WO2022166525A1 - 天线装置及电子设备 - Google Patents

天线装置及电子设备 Download PDF

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Publication number
WO2022166525A1
WO2022166525A1 PCT/CN2022/070802 CN2022070802W WO2022166525A1 WO 2022166525 A1 WO2022166525 A1 WO 2022166525A1 CN 2022070802 W CN2022070802 W CN 2022070802W WO 2022166525 A1 WO2022166525 A1 WO 2022166525A1
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WO
WIPO (PCT)
Prior art keywords
slot
resonance
slit
metal layer
segment
Prior art date
Application number
PCT/CN2022/070802
Other languages
English (en)
French (fr)
Inventor
王泽东
Original Assignee
Oppo广东移动通信有限公司
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Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2022166525A1 publication Critical patent/WO2022166525A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • the present application relates to the field of communication technologies, and in particular, to an antenna device and an electronic device.
  • UWB Ultra Wide Band, Ultra Wide Band
  • UWB positioning technology has better performance and positioning accuracy, and is more suitable for indoor positioning.
  • the mobile phone is the most commonly used mobile terminal, and it is a better choice to apply the UWB positioning technology to the mobile phone.
  • Embodiments of the present application provide an antenna device and an electronic device.
  • the first metal layer and the flexible circuit board form a resonant cavity, so that the Resonance is generated through the resonant cavity, and wireless signals are radiated through the first slot, so the design of the antenna can be simplified.
  • an embodiment of the present application provides an antenna device, and the antenna device includes:
  • a first metal layer a recessed area is formed on the first surface of the first metal layer, and a feeding structure connected to the first metal layer and a first slit extending through the first metal layer and extending along the first direction are arranged in the recessed area;
  • the filling layer is filled in the recessed area and the first gap, and the filling layer is provided with a through hole for passing through the feeding structure;
  • a flexible circuit board includes a flexible substrate, a feeder disposed on the first surface of the flexible substrate, and a second metal layer disposed on the second surface of the flexible substrate, and the flexible circuit board is laminated and disposed on the first surface of the first metal layer. one side, and form a resonant cavity together with the first metal layer in the recessed area;
  • the feeding line is connected with the feeding structure, and is used for feeding an excitation signal into the resonant cavity through the feeding structure, so as to excite the resonant cavity to generate the target resonance.
  • the present application also provides an electronic device, the electronic device comprising:
  • the inner surface of the metal back cover is formed with a concave area, and the concave area is provided with a feeding structure connected to the metal back cover and a first slit extending through the metal back cover and extending in a first direction;
  • the filling layer is filled in the recessed area and the first gap, and the filling layer is provided with a through hole for passing through the feeding structure;
  • a flexible circuit board includes a flexible substrate, a feeder disposed on the first surface of the flexible substrate, and a metal layer disposed on the second surface of the flexible substrate, and the flexible circuit board is stacked and disposed on the side where the first surface of the metal back cover is located, and a resonant cavity is formed together with the metal back cover in the recessed area;
  • the feeding line is connected with the feeding structure, and is used for feeding the excitation signal into the resonant cavity through the feeding structure, so as to make the resonant cavity generate the target resonance.
  • FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is a schematic exploded schematic diagram of a first structure of an antenna device provided by an embodiment of the present application
  • FIG. 3 is a schematic three-dimensional structure diagram of the first metal layer in FIG. 2;
  • FIG. 4 is a schematic diagram of the overall structure of the antenna device provided in FIG. 2;
  • FIG. 5 is a schematic exploded schematic diagram of the second structure of the antenna device provided by the embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a first slot in an antenna device according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a second slot in an antenna device provided by an embodiment of the present application.
  • FIG. 8 is a schematic exploded schematic diagram of a third structure of an antenna device provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of the current distribution corresponding to the resonance frequency points formed when the antenna device is in operation in the embodiment of the application.
  • FIG. 10 is a reflection coefficient curve diagram of an antenna device provided by an embodiment of the present application.
  • FIG. 11 is a schematic diagram of a system efficiency curve of an antenna device provided by an embodiment of the present application.
  • FIG. 12 is a far-field radiation pattern of the antenna device provided by the embodiment of the application.
  • FIG. 13 is another far-field radiation pattern of the antenna device provided by the embodiment of the application.
  • FIG. 14 is another far-field radiation pattern of the antenna device provided by the embodiment of the application.
  • 15 is a schematic diagram of a second structure of an electronic device provided by an embodiment of the present application.
  • FIG. 16 is a third schematic structural diagram of an electronic device provided by an embodiment of the application.
  • 17 is a schematic diagram of a fourth structure of an electronic device provided by an embodiment of the application.
  • FIG. 18 is a fifth structural schematic diagram of an electronic device provided by an embodiment of the application.
  • FIG. 19 is a schematic diagram of a sixth structure of an electronic device provided by an embodiment of the present application.
  • An embodiment of the present application provides an electronic device, and the electronic device may include a smart phone, a tablet computer, a game device, an AR (Augmented Reality, augmented reality) device, a notebook computer, a desktop computing device, and the like.
  • the electronic device may include a smart phone, a tablet computer, a game device, an AR (Augmented Reality, augmented reality) device, a notebook computer, a desktop computing device, and the like.
  • FIG. 1 is a schematic diagram of a first structure of an electronic device 100 according to an embodiment of the present application.
  • the electronic device 100 includes a display screen 10 , a housing 20 , a circuit board 30 and a battery 40 .
  • the display screen 10 is disposed on the casing 20 to form a display surface of the electronic device 100 for displaying information such as images and texts.
  • the display screen 10 may include a liquid crystal display (Liquid Crystal Display, LCD) or an organic light-emitting diode (Organic Light-Emitting Diode, OLED) type display screen.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • the display screen 10 may include a display surface and a non-display surface opposite to the display surface.
  • the display surface is the surface of the display screen 10 facing the user, that is, the surface of the display screen 10 that is visible to the user on the electronic device 100.
  • the non-display surface is the surface of the display screen 10 facing the interior of the electronic device 100 . Wherein, the display surface is used for displaying information, and the non-display surface does not display information.
  • a cover plate may also be provided on the display screen 10 to protect the display screen 10 and prevent the display screen 10 from being scratched or damaged by water.
  • the cover plate may be a transparent glass cover plate, so that the user can observe the content displayed on the display screen 10 through the cover plate. It can be understood that the cover plate may be a glass cover plate made of sapphire.
  • the casing 20 is used to form the outer contour of the electronic device 100 so as to accommodate the electronic devices, functional components, etc. of the electronic device 100 , and at the same time form a seal and protect the electronic devices and functional components inside the electronic device.
  • the camera, circuit board, vibration motor and other functional components of the electronic device 100 may be arranged inside the housing 20 .
