WO2022158076A1 - Dispositif de montage de composant et procédé de montage de composant - Google Patents

Dispositif de montage de composant et procédé de montage de composant Download PDF

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Publication number
WO2022158076A1
WO2022158076A1 PCT/JP2021/039694 JP2021039694W WO2022158076A1 WO 2022158076 A1 WO2022158076 A1 WO 2022158076A1 JP 2021039694 W JP2021039694 W JP 2021039694W WO 2022158076 A1 WO2022158076 A1 WO 2022158076A1
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WIPO (PCT)
Prior art keywords
mounting
component
nozzles
nozzle
height
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PCT/JP2021/039694
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English (en)
Japanese (ja)
Inventor
昭博 秋山
忠士 遠藤
憲一郎 石本
Original Assignee
パナソニックＩｐマネジメント株式会社
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Priority to JP2022576985A priority Critical patent/JPWO2022158076A1/ja
Publication of WO2022158076A1 publication Critical patent/WO2022158076A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a component mounting device and a component mounting method.
  • a component mounting device that mounts components such as electronic components on a board (for example, Patent Document 1).
  • an object of the present invention is to solve the above-mentioned problems and to provide a component mounting apparatus and a component mounting method capable of realizing component mounting with higher quality.
  • a component mounting apparatus of the present invention is a component mounting apparatus for picking up components from a component supply unit and mounting them on a board, comprising: a relay stage on which a plurality of components can be placed; A first component transfer unit that picks up a component from a unit and transfers it to the relay stage, a relay stage camera that captures a plurality of components on the relay stage to obtain a first image, and a mounting nozzle that holds the component.
  • a pickup operation for picking up a component in alignment with an upper component is sequentially performed for each of the mounting nozzles, a carrying operation is performed for moving the mounting nozzle that has picked up the component above the substrate, and the mounting nozzle holds the component.
  • a mounting operation for mounting the component on the mounting point of the substrate is sequentially performed for each of the mounting nozzles.
  • a component mounting method of the present invention is a component mounting method for picking up a component from a component supply unit and mounting it on a substrate, wherein the control unit controls the first component transfer unit to remove the component from the component supply unit. is taken out and transferred to the relay stage, the control unit controls the relay stage camera to image a plurality of components on the relay stage to acquire a first image, and the control unit controls the first a first component recognition for recognizing a plurality of components on the intermediate stage using the image of the intermediate stage, and the control unit controls a second component transfer unit having a plurality of mounting nozzles to perform the first component recognition.
  • a pickup operation for aligning the mounting nozzles with the components on the relay stage and picking up the components using the result of component recognition is sequentially performed for each mounting nozzle, and the mounting nozzles that have picked up the components are moved above the board. , and a mounting operation for mounting the components held by the mounting nozzles on the mounting points of the board is sequentially executed for each of the mounting nozzles.
  • FIG. 2 Schematic plan view of the component mounting apparatus of Embodiment 1
  • FIG. 2 is a bottom perspective view of the take-out head of Embodiment 1
  • 2 is a bottom perspective view of the mounting head of Embodiment 1.
  • Schematic cross-sectional view showing the tip of the extraction nozzle of Embodiment 1 4 is a schematic perspective view showing the tip of the mounting nozzle of Embodiment 1.
  • FIG. 4 is a schematic perspective view showing the tip of the mounting nozzle of Embodiment 1.
  • FIG. 4 is a vertical cross-sectional view showing the internal structure of the main body of the mounting head of the first embodiment;
  • FIG. 4 is a cross-sectional view showing the internal structure of the main body of the mounting head of the first embodiment;
  • FIG. 4 is a vertical cross-sectional view showing the internal structure of the main body of the take-out head of the first embodiment;
  • Schematic perspective view of relay stage of embodiment 1 Schematic vertical cross-sectional view of a relay stage of Embodiment 1
  • Schematic plan view of relay stage of embodiment 1 Schematic diagram showing the peripheral configuration of the brush drive mechanism of the first embodiment
  • FIG. 4 is a schematic vertical cross-sectional view of the substrate transfer unit before the substrate is lifted according to the first embodiment;
  • FIG. 4 is a schematic vertical cross-sectional view of the substrate transfer unit after the substrate is lifted according to the first embodiment;
  • FIG. 2 is a block diagram of a control system of the component mounting apparatus of Embodiment 1;
  • 3 is a block diagram showing the internal configuration of the head unit control section of the first embodiment;
  • 4 is a flowchart showing first reference height setting processing according to the first embodiment; The figure which shows the state where the lower end surface of the mounting nozzle touched the mounting surface. The figure which shows the state where the mounting nozzle rises from the mounting surface.
  • 10 is a flowchart showing second reference height setting processing according to the first embodiment; Schematic diagram for explaining the flow of processing according to the flowchart of FIG.
  • FIG. 4 Schematic diagram for explaining the flow of processing according to the flowchart of FIG.
  • FIG. 4 is a diagram for explaining a method of calculating a target position by a target position calculation unit according to the first embodiment
  • 4 is a diagram showing the flow of a series of component mounting operations by the component mounting apparatus of Embodiment 1
  • FIG. Flowchart relating to component pick-up processing of the first embodiment Schematic diagram for explaining the flow of processing according to the flowchart of FIG. Schematic diagram for explaining the flow of processing according to the flowchart of FIG.
  • Schematic diagram for explaining the flow of processing according to the flowchart of FIG. Graph showing how the output value of the height detection unit changes when the mounted nozzle is lowered according to the command from the operation command unit.
  • FIG. 4 is a schematic plan view showing a state in which nine designated mounting points are designated from among a plurality of mounting points on the board of the first embodiment; 4 is a schematic plan view showing an example in which the substrate of Embodiment 1 has a plurality of divided substrates; FIG. FIG. 3 is a cross-sectional view showing a state in which the component mounting apparatus of the first embodiment performs narrow adjacent mounting; FIG.
  • FIG. 3 is a cross-sectional view showing a state in which the component mounting apparatus of the first embodiment performs narrow adjacent mounting;
  • Flowchart relating to component mounting processing of the second embodiment Flowchart relating to mounting point height estimation processing of the second embodiment
  • Schematic plan view of a component mounting device according to a modified example Schematic plan view of a component mounting apparatus according to another modified example
  • Schematic plan view of a component mounting apparatus according to still another modification A lower perspective view showing a mounting head according to yet another modified example.
  • a component mounting apparatus that picks up components from a component supply unit and mounts them on a board, comprising: a relay stage on which a plurality of components can be placed; a first component transfer unit for transferring to the relay stage; a relay stage camera for capturing a first image by imaging a plurality of components on the relay stage; and a plurality of mounting nozzles for holding the components, a second component transfer unit that picks up a component on the relay stage with the mounting nozzle and mounts it on the substrate; executing first component recognition for recognizing a plurality of components, controlling the second component transfer unit, and using the result of the first component recognition to align the mounting nozzle with the components on the relay stage; a pick-up operation for picking up the components by the mounting nozzles, a carrying operation for moving the mounting nozzles that have picked up the components above the board, and moving the components held by the mounting nozzles to mounting points on the board
  • a component mounting apparatus for sequentially executing
  • the relay stage has a temporary placement section on which a component is placed, the temporary placement section allows the component to be seen through from below, and the relay stage camera is the temporary placement section.
  • the component mounting apparatus according to the first aspect is provided below the part.
  • the component mounting apparatus according to the first aspect or the second aspect, wherein a plurality of relay stage cameras are provided, and the first image is acquired by the plurality of relay stage cameras. do.
  • control unit further controls the relay stage camera to image the component held by the mounting nozzle to obtain a second image.
  • a component mounting apparatus according to any one of the third aspects is provided.
  • control unit further uses the second image to perform second component recognition for recognizing the component held by the mounting nozzle, and performs the second component recognition.
  • a component mounting apparatus according to a fourth aspect, wherein the result of (1) is used to calculate a target position for mounting a component on the mounting point in the mounting operation.
  • the controller moves the plurality of mounting nozzles holding the respective components above the substrate to collectively convey the plurality of components from the first aspect.
  • a component mounting apparatus according to any one of the fifth aspects is provided.
  • the first component transfer section includes a plurality of take-out nozzles, and the control section controls the first component transfer section to supply the components with the take-out nozzles.
  • a retrieving operation for retrieving a component from a unit is sequentially performed for each of the retrieving nozzles, and a carrying operation is performed for transporting a plurality of the retrieving nozzles upward to the intermediate stage while a plurality of the components are held by the plurality of the retrieving nozzles. and sequentially executing the placement operation of placing the component held by the take-out nozzle on the relay stage for each of the take-out nozzles. do.
  • the component mounting apparatus according to the seventh aspect, wherein the number of the take-out nozzles in the first component transfer section is greater than the number of the mounting nozzles in the second component transfer section. offer.
  • the arrangement pitch of the take-out nozzles in the first component transfer section is the same as or 1/n (n is 1 or more) than the arrangement pitch of the mounting nozzles in the second component transfer section. (integer).
  • the eighth aspect or the ninth aspect wherein the number of the take-out nozzles in the first component transfer section is at least twice the number of the mounting nozzles in the second component transfer section.
  • a component mounting method for picking up a component from a component supply unit and mounting it on a substrate, wherein a control unit controls a first component transfer unit to remove the component from the component supply unit. is taken out and transferred to the relay stage, the control unit controls the relay stage camera to image a plurality of components on the relay stage to acquire a first image, and the control unit controls the first a first component recognition for recognizing a plurality of components on the intermediate stage using the image of the intermediate stage, and the control unit controls a second component transfer unit having a plurality of mounting nozzles to perform the first component recognition.
  • a pickup operation for aligning the mounting nozzles with the components on the relay stage and picking up the components using the result of component recognition is sequentially performed for each mounting nozzle, and the mounting nozzles that have picked up the components are moved above the board.
  • the relay stage is provided with a temporary placement section on which the component is placed, the temporary placement section allows the component to be seen through from below, and the relay stage camera There is provided the component mounting method according to the eleventh mode, wherein the component is imaged from below the temporary placement section.
  • the component mounting method according to the eleventh aspect or the twelfth aspect wherein a plurality of the relay stage cameras are provided and the first image is acquired by the plurality of the relay stage cameras. do.
  • the eleventh aspect is further characterized in that the control unit controls the relay stage camera to capture an image of the component held by the mounting nozzle to obtain a second image.
  • a component mounting method according to any one of the thirteenth aspects from the above is provided.
  • control unit further executes second component recognition using the second image to recognize a component held by the mounting nozzle, and the control unit and calculating a target position for mounting the component on the mounting point in the mounting operation by using the result of the second component recognition.
  • the plurality of mounting nozzles each holding the component is moved above the substrate to collectively carry the plurality of components. or provides the component mounting method according to one of the above.
  • the first component transfer section is provided with a plurality of take-out nozzles, and the control section controls the first component transfer section to A retrieving operation of retrieving components from the component supply unit by the retrieving nozzles is sequentially performed for each of the retrieving nozzles, and the plurality of retrieving nozzles are moved upwardly of the intermediate stage while a plurality of components are held by the plurality of retrieving nozzles.
  • a carrying operation of carrying is executed, and a placing operation of placing the component held by the extraction nozzle on the intermediate stage is sequentially carried out for each of the extraction nozzles.
  • the component mounting method according to the seventeenth aspect wherein the number of the take-out nozzles in the first component transfer section is greater than the number of the mounting nozzles in the second component transfer section. offer.
  • the arrangement pitch of the take-out nozzles in the first component transfer section is the same as or 1/n (n is 1 or greater) than the arrangement pitch of the mounting nozzles in the second component transfer section. integer).
  • the eighteenth aspect or the nineteenth aspect wherein the number of the take-out nozzles in the first component transfer section is at least twice the number of the mounting nozzles in the second component transfer section. to provide a component mounting method according to .
  • FIG. 1 is a schematic plan view of a component mounting apparatus 1 of Embodiment 1.
  • FIG. 1 is a schematic plan view of a component mounting apparatus 1 of Embodiment 1.
  • the component mounting device 1 of Embodiment 1 is a device for mounting/mounting components such as electronic components on the substrate 2 positioned in the work area A.
