WO2022174690A1 - 柔性电路板的热成型装置及方法 - Google Patents

柔性电路板的热成型装置及方法 Download PDF

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Publication number
WO2022174690A1
WO2022174690A1 PCT/CN2022/070784 CN2022070784W WO2022174690A1 WO 2022174690 A1 WO2022174690 A1 WO 2022174690A1 CN 2022070784 W CN2022070784 W CN 2022070784W WO 2022174690 A1 WO2022174690 A1 WO 2022174690A1
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WO
WIPO (PCT)
Prior art keywords
forming
circuit board
flexible circuit
molding
driving
Prior art date
Application number
PCT/CN2022/070784
Other languages
English (en)
French (fr)
Inventor
陈达
汪凤英
李一鸣
聂富刚
刘哲
王峰
石一逴
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to EP22755463.1A priority Critical patent/EP4286131A4/en
Priority to US18/546,511 priority patent/US20240098902A1/en
Publication of WO2022174690A1 publication Critical patent/WO2022174690A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/02—Bending or folding
    • B29C53/04—Bending or folding of plates or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/80—Component parts, details or accessories; Auxiliary operations
    • B29C53/84—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Definitions

  • the present application relates to the technical field of thermoforming, and in particular, to a thermoforming device and method for a flexible circuit board.
  • the flexible circuit board can be freely bent, rolled, and folded within the specified space as required, which reduces the difficulty of design, expands the design space, and provides convenience for assembly integration and integration. In order to realize the three-dimensional wiring of the flexible circuit board, it is necessary to pre-bend the flexible circuit board before assembly.
  • both the bending radius is required to be as large as possible, and the error of the bending radius of batch products is required to be as small as possible to ensure the consistency of product performance.
  • the current method of forming flexible circuit boards is mainly to use mold forming, which is characterized by making a copying mold according to the bending shape, placing the flexible circuit board in the copying mold and applying a certain pressure, and taking it out after a period of time, so that the Flexible circuit board molding.
  • mold forming is characterized by making a copying mold according to the bending shape, placing the flexible circuit board in the copying mold and applying a certain pressure, and taking it out after a period of time, so that the Flexible circuit board molding.
  • the bent shape of the flexible circuit board can be basically consistent with the desired shape, the processing and pressure holding time of the flexible circuit board is long, which wastes time in the welding process, and the flexible circuit board will gradually return to its original shape as time increases.
  • the main purpose of the embodiments of the present application is to provide a thermoforming device and method for a flexible circuit board.
  • an embodiment of the present application provides a thermoforming device for a flexible circuit board, comprising: a first forming mechanism, wherein the first forming mechanism is provided with a first forming part, and the first forming part is set to carry a to-be-to-be- A processed flexible circuit board; a second forming mechanism, the second forming mechanism is provided with a second forming part adapted to the first forming part, wherein the first forming part and the second forming part are at least One is correspondingly provided with a heating module configured to perform heat treatment on the flexible circuit board; a first driving mechanism is configured to drive the first molding mechanism and the second molding mechanism to be opposite in a first direction displacement; a second driving mechanism configured to drive the second forming mechanism and the first forming mechanism to undergo relative displacement in a second direction, and the first direction and the second direction are perpendicular to each other; and controlling a device configured to control the first driving mechanism to drive at least one of the first molding mechanism and the second molding mechanism to move to a preset position
  • an embodiment of the present application provides a method for thermoforming a flexible circuit board, which is applied to a thermoforming device for a flexible circuit board.
  • the thermoforming device includes: a first molding mechanism, and the first molding mechanism is provided with a first molding a forming part, the first forming part is configured to carry the flexible circuit board to be processed; a second forming mechanism, the second forming mechanism is provided with a second forming part adapted to the first forming part, wherein , at least one of the first forming part and the second forming part is correspondingly provided with a heating module for heat treatment of the flexible circuit board; a first driving mechanism is configured to drive the first forming mechanism and The second forming mechanism is relatively displaced in the first direction; the second driving mechanism is configured to drive the second forming mechanism and the first forming mechanism to be relatively displaced in the second direction, and the first forming mechanism One direction and the second direction are perpendicular to each other; the method includes: acquiring a control signal; controlling the first driving mechanism to drive at least
  • FIG. 1 is a schematic structural diagram of a thermoforming device for a flexible circuit board from a first perspective according to an embodiment of the present application
  • thermoforming device 2 is a schematic structural diagram of a thermoforming device for a flexible circuit board from a second perspective according to an embodiment of the present application
  • thermoforming device for a flexible circuit board and a flexible circuit board according to an embodiment of the present application
  • FIG. 4 is a schematic diagram of the cooperation between the first forming mechanism and the flexible circuit board of the thermoforming device according to the embodiment of the present application;
  • thermoforming device 5 is a schematic structural diagram of another thermoforming device for a flexible circuit board provided by an embodiment of the present application.
  • 6a is a schematic diagram of a scene of a thermoforming device for a flexible circuit board provided by an embodiment of the present application
  • 6b is a schematic diagram of another scenario of a thermoforming device for a flexible circuit board provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of another scene of a thermoforming device for a flexible circuit board provided by an embodiment of the present application.
  • thermoforming device 1 for a flexible circuit board provided by an embodiment of the present application is used for thermally bending a flexible circuit board to be processed into a predetermined shape.