  • the housing 20 may include a middle frame and a back cover.
  • the middle frame may be a thin plate-like or flake-like structure, and may also be a hollow frame structure.
  • the middle frame is used to provide support for the electronic devices or functional components in the electronic device 100 so as to mount the electronic devices and functional components of the electronic device 100 together.
  • structures such as grooves and protrusions may be provided on the middle frame, so as to facilitate the installation of electronic devices or functional components of the electronic device 100 .
  • the material of the middle frame may include metal or plastic.
  • the back cover is connected with the middle frame.
  • the back cover can be attached to the middle frame by an adhesive such as double-sided tape to realize the connection with the middle frame.
  • the back cover is used to seal the electronic devices and functional components of the electronic device 100 together with the middle frame and the display screen 10 inside the electronic device 100 to form a protective effect on the electronic devices and functional components of the electronic device 100 .
  • the back cover can be integrally formed.
  • structures such as a camera mounting hole for a rear camera may be formed on the back cover.
  • the material of the back cover may also include metal or plastic.
  • the circuit board 30 is arranged inside the casing 20 .
  • the circuit board 30 may be mounted on the middle frame of the housing 20 for fixing, and the circuit board 30 may be sealed inside the electronic device through the back cover.
  • the circuit board may be mounted on one side of the carrier board, and the display screen may be mounted on the other side of the carrier board.
  • the circuit board 30 may be the main board of the electronic device 100 .
  • the circuit board 30 may also integrate one or more functional components such as a processor, a camera, an earphone interface, an acceleration sensor, a gyroscope, and a motor.
  • the display screen 10 may be electrically connected to the circuit board 30 to control the display of the display screen 10 by a processor on the circuit board 30 .
  • the battery 40 is provided inside the case 20 .
  • the battery 40 may be mounted on the middle frame of the case 20 for fixing, and the battery 40 may be sealed inside the electronic device through the back cover.
  • the battery 40 is electrically connected to the circuit board 30 , so that the battery 40 can supply power to the electronic device 100 .
  • the circuit board 30 may be provided with a power management circuit.
  • the power management circuit is used to distribute the voltage provided by the battery 40 to the various electronic devices in the electronic device 100 .
  • the electronic device 100 is further provided with an antenna device, and the antenna device is used for radiating radio frequency signals to the outside world and receiving radio frequency signals from the outside world, so as to realize the wireless communication function of the electronic device 100 .
  • the radio frequency signal may include one of a cellular network signal, a wireless fidelity (Wireless Fidelity, Wi-Fi) signal, an ultra-wideband (Ultra Wide Band, UWB) signal, and a positioning signal.
  • FIG. 2 is a schematic exploded schematic diagram of a first structure of an antenna device 200 provided by an embodiment of the present application
  • FIG. 3 is a schematic three-dimensional structural schematic diagram of the first metal layer 110 in FIG. 2
  • FIG. Schematic diagram of the overall structure of the antenna device 200 .
  • an antenna device 200 is provided, and the antenna device 200 includes:
  • the first metal layer 110, a recessed area 120 is formed on the first surface of the first metal layer 110, and the recessed area 120 is provided with a feeding structure 122 connected to the first metal layer 110 and passing through the first metal layer 110 and along the first direction an extended first slit 124;
  • the filling layer 130 is filled in the recessed area 120 and the first gap 124, and the filling layer 120 is provided with a through hole 126 for passing through the feeding structure 122;
  • the flexible circuit board 140 includes a flexible substrate 142, a feeder 144 disposed on the first surface of the flexible substrate 142, and a second metal layer 146 disposed on the second surface of the flexible substrate 142.
  • the flexible circuit board 140 is stacked on the first surface of the flexible circuit board 142. the side where the first surface of the metal layer 110 is located, and forms a resonant cavity together with the first metal layer 110 in the recessed region 120;
  • the feeding line 144 is connected to the feeding structure 122, and is used for feeding an excitation signal to the resonant cavity through the feeding structure 122, so as to excite the resonant cavity to generate the target resonance, and at this time, the resonant cavity has an intrinsic resonance mode.
  • the above-mentioned feeding structure 122 adopts metal feeding posts.
  • the periphery of the first surface of the first metal layer 110 and the periphery of the second metal layer 146 are connected by laser welding.
  • the above-mentioned feed line 144 and the feed structure 122 are connected by solder tabs.
  • the above-mentioned first slit 112 is usually processed by a CNC (Computer numerical control machine tools, computer numerical control machine) process.
  • CNC Computer numerical control machine tools, computer numerical control machine
  • a recessed area 120 is formed on the first surface of the first metal layer 110 , and a feeding structure 122 connected to the first metal layer 110 and penetrating through the first metal layer 110 are provided in the recessed area 120 .
  • the first slit 124 extending along the first direction, the flexible circuit board 140 is stacked on the side where the first surface of the first metal layer 110 is located, and forms a resonant cavity in the recessed area 120 and the first metal layer 110 together, When an excitation signal is fed into the resonant cavity through the feeding structure 122, the resonant cavity resonates, and the wireless signal is radiated through the first slot 124.
  • the above-mentioned antenna device 200 can simplify the design of the antenna as a whole.
  • the resonant cavity after being fed with an excitation signal, the resonant cavity generates a target resonance and radiates a wireless signal through the first slot 124, the wireless signal is an ultra-wideband signal, and the antenna device 200 corresponds to a UWB antenna device.
  • FIG. 5 which is an exploded schematic diagram of the second structure of the antenna device 200 provided by the embodiment of the present application
  • the recessed region 120 is further provided with a penetrating first metal layer 110 extending along the second direction
  • the second gap 128 is in a different direction from the first direction, and the filling layer 130 is also filled in the second gap 128 .
  • the length of the first slot 124 along the first direction is different from the length of the second slot 128 along the second direction
  • the target resonance includes a first resonance and a second resonance with different resonance frequencies
  • the first resonance is determined by The resonator is excited through the first slot 124 and the second resonance is excited by the resonator through the second slot 128 .
  • the resonator when the length of the first slot 124 along the first direction is different from the length of the second slot 128 along the second direction, when the resonator enters the eigenresonance mode after generating the target resonance, the resonator will generate two The first resonance and the second resonance at different resonance frequency points radiate wireless signals through the first slot 124 and the second slot 128 , thereby increasing the bandwidth of the above-mentioned antenna device 200 .
  • the length of the first slot 124 along the first direction is equal to half of the free space wavelength of the resonance frequency corresponding to the first resonance.
  • a first current path is formed on the first metal layer 110 , the first current path is along the periphery of the first slot 124 , and the current intensity point of the first current path is located at the first At the two ends of the slot 124 , the current zero point of the first current path is located on both sides of the connection between the first slot 124 and the second slot 128 .
