WO2022149294A1 - Dispositif de traitement au laser - Google Patents

Dispositif de traitement au laser Download PDF

Info

Publication number
WO2022149294A1
WO2022149294A1 PCT/JP2021/009202 JP2021009202W WO2022149294A1 WO 2022149294 A1 WO2022149294 A1 WO 2022149294A1 JP 2021009202 W JP2021009202 W JP 2021009202W WO 2022149294 A1 WO2022149294 A1 WO 2022149294A1
Authority
WO
WIPO (PCT)
Prior art keywords
scanner
region
control device
laser
optical pulses
Prior art date
Application number
PCT/JP2021/009202
Other languages
English (en)
Japanese (ja)
Inventor
忠正 横井
克充 芦原
和美 土道
達典 阪本
直毅 吉武
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Publication of WO2022149294A1 publication Critical patent/WO2022149294A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating

Definitions

  • This disclosure relates to a laser processing device.
  • the laser marker which is one of the laser processing devices, draws a processing pattern on the object to be processed by scanning the laser beam along the processing pattern to be drawn using a galvano mirror that can be deflected in two directions (hereinafter, "printing"). (Also called “to do”) is often used.
  • the line width may not be uniform or the printing may be distorted in the laser processing device using the galvano mirror, which causes deterioration of the printing quality. rice field.
  • Patent Document 1 lowers the scanning speed (scanning speed) of the scanner when drawing a curved portion than when drawing a straight portion in order to eliminate the inward rotation phenomenon of the curved portion.
  • Patent Document 1 lowers the scanning speed (scanning speed) of the scanner when drawing a curved portion than when drawing a straight portion in order to eliminate the inward rotation phenomenon of the curved portion.
  • the technique of reducing the pulse oscillation frequency and the duty ratio or the pulse oscillation interval contributing to printing according to the scanning speed is disclosed.
  • the scanning speed of the scanner must be adjusted in consideration of the response delay of the galvano mirror in order to prevent the print quality from being deteriorated due to the response delay of the galvano mirror. .. Therefore, it is difficult to prevent deterioration of print quality in an area where the scanning speed of the scanner cannot be adjusted (for example, an area at the beginning of drawing, an area at the end of drawing, etc.).
  • An object of the present disclosure is to provide a laser processing apparatus capable of preventing deterioration of print quality without adjusting the scanning speed of the scanner.
  • the laser processing apparatus is a laser processing apparatus that draws a processing pattern on an object to be processed, and controls an oscillator that oscillates a laser beam, a scanner that scans the laser beam output from the oscillator, an oscillator, and a scanner. It is provided with a control device for processing and a reception unit for receiving input of a processing pattern of a processing object.
  • the oscillator includes a seed light source that emits seed light, an excitation light source that emits excitation light, and an optical amplification fiber configured to amplify the seed light by injecting the seed light and the excitation light.
  • the seed light source repeatedly generates a pulse train containing a plurality of optical pulses as the seed light, and the control device changes the scanning speed when the laser beam is scanned by the scanner according to the processing pattern received by the reception unit. At least one of the number of light pulses emitted by the seed light source and the pulse width of each of the plurality of light pulses emitted by the seed light source is varied in a predetermined region.
  • the predetermined area is the area where the drawing starts in the processing pattern.
  • the predetermined area is the area of the processing pattern at the end of drawing.
  • the predetermined region is the curved portion region of the machining pattern.
  • the reception unit receives the driving conditions of the scanner.
  • the control device determines the number of optical pulses and the pulse width when scanning the laser beam with the scanner for a predetermined area based on the processing pattern received by the reception unit and the driving conditions of the scanner.
  • the number of optical pulses and the pulse width when scanning the laser beam with the scanner for a predetermined area can be determined before the driving of the scanner is started.
  • control device determines the number of optical pulses and the pulse width when scanning the laser beam with the scanner for a predetermined area based on the driving condition of the scanner.
  • the number of optical pulses and the pulse width when scanning the laser beam with the scanner for a predetermined area can be corrected based on the driving condition of the scanner.
  • the reception unit accepts processing patterns with shades.
  • the control device changes at least one of the number of optical pulses and the pulse width according to the gradation of the processing pattern when the laser light is scanned by the scanner according to the processing pattern with shading received by the reception unit.
  • the scene to which the present invention is applied is a scene in which a processing pattern is drawn on a processing object 90 (hereinafter, also referred to as “printing”) using a laser processing apparatus 100.
  • the laser processing apparatus 100 uses a galvano mirror (X scan mirror 31, Y scan mirror 32) that can be deflected in a two-dimensional direction to transmit the laser light output from the oscillator 20 in the two-dimensional direction on the surface of the object to be processed 90.
  • a galvano mirror X scan mirror 31, Y scan mirror 32
  • processing marks dots
  • a processing pattern is drawn on the object to be processed 90.
  • the speed at which the scanner 30 scans the laser beam (hereinafter, also referred to as “scanning speed”) is in a constant speed region (hereinafter, also referred to as “scanning speed”).
  • the scanning speed is maintained at the set speed (including a speed close to the set speed) in the constant speed region, whereas the scanning speed is slower than the set speed in the region where the scanning speed changes.
  • the area at the beginning of drawing, the area at the end of drawing, and the area of the curved portion correspond to the area where the scanning speed changes, and correspond to the “predetermined area”.
  • the area where drawing starts is the area where laser printing is started, the laser light starts to be emitted, and the scanner 30 changes from a stopped state or a low speed state to a constant speed state within a set speed range. This is a region that shows accelerated behavior up to the point.
  • the area at the end of drawing is an area where laser printing ends, and is an area immediately before the emission of laser light stops, and the scanner 30 is in a constant speed state, a stopped state, or a low speed state within a set speed range. It is a region showing decelerating behavior up to.
  • the curved area is an area in which the scanner 30 simultaneously accelerates or decelerates in two axis directions (X-axis direction and Y-axis direction) within a set speed range during laser printing, or a scanner.
  • 30 is a region that exhibits accelerating or decelerating behavior within a set speed range in one axial direction, while exhibiting constant speed behavior within a set speed range in the other axial direction.
  • the number of optical pulses included in one pulse train and each of the optical pulses among the parameters related to the laser light shown in FIG. Uniform printing is realized by changing at least one of the pulse width tw between the predetermined region and the constant speed region.
