirectly connected to each circuit pattern via a wire.
  • the first transistor Tr1 is arranged on the X1 side of the convex portion 31A, and the third transistor Tr3 is arranged on the X2 side of the convex portion 31A.
  • the first transistor Tr1 and the third transistor Tr3 are arranged symmetrically with respect to the straight line extending in the Y1-Y2 direction common to the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33.
  • the second transistor Tr2 is arranged on the X1 side of the recess 33A
  • the fourth transistor Tr4 is arranged on the X2 side of the recess 33A.
  • the second transistor Tr2 and the fourth transistor Tr4 are arranged symmetrically with respect to the straight line extending in the Y1-Y2 direction common to the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33.
  • the X1 side is an example of the first direction side
  • the X2 side is an example of the second direction side.
  • the first transistor Tr1 and the third transistor Tr3 are arranged on one straight line extending in the X1-X2 direction, and the second transistor Tr2 and the fourth transistor Tr4 are arranged on another straight line extending in the X1-X2 direction. It is
  • the semiconductor device 100 has multiple first wires 41 , multiple second wires 42 , multiple third wires 43 , and multiple fourth wires 44 .
  • a first wire 41 connects the source of the first transistor Tr1 and the third circuit pattern 33 .
  • a second wire 42 connects the source of the second transistor Tr2 and the second circuit pattern 32 .
  • a third wire 43 connects the source of the third transistor Tr3 and the third circuit pattern 33 .
  • a fourth wire 44 connects the source of the fourth transistor Tr4 and the second circuit pattern 32 .
  • a metal plate such as a copper (Cu) plate may be used instead of the wire.
  • the P busbar 11 has a flat plate portion 11A and three contact portions 11B.
  • the flat plate portion 11A has a first main surface 11C perpendicular to the Y1-Y2 direction and extends in the X1-X2 direction.
  • the flat plate portion 11A is arranged so as to overlap with the convex portion 31A in plan view.
  • the position of the flat plate portion 11A is preferably close to the Y1 side end of the convex portion 31A in plan view.
  • 11 C of 1st main surfaces are main surfaces by the side of Y1 of 11 A of flat plate parts.
  • the flat plate portion 11A is separated from the first circuit pattern 31 and the third circuit pattern 33 on the Z1 side.
  • the three contact portions 11B extend from the Z2 side end of the flat plate portion 11A and are bent toward the Y2 side.
  • the three contact portions 11B are connected to the convex portion 31A via a bonding material such as solder in the first region 21, the second region 22 and the third region 23, respectively.
  • a portion of the convex portion 31A to which the contact portion 11B is connected is an example of a first connection portion.
  • the N busbar 12 has a flat plate portion 12A and three contact portions 12B.
  • the flat plate portion 12A has a second major surface 12C perpendicular to the Y1-Y2 direction and extends in the X1-X2 direction.
  • the flat plate portion 12A is arranged so as to overlap the second circuit pattern 32 in plan view.
  • the position of the flat plate portion 12A is preferably close to the end of the second circuit pattern 32 on the Y2 side in plan view.
  • the second main surface 12C is the main surface on the Y2 side of the flat plate portion 12A.
  • the first main surface 11C and the second main surface 12C are parallel, and at least part of the first main surface 11C and at least part of the second main surface 12C face each other.
  • the flat plate portion 12A is separated from the second circuit pattern 32 and the third circuit pattern 33 on the Z1 side.
  • the three contact portions 12B extend from the Z2 side end of the flat plate portion 12A and are bent toward the Y1 side.
  • the three contact portions 12B are connected to the second circuit pattern 32 via a bonding material such as solder within the first region 21, the second region 22, and the third region 23, respectively.
  • a portion of the second circuit pattern 32 to which the contact portion 12B is connected is an example of a second connection portion.
  • the flat plate portion 11A and the flat plate portion 12A overlap above the insulating substrate 1 when viewed from the Y1-Y2 direction.
  • the distance between the first major surface 11C and the second major surface 12C is preferably 5 mm or less, more preferably 3 mm or less.
  • An insulating sheet 13 is arranged between the P bus 11 and the N bus 12 .
