WO2022151874A1 - 发热组件、电子雾化装置及发热组件的制备方法 - Google Patents

发热组件、电子雾化装置及发热组件的制备方法 Download PDF

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Publication number
WO2022151874A1
WO2022151874A1 PCT/CN2021/136168 CN2021136168W WO2022151874A1 WO 2022151874 A1 WO2022151874 A1 WO 2022151874A1 CN 2021136168 W CN2021136168 W CN 2021136168W WO 2022151874 A1 WO2022151874 A1 WO 2022151874A1
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Prior art keywords
porous ceramic
heating
heat
layer
heating layer
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PCT/CN2021/136168
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English (en)
French (fr)
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龙继才
周宏明
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深圳麦克韦尔科技有限公司
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Priority to EP21919065.9A priority Critical patent/EP4280814A4/en
Publication of WO2022151874A1 publication Critical patent/WO2022151874A1/zh
Priority to US18/349,874 priority patent/US20230346028A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/10—Devices using liquid inhalable precursors
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/50—Control or monitoring
    • A24F40/51—Arrangement of sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/03—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/04—Waterproof or air-tight seals for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/021—Heaters specially adapted for heating liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/022—Heaters specially adapted for heating gaseous material

Definitions

  • the present application relates to the technical field of atomizers, and in particular, to a heating component, an electronic atomization device and a method for preparing the heating component.
  • Porous materials generally have the advantages of low relative density, high specific strength, high specific surface area, light weight, and good permeability.
  • the electromagnetic and high thermal conductivity properties of metals make porous metal materials have good application value in functional fields such as sensors, electromagnetic shielding, electrode materials and heat exchange.
  • Porous ceramic materials have the characteristics of high temperature resistance, corrosion resistance, good air permeability, good biocompatibility and good environmental compatibility, which make them have important application value in the fields of fluid filtration, catalyst carriers and adsorption materials, especially for electronic in the atomizing device.
  • the structure of ceramic atomizing cores used in electronic atomization devices can be divided into two categories: one is a heating wire wound or embedded in a heating net on a porous ceramic substrate, and the other is a dense resistive heating thick film sintered on the porous ceramic substrate.
  • the ceramic atomizing cores of these two structures have a certain height and dense structure of the heating wire or the heating film, and the wettability between the metal and the substrate to be atomized is poor, so that the substrate to be atomized cannot be completely infiltrated during the working process.
  • dry burning, carbon deposition and hole blocking and burnt smell appear, which seriously affects the taste of the electronic atomization device.
  • the present application provides a heating component, an electronic atomization device and a method for preparing the heating component to solve the technical problem of poor wettability between the metal layer of the ceramic atomizing core and the substrate to be atomized in the prior art .
  • the first technical solution provided by the present application is to provide a heating component, including: a porous ceramic substrate and a heating layer; the porous ceramic substrate is used to guide the substrate to be atomized; the heating layer It is used for heating and atomizing the substrate to be atomized; the heat-generating layer has a porous structure; wherein, the heat-generating layer is partially filled in the porous ceramic substrate.
  • a part of the heat generating layer is filled in the porous ceramic substrate, and the other part is arranged outside the porous ceramic substrate.
  • the thickness of the part of the heat-generating layer disposed outside the porous ceramic base is 1-15 ⁇ m; the thickness of the part of the heat-generating layer filled into the porous ceramic base is 30-200 ⁇ m.
  • a part of the heat generating layer in the porous ceramic base is filled in the holes formed by the porous ceramic base, and a part is attached to the pore walls of the holes formed by the porous ceramic base.
  • the porosity of the heat generating layer is 20%-60%.
  • the heat generating layer includes one or more of metals, alloys and conductive ceramics.
  • the porosity of the porous ceramic substrate is 40%-75%, and the average pore diameter of the porous ceramic substrate is 10-40 ⁇ m.
  • the porous ceramic base also includes two electrodes arranged on the porous ceramic base at intervals for connecting the heating layer and the battery; the resistances of the two electrodes are both less than 0.1 ⁇ .
  • the resistance value of the heating component is 0.5 ⁇ -2.0 ⁇ .
  • the second technical solution provided by the present application is to provide an electronic atomization device, which includes: a heating component, wherein the heating component is any one of the heating components described above.
  • the third technical solution provided by the present application is to provide a preparation method of a heating component, including: obtaining a porous ceramic substrate; forming a heating layer with a porous structure on the surface of the porous ceramic substrate; The heat-generating layer is specifically formed by sintering the conductive paste, and the heat-generating layer is partially filled in the porous ceramic matrix.
  • the conductive paste includes conductive powder and an organic carrier
  • the conductive powder includes one or more of metals, alloys, and conductive ceramics
  • the organic carrier includes a main solvent, a thickener, and a flow control agent and surfactants.
  • the percentage of the conductive powder in the total mass of the conductive paste is 50%-90%, and the percentage of the organic vehicle in the total mass of the conductive paste is 10%-50%; the conductive paste
  • the viscosity is 10000Pa ⁇ S-1000000Pa ⁇ S.
  • the percentage of the main solvent to the total mass of the organic carrier is 70%-90%
  • the percentage of the thickener to the total mass of the organic carrier is 0.5%-20%
  • the flow control agent accounts for all the The percentage of the total mass of the organic carrier is 0.1%-10%
  • the percentage of the surfactant in the total mass of the organic carrier is 0%-5%.
  • the D50 (median particle size) of the conductive powder is not greater than 5 ⁇ m.
  • the sintering temperature is 700-1500°C.
  • the heating component in the present application includes a porous ceramic substrate and a heating layer
  • the porous ceramic substrate is used to guide the substrate to be atomized
  • the heating layer is used to heat and atomize the substrate to be atomized
  • the heat generating layer has a porous structure and a part of the heat generating layer is filled in the porous ceramic matrix.
  • Fig. 1 is the structural representation of the electronic atomization device provided by the application
  • FIG. 2 is a schematic structural diagram of a heating assembly provided by the present application.
  • FIG. 3 is a schematic cross-sectional view of an embodiment of a heating element provided by the present application.
  • FIG. 4 is a schematic cross-sectional view of another embodiment of the heating assembly provided by the present application.
  • FIG. 6 is a microscopic topography diagram of the surface of the heating component provided by the application under a scanning electron microscope;
  • FIG. 7 is a schematic diagram of the preparation process of the heating component provided by the present application.
  • FIG. 8 is a schematic diagram of the preparation process of the porous ceramic matrix in the heating element provided by the present application.
  • FIG. 9 is a schematic diagram of the preparation process of the heating layer in the heating assembly provided by the present application.
  • FIG. 10 is a microscopic topography diagram of the cross-section of the heating component provided by the application under a scanning electron microscope;
  • FIG. 11 is a microscopic topography diagram of a cross-section of a heating assembly in the prior art under a scanning electron microscope;
  • FIG. 12 is a schematic diagram of the product of the heating element provided in the present application.
