WO2022158714A1 - 다이캐스팅 금속 부품-고분자 수지 복합체 및 이의 제조방법 - Google Patents
다이캐스팅 금속 부품-고분자 수지 복합체 및 이의 제조방법 Download PDFInfo
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- WO2022158714A1 WO2022158714A1 PCT/KR2021/018785 KR2021018785W WO2022158714A1 WO 2022158714 A1 WO2022158714 A1 WO 2022158714A1 KR 2021018785 W KR2021018785 W KR 2021018785W WO 2022158714 A1 WO2022158714 A1 WO 2022158714A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- polymer resin
- sodium
- sulfate
- silicate
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 68
- 239000002952 polymeric resin Substances 0.000 title claims abstract description 59
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 28
- 239000002184 metal Substances 0.000 title claims abstract description 28
- 238000004512 die casting Methods 0.000 title claims abstract description 25
- 239000002131 composite material Substances 0.000 title claims abstract description 14
- 229910000861 Mg alloy Inorganic materials 0.000 claims abstract description 19
- 229910001297 Zn alloy Inorganic materials 0.000 claims abstract description 18
- 238000002347 injection Methods 0.000 claims abstract description 16
- 239000007924 injection Substances 0.000 claims abstract description 16
- 239000001307 helium Substances 0.000 claims abstract description 8
- 229910052734 helium Inorganic materials 0.000 claims abstract description 8
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims abstract description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 33
- 239000007864 aqueous solution Substances 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 239000012153 distilled water Substances 0.000 claims description 20
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 17
- -1 polyethylene Polymers 0.000 claims description 16
- 238000005868 electrolysis reaction Methods 0.000 claims description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 15
- 150000001340 alkali metals Chemical class 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229910052783 alkali metal Inorganic materials 0.000 claims description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 10
- 238000005238 degreasing Methods 0.000 claims description 10
- 229910019142 PO4 Inorganic materials 0.000 claims description 9
- 239000004115 Sodium Silicate Substances 0.000 claims description 9
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 9
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 9
- 239000000805 composite resin Substances 0.000 claims description 9
- 239000010452 phosphate Substances 0.000 claims description 9
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 9
- 239000004698 Polyethylene Substances 0.000 claims description 8
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 8
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 7
- 150000005325 alkali earth metal hydroxides Chemical class 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 7
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 7
- 235000011152 sodium sulphate Nutrition 0.000 claims description 7
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 6
- 229920002292 Nylon 6 Polymers 0.000 claims description 5
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 5
- 239000004954 Polyphthalamide Substances 0.000 claims description 5
- 239000004110 Zinc silicate Substances 0.000 claims description 5
- 229920006375 polyphtalamide Polymers 0.000 claims description 5
- 235000019352 zinc silicate Nutrition 0.000 claims description 5
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 4
- 239000008151 electrolyte solution Substances 0.000 claims description 4
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000391 magnesium silicate Substances 0.000 claims description 3
- 229910052919 magnesium silicate Inorganic materials 0.000 claims description 3
- 235000019792 magnesium silicate Nutrition 0.000 claims description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 3
- 235000019795 sodium metasilicate Nutrition 0.000 claims description 3
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 3
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 3
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 3
- GEZAUFNYMZVOFV-UHFFFAOYSA-J 2-[(2-oxo-1,3,2$l^{5},4$l^{2}-dioxaphosphastannetan-2-yl)oxy]-1,3,2$l^{5},4$l^{2}-dioxaphosphastannetane 2-oxide Chemical compound [Sn+2].[Sn+2].[O-]P([O-])(=O)OP([O-])([O-])=O GEZAUFNYMZVOFV-UHFFFAOYSA-J 0.000 claims description 2