  • the O busbar 10 has a flat plate portion 10A and three contact portions 10B.
  • the flat plate portion 10A extends in the X1-X2 direction.
  • the flat plate portion 10A is arranged so as to overlap the third circuit pattern 33 in plan view.
  • the flat plate portion 10A is separated from the third circuit pattern 33 on the Z1 side.
  • the three contact portions 10B extend from the Z2 side end of the flat plate portion 10A and are bent toward the Y2 side.
  • the three contact portions 10B are connected to the third circuit pattern 33 via a bonding material such as solder in the first region 21, the second region 22 and the third region 23, respectively.
  • the first transistor Tr1 and the third transistor Tr3 are connected between the P bus 11 and the O bus 10
  • a second transistor Tr2 and a fourth transistor Tr4 are connected between the N bus 12 and the O bus 10 .
  • the first transistor Tr1, the second transistor Tr2, the third transistor Tr3, and the fourth transistor Tr4 are MOS (metal-oxide-semiconductor) field effect transistors (FETs) and include body diodes.
  • FIG. 5 is a diagram showing an example of current paths in the semiconductor device according to the first embodiment.
  • the transistor on one arm turns off, the current is commutated to the diode on the other arm (the body diode or the diode connected in parallel with the transistor), and the current decreases. Therefore, the change in current per unit time (di/dt) in the path from the P bus 11 to the N bus 12 and back to the capacitor (not shown) connected between the P bus 11 and the N bus 12 is become a big thing.
  • a first circuit pattern 31 In the first region 21, from the contact portion 11B of the P bus 11, a first circuit pattern 31, a first transistor Tr1, a first wire 41, a third circuit pattern 33, a second transistor Tr2, a second There is a current path 91 that reaches the contact portion 12B of the N bus 12 via the wire 42 and the second circuit pattern 32 .
  • a first circuit pattern 31 In the first region 21, from the contact portion 11B of the P bus 11, a first circuit pattern 31, a third transistor Tr3, a third wire 43, a third circuit pattern 33, a fourth transistor Tr4, a second There is also a current path 92 through wire 42 and second circuit pattern 32 to contact portion 12B of N busbar 12 . Similar current paths 91 and 92 are also present in the second region 22 and the third region 23 .
  • a first circuit pattern 31, a second circuit pattern 32, a third circuit pattern 33, a first transistor Tr1, a second transistor Tr2, a third A transistor Tr3 and a fourth transistor Tr4 are arranged. Therefore, the inductance in current path 91 and the inductance in current path 92 are equivalent to each other.
  • the inductance in the current path 91 and the inductance in the current path 92 are equivalent to each other, and in the third area 23 , the inductance in the current path 91 and the inductance in the current path 92 are equivalent to each other.
  • the inductances of the three current paths 91 and the inductances of the three current paths 92 are equivalent to each other also between the first region 21, the second region 22, and the third region 23.
  • the contact portion 11B and the contact portion 12B are provided in the section where the first main surface 11C of the P busbar 11 and the second main surface 12C of the N busbar 12 face each other. Since the inductance between the P bus 11 and the N bus 12 is canceled out, no difference in inductance occurs in the section where the first main surface 11C and the second main surface 12C face each other. Therefore, by arranging the contact portion 11B and the contact portion 12B within this section, it is possible to further reduce variations in inductance.
  • the first main surface 11C and the second main surface 12C are parallel, and at least a portion of the first main surface 11C and at least a portion of the second main surface 12C facing each other. Therefore, the inductances of the P bus 11 and the N bus 12 are equivalent among the first region 21 , the second region 22 and the third region 23 . Furthermore, the inductances in the three current paths 91 and the inductances in the three current paths 92 are equivalent to each other among the first region 21, the second region 22, and the third region 23. FIG. Therefore, the inductance can be made uniform among the plurality of first transistors Tr1.
  • the inductances can be uniform among the plurality of second transistors Tr2, the inductances can be uniform among the plurality of third transistors Tr3, and the inductances can be uniform among the plurality of fourth transistors Tr4. .
