WO2022172900A1 - セラミック板及びその製造方法、並びに、回路基板及びその製造方法 - Google Patents

セラミック板及びその製造方法、並びに、回路基板及びその製造方法 Download PDF

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WO2022172900A1
WO2022172900A1 PCT/JP2022/004738 JP2022004738W WO2022172900A1 WO 2022172900 A1 WO2022172900 A1 WO 2022172900A1 JP 2022004738 W JP2022004738 W JP 2022004738W WO 2022172900 A1 WO2022172900 A1 WO 2022172900A1
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Prior art keywords
ceramic plate
hole
main surface
ceramic
holes
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PCT/JP2022/004738
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English (en)
French (fr)
Japanese (ja)
Inventor
利貴 山縣
大樹 藤吉
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デンカ株式会社
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Priority to JP2022542775A priority Critical patent/JPWO2022172900A1/ja
Publication of WO2022172900A1 publication Critical patent/WO2022172900A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C04B35/587—Fine ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to a ceramic plate and its manufacturing method, and a circuit board and its manufacturing method.
  • Insulating ceramic plates are sometimes used for circuit boards mounted on power modules and the like.
  • a technique for manufacturing such a circuit board a technique is known in which a metal plate is bonded to the main surface of a ceramic plate to form a bonded substrate, and a circuit pattern is formed from the metal plate of the bonded substrate to manufacture a circuit substrate.
  • a ceramic plate used for such a circuit board is provided with a margin portion, which is also called a dummy region, at the end portion so as to be processed to a predetermined size.
  • the margin is removed from the ceramic substrate by folding along break lines formed by laser light.
  • Japanese Patent Application Laid-Open No. 2002-200000 proposes arranging a through hole having a corner so as to straddle a wiring substrate area and a dummy area.
  • the present disclosure provides a ceramic plate having through holes and yet having sufficiently high reliability, and a method for manufacturing the same.
  • the present disclosure also provides a circuit board having sufficiently high reliability by including such a ceramic plate, and a method of manufacturing the same.
  • the present disclosure includes a main surface and a through hole formed through the thickness direction and closer to the center than the outer edge of the main surface, and the through hole is formed by cutting with a laser beam.
  • a ceramic plate is provided, wherein the outline of the through holes on the main surface is curved.
  • the through-holes of this ceramic plate are formed closer to the center than the outer edge of the main surface, they are less likely to be damaged than when the through-holes are provided closer to the outer edge. Further, since the through-hole is formed by cutting with a laser beam, minute cracks (microcracks) in the inner wall can be sufficiently reduced. In addition, since the outline of the through-hole on the main surface is curved, it is possible to prevent the through-hole from becoming a crack starting point. Therefore, the ceramic plate has sufficiently high reliability even though it has through holes.
  • the inner wall of the through-hole may be composed of a cut surface formed by irradiating the laser beam once. As a result, the unevenness of the inner wall of the through-hole can be sufficiently reduced, and the ceramic plate can be made more difficult to crack.
  • the through-hole may be formed by making the laser light go around the main surface along the contour line. As a result, it is possible to smoothly form a through hole in which unevenness of the inner wall is sufficiently reduced.
  • the opening area of the through holes on the main surface of the ceramic plate may be 10 mm 2 or more.
  • a through hole having such a large size can be used for various purposes. Moreover, even with such a large size, the reliability of the ceramic plate can be sufficiently maintained.
  • the ceramic plate may have a thickness of 0.3 to 0.7 mm and a maximum bending load of 40 N or more.
  • a ceramic plate having such a thickness and a maximum load has high reliability while sufficiently reducing thermal resistance in the thickness direction. Therefore, the ceramic plate is useful for circuit boards.
  • the present disclosure provides a circuit board comprising any one of the ceramic plates described above and a conductor portion joined to the ceramic plate. Since this circuit board includes any one of the ceramic plates described above, it has sufficiently high reliability.
  • the present disclosure irradiates the main surface of a plate-shaped ceramic substrate with a laser beam and cuts out a part of the ceramic substrate, thereby penetrating in the thickness direction closer to the center than the outer edge of the main surface.