- WWILHZQYNPQALT-UHFFFAOYSA-N 2-methyl-2-morpholin-4-ylpropanal Chemical compound O=CC(C)(C)N1CCOCC1 WWILHZQYNPQALT-UHFFFAOYSA-N 0.000 claims description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004111 Potassium silicate Substances 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 2
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 2
- JUNWLZAGQLJVLR-UHFFFAOYSA-J calcium diphosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])(=O)OP([O-])([O-])=O JUNWLZAGQLJVLR-UHFFFAOYSA-J 0.000 claims description 2
- 239000000920 calcium hydroxide Substances 0.000 claims description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 2
- 229940043256 calcium pyrophosphate Drugs 0.000 claims description 2
- 239000000378 calcium silicate Substances 0.000 claims description 2
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 2
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 claims description 2
- 235000019821 dicalcium diphosphate Nutrition 0.000 claims description 2
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 2
- 235000019820 disodium diphosphate Nutrition 0.000 claims description 2
- GYQBBRRVRKFJRG-UHFFFAOYSA-L disodium pyrophosphate Chemical compound [Na+].[Na+].OP([O-])(=O)OP(O)([O-])=O GYQBBRRVRKFJRG-UHFFFAOYSA-L 0.000 claims description 2
- CADNYOZXMIKYPR-UHFFFAOYSA-B ferric pyrophosphate Chemical compound [Fe+3].[Fe+3].[Fe+3].[Fe+3].[O-]P([O-])(=O)OP([O-])([O-])=O.[O-]P([O-])(=O)OP([O-])([O-])=O.[O-]P([O-])(=O)OP([O-])([O-])=O CADNYOZXMIKYPR-UHFFFAOYSA-B 0.000 claims description 2
- NUHSROFQTUXZQQ-UHFFFAOYSA-N isopentenyl diphosphate Chemical compound CC(=C)CCO[P@](O)(=O)OP(O)(O)=O NUHSROFQTUXZQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229930182823 kanamycin A Natural products 0.000 claims description 2
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052912 lithium silicate Inorganic materials 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 2
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 2
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 2
- KAQHZJVQFBJKCK-UHFFFAOYSA-L potassium pyrosulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OS([O-])(=O)=O KAQHZJVQFBJKCK-UHFFFAOYSA-L 0.000 claims description 2
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052913 potassium silicate Inorganic materials 0.000 claims description 2
- 235000019353 potassium silicate Nutrition 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 claims description 2
- 229910000342 sodium bisulfate Inorganic materials 0.000 claims description 2
- JXAZAUKOWVKTLO-UHFFFAOYSA-L sodium pyrosulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OS([O-])(=O)=O JXAZAUKOWVKTLO-UHFFFAOYSA-L 0.000 claims description 2
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 2
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 2
- BYTVRGSKFNKHHE-UHFFFAOYSA-K sodium;[hydroxy(oxido)phosphoryl] phosphate;iron(2+) Chemical compound [Na+].[Fe+2].OP([O-])(=O)OP([O-])([O-])=O BYTVRGSKFNKHHE-UHFFFAOYSA-K 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 claims description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 2
- 229960001763 zinc sulfate Drugs 0.000 claims description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 2
- ODPYDILFQYARBK-UHFFFAOYSA-N 7-thiabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2SC2=C1 ODPYDILFQYARBK-UHFFFAOYSA-N 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- JZRWCGZRTZMZEH-UHFFFAOYSA-N Thiamine Natural products CC1=C(CCO)SC=[N+]1CC1=CN=C(C)N=C1N JZRWCGZRTZMZEH-UHFFFAOYSA-N 0.000 claims 1
- 235000012241 calcium silicate Nutrition 0.000 claims 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 229940005657 pyrophosphoric acid Drugs 0.000 claims 1
- 235000012222 talc Nutrition 0.000 claims 1
- KYMBYSLLVAOCFI-UHFFFAOYSA-N thiamine Chemical compound CC1=C(CCO)SCN1CC1=CN=C(C)N=C1N KYMBYSLLVAOCFI-UHFFFAOYSA-N 0.000 claims 1
- 229960003495 thiamine Drugs 0.000 claims 1
- 235000019157 thiamine Nutrition 0.000 claims 1
- 239000011721 thiamine Substances 0.000 claims 1
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 abstract description 6
- 238000005259 measurement Methods 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 16
- 239000003792 electrolyte Substances 0.000 description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 12
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 8
- 229910017604 nitric acid Inorganic materials 0.000 description 8
- 229910000838 Al alloy Inorganic materials 0.000 description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 description 7
- 230000002378 acidificating effect Effects 0.000 description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 5