  • the length of the second slot 128 along the second direction is equal to half of the free-space wavelength of the resonance frequency corresponding to the second resonance.
  • a second current path is formed on the first metal layer 110 when the resonant cavity generates the second resonance. At the two ends of the slot 128 , the current zero point of the second current path is located on both sides of the connection between the second slot 128 and the first slot 124 .
  • the first slit 124 and the second slit 128 are in cross communication with each other.
  • the current zero point of the first current path is located on both sides of the connection between the first slit 124 and the second slit 128
  • the current zero point of the second current path is located between the first slit 124 and the second slit 128 . sides.
  • the first slit 124 includes a first slit segment 1241 , a second slit segment 1242 and a third slit segment 1243 that are connected in sequence, and the first slit segment 1241 and the third slit segment 1243 are all connected with The second slit 1242 is vertical.
  • the second slit 128 includes a fourth slit segment 1281 , a fifth slit segment 1282 and a sixth slit segment 1283 that are connected in sequence, and the fourth slit segment 1281 and the sixth slit segment 1283 are all connected with The fifth slot segment 1282 is vertical.
  • FIG. 8 is an exploded view of a third structure of an antenna device 200 provided by an embodiment of the present application.
  • the antenna device 200 includes a first metal layer 110 , a first A recessed area 120 is formed on the surface.
  • the recessed area 120 is provided with a feeding structure 122 connected to the first metal layer 110 and a first slit 124 extending through the first metal layer 110 and extending in the first direction.
  • the first metal layer 110 and the second gap 128 extending along the second direction, the second direction and the first direction are different directions, and the filling layer 130 is also filled in the second gap 128 .
  • the antenna device 200 further includes a filling layer 130 , the filling layer 130 is filled in the recessed area 120 and the first slit 124 , and the filling layer 120 is provided with a through hole for passing through the feeding structure 122 .
  • the antenna device 200 further includes a flexible circuit board 140.
  • the flexible circuit board 140 includes a flexible substrate 142, a feeder 144 disposed on the first surface of the flexible substrate 142, and a second metal layer 146 disposed on the second surface of the flexible substrate 142.
  • the flexible circuit The plate 140 is stacked on the side where the first surface of the first metal layer 110 is located, and forms a resonant cavity together with the first metal layer 110 in the recessed area 120 .
  • first slot 124 and the second slot 128 are in cross-connection with each other, and the first slot 124 includes a first slot segment 1241 , a second slot segment 1242 and a third slot segment 1243 which are connected in sequence, and the first slot segment 1241 and the third slot segment The segments 1243 are all perpendicular to the second slot 1242.
  • the second slot 128 includes a fourth slot segment 1281, a fifth slot segment 1282 and a sixth slot segment 1283 that are connected in sequence.
  • the fourth slot segment 1281 and the sixth slot segment 1283 are both connected to the The fifth slit segment 1282 is vertical, and at this time, the first slit 124 and the second slit 128 are both "I-shaped slits".
  • the length of the first slit 124 along the first direction is the sum of the slit length of the second slit segment 1242 , the slit width of the first slit segment 1241 and the slit width of the third slit segment 1243 , and the second slit 128 along the second direction is the sum of the slit length of the fifth slit segment 1282 , the slit width of the fourth slit segment 1281 and the slit width of the sixth slit segment 1283 .
  • the resonator when the resonator enters the eigenresonance mode after generating the target resonance, the resonator will generate two The first resonance and the second resonance at different resonance frequencies.
  • the resonant cavity will generate two first resonance and second resonance at the same resonance frequency.
  • the first current path is formed on the first metal layer 110 when the resonant cavity generates the first resonance, the first current path is along the periphery of the first slot 124 , and the current intensity point of the first current path is located on two sides of the first slot 124 .
  • a second current path is formed on the first metal layer 110 .
  • the current zero point of the first current path is located on both sides of the connection between the first slit 124 and the second slit 128
  • the current zero point of the second current path is located on both sides of the connection between the second slit 128 and the first slit 124 .
  • FIG. 9 is a schematic diagram of the current distribution at the resonance frequency point corresponding to the resonance cavity in the antenna device 200 according to the embodiment of the present application when the target resonance is generated, wherein the length of the first metal layer 110 is L, The width is W and the thickness is H, the length of the first slit 124 in the first direction is Ls, and the length of the second slit 128 in the second direction is Ws.
  • the first resonance is excited by the resonant cavity through the first slot 124
  • the second resonance is excited by the resonant cavity through the second slot 128, and a first current is formed on the first metal layer 110 when the resonant cavity generates the first resonance path
  • a second current path is formed on the first metal layer 110 when the resonant cavity generates a second resonance.
  • the current strong points of the first current path are located at both ends of the first slot 124
  • the current zero point of the first current path is located between the first slot 124 and the first slot 124 .
  • the current strong point of the second current path is located at both ends of the second slit 128 , and the current zero point of the second current path is located on the two sides where the second slit 128 communicates with the first slit 124 . side.
  • the antenna device 200 can radiate in two similar resonance modes, and further It greatly broadens the working bandwidth of the UWB antenna.
  • the resonant frequency point is represented by f mnp
  • the resonant frequency point f mnp is calculated by the following formula:
  • ur represents the magnetic permeability
  • ⁇ r represents the dielectric constant
  • m and n are both positive integers
  • p is an integer
  • L is the length of the first metal layer 110
  • W is the width of the first metal layer 110
  • H is the The thickness of the first metal layer 110 .
  • both m and n take 1, and p takes 0.
  • the reflection coefficient of the antenna device 200 is less than -8.3dB. It can be seen that the matching characteristic of the antenna device 200 is good. It can completely cover all frequency bands of UWB positioning technology in 6.5GHz.
  • 11 is a system efficiency curve of the antenna device 200 in the 6.25-6.75GHz frequency band in the embodiment of the application.
  • the average value of the system efficiency is about -2dB, and the antenna device 200 has excellent radiation performance.
  • FIG. 12 is a far-field radiation pattern at 6.25 GHz of the antenna device 200 according to an embodiment of the application
  • FIG. 13 is a far-field radiation pattern at 6.5 GHz of the antenna device 200 according to an embodiment of the application
  • FIG. 14 is an implementation of the application
  • the far-field radiation pattern of the antenna device 200 at 6.75 GHz is provided.
  • the corresponding directivity coefficients are all about 6.5 dBi, and the patterns are stable in the respective corresponding frequency bands.
  • the antenna device 200 is very suitable as a UWB positioning system. the receiving antenna.
  • Phi in FIGS. 12-14 respectively represents the far-field radiation angles corresponding to the antenna devices 200 respectively.