  • the thermoforming device 1 includes a first forming mechanism 11 , a second forming mechanism 12 , a first driving mechanism 21 , a second driving mechanism 22 and a controller.
  • the first forming mechanism 11 is configured to carry the flexible circuit board to be processed
  • the second forming mechanism 12 is adapted to the first forming mechanism 11 to thermally bend the flexible circuit board to be processed into a predetermined shape.
  • at least one of the first molding mechanism 11 and the second molding mechanism 12 is provided with a heating module, which is configured to perform heat treatment on the flexible circuit board carried by the first molding mechanism 11 .
  • the first molding mechanism 11 is provided with a first molding portion 111 , which is configured to carry the flexible circuit board A to be processed
  • the second molding mechanism 12 is provided with a second molding portion 121 , which is Set to fit with the first molding part 111 .
  • at least one of the first forming part 111 and the second forming part 121 is provided with a heating module.
  • the shapes of the first molding portion 111 and the second molding portion 121 are obtained according to the desired shape of the flexible circuit board A after processing.
  • the flexible circuit board A to be processed is heated by the heating module, so that the flexible circuit board A has plasticity, and then the flexible circuit board A is pressed by the first molding part 111 and the second molding part 121 to shape the flexible circuit board A fixed, so that the flexible circuit board A can be formed quickly and accurately.
  • the first molding mechanism 11 is provided with a limiting portion 112 for retaining the flexible circuit board A, for limiting the flexible circuit board A carried on the first molding portion 111 .
  • the limiting portions 112 are set according to the flexible circuit board A. For example, if there are protruding connectors at both ends of the flexible circuit board A, the limiting portions 112 are correspondingly provided on opposite sides of the first molding portion 111 . 112 is specifically a limit groove matched with the connecting piece.
  • the flexible circuit board A carried on the first molding portion 111 is prevented from being displaced, resulting in poor molding effect during processing.
  • the controller controls the first driving mechanism 21 to drive at least one of the first molding mechanism 11 and the second molding mechanism 12 to move in the first direction, so as to move the first molding mechanism 11 and the second molding mechanism 12 to a preset position .
  • the controller controls the second driving mechanism 22 to drive at least one of the first molding mechanism 11 and the second molding mechanism 12 to move in the second direction, so that the first molding mechanism 11 and the second molding mechanism 12 are pressed and carried on the first molding mechanism
  • the flexible circuit board of the mechanism 11 is heated and bent into a preset shape by the heating module.
  • the first direction is perpendicular to the second direction, and the second direction is the direction in which the second forming mechanism 12 and the first forming mechanism 11 approach or move away from each other.
  • the preset position is the position where the second molding portion 121 faces the flexible circuit board A carried on the first molding portion 111 .
  • the second direction is the Z-axis direction.
  • thermoforming device 1 may be provided with corresponding control components, such as buttons, touch interfaces, etc., and the operator sends corresponding driving instructions to the thermoforming device 1 through the control components to control the first driving mechanism 21 and the second driving mechanism. 22 Perform the corresponding operation. It is also possible that the controller automatically obtains the current working state of the thermoforming device 1, and then controls the first driving mechanism 21 and the second driving mechanism 22 to perform corresponding operations according to the current working state, which is not limited herein.
  • the thermoforming device 1 further includes a support mechanism 30 , and the support mechanism 30 includes a first support portion 301 , a second support portion 302 , and a connection connecting the first support portion 301 and the second support portion 302 .
  • Connection part 303 The first support portion 301 is arranged to support the first forming mechanism 11
  • the second support portion 302 is arranged to support the second forming mechanism 12
  • the second support portion 302 and the first support portion 301 are arranged at intervals through the connecting portion 303 to
  • the first molding mechanism 11 and the second molding mechanism 12 are arranged at intervals.
  • thermoforming device 1 is further provided with a positioning mechanism 40, which is configured to acquire relative position information of the first forming mechanism 11 and the second forming mechanism 12, so that the controller automatically controls the first driving mechanism according to the position information 21 and the second drive mechanism 22 perform corresponding operations.
  • a positioning mechanism 40 which is configured to acquire relative position information of the first forming mechanism 11 and the second forming mechanism 12, so that the controller automatically controls the first driving mechanism according to the position information 21 and the second drive mechanism 22 perform corresponding operations.
  • the positioning mechanism 40 is connected with the second driving mechanism 22 , and the positioning mechanism 40 obtains the position information of the first molding mechanism 11 , thereby obtaining the relative position information of the first molding mechanism 11 and the second molding mechanism 12 .
  • the positioning mechanism 40 includes an image acquisition device through which image information of the first molding mechanism 11 is acquired, and the controller analyzes the image information to obtain relative position information of the first molding mechanism 11 and the second molding mechanism 12 .
  • the image acquisition device includes, but is not limited to, a charge-coupled device CCD (Charge-coupled Device), a CMOS (Complementary Metal-Oxide-Semiconductor) sensor, and the like.
  • the first driving machine 21 includes the first driving component 211 and the second driving component 212
  • the positioning mechanism 40 is connected to the second driving mechanism 22
  • the positioning mechanism 40 is an image capturing device as an example. The working principle is explained.
  • the first drive assembly 211 is connected with the first support portion 301 and is configured to drive the second drive assembly 212 and the first forming mechanism 11 to move in the first direction.