  • a method for manufacturing a ceramic plate comprising a step of forming a through-hole through which a through-hole is formed, and the outline of the through-hole on the main surface is curved.
  • the through-holes are formed closer to the center than the outer edge of the main surface of the ceramic substrate, it is possible to manufacture a ceramic plate that is less likely to break than when the through-holes are formed closer to the outer edge. can. Since the formed through-hole is formed by cutting out a part of the ceramic base material with a laser beam, it is possible to sufficiently reduce minute cracks on the inner wall of the through-hole. In addition, since the outline of the through-hole on the main surface is curved, it is possible to prevent the through-hole from becoming a crack starting point. Therefore, the ceramic plate obtained by the above manufacturing method has sufficiently high reliability even though it has through holes.
  • the inner wall may be composed of a cut surface formed by irradiating a laser beam once. As a result, the unevenness of the inner wall of the through-hole can be sufficiently reduced, and the ceramic plate can be made more difficult to crack.
  • the laser beam may form a through-hole by going around the main surface along the contour line. As a result, it is possible to smoothly form a through hole in which unevenness of the inner wall is sufficiently reduced.
  • the present disclosure provides a step of laminating a metal plate so as to cover the main surface and through-holes of any one of the ceramic plates described above, and bonding the metal plate to the ceramic plate to produce a bonded substrate. and removing a portion of the metal plate so as to expose the through hole to form a conductor portion on the main surface. Since this circuit board is manufactured using any one of the ceramic plates described above, it has sufficiently high reliability.
  • FIG. 2 is a plan view of the ceramic plate of FIG. 1;
  • FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2;
  • FIG. 4 is a plan view showing another example of a ceramic plate;
  • FIG. 2 is a schematic diagram when the ceramic plate of FIG. 1 is divided; It is a figure which shows the measuring method of bending strength.
  • It is a top view of a circuit board.
  • 1 is an electron micrograph showing an enlarged example of an inner wall of a through-hole formed by cutting with a laser beam.
  • 1 is an electron micrograph showing an enlarged example of a fracture surface obtained by fracture along a scribe line formed with a laser beam.
  • FIG. 1 is a perspective view showing an example of a ceramic plate
  • FIG. 2 is a plan view of the ceramic plate in FIG.
  • the ceramic plate 100 shown in FIGS. 1 and 2 has a flat plate shape.
  • the main surface 100A of the ceramic plate 100 has a rectangular shape and is divided into a plurality of linear first scribe lines L1 and linear second scribe lines L2 extending in mutually different directions. That is, the main surface 100A is provided with two first scribe lines L1 extending in the first direction and two second scribe lines L2 extending along the second direction orthogonal to the first direction. ing.
  • the first scribe line L1 and the second scribe line L2 extend in directions perpendicular to each other.
  • the first scribe line L1 and the second scribe line L2 are configured by aligning a plurality of holes formed by laser light in a straight line. None of the holes forming the first scribe line L1 and the second scribe line L2 are penetrating. Examples of laser light sources include carbon dioxide lasers and YAG lasers. A plurality of holes are formed along a predetermined direction by intermittently irradiating a laser beam from such a laser light source. Thus, the first scribe line L1 and the second scribe line L2 can be formed.
  • the two first scribe lines L1 parallel to each other and the second scribe lines L2 parallel to each other define one partition 10 .
  • the compartment 10 is surrounded by an edge 15 including the outer edge 101 of the main surface 100A.
  • a through hole 50 is formed in the center of the main surface 100A of the ceramic plate 100 so as to penetrate in a direction perpendicular to the main surface 100A (thickness direction of the ceramic plate 100).
  • the through hole 50 is formed by irradiating a laser beam and cutting out a part of the ceramic plate 100 .
  • 50 A of outlines of the through-hole 50 in 100 A of main surfaces are circular. Since the contour line 50A is curved and has no corners, it is possible to sufficiently prevent the through hole 50 from becoming a starting point of cracks.
  • the shape of the outline 50A of the through-hole 50 may be elliptical.