  • the filling layer 130 is composed of a non-metallic material.
  • non-metallic materials can be non-metallic materials such as resin, ceramics, plastics and glass.
  • the non-metallic material generally has a relatively low blocking degree to the wireless signal radiated by the above-mentioned antenna device 200 , which is basically negligible.
  • the thickness of the filling layer 130 is less than the recessed depth of the recessed region 120 .
  • a coating layer is provided on the second surface of the first metal layer 110 , the second surface is a surface opposite to the first surface of the first metal layer 110 , and the coating layer covers the first gap 124 and the second surface. Two slits 128 .
  • FIG. 15 is a schematic diagram of a second structure of an electronic device 100 provided by an embodiment of the present application.
  • the electronic device 100 includes: a metal back cover 150 and the antenna device 200 provided in the above-mentioned embodiment, except that the All structures except the first metal layer 110 .
  • the metal back cover 150 is used to replace the first metal layer 110 in the above-mentioned antenna device 200, and can realize the structure and function of the first metal layer 110 in the above-mentioned antenna device 200.
  • the inner surface of the metal back cover 150 is formed with the above-mentioned
  • the recessed area 120 in the embodiment corresponds to the same recessed area, and the structures arranged in the recessed area on the inner surface of the metal back cover 150 are also the same as the structures arranged in the recessed area 120 in the above-mentioned embodiment.
  • the surface can also realize the structure and function of the second surface of the first metal layer 110 in the above embodiments.
  • FIG. 16 is a third structural schematic diagram of an electronic device 100 provided by an embodiment of the present application.
  • the outer surface of the metal back cover 150 is further provided with a third Two slits 128 .
  • FIG. 17 is a fourth structural schematic diagram of an electronic device 100 provided in an embodiment of the present application.
  • the slit 124, the first slit 124 includes a first slit segment 1241, a second slit segment 1242 and a third slit segment 1243 which are connected in sequence, and the first slit segment 1241 and the third slit segment 1243 are both perpendicular to the second slit 1242 segment,
  • the first slit 124 is an "I-shaped slit".
  • FIG. 18 is a fifth structural schematic diagram of an electronic device 100 provided by an embodiment of the present application
  • the electronic device 100 further includes a second slot 128
  • the second slot 128 includes The fourth slot segment 1281, the fifth slot segment 1282 and the sixth slot segment 1283 are connected in sequence.
  • the fourth slot segment 1281 and the sixth slot segment 1283 are all perpendicular to the fifth slot segment 1282.
  • the first slot 124 is the same as the second slot segment 128.
  • the gaps 128 are all "I-shaped seams".
  • the electronic device 100 further includes a first slit 124 and a second slit 128.
  • a film coating process may be used to align the first slit 124 and the second slit 128.
  • the area where the two slits 128 are located is covered with a film to form a film.
