WO2022151789A1 - 显示面板及具有该显示面板的显示装置 - Google Patents
显示面板及具有该显示面板的显示装置 Download PDFInfo
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- WO2022151789A1 WO2022151789A1 PCT/CN2021/125634 CN2021125634W WO2022151789A1 WO 2022151789 A1 WO2022151789 A1 WO 2022151789A1 CN 2021125634 W CN2021125634 W CN 2021125634W WO 2022151789 A1 WO2022151789 A1 WO 2022151789A1
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- buffer
- display panel
- base material
- layer
- panel according
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- 239000000872 buffer Substances 0.000 claims abstract description 117
- 239000000463 material Substances 0.000 claims description 119
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004814 polyurethane Substances 0.000 claims description 10
- 229920002635 polyurethane Polymers 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 229920000178 Acrylic resin Polymers 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 238000003698 laser cutting Methods 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 78
- 239000002585 base Substances 0.000 description 26
- 239000000758 substrate Substances 0.000 description 16
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 239000006173 Good's buffer Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
Definitions
- the present application relates to the technical field of display screens, and in particular, to a display panel and a display device having the display panel.
- the existing flexible display device has poor impact resistance.
- the display panel of the flexible display device is subjected to an impact force, the display panel of the flexible display device is easily deformed and damaged, which greatly shortens the service life of the flexible display device. Almost damaged will also bring property damage to the user.
- the present application aims to solve one of the above-mentioned technical problems in the prior art at least to a certain extent. To this end, the present application proposes a display panel with better impact resistance.
- the present application also proposes a display device having the above-mentioned display panel.
- the display panel according to the embodiment of the present application includes: a cover plate, a screen film layer, and a buffer layer, the buffer layer is disposed on a side of the screen film layer away from the cover plate, and the buffer layer has at least one The buffer layer of the buffer chamber.
- the display panel of the embodiment of the present application by arranging the buffer cavity in the buffer layer, the display panel can have better impact resistance.
- the buffer layer includes: a base material and a buffer material disposed on the base material, the buffer material is located between the base material and the screen film layer, and the buffer cavity opened in the buffer material.
- the substrate is a polyimide substrate or a polyester resin substrate, and the thickness of the substrate is 50um-100um.
- the base material is a stainless steel base material, and the thickness of the base material is 30um-50um.
- the buffer material is one of acrylic resin, silica gel, polyurethane, siloxane, boric acid-modified hydroxyl-terminated polysiloxane-silica lightweight impact-hardening polymer composite material or Various combinations.
- the thickness of the buffer material is 100um-200um.
- the elastic modulus of the buffer material is 30KPa-100KPa.
- the cross-sectional shape of the buffer cavity is one or more combinations of a rectangle, a circle, and a diamond.
- the buffer cavity is obtained by a laser cutting or die cutting process.
- a display device includes the above-mentioned display panel.
- the display device and the above-mentioned display panel have the same advantages over the prior art, which are not repeated here.
- FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present application.
- FIG. 2 is a schematic cross-sectional view of a display panel according to another embodiment of the present application.
- FIG. 3 is a top view of a buffer material and a substrate according to an embodiment of the present application.
- Fig. 4 is a partial schematic view of the buffer material in Fig. 3;
- FIG 5 is a top view of a buffer material according to another embodiment of the present application.
- Display panel 10 cover plate 1, screen film layer 2, touch layer 21, polarizing layer 22, support film layer 23, first adhesive layer 24, second adhesive layer 25, display device 26, buffer layer 3, base material 31 , buffer material 32 , first material layer 321 , second material layer 322 , third material layer 323 , buffer cavity 33 .
- the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection It can be a mechanical connection, an electrical connection or can communicate with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication between two elements or the interaction relationship between the two elements.
- installed e.g., it may be a fixed connection or a detachable connection
- it can be a mechanical connection, an electrical connection or can communicate with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication between two elements or the interaction relationship between the two elements.