  • the curvature radius r of the contour line 50A may be 0.5 mm or more, 1 mm or more, or 2 mm or more from the viewpoint of sufficiently suppressing the through hole 50 from becoming a crack starting point.
  • the radius of curvature r may be 20 mm or less, or 10 mm or less, from the viewpoint of preventing the strength of the ceramic plate 100 from decreasing due to the through holes 50 becoming too large.
  • the shape of the contour line 50A is not limited to a circle, and may be curved.
  • the curvilinear contour line 50A is composed entirely of curved lines and does not have corners. As a result, it is possible to suppress the occurrence of breakage due to stress concentration.
  • FIG. 3 is a cross-sectional view taken along line III-III in FIG. That is, FIG. 3 shows a cross-sectional view when cutting the ceramic plate 100 along the thickness direction.
  • the partition 10 includes a region of one main surface 100A surrounded by the first scribe line L1 and the second scribe line L2, and the other main surface corresponding to the region. 100B, a virtual line VL1 drawn parallel to the thickness direction of the ceramic plate 100 from the first scribe line L1, and a virtual line (non-linear) drawn parallel to the thickness direction of the ceramic plate 100 from the second scribe line L2. ) and a three-dimensional area surrounded by . That is, the ceramic plate 100 has partitions 10 defined by the first scribe lines L1 and the second scribe lines L2.
  • the inner wall 52 of the through-hole 50 is formed by a laser beam cut surface and does not have a fractured surface. Therefore, it is possible to sufficiently reduce microcracks that may occur when the ceramic plate 100 is broken.
  • the through holes 50 can be formed by irradiating one or both of the main surface 100A and the main surface 100B of the ceramic plate 100 with a laser beam. Examples of laser light sources include carbon dioxide lasers and YAG lasers.
  • the inner wall 52 of the through-hole 50 may be composed of a cut surface formed by irradiating a laser beam once.
  • a cut surface is such that, for example, when a laser beam is irradiated along a predetermined target trajectory on the main surface 100A to form the through hole 50, the number of laps of the laser beam irradiation on the main surface 100A is reduced to one. can be formed by If the same position is irradiated with the laser beam multiple times, unevenness is likely to occur on the cut surface. Therefore, a cut surface formed by one-time irradiation with a laser beam has less irregularities than a cut surface formed by multiple irradiations. Therefore, the ceramic plate 100 can be made more difficult to crack.
  • the thickness h of the ceramic plate 100 may be 0.7 mm or less, 0.5 mm or less, or 0.4 mm or less. By reducing the thickness h, the thermal resistance in the thickness direction can be reduced.
  • the lower limit of the thickness h may be 0.3 mm from the viewpoint of manufacturability.
  • the through hole 50 is formed closer to the center than the outer edge 101 of the main surface 100A. That is, y1>x, where x is the longest distance between the center of the main surface 100A and the contour line 50A, and y1 is the shortest distance between the outer edge 101 of the main surface 100A and the contour line 50A of the through-hole 50. Having the through hole 50 near the center in this manner makes it possible to make the ceramic plate 100 less likely to be damaged when an external force is applied.
  • the contour line 50A of the through-hole 50 is a circle and the center of the through-hole 50 and the center of the main surface 100A coincide, the longest distance x is the radius of the circular contour line 50A.
  • FIG. 4 is a plan view showing another example of the ceramic plate.
  • Through hole 51 of ceramic plate 105 in FIG. 4 is formed offset from center P of main surface 105A.
  • the longest distance x between the center P of the main surface 105A and the contour line 50A is shorter than the shortest distance y1 between the outer edge 101 of the main surface 105A and the contour line 51A of the through-hole 51 . Therefore, also in this example, the through hole 51 is formed closer to the center P than the outer edge 101 of the main surface 105A.
  • the contour line 51A is an ellipse.
  • the range of the curvature radius r of the contour line 51A is as described above.
  • the longest distance x and the shortest distance y1 may satisfy y1 ⁇ 1.5x, y1 ⁇ 2x, and y1 ⁇ 2.5x.