  • first”, “second” and “third” in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second”, “third” may expressly or implicitly include at least one of that feature.
  • "a plurality of” means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear%) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings).
  • FIG. 1 is a schematic structural diagram of the electronic atomization device provided in the present application.
  • the electronic atomizer device includes an atomizer 1 and a power supply assembly 2 that are connected to each other.
  • the atomizer 1 includes a heating component 11 and a liquid reservoir 12; the liquid reservoir 12 is used to store the substrate to be atomized; the heating component 11 is used to heat and atomize the substrate to be atomized in the liquid reservoir 12 to form a Aerosol inhaled by the user.
  • the atomizer 1 can specifically be used to atomize the substrate to be atomized and generate aerosols for use in different fields, such as medical treatment, electronic aerosolization devices, etc.; in a specific embodiment, the atomizer 1 can be used for In the electronic aerosolization device, it is used to atomize the substrate to be atomized and generate aerosol for suction by the smoker.
  • the atomizer 1 It can also be used in hair spray equipment to atomize hair spray for hair styling; or in medical equipment for treating upper and lower respiratory diseases to atomize medical drugs.
  • the power supply assembly 2 includes a battery 21, a controller 22 and an airflow sensor 23; the battery 21 is used to power the atomizer 1, so that the atomizer 1 can atomize the liquid substrate to form an aerosol; the controller 22 is used to control the atomizer 1 works; the airflow sensor 23 is used to detect the change of airflow in the electronic atomizer device to start the electronic atomizer device.
  • the atomizer 1 and the power supply assembly 2 may be integrally provided, or may be detachably connected, and are designed according to specific needs.
  • FIG. 2 is a schematic structural diagram of the heating assembly provided by the present application.
  • the heating element 11 includes a porous ceramic substrate 13 and a heating layer 14 , the heating layer 14 is attached to the porous ceramic substrate 13 , and the heating layer 14 has a porous structure.
  • the porous ceramic substrate 13 contacts the substrate to be atomized from the liquid reservoir 12, and is guided to the heating layer 14 by capillary force, and the heating layer 14 heats and atomizes it to form an aerosol; that is, the porous ceramic substrate 13 It is used to guide the substrate to be atomized, and the heating layer 14 is used to heat the substrate to be atomized.
  • the heating layer 14 includes one or more of metals, alloys and conductive ceramics, as long as the heating layer 14 can realize heating and atomization of the substrate to be atomized. Among them, the heat generating layer 14 is partially filled in the porous ceramic base 13 .
  • the heating layer 14 in the heating element 11 By setting the heating layer 14 in the heating element 11 as a porous structure, the advantages of the porous material such as low relative density, high specific strength, high specific surface area, light weight and good permeability can be utilized. Further, the heating layer 14 is partially filled in the porous ceramic matrix 13, that is, the heating layer 14 and the porous ceramic matrix 13 are combined into one, so that the matrix to be atomized flows into the heating component 11 and is guided by the porous ceramic matrix 13 in the heating component 11. To the heating layer 14, the porous property of the heating layer 14 is utilized to make the substrate to be atomized almost completely infiltrate the heating layer 14, improve the wettability of the substrate to be atomized to the heating layer 14, and supply sufficient oil, thereby preventing the heating element 11 from drying out.
  • the porous property of the heating layer 14 is utilized to make the substrate to be atomized almost completely infiltrate the heating layer 14, improve the wettability of the substrate to be atomized to the heating layer 14, and supply sufficient oil, thereby preventing
  • the heating layer 14 can transfer heat to the surrounding substrate to be atomized in time for atomization, and the amount of smoke is large, and the surface temperature Relatively low, the content of harmful substances generated by high temperature decomposition during the atomization process of the atomized substrate will be greatly reduced, and the phenomenon of carbon deposition and hole blocking will also be greatly reduced, which can effectively improve the suction experience and enhance the electronic atomization device. safety and prolong its service life.
  • the heat generating layer 14 may be partially filled in the porous ceramic base 13 , and the other part may be disposed outside the porous ceramic base 13 ; or, the entire heat generating layer 14 may be filled in the porous ceramic base 13 . That is, in one embodiment, a part of the heat generating layer 14 is filled in the porous ceramic base 13 along its thickness direction, and the other part is arranged outside the porous ceramic base 13. For the specific structure, please refer to FIG. 3 (FIG. 3 is provided by the present application). In another embodiment, the heating layer 14 is completely filled in the porous ceramic substrate 13 along its thickness direction, and a surface of the heating layer 14 is connected to a surface of the porous ceramic substrate 13. Flush, the thickness of the heating layer 14 is smaller than the thickness of the porous ceramic substrate 13, and the specific structure is shown in FIG. The specific arrangement of the heat generating layer 14 and the porous ceramic base 13 can be selected according to requirements.
  • the thickness of the portion of the heat generating layer 14 filled into the porous ceramic base 13 is 30-200 ⁇ m, and the thickness of the portion of the heat-generating layer 14 disposed outside the porous ceramic base 13 is 1-15 ⁇ m.
  • the heating layer 14 is thinner than the surface of the porous ceramic substrate 13, and the distance that the atomized substrate climbs to the heating layer 14 after reaching the surface of the porous ceramic substrate 13 is shortened, which is beneficial for the substrate to be atomized to infiltrate the heating layer 14; 13 has many pores, and its shape is irregular.
  • the thickness of the heating layer 14 infiltrated into the porous ceramic substrate 13 is 30-200 ⁇ m, which is beneficial to the porous ceramic substrate 13 and the heating layer 14.
  • the thermal shock resistance during operation is improved, and the heat generating layer 14 is not easily separated from the porous ceramic substrate 13 .
  • the material of the heating layer 14 filled in the porous ceramic base 13 is partially filled in the holes formed by the porous ceramic base 13 to enhance the bonding strength between the heating layer 14 and the porous ceramic base 13; the other part is attached to the holes formed by the porous ceramic base 13.
  • the infiltrated heating layer 14 blocks the pores formed by the porous ceramic substrate 13, resulting in a significant decrease in the liquid storage capacity of the porous ceramic substrate 13, and at the same time, a channel is provided so that the substrate to be atomized can quickly reach the surface of the heating layer 14, and the effect is to the effect of timely fuel supply. That is, the material of the heat generating layer 14 filled in the porous ceramic base 13 is combined with the material of the porous ceramic base 13 , rather than partially embedding the heat generating layer 14 in the grooves formed on the surface of the porous ceramic base 13 .
  • FIG. 5 is a microscopic topography diagram of the surface of the heating element in the prior art under a scanning electron microscope
  • FIG. 6 is a microscopic topographic diagram of the surface of the heating element provided by the present application under a scanning electron microscope.