- the display panel 10 according to the embodiment of the present application will be described in detail below with reference to FIGS. 1 to 5 .
- the display panel 10 may include: a cover plate 1 , a screen film layer 2 , and a buffer layer 3 .
- the buffer layer 3 is disposed on a side of the screen film layer 2 away from the cover plate 1 .
- the screen film layer 2 is arranged on the back side of the cover plate 1
- the buffer layer 3 is arranged on the back side of the screen film layer 2 .
- the screen film layer 2 may include: a touch layer 21 , a polarizing layer 22 , and a supporting film layer 23 , the touch layer 21 and the cover plate 1 are connected by a first adhesive layer 24 , and the touch layer 21 and the polarizing layer 22 are connected. The connection is achieved through the second adhesive layer 25 , and the display device 26 is arranged between the polarizing layer 22 and the supporting film layer 23 .
- the buffer layer 3 is a buffer layer 3 having at least one buffer cavity 33 .
- the buffer cavity 33 is equivalent to an airbag structure.
- the buffer cavity 33 is set in the buffer layer 3.
- the buffer cavity 33 can ensure that the display panel 10 has a larger deformation space, so that the deformation occurs in a larger space.
- the maximum deformation of the display device part 26 in the screen film layer 2 is reduced, so that the display panel 10 has better impact resistance. 10 can resist a larger impact force, which is beneficial to improve the product quality of the display panel 10 .
- the display panel 10 of the embodiment of the present application by disposing the buffer cavity 33 in the buffer layer 3 , the display panel 10 can deform into the buffer cavity 33 when subjected to an impact force, and when the buffer layer 3 deforms into the buffer cavity 33
- the impact energy can be absorbed, thereby reducing the impact energy carried on the display device 26 or the screen film layer 2, ensuring that the display device 26 is not easily damaged, and the screen film layer 2 is not easily broken, so the display panel 10 of the present application has better impact resistance. , which can resist a larger impact force, thereby making the display panel 10 less deformed and damaged, and the service life of the display panel 10 is greatly prolonged, so as to reduce the user's property loss.
- the buffer layer 3 may include: a base material 31 and a buffer material 32 disposed on the base material 31 , the buffer material 32 is located between the base material 31 and the screen film layer 2 , and the buffer material 32 The cavity 33 is opened in the buffer material 32 .
- the base material 31 can provide a supporting force for the buffer material 32 , so that the buffer material 32 can be kept on the back of the screen film layer 2 .
- the buffer material 32 can be cured by ultraviolet rays (ie, UV curing) to make the adhesive force of the buffer material 32 reach 1000-1200 gf/25cm, and then the buffer material 32 can be bonded and fixed with the screen film layer 2, thereby completing the buffering.
- ultraviolet rays ie, UV curing
- the substrate 31 is a polyimide (ie, PI, Polyimide) substrate 31 or a polyester resin (ie, PET, Polyethylene terephthalate) substrate, and the thickness of the substrate 31 is 50um-100um, This ensures that the base material 31 can provide sufficient support force for the buffer material 32 .
- a polyimide base material or a polyester resin base material when the thickness of the base material 31 is less than 50 um, the strength and stiffness are both small, which cannot provide sufficient supporting force for the buffer material 32 .
- the thickness of the base material 31 is greater than 100 ⁇ m, the thickness of the base material 31 will be relatively thick, which is not conducive to the light and thin design of the display panel 10 .
- the thickness of the base material 31 is 60um, 70um, 80um, 90um and the like.
- the base material 31 is a stainless steel base material, and the thickness of the base material 31 is 30um-50um. That is to say, when the base material 31 is a stainless steel base material, even if the thickness of the base material 31 is relatively thin, the base material 31 has good strength and rigidity, and can provide sufficient supporting force for the buffer material 32 .
- the grades and specifications of stainless steel substrates can be various, such as SUS301, SUS303, SUS304, SUS316, etc.
- the strength and rigidity are both small, so that the buffer material 32 cannot be provided with sufficient supporting force.
