WO2021136052A1 - 天线装置及电子设备 - Google Patents

天线装置及电子设备 Download PDF

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Publication number
WO2021136052A1
WO2021136052A1 PCT/CN2020/138864 CN2020138864W WO2021136052A1 WO 2021136052 A1 WO2021136052 A1 WO 2021136052A1 CN 2020138864 W CN2020138864 W CN 2020138864W WO 2021136052 A1 WO2021136052 A1 WO 2021136052A1
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WO
WIPO (PCT)
Prior art keywords
field communication
near field
conductor structure
metal
differential
Prior art date
Application number
PCT/CN2020/138864
Other languages
English (en)
French (fr)
Inventor
黄武鑫
李偲
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201922500600.5U external-priority patent/CN210805996U/zh
Priority claimed from CN201911421974.6A external-priority patent/CN113131196A/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP20911216.8A priority Critical patent/EP4084219A4/en
Publication of WO2021136052A1 publication Critical patent/WO2021136052A1/zh
Priority to US17/810,024 priority patent/US20220336952A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/24—Inductive coupling
    • H04B5/26—Inductive coupling using coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/35—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using two or more simultaneously fed points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect

Definitions

  • This application relates to the field of communication technology, and in particular to an antenna device and electronic equipment.
  • a common electronic device can support multiple communication modes such as cellular network communication, Wireless Fidelity (Wi-Fi) communication, Global Positioning System (GPS) communication, and Bluetooth (BT) communication.
  • Wi-Fi Wireless Fidelity
  • GPS Global Positioning System
  • BT Bluetooth
  • NFC Near Field Communication
  • the embodiments of the present application provide an antenna device and electronic equipment, which can enhance the radiation field strength of the NFC antenna and improve the performance of the NFC antenna.
  • an antenna device including:
  • Near field communication chip used to provide differential excitation current
  • the near field communication coil is configured to be arranged on the periphery of the camera module, and the near field communication coil is electrically connected to the near field communication chip;
  • the near field communication coil, the first conductor structure, and the second conductor structure are used to jointly transmit the differential excitation current, and when the differential excitation current is transmitted, the near field communication coil forms a first Near field communication radiation field, the first conductor structure forms a second near field communication radiation field, the second conductor structure forms a third near field communication radiation field, and the first near field communication radiation field is used to The second near field communication radiation field and the third near field communication radiation field are enhanced.
  • an embodiment of the present application further provides an electronic device, including an antenna device, and the antenna device includes:
  • Near field communication chip used to provide differential excitation current
  • the near field communication coil is configured to be arranged on the periphery of the camera module, and the near field communication coil is electrically connected to the near field communication chip;
  • the near field communication coil, the first conductor structure, and the second conductor structure are used to jointly transmit the differential excitation current, and when the differential excitation current is transmitted, the near field communication coil forms a first Near field communication radiation field, the first conductor structure forms a second near field communication radiation field, the second conductor structure forms a third near field communication radiation field, and the first near field communication radiation field is used to The second near field communication radiation field and the third near field communication radiation field are enhanced.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
  • Fig. 2 is a rear view of the electronic device shown in Fig. 1.
  • FIG. 3 is a schematic diagram of a first connection structure of an antenna device and a camera module in an electronic device provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of the first structure of the back cover of the electronic device provided by the embodiment of the application.
  • FIG. 5 is a schematic diagram of the second structure of the back cover of the electronic device provided by the embodiment of the application.
  • FIG. 6 is a schematic diagram of a third structure of the back cover of the electronic device provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of the fourth structure of the back cover in the electronic device provided by the embodiment of the application.
  • FIG. 8 is a schematic structural diagram of a middle frame of an electronic device provided by an embodiment of the application.
  • FIG. 9 is a schematic diagram of a first connection structure between a camera module and a near field communication coil in an electronic device provided by an embodiment of the application.
  • FIG. 10 is a schematic diagram of a second connection structure between a camera module and a near field communication coil in an electronic device provided by an embodiment of the application.
  • FIG. 11 is a schematic diagram of a second connection structure between an antenna device and a camera module in an electronic device provided by an embodiment of the application.
  • FIG. 12 is a schematic diagram of a third connection structure between an antenna device and a camera module in an electronic device provided by an embodiment of the application.
  • FIG. 13 is a schematic diagram of a fourth connection structure between an antenna device and a camera module in an electronic device provided by an embodiment of the application.
  • the embodiment of the present application provides an electronic device.
  • the electronic device can be a smart phone, a tablet computer, etc., or a game device, AR (Augmented Reality) device, automobile device, data storage device, audio playback device, video playback device, notebook computer, desktop computing Equipment, etc.
  • AR Augmented Reality
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the application
  • FIG. 2 is a rear view of the electronic device 100 shown in FIG. 1.
  • the electronic device 100 includes a display screen 10, a middle frame 20, a circuit board 30, a battery 40, a back cover 50 and a camera module 60.
  • the display screen 10 is arranged on the middle frame 20 to form a display surface of the electronic device 100 for displaying information such as images and text.
  • the display screen 10 may include a liquid crystal display (Liquid Crystal Display, LCD) or an Organic Light-Emitting Diode (OLED) display screen.
  • the display screen 10 may be a full screen. At this time, the entire area of the display screen 10 is a display area and does not include a non-display area, or the non-display area on the display screen 10 only occupies a small area for the user Area, so that the display screen 10 has a larger screen-to-body ratio.
  • the display screen 10 may also be a non-full screen. In this case, the display screen 10 includes a display area and a non-display area adjacent to the display area. Among them, the display area is used to display information, and the non-display area does not display information.
  • a cover plate may also be provided on the display screen 10 to protect the display screen 10 from being scratched or damaged by water.
  • the cover plate may be a transparent glass cover plate, so that the user can observe the content displayed on the display screen 10 through the cover plate.
  • the cover plate may be a glass cover plate made of sapphire.
  • the middle frame 20 may have a thin plate-like or sheet-like structure, or a hollow frame structure.
  • the middle frame 20 is used to provide support for electronic devices or functional components in the electronic device 100, so as to install the electronic devices and functional components of the electronic device 100 together.
  • the middle frame 20 may be provided with structures such as grooves, protrusions, through holes, etc., to facilitate the installation of electronic devices or functional components of the electronic device 100.
  • the material of the middle frame 20 may include metal or plastic.
  • the circuit board 30 is disposed on the middle frame 20 for fixing, and the circuit board 30 is sealed inside the electronic device 100 through the back cover 50.
  • the circuit board 30 may be the main board of the electronic device 100.
  • a processor may be integrated on the circuit board 30, and one or more of functional components such as a headphone jack, an acceleration sensor, a gyroscope, and a motor may also be integrated.
  • the display screen 10 may be electrically connected to the circuit board 30 to control the display of the display screen 10 through a processor on the circuit board 30.
  • the battery 40 is disposed on the middle frame 20, and the battery 40 is sealed inside the electronic device 100 through the back cover 50. At the same time, the battery 40 is electrically connected to the circuit board 30 to realize that the battery 40 supplies power to the electronic device 100.
  • the circuit board 30 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 40 to various electronic devices in the electronic device 100.
  • the back cover 50 is connected to the middle frame 20.
  • the back cover 50 may be attached to the middle frame 20 by an adhesive such as double-sided tape to realize the connection with the middle frame 20.
  • the back cover 50 is used to seal the electronic devices and functional components of the electronic device 100 in the electronic device 100 together with the middle frame 20 and the display screen 10 to protect the electronic devices and functional components of the electronic device 100.
  • the back cover 50 can be integrally formed.
  • an opening may be formed on the back cover 50, and the opening is used to install a rear camera and other structures.
  • the material of the back cover 50 includes metal, such as metallic copper, metallic aluminum, metallic silver, and the like.
  • the camera module 60 is arranged on the middle frame 20.
  • the camera module 60 can be installed on the middle frame 20 for fixing.
  • the camera module 60 is electrically connected to the circuit board 30 to control the camera module 60 through the processor on the circuit board 30, for example, to control the camera module 60 to take photos or record videos.
  • the camera module 60 may be a rear camera module of the electronic device 100.
  • an opening for installing the camera module 60 can be provided on the back cover, the camera module 60 is installed on the middle frame 20 through the opening, and the camera module 60 can also collect ambient light signals through the opening for imaging.
  • FIG. 3 is a schematic diagram of a first connection structure between an antenna device and a camera module in an electronic device provided by an embodiment of the application; the electronic device 100 may also be provided with an antenna device 200.
  • the antenna device 200 is used to implement the wireless communication function of the electronic device 100.
  • the antenna device 200 may be used to implement near field communication (NFC communication).
  • the antenna device 200 is provided inside the electronic device 100. It is understood that part of the components of the antenna device 200 can be integrated on the circuit board 30 inside the middle frame 20, for example, the signal processing chip and the signal processing circuit in the antenna device 200 can be integrated on the circuit board 30 .
  • part of the components of the antenna device 200 may also be directly arranged on the middle frame 20.
  • the radiator or conductor structure of the antenna device 200 for radiating signals may be directly arranged on the middle frame 20.
  • the antenna device 200 includes a near field communication chip 21, a near field communication coil 22, a first conductor structure 23, a second conductor structure 24 and a ground plane 25.
  • the near field communication chip (NFCIC) 21 can be used to provide a near field communication signal, that is, the NFCIC 21 is used to provide a differential excitation current.
  • the differential excitation current includes two current signals.
  • the two current signals have the same amplitude and opposite phases, or it is understood that the phases of the two current signals differ by 180 degrees.
  • the differential excitation current is a balanced signal. It is understandable that if the analog signal is directly transmitted during the transmission process, it is an unbalanced signal; if the original analog signal is inverted, then the inverted analog signal and the original analog signal are simultaneously transmitted, and the inverted analog signal and the original The analog signal is called a balanced signal.
  • the balanced signal passes through the differential amplifier during the transmission process.
  • the original analog signal and the inverted analog signal are subtracted to obtain an enhanced original analog signal. Since the two transmission lines are subject to the same interference during the transmission process, the subtraction is In the process, the same interference signal is subtracted, so the anti-interference performance of the balanced signal is better.
  • the NFC IC 21 includes a first differential signal terminal 211 and a second differential signal terminal 212.
  • the first differential signal terminal 211 may be a positive (+) port of the NFCIC 21
  • the second differential signal terminal 212 may be a negative (-) port of the NFCIC 21.
  • the first differential signal terminal 211 and the second differential signal terminal 212 are used to provide the differential excitation current.
  • the differential excitation current provided by the NFC IC 21 may be output to the antenna device 200 through the first differential signal terminal 211, and flow back to the NFC IC 21 through the second differential signal terminal 212, thereby Form a conductive loop.
  • the NFC IC21 can be provided on the circuit board 30 of the electronic device 100, or a smaller independent circuit board can also be provided in the electronic device 100, and the NFC IC21 can be integrated into the independent circuit board.
  • the independent circuit board may be a small board in the electronic device 100, for example.
  • the near field communication coil 22 is used to surround the camera module 60.
  • the near field communication coil 22 is electrically connected to the NFC IC 21.
  • the near field communication coil 22 is used to transmit the differential excitation current provided by the NFC IC 21 to form the first near field. Communication radiation field.
  • the first conductor structure 23 is electrically connected to the near field communication coil 22, and the first conductor structure 23 is grounded.
  • the first conductor structure 23 is used to transmit the differential excitation current provided by the NFC IC 21 to form a second near field communication radiation field.
  • the first conductor structure 23 may be a metal structure in the electronic device 100, a metal trace on the circuit board 30, a winding coil, or the like.
  • the second conductor structure 24 is electrically connected to the NFC IC 21, and the second conductor structure 24 is grounded.
  • the second conductor structure 24 is used to transmit the differential excitation current provided by the NFC IC 21 to form a third near field communication radiation field.
  • the second conductor structure 24 may be a metal structure in the electronic device 100, a metal trace on the circuit board 30, a winding coil, or the like.
  • the first conductor structure 23 is electrically connected to the NFC IC 21 through the near field communication coil 22, and the first near field communication radiation field formed by the near field communication coil 22 It is used to enhance the second near field communication radiation field formed by the first conductor structure 23 and the third near field communication radiation field formed by the second conductor structure 24, thereby improving the performance of the NFC antenna.