  • the porosity of the heat generating layer 14 is 20%-60%.
  • the conductive metal of the heating layer taking T29 as an example
  • the heating component is a dense material, and the area provided with the heating layer on the porous ceramic substrate completely covers it, and no exposed porous ceramic is observed. matrix.
  • the porosity of the heating layer 14 is set to 20%-60%, so that there are a large number of irregular holes on the heating layer 14, and some holes are The bare porous ceramic substrate 13 can be directly observed.
  • the surface of the heating layer 14 can be wetted along the exposed holes on the heating layer 14; when the heating element 11 is working, it can prevent the surface of the heating layer 14 from being overheated due to lack of oil. , reducing the generation of peculiar smells such as burnt odor, reducing the content of aldehydes and ketones in the aerosol, and the safety is good.
  • the heating layer 14 has sufficient substrates to be atomized, and the heating layer 14 can transmit energy to the nearby substrates to be atomized in time. It is beneficial to increase the amount of aerosol.
  • the porosity of the porous ceramic base 13 is set to 40%-75%, the average pore size of the porous ceramic base 13 is set to 10-40 ⁇ m, and the resistance The compressive strength is between 50N-500N.
  • the porosity of the porous ceramic body matrix 13 is not less than 40%, in order to ensure that enough substrate to be atomized can be stored in the porous ceramic body 13 for atomization.
  • the porosity of 13 is not higher than 75%, in order to ensure that the porous ceramic matrix 13 has sufficient strength. The higher the porosity, the lower the strength of the porous ceramic matrix 13, which cannot meet the assembly requirements. Too much matrix is more likely to leak.
  • the average pore size of the porous ceramic substrate 13 is greater than 10 ⁇ m, in order to ensure that the resistance slurry can flow into the pores formed by the porous ceramic substrate 13 smoothly, rather than filling the pores on the surface of the porous ceramic substrate 13, so that the heating layer 14 cannot penetrate into the porous ceramic substrate.
  • the structure of the ceramic matrix 13; and the average pore diameter of the porous ceramic matrix 13 is less than 40 ⁇ m, in order to prevent the resistance slurry from infiltrating too much into the porous ceramic matrix 13, causing waste of the resistance slurry, and at the same time, the larger pore size also easily leads to the porous ceramic matrix 13.
  • the resistance slurry on the surface flows into the holes in large quantities, the surface of the porous ceramic substrate 13 is insufficiently covered, and the resistance value does not meet the requirements. Poor stability.
  • the heating element 11 also includes two electrodes 15 arranged on the porous ceramic base 13 at intervals for connecting the heating layer 14 and the battery 21; that is, one end of the electrode 15 is connected to the heating layer 14, and the other end is connected to the battery 21 connections.
  • the electrode 15 is connected with the heating layer 14 to form a complete resistance device.
  • the controller 22 controls whether the battery 21 supplies power to the heating layer 14 according to the detection result of the airflow sensor 23 . After the battery 21 supplies power to the heating layer 14 , the heating layer 14 starts to work.
  • the resistances of the two electrodes 15 are both less than 0.1 ⁇ , so as to avoid heating of the electrodes 15 as much as possible, resulting in wasted energy, and to prevent damage to the components of the electrodes 15 and the heating layer 14 in contact therewith.
  • the bonding strength of the electrode 15 and the porous ceramic substrate 13 is greater than or equal to 5MPa, preventing the electrode 15 from falling off the porous ceramic substrate 13, prolonging the service life of the heating element 11, and improving the performance of the electronic atomization device.
  • FIG. 7 is a schematic diagram of the preparation process of the heating element provided by the present application
  • FIG. 8 is a schematic diagram of the preparation process of the porous ceramic matrix in the heating element provided by the present application
  • the manufacturing method of the heating element 11 includes:
  • the ceramic powder is prepared, and the porous ceramic matrix 13 is formed by sintering.
  • the preparation method of the porous ceramic substrate 13 includes:
  • the raw materials for preparing the porous ceramic matrix 13 include ceramic powder and organic carrier.
  • Ceramic powders include but are not limited to alumina, calcium oxide, silica, magnesium oxide and sodium oxide; organic carriers include but are not limited to paraffin, polypropylene, polyethylene, vegetable oil, oleic acid, microcrystalline wax, beeswax, stearic acid .
  • the mass percentage of the ceramic powder in the total mass of the raw materials of the porous ceramic matrix 13 is 40%-68%.
  • the ceramic powder is composed of 5%-15% alumina, 5%-30% calcium oxide, 20%-60% silicon oxide, 5%-20% magnesium oxide, 1%-15% sodium oxide ;
  • the organic carrier is composed of 40%-65% paraffin, 5%-30% microcrystalline wax, 5%-15% beeswax, 5%-20% polyethylene, 5%-20% polypropylene, 1%-10% stearin Acid composition. Among them, the percentage is the mass percentage.
  • the temperature and mixing time of the internal mixer can be selected as required.
  • step S012 The product obtained by banburying in step S012 is cooled and crushed to obtain an injection material.
  • the injection material is added to the hopper, and the molding blank is obtained by the injection machine.
  • the process conditions are: mold temperature 12-50 degrees, injection temperature 110-200 degrees, injection pressure 10-100Mpa.
  • step S013 Move the molded body obtained by injection molding in step S013 into the degreasing furnace, first heat the degreasing furnace to 160-250 degrees at a speed of 0.5-4 degrees per minute, and keep the temperature for 1-4 hours; then at 0.5-5 degrees per minute It is heated to 250-450 degrees at a speed of 1-3 hours, and kept for 1-3 hours; then it is heated to 600 degrees at a rate of 1-3 degrees/min, and kept for 2-3 hours; finally, it is cooled to room temperature.
  • the embryo body obtained by degreasing in step S014 is heated to a sintering temperature of 850-1250 degrees in stages at different heating rates of 0.5-5 degrees per minute, kept for 1-6 hours, and sintered at normal pressure. It can be understood that in the staged heating process, the heating rate of each stage is the same. After cooling in the furnace, a porous ceramic substrate 13 is obtained.
  • a heat-generating layer with a porous structure is formed on the surface of the porous ceramic substrate.
  • a heat-generating layer 14 having a porous structure is formed on the surface of the porous ceramic base 13, the heat-generating layer 14 is specifically sintered with a conductive slurry, and the heat-generating layer 14 is partially filled in the porous ceramic base 13;
  • the preparation method includes:
  • the functional phase raw materials of the conductive powder include one or more of conductive metals, alloys, and conductive ceramics such as Ag, Pd, Pt, Au, Ru, Ni, Cu, Ti, RuO2, and TiB2.
  • the above-mentioned functional phase raw materials are mixed to obtain conductive powder, and the D50 (median particle size) of the conductive powder is less than or equal to 5 ⁇ m.