  • At least a portion of the first main surface 11C and at least a portion of the second main surface 12C are arranged between two sets positioned at both ends of the plurality of sets of the contact portions 11B and the contact portions 12B. They are preferably facing each other. Moreover, above the insulating substrate 1, it is more preferable that the first main surface 11C and the second main surface 12C are opposed to each other.
  • a first transistor Tr 1 and a third transistor Tr 3 are provided on the first circuit pattern 31
  • a second transistor Tr 2 and a fourth transistor Tr 4 are provided on the third circuit pattern 33 . Therefore, the first transistor Tr1 and the third transistor Tr3 easily release heat through the first circuit pattern 31, and the second transistor Tr2 and the fourth transistor Tr4 easily release heat through the third circuit pattern 33.
  • FIG. 1 A first transistor Tr 1 and a third transistor Tr 3 are provided on the first circuit pattern 31
  • a second transistor Tr 2 and a fourth transistor Tr 4 are provided on the third circuit pattern 33 . Therefore, the first transistor Tr1 and the third transistor Tr3 easily release heat through the first circuit pattern 31, and the second transistor Tr2 and the fourth transistor Tr4 easily release heat through the third circuit pattern 33.
  • the inductance in the current path 91 and the inductance in the current path 92 are equivalent between the set of the plurality of first transistors Tr1 and the second transistors Tr2 and the set of the plurality of the third transistors Tr3 and the fourth transistors Tr4. Therefore, the inductance can be made uniform between the first transistor Tr1 and the third transistor Tr3, and the inductance can be made uniform between the second transistor Tr2 and the fourth transistor Tr4.
  • a set of the first transistor Tr1 and the second transistor Tr2 and a set of the third transistor Tr3 and the fourth transistor Tr4 can be provided between one contact portion 11B and one contact portion 12B. Therefore, if the total number of transistors is the same, the number of contact portions 11B and contact portions 12B can be reduced.
  • the shape of the portion through which the current flows of the first circuit pattern 31, the second circuit pattern 32, and the third circuit pattern 33 from the contact portion 11B to the contact portion 12B via the first transistor Tr1 and the second transistor Tr2 is the shape of the first circuit pattern. Equivalent between the region 21, the second region 22, and the third region 23, that is, between a plurality of pairs of the first transistors Tr1 and the second transistors Tr2. When a plurality of pairs of the first transistor Tr1 and the second transistor Tr2 are provided electrically in parallel between one contact portion 11B and one contact portion 12B, the first circuit pattern 31 and the second transistor Tr2 are arranged between the plurality of pairs. The positions of the first transistor Tr1 and the second transistor Tr2 on the two circuit patterns 32 and the third circuit pattern 33 are different.
  • the inductance tends to vary.
  • a plurality of pairs of the first circuit pattern 31, the second circuit pattern 32, and the third circuit pattern 33, in which the shapes of the current-flowing portions are equivalent are provided, a plurality of the first transistors Tr1 and the It is easy to match the inductance of the portion where the current flows between the set of two transistors Tr2.
  • the shape of the portion through which the current flows of the first circuit pattern 31, the second circuit pattern 32, and the third circuit pattern 33 from the contact portion 11B to the contact portion 12B via the third transistor Tr3 and the fourth transistor Tr4 is , between the first region 21, the second region 22 and the third region 23, that is, between the sets of the plurality of third transistors Tr3 and fourth transistors Tr4.
  • the first circuit pattern 31 and the first circuit pattern 31 are arranged between the plurality of sets.
  • the positions of the third transistor Tr3 and the fourth transistor Tr4 on the two circuit patterns 32 and the third circuit pattern 33 are different.
  • the inductance tends to vary.
  • the plurality of the third transistors Tr3 and the third transistors Tr3 it is easy to match the inductance of the portion where the current flows between the set of four transistors Tr4.