- 235000017557 sodium bicarbonate Nutrition 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- ZOIVSVWBENBHNT-UHFFFAOYSA-N dizinc;silicate Chemical compound [Zn+2].[Zn+2].[O-][Si]([O-])([O-])[O-] ZOIVSVWBENBHNT-UHFFFAOYSA-N 0.000 description 4
- 235000006408 oxalic acid Nutrition 0.000 description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 description 4
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 description 4
- 235000019982 sodium hexametaphosphate Nutrition 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000001488 sodium phosphate Substances 0.000 description 3
- 229910000162 sodium phosphate Inorganic materials 0.000 description 3
- 235000011008 sodium phosphates Nutrition 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 3
- 239000003929 acidic solution Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- KYOHRXSGUROPGY-OFNLCGNNSA-N (6r,7r)-7-[[(2z)-2-(2-amino-1,3-thiazol-4-yl)-2-methoxyiminoacetyl]amino]-8-oxo-3-(5,6,7,8-tetrahydroquinolin-1-ium-1-ylmethyl)-5-thia-1-azabicyclo[4.2.0]oct-2-ene-2-carboxylic acid;hydrogen sulfate Chemical compound OS(O)(=O)=O.N([C@@H]1C(N2C(=C(C[N+]=3C=4CCCCC=4C=CC=3)CS[C@@H]21)C([O-])=O)=O)C(=O)\C(=N/OC)C1=CSC(N)=N1 KYOHRXSGUROPGY-OFNLCGNNSA-N 0.000 description 1
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- IBZGBXXTIGCACK-UHFFFAOYSA-N 6,7,9,11-tetrahydroxy-9-(2-hydroxyacetyl)-4-methoxy-8,10-dihydro-7h-tetracene-5,12-dione Chemical compound C1C(O)(C(=O)CO)CC(O)C2=C1C(O)=C1C(=O)C(C=CC=C3OC)=C3C(=O)C1=C2O IBZGBXXTIGCACK-UHFFFAOYSA-N 0.000 description 1
- 239000007977 PBT buffer Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000012438 extruded product Nutrition 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 235000019794 sodium silicate Nutrition 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229960002363 thiamine pyrophosphate Drugs 0.000 description 1
- 235000008170 thiamine pyrophosphate Nutrition 0.000 description 1
- 239000011678 thiamine pyrophosphate Substances 0.000 description 1
- YXVCLPJQTZXJLH-UHFFFAOYSA-N thiamine(1+) diphosphate chloride Chemical compound [Cl-].CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N YXVCLPJQTZXJLH-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/70—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/026—Chemical pre-treatments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
- B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
- B29C66/72321—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/02—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3002—Superstructures characterized by combining metal and plastics, i.e. hybrid parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Definitions
- the present invention relates to a metal-resin composite in which a polymer resin is bonded to a substrate of a metal, particularly a zinc alloy, a magnesium alloy, or a die-casting part thereof, and a method for manufacturing the same.
- the metal-resin composite is used for waterproofing by bonding or coating a polymer resin to a metal, particularly aluminum or an alloy thereof, and is widely used in electronic devices, automobile parts, and the like.
- Metal-resin composites are typically washed, cleaned, and degreased, then etched, and then electrolyzed again to form micropores in aluminum and an oxide film on its surface, and then polymer resins are treated with aluminum through injection, etc. By binding to the aluminum-resin composite is prepared.
- degreasing is performed at a relatively high temperature with a degreasing solution containing sodium carbonate, etc., and etching is performed in an alkaline aqueous solution containing 30-60 wt% of sodium hydroxide, and then phosphoric acid, sulfuric acid, oxalic acid and citric acid are used as electrolytes.
- phosphoric acid, sulfuric acid, oxalic acid and citric acid are used as electrolytes.
- the etching process is performed in two steps in an acidic aqueous solution containing hydrochloric acid and an acidic aqueous solution having an acid concentration of 10-80 wt%, and then electrolytically injected with a diazole-based derivative compound, resulting in a bonding strength of 38 Mpa or higher.
- a method for preparing an aluminum-resin composite is provided.
- Korean Patent No. 2148308 discloses that an aluminum alloy metal material is used as an anode, electrolyzed at a current density of 0.1-2.0A/dm2 in an acidic solution, and then electrolyzed again in an aqueous solution containing a triazine thiol derivative to produce an aluminum-resin composite.
- a manufacturing method is presented.