- the thickness of the substrate 31 is greater than 50 ⁇ m, the thickness of the substrate 31 will be thicker and the weight will be heavier, which is not conducive to the light and thin design of the display panel 10 .
- the thickness of the base material 31 is 35um, 40um, 45um, or the like.
- the buffer material 32 is acrylic resin (the general term for acrylic acid, methacrylic acid and its derivative polymers, such as commonly used acrylic), silica gel, polyurethane (PU, polyurethane, that is, polyurethane) ), siloxane, and one or more combinations of boric acid-modified hydroxyl terminated polysiloxane-silica lightweight impact-hardening polymer composites (ie, P4U).
- acrylic resin the general term for acrylic acid, methacrylic acid and its derivative polymers, such as commonly used acrylic
- silica gel silica gel
- polyurethane PU, polyurethane, that is, polyurethane
- siloxane siloxane
- P4U boric acid-modified hydroxyl terminated polysiloxane-silica lightweight impact-hardening polymer composites
- the buffer material 32 is one of acrylic resin, silica gel, polyurethane, siloxane, boric acid-modified hydroxyl terminated polysiloxane-silica lightweight impact-hardening polymer composite material. made of one material.
- the buffer material 32 is a composite material of acrylic resin, silica gel, polyurethane, siloxane, and boric acid-modified hydroxyl terminated polysiloxane-silica lightweight impact-hardening polymer composite material. A combination of materials.
- the buffer material 32 is a composite structure, and the buffer material 32 may include a first material layer 321 , a second material layer 322 , and a third material layer 323 , and the second material layer 322 is located in the Between the first material layer 321 and the third material layer 323, each of the first material layer 321, the second material layer 322, and the third material layer 323 may be of different materials, and the first material layer 321 and the third material layer 321
- the material layer 323 may also be made of the same material, while the second material layer 322 may be made of another material.
- the first material layer 321 and the third material layer 323 may be acrylic resin, acrylic resin
- the elastic modulus of the polyurethane is 30KPa-80KPa
- the second material layer 322 can be polyurethane
- the elastic modulus of the polyurethane is 30KPa-60KPa.
- the buffer material 32 may include two layers, four layers, five layers or more, and the materials of each layer may be the same or different, and the single layer may also be made of mixed materials, which is not discussed here. Repeat.
- the thickness of the buffer material 32 is 100um-200um.
- the thickness of the buffer material 32 is less than 100 ⁇ m, the size of the buffer cavity 33 is small and cannot provide sufficient buffer capacity for the buffer material 32 .
- the thickness of the buffer material 32 is greater than 200 ⁇ m, the thickness of the buffer material 32 will be relatively thick, which is not conducive to the light and thin design of the display panel 10 .
- the thickness of the buffer material 32 is 120um, 150um, 180um, or the like.
- the elastic modulus of the buffer material 32 is 30KPa-100KPa, thereby ensuring that the buffer material 32 has good impact buffering performance.
- the elastic modulus of the buffer material 32 is less than 30KPa, the buffer material 32 is relatively hard, and the buffer capacity of the buffer material 32 is not obvious.
- the buffer material 32 cannot provide a good buffer force; when the buffer material 32 The elastic modulus is greater than 100KPa, and the buffer material 32 is too soft.
- the buffer material 32 cannot provide a good support for the screen film layer 2 .
- the cross-sectional shape of the buffer cavity 33 is one or more combinations of a rectangle, a circle, and a diamond.
- the cross-sectional shape of the buffer cavity 33 is a rectangle, the length dimension a of the rectangle can be 3mm-10mm, the width dimension b can be 3mm-10mm, a and b can be equal, so that the rectangular buffer cavity becomes a square buffer cavity.
- the cross-sectional shape of the buffer cavity 33 is a rhombus.
- the cross-sectional shape of the buffer cavity 33 may be circular, or a combination of various shapes.
