WO2022127651A1 - 发热组件及电子雾化装置 - Google Patents

发热组件及电子雾化装置 Download PDF

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WO2022127651A1
WO2022127651A1 PCT/CN2021/136170 CN2021136170W WO2022127651A1 WO 2022127651 A1 WO2022127651 A1 WO 2022127651A1 CN 2021136170 W CN2021136170 W CN 2021136170W WO 2022127651 A1 WO2022127651 A1 WO 2022127651A1
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Prior art keywords
dielectric layer
layer
heating
porous ceramic
glass phase
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PCT/CN2021/136170
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English (en)
French (fr)
Inventor
陈鹏
郑良福
吴振兴
蒋金峰
杜靖
卜桂华
谢建声
Original Assignee
深圳麦克韦尔科技有限公司
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Publication of WO2022127651A1 publication Critical patent/WO2022127651A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/50—Control or monitoring
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/50—Control or monitoring
    • A24F40/51—Arrangement of sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels

Definitions

  • the present application relates to the technical field of atomizers, and in particular, to a heating component and an electronic atomization device.
  • the ceramic atomizing cores of electronic atomization devices are printed on a porous ceramic substrate with nickel-chromium or iron-chromium-aluminum.
  • the content of chromium in the metal film of the ceramic atomizing core is relatively high, generally about 20% by weight. .
  • the design of high chromium content is mainly to ensure that a protective chromium oxide passivation film can be formed on the surface of the metal film during use to prevent the metal film from being corroded during the atomization process.
  • the present application provides a heating component and an electronic atomization device, so as to solve the potential safety hazard brought by the metal film of the ceramic atomization core to the user of the electronic atomization device in the prior art.
  • the first technical solution provided by the present application is to provide a heating component, comprising: a porous ceramic substrate, a heating layer and a first dielectric layer; the heating layer and the porous ceramic substrate are attached and arranged; A dielectric layer is attached and disposed on the surface of the heat generating layer away from the porous ceramic substrate; the first dielectric layer includes a glass phase and a non-glass phase inorganic non-metallic material.
  • a second medium layer is further included, and the second medium layer is attached and disposed on the surface of the heat generating layer close to the porous ceramic substrate.
  • it further includes a third medium layer, the third medium layer is attached and arranged on the surface of the first medium layer away from the heat generating layer; and a plurality of through holes are arranged on the third medium layer.
  • the weight percentage of the glass phase in the first dielectric layer, the second dielectric layer and the third dielectric layer is 77%-93%
  • the non-glass phase inorganic non-metallic material has a weight percentage of 77%-93%.
  • the weight percentage is 7%-23%.
  • the glass phase is a SiO 2 -ZnO-BaO system.
  • the non-glass phase inorganic non-metallic material is one or more of SiO 2 , Al 2 O 3 , and SiC, and the particle size of the inorganic non-metallic material is 1 ⁇ m-20 ⁇ m.
  • the thicknesses of the first dielectric layer, the second dielectric layer and the third dielectric layer are 5 ⁇ m-60 ⁇ m.
  • the patterns of the first dielectric layer, the second dielectric layer and the third dielectric layer are the same.
  • the raw material of the heat-generating layer is a metal or non-metal conductive phase
  • the thickness of the heat-generating layer is 5 ⁇ m-60 ⁇ m.
  • the raw material of the heating layer is one or more of silver-based alloy, nickel-based alloy, iron-based alloy, titanium-based alloy and zirconium-based alloy.
  • the second technical solution provided by the present application is to provide an electronic atomization device, which includes: a heating component, wherein the heating component is any one of the heating components described above.
  • the heating component in the present application includes a porous ceramic substrate, a heating layer and a first dielectric layer, the heating layer and the porous ceramic substrate are attached to each other, and the first dielectric layer is attached to the heating element.
  • the layer is remote from the surface of the porous ceramic substrate, and the first dielectric layer includes a glass phase, a non-glass phase inorganic non-metallic material and an organic carrier.
  • the heating layer can be made of materials without harmful heavy metals, which minimizes the effect of the material of the heating layer in the heating component on the electronic atomization. Safety hazard posed by the user of the device.
  • Fig. 1 is the structural representation of the electronic atomization device provided by the application
  • FIG. 2 is a schematic structural diagram of a first embodiment of a heating assembly provided by the present application.
  • FIG. 3 is a schematic flowchart of a manufacturing method of a heating component in the first embodiment of the heating component provided by the present application;
  • FIG. 4 is a schematic structural diagram of a second embodiment of a heating assembly provided by the present application.
  • FIG. 5 is a schematic flowchart of a method for manufacturing a heating component in the second embodiment of the heating component provided by the present application
  • step S03 is a topography diagram of step S03 in the second embodiment of the heating element provided by the present application.
  • step S04 is a topography diagram of step S04 in the second embodiment of the heating element provided by the present application.
  • step S05 is a structural diagram of step S05 in the second embodiment of the heating component provided by the present application.
  • FIG. 9 is a schematic structural diagram of a third embodiment of a heating assembly provided by the present application.
  • FIG. 10 is a schematic flowchart of a manufacturing method of a heating element in the third embodiment of the heating element provided by the present application.
  • first”, “second” and “third” in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second”, “third” may expressly or implicitly include at least one of that feature.
  • "a plurality of” means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear%) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings).
  • FIG. 1 is a schematic structural diagram of the electronic atomization device provided in the present application.
  • the electronic atomization device can be used for the atomization of liquid substrates such as smoke liquid and medicinal liquid.
  • the electronic atomizer device includes an atomizer 1 and a power supply assembly 2 that are connected to each other.
  • the nebulizer 1 is used for storing the substrate to be atomized and atomizing the substrate to be atomized to form an aerosol that can be inhaled by a user.
  • the atomizer 1 can specifically be used to atomize the substrate to be atomized and generate aerosols for use in different fields, such as medical treatment, electronic aerosolization devices, etc.; in a specific embodiment, the atomizer 1 can be used for In the electronic aerosolization device, it is used to atomize the substrate to be atomized and generate aerosol for suction by the smoker.
  • the atomizer 1 It can also be used in hair spray equipment to atomize hair spray for hair styling; or in medical equipment for treating upper and lower respiratory diseases to atomize medical drugs.
  • the atomizer 1 includes a heating component 11 and a liquid storage tank 12, the liquid storage tank 12 is used for storing the substrate to be atomized, and the heating component 11 is used for heating and atomizing the substrate to be atomized in the liquid storage tank 12.
  • the power supply assembly 2 includes a battery 21, a controller 22 and an airflow sensor 23; the battery 21 is used to power the atomizer 1, so that the atomizer 1 can atomize the liquid substrate to form an aerosol; the controller 22 is used to control the atomizer 1 works; the airflow sensor 23 is used to detect the change of airflow in the electronic atomizer device to start the electronic atomizer device.
  • the atomizer 1 and the power supply assembly 2 may be integrally provided, or may be detachably connected, and are designed according to specific needs.
  • FIG. 2 is a schematic structural diagram of the first embodiment of the heating assembly provided by the present application.
  • the heating element 11 includes a porous ceramic substrate 13 , a heating layer 14 and a first dielectric layer 15 .
  • the heating layer 14 is attached to the porous ceramic substrate 13
  • the first dielectric layer 15 is attached to the surface of the heating layer 14 away from the porous ceramic substrate 13 .
  • the heating layer 14 may be a metal film, a metal wire, a metal mesh or other heating circuits, which can be selected as required.
  • the first dielectric layer 15 can be a glass phase, a ceramic film layer, etc. that are stable in the substrate to be atomized or the aerosol that has been atomized, which can block the contact between the substrate to be atomized or the aerosol that has been atomized and the heating layer 14. Can.
  • the first dielectric layer 15 includes a glass phase and a non-glass phase inorganic non-metallic material.
  • the glass phase accounts for 77%-93% of the total weight of the first dielectric layer 15, and the non-glass phase inorganic non-metallic material accounts for 7%-23% of the total weight of the first dielectric layer 15.
  • the first dielectric layer 15 is prepared by drying the first slurry, the first slurry includes a glass phase, a non-glass phase inorganic non-metallic material and an organic carrier, and the organic carrier includes a resin and a solvent. During the drying process of the first slurry, the organic carrier continues to volatilize. Therefore, the first dielectric layer 15 includes a glass phase and a non-glass phase inorganic non-metallic material. The difference between the first dielectric layer 15 and the first slurry lies in whether or not an organic vehicle is contained.
  • the non-glass phase inorganic non-metal material is a high-melting point inorganic non-metal material (melting point is greater than 1800° C.), and its melting point is higher than that of the glass phase.
  • the weight percentage of the glass phase in the total weight of the first paste is 50%-70%, and the non-glass phase inorganic non-metallic material in the total weight of the first paste is 5%-15% by weight,
  • the weight percentage of the organic vehicle in the total weight of the first slurry is 25%-35%.
  • the glass phase is a SiO 2 -ZnO-BaO system, which can be better matched with the porous ceramic matrix 13 to prevent the first slurry from generating stress during high-temperature sintering and causing the first dielectric layer 15 Microcracks are generated;
  • the glass phase system is not limited to the SiO 2 -ZnO-BaO system, other systems such as SiO 2 -CaO-ZnO, SiO 2 -ZnO-R 2 O, SiO 2 -B 2 O 3 , etc. can be realized.