- zinc or magnesium alloys used for die casting contain up to 15% of metals and impurities other than the main metal. Accordingly, even if the desmut process is performed with an aqueous nitric acid solution after the etching process, the smut is not easily removed from the surface of the metal. Tensile strength (adhesive strength) was not sufficiently secured. In other words, when the conventional technology applied to aluminum was applied to a material for die casting such as zinc or magnesium alloy, the same result was not obtained.
- An object of the present invention is to provide a metal-polymer resin bonded body in which a polymer resin is directly bonded to a base material of a metal, particularly a zinc alloy, a magnesium alloy, or a die-casting part thereof, and in which sufficient tensile strength is secured unlike in the prior art.
- Another object of the present invention is to provide a method for manufacturing such a metal-polymer resin bonded body.
- the present invention which was devised to solve the above technical problems, undergoes both a desmut process and an ultrasonic cleaning process after etching in the existing process that basically undergoes degreasing, etching, and electrolysis processes, and also in the electrolysis process (1 ) It is characterized in that an electrolyte solution containing any one of alkali or alkaline earth metal hydroxide, (2) phosphate or sulfate, and (3) silicate is used. Another feature is the use of an alkaline aqueous solution as a desmut solution in the above process.
- the composite of a zinc alloy, a magnesium alloy, or a die-casting part thereof and a polymer resin manufactured through the above process has high bonding strength and excellent airtightness unlike the prior art.
- FIG. 2 is a schematic diagram of a product and process according to the present invention.
- metal die casting is specially etched, desmuted, washed and electrolytically treated, and then directly injection molded thereto to produce a metal-polymer resin bonded body, thereby solving these problems at once and commercializing it.
- metal-polymer resin bonded body extruded product having a very high bonding strength.
- the degreasing process is usually performed at a temperature of 30-80° C. for 30-300 seconds. If necessary, ultrasonic waves can be applied, and degreasing containing at least one of sodium carbonate, sodium phosphate, sodium silicate, sodium hydrogen carbonate, and sodium hexametaphosphate. carried out with liquid. In particular, it is preferable to contain sodium carbonate and sodium phosphate because the efficiency of degreasing is high.
- the etching process is performed in one step or two steps.
- it is preferable to use an acidic aqueous solution etchant and in the two-step process, the etching process of the acidic aqueous solution is first performed, and then the acidic solution is used again.
- It can be etched with an aqueous solution, but it is more preferable to go through an etching process of an aqueous alkali solution in the second half from the viewpoint of uniformly forming pores having a size of several tens of nm.
- an aqueous solution containing at least one hydrochloric acid, sulfuric acid, nitric acid or hydrogen peroxide is preferable, and per 100 parts by weight of distilled water, 3-15 parts by weight of sulfuric acid, 3-15 parts by weight of hydrochloric acid, 5-10 parts by weight of nitric acid, 1-10 parts by weight of hydrogen peroxide Parts by weight are preferred.
- distilled water 3-15 parts by weight of sulfuric acid, 3-15 parts by weight of hydrochloric acid, 5-10 parts by weight of nitric acid, 1-10 parts by weight of hydrogen peroxide Parts by weight are preferred.
- hydrochloric acid, sulfuric acid and hydrogen peroxide in the above relative ratios have the best etching efficiency.
- the smut formed on the surface is primarily removed with pure water, an aqueous solution containing nitric acid or an aqueous solution containing hydrogen peroxide.
- Smut is formed by various factors, but in the case of die-casting alloys, the impurity content is very high, about 3-5%, and there are many components that do not dissolve in the etching solution. Even after the mut process, smut remains in a certain amount or more. In particular, since the desmut solution containing nitric acid has been used for aluminum alloy, a significant amount of smut remains even after such desmut process in the case of zinc and magnesium alloys or parts for die casting thereof.
- an alkaline aqueous solution containing an alkali metal or alkaline earth metal hydroxide is used as a desmut solution, unlike an aluminum alloy, and ultrasonic cleaning and electrolysis processes under specific conditions to be described later and It was confirmed that this problem was solved by combining.
- sodium hydroxide and potassium hydroxide have the best desmut efficiency.
- the ultrasonic generator can use a plurality of devices at the same time for one washing tank. If the frequency of the ultrasonic wave is too small, it is disadvantageous in that a significant amount of smut is not removed, and if it is too high, it is disadvantageous in that the product is detached from the jig. Therefore, the ultrasonic frequency is combined with other processes within the above range to express the optimal effect. In addition, if an aqueous solution containing 1-10 parts by weight of hydrogen peroxide is used during ultrasonic cleaning, cleaning is performed more smoothly.