- the thickness dimension c of the partition wall of two adjacent buffer cavities 33 may be 2 mm-5 mm to ensure that the two adjacent buffer cavities 33 do not interfere with each other.
- the buffer cavity 33 is obtained by a laser cutting or die cutting process.
- laser cutting can use picosecond or femtosecond laser.
- the substrate 31 can be obtained by die cutting or chemical etching to obtain a desired size, and after the buffer material 32 is attached to the surface of the substrate 31 , a buffer cavity 33 with a desired shape is obtained by laser cutting.
- the substrate 31 can be obtained by die-cutting or chemical etching to obtain a desired size, and the buffer material 32 can be attached to the surface of the substrate 31 after obtaining a buffer cavity 33 of a desired shape through a die-cutting process.
- the display panel 10 After the buffer layer 3 with the buffer cavity 33 is disposed on the back of the screen film layer 2, the display panel 10 has better impact resistance.
- the drop height of the display panel 10 with the thickness of layer 3 is obviously different, the drop height of the display panel 10 with the buffer layer 3 is obviously greater than that of the display panel 10 without the buffer layer 3, and the display panel 10 with the buffer layer 3 is thicker.
- the drop height of the display panel 10 is significantly greater than that of the display panel 10 when the buffer layer 3 is thinner.
- the display device includes the display panel 10 of the above-mentioned embodiment. Since the buffer cavity 33 is provided inside the display panel 10, the display panel 10 can have better impact resistance, and thus the display device has Good impact resistance.
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Abstract
一种显示面板及具有该显示面板的显示装置,该显示面板(10)包括:盖板(1)、屏幕膜层(2)、缓冲层(3),所述缓冲层(3)设置在所述屏幕膜层(2)的背离所述盖板(1)的一侧,且所述缓冲层(3)为具有至少一个缓冲腔的缓冲层。
Description
相关申请的交叉引用