  • the D50 of the conductive powder is controlled to be less than 5 microns, because the conductive powder is small in size and light in weight, the conductive powder is more likely to adhere to the pore walls of the holes formed by the porous ceramic matrix 13, which is more conducive to the formation of the present application.
  • the heating element 11 is provided.
  • the organic carrier includes a main solvent, a thickener, a flow control agent and a surfactant, and the main solvent, the thickener, the flow control agent and the surfactant are mixed uniformly to obtain the organic carrier.
  • the main solvent is one or more of terpineol, tributyl citrate, butyl carbitol and butyl carbitol acetate;
  • the thickener is ethyl cellulose;
  • the flow control agent is hydrogenated castor oil , one or more of polyamide wax;
  • the surfactant is one or more of polyvinyl butyral, span-85 and lecithin.
  • the percentage of the main solvent in the total mass of the organic carrier is 70-90%, the percentage of the thickener in the total mass of the organic carrier is 0.5%-20%, and the percentage of the flow control agent in the total mass of the organic carrier is 0.1%-10% %, the percentage of surfactant in the total mass of the organic carrier is 0-5%.
  • the main solvent, thickener, flow control agent and surfactant in the organic carrier and their proportions are selected according to needs.
  • the conductive powder accounts for 50%-90% of the total mass of the conductive paste, and the organic carrier accounts for 10%-50% of the total mass of the conductive paste.
  • the viscosity of the conductive paste is 10000Pa ⁇ S-1000000Pa ⁇ S, the viscosity testing instrument is AMETEK BROOKFIELD DV3THBCJ0, the rotor is CPA-52Z, and the speed is 1RPM.
  • the porous ceramic substrate 13 is loaded into the screen printing fixture, the conductive paste is coated on the porous ceramic substrate 13 by screen printing, and then the heating element 11 in which part of the heating layer 14 infiltrates into the porous ceramic substrate 13 is obtained by flowing and drying.
  • the preform, that is, the heating layer 14 is formed on the surface of the porous ceramic base 13, as shown in FIG. 10 (FIG. 10 is the microscopic topography of the section of the heating component provided in this application under the scanning electron microscope), and the sintered metal layer 14 is partially provided In the porous ceramic substrate 13; compared with the prior art, as shown in FIG. 11 (FIG.
  • the metal layer 14 is attached to the surface of the porous ceramic substrate 13, It does not penetrate into the porous ceramic matrix 13 , which improves the wettability between the heating layer 14 and the porous ceramic matrix 13 , so that the heating layer 14 and the porous ceramic matrix 13 are integrated into one.
  • spraying physical vapor deposition (PVD), chemical vapor deposition (CVD), etc., or a combination of multiple processes can be used to prepare the heat generating layer 14, and the specific process can be selected according to needs.
  • the resting time of the flow level is at least 3min, to ensure that the conductive paste can fully penetrate into the porous ceramics under the capillary force of the porous ceramics and the traction of the conductive paste gravity, forming a structure in which the heating layer 14 partially penetrates into the porous ceramics substrate 13 .
  • the drying temperature is controlled at 30-70°C, and the drying time is 15min-30min; the drying temperature is greater than 30°C, in order to ensure that the solvent in the organic carrier in the conductive paste can volatilize quickly, so that the conductive paste can be cured; the drying temperature The temperature is lower than 70°C, in order to prevent the viscosity of the conductive paste from rapidly decreasing at high temperature, the fluidity of the conductive paste increases, and a large amount of the conductive paste flows into the pores of the porous ceramic, resulting in insufficient coverage of the slurry on the surface of the porous ceramic substrate 13, which further increases the resistance of the heating layer 14. too large.
  • Ag, Pd, Pt, Au, Ru, and Ni are mixed to obtain conductive powder, and the D50 of the conductive powder is 3 microns.
  • the conductive powder is mixed with an organic carrier to obtain a conductive paste with a viscosity of 100,000 Pa ⁇ S; wherein, the conductive powder accounts for 90% of the total mass of the conductive paste, and the organic carrier accounts for 10% of the total mass of the conductive paste.
  • the conductive paste was coated on the porous ceramic substrate 13 by screen printing, and then was allowed to stand for 3 minutes in a flow state and dried at 60° C. to form a heating layer 14 with a porous structure on the surface of the porous ceramic substrate 13, and some of the heating layers were formed. 14 is filled in the porous ceramic matrix 13 .
  • the heating layer 14 and the porous ceramic substrate 13 are combined into one body, thereby facilitating the infiltration of the entire heating layer 14 by the substrate to be atomized.
  • Electrodes are formed on the surface of the porous ceramic substrate, and a heating element is obtained after sintering.
  • Electrode paste can choose conductive paste purchased from the market, or can be self-made. Put the heating element 11 prefab into the screen printing fixture, coat the electrode slurry on the porous ceramic substrate by screen printing, let it flow for 5 minutes after the screen printing, and dry it at a temperature of 20°C-200°C for 10min-30min, so that Two electrodes 15 are formed on the porous ceramic base 13 , and the two electrodes 15 are respectively connected to the front and rear ends of the heating layer 14 . Then, the heating element 11 of the present application is obtained by sintering at a temperature of 700° C.-1500° C., as shown in FIG. 12 ( FIG. 12 is a product schematic diagram of the heating element provided by the present application). In other embodiments, the electrode 15 can also be prepared by spraying, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc., and the specific process can be selected as required.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • the heating component in this application includes a porous ceramic substrate and a heating layer, the porous ceramic substrate is used to guide the substrate to be atomized, the heating layer is used to heat and atomize the substrate to be atomized, the heating layer has a porous structure and a part of the heating layer is filled in in a porous ceramic matrix.
  • the heating layer is set as a porous structure, and filling part of the heating layer in the porous ceramic matrix, the wettability between the porous ceramic matrix and the heating layer is improved, so that the substrate to be atomized and the heating layer are in more sufficient contact, which is beneficial to the heating layer in time.
  • the heat is transferred to the surrounding substrate to be atomized, which increases the amount of aerosol, and avoids the phenomenon of dry burning, carbon deposition, hole blocking, and burnt smell, and improves the user's experience.