  • first near field communication radiation field, the second near field communication radiation field, and the third near field communication radiation field at least partially overlap, so that the first near field communication radiation field, The second near field communication radiation field and the third near field communication radiation field can be mutually enhanced, thereby improving the performance of the NFC antenna.
  • the direction of the differential excitation current in the near field communication coil 22 may be the same as the first near field communication radiation field.
  • the direction of the differential excitation current in one conductor structure 23 is the same or has a certain angle, and the direction of the differential excitation current in the near field communication coil 22 can be the same as the direction of the differential excitation current in the second conductor structure 24 or has a certain angle. The angle is less than 90 degrees.
  • the first conductor structure 23 may also be directly electrically connected to the NFC IC 21
  • the near field communication coil 22 may also be located between the second conductor structure 24 and the NFC IC 21, and the second conductor structure 24 passes through the near field communication coil 22. It is electrically connected to NFC IC21.
  • first conductor structure 23, the second conductor structure 24, and the near field communication coil 22 may also be electrically connected to the NFC IC 21.
  • first conductor structure 23, the second conductor structure 24, and the near field communication coil 22 are respectively When electrically connected to the NFC IC 21, the first conductor structure 23, the second conductor structure 24, and the near field communication coil 22 are respectively grounded.
  • the ground plane 25 is used to form a common ground.
  • the ground plane 25 may be formed by a conductor, a printed circuit, or a metal printed layer in the electronic device 100.
  • the ground plane 25 may be provided on the circuit board 30 of the electronic device 100.
  • the ground plane 25 may also be formed on the middle frame 20 of the electronic device 100, or the ground plane 25 may also be formed by the metal back cover 50.
  • the ground plane 25 includes a first ground point 251 and a second ground point 252 arranged at intervals.
  • the first ground point 251 and the second ground point 252 may be, for example, the ends of the ground plane 25, or may also be raised structures on the ground plane 25, or may be pads formed on the ground plane 25, or the like.
  • the ground plane 25 forms a conductive path between the first ground point 251 and the second ground point 252, and the conductive path can be used to conduct current. That is, when a voltage signal is applied to the first ground point 251 and the second ground point 252, a current can be generated between the first ground point 251 and the second ground point 252, thereby forming a current loop. It can be understood that when the NFC IC21 provides a differential excitation current, the conductive path between the first ground point 251 and the second ground point 252 can be used to transmit the differential excitation current.
  • the first conductor structure 23 includes a first feed end 231 and a first ground end 232 that are arranged at intervals.
  • the first feeding end 231 is electrically connected to the first end of the near field communication coil 22, and the second end of the near field communication coil 22 is electrically connected to the first differential signal end 211 of the NFC IC 21, so that the first differential signal ends 211 are respectively connected.
  • the near field communication coil 22 and the first feeding end 231 of the first conductor structure 23 are fed.
  • the differential excitation current provided by the NFC IC21 can be transmitted to the near field communication coil 22 and the first feeding end 231 of the first conductor structure 23 via the first differential signal terminal 211, so as to realize the transmission to the near field communication coil 22 and the first conductor.
  • Structure 23 is fed.
  • the first ground terminal 232 is electrically connected to the first ground point 251 of the ground plane 25, thereby realizing the return of the first conductor structure 23 and the near field communication coil 22 to the ground.
  • the second conductor structure 24 includes a second feed end 241 and a second ground end 242 which are arranged at intervals.
  • the second power feeding terminal 241 is electrically connected to the second differential signal terminal 212 of the NFC IC 21, so that the second differential signal terminal 212 feeds power to the second power feeding terminal 241.
  • the differential excitation current provided by the NFC IC 21 may be transmitted to the second differential signal terminal 212 via the second feeding terminal 241, so as to realize the feeding of the second conductor structure 24.
  • the second ground terminal 242 is electrically connected to the second ground point 252 of the ground plane 25, so as to realize the return of the second conductor structure 24 to the ground.
  • the near field communication coil 22, the first conductor structure 23, the conductive path on the ground plane 25, and the second conductor structure 24 jointly form a conductive loop for the transmission of the differential excitation current. That is, the differential excitation current is output from a signal terminal of the NFC IC 21, for example, output from the first differential signal terminal 211, and then fed into the near field communication coil 22, and transmitted to the second signal terminal via the near field communication coil 22.
  • a conductor structure 23 is transmitted through the first conductor structure 23 to the conductive path on the ground plane 25, and then transmitted through the conductive path to the second conductor structure 24, and finally flows back to the second conductor structure 24 through the second conductor structure 24.
  • the second differential signal terminal 212 of the NFC IC21 forms a complete conductive loop.
  • the conductive loop transmits the differential excitation current
  • the near field communication coil 22, the first conductor structure 23, the conductive path on the ground plane 25, and the second conductor structure 24 can jointly generate an alternating electromagnetic field, thereby The NFC signal is radiated to the outside to realize the NFC communication of the electronic device 100.
  • the conductive loop is transmitting the differential signal.
  • the current is transmitted from the first differential signal terminal 211 of the NFC IC 21 to the first terminal of the near field communication coil 22, and then the differential excitation current is transmitted in the counterclockwise direction in the near field communication coil 22, and is transmitted by the near field communication coil 22.
  • the second end of the communication coil 22 is transmitted to the first conductor structure 23, and then transmitted from the first conductor structure 23 to the ground plane 25, and then transmitted through the conductive path on the ground plane 25 to the second conductor structure 24, and then by the second conductor
  • the structure 24 is transmitted to the second differential signal terminal 212 of the NFC IC 21.
  • the first differential signal terminal 211 of the NFC IC 21 When the first differential signal terminal 211 of the NFC IC 21 is set to negative (-) and the second differential signal terminal 212 is set to positive (+), when the conductive loop transmits the differential excitation current, the current is transferred by the NFC IC
  • the second differential signal terminal 212 of 21 is transmitted to the second conductor structure 24, and then transmitted from the second conductor structure 24 to the ground plane 25, and then transmitted to the first conductor structure 23 through the conductive path on the ground plane 25, and then transmitted by the first conductor structure 23.
  • the conductor structure 23 is transmitted to the first end of the near field communication coil 22, and the differential excitation current is transmitted in the clockwise direction in the near field communication coil 22, and is transmitted from the second end of the near field communication coil 22 to the first differential of the NFC IC 21 Signal terminal 211.
  • first conductor structure 23 and the second conductor structure 24 may both be a metal structure in the electronic device 100, a metal trace on the circuit board 30, a winding coil, or the like.
  • the circuit board 30 of the electronic device 100 is provided with a printed circuit.
  • the first conductor structure 23 may be the printed circuit, or the second conductor structure 24 may be the printed circuit.
  • the electronic device 100 includes a flexible printed circuit (FPC), and the FPC is electrically connected to the circuit board 30.
  • the FPC can be, for example, the FPC of the display screen, the FPC of the camera, the FPC of the motor, etc., or the FPC can be an independent FPC used to realize the NFC conductor structure, which can be fixed to the housing of the electronic device 100. in vivo.
  • the FPC is provided with metal traces, and the metal traces are used to transmit signals, for example, can be used to transmit control signals of a display screen, control signals of a camera, control signals of a motor, and the like.
  • the first conductor structure 23 may include the metal trace, or the second conductor structure 24 may include the metal trace.
  • the metal back cover 50 is provided with first metal stubs and second metal stubs at intervals.
  • the first metal stubs form the first conductor structure 23 and the second metal stubs form the second conductor structure 24.
  • FIG. 4 is a schematic diagram of the first structure of the back cover of the electronic device provided by the embodiment of the application; when the first metal stub and the second metal stub are located at two opposite sides of the back cover 50 When side, the two sides are the left side and the right side respectively.
  • the back cover 50 is provided with a first gap 51 and a second gap 52 at intervals, and the first gap 51 and the second gap 52 are both provided through the back cover 50.
  • the first slit 51 extends toward the first direction on the back cover 50 to form a first metal stub
  • the second slit 52 extends toward the second direction on the back cover 50 to form a second metal stub, where the first direction
  • the second direction can be the same or different.
  • the back cover 50 is further provided with a first slit 53 and a second slit 54.
  • the first slit 53 and the second slit 54 are provided through the back cover 50, and the first slit 53 and the first slit 51 They are connected to each other to form a first metal stub, and the second slit 54 and the second gap 52 are connected to each other to form a second metal stub.
  • the back cover 50 is also provided with an opening 55 for installing the camera module 60.
  • the opening 55 can be arranged at a position close to the edge of the back cover 50, and the opening 55 can also be arranged at the middle position of the back cover 50.
  • the opening 55 The setting position of the can be set according to actual needs, and will not be repeated one by one in the embodiment of this application.
  • the shape of the opening 55 is a circle or an ellipse. It is understandable that the shape of the opening 55 can also be a square or an irregular shape.
  • the specific shape of the opening 55 can be set according to the shape and size of the camera module 60. The application embodiment does not further limit the specific shape of the opening 55.
  • FIG. 5 is a schematic diagram of the second structure of the back cover of the electronic device provided by the embodiment of the application; the back cover 50 may also be provided with a through hole 56 which is located between the first gap 51 and the opening 55 And the through hole 56 and the opening 55 are in communication with each other, so that the differential excitation current signal transmitted by the near field communication coil 22 is transmitted to the outside of the electronic device through the opening 55 and the through hole 56, so that more differential excitation current signals can be transmitted to The outside of the electronic device can improve the performance of the NFC antenna.
  • FIG. 6 is a schematic diagram of the third structure of the back cover of the electronic device provided by the embodiment of the application.
  • the through hole 56 may be connected to the opening 55 and the first gap. 51 are connected to each other to realize that the differential excitation current signal transmitted by the near field communication coil 22 is transmitted to the outside of the electronic device through the opening 55, the through hole 56 and the first gap 51, so that more differential excitation current signals can be transmitted to the electronic device.
  • the through hole 56 may be connected to the opening 55 and the first gap. 51 are connected to each other to realize that the differential excitation current signal transmitted by the near field communication coil 22 is transmitted to the outside of the electronic device through the opening 55, the through hole 56 and the first gap 51, so that more differential excitation current signals can be transmitted to the electronic device.
  • the through hole 56 may be connected to the opening 55 and the first gap. 51 are connected to each other to realize that the differential excitation current signal transmitted by the near field communication coil 22 is transmitted to the outside of the electronic device through the opening 55, the through hole 56 and the first gap 51
  • FIG. 7 is a schematic diagram of the fourth structure of the back cover of the electronic device provided by the embodiment of the application.
  • the first metal branch may also be located at the upper or lower end of the back cover 50, for example, when the first When the metal branch is located at the upper end of the back cover 50 and the second metal branch is located at the right end of the back cover 50, the through hole 56 on the back cover 50 is located at the upper end of the back cover 50, and the through hole 56 is located between the first gap 51 and the opening 55
  • the arrangement position of the through hole 56 can be adapted to the position of the first metal stub. It is understandable that the arrangement position of the through hole 56 can also be adapted to the position of the second metal stub.
  • the first conductor structure 23 and the second conductor structure 24 are located on the metal back cover 50, the first conductor structure 23 and the second conductor structure 24
  • the ground terminal 232 and the second ground terminal 242 are located away from the near field communication coil 22.
  • the first ground terminal 232 is located at the end of the first metal branch and away from the first slit 53
  • the second ground terminal 242 is located at the second metal branch.
  • the end away from the second gap 54 is set. Since the ground ends of the first conductor structure 23 and the second conductor structure 24 are not set close to the near field communication coil 22, the differential excitation current transmitted by the NFC antenna can form a positive eddy current, thereby The performance of the NFC antenna can be improved.
  • the middle frame 20 is provided with first metal stubs and second metal stubs at intervals, the first metal stubs form the first conductor structure 23, and the second metal stubs form the second conductor structure 24.
  • FIG. 8 is a schematic structural diagram of a middle frame of an electronic device according to an embodiment of the application.
  • the middle frame 20 includes a substrate 201 and a metal frame 202.
  • the substrate 201 may be a thin plate or a sheet structure.
  • structures such as holes or grooves may be formed on the substrate 201.
  • the holes or grooves formed on the substrate 201 can be used for mounting other electronic components of the electronic device 100.
  • electronic components such as a camera and a circuit board of the electronic device 100 may be mounted on the substrate 201 through holes or slots.
  • the material of the substrate 201 may include metal or plastic.