  • the shapes of the portions of the first circuit pattern 31, the second circuit pattern 32, and the third circuit pattern where current flows are symmetrical, and the set of the first transistor Tr1 and the second transistor Tr2 is arranged on the X1 side of the axis of symmetry. , a third transistor Tr3 and a fourth transistor Tr4 are arranged on the X2 side of the axis of symmetry. Therefore, it is easy to make the inductance in the current path 91 and the inductance in the current path 92 equivalent.
  • FIG. 6 is a top view showing the semiconductor device according to the second embodiment.
  • the semiconductor device 200 mainly includes an insulating substrate 1, an O bus 10, a P bus 11, an N bus 12, a first transistor Tr1, and a second transistor Tr2. and
  • the semiconductor device 200 includes a first region 21, a second region 22, a third region 23, a fourth region 24, a fifth region 25, and a sixth region 26 arranged in the X1-X2 direction.
  • the fifth region 25 is arranged on the X1 side of the sixth region 26, the fourth region 24 is arranged on the X1 side of the fifth region 25, the third region 23 is arranged on the X1 side of the fourth region 24, and the second
  • the region 22 is arranged on the X1 side of the third region 23 , and the first region 21 is arranged on the X1 side of the second region 22 .
  • a first circuit pattern 31 and a A second circuit pattern 32 and a third circuit pattern 33 are formed.
  • the first circuit pattern 31, the second circuit pattern 32, and the third circuit pattern 33 in the second embodiment are the axes of symmetry of the first circuit pattern 31, the second circuit pattern 32, and the third circuit pattern 33 in the first embodiment. It has a shape similar to that of the portion on the X1 side.
  • the first transistor Tr1 and the second transistor Tr2 are provided in the first region 21, the second region 22, the third region 23, the fourth region 24, the fifth region 25 and the sixth region 26, respectively.
  • the first transistor Tr ⁇ b>1 is provided on the first circuit pattern 31 and the second transistor Tr ⁇ b>2 is provided on the third circuit pattern 33 .
  • the drain of the first transistor Tr1 is connected to the first circuit pattern 31 via a bonding material such as solder, and the drain of the second transistor Tr2 is connected to the third circuit pattern 33 via a bonding material such as solder.
  • the P busbar 11 has a flat plate portion 11A and six contact portions 11B.
  • the six contact portions 11B protrude in the first region 21, the second region 22, the third region 23, the fourth region 24, the fifth region 25 and the sixth region 26 via a bonding material such as solder. It is connected to the section 31A.
  • the N busbar 12 has a flat plate portion 12A and six contact portions 12B.
  • the six contact portions 12B are connected to the first region 21, the second region 22, the third region 23, the fourth region 24, the fifth region 25 and the sixth region 26 via a bonding material such as solder. 2 are connected to the circuit pattern 32 .
  • the O busbar 10 has a flat plate portion 10A and six contact portions 10B.
  • the six contact portions 12B are connected to the first region 21, the second region 22, the third region 23, the fourth region 24, the fifth region 25 and the sixth region 26 via a bonding material such as solder. 3 are connected to the circuit pattern 33 .
  • the inductances can be uniform among the plurality of first transistors Tr1, and the inductances can be uniform among the plurality of second transistors Tr2.
  • the first transistor Tr1 or the second transistor Tr2 may not be provided.
  • the second wire 42 connects the second circuit pattern 32 and the third circuit pattern 33, even if the second transistor Tr2 is not provided, from the contact portion 11B via the first transistor Tr1, A current path is configured to reach the contact portion 12B.
  • the first wire 41 connects the first circuit pattern 31 and the second circuit pattern 32
  • the second transistor Tr2 can be connected from the contact portion 11B even if the first transistor Tr1 is not provided.
  • a current path is configured to reach the contact portion 12B via.
  • FIG. 7 is a top view showing the semiconductor device according to the third embodiment.
  • a first transistor Tr1, a second transistor Tr2, a third transistor Tr3 and a third transistor Tr3 are provided in the first region 21, the second region 22 and the third region .
  • a fifth transistor Tr5, a sixth transistor Tr6, a seventh transistor Tr7 and an eighth transistor Tr8 are provided.
  • the fifth transistor Tr5 is arranged on the X1 side of the projection 31A and near the first transistor Tr1, and the seventh transistor Tr7 is arranged on the X2 side of the projection 31A and near the third transistor Tr3.