  • the component mounting apparatus 1 shown in FIG. 1 includes a board transfer unit 4, a first component supply unit 6, a second component supply unit 8, a third component supply unit 10, a pick-up head 12, a mounting head 14, Head camera 16, XY table 17 (X-axis beams 18, 20 and Y-axis tables 22, 24), relay stage 26, relay stage camera 28, first parts disposal box 30, parts camera 32, A two-component disposal box 34 and a control unit 35 are provided.
  • the substrate transport unit 4 is a unit for holding and transporting the substrate 2 and positioning it in the work area A.
  • the substrate transport unit 4 has a transport conveyor 5 that transports the substrate 2 in the X direction, and FIG. 1 mainly shows the transport conveyor 5 .
  • the work area A is an area for performing the component mounting work on the board 2 and is set on the transport conveyor 5 .
  • the component supply units 6, 8, and 10 are units for supplying components such as electronic components.
  • the component supply units 6, 8, and 10 of Embodiment 1 are each composed of a tape feeder, and have a function of conveying a carrier tape containing components to a predetermined component pick-up position.
  • the first component supply unit 6 is arranged on one side (FRONT) of the work area A, and the second component supply unit 8 and the third component supply unit 10 are arranged on the other side (REAR). are placed in
  • the component supply units 6, 8, and 10 of Embodiment 1 supply components of different sizes. Specifically, the first component supply unit 6 supplies minute components, the second component supply unit 8 supplies small components, and the third component supply unit 10 supplies medium-sized components.
  • the size of a minute part is, for example, 0.4 mm ⁇ 0.2 mm or less in horizontal and vertical dimensions in plan view, and the size of a small part is, for example, 0.6 mm ⁇ 0.3 mm to 1.0 mm ⁇ 0.5 mm.
  • a medium-sized part is, for example, a part whose length and width dimensions are 1.6 mm ⁇ 0.8 mm or more and which is accommodated in a carrier tape with a width of 8 mm to 32 mm and supplied from a tape feeder.
  • the take-out head 12 is a component transfer section (first component transfer section) for picking up micro-components supplied by the first component supply unit 6 and transferring them to the relay stage 26 .
  • the take-out head 12 is provided corresponding to the first component supply unit 6 and not corresponding to the second component supply unit 8 and the third component supply unit 10 . That is, the take-out head 12 is controlled so as not to take out the components supplied by the second component supply unit 8 and the third component supply unit 10 .
  • the mounting head 14 is a component transfer section (second component transfer section) for picking up a component and transferring/mounting it onto the substrate 2 .
  • the mounting head 14 is provided corresponding to each of the component supply units 6, 8, and 10, and has a function of picking up a minute component placed on the relay stage 26 and mounting it on the board 2, and a component supply unit. It also has a function of directly picking up small-sized or medium-sized parts from 8 and 10 and mounting them on the board 2 .
  • the head camera 16 is a camera provided on the mounting head 14 .
  • the head camera 16 is attached to the mounting head 14 with its imaging direction directed downward, and moves together with the movement of the mounting head 14 .
  • the head camera 16 is controlled so as to capture an image of the board 2 placed in the work area A and the like.
  • the XY table 17 is a member that supports each of the pick-up head 12 and the mounting head 14 so as to be movable in the XY directions.
  • the XY table 17 comprises a first X-axis beam 18, a second X-axis beam 20, and Y-axis beams 22,24.
  • the first X-axis beam 18 is provided between the Y-axis beams 22 and 24, extending along the X direction, and supports the take-out head 12 so as to be movable in the X direction.
  • the second X-axis beam 20 is provided between the Y-axis beams 22 and 24 to extend along the X direction and supports the mounting head 14 so as to be movable in the X direction.
  • Y-axis beams 22 and 24 respectively support first X-axis beam 18 and second X-axis beam 20 for movement in the Y direction.
  • the relay stage 26 is a stage for temporarily placing minute components supplied from the first component supply unit 6 .
  • a relay stage camera 28 is provided on the relay stage 26 .
  • the relay stage camera 28 is a camera for capturing images of minute parts placed on the relay stage 26 . Based on the image captured by the relay stage camera 28, the position and orientation of the minute component can be recognized, and the nozzle and the component can be aligned when the mounting head 14 picks up the component. By aligning the parts, even if the parts are minute parts, they can be picked up and held with high accuracy, and the mounting accuracy on the substrate 2 is improved. Furthermore, it is also suitable for "narrow adjacent mounting" in which components are mounted on the substrate 2 at narrow intervals (see FIGS. 34A and 34B).
  • the first parts disposal box 30 is a box for parts disposal provided adjacent to the relay stage 26 . A part of the minute components placed on the relay stage 26 is selectively discarded in the first component discard box 30 .
  • the parts camera 32 is a camera for imaging the parts held by the mounting head 14 .
  • the component camera 32 is fixed with its imaging direction directed upward.
  • the second parts disposal box 34 is a box for parts disposal similar to the first parts disposal box 30 . Some of the small-sized components or medium-sized components held by the mounting head 14 are selectively discarded in the second component discard box 34 .
  • FIG. 2 is a bottom perspective view of pick head 12 and FIG. 3 is a bottom perspective view of load head 14.
  • FIG. 2 is a bottom perspective view of pick head 12 and FIG. 3 is a bottom perspective view of load head 14.
  • the extraction head 12 includes a plurality of extraction nozzles 36 and a body portion 38. As shown in FIG. 2, the extraction head 12 includes a plurality of extraction nozzles 36 and a body portion 38. As shown in FIG. 2, the extraction head 12 includes a plurality of extraction nozzles 36 and a body portion 38. As shown in FIG.
  • the take-out nozzle 36 is a holding nozzle for transferring the minute parts mentioned above.
  • the extraction nozzles 36 are regularly spaced in the X and Y directions.
  • the pitch of the extraction nozzles 36 is set at equal intervals, with a pitch X1 in the X direction and a pitch Y1 in the Y direction.
  • a total of 16 extraction nozzles 36 are provided, four in the X direction and four in the Y direction.
  • the body part 38 is a member that supports the plurality of extraction nozzles 36 .
  • the body portion 38 supports the plurality of extraction nozzles 36 and internally includes a drive mechanism for driving the plurality of extraction nozzles 36 .
  • the drive mechanism performs lifting operation of the extraction nozzle 36 and suction operation of the component by the extraction nozzle 36 . Details will be described later.
  • the mounting head 14 includes a head camera 16, a plurality of mounting nozzles 40, a plurality of shafts 42, and a body portion 44.
  • the mounting nozzle 40 is a holding nozzle for transferring the above-mentioned minute parts, small parts or medium-sized parts.
  • the mounted nozzles 40 are regularly spaced in the X and Y directions.
  • the pitch of the mounted nozzles 40 is set at equal intervals with a pitch X2 in the X direction and a pitch Y2 in the Y direction.
  • a total of eight mounting nozzles 40 are provided, four in the X direction and two in the Y direction. That is, the number of extraction nozzles 36 is doubled with respect to the number of mounting nozzles 40 .
  • the pitch X1 of the extraction nozzles 36 in the X direction and the pitch X2 of the mounting nozzles 40 in the X direction are set to be the same, and the pitch Y1 of the extraction nozzles 36 in the Y direction is the same as the pitch in the Y direction of the mounting nozzles 40. It is set to 1/2 of Y2.
  • the relationship between the pitches Y1 and Y2 in the Y direction is not limited to being set to 1/2, but may be set to 1/n (n is an integer equal to or greater than 1).
  • the shaft 42 is a member for attaching the mounting nozzle 40 in a replaceable manner.
  • One mounting nozzle 40 is attached to one shaft 42 as shown in FIG.
  • the body part 44 is a member that supports the head camera 16 and the plurality of shafts 42 .
  • a driving mechanism for driving the plurality of shafts 42 is provided inside the body portion 44 .
  • the drive mechanism performs an integral lifting operation of the shaft 42 and the mounting nozzle 40 attached to the shaft 42 and an operation of picking up a component by the mounting nozzle 40 . Details will be described later.
  • FIG. 4 and 5 are schematic diagrams showing the tip of the extraction nozzle 36.
  • FIG. 4 and 5 are schematic diagrams showing the tip of the extraction nozzle 36.
  • FIG. 4 shows an enlarged cross-sectional view of the tip of the extraction nozzle 36, and (b) shows a bottom view of the tip of the extraction nozzle 36. As shown in FIG.
  • a porous member 46 having air permeability is arranged at the tip of the ejection nozzle 36 .
  • the porous member 46 is fitted into a recess provided at the tip of the take-out nozzle 36 and arranged to face the suction hole 48 inside.
  • the suction hole 48 is connected to a suction source (not shown) to generate negative pressure for sucking the component.
  • the porous member 46 attracts components to its bottom surface 46A by the negative pressure generated by the suction holes 48 .
  • a bottom surface 46 ⁇ /b>A of the porous member 46 corresponds to the lower end surface of the ejection nozzle 36 .
  • the material of the porous member 46 may be any material as long as it transmits the negative pressure generated by the suction holes 48 to the bottom surface 46A.
  • FIG. 5 shows the state immediately before picking up the component P by the take-out nozzle 36, and (b) shows the state immediately after picking up the component P.
  • the pocket 52 of the carrier tape 50 of the first component supply unit 6 contains a component P as a minute component.
  • the tip of the take-out nozzle 36 is brought close to the part P to suck the part P.
  • the part P is taken out from the pocket 52 of the carrier tape 50 by raising the take-out nozzle 36 as shown in FIG. 5(b).
  • FIG. 6 and 7 are bottom perspective views showing the tip of the mounting nozzle 40.
  • FIG. 6 and 7 are bottom perspective views showing the tip of the mounting nozzle 40.
  • the mounting nozzle 40 has a suction hole 54 formed in its lower end surface.
  • the suction hole 54 is connected to a suction source (not shown) to generate a negative pressure for sucking the component P.
  • the shape of the suction hole 54 is not limited to the shape shown in FIG. 6, and may be any shape.
  • the lower end surface of the mounting nozzle 40 is brought close to the component P (micro component, small component, or medium-sized component) to pick up the component P.
  • the component P micro component, small component, or medium-sized component
  • FIG. 8A, 8B, and 9 the drive mechanism of the mounting nozzle 40 and the extraction nozzle 36 will be described using FIGS. 8A, 8B, and 9.
  • 8A and 8B are a vertical cross-sectional view and a cross-sectional view showing the internal structure of the body portion 44 of the mounting head 14, respectively.
  • the drive mechanism for the mounting nozzle 40 includes a plurality of servomotors 56, a plurality of pulleys 57, a toothed belt 58, a .theta.-axis motor 59, and a pulley 60.
  • the servomotor 56 is a motor that vertically moves the shaft 42 and the mounting nozzle 40 in the Z direction.
  • One servomotor 56 is provided for the combination of the shaft 42 and the mounted nozzle 40, and a total of eight servomotors 56 are provided in the example shown in FIGS. 8A and 8B.
  • Each servo motor 56 has a linear motor 61 and an encoder 62 .
  • the linear motor 61 is a motor unit that raises and lowers the shaft 42 inserted in the vertical direction.
  • the encoder 62 is a member that outputs encoder pulses (position signals) indicating the moving distance and direction of the shaft 42 as the shaft 42 moves.
  • the encoder pulse output by the encoder 62 is used as height information of the mounted nozzle 40 .
  • the pulley 57 is a pulley arranged to surround the shaft 42 .
  • the pulley 57 and the shaft 42 are connected so that the vertical movement of the shaft 42 is not transmitted to the pulley 57 while meshing so that the rotational force in the rotation direction R ⁇ b>1 is transmitted.
  • a total of eight pulleys 57 are provided like the servo motors 56 , and all of the plurality of pulleys 57 are meshed with the toothed belt 58 .
  • the toothed belt 58 is a belt for synchronously rotating a plurality of pulleys 57 .
  • the toothed belt 58 is connected to the ⁇ -axis motor 59 via pulleys 60 .
  • the ⁇ -axis motor 59 is a motor for rotating the toothed belt 58 .
  • the ⁇ -axis motor 59 has an output shaft 59A, and the output shaft 59A is engaged with the pulley 60. As shown in FIG. The rotational force of the ⁇ -axis motor 59 is transmitted to the pulley 60 and the toothed belt 58 via the output shaft 59A.
  • the plurality of mounting nozzles 40 can be integrally rotated in the rotation direction R1 by being driven by the ⁇ -axis motor 59, and can be mounted by being driven by the respective servo motors 56.
  • the nozzles 40 can be individually driven up and down in the vertical direction D1.