  • the film covers at least the first slit 124 and the second slit 128, and the color of the film is the same as the color of the metal back cover 150, so that the metal The back cover 150 as a whole achieves the look and feel of metal.
  • FIG. 19 is a sixth schematic structural diagram of an electronic device 100 provided in an embodiment of the present application. At least three resonant cavities are formed in the electronic device 100 , including the first resonator The cavity, the second resonant cavity and the third resonant cavity, the first location area a in the outer surface of the metal back cover 150 corresponds to the first resonant cavity, and the second location area b in the outer surface of the metal back cover 150 corresponds to For the second resonant cavity, the third location area c on the outer surface of the metal back cover 150 corresponds to the third resonant cavity, and the first location area a and the second location area b are arranged along the corresponding first arrangement direction (vertical in FIG. 19 ). The first position area a and the third position area c are arranged along the corresponding second arrangement direction (the horizontal x-axis direction in FIG. 19 ), and the first arrangement direction and the second arrangement direction are perpendicular.
  • the first position area a, the second position area b and the third position area c are all provided with two “I-shaped seams” that intersect each other.

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Abstract

一种天线装置及电子设备，包括：第一金属层，形成有凹陷区域，凹陷区域内设置有馈电结构及第一缝隙；填充层，填充于凹陷区域及第一缝隙，填充层设有通孔；柔性电路板，包括柔性基板、馈线及第二金属层，柔性电路板层叠设置于第一金属层，并在凹陷区域与第一金属层共同形成一谐振腔；馈线与馈电结构连接。

Description

天线装置及电子设备
本申请要求于2021年02月08日提交中国专利局、申请号为202110172457.0、发明名称为“天线装置及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，特别涉及一种天线装置及电子设备。
背景技术
诸如智能手机等电子设备通常能够支持多种无线通信模式，例如UWB(Ultra Wide Band，超宽带)通信模式。UWB定位技术具有较好的性能和定位精度，更适用于室内定位。其中，手机作为最常用的移动终端，将UWB定位技术应用于手机中，是较好的选择。
发明内容
本申请实施例提供一种天线装置和电子设备，通过在第一金属层的第一表面上形成凹陷区域以及凹陷区域内设置第一缝隙，第一金属层与柔性电路板形成谐振腔，从而可以通过谐振腔产生谐振，并通过该第一缝隙辐射无线信号，因此可简化天线的设计。
第一方面，本申请实施例提供一种天线装置，该天线装置包括：
第一金属层，第一金属层的第一表面形成有凹陷区域，凹陷区域内设置有连接第一金属层的馈电结构及贯穿第一金属层且沿第一方向延伸的第一缝隙；
填充层，填充层填充于凹陷区域及第一缝隙，填充层设有用于穿设馈电结构的通孔；
柔性电路板，柔性电路板包括柔性基板、设置于柔性基板第一表面的馈线及设置于柔性基板第二表面的第二金属层，柔性电路板层叠设置于第一金属层的第一表面所在的一侧，并在凹陷区域与第一金属层共同形成一谐振腔；
馈线与馈电结构连接，用于通过馈电结构向谐振腔馈入激励信号，以激励谐振腔产生目标谐振。
第二方面，本申请还提供一种电子设备，上述电子设备包括：
金属后盖，金属后盖的内表面形成有凹陷区域，凹陷区域内设置有连接金属后盖的馈电结构及贯穿金属后盖且沿第一方向延伸的第一缝隙；
填充层，填充层填充于凹陷区域及第一缝隙，填充层设有用于穿设馈电结构的通孔；
柔性电路板，柔性电路板包括柔性基板、设置于柔性基板第一表面的馈线及设置于柔性基板第二表面的金属层，柔性电路板层叠设置于金属后盖的第一表面所在的一侧，并在凹陷区域与金属后盖共同形成一谐振腔；
馈线与馈电结构连接，用于通过馈电结构向谐振腔馈入激励信号，以使谐振腔产生目标谐振。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的 附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的第一结构示意图；
图2是本申请实施例提供的天线装置的第一结构爆炸示意图；
图3为图2中第一金属层的立体结构示意图；
图4为图2中所提供的天线装置的整体结构示意图；
图5为本申请实施例提供的天线装置的第二结构爆炸示意图；
图6为本申请实施例提供的天线装置中的第一缝隙的一种结构示意图；
图7为本申请实施例提供的天线装置中的第二缝隙的一种结构示意图；
图8为本申请实施例提供的天线装置的第三结构爆炸示意图；
图9为本申请实施例中天线装置工作时形成的谐振频点所对应的电流分布示意图；
图10为本申请实施例提供的天线装置的反射系数曲线图；
图11为本申请实施例提供的天线装置的系统效率曲线示意图；
图12为本申请实施例提供的天线装置的一远场辐射方向图；
图13为本申请实施例提供的天线装置的另一远场辐射方向图；
图14为本申请实施例提供的天线装置的又一远场辐射方向图；
图15为本申请实施例提供的一种电子设备的第二种结构示意图；
图16为本申请实施例提供的一种电子设备的第三种结构示意图；
图17为本申请实施例提供的一种电子设备的第四种结构示意图；
图18为本申请实施例提供的一种电子设备的第五种结构示意图；
图19为本申请实施例提供的一种电子设备的第六种结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本申请的保护范围。
本申请实施例提供一种电子设备，该电子设备可以包括智能手机、平板电脑、游戏设备、AR(Augmented Reality，增强现实)设备、笔记本电脑、桌面计算设备等。