  • the number of optical pulses included in one pulse train and the pulse width tw of each of the light pulses are elements that determine the width of dots (that is, the pulse train width Tw) that affects the thickness and density of the line segment. Therefore, in the laser processing apparatus 100, it is possible to prevent the print quality from deteriorating without adjusting the scanning speed of the scanner 30.
  • LD Laser Diode (semiconductor laser).
  • FIGS. 1 and 2 are diagrams showing a configuration example of the laser processing apparatus 100 according to the embodiment.
  • the laser processing device 100 is a laser marker including an oscillator 20, a scanner 30, a control device 50, and an input device 60.
  • the oscillator 20 oscillates a laser beam.
  • the scanner 30 scans the laser beam output from the oscillator 20.
  • the control device 50 controls the oscillator 20 and the scanner 30.
  • the input device 60 is an example of a “reception unit” and receives information input from a user.
  • the oscillator 20 adopts the MOPA (Master Oscillator and Power Amplifier) method.
  • the MOPA method is a method in which a highly stable main oscillator (or seed light) for generating a high-definition beam and a high-output optical amplifier are separated and each is controlled independently.
  • the oscillator 20 includes an optical fiber 1,8, a seed LD2, an excited LD3, 9A, 9B, an isolator 4,6,11, a coupler 5,10, an end cap 12, a driver 13, and the like. It is provided with 14, 15A and 15B, and is configured to amplify the seed light generated from the seed LD2 by the optical fibers 1 and 8 and output the amplified seed light.
  • Optical fibers 1 and 8 are optical amplification fibers.
  • the optical fibers 1 and 8 may be quartz-based fibers containing quartz as a main component, or may be plastic optical amplification fibers.
  • the optical fibers 1 and 8 have a core to which a rare earth element which is an optical amplification component is added, and a clad provided around the core.
  • the seed LD2 is a laser light source that emits seed light.
  • the seed LD2 repeatedly outputs a pulse train (see FIG. 3) including a plurality of optical pulses as the seed light.
  • the wavelength of the seed light is, for example, a wavelength selected from the range of 1000 to 1100 nm.
  • the driver 13 repeatedly applies a pulsed current to the seed LD2 in accordance with the instruction of the control device 50 to drive the seed LD2 in a pulsed manner, and repeatedly generate seed light (pulse train) including a plurality of optical pulses from the seed LD2. ..
  • the seed light emitted from the seed LD2 passes through the isolator 4.
  • the isolator 4 realizes a function of transmitting light in only one direction and blocking light incident on the opposite direction of the light.
  • the isolator 4 transmits the seed light from the seed LD 2 and blocks the return light from the optical fiber 1. This makes it possible to prevent the return light from the optical fiber 1 from incident on the seed LD2.
  • the seed LD 2 may be damaged, and the provision of the isolator 4 can prevent such a problem.
  • Excitation LD3 is an excitation light source that emits excitation light for exciting the atoms of rare earth elements added to the core of the optical fiber 1.
  • the driver 14 drives the excited LD3 by CW (Continuous Wave) according to the instruction of the control device 50 (continuous operation).
  • the coupler 5 combines the seed light from the seed LD2 and the excitation light from the excitation LD3 and causes them to enter the optical fiber 1.
  • the excitation light incident on the optical fiber 1 is absorbed by the atom of the rare earth element contained in the core, and the atom is excited.
  • the excited atoms cause stimulated emission by the seed light, so that the seed light is amplified.
  • the isolator 6 passes the seed light (optical pulse) amplified by the optical fiber 1 and emitted from the optical fiber 1 and blocks the light returning to the optical fiber 1.
  • Excitation LD9A and 9B emit excitation light for exciting the atoms of rare earth elements contained in the core of the optical fiber 8.
  • the drivers 15A and 15B drive each of the excited LD9A and 9B by CW according to the instruction of the control device 50.
  • the coupler 10 combines the optical pulse output from the optical fiber 1 and the excitation light from the excitation LDs 9A and 9B to be incident on the optical fiber 8.
  • the optical pulse incident on the optical fiber 8 is amplified by the same action as the optical amplification action in the optical fiber 1.
  • the isolator 11 passes the optical pulse emitted from the optical fiber 8 and blocks the light returning to the optical fiber 8.
  • the optical pulse that has passed through the isolator 11 is emitted into the atmosphere from the end face of the optical fiber attached to the isolator 11.
  • the end cap 12 is provided to prevent damage that occurs at the interface between the end face of the optical fiber and the atmosphere when an optical pulse having a high peak power is emitted from the optical fiber into the atmosphere.
  • the end cap 12 may be provided inside the isolator 11.
  • the number of excited LDs in the first stage is 1, and the number of excited LDs in the second stage is 2, but the number of excited LDs is not limited to these values. do not have.
  • the scanner 30 scans the laser beam output from the oscillator 20 in a two-dimensional direction on the surface of the object to be machined 90.
  • the scanner 30 includes an X-scan mirror 31, a Y-scan mirror 32, an X-axis motor 33, a Y-axis motor 34, a driver 35, and a condenser lens 36, and uses these elements.
  • the laser beam is scanned along the processing pattern.
  • the processing pattern is accepted by the input device 60 described later.
  • the X scan mirror 31 is a galvano mirror that can be deflected in the X-axis direction, and deflects the laser beam in the X direction.
  • the Y scan mirror 32 is a galvano mirror that can be deflected in the Y-axis direction, and deflects the laser beam in the Y-axis direction.
  • the X-axis motor 33 is a drive source for the X scan mirror 31.
  • the Y-axis motor 34 is a drive source for the Y-scan mirror 32.
  • the driver 35 drives the X-axis motor 33 and the Y-axis motor 34 according to the instructions of the control device 50.
  • the condenser lens 36 is an f ⁇ lens or the like for condensing laser light.
  • the laser beam output from the oscillator 20 is scanned by the scanner 30 in a two-dimensional direction on the surface of the object to be machined 90, so that dots are formed on the object to be machined 90 along the machining pattern.
  • the control device 50 comprehensively controls the operation of the laser processing device 100 by controlling the drivers 13, 14, 15A, 15B, and 35.
  • the input device 60 receives the input of information from the user and transmits the received information to the control device 50.
  • the information received by the input device 60 is, for example, a machining pattern of the machining object 90, a driving condition of the scanner 30, and the like.
  • the processing pattern received by the input device 60 may be a processing pattern composed of a region irradiated with laser light (hereinafter, also referred to as “irradiation region”) and a region not irradiated with laser light, or may be composed of only an irradiation region. It may be a processing pattern. Further, the irradiation area may have light and shade, or may have no light and shade.