  • the substrate 201 may be an aluminum alloy substrate.
  • the metal frame 202 is formed on the periphery of the substrate 201.
  • the metal frame 202 may be formed by surrounding the periphery of the substrate 201 with a metal material.
  • the material of the metal frame 202 may include metals such as aluminum alloy and magnesium alloy.
  • the metal frame 202 may be a magnesium alloy metal frame.
  • the width of the metal frame 202 may be between 2 mm (millimeters) and 5 mm.
  • the metal frame 202 is provided with a slit, such as a third slit 2021.
  • the third slit 2021 is provided through the thickness direction of the metal frame 202 to divide the metal frame 202 into at least a first metal part 2022 and a second metal part 2023.
  • the first metal part 2022 forms a first metal stub
  • the second metal part 2023 forms a second metal stub.
  • a gap 2011 is provided between the metal frame 202 and the substrate 201.
  • the gap 2011 is connected to the third gap 2021.
  • the third gap 2021 divides the gap 2011 into a first part and a second part.
  • the gap 2011 is formed by the third gap.
  • the first part is formed by extending to the left along the metal frame 202 at 2021.
  • the gap 2011 is formed by extending to the right along the metal frame 202 from the third slit 2021 to form a second part.
  • the metal frame 202 corresponding to the first part is the first metal part 2022, and the second Part of the corresponding metal frame is the second metal part 2023.
  • a plastic material may be filled in the third slit 2021 and the gap 2011, and the plastic material seals the third slit 2021 and the gap 2011.
  • the third slit 2021 and the gap 2011 can be filled with a plastic material of the same color as the metal frame 202, which reduces the types of appearance colors of the electronic device 100 and helps improve the electronic device. The appearance of beauty.
  • the middle frame 20 may also include a substrate and a plastic frame.
  • the plastic frame is arranged around the substrate.
  • the first metal stub and the second metal stub are formed by arranging two metal sheets on the plastic frame.
  • the back cover 50 may also be provided with through holes, such as through holes.
  • Hole 56, through hole 56 communicate with opening 55 and gap 2011, so as to realize that the differential excitation current signal transmitted by near field communication coil 22 is transmitted to the outside of the electronic device through opening 55, through hole 56 and gap 2011, which can make more differential The excitation current signal is transmitted to the outside of the electronic device to further improve the performance of the NFC antenna.
  • the camera module 60 may include a camera and metal decorative parts.
  • the camera is used to collect ambient light signals for imaging, so as to realize photographing or video recording.
  • the camera may include a lens and a base.
  • the lens is installed on the base to fix the lens.
  • the base can be installed on the middle frame 20 or on the circuit board 30 for fixing.
  • the metal decorative piece forms a mounting hole around the camera, and the camera is located in the mounting hole.
  • the metal decorative piece can play a decorative role to prevent the internal structure of the camera from being observed from the outside of the electronic device; on the other hand, it can also play a role.
  • the near field communication coil 22 may be arranged around the periphery of the camera, and the near field communication coil 22 may also be arranged around the periphery of the metal decoration.
  • the camera When the near field communication coil 22 is arranged around the periphery of the camera, the camera includes a lens and a base, and the lens is fixed on the base.
  • the near field communication coil 22 can be arranged around the base or around the end of the lens close to the base.
  • the near field communication coil 22 When the near field communication coil 22 is arranged around the periphery of the metal decoration, the near field communication coil 22 is an unclosed coil to form two ends, which are used to communicate with the NFC IC 21 and the first conductor structure 23. connection.
  • the material of the metal decoration part may include, for example, aluminum alloy, magnesium alloy, copper alloy and other materials.
  • the metal decorative piece is provided with a third gap, the third gap is located between the through hole 56 and the opening 55, the third gap is provided through the metal decorative piece to divide the metal decorative piece into two parts, and the third gap is connected to the mounting hole
  • the transmission direction of the induced current generated in the metal decoration can be changed, so that the direction of the differential excitation current transmitted by the near field communication coil 22 is the same as that in the metal decoration.
  • the directions of the induced currents generated are perpendicular to each other, forming orthogonal polarizations, so as to reduce the interference of the induced magnetic field formed in the metal decorative piece on the near-field communication signal, thereby further improving the performance of the NFC antenna.
  • the camera module 60 may also include multiple cameras.
  • the near field communication coil 22 may be arranged around the periphery of at least one camera.
  • the near field communication coil 22 may surround one
  • the cameras are arranged on the periphery, and the near field communication coil 22 can also be arranged around the periphery of the two cameras.
  • the near field communication coil 22 may also be arranged around the periphery of the metal decoration.
  • the number of cameras can be two, three, or four, etc., and the number of cameras can be flexibly set according to actual needs.
  • FIG. 9 is a schematic diagram of the first connection structure of the camera module and the near field communication coil provided by the embodiment of the application.
  • the camera module 60 includes two cameras 61 and a metal decoration 62, and the metal decoration 62 is arranged around each camera 61. Two cameras such as a first camera 61a and a second camera 61b.
  • the metal decoration 62 is provided with two mounting holes 621, two mounting holes 621 such as a first mounting hole 621a and a second mounting hole 621b, the first mounting hole 621a is used for mounting a first camera 61a, and the second mounting hole 621b is used To install the second camera 61b.
  • the metal decorative part 62 is further provided with a fourth slit 622 and a fifth slit 623.
  • the fourth slit 622 is provided adjacent to the first mounting hole 621a, and the fourth slit 622 is provided through the metal decorative part 62 to secure the metal decorative part 62.
  • the fifth slot 623 is located between the first mounting hole 621a and the second mounting hole 621b, and the fourth slot 622, the fifth slot 623, and the first mounting hole
  • the hole 621a and the second mounting hole 621b communicate with each other, so that the fourth slot 622, the first mounting hole 621a, the second mounting hole 621b, and the fifth slot 623 can be formed as a whole.
  • the metal decoration can be made The transmission direction of the induced current generated in the element 62 is changed, so that the direction of the differential excitation current transmitted by the near field communication coil 22 and the direction of the induced current generated in the metal decorative element 62 are perpendicular to each other, forming orthogonal polarization to reduce The induced magnetic field formed in the metal decoration 62 interferes with the near field communication signal, thereby further improving the performance of the NFC antenna.
  • FIG. 10 is a schematic diagram of the second connection structure of the camera module and the near field communication coil provided by the embodiment of the application; the camera module 60 may also include three cameras 61 And the metal decoration 62, three cameras 61 such as the first camera 61a, the second camera 61a and the third camera 61c, the metal decoration 62 is provided with three mounting holes 621, and the three mounting holes 621 are such as the first mounting hole 621a and the third camera 61c. There are two mounting holes 621b and a third mounting hole 621c. The first mounting hole 621a is used for mounting the first camera 61a, the second mounting hole 621b is used for mounting the second camera 61b, and the third mounting hole 621c is used for mounting the third camera 61c.
  • the metal decoration 62 also has three gaps, such as a fourth gap 622, a fifth gap 623, and a sixth gap 624.
  • the fourth gap 622 is adjacent to the first mounting hole 621a, and the fourth gap 622 penetrates the metal.
  • the decoration piece 62 is provided to divide the metal decoration piece 62 into two parts, the fifth gap 623 is located between the first mounting hole 621a and the second mounting hole 621b, and the sixth gap 624 is located at the Between the second mounting hole 621b and the third mounting hole 621c, and the fourth gap 622, the fifth gap 623, the sixth gap 624, the first mounting hole 621a, the second The mounting hole 621b and the third mounting hole 621c are in communication with each other, so that the third mounting hole 621c, the sixth slot 624, the second mounting hole 621b, the fifth slot 623, the first mounting hole 621a, and the fourth slot 622 can communicate with each other. Formed as one.
  • the near field communication coil 22 When the near field communication coil 22 is arranged around the metal decoration 62, since the fourth slit 622, the fifth slit 623, and the sixth slit 624 are provided in the metal decoration 62, when the near field communication coil 22 transmits the differential excitation current , The transmission direction of the induced current generated in the metal decoration 62 can be changed, so that the direction of the differential excitation current transmitted by the near field communication coil 22 and the direction of the induced current generated in the metal decoration 62 are perpendicular to each other, forming an orthogonal Polarization is used to reduce the interference of the induced magnetic field formed in the metal decoration 62 on the near field communication signal, thereby further improving the performance of the NFC antenna.
  • FIG. 11 is a schematic diagram of a second structure of an antenna device and a camera module in an electronic device provided by an embodiment of the application.
  • the antenna device 200 further includes a first non-near field communication chip 26 and a second non-near field communication chip 27.
  • the first non-near field communication chip 26 is, for example, IC1
  • the second non-near field communication chip 27 is, for example, IC2. It can be understood that both the first non-near field communication chip 26 and the second non-near field communication chip 27 can be integrated on the circuit board 30 of the electronic device 100.
  • the first non-near field communication chip 26 is used to provide a first non-near field communication excitation signal.
  • the first non-near field communication excitation signal is an unbalanced signal.
  • the first non-near field communication excitation signal may include a cellular network signal, a wireless fidelity (Wireless Fidelity, Wi-Fi) signal, a global positioning system (Global Positioning System, GPS) signal, and a Bluetooth (Bluetooth, BT) signal.
  • a wireless fidelity Wireless Fidelity, Wi-Fi
  • GPS Global Positioning System
  • Bluetooth Bluetooth
  • the first non-near field communication chip 26 may be a cellular communication chip for providing the cellular network signal; the first non-near field communication chip 26 may be a Wi-Fi chip for providing the Wi-Fi signal; the first non-near field communication chip 26 may be a GPS chip for providing the GPS signal; the first non-near field communication chip 26 may also be a BT chip for providing the BT signal.
  • the first conductor structure 23 further includes a third feeding end 233.
  • the third power feeding terminal 233 is spaced apart from the first power feeding terminal 231 and the first ground terminal 232.
  • the third feeding terminal 233 is electrically connected to the first non-near field communication chip 26, and the first non-near field communication chip 26 is grounded. Therefore, the first non-near field communication chip 26 can feed the first non-near field communication excitation signal to the first conductor structure 23 through the third feeding end 223. Therefore, the first conductor structure 23 can also be used to transmit the first non-near field communication excitation signal.
  • the first conductor structure 23 can be used to transmit the differential excitation current signal provided by the NFC IC 21, and can also be used to transmit the first non-near field communication provided by the first non-near field communication chip 26.
  • the excitation signal can thereby realize the multiplexing of the first conductor structure 23, which can reduce the number of conductor structures used for transmitting wireless signals in the electronic device 100, thereby saving the internal space of the electronic device 100.
  • the frequency of the NFC signal is usually 13.56MHz (megahertz)
  • the frequency of the cellular network signal is usually above 700MHz
  • the frequency of the Wi-Fi signal is usually 2.4GHz (gigahertz) or 5GHz
  • the frequency of the GPS signal The frequency usually includes multiple frequency bands such as 1.575GHz, 1.227GHz, 1.381GHz, 1.841GHz, etc.
  • the frequency of the BT signal is usually 2.4GHz. Therefore, with respect to cellular network signals, Wi-Fi signals, GPS signals, and BT signals, NFC signals are low-frequency signals, while cellular network signals, Wi-Fi signals, GPS signals, and BT signals are all high-frequency signals.
  • the NFC signal is a low-frequency signal
  • the first non-near field communication excitation signal is a high-frequency signal
  • the frequency of the NFC signal is less than the frequency of the first non-near field communication excitation signal
  • the lower the frequency of the wireless signal the longer the required radiator length; and the higher the frequency of the wireless signal, the shorter the required radiator length. That is, the length of the radiator required to transmit the NFC signal is greater than the length of the radiator required to transmit the first non-near field communication excitation signal.
  • the distance between the first feeding end 231 and the first grounding end 232 is greater than the distance between the third feeding end 233 and the first grounding end 232. Therefore, in the first conductor structure 23, the length of the radiator for transmitting the NFC signal is greater than the length of the radiator for transmitting the first non-near field communication excitation signal.
  • the third feeding end 233 and the first feeding end 231 may be located on the same side of the first grounding end 232. That is, the third power feeding terminal 233 is located between the first power feeding terminal 231 and the first ground terminal 232. Compared with the third feeding end 233 and the first feeding end 231 located on different sides of the first grounding end 232, the third feeding end 233 and the first feeding end 231 is located on the same side of the first ground terminal 232 and can reuse the part between the third feed terminal 233 and the first ground terminal 232, so that the overall length of the first conductor structure 23 can be reduced.