请参阅图1，图1为本申请实施例提供的电子设备100的第一种结构示意图。
电子设备100包括显示屏10、壳体20、电路板30以及电池40。
其中，显示屏10设置在壳体20上，以形成电子设备100的显示面，用于显示图像、文本等信息。其中，显示屏10可以包括液晶显示屏(Liquid Crystal Display，LCD)或有机发光二极管显示屏(Organic Light-Emitting Diode，OLED)等类型的显示屏。
可以理解的，显示屏10可以包括显示面以及与所述显示面相对的非显示面。所述显示 面为所述显示屏10朝向用户的表面，也即所述显示屏10在电子设备100上用户可见的表面。所述非显示面为所述显示屏10朝向电子设备100内部的表面。其中，所述显示面用于显示信息，所述非显示面不显示信息。
可以理解的，显示屏10上还可以设置盖板，以对显示屏10进行保护，防止显示屏10被刮伤或者被水损坏。其中，所述盖板可以为透明玻璃盖板，从而用户可以透过盖板观察到显示屏10显示的内容。可以理解的，所述盖板可以为蓝宝石材质的玻璃盖板。
壳体20用于形成电子设备100的外部轮廓，以便于容纳电子设备100的电子器件、功能组件等，同时对电子设备内部的电子器件和功能组件形成密封和保护作用。例如，电子设备100的摄像头、电路板、振动马达都功能组件都可以设置在壳体20内部。可以理解的，所述壳体20可以包括中框和后盖。
其中，所述中框可以为薄板状或薄片状的结构，也可以为中空的框体结构。中框用于为电子设备100中的电子器件或功能组件提供支撑作用，以将电子设备100的电子器件、功能组件安装到一起。例如，所述中框上可以设置凹槽、凸起等结构，以便于安装电子设备100的电子器件或功能组件。可以理解的，中框的材质可以包括金属或塑胶等。
所述后盖与所述中框连接。例如，所述后盖可以通过诸如双面胶等粘接剂贴合到中框上以实现与中框的连接。其中，后盖用于与所述中框、所述显示屏10共同将电子设备100的电子器件和功能组件密封在电子设备100内部，以对电子设备100的电子器件和功能组件形成保护作用。可以理解的，后盖可以一体成型。在后盖的成型过程中，可以在后盖上形成后置摄像头的摄像头安装孔等结构。可以理解的，后盖的材质也可以包括金属或塑胶等。
电路板30设置在所述壳体20内部。例如，电路板30可以安装在壳体20的中框上，以进行固定，并通过后盖将电路板30密封在电子设备内部。具体的，所述电路板可以安装在承载板的一侧，以及所述显示屏安装在所述承载板的另一侧。其中，电路板30可以为电子设备100的主板。其中，所述电路板30上还可以集成有处理器、摄像头、耳机接口、加速度传感器、陀螺仪、马达等功能组件中的一个或多个。同时，显示屏10可以电连接至电路板30，以通过电路板30上的处理器对显示屏10的显示进行控制。
电池40设置在壳体20内部。例如，电池40可以安装在壳体20的中框上，以进行固定，并通过后盖将电池40密封在电子设备内部。同时，电池40电连接至所述电路板30，以实现电池40为电子设备100供电。其中，电路板30上可以设置有电源管理电路。所述电源管理电路用于将电池40提供的电压分配到电子设备100中的各个电子器件。
其中，电子设备100中还设置有天线装置，所述天线装置用于向外界辐射射频信号和接收外界的射频信号，以实现电子设备100的无线通信功能。其中，射频信号可以包括蜂窝网络信号、无线保真(Wireless Fidelity，Wi-Fi)信号、超宽带信号(Ultra Wide Band，UWB)以及定位信号等信号中的一种。
参考图2至图4，图2是本申请实施例提供的天线装置200的第一结构爆炸示意图，图3是图2中第一金属层110的立体结构示意图，图4为图2中所提供的天线装置200的整体结构示意图。
在本申请实施例中，提供一种天线装置200，该天线装置200包括：
第一金属层110，第一金属层110的第一表面形成有凹陷区域120，凹陷区域120内设置有连接第一金属层110的馈电结构122及贯穿第一金属层110且沿第一方向延伸的第一缝隙124；
填充层130，填充层130填充于凹陷区域120及第一缝隙124，填充层120设有用于穿设馈电结构122的通孔126；
柔性电路板140，柔性电路板140包括柔性基板142、设置于柔性基板142第一表面的馈线144及设置于柔性基板142第二表面的第二金属层146，柔性电路板140层叠设置于第一金属层110的第一表面所在的一侧，并在凹陷区域120与第一金属层110共同形成一谐振腔；
馈线144与馈电结构122相连接，用于通过馈电结构122向谐振腔馈入激励信号，以激励谐振腔产生目标谐振，此时该谐振腔出现本征谐振模式。
在至少一个实施例中，上述馈电结构122采用金属馈电柱。
在至少一个实施例中，第一金属层110的第一表面的周缘与第二金属层146的周缘采用激光焊接相连接。
在至少一个实施例中，上述馈线144与馈电结构122通过焊接片连接。
在一些实施例中，上述第一缝隙112通常采用CNC(Computer numerical control machine tools，计算机数控机床)工艺加工而成。
本申请实施例提供的天线装置200中，第一金属层110的第一表面形成有凹陷区域120，凹陷区域120内设置有连接第一金属层110的馈电结构122及贯穿第一金属层110且沿第一方向延伸的第一缝隙124，柔性电路板140层叠设置于第一金属层110的第一表面所在的一侧，并在凹陷区域120与第一金属层110共同形成一谐振腔，当通过馈电结构122向谐振腔馈入激励信号时，该谐振腔产生谐振，并通过该第一缝隙124辐射无线信号，上述天线装置200可从整体上简化天线的设计。在至少一个实施例中，上述谐振腔在被馈入激励信号后，产生目标谐振并通过第一缝隙124辐射无线信号，该无线信号为超宽带信号，该天线装置200对应为UWB天线装置。
在至少一个实施例中，如图5所示，图5是本申请实施例提供的天线装置200的第二结构爆炸示意图，凹陷区域120还设置有贯穿第一金属层110且沿第二方向延伸的第二缝隙128，第二方向与第一方向为不同方向，填充层130还填充于第二缝隙128。
在至少一个实施例中，第一缝隙124沿第一方向的长度与第二缝隙128沿第二方向的长度不同，目标谐振包括谐振频点不同的第一谐振和第二谐振，第一谐振由谐振腔通过第 一缝隙124激励，第二谐振由谐振腔通过第二缝隙128激励。
其中，第一缝隙124沿第一方向的长度与第二缝隙128沿第二方向的长度不同时，当该谐振腔在产生目标谐振后进入本征谐振模式时，此时谐振腔会产生两个不同谐振频点的第一谐振和第二谐振，并通过第一缝隙124和第二缝隙128辐射无线信号，进而提高了上述天线装置200的带宽。
在至少一个实施例中，第一缝隙124沿第一方向的长度等于第一谐振所对应的谐振频点在自由空间波长的一半。
在至少一个实施例中，谐振腔产生第一谐振时在第一金属层110上形成第一电流路径，第一电流路径沿第一缝隙124的周缘，第一电流路径的电流强点位于第一缝隙124的两个端部，第一电流路径的电流零点位于第一缝隙124与第二缝隙128连通处的两侧。
在至少一个实施例中，第二缝隙128沿第二方向的长度等于第二谐振所对应的谐振频点在自由空间波长的一半。
在至少一个实施例中，谐振腔产生第二谐振时在第一金属层110上形成第二电流路径，第二电流路径沿第二缝隙128的周缘，第二电流路径的电流强点位于第二缝隙128的两个端部，第二电流路径的电流零点位于第二缝隙128与第一缝隙124连通处的两侧。
在至少一个实施例中，第一缝隙124与第二缝隙128相互交叉连通。
在至少一个实施例中，第一电流路径的电流零点位于第一缝隙124与第二缝隙128连通处的两侧，第二电流路径的电流零点位于第一缝隙124与第二缝隙128连通处的两侧。
在至少一个实施例中，参考图6，第一缝隙124包括依次连通的第一缝隙段1241、第二缝隙1242段以及第三缝隙段1243，第一缝隙段1241、第三缝隙段1243均与第二缝隙1242段垂直。