  • the longest distance x between the center P and the contour line 50A is shorter than the shortest distance y2 between the scribe lines L1 and L2 formed on the main surface 105A and the contour line 51A of the through hole 51.
  • the ceramic plate 105 can be made more difficult to crack.
  • the ceramic plate obtained by dividing along the scribe lines L1 and L2 also has sufficiently high reliability.
  • the longest distance x and the shortest distance y2 may satisfy y2 ⁇ 1.4x, y2 ⁇ 1.8x, and y2 ⁇ 2.3x.
  • y2 sufficiently large with respect to x in this manner, the through hole 51 is sufficiently separated from the scribe lines L1 and L2 and is sufficiently close to the center P of the main surface 105A. Therefore, breakage of the ceramic plate can be further suppressed.
  • scribe lines may not be formed on the ceramic plate. Even if no scribe line is formed, the through-hole and the outer edge of the main surface may satisfy the above-described relationship between x and y1.
  • the size, position and shape of the through holes 50, 51 are not limited to the above examples.
  • the through holes may be formed such that the center P of the main surface is inside the outline 50A.
  • the center P may be on the contour line 50A (51A).
  • first scribe line L1 and the second scribe line L2 are formed only on one main surface of the ceramic plate, but the present invention is not limited to this.
  • first scribe line L1 and the second scribe line L2 may also be formed on the main surface 100B of the ceramic plate 100 opposite to the main surface 100A.
  • either one of the first scribe line L1 and the second scribe line L2 may be formed, or the scribe line may not be formed on both main surfaces.
  • FIG. 5 is a schematic diagram of cutting the end of the ceramic plate 100 along the first scribe line L1 and the second scribe line L2.
  • the ceramic plate 100 of FIG. 1 is divided into a ceramic plate 102 and four pieces 15A. That is, the partitioned portion 10 of the ceramic plate 100 becomes another example of the ceramic plate 102, and the end portion 15 becomes four pieces 15A.
  • the end portion 15 is divided into four pieces 15A, but the end portion 15 may be separated from the ceramic plate 100 without being divided. That is, the ceramic plate 100 may be cut out and divided into the end portion 15 and the ceramic plate 102 .
  • the ceramic plate 102 obtained in this way also has the through holes 50 formed closer to the center of the main surface 102A than the outer edge 103 of the main surface 102A, so that it is difficult to break and has sufficiently excellent reliability.
  • the ceramic plates 100, 102, 105 may contain at least one selected from the group consisting of silicon nitride, silicon carbide, alumina, aluminum nitride and boron nitride.
  • the ceramic plates 100, 102, 105 may be, for example, silicon nitride plates from the viewpoint of ease of forming the through holes 50, 51 with laser light.
  • the maximum bending load of the ceramic plates 100, 102, 105 may be, for example, 40N or more, or may be 50N or more. The maximum bending load in this specification is measured as follows using a measuring device for measuring bending strength.
  • a tension/compression tester (model: SDT-503NB-50R1T) manufactured by Imada Seisakusho Co., Ltd. can be used.
  • the maximum bending load there is no particular upper limit to the maximum bending load, and it may be 100 N or less, for example.
  • the test pieces (ceramic plates 100, 102, 105) are placed on a pair of supports 31, 32 of the measuring device 200.
  • the bending strength can be measured by vertically sandwiching the test piece between the support portions 31 and 32 and the load portion 33 provided above them and moving the load portion 33 downward with respect to the support portions 31 and 32 .
  • the bending strength is calculated by the following formula.
  • F is the maximum bending load when the test piece breaks
  • L is the distance between fulcrums
  • b the width of the test piece
  • the test piece is arranged so that the diameter of this circle and the tip of the load part 33 match. This makes it possible to evaluate the resistance to cracking of the test piece having the through-holes 50 (51) with a high degree of objectivity.
  • the opening area of the through holes 50 and 51 on the main surface may be, for example, 10 mm 2 or more, 25 mm 2 or more, or 50 mm 2 or more.
  • the through holes 50 and 51 can be suitably used for fixing the ceramic plates 100, 102 and 105 or a circuit board having them, for example.