  • the specific material can be selected according to the sintering process of the porous ceramic matrix 13 and the first slurry.
  • the non-glass phase inorganic non-metallic material includes SiO 2
  • the non-glass phase inorganic non-metallic material has a particle size of 1 ⁇ m-20 ⁇ m, which can better reduce the expansion and contraction of the first slurry during high-temperature sintering
  • the non-glass phase inorganic non-metallic material is not limited to SiO 2 , and can be realized by Al 2 O 3 , ZrO 2 , SiC, etc. with similar functions.
  • the non-glass phase inorganic non-metallic material can be selected according to needs.
  • the organic vehicle includes a resin and a solvent.
  • Resins include ethyl cellulose
  • solvents include terpineol and butyl carbitol acetate systems, both terpineol and butyl carbitol acetate are good solvents for ethyl cellulose, terpineol and butyl carbitol acetate
  • the combination of esters can control the volatility and leveling of the first slurry, while terpineol and butyl carbitol acetate can adjust the viscosity of the organic carrier, and the appropriate viscosity can fully wet the glass phase and non-glass phase inorganic non- Metal material to improve the printability of the first paste.
  • terpineol accounts for 50%-70% of the total weight of the organic carrier
  • butyl carbitol acetate accounts for 27%-42% of the total weight of the organic carrier
  • ethyl cellulose accounts for the total weight of the organic carrier.
  • the weight percentage by weight is 3%-8%.
  • the resin can also be cellulose acetate butyrate, acrylic resin, polyvinyl butyral, etc.
  • the solvent can also be butyl carbitol, diethylene glycol dibutyl ether, triethylene glycol butyl ether, Alcohol ester 12, tributyl citrate, tripropylene glycol butyl ether, etc.
  • the specific material composition of resin and solvent can be selected according to needs.
  • the pH value of the substrate to be atomized is usually 3.9-10.2, and the atomization temperature is usually 200-350°C.
  • the substrate to be atomized is extremely corrosive at the atomization temperature.
  • the content of chromium in the raw material of the heating layer 14 is usually increased to form a protective chromium oxide passivation film on the surface of the heating layer 14 .
  • Chromium is a harmful heavy metal. The accumulation of heavy metals in human organs such as liver, kidney, and lung will cause damage to corresponding organs and threaten the health of users.
  • the performance of the heating layer 14 is affected, so that the heating layer 14 cannot accurately respond to the control signal of the controller 22, and the temperature actually reached by the heating layer 14 is different from the temperature that the controller 22 controls. There is a difference in temperature, or the temperature actually reached by the heating layer 14 is unstable, which affects the concentration of volatile aroma in the aerosol, which in turn affects the consistency of the taste of the atomized aerosol and reduces the user's experience.
  • the material of the first dielectric layer 15 enables it to exist stably in the substrate to be atomized or the atomized aerosol, and is hardly corroded by the substrate to be atomized or the atomized aerosol.
  • the first dielectric layer 15 can block the substrate to be atomized or atomized
  • the good aerosol is in contact with the heating layer 14, which greatly reduces the corrosion of the substrate to be atomized or the atomized aerosol to the heating layer 14, and prolongs its service life; and then reduces the impact on the heavy metal content (such as the heating layer 14 material). chrome) requirements.
  • the heating layer 14 can use any metal or non-metal conductive phase that meets the functional requirements, which greatly improves product safety; , metal or non-metal conductive phase without harmful heavy metals can be selected.
  • the material of the heating layer 14 does not contain toxic heavy metals; the heating layer 14 can be made of biomedical materials, such as titanium-based alloys, zirconium-based alloys, nickel-based alloys, silver-based alloys, iron-based alloys, etc.
  • the layer 14 is easy to sinter, has high safety, and has excellent dry and wet burning properties.
  • FIG. 3 is a schematic flowchart of a manufacturing method of a heating element in the first embodiment of the heating element provided by the present application.
  • the manufacturing method of the heating element 11 includes:
  • Step S01 obtaining a porous ceramic substrate.
  • the ceramic powder is prepared, and the porous ceramic matrix 13 is made by screen printing and sintering.
  • Step S02 forming a heat generating layer on the surface of the porous ceramic.
  • the raw materials for forming the heating layer 14 are made into resistance paste; the resistance paste is screen-printed on the surface of the porous ceramic base 13; under the air atmosphere, the porous ceramic base 13 and the resistance paste are placed in a certain Baking at a temperature (60-80° C.) to form a heat-generating layer 14 on the surface of the porous ceramic substrate 13 .
  • the main component of the resistor paste is nickel.
  • the thickness of the heat generating layer 14 is 5 ⁇ m-60 ⁇ m.
  • Step S03 forming a first dielectric layer on the surface of the heat generating layer away from the porous ceramic substrate.
  • the raw material for forming the first dielectric layer 15 is made into a first slurry; the first slurry is screen-printed on the surface of the heating layer 14 away from the porous ceramic substrate 13; in an air atmosphere, the porous ceramic
  • the base 13 , the heat-generating layer 14 and the first slurry are dried at a certain temperature (60-80° C.) to form a first dielectric layer 15 on the surface of the heat-generating layer 14 away from the porous ceramic base 13 .
  • the thickness of the first dielectric layer 15 It is 5 ⁇ m-60 ⁇ m, and the resistance value is 0.7 ⁇ -0.9 ⁇ .
  • the first paste includes a glass phase, a non-glass phase inorganic non-metallic material and an organic vehicle, and the organic vehicle includes a resin and a solvent.
  • the glass phase is a SiO 2 -ZnO-BaO system, and the weight percentage of the glass phase in the total weight of the first paste is 50%-70%;
  • the non-glass phase inorganic non-metallic materials include SiO 2 , and the non-glass phase
  • the particle size of the inorganic non-metallic material is 1 ⁇ m-20 ⁇ m, the weight percentage of the non-glass phase inorganic non-metallic material in the total weight of the first slurry is 5%-15%;
  • the weight percentage of the organic carrier in the total weight of the first slurry is 25%-35%,
  • the organic carrier includes resin and solvent, the resin includes ethyl cellulose, the solvent includes terpineol and butyl carbitol acetate system, the weight percentage of ethyl cellulose in the total weight of the organic
  • Step S04 The porous ceramic substrate, the heat generating layer and the first dielectric layer are formed into an integral structure by sintering.
  • the porous ceramic substrate 13, the heat-generating layer 14 and the first dielectric layer 15 are sintered at a certain temperature (the maximum temperature is 1100°C, and the sintering time is 30 minutes), that is, the porous ceramic substrate 13, the heat-generating layer 14 are sintered by a co-firing process. It forms an integral structure with the first dielectric layer 15 .
  • the patterns of the first dielectric layer 15 and the heat generating layer 14 are the same.
  • the porous ceramic substrate 13, the heat generating layer 14 and the first dielectric layer 15 can be formed by spraying, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc., or can be used in combination with various processes ;
  • the porous ceramic substrate 13, the heating layer 14 and the first dielectric layer 15 can also be formed into an integrated structure by a non-co-firing process, which can be selected according to needs.
  • the heating layer 14 of the heating component 11 needs to be provided with pins to be electrically connected to the battery 21, and the pins are coated with silver paste to prevent the pins from being corroded by the substrate to be atomized or the aerosol that has been atomized. Play a protective role; other metal coatings can also be used to protect the pins, which can be selected according to needs.
  • the heating element 11, the heating element No. 1 and the heating element No. 2 in the first embodiment are compared, and the advantages and disadvantages of their performances are proved by implementation.
  • the heating element No. 1 is composed of a porous ceramic base 13 and a heating layer 14, wherein the main material of the heating layer 14 is nickel;
  • the heating element No. 2 is composed of a porous ceramic base 13 and a heating layer 14. Nickel Chrome.
  • the heating component 11 in the first embodiment of the present application is referred to as heating component No. 3;
  • the material is nickel, and the main material of the first dielectric layer 15 is Si-Zn-Ba glass system.
  • FIG. 4 is a schematic structural diagram of the second embodiment of the heating element provided by the present application.
  • the structure of the heating element 11 is basically the same as that in the first embodiment, the difference is that the heating element 11 further includes a second dielectric layer 16 .
  • the heating element 11 includes a porous ceramic substrate 13 , a heating layer 14 , a first dielectric layer 15 and a second dielectric layer 16 .
  • the second dielectric layer 16 is attached to the surface of the heating layer 14 close to the porous ceramic substrate 13 , and the second dielectric layer 16 is attached to the porous ceramic substrate 13 .
  • the second medium layer 16 can be a glass phase, inorganic non-metallic composite material, ceramic film, etc. that are stable in the matrix to be atomized or the aerosol to be atomized, which can block the matrix to be atomized or the aerosol that is atomized from interacting with the atomized aerosol.
  • the contact between the heating layer 14 and the film-base bonding force of the heating layer 14 ie, the bonding force between the heating layer 14 and other elements in the heating assembly) can be improved.
  • the second dielectric layer 16 includes a glass phase and a non-glass phase inorganic non-metallic material.
  • the glass phase accounts for 77%-93% of the total weight of the second dielectric layer 16
  • the non-glass phase inorganic non-metallic materials account for 7%-23% of the total weight of the second dielectric layer 16.
