JPWO2022172900A1 - - Google Patents

Info

Publication number
JPWO2022172900A1
JPWO2022172900A1 JP2022542775A JP2022542775A JPWO2022172900A1 JP WO2022172900 A1 JPWO2022172900 A1 JP WO2022172900A1 JP 2022542775 A JP2022542775 A JP 2022542775A JP 2022542775 A JP2022542775 A JP 2022542775A JP WO2022172900 A1 JPWO2022172900 A1 JP WO2022172900A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022542775A
Other languages
Japanese (ja)
Other versions
JPWO2022172900A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022172900A1 publication Critical patent/JPWO2022172900A1/ja
Publication of JPWO2022172900A5 publication Critical patent/JPWO2022172900A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C04B35/587—Fine ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
JP2022542775A 2021-02-12 2022-02-07 Pending JPWO2022172900A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021021101 2021-02-12
PCT/JP2022/004738 WO2022172900A1 (ja) 2021-02-12 2022-02-07 セラミック板及びその製造方法、並びに、回路基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2022172900A1 true JPWO2022172900A1 (enrdf_load_stackoverflow) 2022-08-18
JPWO2022172900A5 JPWO2022172900A5 (enrdf_load_stackoverflow) 2023-01-24

Family

ID=82837896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022542775A Pending JPWO2022172900A1 (enrdf_load_stackoverflow) 2021-02-12 2022-02-07

Country Status (2)

Country Link
JP (1) JPWO2022172900A1 (enrdf_load_stackoverflow)
WO (1) WO2022172900A1 (enrdf_load_stackoverflow)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541169U (ja) * 1991-11-01 1993-06-01 三菱電機株式会社 プリント基板
JPH09511791A (ja) * 1994-10-20 1997-11-25 エレクトロ サイエンティフィック インダストリーズ インコーポレイテッド 通路をメッキするレーザ法
JP2002223044A (ja) * 2001-01-24 2002-08-09 Tdk Corp 電子部品の製造方法及び集合基板
JP2005345526A (ja) * 2004-05-31 2005-12-15 Sumitomo Heavy Ind Ltd ガルバノスキャナの制御方法、装置及びレーザ加工方法
JP2006134989A (ja) * 2004-11-04 2006-05-25 Mitsubishi Electric Corp ヒートシンク、発熱体、放熱構造物および熱交換器
JP2011110589A (ja) * 2009-11-27 2011-06-09 Hitachi Via Mechanics Ltd レーザ加工方法
JP2011171349A (ja) * 2010-02-16 2011-09-01 Kyocera Corp 配線基板およびそれを用いた電子装置
JP2015023087A (ja) * 2013-07-17 2015-02-02 三菱電機株式会社 基板固定構造
JP2016051778A (ja) * 2014-08-29 2016-04-11 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板
WO2019167942A1 (ja) * 2018-02-27 2019-09-06 三菱マテリアル株式会社 絶縁回路基板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541169U (ja) * 1991-11-01 1993-06-01 三菱電機株式会社 プリント基板
JPH09511791A (ja) * 1994-10-20 1997-11-25 エレクトロ サイエンティフィック インダストリーズ インコーポレイテッド 通路をメッキするレーザ法
JP2002223044A (ja) * 2001-01-24 2002-08-09 Tdk Corp 電子部品の製造方法及び集合基板
JP2005345526A (ja) * 2004-05-31 2005-12-15 Sumitomo Heavy Ind Ltd ガルバノスキャナの制御方法、装置及びレーザ加工方法
JP2006134989A (ja) * 2004-11-04 2006-05-25 Mitsubishi Electric Corp ヒートシンク、発熱体、放熱構造物および熱交換器
JP2011110589A (ja) * 2009-11-27 2011-06-09 Hitachi Via Mechanics Ltd レーザ加工方法
JP2011171349A (ja) * 2010-02-16 2011-09-01 Kyocera Corp 配線基板およびそれを用いた電子装置
JP2015023087A (ja) * 2013-07-17 2015-02-02 三菱電機株式会社 基板固定構造
JP2016051778A (ja) * 2014-08-29 2016-04-11 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板
WO2019167942A1 (ja) * 2018-02-27 2019-09-06 三菱マテリアル株式会社 絶縁回路基板

Also Published As

Publication number Publication date
WO2022172900A1 (ja) 2022-08-18

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