  • the through holes 50 and 51 may be formed as screw holes, and the ceramic plate or the circuit board provided therewith may be fixed to another base material using screws.
  • the uses and functions of the through holes 50 and 51 are not limited to this, and for example, the through holes 50 and 51 may be used as through holes.
  • the through-holes 50 and 51 may be metal-plated to insert electronic components, or may be used as via-holes for conducting between layers.
  • the opening area of the through holes 50, 51 on the main surfaces may be less than 200 mm 2 or less than 100 mm 2 .
  • the ratio of the opening area of the through holes 50, 51 to the total area of the main surfaces 100A, 102A, 105A of the ceramic plates 100, 102, 105 may be less than 8%, and less than 5%.
  • the ratio may be 0.1% or more, or may be 0.2% or more.
  • a plurality of through-holes may be provided in the ceramic plate.
  • all through-holes are formed closer to the center of the main surface than the outer edge of the main surface. Examples of the position, shape, size and open area ratio of each through-hole are as described above.
  • the plurality of through-holes may have different shapes, sizes, and open area ratios.
  • the shape of the ceramic plate is not limited to a quadrangular prism shape. For example, the corners may be chamfered, or it may have a cylindrical shape or a polygonal prism shape other than a quadrangular prism.
  • the size of the ceramic plate is also not particularly limited, and the area of the main surface of the ceramic plate including the opening area of the through holes may be 2800 mm 2 or more, or 3375 mm 2 or more. Also, the area of the main surface of the ceramic plate, including the opening area of the through holes, may be 21,250 mm 2 or less, and may be 20,000 mm 2 or less.
  • These steps may be performed simultaneously, or the through holes may be formed first, and then the first scribe line L1 and the second scribe line L2 may be formed.
  • Examples of laser light include carbon dioxide lasers and YAG lasers.
  • the same laser beam or different laser beams may be used for forming the through-holes and forming the scribe lines L1 and L2.
  • the main surface of the ceramic base material is irradiated with a laser beam, and a plurality of holes are formed so as to connect with each other to form the scribe lines L1 and L2 on the main surface of the ceramic base material. be able to.
  • a circular target trajectory corresponding to the contour line 50A of the through-hole 50 to be formed is set at a predetermined position on the main surface 100A of the ceramic substrate.
  • a laser beam is irradiated to one point on this target trajectory to form a hole penetrating through the ceramic substrate in the thickness direction.
  • the irradiation position of the laser light is gradually moved in a predetermined circumferential direction (clockwise or counterclockwise) along the target trajectory.
  • the number of rounds of laser light irradiation may be one or two or more.
  • the inner wall 52 of the through-hole 50 will be composed of a cut surface by the laser beam. In this case, since the inner wall 52 does not have a fracture surface, microcracks in the inner wall 52 can be sufficiently reduced.
  • the number of laps of laser light irradiation may be two or more. However, when the number of turns of the laser light on the target trajectory increases, the irradiation position may shift slightly for each turn, and the unevenness of the inner wall 52 may increase. Therefore, it is also possible to move in a predetermined circumferential direction on the target trajectory while penetrating the hole, and to cut out the ceramic base material with the target trajectory being circulated once. That is, the ceramic base material may be cut out along the main surface 100A along the contour line 50A. As a result, the inner wall 52 formed by the cut surface formed by irradiating the laser beam once is obtained. Therefore, it is possible to form the through hole 50 constituted by the inner wall 52 with sufficiently reduced unevenness.
  • the cut surface formed by making the number of revolutions of the laser light irradiated along the target trajectory one in this way is referred to as "the cut surface formed by irradiating the laser light once”.
  • a cut surface formed by the laser beam traveling two or more times along the same trajectory does not correspond to "a cut surface formed by irradiating the laser beam once".
  • the output of the laser light when forming the through holes 50 may be 50 to 300W. If the output is less than 50 W, the time required to cut the ceramic substrate tends to be long. When the output exceeds 300 W, the number of microcracks that occur when cutting the ceramic substrate tends to increase.
  • the focal length of the laser light may be 5 mm or less, 3 mm or less, or 0.0 mm (just focus). By reducing the focal length, the condensed diameter becomes smaller, and the time required for cutting can be shortened even if the output is reduced.