  • the second dielectric layer 16 is prepared by drying the second slurry, the second slurry includes a glass phase, a non-glass phase inorganic non-metallic material and an organic vehicle, and the organic vehicle includes a resin and a solvent. During the drying process of the second slurry, the organic carrier continues to volatilize. Therefore, the second dielectric layer 16 includes a glass phase and a non-glass phase inorganic non-metallic material. The difference between the second dielectric layer 16 and the second slurry is whether or not an organic vehicle is contained.
  • the non-glass phase inorganic non-metallic material is a high-melting point inorganic non-metal material (melting point greater than 1800° C.), and its melting point is higher than that of the glass phase.
  • the components and proportions of the second slurry and the first slurry are basically the same, and will not be repeated here.
  • the second dielectric layer 16 By arranging the second dielectric layer 16 between the heating layer 14 and the porous ceramic substrate 13, the second dielectric layer 16 is a dense layer, which blocks the contact between the substrate to be atomized near the surface of the porous ceramic substrate 13 and the heating layer 14 and the heating layer 14, The corrosion of the substrate to be atomized to the heating layer 14 is greatly slowed down.
  • the second dielectric layer 16 includes a first surface and a second surface disposed opposite to each other, the first surface and the heating layer 14 are attached to each other, the second surface is attached to the porous ceramic substrate 13, and the second dielectric layer 16 is attached to the heating layer. 14.
  • the bonding strength of the porous ceramic substrate 13 is greater than the bonding strength of the heating layer 14 and the porous ceramic substrate 13.
  • the bonding strength between the heating layer 14 and the porous ceramic substrate 13 is improved through the second dielectric layer 16, that is, the bonding force of the membrane substrate is improved. , thereby reducing the risk of the heat-generating layer 14 falling off, that is, improving the adverse effects caused by thermal vibration.
  • the non-glass phase inorganic non-metallic material in the second dielectric layer 16 acts as a skeleton, which can improve the matching and bonding force of the film base.
  • the ratio between the components in the second dielectric layer 16 can be selected according to the thermal expansion coefficients of the porous ceramic substrate 13 and the heating layer 14, so as to improve the bonding force of the film substrate and reduce the risk of the heating layer 14 falling off. In turn, the adverse effects caused by thermal vibration are improved. If the surface of the heating layer 14 close to the porous ceramic substrate 13 is less corroded by the substrate to be atomized, the bonding force between the heating layer 14 and the porous ceramic substrate 13 is strong, and the influence of thermal vibration on the membrane substrate is small.
  • the second dielectric layer 16 is not disposed between the layer 14 and the porous ceramic substrate 13, and the disposition of the second dielectric layer 16 is selected according to specific needs.
  • the materials of the first dielectric layer 15 and the second dielectric layer 16 enable them to exist stably in the substrate to be atomized or the atomized aerosol, and are hardly corroded by the substrate to be atomized or the atomized aerosol.
  • the first dielectric layer 15 and the second dielectric layer 16 can block the substrate to be atomized or the atomized aerosol from contacting the heating layer 14, which greatly reduces the amount of substrate to be atomized or the atomized aerosol.
  • the corrosion of the aerosol to the heating layer 14 prolongs its service life and reduces the requirement for the content of heavy metals (such as chromium) in the material of the heating layer 14 .
  • the heating layer 14 can use any metal or non-metal conductive phase that meets the functional requirements, which greatly improves product safety; even in order to cut off harmful heavy metals To avoid safety hazards or reduce costs, metal or non-metal conductive phases without harmful heavy metals can be selected.
  • the material of the heating layer 14 does not contain toxic heavy metals; the heating layer 14 can be made of biomedical materials, such as titanium-based alloys, zirconium-based alloys, nickel-based alloys, silver-based alloys, iron-based alloys, etc. 14 Easy sintering, high safety, excellent dry and wet sintering performance.
  • FIG. 5 is a schematic flowchart of a manufacturing method of a heating component in the second embodiment of the heating component provided by the present application.
  • the manufacturing method of the heating element 11 includes:
  • Step S01 obtaining a porous ceramic substrate.
  • the ceramic powder is prepared, and the porous ceramic matrix 13 is made by screen printing and sintering.
  • Step S02 forming a second dielectric layer on the surface of the porous ceramic.
  • the raw material for forming the second dielectric layer 16 is made into a second slurry; the second slurry is screen-printed on the surface of the porous ceramic base 13; in an air atmosphere, the porous ceramic base 13 and the first A slurry is dried at a certain temperature (60-80° C.) to form a second dielectric layer 16 on the surface of the porous ceramic substrate 13 , and the thickness of the second dielectric layer 16 is 5 ⁇ m-60 ⁇ m.
  • the second paste includes a glass phase, a non-glass phase inorganic non-metallic material and an organic vehicle, and the organic vehicle includes a resin and a solvent.
  • the glass phase is a SiO 2 -ZnO-BaO system, and the weight percentage of the glass phase in the total weight of the second paste is 50%-70%;
  • the non-glass phase inorganic non-metallic materials include SiO 2 , and the non-glass phase
  • the particle size of the inorganic non-metallic material is 1 ⁇ m-20 ⁇ m, the weight percentage of the non-glass phase inorganic non-metallic material in the total weight of the second slurry is 5%-15%;
  • the weight percentage of the organic carrier in the total weight of the second slurry is 25%-35%,
  • the organic carrier includes resin and solvent, the resin includes ethyl cellulose, the solvent includes terpineol and butyl carbitol acetate system, the weight percentage of ethyl cellulose in the total weight of the organic
  • Step S03 forming a heat generating layer on the surface of the second dielectric layer away from the porous ceramic substrate.
  • the raw materials for forming the heating layer 14 are made into resistance paste; the resistance paste is screen printed on the surface of the second dielectric layer 16 away from the porous ceramic base 13 ; under the air atmosphere, the porous ceramic base 13 , The second dielectric layer 16 and the resistive paste are dried at a certain temperature (60-80° C.) to form a heating layer 14 on the surface of the second dielectric layer 16 away from the porous ceramic substrate 13 .
  • the main component of the resistor paste is nickel.
  • the thickness of the heating layer 14 is 5 ⁇ m-60 ⁇ m, as shown in FIG. 6 ( FIG. 6 is a topography diagram of step S03 in the second embodiment of the heating element provided by the present application).
  • Step S04 forming a first dielectric layer on the surface of the heat generating layer away from the porous ceramic substrate.
  • the raw material for forming the first dielectric layer 15 is made into a first slurry; the first slurry is screen-printed on the surface of the heating layer 14 away from the porous ceramic substrate 13; in an air atmosphere, the porous ceramic
  • the base 13 , the second dielectric layer 16 , the heating layer 14 and the first slurry are dried at a certain temperature (60-80° C.) to form the first dielectric layer 15 on the surface of the heating layer 14 away from the porous ceramic base 13 .
  • the thickness of a dielectric layer 15 is 5 ⁇ m-60 ⁇ m, and the resistance value is 0.7 ⁇ -0.9 ⁇ , as shown in FIG.
  • the first paste includes a glass phase, a non-glass phase inorganic non-metallic material and an organic vehicle, and the organic vehicle includes a resin and a solvent.
  • the glass phase is a SiO 2 -ZnO-BaO system, and the weight percentage of the glass phase in the total weight of the first paste is 50%-70%;
  • the non-glass phase inorganic non-metallic materials include SiO 2 , and the non-glass phase
  • the particle size of the inorganic non-metallic material is 1 ⁇ m-20 ⁇ m, the weight percentage of the non-glass phase inorganic non-metallic material in the total weight of the first slurry is 5%-15%;
  • the weight percentage of the organic carrier in the total weight of the first slurry is 25%-35%,
  • the organic carrier includes resin and solvent, the resin includes ethyl cellulose, the solvent includes terpineol and butyl carbitol acetate system, the weight percentage of ethyl cellulose in the total weight of the organic
  • Step S05 The porous ceramic substrate, the second dielectric layer, the heat generating layer and the first dielectric layer are formed into an integral structure by sintering.
  • the porous ceramic substrate 13 , the second dielectric layer 16 , the heat generating layer 14 and the first dielectric layer 15 are sintered at a certain temperature (the maximum temperature is 1100° C., and the sintering time is 30 minutes), that is, the porous ceramic is made by a co-firing process.
  • the base body 13, the second dielectric layer 16, the heat generating layer 14 and the first dielectric layer 15 form an integral structure, as shown in FIG.
  • the patterns of the second dielectric layer 16 , the heat generating layer 14 and the first dielectric layer 15 are the same.
  • the porous ceramic substrate 13, the second dielectric layer 16, the heat generating layer 14 and the first dielectric layer 15 may be formed by spraying, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • Various processes can be used in combination; the porous ceramic substrate 13, the second dielectric layer 16, the heating layer 14 and the first dielectric layer 15 can also be formed into an integrated structure by a non-co-firing process, which can be selected according to needs.
  • FIG. 9 is a schematic structural diagram of the third embodiment of the heating element provided by the present application.
  • the structure of the heating element 11 is basically the same as that in the second embodiment, the difference is that the heating element 11 further includes a third dielectric layer 17 .
  • the heating element 11 includes a porous ceramic substrate 13 , a heating layer 14 , a first dielectric layer 15 , a second dielectric layer 16 and a third dielectric layer 17 .