  • the drive condition of the scanner 30 accepted by the input device 60 is a type related to the scanning speed of the scanner 30, and is, for example, "standard", “low speed”, “high speed”, and the like.
  • the control device 50 sets the scanning speed corresponding to the type as the set speed.
  • control device 50 for example, a personal computer that executes a predetermined program is adopted.
  • input device 60 for example, a mouse, a keyboard, a touch panel, or the like is adopted.
  • the control device 50 controls the operation of the drivers 13, 14, 15A, 15B based on the information received from the input device 60, and while operating the drivers 13, 14, 15A, 15B (that is, the oscillator 20). (While the laser beam is emitted from), the operation of the driver 35 is controlled.
  • FIG. 3 is a diagram showing a waveform of seed light generated from seed LD2.
  • the seed light generated from the seed LD2 is a pulse train (multi-pulse) including a plurality of light pulses.
  • a pulse train including a plurality of optical pulses is generated from the seed LD2 for each repetition period tprd.
  • the time interval (pulse interval) of the plurality of optical pulses is tp.
  • the repetition period tprd and the pulse interval tp are set based on the processing conditions of the object to be processed, for example, the material (metal, resin, etc.) of the object to be processed, the processing time, the processing quality, and the like.
  • the repetition period tprd is selected from the range of 1 ⁇ s to 1 ms.
  • the pulse interval tp is shorter than the repetition period tprd, and is selected from, for example, between 1 ns and 100 ns.
  • the pulse interval tp is short, the scanning distance between one pulse and the next pulse is very short in the pulse train constituting one multi-pulse. Therefore, the next pulse is irradiated within the range of the machining mark on the surface of the machining object by the previous pulse, and as a result, the pulse train constituting one multi-pulse is irradiated to almost the same place of the machining object to form a dot. do. That is, the dot is composed of a plurality of optical pulses (pulse trains).
  • the laser processing apparatus 100 adopts a MOPA method using an optical amplification fiber, and uses light from a semiconductor laser as seed light.
  • the seed light generated from the seed LD2 is amplified by the optical fibers 1 and 8 and output from the laser processing apparatus 100. Since the seed LD2 outputs a pulse train containing a plurality of light pulses as seed light, the laser processing apparatus 100 outputs a pulse train containing a plurality of light pulses, in other words, a multi-pulse laser light.
  • the seed LD2 When the driver 13 drives the seed LD2, the seed LD2 generates a seed light (pulse train).
  • the repetition period tprd of the seed light (pulse train) generated from the seed LD2 By controlling the current supplied to the seed LD2 by the driver 13, the repetition period tprd of the seed light (pulse train) generated from the seed LD2, the number of optical pulses contained in one pulse train, the pulse interval tp, and each optical pulse. Multiple parameters related to seed light, such as peak power (pulse amplitude) and pulse width tw of each light pulse, can be controlled independently of each other.
  • the laser light output from the laser processing apparatus 100 is seed light amplified by the optical fibers 1 and 8.
  • the peak power of an optical pulse (pulse amplitude) and the pulse width of each optical pulse can be controlled independently of each other.
  • a pulse train (multi-pulse) can be output as a laser beam from the laser processing apparatus 100. Further, a plurality of parameters related to the laser beam (pulse train) output from the laser processing apparatus 100 can be controlled independently of each other. Therefore, according to the embodiment, the laser beam (pulse train) for performing the desired processing can be output from the laser processing apparatus 100.
  • FIG. 4 is a diagram for explaining the Q-switch method.
  • the Q-switch method is a laser oscillation method, which is compared with the MOPA method.
  • pulsed laser light is output by instantaneously opening an element called a Q-switch.
  • the laser energy is increased between the total reflection mirror and the partially transmitted mirror by using the principle of laser resonance, and the pulse laser light is output by momentarily opening the Q switch.
  • FIG. 5 is a diagram showing the relationship between the frequency and the pulse train width (pulse width) in the MOPA method and the Q-switch method.
  • the vertical axis shows the pulse train width Tw (pulse width in the Q-switch system), and the horizontal axis shows the frequency.
  • the pulse width of the pulsed laser beam is uniquely determined in relation to the frequency.
  • the pulse train width does not change even if the frequency changes.
  • the pulse train width is the width of a pulse train containing a plurality of optical pulses, that is, the width of dots, and is shown by Tw in FIG. That is, in the case of the MOPA method, a pulse train having the same pulse train width Tw can be output at different frequencies.
  • the pulse train width Tw is arbitrarily set by changing at least one of the number of optical pulses included in one pulse train and the pulse width tw of each of the light pulses (see FIG. 3). Because it can be done.
  • the laser processing device 100 can increase the degree of freedom in changing the pulse train width Tw as compared with the Q-switch type laser processing device.
  • the pulse train width Tw is an element that affects the thickness and density of the line segment.
  • the laser processing apparatus 100 changes at least one of the number of optical pulses included in one pulse train and the pulse width of each of the optical pulses in a predetermined region and a constant velocity region, that is, changes the irradiation conditions of the laser beam. By changing between the predetermined area and the constant speed area, the pulse train width Tw in the predetermined area is adjusted to realize uniform printing.
  • irradiation conditions An example of changing the irradiation conditions of the laser beam (hereinafter, also simply referred to as “irradiation conditions”) performed by the laser processing apparatus 100 will be described with reference to FIGS. 2, 6, and 7.
  • the irradiation conditions are changed by changing the values of the parameters related to the laser beam.
  • FIG. 6 is a diagram showing an example of changing the irradiation conditions between the area at the beginning of drawing and the area at the end of drawing.
  • FIG. 7 is a diagram showing an example of changing the irradiation conditions in the curved portion.
  • Patterns 1A to 3A and patterns 1B to 3B are examples of changing the irradiation conditions performed by the laser processing apparatus 100
  • Comparative Example A and Comparative Example B are examples of cases where the irradiation conditions are not changed.
  • the region at the beginning of drawing, the region at the end of drawing, and the region of the curved portion are examples of predetermined regions, and the region in the middle of the line segment and the region of the straight line portion are examples of the constant velocity region.
  • Pattern 1A and pattern 1B are examples of cases where the frequency and the number of optical pulses included in one pulse train (dot) are changed between a predetermined region and a constant speed region.
  • the irradiation conditions in the constant velocity region are such that the frequency is 100 kHz, the number of optical pulses contained in one pulse train is eight, and the pulse width of each of the optical pulses is 8 ns, whereas the irradiation in a predetermined region is performed.