  • the second drive assembly 212 is connected with the first drive assembly 211 and the first forming mechanism 11, and is configured to drive the first forming mechanism 11 to move in the first direction.
  • the first direction includes at least two different directions.
  • the first drive assembly 211 drives the second drive assembly 212 and the first forming mechanism 11 to move in the X-axis direction, wherein the X-axis direction is a direction close to or away from the connection between the first support part 301 and the connection part 303 .
  • the second driving assembly 212 drives the first forming mechanism 11 to move in the Y-axis direction, wherein the Y-axis direction is perpendicular to the X-axis direction.
  • the second driving machine 22 drives the second forming mechanism 12 to move in a second direction, and the second direction is perpendicular to the Y-axis direction and the X-axis direction.
  • the controller uses the position information obtained by the positioning mechanism 40 to further determine whether the first molding mechanism 11 is in a preset position relative to the second molding mechanism 12 .
  • the first molding mechanism 11 is provided with a reference point M, and the position information of the first molding mechanism 11 is obtained by acquiring the position information of the M point, and it is judged whether the position of the M point is in a preset position, and then the first molding mechanism is judged. Whether the mechanism 11 is in a preset position.
  • point N is the preset position of point M.
  • the M point is not currently in the preset position, and the displacement information of the first driving component 211 in the X-axis direction is obtained according to the relative position information of the N point and the M point, and the displacement information of the second driving component 212 in the Y-axis direction is obtained.
  • the controller controls the first driving assembly 211 and the second driving assembly 212 according to the displacement information to drive the first forming mechanism 11 to move.
  • the controller controls the second driving machine 22 to drive the second molding mechanism 12 to move in the second direction, so that the second molding mechanism 12 cooperates with the first molding mechanism 11 presses the flexible circuit board A carried by the first molding mechanism 11, and heats the flexible circuit board A through the heating module, so that the flexible circuit board A is thermally bent into a predetermined shape.
  • At least one of the first molding mechanism 11 and the second molding mechanism 12 is driven by the second driving mechanism 22 to move to a preset position, so as to prevent the flexible circuit board A from being heated and formed by the first molding part 111 and the second molding part 121 During the process, since the first forming part 111 , the second forming part 121 and the flexible circuit board A to be processed are misaligned, the forming effect of the flexible circuit board A is affected.
  • thermoforming apparatus 1 is provided with at least two first forming mechanisms 11 at intervals, so that the thermoforming apparatus 1 can process the flexible circuit boards in batches and improve production efficiency.
  • the corresponding first forming part 111 and the second forming part 121 can be replaced according to the actual demand for the desired shape of the flexible circuit board in the production process, so that the thermoforming device 1 can hot-bend the processed flexible circuit board into different shapes.
  • the controller includes a memory and a processor, a memory and a processor, and a communication interface.
  • the communication interface, the memory, and the processor communicate through the bus connection.
  • the memory may be volatile memory (volatile memory), such as random access memory (Random Access Memory, RAM); or non-volatile memory (non-volatile memory), such as read only memory (Read Only Memory, ROM) ), flash memory (flash memory), hard disk (Hard Disk Drive, HDD) or solid-state drive (Solid-State Drive, SSD); or a combination of the above types of memory.
  • volatile memory such as random access memory (Random Access Memory, RAM); or non-volatile memory (non-volatile memory), such as read only memory (Read Only Memory, ROM) ), flash memory (flash memory), hard disk (Hard Disk Drive, HDD) or solid-state drive (Solid-State Drive, SSD); or a combination of the above types of memory.
  • RAM random access memory
  • non-volatile memory non-volatile memory
  • Memory is used to store computer programs that can provide instructions and data to the processor.
  • the processor can be a central processing unit (Central Processing Unit, CPU), the processor can also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuit (Application Specific Integrated Circuit, ASIC), Field-Programmable Gate Array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.
  • the general-purpose processor can be a microprocessor or the processor can also be any conventional processor or the like.
  • thermoforming method of the flexible circuit board provided by the embodiment of the present application will be described below in combination with the working principle of the device 1 for thermoforming a flexible circuit board.
  • thermoforming method for a flexible circuit board is applied to a thermoforming device 1 for a flexible circuit board, and the thermoforming method includes:
  • the control signal may be actively triggered by the operator. For example, after the operator confirms that the flexible circuit board A to be processed has been correctly placed on the first molding mechanism 11 , the operator controls components such as buttons and touch interfaces provided on the thermoforming device 1 , or controls the components through a device connected to the thermoforming device 1 . Terminal devices such as mobile phones and computers send control signals to the thermoforming apparatus 1 so that the thermoforming apparatus 1 starts to process the flexible circuit board A.
  • the control signal can also be automatically generated by the thermoforming device 1 .
  • the thermoforming device 1 is provided with an image acquisition device, which is set to acquire image information of the first forming mechanism 11, and analyzes whether the flexible circuit board A to be processed is correctly placed on the first forming mechanism 11 through the acquired image information.
  • a control signal is generated so that the thermoforming device 1 starts to process the flexible circuit board A.
  • thermoforming device 1 After receiving the control signal, the thermoforming device 1 enters the processing mode to thermally bend the flexible circuit board A to be processed into a preset shape.