  • the second non-near field communication chip 27 is used to provide a second non-near field communication excitation signal.
  • the second non-near field communication excitation signal is an unbalanced signal.
  • the second non-near field communication excitation signal may include one of a cellular network signal, a wireless fidelity signal (Wi-Fi signal), a global positioning system signal (GPS signal), and a Bluetooth signal (BT signal).
  • the second non-near field communication chip 27 may be a cellular communication chip for providing the cellular network signal; the second non-near field communication chip 27 may be a Wi-Fi chip for providing the Wi-Fi signal; the second non-near field communication chip 27 may be a GPS chip for providing the GPS signal; the second non-near field communication chip 27 may also be a BT chip for providing the BT signal.
  • the second non-near field communication excitation signal and the first non-near field communication excitation signal may be signals of the same communication type or signals of different communication types.
  • the second non-near field communication chip 27 and the first non-near field communication chip 26 may be the same type of chip or different types of chips.
  • the second conductor structure 24 further includes a fourth feeding end 243.
  • the fourth feeding end 243 is spaced apart from the second feeding end 241 and the second grounding end 242.
  • the fourth feeding terminal 233 is electrically connected to the second non-near field communication chip 27, and the second non-near field communication chip 27 is grounded. Therefore, the second non-near field communication chip 27 can feed the second non-near field communication signal to the second conductor structure 24 through the fourth feeding end 243. Therefore, the second conductor structure 24 can also be used to transmit the second non-near field communication excitation signal.
  • the second conductor structure 24 can be used to transmit the differential excitation current signal provided by the NFC IC 21, and can also be used to transmit the second non-near field signal provided by the second non-near field communication chip 27. By communicating the excitation signal, multiplexing of the second conductor structure 24 can be realized, and the number of conductor structures used for transmitting wireless signals in the electronic device 100 can be further reduced, so that the internal space of the electronic device 100 can be further saved.
  • the distance between the second feed end 241 and the second ground end 242 is greater than the distance between the fourth feed end 243 and the second ground end 242 . Therefore, in the second conductor structure 24, the length of the radiator that transmits the NFC signal is greater than the length of the radiator that transmits the second non-near field communication excitation signal.
  • the fourth feeding end 243 and the second feeding end 241 may be located on the same side of the second grounding end 242. That is, the fourth power feeding terminal 243 is located between the second power feeding terminal 241 and the second ground terminal 242. Compared with the fourth feeding end 243 and the second feeding end 241 being located on different sides of the second grounding end 242, the fourth feeding end 243 and the second feeding end 241 Located on the same side of the second ground terminal 242 can reuse the part between the fourth feed terminal 243 and the second ground terminal 242, so that the overall length of the second conductor structure 24 can be reduced.
  • FIG. 12 is a schematic diagram of a third structure of an antenna device and a camera module in an electronic device provided by an embodiment of the application.
  • the antenna device 200 further includes a first matching circuit M1, a second matching circuit M2, a third matching circuit M3, a first filter circuit LC1, a second filter circuit LC2, a third filter circuit LC3, and a fourth filter circuit LC4 .
  • the matching circuit may also be referred to as a matching network, a tuning circuit, a tuning network, and so on.
  • the filter circuit can also be called a filter network.
  • the first matching circuit M1 is respectively connected to the first differential signal terminal 211 of the NFC IC21, the second differential signal terminal 212 of the NFC IC21, the first feeding terminal 231 of the first conductor structure 23, and the The second feeding end 241 of the second conductor structure 24 is electrically connected.
  • the first matching circuit M1 is used to match the impedance when the conductive loop transmits the differential excitation current.
  • the conductive loop is a conductive loop formed by the near field communication coil 22, the first conductor structure 23, the conductive path on the ground plane 25, and the second conductor structure 24.
  • the first matching circuit M1 includes a first input terminal a, a second input terminal b, a first output terminal c, and a second output terminal d.
  • the first input terminal a is electrically connected to the first differential signal terminal 211 of the NFC IC 21
  • the second input terminal b is electrically connected to the second differential signal terminal 212 of the NFC IC 21
  • the first The output end c is electrically connected to the first feeding end 231 of the first conductor structure 23
  • the second output end d is electrically connected to the second feeding end 241 of the second conductor structure 24.
  • the first filter circuit LC1 is arranged between the first differential signal terminal 211 of the NFC IC 21 and the first input terminal a of the first matching circuit M1.
  • the first filter circuit LC1 is used to filter out the first interference signal between the first differential signal terminal 211 and the first input terminal a.
  • the first interference signal is an electrical signal other than the differential excitation current provided by the NFC IC 21.
  • the second filter circuit LC2 is arranged between the second differential signal terminal 212 of the NFC IC 21 and the second input terminal b of the first matching circuit M1.
  • the second filter circuit LC2 is used to filter out the second interference signal between the second differential signal terminal 212 and the second input terminal b.
  • the second interference signal is an electrical signal other than the differential excitation current provided by the NFC IC 21.
  • the second matching circuit M2 is electrically connected to the first non-near field communication chip 26 and the third feeding end 233 of the first conductor structure 23 respectively.
  • the second matching circuit M2 is used to match the impedance when the first conductor structure 23 transmits the first non-near field communication excitation signal.
  • the third filter circuit LC3 is arranged between the first non-near field communication chip 26 and the second matching circuit M2.
  • the third filter circuit LC3 is used to filter out the third interference signal between the first non-near field communication chip 26 and the second matching circuit M2.
  • the third interference signal is an electrical signal other than the first non-near field communication excitation signal provided by the first non-near field communication chip 26.
  • the third matching circuit M3 is electrically connected to the second non-near field communication chip 27 and the fourth feeding end 243 of the second conductor structure 24 respectively.
  • the third matching circuit M3 is used to match the impedance when the second conductor structure 24 transmits the second non-near field communication excitation signal.
  • the fourth filter circuit LC4 is arranged between the second non-near field communication chip 27 and the third matching circuit M3.
  • the fourth filter circuit LC4 is used to filter out the fourth interference signal between the second non-near field communication chip 27 and the third matching circuit M33.
  • the fourth interference signal is an electrical signal other than the second non-near field communication excitation signal provided by the second non-near field communication chip 27.
  • first matching circuit M1, the second matching circuit M2, and the third matching circuit M3 may all include a circuit composed of any series or parallel connection of capacitors and inductors.
  • the first filter circuit LC1, the second filter circuit LC2, the third filter circuit LC3, and the fourth filter circuit LC4 may also include a circuit composed of any series or parallel connection of capacitors and inductors.
  • FIG. 13 is a schematic diagram of a fourth structure of an antenna device and a camera module in an electronic device according to an embodiment of the application.
  • the first matching circuit M1 may include four capacitors C1, C2, C3, and C4, for example.
  • the capacitor C1 is connected in series with the first differential signal terminal 211 of the NFCIC 21, and the capacitor C2 is connected in series with the second differential signal terminal 212 of the NFCIC 21.
  • the capacitor C3 is in series with the capacitor C4, and after the series is connected in parallel with the NFC IC 21, and the capacitor C3 and the capacitor C4 are grounded. It can be understood that the capacitance values of the capacitors C1, C2, C3, and C4 can be set according to actual needs.
  • the first filter circuit LC1 may include, for example, an inductor L1 and a capacitor C5. Wherein, the inductor L1 is connected in series between the first differential signal terminal 211 and the first matching circuit M1, and the capacitor C5 is connected in parallel with the NFC IC 21 and grounded. It can be understood that the inductance value of the inductor L1 and the capacitance value of the capacitor C5 can be set according to actual needs.
  • the second filter circuit LC2 may include, for example, an inductor L2 and a capacitor C6.
  • the inductor L2 is connected in series between the second differential signal terminal 212 and the first matching circuit M1, and the capacitor C6 is connected in parallel with the NFC IC 21 and grounded. It can be understood that the inductance value of the inductor L2 and the capacitance value of the capacitor C6 can be set according to actual needs.
  • the second matching circuit M2 may include capacitors C7 and C8, for example.
  • the capacitor C7 is connected in series between the third feeding end 233 of the first conductor structure 23 and the first non-near field communication chip 26, and the capacitor C8 is connected in parallel with the first non-near field communication chip 26 and grounded. It can be understood that the capacitance values of the capacitors C7 and C8 can be set according to actual needs.
  • the third filter circuit LC3 may include, for example, an inductor L3 and a capacitor C9. Wherein, the inductor L3 is connected in series between the first non-near field communication chip 26 and the second matching circuit M2, and the capacitor C9 is connected in parallel with the first non-near field communication chip 26 and grounded. It can be understood that the inductance value of the inductor L3 and the capacitance value of the capacitor C9 can be set according to actual needs.
  • the third matching circuit M3 may include capacitors C10 and C11, for example.
  • the capacitor C10 is connected in series between the fourth feeding end 243 of the second conductor structure 24 and the second non-near field communication chip 27, and the capacitor C11 is connected in parallel with the second non-near field communication chip 27 and grounded. It can be understood that the capacitance values of the capacitors C10 and C11 can be set according to actual needs.
  • the fourth filter circuit LC4 may include, for example, an inductor L4 and a capacitor C12. Wherein, the inductor L4 is connected in series between the second non-near field communication chip 27 and the third matching circuit M3, and the capacitor C12 is connected in parallel with the second non-near field communication chip 27 and grounded. It can be understood that the inductance value of the inductor L4 and the capacitance value of the capacitor C12 can be set according to actual needs.