  • the conditions are that the frequency is 75 kHz, the number of optical pulses included in one pulse train is four, and the pulse width of each of the optical pulses is 8 ns.
  • the frequency is changed from 100 kHz to 75 kHz, and the number of optical pulses included in one pulse train is changed from 8 to 4.
  • the frequency is changed from 100 kHz to 75 kHz, the number of dots formed on the workpiece 90 is reduced from 4 (see Comparative Example A and Comparative Example B) to 3, and as a result, the dots become dense in a predetermined region. Is avoided.
  • the pulse train width Tw is suppressed, and as a result, the line width is prevented from becoming thick in a predetermined region. Therefore, the density and line width of the processing pattern formed on the object to be processed become uniform.
  • Pattern 2A and pattern 2B are examples of cases where the frequency and the pulse width of each of the optical pulses included in one pulse train are changed between a predetermined region and a constant speed region.
  • the irradiation conditions in the constant velocity region are such that the frequency is 100 kHz, the number of optical pulses contained in one pulse train is eight, and the pulse width of each of the optical pulses is 8 ns, whereas the irradiation in a predetermined region is performed.
  • the conditions are that the frequency is 75 kHz, the number of optical pulses included in one pulse train is eight, and the pulse width of each of the optical pulses is 4 ns.
  • the frequency is changed from 100 kHz to 75 kHz, and the pulse width of each of the optical pulses included in one pulse train is changed from 8 ns to 4 ns.
  • the frequency is changed from 100 kHz to 75 kHz, the number of dots formed on the workpiece 90 is reduced from 4 (see Comparative Example A and Comparative Example B) to 3, and as a result, the dots become dense in a predetermined region. Is avoided.
  • the pulse width of each of the optical pulses included in one pulse train from 8 ns to 4 ns, the pulse train width Tw is suppressed, and as a result, the line width is prevented from becoming thick in a predetermined region. Therefore, the density and line width of the processing pattern formed on the object to be processed become uniform.
  • Pattern 3A and pattern 3B are examples of cases where the frequency, the number of optical pulses included in one pulse train, and the pulse width of each of the optical pulses are changed between a predetermined region and a constant speed region.
  • the irradiation conditions in the constant velocity region are such that the frequency is 100 kHz, the number of optical pulses contained in one pulse train is eight, and the pulse width of each of the optical pulses is 8 ns, whereas the irradiation in a predetermined region is performed.
  • the conditions are that the frequency is 75 kHz, the number of optical pulses included in one pulse train is two, and the pulse width of each of the optical pulses is 16 ns.
  • the frequency is changed from 100 kHz to 75 kHz
  • the number of optical pulses contained in one pulse train is changed from 8 to 2
  • the pulse width is 8 ns. Is changed to 16ns.
  • the frequency is changed from 100 kHz to 75 kHz
  • the number of dots formed on the workpiece 90 is reduced from 4 (see Comparative Example A and Comparative Example B) to 3, and as a result, the dots become dense in a predetermined region. Is avoided.
  • the pulse width of each of the optical pulses included in one pulse train has expanded from 8 ns to 16 ns, the number of optical pulses contained in one pulse train has decreased from eight to two, so that the predetermined region As a result of suppressing the pulse train width Tw in, it is possible to prevent the line width from becoming thick in a predetermined region. Therefore, the density and line width of the processing pattern formed on the object to be processed become uniform.
  • the laser processing apparatus 100 includes the number of optical pulses included in one pulse train and the pulse width of each of the optical pulses among the parameters related to the laser light. Uniform printing is realized by changing at least one of the above in the predetermined area and the constant speed area.
  • At least one of the number of optical pulses included in one pulse train and the pulse width of each of the optical pulses and the frequency are changed in the predetermined region and the constant velocity region.
  • only one of the number of optical pulses included in one pulse train and the pulse width of each of the optical pulses may be changed between the predetermined region and the constant velocity region.
  • the parameter value was not changed in one predetermined area, but the parameter value may be changed stepwise in one predetermined area.
  • Method of determining irradiation conditions (specifically, frequency, the number of optical pulses included in one pulse train, and the pulse width of each of the optical pulses) in a predetermined region will be described.
  • FIG. 8 is a diagram for explaining a method of determining irradiation conditions in a predetermined area. Irradiation conditions in a predetermined area are determined by the control device 50.
  • the control device 50 predicts the acceleration of the scanner 30 in a predetermined region by using any one of the three methods shown in FIG. 8, and the predicted acceleration of the scanner 30 and the irradiation condition in the constant speed region. Based on the above, the irradiation conditions in a predetermined region, that is, the frequency, the number of optical pulses contained in one pulse train, and the pulse width of each of the optical pulses are determined. Since the acceleration of the scanner 30 is zero (including a value close to zero) in the constant speed region, uniform printing can be achieved by predicting what value the acceleration of the scanner 30 will be in a predetermined region. It is possible to determine the frequency required for realization, the number of optical pulses contained in one pulse train, and the pulse width of each of the optical pulses.
  • the control device 50 predicts the acceleration of the scanner 30 in a predetermined region based on the machining pattern and the driving conditions of the scanner 30 received by the input device 60.
  • the control device 50 gives an irradiation condition in all predetermined regions (a region at the beginning of drawing, a region of a curved portion, and a region at the end of drawing) before issuing an instruction to start scanning to the scanner 30. Can be determined.
  • the control device 50 After issuing an instruction to start scanning to the scanner 30, the control device 50 starts scanning the laser beam for the corresponding predetermined region (the region at the beginning of drawing, the region of the curved portion, or the region at the end of drawing). In the meantime, the irradiation conditions in the corresponding predetermined area may be determined.
  • the control device 50 predicts the acceleration in a predetermined region based on the driving condition of the scanner 30. Therefore, according to the second method or the third method, the irradiation condition in the predetermined region is determined after the scanner 30 receives the scanning start instruction (input signal).
  • the control device 50 changes the current value thereafter based on the input value (input signal) input to the motors of the scanner 30 (X-axis motor 33 and Y-axis motor 34 shown in FIG. 1). Predict. Since the positions of the mirrors (X scan mirror 31 and Y scan mirror 32 shown in FIG. 1) change with changes in the current value, the control device 50 predicts the change in the current value to accelerate the scanner 30. Can be predicted.