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Abstract

本申请公开了一种发热组件、电子雾化装置及发热组件的制备方法，发热组件包括多孔陶瓷基体和发热层，多孔陶瓷基体用于导引待雾化基质，发热层用于加热雾化待雾化基质，发热层为多孔结构且发热层的一部分填充在多孔陶瓷基体中。通过将发热层设置为多孔结构，并将部分发热层填充在多孔陶瓷基体中，提高多孔陶瓷基体与发热层的浸润性，使得待雾化基质与发热层接触更加充分，有利于发热层及时将热量传输给其周围的待雾化基质，增大气溶胶量，提高用户的使用体验感。本申请还公开了一种发热组件的制备方法以制备上述结构的发热组件。

Description

发热组件、电子雾化装置及发热组件的制备方法
相关申请的交叉引用
本申请基于2021年01月13日提交的中国专利申请2021100441273主张其优先权，此处通过参照引入其全部的记载内容。
技术领域
本申请涉及雾化器技术领域，具体是涉及一种发热组件、电子雾化装置及发热组件的制备方法。
背景技术
多孔材料一般具有相对密度低、比强度高、比表面积高、重量轻、渗透性性好等优点。金属的电磁及高热导特性，使多孔金属材料在传感器、电磁屏蔽、电极材料和热交换等功能领域具有良好的应用价值。多孔陶瓷材料耐高温、耐腐蚀、透气性好、生物相容性好、环境相容性好的特点使其在流体过滤、催化剂载体和吸附材料等领域具有重要的应用价值，特别是用于电子雾化装置中。
目前，用于电子雾化装置的陶瓷雾化芯结构可分为两类：一是多孔陶瓷基体上缠绕发热丝或嵌入发热网，二是多孔陶瓷基体上烧结一层致密电阻发热厚膜。这两种结构的陶瓷雾化芯因为发热丝或者发热膜具有一定的高度且结构致密，而金属与待雾化基质之间的浸润性较差，导致工作过程中，待雾化基质无法完全浸润发热丝或者发热膜表面而出现干烧、积碳堵孔以及焦味等现象，严重影响电子雾化装置的口感。
发明内容
有鉴于此，本申请提供一种发热组件、电子雾化装置及发热组件的制备方法，以解决现有技术中陶瓷雾化芯的金属层与待雾化基质之间浸润性较差的技术问题。
为了解决上述技术问题，本申请提供的第一个技术方案为：提供一种发热组件，包括：多孔陶瓷基体和发热层；所述多孔陶瓷基体用于导引待雾化基质；所述发热层用于加热雾化待雾化基质；所述发热层为多孔结构；其中，所述发热层部分填充在所述多孔陶瓷基体中。
其中，所述发热层沿着厚度方向，一部分填充在所述多孔陶瓷基体中，另一部分设置于所述多孔陶瓷基体外。
其中，所述发热层设置于所述多孔陶瓷基体外的部分的厚度为1-15μm；所述发热层填充至所述多孔陶瓷基体中的部分的厚度为30-200μm。
其中，在所述多孔陶瓷基体中的所述发热层一部分填充在所述多孔陶瓷基体形成的孔洞中，一部分附着于所述多孔陶瓷基体形成的孔洞的孔壁上。
其中，所述发热层的孔隙率为20％-60％。
其中，所述发热层包括金属、合金以及导电陶瓷中的一种或多种。
其中，所述多孔陶瓷基体的孔隙率为40％-75％，所述多孔陶瓷基体的平均孔径为10-40μm。
其中，还包括间隔设置于所述多孔陶瓷基体上的两个电极，用于连接所述发热层与电池；两个所述电极的阻值均小于0.1Ω。
其中，所述发热组件的阻值为0.5Ω-2.0Ω。
为了解决上述技术问题，本申请提供的第二个技术方案为：提供一种电子雾化装置，包括：发热组件，所述发热组件为上述任意一项所述的发热组件。
为了解决上述技术问题，本申请提供的第三个技术方案为：提供一种发热组件的制备方法，包括：获取多孔陶瓷基体；在所述多孔陶瓷基体表面形成具有多孔结构的发热层；所述发热层具体通过导电浆料烧结而成，且所述发热层部分填充在所述多孔陶瓷基体中。
其中，所述导电浆料包括导电粉体和有机载体，所述导电粉体包括金属、合金、导电陶瓷中的一种或多种，所述有机载体包括主溶剂、增稠剂、流动控制剂和表面活性剂。
其中，所述导电粉体占所述导电浆料总质量的百分比为50％-90％， 所述有机载体占所述导电浆料总质量的百分比为10％-50％；所述导电浆料的粘度为10000Pa·S-1000000Pa·S。
其中，所述主溶剂占所述有机载体总质量的百分比为70％-90％，所述增稠剂占所述有机载体总质量的百分比为0.5％-20％，所述流动控制剂占所述有机载体总质量的百分比为0.1％-10％，所述表面活性剂占所述有机载体总质量的百分比为0％-5％。
其中，所述导电粉体的D50(中值粒径)不大于5μm。
其中，所述烧结温度为700～1500℃。
本申请的有益效果：区别于现有技术，本申请中的发热组件包括多孔陶瓷基体和发热层，多孔陶瓷基体用于导引待雾化基质，发热层用于加热雾化待雾化基质，发热层为多孔结构且发热层的一部分填充在多孔陶瓷基体中。通过将发热层设置为多孔结构，并将部分发热层填充在多孔陶瓷基体中，提高多孔陶瓷基体与发热层的浸润性，使得待雾化基质与发热层接触更加充分，有利于发热层及时将热量传输给其周围的待雾化基质，增大气溶胶量，且避免了干烧、积碳堵孔以及焦味等现象，提高用户的使用体验感。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本申请提供的电子雾化装置的结构示意图；
图2是本申请提供的发热组件的结构示意图；
图3是本申请提供的发热组件的一实施方式的截面示意图；
图4是本申请提供的发热组件的另一实施方式的截面示意图；
图5是现有技术中发热组件的表面在扫描电镜下微观形貌图；
图6是本申请提供的发热组件的表面在扫描电镜下微观形貌图；
图7是本申请提供的发热组件的制备流程示意图；
图8是本申请提供的发热组件中多孔陶瓷基体的制备流程示意 图；
图9是本申请提供的发热组件中发热层的制备流程示意图；
图10是本申请提供的发热组件的截面在扫描电镜下微观形貌图；
图11是现有技术中发热组件的截面在扫描电镜下微观形貌图；
图12是本申请提供的发热组件的产品示意图。
具体实施方式
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。本申请实施例中的术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或组件。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解 的是，本文所描述的实施例可以与其它实施例相结合。