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Abstract

一种天线装置及电子设备，包括：近场通信芯片；近场通信线圈；第一导体结构；第二导体结构；在传输差分激励电流时，近场通信线圈形成第一近场通信辐射场，第一导体结构形成第二近场通信辐射场，第二导体结构形成第三近场通信辐射场，第一近场通信辐射场用于对第二近场通信辐射场和第三近场通信辐射场进行增强。

Description

天线装置及电子设备
本申请要求于2019年12月31日提交中国专利局、申请号为201911421974.6、发明名称为“天线装置及电子设备”的中国专利申请的优先权，以及于2019年12月31日提交中国专利局、申请号为201922500600.5、实用新型名称为“天线装置及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，特别涉及一种天线装置及电子设备。
背景技术
随着通信技术的发展，诸如智能手机等电子设备能够实现的功能越来越多，电子设备的通信模式也更加多样化。例如，通常的电子设备可以支持蜂窝网络通信、无线保真(Wireless Fidelity，Wi-Fi)通信、全球定位系统(Global Positioning System，GPS)通信、蓝牙(Bluetooth，BT)通信等多种通信模式。此外，随着通信技术的进步，近来电子设备逐渐可以实现近场通信(Near Field Communication，NFC)。可以理解的，电子设备的每一种通信模式都需要相应的天线来支持。
发明内容
本申请实施例提供一种天线装置及电子设备，可以增强NFC天线的辐射场强，提升NFC天线性能。
第一方面，本申请实施例提供一种天线装置，包括：
近场通信芯片，用于提供差分激励电流；
近场通信线圈，用于设置在摄像头模组周缘，所述近场通信线圈与所述近场通信芯片电连接；
第一导体结构，与所述近场通信线圈电连接，且所述第一导体结构接地；
第二导体结构，与所述近场通信芯片电连接，且所述第二导体结构接地；
其中，所述近场通信线圈、所述第一导体结构、所述第二导体结构用于共同传输所述差分激励电流，在传输所述差分激励电流时，所述近场通信线圈形成第一近场通信辐射场，所述第一导体结构形成第二近场通信辐射场，所述第二导体结构形成第三近场通信辐射场，所述第一近场通信辐射场用于对所述第二近场通信辐射场和所述第三近场通信辐射场进行增强。
第二方面，本申请实施例还提供一种电子设备，包括天线装置，所述天线装置包括：
近场通信芯片，用于提供差分激励电流；
近场通信线圈，用于设置在摄像头模组周缘，所述近场通信线圈与所述近场通信芯片电连接；
第一导体结构，与所述近场通信线圈电连接，且所述第一导体结构接地；
第二导体结构，与所述近场通信芯片电连接，且所述第二导体结构接地；
其中，所述近场通信线圈、所述第一导体结构、所述第二导体结构用于共同传输所述差分激励电流，在传输所述差分激励电流时，所述近场通信线圈形成第一近场通信辐射场，所述第一导体结构形成第二近场通信辐射场，所述第二导体结构形成第三近场通信辐射场，所述第一近场通信辐射场用于对所述第二近场通信辐射场和所述第三近场通信辐射场进行增强。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本 领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的结构示意图。
图2为图1所示的电子设备的后视图。
图3为本申请实施例提供的电子设备中天线装置与摄像头模组的第一种连接结构示意图。
图4为本申请实施例提供的电子设备中后盖的第一种结构示意图。
图5为本申请实施例提供的电子设备中后盖的第二种结构示意图。
图6为本申请实施例提供的电子设备中后盖的第三种结构示意图。
图7为本申请实施例提供的电子设备中后盖的第四种结构示意图。
图8为本申请实施例提供的电子设备的中框的结构示意图。
图9为本申请实施例提供的电子设备中摄像头模组与近场通信线圈的第一种连接结构示意图。
图10为本申请实施例提供的电子设备中摄像头模组与近场通信线圈的第二种连接结构示意图。
图11为本申请实施例提供的电子设备中天线装置与摄像头模组的第二种连接结构示意图。
图12为本申请实施例提供的电子设备中天线装置与摄像头模组的第三种连接结构示意图。
图13为本申请实施例提供的电子设备中天线装置与摄像头模组的第四种连接结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种电子设备。所述电子设备可以是智能手机、平板电脑等设备，还可以是游戏设备、AR(Augmented Reality，增强现实)设备、汽车装置、数据存储装置、音频播放装置、视频播放装置、笔记本电脑、桌面计算设备等。
参考图1和图2，图1为本申请实施例提供的电子设备100的结构示意图，图2为图1所示电子设备100的后视图。
电子设备100包括显示屏10、中框20、电路板30、电池40、后盖50以及摄像头模组60。
其中，显示屏10设置在中框20上，以形成电子设备100的显示面，用于显示图像、文本等信息。其中，显示屏10可以包括液晶显示屏(Liquid Crystal Display，LCD)或有机发光二极管显示屏(Organic Light-Emitting Diode，OLED)等类型的显示屏。
可以理解的，显示屏10可以为全面屏，此时，显示屏10的整个区域都是显示区域而不包括非显示区域，或者显示屏10上的非显示区域对用户而言仅占据较小的区域，从而显示屏10具有较大的屏占比。或者，显示屏10也可以为非全面屏，此时显示屏10包括显示区域以及与显示区域邻接的非显示区域。其中，显示区域用于显示信息，非显示区域不显示信息。
可以理解的，显示屏10上还可以设置盖板，以对显示屏10进行保护，防止显示屏10被刮伤或者被水损坏。其中，盖板可以为透明玻璃盖板，从而用户可以透过盖板观察到显示屏10显示的内容。可以理解的，盖板可以为蓝宝石材质的玻璃盖板。
中框20可以为薄板状或薄片状的结构，也可以为中空的框体结构。中框20用于为电子设备100中的电子器件或功能组件提供支撑作用，以将电子设备100的电子器件、功能组件 安装到一起。例如，中框20上可以设置凹槽、凸起、通孔等结构，以便于安装电子设备100的电子器件或功能组件。可以理解的，中框20的材质可以包括金属或塑胶等。
电路板30设置在中框20上以进行固定，并通过后盖50将电路板30密封在电子设备100的内部。其中，电路板30可以为电子设备100的主板。电路板30上可以集成有处理器，此外还可以集成耳机接口、加速度传感器、陀螺仪、马达等功能组件中的一个或多个。同时，显示屏10可以电连接至电路板30，以通过电路板30上的处理器对显示屏10的显示进行控制。
电池40设置在中框20上，并通过后盖50将电池40密封在电子设备100的内部。同时，电池40电连接至所述电路板30，以实现电池40为电子设备100供电。其中，电路板30上可以设置有电源管理电路。所述电源管理电路用于将电池40提供的电压分配到电子设备100中的各个电子器件。
后盖50与中框20连接。例如，后盖50可以通过诸如双面胶等粘接剂贴合到中框20上以实现与中框20的连接。其中，后盖50用于与中框20、显示屏10共同将电子设备100的电子器件和功能组件密封在电子设备100内部，以对电子设备100的电子器件和功能组件形成保护作用。可以理解的，后盖50可以一体成型。在后盖50的成型过程中，可以在后盖50上形成开口，开口用于安装后置摄像头等结构。其中，后盖50的材质包括金属，例如金属铜、金属铝、金属银等。
摄像头模组60设置在中框20上。例如，摄像头模组60可以安装在中框20上，以进行固定。同时，摄像头模组60电连接至所述电路板30，以通过电路板30上的处理器对摄像头模组60进行控制，例如控制摄像头模组60拍照或录像。
可以理解的，摄像头模组60可以为电子设备100的后置摄像头模组。此时，后盖上可以设置用于安装摄像头模组60的开口，摄像头模组60通过所述开口安装在中框20上，并且摄像头模组60还可以通过所述开口采集环境光信号成像。
请参阅图3，图3为本申请实施例提供的电子设备中天线装置与摄像头模组的第一种连接结构示意图；电子设备100中还可以设置天线装置200。天线装置200用于实现电子设备100的无线通信功能，例如天线装置200可以用于实现近场通信(NFC通信)。天线装置200设置在电子设备100的内部。其中，可以理解的天线装置200的部分器件可以集成在所述中框20内部的电路板30上，例如所述天线装置200中的信号处理芯片以及信号处理电路可以集成在所述电路板30上。此外，所述天线装置200的部分器件还可以直接设置在所述中框20上。例如所述天线装置200用于辐射信号的辐射体或者导体结构可以直接设置在所述中框20上。
天线装置200包括近场通信芯片21、近场通信线圈22、第一导体结构23、第二导体结构24以及接地平面25。
在本申请的描述中，需要理解的是，诸如“第一”、“第二”等术语仅用于区分类似的对象，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
其中，近场通信芯片(NFCIC)21可以用于提供近场通信信号，也即，NFCIC21用于提供差分激励电流。所述差分激励电流包括两个电流信号。所述两个电流信号的振幅相同，并且相位相反，或者理解为所述两个电流信号的相位相差180度。此外，所述差分激励电流为平衡信号。可以理解的，模拟信号在传输过程中，如果被直接传送就是非平衡信号；如果把原始的模拟信号反相，然后同时传送反相的模拟信号和原始的模拟信号，反相的模拟信号和原始的模拟信号就叫做平衡信号。平衡信号在传送过程中经过差动放大器，原始的模拟信号和反相的模拟信号相减，得到加强的原始模拟信号，由于在传送过程中，两条传送线路受到相同的干扰，在相减的过程中，减掉了相同的干扰信号，因此平衡信号的抗干扰性能更好。
NFC IC21包括第一差分信号端211和第二差分信号端212。例如，所述第一差分信号端211可以为所述NFCIC 21的正(+)端口，所述第二差分信号端212可以为所述NFC IC21的 负(-)端口。所述第一差分信号端211和所述第二差分信号端212用于提供所述差分激励电流。例如，所述NFC IC 21提供的差分激励电流可以经由所述第一差分信号端211输出到所述天线装置200中，并经由所述第二差分信号端212回流到所述NFC IC21中，从而形成导电回路。
其中，可以理解的，所述NFC IC21可以设置在电子设备100的电路板30上，或者也可以在电子设备100中设置一个较小的独立电路板，并将所述NFC IC21集成到所述独立电路板上。所述独立电路板例如可以为电子设备100中的小板。
近场通信线圈22，用于围绕摄像头模组60设置，近场通信线圈22与NFC IC 21电连接，近场通信线圈22用于传输NFC IC 21提供的差分激励电流，以形成第一近场通信辐射场。
第一导体结构23，与近场通信线圈22电连接，且第一导体结构23接地，第一导体结构23用于传输NFC IC 21提供的差分激励电流，以形成第二近场通信辐射场。
其中，所述第一导体结构23可以为电子设备100中的金属结构、电路板30上的金属走线、绕制线圈等结构。
第二导体结构24与NFC IC 21电连接，且第二导体结构24接地，第二导体结构24用于传输NFC IC 21提供的差分激励电流，以形成第三近场通信辐射场。
其中，所述第二导体结构24可以为电子设备100中的金属结构、电路板30上的金属走线、绕制线圈等结构。
本申请实施例中，通过将近场通信线圈22围绕摄像头模组设置，第一导体结构23通过近场通信线圈22与NFC IC 21电连接，近场通信线圈22形成的第一近场通信辐射场用于对第一导体结构23形成的第二近场通信辐射场以及第二导体结构24形成的第三近场通信辐射场增强，从而可以提高NFC天线性能。
其中，可以理解的，所述第一近场通信辐射场、所述第二近场通信辐射场以及所述第三近场通信辐射场至少部分重叠，从而所述第一近场通信辐射场、所述第二近场通信辐射场以及所述第三近场通信辐射场可以相互增强，进而可以提高NFC天线的性能。
其中，由于所述第一近场通信辐射场、所述第二近场通信辐射场以及所述第三近场通信辐射场至少部分重叠，近场通信线圈22中差分激励电流的方向可以与第一导体结构23内差分激励电流的方向相同或具有一定夹角，近场通信线圈22中差分激励电流的方向可以与第二导体结构24内差分激励电流的方向相同或具有一定夹角，该夹角小于90度。
可以理解的，第一导体结构23也可以直接与NFC IC 21电连接，近场通信线圈22也可以位于第二导体结构24与NFC IC 21之间，第二导体结构24通过近场通信线圈22与NFC IC21电连接。