本申请要求申请日为2021年1月15日、申请号为202110054330.9、专利申请名称为“显示面板及具有该显示面板的显示装置”的优先权。
本申请涉及显示屏技术领域,具体而言,涉及一种显示面板及具有该显示面板的显示装置。
现有的柔性显示装置抗冲击性较差,当柔性显示装置的显示面板受到冲击力时,容易导致柔性显示装置的显示面板变形、损坏,使得柔性显示装置的使用寿命大大缩短,且柔性显示装置易损坏也会给用户带来财产损失。
发明内容
本申请旨在至少在一定程度上解决现有技术中的上述技术问题之一。为此,本申请提出一种显示面板,具有较好的抗冲击能力。
本申请还提出了一种具有上述显示面板的显示装置。
根据本申请实施例的显示面板包括:盖板、屏幕膜层、缓冲层,所述缓冲层设置在所述屏幕膜层的背离所述盖板的一侧,且所述缓冲层为具有至少一个缓冲腔的缓冲层。
根据本申请实施例的显示面板,通过在缓冲层内设置缓冲腔,可使得显示面板具有较好的抗冲击能力。
根据本申请的一些实施例,所述缓冲层包括:基材和设置于所述基材上的缓冲材,所述缓冲材位于所述基材与所述屏幕膜层之间,所述缓冲腔开设在所述缓冲材内。
根据本申请的一些实施例,所述基材是聚酰亚胺基材或涤纶树脂基材,且所述基材的厚度为50um-100um。
根据本申请的一些实施例,所述基材是不锈钢基材,且所述基材的厚度为30um-50um。
根据本申请的一些实施例,所述缓冲材为丙烯酸树脂、硅胶、聚氨酯、硅氧烷、硼酸改性端羟基聚硅氧烷-二氧化硅轻质冲击硬化聚合物复合材料中的一种或多种组合。
根据本申请的一些实施例,所述缓冲材的厚度为100um-200um。
根据本申请的一些实施例,所述缓冲材的弹性模量为30KPa-100KPa。
根据本申请的一些实施例,所述缓冲腔的截面形状为矩形、圆形、菱形中的一种或多种组合。
根据本申请的一些实施例,所述缓冲腔通过激光切割或者模切工艺得到。
根据本申请另一方面实施例的显示装置,包括上述的显示面板。
所述显示装置与上述的显示面板相对于现有技术所具有的优势相同,在此不再赘述。
本申请的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。
图1是根据本申请一个实施例的显示面板的剖面示意图;
图2是根据本申请另一个实施例的显示面板的剖面示意图;
图3是根据本申请一个实施例的缓冲材和基材的俯视图;
图4是图3中的缓冲材的局部示意图;
图5是根据本申请另一个实施例的缓冲材的俯视图。
附图标记:
显示面板10、盖板1、屏幕膜层2、触控层21、偏光层22、支撑膜层23、第一粘结层24、第二粘结层25、显示器件26、缓冲层3、基材31、缓冲材32、第一材质层321、第二材质层322、第三材质层323、缓冲腔33。
下面详细描述本申请的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,旨在用于解释本申请,而不能理解为对本申请的限制。
在本申请的描述中,需要理解的是,术语“正面”、“背面”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。
在本申请中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接或可以互相通讯;可以是直接相连,也可以通过中间媒介间接 相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。
下面结合图1-图5详细描述根据本申请实施例的显示面板10。
参照图1-图2所示,根据本申请实施例的显示面板10可以包括:盖板1、屏幕膜层2、缓冲层3,缓冲层3设置在屏幕膜层2的背离盖板1的一侧,即屏幕膜层2设置在盖板1的背面,缓冲层3设置在屏幕膜层2的背面。
屏幕膜层2可以包括:触控层21、偏光层22、支撑膜层23,触控层21与盖板1之间通过第一粘结层24实现连接,触控层21与偏光层22之间通过第二粘结层25实现连接,显示器件26设置在偏光层22与支撑膜层23之间。
缓冲层3为具有至少一个缓冲腔33的缓冲层3。缓冲腔33相当于气囊结构,在缓冲层3内设置缓冲腔33,当显示面板10受到外部冲击力时,缓冲腔33可以保证显示面板10具有较大的变形空间,使变形发生在更大的区域,以减小显示器件26失效或屏幕膜层2破裂的风险,减小屏幕膜层2中的显示器件局部26的最大变形量,从而使得显示面板10具有较好的抗冲击能力,显示面板10能够抵抗更大的冲击力,有利于提升显示面板10的产品质量。