  • the irradiation condition in the predetermined region is the scanning of the laser beam to the predetermined region (the region at the beginning of drawing, the region of the curved portion, or the region at the end of drawing) after receiving the input signal by the scanner 30. Will be determined before the start of.
  • control device 50 calculates the difference between the actual mirror position and the mirror position that should be by detecting the rotation position of the motor of the scanner 30 using the rotary encoder, and based on the calculated difference. Predicts the acceleration of the scanner 30.
  • the irradiation condition in the predetermined region is the corresponding predetermined region (the region where the drawing starts, the region of the curved portion, or the drawing) after the current value starts to change after the input signal is received by the scanner 30. It is determined before the start of scanning the laser beam for the end region).
  • control device 50 may detect the value of the current supplied to the motor of the scanner 30 instead of the rotation position of the motor of the scanner 30.
  • the control device 50 predicts the acceleration of the scanner 30 by using any one of the above three methods until the scanning of the laser beam for the predetermined region is started, so that the irradiation condition in the predetermined region is reached. That is, the frequency, the number of optical pulses contained in one pulse train, and the pulse width of each of the optical pulses are determined, and the oscillator 20 is instructed to change the value of each parameter to the determined content.
  • the control device 50 may determine the irradiation conditions in all the predetermined regions (the region at the beginning of drawing, the region at the curved portion, and the region at the end of drawing) by using any one of the above three methods. However, the method used for each region may be changed. As an example, the control device 50 may determine only the region at the beginning of drawing by using the first method, and determine the region of the curved portion and the region at the end of drawing by using the second method or the third method. ..
  • control device 50 determines the irradiation conditions in all the predetermined regions by using the first method, and then determines by the second method or the third method, and the content determined by the first method is the second.
  • the correction may be made based on the content determined in the above method or the third method.
  • the method of predicting the acceleration of the scanner 30 based on the driving condition of the scanner 30 is not limited to the second method and the third method, and a method of detecting the movement of the mirror may be used.
  • the printing process performed by the control device 50 will be described with reference to FIGS. 9 to 11.
  • the control device 50 prints while changing the irradiation conditions between a predetermined area and a constant speed area.
  • the control device 50 determines the irradiation conditions in the constant speed region based on the driving conditions of the scanner 30 input by the user, and determines the irradiation conditions in the predetermined region by at least one of the three methods described with reference to FIG. To determine using.
  • FIG. 9 is a flowchart showing an example of printing processing when the irradiation condition in a predetermined area is determined by using the first method.
  • step S905 the control device 50 receives the machining pattern and the driving conditions of the scanner 30.
  • the processing pattern and the driving conditions of the scanner 30 are received by the input device 60 and transmitted to the control device 50.
  • the driving condition of the scanner 30 is a type related to the scanning speed of the scanner 30, and is, for example, "standard", “low speed”, “high speed”, and the like.
  • step S910 the control device 50 generates print data based on the processing pattern received in step S905.
  • step S915 the control device 50 determines a predetermined area and a constant speed area based on the print data generated in step S910.
  • step S920 the control device 50 determines the irradiation condition in the constant speed region to the irradiation condition corresponding to the driving condition of the scanner 30 received in step S905.
  • the frequency is 100 kHz and the number of optical pulses included in one pulse train is eight as the irradiation condition in the constant velocity region.
  • the pulse width is determined to be 8 ns.
  • step S925 the control device 50 determines the irradiation conditions in the predetermined region by using the first method. Specifically, the control device 50 predicts the acceleration in a predetermined region based on the machining pattern received in step S905 and the driving conditions of the scanner 30, and the predicted acceleration and the irradiation in the constant speed region determined in step S920. Irradiation conditions in a predetermined area are determined based on the conditions. As an example, in the example of Pattern 1A and Pattern 1B of FIGS. 6 and 7, according to step S925, the frequency is 75 kHz, the number of optical pulses included in one pulse train is four, and the pulse is a pulse as the irradiation condition in the predetermined region. The width is determined to be 8ns.
  • step S930 the control device 50 instructs the start of printing. Specifically, the control device 50 instructs the oscillator 20 to start outputting the laser beam, and instructs the scanner 30 to start scanning. At this time, the control device 50 outputs the laser beam to the constant speed region under the irradiation condition determined in step S920, and outputs the laser beam to the predetermined region under the irradiation condition determined in step S925. Instruct the oscillator 20. As a result, when the laser beam is scanned in the constant speed region, the laser beam under the irradiation conditions determined in step S920 is output from the oscillator 20, and the laser beam is scanned in the predetermined region. Is that the laser beam under the irradiation conditions determined in step S925 is output from the oscillator 20.
  • step S935 the control device 50 determines whether or not all of the machining patterns accepted in step S905 have been printed. When all the processing patterns accepted in step S905 have been printed (YES in step S935), the control device 50 instructs the end of printing (step S940). Specifically, the control device 50 instructs the oscillator 20 to end the output of the laser beam, and instructs the scanner 30 to end the scanning. After step S940, the control device 50 ends a series of processes shown in FIG.
  • FIG. 10 is a flowchart showing an example of printing processing when the irradiation condition in a predetermined area is determined by using the second method or the third method.
  • control device 50 performs the same processing as in steps S905 to S920.
  • step S1025 the control device 50 instructs the start of printing. Specifically, the control device 50 instructs the oscillator 20 to start outputting the laser beam, and instructs the scanner 30 to start scanning. At this time, the control device 50 instructs the oscillator 20 to output the laser beam under the irradiation conditions determined in step S1020 for all the regions (predetermined region and constant speed region) of the machining pattern.
  • step S1030 the control device 50 acquires the driving status of the scanner 30.