  • FIG. 9 is a plan view showing the internal structure of the body portion 38 of the take-out head 12. As shown in FIG.
  • the drive mechanism for the extraction nozzle 36 includes a plurality of servomotors 63, a plurality of pulleys 64, a toothed belt 65, a .theta.-axis motor 66 having an output shaft 66A, and a pulley 67.
  • Each servo motor 63 has a linear motor 68 and an encoder 69 .
  • the functions and connection relationships of these configurations are the same as the driving mechanism of the mounted nozzle 40 described with reference to FIGS. 8A and 8B, so description thereof will be omitted.
  • the extraction nozzles 36 can be driven up and down individually in the vertical direction D2.
  • FIG. 10 the configuration of the relay stage 26 will be explained using FIGS. 10 to 16.
  • FIG. 10 the configuration of the relay stage 26 will be explained using FIGS. 10 to 16.
  • FIG. 10 is a schematic perspective view of the relay stage 26
  • FIG. 11 is a schematic longitudinal sectional view of the relay stage 26
  • FIG. 12 is a schematic plan view of the relay stage 26.
  • the relay stage 26 includes a relay stage camera 28, a first component disposal box 30, a temporary placement section 70, a housing 74, a component removing brush 76, and a brush driving mechanism 78. and
  • the temporary placement section 70 is a member for temporarily placing a component P as a minute component.
  • the upper surface of the temporary placement portion 70 is a placement surface 71 for placing the component P thereon.
  • the placement surface 71 has a size that allows a plurality of components P to be placed thereon. It has an area in which the part P can be arranged. 10 and 11 illustrate a state in which a total of 16 parts P are placed on the placement surface 71.
  • the height position of the mounting surface 71 is set at a reference height (first reference height H1) with respect to the relay stage 26.
  • the temporary placement portion 70 is used as a reference member (first reference member) for setting the first reference height H1.
  • the temporary placement portion 70 of Embodiment 1 is composed of a transparent plate-like member.
  • the temporary placement section 70 can be seen through in the thickness direction by the relay stage camera 28 provided below the temporary placement section 70 .
  • the relay stage camera 28 images a plurality of parts P placed on the temporary placement section 70 .
  • the relay stage camera 28 is arranged in a space surrounded by a housing 74 below the temporary placement section 70 with its imaging direction facing upward. In Embodiment 1, two relay stage cameras 28 are provided.
  • the relay stage camera 28 has a predetermined imaging range B.
  • the imaging range B is set to a range in which a plurality of (16 in total) components P placed on the placement surface 71 can be imaged.
  • the housing 74 is a housing portion of the relay stage 26 and supports members such as the temporary placement section 70 and the relay stage camera 28 .
  • a plurality of lights 80 and a plurality of diffusion plates 82 are provided inside the housing 74 .
  • the lighting 80 is a member that irradiates light toward the imaging range B of the relay stage camera 28
  • the diffusion plate 82 is a member that diffuses the light irradiated by the lighting 80 .
  • the component removing brush 76 is a brush for removing the component P remaining on the mounting surface 71 . As shown in FIG. 10 and the like, the component removing brush 76 is composed of a large number of brushes protruding downward. The component removing brush 76 is configured to be linearly movable in the X direction, and pushes out the component P left behind on the placement surface 71 toward the first component removing box 30 to discard the component P. The parts P discarded in the first part removal box 30 become discarded parts Pz (FIGS. 11 and 12).
  • the brush driving mechanism 78 is a mechanism for driving the component removing brush 76.
  • the brush driving mechanism 78 includes a motor 84 and a belt cover 86. As shown in FIG.
  • FIGS. 13 and 14 are schematic cross-sectional views showing the peripheral configuration of the brush driving mechanism 78.
  • FIG. 13 and 14 are schematic cross-sectional views showing the peripheral configuration of the brush driving mechanism 78.
  • the brush driving mechanism 78 includes a belt 88, a connecting portion 90, a slider 92, and a guide 94 in addition to the motor 84 and the belt cover 86.
  • the motor 84 rotates the belt 88 .
  • Motor 84 and belt 88 are housed inside belt cover 86 .
  • a connecting portion 90 is attached to the belt 88 , and the belt 88 is connected to the slider 92 by the connecting portion 90 .
  • the slider 92 is a member that linearly moves in the X direction along the guide 94, and is integrally attached with the component removing brush 76 described above.
  • the guide 94 is mounted horizontally on the side surface of the housing 74 and extends along the X direction.
  • the motor 84 is driven to rotate the belt 88 to move the component removal brush 76 in the X direction, thereby removing the component P placed on the placement surface 71 from the first component. It can be pushed out to the disposal box 30 and removed from the temporary placement section 70 .
  • FIG. 15 is a schematic longitudinal sectional view of the substrate transport unit 4 before the substrate 2 is lifted
  • FIG. 16 is a schematic longitudinal sectional view of the substrate transport unit 4 after the substrate 2 is lifted. .
  • the substrate transport unit 4 includes a pair of transport conveyors 5 and backup pins 98. Further, each transport conveyor 5 has a board pressing member 95 , a board guide 96 and a transport belt 97 .
  • the substrate pressing members 95 are plate-shaped members for pressing the substrate 2 from above, and are provided as a pair above the transport belt 97 .
  • the substrate guide 96 is a member that supports the conveying belt 97, the substrate pressing member 95, and the like.
  • the backup pin 98 is a rod-shaped member that can move up and down below the work area A, and a plurality of backup pins 98 are provided so as to be able to contact the lower surface of the substrate 2 .
  • the substrate 2 supported by the conveyor belt 97 is lifted by the backup pins 98 as shown in FIG.
  • the lifted substrate 2 contacts the lower surface 95B of the substrate holding member 95 and is held down by the substrate holding member 95 from above. Thereby, the substrate 2 is positioned in the work area A.
  • the backup pins 98 and the transport conveyor 5 constitute a substrate holding portion 99 that holds the substrate 2 .
  • At least one first measurement point 95M (see FIG. 1) for setting a reference height (second reference height H2) for the work area A is set on the upper surface 95A of each substrate holding member 95.
  • first measurement points 95M are provided on one substrate pressing member 95, for a total of four points.
  • the substrate pressing member 95 is used as a reference member (second reference member) for setting the second reference height H2.
  • the reference height (second reference height H2) for the work area A is set to match the height position of the lower surface 95B (FIG. 15) of the substrate holding member 95.
  • the reference height (second reference height H2) can be set from the height position of the first measurement point 95M and the known dimension (thickness) of the substrate holding member 95.
  • control unit 35 is a member that controls the component mounting apparatus 1 as a whole.
  • the control unit 35 includes, for example, a microcomputer. A detailed configuration of the control unit 35 will be described with reference to FIG. 17 .
  • FIG. 17 is a block diagram of the control system of the component mounting apparatus 1.
  • the controller 35 has a head unit controller 100 and a main body controller 102 .
  • the head unit control section 100 has a function of controlling the up-and-down operation and suction operation of the extraction nozzle 36 of the extraction head 12 and the up-and-down operation and suction operation of the mounting nozzle 40 of the mounting head 14 .
  • the body control section 102 has a function of controlling the transportation of the board 2 in the component mounting apparatus 1 and the imaging operation of the camera, and transmitting a control command to the head unit control section 100 .
  • the head unit control section 100 and the main body control section 102 are electrically connected via a wiring connector (not shown) or the like.
  • the head unit control section 100 has an extraction head control section 104 for controlling the extraction head 12 and a mounting head control section 106 for controlling the mounting head 14 .
  • the internal configuration of the head unit control section 100 including the picking head control section 104 and the mounting head control section 106 is shown in FIG.
  • the mounting head control unit 106 has the servo motors 56 (#1 to #1) of the mounting nozzles 40 for each of the plurality of mounting nozzles 40 (here, eight nozzles) arranged on the mounting head 14 . 8) is provided with a motor control unit 112 (#1 to #8).
  • the mounting head control unit 106 is further provided with a ⁇ -axis motor control unit 114 that controls the ⁇ -axis motor 59 arranged on the mounting head 14 .
  • Each of the motor control units 112 includes a motor driver 116, a contact detection unit 118, a height detection unit 120 (installed nozzle height detection unit), a lowest point storage unit 122, and an operation command unit 124.
  • the motor driver 116 supplies power to the servomotor 56 to drive it according to the motion command from the motion command unit 124 . Specifically, the motor driver 116 detects the deviation between the target values such as position and speed based on the position command and speed command from the motion command unit 124 and the current values such as position and speed detected by the pulse signal sent from the encoder 62. The servo motor 56 is driven by servo control that feeds back the .
  • the contact detection unit 118 detects that the mounting nozzle 40 has come into contact with an object such as the relay stage 26 or a component, or that the component P held by the mounting nozzle 40 has landed (contacted) a mounting point on the board 26 .
  • the detection is performed based on the torque (current) output by the motor driver 116 or encoder pulses from the encoder 62 .
  • the torque (current) supplied from the motor driver 116 to the servomotor 56 increases when the mounted nozzle 40 comes into contact with an object and cannot move down and the deviation from the target value increases.
  • contact is detected by detecting an increase in this torque (current).
  • the contact is detected based on the encoder pulse, the contact is detected when the period of the encoder pulse becomes longer, when the encoder pulse is not detected, or when the encoder pulse indicating the change from descent to rise is received.
  • the height detection unit 120 counts encoder pulses from the encoder 62 of the servomotor 56 . This count value serves as height information indicating the position of the mounting nozzle 40 in the height direction. That is, the height detection section 120 has a height detection function of detecting the height of the mounted nozzle 40 based on the position signal from the servomotor 56 (extraction nozzle height detection section). Mounting point height measurement, which will be described later, is performed using the height detection function of the height detection unit 120 .
  • the lowest point storage unit 122 stores the minimum value of the values output by the height detection unit 120 during a predetermined period when the contact detection unit 118 detects the contact of the mounting nozzle 40, that is, the lowest point of the mounting nozzle 40 during the predetermined period. Temporarily stores the value indicating the height (lowest point). In this embodiment, as the position of the mounting nozzle 40 becomes lower, the value output by the height detection unit 120 also becomes smaller. However, if the value output by the height detection unit 120 increases as the position of the mounted nozzle 40 becomes lower, the “maximum value” may be stored in the lowest point storage unit 122 . The value stored in the lowest point storage unit 122 is used as height information of the mounted nozzle 40 .
  • the operation command unit 124 issues an operation command for raising and lowering the mounting nozzle 40 .
  • the motion command unit 124 transmits to the motor driver 116 signals as position commands and speed commands based on preset motion patterns.
  • the motor control unit 112 and the ⁇ -axis motor control unit 114 are realized, for example, by a processing circuit executing a computer program, by a processing circuit alone, or by a memory alone. The same applies to other control units.
  • the extraction head control unit 104 controls the servo motors 63 (#1 to #16) of the extraction nozzles 36 for each of the plurality of extraction nozzles 36 (here, 16 nozzles) arranged in the extraction head 12.
  • a motor control unit 108 is provided (#1 to #16).
  • the take-out head control unit 104 is further provided with a ⁇ -axis motor control unit 110 that controls the ⁇ -axis motor 66 arranged on the take-out head 12 .
  • Each of the motor control units 108 includes a motor driver 160 and an operation command unit 168.
  • the motor driver 160 and the motion commander 168 have the same functions as the motor driver 116 and the motion commander 124 described above, respectively, so description thereof will be omitted.
  • the main body control section 102 is connected to each component of the component mounting apparatus 1 .
  • the body control unit 102 includes, for example, the head camera 16, the XY table 17, the substrate transport unit 4, the component camera 32, the two relay stage cameras 28, the motor 84, the first component supply unit 6, the second component It is connected to the supply unit 8 and the third component supply unit 10 .
  • the body control unit 102 includes a mounting work executing unit 126, a component thickness measuring unit 128, a reference height setting unit 130, a mounting point height measuring unit 132, a mounting point height measuring unit 132, and a mounting point height measuring unit 132. It has a measurement unit 134 and a target position calculation unit 136 .
  • the mounting work executing unit 126 operates the XY table 17, the board transfer unit 4, the component supply units 6, 8, 10, the picking head 12, the mounting head 14, the head camera 16, the component camera 32, It controls the relay stage camera 28 and the like. Thus, a series of operations for mounting the component P on the substrate 2 are executed.