请参阅图1，是本申请提供的电子雾化装置的结构示意图。
电子雾化装置可用于等液态基质的雾化。电子雾化装置包括相互连接的雾化器1和电源组件2。
雾化器1包括发热组件11和储液器12；储液器12用于存储待雾化基质；发热组件11用于将储液器12中的待雾化基质加热雾化，以形成可供用户吸食的气溶胶。该雾化器1具体可用于雾化待雾化基质并产生气溶胶，以用于不同的领域，比如，医疗、电子气溶胶化装置等；在一具体实施例中，该雾化器1可用于电子气溶胶化装置，用于雾化待雾化基质并产生气溶胶，以供抽吸者抽吸，以下实施例均以此为例；当然，在其他实施例中，该雾化器1也可应用于喷发胶设备，以雾化用于头发定型的喷发胶；或者应用于治疗上下呼吸系统疾病的医用设备，以雾化医用药品。
电源组件2包括电池21、控制器22和气流传感器23；电池21用于为雾化器1供电，以使得雾化器1能够雾化液态基质形成气溶胶；控制器22用于控制雾化器1工作；气流传感器23用于检测电子雾化装置中气流变化以启动电子雾化装置。
雾化器1与电源组件2可以是一体设置，也可以是可拆卸连接，根据具体需要进行设计。
请参阅图2，是本申请提供的发热组件的结构示意图。
发热组件11包括多孔陶瓷基体13和发热层14，发热层14附着于多孔陶瓷基体13上，发热层14为多孔结构。多孔陶瓷基体13接触到来自储液器12中的待雾化基质，利用毛细作用力将其导引至发热层14，发热层14对其进行加热雾化形成气溶胶；即，多孔陶瓷基体13用于导引待雾化基质，发热层14用于加热待雾化基质。发热层14包括金属、合金以及导电陶瓷中的一种或多种，只需发热层14能够实现对待雾化基质的加热雾化即可。其中，发热层14部分填充在多孔陶瓷基体13中。
通过将发热组件11中的发热层14设置为多孔结构，可以利用多孔材料的相对密度低、比强度高、比表面积高、重量轻、渗透性好等 优点。进一步，将发热层14部分填充在多孔陶瓷基体13中，即将发热层14与多孔陶瓷基体13复合为一体，使待雾化基质流入发热组件11，被发热组件11中的多孔陶瓷基体13导引至发热层14，利用发热层14的多孔性能，以使待雾化基质几乎完全浸润发热层14，提高待雾化基质对发热层14的浸润性，供油充分，从而避免发热组件11出现干烧、积碳堵孔、焦味等现象，提高电子雾化装置的口感；加热雾化时发热层14可及时将热量传递给周围的待雾化基质而进行雾化，烟雾量大，表面温度相对较低，待雾化基质雾化过程中因高温分解产生的有害物质含量将会极大降低，其积碳堵孔现象也会大大降低，可以有效地改善抽吸体验以及提升电子雾化装置的安全性，并延长其使用寿命。
可以理解的是，发热层14可以是部分填充在多孔陶瓷基体13中，另一部分可以是设置于多孔陶瓷基体13外；或者，也可以是整个发热层14填充在多孔陶瓷基体13中。即，在一种实施方式中，发热层14沿着其厚度方向，一部分填充在多孔陶瓷基体13中，另一部分设置于多孔陶瓷基体13外，具体结构参见图3(图3是本申请提供的发热组件的一实施方式的截面示意图)；在另一种实施方式中，发热层14沿着其厚度方向完全填充在多孔陶瓷基体13中，发热层14的一表面与多孔陶瓷基体13的一表面平齐，发热层14的厚度小于多孔陶瓷基体13的厚度，具体结构参见图4(图4是本申请提供的发热组件的另一实施方式的截面示意图)。发热层14与多孔陶瓷基体13的具体设置方式根据需要进行选择。
具体地，发热层14填充至多孔陶瓷基体13中的部分的厚度为30-200μm，发热层14设置于多孔陶瓷基体13外的部分的厚度为1-15μm。发热层14高于多孔陶瓷基体13表面厚度较小，待雾化基质到达多孔陶瓷基体13表面后爬升至发热层14上的距离缩短，有利于待雾化基质浸润发热层14；由于多孔陶瓷基体13的孔多，且其形貌不规则，将发热层14下渗至多孔陶瓷基体13中的厚度为30-200μm，这有利于多孔陶瓷基体13与发热层14形成良好的机械咬合，使其在工作过程中的抗热震性能提高，发热层14不易与多孔陶瓷基体13分 离。发热层14填充在多孔陶瓷基体13中的材料，一部分填充在多孔陶瓷基体13形成的孔洞中，增强发热层14与多孔陶瓷基体13的结合强度；另一部分附着于多孔陶瓷基体13形成的孔洞的孔壁上，避免了下渗的发热层14堵塞多孔陶瓷基体13形成的孔洞，造成多孔陶瓷基体13的储液量明显下降，同时提供通道使待雾化基质可快速到达发热层14表面，起到及时供油的效果。也就是说，发热层14填充在多孔陶瓷基体13中的材料与多孔陶瓷基体13的材料复合在一起，而不是将发热层14部分嵌在多孔陶瓷基体13表面形成的凹槽中。
请参阅图5和图6，图5是现有技术中发热组件的表面在扫描电镜下微观形貌图，图6是本申请提供的发热组件的表面在扫描电镜下微观形貌图。
发热层14的孔隙率为20％-60％。参见图5，现有技术中，发热组件中发热层(以T29为例)的导电金属为致密材料，多孔陶瓷基体上设置有发热层的区域将其完全覆盖，并未观察到裸露的多孔陶瓷基体。而本申请提供的发热组件11，参见图6，在300倍扫描电镜下，通过将发热层14的孔隙率设置为20％-60％，使得发热层14上存在大量不规则的孔，部分孔洞可以直接观察到裸露的多孔陶瓷基体13。待雾化基质浸润多孔陶瓷基体13后，可顺着发热层14上裸露出的孔洞润湿发热层14表面；当发热组件11工作时，可避免发热层14表面由于缺油而导致温度偏高，减少焦味等异味产生，降低气溶胶中的醛酮类含量，安全性好，同时发热层14周围待雾化基质充足，发热层14可将能量及时传给其附近的待雾化基质，有利于气溶胶量增大。
由于发热层14通过电阻浆料烘干烧结的方式附着于多孔陶瓷基体13上，多孔陶瓷基体13的空隙率设置为40％-75％，多孔陶瓷基体13的平均孔径设置为10-40μm，抗压强度在50N-500N之间。多孔陶瓷体基体13的孔隙率不低于40％，是为了保证多孔陶瓷基体13中可储存足够的待雾化基质用于雾化，孔隙率过低容易导致缺油干烧；多孔陶瓷体基体13的孔隙率不高于75％，是为了保证多孔陶瓷基体13具备足够的强度，孔隙率越高，多孔陶瓷基体13强度越低，无法满足装配要求，同时孔隙率越高，储存的待雾化基质过多，更容 易漏液。多孔陶瓷基体13的平均孔径大于10μm，是为了保证电阻浆料可以较顺利的流入多孔陶瓷基体13形成的孔洞中，而不是填充在多孔陶瓷基体13表面的孔中，无法实现发热层14渗入多孔陶瓷基体13结构；而多孔陶瓷基体13的平均孔径小于40μm，是为了防止电阻浆料过多的渗入多孔陶瓷基体13中，造成电阻浆料的浪费，同时孔径较大也易导致多孔陶瓷基体13表面的电阻浆料大量流入孔洞，覆盖多孔陶瓷基体13表面不足，阻值达不到要求，电阻浆料与多孔陶瓷基体13烧结后形成的发热层14连续性较差，电阻在工作过程中的稳定性较差。