- the electrolytic solution used in the electrolytic process is surprisingly high when an aqueous solution containing at least one of (1) alkali metal or alkali earth metal hydroxide, (2) phosphate or sulfate, and (3) silicate is used.
- Tensile strength is achieved. Among these, the case in which all three are included is the most preferable.
- hydroxide of alkali metal or alkaline earth metal sodium hydroxide, potassium hydroxide, magnesium hydroxide or calcium hydroxide can be used, but sodium hydroxide or potassium hydroxide, which are hydroxides of alkali metal, is preferable because of higher electrolysis efficiency.
- lithium hydroxide is excellent, it has a disadvantage of high unit cost.
- the content of the hydroxide of alkali metal or alkaline earth metal is preferably 0.1-20 parts by weight based on 100 parts by weight of distilled water, more preferably 1-15 parts by weight, more preferably 2-10 parts by weight, most preferably 3-7 parts by weight. is part by weight. If the content is less than this, the voltage is increased and power consumption is increased, and it is disadvantageous in that the coating is not uniformly on the metal surface, and if it is more than this, it is disadvantageous in that the coating is irregular.
- Phosphate compounds include sodium pyrophosphate, sodium acid pyrophosphate, calcium pyrophosphate, tin pyrophosphate, copper pyrophosphate, iron pyrophosphate, sodium iron pyrophosphate, potassium pyrophosphate, isopentenyl pyrophosphate, melamine pyrophosphate, thiamine pyrophosphate.
- Phosphoric acid and the like are preferred. Among them, sodium pyrophosphate and potassium pyrophosphate are most preferable from the viewpoint of electrolysis efficiency.
- Sulfate compounds include ammonium sulfate, ammonium persulfate, ammonium hydrogen sulfate, calcium sulfate, potassium persulfate, potassium pyrosulfate, zinc sulfate, sodium thiosulfate, sodium hydrogen sulfate, sodium sulfate, sodium pyrosulfate, kanamicin sulfate, cerium sulfate, cefquinome Sulfate, sodium donenesyl sulfate, magnesium sulfate and the like are preferable. Among them, potassium sulfate and sodium sulfate are most preferable from the viewpoint of electrolysis efficiency.
- the content of the sulfate or phosphate compound is preferably 0.1-25 parts by weight based on 100 parts by weight of distilled water, more preferably 3-17 parts by weight, still more preferably 5-15 parts by weight, and most preferably 7-12 parts by weight. . If the content is less than this, it is disadvantageous in terms of not being evenly coated on the metal surface, and if it is more than this, it is disadvantageous in that the coating becomes irregular.
- silicate compounds include calcium silicate, talc (Magnesium silicate), magnesium silicate, zinc silicate, aluminum silicate, zirconium silicate, sodium orthosilicate, sodium silicate, sodium metasilicate, sodium silicate, lithium metasilicate, Ethyl silicate, potassium silicate, etc. are preferable.
- sodium silicate and sodium metasilicate are the most preferable from a viewpoint of electrolysis efficiency especially.
- the content of the silicate compound is preferably 0.1-30 parts by weight based on 100 parts by weight of distilled water, more preferably 1-25 parts by weight, still more preferably 3-15 parts by weight, and most preferably 4-10 parts by weight. If the content is less than this, it is disadvantageous in that it is not evenly coated on the metal surface, and if it is more than this, it is disadvantageous in that the coating becomes irregular.
- the relative content also has a significant effect on the bonding strength, and their relative content is 40-350 parts by weight of phosphate or sulfate and 30-150 parts by weight of silicate per 100 parts by weight of hydroxide of alkali metal or alkaline earth metal. , the electrolysis efficiency is very good. Most preferably, 150-250 parts by weight of phosphate or sulfate and 70-130 parts by weight of silicate per 100 parts by weight of hydroxide of alkali metal or alkaline earth metal.
- the electrolysis process is preferably performed for 180-2400 seconds at a temperature of 10-70°C with a voltage of 0.1-10V and a current density of 0.1-5A/dm2. More preferably, it is carried out for 600-1800 seconds at 20-40°C at 1-2A/dm2 at a voltage of 1-5V.