  • the mounting work execution unit 126 repeats the operation of moving the mounting head 14 from the component supply units 6, 8, 10 or the relay stage 26 to the work area A (hereinafter, this operation is referred to as a "turn") a plurality of times to mount the component P to the substrate 2 is executed. Further, the mounting work executing section 126 executes the work of picking up the minute components supplied from the component supply unit 6 by the picking head 12 and transferring them to the relay stage 26 before the turn is started or between turns. Let
  • the component thickness measurement unit 128 controls the mounting head 14 to pick up the component P placed on the relay stage 26 based on the height information of the mounting nozzle 40 output by the height detection unit 120. Measure the thickness of the part P. To measure the thickness of the component P, a first reference height H1 with respect to the reference plane of the relay stage 26 is used.
  • the reference height setting unit 130 controls the mounting head 14 to bring the lower end surface of the mounting nozzle 40 into contact with the mounting surface 71, which is the reference surface of the relay stage 26, and the height detection unit 120 outputs A first reference height H1 for the relay stage 26 is set based on the height information of the mounting nozzle 40 .
  • the reference height setting unit 130 further controls the mounting head 14 to cause the lower end surface of the mounting nozzle 40 to contact the upper surface 95A of the substrate holding member 95 in the work area A, and the height detection unit 120 outputs A second reference height H2 for the work area A is set based on the height information of the mounted nozzle 40 .
  • the mounting point height measuring unit 132 controls the mounting head 14 to mount the component P on the mounting point of the substrate 2 based on the height information of the mounting nozzle 40 output by the height detecting unit 120. Measure the height of a point. In order to measure the height of the mounting point, the second reference height H2 of the work area A and the thickness information of the component are used.
  • the mounting point height estimation unit 134 calculates the estimated heights of other mounting points whose heights have not been measured, based on the height data of the plurality of mounting points obtained by the mounting point height measurement unit 132 .
  • the mounting point other estimating unit 134 of the first embodiment uses "surface correction" for estimating the mounting point height.
  • the target position calculation unit 136 calculates a target position for moving the mounting nozzle 40 holding the component P when mounting the component P on the board 2 . A specific calculation method will be described later with reference to FIG. 20 and the like.
  • the body control unit 102 further stores a mounting program 138, a target position 140, component data 142, board data 144, reference height data 146, mounting point data 148, component thickness ( measurement value) 150 and mounting point height (measurement value) 152 .
  • the mounting program 138 is a program that defines the mounting order and mounting positions of the parts P.
  • An example of the loading program 138 is shown in FIG.
  • the mounting program 138 shown in FIG. 19 includes “mounting No.”, “turn No.”, “component type”, “mounting point”, “X”, “Y”, “ ⁇ ”, and “Z” as a plurality of types of information. It stores information about each of "take-out nozzle”, “mounted nozzle”, “relay”, and "specified mounting point”.
  • “Mounting No.” is identification information indicating the mounting order of the component P.
  • “Turn No.” is identification information indicating in what turn the part P is to be mounted on the board 2 .
  • “Component” is identification information indicating a component P to be mounted.
  • the “mounting point” is identification information indicating the mounting point where the component P to be mounted is to be mounted.
  • “X” and “Y” are numerical information indicating the X coordinate and Y coordinate of the mounting point where the target component P is mounted, respectively.
  • “ ⁇ ” is numerical information indicating the orientation of the component P to be mounted on the board 2 .
  • “Z” is numerical value information indicating the height of the mounting point of the board 2 held by the board holding portion 99 in an ideal state by the height difference from the second reference height H2.
  • the “extraction nozzle” is identification information indicating which extraction nozzle 36 holds the component P to be mounted.
  • “Mounting nozzle” is identification information indicating which mounting nozzle 40 holds the component P to be mounted.
  • “Relay” is identification information indicating whether or not the component P to be mounted passes through the relay stage 26 . In the example of FIG. 19, when the “relay” identification information is “1”, it indicates that the relay stage 26 is passed, and when it is “0”, it indicates that the relay stage 26 is not passed.
  • the 'designated mounting point' is identification information indicating which of the plurality of mounting points is designated as the 'designated mounting point' for estimating the height of another mounting point. In the example of FIG. 19, when the identification information of the "designated mounting point" is "1”, it indicates that the mounting point is designated as the designated mounting point. indicates that it is not specified in
  • the target position 140 is information indicating the target position to which the mounting nozzle 40 holding the component P is moved when mounting the component P on the substrate 2 .
  • Target position 140 is calculated by target position calculator 136 .
  • the part data 142 is data related to the part P.
  • the part data 142 includes, for example, information (for example, catalog data) on dimensions, shapes, types, etc. of the parts P.
  • information for example, catalog data
  • the board data 144 is data relating to the board 2 .
  • the board data 144 includes, for example, information such as a relative positional relationship between a reference mark for recognizing the position of the board 2 (see reference mark 174 in FIG. 32) and each mounting point.
  • the reference height data 146 is data including the first reference height H1 and the second reference height H2 set by the reference height setting unit 130.
  • the mounting point data 148 is data relating to the mounting points of the board 2 carried in.
  • the mounting point data 148 includes, for example, the X-coordinate, Y-coordinate, and Z-coordinate of the mounting point, and the orientation ⁇ of the component P to be mounted at the mounting point.
  • the mounting point data 148 is a mounting point height storage unit that stores the height of the mounting point.
  • the part thickness (measured value) 150 stores the thickness of the part P measured by the part thickness measuring unit 128.
  • the mounting point height (measurement value) 152 stores the height of the mounting point measured by the mounting point height measurement unit 132 .
  • the body control unit 102 further includes a first recognition unit 154, a second recognition unit 156, and a third recognition unit 158.
  • the first recognition unit 154 is a board recognition unit that recognizes the board 2 using the captured image of the head camera 16 .
  • the second recognition unit 156 is a component recognition unit that recognizes the component P placed on the relay stage 26 using the captured image of the relay stage camera 28 .
  • the third component recognition section 158 is a component recognition section that recognizes the component P held by the mounting head 14 using the captured image of the component camera 32 .
  • reference height setting processing reference height H1 and H2 setting processing
  • FIG. 20 is a flow chart showing the setting process of the first reference height H1. Each process of the flow shown in FIG. 20 is executed by the control unit 35 including the reference height setting unit 130.
  • FIG. 20 is a flow chart showing the setting process of the first reference height H1. Each process of the flow shown in FIG. 20 is executed by the control unit 35 including the reference height setting unit 130.
  • the control unit 35 moves the mounting nozzle 40 to the relay stage 26 (S1). Specifically, the XY table 7 that supports the mounting head 14 is controlled by the reference height setting unit 130 of the main body control unit 102, and the mounting head having the plurality of mounting nozzles 40 in a state in which the component P is not held is adjusted. 14 is moved above the relay stage 26 . Note that this flow is executed in a state where the component P is not placed on the placement surface 71 of the relay stage 26 .
  • the control unit 35 starts lowering the mounting nozzle 40 (S2). Specifically, the motor driver 116 controls the servo motor 56 corresponding to one mounting nozzle 40 among the plurality of mounting nozzles 40 in accordance with a command from the operation command section 124 of the mounting head control section 106, The mounting nozzle 40 is lowered toward the mounting surface 71 .
  • the control unit 35 waits for the contact detection unit 118 to detect that the mounting nozzle 40 has come into contact with the mounting surface 71 (S3).
  • FIG. 21 shows a state in which the lower end surface of the mounting nozzle 40 is in contact with the mounting surface 71.
  • FIG. 21 when it is detected that the lower end surface of the mounting nozzle 40 has come into contact with the placement surface 71 (YES in S3), the process proceeds to step S4.
  • the control unit 35 controls the servomotor 56 to stop the mounting nozzle 40 from descending (S4), and sets the first reference height H1 by the reference height setting unit 130 (S5).
  • the reference height setting unit 130 acquires the height information of the mounting nozzle 40 in contact with the mounting surface 71 from the height detection unit 120 or the lowest point storage unit 122 . Then, the reference height setting unit 130 stores the acquired height information in the storage unit 103 as the reference height H1, that is, the reference height data 146. FIG. This completes the setting of the reference height H1 for this mounting nozzle 40 .
  • the reference height setting unit 130 sets the average value of the acquired height information as the reference height H1. . Also, when the lower end surface of the same mounting nozzle 40 is brought into contact with a plurality of places on the mounting surface 71, the reference height setting unit 130 sets a surface function obtained from the obtained plurality of height information as the reference height H1. do.
  • the control unit 35 controls the servomotor 56 to raise the mounting nozzle 40 as shown in FIG. 22 (S6).
  • the mounted nozzle 40 that has risen is returned to the same height position as the other mounted nozzles 40 .
  • the control unit 35 determines whether or not all mounted nozzles 40 have been completed (S7). In step S7, the control unit 35 determines whether or not the processes of steps S1 to S6 have been executed for all of the plurality of mounting nozzles 40 (#1 to #8) provided in the mounting head . If there are mounted nozzles 40 that have not been subjected to the processing of steps S1 to S6, it is determined that all mounted nozzles 40 have not been completed (NO in S7), and the other mounted nozzles 40 are also subjected to step S1.
  • the processing of S6 is executed. That is, the processes of steps S1 to S6 are executed for each of the plurality of mounting nozzles 40, and the first reference height H1 is set for each mounting nozzle 40. FIG. Thereby, the first reference height H ⁇ b>1 can be set without being affected by individual differences among the plurality of mounting nozzles 40 .
  • each of the mounting nozzles 40 is replaceably attached to the shaft 42, and the first reference height H1 can be set for each combination of the mounting nozzle 40 and the shaft 42. This makes it possible to set the first reference height H1 with higher accuracy.
  • step S7 When the processing of steps S1 to S6 for all mounting nozzles 40 is completed, it is determined that all mounting nozzles 40 have been completed (YES in step S7), and the setting processing for the first reference height H1 ends.
  • FIG. 23 is a flowchart showing the setting process of the second reference height H2
  • FIGS. 24A and 24B are schematic diagrams for explaining the flow of the process according to the flowchart of FIG.
  • Each process according to the flowchart of FIG. 23 is executed by the control section 35 including the reference height setting section 130 .
  • the description of the content that overlaps with the first reference height setting process described above will be omitted as appropriate.
  • the control unit 35 moves the mounting nozzle 40 to the work area A (S8).
  • the XY table 7 that supports the mounting head 14 is controlled by the reference height setting unit 130 of the main body control unit 102, and the mounting head having the plurality of mounting nozzles 40 in a state in which the component P is not held is adjusted. 14 is moved above the substrate transfer unit 4 in the work area A. As shown in FIG. This flow is executed in a state where the substrate 2 is not arranged in the work area A.
  • the control unit 35 starts lowering the mounting nozzle 40 (S9).
  • the motor driver 116 controls the servo motor 56 corresponding to one mounting nozzle 40 among the plurality of mounting nozzles 40 in accordance with a command from the operation command section 124 of the mounting head control section 106, As shown in FIG. 24A , the mounting nozzle 40 is lowered toward the substrate holding member 95 of the substrate transfer unit 4 .
  • a pair of substrate pressing members 95 are provided, and the mounting nozzle 40 is lowered toward one substrate pressing member 95 (on the left side of the drawing).
  • the control unit 35 waits for the contact detection unit 118 to detect that the mounting nozzle 40 has come into contact with the upper surface 95A (first measurement point 95M) of the substrate pressing member 95 (S10).
  • the mounting nozzle 40 stops descending (S11), and the mounting height obtained by the height detection unit 120 is The height information of the nozzle 40 or the height information stored in the lowest point storage unit 122 is acquired and stored (S12). Thereby, the height of the upper surface 95A (first measurement point 95M) is measured.
  • the control unit 35 raises the mounting nozzle 40 (S13) and determines whether or not height measurement has been completed at all measurement points (S14). In the first embodiment, there are four first measurement points 95M, so if height measurements at all measurement points have not been completed (NO in S14), steps S8 to S14 are executed again.
  • the mounting nozzle 40 is directed toward the upper surface of the other substrate holding member 95 as shown in FIG. 24B. It is lowered (S8-S9), and the remaining first measurement points 95M are measured (S10-S13).
  • the second reference height H2 is set (S15).
  • the average value of the heights of the four first measurement points 95M is set as the second reference height H2.
  • FIG. 25 is a block diagram for explaining a target position calculation method by the target position calculator 136.