  • the third dielectric layer 17 is attached to the surface of the second dielectric layer 16 away from the heat generating layer 14 .
  • the third dielectric layer 17 is provided with a plurality of through holes, so that the third dielectric layer 17 is formed into a grid shape, thereby increasing the atomization area of the atomization surface of the heating element 11 .
  • the substrate to be atomized enters the porous ceramic substrate 13 through the surface of the porous ceramic substrate 13 away from the heating layer 14 , and the substrate to be atomized is guided to the porous ceramic substrate 13 from the surface of the porous ceramic substrate 13 away from the heating layer 14 by its capillary force. to the surface close to the heat generating layer 14 .
  • the through holes on the third dielectric layer 17 can be used for storage.
  • the substrate to be atomized can prevent the heating element 11 from drying out and reduce the temperature of the heating layer 14 to a certain extent.
  • the third dielectric layer 17 can be a glass phase, an inorganic non-metallic composite material, a ceramic film layer, etc. that are stable in the matrix to be atomized or the aerosol that has been atomized.
  • the third dielectric layer 17 includes a glass phase and a non-glass phase inorganic non-metallic material.
  • the glass phase accounts for 77%-93% of the total weight of the third dielectric layer 17, and the non-glass phase inorganic non-metallic materials account for 7%-23% of the total weight of the third dielectric layer 17.
  • the third medium layer 17 is prepared by drying a third slurry, the third slurry includes a glass phase, a non-glass phase inorganic non-metallic material and an organic carrier, and the organic carrier includes a resin and a solvent. During the drying process of the third slurry, the organic carrier continues to volatilize. Therefore, the third dielectric layer 17 includes a glass phase and a non-glass phase inorganic non-metallic material. The difference between the third dielectric layer 17 and the third slurry lies in whether or not an organic vehicle is contained.
  • the non-glass phase inorganic non-metallic material is a high-melting point inorganic non-metal material (melting point greater than 1800° C.), and its melting point is higher than that of the glass phase.
  • the composition and ratio of the third slurry and the first slurry are basically the same, which will not be repeated.
  • FIG. 10 is a schematic flowchart of a manufacturing method of a heating element in the third embodiment of the heating element provided by the present application.
  • the manufacturing method of the heating element 11 includes:
  • Step S01 obtaining a porous ceramic substrate.
  • the ceramic powder is prepared, and the porous ceramic matrix 13 is made by screen printing and sintering.
  • Step S02 forming a second dielectric layer on the surface of the porous ceramic.
  • the raw material for forming the second dielectric layer 16 is made into a second slurry; the second slurry is screen-printed on the surface of the porous ceramic base 13; in an air atmosphere, the porous ceramic base 13 and the first A slurry is dried at a certain temperature (60-80° C.) to form a second dielectric layer 16 on the surface of the porous ceramic substrate 13 , and the thickness of the second dielectric layer 16 is 5 ⁇ m-60 ⁇ m.
  • the second paste includes a glass phase, a non-glass phase inorganic non-metallic material and an organic vehicle, and the organic vehicle includes a resin and a solvent.
  • the glass phase is a SiO 2 -ZnO-BaO system, and the weight percentage of the glass phase in the total weight of the second paste is 50%-70%;
  • the non-glass phase inorganic non-metallic materials include SiO 2 , and the non-glass phase
  • the particle size of the inorganic non-metallic material is 1 ⁇ m-20 ⁇ m, the weight percentage of the non-glass phase inorganic non-metallic material in the total weight of the second slurry is 5%-15%;
  • the weight percentage of the organic carrier in the total weight of the second slurry is 25%-35%,
  • the organic carrier includes resin and solvent, the resin includes ethyl cellulose, the solvent includes terpineol and butyl carbitol acetate system, the weight percentage of ethyl cellulose in the total weight of the organic
  • Step S03 forming a heat generating layer on the surface of the second dielectric layer away from the porous ceramic substrate.
  • the raw materials for forming the heating layer 14 are made into resistance paste; the resistance paste is screen printed on the surface of the second dielectric layer 16 away from the porous ceramic base 13 ; under the air atmosphere, the porous ceramic base 13 , The second dielectric layer 16 and the resistive paste are dried at a certain temperature (60-80° C.) to form a heating layer 14 on the surface of the second dielectric layer 16 away from the porous ceramic substrate 13 .
  • the main component of the resistor paste is nickel.
  • the thickness of the heat generating layer 14 is 5 ⁇ m-60 ⁇ m.
  • Step S04 forming a first dielectric layer on the surface of the heat generating layer away from the porous ceramic substrate.
  • the raw material for forming the first dielectric layer 15 is made into a first slurry; the first slurry is screen-printed on the surface of the heating layer 14 away from the porous ceramic substrate 13; in an air atmosphere, the porous ceramic
  • the base 13 , the second dielectric layer 16 , the heating layer 14 and the first slurry are dried at a certain temperature (60-80° C.) to form the first dielectric layer 15 on the surface of the heating layer 14 away from the porous ceramic base 13 .
  • the thickness of a dielectric layer 15 is 5 ⁇ m-60 ⁇ m, and the resistance value is 0.7 ⁇ -0.9 ⁇ .
  • the first paste includes a glass phase, a non-glass phase inorganic non-metallic material and an organic vehicle, and the organic vehicle includes a resin and a solvent.
  • the glass phase is a SiO 2 -ZnO-BaO system, and the weight percentage of the glass phase in the total weight of the first paste is 50%-70%;
  • the non-glass phase inorganic non-metallic materials include SiO 2 , and the non-glass phase
  • the particle size of the inorganic non-metallic material is 1 ⁇ m-20 ⁇ m, the weight percentage of the non-glass phase inorganic non-metallic material in the total weight of the first slurry is 5%-15%;
  • the weight percentage of the organic carrier in the total weight of the first slurry is 25%-35%,
  • the organic carrier includes resin and solvent, the resin includes ethyl cellulose, the solvent includes terpineol and butyl carbitol acetate system, the weight percentage of ethyl cellulose in the total weight of the organic
  • Step S05 forming a third dielectric layer on the surface of the first dielectric layer away from the heat generating layer.
  • the raw material for forming the third dielectric layer 17 is made into a third paste; the third paste is screen-printed on the surface of the first dielectric layer 15 away from the heating layer 14; in an air atmosphere, the porous The ceramic substrate 13 , the second dielectric layer 16 , the heat generating layer 14 , the first dielectric layer 15 and the third slurry are dried at a certain temperature (60-80° C.) so that the surface of the first dielectric layer 15 away from the heat generating layer 14 is dried.
  • a third dielectric layer 17 is formed, and the thickness of the third dielectric layer 17 is 5 ⁇ m-60 ⁇ m.
  • the third paste includes a glass phase, a non-glass phase inorganic non-metallic material and an organic vehicle, and the organic vehicle includes a resin and a solvent.
  • the glass phase is a SiO 2 -ZnO-BaO system, and the weight percentage of the glass phase in the total weight of the third paste is 50%-70%;
  • the non-glass phase inorganic non-metallic materials include SiO 2 , and the non-glass phase
  • the particle size of the inorganic non-metallic material is 1 ⁇ m-20 ⁇ m, the weight percentage of the non-glass phase inorganic non-metallic material in the total weight of the third slurry is 5%-15%;
  • the weight percentage of the organic carrier in the total weight of the third slurry is 25%-35%,
  • the organic carrier includes resin and solvent, the resin includes ethyl cellulose, the solvent includes terpineol and butyl carbitol acetate system, the weight percentage of ethyl cellulose in the total weight of the organic
  • Step S06 The porous ceramic substrate, the second dielectric layer, the heat generating layer, the first dielectric layer and the third dielectric layer are formed into an integral structure by sintering.
  • the porous ceramic substrate 13, the second dielectric layer 16, the heat generating layer 14, the first dielectric layer 15 and the third dielectric layer 17 are sintered at a certain temperature (the maximum temperature is 1100°C, and the sintering time is 30 minutes), that is, using The co-firing process makes the porous ceramic substrate 13 , the second dielectric layer 16 , the heat generating layer 14 , the first dielectric layer 15 and the third dielectric layer 17 form an integral structure.
  • the patterns of the second dielectric layer 16 , the heat generating layer 14 , the first dielectric layer 15 and the third dielectric layer 17 are the same.
  • the porous ceramic substrate 13 , the second dielectric layer 16 , the heat generating layer 14 , the first dielectric layer 15 and the third dielectric layer 17 can be processed by spraying, physical vapor deposition (PVD), chemical vapor deposition (CVD) ), etc., and can also be used in combination with a variety of processes; the porous ceramic matrix 13, the second dielectric layer 16, the heating layer 14, the first dielectric layer 15 and the third dielectric layer 17 can also be non-co-firing to form an integrated structure. Select as needed.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • the heating component in this application includes a porous ceramic substrate, a heating layer and a first dielectric layer.
  • the heating layer is attached to the porous ceramic substrate, and the first dielectric layer is attached to the surface of the heating layer away from the porous ceramic substrate.
  • the first dielectric layer Including glass phase, non-glass phase inorganic non-metallic materials and organic supports.
  • the heating layer can be made of materials without harmful heavy metals, which minimizes the effect of the material of the heating layer in the heating component on the electronic atomization. Safety hazard posed by the user of the device.