  • the fifth transistor Tr5 and the seventh transistor Tr7 are arranged symmetrically with respect to the straight line extending in the Y1-Y2 direction common to the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33.
  • the sixth transistor Tr6 is arranged on the X1 side of the recess 33A and near the second transistor Tr2, and the eighth transistor Tr8 is arranged on the X2 side of the recess 33A and near the fourth transistor Tr4.
  • the sixth transistor Tr6 and the eighth transistor Tr8 are arranged symmetrically with respect to the straight line extending in the Y1-Y2 direction common to the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33.
  • the fifth transistor Tr5 is an example of a plurality of first transistors
  • the sixth transistor Tr6 is an example of a plurality of second transistors
  • the seventh transistor Tr7 is an example of a plurality of third transistors
  • the eighth transistor Tr8 is It is an example of a plurality of fourth transistors.
  • the fifth transistor Tr5 and the seventh transistor Tr7 are arranged on one straight line extending in the X1-X2 direction, and the sixth transistor Tr6 and the eighth transistor Tr8 are arranged on another straight line extending in the X1-X2 direction. It is
  • the semiconductor device 300 has multiple fifth wires 45 , multiple sixth wires 46 , multiple seventh wires 47 , and multiple eighth wires 48 .
  • a fifth wire 45 connects the source of the fifth transistor Tr5 and the third circuit pattern 33 .
  • a sixth wire 46 connects the source of the sixth transistor Tr6 and the second circuit pattern 32 .
  • a seventh wire 47 connects the source of the seventh transistor Tr7 and the third circuit pattern 33 .
  • the eighth wire 48 connects the source of the eighth transistor Tr8 and the second circuit pattern 32 .
  • the lengths of the first wire 41 and the fifth wire 45 are different. Inductance in the current path from the contact portion 11B to the third circuit pattern 33 via the first circuit pattern 31 and the set of the first transistor Tr1 and the first wire 41 or the set of the fifth transistor Tr5 and the fifth wire 45 are equivalent.
  • the second wire 42 and the sixth wire 46 have different lengths. Inductance in the current path from the third circuit pattern 33 to the contact portion 12B via the set of the second transistor Tr2 and the second wire 42 or the set of the sixth transistor Tr6 and the sixth wire 46, and the second circuit pattern 32 are equivalent.
  • the third wire 43 and the seventh wire 47 have different lengths. Inductance in the current path from the contact portion 11B to the third circuit pattern 33 via the first circuit pattern 31 and the set of the third transistor Tr3 and the third wire 43 or the set of the seventh transistor Tr7 and the seventh wire 47 are equivalent.
  • the fourth wire 44 and the eighth wire 48 have different lengths. Inductance in the current path from the third circuit pattern 33 to the contact portion 12B via the set of the fourth transistor Tr4 and the fourth wire 44 or the set of the eighth transistor Tr8 and the eighth wire 48 and the second circuit pattern 32 are equivalent.
  • the inductance in the current path through the set of wires 46 is equivalent among the first region 21, the second region 22 and the third region 23.
  • the set of the third transistor Tr3 and the third wire 43 or the set of the seventh transistor Tr7 and the seventh wire 47 and the set of the fourth transistor Tr4 and the fourth wire 44 or the set of the eighth transistor Tr8 and the eighth wire 48 The inductance in the current path through and is equivalent among the first region 21 , the second region 22 and the third region 23 .
  • the inductances can be made uniform among the plurality of first transistors Tr1 and fifth transistors Tr5.
  • the inductances can be made uniform among the plurality of second transistors Tr2 and sixth transistors Tr6, the inductances can be made uniform among the plurality of third transistors Tr3 and seventh transistors Tr7, and the plurality of fourth transistors Tr3 and Tr7 can be made uniform in inductance.
  • Inductance can be made uniform between Tr4 and the eighth transistor Tr8.
  • FIG. 8 is a top view showing the semiconductor device according to the fourth embodiment.
  • a semiconductor device 400 includes a first diode D1, a second diode D2, and a third diode D3 in a first region 21, a second region 22, and a third region 23. and a fourth diode D4.
  • a first diode D ⁇ b>1 and a third diode D ⁇ b>3 are provided on the first circuit pattern 31
  • a second diode D ⁇ b>2 and a fourth diode D ⁇ b>4 are provided on the third circuit pattern 33 .