可以理解的是，发热组件11还包括间隔设置于多孔陶瓷基体13上的两个电极15，用于连接发热层14与电池21；即，电极15的一端与发热层14连接，另一端与电池21连接。电极15与发热层14连接构成完整的电阻器件。控制器22根据到气流传感器23的检测结果控制电池21是否向发热层14供电，电池21向发热层14供电后，发热层14开始工作。两个电极15的阻值均小于0.1Ω，尽可能避免电极15发热，造成能量浪费，且防止电极15部件及与其接触的发热层14损坏。电极15与多孔陶瓷基体13的结合强度大于等于5MPa，防止电极15从多孔陶瓷基体13上脱落，延长发热组件11的使用寿命，进而提高电子雾化装置的性能。
请参阅图7-图9，图7是本申请提供的发热组件的制备流程示意图，图8是本申请提供的发热组件中多孔陶瓷基体的制备流程示意图，图9是本申请提供的发热组件中发热层的制备流程示意图。
发热组件11的制作方法包括：
S01：获取多孔陶瓷基体。
准备好陶瓷粉料，通过烧结制成多孔陶瓷基体13。具体地，多孔陶瓷基体13的制备方法包括：
S011：获取制备多孔陶瓷基体的原料。
制备多孔陶瓷基体13的原料包括陶瓷粉体和有机载体。陶瓷粉体包括但不限于氧化铝、氧化钙、氧化硅、氧化镁和氧化钠；有机载体包括但不限于石蜡、聚丙烯、聚乙烯、植物油、油酸、微晶蜡、蜂 蜡、硬脂酸。陶瓷粉体占多孔陶瓷基体13原料总质量的质量百分比为40％-68％。
在一实施方式中，陶瓷粉体由5％-15％氧化铝、5％-30％氧化钙、20％-60％氧化硅、5％-20％氧化镁、1％-15％氧化钠组成；有机载体由40％-65％石蜡、5％-30％微晶蜡、5％-15％蜂蜡、5％-20％聚乙烯、5％-20％聚丙烯、1％-10％硬脂酸组成。其中，百分比为质量百分比。
S012：对多孔陶瓷基体的原料进行密炼。
将密炼机温度调至60-180度，将10-80重量份的有机载体分次加入密炼室进行密炼，同时将100重量份的陶瓷粉体分次加入密炼室内进行密炼，20-60分钟后关闭密炼室。可以理解的是，有机载体和陶瓷粉体通过等量分次加入密炼室。密炼机的温度和密炼时间可以根据需要进行选择。
S013：对密炼产物注射成型。
将步骤S012密炼得到的产物冷却，并进行碎料，得到注射料。将注射料加于料斗，通过注射机得到成型坯体。工艺条件为：模温12-50度，射出温度110-200度，射出压力10-100Mpa。
S014：对注射成型的胚体进行脱脂。
将步骤S013注射成型得到的成型胚体移入脱脂炉内，先将脱脂炉以0.5-4度/分钟的速度升温至160-250度，并保温1-4小时；再以0.5-5度/分钟的速度升温至250-450度，并保温1-3小时；再以1-3度/分钟的速度升温至600度，并保温2-3小时；最后冷却至室温。
S015：烧结得到多孔陶瓷基体。
将步骤S014脱脂得到的胚体以0.5-5度/分钟的不同升温速率，分阶段升温至烧结温度850-1250度，保温1-6小时，采用常压烧结。可以理解，分阶段升温过程中，每一阶段的升温速率相同。随炉冷却，得到多孔陶瓷基体13。
S02：在多孔陶瓷基体表面形成具有多孔结构的发热层。
具体地，在多孔陶瓷基体13表面形成具有多孔结构的发热层14，发热层14具体通过导电浆料烧结而成，且发热层14部分填充在多孔陶瓷基体13中；制备方法包括：
S021：获取导电粉体。
导电粉体的功能相原料包括Ag、Pd、Pt、Au、Ru、Ni、Cu、Ti、RuO2、TiB2等具有导电性的金属、合金、导电陶瓷中的一种或多种。将上述功能相原料进行混合得到导电粉体，导电粉体的D50(中值粒径)小于等于5μm。将导电粉体的D50控制在5微米以下，是因为导电粉体的体积小、质量轻，则导电粉体更容易附着在多孔陶瓷基体13形成的孔洞的孔壁上，更有利于形成本申请提供的发热组件11。
S022：获取有机载体。
有机载体包括主溶剂、增稠剂、流动控制剂和表面活性剂，将主溶剂、增稠剂、流动控制剂和表面活性剂混合均匀得到有机载体。主溶剂为松油醇、柠檬酸三丁酯、丁基卡必醇、丁基卡必醇醋酸酯中的一种或多种；增稠剂为乙基纤维素；流动控制剂为氢化蓖麻油、聚酰胺腊中的一种或多种；表面活性剂为聚乙烯醇缩丁醛、司班-85、卵磷脂中的一种或多种。主溶剂占有机载体的总质量的百分比为70-90％，增稠剂占有机载体的总质量的百分比为0.5％-20％，流动控制剂占有机载体的总质量的百分比为0.1％-10％，表面活性剂占有机载体的总质量的百分比为0-5％。有机载体中主溶剂、增稠剂、流动控制剂和表面活性剂及其比例关系，根据需要进行选择。
S023：将有机载体和导电粉体混合得到导电浆料。
导电粉体占导电浆料总质量百分比为50％-90％，有机载体占导电浆料总质量百分比为10％-50％。导电浆料的粘度为10000Pa·S-1000000Pa·S，粘度测试仪器为AMETEK BROOKFIELD DV3THBCJ0，转子CPA-52Z,转速1RPM。
S024：将导电浆料涂覆在多孔陶瓷基体上。
将多孔陶瓷基体13装入丝印夹具中，通过丝网印刷将导电浆料涂覆在多孔陶瓷基体13上，然后经流平静置、烘干得到部分发热层14渗入多孔陶瓷基体13的发热组件11预制件，即在多孔陶瓷基体13表面形成发热层14，如图10所示(图10是本申请提供的发热组件的截面在扫描电镜下微观形貌图)，烧结后的金属层14部分设置于多孔陶瓷基体13中；较现有技术，如图11所示(图11是现有技 术中发热组件的截面在扫描电镜下微观形貌图)，金属层14附着于多孔陶瓷基体13表面，并未渗入多孔陶瓷基体13中，提高了发热层14与多孔陶瓷基体13的浸润性，使发热层14与多孔陶瓷基体13复合为一体。在其他实施方式中，也可以采用喷涂、物理气相沉积工艺(PVD)、化学气相沉积工艺(CVD)等方式，也可以多种工艺搭配使用制备发热层14，具体工艺可以根据需要进行选择。