- pores with an average size of several tens of nm are evenly distributed and formed on the surface of the metal, but there is little or no smut that blocks these pores or grows in a dendrite shape on the surface to weaken the bonding force when bonding with the resin. is completely removed
- the polymer resin is injection molded into the metal part by an injection molding machine, and the polymer resin is bonded to the metal part.
- polyphenylene sulfide PPA (polyphthalamide), PA (polyamide), PA6 (polyamide 6), PA66 (polyamide 66), PE (polyethylene), PP (polypropylene), TPU (thermoplastic polyurethane)
- PPA polyphthalamide
- PA polyamide
- PA6 polyamide 6
- PA66 polyamide 66
- PE polyethylene
- PP polypropylene
- TPU thermoplastic polyurethane
- the bonding surface tends to break when combined with metal, and in the case of PE or PP, it is relatively soft compared to other polymers such as PPS and is easily deformed by tensile force or stress. It tends to come off relatively easily, so the bonding force is relatively weak. Therefore, in the case of such a polymer resin, even if it is prepared according to the present invention, the bonding strength is only 20 MPa or more.
- Polymer resins having a melting point of less than about 200°C, such as PE and PP, or crystalline polymer resins such as LCP usually behave as above.
- polymers such as PC, PBT, PPS, PPA, PA, PA 6, and PA 66 are relatively hard, so when the polymer resin penetrates into the nanopores through injection molding and hardens, it does not come off easily even if a strong tensile force is applied. . Therefore, in the case of such a polymer resin, when it is prepared according to the present invention, the bonding strength is very high at 30 MPa or more.
- a polymer such as TPU is a very soft material and has a very high elongation, so it is technically difficult to measure the tensile strength (bonding force).
- Twenty specimens were prepared by processing a zinc die-casting metal material with a thickness of 3 mm to a size of 40x12x3mm. In the case of bonding, a hole of 4mm in size is additionally machined in the previously prepared specimen so that it can be mounted on a rack. The specimen is mounted on a rack using the machined hole.
- a rack on which the previously prepared specimen was mounted was placed in a mixture of sodium bicarbonate and sodium hexametaphosphate in distilled water, and ultrasonic degreasing was performed for 60 seconds to remove impurities on the surface, followed by washing again with distilled water.
- the sample washed in the above was put in a distilled water mixture (70° C.) contained in a bubble stirrer of sulfuric acid (13.3 parts by weight), hydrochloric acid (13.3 parts by weight), and hydrogen peroxide (6.7 parts by weight) for 5 minutes to etch, and then washed with distilled water Impurities and smut were removed from the desmut solution (5% sodium hydroxide aqueous solution).
- ultrasonic washing was performed for 120 seconds at 50 kHz in an ultrasonic bath containing distilled water.
- the specimen which has been washed with ultrasonic water, is placed in a distilled water mixture (50°C) of sodium hydroxide (13.3 parts by weight), sodium sulfate (13.3 parts by weight), and zinc silicofluoride (6.7 parts by weight) and electrolyzed at a constant voltage of 5V for 1500 seconds to form a coating layer to form
- the injection machine used a 15-ton injection machine of Daekyung Hydraulics, and injection was performed with a mold temperature of 150°C, a nozzle temperature of 330°C, an injection pressure of 70 bar, and a holding pressure of 5 seconds. Of the total of 20 specimens, 10 were used for the tensile test, and the remaining 10 were used for the leakage test.
- Example 2 It was carried out in the same manner as in Example 1, but an aqueous solution containing 5% by weight of hydrogen peroxide was used instead of distilled water during ultrasonic cleaning.
- Example 2 It was carried out in the same manner as in Example 1, but an aqueous solution containing only 20 parts by weight of sodium hydroxide as an electrolyte was used.
- Example 2 It was carried out in the same manner as in Example 1, except that an aqueous solution containing only sodium sulfate 20 parts by weight was used as the electrolyte.
- Example 2 It was carried out in the same manner as in Example 1, except that an aqueous solution containing only 20 parts by weight of zinc silicate fluoride was used as the electrolyte.
- Example 2 It was carried out in the same manner as in Example 1, except that a mixed solution of sodium hydroxide (6.7 parts by weight) and zinc silicate (6.7 parts by weight) in distilled water was used as an electrolyte.