  • Each cathode of the first diode D1 and the third diode D3 is connected to the first circuit pattern 31 via a bonding material such as solder, and each cathode of the second diode D2 and the fourth diode D4 is connected to a bonding material such as solder. is connected to the third circuit pattern 33 via the .
  • the first diode D1 is arranged on the X1 side of the projection 31A and near the first transistor Tr1, and the third diode D3 is arranged on the X2 side of the projection 31A and near the third transistor Tr3.
  • the first diode D1 and the third diode D3 are arranged symmetrically with respect to the straight line extending in the Y1-Y2 direction common to the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33.
  • the second diode D2 is arranged on the X1 side of the recess 33A and near the second transistor Tr2, and the fourth diode D4 is arranged on the X2 side of the recess 33A and near the fourth transistor Tr4.
  • the second diode D2 and the fourth diode D4 are arranged symmetrically with respect to the straight line extending in the Y1-Y2 direction common to the first circuit pattern 31, the second circuit pattern 32 and the third circuit pattern 33.
  • the first diode D1 and the third diode D3 are arranged on one straight line extending in the X1-X2 direction, and the second diode D2 and the fourth diode D4 are arranged on another straight line extending in the X1-X2 direction. It is
  • the semiconductor device 400 has multiple ninth wires 61 , multiple tenth wires 62 , multiple eleventh wires 63 , and multiple twelfth wires 64 .
  • a ninth wire 61 connects the source of the first transistor Tr1 and the anode of the first diode D1.
  • a tenth wire 62 connects the source of the second transistor Tr2 and the anode of the second diode D2.
  • An eleventh wire 63 connects the source of the third transistor Tr3 and the anode of the third diode D3.
  • a twelfth wire 64 connects the source of the fourth transistor Tr4 and the anode of the fourth diode D4.
  • the fourth embodiment not only the body diodes of the first transistor Tr1, the second transistor Tr2, the third transistor Tr3, and the fourth transistor Tr4 are free-wheeling, but also the first diode D1, the second diode D2, The third diode D3 and the fourth diode D4 can also be circulated. Also, an insulated gate bipolar transistor (IGBT) having no body diode or the like can be used as the transistor.
  • IGBT insulated gate bipolar transistor
  • the transistors may be field effect transistors such as MOSFETs or IGBTs configured using silicon carbide.
  • the diode may be a Schottky barrier diode or a PN junction diode configured using silicon carbide. By using silicon carbide, excellent breakdown voltage can be obtained. For example, breakdown voltages of 750V, 1200V, 1700V and 3300V are obtained.
  • the main material of the transistor or diode may be silicon, gallium nitride or gallium oxide.
  • semiconductor devices using wide-gap semiconductors such as silicon carbide are capable of high withstand voltage due to high breakdown electric field, high-speed operation due to high saturation electron velocity, and high-temperature operation due to high thermal conductivity. . Therefore, by using a silicon carbide transistor, high-speed switching operation can be made possible while reducing variations in inductance.
  • the size of the semiconductor device tends to be larger than in a configuration in which a transistor including a body diode is used and a diode is not connected in parallel to the transistor. If the inductance between the P-bus and the N-bus is canceled, variations in inductance can be reduced even if the size of the semiconductor device increases.
  • Insulating substrate 10 O bus line 10A: Flat plate portion 10B: Contact portion 11: P bus line 11A: Flat plate portion 11B: Contact portion (first connecting portion) 11C: first main surface 12: N busbar 12A: flat plate portion 12B: contact portion (second connecting portion) 12C: Second main surface 13: Insulating sheet 21: First region 22: Second region 23: Third region 24: Fourth region 25: Fifth region 26: Sixth region 31: First circuit pattern 31A: Protrusion 32: Second circuit pattern 33: Third circuit pattern 33A: Recess 41: First wire 42: Second wire 43: Third wire 44: Fourth wire 45: Fifth wire 46: Sixth wire 47: Seventh wire 48: Eighth wire 61: Ninth wire 62: Tenth wire 63: Eleventh wire 64: Twelfth wire 91, 92: Current paths 100, 200, 300, 400: Semiconductor device Tr1: First transistor Tr2: Second Transistor Tr3: Third transistor Tr4: Fourth transistor Tr5: Fifth transistor Tr6: Sixth transistor Tr7: Seventh transistor Tr8