  • the first driving mechanism 21 is controlled to drive at least one of the first molding mechanism 11 and the second molding mechanism 12 to move to a preset position in the first direction, and control
  • the second driving mechanism 22 drives at least one of the first molding mechanism 11 and the second molding mechanism 12, so that the first molding mechanism 11 and the second molding mechanism 12 are in the second direction
  • the flexible circuit board A is moved relatively up to press the flexible circuit board A, and the flexible circuit board A carried on the first molding part 11 is thermally bent into a predetermined shape by the heating module.
  • thermoforming device 1 For the detailed implementation steps of this embodiment, please refer to the above description of the working principle of the thermoforming device 1 , which will not be repeated here.
  • the first molding mechanism 11 and the second molding mechanism 12 are driven to move to the preset positions by the first driving mechanism 21 and the second driving mechanism 22, which avoids the problem that the first molding part 111, the second molding part 121 and the bearing on the first molding
  • the flexible circuit board A of the part 111 is dislocated, which leads to the problem of inaccurate molding of the flexible circuit board A.
  • the first forming mechanism 11 and the second forming mechanism 12 are driven by the second driving mechanism 22 to pressurize the flexible circuit board A, and the flexible circuit board A is heated by the heating module, so that the flexible circuit board A can be formed more quickly,
  • the processed flexible circuit board A can maintain the shape for a long time, which improves the production efficiency.
  • the method further includes: controlling the heating module to stop heating, so that the flexible circuit board A supported on the first molding part 111 is heated. Cooling under the preset shape, after the flexible circuit board A is cooled under the preset shape for a preset time, the second driving mechanism 22 is controlled to drive at least one of the first molding mechanism 11 and the second molding mechanism 12, so that the first molding mechanism 11 and the second molding mechanism 12 are controlled. A molding mechanism 11 is far away from the second molding mechanism 12 .
  • the second driving mechanism 22 drives at least one of the first molding machine 11 and the second molding mechanism 12 to keep the first molding mechanism 11 and the second molding mechanism 12 away from each other, so as to facilitate the operator to process the finished flexible circuit board A Take out from the first molding part 111 .