- Example 2 It was carried out in the same manner as in Example 1, except that a mixed solution of sodium hydroxide (6.7 parts by weight) and sodium sulfate (6.7 parts by weight) in distilled water was used as an electrolyte.
- Example 2 It was carried out in the same manner as in Example 1, except that a mixed solution of sodium sulfate (6.7 parts by weight) and zinc silicate (6.7 parts by weight) in distilled water was used as the electrolyte.
- Example 2 It was carried out in the same manner as in Example 1, except that an aqueous solution containing 10 parts by weight of oxalic acid and 5 parts by weight of citric acid was used as an electrolyte.
- the adhesive strength between the metal alloy and the cured resin was measured using a tensile tester (UTM, Time Group), and the tensile strength at the time when the alloy and the polymer resin were separated when peeled at a rate of 5 mm/min.
- the average value of tensile strength was calculated by repeating the same experiment 10 times.
- the amount of helium leakage at the interface was measured using a helium leakage tester manufactured by Canon ANELVA. If the amount of helium leakage is less than 10 -8 Pa ⁇ m 3 /s as a standard, it is indicated as good, and if it exceeds, it is indicated as defective. In the airtightness test, the same experiment was repeated for 10 samples to confirm the number of defects. If the average value of the helium leakage during 10 measurements is accurately measured, the arithmetic average is obtained.
- the bonding strength and airtightness are very excellent. If it does not contain any alkali metal or alkaline earth metal hydrate, phosphate, sulfate, or silicate, or if any of the desmut process or washing process is omitted, the tensile strength is 25 MPa or less, and the average helium leakage rate exceeds the standard value. In addition, the airtightness was weak, and it was impossible to use it as a waterproofing part. In particular, in spite of applying the same manufacturing process, when an aluminum alloy material is used, the adhesive strength is not sufficiently secured.
- the metal-polymer resin bonded body manufactured by the present invention has a tensile strength of 30 MPa and airtightness is secured, and according to the manufacturing method of the present invention, a separate adhesive tape Without the use of bare bonds, it is possible to manufacture a metal-polymer resin bonded body by insert injection into a zinc alloy, a magnesium alloy, or a die-casting part thereof.
- the metal-polymer resin composite manufactured by direct injection and bonding to zinc alloy, magnesium alloy, or its die-casting parts has excellent adhesion and airtightness as well as various shapes, as well as various shapes, It can be easily combined with injection molding on the inner surface of a three-dimensional shape, and can be used for camera holders, brackets, automobile parts, etc. because of its thin thickness and miniaturization. In particular, it can be very usefully used as a small camera holder used in small electronic devices such as cell phones.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
구분 | 인장강도(MPa) | 헬륨누설량 불량 발생 개수 | 비고 |
실시예 1 | 38.2 | 0 | 기본 실시예 |
실시예 2 | 39.1 | 0 | 초음파 세척액 변경 |
실시예 3 | 32.4 | 1 | 전해액 변경 |
실시예 4 | 31.1 | 2 | 전해액 변경 |
실시예 5 | 34.2 | 1 | 전해액 변경 |
실시예 6 | 33.9 | 1 | 전해액 변경 |
실시예 7 | 34.1 | 1 | 전해액 변경 |
실시예 8 | 33.1 | 1 | 디스머트액 변경 |
실시예 9 | 38.0 | 0 | 금속 재질 변경 |
실시예 10 | 23.7 | 0 | 고분자 수지 변경 |
비교예 1 | 22.1 | 10 | 전해액 변경 |
비교예 2 | 29.8 | 6 | 디스머트 공정 생략 |
비교예 3 | 28.3 | 7 | 초음파 세척 공정 생략 |
비교예 4 | 24.8 | 10 | 금속 재질 변경 |
비교예 5 | 27.7 | 7 | 초음파 주파수 변경 |
비교예 6 | 37.6(시료 2개 탈착으로 측정 불가) | 0(시료 2개 탈착으로 측정 불가) | 초음파 주파수 변경 |
비교예 7 | 22.7 | 8 | 디스머트액 변경 |
비교예 8 | 9.8 | 8 | 디스머트액 변경 |
Claims (15)
- 아연 합금, 마그네슘 합금 또는 이의 다이캐스팅 부품에 고분자 수지를 직접 사출성형하여 사출물이 금속 표면에 직접 결합된 금속-고분자 수지 복합체로서, 고분자 수지의 주성분이 폴리에틸렌(PE), 폴리프로필렌(PP), 액정형 고분자(LCP) 등과 같은 연질형 또는 결정형 고분자 수지인 경우, 금속과 고분자 수지의 인장강도가 20MPa 이상이고, 고분자 수지의 주성분이 PC(폴리카보네이트), PBT(폴리부틸렌테레프탈레이트), PPS(폴리페닐렌설파이드), PPA(폴리프탈아마이드), PA(폴리아마이드), PA6(폴리아마이드 6), PA66(폴리아마이드 66) 등과 같은 경질형 고분자 수지인 경우, 금속과 고분자 수지의 인장강도가 30MPa 이상인 것을 특징으로 하는 금속-고분자 수지 복합체.