  • the control device 50 determines the irradiation condition in the predetermined region by using the second method
  • the control device 50 acquires an input value input to the motor of the scanner 30.
  • the control device 50 acquires the rotation position of the motor of the scanner 30 or the value of the current supplied to the motor of the scanner 30. ..
  • step S1035 the control device 50 determines the irradiation conditions in the predetermined region by using the second method or the third method. Specifically, according to the second method, the control device 50 predicts the acceleration of the scanner 30 based on the input value input to the motor of the scanner 30 acquired in step S1030, and in the predicted acceleration and step S1020. The irradiation condition in the predetermined region is determined based on the irradiation condition in the determined constant velocity region.
  • the control device 50 predicts and predicts the acceleration of the scanner 30 based on the rotation position of the motor of the scanner 30 acquired in step S1030 or the value of the current supplied to the motor of the scanner 30.
  • the irradiation condition in the predetermined region is determined based on the acceleration and the irradiation condition in the constant speed region determined in step S1020.
  • the frequency is 75 kHz
  • the number of optical pulses included in one pulse train is four
  • the pulse is a pulse as the irradiation condition in the predetermined region.
  • the width is determined to be 8ns.
  • step S1040 the control device 50 instructs the oscillator 20 to change only the irradiation condition of a predetermined region of the processing pattern to the irradiation condition determined in step S1035.
  • Step S1040 the control device 50 performs step S1045 and step S1050, and ends a series of processes shown in FIG.
  • Step S1045 and step S1050 are the same processes as in step S935 and step S940.
  • FIG. 11 is a flowchart showing an example of a printing process in which the irradiation conditions in a predetermined area are determined by using the first method and then corrected by using the second method or the third method.
  • control device 50 performs the same processing as in steps S905 to S930.
  • step S1135 the control device 50 acquires the driving status of the scanner 30.
  • the process of step S1135 is the same process as that of step S1030.
  • step S1140 the control device 50 determines the irradiation condition in the predetermined region by using the second method or the third method.
  • the process of step S1140 is the same as that of step S1035.
  • step S1145 the control device 50 instructs the oscillator 20 to correct the irradiation condition in the predetermined region to the irradiation condition determined in step S1140.
  • Step S1145 the control device 50 performs step S1150 and step S1155, and ends a series of processes shown in FIG.
  • Step S1150 and step S1155 are the same processes as in step S935 and step S940.
  • the laser processing apparatus 100 in the embodiment scans the laser light with the scanner 30 along the processing pattern
  • the number of optical pulses included in one pulse train and the pulse width of each of the optical pulses are used.
  • printing is performed while changing the irradiation condition of the laser beam between the predetermined region and the constant speed region. This makes it possible to prevent the printing from becoming darker or the line width from becoming thicker in a predetermined area where the scanning speed of the scanner 30 is slower than the set speed.
  • the density and line width of the processing pattern formed on the object to be processed become uniform, so that it is possible to prevent the print quality from deteriorating.
  • the laser processing apparatus 100 uses the scanner 30 when changing the value of each parameter related to the seed light. There is no need to stop. That is, in the laser processing apparatus 100, even if the irradiation condition of the laser beam is changed between the predetermined region and the constant speed region, the tact time does not increase.
  • FIG. 12 are diagrams showing an example of irradiation conditions when printing a processing pattern with shading.
  • FIG. 12 as an example of a processing pattern with shading, a processing pattern composed of two regions (regions P and Q) having different gradations is drawn.
  • the laser processing apparatus 100 sets different irradiation conditions for each region having different gradations.
  • the irradiation conditions in each region are determined by the control device 50 according to the gradation of each region.
  • the frequency is set to 200 kHz
  • the number of optical pulses included in one pulse train (dot) is set to 16
  • the pulse width of each of the optical pulses is set to 8 ns
  • the irradiation in the region Q is performed.
  • the frequency is set to 100 kHz
  • the number of optical pulses included in one pulse train is set to 8
  • the pulse width of each of the optical pulses is set to 8 ns.
  • the frequency and the number of optical pulses included in one pulse train, and the frequency and one pulse train among the pulse widths of the optical pulses are used.
  • different values are set for each region having different gradations with respect to the number of included optical pulses
  • the combination of parameters in which different values are set is not limited to this.
  • a value different for each region having a different gradation for at least one of the number of optical pulses included in one pulse train and the pulse width of each of the optical pulses Should be set.
  • FIG. 13 is a flowchart showing an example of a printing process when printing a processing pattern with shading. The process shown in FIG. 13 is performed by the control device 50.
  • step S1305 and step S1310 the control device 50 performs the same processing as in step S905 and step S910.
  • step S1315 the control device 50 determines the irradiation conditions for each gradation of the processing pattern based on the print data generated in step S1310. Specifically, the control device 50 divides the processing pattern into a plurality of regions having different gradations based on the print data generated in step S1310, and determines the irradiation conditions in each region according to the gradation of each region.
  • the frequency is 200 kHz
  • the number of optical pulses included in one pulse train is 16, and the pulse width is set.
  • the irradiation condition in the region Q thinner than the region P is determined to be 8 ns
  • the frequency is 100 kHz
  • the number of optical pulses included in one pulse train is eight
  • the pulse width is determined to be 8 ns.
  • step S1315 the frequency, the number of optical pulses included in one pulse train, and the pulse width of each of the optical pulses are determined according to the gradation of each region.
  • the frequency and the number of optical pulses included in one pulse train are determined to be different values in the regions having different gradations, but the regions having different gradations are combined into one pulse train. At least one of the number of included optical pulses and the pulse width of each of the optical pulses may be determined to be different values.
  • the irradiation condition determined in step S1315 is adopted as the irradiation condition in the constant speed region, and the irradiation condition in the predetermined region is determined in step S1325 described later.
  • step S1320 the control device 50 determines a predetermined area and a constant speed area based on the print data generated in step S1310.