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Abstract

一种发热组件(11)及电子雾化装置，发热组件(11)包括多孔陶瓷基体(13)、发热层(14)和第一介质层(15)，发热层(14)与多孔陶瓷基体(13)贴合设置，第一介质层(15)贴合设置于发热层(14)远离多孔陶瓷基体(13)的表面；第一介质层(15)包括玻璃相、非玻璃相的无机非金属材料。通过在发热层(14)远离多孔陶瓷基体(13)的表面设置第一介质层(15)，阻隔待雾化基质与发热层(14)接触，大大降低待雾化基质对发热层(14)的腐蚀，延长发热组件(11)的使用寿命，进而延长电子雾化装置的使用寿命；并且由于第一介质层(15)阻隔了待雾化基质对发热层(14)的腐蚀，发热层(14)可以由无有害重金属材料制成，最大限度的降低了发热组件(11)中发热层(14)的材料对电子雾化装置使用者造成的安全隐患。

Description

发热组件及电子雾化装置
相关申请的交叉引用
本申请基于2020年12月14日提交的中国专利申请2020114742360主张其优先权，此处通过参照引入其全部的记载内容。
技术领域
本申请涉及雾化器技术领域，具体是涉及一种发热组件及电子雾化装置。
背景技术
现有的，电子雾化装置的陶瓷雾化芯大多为在多孔陶瓷基体上印刷镍铬或铁铬铝，陶瓷雾化芯金属膜中铬含量较高，一般其重量百分含量为20％左右。高铬含量的设计主要是为了在使用过程中保证金属膜表面可形成一层保护性的氧化铬钝化膜，防止金属膜在雾化过程中因被腐蚀而失效。
众所周知，重金属元素(如铬)会在人体器官如肝、肾、肺积聚而造成相应器官的损伤，陶瓷雾化芯金属膜中的高含量铬金属等其他有害重金属的存在会给电子雾化装置的使用者带来安全隐患。且陶瓷雾化芯金属膜易受腐蚀，影响电子雾化装置的使用寿命。
发明内容
有鉴于此，本申请提供一种发热组件及电子雾化装置，以解决现有技术中陶瓷雾化芯的金属膜给电子雾化装置的使用者带来的安全隐患。
为了解决上述技术问题，本申请提供的第一个技术方案为：提供一种发热组件，包括：多孔陶瓷基体、发热层和第一介质层；发热层与所述多孔陶瓷基体贴合设置；第一介质层贴合设置于所述发热层远 离所述多孔陶瓷基体的表面；所述第一介质层包括玻璃相、非玻璃相的无机非金属材料。
其中，进一步还包括第二介质层，所述第二介质层贴合设置于所述发热层靠近所述多孔陶瓷基体的表面。
其中，进一步还包括第三介质层，所述第三介质层贴合设置于所述第一介质层远离所述发热层的表面；所述第三介质层上设置有多个通孔。
其中，其中，所述第一介质层、所述第二介质层和所述第三介质层中所述玻璃相的重量百分比为77％-93％，所述非玻璃相的无机非金属材料的重量百分比为7％-23％。
其中，其中，所述玻璃相为SiO 2-ZnO-BaO体系。
其中，所述非玻璃相无机非金属材料为SiO 2、Al 2O 3、SiC中一种或多种，所述无机非金属材料的粒度为1μm-20μm。
其中，所述第一介质层、所述第二介质层和所述第三介质层的厚度为5μm-60μm。
其中，所述第一介质层、所述第二介质层和所述第三介质层的图案相同。
其中，所述发热层的原材料为金属或非金属导电相，所述发热层的厚度为5μm-60μm。
其中，所述发热层的原材料为银基合金、镍基合金、铁基合金、钛基合金和锆基合金中的一种或多种。
为了解决上述技术问题，本申请提供的第二个技术方案为：提供一种电子雾化装置，包括：发热组件，所述发热组件为上述任意一项所述的发热组件。
本申请的有益效果：区别于现有技术，本申请中的发热组件包括多孔陶瓷基体、发热层和第一介质层，发热层与多孔陶瓷基体贴合设置，第一介质层贴合设置于发热层远离多孔陶瓷基体的表面，第一介质层包括玻璃相、非玻璃相的无机非金属材料和有机载体。通过在发热层远离多孔陶瓷基体的表面设置第一介质层，阻隔待雾化基质与发热层接触，大大降低待雾化基质对发热层的腐蚀，延长发热组件的使 用寿命，进而延长电子雾化装置的使用寿命；并且由于第一介质层阻隔了待雾化基质对发热层的腐蚀，发热层可以由无有害重金属材料制成，最大限度的降低了发热组件中发热层的材料对电子雾化装置使用者造成的安全隐患。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本申请提供的电子雾化装置的结构示意图；
图2是本申请提供的发热组件第一实施例的结构示意图；
图3是本申请提供的发热组件第一实施例中发热组件制作方法流程示意图；
图4是本申请提供的发热组件第二实施例的结构示意图；
图5是本申请提供的发热组件第二实施例中发热组件制作方法流程示意图；
图6是本申请提供的发热组件第二实施例中步骤S03的形貌图；
图7是本申请提供的发热组件第二实施例中步骤S04的形貌图；
图8是本申请提供的发热组件第二实施例中步骤S05的结构图；
图9是本申请提供的发热组件第三实施例的结构示意图；
图10是本申请提供的发热组件第三实施例中发热组件制作方法流程示意图。
具体实施方式
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。本申请实施例中的术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或组件。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参阅图1，是本申请提供的电子雾化装置的结构示意图。
电子雾化装置可用于烟液、药液等液态基质的雾化。电子雾化装置包括相互连接的雾化器1和电源组件2。
雾化器1用于存储待雾化基质并雾化待雾化基质以形成可供用户吸食的气溶胶。该雾化器1具体可用于雾化待雾化基质并产生气溶胶，以用于不同的领域，比如，医疗、电子气溶胶化装置等；在一具体实施例中，该雾化器1可用于电子气溶胶化装置，用于雾化待雾化基质并产生气溶胶，以供抽吸者抽吸，以下实施例均以此为例；当然，在其他实施例中，该雾化器1也可应用于喷发胶设备，以雾化用于头发定型的喷发胶；或者应用于治疗上下呼吸系统疾病的医用设备，以雾化医用药品。雾化器1包括发热组件11和储液器12，储液器12用于存储待雾化基质，发热组件11用于将储液器12中的待雾化基质 加热雾化。
电源组件2包括电池21、控制器22和气流传感器23；电池21用于为雾化器1供电，以使得雾化器1能够雾化液态基质形成气溶胶；控制器22用于控制雾化器1工作；气流传感器23用于检测电子雾化装置中气流变化以启动电子雾化装置。
雾化器1与电源组件2可以是一体设置，也可以是可拆卸连接，根据具体需要进行设计。
请参阅图2，是本申请提供的发热组件第一实施例的结构示意图。
在本实施例中，发热组件11包括多孔陶瓷基体13、发热层14和第一介质层15。发热层14与多孔陶瓷基体13贴合设置，第一介质层15贴合设置于发热层14远离多孔陶瓷基体13的表面。其中，发热层14可以是金属膜、金属丝、金属网或其它发热线路，根据需要进行选择。第一介质层15可以是在待雾化基质或雾化好的气溶胶中稳定的玻璃相、陶瓷膜层等，能够阻隔待雾化基质或雾化好的气溶胶与发热层14的接触即可。
本实施例中，第一介质层15包括玻璃相、非玻璃相的无机非金属材料。玻璃相占第一介质层15总重量的重量百分比为77％-93％，非玻璃相的无机非金属材料占第一介质层15总重量的重量百分比为7％-23％。
第一介质层15由第一浆料烘干制得，第一浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。第一浆料烘干过程中，有机载体持续挥发，因此，第一介质层15包括玻璃相、非玻璃相的无机非金属材料。第一介质层15与第一浆料的不同之处在于是否含有有机载体。其中，非玻璃相的无机非金属材料为高熔点无机非金属材料(熔点大于1800℃)，其熔点高于玻璃相的熔点。
第一浆料中，玻璃相占第一浆料总重量的重量百分比为50％-70％，非玻璃相的无机非金属材料占第一浆料总重量的重量百分比为5％-15％，有机载体占第一浆料总重量的重量百分比为25％-35％。
在一个实施例中，玻璃相为SiO 2-ZnO-BaO体系，该玻璃相体系 可以更好的与多孔陶瓷基体13进行匹配，防止第一浆料在高温烧结过程中产生应力使第一介质层15产生微裂纹；玻璃相体系不限于SiO 2-ZnO-BaO体系，其他体系SiO 2-CaO-ZnO、SiO 2-ZnO-R 2O、SiO 2-B 2O 3等均可实现，玻璃相的材料具体可根据多孔陶瓷基体13及第一浆料的烧结工艺进行选择。