可以理解的，第一导体结构23、第二导体结构24以及近场通信线圈22也可以分别与NFC IC 21电连接，当第一导体结构23、第二导体结构24以及近场通信线圈22分别与NFC IC21电连接时，第一导体结构23、第二导体结构24以及近场通信线圈22分别接地。
接地平面25用于形成公共地。其中，接地平面25可以通过电子设备100中的导体、印刷线路或者金属印刷层等形成。例如，接地平面25可以设置在电子设备100的电路板30上。接地平面25还可以形成在电子设备100的中框20上，或者也可以通过金属后盖50来形成接地平面25。
接地平面25包括间隔设置的第一接地点251和第二接地点252。第一接地点251、第二接地点252例如可以为接地平面25的端部，或者也可以为接地平面25上的凸起结构，或者也可以为接地平面25上形成的焊盘等等。
其中，接地平面25在第一接地点251和第二接地点252之间形成导电路径，导电路径可以用于传导电流。也即，当在第一接地点251与第二接地点252施加电压信号时，第一接地点251与第二接地点252之间可以产生电流，从而形成电流回路。可以理解的，当NFC IC21 提供差分激励电流时，第一接地点251和第二接地点252之间的导电路径可以用于传输所述差分激励电流。
第一导体结构23包括间隔设置的第一馈电端231和第一接地端232。第一馈电端231与近场通信线圈22的第一端电连接，近场通信线圈22的第二端与NFC IC21的第一差分信号端211电连接，从而实现第一差分信号端211分别向近场通信线圈22和第一导体结构23的第一馈电端231馈电。例如，NFC IC21提供的差分激励电流可以经由第一差分信号端211传输到近场通信线圈22和第一导体结构23的第一馈电端231，以实现向近场通信线圈22和第一导体结构23馈电。第一接地端232与接地平面25的第一接地点251电连接，从而实现第一导体结构23和近场通信线圈22的回地。
第二导体结构24包括间隔设置的第二馈电端241和第二接地端242。第二馈电端241与NFC IC21的第二差分信号端212电连接，从而实现第二差分信号端212向第二馈电端241馈电。例如，NFC IC21提供的差分激励电流可以经由第二馈电端241传输到第二差分信号端212，以实现向第二导体结构24馈电。第二接地端242与接地平面25的第二接地点252电连接，从而实现第二导体结构24的回地。
其中，近场通信线圈22、第一导体结构23、接地平面25上的导电路径以及第二导体结构24共同形成供所述差分激励电流传输的导电回路。也即，所述差分激励电流从所述NFC IC21的一个信号端输出，例如从所述第一差分信号端211输出，随后被馈入近场通信线圈22，经由近场通信线圈22传输到第一导体结构23，经由第一导体结构23传输到所述接地平面25上的导电路径，随后经由所述导电路径传输到第二导体结构24，最终通过所述第二导体结构24回流到所述NFC IC21的第二差分信号端212，从而形成完整的导电回路。
可以理解的，所述导电回路在传输所述差分激励电流时，近场通信线圈22、第一导体结构23、接地平面25上的导电路径、第二导体结构24可以共同产生交变电磁场，从而向外辐射NFC信号，以实现所述电子设备100的NFC通信。
如图3所示，其中，当把NFC IC 21的第一差分信号端211设置为正极(+)，第二差分信号端212设置为负极(-)时，所述导电回路在传输所述差分激励电流时，电流由NFC IC 21的第一差分信号端211传输到近场通信线圈22的第一端，然后，差分激励电流在近场通信线圈22内沿逆时针方向传输，并由近场通信线圈22的第二端传输至第一导体结构23，再由第一导体结构23传输到接地平面25，再通过接地平面25上的导电路径传输到第二导体结构24，再由第二导体结构24传输到NFC IC 21的第二差分信号端212。
当把NFC IC 21的第一差分信号端211设置为负极(-)，第二差分信号端212设置为正极(+)时，所述导电回路在传输所述差分激励电流时，电流由NFC IC 21的第二差分信号端212传输至第二导体结构24，再由第二导体结构24传输到接地平面25，再通过接地平面25上的导电路径传输到第一导体结构23，并由第一导体结构23传输至近场通信线圈22的第一端，差分激励电流在近场通信线圈22内沿顺时针方向传输，并由近场通信线圈22的第二端传输到NFC IC 21的第一差分信号端211。
其中，所述第一导体结构23、所述第二导体结构24都可以为电子设备100中的金属结构、电路板30上的金属走线、绕制线圈等结构。
例如，电子设备100的电路板30上设置有印刷线路。所述第一导体结构23可以为所述印刷线路，或者所述第二导体结构24为所述印刷线路。
再例如，电子设备100包括柔性电路板(Flexible Printed Circuit，FPC)，所述FPC与所述电路板30电连接。其中，所述FPC例如可以为显示屏的FPC、摄像头的FPC、马达的FPC等结构，或者所述FPC可以为用于实现NFC导体结构的独立的FPC，其可以固定于电子设备的100的壳体内。所述FPC上设置有金属走线，所述金属走线用于传输信号，例如可以用于传输显示屏的控制信号、摄像头的控制信号、马达的控制信号等。所述第一导体结构23可 以包括所述金属走线，或者所述第二导体结构24包括所述金属走线。
再例如，金属后盖50上间隔设置有第一金属枝节和第二金属枝节，所述第一金属枝节形成第一导体结构23，第二金属枝节形成第二导体结构24。
请继续参阅图3并同时参阅图4，图4为本申请实施例提供的电子设备中后盖的第一种结构示意图；当第一金属枝节和第二金属枝节位于后盖50相对的两个侧边时，两个侧边分别为左侧边和右侧边，后盖50上间隔设有第一缝隙51和第二缝隙52，第一缝隙51和第二缝隙52均贯穿后盖50设置，第一缝隙51在后盖50上朝向第一方向延伸，以形成第一金属枝节，第二缝隙52在后盖50上朝向第二方向延伸，以形成第二金属枝节，其中，第一方向和第二方向可以相同，也可以不同。
具体地，后盖50上还设有第一断缝53和第二断缝54，第一断缝53与第二断缝54贯穿后盖50设置，且第一断缝53与第一缝隙51相互连通，以形成第一金属枝节，第二断缝54与第二缝隙52相互连通，以形成第二金属枝节。
后盖50上还设有开口55，开口55用于安装摄像头模组60，其中，开口55可以设置于后盖50靠近边缘的位置，开口55也可以设置于后盖50的中间位置，开口55的设置位置可以根据实际需要进行设置，本申请实施例不再一一赘述。
其中，开口55的形状为圆形或椭圆形，可以理解的，开口55的形状也可以为方形，或者不规则的形状，开口55的具体形状可以根据摄像头模组60的形状大小进行设置，本申请实施例不对开口55的具体形状作进一步的限定。
请一并参阅图5，图5为本申请实施例提供的电子设备中后盖的第二种结构示意图；后盖50还可以设置通孔56，通孔56位于第一缝隙51和开口55之间，且通孔56与开口55相互连通，以使近场通信线圈22传输的差分激励电流信号通过开口55和通孔56传输至电子设备的外部，可以使更多的差分激励电流信号传输至电子设备的外部，从而可以提高NFC天线的性能。
可以理解的是，请参阅图6，图6为本申请实施例提供的电子设备中后盖的第三种结构示意图，为了进一步提高NFC天线的性能，通孔56可以与开口55和第一缝隙51相互连通，以实现近场通信线圈22传输的差分激励电流信号通过开口55、通孔56和第一缝隙51传输至电子设备的外部，可以使更多的差分激励电流信号传输至电子设备的外部，以进一步可以提高NFC天线的性能。
可以理解的，请参阅图7，图7为本申请实施例提供的电子设备中后盖的第四种结构示意图，第一金属枝节也可以位于后盖50的上端或下端，例如，当第一金属枝节位于后盖50的上端，第二金属枝节位于后盖50的右端时，后盖50上的通孔56位于后盖50的上端，且通孔56位于第一缝隙51和开口55之间，其中，通孔56的设置位置可以与第一金属枝节的位置相适应，可以理解的，通孔56的设置位置也可以与第二金属枝节的位置相适应。
请继续参阅图3和图4，为了进一步提高NFC天线的性能，当第一导体结构23和第二导体结构24位于金属后盖50时，第一导体结构23和第二导体结构24的第一接地端232和第二接地端242远离近场通信线圈22设置，例如，第一接地端232位于第一金属枝节且远离第一断缝53的一端设置，第二接地端242位于第二金属枝节且远离第二断缝54的一端设置，由于第一导体结构23和第二导体结构24的接地端都不靠近近场通信线圈22设置，NFC天线传输的差分激励电流可以形成正向涡流，从而可以提高NFC天线的性能。
再例如，中框20上间隔设置有第一金属枝节和第二金属枝节，所述第一金属枝节形成第一导体结构23，第二金属枝节形成第二导体结构24。
请参阅图8，图8为本申请实施例提供的电子设备的中框的结构示意图，中框20包括基板201和金属边框202。其中，基板201可以为薄板状或薄片状结构。在一些实施例中，基板201上可以形成有孔或槽等结构。基板201上形成的孔或槽可以用于安装电子设备100的其他 电子元件。例如，电子设备100的摄像头、电路板等电子元件可以通过孔或槽安装在基板201上。基板201的材质可以包括金属或塑胶。例如，基板201可以为铝合金基板。
金属边框202形成在所述基板201周缘。例如，金属边框202可以由金属材料在基板201周缘围设一圈形成。金属边框202的材质可以包括铝合金、镁合金等金属。例如，在一些实施例中，金属边框202可以为镁合金金属边框。金属边框202的宽度可以在2mm(毫米)至5mm之间。
金属边框202上设置有断缝，诸如第三断缝2021，第三断缝2021贯穿金属边框202的厚度方向设置，以将金属边框202分割为至少第一金属部2022和第二金属部2023，其中，第一金属部2022形成第一金属枝节，所述第二金属部2023形成第二金属枝节。
金属边框202和基板201之间设有缝隙2011，缝隙2011与第三断缝2021相互连通，第三断缝2021将缝隙2011分为第一部分和第二部分，例如，缝隙2011由第三断缝2021处沿金属边框202向左边延伸形成第一部分，缝隙2011由第三断缝2021处沿金属边框202向右边延伸形成第二部分，第一部分对应的金属边框202为第一金属部2022，第二部分对应的金属边框为第二金属部2023。
可以理解的，为了提高电子设备的结构强度，可以在第三断缝2021和缝隙2011内填充塑胶材料，塑胶材料密封第三断缝2021和缝隙2011。
可以理解的，为了提高电子设备的外观美感，可以在第三断缝2021和缝隙2011内填充与金属边框202颜色一样的塑胶材料，减少电子设备100的外观颜色的种类，有助于提高电子设备的外观美感。
可以理解的，中框20也可以包括基板和塑胶边框，塑胶边框围绕基板设置，通过在塑胶边框设置两个金属片以形成第一金属枝节和第二金属枝节。
可以理解的，当在中框20上设置第一金属枝节以形成第一导体结构23，以及设置第二金属枝节以形成第二导体结构24时，后盖50上也可以设置通孔，诸如通孔56，通孔56与开口55和缝隙2011连通，以实现近场通信线圈22传输的差分激励电流信号通过开口55、通孔56和缝隙2011传输至电子设备的外部，可以使更多的差分激励电流信号传输至电子设备的外部，以进一步可以提高NFC天线的性能。
摄像头模组60可以包括一个摄像头和金属装饰件。摄像头用于采集环境光信号进行成像，从而实现拍照或录像。其中，摄像头可以包括镜头和底座。镜头安装在底座上，以对镜头进行固定。底座可以安装在中框20上，或者安装在电路板30上，以进行固定。
其中，金属装饰件围绕摄像头形成一安装孔，摄像头位于该安装孔内，金属装饰件一方面可以起到装饰作用，防止从电子设备外部可以观察到摄像头的内部结构；另一方面也可以起到对摄像头辅助固定的作用，增强摄像头的结构稳定性。
其中，近场通信线圈22可以围绕摄像头的周缘设置，近场通信线圈22也可以围绕金属装饰件的周缘设置。
当近场通信线圈22围绕摄像头的周缘设置时，摄像头包括镜头和基座，镜头固定于基座上，近场通信线圈22可以围绕基座设置，也可以围绕镜头靠近基座的一端设置。
当近场通信线圈22围绕金属装饰件的周缘设置时，近场通信线圈22是不闭合的线圈，以形成两个端部，两个端部用于与NFC IC 21和第一导体结构23电连接。
其中，金属装饰件的材质例如可以包括铝合金、镁合金、铜合金等材质。
金属装饰件设有第三缝隙，第三缝隙位于通孔56与开口55之间，第三缝隙贯穿金属装饰件设置，以将金属装饰件分割为两部分，并且，第三缝隙与安装孔连通，在近场通信线圈22传输所述差分激励电流时，可以使金属装饰件中产生的感应电流的传输方向发生改变，以使近场通信线圈22传输的差分激励电流的方向与金属装饰件中产生的感应电流的方向相互垂直，形成正交极化，以降低金属装饰件中形成的感应磁场对近场通信信号的干扰，从 而可以进一步提高NFC天线的性能。