  • thermoforming device and method for a flexible circuit board includes a first forming mechanism, the first forming mechanism is provided with a first forming part, and the first forming part is set to carry a flexible circuit to be processed a plate; a second forming mechanism, the second forming mechanism is provided with a second forming part adapted to the first forming part, wherein at least one of the first forming part and the second forming part is correspondingly disposed There is a heating module configured to perform heat treatment on the flexible circuit board; a first driving mechanism is configured to drive the first molding mechanism and the second molding mechanism to produce relative displacement in a first direction; a second driving mechanism a driving mechanism configured to drive the second molding mechanism and the first molding mechanism to produce relative displacement in a second direction, and the first direction and the second direction are perpendicular to each other; and a controller configured to control the first driving mechanism to drive at least one of the first forming mechanism and the second forming mechanism to move to a preset position in a first direction, and to control the second driving
  • the flexible circuit board is heated by at least one of the first forming mechanism and the second forming mechanism, so that the forming time of the flexible circuit board is shorter, and the formed flexible circuit board has a standard bending shape, which can maintain the shape for a long time. Improved production efficiency.
  • Such software may be distributed on computer-readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media).
  • computer storage media includes both volatile and nonvolatile implemented in any method or technology for storage of information, such as computer readable instructions, data structures, program modules or other data flexible, removable and non-removable media.
  • Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cartridges, magnetic tape, magnetic disk storage or other magnetic storage devices, or may Any other medium used to store desired information and which can be accessed by a computer.
  • communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and can include any information delivery media, as is well known to those of ordinary skill in the art .

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Abstract

一种柔性电路板的热成型装置及方法，柔性电路板的热成型装置包括第一成型机构(11)，所述第一成型机构(11)设置有第一成型部(111)，所述第一成型部(111)被设置成承载待加工的柔性电路板(A)；第二成型机构(12)，所述第二成型机构(12)设置有与所述第一成型部(111)适配的第二成型部(121)，其中，所述第一成型部(111)和所述第二成型部(121)中至少一者对应设置有用于对所述柔性电路板进行热处理的加热模组。

Description

柔性电路板的热成型装置及方法
相关申请的交叉引用
本申请基于申请号为202110188050.7、申请日为2021年2月18日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及热成型技术领域，尤其涉及一种柔性电路板的热成型装置及方法。
背景技术
随着科技的进步，在智能手机、平板电脑、触摸控产品等电子产品的驱动下，柔性电路板(Flexible Printed Circuit，FPC)的市场需求也越来越大。柔性电路板可以按照要求在规定空间内自由弯曲、卷绕、折叠，减小设计的难度，扩展了设计空间，为装配一体化和集成化提供了方便。而为了实现柔性电路板的三维走线，需要在组装前对柔性电路板进行预折弯成型处理。
特别是对于光收发器件，对柔性电路板的成型工艺提出要求：既要求弯曲半径尽可能大，也要求批量产品的弯曲半径的误差尽可能小，才能保证产品性能的一致性。
目前的柔性电路板的成型方法主要是采用模具成型，其特点是根据折弯形状制作仿形模具，将柔性电路板放置在仿形模具内并施加一定压力，在保持一段时间后取出，以使柔性电路板成型。虽然可以使柔性电路板折弯后的形状与期望形状基本一致，但是柔性电路板的加工保压时间长，浪费焊接工序时间，且随时间增加柔性电路板会逐渐恢复原状。
因此，如何使柔性电路板快速且精准的成型是本领域技术人员亟待解决的技术问题。
发明内容
本申请实施例的主要目的在于提供一种柔性电路板的热成型装置及方法。
第一方面，本申请实施例提供一种柔性电路板的热成型装置，包括：第一成型机构，所述第一成型机构设置有第一成型部，所述第一成型部被设置成承载待加工的柔性电路板；第二成型机构，所述第二成型机构设置有与所述第一成型部适配的第二成型部，其中，所述第一成型部和所述第二成型部至少一者对应设置有被设置成对所述柔性电路板进行热处理的加热模组；第一驱动机构，被设置成驱动所述第一成型机构和所述第二成型机构在第一方向上发生相对位移；第二驱动机构，被设置成驱动所述第二成型机构和所述第一成型机构在第二方向上发生相对位移，且所述第一方向和所述第二方向相互垂直；及控制器，被设置成控制所述第一驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者在第一方向上运动到预设位置，并控制所述第二驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者，以使在所述第一成型机构和所述第二成型机构在第二方向上相对运动以压制所述柔性电路板，并通过所述加热模组将所述柔性电路板热弯成预设形状。