在一个实施例中，非玻璃相的无机非金属材料包括SiO 2，非玻璃相的无机非金属材料的粒度为1μm-20μm，可以更好的降低第一浆料在高温烧结过程的膨胀收缩；非玻璃相的无机非金属材料不限于SiO 2，与其功能相似的Al 2O 3、ZrO 2、SiC等均可实现，非玻璃相的无机非金属材料具体可以根据需要进行选择。
在一个实施例中，有机载体包括树脂和溶剂。树脂包括乙基纤维素，溶剂包括松油醇和丁基卡必醇醋酸酯体系，松油醇和丁基卡必醇醋酸酯均为乙基纤维素的良溶剂，松油醇和丁基卡必醇醋酸酯搭配使用可以调控第一浆料的挥发性和流平性，同时松油醇和丁基卡必醇醋酸酯可以调节有机载体的粘度，适当的粘度可以充分润湿玻璃相和非玻璃相无机非金属材料，改善第一浆料的印刷性。其中，松油醇占有机载体总重量的重量百分比为50％-70％，丁基卡必醇醋酸酯占有机载体总重量的质量百分比为27％-42％，乙基纤维素占有机载体总重量的重量百分比为3％-8％。其他实施方式中，树脂还可以是醋酸丁酸纤维素、丙烯酸树脂、聚乙烯缩丁醛等；溶剂还可以是丁基卡必醇、二乙二醇二丁醚、三乙二醇丁醚、醇酯十二、柠檬酸三丁酯、三丙二醇丁醚等；树脂和溶剂的具体材料组成可以根据需要进行选择。
待雾化基质的体系众多，待雾化基质的pH值通常为3.9-10.2，雾化温度通常为200-350℃，待雾化基质在雾化温度下具有极强的腐蚀性。为了降低待雾化基质对发热层14的腐蚀性，通常通过提高发热层14原材料中的铬含量，以使在发热层14表面形成具有保护性的氧化铬钝化膜来实现。铬为有害重金属，重金属在人体器官如肝、肾、肺积聚会造成相应器官的损伤，对使用者的身体健康造成威胁。且发热层14被待雾化基质腐蚀后，影响发热层14的性能，使得发热层14无法准确响应控制器22的控制信号，发热层14加热实际达到的 温度与控制器22控制其需达到的温度存在差值，或发热层14加热实际达到的温度不稳定，影响气溶胶中挥发性香气的浓度，进而影响雾化好的气溶胶口感的一致性，降低使用者的体验感。
本申请中，第一介质层15的材料使其能够在待雾化基质或雾化好的气溶胶中稳定存在，几乎不受待雾化基质或雾化好的气溶胶的腐蚀。通过在发热层14远离多孔陶瓷基体13的表面贴合设置第一介质层15，由于发热层14和第一介质层15均为致密层，第一介质层15可以阻隔待雾化基质或雾化好的气溶胶与发热层14接触，大大降低待雾化基质或雾化好的气溶胶对发热层14的腐蚀，延长了其使用寿命；进而降低了对发热层14材料中对重金属含量(如铬)的要求。
通过设置第一介质层15保护发热层14后，使得发热层14可以采用任意功能性达标的金属或非金属导电相，大大提高产品安全性；甚至为了切断有害重金属带来的安全隐患或降低成本，可选用无有害重金属的金属或非金属导电相。
本申请实施例中，发热层14的材料中不包含有毒重金属；发热层14可采用生物医用材料，如钛基合金、锆基合金、镍基合金、银基合金、铁基合金等，使得发热层14易烧结，安全性高，干湿烧等性能优异。
请参阅图3，是本申请提供的发热组件第一实施例中发热组件制作方法流程示意图。
发热组件11的制作方法包括：
步骤S01：获取多孔陶瓷基体。
具体地，准备好陶瓷粉料，通过丝网印刷、烧结制成多孔陶瓷基体13。
步骤S02：在多孔陶瓷表面形成发热层。
具体地，将用于形成发热层14的原材料制成电阻浆料；将电阻浆料通过丝网印刷在多孔陶瓷基体13的表面；在空气氛围下，将多孔陶瓷基体13和电阻浆料在一定温度下(60-80℃)进行烘干以在多孔陶瓷基体13表面形成发热层14。本实施例中，电阻浆料的主要成分为镍。发热层14的厚度为5μm-60μm。
步骤S03：在发热层远离多孔陶瓷基体的表面形成第一介质层。
具体地，将用于形成第一介质层15的原材料制成第一浆料；将第一浆料通过丝网印刷在发热层14远离多孔陶瓷基体13的表面；在空气氛围中，将多孔陶瓷基体13、发热层14和第一浆料在一定温度下(60-80℃)进行烘干以在发热层14远离多孔陶瓷基体13的表面形成第一介质层15，第一介质层15的厚度为5μm-60μm，电阻值为0.7Ω-0.9Ω。
其中，第一浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。本实施例中，玻璃相为SiO 2-ZnO-BaO体系，玻璃相占第一浆料总重量的重量百分比为50％-70％；非玻璃相的无机非金属材料包括SiO 2，非玻璃相的无机非金属材料的粒度为1μm-20μm，非玻璃相的无机非金属材料占第一浆料总重量的重量百分比为5％-15％；有机载体占第一浆料总重量的重量百分比为25％-35％，有机载体包括树脂和溶剂，树脂包括乙基纤维素，溶剂包括松油醇和丁基卡必醇醋酸酯体系，乙基纤维素占有机载体总重量的重量百分比为3％-8％，松油醇占有机载体总重量的重量百分比为50％-70％，丁基卡必醇醋酸酯占有机载体总重量的质量百分比为27％-42％。
步骤S04：通过烧结使多孔陶瓷基体、发热层和第一介质层形成一整体结构。
具体地，将多孔陶瓷基体13、发热层14和第一介质层15在一定温度下烧结(最高温为1100℃，烧结时间30min)，即，采用共烧工艺使多孔陶瓷基体13、发热层14和第一介质层15形成一整体结构。其中，第一介质层15和发热层14的图案相同。
在其他实施方式中，多孔陶瓷基体13、发热层14和第一介质层15可以通过喷涂、物理气相沉积工艺(PVD)、化学气相沉积工艺(CVD)等方式形成，也可以多种工艺搭配使用；多孔陶瓷基体13、发热层14和第一介质层15也可采用非共烧工艺形成一体结构，根据需要进行选择。
可以理解的是，发热组件11的发热层14上需设置引脚以与电池 21电连接，引脚上涂覆银浆，以防止引脚被待雾化基质或雾化好的气溶胶腐蚀，起到保护作用；也可以选用其他金属涂层来保护引脚，根据需要进行选择。
将第一实施例中的发热组件11、发热组件一号和发热组件二号进行比较，通过实现证明其性能的优劣。其中，发热组件一号由多孔陶瓷基体13和发热层14组成，其中，发热层14的主要材料为镍；发热组件二号由多孔陶瓷基体13和发热层14组成，发热层14的主要材料为镍铬。为了方便统计，将本申请第一实施例中的发热组件11称为发热组件三号；发热组件三号由多孔陶瓷基体13、发热层14和第一介质层15组成，其中，发热层14的材料为镍，第一介质层15的主要材料为Si-Zn-Ba玻璃体系。
实验一：发热组件一号、发热组件二号和发热组件三号分别浸入4％乙酸进行浸泡实验，实验结果如表1所示。
表14％乙酸浸泡结果
发热组体 4％乙酸浸出Ni量(μg/ml)
三号 低于仪器检出限值
二号 16.20
一号 19.00
实验二：发热组件一号、发热组件二号和发热组件三号分别浸入57mg的芒果香味待雾化基质进行浸泡实验，实验结果如表2所示。
表2芒果57mg烟油浸泡结果
发热组件 芒果烟油浸出Ni量(g/ml) 芒果烟油浸出Cr量(g/ml)
三号 低于仪器检出限值 无
二号 3.0 1
一号 3.50 无
实验三：发热组件一号、发热组件二号和发热组件三号在恒功率6.5W、通3S断8S、空气中循环50次的条件下分别进行寿命测试实验，实验结果如表3所示。
表3干烧寿命测试
发热组件 测试结果
三号 50次未烧断，冷却后电阻无变化
二号 12次后烧断
一号 50次未烧断，冷却后电阻无变化
实验四：发热组件一号、发热组件二号和发热组件三号在功率6.5W、通3S断8S、丙三醇中循环50次的条件下分别进行寿命测试实验，测试条件：恒功率6.5w、通3s断开8s、丙三醇中200次循环寿命测试，实验结果如表4所示。
表4湿烧寿命测试
发热组件 测试结果
三号 200次未失效，烟雾量正常
二号 200次未失效，烟雾量正常
一号 200次未失效，烟雾量正常
通过表1和表2的实验结果可知，本申请第一实施例的发热组件11(发热组件三号)的金属离子溶出明显降低或无法检出。通过表3和表4的实验结果可知，本申请第一实施例的发热组件11(发热组件三号)的使用寿命高于现有的发热组件11。因此，本申请的发热组件11能够显著降低发热层14材料对使用者造成的安全隐患。
请参阅图4，是本申请提供的发热组件第二实施例的结构示意图。
在第二实施例中，发热组件11的结构与第一实施例中基本相同，不同之处在于发热组件11还包括第二介质层16。
在本实施例中，发热组件11包括多孔陶瓷基体13、发热层14、第一介质层15和第二介质层16。第二介质层16贴合设置于发热层14靠近多孔陶瓷基体13的表面，第二介质层16与多孔陶瓷基体13贴合设置。第二介质层16可以是在待雾化基质或雾化好的气溶胶中稳定的玻璃相、无机非金属复合材料、陶瓷膜层等，能够阻隔待雾化基质或雾化好的气溶胶与发热层14的接触，且提高发热层14的膜基结合力(即，发热层14与发热组件中其他元件的结合力)即可。