根据本申请实施例的显示面板10,通过在缓冲层3内设置缓冲腔33,使得显示面板10在受到冲击力时,可以向缓冲腔33内变形,缓冲层3在向缓冲腔33内变形时会吸收冲击能量,从而减小显示器件26或屏幕膜层2上承载的冲击能量,保证显示器件26不易损坏、屏幕膜层2不易破裂,因此本申请的显示面板10具有较好的抗冲击能力,能够抵抗更大的冲击力,由此使得显示面板10不易变形、损坏,显示面板10的使用寿命大大延长,以减少用户的财产损失。
在图1-图2所示的实施例中,缓冲层3可以包括:基材31和设置于基材31上的缓冲材32,缓冲材32位于基材31与屏幕膜层2之间,缓冲腔33开设在缓冲材32内。基材31可以为缓冲材32提供支撑力,使得缓冲材32能够保持在屏幕膜层2的背面。
可选地,缓冲材32可通过紫外线固化(即UV固化)的方式使得缓冲材32的粘力达到1000-1200gf/25cm,再将缓冲材32与屏幕膜层2粘结固定,由此完成缓冲层3与屏幕膜层2的成型工序。
在本申请的一些实施例中,基材31是聚酰亚胺(即PI,Polyimide)基材31或涤纶树脂(即PET,Polyethylene terephthalate)基材,且基材31的厚度为50um-100um,由此保证基材31可以为缓冲材32提供足够的支撑力。对于聚酰亚胺基材或涤纶树脂基材而言,当基材31的厚度小于50um时,强度和刚度均较小,无法为缓冲材32提供足够的支撑力。当基材31的厚度大于100um时,会导致基材31的厚度较厚,而不利于显示面板10的轻薄 化设计。可选地,基材31的厚度为60um、70um、80um、90um等。
在本申请的一些实施例中,基材31是不锈钢基材,且基材31的厚度为30um-50um。也就是说,当基材31是不锈钢基材时,即便基材31的厚度较薄,基材31也具有较好的强度和刚度,可以为缓冲材32提供足够的支撑力。不锈钢基材的牌号规格可以是多种,例如SUS301、SUS303、SUS304、SUS316等。对于不锈钢基材而言,当基材31的厚度小于30um时,强度和刚度均较小,无法为缓冲材32提供足够的支撑力。当基材31的厚度大于50um时,会导致基材31的厚度较厚,重量较重,而不利于显示面板10的轻薄化设计。可选地,基材31的厚度为35um、40um、45um等。
在本申请的一些实施例中,缓冲材32为丙烯酸树脂(丙烯酸、甲基丙烯酸及其衍生物聚合物的总称,例如常用的亚克力)、硅胶、聚氨酯(PU,polyurethane,即聚氨基甲酸酯)、硅氧烷、硼酸改性端羟基聚硅氧烷-二氧化硅轻质冲击硬化聚合物复合材料(即P4U)中的一种或多种组合。
例如在图1所示的实施例中,缓冲材32为丙烯酸树脂、硅胶、聚氨酯、硅氧烷、硼酸改性端羟基聚硅氧烷-二氧化硅轻质冲击硬化聚合物复合材料中的其中一种材料制成。
而在图2所示的实施例中,缓冲材32为丙烯酸树脂、硅胶、聚氨酯、硅氧烷、硼酸改性端羟基聚硅氧烷-二氧化硅轻质冲击硬化聚合物复合材料中的多种材料组合而成。
具体而言,在图2所示的实施例中,缓冲材32为复合结构,缓冲材32可以包括第一材质层321、第二材质层322、第三材质层323,第二材质层322位于第一材质层321与第三材质层323之间,第一材质层321、第二材质层322、第三材质层323中的每一层可以是不同的材料,第一材质层321与第三材质层323也可以是同种材料,而第二材质层322为另一种材料,例如在一些可选的实施例中,第一材质层321与第三材质层323可以是丙烯酸树脂,丙烯酸树脂的弹性模量为30KPa-80KPa,第二材质层322可以是聚氨酯,聚氨酯的弹性模量为30KPa-60KPa。
在本申请的描述中,需要理解的是,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。
当然,在一些未示出的实施例中,缓冲材32可以包括两层、四层、五层或更多层,各层材料可以相同或不同,单层也可以是混合材料制成,这里不再赘述。
在本申请的一些实施例中,缓冲材32的厚度为100um-200um。当缓冲材32的厚度小于100um时,缓冲腔33的尺寸较小,无法为缓冲材32提供足够的缓冲能力。当缓冲材32的厚度大于200um时,会导致缓冲材32的厚度较厚,而不利于显示面板10的轻薄化设计。 可选地,缓冲材32的厚度为120um、150um、180um等。