第二方面，本申请实施例提供一种柔性电路板的热成型方法，应用于柔性电路板的热成 型装置，所述热成型装置包括：第一成型机构，所述第一成型机构设置有第一成型部，所述第一成型部被设置成承载待加工的柔性电路板；第二成型机构，所述第二成型机构设置有与所述第一成型部适配的第二成型部，其中，所述第一成型部和所述第二成型部至少一者对应设置有用于对所述柔性电路板进行热处理的加热模组；第一驱动机构，被设置成驱动所述第一成型机构和所述第二成型机构在第一方向上发生相对位移；第二驱动机构，被设置成驱动所述第二成型机构和所述第一成型机构在第二方向上发生相对位移，且所述第一方向和所述第二方向相互垂直；所述方法包括：获取控制信号；根据所述控制信号控制所述第一驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者在第一方向上运动到预设位置，并控制所述第二驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者，以使在所述第一成型机构和所述第二成型机构在第二方向上相对运动以压制所述柔性电路板，并通过所述加热模组将所述柔性电路板热弯成预设形状。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种柔性电路板的热成型装置第一视角的结构示意图；
图2为本申请实施例提供的一种柔性电路板的热成型装置第二视角的结构示意图；
图3为本申请实施例提供的一种柔性电路板的热成型装置和柔性电路板的配合示意图；
图4为本申请实施例提供的热成型装置的第一成型机构和柔性电路板的配合示意图；
图5为本申请实施例提供的另一种柔性电路板的热成型装置的结构示意图；
图6a为本申请实施例提供的一种柔性电路板的热成型装置的场景示意图；
图6b为本申请实施例提供的一种柔性电路板的热成型装置的另一场景示意图；
图7为本申请实施例提供的一种柔性电路板的热成型装置的又一场景示意图。
附图标记：11、第一成型机构；12、第二成型机构；21、第一驱动机构；22、第二驱动机构；111、第一成型部；112、限位部；121、第二成型部；211、第一驱动组件；212、第二驱动组件；30、支撑机构；301、第一支撑部；302、第二支撑部；303、连接部；40、定位机构。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
附图中所示的流程图仅是示例说明，不是必须包括所有的内容和操作/步骤，也不是必须按所描述的顺序执行。例如，有的操作/步骤还可以分解、组合或部分合并，因此实际执行的顺序有可能根据实际情况改变。
应当理解，在此本申请说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本申请。如在本申请说明书和所附权利要求书中所使用的那样，除非上下文清楚地 指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
下面结合附图，对本申请的一些实施例作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1，本申请实施例提供的柔性电路板的热成型装置1，用于将待加工的柔性电路板热弯成预设形状。
该热成型装置1包括第一成型机构11、第二成型机构12、第一驱动机构21、第二驱动机构22及控制器。第一成型机构11被设置成承载待加工的柔性电路板，第二成型机构12与第一成型机构11适配，以将待加工的柔性电路板热弯成预设形状。其中，第一成型机构11和第二成型机构12中至少一者设置有加热模组，被设置成对承载于第一成型机构11的柔性电路板进行热处理。
具体地，请参阅图2和图3，第一成型机构11设置有第一成型部111，被设置成承载待加工的柔性电路板A，第二成型机构12设置有第二成型部121，被设置成与第一成型部111适配。且第一成型部111和第二成型部121中的至少一者设置有加热模组。
其中，第一成型部111和第二成型部121的形状，是根据柔性电路板A加工后的期望形状得到的。
通过加热模组对待加工的柔性电路板A进行加热处理，以使柔性电路板A具有可塑性，然后通过第一成型部111和第二成型部121压制柔性电路板A，对柔性电路板A进行成型固定，以使柔性电路板A可以快速且精准的成型。
请参阅图4，在一些实施例中，第一成型机构11设置有用于固位柔性电路板A的限位部112，用于对承载于第一成型部111的柔性电路板A限位。具体地，限位部112根据柔性电路板A设置，例如，柔性电路板A两端有凸起的连接件，则在第一成型部111的相对两侧对应设置有限位部112，限位部112具体为和连接件匹配的限位凹槽。
通过在第一成型机构11上设置限位部112，防止在加工过程中，承载于第一成型部111的柔性电路板A因为发生移位而导致成型效果不佳。
控制器控制第一驱动机构21驱动第一成型机构11和第二成型机构12中的至少一者在第一方向上运动，以使第一成型机构11和第二成型机构12运动到预设位置。然后控制器控制第二驱动机构22驱动第一成型机构11和第二成型机构12中至少一者在第二方向上运动，使第一成型机构11和第二成型机构12压制承载于第一成型机构11的柔性电路板，并通过加热模组将柔性电路板热弯成预设形状。其中，第一方向垂直于第二方向，且第二方向为第二成型机构12和第一成型机构11相互靠近或远离的方向。其中，预设位置为第二成型部121正对承载于第一成型部111的柔性电路板A的位置，本实施方式中，第二方向即为Z轴方向。
其中，可以是热成型装置1设置有对应的控制组件，如按钮、触控界面等，操作员通过控制组件向热成型装置1发送对应驱动指令，以控制第一驱动机构21和第二驱动机构22执行对应的操作。也可以是控制器自动获取热成型装置1的当前工作状态，进而根据当前工作状态控制第一驱动机构21和第二驱动机构22执行对应的操作，在此不做限定。
请参阅图5，在一些实施例中，热成型装置1还包括支撑机构30，支撑机构30包括第一支撑部301、第二支撑部302和连接第一支撑部301和第二支撑部302的连接部303。第一支撑部301被设置成支撑第一成型机构11，第二支撑部302被设置成支撑第二成型机构12，且第二支撑部302和第一支撑部301通过连接部303间隔设置，以使第一成型机构11和第二成 型机构12间隔设置。
在一些实施例中，热成型装置1还设置有定位机构40，被设置成获取第一成型机构11和第二成型机构12的相对位置信息，以使控制器根据位置信息自动控制第一驱动机构21和第二驱动机构22执行对应的操作。
在一些示例中，定位机构40与第二驱动机构22连接，通过定位机构40获取第一成型机构11的位置信息，从而获取第一成型机构11和第二成型机构12的相对位置信息。
例如，定位机构40包括图像获取装置，通过图像获取装置获取第一成型机构11的图像信息，控制器分析图像信息以得到第一成型机构11和第二成型机构12的相对位置信息。图像获取装置包括但不限于电荷耦合元件CCD(Charge-coupled Device)、CMOS(Complementary Metal-Oxide-Semiconductor)传感器等。