可以理解的，摄像头模组60也可以包括多个摄像头，当摄像头模组60包括多个摄像头时，近场通信线圈22可以围绕至少一个摄像头的周缘设置，例如，近场通信线圈22可以围绕一个摄像头的周缘设置，近场通信线圈22也可以围绕两个摄像头的周缘设置。
可以理解的，当摄像头模组60包括多个摄像头时，近场通信线圈22也可以围绕金属装饰件的周缘设置。
其中，摄像头的数量可以为两个、三个或四个等，摄像头的数量可以根据实际需要进行灵活设置。
下面以摄像头模组60包括两个摄像头为例进行详细说明。
请继续参阅图6并同时参阅图9，图9为本申请实施例提供的摄像头模组和近场通信线圈的第一种连接结构示意图。摄像头模组60包括两个摄像头61和金属装饰件62，金属装饰件62围绕每一个摄像头61设置。两个摄像头诸如第一摄像头61a和第二摄像头61b。
金属装饰件62设有两个安装孔621，两个安装孔621诸如第一安装孔621a和第二安装孔621b，第一安装孔621a用于安装一个第一摄像头61a，第二安装孔621b用于安装第二摄像头61b。
金属装饰件62还设有第四缝隙622和第五缝隙623，第四缝隙622与所述第一安装孔621a相邻设置，第四缝隙622贯穿金属装饰件62设置，以将金属装饰件62分割为两部分，所述第五缝隙623位于所述第一安装孔621a和所述第二安装孔621b之间，且所述第四缝隙622、所述第五缝隙623、所述第一安装孔621a与所述第二安装孔621b相互连通，从而第四缝隙622、第一安装孔621a、第二安装孔621b、第五缝隙623之间可以形成为一体。
当近场通信线圈22围绕金属装饰件62设置时，由于金属装饰件62内设置有第四缝隙622和第五缝隙623，在近场通信线圈22传输所述差分激励电流时，可以使金属装饰件62中产生的感应电流的传输方向发生改变，以使近场通信线圈22传输的差分激励电流的方向与金属装饰件62中产生的感应电流的方向相互垂直，形成正交极化，以降低金属装饰件62中形成的感应磁场对近场通信信号的干扰，从而可以进一步提高NFC天线的性能。
可以理解的是，请同时参阅图7和图10，图10为本申请实施例提供的摄像头模组和近场通信线圈的第二种连接结构示意图；摄像头模组60也可以包括三个摄像头61和金属装饰件62，三个摄像头61诸如第一摄像头61a、第二摄像头61a以及第三摄像头61c，金属装饰件62设有三个安装孔621，三个安装孔621诸如第一安装孔621a、第二安装孔621b以及第三安装孔621c，第一安装孔621a用于安装第一摄像头61a，第二安装孔621b用于安装第二摄像头61b、第三安装孔621c用于安装第三摄像头61c。
其中，金属装饰件62还设有三个缝隙，诸如第四缝隙622、第五缝隙623和第六缝隙624，第四缝隙622与所述第一安装孔621a相邻设置，第四缝隙622贯穿金属装饰件62设置，以将金属装饰件62分割为两部分，所述第五缝隙623位于所述第一安装孔621a和所述第二安装孔621b之间，所述第六缝隙624位于所述第二安装孔621b和所述第三安装孔621c之间，且所述第四缝隙622、所述第五缝隙623、所述第六缝隙624、所述第一安装孔621a、所述第二安装孔621b、所述第三安装孔621c相互连通，从而第三安装孔621c、第六缝隙624、第二安装孔621b、第五缝隙623、第一安装孔621a、第四缝隙622之间可以形成为一体。
当近场通信线圈22围绕金属装饰件62设置时，由于金属装饰件62内设置有第四缝隙622、第五缝隙623和第六缝隙624，在近场通信线圈22传输所述差分激励电流时，可以使金属装饰件62中产生的感应电流的传输方向发生改变，以使近场通信线圈22传输的差分激励电流的方向与金属装饰件62中产生的感应电流的方向相互垂直，形成正交极化，以降低金属装饰件62中形成的感应磁场对近场通信信号的干扰，从而可以进一步提高NFC天线的性能。
请参阅图11，图11为本申请实施例提供的电子设备中天线装置与摄像头模组的第二种结构示意图。其中，天线装置200还包括第一非近场通信芯片26、第二非近场通信芯片27。其中，第一非近场通信芯片26诸如为IC1，第二非近场通信芯片27诸如为IC2。可以理解的，第一非近场通信芯片26、第二非近场通信芯片27都可以集成在电子设备100的电路板30上。
第一非近场通信芯片26用于提供第一非近场通信激励信号。其中，所述第一非近场通信激励信号为非平衡信号。所述第一非近场通信激励信号可以包括蜂窝网络信号、无线保真(Wireless Fidelity，Wi-Fi)信号、全球定位系统(Global Positioning System，GPS)信号、蓝牙(Bluetooth，BT)信号中的一种。相应的，所述第一非近场通信芯片26可以为蜂窝通信芯片，用于提供所述蜂窝网络信号；所述第一非近场通信芯片26可以为Wi-Fi芯片，用于提供所述Wi-Fi信号；所述第一非近场通信芯片26可以为GPS芯片，用于提供所述GPS信号；所述第一非近场通信芯片26还可以为BT芯片，用于提供所述BT信号。
第一导体结构23还包括第三馈电端233。所述第三馈电端233与所述第一馈电端231、所述第一接地端232间隔设置。所述第三馈电端233与所述第一非近场通信芯片26电连接，并且所述第一非近场通信芯片26接地。从而，所述第一非近场通信芯片26可以通过所述第三馈电端223向所述第一导体结构23馈入所述第一非近场通信激励信号。因此，所述第一导体结构23还可以用于传输所述第一非近场通信激励信号。
可以理解的，所述第一导体结构23既可以用于传输所述NFC IC21提供的差分激励电流信号，又可以用于传输所述第一非近场通信芯片26提供的第一非近场通信激励信号，从而可以实现第一导体结构23的复用，能够减少电子设备100中用于传输无线信号的导体结构的数量，从而可以节省电子设备100的内部空间。
其中，需要说明的是，NFC信号的频率通常为13.56MHz(兆赫兹)，蜂窝网络信号的频率通常在700MHz以上，Wi-Fi信号的频率通常为2.4GHz(吉赫兹)或5GHz，GPS信号的频率通常包括1.575GHz、1.227GHz、1.381GHz、1.841GHz等多个频段，BT信号的频率通常为2.4GHz。因此，相对于蜂窝网络信号、Wi-Fi信号、GPS信号、BT信号而言，NFC信号为低频信号，而蜂窝网络信号、Wi-Fi信号、GPS信号、BT信号均为高频信号。或者也可以理解为，NFC信号为低频信号，所述第一非近场通信激励信号为高频信号，NFC信号的频率小于所述第一非近场通信激励信号的频率。
此外，需要说明的是，在传输无线信号时，无线信号的频率越低，所需的辐射体长度越长；而无线信号的频率越高，所需的辐射体长度越短。也即，传输所述NFC信号所需的辐射体的长度大于传输所述第一非近场通信激励信号所需的辐射体长度。
因此，在所述第一导体结构23中，所述第一馈电端231与所述第一接地端232的距离大于所述第三馈电端233与所述第一接地端232的距离。从而，即可使得在所述第一导体结构23中，传输所述NFC信号的辐射体的长度大于传输所述第一非近场通信激励信号的辐射体的长度。
此外，为了减小第一导体结构23的整体长度，可以设置为所述第三馈电端233与所述第一馈电端231位于所述第一接地端232的同一侧。也即，所述第三馈电端233位于所述第一馈电端231与所述第一接地端232之间。相较于所述第三馈电端233与所述第一馈电端231位于所述第一接地端232的不同侧而言，所述第三馈电端233与所述第一馈电端231位于所述第一接地端232的同一侧可以复用所述第三馈电端233与所述第一接地端232之间的部分，从而可以减小第一导体结构23的整体长度。
所述第二非近场通信芯片27用于提供第二非近场通信激励信号。其中，所述第二非近场通信激励信号为非平衡信号。所述第二非近场通信激励信号可以包括蜂窝网络信号、无线保真信号(Wi-Fi信号)、全球定位系统信号(GPS信号)、蓝牙信号(BT信号)中的一种。相应的，所述第二非近场通信芯片27可以为蜂窝通信芯片，用于提供所述蜂窝网络信号； 所述第二非近场通信芯片27可以为Wi-Fi芯片，用于提供所述Wi-Fi信号；所述第二非近场通信芯片27可以为GPS芯片，用于提供所述GPS信号；所述第二非近场通信芯片27还可以为BT芯片，用于提供所述BT信号。
其中，需要说明的是，所述第二非近场通信激励信号与所述第一非近场通信激励信号既可以相同通信类型的信号，也可以是不同通信类型的信号。相应的，所述第二非近场通信芯片27与所述第一非近场通信芯片26既可以是相同类型的芯片，也可以是不同类型的芯片。
第二导体结构24还包括第四馈电端243。所述第四馈电端243与所述第二馈电端241、所述第二接地端242间隔设置。所述第四馈电端233与所述第二非近场通信芯片27电连接，并且所述第二非近场通信芯片27接地。从而，所述第二非近场通信芯片27可以通过所述第四馈电端243向所述第二导体结构24馈入所述第二非近场通信信号。因此，所述第二导体结构24还可以用于传输所述第二非近场通信激励信号。
可以理解的，所述第二导体结构24既可以用于传输所述NFC IC 21提供的差分激励电流信号，又可以用于传输所述第二非近场通信芯片27提供的第二非近场通信激励信号，从而可以实现所述第二导体结构24的复用，能够进一步减少电子设备100中用于传输无线信号的导体结构的数量，从而可以进一步节省电子设备100的内部空间。
同样的，在所述第二导体结构24中，所述第二馈电端241与所述第二接地端242的距离大于所述第四馈电端243与所述第二接地端242的距离。从而，即可使得在所述第二导体结构24中，传输所述NFC信号的辐射体的长度大于传输所述第二非近场通信激励信号的辐射体的长度。
此外，为了减小第二导体结构24的整体长度，可以设置为所述第四馈电端243与所述第二馈电端241位于所述第二接地端242的同一侧。也即，所述第四馈电端243位于所述第二馈电端241与所述第二接地端242之间。相较于述第四馈电端243与所述第二馈电端241位于所述第二接地端242的不同侧而言，所述第四馈电端243与所述第二馈电端241位于所述第二接地端242的同一侧可以复用所述第四馈电端243与所述第二接地端242之间的部分，从而可以减小所述第二导体结构24的整体长度。
参考图12，图12为本申请实施例提供的电子设备中天线装置与摄像头模组的第三种结构示意图。其中，所述天线装置200还包括第一匹配电路M1、第二匹配电路M2、第三匹配电路M3、第一滤波电路LC1、第二滤波电路LC2、第三滤波电路LC3以及第四滤波电路LC4。可以理解的，匹配电路也可以称为匹配网络、调谐电路、调谐网络等。滤波电路也可以称为滤波网络。
所述第一匹配电路M1分别与所述NFC IC21的第一差分信号端211、所述NFC IC21的第二差分信号端212、所述第一导体结构23的第一馈电端231、所述第二导体结构24的第二馈电端241电连接。所述第一匹配电路M1用于对所述导电回路传输所述差分激励电流时的阻抗进行匹配。其中，所述导电回路即为所述近场通信线圈22、所述第一导体结构23、所述接地平面25上的导电路径以及所述第二导体结构24共同形成的导电回路。
其中，所述第一匹配电路M1包括第一输入端a、第二输入端b、第一输出端c、第二输出端d。所述第一输入端a与所述NFC IC 21的第一差分信号端211电连接，所述第二输入端b与所述NFC IC 21的第二差分信号端212电连接，所述第一输出端c与所述第一导体结构23的第一馈电端231电连接，所述第二输出端d与所述第二导体结构24的第二馈电端241电连接。
所述第一滤波电路LC1设置在所述NFC IC 21的第一差分信号端211与所述第一匹配电路M1的第一输入端a之间。所述第一滤波电路LC1用于滤除所述第一差分信号端211与所述第一输入端a之间的第一干扰信号。所述第一干扰信号即为所述NFC IC 21提供的 差分激励电流之外的电信号。
所述第二滤波电路LC2设置在所述NFC IC 21的第二差分信号端212与所述第一匹配电路M1的第二输入端b之间。所述第二滤波电路LC2用于滤除所述第二差分信号端212与所述第二输入端b之间的第二干扰信号。所述第二干扰信号即为所述NFC IC 21提供的差分激励电流之外的电信号。
所述第二匹配电路M2分别与所述第一非近场通信芯片26、所述第一导体结构23的第三馈电端233电连接。所述第二匹配电路M2用于对所述第一导体结构23传输所述第一非近场通信激励信号时的阻抗进行匹配。
所述第三滤波电路LC3设置在所述第一非近场通信芯片26与所述第二匹配电路M2之间。所述第三滤波电路LC3用于滤除所述第一非近场通信芯片26与所述第二匹配电路M2之间的第三干扰信号。所述第三干扰信号即为所述第一非近场通信芯片26提供的第一非近场通信激励信号之外的电信号。