本实施例中，第二介质层16包括玻璃相、非玻璃相的无机非金属材料。玻璃相占第二介质层16总重量的重量百分比为77％-93％，非玻璃相的无机非金属材料占第二介质层16总重量的重量百分比为7％-23％。
第二介质层16由第二浆料烘干制得，第二浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。第二浆料烘干过程中，有机载体持续挥发，因此，第二介质层16包括玻璃相、非玻璃相的无机非金属材料。第二介质层16与第二浆料的不同之处在于是否含有有机载体。其中，非玻璃相的无机非金属材料为高熔点无机非金属材料(熔点大于1800℃)，其熔点高于玻璃相的熔点。第二浆料与第一浆料的组成成分及其比例基本相同，不再赘述。
通过在发热层14与多孔陶瓷基体13之间设置第二介质层16，第二介质层16为致密层，阻隔多孔陶瓷基体13靠近发热层14表面的待雾化基质与发热层14的接触，大大减缓待雾化基质对发热层14的腐蚀。同时，第二介质层16包括相对设置的第一表面和第二表面，第一表面与发热层14贴合设置，第二表面与多孔陶瓷基体13贴合设置，第二介质层16与发热层14、多孔陶瓷基体13的结合强度大于发热层14与多孔陶瓷基体13的结合强度，因此，通过第二介质层16提高发热层14与多孔陶瓷基体13的结合强度，即提高了膜基结合力，进而降低了发热层14脱落的风险，即改善了热振带来的不利影响。可以理解的是，第二介质层16中的非玻璃相无机非金属材料起到骨架作用，能够提高膜基的匹配性和结合力。
可以理解的是，第二介质层16中各个成分之间的比例可以根据多孔陶瓷基体13和发热层14的热膨胀系数来进行选择，以提高膜基结合力的同时降低发热层14脱落的风险，进而改善热振带来的不利影响。若发热层14靠近多孔陶瓷基体13的表面受待雾化基质的腐蚀较轻，发热层14与多孔陶瓷基体13的结合力较强，且热振对膜基的影响较小，可以选择在发热层14与多孔陶瓷基体13之间不设置第二介质层16，第二介质层16的设置根据具体需要进行选择。
第一介质层15和第二介质层16的材料使其能够在待雾化基质或雾化好的气溶胶中稳定存在，几乎不受待雾化基质或雾化好的气溶胶的腐蚀。通过在发热层14与多孔陶瓷基体13之间设置第二介质层16、发热层14远离多孔陶瓷基体13的表面贴合设置第一介质层15， 由于发热层14和第一介质层15、第二介质层16均为致密层，第一介质层15和第二介质层16可以阻隔待雾化基质或雾化好的气溶胶与发热层14接触，大大降低待雾化基质或雾化好的气溶胶对发热层14的腐蚀，延长了其使用寿命；降低了对发热层14材料中对重金属含量(如铬)的要求。通过设置第一介质层15和第二介质层16保护发热层14后，使得发热层14可以采用任意功能性达标的金属或非金属导电相，大大提高产品安全性；甚至为了切断有害重金属带来的安全隐患或降低成本，可选用无有害重金属的金属或非金属导电相。
本实施例中，发热层14的材料中不包含有毒重金属；发热层14可采用生物医用材料，如钛基合金、锆基合金、镍基合金、银基合金、铁基合金等，使得发热层14易烧结，安全性高，干湿烧等性能优异。
请参阅图5，是本申请提供的发热组件第二实施例中发热组件制作方法流程示意图。
发热组件11的制作方法包括：
步骤S01：获取多孔陶瓷基体。
具体地，准备好陶瓷粉料，通过丝网印刷、烧结制成多孔陶瓷基体13。
步骤S02：在多孔陶瓷表面形成第二介质层。
具体地，将用于形成第二介质层16的原材料制成第二浆料；将第二浆料通过丝网印刷在多孔陶瓷基体13的表面；在空气氛围中，将多孔陶瓷基体13和第一浆料在一定温度下(60-80℃)进行烘干以在多孔陶瓷基体13的表面形成第二介质层16，第二介质层16的厚度为5μm-60μm。
其中，第二浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。本实施例中，玻璃相为SiO 2-ZnO-BaO体系，玻璃相占第二浆料总重量的重量百分比为50％-70％；非玻璃相的无机非金属材料包括SiO 2，非玻璃相的无机非金属材料的粒度为1μm-20μm，非玻璃相的无机非金属材料占第二浆料总重量的重量百分比为5％-15％；有机载体占第二浆料总重量的重量百分比为25％-35％，有机载体包括树脂和溶剂，树脂包括乙基 纤维素，溶剂包括松油醇和丁基卡必醇醋酸酯体系，乙基纤维素占有机载体总重量的重量百分比为3％-8％，松油醇占有机载体总重量的重量百分比为50％-70％，丁基卡必醇醋酸酯占有机载体总重量的质量百分比为27％-42％。
步骤S03：在第二介质层远离多孔陶瓷基体表面形成发热层。
具体地，将用于形成发热层14的原材料制成电阻浆料；将电阻浆料通过丝网印刷在第二介质层16远离多孔陶瓷基体13的表面；在空气氛围下，将多孔陶瓷基体13、第二介质层16和电阻浆料在一定温度下(60-80℃)进行烘干以在第二介质层16远离多孔陶瓷基体13表面形成发热层14。本实施例中，电阻浆料的主要成分为镍。发热层14的厚度为5μm-60μm，如图6所示(图6是本申请提供的发热组件第二实施例中步骤S03的形貌图)。
步骤S04：在发热层远离多孔陶瓷基体的表面形成第一介质层。
具体地，将用于形成第一介质层15的原材料制成第一浆料；将第一浆料通过丝网印刷在发热层14远离多孔陶瓷基体13的表面；在空气氛围中，将多孔陶瓷基体13、第二介质层16、发热层14和第一浆料在一定温度下(60-80℃)进行烘干以在发热层14远离多孔陶瓷基体13的表面形成第一介质层15，第一介质层15的厚度为5μm-60μm，电阻值为0.7Ω-0.9Ω，如图7所示(图7是本申请提供的发热组件第二实施例中步骤S04的形貌图)。
其中，第一浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。本实施例中，玻璃相为SiO 2-ZnO-BaO体系，玻璃相占第一浆料总重量的重量百分比为50％-70％；非玻璃相的无机非金属材料包括SiO 2，非玻璃相的无机非金属材料的粒度为1μm-20μm，非玻璃相的无机非金属材料占第一浆料总重量的重量百分比为5％-15％；有机载体占第一浆料总重量的重量百分比为25％-35％，有机载体包括树脂和溶剂，树脂包括乙基纤维素，溶剂包括松油醇和丁基卡必醇醋酸酯体系，乙基纤维素占有机载体总重量的重量百分比为3％-8％，松油醇占有机载体总重量的重量百分比为50％-70％，丁基卡必醇醋酸酯占有机载体总重量的质 量百分比为27％-42％。
步骤S05：通过烧结使多孔陶瓷基体、第二介质层、发热层和第一介质层形成一整体结构。
具体地，将多孔陶瓷基体13、第二介质层16、发热层14和第一介质层15在一定温度下烧结(最高温为1100℃，烧结时间30min)，即，采用共烧工艺使多孔陶瓷基体13、第二介质层16、发热层14和第一介质层15形成一整体结构，如图8所示(图8是本申请提供的发热组件第二实施例中步骤S05的结构图)。其中，第二介质层16、发热层14和第一介质层15的图案相同。
在其他实施方式中，多孔陶瓷基体13、第二介质层16、发热层14和第一介质层15可以通过喷涂、物理气相沉积工艺(PVD)、化学气相沉积工艺(CVD)等方式形成，也可以多种工艺搭配使用；多孔陶瓷基体13、第二介质层16、发热层14和第一介质层15也可采用非共烧工艺形成一体结构，根据需要进行选择。
请参阅图9，是本申请提供的发热组件第三实施例的结构示意图。
在第三实施例中，发热组件11的结构与第二实施例中基本相同，不同之处在于发热组件11还包括第三介质层17。
在本实施例中，发热组件11包括多孔陶瓷基体13、发热层14、第一介质层15、第二介质层16和第三介质层17。第三介质层17贴合设置于第二介质层16远离发热层14的表面。第三介质层17上设置有多个通孔，以使第三介质层17形成网格状，增大了发热组件11的雾化面的雾化面积。通常待雾化基质通过多孔陶瓷基体13远离发热层14的表面进入多孔陶瓷基体13，向多孔陶瓷基体13利用其毛细作用力将待雾化基质从多孔陶瓷基体13远离发热层14的表面导引至靠近发热层14的表面。待雾化基质到达多孔陶瓷基体13靠近发热层14的表面后，由于第一介质层15、发热层14和第二介质层16均为致密层，第三介质层17上的通孔可用于存储待雾化基质，能够防止发热组件11干烧，且在一定程度上降低发热层14的温度。第三介质层17可以是在待雾化基质或雾化好的气溶胶中稳定的玻璃相、无机非金属复合材料、陶瓷膜层等。
本实施例中，第三介质层17包括玻璃相、非玻璃相的无机非金属材料。玻璃相占第三介质层17总重量的重量百分比为77％-93％，非玻璃相的无机非金属材料占第三介质层17总重量的重量百分比为7％-23％。