本实施方式中以第一驱动机21包括第一驱动组件211和第二驱动组件212，同时定位机构40与第二驱动机构22连接且定位机构40为图像获取装置为例对热成型装置1的工作原理进行说明。
如图5所示，第一驱动组件211与第一支撑部301连接，被设置成驱动第二驱动组件212和第一成型机构11在第一方向上运动。第二驱动组件212与第一驱动组件211和第一成型机构11连接，被设置成驱动第一成型机构11在第一方向上运动。其中，第一方向至少包括两个不同的方向。
具体地，第一驱动组件211驱动第二驱动组件212和第一成型机构11在X轴方向上运动，其中，X轴方向为靠近或远离第一支撑部301和连接部303连接处的方向。第二驱动组件212驱动第一成型机构11在Y轴方向上运动，其中，Y轴方向垂直于X轴方向。第二驱动机22驱动第二成型机构12在第二方向上运动，且第二方向垂直于Y轴方向和X轴方向。
控制器通过定位机构40获取的位置信息，进而判断第一成型机构11相对于第二成型机构12是否处于预设位置。
具体地，第一成型机构11上设置有参照点M，通过获取M点的位置信息来获取第一成型机构11的位置信息，并判断M点的位置是否处于预设位置，进而判断第一成型机构11是否处于预设位置。
请参阅图6a，图像获取装置获取的图像信息中，N点为M点的预设位置。通过分析图像信息可知，M点当前不处于预设位置，根据N点和M点的相对位置信息得到第一驱动组件211在X轴方向上的位移信息，和第二驱动组件212在Y轴方向上的位移信息。控制器根据位移信息控制第一驱动组件211和第二驱动组件212以驱动第一成型机构11运动。
请参阅图6b，在第一成型机构11运动完毕后，当图像获取装置再次获取的图像信息中，分析得出N点和M点之间的距离小于预设值时，则表明M点当前处于预设位置，即第一成型机构11处于预设位置。
请参阅图7，当第一成型机构11处于预设位置后，控制器控制第二驱动机22驱动第二成型机构12在第二方向上运动，以使第二成型机构12配合第一成型机构11压制承载于第一成型机构11的柔性电路板A，并通过加热模组对柔性电路板A加热，以使柔性电路板A热弯成预设形状。
通过第二驱动机构22驱动第一成型机构11和第二成型机构12中的至少一者运动到预设位置，以避免第一成型部111和第二成型部121对柔性电路板A加热成型的过程中，因为第 一成型部111、第二成型部121和待加工的柔性电路板A发生错位，从而影响柔性电路板A的成型效果。
在一些实施例中，如图1所示，热成型装置1间隔设置有至少两个第一成型机构11，以使热成型装置1可以对柔性电路板进行批量加工，提高生产效率。
在一些实施例中，可根据生产过程中对柔性电路板期望形状的实际需求，更换对应的第一成型部111和第二成型部121，使热成型装置1可以对加工的柔性电路板热弯成不同的形状。
在一些实施方式中，控制器包括存储器和处理器，存储器和处理器及通信接口。通信接口、存储器、处理器通过总线连接进行通信。
其中，存储器可以是易失性存储器(volatile memory)，例如随机存取存储器(Random Access Memory，RAM)；或者非易失性存储器(non-volatile memory)，例如只读存储器(Read Only Memory，ROM)，快闪存储器(flash memory)，硬盘(Hard Disk Drive，HDD)或固态硬盘(Solid-State Drive，SSD)；或者以上种类的存储器的组合。存储器用于存储计算机程序，可以向处理器提供指令和数据。
处理器可以是中央处理单元(Central Processing Unit，CPU)，该处理器还可以是其他通用处理器、数字信号处理器(Digital Signal Processor，DSP)、专用集成电路(Application Specific Integrated Circuit，ASIC)、现场可编程门阵列(Field-Programmable Gate Array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件等。其中，通用处理器可以是微处理器或者该处理器也可以是任何常规的处理器等。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见下文针对柔性电路板的热成型方法的详细描述，此处不再赘述。
以下将结合柔性电路板的热成型装置1的工作原理，对本申请实施例提供的柔性电路板的热成型方法进行说明。
该柔性电路板的热成型方法应用于柔性电路板的热成型装置1，该热成型方法包括：
获取控制信号。
其中，控制信号可以是操作员主动触发的。如，操作员确认待加工的柔性电路板A已经正确放置在第一成型机构11上后，通过热成型装置1上设置的按钮、触控界面等控制组件，或者通过与热成型装置1连接的手机、电脑等终端设备，向热成型装置1发送控制信号，以使热成型装置1开始对柔性电路板A进行加工。
控制信号还可以是热成型装置1自动生成。如，热成型装置1设置有图像获取装置，被设置成获取第一成型机构11的图像信息，通过获取的图像信息分析待加工的柔性电路板A是否正确放置在第一成型机构11上，如果柔性电路板A正确放置在第一成型机构11上，则生成控制信号，以使热成型装置1开始对柔性电路板A进行加工。
热成型装置1在接收到控制信号后，进入加工模式，以将待加工的柔性电路板A热弯成预设形状。
热成型装置1进入加工模式后，控制所述第一驱动机构21驱动所述第一成型机构11和所述第二成型机构12中至少一者在第一方向上运动到预设位置，并控制所述第二驱动机构22驱动所述第一成型机构11和所述第二成型机构12中至少一者，以使在所述第一成型机构11和所述第二成型机构12在第二方向上相对运动以压制所述柔性电路板A，并通过所述加 热模组将承载于所述第一成型部11的所述柔性电路板A热弯成预设形状。
本实施例详细的实施步骤请参见上述对热成型装置1的工作原理的描述，在此不做赘述。
通过第一驱动机构21和第二驱动机构22驱动第一成型机构11和第二成型机构12运动到预设位置，避免了因为第一成型部111、第二成型部121和承载于第一成型部111的柔性电路板A发生错位，而导致柔性电路板A成型不精准的问题。同时通过第二驱动机构22驱动第一成型机构11和第二成型机构12对柔性电路板A加压，并通过加热模组对柔性电路板A加热，使柔性电路板A能更快速的成型，且加工完成的柔性电路板A能长时间维持形状，提高了生产效率。
在一些实施例中，承载于第一成型部111的柔性电路板A热弯成预设形状之后，还包括：控制加热模组停止加热，以使承载于第一成型部111的柔性电路板A在预设形状下冷却，当柔性电路板A在预设形状下冷却预设时间后，控制第二驱动机构22驱动第一成型机构11和第二成型机构12中的至少一者，以使第一成型机构11远离第二成型机构12。
通过对已经到达预设形状的柔性电路板A进行冷却处理，以使柔性电路板A的可塑性降低，以防止柔性电路板A在加工完成后因为余温而变形。第二驱动机构22驱动第一成型机11构和第二成型机构12的至少一者，使第一成型机构11和第二成型机构12相互远离，以方便操作员将完成加工的柔性电路板A从第一成型部111取出。