所述第三匹配电路M3分别与所述第二非近场通信芯片27、所述第二导体结构24的第四馈电端243电连接。所述第三匹配电路M3用于对所述第二导体结构24传输所述第二非近场通信激励信号时的阻抗进行匹配。
所述第四滤波电路LC4设置在所述第二非近场通信芯片27与所述第三匹配电路M3之间。所述第四滤波电路LC4用于滤除所述第二非近场通信芯片27与所述第三匹配电路M33之间的第四干扰信号。所述第四干扰信号即为所述第二非近场通信芯片27提供的第二非近场通信激励信号之外的电信号。
其中，可以理解的，所述第一匹配电路M1、所述第二匹配电路M2、所述第三匹配电路M3都可以包括由电容、电感的任意串联或者任意并联所组成的电路。所述第一滤波电路LC1、所述第二滤波电路LC2、所述第三滤波电路LC3、所述第四滤波电路LC4也可以包括由电容、电感的任意串联或者任意并联所组成的电路。
参考图13，图13为本申请实施例提供的电子设备中天线装置与摄像头模组的第四种结构示意图。
所述第一匹配电路M1例如可以包括四个电容C1、C2、C3、C4。其中，电容C1与NFCIC 21的第一差分信号端211串联，电容C2与NFC IC 21的第二差分信号端212串联。电容C3与电容C4串联，并且串联之后与所述NFC IC 21并联，并且电容C3与电容C4之间接地。可以理解的，电容C1、C2、C3、C4的电容值可以根据实际需要进行设置。
所述第一滤波电路LC1例如可以包括电感L1和电容C5。其中，电感L1串联在所述第一差分信号端211与所述第一匹配电路M1之间，电容C5与所述NFC IC 21并联并接地。可以理解的，电感L1的电感值、电容C5的电容值都可以根据实际需要进行设置。
所述第二滤波电路LC2例如可以包括电感L2和电容C6。其中，电感L2串联在所述第二差分信号端212与所述第一匹配电路M1之间，电容C6与所述NFC IC 21并联并接地。可以理解的，电感L2的电感值、电容C6的电容值都可以根据实际需要进行设置。
所述第二匹配电路M2例如可以包括电容C7、C8。其中，电容C7串联在第一导体结构23的第三馈电端233与第一非近场通信芯片26之间，电容C8与所述第一非近场通信芯片26并联并接地。可以理解的，电容C7、C8的电容值可以根据实际需要进行设置。
所述第三滤波电路LC3例如可以包括电感L3和电容C9。其中，电感L3串联在第一非近场通信芯片26与所述第二匹配电路M2之间，电容C9与所述第一非近场通信芯片26并联并接地。可以理解的，电感L3的电感值、电容C9的电容值都可以根据实际需要进行设置。
所述第三匹配电路M3例如可以包括电容C10、C11。其中，电容C10串联在第二导体结构24的第四馈电端243与第二非近场通信芯片27之间，电容C11与所述第二非近场通 信芯片27并联并接地。可以理解的，电容C10、C11的电容值可以根据实际需要进行设置。
所述第四滤波电路LC4例如可以包括电感L4和电容C12。其中，电感L4串联在第二非近场通信芯片27与所述第三匹配电路M3之间，电容C12与所述第二非近场通信芯片27并联并接地。可以理解的，电感L4的电感值、电容C12的电容值都可以根据实际需要进行设置。
以上对本申请实施例提供的天线装置及电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (25)

  1. 一种天线装置，包括：
    近场通信芯片，用于提供差分激励电流；
    近场通信线圈，用于设置在摄像头模组周缘，所述近场通信线圈与所述近场通信芯片电连接；
    第一导体结构，与所述近场通信线圈电连接，且所述第一导体结构接地；
    第二导体结构，与所述近场通信芯片电连接，且所述第二导体结构接地；
    其中，所述近场通信线圈、所述第一导体结构、所述第二导体结构用于共同传输所述差分激励电流，在传输所述差分激励电流时，所述近场通信线圈形成第一近场通信辐射场，所述第一导体结构形成第二近场通信辐射场，所述第二导体结构形成第三近场通信辐射场，所述第一近场通信辐射场用于对所述第二近场通信辐射场和所述第三近场通信辐射场进行增强。
  2. 根据权利要求1所述的天线装置，其中，所述第一近场通信辐射场、所述第二近场通信辐射场和所述第三近场通信辐射场至少部分重叠。
  3. 根据权利要求1所述的天线装置，还包括接地平面，其中：
    所述近场通信芯片包括第一差分信号端和第二差分信号端，所述第一差分信号端和所述第二差分信号端用于提供所述差分激励电流；
    所述接地平面包括间隔设置的第一接地点和第二接地点，所述接地平面在所述第一接地点和所述第二接地点之间形成导电路径；
    所述第一导体结构包括间隔设置的第一馈电端和第一接地端，所述第一馈电端通过所述近场通信线圈与所述第一差分信号端电连接，所述第一接地端与所述第一接地点电连接；
    所述第二导体结构包括间隔设置的第二馈电端和第二接地端，所述第二馈电端与所述第二差分信号端电连接，所述第二接地端与所述第二接地点电连接；
    其中，所述近场通信线圈、所述第一导体结构、所述导电路径以及所述第二导体结构共同形成供所述差分激励电流传输的导电回路。
  4. 根据权利要求3所述的天线装置，其中：
    所述近场通信芯片的第一差分信号端为正极时，所述近场通信线圈内的差分激励电流沿逆时针方向传输；
    所述近场通信芯片的第一差分信号端为负极时，所述近场通信线圈内的差分激励电流沿顺时针方向传输。
  5. 根据权利要求3所述的天线装置，其中，还包括：
    第一非近场通信芯片，用于提供第一非近场通信激励信号；
    所述第一导体结构还包括第三馈电端，所述第三馈电端与所述第一非近场通信芯片电连接，所述第一导体结构还用于传输所述第一非近场通信激励信号。
  6. 根据权利要求3所述的天线装置，其中，还包括：
    第二非近场通信芯片，用于提供第二非近场通信激励信号；
    所述第二导体结构还包括第四馈电端，所述第四馈电端与所述第二非近场通信芯片电连接，所述第二导体结构还用于传输所述第二非近场通信激励信号。
  7. 根据权利要求3所述的天线装置，其中，还包括：
    第一匹配电路，分别与所述第一差分信号端、所述第二差分信号端、所述第一馈电端、所述第二馈电端电连接，所述第一匹配电路用于对所述导电回路传输所述差分激励电流时的阻抗进行匹配。
  8. 根据权利要求5所述的天线装置，其中，还包括：
    第二匹配电路，分别与所述第一非近场通信芯片、所述第三馈电端电连接，所述第二 匹配电路用于对所述第一导体结构传输所述第一非近场通信激励信号时的阻抗进行匹配。
  9. 根据权利要求6所述的天线装置，其中，还包括：
    第三匹配电路，分别与所述第二非近场通信芯片、所述第四馈电端电连接，所述第三匹配电路用于对所述第二导体结构传输所述第二非近场通信激励信号时的阻抗进行匹配。
  10. 一种电子设备，包括天线装置，所述天线装置包括：
    近场通信芯片，用于提供差分激励电流；
    近场通信线圈，用于设置在摄像头模组周缘，所述近场通信线圈与所述近场通信芯片电连接；
    第一导体结构，与所述近场通信线圈电连接，且所述第一导体结构接地；
    第二导体结构，与所述近场通信芯片电连接，且所述第二导体结构接地；
    其中，所述近场通信线圈、所述第一导体结构、所述第二导体结构用于共同传输所述差分激励电流，在传输所述差分激励电流时，所述近场通信线圈形成第一近场通信辐射场，所述第一导体结构形成第二近场通信辐射场，所述第二导体结构形成第三近场通信辐射场，所述第一近场通信辐射场用于对所述第二近场通信辐射场和所述第三近场通信辐射场进行增强。
  11. 根据权利要求10所述的电子设备，其中，所述第一近场通信辐射场、所述第二近场通信辐射场和所述第三近场通信辐射场至少部分重叠。
  12. 根据权利要求10所述的电子设备，所述天线装置还包括接地平面，其中：
    所述近场通信芯片包括第一差分信号端和第二差分信号端，所述第一差分信号端和所述第二差分信号端用于提供所述差分激励电流；
    所述接地平面包括间隔设置的第一接地点和第二接地点，所述接地平面在所述第一接地点和所述第二接地点之间形成导电路径；
    所述第一导体结构包括间隔设置的第一馈电端和第一接地端，所述第一馈电端通过所述近场通信线圈与所述第一差分信号端电连接，所述第一接地端与所述第一接地点电连接；
    所述第二导体结构包括间隔设置的第二馈电端和第二接地端，所述第二馈电端与所述第二差分信号端电连接，所述第二接地端与所述第二接地点电连接；
    其中，所述近场通信线圈、所述第一导体结构、所述导电路径以及所述第二导体结构共同形成供所述差分激励电流传输的导电回路。
  13. 根据权利要求12所述的电子设备，其中：
    所述近场通信芯片的第一差分信号端为正极时，所述近场通信线圈内的差分激励电流沿逆时针方向传输；
    所述近场通信芯片的第一差分信号端为负极时，所述近场通信线圈内的差分激励电流沿顺时针方向传输。
  14. 根据权利要求12所述的电子设备，其中，所述天线装置还包括：
    第一非近场通信芯片，用于提供第一非近场通信激励信号；
    所述第一导体结构还包括第三馈电端，所述第三馈电端与所述第一非近场通信芯片电连接，所述第一导体结构还用于传输所述第一非近场通信激励信号。
  15. 根据权利要求12所述的电子设备，其中，所述天线装置还包括：
    第二非近场通信芯片，用于提供第二非近场通信激励信号；
    所述第二导体结构还包括第四馈电端，所述第四馈电端与所述第二非近场通信芯片电连接，所述第二导体结构还用于传输所述第二非近场通信激励信号。
  16. 根据权利要求10所述的电子设备，其中，还包括：
    金属后盖，设置有开口；
    摄像头模组，设置于所述开口内，所述近场通信线圈围绕所述摄像头模组设置。
  17. 根据权利要求16所述的电子设备，其中，还包括：
    中框，与所述金属后盖连接，所述中框上设置有第一金属枝节和第二金属枝节，所述第一金属枝节形成所述第一导体结构，所述第二金属枝节形成所述第二导体结构。
  18. 根据权利要求16所述的电子设备，其中，所述金属后盖上设置有第一金属枝节和第二金属枝节，所述第一金属枝节形成所述第一导体结构，所述第二金属枝节形成所述第二导体结构。
  19. 根据权利要求18所述的电子设备，其中，所述金属后盖上间隔设置有第一缝隙和第二缝隙，以在所述金属后盖上形成所述第一金属枝节和所述第二金属枝节。
  20. 根据权利要求19所述的电子设备，其中，所述金属后盖设有通孔，所述通孔设置于所述开口和所述第一缝隙之间，且所述通孔与所述开口和所述第一缝隙连通，以使所述近场通信线圈依次通过所述开口、所述通孔、所述第一缝隙将所述差分激励电流传输至所述电子设备的外部。
  21. 根据权利要求16任一项所述的电子设备，其中，所述摄像头模组包括多个摄像头，所述近场通信线圈围绕至少一个所述摄像头设置。
  22. 根据权利要求16任一项所述的电子设备，其中，所述摄像头模组包括至少一个摄像头和金属装饰件，所述金属装饰件上设置有至少一个安装孔，一所述摄像头设置于一所述安装孔内，所述近场通信线圈围绕所述金属装饰件设置。
  23. 根据权利要求22所述的电子设备，其中，所述金属装饰件还设置有第三缝隙，所述第三缝隙贯穿所述金属装饰件设置，以将所述金属装饰件分割为两部分，且所述第三缝隙与所述安装孔连通，以使所述金属装饰件中产生的感应电流的方向与所述近场通信线圈传输所述差分激励电流的方向相互垂直。
  24. 根据权利要求16任一项所述的电子设备，其中，所述摄像头模组包括第一摄像头、第二摄像头、第三摄像头和金属装饰件；
    所述金属装饰件上间隔设置有第一安装孔、第二安装孔和第三安装孔，所述第一摄像头设置于所述第一安装孔内，所述第二摄像头设置于所述第二安装孔内，所述第三摄像头设置于所述第三安装孔内，所述近场通信线圈围绕所述金属装饰件设置。
  25. 根据权利要求24所述的电子设备，其中，所述金属装饰件还设置有第四缝隙、第五缝隙和第六缝隙，所述第四缝隙贯穿所述金属装饰件设置，以将所述金属装饰件分割为两部分，所述第五缝隙位于所述第一安装孔和所述第二安装孔之间，所述第六缝隙位于所述第二安装孔和所述第三安装孔之间，且所述第四缝隙、所述第五缝隙、所述第六缝隙、所述第一安装孔、所述第二安装孔与所述第三安装孔相互连通，以使所述金属装饰件中产生的感应电流的方向与所述近场通信线圈传输所述差分激励电流的方向相互垂直。
PCT/CN2020/138864 2019-12-31 2020-12-24 天线装置及电子设备 WO2021136052A1 (zh)

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