  • the process of step S1320 is the same process as that of step S915.
  • step S1325 the control device 50 determines the irradiation conditions in the predetermined region by using the first method. Specifically, first, the control device 50 specifies the irradiation condition determined in step S1315 for the region to which the predetermined region belongs. For convenience of explanation, the specified irradiation conditions will be referred to as "reference irradiation conditions" below. Next, the control device 50 predicts the acceleration in the predetermined region based on the machining pattern and the driving condition of the scanner 30 received in step S1305, and irradiates in the predetermined region based on the predicted acceleration and the reference irradiation condition. Determine the conditions.
  • the frequency is 75 kHz
  • the number of optical pulses included in one pulse train is four
  • the pulse width is set as the irradiation conditions in the predetermined region. It is decided to be 8ns.
  • the frequency and the number of optical pulses included in one pulse train are changed in the predetermined region and the constant speed region, but the optical pulses included in one pulse train are the same as in the above-described embodiment.
  • At least one of the number of light pulses and the pulse width of each of the optical pulses may be changed between a predetermined region and a constant velocity region.
  • step S1330 the control device 50 instructs the start of printing. Specifically, the control device 50 instructs the oscillator 20 to start outputting the laser beam, and instructs the scanner 30 to start scanning. At this time, the control device 50 outputs the laser beam to the constant speed region under the irradiation condition determined in step S1315, and outputs the laser beam to the predetermined region under the irradiation condition determined in step S1325. Instruct the oscillator 20. As a result, when the laser beam is scanned in the constant speed region, the laser beam under the irradiation conditions determined in step S1315 is output from the oscillator 20, and the laser beam is scanned in the predetermined region. Is that the laser beam under the irradiation conditions determined in step S1325 is output from the oscillator 20.
  • Step S1330 the control device 50 performs step S1335 and step S1340, and ends a series of processes shown in FIG.
  • Step S1335 and step S1340 are the same processes as in step S935 and step S940.
  • the laser processing apparatus 100 it is not necessary to stop the scanner 30 when changing the value of each parameter related to the seed light. Therefore, according to the modification, the laser processing apparatus 100 can draw a processing pattern with shading without stopping the scanner 30.
  • the laser processing apparatus 100 draws a processing pattern with shading, but at least one of the number of optical pulses included in one pulse train and the pulse width of each of the optical pulses. Can be changed between a predetermined region and a constant speed region. As a result, it is possible to prevent the printing from becoming darker or the line width from becoming thicker in a predetermined area where the scanning speed of the scanner 30 is slower than the set speed, so that it is possible to prevent the print quality from deteriorating. Further, in the laser processing apparatus 100, it is not necessary to stop the scanner 30 when changing the value of each parameter related to the seed light, so that the tact time increases even if the parameter value is changed between the predetermined region and the constant speed region. There is nothing to do.
  • the processing pattern is composed of two or more regions having different gradations, but the processing pattern is not limited to this.
  • the processing pattern may be composed of three or more regions having different gradations.
  • the control device 50 determines the irradiation condition in the predetermined region by using the first method, but the irradiation condition in the predetermined region is determined by the second method as in the above-described embodiment. Alternatively, it may be determined using a third method. Further, the control device 50 determines the irradiation conditions in the predetermined region by using the first method, and then determines by the second method or the third method, and the contents determined by the first method are determined by the second method. Alternatively, the correction may be made based on the content determined by the third method.
  • control device 50 sets the irradiation conditions in all predetermined regions (the region at the beginning of drawing, the region of the curved portion, and the region at the end of drawing) in any one of the above three methods. It may be determined by using a method, or the irradiation conditions in each predetermined region may be determined by changing the method used for each region.
  • a laser machining apparatus (100) that draws a machining pattern on a machining object (90).
  • An oscillator (20) that oscillates laser light and A scanner (30) that scans the laser beam output from the oscillator (20), and a scanner (30).
  • a control device (50) that controls the oscillator (20) and the scanner (30),
  • a reception unit (60) for receiving an input of the processing pattern of the processing object (90) is provided.
  • the oscillator (20) is A seed light source (2) that emits seed light and Excitation light sources (3, 9A, 9B) that emit excitation light, and It comprises an optical amplification fiber (1,8) configured to amplify the seed light by injecting the seed light and the excitation light.
  • the seed light source (2) repeatedly generates a pulse train containing a plurality of optical pulses as the seed light.
  • the control device (50) has the seed in a predetermined region where the scanning speed changes.
  • a laser processing apparatus that varies at least one of the number of the optical pulses emitted by the light source and the pulse width of each of the plurality of optical pulses emitted by the seed light source.
  • the reception unit (60) receives the drive conditions of the scanner (30) and receives the drive conditions.
  • the control device (50) receives the number of the optical pulses and the pulse width when the scanner (30) scans the laser beam with respect to the predetermined region at the reception unit (60).
  • the laser processing apparatus according to any one of configurations 1 to 4, which is determined based on the pattern and the driving conditions of the scanner (30).
  • the control device (50) determines the number of the optical pulses and the pulse width when the scanner (30) scans the laser beam with respect to the predetermined region based on the driving condition of the scanner (30).
  • the laser processing apparatus according to any one of configurations 1 to 5, which is determined.
  • the reception unit (60) receives the processing pattern having a shade, and receives the processing pattern.
  • the control device (50) scans the laser beam with the number of optical pulses and the pulse width.
  • the laser processing apparatus according to any one of Configurations 1 to 6, wherein at least one of the above is varied according to the gradation of the processing pattern.
  • 1,8 optical fiber 2 seed LD, 3,9A, 9B excited LD, 4,6,11 isolator, 5,10 coupler, 12 end cap, 13,14,15A, 15B, 35 driver, 20 oscillator, 30 Scanner, 31 X-scan mirror, 32 Y-scan mirror, 33 X-axis motor, 34 Y-axis motor, 36 condenser lens, 50 control device, 60 input device, 90 machining object, 100 laser machining device, Tw pulse train width, tp Pulse interval, tprd repetition cycle, tw pulse width.