第三介质层17由第三浆料烘干制得，第三浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。第三浆料烘干过程中，有机载体持续挥发，因此，第三介质层17包括玻璃相、非玻璃相的无机非金属材料。第三介质层17与第三浆料的不同之处在于是否含有有机载体。其中，非玻璃相的无机非金属材料为高熔点无机非金属材料(熔点大于1800℃)，其熔点高于玻璃相的熔点。第三浆料与第一浆料的组成成分及其比例基本相同，不再赘述。
请参阅图10，是本申请提供的发热组件第三实施例中发热组件制作方法流程示意图。
发热组件11的制作方法包括：
步骤S01：获取多孔陶瓷基体。
具体地，准备好陶瓷粉料，通过丝网印刷、烧结制成多孔陶瓷基体13。
步骤S02：在多孔陶瓷表面形成第二介质层。
具体地，将用于形成第二介质层16的原材料制成第二浆料；将第二浆料通过丝网印刷在多孔陶瓷基体13的表面；在空气氛围中，将多孔陶瓷基体13和第一浆料在一定温度下(60-80℃)进行烘干以在多孔陶瓷基体13的表面形成第二介质层16，第二介质层16的厚度为5μm-60μm。
其中，第二浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。本实施例中，玻璃相为SiO 2-ZnO-BaO体系，玻璃相占第二浆料总重量的重量百分比为50％-70％；非玻璃相的无机非金属材料包括SiO 2，非玻璃相的无机非金属材料的粒度为1μm-20μm，非玻璃相的无机非金属材料占第二浆料总重量的重量百分比为5％-15％；有机载体占第二浆料总重量的 重量百分比为25％-35％，有机载体包括树脂和溶剂，树脂包括乙基纤维素，溶剂包括松油醇和丁基卡必醇醋酸酯体系，乙基纤维素占有机载体总重量的重量百分比为3％-8％，松油醇占有机载体总重量的重量百分比为50％-70％，丁基卡必醇醋酸酯占有机载体总重量的质量百分比为27％-42％。
步骤S03：在第二介质层远离多孔陶瓷基体表面形成发热层。
具体地，将用于形成发热层14的原材料制成电阻浆料；将电阻浆料通过丝网印刷在第二介质层16远离多孔陶瓷基体13的表面；在空气氛围下，将多孔陶瓷基体13、第二介质层16和电阻浆料在一定温度下(60-80℃)进行烘干以在第二介质层16远离多孔陶瓷基体13表面形成发热层14。本实施例中，电阻浆料的主要成分为镍。发热层14的厚度为5μm-60μm。
步骤S04：在发热层远离多孔陶瓷基体的表面形成第一介质层。
具体地，将用于形成第一介质层15的原材料制成第一浆料；将第一浆料通过丝网印刷在发热层14远离多孔陶瓷基体13的表面；在空气氛围中，将多孔陶瓷基体13、第二介质层16、发热层14和第一浆料在一定温度下(60-80℃)进行烘干以在发热层14远离多孔陶瓷基体13的表面形成第一介质层15，第一介质层15的厚度为5μm-60μm，电阻值为0.7Ω-0.9Ω。
其中，第一浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。本实施例中，玻璃相为SiO 2-ZnO-BaO体系，玻璃相占第一浆料总重量的重量百分比为50％-70％；非玻璃相的无机非金属材料包括SiO 2，非玻璃相的无机非金属材料的粒度为1μm-20μm，非玻璃相的无机非金属材料占第一浆料总重量的重量百分比为5％-15％；有机载体占第一浆料总重量的重量百分比为25％-35％，有机载体包括树脂和溶剂，树脂包括乙基纤维素，溶剂包括松油醇和丁基卡必醇醋酸酯体系，乙基纤维素占有机载体总重量的重量百分比为3％-8％，松油醇占有机载体总重量的重量百分比为50％-70％，丁基卡必醇醋酸酯占有机载体总重量的质量百分比为27％-42％。
步骤S05：在第一介质层远离发热层的表面形成第三介质层。
具体地，将用于形成第三介质层17的原材料制成第三浆料；将第三浆料通过丝网印刷在第一介质层15远离发热层14的表面；在空气氛围中，将多孔陶瓷基体13、第二介质层16、发热层14、第一介质层15和第三浆料在一定温度下(60-80℃)进行烘干以在第一介质层15远离发热层14的表面形成第三介质层17，第三介质层17的厚度为5μm-60μm。
其中，第三浆料包括玻璃相、非玻璃相的无机非金属材料和有机载体，有机载体包括树脂和溶剂。本实施例中，玻璃相为SiO 2-ZnO-BaO体系，玻璃相占第三浆料总重量的重量百分比为50％-70％；非玻璃相的无机非金属材料包括SiO 2，非玻璃相的无机非金属材料的粒度为1μm-20μm，非玻璃相的无机非金属材料占第三浆料总重量的重量百分比为5％-15％；有机载体占第三浆料总重量的重量百分比为25％-35％，有机载体包括树脂和溶剂，树脂包括乙基纤维素，溶剂包括松油醇和丁基卡必醇醋酸酯体系，乙基纤维素占有机载体总重量的重量百分比为3％-8％，松油醇占有机载体总重量的重量百分比为50％-70％，丁基卡必醇醋酸酯占有机载体总重量的质量百分比为27％-42％。
步骤S06：通过烧结使多孔陶瓷基体、第二介质层、发热层、第一介质层和第三介质层形成一整体结构。
具体地，将多孔陶瓷基体13、第二介质层16、发热层14、第一介质层15和第三介质层17在一定温度下烧结(最高温为1100℃，烧结时间30min)，即，采用共烧工艺使多孔陶瓷基体13、第二介质层16、发热层14、第一介质层15和第三介质层17形成一整体结构。其中，第二介质层16、发热层14、第一介质层15和第三介质层17的图案相同。
在其他实施方式中，多孔陶瓷基体13、第二介质层16、发热层14、第一介质层15和第三介质层17可以通过喷涂、物理气相沉积工艺(PVD)、化学气相沉积工艺(CVD)等方式形成，也可以多种工艺搭配使用；多孔陶瓷基体13、第二介质层16、发热层14、第一介 质层15和第三介质层17也可采用非共烧工艺形成一体结构，根据需要进行选择。
本申请中的发热组件包括多孔陶瓷基体、发热层和第一介质层，发热层与多孔陶瓷基体贴合设置，第一介质层贴合设置于发热层远离多孔陶瓷基体的表面，第一介质层包括玻璃相、非玻璃相的无机非金属材料和有机载体。通过在发热层远离多孔陶瓷基体的表面设置第一介质层，阻隔待雾化基质与发热层接触，大大降低待雾化基质对发热层的腐蚀，延长发热组件的使用寿命，进而延长电子雾化装置的使用寿命；并且由于第一介质层阻隔了待雾化基质对发热层的腐蚀，发热层可以由无有害重金属材料制成，最大限度的降低了发热组件中发热层的材料对电子雾化装置使用者造成的安全隐患。
以上所述仅为本申请的部分实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (11)

  1. 一种发热组件，用于电子雾化装置，其中，包括：
    多孔陶瓷基体：
    发热层，与所述多孔陶瓷基体贴合设置；
    第一介质层，贴合设置于所述发热层远离所述多孔陶瓷基体的表面；所述第一介质层包括玻璃相、非玻璃相的无机非金属材料。
  2. 根据权利要求1所述的发热组件，其中，进一步还包括第二介质层，所述第二介质层贴合设置于所述发热层靠近所述多孔陶瓷基体的表面。
  3. 根据权利要求1所述的发热组件，其中，进一步还包括第三介质层，所述第三介质层贴合设置于所述第一介质层远离所述发热层的表面；所述第三介质层上设置有多个通孔。
  4. 根据权利要求1-3任意一项所述的发热组件，其中，所述第一介质层、所述第二介质层和所述第三介质层中所述玻璃相的重量百分比为77％-93％，所述非玻璃相的无机非金属材料的重量百分比为7％-23％。。
  5. 根据权利要求4所述的发热组件，其中，所述玻璃相为SiO 2-ZnO-BaO体系。
  6. 根据权利要求4所述的发热组件，其中，所述非玻璃相无机非金属材料为SiO 2、Al 2O 3、SiC中一种或多种，所述无机非金属材料的粒度为1μm-20μm。
  7. 根据权利要求1-3任意一项所述的发热组件，其中，所述第一介质层、所述第二介质层和所述第三介质层的厚度为5μm-60μm。
  8. 根据权利要求1-3任意一项所述的发热组件，其中，所述第一介质层、所述第二介质层和所述第三介质层的图案相同。
  9. 根据权利要求1所述的发热组件，其中，所述发热层的原材料为金属或非金属导电相，所述发热层的厚度为5μm-60μm。
  10. 根据权利要求9所述的发热组件，其中，所述发热层的原材料为银基合金、镍基合金、铁基合金、钛基合金和锆基合金中的一种或多种。
  11. 一种电子雾化装置，其中，包括发热组件，所述发热组件为权利要求1-10任意一项所述的发热组件。
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