  • FIG. 26 is a diagram showing the flow of a series of component mounting operations by the component mounting apparatus 1. As shown in FIG.
  • the substrate 2 is first carried into the work area A. As shown in FIG. Specifically, the substrate 2 is transported by the transport conveyor 5 of the substrate transport unit 4 and positioned in the work area A. As shown in FIG.
  • the board 2 positioned in the work area A is recognized. Specifically, the mounting head 14 having the head camera 16 is moved in the XY directions, and the head camera 16 is arranged above the substrate 2 to image the substrate 2 .
  • the first recognition unit 154 recognizes the position of the board 2 based on the image captured by the head camera 16 .
  • the recognition result of the board 2 by the first recognition section 154 is transmitted to the target position calculation section 136 .
  • the target position calculation unit 136 reads information on all mounting points scheduled for the component mounting apparatus 1 from the mounting program 138 .
  • the information to be read is the information of X, Y, ⁇ , and Z in the installation program 138 shown in FIG.
  • the target position calculation unit 136 corrects the read X, Y, and ⁇ based on the board recognition result by the first recognition unit 154 to obtain the mounting point after correction.
  • Data 148 (X1, Y1, ⁇ 1) are calculated and stored in the storage section 103 . If there is an estimated value for the mounting point by the mounting point height estimating unit 134, the target position calculating unit 136 stores the value as Z1, but if there is no estimated value, stores the Z of the mounting program 138 as Z1. At the start of the first turn, there is no estimated value by the mounting point height estimator 134 for the mounting point, so Z in the mounting program 138 is set as Z1.
  • (X1, Y1, ⁇ 1) of the mounting point data 148 is a temporary target position of each mounting nozzle 40 in the component mounting process.
  • the pick-up head 12 is moved to the intermediate stage 26 while the plurality of pick-up nozzles 36 are holding the component P.
  • a plurality of (for example, 16) components P are collectively transported from the first component supply unit 6 to the relay stage 26 .
  • the component P held by the extraction nozzle 36 is placed on the temporary placement portion 70 of the relay stage 26 .
  • the plurality of take-out nozzles 36 are simultaneously lowered to release the suction of the component P near the placement surface 71 of the temporary placement portion 70 , and the component P is placed on the placement surface 71 .
  • a plurality of (for example, 16) parts P are arranged on the placement surface 71 as shown in FIG.
  • the take-out nozzle 36 collectively conveys 16 components P mounted on the substrate 2 in the first turn and the second turn, in other words, a plurality of components P for multiple turns to the relay stage 26 .
  • the take-out head 12 returns to the component supply unit 6.
  • component recognition is performed for the component P placed on the relay stage 26 .
  • the relay stage camera 28 shown in FIG. 10 and the like is used to image the component P placed on the temporary placement section 70 from below.
  • two relay stage cameras 28 are provided, and 16 parts P arranged on the temporary placement section 70 can be imaged simultaneously.
  • Each component P is recognized by the second recognition section 156 of the control section 35 based on the captured image (first image).
  • Recognition of the component P at this timing is “pre-pickup component recognition” (first component recognition) performed before the component P is picked up by the mounting head 14 .
  • pre-pickup component recognition is executed for all components P placed in the temporary placement section 70 .
  • the component P is picked up by the mounting head 14 .
  • the mounting head 14 moves from the work area A to the relay stage 26 during pre-pickup component recognition (FIG. 26). Further, when the pre-pickup component recognition is completed while the mounting head 14 is moving, the main body control unit 102 starts the component pick-up process.
  • Fig. 27 shows the flow of parts pick-up processing. Each process of the flowchart shown in FIG. 27 is executed by the mounting work execution unit 126 of the control unit 35 .
  • the mounting work execution unit 126 acquires the result of pre-pickup component recognition (S16). Specifically, mounting work execution unit 126 of main body control unit 102 reads data temporarily stored in second recognition unit 156 as a result of pre-pickup component recognition.
  • the result of pre-pickup component recognition includes position information of each component P placed on the relay stage 26 .
  • the mounting work execution unit 126 transmits the position information of one or more (maximum eight) components P scheduled to be mounted on the board 2 in the turn started to the second recognition unit 156. Get from
  • the mounting work execution unit 126 aligns the mounting nozzle 40 with the component P (S17). Specifically, the mounting work execution unit 126 aligns the mounting nozzle 40 assigned by the mounting program 138 to one component P among the plurality of components P recognized in the pre-pickup component recognition in the XY directions. do. In the first embodiment, as shown in FIG. 28A, alignment is performed so that the center of the lower end surface of the mounting nozzle 40 in the XY direction is aligned with the center of the component P in the XY direction.
  • the mounting work execution unit 126 starts lowering the mounting nozzle 40 in parallel with the alignment of the mounting nozzle 40 (S18). Specifically, the mounting work execution unit 126 transmits a command to the motor control unit 112 , and the motor control unit 112 controls the servo motor 56 to lower the mounting nozzle 40 . As a result, the part P can be moved obliquely downward as shown in FIG. 28A, and the work time can be shortened to improve productivity.
  • the mounting work execution unit 126 causes the mounting nozzle 40 to start suctioning after a predetermined timing from when the mounting nozzle 40 starts to descend (S19). Specifically, a valve (not shown) connected through a pipe to the suction hole 54 (see FIG. 6) of the mounting nozzle 40 is driven to connect the suction hole 54 and a negative pressure source, thereby generating a negative pressure in the suction hole 54. state. When the mounting nozzle 40 continues to descend in this state, it contacts the component P placed on the relay stage 26 (FIG. 28B).
  • the mounting work execution unit 126 determines whether or not the mounting nozzle 40 has come into contact (S20). A specific method will be described with reference to FIG. 28D.
  • FIG. 28D is a graph showing how the output value of the height detection unit 120 changes when the mounting nozzle 40 is lowered according to the command from the operation command unit 124.
  • FIG. 28D is a graph showing how the output value of the height detection unit 120 changes when the mounting nozzle 40 is lowered according to the command from the operation command unit 124.
  • the output value of the height detection section 120 fluctuates.
  • the contact detection unit 118 determines that the lower end surface of the mounting nozzle 40 has come into contact with the mounting surface 71. .
  • the mounting work execution unit 126 When the mounting work execution unit 126 detects that the lower end surface of the mounting nozzle 40 has come into contact with the component P (YES in S20), it stores the minimum height of the mounting nozzle 40 (S21). Specifically, the lowest point storage unit 122 stores the minimum output value of the height detection unit 120 during a predetermined period after the lower end surface of the mounting nozzle 40 contacts the component P.
  • FIG. 1 A block diagram illustrating an a height of the mounting nozzle 40 .
  • a "buffer period” is defined from the detection of the contact of the mounted nozzle 40 to the start of the upward movement of the mounted nozzle 40. ”. This makes it possible to acquire the minimum value during the period when the output value is stable without adopting the output value of the height detection unit 120 during the unstable period immediately after the contact is detected.
  • the mounting work execution unit 126 raises the mounting nozzle 40 (S22). Specifically, the mounting work execution unit 126 transmits a command to the motor control unit 112 , and the motor control unit 112 controls the servomotor 56 to raise the mounting nozzle 40 . In the first embodiment, as shown in FIG. 28C, the mounted nozzle 40 is moved obliquely upward.
  • the mounting work execution unit 126 commands post-pickup component recognition (S23). Specifically, the mounting work execution unit 126 transmits a command to the relay stage camera 28 , images the component P held by the mounting nozzle 40 , and outputs the image to the second recognition unit 156 . As shown in FIG. 28C , the intermediate stage camera 28 arranged below picks up an image of the part P that has moved obliquely upward and is lifted from the temporary placement section 70 . The part P is recognized by the second recognition section 156 of the control section 35 based on the captured image (second image). Recognition of the component P at this timing is “post-pickup component recognition (second component recognition)” performed after the component P is picked up by the mounting head 14 .
  • the second recognition unit 156 recognizes positional deviation between the component P held by the mounting nozzle 40 and the mounting nozzle 40 . Specifically, the deviation ( ⁇ X, ⁇ Y) between the center of the mounting nozzle 40 and the center of the component P and the angular difference ( ⁇ ) between the orientation of the mounting nozzle 40 and the orientation of the component P are determined using a well-known image recognition technique. Ask. These deviations and angular differences are output to the target position calculator 136 as the post-pickup component recognition result (arrow (B) in FIG. 25).
  • the component thickness measurement unit 128 acquires the minimum height of the mounting nozzle 40 (S24). Specifically, the component thickness measurement unit 128 of the main body control unit 102 reads and acquires the minimum height value of the mounting nozzle 40 stored in the lowest point storage unit 122 of the motor control unit 112 in step S21. do.
  • the part thickness measurement unit 128 calculates the thickness of the part P (S25). Specifically, the component thickness measurement unit 128 calculates the minimum value of the height of the mounting nozzle 40 acquired in step S24 and the first reference height H1 of the relay stage 26 stored in the reference height storage unit 146. and the thickness of the part P is calculated. The minimum value of the height of the mounting nozzle 40 corresponds to the height of the lower end surface of the mounting nozzle 40 when the mounting nozzle 40 contacts the component P as shown in FIG. The thickness of the part P can be calculated by obtaining the difference from the thickness H1. The calculated thickness of the component P is stored in the storage unit of the main body control unit 102 as the component thickness (measured value) 150 .
  • the mounting work execution unit 126 determines whether or not there is an incomplete mounting nozzle 40 that has not finished picking up the component P (S26).
  • steps S17 to S25 are performed among the plurality of mounted nozzles 40 for one turn. If there is a mounted nozzle 40 for which steps S17 to S25 have not been executed among the plurality of mounted nozzles 40 for one turn, it is determined that there is a mounted nozzle 40 for which steps S17 to S25 have not been completed (YES in S26), and steps S17 to S26 are performed. again. That is, the process of picking up the component P and the calculation of the thickness of the component P are executed for each of the plurality of mounting nozzles 40 (#1 to #8) provided in the mounting head 14.
  • steps S17 to S25 are executed for all of the plurality of mounted nozzles 40 for one turn, it is determined that there is no unfinished mounted nozzle 40 (NO in S26), and the processing of the flowchart shown in FIG. 27 ends.
  • the component mounting apparatus 1 of Embodiment 1 repeatedly executes the processing of the flowchart shown in FIG. 27 for each turn. As a result, according to the mounting order of the mounting program 138, the pick-up processing and thickness calculation of the component P by the mounting nozzle 40 are sequentially performed for each turn.
  • the mounting head 14 moves to the work area A with the multiple mounting nozzles 40 picking up the component P.
  • the target position calculator 136 obtains the target positions (X2, Y2, ⁇ 2, Z2) of the respective mounting nozzles 40 when the component P is mounted on the substrate 2 during this collective transportation.
  • a method of calculating the target position (X2, Y2, ⁇ 2, Z2) by the target position calculator 136 will be described with reference to FIG.
  • the first calculation unit 136A of the target position calculation unit 136 calculates the target position based on (A) the mounting point data 148 (X1, Y1, ⁇ 1) and (B) the post-pickup part recognition result. Calculate the position (X2, Y2, ⁇ 2). Specifically, the post-pickup component recognition results ( ⁇ X, ⁇ Y, ⁇ ) are used to correct the provisional target position indicated by the mounting point data 148 (X1, Y1, ⁇ 1) to obtain the target position (X2, Y2). , ⁇ 2).
  • the component P is recognized. is performed by component recognition in which the third recognition unit 158 processes an image captured by the component camera 32 (FIG. 1).
  • the mounting point data 148 (X1, Y1, ⁇ 1) is corrected using (C) the component recognition result by the third recognition unit 158 instead of the (B) post-pickup component recognition result, and the target position ( X2, Y2, ⁇ 2) are calculated.
  • the third recognition unit 158 recognizes the components. Obtained by recognizing P.
  • the target position (X2, Y2, ⁇ 2) calculated by the first calculation unit 136A and (5) the target height (Z2) calculated by the second calculation unit 136B are set as the target position 140 by the main body control unit.
  • 102 is stored in the storage unit 103 .
  • FIG. 29 shows a flow of processing for mounting the component P by the mounting head 14 .
  • Each process of the flowchart shown in FIG. 29 is executed by the mounting work execution unit 126 .
  • the mounting work execution unit 126 acquires the target position (X2, Y2, ⁇ 2, Z2) (S27). Specifically, the mounting work execution unit 126 acquires the target position (X2, Y2, ⁇ 2, Z2) calculated by the target position calculation unit 136 .