  • the frequency of the laser light may be 0.5-500 kHz. If the frequency is less than 0.5 kHz, the energy per pulse increases and microcracks tend to occur easily. When the frequency exceeds 500 kHz, the time required to cut the ceramic substrate tends to become longer.
  • the moving speed (processing speed) of the laser beam may be 10 to 200 mm/sec, or may be 20 to 100 mm/sec. This makes it possible to sufficiently suppress the occurrence of microcracks while maintaining manufacturing efficiency.
  • the ceramic substrate used in the above-described manufacturing method includes, for example, a lamination step of laminating a plurality of ceramic green sheets to obtain a laminate, a degreasing step of heating and degreasing the laminate, and firing the degreased laminate. and a firing step of obtaining a ceramic plate. Details are described below.
  • Ceramics are not particularly limited, and include, for example, nitrides, oxides and carbides. Specific examples include silicon nitride, silicon carbide, alumina, aluminum nitride and boron nitride. Binders include those containing organic components.
  • the binder may be an acrylic copolymer.
  • the dispersant may be an unsaturated fatty acid.
  • the raw material slurry is applied to a predetermined thickness on the release film by a doctor blade method, calendar method, extrusion method, or the like. Thereafter, the coated raw material slurry is dried and peeled off from the release film to obtain a ceramic green sheet.
  • the ceramic green sheets may be processed into a desired shape, for example by cutting. The materials and shapes of the plurality of ceramic green sheets may be the same or different.
  • a laminate is obtained by stacking multiple ceramic green sheets on a setter.
  • a plurality of ceramic green sheets are laminated so that their main surfaces are in contact with each other, and another setter is placed thereon to produce a laminate.
  • the laminate In the degreasing step, the laminate is placed in a degreasing furnace and heated to, for example, 300°C to 700°C. As a result, the binder and dispersant contained in the ceramic green sheets volatilize and the ceramic green sheets shrink.
  • the degreased ceramic green sheets are placed in a firing furnace and heated to 1600°C to 2000°C. Thereby, the ceramic green sheets are fired to obtain a ceramic plate.
  • the degreasing furnace used for degreasing and the firing furnace used for firing may be the same furnace or may be different furnaces. Also, the heating temperature, time and atmosphere may be appropriately adjusted according to the composition of the ceramic green sheet. In this way, a plate-shaped ceramic substrate can be obtained.
  • the method for producing the ceramic substrate is not limited to the method described above.
  • FIG. 7 is a plan view showing an example of a circuit board.
  • the circuit board 350 includes a ceramic plate 102 and conductor portions 20, 22, 24 joined to the main surface 102A of the ceramic plate 102 via, for example, brazing material.
  • the circuit board 350 is used, for example, as a component such as a power module.
  • electronic components are mounted on the conductor portions 20 , 22 , 24 of the circuit board 350 . Since the circuit board 350 includes the ceramic plate 102, it is highly reliable.
  • the circuit board 350 can be fixed to another member through the through holes 50 formed in the ceramic plate 102 .
  • a product such as a power module that includes the circuit board 350 and other members has high reliability.
  • the principal surface of the circuit board 350 opposite to the principal surface 102A may be in contact with a cooling member (cooling fin).
  • a fixing jig such as a screw may be inserted into the through hole 50 formed in the ceramic plate 102, and the ceramic plate 102 and the cooling member may be fixed to each other by the fixing jig.
  • a metal plate is laminated so as to cover the main surface 100A of the ceramic plate 100, the metal plate is bonded to the ceramic plate 100 to prepare a bonded substrate, and a part of the metal plate in the bonded substrate is removed. and forming a conductor portion.
  • the metal plate may have a flat plate shape similar to the ceramic plate 100 .
  • the metal plates are each joined to the main surface 100A of the ceramic plate 100 via brazing filler metal.
  • a paste-like brazing material is applied to the main surface 100A of the ceramic plate 100 by a roll coater method, screen printing method, transfer method, or the like.