在至少一个实施例中，参考图7，第二缝隙128包括依次连通的第四缝隙段1281、第五缝隙段1282以及第六缝隙段1283，第四缝隙段1281、第六缝隙段1283均与第五缝隙段1282垂直。
在一实施例中，如图8所示，图8为本申请实施例提供的天线装置200的第三结构爆炸图，该天线装置200包括第一金属层110，第一金属层110的第一表面形成有凹陷区域120，凹陷区域120内设置有连接第一金属层110的馈电结构122及贯穿第一金属层110且沿第一方向延伸的第一缝隙124，凹陷区域120还设置有贯穿第一金属层110且沿第二方向延伸的第二缝隙128，第二方向与第一方向为不同方向，填充层130还填充于第二缝隙128。
其中，天线装置200还包括填充层130，填充层130填充于凹陷区域120及第一缝隙124，填充层120设有用于穿设馈电结构122的通孔。
其中，天线装置200还包括柔性电路板140，柔性电路板140包括柔性基板142、设置于柔性基板142第一表面的馈线144及设置于柔性基板142第二表面的第二金属层146，柔性电路板140层叠设置于第一金属层110的第一表面所在的一侧，并在凹陷区域120与 第一金属层110共同形成一谐振腔。
其中，第一缝隙124与第二缝隙128相互交叉连通，第一缝隙124包括依次连通的第一缝隙段1241、第二缝隙段1242以及第三缝隙段1243，第一缝隙段1241、第三缝隙段1243均与第二缝隙1242段垂直，第二缝隙128包括依次连通的第四缝隙段1281、第五缝隙段1282以及第六缝隙段1283，第四缝隙段1281、第六缝隙段1283均与第五缝隙段1282垂直，此时，第一缝隙124和第二缝隙128均为“工型缝”。
第一缝隙124沿第一方向的长度为第二缝隙段1242的缝隙长度、第一缝隙段1241的缝隙宽度以及第三缝隙段1243的缝隙宽度三者之和，第二缝隙128沿第二方向的长度为第五缝隙段1282的缝隙长度、第四缝隙段1281的缝隙宽度以及第六缝隙段1283的缝隙宽度的三者之和。
其中，若第一缝隙124沿第一方向的长度与第二缝隙128沿第二方向的长度不同，则当该谐振腔在产生目标谐振后进入本征谐振模式时，此时谐振腔会产生两个不同谐振频点的第一谐振和第二谐振。
其中，若第一缝隙124沿第一方向的长度与第二缝隙128沿第二方向的长度相同且均等于谐振频点在自由空间波长的一半，则当该谐振腔在产生目标谐振后进入本征谐振模式时，此时谐振腔会产生两个相同谐振频点的第一谐振和第二谐振。
其中，谐振腔产生第一谐振时在第一金属层110上形成第一电流路径，第一电流路径沿第一缝隙124的周缘，第一电流路径的电流强点位于第一缝隙124的两个端部，谐振腔产生第二谐振时在第一金属层110上形成第二电流路径，第二电流路径沿第二缝隙128的周缘，第二电流路径的电流强点位于第二缝隙128的两个端部，第一电流路径的电流零点位于第一缝隙124与第二缝隙128连通处的两侧，第二电流路径的电流零点位于第二缝隙128与第一缝隙124与连通处的两侧。
如图9所示，图9为本申请实施例提供的天线装置200中的谐振腔在产生目标谐振时所对应的谐振频点的电流分布示意图，其中，第一金属层110的长度为L、宽度为W和厚度为H，第一缝隙124沿第一方向的长度为Ls，第二缝隙128沿第二方向的长度为Ws。
其中，参考图9，当通过馈线144和馈电结构122向谐振腔馈入激励信号时，该谐振腔体此时产生本征谐振，并通过上述第一缝隙124和第二缝隙128辐射UWB信号，此时若Ls＝Ws且等于该谐振频点在自由空间波长的一半，只有一个谐振频点，若Ls与Ws不等且长度相近，则该谐振腔产生本征谐振时，产生两个不同谐振频点的第一谐振和第二谐振。
其中，参考图9，第一谐振由谐振腔通过第一缝隙124激励，第二谐振由谐振腔通过第二缝隙128激励，谐振腔产生第一谐振时在第一金属层110上形成第一电流路径，谐振腔产生第二谐振时在第一金属层110上形成第二电流路径，第一电流路径沿第一缝隙124的周缘(图9中对应实线箭头所示)，第二电流路径沿第二缝隙128的周缘(图9中对应实 线箭头所示)，第一电流路径的电流强点位于第一缝隙124的两个端部，第一电流路径的电流零点位于第一缝隙124与第二缝隙128连通处的两侧，第二电流路径的电流强点位于第二缝隙128的两个端部，第二电流路径的电流零点位于第二缝隙128与第一缝隙124连通处的两侧。
在至少一个实施例中，通过设置第一缝隙124和第二缝隙128两个不同长度且长度相近的交叉式“工型缝”，使得天线装置200能够以两个相近的谐振模式进行辐射，进而大大拓宽了UWB天线的工作带宽。
其中，以f mnp表示谐振频点，则该谐振频点f mnp采用以下公式进行计算：
Figure PCTCN2022070802-appb-000001
其中，u r表示磁导率，ε r表示介电常数，m和n均取正整数，p为整数，L为第一金属层110的长度、W为第一金属层110的宽度，H为第一金属层110的厚度。
在一些实施例中，m和n均取1，p取0。
图10为本申请实施例中天线装置200在工作时的反射系数曲线图，显然，该天线装置200在6.25GHz～6.75GHz内反射系数小于-8.3dB，可知该天线装置200的匹配特性良好，可完全覆盖UWB定位技术在6.5GHz的全部频段。
图11为本申请实施例中天线装置200在6.25～6.75GHz内的系统效率曲线，在6.25～6.75GHz频段内，该系统效率均值约为-2dB，该天线装置200辐射性能十分优异。
图12为本申请实施例提供的天线装置200在6.25GHz的远场辐射方向图，图13为本申请实施例提供的天线装置200在6.5GHz的远场辐射方向图，图14为本申请实施例提供的天线装置200在6.75GHz的远场辐射方向图，显然，对应的方向性系数均在6.5dBi左右，在各自对应的频段内方向图稳定，该天线装置200非常适用于作为UWB定位系统的接收天线。
其中，图12-14中Phi分别表示天线装置200各自对应的远场辐射角度。
在至少一个实施例中，填充层130由非金属材料构成。
上述非金属材料可采用树脂、陶瓷、塑料以及玻璃等非金属材料。
通过在凹陷区120填充非金属材料，能够防止第一金属层110与柔性电路板140之间空隙过大，同时在一定程度上还能增强第一金属层110的支撑度，同时，上述填充的非金属材料通常对上述天线装置200所辐射的无线信号的阻挡程度较低，基本上可忽略。
在至少一个实施例中，填充层130的厚度小于凹陷区域120的凹陷深度。
在至少一个实施例中，第一金属层110的第二表面设置有覆膜层，第二表面为与第一金属层110的第一表面相对的表面，覆膜层覆盖第一缝隙124和第二缝隙128。
此外，如图15所示，图15为本申请实施例提供的一种电子设备100的第二种结构示 意图，该电子设备100包括：金属后盖150以及上述实施例提供的天线装置200中除去第一金属层110之外的所有结构。
其中，金属后盖150用于对上述天线装置200中的第一金属层110进行替代，能够实现上述天线装置200中第一金属层110的结构和功能，金属后盖150的内表面形成与上述实施例中的凹陷区域120对应相同的凹陷区域，金属后盖150的内表面凹陷区域内所设置的结构也与上述实施例中凹陷区域120内所设置的结构完全相同，金属后盖150的外表面也能够实现上述实施例中第一金属层110的第二表面的结构和功能。
其中，上述实施例提供的天线装置200中除去第一金属层110之外的所有结构均设置在电子设备100当中，参考上述实施例对应的描述即可理解，在此，不再进行赘述。
其中，通过将电子设备100的金属后盖150作为对应的金属层以替代天线装置200的第一金属层110，进而形成有效的谐振腔体以产生目标谐振并通过第一缝隙124辐射无线信号，在保证天线装置200的性能的前提下，能够更进一步的降低天线装置200的应用成本，使得电子设备100能够以较低的成本装配天线装置200，从整体上提高了电子设备100天线的性能。在至少一个实施例中，如图16所示，图16为本申请实施例提供的一种电子设备100的第三种结构示意图，该电子设备100中金属后盖150的外表面还设置有第二缝隙128。