  • the mounting work execution unit 126 positions the mounting nozzle 40 at the mounting point (S28). Specifically, the mounting nozzle 40 holding the component P to be mounted on the board 2 is positioned in the XY direction and the ⁇ direction according to the mounting order of the mounting program 138 under the control of the mounting work execution unit 126 . During positioning, the mounted nozzle 40 is moved toward the target position (X2, Y2, ⁇ 2) acquired in step S27. In the first embodiment, as shown in FIG. 30A, the mounting nozzle 40 is positioned by moving it obliquely downward while lowering it in the Z direction.
  • the mounting work execution unit 126 determines whether or not the mounting point is the designated mounting point (S29). Specifically, the mounting work execution unit 126 determines whether or not the mounting point of the board 2 on which the component P is to be mounted is designated as the designated mounting point in the mounting program 138 . In the example of the mounting program 138 shown in FIG. 19, the mounting points corresponding to the first to ninth parts P in the mounting order of the parts P are designated as the designated mounting points. not specified. Therefore, all mounting points where components are mounted in the first turn are designated mounting points.
  • step S30 it is determined whether or not the mounting nozzle 40 holding the component P has come into contact with the mounting point of the substrate 2 using the same contact detection method as in step S20 described above.
  • the mounting nozzle 40 continues to descend. On the other hand, as shown in FIG. 30B, when the component P held by the mounting nozzle 40 contacts the upper surface of the substrate 2, the contact of the mounting nozzle 40 is detected (YES in S31).
  • the mounting work executing section 126 cancels the suction by the mounting nozzle 40 (vacuum breaking) and raises the mounting nozzle 40 (S34).
  • the mounting nozzle 40 is moved upward and obliquely raised.
  • the mounting work execution unit 126 acquires the minimum value (S35). Specifically, in the same manner as in step S21 described above, the lowest point storage unit 122 stores the output value for a predetermined period immediately before the mounting nozzle 40 is lifted after contact is detected (YES in S31). The minimum value of the height of the mounted nozzle 40 is read and acquired. This minimum value is the height position of the mounting nozzle 40 when the component P is mounted on the substrate 2 .
  • the mounting work execution unit 126 instructs the mounting point height measurement unit 132 to calculate the mounting point height (S36).
  • the mounting point height measuring unit 132 that has received this command calculates the height of the mounting point. Specifically, since the minimum value of the mounting nozzle 40 obtained in step S35 corresponds to the height Z3 of the mounting nozzle 40 that holds the component P in contact with the mounting point of the substrate 2 as shown in FIG. By subtracting the thickness (measured value) 150, the mounting point height Z4, which is the height of the mounting point of the substrate 2, can be calculated.
  • the calculated mounting point height Z4 is stored in the storage unit 103 of the main body control unit 102 as the mounting point height (measured value) 152 .
  • the thickness of the component used to calculate the height of the mounting point is not the catalog value but the accurate value measured for the component P actually mounted at the mounting point. so you can get the exact mounting point height.
  • the mounting work execution unit 126 determines whether or not there is an unfinished mounting nozzle 40 (S37). Specifically, determination is made based on whether or not there is a mounting nozzle 40 for which steps S28 to S36 have not been executed among the plurality of mounting nozzles 40 for one turn according to the mounting order of the mounting program 138 .
  • steps S28 to S36 are performed. again.
  • steps S28 to S36 have been executed for all of the plurality of mounting nozzles 40 for one turn, it is determined that there is no unfinished mounting nozzle 40 (NO in S37), and the component mounting process ends. This completes the component mounting process for the first turn.
  • the component mounting apparatus 1 repeatedly executes a series of processes from the setting of the mounting data 148 by the target position calculation unit 136 to the component mounting process (FIG. 29) for each turn.
  • the mounting of the component P by the mounting nozzle 40 after the second turn and the calculation of the mounting point height Z4 of the board 2 on which the component P is mounted are sequentially performed.
  • the mounting points corresponding to the first to ninth parts P in the mounting order are designated as the designated mounting points.
  • the parts P whose mounting order is 1st to 6th are programmed to be mounted in the first turn, and the parts P whose mounting order is 7th to 9th are mounted in the second turn. Therefore, when the flow shown in FIG. 29 is executed for the parts P in the first and second turns, all mounting points (first to ninth in the mounting order) are determined to be designated mounting points. (YES in S29), each process of steps S30, S31, and S34 to S36 is executed for each mounting point. As a result, the mounting point height H4 is calculated for all nine designated mounting points.
  • the mounting point height estimation unit 134 performs height estimation processing for mounting points other than the designated mounting points.
  • Fig. 31 shows the flow of the mounting point height estimation process. Each process of the flowchart shown in FIG. 31 is executed by the mounting point height estimation unit 134 .
  • the mounting point height estimation unit 134 determines whether or not the turn has ended (S38). Specifically, it is determined whether or not the component mounting process (FIG. 29) has ended.
  • the mounting point height estimation unit 134 determines whether or not the heights of all designated mounting points have been acquired (S39). In the example shown in FIG. 19, when the mounting point heights (measurement values) 152 for the mounting points 1st to 9th in the mounting order are obtained, it is determined that the heights of all the mounting points have been obtained (S39). Yes), the process proceeds to step S40.
  • the processing after S40 is not executed. After that, when the second turn ends and the first to ninth mounting point heights (measured values) 152 are obtained (YES in S39), the processing from S40 onwards is executed.
  • the mounting point height estimation unit 134 calculates the board shape (S40). Specifically, mounting point heights (measured values) 152 for a plurality of designated mounting points are obtained (arrow (G) in FIG. 25), and based on the obtained mounting point heights (measured values) 152, the substrate 2 Calculate the overall shape of .
  • "surface correction" is used when calculating the substrate shape.
  • the surface correction method for example, any method disclosed in Japanese Patent Laid-Open No. 2006-203020 may be used. Any calculation method capable of calculating the overall shape of the substrate 2 may be used without being limited to the surface correction. By calculating the overall shape of the substrate 2, the height at any position of the substrate 2 can be calculated.
  • FIG. 32 is a schematic front view showing a state in which nine designated mounting points 172 are designated from a plurality of mounting points 170 on the substrate 2.
  • FIG. 32 a plurality of reference marks 174 are provided at corners of the substrate 2, and the first recognition unit 154 recognizes the position of the substrate 2 based on the image captured by the head camera 16 described above. used for
  • a plurality of designated mounting points 172 are evenly distributed. As a result, it is possible to improve the calculation accuracy when calculating the substrate shape by surface correction. As the number of designated mounting points 172 increases, the accuracy of board shape calculation improves. Therefore, by providing a total of nine designated mounting points 172, the calculation accuracy can be further improved.
  • FIG. 33 is a schematic front view showing an example in which the substrate 176 has a plurality of split substrates 178.
  • the substrate 176 has four divided substrates 178, and nine designated mounting points 180 are designated on each of the divided substrates 178.
  • the overall shape of the substrate 176 can be calculated with higher accuracy.
  • the mounting point height estimation unit 134 calculates the heights of other mounting points (S41). Specifically, the mounting point height estimator 134 calculates the estimated heights of the other mounting points not designated as the designated mounting points based on the shape of the substrate 2 calculated in step S40. That is, the height of the mounting point where the component P is not mounted is estimated.
  • the mounting point height estimation unit 134 updates the mounting point data (Z1) (S42). Specifically, the mounting point height estimation unit 134 updates the value of Z1 in the mounting point data 148 based on the estimated height of the mounting point calculated in step S41 (arrow (6) in FIG. 25). After that, the flow shown in FIG. 31 ends. In the first embodiment, after the end of the second turn, the mounting point height estimation unit 134 executes height estimation processing for mounting points other than the designated mounting points, and updates the mounting point data (Z1). That is, the value is updated to reflect the actual deformation of the substrate 2 . Therefore, for the third and subsequent turns, the updated mounting point data (Z1) is used to calculate the target height (Z2). It is possible to realize high-quality component mounting with less component P mounting mistakes and positional deviation after mounting.
  • step S32 the mounting work execution unit 126 lowers the mounting nozzle 40 (S32), and determines whether or not the mounting nozzle 40 has reached the target height (Z2) (S33).
  • steps S32 and S33 are passed through, the contact detection of the component P (S31) is not performed unlike when it is determined to be the designated mounting point, so the mounting nozzle 40 is lowered toward the target height (Z2) at high speed can be made That is, after the mounting point height estimation process is performed, the mounting nozzle 40 can be lowered at high speed to mount the component P, and productivity can be improved.
  • the mounting nozzle 40 is lowered at a low speed (S30) in order to detect contact between the component P and the board 2 (S31).
  • the target height (Z2) of the mounting point has been calculated by the mounting point height estimation process, so the mounting point is mounted toward the target height (Z2).
  • the nozzle 40 can be lowered at high speed (S32, S33). In either case, the mounting nozzle 40 can be lowered to a position where the component P contacts the board 2 as shown in FIG.
  • the mounting of the component P on the board 2 by the mounting head 14 is performed for each turn.
  • the mounting nozzle 40 is lowered at a low speed in order to mount the component P with contact detection. Therefore, the mounting nozzle 40 can be lowered at high speed to improve the processing speed.
  • the calculation of the target position (X2, Y2, Z2, ⁇ 2) by the target position calculator 136 described above can be performed while the mounting head 14 picks up the component P on the relay stage 26 and moves to the work area A. can. Thereby, working efficiency can be improved.
  • the take-out head 12 performs a take-out operation for picking up minute components from the first component supply unit 6, a transport operation for collectively transporting the taken-out minute components to the relay stage 26, and a transport operation for transferring the minute components to the relay stage 26.
  • a placement operation to place the component and a return operation to return to the first component supply unit 6 are repeatedly performed.
  • the mounting head 14 also moves from the work area A to the relay stage 26, picks up minute parts placed on the relay stage 26, and collectively transports the picked-up minute parts to the work area A.
  • a carrying operation and a mounting operation for mounting a minute component on the board 2 in the work area A are repeatedly executed for each turn.
  • the number of extraction nozzles 36 in the extraction head 12 is greater than the number of mounting nozzles 40 in the mounting head 14, so that the number of minute components that can be batch-conveyed to the relay stage 26 can be increased.
  • the number (16) of the extraction nozzles 36 is double the number (8) of the mounting nozzles 40.
  • the loading head 14 can be controlled to perform two turns of work. Thereby, working efficiency can be improved.
  • the component P ( It includes a turn for picking up small or medium-sized parts and mounting them on the substrate 2 .
  • the mounting head 14 picks up the component P from the component supply units 8 and 10, moves above the component camera 32, performs imaging and component recognition of the component P by the component camera 32, and then moves to the work area A.
  • the mounting operation of mounting the component P on the mounting point of the substrate 2 is sequentially performed for each mounting nozzle 40, as in the case of the minute component.
  • the values of the mounting point data 148 based on the initial values of the mounting program 138 are used to lower the mounting nozzle 40 at high speed to mount the component P on the board 2 .
  • component mounting can be performed while switching the component supply units 6, 8, and 10 that supply the component P on a turn-by-turn basis.
  • the component mounting apparatus 1 of Embodiment 1 is a component mounting apparatus that picks up components P from the first component supply unit 6 and mounts them on the substrate 2, and is a relay stage on which a plurality of components P can be mounted.
  • a pick-up head 12 (first component transfer section) that picks up a component P from the first component supply unit 6 and transfers it to the relay stage 26
  • a plurality of components P on the relay stage 26 are imaged to obtain a first It has a relay stage camera 28 that acquires an image and a plurality of mounting nozzles 40 that hold the component P.
  • the control unit 35 executes pre-pickup part recognition (first part recognition) for recognizing a plurality of parts P on the relay stage 26 using the first image, and controls the mounting head 14 to perform pre-pickup part recognition.
  • pre-pickup part recognition first part recognition
  • the mounting nozzles 40 are aligned with the components P on the relay stage 26, and the picking up operation of picking up the components P is sequentially performed for each mounting nozzle 40, and the mounting nozzles 40 picking up the components P are placed on the substrate 2.
  • the mounting operation of mounting the components P held by the mounting nozzles 40 on the mounting points of the board 2 is sequentially executed for each mounting nozzle 40 .