在本申请的一些实施例中,缓冲材32的弹性模量为30KPa-100KPa,由此保证缓冲材32具有较好的碰撞缓冲性能。当缓冲材32的弹性模量小于30KPa,缓冲材32较硬,缓冲材32的缓冲能力不明显,在显示面板10受到冲击力时,缓冲材32无法提供较好的缓冲力;当缓冲材32的弹性模量大于100KPa,缓冲材32太软,在显示面板10未受到冲击力时,缓冲材32无法对屏幕膜层2提供较好的支撑力。
在本申请的一些实施例中,缓冲腔33的截面形状为矩形、圆形、菱形中的一种或多种组合。例如在图3-图4所示的实施例中,缓冲腔33的截面形状为矩形,该矩形的长度尺寸a可以是3mm-10mm,宽度尺寸b可以是3mm-10mm,a与b可以相等,以使矩形缓冲腔成为正方形缓冲腔。在图5所示的实施例中,缓冲腔33的截面形状为菱形。在一些未示出的实施例中,缓冲腔33的截面形状可以为圆形,或者是多种形状的组合。
参照图4所示,相邻两个缓冲腔33的分隔壁厚度尺寸c可以是2mm-5mm,以保证相邻两个缓冲腔33互不干扰。
在本申请的一些实施例中,缓冲腔33通过激光切割或者模切工艺得到。其中,激光切割可使用皮秒或飞秒激光。
在一些实施例中,基材31可以通过模切或化学蚀刻获得所需尺寸,缓冲材32贴合至基材31表面后,再通过激光切割获得所需形状的缓冲腔33。
在另一些实施例中,基材31可以通过模切或化学蚀刻获得所需尺寸,缓冲材32通过模切工艺获得所需形状的缓冲腔33后,再贴合至基材31表面。
在屏幕膜层2的背面设置具有缓冲腔33的缓冲层3之后,使得显示面板10具有较好的抗冲击性能,例如在落球测试试验中,未设置缓冲层3的显示面板10与具有不同缓冲层3厚度的显示面板10的落球高度具有明显区别,具有缓冲层3的显示面板10的落球高度明显大于未设置缓冲层3的显示面板10的落球高度,并且缓冲层3较厚时显示面板10的落球高度明显大于缓冲层3较薄时显示面板10的落球高度,其详细结果如表一所示:
表一 落球测试试验结果
测试项目 | 基础方案 | 对比方案1 | 对比方案2 |
缓冲层厚度(um) | 0(即无缓冲层) | 80-150 | 150-200 |
落球高度(cm) | 1.7 | 2.4 | 3.9 |
根据本申请另一方面实施例的显示装置,包括上述实施例的显示面板10,由于显示面板10内部设置了缓冲腔33,可使得显示面板10具有较好的抗冲击能力,进而使得显示装置具有较好的抗冲击能力。
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例” 或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。此外,本领域的技术人员可以将本说明书中描述的不同实施例或示例进行接合和组合。
尽管上面已经示出和描述了本申请的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本申请的限制,本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。
Claims (10)
- 一种显示面板,其特征在于,包括:盖板、屏幕膜层、缓冲层,所述缓冲层设置在所述屏幕膜层的背离所述盖板的一侧,且所述缓冲层为具有至少一个缓冲腔的缓冲层。
- 根据权利要求1所述的显示面板,其特征在于,所述缓冲层包括:基材和设置于所述基材上的缓冲材,所述缓冲材位于所述基材与所述屏幕膜层之间,所述缓冲腔开设在所述缓冲材内。
- 根据权利要求2所述的显示面板,其特征在于,所述基材是聚酰亚胺基材或涤纶树脂基材,且所述基材的厚度为50um-100um。
- 根据权利要求2所述的显示面板,其特征在于,所述基材是不锈钢基材,且所述基材的厚度为30um-50um。
- 根据权利要求2所述的显示面板,其特征在于,所述缓冲材为丙烯酸树脂、硅胶、聚氨酯、硅氧烷、硼酸改性端羟基聚硅氧烷-二氧化硅轻质冲击硬化聚合物复合材料中的一种或多种组合。
- 根据权利要求2所述的显示面板,其特征在于,所述缓冲材的厚度为100um-200um。
- 根据权利要求2所述的显示面板,其特征在于,所述缓冲材的弹性模量为30KPa-100KPa。
- 根据权利要求1所述的显示面板,其特征在于,所述缓冲腔的截面形状为矩形、圆形、菱形中的一种或多种组合。
- 根据权利要求1或8所述的显示面板,其特征在于,所述缓冲腔通过激光切割或者模切工艺得到。
- 一种显示装置,其特征在于,包括权利要求1-9中任一项所述的显示面板。
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