  • the brazing material contains, for example, metal components such as silver and titanium, an organic solvent, a binder, and the like.
  • the brazing material may have a viscosity of, for example, 5 to 20 Pa ⁇ s.
  • the content of the organic solvent in the brazing material may be, for example, 5 to 25% by mass, and the content of the binder may be, for example, 2 to 15% by mass.
  • a metal plate is attached to the main surface 100A of the ceramic plate 100 to which the brazing material is applied to produce a laminate in which the metal plate and the ceramic plate 100 are laminated. Thereafter, the ceramic plate 100 and the metal plate are sufficiently bonded by heating in a heating furnace to obtain a bonded substrate.
  • the heating temperature may be, for example, 700-900°C.
  • the atmosphere in the heating furnace may be an inert gas such as nitrogen, and the heating may be performed under reduced pressure below atmospheric pressure, or may be performed under vacuum.
  • the heating furnace may be of a continuous type that continuously manufactures a plurality of bonded substrates, or it may be of a batch type that manufactures one or a plurality of bonded substrates. Heating may be performed while pressing the laminate in the lamination direction.
  • the conductors 20, 22, 24 are formed by removing part of the metal plate in the bonding substrate.
  • This step may be performed, for example, by photolithography. Specifically, first, a photosensitive resist is printed on the main surface of the metal plate. Then, using an exposure device, a resist pattern having a predetermined shape is formed. The resist may be negative or positive. Uncured resist is removed, for example, by washing.
  • the part of the metal plate that is not covered with the resist pattern is removed by etching. At this time, the portion of the metal plate that covers the through hole 50 is also removed. As a result, a portion of the main surface 100A of the ceramic plate 100 and the through holes 50 are exposed. After that, the resist pattern is removed to form conductor portions 20, 22, and 24. Next, as shown in FIG. After that, the ceramic plate 100 is divided along the first scribe line L1 and the second scribe line L2 to cut off the ends 15 . In this way, it is possible to obtain a circuit board 350 that is excellent in reliability while having the ceramic plate 102 having the through holes 50 .
  • bonded substrates comprising the ceramic plate 105 or different ceramic plates may be used to manufacture composite substrates and circuit boards.
  • the ceramic plate may not have scribe lines.
  • the circuit board can be manufactured without dividing the ceramic plate.
  • a circuit board may be manufactured by dividing an aggregate board. In this case, if each ceramic plate provided on the circuit board obtained by dividing the aggregate board has the same through-hole as described above, the circuit board has high reliability.
  • the formed body is placed on a setter made of boron nitride, placed in an electric furnace equipped with a carbon heater, degreased in air at 500°C for 12 hours, and heated to 1800°C in a nitrogen gas atmosphere. and sintered for 12 hours to obtain a silicon nitride sintered body.
  • the silicon nitride sintered body had a square prism shape.
  • one main surface of the silicon nitride plate was irradiated with a laser beam to form a through hole penetrating in the thickness direction at the center of the main surface.
  • the laser irradiation conditions were as follows. ⁇ Focal length: 0.0mm (just focus) ⁇ Processing speed: 50mm/sec ⁇ Output: 200W
  • a laser beam was irradiated along a circular target trajectory corresponding to the size of the through-hole. Irradiation of the laser light was performed so that a circle was drawn clockwise on the main surface while forming a through hole at the irradiation position.
  • a through-hole having a cylindrical shape with a diameter of 10 mm was formed by making one round of the target trajectory of the laser beam.
  • a silicon nitride plate of Example 1 was produced.
  • the opening area of the through hole, the ratio of the opening area to the main surface, the longest distance x between the center of the main surface and the contour line of the through hole, and the shortest distance y1 between the outer edge of the main surface and the contour line of the through hole are , as shown in Table 1.
  • a scribe line was formed on the main surface using a laser beam so as to have the shortest distance y2 shown in Table 1.
  • the maximum bending load F of the silicon nitride plate having through holes was measured.
  • a tension/compression tester (model: SDT-503NB-50R1T) manufactured by Imada Seisakusho Co., Ltd. was used.