  • the component mounting method of the first embodiment is a component mounting method in which the component P is picked up from the first component supply unit 6 and mounted on the substrate 2.
  • the control unit 35 controls the pickup head 12 to A component P is picked up from the component supply unit 6 and transferred to the relay stage 26, and the control unit 35 controls the relay stage camera 28 to image the plurality of components P on the relay stage 26 to obtain a first image.
  • the controller 35 executes pre-pickup component recognition for recognizing a plurality of components P on the relay stage 26 using the first image, and the controller 35 controls the mounting head 14 having a plurality of mounting nozzles 40 .
  • the component P is mounted on the substrate 2 in a state where the attitude of the component P is stabilized. It is possible to achieve higher quality component mounting. Also, even when a minute component is held as the component P, the area where the component P protrudes from the holding surface of the mounting nozzle 40 can be reduced. It is suitable for "narrow adjacent mounting" to be mounted on the substrate 2. Furthermore, since a plurality of components P on the relay stage 26 are collectively imaged and recognized, the operation of picking up the components P by a plurality of mounting nozzles 40 can be efficiently executed.
  • the control unit 35 activates the second recognition unit 156 (component recognition unit) that recognizes the component P based on the image captured by the relay stage camera 28. Further, the control unit 35 controls the mounting nozzle 40 to align the center of the lower end surface of the mounting nozzle 40 toward the center of the component P recognized by the second recognition unit 156, thereby locating the component P. to pick up. As a result, the component P is picked up by aligning the center of the lower end surface of the mounting nozzle 40 with the center of the component P, so that the component P can be held in a stable posture by the mounting nozzle 40, and the mounting nozzle 40 can be moved. , the component P can be mounted in an appropriate posture at the mounting point. In particular, it exerts a remarkable effect when mounting minute parts.
  • the relay stage 26 has the temporary placement section 70 on which the component P is placed, and the temporary placement section 70 allows the component P to be seen through from below.
  • the relay stage camera 28 is arranged below the temporary placement section 70 . Accordingly, the relay stage camera 28 can be arranged below the temporary placement section 70 to image the component P without interfering with the movement of the pick-up head 12 . In addition, the pickup head 12 does not interfere with the imaging of the component P.
  • a plurality of relay stage cameras 28 are provided, and the plurality of relay stage cameras 28 acquire the first image.
  • the area of the temporary placement portion 70 can be widened, and the work of mounting many parts P can be efficiently performed.
  • the control unit 35 further controls the relay stage camera 28 to image the component P held by the mounting nozzle 40 to generate the second image. to get As a result, by using the same relay stage camera 28 to image the picked-up component P, there is no need to photograph the picked-up component P with a component recognition camera separate from the relay stage camera 28. does not need to move above the component camera 32 . As a result, wasteful operations can be eliminated, and highly productive component mounting can be realized.
  • the control unit 35 further uses the second image to perform post-pickup component recognition for recognizing the component P held by the mounting nozzle 40. Then, using the result of component recognition after pickup, a target position for mounting the component P at the mounting point in the mounting operation is calculated. As a result, the mounting accuracy of the component P can be improved, and component mounting with few mounting errors and narrow adjacent mounting can be realized.
  • the control unit 35 moves the plurality of mounting nozzles 40 holding the respective components P above the substrate 2 in the conveying operation so that the plurality of components P are mounted. are collectively transported. Accordingly, by collectively transporting a plurality of components P from the relay stage 26 to above the substrate 2, the working efficiency of component mounting can be improved.
  • the take-out head 12 has a plurality of take-out nozzles 36, and the control unit 35 controls the take-out head 12 so that the take-out nozzles 36 mount the first component.
  • a take-out operation for taking out the parts P from the supply unit 6 is sequentially performed for each take-out nozzle 36, and the plurality of take-out nozzles 36 are conveyed above the intermediate stage 26 while holding the plurality of parts P by the plurality of take-out nozzles 36.
  • a carrying operation is performed, and a placement operation for placing the component P held by the ejection nozzle 36 on the intermediate stage 26 is sequentially performed for each ejection nozzle 36 . Accordingly, by batch-conveying a plurality of components P from the first component supply unit 6 to the relay stage 26, the working efficiency of component mounting can be improved.
  • the number of extraction nozzles 36 in the extraction head 12 is greater than the number of mounting nozzles 40 in the mounting head 14 .
  • a larger number of components P can be transferred to the intermediate stage 26 than one batch transfer of the mounting head 14 by one batch transfer of the pick-up head 12, and the work efficiency of component mounting is improved. can be done.
  • the arrangement pitch of the extraction nozzles 36 in the extraction head 12 is the same as or 1/n (where n is 1 or more) the arrangement pitch of the mounting nozzles 40 in the mounting head 14. integer).
  • the number of extraction nozzles 36 in the extraction head 12 (16) is twice the number of mounting nozzles 40 in the mounting head 14 (8).
  • the parts P by two or more batch transports of the mounting head can be transferred to the relay stage 26, so that the working efficiency of component mounting can be improved.
  • the number of extraction nozzles 36 is not limited to twice the number of mounting nozzles 40, but may be more than twice.
  • the component mounting apparatus 1 of Embodiment 1 is a component mounting apparatus that mounts a component P on a mounting point of a substrate 2, and includes a mounting nozzle 40 that holds the component P and mounts it on the substrate 2;
  • a relay having a servo motor 56 (motor) for raising and lowering the nozzle 40, a height detection unit 120 (mounted nozzle height detection unit) for detecting the height of the mounted nozzle 40, and a mounting surface 71 (first reference surface).
  • a control unit 35 is provided.
  • the control unit 35 sets the first reference height H1 based on the height detected by the height detection unit 120 when the lower end surface of the mounting nozzle 40 is brought into contact with the mounting surface 71 of the relay stage 26, and the substrate a reference height setting unit 130 for setting the second reference height H2 based on the height detected by the height detection unit 120 when the lower end surface of the mounting nozzle 40 is brought into contact with the upper surface 95A of the pressing member 95;
  • the thickness of the component P is measured based on the first reference height H1 and the height detected by the height detection unit 120 when the component P is sandwiched between the placement surface 71 and the lower end surface of the mounting nozzle 40.
  • a target position calculation unit 136 that calculates the height (Z2) and a motor control unit 112 that controls the servo motor 56 based on the target height (Z2) are provided.
  • the component mounting method of the first embodiment is a component mounting method for mounting the component P on the mounting point of the substrate 2.
  • the lower end surface of the mounting nozzle 40 is brought into contact with the mounting surface 71 of the mounting nozzle 40, and the first reference height H1 is set from the height detected by the height detection unit 120 capable of detecting the height of the mounting nozzle 40, and the control unit 35 controls the mounting nozzle 40 to bring the lower end surface of the mounting nozzle 40 into contact with the upper surface 95A of the substrate pressing member 95 provided in the work area A of the substrate 2, and the height detected by the height detection unit 120 is reached.
  • the control unit 35 controls the mounting nozzle 40 to sandwich the component P between the mounting surface 71 and the lower end surface of the mounting nozzle 40, and the height detection unit 120
  • the thickness of the component P is calculated based on the height detected by and the first reference height H1.
  • a target height (Z2) for lowering the mounting nozzle 40 holding the component P toward the mounting point is calculated.
  • the servo motor 56 for raising and lowering the mounting nozzle 40 is controlled to lower the mounting nozzle 40 toward the mounting point.
  • the thickness of the component P can be measured using the height detection function of the mounting nozzle 40, there is no need for a dedicated measuring device for measuring the thickness of the component. can be reduced in size and weight, and the component mounting apparatus 1 with high productivity can be realized.
  • the mounting nozzle 40 is replaceably attached to the shaft 42 that is driven up and down by the servomotor 56, and the reference height setting section 130 is configured so that the mounting nozzle 40 Separately, a first reference height H1 and a second reference height H2 are set. Accordingly, by setting the first reference height H1 and the second reference height H2 for each mounting nozzle 40, the component thickness measurement and component mounting can be performed without being affected by the individual difference of the mounting nozzles 40. can.
  • a plurality of mounting nozzles 40 are provided, and are replaceably attached to each of a plurality of shafts 42 driven up and down by a servomotor 56.
  • the setting unit 130 sets the first reference height H1 and the second reference height H2 for each combination of the mounting nozzle 40 and the shaft 42 . Accordingly, by setting the first reference height H1 and the second reference height H2 for each combination of the mounting nozzle 40 and the shaft 42, the part thickness can be measured without being affected by the individual differences of the mounting nozzle 40 and the shaft 42. Part mounting can be performed.
  • the component thickness measurement unit 128 detects the height detection unit 120 when the component P placed on the mounting surface 71 is picked up by the mounting nozzle 40 .
  • the thickness of the component P is measured based on the height detected by the target position calculation unit 136, and the target position calculation unit 136 calculates the target height (Z2) while the mounting nozzle 40 picks up the component P and moves to the work area A. calculate. This makes it possible to measure the thickness of the component P and calculate the target height (Z2) in a series of operations from picking up the component P to mounting it.
  • the component thickness measurement unit 128 detects the height detection unit 120 during a predetermined period immediately before the mounting nozzle 40 picking up the component P leaves the mounting surface 71 .
  • the thickness of the part P is measured based on the value (minimum value) indicating the lowest point among the values detected by .
  • the thickness of the component P can be measured more accurately by using the minimum value of the period during which the influence of the impact during picking up is less likely to occur.
  • the relay stage camera 28 that captures the image of the component P placed on the mounting surface 71 is further provided, and the control unit 35 controls the relay stage camera 28 to It further has a second recognition unit 156 (component recognition unit) that recognizes the component P based on the captured image.
  • the center of the lower end face of the mounting nozzle 40 is aligned toward the center of the component P to pick up the component P.
  • the center of the lower end face of the mounting nozzle 40 is aligned with the center of the component P to pick up the component P, so the thickness of the component P can be measured more accurately.
  • the first reference member having the first reference surface is a relay stage on which the component P supplied from the first component supply unit 6 is temporarily placed. 26. Accordingly, provision of the intermediate stage 26 allows the component P to be temporarily placed before being mounted on the board 2 .
  • the second reference member having the second reference surface is a substrate pressing member that presses and positions the substrate 2 supported from below by the backup pins 98 from above. 95. Accordingly, the substrate pressing member 95 can be used as a reference member for setting the second reference height H2.
  • the component mounting apparatus 1 of Embodiment 1 is a component mounting apparatus that mounts a component P at the mounting point of the board 2 carried into the work area A, holds the component P, and mounts it on the board 2.
  • a servo motor 56 that raises and lowers the mounted nozzle 40
  • a height detector 120 mounted nozzle height detector
  • the control unit 35 determines the mounting point based on the height of the mounting nozzle 40 detected by the height detection unit 120 when the mounting nozzle 40 holding the component P mounts the component P at the mounting point and the thickness of the component P.
  • the mounting point height measuring unit 132 Based on the mounting point height measuring unit 132 that measures the height of the mounting point height measuring unit 132 and the heights of the plurality of mounting points measured by the mounting point height measuring unit 132, the estimated height of the mounting point where the component P is not mounted is calculated. Based on the calculated mounting point height estimator 134 and the estimated height of the mounting point and the thickness of the component P mounted at the mounting point, the mounting nozzle 40 holding the component P is lowered toward the mounting point.
  • a target position calculation unit that calculates the target height (Z2) and a motor control unit 112 that controls the servo motor 56 based on the target height (Z2) are provided.
  • the component mounting method of the first embodiment is a component mounting method for mounting the component P on the mounting point of the board 2 carried into the work area A, and the control unit 35 controls the mounting nozzle 40 holding the component P.
  • the component P is mounted on the mounting point of the substrate 2 under control, and the mounting nozzle 40 mounts the component P on the mounting point using the height detection unit 120 that detects the height of the mounting nozzle 40 by the control unit 35.
  • the height of the mounting point is measured based on the height of the mounting nozzle 40 detected by the height detection unit 120 and the thickness of the component P when the mounting nozzle 40 is mounted, and the control unit 35 controls the measured heights of the plurality of mounting points.
  • the control unit 35 calculates the component P based on the estimated height of the mounting point and the thickness of the component P mounted at the mounting point.
  • a target height (Z2) for lowering the held mounting nozzle 40 toward the mounting point is calculated, and the control unit 35 operates the servo motor 56 for raising and lowering the mounting nozzle 40 based on the target height (Z2). Control to lower the mounting nozzle 40 toward the mounting point.