其中，流平静置时间至少为3min，保证导电浆料可以在多孔陶瓷的毛细作用力、导电浆料重力的牵引作用下充分渗透进多孔陶瓷内部，形成发热层14部分渗入多孔陶瓷基体13的结构。烘干温度控制在30-70℃，烘干时间15min-30min；烘干温度大于30℃，是为了保证导电浆料中的有机载体中的溶剂能快速挥发，使导电浆料固化；烘干温度小于70℃，是为了防止导电浆料高温下粘度快速降低，导电浆料流动性增加，大量流入多孔陶瓷的孔洞中，造成多孔陶瓷基体13表面浆料覆盖不足，进而使得发热层14的阻值偏大。
在一实施方式中，将Ag、Pd、Pt、Au、Ru、Ni混合得到导电粉体，导电粉体的D50为3微米。选用松油醇和丁基卡必醇作为主溶剂，选用乙基纤维素作为增稠剂，选用氢化蓖麻油作为流动控制剂，选用聚乙烯醇缩丁醛作为表面活性剂，混合得到有机载体；其中，主溶剂占有机载体的总质量的百分比为85％，增稠剂占有机载体的总质量的百分比为8％，流动控制剂占有机载体的总质量的百分比为4％，表面活性剂占有机载体的总质量的百分比为3％。将导电粉体与有机载体混合得到导电浆料，其粘度为100000Pa·S；其中，导电粉体占导电浆料总质量百分比为90％，有机载体占导电浆料总质量百分比为10％。通过丝网印刷将导电浆料涂覆在多孔陶瓷基体13上，然后经流平静置3min、在60℃下烘干以在多孔陶瓷基体13表面形成具有多孔结构的发热层14，且部分发热层14填充在多孔陶瓷基体13中。
通过使用本申请提供的多孔陶瓷基体13表面形成发热层14的制备方法，使得发热层14的与多孔陶瓷基体13复合为一体，进而有利于待雾化基质浸润整个发热层14。
S03：在多孔陶瓷基体表面形成电极，烧结后得到发热组件。
获取电极浆料，电极浆料可以选择市场购买的导电浆料，也可以自制。将发热组件11预制件装入丝印夹具中，通过丝网印刷将电极浆料涂覆多孔陶瓷基体上，丝印后流平静置5min，在20℃-200℃的温度下烘干10min-30min，以在多孔陶瓷基体13上形成两个电极15，且两个电极15分别与发热层14的首尾两端相连。然后，在700℃-1500℃的温度下烧结，得到本申请的发热组件11，如图12所示(图12是本申请提供的发热组件的产品示意图)。在其他实施方式中，也可以采用喷涂、物理气相沉积工艺(PVD)、化学气相沉积工艺(CVD)等方式制备电极15，具体工艺可以根据需要进行选择。
本申请中的发热组件包括多孔陶瓷基体和发热层，多孔陶瓷基体用于导引待雾化基质，发热层用于加热雾化待雾化基质，发热层为多孔结构且发热层的一部分填充在多孔陶瓷基体中。通过将发热层设置为多孔结构，并将部分发热层填充在多孔陶瓷基体中，提高多孔陶瓷基体与发热层的浸润性，使得待雾化基质与发热层接触更加充分，有利于发热层及时将热量传输给其周围的待雾化基质，增大气溶胶量，且避免了干烧、积碳堵孔以及焦味等现象，提高用户的使用体验感。
以上所述仅为本申请的部分实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (16)

  1. 一种发热组件，其中，包括：
    多孔陶瓷基体，用于导引待雾化基质；
    发热层，用于加热雾化待雾化基质；所述发热层为多孔结构；其中，所述发热层部分填充在所述多孔陶瓷基体中。
  2. 根据权利要求1所述的发热组件，其中，所述发热层沿着厚度方向，一部分填充在所述多孔陶瓷基体中，另一部分设置于所述多孔陶瓷基体外。
  3. 根据权利要求2所述的发热组件，其中，所述发热层设置于所述多孔陶瓷基体外的部分的厚度为1-15μm；所述发热层填充至所述多孔陶瓷基体中的部分的厚度为30-200μm。
  4. 根据权利要求2所述的发热组件，其中，在所述多孔陶瓷基体中的所述发热层一部分填充在所述多孔陶瓷基体形成的孔洞中，一部分附着于所述多孔陶瓷基体形成的孔洞的孔壁上。
  5. 根据权利要求1所述的发热组件，其中，所述发热层的孔隙率为20％-60％。
  6. 根据权利要求1所述的发热组件，其中，所述发热层包括金属、合金以及导电陶瓷中的一种或多种。
  7. 根据权利要求1所述的发热组件，其中，所述多孔陶瓷基体的孔隙率为40％-75％，所述多孔陶瓷基体的平均孔径为10-40μm。
  8. 根据权利要求1所述的发热组件，其中，还包括间隔设置于所述多孔陶瓷基体上的两个电极，用于连接所述发热层与电池；两个所述电极的阻值均小于0.1Ω。
  9. 根据权利要求1所述的发热组件，其中，所述发热组件的阻值为0.5Ω-2.0Ω。
  10. 一种电子雾化装置，其中，包括发热组件，所述发热组件为权利要求1-9任意一项所述的发热组件。
  11. 一种发热组件的制备方法，其中，包括：
    获取多孔陶瓷基体；
    在所述多孔陶瓷基体表面形成具有多孔结构的发热层；所述发热层具体通过导电浆料烧结而成，且所述发热层部分填充在所述多孔陶瓷基体中。
  12. 根据权利要求11所述的发热组件的制备方法，其中，所述导电浆料包括导电粉体和有机载体，所述导电粉体包括金属、合金、导电陶瓷中的一种或多种，所述有机载体包括主溶剂、增稠剂、流动控制剂和表面活性剂。
  13. 根据权利要求12所述的发热组件的制备方法，其中，所述导电粉体占所述导电浆料总质量的百分比为50％-90％，所述有机载体占所述导电浆料总质量的百分比为10％-50％；所述导电浆料的粘度为10000Pa·S-1000000Pa·S。
  14. 根据权利要求12所述的发热组件的制备方法，其中，所述主溶剂占所述有机载体总质量的百分比为70％-90％，所述增稠剂占所述有机载体总质量的百分比为0.5％-20％，所述流动控制剂占所述有机载体总质量的百分比为0.1％-10％，所述表面活性剂占所述有机载体总质量的百分比为0％-5％。
  15. 根据权利要求12所述的发热组件的制备方法，其中，所述导电粉体的中值粒径不大于5μm。
  16. 根据权利要求11所述的发热组件的制备方法，其中，所述烧结温度为700-1500℃。
PCT/CN2021/136168 2021-01-13 2021-12-07 发热组件、电子雾化装置及发热组件的制备方法 WO2022151874A1 (zh)

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