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
PCT/JP2022/004703 2021-02-16 2022-02-07 半導体装置 Ceased WO2022176675A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023500740A JPWO2022176675A1 (https=) 2021-02-16 2022-02-07

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-022616 2021-02-16
JP2021022616 2021-02-16

Publications (1)

Publication Number Publication Date
WO2022176675A1 true WO2022176675A1 (ja) 2022-08-25

Family

ID=82930863

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/004703 Ceased WO2022176675A1 (ja) 2021-02-16 2022-02-07 半導体装置

Country Status (2)

Country Link
JP (1) JPWO2022176675A1 (https=)
WO (1) WO2022176675A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005192328A (ja) * 2003-12-25 2005-07-14 Toyota Motor Corp 半導体装置
JP2017055610A (ja) * 2015-09-11 2017-03-16 富士電機株式会社 パワー半導体装置
WO2017169693A1 (ja) * 2016-04-01 2017-10-05 三菱電機株式会社 半導体モジュール

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060157A (ja) * 2001-08-08 2003-02-28 Mitsubishi Electric Corp パワーモジュール
JP2007042796A (ja) * 2005-08-02 2007-02-15 Toshiba Corp 電力用半導体素子及びインバータ装置
US8076696B2 (en) * 2009-10-30 2011-12-13 General Electric Company Power module assembly with reduced inductance
CN103545282B (zh) * 2013-11-05 2016-04-20 株洲南车时代电气股份有限公司 绝缘栅双极晶闸管模块及电极功率端子
US10141254B1 (en) * 2018-05-14 2018-11-27 Ford Global Technologies, Llc Direct bonded copper power module with elevated common source inductance

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005192328A (ja) * 2003-12-25 2005-07-14 Toyota Motor Corp 半導体装置
JP2017055610A (ja) * 2015-09-11 2017-03-16 富士電機株式会社 パワー半導体装置
WO2017169693A1 (ja) * 2016-04-01 2017-10-05 三菱電機株式会社 半導体モジュール

Also Published As

Publication number Publication date
JPWO2022176675A1 (https=) 2022-08-25

Similar Documents

Publication Publication Date Title
US8461623B2 (en) Power semiconductor module
US11515292B2 (en) Semiconductor device
JP7428017B2 (ja) 半導体モジュール
JP7428018B2 (ja) 半導体モジュール
US11456238B2 (en) Semiconductor device including a semiconductor chip connected with a plurality of main terminals
CN106489203A (zh) 半桥式功率半导体模块及其制造方法
WO2017056176A1 (ja) 半導体装置およびそれを備える半導体モジュール
US20230282622A1 (en) Semiconductor device
CN117063275A (zh) 功率半导体封装
US20230335413A1 (en) Semiconductor device
JP7231109B2 (ja) 電気回路及び半導体モジュール
CN110504255B (zh) 反向导通型半导体装置
JP2024008998A (ja) 電子回路、半導体モジュール及び半導体装置
CN115440694A (zh) 半导体器件
WO2022176675A1 (ja) 半導体装置
US12334427B2 (en) Semiconductor device
US20240030211A1 (en) Semiconductor module
CN119654712A (zh) 功率半导体模块以及电力转换装置
US20250364382A1 (en) Semiconductor device
JP7519956B2 (ja) スイッチング装置、半導体装置、およびスイッチング装置の製造方法
US20240290759A1 (en) Semiconductor device
US20240321655A1 (en) Semiconductor module
CN118538696A (zh) 半导体装置
JP2024037408A (ja) 半導体モジュール
JP2022188893A (ja) 半導体装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22755996

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2023500740

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22755996

Country of ref document: EP

Kind code of ref document: A1