  • the distance L between fulcrums was 30 mm
  • the width b of the test piece was 60 mm
  • the thickness h of the test piece was 0.32 mm.
  • the load portion 33 was pressed so as to bisect the through-hole, and the measurement was performed. Measurements were made using 5 specimens.
  • the average values of the maximum bending loads F were as shown in Table 1.
  • Example 2-4 A silicon nitride plate was produced in the same manner as in Example 1, except that the size of the through holes was changed as shown in Table 1. Then, in the same manner as in Example 1, the average value of the maximum bending loads F of the silicon nitride plates having through holes was obtained. As a result, the average value of the maximum bending load F was as shown in Table 1
  • FIG. 8 is a scanning electron microscope photograph (SEM photograph) showing an enlarged part of the inner wall of the through hole formed in the silicon nitride plate of Example 5.
  • the upper side is an SEM photograph at approximately 200 times magnification, and the lower side is an SEM photograph at approximately 1000 times magnification.
  • FIG. 9 is an enlarged SEM photograph showing a part of a fracture surface obtained by breaking a silicon nitride sintered body similar to the silicon nitride sintered body used in Example 5 along the scribe line. .
  • the upper side is an SEM photograph at approximately 200 times magnification, and the lower side is an SEM photograph at approximately 1000 times magnification.
  • microcracks had occurred, as shown.
  • no microcracks were detected on the inner wall of the through-hole in FIG. From this, it was confirmed that microcracks are less likely to occur in the inner wall (cut surface) of a through hole formed by cutting with a laser beam.
  • the present disclosure it is possible to provide a ceramic plate having sufficiently high reliability while having through holes, and a method for manufacturing the same. Also, it is possible to provide a circuit board having sufficiently high reliability provided with such a ceramic plate and a method of manufacturing the same.

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  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
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  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2022/004738 2021-02-12 2022-02-07 セラミック板及びその製造方法、並びに、回路基板及びその製造方法 WO2022172900A1 (ja)

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JPH09511791A (ja) * 1994-10-20 1997-11-25 エレクトロ サイエンティフィック インダストリーズ インコーポレイテッド 通路をメッキするレーザ法
JP2005345526A (ja) * 2004-05-31 2005-12-15 Sumitomo Heavy Ind Ltd ガルバノスキャナの制御方法、装置及びレーザ加工方法
JP2006134989A (ja) * 2004-11-04 2006-05-25 Mitsubishi Electric Corp ヒートシンク、発熱体、放熱構造物および熱交換器
JP2011110589A (ja) * 2009-11-27 2011-06-09 Hitachi Via Mechanics Ltd レーザ加工方法
JP2011171349A (ja) * 2010-02-16 2011-09-01 Kyocera Corp 配線基板およびそれを用いた電子装置

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JPH0541169U (ja) * 1991-11-01 1993-06-01 三菱電機株式会社 プリント基板
JP2002223044A (ja) * 2001-01-24 2002-08-09 Tdk Corp 電子部品の製造方法及び集合基板
JP6076217B2 (ja) * 2013-07-17 2017-02-08 三菱電機株式会社 基板固定構造およびその基板固定構造を適用した電子機器
JP2016051778A (ja) * 2014-08-29 2016-04-11 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板
CN111758302A (zh) * 2018-02-27 2020-10-09 三菱综合材料株式会社 绝缘电路基板

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH09511791A (ja) * 1994-10-20 1997-11-25 エレクトロ サイエンティフィック インダストリーズ インコーポレイテッド 通路をメッキするレーザ法
JP2005345526A (ja) * 2004-05-31 2005-12-15 Sumitomo Heavy Ind Ltd ガルバノスキャナの制御方法、装置及びレーザ加工方法
JP2006134989A (ja) * 2004-11-04 2006-05-25 Mitsubishi Electric Corp ヒートシンク、発熱体、放熱構造物および熱交換器
JP2011110589A (ja) * 2009-11-27 2011-06-09 Hitachi Via Mechanics Ltd レーザ加工方法
JP2011171349A (ja) * 2010-02-16 2011-09-01 Kyocera Corp 配線基板およびそれを用いた電子装置

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