  • the height information of the mounting point measured when the mounting nozzle 40 mounts the component P on the mounting point is used to determine the height of other mounting points where the component P is not mounted.
  • the component can be mounted using the estimated height, and a dedicated measuring device for measuring the height of the mounting point becomes unnecessary. As a result, work efficiency can be improved while simplifying the component mounting apparatus 1 .
  • the relay stage 26 having the mounting surface 71 as the reference surface is further provided.
  • the control unit 35 further includes a reference height setting unit that sets the first reference height H1 based on the height detected by the height detection unit 120 when the lower end surface of the mounting nozzle 40 is brought into contact with the mounting surface 71. 130, the thickness of the component P is measured based on the height detected by the height detection unit 120 when the component P is sandwiched between the mounting surface 71 and the lower end surface of the mounting nozzle 40, and the reference height.
  • a component thickness measuring unit 128 is provided, and a mounting point height measuring unit 132 measures the height of the mounting point using the thickness of the component P measured by the component thickness measuring unit 128 .
  • the height of the mounting point can be accurately measured even if the thickness of the component P varies. can.
  • the reliability of the estimated mounting point height calculated by the mounting point height estimating unit 134 is improved, and highly reliable component mounting can be realized.
  • the component thickness measurement unit 128 detects the height detection unit 120 when the component P placed on the mounting surface 71 is picked up by the mounting nozzle 40 . calculates the thickness of the part P based on the height detected by . As a result, part thickness measurement and target height calculation can be executed in a series of operations from picking up the part P to mounting it.
  • some of the mounting points 170 are designated as a plurality of designated mounting points 172 for the mounting point height estimator 134 to calculate the estimated height.
  • the mounting point height estimation unit 134 calculates the estimated height of the mounting point 170 where the component P is not mounted, based on the heights obtained from the plurality of designated mounting points 172 . Accordingly, by setting the designated mounting point 172 in advance, the optimum mounting point 170 can be set as the designated mounting point 172, and the estimated height of the mounting point 170 calculated by the mounting point height estimation unit 134 can be calculated. reliability is improved.
  • the motor control unit 112 has the contact detection unit 118 that detects that the component P or the mounting nozzle 40 has come into contact with the mounting point 170, and the control unit
  • the control unit 35 controls the mounting nozzle 40 to descend until the contact detection unit 118 detects contact.
  • the mounting nozzle 40 is controlled to descend until reaching the target height (Z2) calculated by the target position calculation unit 136 .
  • the component P is mounted on the mounting points 170 other than the designated mounting point 172 without contact detection, so that the mounting time of the component P can be shortened and the productivity can be improved.
  • the substrate 176 includes a plurality of divided substrates 178, and a plurality of designated mounting points 180 are set for each divided substrate 178.
  • the substrate 176 includes a plurality of divided substrates 178, by setting a plurality of designated mounting points 180 for each divided substrate 178, the estimated height of the mounting points on the entire substrate 176 can be calculated with high accuracy. can be done.
  • the designated mounting points 172 and 204 are set to nine or more mounting points. As a result, the estimated height of the mounting point can be calculated with high accuracy.
  • Embodiment 2 A component mounting apparatus according to Embodiment 2 of the present invention and a component mounting method using the same will be described.
  • differences from the first embodiment will be mainly described, and descriptions overlapping with the first embodiment will be omitted.
  • Embodiment 2 is different from Embodiment 1 in that height measurement is also performed for mounting points other than the designated mounting points, and the estimated height of the board 2 is updated using newly obtained height information of the mounting points. .
  • FIG. 35 is a flowchart relating to component mounting processing according to the second embodiment.
  • step S27 and S28 are executed in the same manner as in the first embodiment, component mounting with contact detection is performed without determining whether or not the mounting point is the designated mounting point (S29). (S130, S131). Regardless of whether or not the mounting point is the designated mounting point, the control unit 35 starts lowering the mounting nozzle 40 (S130), and determines whether contact of the mounting nozzle 40 is detected (S131). Steps S130 and S131 are the same processes as steps S30 and S31 of the first embodiment, respectively.
  • FIG. 36 is a flowchart relating to mounting point height estimation processing according to the second embodiment.
  • step S143 is executed. Specifically, the control unit 35 determines whether or not to update the next turn (S143). If it is determined to update the next turn (YES in S143), steps S38 to S42 are executed again, and the mounting point data 148 (Z1) is updated also for the next turn (S42).
  • step S143 for example, a threshold is set for the number of updates, and if the number of updates is equal to or less than the threshold, it is determined that the next turn will be updated (YES in S143). may be determined not to update the next turn either (NO in S143). Alternatively, if the component P is not mounted at all the mounting points that the component mounting apparatus 1 takes charge of, it is determined that the next turn will be updated (YES in S143), and all the mounting points that the component mounting apparatus 1 takes charge of have the components. If P is mounted, it may be determined not to update the next turn either (NO in S143).
  • step S143 the mounting point height newly obtained in step S36 of FIG. Calculation can be performed (S41), and the mounting point data (Z1) can be continuously updated (S42).
  • the number of mounted parts P increases, the amount of original data for estimating the mounting point height increases. can be improved.
  • the flow shown in FIG. 36 ends.
  • the same processes as steps S32 and S33 of the flow shown in FIG. 29 may be performed instead of the processes of steps S130 and S131.
  • the mounting nozzle 40 can be lowered at high speed toward the target height (Z2) while calculating the target height (Z2) based on the more accurate estimated height of the mounting point. Processing can be performed accurately and at high speed.
  • the mounting point height measuring unit 132 also measures the height of mounting points other than the designated mounting point, and the mounting point height estimating unit 134 measures the height of the designated mounting point. and the newly measured height of the mounting point is used to calculate the estimated height of the other mounting point.
  • the mounting point height (measured value) 152 includes the measured value of the height of the designated mounting point as well as the measured value of the height of the mounting points other than the designated mounting point.
  • the mounting point height estimation unit 134 uses the height of the new mounting point obtained by the mounting point height measurement unit 132 to , calculate the estimated height of the mounting point where the component P is not mounted, and update the already calculated estimated height of the mounting point. Thereby, the accuracy of the estimated height can be improved.
  • FIG. 37 is a diagrammatic representation of FIG. 37 to 41.
  • FIG. 37 is a schematic plan view of a component mounting device 200 according to a modification.
  • a component mounting apparatus 200 shown in FIG. 37 is mainly different from Embodiments 1 and 2 in that it includes two relay stages 228A and 228B, two picking heads 212A and 212B, and two mounting heads 214A and 214B.
  • the XY table 217 comprises a first X-axis beam 218A, a second X-axis beam 218B, a third X-axis beam 220A and a fourth X-axis beam 220B.
  • a first X-axis beam 218A supports the first pick head 212A
  • a second X-axis beam 218B supports the second pick head 212B
  • a third X-axis beam 220A supports the first mounting head 214A
  • a fourth X-axis beam 220B supports the second mounting head 214B.
  • the first take-out head 212A, the first relay stage 228A and the first mounting head 214A are provided corresponding to the first component supply unit 6.
  • the second take-out head 212B, the second relay stage 228B and the second mounting head 214B are provided corresponding to the second component supply unit 8. As shown in FIG. According to such a configuration, it is possible to cope with the case where the second component supply unit 8 supplies minute components in the same way as the first component supply unit 6 does.
  • FIG. 38 is a schematic plan view of a component mounting device 300 according to another modified example.
  • a component mounting apparatus 300 shown in FIG. 38 mainly differs from the modified example shown in FIG. 37 in that only one mounting head 314 is provided.
  • the XY table 317 includes a first X-axis beam 218A, a second X-axis beam 218B, and a third X-axis beam 320 that supports the mounting head 314. As shown in FIG.
  • the first pick-up head 212A, the first relay stage 228A and the mounting head 314 are provided corresponding to the first component supply unit 6, and the second pick-up head 212B, the second relay stage 228B and the mounting head 314 are provided for the first component supply unit 6. It is provided corresponding to the two-component supply unit 8 .
  • the mounting head 314 can also be used for the two component supply units 6 and 8 .
  • FIG. 39 is a schematic plan view of a component mounting apparatus 400 according to still another modification.
  • a component mounting apparatus 400 shown in FIG. 39 is mainly different from the modified example shown in FIG. 38 in that it does not have a pick-up head and has only one mounting head 314 .
  • the XY table 417 has a third X-axis beam 320 that supports the mounting head 314 .
  • one mounting head 314 is used to take out the component P from the component supply units 6 and 8, place the component P on the relay stages 228A and 228B, and load the component P from the relay stages 228A and 228B. Picking up the component P and mounting the component P on the substrate 2 are all performed. Thereby, the structure of the component mounting apparatus 400 can be simplified.
  • FIG. 40 is a perspective view showing a mounting head 514 according to yet another modified example.
  • a mounting head 514 shown in FIG. 40 includes a head camera 516 , a plurality of mounting nozzles 540 , a plurality of shafts 542 and a body portion 544 .
  • the plurality of mounted nozzles 540 and the plurality of shafts 542 are each arranged in an annular shape and configured to be rotatable around a rotation axis G extending in the Z direction.
  • the rotary type mounting head 514 in which the plurality of mounting nozzles 540 are arranged in an annular shape may be used instead of the mounting head 14 .
  • the take-out head 12 may likewise be of the rotary type.
  • FIG. 41 is a schematic longitudinal sectional view showing a relay stage 626 according to yet another modified example.
  • a relay stage 626 shown in FIG. 41 includes a relay stage camera 628 , a temporary placement section 670 , a housing 674 , lighting 680 and a diffusion plate 682 .
  • the relay stage camera 628 is provided above the temporary placement section 670 instead of below the temporary placement section 670 .
  • the relay stage camera 628 is fixed with its imaging direction directed downward.
  • the temporary placement portion 670 is made of a transparent plate, and the light emitted by the illumination 680 can be diffused by the diffusion plate 682 and pass through the temporary placement portion 670 to illuminate the component P.
  • FIG. The relay stage camera 628 captures an image of the component P on the temporary placement section 670 located below the temporary placement section 670 at a timing when the picking head 12 or the mounting head 14 is not above the temporary placement section 670 .
  • the present invention is applicable to any component mounting device and component mounting method.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif de montage de composant (1) pour l'élimination d'un composant (P) à partir d'une unité d'alimentation en composants (6) et le montage de celui-ci sur un substrat (2) qui est pourvu : d'un étage de relais (26), une première unité de transfert de composant (12), une caméra d'étage de relais (28), une seconde unité de transfert de composant (14), et une unité de commande (35), l'unité de commande (35) exécutant : une première reconnaissance de composant, dans laquelle une première image est utilisée pour reconnaître de multiples composants (P) sur l'étage relais (26); des opérations de capture, séquentiellement par une buse de montage (40), dans laquelle la seconde unité de transfert de composants (14) est commandée et les résultats de la première reconnaissance de composant sont utilisés pour positionner une buse de montage (40) sur un composant (P) sur l'étage relais (26) et pour saisir le composant (P); des opérations de transport dans lesquelles la buse de montage (40) qui a prélevé le composant (P) est déplacé au-dessus du substrat (2); et des opérations de montage, séquentiellement par une buse de montage (40), dans laquelle le composant (P) maintenu par la buse de montage (40) est monté sur un point de montage sur le substrat (2).
PCT/JP2021/039694 2021-01-19 2021-10-27 Dispositif de montage de composant et procédé de montage de composant WO2022158076A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135992A (ja) * 1997-10-31 1999-05-21 Victor Co Of Japan Ltd 部品搭載装置
JP2009004400A (ja) * 2007-06-19 2009-01-08 Yamaha Motor Co Ltd 実装機および部品吸着装置
JP2010199630A (ja) * 2002-11-13 2010-09-09 Fuji Mach Mfg Co Ltd 電子部品実装方法および装置
JP2019029563A (ja) * 2017-08-01 2019-02-21 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135992A (ja) * 1997-10-31 1999-05-21 Victor Co Of Japan Ltd 部品搭載装置
JP2010199630A (ja) * 2002-11-13 2010-09-09 Fuji Mach Mfg Co Ltd 電子部品実装方法および装置
JP2009004400A (ja) * 2007-06-19 2009-01-08 Yamaha Motor Co Ltd 実装機および部品吸着装置
JP2019029563A (ja) * 2017-08-01 2019-02-21 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

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