在至少一个实施例中，如图17所示，图17为本申请实施例提供的一种电子设备100的第四种结构示意图，该电子设备100中金属后盖150的外表面设置有第一缝隙124，该第一缝隙124包括依次连通的第一缝隙段1241、第二缝隙1242段以及第三缝隙段1243，第一缝隙段1241、第三缝隙段1243均与第二缝隙1242段垂直，该第一缝隙124为“工型缝”。
在至少一个实施例中，如图18所示，图18为本申请实施例提供的一种电子设备100的第五种结构示意图，该电子设备100还包括第二缝隙128，第二缝隙128包括依次连通的第四缝隙段1281、第五缝隙段1282以及第六缝隙段1283，第四缝隙段1281、第六缝隙段1283均与第五缝隙段1282垂直，该第一缝隙124为和第二缝隙128均为“工型缝”。
在至少一个实施例中，电子设备100还包括第一缝隙124和第二缝隙128，对于与金属后盖150的第一表面相对的第二表面，可采用覆膜工艺对第一缝隙124和第二缝隙128所在区域进行覆膜处理以形成覆膜层，上述覆膜层至少覆盖第一缝隙124和第二缝隙128，且该覆膜层的颜色和该金属后盖150颜色相同，从而使得金属后盖150整体达到金属的观感和触感。
在至少一个实施例中，如图19所示，图19为本申请实施例提供的一种电子设备100的第六种结构示意图，该电子设备100中至少形成三个谐振腔，包括第一谐振腔、第二谐振腔和第三谐振腔，金属后盖150的外表面中的第一位置区域a对应于第一谐振腔，在金属后盖150的外表面中的第二位置区域b对应于第二谐振腔，金属后盖150的外表面中的 第三位置区域c对应于第三谐振腔，第一位置区域a和第二位置区域b沿对应第一排列方向排布(图19中竖直y轴方向)，第一位置区域a和第三位置区域c沿对应的第二排列方向排布(图19中水平x轴方向)，第一排列方向和第二排列方向垂直。
在至少一个实施例中，如图19所示，第一位置区域a、第二位置区域b和第三位置区域c均设置有相互交叉的两个“工型缝”。
在本申请的描述中，需要理解的是，诸如“第一”、“第二”等术语仅用于区分类似的对象，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
以上对本申请实施例所提供的一种天线装置及电子设备进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种天线装置，包括：
    第一金属层，所述第一金属层的第一表面形成有凹陷区域，所述凹陷区域内设置有连接所述第一金属层的馈电结构及贯穿所述第一金属层且沿第一方向延伸的第一缝隙；
    填充层，所述填充层填充于所述凹陷区域及所述第一缝隙，所述填充层设有用于穿设所述馈电结构的通孔；
    柔性电路板，所述柔性电路板包括柔性基板、设置于所述柔性基板第一表面的馈线及设置于所述柔性基板第二表面的第二金属层，所述柔性电路板层叠设置于所述第一金属层的第一表面所在的一侧，并在所述凹陷区域与所述第一金属层共同形成一谐振腔；
    所述馈线与所述馈电结构连接，用于通过所述馈电结构向所述谐振腔馈入激励信号，以激励所述谐振腔产生目标谐振。
  2. 根据权利要求1所述的天线装置，其中，所述凹陷区域还设置有贯穿所述第一金属层且沿第二方向延伸的第二缝隙，所述第二方向与所述第一方向为不同方向，所述填充层还填充于所述第二缝隙。
  3. 根据权利要求2所述的天线装置，其中，所述第一缝隙沿所述第一方向的长度与所述第二缝隙沿所述第二方向的长度不同，所述目标谐振包括谐振频点不同的第一谐振和第二谐振，所述第一谐振由所述谐振腔通过所述第一缝隙激励，所述第二谐振由所述谐振腔通过所述第二缝隙激励。
  4. 根据权利要求3所述的天线装置，其中，所述第一缝隙沿所述第一方向的长度等于所述第一谐振所对应的谐振频点在自由空间波长的一半。
  5. 根据权利要求3所述的天线装置，其中，所述谐振腔产生所述第一谐振时在所述第一金属层上形成第一电流路径，所述第一电流路径沿所述第一缝隙的周缘，所述第一电流路径的电流强点位于所述第一缝隙的两个端部，所述第一电流路径的电流零点位于所述第一缝隙与所述第二缝隙连通处的两侧。
  6. 根据权利要求3所述的天线装置，其中，所述第二缝隙沿所述第二方向的长度等于所述第二谐振所对应的谐振频点在自由空间波长的一半。
  7. 根据权利要求5所述的天线装置，其中，所述谐振腔产生所述第二谐振时在所述第一金属层上形成第二电流路径，所述第二电流路径沿所述第二缝隙的周缘，所述第二电流路径的电流强点位于所述第二缝隙的两个端部，所述第二电流路径的电流零点位于所述第二缝隙与所述第一缝隙连通处的两侧。
  8. 根据权利要求7所述的天线装置，其中，所述第一缝隙与所述第二缝隙相互交叉连通。
  9. 根据权利要求1所述的天线装置，其中，所述第一缝隙包括依次连通的第一缝隙段、第二缝隙段以及第三缝隙段，所述第一缝隙段、所述第三缝隙段均与所述第二缝隙段垂直。
  10. 根据权利要求9所述的天线装置，其中，所述第二缝隙包括依次连通的第四缝隙段、第五缝隙段以及第六缝隙段，所述第四缝隙段、所述第六缝隙段均与所述第五缝隙段垂直。
  11. 根据权利要求1所述的天线装置，其中，所述填充层的厚度小于所述凹陷区域的凹陷深度。
  12. 一种电子设备，包括：
    金属后盖，所述金属后盖的内表面形成有凹陷区域，所述凹陷区域内设置有连接所述金属后盖的馈电结构及贯穿所述金属后盖且沿第一方向延伸的第一缝隙；
    填充层，所述填充层填充于所述凹陷区域及所述第一缝隙，所述填充层设有用于穿设所述馈电结构的通孔；
    柔性电路板，所述柔性电路板包括柔性基板、设置于所述柔性基板第一表面的馈线及设置于所述柔性基板第二表面的金属层，所述柔性电路板层叠设置于所述金属后盖的第一表面所在的一侧，并在所述凹陷区域与所述金属后盖共同形成一谐振腔；
    所述馈线与所述馈电结构连接，用于通过所述馈电结构向所述谐振腔馈入激励信号，以使所述谐振腔产生目标谐振。
  13. 根据权利要求12所述的电子设备，其中，所述凹陷区域还设置有贯穿所述金属后盖且沿第二方向延伸的第二缝隙，所述第二方向与所述第一方向为不同方向，所述填充层还填充于所述第二缝隙。
  14. 根据权利要求13所述的电子设备，其中，所述第一缝隙沿所述第一方向的长度与所述第二缝隙沿所述第二方向的长度不同，所述目标谐振包括谐振频点不同的第一谐振和第二谐振，所述第一谐振由所述谐振腔通过所述第一缝隙激励，所述第二谐振由所述谐振腔通过所述第二缝隙激励。
  15. 根据权利要求14所述的电子设备，其中，所述第一缝隙沿所述第一方向的长度等于所述第一谐振所对应的谐振频点在自由空间波长的一半。
  16. 根据权利要求14所述的电子设备，其中，所述第二缝隙沿所述第二方向的长度等于所述第二谐振所对应的谐振频点在自由空间波长的一半。
  17. 根据权利要求13所述的电子设备，其中，所述第一缝隙与所述第二缝隙相互交叉连通。
  18. 根据权利要求13所述的电子设备，其中，所述第一缝隙包括依次连通的第一缝隙段、第二缝隙段以及第三缝隙段，所述第一缝隙段、所述第三缝隙段均与所述第二缝隙段垂直。
  19. 根据权利要求18所述的电子设备，其中，所述第二缝隙包括依次连通的第四缝隙段、第五缝隙段以及第六缝隙段，所述第四缝隙段、所述第六缝隙段均与所述第五缝隙段垂直。
  20. 根据权利要求13所述的电子设备，其中，所述金属后盖的第二表面设置有覆膜层，所述第二表面为与所述金属后盖的第一表面相对的表面，所述覆膜层至少覆盖所述第一缝隙和所述第二缝隙，且所述覆膜层的颜色和所述金属后盖颜色相同。
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