本申请提供的一种柔性电路板的热成型装置及方法，包括第一成型机构，所述第一成型机构设置有第一成型部，所述第一成型部被设置成承载待加工的柔性电路板；第二成型机构，所述第二成型机构设置有与所述第一成型部适配的第二成型部，其中，所述第一成型部和所述第二成型部至少一者对应设置有被设置成对所述柔性电路板进行热处理的加热模组；第一驱动机构，被设置成驱动所述第一成型机构和所述第二成型机构在第一方向上发生相对位移；第二驱动机构，被设置成驱动所述第二成型机构和所述第一成型机构在第二方向上发生相对位移，且所述第一方向和所述第二方向相互垂直；及控制器，被设置成控制所述第一驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者在第一方向上运动到预设位置，并控制所述第二驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者，以使在所述第一成型机构和所述第二成型机构在第二方向上相对运动以压制所述柔性电路板，并通过所述加热模组将所述柔性电路板热弯成预设形状。通过第一成型机构和第二成型机构中至少一者对柔性电路板加热，使柔性电路板的成型时间更短，且成型后的柔性电路板具有规范的折弯形状，能长时间维持形状，提高了生产效率。
本领域普通技术人员可以理解，上文中所公开方法中的全部或某些步骤、系统、装置中的功能模块/单元可以被实施为软件、固件、硬件及其适当的组合。在硬件实施例中，在以上描述中提及的功能模块/单元之间的划分不一定对应于物理组件的划分；例如，一个物理组件可以具有多个功能，或者一个功能或步骤可以由若干物理组件合作执行。某些物理组件或所有物理组件可以被实施为由处理器，如中央处理器、数字信号处理器或微处理器执行的软件，或者被实施为硬件，或者被实施为集成电路，如专用集成电路。这样的软件可以分布在计算机可读介质上，计算机可读介质可以包括计算机存储介质(或非暂时性介质)和通信介质(或暂时性介质)。如本领域普通技术人员公知的，术语计算机存储介质包括在用于存储信息(诸如计算机可读指令、数据结构、程序模块或其他数据)的任何方法或技术中实施的易失性和非易失性、可移除和不可移除介质。计算机存储介质包括但不限于RAM、ROM、EEPROM、 闪存或其他存储器技术、CD-ROM、数字多功能盘(DVD)或其他光盘存储、磁盒、磁带、磁盘存储或其他磁存储装置、或者可以用于存储期望的信息并且可以被计算机访问的任何其他的介质。此外，本领域普通技术人员公知的是，通信介质通常包含计算机可读指令、数据结构、程序模块或者诸如载波或其他传输机制之类的调制数据信号中的其他数据，并且可包括任何信息递送介质。
应当理解，在本申请说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者系统不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者系统所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者系统中还存在另外的相同要素。
上述本申请实施例序号仅仅为了描述，不代表实施例的优劣。以上所述，仅为本申请的具体实施例，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种柔性电路板的热成型装置，包括：
    第一成型机构，所述第一成型机构设置有第一成型部，所述第一成型部被设置成承载待加工的柔性电路板；
    第二成型机构，所述第二成型机构设置有与所述第一成型部适配的第二成型部，其中，所述第一成型部和所述第二成型部至少一者对应设置有被设置成对所述柔性电路板进行热处理的加热模组；
    第一驱动机构，被设置成驱动所述第一成型机构和所述第二成型机构在第一方向上发生相对位移；
    第二驱动机构，被设置成驱动所述第二成型机构和所述第一成型机构在第二方向上发生相对位移，且所述第一方向和所述第二方向相互垂直；及
    控制器，被设置成控制所述第一驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者在第一方向上运动到预设位置，并控制所述第二驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者，以使在所述第一成型机构和所述第二成型机构在第二方向上相对运动以压制所述柔性电路板，并通过所述加热模组将所述柔性电路板热弯成预设形状。
  2. 根据权利要求1所述的热成型装置，其中，所述第一成型机构设置有被设置成固位所述柔性电路板的限位部。
  3. 根据权利要求2所述的热成型装置，其中，所述限位部设置于所述第一成型部的相对两侧。
  4. 根据权利要求1-3任一项所述的热成型装置，其中，所述热成型装置还包括支撑机构，所述支撑机构包括被设置成支撑所述第一成型机构的第一支撑部、被设置成支撑所述第二成型机构的第二支撑部、及连接所述第一支撑部及所述第二支撑部的连接部。
  5. 根据权利要求4所述的热成型装置，其中，所述第一驱动机构包括第一驱动组件和第二驱动组件，其中，所述第一驱动组件与所述第一支撑部连接，所述第二驱动组件连接所述第一驱动组件和所述第一成型机构。
  6. 根据权利要求5所述的热成型装置，其中，所述第一成型机构至少为两个，且间隔设置于所述第二驱动组件上。
  7. 根据权利要求5所述的热成型装置，其中，所述热成型装置还包括定位机构，所述定位机构被设置成获取所述第一成型机构和所述第二成型机构的相对位置信息，以使所述控制器根据所述相位位置信息控制所述第一驱动机构和所述第二驱动机构中至少一者执行对应的操作。
  8. 根据权利要求7所述的热成型装置，其中，所述定位机构包括图像获取装置，所述图像获取装置被设置成获取所述第一成型机构和所述第二成型机构的图像信息，以根据所述图像信息获取所述相对位置信息。
  9. 根据权利要求7所述的热成型装置，其中，所述定位机构与所述第二驱动机构连接。
  10. 一种柔性电路板的热成型方法，应用于柔性电路板的热成型装置，其中，所述热成型装置包括：
    第一成型机构，所述第一成型机构设置有第一成型部，所述第一成型部被设置成承载待 加工的柔性电路板；
    第二成型机构，所述第二成型机构设置有与所述第一成型部适配的第二成型部，其中，所述第一成型部和所述第二成型部至少一者对应设置有被设置成对所述柔性电路板进行热处理的加热模组；
    第一驱动机构，被设置成驱动所述第一成型机构和所述第二成型机构在第一方向上发生相对位移；
    第二驱动机构，被设置成驱动所述第二成型机构和所述第一成型机构在第二方向上发生相对位移，且所述第一方向和所述第二方向相互垂直；
    所述方法包括：
    获取控制信号；
    根据所述控制信号控制所述第一驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者在第一方向上运动到预设位置，并控制所述第二驱动机构驱动所述第一成型机构和所述第二成型机构中至少一者，以使在所述第一成型机构和所述第二成型机构在第二方向上相对运动以压制所述柔性电路板，并通过所述加热模组将所述柔性电路板热弯成预设形状。
PCT/CN2022/070784 2021-02-18 2022-01-07 柔性电路板的热成型装置及方法 WO2022174690A1 (zh)

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