Abstract

L'invention concerne un dispositif de traitement au laser (100) comprenant un oscillateur (20), un dispositif de balayage (30), un dispositif de commande (50) et un dispositif d'entrée (60). L'oscillateur (20) produit de manière répétée des trains d'impulsions comprenant de multiples impulsions optiques. Quand un faisceau laser est balayé au moyen du dispositif de balayage (30) selon un motif de traitement accepté par le dispositif d'entrée (60), le dispositif de commande (50) fait varier au moins l'un parmi le nombre d'impulsions optiques et la largeur d'impulsion de chacune des multiples impulsions optiques dans une zone prédéterminée dans laquelle la vitesse de balayage change.
PCT/JP2021/009202 2021-01-07 2021-03-09 Dispositif de traitement au laser WO2022149294A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021001525A JP2022106489A (ja) 2021-01-07 2021-01-07 レーザ加工装置
JP2021-001525 2021-04-23

Publications (1)

Publication Number Publication Date
WO2022149294A1 true WO2022149294A1 (fr) 2022-07-14

Family

ID=82358881

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/009202 WO2022149294A1 (fr) 2021-01-07 2021-03-09 Dispositif de traitement au laser

Country Status (2)

Country Link
JP (1) JP2022106489A (fr)
WO (1) WO2022149294A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009066625A (ja) * 2007-09-13 2009-04-02 Omron Corp レーザマーキング装置
JP2010064144A (ja) * 2008-08-11 2010-03-25 Sumitomo Electric Ind Ltd レーザマーキング方法
JP2010125489A (ja) * 2008-11-28 2010-06-10 Keyence Corp レーザマーカ及びレーザマーキングシステム
JP2019055565A (ja) * 2017-09-22 2019-04-11 ローランドディー．ジー．株式会社 箔押し装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009066625A (ja) * 2007-09-13 2009-04-02 Omron Corp レーザマーキング装置
JP2010064144A (ja) * 2008-08-11 2010-03-25 Sumitomo Electric Ind Ltd レーザマーキング方法
JP2010125489A (ja) * 2008-11-28 2010-06-10 Keyence Corp レーザマーカ及びレーザマーキングシステム
JP2019055565A (ja) * 2017-09-22 2019-04-11 ローランドディー．ジー．株式会社 箔押し装置

Also Published As

Publication number Publication date
JP2022106489A (ja) 2022-07-20

Similar Documents

Publication Publication Date Title
KR0185231B1 (ko) 큐 스위치의 제어된 펄스 폭을 사용하는 레이저 마아킹 시스템 및 방법
JP4445217B2 (ja) レーザマーキング装置
KR101898371B1 (ko) 광증폭 장치 및 레이저 가공 장치
WO2011059049A1 (fr) Dispositif et procédé d'usinage laser
JP2010125489A (ja) レーザマーカ及びレーザマーキングシステム
JP5025391B2 (ja) レーザ加工装置及び加工方法
JP4957474B2 (ja) レーザマーキング装置
WO2022149294A1 (fr) Dispositif de traitement au laser
JP2541501B2 (ja) レ―ザマ―キング方法
WO2021166407A1 (fr) Dispositif de traitement laser et procédé de commande de dispositif de traitement laser
JP7468171B2 (ja) レーザ加工装置および加工方法
JP6682148B2 (ja) レーザパルス切出装置及び切出方法
JP5248353B2 (ja) レーザ加工装置
JP3513489B2 (ja) ガルバノスキャナの制御方法及び装置
WO2023276346A1 (fr) Dispositif d'usinage au laser et procédé de commande d'accélération
JP4461740B2 (ja) レーザマーキング装置
JP2008073733A (ja) レーザ加工装置
JP7165597B2 (ja) レーザ加工装置及びレーザ加工方法
JP2008105054A (ja) レーザ加工装置
WO2021200380A1 (fr) Appareil de traitement au laser
JP2004148322A (ja) レーザマーキング装置
KR20220120467A (ko) 레이저가공장치 및 레이저가공방법
JP2012096254A (ja) レーザ加工装置及びレーザ加工装置の制御方法
JP2003126976A (ja) レーザ加工装置
CN113675718A (zh) 一种增加co2脉冲式激光器输出功率的方法和装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21917519

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21917519

Country of ref document: EP

Kind code of ref document: A1