- 제 1 항에 있어서, 10회 측정시 평균 헬륨 누설량이 10-8Pa·m3/s 이하인 것을 특징으로 하는 금속-고분자 수지 복합체.
- 제 1 항 및 제 2 항 중 어느 한 항에 있어서, 고분자 수지가 아연 합금, 마그네슘 합금 또는 이의 다이캐스팅 부품의 내면에 사출되어 사출물이 상기 합금 또는 부품의 내면에 삽입되어 있는 것을 특징으로 하는 금속-고분자 수지 복합체.
- 아연 합금, 마그네슘 합금 또는 이의 다이캐스팅 부품 등의 금속부재를 탈지 공정, 에칭 공정, 전해공정, 사출 공정을 거쳐, 고분자 수지와 결합시켜 금속-고분자 수지 복합체를 제조하는 방법에 있어서,상기 금속부재를 에칭후 디스머트(desmut)하고, 초음파 세척하며,상기 전해 공정은 (1) 알카리금속 또는 알카리토금속의 수산화물, (2) 인산염 또는 황산염 화합물 및 (3) 규산염 화합물 중에서 하나 이상을 포함하는 전해액에서 수행되는 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 알카리금속 또는 알카리토금속의 수산화물은 수산화나트륨, 수산화칼륨, 수산화마그네슘 또는 수산화칼슘 중 어느 하나 이상인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 인산염 화합물은 피로인산나트륨, 산성피로인산나트륨, 피로인산칼슘, 피로인산주석, 피로인산구리, 피로인산철, 피로인산철나트륨, 피로인산칼륨, 아이소펜테닐피로인산, 멜라민피로인산, 티아민피로인산 중 어느 하나 이상인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 황산염 화합물은 황산암모늄, 과황산암모늄, 황산수소암모늄, 황산칼슘, 과황산칼륨, 피로황산칼륨, 황산아연, 티오황산나트륨, 황산수소나트륨, 황산나트륨, 피로황산나트륨, 카나미신황산염, 황산세륨, 세프퀴놈황산염, 도네실황산나트륨, 황산마그네슘 중 어느 하나 이상인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 규산염 화합물로는 규산 칼슘(calcium silicate), 탈크(Magnesium silicate), 규불화마그네슘, 규불화아연, 규산알루미늄, 규산지르코늄, 올소규산나트륨, 규산나트륨, 메타규산나트륨, 규불화나트륨, 리튬메타실리케이트, 에틸실리케이트, 규산칼륨 중 어느 하나 이상인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 알카리금속 또는 알카리토금속의 수산화물의 함량은 증류수 100 중량부 대비 0.1-20 중량부인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 황산염 화합물의 함량은 증류수 100 중량부 대비 0.1-20 중량부인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 규산염 화합물의 함량은 증류수 100 중량부 대비 0.1-30 중량부인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 전해 공정에서 2가지 이상의 물질이 함께 사용될 경우, 이들의 상대적인 함량은 알카리금속 또는 알카리토금속의 수산화물 100 중량부당 인산염 40-350 중량부, 규산염 30-150 중량부인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 초음파 세척은 과산화수소가 포함된 수용액에서 수행되는 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 초음파 세척에서 사용되는 초음파는 15-70kHz인 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
- 제 4 항에 있어서, 상기 디스머트는 알카리성 수용액에서 수행하는 것을 특징으로 하는 금속-고분자 수지 복합체를 제조하는 방법.
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